Liquid discharge head, liquid discharge device, and method of manufacturing liquid discharge head

Abstract

To provide a liquid discharge head that is less likely to cause jamming due to a recording medium and is durable.SOLUTION: A liquid discharge head includes: a liquid discharge substrate that has a face surface with a discharge port for discharging liquid; a face cover that is joined to the liquid discharge substrate and protects the face surface; and a support member that supports the face cover. The support member has a groove partially overlapping the face cover when viewed from a direction perpendicular to the face surface on a surface to which the face cover is joined, and has resin provided over a space surrounded by the support member and the face cover and the groove.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a liquid ejection head, a liquid ejection apparatus, and a method for manufacturing a liquid ejection head. [Background technology]

[0002] A liquid ejection head is provided with a liquid ejection substrate provided with ejection ports for ejecting liquid. The liquid ejection substrate is generally placed on a support member that also functions as a flow path member for supplying liquid, and the supplied liquid is ejected from the ejection ports to perform recording, etc., on a recording medium. If the edge of the recording medium is curved (curled) when being transported, the edge of the recording medium may come into contact with the side of the liquid ejection head, causing a paper jam.

[0003] As a method for preventing this, Patent Document 1 discloses a liquid ejection head including a nozzle plate with nozzles (ejection ports) that eject liquid toward an ejection target, a nozzle protection member that covers at least a portion of the nozzle surface of the nozzle plate facing the liquid ejection direction, except for the nozzles, and a nozzle protection member holding member with a peripheral wall that is bonded to the nozzle protection member. This configuration includes a resin member between the side of the nozzle protection member that is bonded to the nozzle protection member holding member and the surface of the peripheral wall that faces the liquid ejection direction. With this configuration, even if the edge of the recording medium is curved, the recording medium can be passed between the liquid ejection head and the recording medium transport surface, making jamming less likely to occur. Additionally, peeling of the nozzle protection member is suppressed. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2023-66364 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the liquid ejection head described in Patent Document 1, the resin member provided to prevent the recording medium from coming into contact with the side of the nozzle protection member, which is a face cover that protects the face surface, which is the surface on which the ejection ports of the liquid ejection substrate are provided, is weak against forces from the side, and there is a possibility that the resin member will peel off if the recording medium comes into contact with it. [Means for solving the problem]

[0006] The liquid ejection head of the present invention, which solves the above problem, is a liquid ejection head having a liquid ejection substrate having a face surface with ejection ports for ejecting liquid, a face cover joined to the liquid ejection substrate and protecting the face surface, and a support member supporting the face cover, wherein the support member has a groove on the surface to which the face cover is joined that overlaps partially with the face cover when viewed from a direction perpendicular to the face surface, and has a space surrounded by the support member and the face cover, and resin provided across the groove.

[0007] Furthermore, the present invention provides a method for manufacturing a liquid ejection head that solves the above-mentioned problems, comprising: a liquid ejection substrate having a face surface with ejection ports for ejecting liquid; a face cover joined to the liquid ejection substrate and protecting the face surface; and a support member that supports the face cover, wherein the support member has a groove on the surface to which the face cover is joined that overlaps partially with the face cover when viewed from a direction perpendicular to the face surface, and the method for manufacturing a liquid ejection head further comprises a step of placing resin in the space surrounded by the support member and the face cover, and across the groove. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a highly durable liquid ejection head that is less susceptible to jamming due to recording media. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view illustrating a schematic configuration of a liquid ejection device according to an embodiment. [Figure 2] 1 is a perspective view illustrating a liquid ejection head according to an embodiment. [Figure 3] FIG. 2 is a plan view illustrating a liquid ejection unit before being placed on a support member according to an embodiment. [Figure 4] 1A and 1B are an example of a top view and a side view of a liquid ejection unit arranged on a support member according to an embodiment. [Figure 5] 1 is an example of a cross-sectional view of a liquid ejection head according to an embodiment. [Figure 6] FIG. 2 is a plan view illustrating an example of a support member according to an embodiment. [Figure 7] 5A to 5C are diagrams illustrating a part of a manufacturing process of a liquid ejection head according to an embodiment. [Figure 8] 10 is another example of a cross-sectional view of a liquid ejection head according to an embodiment. [Figure 9] 10 is another example of a top view of a liquid ejection head according to an embodiment. [Figure 10] 1 is an example of a cross-sectional view of a liquid ejection head according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0011] (First embodiment) FIG. 1 is a perspective view showing a schematic configuration of a liquid ejection apparatus 1000 to which the present invention can be applied. The liquid ejection apparatus 1000 includes a transport unit 300 that transports a recording medium 200, and a liquid ejection head 100 that ejects a liquid such as ink. The transport unit 300 transports the recording medium 200 toward the liquid ejection head 100. While cut paper or roll paper is typically used as the recording medium 200, other media may also be used. Recording is performed on the recording medium 200 as it passes between the liquid ejection head 100 and a support surface 301 provided on the transport unit 300. The transport direction of the recording medium 200 is the direction of arrow A shown in FIG. 1. The liquid ejection head 100 of this embodiment is a line-type head having a length corresponding to the width of the recording medium 200 (the width of the recording medium 200 in a direction perpendicular to the transport direction A). However, the present invention can also be applied to a serial-type head that ejects liquid while performing a reciprocating motion.

[0012] FIG. 2(a) is a perspective view of a liquid ejection head 100 of this embodiment, as seen from the face side having ejection ports 11. In the liquid ejection head 100 shown in FIG. 2(a), a liquid ejection unit 10 (see FIG. 3) including a liquid ejection substrate 13 having ejection ports 11 for ejecting liquid on a face surface (liquid ejection surface) 12, and a face cover 20 for protecting the face surface 12, is provided on a support member 30. The support member 30 supports the liquid ejection substrate 13 and the face cover 20 and includes a flow path for supplying liquid to the ejection ports 11. The liquid ejection unit 10 has a flexible wiring board 40 (see FIG. 3) that transmits electrical signals for ejecting liquid to the liquid ejection substrate 13. In this embodiment, four liquid ejection units 10 are arranged in a staggered pattern on the support member 30 to form a line-type head. The number of liquid ejection units 10 can be changed as needed depending on the required head length. The liquid ejection units may be arranged in an inline manner or another method.

[0013] 2(b) is a perspective view of the liquid ejection head 100 of this embodiment, viewed from the side opposite to the face surface 12. The liquid ejection head 100 has a liquid flow path section 50 that fluidly connects a tank (not shown) outside the liquid ejection head and the liquid ejection substrate 13. The configuration shown in FIG. 2(b) includes a liquid flow path section 50a that supplies liquid to the liquid ejection head 100, and a liquid flow path section 50b that recovers liquid from the liquid ejection head 100.

[0014] Liquid such as ink is supplied to the ejection ports 11 via the tank, the liquid flow path section 50, the support member 30, and the liquid ejection substrate 13 in that order. The liquid ejection head 100 may also be provided with other functions such as a liquid circulation function, a temperature control function, and a filter function, as appropriate, depending on the physical properties of the liquid and the performance of the liquid ejection head 100.

[0015] FIG. 3 is a plan view showing the liquid ejection unit 10 before being placed on the support member 30. The liquid ejection substrate 13 is a substrate having liquid flow paths and energy generating elements for ejecting liquid therein, and is formed, for example, with a silicon base. A plurality of ejection ports 11 for ejecting liquid are formed on the surface of the liquid ejection substrate 13, and are formed, for example, from a photosensitive resin. A face cover 20 is bonded to the face surface 12 to protect the face surface 12 including the ejection ports 11. When viewed from a direction perpendicular to the face surface 12, the face cover 20 has openings for exposing the ejection ports 11 of the liquid ejection substrate 13. In other words, when viewed from a direction perpendicular to the face surface 12, the face cover 20 has openings inside which the liquid ejection substrate 13 is placed. The thickness of the face cover 20 is, for example, 0.1 to 0.5 mm.

[0016] Liquid supplied to the liquid ejection substrate 13 is ejected from the ejection ports 11 by driving energy generating elements built into the liquid ejection substrate 13. Heat generating elements or piezoelectric elements are typically used as the energy generating elements, and electrical signals and power are supplied through a flexible wiring board 40 electrically connected to the liquid ejection substrate 13. In this embodiment, two flexible wiring boards 40 are provided on two opposing sides of one liquid ejection substrate 13. The flexible wiring board 40 is primarily composed of a base film, a cover film, and electrical wiring. Flexible resins, such as polyimide resins, are used for the base film and cover film to improve flexibility of deformation. The electrical wiring is made of copper foil or the like and is bonded with an adhesive between the base film and the cover film. A portion of the cover film is removed to expose the electrical wiring, and this exposed portion is used for electrical connection to the liquid ejection substrate 13.

[0017] FIG. 4 shows a state in which multiple liquid ejection units 10 are bonded to a support member 30 so that the heights of their respective face surfaces 12 are the same. FIG. 4(a) is a plan view seen from a direction perpendicular to the face surface 12, and FIG. 4(b) is a side view seen from a direction perpendicular to the face surface 12. Arrow A in FIG. 4(a) indicates the transport direction of the recording medium 200, as in FIG. 1. Note that, in this specification, "height" refers to the position in the direction perpendicular to the face surface 12. The liquid ejection units 10 are bonded to the support member 30 with high precision to achieve high-resolution recording. The support member 30 supports the liquid ejection units 10 and also serves as a flow path member having a flow path that supplies liquid to the liquid ejection substrate 13. An adhesive is applied to the support substrate 30 or the liquid ejection substrate 13 and bonded so as not to clog the flow path. It is preferable that the adhesive be resistant to the liquid to be ejected. In this embodiment, a thermosetting epoxy resin was used and cured by heating at an actual temperature of 100°C. When the temperature of the liquid ejection head 100 changes due to heating during thermal curing of the adhesive or heating due to temperature control of the ejection liquid, internal stress is generated due to the difference in linear expansion coefficient between the support member 30 and the liquid ejection substrate 13, which may damage the liquid ejection head 100. For this reason, it is preferable to reduce the difference in linear expansion coefficient between the support member 30 and the liquid ejection substrate 13. In this embodiment, alumina is used for the support member 30.

[0018] When adhering the liquid ejection unit 10 to the support member 30, as shown in FIG. 4b, the flexible wiring board 40 is bent approximately 90° in the direction opposite to the support surface 301 and passes through the inside of the support member 30 to be connected to an electric board (not shown). FIG. 5(a) is a cross-sectional view corresponding to Va-Va in FIG. 4, and FIG. 5(b) is a partial enlarged view of Vb in FIG. 5(a). The support member 30 includes a first support member 31 that supports the liquid ejection substrate 13 and a second support member 32 that is disposed on the face surface side of the first support member 31 and that joins the face cover 20. As shown in FIGS. 5(a) and 5(b), the face cover 20 is joined to the second support member 32 via a resin member 70. Here, in this embodiment, a surface 32a of the second support member 32 that is joined to the face cover 20 has a groove 321 that partially overlaps with the face cover 20 when viewed from a direction perpendicular to the face surface 12. FIG. 6 shows a plan view of the second support member 32 having the groove 321. The resin member 70 is disposed in the space surrounded by the second support member 32 and the face cover 20, and across the groove 321. By providing such groove 321 and resin member 70, it is possible to obtain the effect of improving the adhesiveness of the face cover 20 against a force applied from the lateral direction.

[0019] Furthermore, the resin member 70 forms an inclined surface 70a that connects the surface and end of the face cover 20 to the surface 32a of the second support member 32. In other words, the cover surface 20a of the face cover 20 opposite the surface that is joined to the second support member 32, the inclined surface 70a of the resin member 70, and the surface 32a of the second support member 32 form a continuous surface. This provides the effect of preventing the recording medium 200 from getting caught on the end of the face cover 20 and peeling off the face cover 20, and of preventing the recording medium 200 from jamming.

[0020] A method for manufacturing a liquid ejection head according to the present invention will be described below.

[0021] As described above, in the liquid ejection head 100 of this embodiment, a plurality of liquid ejection units 10 are provided on the support member 30. The height of the liquid ejection units 10 varies depending on the unit used. Therefore, in this embodiment, a floating mount is used to align the height of each face surface 12. FIG. 7 is a diagram showing the process of placing the liquid ejection units 10 on the support member 30 and fixing them with a resin member 70. FIG. 7(a) is a diagram showing the state immediately before the liquid ejection units 10 are placed on the support member 30 and the resin member 70 is placed. The amount of compression of the adhesive that fixes the liquid ejection substrate 13 to the first support member 31 is adjusted to absorb the difference in face surface height between the liquid ejection units 10 and bond them together.

[0022] In the case of a floating mount, if the face cover 20 comes into contact with the second support member 32, the height of the liquid ejection unit 10 will not be aligned. Therefore, a first gap (space) 90 exists between the second support member 32 and the face cover 20, as shown in FIG. 7(a). In the configuration of this embodiment, in the state shown in FIG. 7(a), a second gap (space) 91 exists between the face cover 20 and the bottom of the groove 321 of the second support member 32. For example, if a recording medium 200 with a curved end is transported through the first gap 90, the end of the recording medium 200 may enter the first gap 90 instead of between the support surface 301 of the transport unit 300 and the liquid ejection head 100. In this case, the recording medium 200 may deform and jam. If jamming occurs, the printing operation must be stopped to remove the recording medium 200. Furthermore, the liquid ejection head 100 may be damaged by the impact caused when the end of the recording medium 200 comes into contact with the liquid ejection substrate 13 or the ejection orifice 11.

[0023] In this embodiment, the resin member 70 is disposed in the first gap 90 and the second gap 91 to ensure the adhesive strength of the liquid ejection head, particularly the face cover. First, as shown in FIG. 7( a), the liquid ejection unit 10 is positioned on the support member 30 by floating. In this state, the first adhesive 71 is applied to the groove 321 of the second support member 32. When the first adhesive 71 contacts the face cover 20, the first adhesive 71 is drawn into the first gap 90 by the capillary force of the first gap 90, filling it (FIG. 7( b)). In this embodiment, a thermosetting resin is used as the first adhesive 71, and the first adhesive 71 is cured by heating while remaining in the first gap 90 due to surface tension. The first adhesive 71 preferably has a low viscosity so that it can fill the first gap 90 using capillary force. Preferably, the viscosity before curing is 4.0 Pa·s or more and 132 Pa·s or less. The first adhesive 71 is not limited to a thermosetting resin; for example, a moisture-curing resin can also be suitably used. It is also preferable to set the height of the first gap 90 so that the first adhesive 71 is filled by capillary force. In this embodiment, as an example, the height of the first gap 90 is set to 0.2 mm.

[0024] Next, the second adhesive 72 is applied to the groove 321, filling the second gap 91, and cured by heat or the like ( FIG. 7( c) ). The second adhesive 72 forms an inclined surface 70a connecting the surface and end of the face cover 20 to the surface 32a of the second support member 32 across the groove 321. In other words, as the second adhesive 72 hardens, a gradient is formed connecting the outer circumferential edge of the face cover 20 to the outer circumferential edge of the groove 321. The gradient (inclined surface 70a) formed by the second adhesive 72 serves as a guide for the recording medium 200 when it is transported, preventing the recording medium 200 from entering between the support member 30 and the face cover 20. The second adhesive 72 is preferably a hard material that is not easily scraped when it comes into contact with the recording medium 200, and preferably has a Young's modulus of approximately 7 GPa. Furthermore, it is preferable that the cured second adhesive 72 does not protrude in the height direction from the face cover 20 toward the recording medium 200. Furthermore, it is preferable that the cured second adhesive 72 does not adhere to the face surface 12. Furthermore, it is preferable that the slope 72 of the second resin member is gentle, and the angle of inclination with respect to the surface 32a is 7° or more and 50° or less. In this embodiment, as an example, a thermosetting epoxy resin with a viscosity of 4.0 Pa s before hardening is used for the first adhesive 71 and the second adhesive 72, and is hardened by heating at 100°C.

[0025] If a large amount of the first adhesive 71 is applied so that both the first gap 90 and the second gap 91 are filled with only the first adhesive 71, the first adhesive 71 that cannot be retained by the capillary force of the first gap 90 may flow out toward the liquid ejection substrate 13. To avoid this, it is preferable to apply the resin member 70 in two steps, as in this embodiment. By first applying and curing an amount of the first adhesive 71 sufficient to be retained by the capillary force of the first gap 90, the second adhesive 72 applied later will not flow toward the liquid ejection substrate 13. In this embodiment, the first adhesive 71 is filled into the first gap 90 using capillary force. Therefore, as shown in FIG. 7 , the first resin surrounded by the surface 20b of the face cover 20 that is bonded to the support member 32 and the inner surface 32b of the support member 32 has a concave shape and does not protrude toward the liquid ejection substrate 13.

[0026] It is desirable to precisely control the amount of application of the first adhesive 71. For example, the heights of the face cover 20 and the second support member 32 can be measured with a laser displacement meter or the like, and the amount of application of the first adhesive 71 can be adjusted according to the measurement results to achieve optimal application.

[0027] Furthermore, by providing the grooves 321 on the surface 32a of the second support member 32, the applied second adhesive 72 can easily form a gradient due to surface tension so as to connect the outer circumferential edge of the face cover 20 to the outer circumferential edge of the grooves 321. Furthermore, the second adhesive 72 applied to the grooves 321 of the second support member 32 acts as an anchor, improving the adhesion between the second adhesive 72 and the second support member 32 and making it less likely to be damaged even if the recording medium 200 comes into contact with it. Furthermore, the face cover 20 becomes stronger against forces applied from the lateral direction. To more effectively obtain the anchoring effect of the disposed resin member 70, it is desirable that the depth of the grooves 321 be 0.2 mm or more. In this embodiment, as an example, the depth of the grooves 321 is 0.4 mm (design tolerance ±0.2 mm).

[0028] The width of the groove 321 can be determined depending on the size of the needle used to apply the resin member 70 (first adhesive 71 and second adhesive 72). To prevent the resin member 70 from spilling out of the groove 321 during application, the width of the groove 321 exposed from the face cover 20 when viewed from a direction perpendicular to the surface 32a of the second support member 32 on which the groove 321 is formed, with the face cover 20 in place, is preferably larger than the outer diameter of the needle, and is preferably 1.0 mm or greater. In this embodiment, as an example, the width of the groove 321 is approximately 2.15 mm, and the overlap between the groove 321 and the face cover 20 in the width direction of the groove 321 is approximately 0.6 mm. Therefore, the width of the groove 321 that does not overlap with the face cover 20 is approximately 1.55 mm. Furthermore, the outer diameter of the needle used to apply the resin member 70 is 0.72 mm, which allows for ample insertion into the groove 321 during application of the resin member 70.

[0029] In this embodiment, as an example, the height of the first gap 90 is 0.2 mm, the length of the first gap 90 in the width direction of the groove 321 is 1.0 mm, the height (depth) of the groove 321 is 0.4 mm, and the height of the second gap 91 is 0.635 mm. When applying the second adhesive 72 to the groove 321 configured in this manner, the adhesive can be applied from, for example, 0.3 to 0.8 mm above the bottom of the groove 321 provided in the support member 30. By providing sufficient clearance in this way with respect to the needle in the width of the groove 321 provided in the second support member 32, the precision requirements for the automatic application device used in the adhesive application process are reduced, which has the advantage of enabling production using a general-purpose application device.

[0030] It is also possible to apply the first adhesive 71 to the surface 32a of the second support member 32 in advance, and then bond the face cover 20 onto the first adhesive 71. In this case, the first adhesive 71 is compressed by the face cover 20, and the first adhesive 71 surrounded by the surface 20b of the face cover 20 and the inner surface 32b of the support member 32 has a convex shape as shown in FIG.

[0031] 4 and 6, the arrangement of the grooves 321 is not limited to the arrangement in which they are provided to correspond to the entire circumference of the face cover 20. For example, as shown in Fig. 9, the grooves 321 are provided to correspond to the side located upstream of the face cover 20 in the transport direction A of the recording medium 200. In such a configuration, the resin member 70 serves as a guide that prevents the recording medium 200 from entering the gap between the support member 30 and the face cover 20, thereby achieving the effect of making jamming less likely to occur.

[0032] Of course, by providing grooves 321 corresponding to the entire outer periphery of the face cover 20 as shown in FIGS. 4 and 6, the joining strength between the face cover 20 and the support member 30 can be further strengthened.

[0033] (Second embodiment) The following description will focus on the differences from the first embodiment described above, and will omit a description of the same parts as in the first embodiment.

[0034] FIG. 10 is a cross-sectional view showing a liquid ejection head of this embodiment, and corresponds to FIG. 5(b) of the first embodiment. In this embodiment, the resin member 70 and the inclined surface 70a are formed using only the first adhesive 71, without using the second adhesive 72 used in the first embodiment. The entire amount of the first adhesive 71 is applied in one go, without being thermally cured in between. In this case, too, it is preferable to apply the first adhesive 71 with precision, so it is desirable to measure the distance between the face cover 20 and the support member 32 with a laser displacement meter or the like, and adjust the amount of first adhesive 71 applied based on the measurement results to apply the optimal amount.

[0035] The first adhesive 71 and the second adhesive 72 form an inclined surface 70a that connects the surface and end of the face cover 20 to the surface 32a of the second support member 32 across the groove 321. At this time, the viscosity of the first adhesive 71 can be selected appropriately according to the dimensions and width of the first gap 90 so that the first adhesive 71 does not flow out toward the liquid ejection substrate 13.

[0036] The present invention includes the following configurations and manufacturing methods.

[0037] (Configuration 1) a liquid ejection substrate having a face surface with ejection ports for ejecting liquid; a face cover bonded to the liquid ejection substrate to protect the face; A support member that supports the face cover; A liquid ejection head having The support member has a groove on a surface to which the face cover is joined, the groove partially overlapping with the face cover when viewed from a direction perpendicular to the face surface, The liquid ejection head has a space surrounded by the support member and the face cover, and a resin provided across the groove.

[0038] (Configuration 2) the resin has an inclined surface inclined with respect to the face surface, A liquid ejection head as described in configuration 1, wherein the cover surface of the face cover opposite to the surface joined to the support member, the inclined surface, and the surface of the support member having the groove form a continuous surface.

[0039] (Configuration 3) 3. The liquid ejection head according to configuration 1 or 2, wherein the groove has a portion that does not overlap with the face cover when viewed in a direction perpendicular to the face surface.

[0040] (Configuration 4) 4. The liquid ejection head according to any one of configurations 1 to 3, wherein the face cover has an opening inside which the liquid ejection substrate is disposed when viewed from a direction perpendicular to the face surface.

[0041] (Configuration 5) 5. The liquid ejection head according to configuration 4, wherein the groove is formed so as to surround the opening when viewed from a direction perpendicular to the face.

[0042] (Configuration 6) 6. The liquid ejection head according to any one of configurations 1 to 5, wherein the space surrounded by the support member and the face cover, and the groove, are filled with the resin.

[0043] (Configuration 7) The liquid ejection head according to any one of configurations 1 to 6, wherein the resin surrounded by the surface of the face cover that is joined to the support member and the side surface of the support member has a concave shape.

[0044] (Configuration 8) A liquid ejection head described in any one of configurations 1 to 7, wherein the resin includes a first resin arranged in the space surrounded by the support member and the face cover, and a second resin arranged in the groove.

[0045] (Configuration 9) 9. The liquid ejection head according to any one of configurations 1 to 8, wherein the support member and the face cover are bonded together via the resin.

[0046] (Configuration 10) A liquid ejection head according to any one of configurations 1 to 9; a conveying means for conveying a medium onto which liquid is to be ejected from the liquid ejection head; A liquid ejection device comprising:

[0047] (Configuration 11) When viewed from a direction perpendicular to the face surface, 11. The liquid ejection device according to configuration 10, wherein the groove has a portion located upstream of the liquid ejection substrate in the transport direction of the medium.

[0048] (Method 1) a liquid ejection substrate having a face surface with ejection ports for ejecting liquid; a face cover bonded to the liquid ejection substrate to protect the face; A support member that supports the face cover; Equipped with The support member has a groove on a surface to which the face cover is joined, the groove partially overlapping with the face cover when viewed from a direction perpendicular to the face surface. A method for manufacturing a liquid ejection head, comprising: A method for manufacturing a liquid ejection head, comprising the step of placing a resin in a space surrounded by the support member and the face cover, and across the groove.

[0049] (Method 2) the resin includes a first resin and a second resin; In the step of placing the resin, placing the first resin in the space surrounded by the support member and the face cover and curing the first resin; disposing the second resin in the groove and curing it; The method for manufacturing a liquid ejection head according to Method 1, comprising the steps of:

[0050] (Method 3) Prior to the step of placing the resin, The method for manufacturing a liquid ejection head according to Method 1 or 2, further comprising the step of arranging the face cover relative to the support member so as to form the space (Method 4). The method for manufacturing a liquid ejection head according to Method 2, wherein the first resin is disposed in the space by capillary force.

[0051] (Method 5) 5. The method for manufacturing a liquid ejection head according to method 2 or 4, wherein the viscosity of the first resin is 4.0 Pa·s or more and 132 Pa·s or less.

[0052] (Method 6) A method for manufacturing a liquid ejection head described in any one of methods 1 to 5, wherein the resin is arranged so that the cover surface opposite the surface of the face cover that is joined to the support member, the surface of the resin, and the surface of the support member having the groove form a continuous surface. [Explanation of symbols]

[0053] 10 Liquid Dispensing Unit 12 Face 13 Liquid discharge board 20 Face coverings 30 Support member 31 first support member 32 Second support member 321 Groove 70 Resin parts 71 First Adhesive 72 Second Adhesive 90 First Gap 91 Second Gap 100 Liquid ejection head 300 Conveyor 1000 liquid dispensing device

Claims

1. a liquid ejection substrate having a face surface with ejection ports for ejecting liquid; a face cover bonded to the liquid ejection substrate to protect the face; A support member that supports the face cover; A liquid ejection head having The support member has a groove on a surface to which the face cover is joined, the groove partially overlapping with the face cover when viewed from a direction perpendicular to the face surface, The liquid ejection head has a space surrounded by the support member and the face cover, and a resin provided across the groove.

2. the resin has an inclined surface inclined with respect to the face surface, 2. The liquid ejection head according to claim 1, wherein the cover surface of the face cover opposite the surface joined to the support member, the inclined surface, and the surface of the support member having the groove form a continuous surface.

3. The liquid ejection head according to claim 1 , wherein the groove has a portion that does not overlap with the face cover when viewed in a direction perpendicular to the face surface.

4. The liquid ejection head according to claim 1 , wherein the face cover has an opening in which the liquid ejection substrate is disposed when viewed from a direction perpendicular to the face surface.

5. The liquid ejection head according to claim 4 , wherein the groove is formed so as to surround the opening when viewed from a direction perpendicular to the face surface.

6. The liquid ejection head according to claim 1 , wherein the groove and the space surrounded by the support member and the face cover are filled with the resin.

7. The liquid ejection head according to claim 1 , wherein the resin surrounded by the surface of the face cover that is joined to the support member and the side surface of the support member has a concave shape.

8. The liquid ejection head according to claim 1 , wherein the resin includes a first resin disposed in the space surrounded by the support member and the face cover, and a second resin disposed in the groove.

9. The liquid ejection head according to claim 1 , wherein the support member and the face cover are bonded together via the resin.

10. A liquid ejection head according to any one of claims 1 to 9; a conveying means for conveying a medium onto which liquid is to be ejected from the liquid ejection head; A liquid ejection device comprising:

11. When viewed from a direction perpendicular to the face surface, The liquid ejection device according to claim 10 , wherein the groove has a portion located upstream of the liquid ejection substrate in the transport direction of the medium.

12. a liquid ejection substrate having a face surface with ejection ports for ejecting liquid; a face cover bonded to the liquid ejection substrate to protect the face; A support member that supports the face cover; Equipped with The support member has a groove on a surface to which the face cover is joined, the groove partially overlapping with the face cover when viewed from a direction perpendicular to the face surface. A method for manufacturing a liquid ejection head, comprising: A method for manufacturing a liquid ejection head, comprising the step of placing a resin in a space surrounded by the support member and the face cover, and across the groove.

13. the resin includes a first resin and a second resin; In the step of placing the resin, placing the first resin in the space surrounded by the support member and the face cover and curing the first resin; disposing the second resin in the groove and curing it; The method for manufacturing a liquid ejection head according to claim 12, comprising the steps of:

14. Prior to the step of placing the resin, The method for manufacturing a liquid ejection head according to claim 13 , further comprising the step of arranging the face cover relative to the support member so as to form the space.

15. The method for manufacturing a liquid ejection head according to claim 14 , wherein the first resin is disposed in the space by capillary force.

16. The method for manufacturing a liquid ejection head according to claim 13, wherein the viscosity of the first resin is 4.0 Pa·s or more and 132 Pa·s or less.

17. The method for manufacturing a liquid ejection head described in claim 12, wherein the resin is arranged so that a cover surface opposite to the surface of the face cover that is joined to the support member, a surface of the resin, and the surface of the support member having the groove form a continuous surface.

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