Light-emitting module

Abstract

To achieve a light-emitting module in which a plurality of light-emitting devices are mounted.SOLUTION: A light-emitting module includes: a wiring board; a first base substance which has a first mounting surface and is electrically connected to the wiring board; a second base substance which has a second mounting surface and is electrically connected to the wiring board; three or more first sub-mounts which are arranged side by side on the first mounting surface; four or more second sub-mounts which are arranged side by side on the second mounting surface; three or more first light-emitting elements which are arranged in the first sub-mount; and four or more second light-emitting elements which are arranged in the second sub-mount. The length of the first sub-mount in a first direction in which the first sub-mounts are aligned on the first mounting surface is longer than the length of the second sub-mount in a second direction in which the second sub-mounts are aligned on the second mounting surface.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a light emitting module. [Background technology]

[0002] Patent Document 1 discloses a light emitting module in which a first light emitting device and a second light emitting device, each having a different number of laser elements mounted in a package of the same shape, are mounted on one wiring board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2020-95939 Summary of the Invention [Problem to be solved by the invention]

[0004] Depending on the type of light emitted from the light emitting module, there is room for devising the mounting mode of the multiple light emitting elements mounted on the first light emitting device and the mounting mode of the multiple light emitting elements mounted on the second light emitting device. [Means for solving the problem]

[0005] The light emitting module disclosed in the embodiment includes a wiring board having a first connection pattern and a second connection pattern on an upper surface thereof, a first base having a first mounting surface, bonded to the first wiring pattern of the wiring board and electrically connected to the wiring board, a second base having a second mounting surface, bonded to the second connection pattern and electrically connected to the wiring board, a plurality of first submounts arranged side by side on the first mounting surface, a plurality of second submounts arranged side by side on the second mounting surface, a plurality of first light emitting elements each arranged on the first submount, and a plurality of second light emitting elements each arranged on the second submount, The first submount includes three or more of the first submounts, the multiple second submounts include a number of second submounts that is one or more greater than the number of the first submounts arranged on the first mounting surface, the multiple first light-emitting elements include three or more of the first light-emitting elements, and the multiple second light-emitting elements include a number of second light-emitting elements that is one or more greater than the number of the first light-emitting elements arranged on the first mounting surface, and a length of the first submounts in a first direction, which is the direction in which the first submounts are arranged on the first mounting surface, is greater than a length of the second submounts in a second direction, which is the direction in which the second submounts are arranged on the second mounting surface.

[0006] At least one of the one or more inventions disclosed in the embodiments is expected to have the effect of realizing a light-emitting module that efficiently emits light. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a perspective view of a light emitting module according to the first to fourth embodiments. [Figure 2] FIG. 2 is a top view of the light emitting modules according to the first to fourth embodiments. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a top view of the wiring substrate according to the first to fourth embodiments. [Figure 5] FIG. 5 is a top view illustrating components arranged inside the first light emitting device and the second light emitting device in the light emitting module according to the first embodiment. [Figure 6] FIG. 6 is a perspective view of the first light emitting device according to each embodiment. [Figure 7] FIG. 7 is a top view of the first light emitting device according to each embodiment. [Figure 8] FIG. 8 is a cross-sectional view of the first light emitting device according to the first to third embodiments and the fifth embodiment, taken along the line VIII-VIII in FIG. [Figure 9] FIG. 9 is a top view illustrating each component arranged inside the first light emitting device according to the first to third embodiments and the fifth embodiment. [Figure 10] FIG. 10 is a perspective view of the second light emitting device according to each embodiment. [Figure 11] FIG. 11 is a top view of the second light emitting device according to each embodiment. [Figure 12] 12 is a cross-sectional view of the second light emitting device according to the first embodiment taken along the line XII-XII in FIG. [Figure 13] FIG. 13 is a top view illustrating each component arranged inside the first light emitting device according to the first embodiment. [Figure 14] FIG. 14 is a top view illustrating components arranged inside the first light emitting device and the second light emitting device in the light emitting module according to the second embodiment. [Figure 15] FIG. 15 is a cross-sectional view of the second light emitting device according to the second embodiment taken along the line XV-XV in FIG. [Figure 16] FIG. 16 is a top view illustrating each component arranged inside the second light emitting device according to the second embodiment. [Figure 17] FIG. 17 is a top view illustrating components arranged inside the first light emitting device and the second light emitting device in the light emitting module according to the third embodiment. [Figure 18]FIG. 18 is a cross-sectional view of the second light emitting device according to the third embodiment taken along the line XVIII-XVIII in FIG. [Figure 19] FIG. 19 is a top view illustrating each component arranged inside the second light emitting device according to the third embodiment. [Figure 20] FIG. 20 is a top view illustrating each component arranged inside the first light emitting device according to the fourth embodiment. [Figure 21] FIG. 21 is a top view of the light emitting module according to the fifth embodiment. [Figure 22] FIG. 22 is a top view of the wiring board according to the fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] In this specification and claims, polygons such as triangles and quadrilaterals are referred to as polygons, including shapes in which the corners of the polygons have been rounded, chamfered, corner-cut, rounded, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle portions of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while retaining the polygonal base are included in the interpretation of "polygon" described in this specification and claims.

[0009] The same applies to words that describe specific shapes, such as trapezoids, circles, and irregularities, not just polygons. The same also applies when dealing with the sides that form the shape. In other words, even if the corners or middle part of a side are processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0010] Furthermore, in this specification or claims, descriptions such as up and down, left and right, front and back, front and back, front and back, etc. merely describe relationships such as relative positions, orientations, directions, etc., and do not necessarily correspond to the relationships during use.

[0011] In addition, directions such as the X direction, Y direction, and Z direction may be indicated using arrows in the drawings, and the directions of these arrows are consistent among multiple drawings relating to the same embodiment.

[0012] Furthermore, in this specification, the terms "component" and "part" may be used when describing components, for example. A "component" refers to an object that is physically handled as a single unit. An object that is physically handled as a single unit can also be said to be an object that is handled as a single part in the manufacturing process. On the other hand, a "part" refers to an object that does not need to be physically handled as a single unit. For example, the term "part" is used when referring to a portion of a component.

[0013] The distinction between "component" and "part" above does not indicate a conscious intention to limit the scope of rights in the interpretation of the doctrine of equivalents. In other words, even if a component is described as a "component" in the claims, this does not mean that the applicant recognizes that treating this component as a single physical unit is essential for the application of the present invention.

[0014] Furthermore, in this specification or claims, when there are multiple elements of a certain type and they need to be distinguished from one another, the elements may be prefixed with "first" or "second." Furthermore, the objects distinguished between the specification and the claims may differ. Therefore, even if the claims describe elements with the same prefixes as the specification, the objects identified by these elements may not be the same between the specification and the claims.

[0015] For example, if there are elements in this specification that are distinguished by the notation "first," "second," and "third," and the elements marked "first" and "third" in this specification are described in the claims, the elements may be distinguished by the notation "first" and "second" in the claims for clarity. In this case, the elements marked "first" and "second" in the claims refer to the elements marked "first" and "third" in this specification, respectively. Note that this rule is not limited to elements, and can be applied rationally and flexibly to other objects as well.

[0016] Hereinafter, embodiments for carrying out the present invention will be described. Furthermore, specific embodiments for carrying out the present invention will be described with reference to the drawings. Note that the embodiments for carrying out the present invention are not limited to these specific embodiments. In other words, the illustrated embodiments are not the only embodiments in which the present invention can be realized. Note that the sizes and positional relationships of components shown in each drawing may be exaggerated for ease of understanding.

[0017] First Embodiment A light-emitting module 100 according to a first embodiment will be described. FIGS. 1 to 13 are diagrams illustrating an exemplary embodiment of the light-emitting module 100. FIG. 1 is a perspective view of the light-emitting module 100. FIG. 2 is a top view of the light-emitting module 100. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4 is a top view of the wiring substrate 9 in the light-emitting module 100. FIG. 5 is a perspective view illustrating components disposed inside a first light-emitting device 1A and a second light-emitting device 1B in the light-emitting module 100. FIG. 6 is a perspective view of the first light-emitting device 1A. FIG. 7 is a top view of the first light-emitting device 1A. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7. FIG. 9 is a top view illustrating components mounted on a first base 10A of the first light-emitting device 1A. FIG. 10 is a perspective view of the second light-emitting device 1B. FIG. 11 is a top view of the second light-emitting device 1B. FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 11. FIG. 13 is a top view showing the state of each component mounted on the second base 10B of the second light emitting device 1B.

[0018] The light-emitting module 100 includes a plurality of components. The components of the light-emitting module 100 include a plurality of light-emitting devices 1 and a wiring substrate 9. The plurality of light-emitting devices 1 include a first light-emitting device 1A and a second light-emitting device 1B. The light-emitting module 100 may also include other components. For example, the light-emitting module 100 may include a connector, a thermistor, etc.

[0019] Each component of the light emitting module 100 will now be described.

[0020] (Light-emitting device 1) The light emitting device 1 includes a plurality of components, including a base 10, a plurality of light emitting elements 20, a plurality of submounts 30, one or a plurality of reflecting members 40, a plurality of protective elements 50, a plurality of wirings 60, a cover member 70, and an optical member 80.

[0021] The light emitting device 1 may include other components. For example, the light emitting device 1 may include further light emitting elements in addition to the plurality of light emitting elements 20. Furthermore, the light emitting device 1 may not include some of the plurality of components listed here.

[0022] Each component of the light emitting device 1 will be described.

[0023] (Base 10) The base 10 has an upper surface 11A, a lower surface 11B, and one or more outer surfaces 11C. When viewed from above, the outer edge shape of the base 10 is rectangular. This rectangle can be a rectangle having long and short sides. In the illustrated base 10, the long side direction of this rectangle is the same as the X direction, and the short side direction is the same as the Y direction. Note that when viewed from above, the outer edge shape of the base 10 does not have to be rectangular.

[0024] A recessed shape is formed in the base 10. The recessed shape is formed from the upper surface 11A and recessed downward from the upper surface 11A. The recess is defined by the recessed shape of the base 10. This recess is surrounded by the upper surface 11A in a top view.

[0025] The inner edge of the upper surface 11A defines the outer edge of the recess. When viewed from above, the outer edge of the recess has a rectangular shape. This rectangle can have a long side and a short side. In the illustrated base 10, the long side of this rectangle is in the same direction as the X direction, and the short side is in the same direction as the Y direction. Note that the outer edge of this recess does not have to be rectangular.

[0026] The base 10 has a mounting surface 11D. The base 10 also has one or more inner surfaces 11E. The mounting surface 11D is located below the top surface 11A and above the bottom surface 11B. The mounting surface 11D is an upper surface. The mounting surface 11D can be said to be an upper surface different from the top surface 11A. The one or more inner surfaces 11E are located above the mounting surface 11D. The one or more inner surfaces 11E intersect with the top surface 11A. The mounting surface 11D and the one or more inner surfaces 11E are included in the multiple surfaces that define the recess of the base 10.

[0027] One or more inner side surfaces 11E are provided perpendicular to the mounting surface 11D. Here, the perpendicularity allows for a difference of ±3 degrees. Note that the inner side surfaces 11E do not have to be perpendicular to the mounting surface 11D.

[0028] The base 10 has one or more step portions 12C. Each step portion 12C has an upper surface and an inner surface that intersects with the upper surface and extends downward from the upper surface. The upper surface of step portion 12C intersects with inner surface 11E. The inner surface of step portion 12C intersects with mounting surface 11D.

[0029] The step portion 12C is formed along a part or all of the inner side surface 11E in a top view. One or more step portions 12C are formed on the inside of the upper surface 11A in a top view. One or more step portions 12C are formed on the inside of one or more inner side surfaces 11E in a top view.

[0030] The base 10 may have a plurality of step portions 12C. The plurality of step portions 12C includes a step portion 12C formed along the inner surface 11E in a top view. The plurality of step portions 12C includes a step portion 12C formed along the entire inner surface 11E in a top view.

[0031] The multiple step portions 12C include, when viewed from above, a step portion 12C (hereinafter referred to as the first step portion) formed along a certain inner surface 11E (hereinafter referred to as the first inner surface), and a step portion 12C (hereinafter referred to as the second step portion) formed along another inner surface 11E (hereinafter referred to as the second inner surface).

[0032] The first inner surface 11E and the second inner surface 11E face each other. The first step portion 12C may be formed only along the first inner surface 11E. The second step portion 12C may be formed only along the second inner surface 11E. In top view, no step portion 12C is provided between the step portions 12C formed along the opposing inner surfaces 11E.

[0033] The base 10 does not have any step portions other than the plurality of step portions 12C on the inside of the upper surface 11A in a top view, and the plurality of step portions 12C can be composed of only two step portions 12C. The plurality of step portions 12C can be composed of only a first step portion 12C and a second step portion 12C.

[0034] The plurality of step portions 12C includes step portions 12C formed along the inner surface 11E with a length of 50% to 100% of the length of the inner surface 11E in a direction parallel to the mounting surface 11D.

[0035] One or more wiring patterns 13 are provided on the upper surface of the step portion 12C. The wiring patterns 13 are electrically connected to other wiring patterns via wiring passing through the inside of the base 10. The other wiring patterns are provided, for example, on the lower surface of the base 10. Note that the wiring patterns 13 may be electrically connected to wiring patterns provided on the upper surface 11A or the outer surface 11C.

[0036] A plurality of wiring patterns 13 are provided on the upper surfaces of one or more step portions 12C. One or more wiring patterns 13 can be provided on each of the plurality of step portions 12C. The base 10 can have step portions 12C on whose upper surfaces a plurality of wiring patterns 13 are provided. By providing the wiring patterns 13 on the upper surfaces of the step portions 12C, it is possible to connect the wiring at a position higher than the mounting surface 11D. This may facilitate the wiring joining process.

[0037] The location where the wiring pattern 13 is provided on the base 10 does not have to be limited to the step portion 12C. The base 10 can be said to have a wiring portion provided for electrical connection, and in the illustrated base 10, the step portion 12C is also a wiring portion.

[0038] The base 10 can be formed primarily from ceramic, or may be formed by joining a bottom member having a mounting surface 11D formed primarily from a metal or a composite containing a metal, and a frame member having a wiring pattern 13 formed primarily from ceramic.

[0039] Here, the term "main material" refers to the material that accounts for the largest proportion of mass or volume in the target structure. Note that when the target structure is formed from a single material, that material is the main material. In other words, when a material is the main material, it means that the proportion of that material can be 100%.

[0040] Examples of ceramics include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide. Examples of metals include copper, aluminum, and iron. Alternatively, composites containing metals such as copper molybdenum, copper-diamond composites, and copper tungsten can be used.

[0041] (Light-emitting element 20) The light emitting element 20 has a light emitting surface from which light is emitted. The light emitting element 20 has an upper surface, a lower surface, and multiple side surfaces. The upper surface or the side surface of the light emitting element 20 serves as the light emitting surface. The light emitting element 20 has one or multiple light emitting surfaces.

[0042] The shape of the upper surface of the light-emitting element 20 is a rectangle having long sides and short sides. However, the shape of the upper surface of the light-emitting element 20 does not have to be rectangular. A semiconductor laser element can be used as the light-emitting element 20. However, the light-emitting element 20 is not limited to a semiconductor laser element, and a light-emitting diode or the like may also be used.

[0043] A single-emitter semiconductor laser element can be used as the light-emitting element 20. Alternatively, a multi-emitter semiconductor laser element having a plurality of emitters can be used as the light-emitting element 20.

[0044] For example, a light emitting element that emits blue light, a light emitting element that emits green light, or a light emitting element that emits red light can be used as the light emitting element 20. Note that a light emitting element that emits light of other colors or wavelengths may also be used as the semiconductor laser element 20.

[0045] Here, blue light refers to light whose peak emission wavelength is in the range of 420 nm to 494 nm, green light refers to light whose peak emission wavelength is in the range of 495 nm to 570 nm, and red light refers to light whose peak emission wavelength is in the range of 605 nm to 750 nm.

[0046] Here, a semiconductor laser element, which is an example of the light-emitting element 20, will be described. When viewed from above, the semiconductor laser element has a rectangular outer shape with one opposite side as the long side and the other opposite side as the short side. Light (laser light) emitted from the semiconductor laser element has a divergence. Furthermore, divergent light is emitted from the emitting end face of the semiconductor laser element. The emitting end face of the semiconductor laser element can be said to be the light emitting surface of the light-emitting element 20.

[0047] Light emitted from a semiconductor laser element forms an elliptical far-field pattern (FFP) in a plane parallel to the light-emitting end facet. FFP is the shape and light intensity distribution of the emitted light at a position away from the light-emitting end facet.

[0048] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with peak intensity in the light intensity distribution of the FFP, is referred to as the light traveling along the optical axis or the light passing through the optical axis. Also, in the light intensity distribution of the FFP, the light with peak intensity is referred to as the light traveling along the optical axis or the light passing through the optical axis. 2 The light having the above intensity is called the main part of the light.

[0049] The shape of the FFP of light emitted from a semiconductor laser element is an ellipse in a plane parallel to the light emitting end face, with the stacking direction being longer than the direction perpendicular to the stacking direction. The stacking direction is the direction in which multiple semiconductor layers including the active layer are stacked in the semiconductor laser element. The direction perpendicular to the stacking direction can also be called the in-plane direction of the semiconductor layers. The long axis direction of the elliptical shape of the FFP can also be called the fast axis direction of the semiconductor laser element, and the short axis direction can also be called the slow axis direction of the semiconductor laser element.

[0050] Based on the light intensity distribution of FFP, 1 / e of the peak light intensity 2The angle at which light with this light intensity spreads is defined as the light spread angle of the semiconductor laser element. The light spread angle is 1 / e of the peak light intensity. 2 In the explanation of this specification, when simply referring to the "angle of light", it is assumed that the angle is 1 / e of the peak light intensity. 2 The divergence angle of light at a light intensity of 1000 nm is defined as the divergence angle of light in the fast axis direction.

[0051] Examples of semiconductor laser elements that emit blue light or green light include semiconductor laser elements that include nitride semiconductors. Examples of nitride semiconductors that can be used include GaN-based semiconductors such as GaN, InGaN, and AlGaN. Examples of semiconductor laser elements that emit red light include those that include InAlGaP-based, GaInP-based, and GaAs-based semiconductors such as GaAs and AlGaAs.

[0052] (Submount 30) The submount 30 has a top surface 31, a bottom surface, and one or more side surfaces 32. When viewed from above, the submount 30 has an outer shape in which the length in one direction is greater than the length in the direction perpendicular to that direction. The top surface 31 is rectangular. The top surface 31 can be rectangular in shape having short and long sides. Alternatively, the top surface 31 may be square in shape.

[0053] The submount 30 is configured in the shape of a rectangular parallelepiped. The distance between the upper surface 31 and the lower surface of the submount 30 is smaller than the distance between the other two opposing surfaces. This distance between the upper surface 31 and the lower surface is referred to as the thickness of the submount 30. Note that the shape of the submount 30 is not limited to a rectangular parallelepiped.

[0054] The length of the short side of the upper surface 31 is 500 μm or more and 1500 μm or less. The length of the long side of the upper surface 31 is 1000 μm or more and 3000 μm or less. The thickness of the submount 30 is 200 μm or more and 500 μm or less. The length of the long side of the upper surface 31 is 120% or more and 300% or less of the length of the short side.

[0055] The submount 30 can be made of, for example, silicon nitride, aluminum nitride, or silicon carbide. The submount 30 is also provided with a metal film for bonding to other components.

[0056] (Reflective member 40) The reflecting member 40 has a light-reflecting surface that reflects light. The light-reflecting surface is inclined with respect to the bottom surface. In other words, the positional relationship of the light-reflecting surface when viewed from the bottom surface is neither perpendicular nor parallel. A line connecting the bottom end and top end of the light-reflecting surface is inclined with respect to the bottom surface of the reflecting member 40. The angle of the light-reflecting surface with respect to the bottom surface, or the angle of the line connecting the bottom end and top end of the light-reflecting surface with respect to the bottom surface, is referred to as the inclination angle of the light-reflecting surface.

[0057] In the illustrated reflecting member 40, the light reflecting surface is flat and forms an inclination angle of 45 degrees with respect to the lower surface of the reflecting member 40. Note that the light reflecting surface does not have to be flat, and may be, for example, a curved surface. Furthermore, the inclination angle of the light reflecting surface does not have to be 45 degrees.

[0058] The reflecting member 40 can be primarily made of glass, metal, or the like. The primary material is preferably a heat-resistant material, such as glass, such as quartz or BK7 (borosilicate glass), or metal, such as aluminum. The reflecting member 40 can also be made primarily of Si. If the primary material is a reflective material, the light-reflecting surface can be formed from the primary material. When the light-reflecting surface is formed separately from the primary material, the light-reflecting surface can be formed using, for example, metal, such as Ag or Al, or a dielectric multilayer film, such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0059] The light reflecting surface has a reflectance of 90% or more for the peak wavelength of light irradiated onto the light reflecting surface. This reflectance may be 95% or more. This reflectance can also be 99% or more. The light reflectance is 100% or less, or less than 100%.

[0060] (protective element 50) The protective element 50 is intended to prevent a specific element (such as a semiconductor laser element) from being destroyed by excessive current flowing through it. An example of the protective element 50 is a Zener diode. The Zener diode may be made of Si.

[0061] (Wiring 60) The wiring 60 is a linear conductive material with joints at both ends. The joints at both ends become joints with other components. The wiring 60 is, for example, a metal wire. Examples of metals that can be used include gold, aluminum, silver, and copper.

[0062] (lid member 70) The lid member 70 has a bottom surface and a top surface, and is configured in the shape of a rectangular parallelepiped flat plate. However, it does not have to be a rectangular parallelepiped. The lid member 70 is translucent, meaning that it transmits light. Here, translucency means that the light transmittance is 80% or more. However, it does not have to have a transmittance of 80% or more for all wavelengths of light. The lid member 70 may have a non-translucent region (a region that does not have translucency) in part.

[0063] The lid member 70 is formed primarily from glass. The primary material of the lid member 70 is a material that has high translucency. The lid member 70 is not limited to glass, and may be formed primarily from sapphire, for example.

[0064] (Optical member 80) The optical member 80 has an upper surface, a lower surface, and side surfaces. The optical member 80 exerts optical effects on incident light, such as reflection, transmission, and refraction, as well as optical effects such as focusing, diffusing, and collimating.

[0065] The optical element 80 can be a lens element having one or more lens surfaces. The one or more lens surfaces are provided on the upper surface side of the optical element 80. Alternatively, they may be provided on the lower surface side of the optical element 80. The upper and lower surfaces are flat. The one or more lens surfaces intersect with the upper surface. The one or more lens surfaces are surrounded by the upper surface in a top view. In a top view, the optical element 80 has a rectangular outer shape. The lower surface of the optical element 80 is rectangular.

[0066] The portion of optical element 80 that overlaps one or more lens surfaces when viewed from above is referred to as the lens portion. The portion of optical element 80 that overlaps with the upper surface when viewed from above is referred to as the non-lens portion. When the lens portion is bisected by an imaginary plane including the upper surface, the lens surface side is referred to as the lens-shaped portion, and the lower surface side is referred to as the flat-plate-shaped portion. The lower surface of the lens portion is a part of the lower surface. In optical element 80, the lower surface is composed of the lower surface of the lens portion and the lower surface of the non-lens portion.

[0067] The illustrated optical member 80 has multiple lens surfaces. The multiple lens surfaces are formed in a continuous line in one direction. The optical member 80 has five lens surfaces, and is formed so that the vertices of these five lens surfaces are aligned on a straight line. This straight line is in the same direction as the X direction.

[0068] Here, the direction in which the lens surfaces are aligned in a top view is referred to as the connecting direction. The length of the lens surfaces in the connecting direction in a top view is greater than the length in the direction perpendicular to this direction. In the illustrated optical member 80, the connecting direction is the same as the X direction.

[0069] The optical member 80 has high light transmittance. The optical member 80 has high light transmittance in both the lens portion and the non-lens portion. Moreover, the optical member 80 as a whole has high light transmittance. The optical member 80 can be formed using glass such as BK7, for example.

[0070] Next, a light emitting device 1 including the above-mentioned components will be described. In the following description of the light emitting device 1, the description of a single component also applies to each of the multiple identical components, as long as it is consistent with the drawings related to the light emitting device 1. In other words, if there are multiple identical components in the drawings and the description of a single component also applies to each of the multiple identical components from the drawings, this description also applies to each of the multiple identical components.

[0071] (Light-emitting device 1) In the light emitting device 1, the light emitting element 20 is mounted on a submount 30. The light emitting element 20 is disposed on an upper surface 31 of the submount 30. In the light emitting device 1 shown in the figure, a semiconductor laser element is used as the light emitting element 20.

[0072] The plurality of light-emitting elements 20 are arranged on different submounts 30. Note that another light-emitting element may be arranged on the submount 30 on which the light-emitting element 20 is arranged. In consideration of heat dissipation, it may be desirable that no light-emitting element other than the one light-emitting element 20 is arranged on one submount 30.

[0073] The light-emitting element 20 is disposed so that its light-emitting surface is located near a side surface 32 of the submount 30. Here, the side surface 32 located near the light-emitting surface will be referred to as a first side surface 32A. Furthermore, the side surface 32 of the submount 30 opposite the first side surface 32A will be referred to as a second side surface 32B. The first side surface 32A is the side surface 32 that intersects with a short side of the top surface 31. The second side surface 32B is the side surface 32 that intersects with a short side that forms a pair with the short side where the first side surface 32A and the top surface 31 intersect. The light-emitting element 20 is disposed on the submount 30 so that its light-emitting surface is closer to the first side surface 32A than the second side surface 32B.

[0074] In the light emitting device 1, the protective element 50 is mounted on the submount 30. The protective element 50 is disposed on the upper surface 31 of the submount 30. The protective element 50 is disposed on the submount 30 on which the semiconductor laser element 20 is disposed. A plurality of protective elements 50 are disposed on different submounts 30.

[0075] In the light emitting device 1, the submount 30 is mounted on the base 10. The submount 30 is disposed on the mounting surface 11D of the base 10. A plurality of submounts 30 are arranged side by side on the mounting surface 11D. The plurality of submounts 30 are arranged side by side in the longitudinal direction of the base 10. The plurality of submounts 30 are arranged side by side in the direction of the long sides of the base 10.

[0076] Here, the direction in which the multiple submounts 30 are lined up in top view is referred to as the first direction. In the light emitting device 1, the multiple light emitting elements 20 are arranged in the first direction. In the light emitting device 1 shown in the figure, the first direction is the same as the X direction. In addition, in top view, the direction parallel to the light emitting surfaces of the light emitting elements 20 arranged on the submounts 30 is the same as the X direction.

[0077] The submounts 30 are arranged so that their first side surfaces 32A are aligned in the first direction. The light emitting elements 20 are arranged so that their light emitting surfaces are aligned in the first direction. When viewed from above, the length of the submounts 30 in a direction perpendicular to the first direction (hereinafter referred to as the second direction) is greater than the length in the first direction.

[0078] In the light emitting device 1, the light emitting surface of the light emitting element 20 faces sideways. The light emitting surfaces of the multiple light emitting elements 20 each face the same direction. Light traveling sideways is emitted from the light emitting surface of the light emitting element 20. In the light emitting device shown in the figure, FFP light with its fast axis direction perpendicular to the mounting surface 11D is emitted from the light emitting surface of the light emitting element 20, which is a semiconductor laser element. The divergence angle in the slow axis direction of each light emitting element 20 is 20 degrees or less. Note that the divergence angle is an angle greater than 0 degrees.

[0079] In the light emitting device 1, one or more reflective members 40 are disposed on the base 10. The reflective member 40 is disposed on the mounting surface 11D. The reflective member 40 has a light reflective surface. Light emitted from the plurality of light emitting elements 20 is reflected by one or more light reflective surfaces. The light reflective surfaces are inclined at an angle of 45 degrees with respect to the traveling direction of the light passing through the optical axis. The light reflected by the light reflective surfaces travels upward. In the illustrated light emitting device 1, one or more main portions of light are irradiated onto the light reflective surface of the reflective member 40.

[0080] The reflective members 40 can be provided one-to-one with respect to the light-emitting elements 20. In other words, the same number of reflective members 40 as the number of light-emitting elements 20 are provided. The multiple reflective members 40 are arranged side by side in the first direction when viewed from above. All of the reflective members 40 have the same size and shape. In the illustrated light-emitting device 1, the light-reflecting surface of the reflective member 40 reflects 90% or more of the light that is irradiated from the main part. Note that one reflective member 40 may be provided for multiple light-emitting elements 20. Also, one reflective member 40 may be provided for all of the light-emitting elements 20. Alternatively, the light-emitting device 1 may not have a reflective member 40.

[0081] In the light emitting device 1, the wiring 60 is joined to the wiring pattern 13. The light emitting device 1 includes a plurality of wirings 60. The plurality of wirings 60 electrically connect one or a plurality of light emitting elements 20 to the base 10.

[0082] In the light emitting device 1, the lid member 70 is bonded to the base 10. The lid member 70 is disposed on the upper surface of the base 10. The lid member 70 is positioned above the stepped portion 12C. By bonding the lid member 70, a closed space is created that is defined by the base 10 and the lid member 70. This space is where the light emitting element 20 is disposed.

[0083] By joining the lid member 70 to the base 10 under a predetermined atmosphere, a hermetically sealed closed space (sealed space) is created. When a semiconductor laser element is used as the light emitting element 20, quality deterioration due to dust collection can be suppressed by hermetically sealing the space in which the semiconductor laser element is disposed. The lid member 70 is translucent to the light emitted from the light emitting element 20. In the illustrated light emitting device 1, 90% or more of the main part of the light emitted from the light emitting element 20 passes through the lid member 70 and is emitted to the outside.

[0084] The optical member 80 is disposed above the cover member 70. The optical member 80 is bonded to the cover member 70. The plurality of light beams emitted from the cover member 70 are incident on the incident surface of the optical member 80. The light beams incident on the incident surface of the optical member 80 are emitted from the lens surface.

[0085] The lens portion of the optical member 80 is disposed in a position closer to one of the two outer surfaces 11C located on opposite sides of the base 10 in a direction perpendicular to the connecting direction. The lens portion of the optical member 80 is disposed in a position spaced the same distance from each of the outer surfaces 11C located on opposite sides of the base 10 in the connecting direction.

[0086] The optical member 80 is arranged such that the lens surface overlaps the reflecting member 40 in a top view. The optical member 80 is arranged such that the lens surface overlaps the light-emitting element 20 in a top view. The optical member 80 is arranged such that the multiple lens surfaces overlap different light-emitting elements 20 in a top view. Light emitted from the different light-emitting elements 20 is emitted from each of one or more lens surfaces. In the illustrated light-emitting device 1, the light-emitting elements 20 are semiconductor laser elements, and a major portion of light emitted from the different light-emitting elements 20 is emitted from each of one or more lens surfaces. One light-emitting element 20 corresponds to one lens surface, and light from the corresponding light-emitting element 20 is emitted from each lens surface.

[0087] (wiring board 9) The wiring substrate 9 has an upper surface, a lower surface, and side surfaces. A plurality of connection patterns 9A are provided on the upper surface of the wiring substrate 9. The plurality of connection patterns 9A include a first connection pattern 9A1 and a second connection pattern 9A2. A plurality of wiring regions 9B are provided on the upper surface of the wiring substrate 9.

[0088] Other components are bonded onto the connection pattern 9A of the wiring board 9. The connection pattern 9A is divided into a plurality of connection regions on the upper surface of the wiring board 9. The plurality of connection regions includes a connection region that is electrically connected to the wiring region 9B. The plurality of connection regions also includes a connection region that is not electrically connected to the wiring region 9B.

[0089] The multiple connection patterns 9A each form the same or similar connection patterns in a top view. Here, "identical or similar" means forming the same encompassing rectangle. The encompassing rectangle refers to the smallest rectangle that encompasses the connection pattern 9A. It can be said that the multiple connection patterns 9A have the same encompassing rectangle. In FIG. 4, the encompassing rectangle is indicated by a dashed line, and the encompassing rectangle for the first connection pattern 9A1 is indicated by the symbol H1, and the encompassing rectangle for the second connection pattern 9A2 is indicated by the symbol H2.

[0090] The first connection pattern 9A1 and the second connection pattern 9A2 are connection patterns 9A with different shapes. The first connection pattern 9A1 has a smaller number of connection regions. In top view, the inclusive rectangles of the first connection pattern 9A1 and the second connection pattern 9A2 have the same size and shape.

[0091] The first connection pattern 9A1 and the second connection pattern 9A2 are arranged side by side. The first connection pattern 9A1 and the second connection pattern 9A2 are arranged close to each other. The distance between the first connection pattern 9A1 and the second connection pattern 9A2 is 300 μm or more and 1000 μm or less.

[0092] (Light emitting module 100) The light-emitting module 100 includes a plurality of light-emitting devices 1, including a first light-emitting device 1A and a second light-emitting device 1B. The first light-emitting device 1A is connected to one of two connection patterns 9A on a wiring substrate 9, and the second light-emitting device 1B is connected to the other. In the illustrated light-emitting module 100, the first light-emitting device 1A is bonded to the first connection pattern 9A1, and the second light-emitting device 1B is bonded to the second connection pattern 9A2.

[0093] The first light emitting device 1A and the second light emitting device 1B are both arranged on the wiring board 9 in the same orientation. The first light emitting device 1A and the second light emitting device 1B are both arranged side by side so that the lens portions of the optical members 80 are in the same direction. For example, in the light emitting module 100, the orientation of the electrodes can be changed by rotating the first light emitting device 1A and the second light emitting device 1B by 180 degrees and mounting them on the wiring board 9. By mounting the first light emitting device 1A and the second light emitting device 1B in the same orientation, such flexible adaptation is possible without changing the interval between the light emitted from the first light emitting device 1A and the light emitted from the second light emitting device 1B.

[0094] Here, the base 10 provided in the first light emitting device 1A is referred to as the first base 10A, and the base 10 provided in the second light emitting device 1B is referred to as the second base 10B. Furthermore, the light emitting element 20 provided in the first light emitting device 1A is referred to as the first light emitting element 20A, and the light emitting element 20 provided in the second light emitting device 1B is referred to as the second light emitting element 20B. Furthermore, the submount 30 provided in the first light emitting device 1A is referred to as the first submount 30A, and the submount 30 provided in the second light emitting device 1B is referred to as the second submount 30B. Furthermore, the protective element 50 provided in the first light emitting device 1A is referred to as the first protective element 50A, and the protective element 50 provided in the second light emitting device 1B is referred to as the second protective element 50B.

[0095] The length of the first base 10A in the long side direction is 90% to 105% of the length of the second base 10B in the long side direction. The length of the first base 10A in the short side direction is 90% to 105% of the length of the second base 10B in the short side direction. In the illustrated light emitting device 1, the first base 10A and the second base 10B have the same length in both the long side direction and the short side direction. Furthermore, the first base 10A and the second base 10B have the same size and shape. In this manner, by adopting a mounting mode in which the size of the surface of the first light emitting device 1A that is connected to the wiring board 9 and the size of the surface of the second light emitting device 1B that is connected to the wiring board 9 are similar, the light emitting device 1 to be connected to the wiring board 9 can be flexibly selected to manufacture the light emitting module 100.

[0096] The length of the first base 10A in the first direction based on the first light emitting device 1A is 90% to 105% of the length of the second base 10B in the first direction based on the second light emitting device 1B. In the illustrated light emitting module 100, the first direction based on the first light emitting device 1A and the first direction based on the second light emitting device 1B are parallel (the same direction). Note that "parallel" here includes a difference of ±3 degrees.

[0097] Depending on the orientation in which the first light emitting device 1A and the second light emitting device 1B are arranged on the wiring substrate 9, the first direction based on the first light emitting device 1A and the first direction based on the second light emitting element 20B may not be parallel to each other. Hereinafter, the direction in which the first light emitting elements 20A are lined up will be referred to as the third direction, and the direction in which the second light emitting elements 20B are lined up will be referred to as the fourth direction. In the illustrated light emitting module 100, the first direction based on the first light emitting element 20A and the third direction are the same direction, and the first direction based on the second light emitting element 20B and the fourth direction are the same direction.

[0098] The length in the third direction of the mounting surface 11D of the first base 10A (hereinafter referred to as the first mounting surface) is 90% to 105% of the length in the fourth direction of the mounting surface 11D of the second base 10B (hereinafter referred to as the second mounting surface). The length in the long side direction of the first mounting surface 11D is 90% to 105% of the length in the long side direction of the second mounting surface 11D. The length in the short side direction of the first mounting surface 11D is 90% to 105% of the length in the short side direction of the second mounting surface 11D. In the illustrated light emitting device 1, the first mounting surface 11D and the second mounting surface 11D have the same length in both the long side direction and the short side direction and are the same size and shape.

[0099] The first base 10A has at least two wiring patterns 13, and the second base 10B has at least three wiring patterns 13. In the illustrated second light emitting device 1B, four wiring patterns 13 are provided on the second base 10B.

[0100] The plurality of first light-emitting elements 20A of the first light-emitting device 1A may include three or more first light-emitting elements 20A. That is, the first light-emitting device 1A may include three or more first light-emitting elements 20A. The number of first light-emitting elements 20A included in the first light-emitting device 1A may be seven or less.

[0101] The second light emitting device 1B may include second light emitting elements 20B in a number that is one or more greater than the number of first light emitting elements 20A included in the first light emitting device 1A. The second light emitting device 1B's multiple second light emitting elements 20B may include second light emitting elements 20B in a number that is one or more greater than the number of first light emitting elements 20A arranged on the first mounting surface. The number of second light emitting elements 20B included in the second light emitting device 1B may be equal to or less than the number of first light emitting elements 20A included in the first light emitting device 1A plus two. In this way, by preparing first light emitting devices 1A and second light emitting devices 1B that differ in the number of mounted light emitting elements 20, the number and type of light emitting elements 20 to be mounted in the light emitting module 100 can be flexibly determined in a mounting mode in which these devices are mounted on a wiring substrate 9.

[0102] The first light-emitting element 20A emits light of a first color, and the second light-emitting element 20B emits light of a color different from the first color. The second light-emitting element 20B emits light of a second color different from the first color. The plurality of second light-emitting elements 20B may include a second light-emitting element 20B that emits light of the second color and a second light-emitting element 20B that emits light of a third color different from the first color and the second color. Hereinafter, the second light-emitting element 20B that emits light of the second color will be referred to as second light-emitting element 20B1, and the second light-emitting element 20B that emits light of the third color will be referred to as second light-emitting element 20B2 to distinguish them.

[0103] In the light-emitting module 100, the plurality of first light-emitting elements 20A and the plurality of second light-emitting elements 20B include a light-emitting element 20 that emits red light, a light-emitting element 20 that emits green light, and a light-emitting element 20 that emits blue light. For example, in the light-emitting module 100, the first color can be red, the second color can be green, and the third color can be blue.

[0104] In the light-emitting module 100, the number of first light-emitting elements 20A is greater than the number of second light-emitting elements 20B1, and the number of second light-emitting elements 20B1 is greater than the number of second light-emitting elements 20B2. In the light-emitting module 100 shown in the figure, a light-emitting element 20 with a first light-emitting efficiency can be used as the first light-emitting element 20A, a light-emitting element 20 with a second light-emitting efficiency can be used as the second light-emitting element 20B1, and a light-emitting element 20 with a third light-emitting efficiency can be used as the second light-emitting element 20B2.

[0105] In the light-emitting module 100, semiconductor laser elements including a GaAs-based semiconductor can be used for the plurality of first light-emitting elements 20A, and semiconductor laser elements including a GaN-based semiconductor can be used for the plurality of second light-emitting elements 20B. In this manner, by mounting light-emitting elements 20 made of different material systems in separate light-emitting devices, the stability and ease of manufacturing the light-emitting devices can be improved, and the productivity of the light-emitting module 100 can be improved.

[0106] The length of the first light emitting element 20A in a direction parallel to the light emitting surface is greater than the length of the second light emitting element 20B in a direction parallel to the light emitting surface, and the difference between the former length and the latter length is 100 μm or more and 400 μm or less.

[0107] The length of the first light-emitting element 20A in the third direction is greater than the length of the second light-emitting element 20B in the fourth direction. The difference between the former length and the latter length is 100 μm or more and 400 μm or less. In a top view, the length of the first light-emitting element 20A in a direction perpendicular to the third direction is greater than the length of the second light-emitting element 20B in a direction perpendicular to the fourth direction. The difference between the former length and the latter length is 100 μm or more and 900 μm or less.

[0108] The plurality of first submounts 30A of the first light emitting device 1A may include three or more first submounts 30A. That is, the first light emitting device 1A may include three or more first submounts 30A. The number of first submounts 30A included in the first light emitting device 1A may be seven or less.

[0109] The second light emitting device 1B may include second submounts 30B whose number is one or more greater than the number of first submounts 30A included in the first light emitting device 1A. The second light emitting device 1B's multiple second submounts 30B may include second submounts 30B whose number is one or more greater than the number of first submounts 30A arranged on the first mounting surface. The number of second submounts 30B included in the second light emitting device 1B may be equal to or less than the number of first submounts 30A included in the first light emitting device 1A plus two.

[0110] The length of the first submount 30A in the third direction is greater than the length of the second submount 30B in the fourth direction. The difference between the former length and the latter length is 100 μm or more and 400 μm or less. The former length is 101% or more and 150% or less of the latter length. By adopting a mounting mode in which the sizes of the first submount 30A and the second submount 30B are determined according to the sizes of the first light-emitting element 20A and the second light-emitting element 20B, it is possible to take into consideration factors that affect optical characteristics such as heat dissipation, and to manufacture a light-emitting module 100 that emits light efficiently.

[0111] The length of the second submount 30B in the direction perpendicular to the fourth direction is greater than the length of the first submount 30A in the direction perpendicular to the third direction. The difference between the lengths of the first and second submounts is 70 μm or more and 300 μm or less. The length of the first submount is 101% or more and 130% or less of the length of the first submount.

[0112] The first light-emitting element 20A is disposed at a position where an imaginary straight line, which passes through one of three points that divide the short side of the top surface 31 of the first submount 30A into four equal parts in a top view and is parallel to the long side of the top surface 31, passes through both the light emission surface and the side surface opposite the light emission surface of the first light-emitting element 20A. Hereinafter, the imaginary straight line will be referred to as the "imaginary line."

[0113] The first protection element 50A is disposed at a position where an imaginary line passes that is parallel to the third direction and passes through the first light emitting element 20A in a top view. The first protection element 50A is also disposed at a position where an imaginary line passes through the other end point of the three points that divide the short side of the top surface 31 of the first submount 30A into four equal parts and is parallel to the long side of the top surface 31 in a top view.

[0114] When viewed from above, the second light-emitting element 20B is positioned such that an imaginary line passing through the center of the short side of the upper surface 31 of the second submount 30B and parallel to the long side passes through both the light emission surface and the side surface opposite the light emission surface of the second light-emitting element 20B.

[0115] The second protection element 50B is disposed at a position where an imaginary line that is parallel to the fourth direction and passes through the second light-emitting element 20B does not pass through in top view. In other words, the second protection element 50B is disposed so that any line that is parallel to the fourth direction and passes through the second protection element 50B in top view does not pass through the second light-emitting element 20B.

[0116] For example, when viewed from above, with the light emitting surface side of the light emitting element 20 defined as the front and the side opposite the light emitting surface defined as the rear, the first protective element 50A is disposed to the side of the first light emitting element 20A, and the second protective element 50B is disposed to the rear of the second light emitting element 20B. By adopting an embodiment in which the protective elements 50 are disposed at different positions in this way, the mounting space of the submount 30 can be effectively utilized, and a compact light emitting module 100 can be realized.

[0117] The second protection element 50B is disposed on the second submount 30B at a position where the distance from the second protection element 50B to the second side surface 32B is shorter than the distance from the second light-emitting element 20B to the second side surface 32B. The longest distance from the second side surface 32B to the second protection element 50B is shorter than the shortest distance from the second side surface 32B to the second light-emitting element 20B. The second protection element 50B is disposed near the second side surface 32B.

[0118] The second protective element 50B is disposed at a position that passes through the center of the length of the second light emitting element 20B in a direction parallel to the light emitting surface, but does not pass through an imaginary line perpendicular to the light emitting surface, in a top view. By disposing the second protective element 50B at such a position, it is possible to reduce the influence of light leaking from the side surface opposite to the light emitting surface.

[0119] With respect to the second submount 30B and the second light-emitting element 20B disposed on the second submount 30B, the length of the long side of the upper surface 31 in a top view is 105% to 150% of the length in a direction perpendicular to the light emission surface of the second light-emitting element 20B. Alternatively, the length of the second submount 30B in the second direction in a top view is 105% to 150% of the length of the second light-emitting element 20B in the second direction.

[0120] With regard to the second submount 30B, the second light-emitting element 20B, and the protective element 50 disposed on the second submount 30B, the length of the second submount 30B in the second direction is greater than the sum of the length of the second light-emitting element 20B in the second direction and the length of the protective element 50 in the second direction by 200 μm to 500 μm. This reduces the size of the submount 30 in the second direction, and enables the light-emitting device 1 to be manufactured in a compact size in the second direction.

[0121] The lid member 70 bonded to the first base 10A and the lid member 70 bonded to the second base 10B have the same size and shape. However, the sizes and shapes of these lid members 70 may be different. Using the same lid member 70 can improve production efficiency.

[0122] The optical member 80 of the first light emitting device 1A and the optical member 80 of the second light emitting device 1B have different shapes. These optical members 80 have the same size and shape when viewed from above. In the illustrated light emitting module 100, the optical member 80 is a lens member, and the lens member of the first light emitting device 1A and the lens member of the second light emitting device 1B have different lens shapes. The lens member of the second light emitting device 1B has a greater number of lens surfaces than the lens member of the first light emitting device 1A.

[0123] Let G1 be the difference between the minimum length of the lens surfaces in the connecting direction of the multiple lens surfaces of the optical member 80 of the first light emitting device 1A and the minimum length of the lens surfaces in the connecting direction of the multiple lens surfaces of the optical member 80 of the second light emitting device 1B. Let G2 be the difference between the spacing between the first submounts 30A in the first light emitting device 1A and the spacing between the second submounts 30B in the second light emitting device 1B. In the light emitting module 100, G2 is smaller than G1. Also, G2 is between 0 μm and 100 μm. This allows the size of the submount 30 to be adjusted to correspond to the size of the lens.

[0124] The length of the second light emitting element 20B2 in the direction parallel to the light emitting surface is 95% to 105% of the length of the second light emitting element 20B1 in the direction parallel to the light emitting surface. The multiple second light emitting elements 20B are aligned so that the lengths of the light emitting elements in the direction parallel to the light emitting surface are approximately the same.

[0125] The plurality of second light-emitting elements 20B1 are arranged side by side in the fourth direction. The plurality of second light-emitting elements 20B2 are arranged side by side in the fourth direction. In top view, on the second mounting surface 11D, the second light-emitting elements 20B1 are arranged in one of two areas divided into two by a virtual line perpendicular to the fourth direction, and the second light-emitting elements 20B2 are arranged in the other area. In this case, the second light-emitting elements 20B2 are not arranged in one area, and the second light-emitting elements 20B1 are not arranged in the other area.

[0126] The second base 10B has two wiring portions that face each other in the fourth direction in top view and have multiple second light-emitting elements 20B disposed between them. Two wiring patterns 13 are provided in one of the two wiring portions to electrically connect the second light-emitting elements 20B1, and two wiring patterns 13 are provided in the other to electrically connect the second light-emitting elements 20B2.

[0127] The plurality of wirings 60 include a plurality of first wirings 60A for electrically connecting the plurality of second light-emitting elements 20B1 and a plurality of second wirings 60B for electrically connecting the plurality of second light-emitting elements 20B2. In the second light-emitting device 1B, the plurality of second light-emitting elements 20B1 are electrically connected in series, and the plurality of second light-emitting elements 20B2 are electrically connected in series.

[0128] The plurality of first wirings 60A includes a first wiring 60A bonded to the first step portion 12C of the second base 10B and to the second light-emitting element 20B1 closest to the first step portion 12C or to the second submount 30B on which the second light-emitting element 20B1 is disposed. The plurality of first wirings 60A also includes a first wiring 60A bonded to the first step portion 12C of the second base 10B and to the second light-emitting element 20B1 farthest from the first step portion 12C or to the second submount 30B on which the second light-emitting element 20B1 is disposed. One of these two first wirings 60A is bonded to the wiring pattern 13 in one region of a region bisected by an imaginary line that passes through the side surface of the second light-emitting element 20B1 opposite the light emission surface and is parallel to the fourth direction, in a top view, and the other first wiring 60A is bonded to another wiring pattern 13 in the other region.

[0129] The plurality of second wirings 60B includes a second wiring 60B bonded to the second step portion 12C of the second base 10B and to the second light-emitting element 20B2 closest to the second step portion 12C or to the second submount 30B on which the second light-emitting element 20B2 is disposed. The plurality of second wirings 60B also includes a second wiring 60B bonded to the second step portion 12C of the second base 10B and to the second light-emitting element 20B1 farthest from the second step portion 12C or to the submount 30 on which the second light-emitting element 20B1 is disposed. One of these two second wirings 60B is bonded to the wiring pattern 13 in one region of a region bisected by an imaginary line that passes through the side surface of the second light-emitting element 20B1 opposite the light emission surface and is parallel to the fourth direction, in a top view, and the other second wiring 60B is bonded to another wiring pattern 13 in the other region.

[0130] Second Embodiment A light-emitting module 200 according to a second embodiment will be described. FIGS. 1 to 4, 6 to 11, and 14 to 16 are drawings for explaining an exemplary embodiment of the light-emitting module 200. FIG. 1 is a perspective view of the light-emitting module 200. FIG. 2 is a top view of the light-emitting module 200. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4 is a top view of the wiring substrate 9 in the light-emitting module 200. FIG. 6 is a perspective view of a first light-emitting device 1A. FIG. 7 is a top view of the first light-emitting device 1A. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7. FIG. 9 is a top view showing components mounted on a first base 10A of the first light-emitting device 1A. FIG. 10 is a perspective view of a second light-emitting device 1C. FIG. 11 is a top view of the second light-emitting device 1C. FIG. 14 is a perspective view for explaining components arranged inside the first light-emitting device 1A and the second light-emitting device 1C in the light-emitting module 200. Fig. 15 is a cross-sectional view taken along the line XV-XV in Fig. 11. Fig. 16 is a top view showing the configuration of each component mounted on the second base substrate 10B of the second light emitting device 1C.

[0131] Light emitting module 200 differs from light emitting module 100 in that second light emitting device 1B of light emitting module 100 is replaced with second light emitting device 1C, but the remaining points are the same. Therefore, the differences between second light emitting device 1C and second light emitting device 1B will be described below.

[0132] The second light emitting device 1C includes a plurality of components. The plurality of components includes a second base 10B, a plurality of second light emitting elements 20B, a plurality of second submounts 30B, one or a plurality of reflecting members 40, a plurality of second protective elements 50B, a plurality of wirings 60, a cover member 70, and an optical member 80. In the second light emitting device 1C, the plurality of second light emitting elements 20B include a second light emitting element 20B1 and a second light emitting element 20B2. The second light emitting device 1C may include other components.

[0133] The second base 10B (base 10), the second light-emitting element 20B (light-emitting element 20), the second submount 30B (submount 30), the reflecting member 40, the second protective element 50B (protective element 50), the wiring 60, the cover member 70, and the optical member 80 are the same as those in the first embodiment, and therefore the description of each component is the same as that in the first embodiment.

[0134] The second light emitting device 1C has different characteristics from the second light emitting device 1B of the first embodiment, but also has some common features. Of the contents described for the second light emitting device 1B in the first embodiment, those that do not cause inconsistencies based on Figures 1 to 4, 6 to 11, and 14 to 16 also apply to the second light emitting device 1C.

[0135] In the second submount 30B in which the second light-emitting element 20B1 farthest from the first step portion 12C is arranged, the second protection element 50B is arranged at a position farther from the first step portion 12C than the first step portion 12C and the first wiring 60A joined to this second submount 30B.

[0136] In the second submount 30B on which the second light-emitting element 20B2 farthest from the second step 12C is disposed, the second protection element 50B is disposed at a position farther from the second step 12C than the second wiring 60B joined to the second step 12C and the second submount 30B. This makes it possible to reduce the length of the wiring 60 and improve stability.

[0137] In each of the second submounts 30B on which the second light-emitting elements 20B1 are arranged, the second protection element 50B is arranged at the same position on the second submount 30B in top view. In each of the second submounts 30B on which the second light-emitting elements 20B2 are arranged, the second protection element 50B is arranged at the same position on the second submount 30B.

[0138] Third Embodiment A light-emitting module 300 according to a third embodiment will be described. FIGS. 1 to 4, 6 to 11, and 17 to 19 are drawings for explaining an exemplary embodiment of the light-emitting module 300. FIG. 1 is a perspective view of the light-emitting module 300. FIG. 2 is a top view of the light-emitting module 300. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4 is a top view of the wiring substrate 9 in the light-emitting module 300. FIG. 6 is a perspective view of a first light-emitting device 1A. FIG. 7 is a top view of the first light-emitting device 1A. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7. FIG. 9 is a top view showing components mounted on a first base 10A of the first light-emitting device 1A. FIG. 10 is a perspective view of a second light-emitting device 1D. FIG. 11 is a top view of the second light-emitting device 1D. FIG. 17 is a perspective view for explaining components arranged inside the first light-emitting device 1A and the second light-emitting device 1D in the light-emitting module 300. Fig. 18 is a cross-sectional view taken along the line XVIII-XVIII in Fig. 11. Fig. 19 is a top view showing the configuration of each component mounted on the second base body 10C of the second light emitting device 1D.

[0139] Light emitting module 300 differs from light emitting module 100 in that second light emitting device 1B of light emitting module 100 is replaced with second light emitting device 1D, but the two share other commonalities. Light emitting module 300 also differs from light emitting module 200 in that second light emitting device 1C of light emitting module 200 is replaced with second light emitting device 1D, but the two share other commonalities. Therefore, the differences between second light emitting device 1D, second light emitting device 1B, and second light emitting device 1C will be described below.

[0140] The second light emitting device 1D includes a plurality of components, including a second base 10C, a plurality of second light emitting elements 20B, a plurality of second submounts 30B, a plurality of third submounts 30C, one or a plurality of reflecting members 40, a plurality of second protective elements 50B, a plurality of wirings 60, a lid member 70, and an optical member 80. The second light emitting device 1D may include other components as well.

[0141] The second light-emitting element 20B (light-emitting element 20), the second submount 30B (submount 30), the reflective member 40, the second protective element 50B (protective element 50), the wiring 60, the cover member 70, and the optical member 80 are the same as those in the first embodiment, and therefore the description of each component is the same as that in the first embodiment.

[0142] The second base 10C has different features from the second base 10B of the first embodiment, but also has some common features. Of the details described for the second base 10B in the first embodiment, those that do not cause inconsistencies based on Figures 1 to 4, 6 to 11, and 17 to 19 also apply to the second base 10C. Below, the different features of the second base 10C will be described.

[0143] (Second base 10C) In the second base 10C, the second step portion 12C is formed along part or all of the second inner side surface 11E and part of the inner side surface 11E (hereinafter referred to as the third inner side surface) that intersects with the second inner side surface 11E. The second step portion 12C can be said to be a step portion 12C that is integrally formed along each of the adjacent second inner side surface 11E and third inner side surface 11E.

[0144] The second step portion 12C is formed along the entire inner surface 11E extending in the short-side direction of the rectangular outer edge of the second base 10C, and along a part of the inner surface 11E extending in the long-side direction of the outer edge, of the adjacent inner surface 11E. The second step portion 12C is formed along the inner surface 11E, with a length that is 10% or more and less than 50% of the inner surface 11E extending in the long-side direction.

[0145] In the illustrated second light emitting device 1D, the second inner surface 11E extends along the short side of the rectangular outer edge of the second base 10C, and the third inner surface 11E extends along the long side. In addition, the second base 10C does not have a step portion 12C formed along the inner surface 11E opposite to the third inner surface 11E.

[0146] In the second step portion 12C, wiring patterns 13 are provided in both a portion formed along the inner surface 11E extending in the short side direction of the rectangular outer edge of the second base 10C and a portion formed along the inner surface 11E extending in the long side direction.

[0147] The second light emitting device 1D will be described below. The second light emitting device 1D has different features from the second light emitting device 1B of the first embodiment and the second light emitting device 1C of the second embodiment, but also has some common features. Of the details explained about the second light emitting device 1B in the first embodiment and the details explained about the second light emitting device 1C in the second embodiment, those details that do not cause inconsistencies based on Figures 1 to 4, 6 to 11, and 17 to 19 also apply to the second light emitting device 1D.

[0148] (Second light emitting device 1D) In the second light emitting device 1D, the length of the long side of the top surface 31 of the third submount 30C is smaller than the length of the long side of the top surface 31 of the second submount 30B. The length of the short side of the top surface 31 of the third submount 30C can be the same as the length of the short side of the top surface 31 of the second submount 30B.

[0149] The third submount 30C does not have the second protection element 50B disposed thereon. By not disposing the second protection element 50B, the length of the long side of the upper surface 31 can be made shorter than that of the second submount 30B.

[0150] The length of the long side of the second submount 30B is greater than that of the third submount 30C by 100 μm to 600 μm, which prevents the base 10 from becoming too large while ensuring an area in the second submount 30B for arranging the second protection element 50B.

[0151] In the second light emitting device 1D, one of the second light emitting element 20B1 and the second light emitting element 20B2 is disposed on the second submount 30B, and the other is disposed on the third submount 30C. In the illustrated second light emitting device 1D, the second light emitting element 20B1 is disposed on the second submount 30B, and the second light emitting element 20B2 is disposed on the third submount 30C.

[0152] The second submount 30B is disposed on the first step portion 12C side, and the third submount 30C is disposed on the second step portion 12C side.

[0153] In relation to the portion of the second step portion 12C formed along the third inner surface 11E, the third submount 30C is disposed at a position where a virtual line passing through this portion of the second step portion 12C passes, and is perpendicular to the third inner surface 11E in a top view. The second submount 30B is disposed at a position where a virtual line passing through this portion of the second step portion 12C passes, and is parallel to the third inner surface 11E in a top view. The second light-emitting element 20B1 disposed on the second submount 30B is not disposed at a position where this virtual line passes. The second protection element 50B disposed on the second submount 30B is disposed at a position where this virtual line passes.

[0154] The second protective element 50B that protects the second light-emitting elements 20B2 arranged on the third submount 30C is arranged on the second step portion 12C. One second protective element 50B that protects each of the second light-emitting elements 20B2 arranged on the third submount 30C is arranged on the second step portion 12C. There is only one second protective element 50B arranged on the second step portion 12C. This allows for a reduction in the number of protective elements 50 used compared to arranging a protective element 50 for each individual light-emitting element 20.

[0155] The multiple wirings 60 bonded to the second step portion 12C include a wiring 60 bonded to the third submount 30C located closest to the second inner side surface 11E or the second light-emitting element 20B2 located on this third submount 30C, and a wiring 60 bonded to the third submount 30C located farthest from the second inner side surface 11E or the second light-emitting element 20B2 located on this third submount 30C. In the second step portion 12C, the second protection element 50B is disposed between these two wirings 60. The former wiring 60 is bonded to the wiring pattern 13 at a portion formed along the second inner side surface 11E of the second step portion 12C, and the latter wiring 60 is bonded to the wiring pattern 13 at a portion formed along the third inner side surface 11E of the second step portion 12C.

[0156] In the second light emitting device 1D, the number of second submounts 30B arranged on the second mounting surface 11D is greater than the number of third submounts 30C arranged on the second mounting surface 11D. The number of second submounts 30B arranged on the second mounting surface 11D is three or more.

[0157] When a protective element 50 is provided in a one-to-one correspondence with a light-emitting element 20, if the protective element 50 is placed in the step portion 12C, the joining of the wiring 60 to the submount 30 becomes complicated. However, if the second submount 30B is used, the semiconductor laser element 20 and the protective element 50 can be placed on the submount 30, making it easier to join the wiring 60.

[0158] It is considered that the greater the number of light emitting elements 20 connected in series, the greater the significance of protecting each individual light emitting element 20. On the other hand, if the number of light emitting elements 20 connected in series is not that large, it is also possible to consider protecting them all together with one protection element 50. According to this concept, it can also be considered preferable that the number of third submounts 30C arranged on the second mounting surface 11D is two or less.

[0159] The distance from the second inner surface 11E to the point farthest from the second inner surface 11E in the portion of the second step portion 12C that is partially provided on the third inner surface 11E is shorter than the distance from the second inner surface 11E to the second submount 30B that is located closest to the second inner surface 11E. This allows the second submount 30B to be located without contacting the second step portion 12C.

[0160] In the second light-emitting device 1D, the difference between the long-side length of the second submount 30B and the long-side length of the third submount 30C is smaller than the length of the portion of the second step portion 12C formed along the third inner side surface 11E in the direction perpendicular to the third inner side surface 11E. This difference in length is preferably 30% to 90% of the length of the portion of the second step portion 12C formed along the third inner side surface 11E in the direction perpendicular to the third inner side surface 11E. This may make the effect of partially providing the step portion 12C more pronounced.

[0161] <Fourth embodiment> A light-emitting module 400 according to a fourth embodiment will be described. FIGS. 1 to 4, 6, 7, 10 to 13, and 20 are drawings for explaining an exemplary embodiment of the light-emitting module 400. FIG. 1 is a perspective view of the light-emitting module 400. FIG. 2 is a top view of the light-emitting module 400. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4 is a top view of the wiring substrate 9 in the light-emitting module 400. FIG. 6 is a perspective view of a first light-emitting device 1E. FIG. 7 is a top view of the first light-emitting device 1E. FIG. 10 is a perspective view of a second light-emitting device 1B. FIG. 11 is a top view of the second light-emitting device 1B. FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 11. FIG. 13 is a top view showing components mounted on a second base 10B of the second light-emitting device 1B. FIG. 20 is a top view showing components mounted on a first base 10A of the first light-emitting device 1E.

[0162] Light emitting module 400 differs from light emitting module 100 in that first light emitting device 1A of light emitting module 100 is replaced with first light emitting device 1E, but the remaining points are the same. Light emitting module 400 can also include second light emitting device 1C or second light emitting device 1D instead of second light emitting device 1B. Therefore, the differences between first light emitting device 1E and first light emitting device 1A will be described.

[0163] (First light emitting device 1E) The first light emitting device 1E has different features from the first light emitting device 1A of the first to third embodiments, but also has some common features. Of the details explained about the first light emitting device 1A in the first to third embodiments, those details that do not cause inconsistencies based on Figure 20 also apply to the first light emitting device 1E.

[0164] In the first light emitting device 1E, the first protective element 50A is disposed on the wiring portion of the first base 10A. The first protective element 50A is disposed on the upper surface of the stepped portion 12C of the first base 10A. In the first light emitting device 1E, the first protective element 50A is not disposed on the first submount 30A.

[0165] Fifth Embodiment A light-emitting module 500 according to a fifth embodiment will be described. FIGS. 6 to 13, 21, and 22 are diagrams for explaining an exemplary embodiment of the light-emitting module 500. FIG. 21 is a top view of the light-emitting module 500. FIG. 22 is a top view of a wiring substrate 99 in the light-emitting module 500. FIG. 6 is a perspective view of a first light-emitting device 1A. FIG. 7 is a top view of the first light-emitting device 1A. FIG. 8 is a cross-sectional view taken along the VIII-VIII line in FIG. 7. FIG. 9 is a top view showing components mounted on a first base 10A of the first light-emitting device 1A. FIG. 10 is a perspective view of a second light-emitting device 1B. FIG. 11 is a top view of the second light-emitting device 1B. FIG. 12 is a cross-sectional view taken along the XII-XII line in FIG. 11. FIG. 13 is a top view showing components mounted on a second base 10B of the second light-emitting device 1B. 22, the inclusive rectangles are indicated by dashed lines, the inclusive rectangle for first connection pattern 9A1 is indicated by symbol H1, and the inclusive rectangle for second connection pattern 9A2 is indicated by symbol H2. The dashed line L1 is a virtual line parallel to the Y direction.

[0166] The light-emitting module 500 differs from the light-emitting module 100 in that the wiring board 9 of the light-emitting module 100 is replaced with a wiring board 99 and the orientation of the first light-emitting device 1A and the second light-emitting device 1B is different, but the light-emitting module 500 shares the same other features. The first light-emitting device 1A of the first embodiment may be replaced with the first light-emitting device 1E of the fourth embodiment. The second light-emitting device 1B of the first embodiment may be replaced with the second light-emitting device 1C of the second embodiment or the second light-emitting device 1D of the third embodiment. In other words, the light-emitting module 500 differs from the light-emitting module 200, the light-emitting module 300, or the light-emitting module 400 in the same respects, but shares the same other features. Also, FIGS. 15 and 16, or FIGS. 18 and 19 may be selectively used as drawings for explaining the light-emitting module 500 according to the fifth embodiment.

[0167] The wiring board 99 in the light-emitting module 500 will be described below. The wiring board 99 has different characteristics from the wiring boards 9 of the first to third embodiments, but also has some common features. Of the contents described about the wiring board 9 in the first to third embodiments, those that do not cause inconsistencies based on Figures 21 and 22 also apply to the wiring board 99.

[0168] (wiring board 99) In the wiring board 99, the first connection pattern 9A1 and the second connection pattern 9A2 are connection patterns 9A having the same shape. However, the connection patterns do not have to have the same shape. The rectangle that includes the first connection pattern 9A1 and the second connection pattern 9A2 is a rectangle with long sides and short sides.

[0169] The first connection pattern 9A1 and the second connection pattern 9A2 are arranged side by side with their orientations reversed. On the wiring board 99, the first connection pattern 9A1 has an inclusive rectangle of the same size and shape as the second connection pattern 9A2, and its orientation is 90 degrees different from that of the inclusive rectangle of the second connection pattern 9A2.

[0170] In top view, the imaginary line connecting the center point P1 of the inclusive rectangle of the first connection pattern 9A1 and the center point P2 of the inclusive rectangle of the second connection pattern 9A2 is not parallel to the Y direction. In other words, this imaginary line is tilted with respect to the Y direction. The angle of tilt of this imaginary line with respect to the Y direction (hereinafter referred to as the first angle) is greater than 0 degrees and less than 45 degrees. The first angle can be 20 degrees or less.

[0171] Next, the light emitting module 500 will be described. The light emitting module 500 has different features from the light emitting modules of the first to fourth embodiments, but also has some common features. Of the details described about the light emitting modules of the first to fourth embodiments, those that do not cause inconsistencies based on Figures 6 to 13, 15, 16, and 18 to 22 also apply to the light emitting module 500.

[0172] (light emitting module 500) In the light-emitting module 500, the first light-emitting device 1A and the second light-emitting device 1B are arranged on the wiring substrate 99 in different orientations. In a top view, the orientation in which the first light-emitting device 1A is arranged is rotated by 90 degrees relative to the orientation in which the second light-emitting device 1B is arranged. In the light-emitting module 500, the third direction and the fourth direction are orthogonal to each other.

[0173] The polarization direction of the light emitted from the first light-emitting element 20A is different from the polarization direction of the light emitted from the second light-emitting element 20B. The polarization direction of the light emitted from the first light-emitting element 20A may be p-polarized light, and the polarization direction of the light emitted from the second light-emitting element 20B may be s-polarized light. Alternatively, the polarization direction of the light emitted from the first light-emitting element 20A may be s-polarized light, and the polarization direction of the light emitted from the second light-emitting element 20B may be p-polarized light.

[0174] The polarization direction of the light emitted from the first light emitting device 1A is the same as the polarization direction of the light emitted from the second light emitting device 1B. The fast axis direction of the FFP of the light that passes through the optical member 80 of the first light emitting device 1A and is emitted from the first light emitting device 1A is the X direction, and the fast axis direction of the FFP of the light that passes through the optical member 80 of the second light emitting device 1B and is emitted from the first light emitting device 1A is the Y direction.

[0175] The angle of inclination of a virtual line L2 connecting the points at which the optical axes of the light emitted from each of the multiple first light-emitting elements 20A exit the first light-emitting device 1A with respect to the Y direction (hereinafter referred to as the second angle) is smaller than the first angle. The second angle is equal to or greater than 0 degrees and less than 20 degrees. The second angle of the illustrated light-emitting module 500 is 0 degrees. In other words, the optical axes of the light emitted from each of the multiple first light-emitting elements 20A are aligned parallel to the Y direction at the points at which the light exits the first light-emitting device 1A.

[0176] The angle of inclination of a virtual line connecting a midpoint P3 of a line segment connecting the points at which the optical axes of light emitted from two first light-emitting elements 20A located at both ends of the plurality of first light-emitting elements 20A aligned in the third direction exit the first light-emitting device 1A and a midpoint P4 of a line segment connecting the points at which the optical axes of light emitted from two second light-emitting elements 20B located at both ends of the plurality of second light-emitting elements 20B aligned in the fourth direction exit the second light-emitting device 1B with respect to the Y direction (hereinafter referred to as the third angle) is smaller than the first angle. The third angle is between 0 degrees and 10 degrees. The third angle of the illustrated light-emitting module 500 is 0 degrees. The positions of the two connection patterns 9A of the wiring substrate 99 are adjusted so that the third angle is 0 degrees, and therefore the first angle is greater than 0 degrees.

[0177] Although the above describes various embodiments of the present invention, the light-emitting module according to the present invention is not strictly limited to the light-emitting modules of the various embodiments. In other words, the present invention can be realized without being limited to the external shape and structure of the light-emitting module disclosed in the various embodiments. The present invention can be applied without necessarily including all necessary and sufficient components. For example, if the claims do not recite some of the components of the light-emitting module disclosed in the embodiments, the claims allow for the design freedom of those components by those skilled in the art, such as substitution, omission, modification of shape, and material changes, and specify that the invention described in the claims applies. [Industrial Applicability]

[0178] The light-emitting modules described in each embodiment can be used in projectors, vehicle headlights, head-mounted displays, lighting, displays, and the like. [Explanation of symbols]

[0179] 100, 200, 300, 400, 500 Light-emitting modules 1. Light-emitting device 1A, 1E First light-emitting device 1B, 1C, 1D Second light-emitting device 10 Base 10A 1st base 10B, 10C 2nd base 11A Top 11B Bottom side 11C External surface 11D Mounting surface 11E Inside surface 12C Step 13 Wiring Pattern 20 Light-emitting element 20A First light-emitting element 20B, 20B1, 20B2 Second light-emitting element 30 Submount 31 Top side 32 Side 32A 1st side 32B 2nd side 30A 1st submount 30B Second submount 30C 3rd submount 40 Reflective material 50 Protection element 50A First Protection Element 50B Second protection element 60 Wiring 60A 1st wiring 60B 2nd wiring 70 Lid member 80 Optical Components 9, 99 Wiring board 9A connection pattern 9A1 First connection pattern 9A2 Second connection pattern 9B Wiring area

Claims

1. a wiring substrate having a first connection pattern and a second connection pattern provided on an upper surface thereof; a first light emitting device including: a plurality of first semiconductor laser elements that emit red light; and a first base having a first mounting surface on which the plurality of first semiconductor laser elements are arranged, the first base being bonded to the first connection pattern of the wiring board and electrically connected to the plurality of first semiconductor laser elements and the wiring board; a second light emitting device including: a plurality of second semiconductor laser elements that emit green light, one or more third semiconductor laser elements that emit blue light, and a second base that has a second mounting surface on which the plurality of second semiconductor laser elements and the one or more third semiconductor laser elements are arranged, the second base being bonded to the second connection pattern on the wiring board and electrically connecting the plurality of second semiconductor laser elements, the one or more semiconductor laser elements, and the wiring board; Equipped with a light emitting module, wherein the number of the plurality of first semiconductor laser elements is greater than the number of the plurality of second semiconductor laser elements, and the number of the plurality of second semiconductor laser elements is greater than the number of the one or more semiconductor laser elements.

2. the plurality of first semiconductor laser elements are arranged side by side in a first direction, the plurality of second semiconductor laser elements and the one or more third semiconductor laser elements are arranged side by side in a second direction, The light emitting module according to claim 1 , wherein the length of the first base in the first direction is 90% or more and 105% or less of the length of the second base in the second direction.

3. The light-emitting module according to claim 1 , wherein the first base and the second base have the same size and shape.

4. the first base has a first inner side surface and a second inner side surface facing each other, a first step portion formed along the first inner side surface and having a wiring pattern provided on an upper surface thereof, and a second step portion formed along the second inner side surface and having a wiring pattern provided on an upper surface thereof; the second base has a first inner side surface and a second inner side surface facing each other, a first step portion formed along the first inner side surface of the second base and having a plurality of wiring patterns provided on an upper surface thereof, and a second step portion formed along the second inner side surface of the second base and having a plurality of wiring patterns provided on an upper surface thereof, the plurality of first semiconductor laser elements are electrically connected to the wiring pattern provided on the upper surface of the first step portion of the first base and to the wiring pattern provided on the upper surface of the second step portion of the first base; the plurality of second semiconductor laser elements are electrically connected to the plurality of wiring patterns provided on the upper surface of the first step portion of the second base; 4. The light emitting module according to claim 1, wherein the one or more third semiconductor laser elements are electrically connected to the plurality of wiring patterns provided on the upper surface of the second step portion of the second base.

5. 5. The light emitting module according to claim 1, wherein the number of said plurality of first semiconductor laser elements is smaller than the number of said plurality of second semiconductor laser elements and the number of said one or more third semiconductor laser elements.

6. the first light-emitting device further includes a plurality of first submounts on each of which the first semiconductor laser element is disposed; the second light-emitting device further includes a plurality of second submounts on which the second semiconductor laser element or the third semiconductor laser element is disposed, the plurality of first submounts are submounts of the same size and shape, The light-emitting module according to claim 1 , wherein the plurality of second submounts are submounts having the same size and shape.

7. The light emitting module according to claim 6 , wherein the first submount and the second submount are different in size and shape from each other.

8. the first light-emitting device further includes a plurality of first reflecting members each of which reflects light emitted from the first semiconductor laser element; the second light emitting device further includes a plurality of second reflecting members each of which reflects light emitted from the second semiconductor laser element or the third semiconductor laser element; the plurality of first reflecting members are reflecting members of the same size and shape, the plurality of second reflecting members are reflecting members of the same size and shape, The light emitting module according to claim 6 , wherein the first reflecting member and the second reflecting member have the same size and shape.

9. the first light emitting device further includes a first cover member joined to the first base; the second light emitting device further includes a second cover member joined to the second base; Equipped with the plurality of first semiconductor laser elements are disposed in a sealed space defined by the first base and the first lid member; the plurality of second semiconductor laser elements and the one or more third semiconductor laser elements are disposed in a sealed space defined by the second base and the second lid member, The light emitting module according to claim 1 , wherein the first cover member and the second cover member have the same size and shape.

10. The first light emitting device does not emit blue or green light, The light emitting module according to claim 1 , wherein red light is not emitted from the second light emitting device.

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