Semiconductor chip cleaning method

Abstract

To disclose a semiconductor chip cleaning method.SOLUTION: The present disclosure provides a semiconductor chip cleaning method, and the present disclosure provides a semiconductor chip cleaning method, in which process water of 40 degrees or less is used to gently and effectively remove dirt, while reducing thermal stress damage to a chip and a chemical reaction risk, and effectively reducing energy consumption and cost. The method includes the following steps, a step 1 of placing an object to be cleaned, in which the object to be cleaned includes a plurality of chips spaced apart from at least one substrate, and a step 2 of setting at least one nozzle, and performing cleaning of while aiming at the chip gap. In the step 2, a nozzle to be used is a fluid nozzle and the cleaning liquid is the process water of 40 degrees or less. An inclination angle of the nozzle in a gap direction can be adjusted.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to the technical field of semiconductors, and more particularly to a semiconductor chip cleaning method for cleaning semiconductor chips using process water at a temperature of 40° C. or less. [Background technology]

[0002] Cleaning semiconductor chips is a critical step in semiconductor manufacturing, primarily to remove contaminants from the chip surface. These contaminants can come from residues from previous processes or dust and particles in the manufacturing environment. Cleaning is essential to ensure chip functionality, as even the smallest amount of contamination can seriously damage the fine circuitry.

[0003] Conventional chip cleaning methods use chemical solvents, acids, alkalis, or hot water, but chemical solvents have problems such as adverse effects on the environment and worker health, and hot water damages chips due to thermal stress, increasing energy consumption and costs. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention aims to overcome these problems and provide a semiconductor chip cleaning method that can gently and effectively remove dirt using process water at 40°C or less, reduce thermal stress damage to the chip and the risk of chemical reactions, and reduce energy consumption and costs. [Means for solving the problem]

[0005] The semiconductor chip cleaning method of the present invention includes the following steps.

[0006] Step 1: Place an object to be cleaned, which includes at least one substrate and a plurality of chips spaced apart from one another.

[0007] Step 2: Set at least one nozzle to target the gaps between the chips and perform cleaning.

[0008] The nozzle used in step 2 is a fluid nozzle, and the cleaning liquid is process water below 40°C. The nozzle can be adjusted in angle toward the gap.

[0009] In the above technical means, the nozzle pressure is 5-125 kgf / cm 2 is.

[0010] In the above technical means, the nozzle has an inclination angle of 20 to 90 degrees.

[0011] In the above technical means, the chip is positioned on the substrate by flux. [Effects of the Invention]

[0012] The present invention (1) reduces thermal stress and the risk of chemical reactions by using process water at 40°C or less, thereby improving product yield. (2) The nozzle accurately cleans the narrow gaps in the chip, reducing residual contaminants and improving the cleaning effect. (3) The nozzle angle can be adjusted, making it suitable for a variety of chips and highly adaptable. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. [Figure 2] FIG. 1 is a flow diagram of the present invention. [Figure 3] FIG. 10 is a diagram showing an example in which process water at 40° C. or less is used as the cleaning liquid. [Figure 4] 10A and 10B are diagrams illustrating a nozzle angle adjustment operation. DETAILED DESCRIPTION OF THE INVENTION

[0014] The present invention will be described in more detail below with reference to specific examples and accompanying drawings.

[0015] As shown in Figures 1 to 3, the semiconductor chip cleaning method of the present invention has the following features. Step 1 (1): The object to be cleaned (10) is placed. The object to be cleaned (10) includes at least one substrate (101) and multiple chips (102) arranged at a predetermined interval. Step 2 (2): At least one nozzle (3) is set up and cleaning is performed by targeting the gaps (103) between the chips (102). In Step 2 (2), the nozzle (3) used is a fluid nozzle, and the cleaning liquid (4) is process water at a temperature of 40°C or less. The nozzle (3) can be adjusted to an angle of inclination toward the gaps (103).

[0016] Using process water below 40°C as the cleaning solution (4) gently and effectively removes contaminants, reducing the risk of thermal stress damage and chemical reactions to the chips (102), thereby improving quality, stabilizing production, and increasing product yield.

[0017] In step two (2), the nozzle (3) precisely delivers the cleaning solution (4) to each narrow gap (103) of the chip (102), allowing the cleaning solution to reach every corner of the chip (102), improving the cleaning effect, reducing contaminant residue, and improving yield.

[0018] The use of fluid nozzles (3) allows for a more uniform distribution of cleaning fluid, especially in the chip (102) gap (103), improving cleaning uniformity, penetration and quality and reducing the risk of residual contaminants.

[0019] The present invention is applicable to various sizes and types of chips (102), has high adaptability, and can be widely used in various semiconductor manufacturing processes. The pressure of the nozzle (3) is 5-125 kgf / cm². Within this range, the nozzle (3) can sufficiently remove dirt and residue, and has a high cleaning effect even in small gaps and hard-to-reach areas.

[0020] The pressure can be adjusted according to the degree of contamination and the type of tip (102), and various degrees of contamination can be handled by using low pressure for light contamination and high pressure for stubborn contamination. Limiting the pressure to 125 kgf / cm2 or less prevents excessive damage to chips (102), particularly those with fragile or fine structures, thereby reducing the risk of damage.

[0021] With the appropriate pressure, the cleaning solution (4) is evenly distributed in all the gaps (103) of the chip (102), improving uniformity and penetration even in narrow or irregular spaces.

[0022] The chip (102) is positioned on the substrate (101) by the flux (20). The use of flux (20) increases the bonding strength between the chip (102) and the substrate (101), ensuring accurate positioning of the chip (102) during manufacturing and improving assembly accuracy. The flux (20) also has excellent thermal conductivity, transferring heat evenly to each soldering area during heating, preventing solder defects caused by uneven heating. In addition, the chemical components of the flux (20) react with and remove oxides on the surface of the chip (102), reducing post-soldering residue and reducing the need for post-cleaning, saving time and resources and improving production speed and efficiency.

[0023] As shown in Figure 4, the tilt angle (a) of the nozzle (3) is between 20 and 90 degrees. By adjusting the tilt angle of the nozzle (3), the coverage area of ​​the cleaning solution (4) can be expanded to cover a wider area of ​​the chip (102) surface. Furthermore, by precisely controlling the spray angle, the contaminated areas on the chip (102) can be directly cleaned, improving cleaning efficiency, shortening cleaning time, and saving resources and costs.

[0024] The above examples are merely illustrative of the present invention and are not intended to limit the scope of the present invention. Any equivalent changes or modifications made based on the structures, features and principles described in the claims of the present invention are included in the claims of the present invention. [Explanation of symbols]

[0025] 1 Step 1 2 Step 2 3 nozzles 4. Cleaning solution 10 Items to be washed 101 Substrate 102 chips 103 Gap 20 Flux a angle

Claims

1. The object to be cleaned (10) includes at least one substrate (101) and a plurality of chips (102) arranged at predetermined intervals; Step 1 (1) of placing the object to be cleaned (10); and step two (2) of setting at least one nozzle (3) to aim at the gap (103) of the tip (102) to perform cleaning; In the step 2 (2), the nozzle (3) used for cleaning is a fluid nozzle, and the cleaning liquid (4) is process water at 40°C or less; The semiconductor chip cleaning method is characterized in that the nozzle (3) is capable of adjusting the inclination angle toward the gap (103).

2. The pressure of the nozzle (3) is 5-125 kgf / cm ２ 2. The semiconductor chip cleaning method according to claim 1, wherein:

3. 3. The semiconductor chip cleaning method according to claim 2, wherein the inclination angle (a) of said nozzle (3) is 20 to 90 degrees.

4. 4. The semiconductor chip cleaning method according to claim 3, wherein the chip (102) is positioned on the substrate (101) by a flux (20).

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