Machining device and method for removing machining chips from machining device

Abstract

To provide a machining device and a method for removing machining chips from the machining device, which can suitably remove machining chips generated during the machining of a workpiece, and remaining in the guide path.SOLUTION: A machining device includes: machining bases configured to each hold a workpiece; a machining-chip guide path, which includes a bottom plate having a horizontal or inclined surface, and side walls each having a surface extending upward from the bottom plate, and which is configured to guide, from the machining bases, machining chips generated during machining of the workpieces; cleaning liquid supply nozzles configured to each supply a cleaning liquid to at least one of the machining base and the machining chip guide path; and remaining-chip removal nozzles configured to each supply a cleaning liquid to a chip-remaining area where the bottom plate and the side walls intersect, thereby removing the machining chips remaining in the chip-remaining area.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus for processing semiconductor wafers and the like, and a method for removing processing debris generated in the processing apparatus. [Background technology]

[0002] Chips for devices such as ICs (Integrated Circuits) are manufactured, for example, using the following procedure. First, a large number of elements are formed on the surface of a workpiece, such as a silicon wafer, using processing techniques such as photolithography to form multiple devices. Next, the back side of the workpiece is ground to thin it. After that, the workpiece is cut along the boundaries of the multiple devices and divided into multiple chips.

[0003] Before and after these processes, the workpiece is often cleaned to remove any machining debris adhering to it. For example, as described in Patent Document 1 below, cleaning is performed by supplying a cleaning liquid such as water to the workpiece held on the holding surface of the chuck table or its surroundings. The machining debris generated during grinding or cutting is washed away by utilizing the flow of fluid and guided into a collection box or the like.

[0004] However, depending on conditions such as the shape and size of the processing debris, the shape of the flow path (guide path) for guiding the processing debris, and the flow rate of the cleaning liquid, the processing debris may become stuck in the guide path, making it necessary to remove this stuck processing debris from the flow path. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2020-129580 Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide a processing device and a method for removing processing debris from a processing device that can suitably remove processing debris that is generated during processing of a workpiece and accumulates in a guide path. [Means for solving the problem]

[0007] According to one aspect of the present invention, there is provided a processing apparatus having a processing table for holding a workpiece, a bottom plate forming a horizontal or inclined surface, and side walls forming surfaces extending upward from the bottom plate, the processing apparatus comprising: a chip guide path for guiding chips generated during processing of the workpiece from the processing table; a cleaning liquid supply nozzle for supplying cleaning liquid to at least one of the processing table and the chip guide path; and a retained chip removal nozzle for removing chips retained in a retention area where the bottom plate and the side walls intersect by supplying cleaning liquid to the retention area.

[0008] Preferably, the chip guide path has a bottom plate that forms a surface that slopes downward as it moves away from the processing table, and a side wall that is provided along the slope of the bottom plate in a plan view.

[0009] Preferably, the debris removal nozzle is positioned above the bottom plate and within 50 mm from the side wall in a plan view so as to spray the cleaning liquid along the extension direction of the side wall in a plan view.

[0010] According to another aspect of the present invention, there is provided a method for removing machining debris from a machining device, the method including: a machining step of machining a workpiece; a machining debris guiding step of supplying a cleaning liquid to at least one of the machining table or a machining debris guide path having a bottom plate forming an inclined surface and a side wall forming a surface extending upward from the bottom plate, and guiding machining debris generated in the machining step into the machining debris guide path; and a retained debris removal step of supplying a cleaning liquid to a retention area where the bottom plate and the side wall intersect, and removing machining debris retained in the retention area. [Effects of the Invention]

[0011] According to a processing device and a method for removing chips from a processing device according to one aspect of the present invention, a cleaning liquid is sprayed from a debris removal nozzle onto a portion of the chip guide path where chips are particularly likely to accumulate, thereby enabling chips to be removed effectively with a small amount of cleaning liquid. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing an example of a configuration of a processing device. [Figure 2] FIG. 2 is a front view of the processing apparatus of FIG. [Figure 3] FIG. 3 is a plan view showing a schematic arrangement of retained debris removal nozzles in the processing device. DETAILED DESCRIPTION OF THE INVENTION

[0013] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the accompanying drawings, in which: Fig. 1 is a perspective view showing an example of the configuration of a processing device 2 according to this embodiment;

[0014] In this embodiment, the processing device 2 is a cutting device that cuts a workpiece 4, such as a silicon wafer. More specifically, the processing device 2 targets substrates called CSP substrates (Chip Scale Packages), QFN substrates (Quad Flat Non-leaded packages), BGA substrates (Ball Grid Arrays), etc. as the workpiece 4, and is configured as a device that performs cutting processes on these substrates.

[0015] Since these substrates have large chip sizes, the scraps generated during cutting tend to be large as well. When such large scraps are generated as scraps, the scrap removal method according to the present embodiment described below is particularly effective.

[0016] However, the processing device is not limited to the cutting device for substrates as described above. It may be a cutting device for cutting smaller chips, or a device that performs grinding instead of cutting. In addition, various devices that generate processing waste during processing can be considered as processing devices.

[0017] The processing device 2 includes a processing table 6 as a holding mechanism for holding the workpiece 4, and a processing unit 8 arranged above the processing table 6 for processing the workpiece 4.

[0018] The processing table 6 is a table that holds a workpiece 4 such as a wafer that is the target of cutting processing by the processing device 2. The processing table 6 includes a movable table 10 that is configured to be movable in the horizontal direction, and a chuck table 12 attached to the movable table 10, and constitutes a holding mechanism that holds the workpiece 4.

[0019] The chuck table 12 is attached to the upper surface of the movable table 10 so as to be rotatable about an axis extending in the vertical direction (Z-axis direction) relative to the movable table 10. The upper surface of the chuck table 12 functions as a holding surface 12a that holds the workpiece 4 by negative pressure transmitted from a suction source (not shown) such as an ejector.

[0020] In this specification, expressions such as "along the Z axis" and "along the side wall" are used, but these do not necessarily mean that the directions are exactly the same or strictly parallel to each other. They also include cases where the directions are roughly along the direction, or where it is acceptable to consider them that way in practice.

[0021] The movable table 10 is adapted to move in one horizontal direction (X-axis direction) relative to a base 14 fixed to the bottom of the processing device 2. The movement of the movable table 10 along the X-axis relative to the base 14 is performed by a movement mechanism configured, for example, with a ball screw, a pulse motor, etc. (not shown).

[0022] The processing unit 8 includes a blade 8a that cuts the workpiece 4 and a cleaning liquid supply nozzle 8b that supplies a liquid such as water, and is supported above the chuck table 12. The processing unit 8 is supported by a movement mechanism (not shown) so as to be movable along a horizontal direction (Y-axis direction) perpendicular to the X-axis direction and a vertical direction (Z-axis direction) relative to the wall of the processing device 2. The movement of the processing unit 8 along the Y-axis and Z-axis is performed by a movement mechanism composed of, for example, a ball screw and a pulse motor (not shown).

[0023] Here, the term "cleaning liquid" as used in this specification will be explained. When cutting, grinding, or other processes are performed on a workpiece such as a wafer, cutting or grinding may be performed while supplying a liquid such as water to the area around the contact point between the blade or grinding wheel and the workpiece. In such cases, the supplied liquid is often referred to as "cutting water" or "grinding water," meaning water supplied for the purpose of cutting or grinding.

[0024] However, in this specification, the configuration and operation of this embodiment are described with a focus on the action of the supplied liquid washing away machining debris. Therefore, even if the liquid is supplied for the purpose of cutting or grinding, it is referred to as a "cleaning liquid" in this specification in the sense that it is a liquid that can ultimately wash away machining debris by being supplied to the workpiece or its surroundings.

[0025] The moving mechanism is a mechanism for performing relative movement between the workpiece 4 held by the holding mechanism (movable table 10, chuck table 12) and the processing unit 8. In this embodiment, the moving table 10 is moved in the X-axis direction, while the processing unit 8 is moved in the Y-axis and Z-axis directions, thereby performing relative movement between the two.

[0026] The blade 8a provided in the processing unit 8 rotates around an axis set along the Y-axis direction to cut the workpiece 4. During cutting, the blade 8a is rotated while in contact with the workpiece 4 on the chuck table 12, while the movable table 10 is moved from upstream to downstream along the X-axis direction. In this way, cutting is performed along a line set in the X-axis direction.

[0027] When cutting along one line is complete, the processing unit 8 is moved upward and the movable table 10 is returned to the upstream side. The processing unit 8 is then moved along the Y-axis direction to the position of the next line, and then the processing unit 8 is lowered to contact the workpiece 4, and cutting is performed along the next line in the same manner.

[0028] Once cutting of the workpiece 4 along a line parallel to the one direction has been completed, the chuck table 12 is then rotated 90° about the Z axis, and similar cutting is performed along a direction perpendicular to the one direction. In this way, the workpiece, which is a disk-shaped wafer, can be cut into a lattice pattern.

[0029] During cutting, a liquid (cleaning liquid) such as water is supplied from the cleaning liquid supply nozzle 8b to the surface of the workpiece 4. Processing waste such as chips and scraps generated during cutting is washed away by the cleaning liquid.

[0030] The processing device 2 of this embodiment is provided with the processing unit 8 having the above-described configuration, two sets of processing tables 6 (movable table 10 and chuck table 12) and base tables 14 as a support mechanism.

[0031] Furthermore, the processing device 2 of this embodiment is provided with a processing debris guide path 16 around each processing table 6 to guide the processing debris swept away along the cleaning liquid from the processing table 6 to the collection box.

[0032] The chip guide path 16 in this embodiment includes a dam portion 18, a first tray portion 20, a second tray portion 22, and a groove portion 24.

[0033] Weir portion 18, which is part of chip guide path 16, is configured with a bottom plate that is the upper surface 10a of movable table 10, which forms a surface along the horizontal direction, and side walls 18b that form surfaces extending upward from bottom plate 10a. 18b that constitutes weir portion 18 surrounds chuck table 12 in a plan view, but side walls 18b are not provided in a portion that corresponds to one direction in the X-axis direction (the front side in FIG. 1). In other words, weir portion 18 forms a ring (C-shape) that is broken in one place in the circumferential direction (hereinafter, the portion of the ring-shaped shape of weir portion 18 where side walls 18b are not provided will be referred to as "open portion 18c").

[0034] The first tray section 20, which is another part of the machining chip guide path 16, is a tray-shaped member attached in a planar view in the direction of the opening section 18c of the weir section 18, and at a position radially outward from the weir section 18, when viewed from the movable table 10 and chuck table 12 that constitute the machining table 6.

[0035] The first tray section 20 is fixed to the movable table 10 at a position lower than the chuck table 12, and the area of ​​the first tray section 20 that is in the middle in the Y-axis direction forms a slope that slopes downward as it moves away from the processing table 6 (i.e., toward the front along the X-axis). In addition, the areas of the first tray section 20 that are on both sides in the Y-axis direction form slopes that slope downward as they move toward the center in the Y-axis direction.

[0036] The first tray portion 20 attached to the movable stage 10 moves in the X-axis direction integrally with the movable stage 10 as the movable stage 10 moves relative to the base 14.

[0037] The second tray section 22, which is another part of the chip guide path 16, is a tray-shaped member that, like the first tray section 20, is attached in a planar direction toward the opening 18a of the weir section 18 when viewed from the chuck table 12, and at a radially outer position than the weir section 18.

[0038] The first tray section 20 is attached to the movable table 10 , whereas the second tray section 22 is attached to the base 14 side, and is positioned lower than the first tray section 20 as a whole.

[0039] The second tray section 22 has a bottom plate 22a that forms a slope that slopes downward as it moves away from the processing table 6 (toward the user along the X-axis), and side walls 22b that are provided along the slope of the bottom plate 22a in a plan view. The side walls 22b are members that form surfaces that extend upward from the bottom plate 22a, and are provided on two sides of the bottom plate 22a that are approximately parallel to the X-axis.

[0040] The end (tip 20a) of the first tray section 20 that is farthest from the movable table 10 in the X-axis direction moves along the X-axis as the movable table 10 moves. In contrast, the position and dimensions of the end (tip 22c) of the bottom plate 22a of the second tray section 22 that is farthest from the movable table 10 in the X-axis direction are set so that it is located farther from the movable table 10 in a plan view than the tip 20a of the first tray section 20, regardless of the position of the movable table 10 within its range of movement along the X-axis.

[0041] In addition, the end portion (base end portion) of the bottom plate 22a of the second tray portion 22 closest to the movable table 10 22d) is positioned so that it is closer to the movable table 10 than the tip 20a of the first tray section 20, regardless of the position of the movable table 10 within its range of movement along the X axis.

[0042] In other words, no matter what position the movable table 10 is in relative to the base 14, the tip end 20a thereof is located between the tip end 22c and base end 22d of the second tray portion 22 in a plan view.

[0043] Due to the inclination of the first tray portion 20, the middle portion of its tip portion 20a (the portion located in the center in the Y-axis direction) is at the lowest position in the first tray portion 20. Similarly, due to the inclination of the bottom plate 22a of the second tray portion 22, its tip portion 22c is at the lowest position in the second tray portion 22.

[0044] The groove portion 24, which is another part of the chip guide path 16, is a flow path that is provided along the Y-axis direction in a plan view at a position farther from the processing table 6 in the X-axis direction than the second tray portion 22. The groove portion 24 includes a bottom plate 24a that forms an inclined surface that slopes along the Y-axis direction, and a side wall 22b that is provided along the inclined direction of the bottom plate 24a in a plan view.

[0045] The side walls 24b are members forming surfaces extending upward from the bottom plate 24a, and are provided on two sides of the bottom plate 24a that are approximately parallel to the Y-axis. The entire groove 24 is provided at a position lower than the second tray portion 22, and a collection box 26, which is a container for collecting processing waste, is connected to the lowest end of the slope formed by the groove 24.

[0046] In the processing device 2, which is a cutting device, the workpiece 4 is subjected to cutting processing while the cleaning liquid is supplied to the workpiece 4, as described above.

[0047] The cleaning liquid supply nozzle 8b of the processing unit 8 supplies cleaning liquid to the chuck table 12 that constitutes the processing table 6. The cleaning liquid supplied to the surface of the workpiece 4 held on the chuck table 12 first flows from the holding surface 12a of the chuck table 12 to the upper surface 10a of the movable table 10. A dam portion 18 is provided on the upper surface 10a of the movable table 10, with the upper surface 10a serving as a base plate.

[0048] The cleaning liquid that flows down from the chuck table 12 onto the bottom plate 10a is blocked from flowing outward by the side walls 18b provided around the chuck table 12, and is guided to the open section 18c where the side walls 18b are not provided, and flows down onto the first tray section 20 located beyond that.

[0049] The cleaning liquid that has flowed down into the first tray portion 20 is guided to the tip portion 20 a according to the inclination provided in the first tray portion 20 , and then flows down from there into the second tray portion 22 .

[0050] The cleaning liquid that flows down into the second tray portion 22 flows toward the tip portion 22c according to the inclination of the bottom plate 22a, and is blocked from flowing outward by the side walls 22b provided on the left and right sides of the flow, and is guided into the groove portion 24.

[0051] The cleaning liquid that has flowed down into the groove 24 flows between the side walls 24b according to the inclination of the bottom plate 24a, and then flows into the collection box 26.

[0052] As a result of the above flow, machining waste such as cuttings and scraps is swept away by the cleaning liquid and is guided along the machining waste guide path 16 to the collection box 26 together with the cleaning liquid.

[0053] In such a flow, depending on various conditions such as the flow rate and flow speed of the cleaning liquid, the shape and dimensions of the machining debris guide path 16, and the shape and dimensions of the machining debris, an area may be created in part of the machining debris guide path 16 where the machining debris is difficult to flow and is likely to stagnate (hereinafter, for convenience, the area in the machining debris guide path where the machining debris is likely to stagnate will be referred to as the "stagnation area").

[0054] The processing device 2 of this embodiment is provided with retained debris removal nozzles 28 at various locations along the above-configured processing debris guide path 16 for removing processing debris retained in the retention area. In this embodiment, a total of six retained debris removal nozzles 28 are provided at positions for spraying cleaning liquid onto the groove portion 24 and the two second tray portions 22.

[0055] In the chip guide path 16, the second tray portion 22 and the groove portion 24 each have a bottom plate 22a, 24a that forms an inclined surface, and a side wall 22b, 24b that is provided along the inclination direction of the bottom plate 22a, 24a. In a flow path with such a shape, the vicinity of the intersection of the bottom plate 22a, 24a and the side wall 22b, 24b (the edge of the bottom plate 22a, 24a, the lower end of the side wall 22b, 24b) may become a retention area where chips tend to accumulate. Therefore, assuming that chips will accumulate here, cleaning liquid is sprayed there from the debris removal nozzle 28 to effectively remove the chips.

[0056] The debris removal nozzles 28 of the second tray section 22 are provided in pairs for each second tray section 22, at positions above the inclination of the bottom plate 22a and immediately inside the pair of side walls 22b in plan view. The debris removal nozzles 28 are arranged so that the axis of the cleaning liquid ejection is aligned with the side walls 22b in plan view, and the cleaning liquid is sprayed from these nozzles in the direction of the side walls 22b around the area where the bottom plate 22a and side walls 22b intersect.

[0057] That is, in the processing device 2 of this embodiment, the portion of the upper surface of the bottom plate 22a constituting the second tray section 22 where it intersects with the side wall 22b and the area extending slightly inward from there is regarded as the retention area A, as shown in Fig. 3. Note that Fig. 3 is a plan view schematically showing the arrangement of the retained debris removal nozzle 28 in the processing device 2.

[0058] In the chip guide path 16 configured as shown in Figure 1, the cleaning water tends to flow mainly through the central region of each component, and therefore, it is assumed that the water volume is small and the flow is weak in the regions on the left and right sides of the flow. Furthermore, if side walls 22b, 24b are located in that position, the chips will experience friction not only with the bottom plates 22a, 24a but also with the side walls 22b, 24b. Due to these factors, chips are likely to accumulate in the region indicated by the symbol A in Figure 3 (the accumulation region).

[0059] The size and shape of the retention area A vary depending on the shape and dimensions of the bottom plate 22a, the inclination, the flow rate of the cleaning liquid, the position where the cleaning liquid flows into the bottom plate 22a, the shape and size of the processing debris, etc., but for example, if the width of the second tray section 22 shown in Figure 3 (the distance between the inner wall surfaces of the pair of side walls 22b) is about 200 mm, the width (dimension in the Y direction) of the retention area A is, for example, about 25 mm or more and 50 mm or less.

[0060] The debris removal nozzle 28 is attached above the bottom plate 22a and within 50 mm from the side wall 22b in a plan view, and sprays the cleaning liquid from that position along the extension direction of the side wall 22b in a plan view.

[0061] In the processing device 2, which is a cutting device, cutting generates chips S including scraps of about several millimeters to several tens of millimeters, which may be swept away by the cleaning liquid into the second tray section 22 and remain in the retention areas A on both sides, as shown in Fig. 3. Cleaning liquid is sprayed here from the retained chip removal nozzle 28 to remove the retained chips.

[0062] The pair of debris removal nozzles 28 are preferably positioned, for example, at a distance of 10 mm to 15 mm inward from sidewall 22b so as to spray cleaning liquid into this retention area A. The distance values ​​shown here indicate the distance between the inner wall surface of sidewall 22b and the spray axis of debris removal nozzle 28. The diameter of each debris removal nozzle 28 is, for example, approximately 5 mm to 10 mm.

[0063] Although the example shown here shows a case where one debris removal nozzle 28 is installed per location, multiple debris removal nozzles 28 may be provided in the same location. For example, two or more debris removal nozzles 28 may be arranged vertically or horizontally so that their axes are spaced apart by approximately 10 mm to 15 mm.

[0064] The groove 24 is also configured with a bottom plate 24a and side walls 24b, similar to the second tray 22, and the intersection of these and the surrounding area can also be considered a retention area. Therefore, in order to remove the processing debris retained there, a pair of retained debris removal nozzles 28 are installed on the upper side of the inclination of the bottom plate 24a and just inside the pair of side walls 24b in a plan view.

[0065] The debris removal nozzle 28 is positioned so that the axis of the cleaning liquid ejection is aligned with the side wall 24b in a plan view, and the cleaning liquid is sprayed from here along the direction of the side wall 24b around the area where the bottom plate 24a and the side wall 24b intersect.

[0066] In addition, the position and orientation of the debris removal nozzles, the number of debris removal nozzles to be installed at one location, and other factors may be freely set depending on the configuration of the processing debris guide path, the amount and dimensions of the generated processing debris, the actual debris retention status, etc.

[0067] For example, in the processing apparatus 2 of this embodiment, the weir portion 18, which constitutes a part of the second tray portion 22 and the groove portion 24, is also composed of a bottom plate (the upper surface of the movable table 10) 10a that forms a horizontal surface and a side wall 18b that protrudes upward from the bottom plate 10a, and depending on the conditions, it is conceivable that processing debris may accumulate at the intersection of the bottom plate 10a and the side wall 18b or in the area nearby. Therefore, a cleaning liquid supply nozzle may be provided to spray cleaning liquid into this area.

[0068] In addition, although the example given here is one in which cleaning liquid is supplied to the processing table 6 from a cleaning liquid supply nozzle 8b provided on the processing unit 8, instead of or in addition to this, a nozzle for supplying cleaning liquid may be provided at another position on the processing chip guide path 16.

[0069] For example, cleaning liquid may be supplied to the workpiece 4 from a nozzle provided at a position separate from the machining unit 8, or cleaning liquid may be supplied from a nozzle somewhere on the chip guide path. Even in such a case, if a stagnation area occurs in the chip guide path, a chip removal nozzle may be provided to spray cleaning liquid into the stagnation area.

[0070] The type of cleaning liquid sprayed from the accumulated debris removal nozzle 28 may be the same as the cleaning liquid supplied from the cleaning liquid supply nozzle 8b of the processing unit 8, or different types of cleaning liquid may be supplied. For example, pure water may be supplied from the cleaning liquid supply nozzle 8b, and water mixed with a surfactant or other component may be sprayed from the accumulated debris removal nozzle 28. When supplying cleaning liquid from the accumulated debris removal nozzle 28, gas may be mixed in to spray two fluids. Alternatively, the cleaning liquid may be sprayed by alternately supplying liquid and gas, intermittently spraying gas while supplying liquid, or intermittently spraying liquid while supplying gas.

[0071] The procedure from the generation of chips during the machining of the workpiece 4 to the guidance of the chips and the removal of chips remaining in the chip guide path 16 can be summarized as follows, for example.

[0072] First, when a machining step is performed to machine the workpiece 4 held on the machining table 6, machining chips such as swarf and offcuts are generated. A cleaning liquid is supplied to at least one of the machining table 6 or the machining chip guide path 16, and a machining chip guiding step is performed in which the cleaning liquid guides the machining chips to the machining chip guide path 16. In the example described above, the cleaning liquid is supplied to the machining table 6 from the cleaning liquid supply nozzle 8b, and further the cleaning liquid flows down from the machining table 6 into the machining chip guide path 16, so that the cleaning liquid is also supplied to the machining chip guide path 16.

[0073] In the portion of the chip guide path 16 that includes the bottom plates 22a, 24a and the side walls 22b, 24b (the second tray portion 22 and the groove portion 24), a cleaning liquid is supplied from the accumulated chip removal nozzle 28 to an accumulation area where the bottom plates 22a, 24a and the side walls 22b, 24b intersect. This executes an accumulated chip removal step that removes chips accumulated in the accumulation area.

[0074] The processing device 2 described above is equipped with a debris removal nozzle 28 that sprays cleaning liquid particularly onto areas of the debris guide path 16, through which the debris flows together with the cleaning liquid, where the debris is likely to accumulate, to remove the accumulated debris.

[0075] The waste generated during the processing of workpieces can be removed to some extent by supplying cleaning liquid and washing it away. However, if the waste does not flow smoothly to the collection box, possible countermeasures include increasing the amount of cleaning liquid supplied or spraying the cleaning liquid more forcefully (increasing the flow rate).

[0076] However, depending on the configuration of the flow path, processing debris may accumulate in a particular area. In such a case, even if the overall supply of cleaning liquid is simply increased, the flow of cleaning liquid may not reach that area effectively, making sufficient cleaning difficult.

[0077] Even if cleaning is possible, increasing the overall flow rate to clean that area will require a correspondingly large amount of cleaning liquid, and much of that liquid will flow through without passing through that area, resulting in a lot of wasted cleaning liquid.The same is true when increasing the overall flow rate of the cleaning liquid.

[0078] In this embodiment, a portion of the chip guide path 16 where chips are particularly likely to accumulate is identified as an accumulation region, and cleaning liquid is sprayed from the accumulated chip removal nozzle 28 onto the accumulation region, in addition to the cleaning liquid supplied from the cleaning liquid supply nozzle 8b. This allows chips to be effectively removed with a small amount of cleaning liquid.

[0079] In particular, when the processing device 2 is a cutting device that handles large-chip-sized substrates such as CSP substrates, QFN substrates, and BGA substrates as the workpiece 4, the scrap material generated during processing tends to be large. Large-sized processing debris is particularly likely to accumulate in the processing debris guide path 16, but even when such large processing debris accumulates, it can be effectively removed by spraying cleaning liquid from the debris removal nozzle 28 as described above.

[0080] The structures, methods, etc. according to the above-described embodiments are not limited to the above-described embodiments, and may be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0081] 2: Processing equipment, 4: Workpiece, 6: Processing table (support mechanism), 8: Processing unit 8a: Blade, 8b: Cleaning liquid supply nozzle, 10: Moving table (support mechanism) 10a: upper surface (bottom plate), 12: chuck table (support mechanism), 12a: holding surface 14: Base, 16: Processing waste guideway, 18: Weir (processing waste guideway), 18b: Side wall 18c: Opening portion, 20: First tray portion (processing waste guide path), 20a: Tip portion 22: second tray portion (processing chip guide path), 22a: bottom plate, 22b: side wall, 22c: tip portion 22d: Base end, 24: Groove (processing waste guiding path), 24a: Bottom plate, 24b: Side wall 26: Collection box, 28: Retention debris removal nozzle, A: Retention area, S: Processing debris

Claims

1. a processing table for holding a workpiece; a chip guide path having a bottom plate forming a horizontal surface or an inclined surface and a side wall forming a surface extending upward from the bottom plate, the chip guide path guiding chips generated during the processing of the workpiece from the processing table; a cleaning liquid supply nozzle for supplying a cleaning liquid to at least one of the processing table and the processing chip guide path; a retained debris removal nozzle that removes processing debris retained in a retained area where the bottom plate and the side wall intersect by supplying a cleaning liquid to the retained area; A processing device comprising:

2. 2. The processing device according to claim 1, wherein the chip guide path has a bottom plate that forms a slope that slopes downward as it moves away from the processing table, and a side wall that is provided along the slope of the bottom plate in a plan view.

3. 3. The processing device according to claim 2, wherein the debris removal nozzle is disposed above the bottom plate and within 50 mm from the side wall in a plan view so as to spray the cleaning liquid along the extension direction of the side wall in a plan view.

4. a processing step of processing a workpiece; a chip guiding step of supplying a cleaning liquid to at least one of the processing table or a chip guiding path having a bottom plate forming an inclined surface and a side wall forming a surface extending upward from the bottom plate, and guiding chips generated in the processing step into the chip guiding path; a retained debris removal step of supplying a cleaning liquid to a retained area where the bottom plate and the side wall intersect and removing processing debris retained in the retained area; A method for removing processing debris from a processing device, comprising:

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