Solid electrolytic capacitor and method for producing solid electrolytic capacitor

Abstract

To provide: a solid electrolytic capacitor capable of suppressing damage to a solid electrolyte layer; and a method for producing the solid electrolytic capacitor.SOLUTION: The solid electrolytic capacitor is provided with: a porous sintered body 1 which has a first surface 11 and contains a valve-acting metal; a positive electrode wire 10 which protrudes from the first surface 11 and contains a valve-acting metal; a dielectric layer 2 which is formed on the porous sintered body 1; a solid electrolyte layer 3 which is formed on the dielectric layer 2; and a negative electrode layer 4 which is formed on the solid electrolyte layer 3. The solid electrolyte layer 3 comprises a first layer 31 which is formed on the dielectric layer 2, and a second layer 32 which is formed on the first layer 31. The solid electrolyte capacitor comprises a protective layer 5 which covers at least a part of the first surface 11, with the first layer 31 being interposed therebetween.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a solid electrolytic capacitor and a method for manufacturing a solid electrolytic capacitor. [Background technology]

[0002] Patent Document 1 discloses an example of a conventional solid electrolytic capacitor. The solid electrolytic capacitor consists of a porous sintered body with a protruding anode wire, a dielectric layer, and a solid electrolyte. The porous sintered body and the anode wire are provided with a cathode layer, an anode terminal, a cathode terminal, and a sealing resin. The solid electrolyte layer is made of a valve metal such as Ta (tantalum) or Nb (niobium). , made of a conductive polymer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-168621 Summary of the Invention [Problem to be solved by the invention]

[0004] The solid electrolyte layer may be damaged during the process of joining the anode wire to the anode terminal or during use. There is a problem.

[0005] The present invention has been devised in light of the above circumstances, and aims to prevent damage to the solid electrolyte layer. To provide a solid electrolytic capacitor capable of controlling the temperature and humidity, and a method for manufacturing the solid electrolytic capacitor. The objective is to achieve this. [Means for solving the problem]

[0006] A first aspect of the present invention provides a solid electrolytic capacitor having a first surface and a valve structure. a porous sintered body containing a valve metal; and an anode wire protruding from the first surface and containing a valve metal. a dielectric layer formed on the porous sintered body; and a solid electrolyte formed on the dielectric layer. a cathode layer formed on the solid electrolyte layer, the solid electrolyte layer being a first layer formed on the dielectric layer and a second layer formed on the first layer, a protective layer covering at least a portion of the first surface via a layer;

[0007] A second aspect of the present invention provides a method for producing a solid electrolytic capacitor, comprising the steps of: forming a porous sintered body containing a valve metal and having a first surface from which an anode wire containing the valve metal protrudes; a step of forming a dielectric layer on the porous sintered body; and a step of disposing a solid electrolyte on the dielectric layer. forming a cathode layer on the solid electrolyte layer; and forming a cathode layer on the solid electrolyte layer. The step of forming the electrolyte layer includes forming a first layer on the dielectric layer, and forming a second layer on the first layer. forming a second layer, and after the step of forming the first layer, The method further includes a step of forming a protective layer that covers at least a portion of the substrate. [Effects of the Invention]

[0008] According to the present disclosure, damage to the solid electrolyte layer can be suppressed.

[0009] Other features and advantages of the present invention will become apparent from the following detailed description taken in conjunction with the accompanying drawings. It will become clearer. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a cross-sectional view showing a solid electrolytic capacitor according to a first embodiment of the present disclosure. [Figure 2]FIG. 2 is an enlarged cross-sectional view of a main portion of the solid electrolytic capacitor according to the first embodiment of the present disclosure. [Figure 3] FIG. 3 is a flow diagram showing a method for manufacturing a solid electrolytic capacitor according to the first embodiment of the present disclosure. [Figure 4] FIG. 4 is a cross-sectional view illustrating the method for manufacturing the solid electrolytic capacitor according to the first embodiment of the present disclosure. [Figure 5] FIG. 5 is a cross-sectional view illustrating the method for manufacturing the solid electrolytic capacitor according to the first embodiment of the present disclosure. [Figure 6] FIG. 6 is a cross-sectional view illustrating the method for manufacturing the solid electrolytic capacitor according to the first embodiment of the present disclosure. [Figure 7] FIG. 7 is a cross-sectional view illustrating the method for manufacturing the solid electrolytic capacitor according to the first embodiment of the present disclosure. [Figure 8] FIG. 8 is a cross-sectional view illustrating the method for manufacturing the solid electrolytic capacitor according to the first embodiment of the present disclosure. [Figure 9] FIG. 9 is a cross-sectional view illustrating the method for manufacturing the solid electrolytic capacitor according to the first embodiment of the present disclosure. [Figure 10] FIG. 10 is a cross-sectional view illustrating the method for manufacturing the solid electrolytic capacitor according to the first embodiment of the present disclosure. [Figure 11] FIG. 11 is a cross-sectional view showing a solid electrolytic capacitor according to a second embodiment of the present disclosure. [Figure 12] FIG. 12 is a flowchart showing a method for manufacturing a solid electrolytic capacitor according to the second embodiment of the present disclosure. [Figure 13] FIG. 13 is a cross-sectional view illustrating a method for manufacturing a solid electrolytic capacitor according to a second embodiment of the present disclosure. [Figure 14] FIG. 14 is a cross-sectional view showing a solid electrolytic capacitor according to a third embodiment of the present disclosure. [Figure 15] FIG. 15 is a flowchart showing a method for manufacturing a solid electrolytic capacitor according to a third embodiment of the present disclosure. [Figure 16] FIG. 16 is a cross-sectional view illustrating a method for manufacturing a solid electrolytic capacitor according to a third embodiment of the present disclosure. [Figure 17] FIG. 17 is a cross-sectional view showing a solid electrolytic capacitor according to a fourth embodiment of the present disclosure. [Figure 18] FIG. 18 is an enlarged cross-sectional view of a main portion of a solid electrolytic capacitor according to a fourth embodiment of the present disclosure. [Figure 19] FIG. 19 is a flowchart showing a method for manufacturing a solid electrolytic capacitor according to a fourth embodiment of the present disclosure. [Figure 20] FIG. 20 is a cross-sectional view illustrating a method for manufacturing a solid electrolytic capacitor according to a fourth embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011] Preferred embodiments of the present invention will now be described in detail with reference to the drawings.

[0012] In the present disclosure, when A is formed on B, it means that A is in direct contact with B, or This also includes cases where A is positioned so that it overlaps with B via another object.

[0013] The terms "first," "second," "third," etc. in this disclosure are used for identification purposes only. and is not intended to impose any order on these objects.

[0014] First Embodiment 1 and 2 show a solid electrolytic capacitor according to a first embodiment of the present disclosure. The solid electrolytic capacitor A1 of the embodiment includes a porous sintered body 1, an anode wire 10, a dielectric layer 2, Solid electrolyte layer 3, cathode layer 4, protective layer 5, anode conductive member 6, cathode conductive member 7, and sealing resin Equipped with 8.

[0015] The porous sintered body 1 contains a valve metal, and is formed by compressing fine powder of the valve metal. It is formed by sintering an intermediate product and has many pores inside. The valve metal contained in the porous sintered body 1 is, for example, Ta (tantalum) or Nb (niobium). The porous sintered body 1 of this embodiment has a first surface 11 and a second surface 12. When the porous sintered body 1 has a rectangular parallelepiped shape, the first surface 11 is one of the surfaces constituting the rectangular parallelepiped. The second surface 12 is four surfaces connected to the first surface 11. Alternatively, the porous sintered body When 1 is cylindrical, the first surface 11 is one end surface, and the second surface 12 is adjacent to the first surface 11. It is the surrounding side that connects.

[0016] The anode wire 10 protrudes from the first surface 11 of the porous sintered body 1, and a part of it is porous. The anode wire 10 penetrates into the sintered body 1. The anode wire 10 contains a valve metal. Examples of the valve metals include Ta (tantalum) and Nb (niobium). The valve metal contained in the anode wire 10 is the same as the valve metal contained in the porous sintered body 1. The same is preferred.

[0017] The dielectric layer 2 is formed on the porous sintered body 1. The dielectric layer 2 is formed on the porous sintered body 1. In this embodiment, the dielectric layer 2 is in direct contact with a portion of the anode wire 10. The dielectric layer 2 is formed in a porous sintered form and is in direct contact with a portion of the anode wire 10. The outer surface including the first surface 11 and the second surface 12 of the porous sintered body 1 and the pores inside the porous sintered body 1 are The dielectric layer 2 includes, for example, an oxide of a valve metal, and a specific example is Ta2 Examples include O5 (tantalum pentoxide) and Nb2O5 (niobium pentoxide).

[0018] The solid electrolyte layer 3 is formed on the dielectric layer 2. The solid electrolyte layer 3 is formed on the dielectric layer 2. The solid electrolyte layer 3 includes a first layer 31 and a second layer 32. The first layer 31 is The second layer 32 is formed on the dielectric layer 2 and is in direct contact with the dielectric layer 2. The first layer 31 is formed on the dielectric layer 2 and is in direct contact with the first layer 31. The first layer 31 is The first surface 11 and the second surface 12 are included in the illustrated example. In this case, the first layer 31 is a portion formed on a part of the anode wire 10 via the dielectric layer 2. The second layer 32 is formed on the second surface 12 via the dielectric layer 2 and the first layer 31. The first layer 31 and the second layer 32 are provided at a position that avoids the first surface 11. , for example, conductive polymers. Specific examples of conductive polymers include polypyrrole. , polythiophene, polyaniline, and polyfuran.

[0019] The cathode layer 4 is formed on the solid electrolyte layer 3. The cathode layer 4 is formed on the second The cathode layer 4 of this embodiment is made up of a graphite layer 41 and a metal layer 4 The graphite layer 41 including 2 is formed on the solid electrolyte layer 3 and is directly connected to the second layer 32. The graphite layer 41 includes graphite. The metal layer 42 includes graphite. The metal layer 42 is formed on the graphite layer 41 and is in direct contact with the graphite layer 41. The cathode layer 4 of this embodiment includes the porous sintered body 1 including the second surface 12. It is formed on the surface and is provided at a position that avoids the first surface 11.

[0020] The protective layer 5 covers at least a part of the first surface 11 via the dielectric layer 2 and the first layer 31. The protective layer 5 includes an insulating material. Examples of the insulating material included in the protective layer 5 include fluorine. Examples of the insulating material include fluorine resin, silicone resin, and acrylic resin. For example, PVF (Polyvinyl Fluoride), ETFE (Ethylene Tetrafluoroethy lene), FEP (Fluorinated Ethylene Propylene), PFA (Tetrafluoroethylene and Perfluoroethylene) Copolymer with fluoroalkoxyethylene), PTEF (Polytetrafluoroethylene), Fluoroolefin-vinyl ether copolymer (FEVE: Fluorethylene Vinyl Ether), A mixture of polyvinylidene fluoride and acrylic resin (PVDF: Poly Vinylidene DiF The protective layer 5 of this embodiment is in direct contact with the first layer 31.

[0021] The protective layer 5 of this embodiment has a first portion 51. The first portion 51 covers substantially the entire first surface 11. The first portion 51 is provided at a position that avoids the second surface 12. 2 is formed at a position that avoids the protective layer 5 (first portion 51). The anode wire 1 is connected to the anode via both the dielectric layer 2 and the solid electrolyte layer 3 or via the dielectric layer 2 only. In this embodiment, the first surface 11 is covered with the protective layer 5 (first portion 51). The thickness t3 to the surface of the anode wire 10 is larger as it approaches the anode wire 10. It corresponds to the size.

[0022] The anode conduction member 6 is made of a porous sintered body 1, an anode wire 10, and a solid electrolytic capacitor A1. It is a member that conducts electricity to a circuit (not shown) that is mounted on it. What is the specific configuration of the anode conduction member 6? In this embodiment, the terminal portion 61 and the relay portion 62 are included.

[0023] The terminal portion 61 has a portion exposed from the sealing resin 8, and the solid electrolytic capacitor A1 is mounted on the terminal portion 61. The terminal portion 61 is used as a mounting terminal when the board is mounted. The terminal portion 61 contains a metal such as copper (Cu). The mounting surface of the terminal portion 61 is provided with a plating layer (not shown) of tin (Sn), nickel (Ni), or the like. ) may be provided.

[0024] The relay portion 62 relays the anode wire 10 and the terminal portion 61. The relay portion 62 is bonded to both of the terminal portions 61. The relay portion 62 contains a metal such as copper (Cu). There is no limitation on the method of joining the relay portion 62 to the anode wire 10 and the terminal portion 61. The terminal portion 62 and the anode wire 10 are joined by, for example, laser welding. The joint 62 is formed by welding such as laser welding or resistance welding, or by using a conductive joining material. They are joined using a joining technique.

[0025] The cathode conductive member 7 is connected to the cathode layer 4 and a circuit (not shown) on which the solid electrolytic capacitor A1 is mounted. The cathode conduction member 7 is a member that conducts the cathode. The cathode conduction member 7 is made of a plate-like member. The cathode conduction member 7 includes a metal such as copper (Cu). The mounting surface of the cathode conduction member 7 is provided with a plating layer (as shown in the figure) of tin (Sn), nickel (Ni), or the like. The cathode conduction member 7 is connected to the cathode layer 4 via a conductive bonding material 79. The conductive bonding material 79 includes, for example, silver (Ag).

[0026] The sealing resin 8 covers the porous sintered body 1, the anode wire 10, the dielectric layer 2, the solid electrolyte layer 3, and the cathode The protective layer 5 covers the anode conductive member 6 and the cathode conductive member 7. The sealing resin 8 contains, for example, an epoxy resin. The anode conduction member 6 and the cathode conduction member 7 are , and a part of each is exposed from the sealing resin 8.

[0027] Next, a method for manufacturing the solid electrolytic capacitor A1 will be described below with reference to FIGS. 3 to 10. will be explained.

[0028] As shown in FIG. 3, the method for manufacturing the solid electrolytic capacitor A1 includes forming a porous sintered body 1. a step of forming a dielectric layer 2; a step of forming a solid electrolyte layer 3 (first layer 31); a step of forming the layer 5, a step of forming the solid electrolyte layer 3 (second layer 32), a step of forming the cathode layer 4 (graph a step of forming a cathode layer 4 (metal layer 42); a step of forming an anode conductive member a step of bonding to a cathode conduction member 7, and a step of forming a sealing resin 8. In this embodiment, after the step of forming the first layer 31, the step of forming the second layer 32 is performed. Before this step, a step of forming a protective layer 5 is carried out.

[0029] First, as shown in Fig. 4, an intermediate product 100 is formed. The intermediate product 100 is formed, for example, by By compressing and molding fine powder of valve metals such as Ta (tantalum) or Nb (niobium), This pressure molding is carried out with the anode wire 10 inserted in the valve metal powder. As a result, an intermediate product 100 is obtained in which the anode wire 10 protrudes from the first surface 11. The intermediate product 100 is then subjected to a sintering process, thereby obtaining a porous sintered body 1.

[0030] Next, the dielectric layer 2 is formed. The dielectric layer 2 is formed, for example, as shown in FIG. The porous sintered body 1 and a part of the anode wire 10 are immersed in the chemical conversion solution 200, and then subjected to anodizing treatment. The chemical conversion solution 200 may be, for example, an aqueous solution of phosphoric acid. As a result, the dielectric material covering the outer surface and pores of the porous sintered body 1 and part of the anode wire 10 is formed. Layer 2 is obtained.

[0031] Next, the first layer 31 is formed. The first layer 31 is formed by, for example, forming a dielectric layer as shown in FIG. The porous sintered body 1 on which the polymer layer 2 is formed is subjected to a chemical polymerization treatment or an electrolytic polymerization treatment. In these polymerization processes, for example, the porous sintered body on which the dielectric layer 2 is formed is In this embodiment, the porous sintered body 1 and the reaction liquid 310 containing the monomer are immersed. The anode wire 10 and a part of the anode wire 10 are immersed in the reaction solution 310. The exposed portion of the dielectric layer 2 is not immersed in the reaction solution 310. The first layer 31 is formed by a porous sintered body including the first surface 11 and the second surface 12. The first layer 31 is formed on the surface of the solid body 1 and on a part of the anode wire 10. The first layer 31 is a dielectric layer. 2. After the first layer 31 is formed, a chemical conversion treatment may be carried out again.

[0032] Next, the protective layer 5 is formed. The protective layer 5 is formed, for example, by dispensing as shown in FIG. The resin paste 500 is applied by using a dispenser Ds. This is a device capable of applying a fixed amount of resin paste 500. The resin paste 500 is This is a material for forming the insulating material contained in the protective layer 5. The resin paste 500 is applied by the spacer Ds so as to cover the first surface 11. The resin paste 500 is not applied to the second surface 12. The anode wire 10 is partially covered with the conductive layer 2 and the first layer 31. By subjecting ST500 to predetermined treatments such as drying, heating, and ultraviolet irradiation, a protective layer is formed. 5 is obtained.

[0033] Next, the second layer 32 is formed. The second layer 32 is formed by, for example, forming a dielectric layer as shown in FIG. The porous sintered body 1 on which the protective layer 2, the first layer 31 and the protective layer 5 are formed is subjected to chemical polymerization or In these polymerization processes, for example, the dielectric The porous sintered body 1 on which the layer 2, the first layer 31 and the protective layer 5 are formed is immersed in a reaction liquid 32 containing a monomer. In this embodiment, the protective layer 5 (first surface 11) is immersed in the reaction liquid 320. By carrying out the polymerization treatment, the second layer 32 is formed as shown in FIG. The second layer 32 is formed on the outer surface of the porous sintered body 1 except for the first surface 11, and is directly connected to the first layer 31. After the second layer 32 is formed, a chemical conversion treatment may be carried out again.

[0034] Next, as shown in FIG. 10, a process of forming a graphite layer 41 and a process of forming a metal layer 42 are performed. As a result, the cathode layer 4 consisting of the graphite layer 41 and the metal layer 42 is formed. The cathode layer 4 is formed on the outer surface of the porous sintered body 1 except for the first surface 11. It is in direct contact with the second layer 32 of the solid electrolyte layer 3 .

[0035] After this, a step of joining the anode wire 10 to the anode conduction member 6 and a step of forming the metal layer 4 of the cathode layer 4 are performed. Then, the cathode conduction member 7 is bonded to the dielectric layer 2, the solid electrolyte layer 3, and the cathode The porous sintered body 1 on which the electrode layer 4 and the protective layer 5 are formed, the anode wire 10, and the anode conductive portion The sealing resin 8 is formed to cover the material 6 and the cathode conduction member 7 respectively. A solid electrolytic capacitor A1 is obtained.

[0036] Next, the effects of the solid electrolytic capacitor A1 and the manufacturing method of the solid electrolytic capacitor A1 will be described. I will explain.

[0037] As shown in FIGS. 1 and 2, a first layer 31 is formed on a first surface 11 of the porous sintered body 1. In the manufacturing method of the solid electrolytic capacitor A1, for example, the anode wire 10 is When laser welding to join the joint 62 or when using the solid electrolytic capacitor A1, In this case, a load may be applied to the base of the anode wire 10. This load may damage the first layer 31. According to this embodiment, the first layer 31 on the first surface 11 is a protective layer. Therefore, according to this embodiment, the solid electrolyte Therefore, damage to the porous layer 3 can be suppressed.

[0038] The first portion 51 is formed on the entire surface of the first surface 11. The layer 31 can be more reliably protected.

[0039] As shown in FIG. 2, the thickness t3 from the first surface 11 to the surface of the protective layer 5 (first portion 51) is The closer to the anode wire 10, the thicker it is. In addition, the first layer 31 located near the anode wire 10 can be protected more reliably.

[0040] When the protective layer 5 is made of the fluororesin exemplified above, it is difficult to dissolve the protective layer 5 in the manufacturing process. This is preferable in that it can be easily dispersed in the coating agent and exhibits high weather resistance. The fluororesin contained therein has a glass transition temperature of 150°C or less, and 120°C or less It is preferable that the temperature is 100°C or lower.

[0041] As shown in FIG. 7, in this embodiment, a resin paste 5 is dispensed using a dispenser Ds. By applying the resin paste 500, the protective layer 5 is formed. This allows for more precise application to areas of wear.

[0042] 11 to 20 show other embodiments of the present invention. In these figures, Elements that are the same as or similar to those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

[0043] Second Embodiment 11 shows a solid electrolytic capacitor according to a second embodiment of the present disclosure. In the solid electrolytic capacitor A2, the protective layer 5 is formed on the second layer 32.

[0044] In this embodiment, the second layer 32 has a portion formed on the first surface 11. The first portion 51 of the protective layer 5 is in direct contact with the first layer 31. The first portion 51 of the protective layer 5 is in direct contact with the second layer 32. are.

[0045] 12 and 13 show a method for manufacturing the solid electrolytic capacitor A2. As shown in FIG. 1, in this embodiment, after the step of forming the second layer 32, the graphite layer 41 Before the step of forming the protective layer 5, the step of forming the protective layer 5 is carried out.

[0046] As shown in FIG. 13, after the second layer 32 is formed, the first surface 11 of the porous sintered body 1 is The conductive layer 2 is covered with a first layer 31 and a second layer 32. That is, referring to FIG. In the chemical polymerization process or electrolytic polymerization process shown above, the first surface 11 and the anode wire 10 A part of the substrate is immersed in the reaction solution 320. Then, in the step shown in FIG. Resin paste 500 is applied to second layer 32 formed on first surface 11 using Ds.

[0047] This embodiment also makes it possible to suppress damage to the solid electrolyte layer 3. According to the embodiment, the first layer 31 and the second layer 32 are covered with a protective layer 5 (first part 5) on the first surface 11. 1) can be protected by

[0048] <Third embodiment> 14 shows a solid electrolytic capacitor according to a third embodiment of the present disclosure. In the solid electrolytic capacitor A3, the protective layer 5 is formed on the graphite layer 41.

[0049] In this embodiment, the protective layer 5 has a first portion 51 and a second portion 52. The first portion 51 is formed on the first surface 11. A dielectric layer 2 is provided between the first portion 51 and the first surface 11. The first portion 51 is in direct contact with the second layer 32. There are.

[0050] The second portion 52 is formed on the second surface 12. In this embodiment, the second portion 52 and Between the second surface 12, the dielectric layer 2, the first layer 31, the second layer 32 and the graphite layer 41 are provided. The second portion 52 is in direct contact with the graphite layer 41. The portion of the second portion 52 that is not covered by the second portion 52 is covered by the metal layer 42. A portion of 52 may be covered by the metal layer 42 .

[0051] 15 and 16 show a method for manufacturing the solid electrolytic capacitor A3. As shown in FIG. 1, in this embodiment, after the step of forming the graphite layer 41, the metal layer 42 is formed. Before the step of forming the protective layer 5, the step of forming the protective layer 5 is carried out.

[0052] In this embodiment, as shown in FIG. 16, after forming the graphite layer 41, The resin paste 500 is applied using a dispenser Ds. The paste 500 is applied onto substantially the entire surface of the first surface 11 and onto a part of the second surface 12. The resin paste 500 applied to the first surface 11 contacts the second layer 32. The applied resin paste 500 contacts the graphite layer 41 .

[0053] The application of the resin paste 500 onto the second surface 12 may be done intentionally or may be done by applying the resin paste 500 onto the first surface 12. In order to more reliably apply the resin paste 500 to the entire surface of the second surface 12, a part of the resin paste 500 is applied to the second surface 12. Therefore, the boundary between the first surface 11 and the second surface 12 may be formed over the entire length. Therefore, it is not limited to the structure covered with the resin paste 500 (protective layer 5). Only the protective layer 5 may be covered with the resin paste 500 (protective layer 5).

[0054] This embodiment also makes it possible to suppress damage to the solid electrolyte layer 3. According to the embodiment, a part of graphite layer 41 is covered with protective layer 5 (second portion 52). This prevents peeling or cracks from occurring at the end of graphite layer 41. It is possible.

[0055] <Fourth embodiment> 17 and 18 show a solid electrolytic capacitor according to a fourth embodiment of the present disclosure. In the solid electrolytic capacitor A4 of this embodiment, the protective layer 5 is formed on the metal layer .

[0056] In this embodiment, the protective layer 5 has a first portion 51 and a second portion 52. The first portion 51 is formed on the first surface 11. A dielectric layer 2 is provided between the first portion 51 and the first surface 11. The first portion 51 is in direct contact with the second layer 32. There are.

[0057] The second portion 52 is formed on the second surface 12. In this embodiment, the second portion 52 and Between the second surface 12, the dielectric layer 2, the first layer 31, the second layer 32, the graphite layer 41, and The second portion 52 is in direct contact with the graphite layer 41 and has a metal layer 42 interposed therebetween. The graphite layer 41 has a portion directly in contact with the metal layer 42. The uncovered portion is covered by a metal layer 42 .

[0058] As shown in FIG. 18, in the illustrated example, the second surface 12 is connected to the second portion 52 (protective layer 5 The thickness t1 is the maximum value of the thickness from the second surface 12 to the surface of the metal layer 42. The thickness t1 is thinner than the thickness t2, which is the maximum thickness. The thickness t1 corresponds to the first thickness in the present disclosure. The thickness t2 corresponds to the second thickness in the present disclosure.

[0059] 19 and 20 show a method for manufacturing the solid electrolytic capacitor A3. As shown in FIG. 1, in this embodiment, the protective layer 5 is formed after the step of forming the metal layer 42. The process is carried out as follows.

[0060] In this embodiment, as shown in FIG. 20, after forming the graphite layer 442, The resin paste 500 is applied using a dispenser Ds. The oil paste 500 is applied to almost the entire surface of the first surface 11 and to a part of the second surface 12. The resin paste 500 applied to the first surface 11 contacts the second layer 32. In this case, a part of the graphite layer 41 is exposed from the metal layer 42. The applied resin paste 500 contacts the graphite layer 41 and the metal layer 42 .

[0061] The application of the resin paste 500 onto the second surface 12 may be done intentionally or may be done by applying the resin paste 500 onto the first surface 12. In order to more reliably apply the resin paste 500 to the entire surface of the second surface 12, a part of the resin paste 500 is applied to the second surface 12. Therefore, the boundary between the first surface 11 and the second surface 12 may be formed over the entire length. Therefore, it is not limited to the structure covered with the resin paste 500 (protective layer 5). Only the protective layer 5 may be covered with the resin paste 500 (protective layer 5).

[0062] This embodiment also makes it possible to suppress damage to the solid electrolyte layer 3. According to the embodiment, a part of the graphite layer 41 and a part of the metal layer 42 are formed as the protective layer 5 (second part 5 2) is covered with the metal layer 42. This can prevent peeling and cracks from occurring at the edges.

[0063] As shown in FIG. 18, the thickness from the second surface 12 to the surface of the second portion 52 (protective layer 5) The thickness t1, which is the maximum value of the thickness from the second surface 12 to the surface of the metal layer 42, is The thickness is thinner than the thickness t2. As a result, the second portion 52 (protective layer 5) can effectively protect the graphite layer 4. The second portion 52 protects the porous sintered body 1 and the metal layer 42. The dimensions of the components including the dielectric layer 2, the solid electrolyte layer 3, the cathode layer 4 and the protective layer 5 may be unintentionally changed. This can prevent the size from becoming too large.

[0064] The solid electrolytic capacitor and the method for manufacturing the solid electrolytic capacitor according to the present invention are the same as those described above. The present invention is not limited to the embodiments. The specific configuration of the denser manufacturing method can be freely designed and modified in various ways.

[0065] [Appendix 1] a porous sintered body having a first surface and including a valve metal; an anode wire protruding from the first surface and including a valve metal; a dielectric layer formed on the porous sintered body; a solid electrolyte layer formed on the dielectric layer; a cathode layer formed on the solid electrolyte layer, The solid electrolyte layer includes a first layer formed on the dielectric layer and a second layer formed on the first layer. and a second layer comprising a protective layer covering at least a part of the first surface via the first layer; Densa. [Appendix 2] 2. The solid electrolytic capacitor according to claim 1, wherein the protective layer is in direct contact with the first layer. [Appendix 3] 2. The solid electrolytic capacitor according to claim 1, wherein the second layer is interposed between the first layer and the protective layer. Densa. [Appendix 4] The cathode layer is a graphite layer formed on the solid electrolyte layer, and the graphite a metal layer formed on the layer, 4. The solid electrolytic capacitor according to claim 3, wherein the protective layer is in contact with the graphite layer. [Appendix 5] 5. The solid electrolytic capacitor according to claim 4, wherein the protective layer is in contact with the metal layer. [Appendix 6] The porous sintered body has a second surface that is spaced from the anode wire and connected to the first surface. Has, the cathode layer is formed on the second surface; The protective layer has a first portion formed on the first surface and a second portion formed on the second surface. 6. The solid electrolytic capacitor according to claim 4 or 5, comprising: [Appendix 7] A first thickness, which is the maximum value of the thickness from the second surface to the surface of the second portion, is the thickness of the solid body described in Appendix 6 is thinner than a second thickness, which is the maximum thickness from the surface of the metal layer to the surface of the metal layer. Electrolytic capacitor. [Appendix 8] The protective layer is made of at least one of a fluororesin, a silicone resin, and an acrylic resin. 8. The solid electrolytic capacitor according to any one of claims 1 to 7, comprising: [Appendix 9] a third thickness from the first surface to the surface of the protective layer is thicker as it approaches the anode wire; 9. The solid electrolytic capacitor according to any one of appendices 1 to 8. [Appendix 10] a porous sintered body having a first surface from which an anode wire containing a valve metal protrudes, the porous sintered body comprising a valve metal; forming a body; forming a dielectric layer on the porous sintered body; forming a solid electrolyte layer on the dielectric layer; forming a cathode layer on the solid electrolyte layer; The step of forming the solid electrolyte layer includes the steps of forming a first layer on the dielectric layer and forming a second layer on the first layer; After the step of forming the first layer, a protective layer is formed to cover at least a part of the first surface. A method for manufacturing a solid electrolytic capacitor, comprising the steps of: [Appendix 11] The step of forming the protective layer is performed before the step of forming the second layer, as described in Appendix 10. A method for manufacturing a solid electrolytic capacitor. [Appendix 12] After the step of forming the second layer, the protective layer is formed before the step of forming the cathode layer. 11. The method for producing a solid electrolytic capacitor according to claim 10, further comprising the steps of: [Appendix 13] The step of forming the cathode layer includes forming a graphite layer on the solid electrolyte layer. forming a metal layer on the graphite layer; After the step of forming the graphite layer and before the step of forming the metal layer, 11. The method for manufacturing a solid electrolytic capacitor according to claim 10, further comprising the step of forming a layer. [Appendix 14] The step of forming the protective layer is performed after the step of forming the cathode layer, as described in Appendix 10. A method for manufacturing a solid electrolytic capacitor. [Appendix 15] The step of forming the first layer includes a chemical polymerization process or an electrolytic polymerization process. 15. A method for producing a solid electrolytic capacitor according to any one of claims 14 to 14. [Appendix 16] The step of forming the second layer includes a chemical polymerization process or an electrolytic polymerization process. 16. A method for producing a solid electrolytic capacitor according to any one of claims 15 to 15. [Appendix 17] The step of forming the protective layer includes dispensing a paste material for the protective layer using a dispenser. The solid electrolytic capacitor according to any one of appendices 10 to 16, wherein the coating is applied to the first surface. Manufacturing method. [Appendix 18] The protective layer is made of at least one of a fluororesin, a silicone resin, and an acrylic resin. 18. A method for producing the solid electrolytic capacitor according to any one of claims 10 to 17, comprising: [Explanation of symbols]

[0066] A1, A2, A3, A4: Solid electrolytic capacitors 1: Porous sintered body 2: Dielectric layer 3: Solid electrolyte layer 4: Cathode layer 5:Protective layer 6: Anode conductive member 7: Cathode conductive member 8: Sealing resin 10: Anode wire 11: 1st page 12:Second side 31: 1st layer 32: 2nd layer 41: Graphite layer 42: Metal layer 51: Part 1 52: Part 2 61:Terminal section 62: Relay section 79: Conductive bonding material 100: Intermediate product 200: Chemical liquid 310, 320: Reaction solution 442: graphite layer 500: Resin paste Ds: Dispenser t1, t2, t3: thickness

Claims

1. a porous sintered body having a first surface and including a valve metal; an anode wire protruding from the first surface and comprising a valve metal; a dielectric layer formed on the porous sintered body; a solid electrolyte layer formed on the dielectric layer; a cathode layer formed on the solid electrolyte layer, The solid electrolyte layer includes a first layer formed on the dielectric layer and a second layer formed on the first layer. and a second layer comprising a protective layer covering at least a part of the first surface via the first layer; Densa.

2. The solid electrolytic capacitor according to claim 1 , wherein the protective layer is in direct contact with the first layer.

3. 2. The solid electrolytic capacitor according to claim 1, wherein the second layer is interposed between the first layer and the protective layer. Condensa.

4. The cathode layer is a graphite layer formed on the solid electrolyte layer, and the graphite a metal layer formed on the layer, The solid electrolytic capacitor according to claim 3 , wherein the protective layer is in contact with the graphite layer.

5. The solid electrolytic capacitor according to claim 4 , wherein the protective layer is in contact with the metal layer.

6. The porous sintered body has a second surface that is spaced from the anode wire and connected to the first surface. Has, the cathode layer is formed on the second surface; The protective layer has a first portion formed on the first surface and a second portion formed on the second surface. The solid electrolytic capacitor according to claim 4 or 5, comprising:

7. The first thickness, which is the maximum value of the thickness from the second surface to the surface of the second portion, is 7. The fixing method according to claim 6, wherein the thickness is smaller than a second thickness which is the maximum thickness from the surface of the metal layer to the surface of the metal layer. Body electrolytic capacitor.

8. The protective layer is made of at least one of a fluororesin, a silicone resin, and an acrylic resin.

8. The solid electrolytic capacitor according to claim 1, comprising:

9. a third thickness from the first surface to the surface of the protective layer is greater as it approaches the anode wire; 9. The solid electrolytic capacitor according to claim 1.

10. a porous sintered body having a first surface from which an anode wire containing a valve metal protrudes, the porous sintered body comprising a valve metal; forming a body; forming a dielectric layer on the porous sintered body; forming a solid electrolyte layer on the dielectric layer; forming a cathode layer on the solid electrolyte layer; The step of forming the solid electrolyte layer includes the steps of forming a first layer on the dielectric layer; forming a second layer on the first layer; After the step of forming the first layer, a protective layer is formed to cover at least a part of the first surface. A method for manufacturing a solid electrolytic capacitor, comprising the steps of:

11. The method according to claim 10, wherein the step of forming the protective layer is performed before the step of forming the second layer. A method for manufacturing the above solid electrolytic capacitor.

12. After the step of forming the second layer, the protective layer is formed before the step of forming the cathode layer. The method for producing a solid electrolytic capacitor according to claim 10 , further comprising the steps of:

13. The step of forming the cathode layer includes forming a graphite layer on the solid electrolyte layer. forming a metal layer on the graphite layer; After the step of forming the graphite layer and before the step of forming the metal layer, The method for manufacturing a solid electrolytic capacitor according to claim 10 , further comprising the step of forming a layer.

14. The method according to claim 10, wherein the step of forming the protective layer is performed after the step of forming the cathode layer. A method for manufacturing the above solid electrolytic capacitor.

15. 10. The method according to claim 10, wherein the step of forming the first layer includes a chemical polymerization process or an electrolytic polymerization process.

15. A method for producing the solid electrolytic capacitor according to any one of claims 14 to 14.

16. The method according to claim 10, wherein the step of forming the second layer includes a chemical polymerization process or an electrolytic polymerization process.

16. A method for producing the solid electrolytic capacitor according to any one of claims 15 to 15.

17. The step of forming the protective layer includes dispensing a paste material for the protective layer using a dispenser. The solid electrolytic capacitor according to claim 10, wherein the first surface is coated with the solvent. Manufacturing method.

18. The protective layer is made of at least one of a fluororesin, a silicone resin, and an acrylic resin. The method for producing the solid electrolytic capacitor according to claim 10 , comprising:

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