Mobile phone

Abstract

To provide an electronic device with a novel structure.SOLUTION: A battery is provided for each component used in an electronic device, resulting in an electronic device with two batteries. A new device is realized, which has two batteries and a display unit that can be called a flexible display, and the display unit has multiple bendable parts.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] One aspect of the present invention relates to an article, a method, or a manufacturing method. Alternatively, the present invention relates to a process, Pertaining to a machine, manufacture, or composition of matter. One embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a power storage device, a lighting device, or an electronic device. In particular, the present invention relates to an electronic device and its operating system.

[0002] In this specification, the term "electronic device" refers to any device that has a secondary battery. Electro-optical devices having a secondary battery, and information terminal devices having a secondary battery are all electronic devices. [Background technology]

[0003] Electronic devices that are carried by users or worn by users are being actively developed. For example, Patent Document 1 describes a thin portable book.

[0004] Electronic devices carried by users or worn by users are powered by batteries. In particular, the power consumption is kept to a minimum in order to operate the electronic device. If the CPU contains a processing unit, it will consume more power when in operation. Therefore, CPU processing has a significant impact on power consumption. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Unexamined Patent Publication No. 15796 / 1983 Summary of the Invention [Problem to be solved by the invention]

[0006] It is desirable for users to use electronic devices for long periods of time, and for this reason, large-capacity batteries are required. If a large-capacity battery is built into an electronic device, Therefore, we are developing a compact or In this specification, the term "electronic device" refers to a battery that is thin and has a large capacity. The definition of "built into a vessel" is, of course, that it must be built in so that it cannot be removed or replaced. Things that can be freely removed, such as battery packs, are also called built-in.

[0007] Furthermore, as electronic devices become smaller and thinner, the battery capacity is also limited. The circuit and battery are housed in a small space. If the product is small, the capacitance will be small.

[0008] In addition, the battery generates heat when it is charged or discharged, which may have a thermal effect on the surrounding area. do.

[0009] As electronic devices become smaller and smaller, circuits, batteries, etc. can be housed in smaller spaces, One of the challenges is how to control power consumption and heat generation.

[0010] In addition, the present invention provides an electronic device with a novel structure. Specifically, the electronic device can be made into various external shapes. To provide an electronic device with a novel structure that can

[0011] The description of these problems does not preclude the existence of other problems. The embodiment does not necessarily have to solve all of these problems. The above will be made clear from the description, drawings, claims, etc. It is possible to extract other issues from the descriptions in the patent, claims, etc. [Means for solving the problem]

[0012] A battery is provided for each component used in the electronic device, making the electronic device have a plurality of power sources. As an electronic device with multiple power sources, an operator can selectively drive only the parts to be used. The feeding system can reduce power consumption.

[0013] The electronic device also includes a power supply management circuit (including a power supply monitoring circuit) for managing the plurality of power supplies. )

[0014] The configuration disclosed in this specification includes a central processing unit, a display unit, a touch input unit, a receiving unit, An electronic device having a transmitter and a power management circuit, wherein the central processing unit is a first battery The first receiving unit is configured to wirelessly charge the first battery. The display unit has a function of being able to be charged, and the display unit has a second battery, a second receiving unit, and a second transmitting unit. The first receiving unit has a function of wirelessly charging the second battery. The touch input unit is electrically connected to the second battery, and the power management circuit is connected to the first battery. One battery or the second battery can be used to wirelessly charge the other battery. It is an electronic device that has the function of being able to

[0015] Other components include a central processing unit, a display unit, a touch input unit, a receiving unit, and a transmitting unit. and a power management circuit, wherein the central processing unit is connected to a first battery and a first The first receiving unit is configured to wirelessly charge the first battery. The display unit has a second battery, a second receiving unit, and a second transmitting unit. The second receiving unit has a function of wirelessly charging the second battery, and The input unit has a third battery, a third receiving unit, and a third transmitting unit, and the power management circuit The power of either the first battery, the second battery, or the third battery , wireless charging of either the first battery, the second battery or the third battery. It is an electronic device that has the function of being able to charge.

[0016] Each battery is connected to a circuit that allows it to be charged wirelessly. At the very least, each battery is connected to its own radio receiver via its own regulator. and electrically connected to the

[0017] A regulator is a type of electronic circuit that keeps the output voltage or current constant. The regulator is a circuit that controls the linear They are classified into two types: switching regulators and switching regulators. The regulator is also called a DC-DC converter.

[0018] Furthermore, each battery has a transmitter that can charge another battery with the power of the other battery. In addition, the power management circuit that manages the amount of power of each battery may periodically The constantly collects data on the remaining capacity of each battery and adjusts the power accordingly.

[0019] For example, in information terminals such as mobile phones and smartphones, one power source (battery ) devices, if one of them is turned off, all functions will stop. When the power is on, even if there are unused functional circuits, they are in standby mode, so power consumption If there are unused functional circuits, the unused The electrical connection between the functional circuit and the battery can be turned off to save power consumption. can.

[0020] As the touch input unit, for example, a capacitance type touch sensor can be applied. There are surface capacitive touch panels and projected capacitive touch panels. There are two types of capacitance sensors, self-capacitance type and mutual capacitance type, which mainly differ in the driving method. It is preferable to use a sensor that detects the proximity or contact of a detection target such as a finger. Various sensors that can detect In this specification, the touch input unit may be a Input operations are not limited to touching the display with a finger or the like, but can also be performed by bringing a finger close to the display without contact. This also includes devices that can be operated by inputting data.

[0021] The touch input unit uses a transistor using an oxide semiconductor layer (also called an OS transistor). An active touch sensor having a capacitance and a capacitance may be used. By applying an OS transistor to the touch sensor, the potential of the node can be maintained for a long period of time. This makes it possible to hold the data in a certain state, thereby reducing the frequency of refresh operations.

[0022] Select the battery that corresponds to the part you are using from among the multiple batteries in the electronic device. The operating system that controls it determines which batteries to use and which not. By reducing battery power consumption, the amount of time the device can be used per charge can be increased. It can be extended.

[0023] In addition, the power management circuitry prevents other uses of the battery connected to the function you want to use. You may control the battery to supply power from other batteries connected to functions that are not being used. Select the battery that corresponds to the part you are using from among the multiple batteries in the electronic device. The operating system selects and adjusts the amount of power each battery uses. The power management circuitry also extends the usable time of the functions that are If you keep one of the batteries as an emergency power source, you will be able to use your electronic devices in an emergency. For example, when a mobile phone is turned on, the display Therefore, if there is no power to display the display, you may not be able to make a call. In an electronic device having multiple batteries, a power management circuit is used to It is secured as an emergency power source, and the power supply to the display is turned off, leaving only the communication function. If you have an emergency power supply available, you can make calls without turning on the display. be.

[0024] In addition, in the case of electronic devices with curved or complex shapes, it may be necessary to use one large battery. In this case, there are limitations on the placement of the battery, and a large battery can ruin the design. In addition, if small batteries are scattered around, there is a risk of explosion. This reduces the risk of electric shock and is safer than larger batteries.

[0025] Specifically, it has two batteries and a display that can be called a flexible display. The display unit has a plurality of foldable portions, and the electronic device is called a new device. The new device has a central processing unit, a display unit, and a touch input unit. The electronic device has a display unit and a power management circuit, and the display unit is bendable and has a first region. The first area overlaps with the central processing unit, and the display unit In the deployed state, the second region and the first battery have overlapping regions, and When the display unit is unfolded, the third area and the second battery overlap each other. When the display unit is bent, the first battery and the second battery are connected to each other. It is an electronic device having an area that does not overlap with the

[0026] This new device can be made smaller by bending the display into an S-shape. When the display is bent (also called folded), the first battery is connected to the second battery. If the battery is not placed on top of the new device, it can be made thinner. , the size of the first battery is larger than the second battery.

[0027] If a user drops an electronic device while carrying it, a single large battery can cause Damage to the battery can cause the electronic device to lose all of its functionality. If a small battery is used, even if one of the small batteries is damaged, at least one small battery will still be in use. If a battery is available, some functions can be used. By providing this, electronic devices with multiple small batteries can still be used even if some of them are broken. This makes it possible to realize electronic devices that are less likely to break.

[0028] In addition, even if one of the small batteries is damaged or runs out of power, the power management circuitry will keep the device running. By substituting other batteries, electronic devices can be used. Even if the power of one battery runs out, the power management circuitry will continue to connect to other batteries. The transmitter is charged wirelessly, allowing for extended use. That is, it is possible to use a battery having a power management circuit that can mutually supply power from each battery. It is possible to realize a child device.

[0029] In addition, batteries are devices that deteriorate with the number of times they are charged. By adjusting the number of times you charge or by selecting the battery appropriately, This can extend the battery life. The power management circuit monitors the battery and uses it appropriately according to the degree of deterioration of the battery. The battery you choose can also help extend the life of your electronic devices.

[0030] In addition, at least one of the multiple small batteries provided in the electronic device is a secondary battery, It is preferable to use one that can be charged wirelessly.

[0031] Secondary batteries include lithium-ion secondary batteries such as lithium polymer batteries, One or more of the following: ion capacitor, electric double layer capacitor, redox capacitor The electronic device includes an antenna that receives power wirelessly and a and control means for supplying power to the functional circuitry.

[0032] In addition, the antenna included in the electronic device constitutes a communication module that realizes the non-contact charging function. The communication module supports standards such as Qi or Powermat. A charging method may be used. When charging, multiple batteries may be charged simultaneously. The antenna included in the electronic device may be controlled to have a short-range wireless communication function. A communication module may be configured to realize this.

[0033] In addition, when multiple types of sensors are installed in an electronic device, a battery must be provided for each component used. Therefore, the user can selectively install or remove the sensor they want to use. For example, a wrist-worn electronic device equipped with a pulse sensor, temperature sensor, and location information detection sensor (such as GPS) A control circuit that can control the acceleration sensor, angular velocity sensor, etc., and connects them If a connection part (connection socket) for this purpose is provided, the user can change the sensor according to the function they want to use. In this case, each sensor has a small It has a battery and regulator, and the more functions you use, the more compact it becomes. The battery is connected to form an electronic device having a plurality of small batteries.

[0034] In addition, a transistor including an oxide semiconductor layer is used as a transistor for a regulator. When used, the off-state current is small, which contributes to power saving. A regulator (DC-DC converter) with a control circuit composed of a capacitor is subject to high temperatures of 150°C or higher. Therefore, the DC-DC converter according to this embodiment can operate even at low temperatures. This is suitable for electronic devices that are likely to become hot during operation.

[0035] As an oxide semiconductor to be used in the oxide semiconductor layer that will become the channel formation region of an OS transistor It is preferable that the alloy contains at least indium (In) or zinc (Zn). and Zn. In addition to these, it is preferable to use stabilizers that strongly bind oxygen. The stabilizer preferably includes gallium (Ga), tin (S), etc. n), zirconium (Zr), hafnium (Hf) and aluminum (Al) It is sufficient to have either one of the above.

[0036] Other stabilizers include lanthanides such as lanthanum (La) and cerium ( Ce), praseodymium (Pr), neodymium (Nd), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), hol Mium (Ho), Erbium (Er), Thulium (Tm), Ytterbium (Yb), Ru It may contain one or more of tetraethion (Tetrium) (Lu).

[0037] The oxide semiconductor layer of the OS transistor can be formed using the following oxides: , indium oxide, tin oxide, zinc oxide, In-Zn oxide, Sn-Zn oxide, A l-Zn oxide, Zn-Mg oxide, Sn-Mg oxide, In-Mg oxide, I n-Ga oxide, In-Ga-Zn oxide (also written as IGZO), In-Al- Zn-based oxides, In-Sn-Zn-based oxides, Sn-Ga-Zn-based oxides, Al-Ga-Z n-based oxides, Sn-Al-Zn-based oxides, In-Hf-Zn-based oxides, In-Zr-Zn In-Ti-Zn oxide, In-Sc-Zn oxide, In-Y-Zn oxide oxides, In-La-Zn oxides, In-Ce-Zn oxides, In-Pr-Zn oxides In-Nd-Zn oxides, In-Sm-Zn oxides, In-Eu-Zn oxides , In-Gd-Zn oxide, In-Tb-Zn oxide, In-Dy-Zn oxide, In-Ho-Zn oxide, In-Er-Zn oxide, In-Tm-Zn oxide, I n-Yb-Zn oxide, In-Lu-Zn ​​oxide, In-Sn-Ga-Zn oxide , In-Hf-Ga-Zn oxide, In-Al-Ga-Zn oxide, In-Sn-A l-Zn oxide, In-Sn-Hf-Zn oxide, In-Hf-Al-Zn oxide etc.

[0038] For example, In:Ga:Zn=1:1:1, In:Ga:Zn=3:1:2, or In In-Ga-Zn oxides with an atomic ratio of Ga:Zn=2:1:3 and oxides with similar compositions It is a good idea to use compounds.

[0039] When a large amount of hydrogen is contained in the oxide semiconductor film forming the channel formation region, By bonding, some of the hydrogen atoms become donors, generating electrons that act as carriers. This causes the threshold voltage of the transistor to shift in the negative direction. After the oxide semiconductor film is formed, dehydration treatment (dehydrogenation treatment) is performed to remove hydrogen from the oxide semiconductor film. Therefore, it is preferable to remove hydrogen or moisture to purify the material so that it contains as few impurities as possible. It's nice.

[0040] Note that dehydration treatment (dehydrogenation treatment) of the oxide semiconductor film removes oxygen from the oxide semiconductor film. Therefore, dehydration treatment (dehydrogenation treatment) of the oxide semiconductor film is ) by adding oxygen that has been reduced by the dehydration treatment (dehydrogenation) In order to compensate for the oxygen vacancies increased by the treatment, oxygen is added to the oxide semiconductor film. In this specification and the like, the case where oxygen is supplied to an oxide semiconductor film is referred to as "adding oxygen." This treatment is sometimes referred to as oxidation treatment, or oxygen contained in an oxide semiconductor film is reduced from the stoichiometric composition. When the amount of oxygen used is large, it is sometimes referred to as hyperoxygenation treatment.

[0041] In this way, hydrogen or moisture is removed from the oxide semiconductor film by dehydration treatment (dehydrogenation treatment). By adding oxygen to the silicon dioxide, the oxygen vacancies are compensated for, resulting in i-type (intrinsic) or An oxide semiconductor film that is close to i-type and is substantially i-type (intrinsic) can be obtained. The term "substantially intrinsic" means that there are very few carriers derived from donors in the oxide semiconductor film ( (close to zero), and the carrier density is 1×10 17 / cm 3 Below, 1×10 16 / cm 3 below, 1×10 15 / cm 3 Below, 1×10 14 / cm 3 Below, 1×10 13 / cm 3 Below is This means that...

[0042] In addition, a transistor including an i-type or substantially i-type oxide semiconductor film as described above For example, a transistor using an oxide semiconductor film can achieve excellent off-state current characteristics. The drain current when the transistor is off is 1×10 at room temperature (approximately 25°C). -18 Below A , preferably 1 x 10 -21 A or less, more preferably 1×10 -24 A or below, or 85 1 x 10 at °C -15 A or less, preferably 1×10 -18A or less, more preferably 1 x 1 0 -21 A or less. Note that the off state of a transistor is an n-channel In the case of a transistor, this refers to a state in which the gate voltage is sufficiently smaller than the threshold voltage. If the gate voltage is more than 1 V, more than 2 V, or more than 3 V less than the threshold voltage, the transistor The starter is turned off.

[0043] The oxide semiconductor to be formed may have, for example, a non-single crystal structure. For example, an oxide semiconductor having a CAAC may be used as a CAAC-OS (C Axis Aligned Crystalline Oxide Semiconductor The CAAC-OS film is an oxide film with multiple crystal parts aligned along the c-axis. The CAAC-OS film is a type of semiconductor film. The CAAC-OS film was observed by a dissection electron microscope. By observing a combined analysis image of the bright field image and the diffraction pattern (also called a high-resolution TEM image), On the other hand, clear results can also be seen in the high-resolution TEM image. The boundaries between crystal parts, that is, the grain boundaries (also called grain boundaries), can be confirmed. Therefore, the CAAC-OS film does not suffer from a decrease in electron mobility due to the grain boundaries. High-resolution TE observation of the cross section of the CAAC-OS film from a direction roughly parallel to the sample surface Observing the M image, it can be seen that metal atoms are arranged in layers in the crystalline region. Each layer of metal atoms is formed on a surface on which the CAAC-OS film is to be formed (also referred to as a surface on which the CAAC-OS film is to be formed) or on the upper surface. The shape reflects the unevenness of the surface, and is aligned parallel to the surface on which the CAAC-OS film is formed or the top surface. On the other hand, a high-resolution TEM image of the CAAC-OS film was taken from a direction roughly perpendicular to the sample surface. Observation reveals that the metal atoms are arranged in triangular or hexagonal shapes in the crystals. However, there is no regularity in the arrangement of metal atoms between different crystal parts. In this specification, "parallel" means that two straight lines are arranged at an angle of -10° or more and 10° or less. Therefore, it includes the case where the angle is between -5° and 5°. refers to the state in which two straight lines are arranged at an angle of 80° or more and 100° or less. This includes cases where the angle is between 85° and 95°.

[0044] In addition, a battery is provided for each component used in the electronic device, and electronic devices with multiple power sources ,The operating system also has its own characteristics. For example, the operating system The first battery, the second battery, the third battery, and these batteries It has a control unit that manages the charging and discharging functions, and can be charged wirelessly at the same time. The rating system must have at least multiple power sources (such as secondary batteries) and a CPU or other control The control unit manages the power of the plurality of power sources. The number of power supply circuits is not limited to one, and may be the same as the number of power supplies, for example.

[0045] Also, an operating system for an electronic device having multiple power sources includes a first battery and a second battery. a second battery, a third battery, and a power supply that manages the first to third batteries; and a management circuit, and the first battery is wirelessly connected to the second battery or the third battery. The operating system that powers the battery. The power management circuitry Monitors Terry's energy level and wirelessly transfers power from one battery to another The charging can be performed automatically or by user operation as appropriate. [Effects of the Invention]

[0046] A battery is provided for each component used in electronic devices, allowing selective operation of only the components in use. The operating system can save power. The description of these effects does not preclude the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. Other effects will become apparent from the description, drawings, claims, etc. It is possible to extract other effects from the description, drawings, claims, etc. is. [Brief explanation of the drawings]

[0047] [Figure 1] 1A and 1B are diagrams showing an electronic device according to one embodiment of the present invention when unfolded, in which (A) is the top, (B) is the left side, (C) is the front, (D) is the right side, (E) is the back, (F) is the bottom, and (G) is a cross section. [Figure 2] 1A and 1B are a plan view and a cross-sectional view illustrating one embodiment of the present invention. [Figure 3] 1A and 1B are diagrams illustrating an electronic device of one embodiment of the present invention in a folded state. [Figure 4] 1 is a perspective view illustrating a part of a configuration of an electronic device according to one embodiment of the present invention. [Figure 5] 1A and 1B are a plan view and a cross-sectional view illustrating one embodiment of the present invention. [Figure 6] 1A and 1B are block diagrams illustrating electronic devices according to one embodiment of the present invention. [Figure 7] 1A and 1B are a plan view and a cross-sectional view illustrating one embodiment of the present invention. [Figure 8] 1A to 1C are cross-sectional views illustrating steps in one embodiment of the present invention. [Figure 9] 1A to 1C are cross-sectional views illustrating steps in one embodiment of the present invention. [Figure 10] 1A to 1C are cross-sectional views illustrating steps in one embodiment of the present invention. [Figure 11] 1A and 1B are a plan view and a cross-sectional view illustrating one embodiment of the present invention. [Figure 12] FIG. 1 is a cross-sectional view illustrating one embodiment of the present invention. [Figure 13] 1A and 1B are a plan view and a cross-sectional view illustrating one embodiment of the present invention. [Figure 14] 1A and 1B are a projection view and a perspective view illustrating a configuration of an input / output device according to an embodiment; [Figure 15] 1 is a cross-sectional view illustrating a configuration of an input / output device according to an embodiment. [Figure 16] 3A and 3B are diagrams for explaining the configurations and driving methods of a detection circuit 19 and a converter CONV according to an embodiment. [Figure 17] FIG. 10 is a diagram illustrating the radius of curvature of a surface. [Figure 18] FIG. 10 is a diagram illustrating a center of curvature. [Figure 19] 1A to 1C are a perspective view, a schematic view, and a cross-sectional view illustrating one embodiment of the present invention. [Figure 20] 1A and 1B are a plan view and a cross-sectional view illustrating one embodiment of the present invention. [Figure 21] 1 is a perspective view of an electronic device according to an embodiment of the present invention when unfolded; [Figure 22] 1 is a perspective view illustrating an electronic device of one embodiment of the present invention in a folded state. [Figure 23] 1A and 1B are block diagrams illustrating electronic devices according to one embodiment of the present invention. [Figure 24] 1A and 1B are a plan view and a cross-sectional view illustrating one embodiment of the present invention. [Figure 25] 1A and 1B are a plan view and a cross-sectional view illustrating one embodiment of the present invention. [Figure 26] 1A and 1B are a block diagram and a timing chart of a touch sensor; [Figure 27] Circuit diagram of a touch sensor. [Figure 28] 1A and 1B are a block diagram and a timing chart of a display device. [Figure 29] 1A to 1C are diagrams illustrating operations of a display device and a touch sensor. [Figure 30] 1A to 1C are diagrams illustrating operations of a display device and a touch sensor. [Figure 31] Block diagram of a touch panel. [Figure 32] Circuit diagram of a pixel. [Figure 33] FIG. 2 is a timing chart illustrating the operation of the display device. DETAILED DESCRIPTION OF THE INVENTION

[0048] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the following description, and various modifications in form and details are possible by those skilled in the art. Furthermore, the present invention should not be construed as being limited to the description of the following embodiments. It is not something that can be done.

[0049] (Embodiment 1) In this embodiment, a novel device with excellent convenience and reliability is provided, which has a bendable portion. 1, 2, 3, 4, 5, 6, and 7 show examples of electronic devices having a display unit having a plurality of 17 and 18. The individual elements that make up the electronic device will be explained below. These components cannot be clearly separated, and one component may also function as another component, or may be used in combination with other components. It may include part of the configuration.

[0050] The electronic device of the present embodiment can be configured to bend a display unit at multiple bendable positions. The user can choose between two modes: a folding mode for compactness and a mode with the display unfolded. can be used manually as needed.

[0051] The unfolded view of the electronic device is shown in Figure 1. Figure 1(A) shows the electronic device as seen from above. 1(B) is a side view (left), and FIG. 1(C) is a side view (left) from which the user views the display. Figure 1(D) is a view from the side (right), FIG. 1(E) is a view of the rear surface, and FIG. 1(F) is a view of the bottom surface.

[0052] As shown in FIG. 1(C), the display unit 116 is formed in the first bent region (side roll portion 11). 6a), a second bent region (side roll portion 116b), and The main screen is sandwiched between them.

[0053] The ratio of the length of the short side to the length of the long side of the main screen of the display unit 116 is The ratio of the length to the length of the long side is 0.9 to 1.1 times, for example, the length of the short side :The length of the long side is approximately 9:16.

[0054] FIG. 21 shows a perspective view of an example of an electronic device. The electronic device is connected by a plurality of hinges 13. The display unit is made up of three housings 10, 11, and 12, and the gaps between the housings and the display unit are designed to allow the display unit to bend. The parts where the electronic device is folded overlap, and the display unit 116 is bent at that part. FIG. 10 is a perspective view of the compact mode.

[0055] As shown in FIG. 1(E), the display unit overlaps part of the side surface and part of the back surface of the electronic device. This area is always curved. 0 mm or less, preferably 8 mm or less, more preferably 5 mm or less, particularly preferably 4 mm or less It can be bent with the following radius of curvature:

[0056] Also, Figure 20 shows a modification of Figure 2, showing three batteries. In the case of an electronic device having a terie, when cut along the chain line A-A' in Figure 1(C), An enlarged cross-sectional view of the above is shown in Figure 1(G). As shown in Figure 1(G), are provided with batteries 112, 117, and 153, respectively.

[0057] In the above configuration, the display panel including the display unit 116 has a curvature radius of 1 mm or more, preferably a curved surface. The film sandwiching the layer containing the display element is The cross-sectional structure of the curved display panel is made up of two films. The structure is sandwiched between curves.

[0058] The radius of curvature of a surface will be explained with reference to FIG. 17. In FIG. 17(A), a curved surface 1700 On a plane 1701 that cuts the surface 1700, a part of a curve 1702 included in the surface 1700 is cut by an arc of a circle. The radius of the circle is the radius of curvature 1703, and the center of the circle is the center of curvature 1704. FIG. 17(B) shows a top view of the curved surface 1700. FIG. 17(C) shows the curved surface 1700 on a plane 1701. When cutting a curved surface with a plane, the angle of the plane to the curved surface and The radius of curvature of the curve that appears in the cross section varies depending on the cutting position. Now, the smallest radius of curvature is taken as the radius of curvature of the surface.

[0059] When a display panel in which a layer 1805 including a display element is sandwiched between two films is curved, The radius of curvature 1802 of the film 1801 on the side closer to the center of curvature 1800 of the display panel is The radius of curvature 1804 of the film 1803 on the side farther from the center 1800 is smaller than the radius of curvature 1804 of the film 1803 (FIG. 18(A) )) If the display panel is curved to make the cross section arc-shaped, the film with the center of curvature close to 180° The surface is subjected to compressive stress, and the surface of the film far from the center of curvature 1800 is subjected to tensile stress. (Figure 18(B)).

[0060] The cross-sectional shape of the display panel is not limited to a simple arc shape, and may be a shape having a partial arc. For example, the shape shown in FIG. 18(C), a wave shape (FIG. 18(D)), an S-shape, etc. When the curved surface of the display panel has a shape with multiple centers of curvature, In a surface having the smallest radius of curvature among the radii of curvature at each of a plurality of centers of curvature, Of the two films, the radius of curvature of the film closest to the center of curvature is preferably 4 mm or more. The display panel can be deformed within a range of 30 mm or more.

[0061] Figure 2(A) shows a schematic diagram of the placement of each battery. The display unit 116 and the arrangement of the batteries are shown. 25, a bending point 116e of the display unit is located, as shown by the dotted line in FIG. The display curve shown by the dotted line in FIG. 2(A) is between the battery 112 and the battery 153. The dotted line in FIG. 2(A) is the bending point of the display unit, and the straight line is the bending point of the display unit. However, it is not limited to making creases, and the area where the radius of curvature is smallest is simulated. It refers formally.

[0062] The battery 112 is electrically connected to the regulator 113, which The regulator 113 is electrically connected to a system unit 125 including a CPU. In Fig. 2(A) and Fig. 2(B), each battery Although the sizes of the CPs are almost the same, they are not particularly limited. For example, The battery 112 electrically connected to the U is made thicker than the other batteries, and has a large capacity. A secondary battery having a large capacity is used.

[0063] The battery 153 is electrically connected to the regulator 154. The regulator 154 is electrically connected to the touch input unit and the display unit. Alternatively, it may be connected to a transmission circuit.

[0064] FIG. 2(B) shows a cross section of FIG. 2(A), and shows how the CPU is positioned when the electronic device is unfolded. 1 shows the positional relationship between the system unit 125 including the system unit 125 and each part.

[0065] FIG. 2C shows the state of the system unit 125 including the CPU and each component when the electronic device is bent. The display part is bent at points 116d and 116e, where the battery is located. They do not overlap, and by bending that part, electronic devices can be made smaller.

[0066] FIG. 3 shows the electronic device in a folding and compact mode, and its perspective view is the same as FIG. 2. 2. Figure 3(A) shows the top view of the electronic device, and Figure 3(B) shows the side view (left). In Figure 3(C), the side on which the user views the display is the front. Figure 3(D) is a side view (right), and Figure 3(E) is a rear view. 3(F) is a view of the bottom surface.

[0067] Even when folded and compact, as shown in FIG. 3(C), the first bent region ( a bendable region (also referred to as side roll portion 116a), and a bendable region (side roll portion 116c), The main screen is sandwiched between them.

[0068] The ratio of the length of the short side to the length of the long side of the main screen of the display unit 116 is The ratio of the length to the length of the long side is 0.9 to 1.1 times, for example, the length of the short side :The length of the long side is approximately 9:16.

[0069] In this way, the display can be displayed so as to fit within the first area of ​​the display unit in the folded state. A first image having a vertical length to horizontal length ratio of approximately the same value as a second image having a vertical length to horizontal length ratio of approximately the same value as a ... It can be displayed so that it fits within the display area of ​​the expanded display. It is possible to provide a novel information processing device that is excellent in convenience and reliability.

[0070] In addition, in FIG. 4, a touch input unit and a display unit are connected to one battery 117 on the same FPC. An example of electrical connection using 4 is shown below.

[0071] The display unit 116 is made up of two films, and a light-emitting element is placed between the two films. The display driver circuit includes a touch sensor 152 and a part of the sensor driver circuit. A peeling layer is provided on a glass substrate, and a transistor and a light-emitting element are formed thereon. The plate is removed and adhered to the first flexible film 143. Also, peeling it off onto a glass substrate After forming the transistor and the touch sensor 152 thereon, the glass substrate is removed. The second flexible film 144 is removed and adhered to the second flexible film 144. In the configuration of FIG. The film 144 is aligned with and bonded to the first flexible film 143. It also functions as a sealing material for optical elements.

[0072] The lead electrodes 141 of the battery 117 and the regulator 118 are electrically connected to the circuit board 140. The battery 1 is electrically connected to the FPC 4, and the FPC 4 is connected to a connector on the circuit board 140. The FPC4 uses a laminated lithium ion secondary battery as the battery 17. It has three ends, one of which connects to a connector on the circuit board 140, The second end is connected to the touch panel terminal, and the third end is connected to the display terminal. Although an example using one FPC is shown here, two or more FPCs can be used. C may be used to connect them together.

[0073] A part 142 of the drive circuit is mounted on the FPC 4. The touch sensor driving circuit and the display driving circuit are included. A part of the driver circuit may be shared. Also, the video signal to the display unit may be transmitted via the FP It is supplied from the circuit connected to the end of C5, or a receiving circuit is provided at the end of FPC5. A video signal may be supplied to the display unit using wired communication. , and supply it to the circuit connected to the end of FPC5, or provide a transmission circuit at the end of FPC5. The input signal of the touch sensor may be supplied to a CPU or the like via wireless communication.

[0074] In addition, the present invention is not limited to electronic devices that are bent at two points on the display unit as shown in FIG. 5(A), 5(B), and 5(C) show a structure in which the wire is bent at four points. The figure shows an example of an electronic device that can be bent. The bent parts 116g and 116f of the display are further set. By doing so, the display area of ​​the display unit can be increased. 5(A) shows a cross section of the electronic device, and when the electronic device is unfolded, the system unit 12 including the CPU 5 and the positional relationship of each part. , the positional relationship between the system unit 125 including the CPU and each part is shown. The 116d, 116e, 116f, and 116g do not have overlapping batteries, and the The electronic device can be made smaller by bending it. In the electronic device shown in Figure 5, When a user holds an electronic device with both hands, the batteries are located on both ends of the display. This means that the battery placement makes it easy to hold.

[0075] FIG. 6 shows a block diagram of the device 110. The device 110 in FIG. 6 is the same as the device shown in FIG. It refers to an electronic device that has two batteries as shown in the figure and can be made smaller by bending the display. .

[0076] The device 110 according to this embodiment includes a control module 115 and a display module 12. 1 and a power management circuit 127. The control module 115 controls the entire device 110. The controller controls the operation of the device, communication, and display of information on the display unit 116.

[0077] The control module 115 includes a CPU 111, a battery 112, a regulator 113, and a wireless It includes a receiving unit 114 and a wireless transmitting unit 128 .

[0078] The display module 121 includes a display unit 116, a display drive circuit 119, and a battery 117. , regulator 118, touch sensor 152, sensor drive circuit 159, bending position sensor The radio communication device 100 includes a radio receiving unit 120, a radio transmitting unit 129, and a radio receiving section 160.

[0079] The device 110 can be bent at multiple locations on the display 116, allowing for hidden viewing. By not displaying an image in the display area, power consumption can be reduced. In calligraphy, images include information that can be perceived visually, such as letters and symbols. The bending position sensor 160 detects the position at which the display unit is bent and provides bending position information. For example, if the bending position is predetermined, If there are multiple bending positions, place multiple sensors on the By arranging the data in a grid or matrix, the coordinates of the folded position can be identified. The folding position sensor 160 can be provided, for example, along the periphery of the display area. The bending position sensor 160 may be, for example, a switch, a MEMS pressure sensor, or a pressure-sensitive sensor. It can be configured using a sensor or the like.

[0080] Specifically, a switch having a mechanical contact or a magnetic switch is attached by bending the display unit. The display unit may be arranged so as to open and close in response to the movement of the display unit.

[0081] Alternatively, a plurality of pressure-sensitive sensors may be provided on the display unit. A piezoelectric element can be attached to the display. A pressure sensor can be used to detect bending movements. By detecting the increase in pressure that accompanies this, the bending position can be determined.

[0082] As the piezoelectric element, for example, an organic piezoelectric film can be used. Acid-containing piezoelectric film, polyvinylidene fluoride-containing piezoelectric film, polyester a film-like piezoelectric film including a piezoelectric film containing a chiral polymer, or a film-like piezoelectric film including a chiral polymer, The element can be used.

[0083] The piezoelectric element may be used in combination with the bending position sensor 160 and a pressure-sensing touch panel. stomach.

[0084] By using the folding position sensor 160, one display area is detected at the folded portion. It can be used in two separate areas, with the border at the center, and you can select the image to display in one of the display areas. Or, select one or more images to display depending on the folding state of the display area. The display area can be divided into two parts at the bent part. To achieve this, the display area of ​​the display unit 116 can be divided and driven by the display drive circuit 119. It is preferable.

[0085] In addition, by using the bending position sensor 160, the touch input area can be adjusted by bending the touch input area. The touch input area can be divided into two areas, and one of the areas can be disabled. The touch input area refers to the area that can be detected by the touch sensor, and is roughly the same as the display area. The touch input area is divided into two parts by the folded part. To achieve this, the touch input area of ​​the touch sensor 152 is divided and driven by the sensor drive circuit 159. It is preferable to have a configuration that allows this.

[0086] The device 110 can be bent at multiple locations on the display 116, allowing for hidden viewing. The image in the display area is not displayed to reduce power consumption. This can disable the detection of the touch sensor and prevent malfunction.

[0087] In this embodiment, the opposing substrate (sealing substrate) of the display unit 116 is provided with a touch panel function. Specifically, a transistor using an oxide semiconductor layer and an organic EL element are used. and a touch sensor using a transistor that uses an oxide semiconductor layer. In this embodiment mode, a display panel in which a part of the display portion is bent is used. To facilitate this, it is preferable to use a flexible material for the sealing substrate as well.

[0088] As shown in FIG. 6, at least one sensor drive circuit 159 is mounted on one IC chip. The number of parts to be mounted is reduced by including at least a part of the display driver circuit 119. That's fine.

[0089] Each regulator supplies the power or signal required for each functional circuit from the connected battery. When charging the battery, the regulator prevents overcharging. In addition, in FIG. 6, a single regulator can be used to connect a wireless receiver and a wireless transmitter. The example shows the connection between the regulator for the wireless receiver and the regulator for the wireless transmitter. It may be connected separately to the

[0090] The devices 110 share battery power with each other through the power management circuit 127. The power management circuit 127 also monitors the amount of power in the batteries 112 and 117. The wireless charging of one battery by supplying power to another is automatic or The power management circuit 127 can be operated by the user. The amount of power in batteries 112 and 117 is monitored, and the amount of power transferred from one battery to another is monitored. The device can be automatically or automatically operated by the user to wirelessly supply power to the device and charge it. This can be done.

[0091] In addition, the device 110 can independently turn each module on or off. It is possible to selectively operate only the modules that are being used. This system allows the device 110 to consume less power.

[0092] Furthermore, if it is a still image, the display module 121 and the control module 115 are turned on. After the still image is displayed on the display unit 116, the control module 11 Even if the display module 5 is turned off, only the display module 121 is turned on and a still image continues to be displayed. Note that the transistor in the display portion 116 is formed using an oxide semiconductor layer ( For example, oxide materials containing In, Ga, and Zn) or memory for each pixel If the configuration has this, the power supply from the battery 117 can be cut off after the still image is displayed. You can also keep the still image displayed for a set period of time.

[0093] In this embodiment, the display module 121 and the control module 115 are wireless. Although an example having a transmitter and a wireless receiver has been shown, there is no particular limitation, and each battery may be directly connected. The batteries may be connected in series or in parallel, in which case they can be charged wirelessly to electronic devices. The device has at least a receiving circuit (including an antenna for wireless charging) for It is sufficient to electrically connect the battery to any one of the batteries.

[0094] FIG. 23 shows a block diagram of a device 110 that is partially different from that shown in FIG. 6. The device 110 has at least three batteries as shown in FIG. 20 and has a display that is bent. This refers to electronic devices that can be made smaller by using a microcomputer.

[0095] The device 110 according to this embodiment includes a control module 115 and a display module 12. 1, a touch input unit 156, and a power management circuit 127. The control module 115 A controller that controls the entire device 110, communication, and display of information on the display unit 116. It is La.

[0096] The control module 115 includes a CPU 111, a battery 112, a regulator 113, and a wireless It includes a receiving unit 114 and a wireless transmitting unit 128 .

[0097] The display module 121 includes a display unit 116, a display drive circuit 119, and a battery 117. , a regulator 118 , a wireless receiving unit 120 , and a wireless transmitting unit 129 .

[0098] The touch input unit 156 includes a touch sensor 152, a battery 153, and a regulator 154. 54, a wireless receiving unit 155, and a wireless transmitting unit 150.

[0099] In this embodiment, the opposing substrate (sealing substrate) of the display unit 116 is provided with a touch panel function. Specifically, a transistor using an oxide semiconductor layer and an organic EL element are used. a substrate having a touch sensor including a transistor including an oxide semiconductor layer; and a sealing substrate having a touch sensor including a transistor including an oxide semiconductor layer. In this embodiment, a display panel in which a part of the display portion is bent is used. Therefore, it is preferable to use a flexible material for the sealing substrate. The FPC that supplies power to the L element and the FPC that supplies power to the touch sensor are separate. This shows an example of using a 100V power supply and connecting it to separate batteries.

[0100] It is also possible to provide an optical sensor in each pixel of the display unit 116 to make it an optical touch panel. The touch input unit 156 may be a resistive or capacitive touch panel. can also be placed on top of the display unit 116.

[0101] Each regulator supplies the power or signal required for each functional circuit from the connected battery. When charging the battery, the regulator prevents overcharging. In addition, in FIG. 23, a single regulator can be used to connect the wireless receiving section and the wireless transmitting section. The figure shows an example in which a regulator for the wireless receiver and a regulator for the wireless transmitter are connected. The regulator may be connected separately.

[0102] The devices 110 share battery power with each other through the power management circuit 127. The power management circuit 127 may also monitor the amount of power in the batteries 112, 117, and 153. This involves wirelessly transmitting power from one battery to another to charge them. This can be done automatically or by user operation as appropriate. 7 monitors the amount of power of batteries 112, 117, and 153, and among the multiple batteries, Wirelessly transfers power from one device to another to charge it automatically or by user control. This can be done as appropriate.

[0103] In addition, the device 110 can independently turn each module on or off. It is possible to selectively operate only the modules that are being used. This system allows the device 110 to consume less power.

[0104] For example, when the user wants to turn off the display screen without using the display, the display unit 11 6, the battery 117 is turned off and not used, and the touch input unit 156 and and the control module 115 is turned on. When you want to display the screen again, touch the screen. By pressing the button, the display screen can be turned on.

[0105] Furthermore, if it is a still image, the display module 121 and the control module 115 are turned on. After the still image is displayed on the display unit 116, the control module 11 Even if the display module 5 is turned off, only the display module 121 is turned on and a still image continues to be displayed. Note that the transistor in the display portion 116 is formed using an oxide semiconductor layer ( For example, oxide materials containing In, Ga, and Zn) or memory for each pixel If the configuration has this, the power supply from the battery 117 can be cut off after the still image is displayed. You can also keep the still image displayed for a set period of time.

[0106] In this embodiment, the display module 121, the control module 115, and the touch input Although an example in which each power supply unit 156 has a battery has been shown, it is not particularly limited to a total of three batteries. It is not limited to four or more batteries, including the functional module and its battery. The electronic device may also be

[0107] In this embodiment, the display module 121, the control module 115, and the touch input In the above example, the input unit 156 includes a wireless transmitting unit and a wireless receiving unit. However, this is not particularly limited. The batteries may be connected in series or in parallel. At least one receiving circuit (including a wireless charging antenna) for contactless charging of the child device is installed. The battery may have a power supply and be electrically connected to one of the batteries via a regulator.

[0108] In addition, if an electronic device is equipped with a communication module as a communication function, it can be considered an information terminal device. In addition, electronic devices can be used with communication modules that realize short-range wireless communication functions such as telephones. In that case, the communication module will also have a battery. Other functions may also be installed, for example, sensors (force, displacement, position, speed , acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substances, sound, time, hardness, Measures electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor or infrared. A microphone, etc. may also be provided.

[0109] Furthermore, electronic devices may have slots for inserting SIM cards or other US devices such as USB memory sticks. A connector section for connecting the B device may be provided.

[0110] As mentioned above, electronic devices are made up of units (modules and functions) used in electronic devices. A battery is provided for each of the plurality of batteries, and the plurality of batteries are managed by the power management circuit 127. As an electronic device with multiple batteries, it is possible to select only the functions to be used. By selectively running the operating system, power saving can be achieved. The power management circuit 127 monitors the amount of power in each battery and transfers power from one battery to another. Wirelessly power and charge the battery, either automatically or by user control. It is possible to select the battery that corresponds to the part to be used from among multiple batteries in an electronic device. The operating system selects the appropriate battery and adjusts the power consumption of each battery. The system can extend the available time for the features you use.

[0111] In addition, each battery has a communication module that enables contactless charging. It can be controlled to charge multiple batteries simultaneously. The power management circuitry allows for the adjustment of power consumption, so the power of each battery can be shared. They can supply each other.

[0112] (Embodiment 2) In this embodiment, an example that is partially different from the first embodiment is shown in FIG. 7. Note that the same parts as in FIG. The same reference numerals are used for the same parts, and detailed explanations of the same parts will be omitted.

[0113] In the first embodiment, an example in which two batteries of approximately the same size are used is shown. As shown in FIG. 7(A), the size and arrangement of the battery are different from those in the first embodiment. The size of the display area of ​​the display unit 116 is approximately 5.9 inches.

[0114] Figure 7(A) shows a schematic diagram showing the arrangement of each battery. The display 116 on the front panel and the placement of each battery are shown. Between the two points 53 is a bending point 116d of the display unit, as shown by the dotted line in FIG. 7(A).

[0115] The battery 112 is electrically connected to the regulator 113, which The regulator 113 is electrically connected to a system unit 125 including a CPU. The signal may be connected to a line or a transmission circuit.

[0116] The battery 753 is electrically connected to the regulator 754. The regulator 754 is electrically connected to the display unit 11. The regulator 754 is electrically connected to the receiving circuit or the transmitting circuit. It may be connected.

[0117] FIG. 7B shows a cross section of FIG. 7A, and shows how the CPU is positioned when the electronic device is unfolded. 1 shows the positional relationship between the system unit 125 including the system unit 125 and each part.

[0118] FIG. 7C shows the state of the system unit 125 including the CPU and each component when the electronic device is bent. When the electronic device is bent, the battery 112 , and is arranged so as not to overlap with the battery 753. This allows the thickness of the electronic device to be reduced when miniaturized compared to the first embodiment. The battery does not overlap the bending points 116d and 116e of the display part, and the bending points This has led to the miniaturization of electronic devices.

[0119] Also, if an electronic device has three batteries, the size of the three batteries should be approximately the same. For example, as shown in FIG. 24(A), two batteries may be used. The size and layout of the display area of ​​the display unit 116 is approximately 5.9 It is inches.

[0120] Figure 24(A) shows a schematic diagram showing the layout of each battery. The rear display 116 and the placement of the batteries are shown. Between the points 116a and 116b, a bending point 116e of the display unit is located, as indicated by the dotted line in FIG. 24(A). In addition, a display unit shown by a dotted line in FIG. 24(A) is provided between the battery 717 and the battery 753. The bending point 116d is located at this point.

[0121] The battery 112 is electrically connected to the regulator 113, which The regulator 113 is electrically connected to a system unit 125 including a CPU. The signal may be connected to a line or a transmission circuit.

[0122] The battery 717 is electrically connected to the regulator 718. The regulator 718 is electrically connected to the drive circuit of the display unit 116. Alternatively, it may be connected to a transmission circuit.

[0123] The battery 753 is electrically connected to the regulator 754. The regulator 754 is electrically connected to the touch input unit. It may be connected to a road.

[0124] FIG. 24(B) shows a cross section of FIG. 24(A), and when the electronic device is deployed, the CP The diagram shows the positional relationship between the system unit 125 including U and each part.

[0125] FIG. 24C shows the state of the system unit 125 including the CPU when the electronic device is bent. The positional relationship of each part is shown. When the electronic device is bent, the battery 112 overlaps with battery 717 and battery 753, but 753 are arranged so as not to overlap. Compared to 1, the thickness of the electronic device can be reduced when it is miniaturized. The battery is not overlapped at the points 116d and 116e, and by bending these points, Electronic devices are becoming smaller.

[0126] This embodiment mode can be freely combined with other embodiment modes.

[0127] (Embodiment 3) In the first embodiment, the first flexible film 143 and the second flexible film 144 are used. In this embodiment, a flexible display panel is formed by a peeling method. In this embodiment mode, an example of manufacturing the semiconductor device using a peeling layer will be described below.

[0128] First, a peeling layer 203 is formed on a fabrication substrate 201, and a peeled layer 205 is formed on the peeling layer 203. In addition, a separation layer 223 is formed on the formation substrate 221. A peeled layer 225 is formed thereon (FIG. 8(B)).

[0129] For example, when a tungsten film is used as a peeling layer, N2O plasma treatment A tungsten oxide film can be formed between the tungsten film and the layer to be peeled. By performing plasma treatment and forming a tungsten oxide film, the layer to be peeled can be peeled off with little force. At this time, separation occurs at the interface between the tungsten film and the tungsten oxide film. As a result, the tungsten oxide film may remain on the peeled layer side. The remaining silicon film may adversely affect the characteristics of the transistor. After the step of separating the peeling layer from the layer to be peeled, a step of removing the tungsten oxide film may be included. preferable.

[0130] Another aspect of the present invention is a method for depositing a tungsten film having a thickness of 0.1 nm or more and less than 200 nm on a substrate. A membrane is used.

[0131] Next, the substrate 201 and the substrate 221 are placed so that the surfaces on which the peeled layers are formed face each other. The bonding layer 207 and the frame-shaped bonding layer 211 are used to bond the substrate 100 and the substrate 100 together. The frame-shaped bonding layer 211 is then hardened (FIG. 8(C)). After providing the bonding layer 211 and the bonding layer 207 inside the frame-shaped bonding layer 211, The substrate 01 and the substrate 221 are placed opposite each other and bonded together.

[0132] The bonding of the fabrication substrate 201 and the fabrication substrate 221 is preferably carried out in a reduced pressure atmosphere. stomach.

[0133] Although FIG. 8C shows a case where the size of the peeling layer 203 and the size of the peeling layer 223 are different, Alternatively, a release layer of the same size may be used, as shown in FIG. 8(D).

[0134] The bonding layer 207 overlaps the peeling layer 203, the peeled layer 205, the peeled layer 225, and the peeling layer 223. The end of the bonding layer 207 is positioned so that the peeling layer 203 or the peeling layer 223 It is preferable that the edge is located inside at least one edge (the edge that is to be peeled first). This can prevent the formation substrate 201 and the formation substrate 221 from being strongly adhered to each other, and the subsequent peeling process This can prevent a decrease in yield.

[0135] Next, a starting point for peeling is formed by irradiation with laser light (FIGS. 9(A) and 9(B)).

[0136] The fabrication substrate 201 and the fabrication substrate 221 may be peeled from either one of them. In this case, the film may be peeled off from a substrate on which a large release layer is formed, or from a substrate on which a small release layer is formed. The device may be peeled off from the plate. When the device is fabricated, it may be peeled off from the substrate on which the device is formed, or from the other substrate. Here, an example in which the fabrication substrate 201 is peeled off first will be shown.

[0137] The laser beam penetrates the hardened bonding layer 207 or the hardened frame-shaped bonding layer 211 and the peeled layer 2 The area where the bonding layer 207 overlaps with the peeling layer 203 is irradiated. The case where the frame-shaped bonding layer 211 is in an uncured state is shown as an example. 07 is irradiated with laser light (see arrow P3 in FIG. 9(A)).

[0138] By removing a part of the layer to be peeled 205, a starting point of peeling can be formed (shown by the dotted line in FIG. 9(B)). At this time, not only the layer to be peeled 205 but also the peeling layer 203 and the bonding layer 207 A part of the pore size may be removed.

[0139] The laser light is preferably applied from the substrate side on which the peeling layer to be peeled is provided. When the laser beam is irradiated to the region where the peeled layer 203 and the peeling layer 223 overlap, By forming cracks only in the layer 205 to be peeled out of the layer 225 to be peeled, a substrate can be selectively produced. The peeling layer 201 and the peeling layer 203 can be peeled off (see the area surrounded by the dotted line in FIG. 9(B)). .

[0140] When the region where the peeling layer 203 and the peeling layer 223 overlap is irradiated with laser light, the peeling layer 203 side The starting point of peeling is formed in both the layer to be peeled 205 and the layer to be peeled 225 on the peeling layer 223 side. Therefore, it may be difficult to selectively peel off one of the substrates. The conditions for laser irradiation may be limited so that cracks are generated only in the layer to be peeled. do.

[0141] Then, the layer to be peeled 205 and the substrate 201 are separated from each other at the peeling starting point (FIG. 9). (C, (D)). This allows the layer to be peeled 205 to be transferred from the fabrication substrate 201 to the fabrication substrate 221. It can be transposed.

[0142] The peeled layer 205 separated from the fabricated substrate 201 in the step shown in FIG. 9(D) and the substrate 231 The substrates are bonded together using a bonding layer 233, and the bonding layer 233 is cured (FIG. 10(A)).

[0143] Next, a sharp blade such as a cutter is used to create a starting point for peeling (Figure 10(B) and (C) ).

[0144] If the substrate 231 on the side where the peeling layer 223 is not provided can be cut with a blade or the like, , a cut may be made in the bonding layer 233 and the peeled layer 225 (arrow P in FIG. 10(B)). 5). This removes a part of the layer to be peeled 225, forming a starting point for peeling (see FIG. 1 0(C) (see the area enclosed by the dotted line).

[0145] For example, in the region where the formation substrate 221 and the substrate 231 do not overlap with the peeling layer 223, the bonding layer 233 When the substrate 221 and the substrate 231 are bonded together, the high adhesion between the substrate 221 and the substrate 231 makes it possible to In the subsequent peeling process, some areas may not be peeled, resulting in a decrease in yield. Then, a frame-shaped cut is made in the area where the hardened bonding layer 233 and the peeling layer 223 overlap, It is preferable to form the peeling starting point in a solid line. This increases the yield of the peeling process. It is possible.

[0146] Then, the layer to be peeled 225 and the fabrication substrate 221 are separated from each other at the formed peeling starting point (FIG. 1 0(D)). This allows the peeled layer 225 to be transferred from the fabrication substrate 221 to the substrate 231. This can be done.

[0147] In addition, a liquid such as water is allowed to penetrate into the interface between the peeling layer 223 and the peeled layer 225, and the fabrication substrate 22 The liquid may be separated from the peeling layer 223 by capillary action. By penetrating between the layers 225, it can be easily separated. Electricity adversely affects the functional elements included in the peeled layer 225 (semiconductor elements may be damaged by static electricity) It is also possible to spray the liquid in mist or vapor form. The liquid can be pure water or an organic solvent, and can be neutral, alkaline, or Alternatively, an acidic aqueous solution or an aqueous solution containing a dissolved salt may be used.

[0148] In the peeling method according to one aspect of the present invention described above, a starting point for peeling is formed using a sharp blade or the like, The peeling process is carried out after the peeling layer and the peeled layer are brought into a state where they can be easily peeled from each other. The yield can be improved.

[0149] In addition, a pair of substrates each having a peeled layer formed thereon are bonded together in advance, and then peeled. The substrates that make up the device to be manufactured can be bonded together. When laminating the delamination, it is possible to bond the substrates with low flexibility together, and the flexibility This improves the alignment accuracy of the bonding compared to when bonding two functional substrates together. Cut.

[0150] An example of a flexible light-emitting device that can be manufactured using the above-described peeling method is as follows: Explained below.

[0151] Figures 11, 12, and 13 show flexible light-emitting devices using organic EL elements as light-emitting elements. The flexible light-emitting device of this embodiment has a curvature radius of 1 mm, for example. The bending direction does not matter. The bending point must be It may be one place or two or more places. For example, when the light emitting device is folded in two or three, It is possible.

[0152] For example, a light-emitting device according to one embodiment of the present invention includes a first flexible substrate, a second flexible substrate, and a light-emitting element. a light-emitting element between the first flexible substrate and the second flexible substrate; a first insulating layer between the optical elements, and a first bonding layer between the second flexible substrate and the light emitting element; The light-emitting element has a layer containing a light-emitting organic compound between a pair of electrodes, and the first The water vapor permeability of the insulating layer is 1×10 -5 g / m 2 Less than a day.

[0153] The light-emitting device has a second insulating layer between the second flexible substrate and the first bonding layer. The second insulating layer has a water vapor permeability of 1×10 -5 g / m 2 - It is preferable that it is less than 1 day. In addition, the light emitting device may further include a frame-shaped second bonding layer surrounding the first bonding layer. It is preferable that

[0154] In this specification, the term "light-emitting device" includes a display device using a light-emitting element. The optical element is connected to a connector, such as anisotropic conductive film or TCP (Tape Carrier). The module has a printed wiring board at the end of the TCP. The COG (Chip On Glass) method is used for the module or light emitting element. A module on which an IC (integrated circuit) is directly mounted may be included in a light emitting device. Furthermore, lighting fixtures and the like may also be included in the light-emitting device.

[0155] <Configuration example 1> FIG. 11(A1) shows a plan view of the light emitting device, and FIG. 11(B) shows the structure of the light emitting device along the dashed line in FIG. 11(A1). The cross section between X3 and Y3 is shown. The light emitting device shown in FIG. 11(B) is a top view using a color-coded method. In this embodiment, the light emitting device is an R( A configuration that expresses one color using three light-emitting units of R (red), G (green), and B (blue), or A configuration that expresses one color using four light-emitting units of G (green), B (blue), and W (white) is suitable. There are no particular limitations on the color elements, and colors other than RGBW may be used. For example, It may be composed of yellow, cyan, magenta, etc.

[0156] The light emitting device shown in FIG. 11(A1) includes a light emitting portion 491, a driving circuit portion 493, and an FPC (Flexible Printed Circuit). It has a light emitting unit 491 and a driving circuit The organic EL element and the transistor included in the path portion 493 are mounted on the flexible substrate 420 and the flexible substrate 42 8, and is sealed by a frame-shaped bonding layer 404 and a bonding layer 407. In FIG. In the example shown in FIG. 1, the conductive layer 457 and the connector 497 are connected to each other at the opening of the frame-shaped bonding layer 404. Shows.

[0157] The light emitting device shown in FIG. 11(B) includes a flexible substrate 420, an adhesive layer 422, an insulating layer 424, a transistor, and a light emitting device. The transistor 455, the insulating layer 463, the insulating layer 465, the insulating layer 405, the organic EL element 450 (the A first electrode 401, an EL layer 402, and a second electrode 403, a frame-shaped bonding layer 404, a bonding layer 407, a flexible substrate 428, and a conductive layer 457. 7 and the second electrode 403 are transparent to visible light.

[0158] In the light-emitting portion 491 of the light-emitting device shown in FIG. 11(B), the adhesive layer 422 and the insulating layer 424 are interposed therebetween. A transistor 455 and an organic EL element 450 are provided on a flexible substrate 420 . The organic EL element 450 includes a first electrode 401 on an insulating layer 465 and an E The first electrode 401 has an L layer 402 and a second electrode 403 on the EL layer 402. The first electrode 4 is electrically connected to the source electrode or the drain electrode of the transistor 455. The first electrode 401 preferably reflects visible light. The edge of the first electrode 401 is covered with an insulating layer 405. It is being done.

[0159] The driver circuit portion 493 includes a plurality of transistors. 1 shows one of the transistors included in the semiconductor memory device.

[0160] The conductive layer 457 transmits signals (video signals, clock signals, start signals, etc.) from the outside to the driving circuit section 493. It is electrically connected to an external input terminal that transmits a signal (such as a start signal or a reset signal) or a potential. Here, an example is shown in which an FPC495 is provided as an external input terminal.

[0161] In order to prevent an increase in the number of processes, the conductive layer 457 is formed on the same substrate as the electrodes and wiring used in the light-emitting section and the driving circuit section. It is preferable to form the conductive layer 457 using the same material and in the same process. This example shows a case where the electrode is made of the same material and in the same process as the electrode that constitutes the stator.

[0162] The insulating layer 463 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 465 also has a planarizing function to reduce surface irregularities caused by the transistor. It is preferable to select an insulating layer having a

[0163] The frame-shaped bonding layer 404 is preferably a layer having a higher gas barrier property than the bonding layer 407. This makes it possible to prevent moisture and oxygen from entering the light emitting device from the outside. This makes it possible to realize a highly reliable light emitting device.

[0164] In the first configuration example, the light emitted from the organic EL element 450 is extracted from the light emitting device through the bonding layer 407. Therefore, it is preferable that the bonding layer 407 has higher light-transmitting properties than the frame-shaped bonding layer 404. In addition, it is preferable that the bonding layer 407 has a higher refractive index than the frame-shaped bonding layer 404. Furthermore, the bonding layer 407 has a smaller shrinkage in volume when hardened than the frame-shaped bonding layer 404. It is preferable that:

[0165] The light emitting device shown as Configuration Example 1 can be manufactured with a high yield by using the above-described peeling method. In the above-described peeling method, the insulating layer 424 and each transistor are formed as layers to be peeled. By forming the insulating layer 424 on a substrate, the insulating layer 424 and the transistor can be formed at high temperatures. By using the insulating layer 424 and transistors formed at high temperatures, highly reliable light emission can be achieved. An organic EL element 450 or the like may be further formed as a peeled layer. stomach.

[0166] <Configuration example 2> FIG. 11(A2) shows a plan view of the light emitting device, and FIG. 11(C) shows the structure of the light emitting device along the dashed line in FIG. 11(A2). The cross section between X4 and Y4 is shown. The light emitting device shown in FIG. 11(C) uses a color filter method. It is a bottom-emission type light-emitting device.

[0167] The light emitting device shown in FIG. 11(C) includes a flexible substrate 420, an adhesive layer 422, an insulating layer 424, a transistor, and a light emitting device. a transistor 454, a transistor 455, an insulating layer 463, a colored layer 432, an insulating layer 465, a conductive layer The conductive layer 435, the insulating layer 467, the insulating layer 405, the organic EL element 450 (first electrode 401, E The L layer 402 and the second electrode 403, the bonding layer 407, the flexible substrate 428, and the conductive layer 4 57. The flexible substrate 420, the adhesive layer 422, the insulating layer 424, the insulating layer 463, the insulating layer 465, the insulating layer 467, and the first electrode 401 are transparent to visible light.

[0168] In the light-emitting section 491 of the light-emitting device shown in FIG. 11(C), the adhesive layer 422 and the insulating layer 424 are interposed therebetween. A switching transistor 454 and a current control transistor are formed on the flexible substrate 420. The organic EL element 450 is provided between the insulating layer 4 67, a first electrode 401, an EL layer 402 on the first electrode 401, and a The first electrode 401 is connected to the transistor via a conductive layer 435. The first electrode 401 is electrically connected to the source electrode or drain electrode 455. The second electrode 403 is covered with an insulating layer 405. The second electrode 403 preferably reflects visible light. The light-emitting device also has a colored layer 432 on the insulating layer 463 that overlaps the organic EL element 450. .

[0169] The driver circuit portion 493 includes a plurality of transistors. 1 shows two transistors among the transistors included in the semiconductor memory device.

[0170] The conductive layer 457 is connected to an external input terminal for transmitting signals and potentials from the outside to the driver circuit portion 493. Here, an example is shown in which an FPC495 is used as the external input terminal. In this example, the conductive layer 457 is formed using the same material and process as the conductive layer 435. Shows.

[0171] The insulating layer 463 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layers 465 and 467 reduce surface irregularities caused by transistors and wirings. It is preferable to select an insulating layer that has a planarizing function to achieve this.

[0172] As shown in FIG. 12A, a touch sensor may be provided on the flexible substrate 420. The touch sensor includes a conductive layer 441, a conductive layer 442, and an insulating layer 443. As shown in FIG. 12B, a flexible substrate 444 is provided between the flexible substrate 420 and the touch sensor. The touch sensor may be provided between the flexible substrate 420 and the flexible substrate 444. An FPC 445 for a touch sensor may be provided.

[0173] The light emitting device shown as Configuration Example 2 can be manufactured with a high yield by using the above-described peeling method. In the above-described peeling method, the insulating layer 424 and each transistor are formed as layers to be peeled. By forming the insulating layer 424 on a substrate, the insulating layer 424 and the transistor can be formed at high temperatures. By using the insulating layer 424 and transistors formed at high temperatures, highly reliable light emission can be achieved. An organic EL element 450 or the like may be further formed as a peeled layer. stomach.

[0174] <Configuration example 3> FIG. 13(A1) shows a plan view of the light emitting device, and FIG. 13(B) shows the structure of the light emitting device along the dashed line in FIG. 13(A1). The cross section between X5 and Y5 is shown. The light emitting device shown in FIG. 13(A1) uses a color filter method. It is a top-emission type light-emitting device.

[0175] The light emitting device shown in FIG. 13(B) includes a flexible substrate 420, an adhesive layer 422, an insulating layer 424, a transistor, and a light emitting device. Transistor 455, insulating layer 463, insulating layer 465, insulating layer 405, spacer 496, organic E The EL element 450 (first electrode 401, EL layer 402, and second electrode 403), the bonding layer 40 7, overcoat 453, light-shielding layer 431, coloring layer 432, insulating layer 226, adhesive layer 426 , a flexible substrate 428, and a conductive layer 457. The edge layer 226, the bonding layer 407, the overcoat 453, and the second electrode 403 are transparent to visible light. Pass.

[0176] In the light-emitting section 491 of the light-emitting device shown in FIG. 13(B), the adhesive layer 422 and the insulating layer 424 are interposed therebetween. A transistor 455 and an organic EL element 450 are provided on a flexible substrate 420 . The organic EL element 450 includes a first electrode 401 on an insulating layer 465 and an E The first electrode 401 has an L layer 402 and a second electrode 403 on the EL layer 402. The first electrode 4 is electrically connected to the source electrode or the drain electrode of the transistor 455. The end of the first electrode 401 is covered with an insulating layer 405. The first electrode 401 is capable of reflecting visible light. It is preferable that the insulating layer 405 has a spacer 496 on it. The distance between the flexible substrate 420 and the flexible substrate 428 can be adjusted.

[0177] The light-emitting device also has a colored layer 432 that overlaps the organic EL element 450 via the bonding layer 407. The light-shielding layer 431 overlaps with the insulating layer 405 via the bonding layer 407 .

[0178] The driver circuit portion 493 includes a plurality of transistors. 1 shows one of the transistors included in the semiconductor memory device.

[0179] The conductive layer 457 is connected to an external input terminal for transmitting signals and potentials from the outside to the driver circuit portion 493. Here, an example is shown in which an FPC495 is used as the external input terminal. Here, the conductive layer 457 is formed of the same material as the electrode of the transistor 455. An example of fabrication in one process is shown below.

[0180] In the light-emitting device shown in FIG. 13(B), the connector 497 is located on the insulating layer 226. 97 includes a flexible substrate 428, an adhesive layer 426, an insulating layer 226, a bonding layer 407, and an insulating layer 465. and is connected to the conductive layer 457 through an opening in the insulating layer 463. The connecting member 497 is connected to the FPC 495. The FPC 495 and the conductive layer 4 are connected to each other via the connecting member 497. 57 is electrically connected. When the conductive layer 457 and the flexible substrate 428 overlap, By opening the substrate 428 (or by using a flexible substrate with openings), the conductive layer 457 , the connector 497, and the FPC 495 can be electrically connected.

[0181] The insulating layer 424 preferably has a high gas barrier property. Similarly, the insulating layer 226 can prevent moisture and oxygen from entering the light emitting device. It is preferable that the barrier property is high, so that moisture and oxygen can be prevented from emitting from the flexible substrate 428 side. This can prevent intrusion into the device.

[0182] The light emitting device shown as Configuration Example 3 can be manufactured with a high yield by using the above-described peeling method. In the above-described peeling method, the insulating layer 424, the transistors, the organic EL element, and the like are removed from the substrate. Then, on another substrate, an L element 450 and the like are formed as a layer to be peeled. The insulating layer 226, the colored layer 432, the light-shielding layer 431, etc. are formed as layers to be peeled off. After bonding the fabrication substrate, the peeled layer and fabrication substrate are separated, and the peeled layer and flexible substrate are bonded together. By bonding the layers together, a light-emitting device shown as Configuration Example 3 can be manufactured.

[0183] In the peeling method of one embodiment of the present invention, an insulating layer and a transistor are formed on a formation substrate at high temperature. The insulating layer 424, the insulating layer 226, and the transistor formed at high temperatures can be used. By doing so, a highly reliable light-emitting device can be realized. Insulating layers (insulating layer 226 and insulating layer 424) with high gas barrier properties can be disposed. This makes it possible to prevent impurities such as moisture from entering the organic EL element 450.

[0184] <Configuration Example 4> FIG. 13(A2) shows a plan view of the light emitting device, and FIG. 13(C) shows the structure of the light emitting device along the dashed line in FIG. 13(A2). The cross section of the X6-Y6 line is shown. The light emitting device shown in FIG. 13(A2) uses a color filter method. It is a top-emission type light-emitting device.

[0185] The light emitting device shown in FIG. 13(C) includes a flexible substrate 420, an adhesive layer 422, an insulating layer 424, a transistor, and a light emitting device. The transistor 455, the insulating layer 463, the insulating layer 465, the insulating layer 405, the organic EL element 450 (the The first electrode 401, the EL layer 402, and the second electrode 403, the frame-shaped bonding layer 404a, the frame-shaped The bonding layer 404b, the bonding layer 407, the overcoat 453, the light-shielding layer 431, and the colored layer 432 , an insulating layer 226, an adhesive layer 426, a flexible substrate 428, and a conductive layer 457. a substrate 428, an adhesive layer 426, an insulating layer 226, a bonding layer 407, an overcoat 453, and The second electrode 403 transmits visible light.

[0186] In the light-emitting section 491 of the light-emitting device shown in FIG. 13(C), the adhesive layer 422 and the insulating layer 424 are interposed therebetween. A transistor 455 and an organic EL element 450 are provided on a flexible substrate 420 . The organic EL element 450 includes a first electrode 401 on an insulating layer 465 and an E The first electrode 401 has an L layer 402 and a second electrode 403 on the EL layer 402. The first electrode 4 is electrically connected to the source electrode or the drain electrode of the transistor 455. The end of the first electrode 401 is covered with an insulating layer 405. The first electrode 401 is capable of reflecting visible light. In addition, the light-emitting device has a colored layer overlapping the organic EL element 450 via the bonding layer 407. The insulating layer 405 has a light-shielding layer 432 and a light-shielding layer 431 that overlaps with the insulating layer 405 with the bonding layer 407 interposed therebetween.

[0187] The driver circuit portion 493 includes a plurality of transistors. In this embodiment, one of the transistors included in the driving Although an example in which the drive circuit portion 493 is located inside the frame-shaped bonding layers 404a and 404b is shown, one or both of them may be It may be located outside of the

[0188] The conductive layer 457 is connected to an external input terminal for transmitting signals and potentials from the outside to the driver circuit portion 493. Here, an example is shown in which an FPC495 is used as the external input terminal. Here, the conductive layer 457 is formed of the same material as the electrode of the transistor 455. The connector 497 on the insulating layer 226 is connected to the conductive layer 457. The connector 497 is connected to the FPC 495. 495 and the conductive layer 457 are electrically connected.

[0189] The conductive layer 457 is positioned outside the frame-shaped bonding layer 404a, so that the FPC 495 and the connecting body 4 The connection portion of the connector 497 and the connection portion of the conductive layer 457 are prone to moisture penetration. Even if the organic EL element 450 is not used, impurities such as moisture can be prevented from entering the organic EL element 450. .

[0190] FIG. 13C is different from FIG. 13B in that the insulating layer 465 is not exposed on the side surface of the light-emitting device. When an organic insulating material with low gas barrier properties is used as the material for the insulating layer 465, It is preferable that the edge layer 465 is not exposed on the side surface of the light emitting device. The frame-shaped bonding layer is positioned on the side surface of the light emitting device, thereby improving the reliability of the light emitting device. Note that depending on the material of the insulating layer 465, as shown in FIG. The insulating layer 465 may be exposed at the edges of the light emitting device.

[0191] The frame-shaped bonding layer 404a and the frame-shaped bonding layer 404b have a larger gas barrier than the bonding layer 407. This prevents moisture and oxygen from penetrating the light emitting device from the side surfaces. Therefore, a highly reliable light emitting device can be realized.

[0192] For example, among the bonding layer 407, the frame-shaped bonding layer 404a, and the frame-shaped bonding layer 404b, water vapor The layer with the lowest air permeability is the frame-shaped bonding layer 404a, and the frame-shaped bonding layer 404b absorbs moisture. By including a desiccant or the like, the frame-shaped bonding layer 404a can prevent moisture from entering. The frame-shaped bonding layer 404b absorbs the moisture that has passed through 404a, and the bonding layer 40 7. Furthermore, the intrusion of moisture into the organic EL element 450 can be particularly suppressed.

[0193] In the fourth configuration example, light emitted from the organic EL element 450 is extracted from the light emitting device through the bonding layer 407. Therefore, the bonding layer 407 is stronger than the frame-shaped bonding layer 404a and the frame-shaped bonding layer 404b. It is preferable that all of the bonding layers 407 have high light-transmitting properties. The bonding layer 407 preferably has a higher refractive index than the bonding layer 404b. It is preferable that the volume shrinkage during hardening is smaller than that of the bonding layer 404a and the frame-shaped bonding layer 404b. It's nice.

[0194] The light emitting device shown as Configuration Example 4 can be manufactured with a high yield by using the above-described peeling method. In the above-described peeling method, the insulating layer 424, the transistors, the organic EL element, and the like are removed from the substrate. Then, on another substrate, an L element 450 and the like are formed as a layer to be peeled. The insulating layer 226, the colored layer 432, the light-shielding layer 431, etc. are formed as layers to be peeled off. After bonding the fabrication substrate, the peeled layer and fabrication substrate are separated, and the peeled layer and flexible substrate are bonded together. By bonding the layers together, a light-emitting device shown as Configuration Example 4 can be manufactured.

[0195] In the above-described peeling method, an insulating layer and a transistor can be formed on a substrate at high temperature. By using the insulating layer 424, the insulating layer 226, and the transistor formed at high temperature, This allows for a highly reliable light-emitting device to be realized. It is possible to arrange insulating layers with high barrier properties (insulating layer 226 and insulating layer 424). This can prevent impurities such as moisture from entering the organic EL element 450.

[0196] As described above, in the fourth configuration example, the insulating layer 424, the insulating layer 226, the frame-shaped bonding layers 404a and 404b As a result, water is absorbed from the front surface (display surface), rear surface (surface opposite to the display surface), and side surfaces of the light-emitting device. Therefore, it is possible to prevent impurities such as inorganic compounds from entering the organic EL element 450. This can improve the reliability of the system.

[0197] Here, an example in which an organic EL element is used as a display element is shown. One aspect of the present invention is not limited to this.

[0198] In one embodiment of the present invention, an active element (active element, non-linear element) is used in a pixel. The active matrix method or the passive matrix method that does not have active elements in the pixels is used. It is possible.

[0199] This embodiment mode can be freely combined with other embodiment modes.

[0200] (Fourth embodiment) In this embodiment, the configuration of the input / output device of one embodiment of the present invention will be described with reference to FIGS. 14 and 15. The explanation will be given with reference to the above.

[0201] FIG. 14 is a projection diagram illustrating the configuration of an input / output device of one embodiment of the present invention.

[0202] FIG. 14A is a projection view of an input / output device 500 according to one embodiment of the present invention, and FIG. 10 is a projection view illustrating the configuration of a detection unit 20U included in the force device 500. FIG.

[0203] FIG. 15 is a cross-sectional view illustrating a structure of an input / output device 500 of one embodiment of the present invention.

[0204] FIG. 15A is a cross-sectional view of the input / output device 500 of one embodiment of the present invention shown in FIG. 14 along Z1-Z2. FIG.

[0205] The input / output device 500 can also be called a touch panel.

[0206] <Example 1 of input / output device configuration> The input / output device 500 described in this embodiment has a window 14 that transmits visible light and A plurality of detection units 20U are arranged in a trix shape, and are arranged in the row direction (indicated by arrow R in the drawing). A scanning line G1 electrically connects the plurality of detection units 20U placed in the column direction (arrows in the figure) signal lines DL and C) electrically connecting the plurality of detection units 20U and A flexible first base material 1 supports the detection unit 20U, the scanning line G1, and the signal line DL. 6, and the flexible input device 100 overlapping the window portion 14 and arranged in a matrix. A display comprising a plurality of pixels 502 and a flexible second substrate 510 supporting the pixels 502. 501 (see FIGS. 14A to 14C).

[0207] The detection unit 20U includes a detection element C that overlaps the window portion 14 and a detection element C that is electrically connected to the detection element C. The detector 19 is provided (see FIG. 14(B)).

[0208] The sensing element C includes an insulating layer 23, a first electrode 21, and a second electrode 22 sandwiching the insulating layer 23. (See FIG. 15(A)).

[0209] The detection circuit 19 receives the selection signal and generates a detection signal D based on the change in capacitance of the detection element C. Supply ATA.

[0210] The scanning line G1 can supply a selection signal, and the signal line DL supplies a detection signal DATA. The detection circuit 19 is arranged so as to overlap the gaps between the plurality of windows 14.

[0211] The input / output device 500 described in this embodiment includes a detection unit 20U and a detection unit A colored layer is provided between the pixels 502 that overlap with the window portions 14 of the pixel 20U.

[0212] The input / output device 500 described in this embodiment is a detection device having a window 14 that transmits visible light. A flexible input device 100 having a plurality of units 20U and a pixel 502 overlapping the window portion 14 and a plurality of flexible display units 501, and a colored layer is provided between the window unit 14 and the pixel 502. It consists of:

[0213] This allows the input / output device to generate a detection signal based on the change in capacitance and a detection unit that supplies the detection signal. and displaying image information associated with the location information of the detection unit. As a result, a novel and convenient device with excellent reliability can be realized. Input / output devices may be provided.

[0214] The input / output device 500 is connected to the FPC 1 or and / or an FPC 2 that supplies a signal including image information to the display unit 501.

[0215] In addition, a protective layer 17p and / or an input / output layer 502 are provided to protect the input / output device 500 from scratches. The device 500 may include an anti-reflective layer 567p that reduces the intensity of reflected ambient light.

[0216] The input / output device 500 also includes a scanning line driving circuit that supplies selection signals to the scanning lines of the display unit 501. 503g, wiring 511 for supplying signals and terminals 519 electrically connected to the FPC2 Has.

[0217] The individual elements that make up the input / output device 500 will be described below. are not clearly separable, and one component may also contain other components or parts of other components. be.

[0218] For example, the input device 100 having the colored layer at a position overlapping the plurality of window portions 14 is 0 and also a color filter.

[0219] In addition, for example, an input / output device 500 in which the input device 100 is superimposed on a display unit 501 is 100 and also a display unit 501.

[0220] <<Overall Configuration>> The input / output device 500 includes the input device 100 and a display unit 501 (see FIG. 14(A)).

[0221] <<Input Device 100>> The input device 100 is a device that supports a plurality of detection units 20U and a detection unit. For example, a plurality of detection units are arranged in a matrix of 40 rows and 15 columns. The knit 20U is disposed on a flexible substrate 16.

[0222] <<Window 14, Colored Layer, and Light-Shielding Layer BM>> The window 14 transmits visible light.

[0223] A colored layer that transmits light of a predetermined color is provided at a position overlapping the window portion 14. For example, a colored layer CFB that transmits green light, a colored layer CFG that transmits red light, or Equipped with CFR (see Figure 14(B)).

[0224] In addition to blue, green, and / or red, a colored layer that transmits white light or a yellow Colored layers that transmit light of various colors may be provided.

[0225] The colored layer may contain a metal material, a pigment, a dye, or the like.

[0226] A light-shielding layer BM is provided so as to surround the window portion 14. The light-shielding layer BM transmits light from the window portion 14. It's difficult.

[0227] Carbon black, metal oxides, composite oxides including solid solutions of multiple metal oxides, etc. can be used for the layer BM.

[0228] The scanning line G1, the signal line DL, the wiring VPI, the wiring RES, and the like are arranged at positions overlapping the light-shielding layer BM. It is provided with a wiring VRES and a detection circuit 19.

[0229] In addition, a light-transmitting overcoat layer that covers the colored layer and the light-shielding layer BM may be provided. do.

[0230] Detecting element C: The detecting element C has a first electrode 21, a second electrode 22, and a first electrode 21. An insulating layer 23 is provided between the second electrodes 22 (see FIG. 15(A)).

[0231] The first electrode 21 is formed, for example, in an island shape so as to be separated from other regions. The same electrode as the first electrode 21 is used so that the first electrode 21 is not identified to the user of the force device 500. It is preferable to arrange the layer that can be fabricated in the process in close proximity to the first electrode 21. More preferably, the first electrode 21 and the layer disposed adjacent to the first electrode 21 are disposed in the gap. It is preferable to minimize the number of windows 14 in the gap. A configuration with this is preferred.

[0232] The second electrode 22 is provided so as to overlap the first electrode 21, and the first electrode 21 and the second electrode 22 An insulating layer 23 is provided between them.

[0233] For example, the first electrode 21 or the second electrode 22 of the sensing element C placed in the atmosphere is connected to the atmosphere. When an object with a different dielectric constant approaches, the capacitance of the sensing element C changes. When an object approaches the sensing element C, the capacitance of the sensing element C changes. This allows for proximity detection. It can be used as a vessel.

[0234] For example, the capacitance of the sensing element C, which can be deformed, changes with the deformation.

[0235] Specifically, when an object such as a finger touches the sensing element C, the first electrode 21 and the second electrode As the spacing between the poles 22 decreases, the capacitance of the sensing element C increases. It can be used.

[0236] Specifically, by bending the detection element C, the first electrode 21 and the second electrode 22 This increases the capacitance of the sensing element C. It can be used.

[0237] The first electrode 21 and the second electrode 22 include a conductive material.

[0238] For example, inorganic conductive materials, organic conductive materials, metals, conductive ceramics, etc. It can be used for the electrode 21 and the second electrode 22.

[0239] Specifically, aluminum, chromium, copper, tantalum, titanium, molybdenum, and tungsten a metal element selected from nickel, silver, or manganese; a composite containing the above-mentioned metal element; Gold or an alloy combining the above-mentioned metal elements can be used.

[0240] Alternatively, indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, gallium Conductive oxides such as zinc oxide doped with ammonium can be used.

[0241] Alternatively, graphene or graphite can be used. The graphene-containing film can be For example, the graphene oxide film can be formed by reducing a film containing the graphene oxide. Examples of the method include a method of applying heat and a method of using a reducing agent.

[0242] Alternatively, a conductive polymer can be used.

[0243] <Detection Circuit 19> The detection circuit 19 includes, for example, transistors M1 to M3. The detection circuit 19 also includes wiring for supplying a power supply potential and a signal. For example, wiring VPI, This includes wiring CS, scanning line G1, wiring RES, wiring VRES, and signal line DL. The specific configuration of the detection circuit 19 will be described in detail in the fifth embodiment.

[0244] The detection circuit 19 may be disposed in an area that does not overlap with the window portion 14. For example, By arranging the wiring in a non-overlapping area, it is possible to This makes it easier to see what is nearby.

[0245] For example, transistors M1 to M2 that can be formed in the same process are It can be used for register M3.

[0246] The transistor M1 has a semiconductor layer, for example, a group 14 element, a compound semiconductor, or an oxide Semiconductors containing silicon, gallium, and the like can be used for the semiconductor layer. A semiconductor containing indium arsenic or an oxide semiconductor containing indium can be used.

[0247] Note that the structure of a transistor in which an oxide semiconductor is used for a semiconductor layer is Explain in detail.

[0248] A conductive material can be applied to the wiring.

[0249] For example, inorganic conductive materials, organic conductive materials, metals, or conductive ceramics can be used for wiring. Specifically, it can be used for the first electrode 21 and the second electrode 22. The same materials can be applied.

[0250] Aluminum, gold, platinum, silver, nickel, titanium, tungsten, chromium, molybdenum, A metal material such as iron, cobalt, copper, or palladium, or an alloy material containing such a metal material, is used as a scanning line. It can be used for G1, signal line DL, wiring VPI, wiring RES and wiring VRES.

[0251] The film formed on the substrate 16 may be processed to form the detection circuit 19 on the substrate 16 .

[0252] Alternatively, the detection circuit 19 formed on another substrate may be transferred to the substrate 16 .

[0253] Note that a manufacturing method of the detection circuit will be described in detail in Embodiment 5.

[0254] <<Substrate 16>> An organic material, an inorganic material, or a composite material of an organic material and an inorganic material is formed on a flexible substrate 1 It can be used for 6.

[0255] 5 μm or more and 2500 μm or less, preferably 5 μm or more and 680 μm or less, more preferably 5 μm or more and 170 μm or less, more preferably 5 μm or more and 45 μm or less, more preferably 5 μm or more and 45 μm or less The material has a thickness of 8 μm or more and 45 μm or less, more preferably 8 μm or more and 25 μm or less. It can be used for material 16.

[0256] Furthermore, a material that is inhibited from permeating impurities can be suitably used for the substrate 16. For example, Water vapor transmission rate of 10 -5 g / m 2 ·day or less, preferably 10 -6 g / m 2 ·day The following materials can be suitably used:

[0257] In addition, it is preferable to use a material for the base material 16 that has a linear expansion coefficient approximately equal to that of the second base material 510. For example, if the linear expansion coefficient is 1×10 -3 / K or less, preferably 5×10 -5 / K or less, More preferably 1×10 -5 A material having a solubility of 1 / K or less can be suitably used.

[0258] For example, an organic material such as a resin, a resin film, or a plastic film is used for the substrate 16. You can be there.

[0259] For example, inorganic materials such as metal plates or thin glass plates with a thickness of 10 μm to 50 μm are used. , can be used for the substrate 16.

[0260] For example, a metal plate, a thin glass plate, or a film of an inorganic material can be formed into a resin film using a resin layer. A composite material formed by laminating two or more materials, etc., can be used as the substrate 16.

[0261] For example, fibrous or particulate metal, glass or inorganic material is coated with a resin or resin film. A composite material in which the particles are dispersed can be used for the substrate 16.

[0262] For example, a thermosetting resin or an ultraviolet curing resin can be used for the resin layer.

[0263] Specifically, polyester, polyolefin, polyamide, polyimide, polycarbonate A resin film or plate made of polyethylene terephthalate or acrylic resin can be used.

[0264] Specifically, alkali-free glass, soda-lime glass, potash glass, or crystal glass A sachet or the like can be used.

[0265] Specifically, a metal oxide film, a metal nitride film, a metal oxynitride film, or the like can be used. For example, silicon oxide, silicon nitride, silicon oxynitride, alumina film, etc. can be used.

[0266] Specifically, SUS or aluminum or the like having openings formed therein can be used.

[0267] Specifically, resins such as acrylic, urethane, epoxy, or siloxane bond-containing resins are used. Resins can be used.

[0268] For example, a flexible substrate 16b, a barrier film 16a that prevents the diffusion of impurities, and a substrate 16 The laminated body including the resin layer 16c and the barrier film 16a is placed on the substrate 16. It can be suitably used for the following purposes (see FIG. 15(A)).

[0269] Specifically, a 600 nm silicon oxynitride film and a 200 nm silicon nitride film are stacked. A film containing the laminated material can be used for the barrier film 16a.

[0270] Specifically, a silicon oxynitride film having a thickness of 600 nm, a silicon nitride film having a thickness of 200 nm, and a silicon nitride film having a thickness of 20 0 nm thick silicon oxynitride film, 140 nm thick silicon nitride oxide film and 100 nm thick oxide A film containing a laminated material in which silicon nitride films are laminated in this order can be used as the barrier film 16a. Cut.

[0271] Polyester, polyolefin, polyamide, polyimide, polycarbonate or a A resin film such as acrylic resin, a resin plate, a laminate, or the like can be used for the substrate 16b. .

[0272] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide Amide, polycarbonate or acrylic, urethane, epoxy or siloxane bonded A material containing a resin having the above properties can be used for the resin layer 16c.

[0273] <<Protective substrate 17, protective layer 17p>> A flexible protective substrate 17 and / or a protective layer 17p is provided. The flexible protective substrate 17 or protective layer 17p prevents scratches and allows the input device to be Protect the device 100.

[0274] For example, polyester, polyolefin, polyamide, polyimide, polycarbonate or Alternatively, a resin film such as an acrylic resin, a resin plate, or a laminate may be used as the protective substrate 17. This can be done.

[0275] For example, a hard coat layer or a ceramic coat layer can be used for the protective layer 17p. Specifically, a layer containing UV curable resin or aluminum oxide is overlaid on the second electrode 22. It may be formed at a position.

[0276] Display unit 501: The display unit 501 has a plurality of pixels 502 arranged in a matrix. (See Figure 14(C)).

[0277] For example, pixel 502 includes subpixel 502B, subpixel 502G, and subpixel 502R, Each sub-pixel comprises a display element and a pixel circuit for driving the display element.

[0278] The sub-pixel 502B of the pixel 502 is disposed at a position overlapping the colored layer CFB, and the sub-pixel 50 The sub-pixel 2G is disposed at a position overlapping with the colored layer CFG, and the sub-pixel 502R is disposed at a position overlapping with the colored layer CFR. It is placed in a location.

[0279] In this embodiment, an organic electroluminescence element that emits white light is used as a display element. Although a case where it is applied will be described, the display element is not limited to this.

[0280] For example, organic electroluminescence (OLED) devices emit different colors of light so that each sub-pixel emits a different color of light. A light-emitting element may be applied to each sub-pixel.

[0281] In addition, the display unit may be an active matrix type having active elements in the pixels, or A passive matrix system that does not have active elements can be used.

[0282] In the active matrix system, the active element (active element, nonlinear element) is a transistor. Use not only transistors but also various active elements (active elements, nonlinear elements) For example, MIM (Metal Insulator Metal) or TF It is also possible to use a thin film diode (D). Since the number of manufacturing steps is small, it is possible to reduce manufacturing costs and improve yields. Alternatively, these elements can improve the aperture ratio due to their small size, It is possible to achieve low power consumption and high brightness.

[0283] Active elements (active elements, non-linear elements) other than the active matrix type It is also possible to use a passive matrix type that does not use active elements (active elements Since it does not use nonlinear elements, there are fewer manufacturing steps, which reduces manufacturing costs and improves yield. Alternatively, active elements (active elements, nonlinear elements) can be used. Therefore, the aperture ratio can be improved, and it is possible to achieve low power consumption or high brightness. can be done.

[0284] <<Second substrate 510>> A flexible material can be used for the second substrate 510. For example, the materials that can be used for substrate 16 can be applied to second substrate 510 .

[0285] For example, a flexible substrate 510b, a barrier film 510a that prevents the diffusion of impurities, and a substrate 510b and a resin layer 510c that bonds the barrier film 510a. can be suitably used for the second base material 510 (see FIG. 15(A)).

[0286] <Sealant 560> The sealant 560 bonds the base material 16 and the second base material 510 together. The refractive index of the sealing material 60 is larger than that of air. The stopper 560 has a function of optical bonding.

[0287] The pixel circuit and the light emitting element (for example, light emitting element 550R) are disposed between the second substrate 510 and the substrate 16. is located.

[0288] <Pixel Configuration> The sub-pixel 502R includes a light-emitting module 580R.

[0289] Subpixel 502R can supply power to light-emitting element 550R and light-emitting element 550R. The light-emitting module 580R includes a pixel circuit including a transistor 502t that can emit light. It includes a photo element 550R and an optical element (for example, a colored layer CFR).

[0290] The light-emitting element 550R includes a lower electrode, an upper electrode, and a light-emitting organic compound between the lower electrode and the upper electrode. It has a layer containing the substance.

[0291] The light emitting module 580R has a colored layer CFR in the direction in which light is extracted. Any material may be used as long as it transmits light having a wavelength, such as red, green, or blue. It is to be noted that the other sub-pixels may be provided with colored layers. The light emitted by the light-emitting element is emitted without passing through the colored layer. It may be possible.

[0292] In addition, when the sealing material 560 is provided on the side from which light is extracted, the sealing material 560 It contacts 550R and the colored layer CFR.

[0293] The colored layer CFR is located so as to overlap the light emitting element 550R. A part of the emitted light passes through the colored layer CFR and travels to the light emitting module 58 in the direction of the arrow shown in the figure. It is ejected outside 0R.

[0294] A light-shielding layer BM is provided so as to surround the colored layer (for example, the colored layer CFR).

[0295] <<Configuration of pixel circuit>> An insulating film 521 that covers a transistor 502t included in the pixel circuit is provided. The insulating film 521 can be used as a layer for flattening unevenness caused by the pixel circuit. In addition, a laminated film including a layer that can suppress the diffusion of impurities can be applied to the insulating film 521. This prevents the reliability of the transistor 502t and the like from being reduced due to the diffusion of impurities. It can be controlled.

[0296] A lower electrode is disposed on the insulating film 521, and a partition wall 528 is disposed on the insulating film 521 so as to overlap the edge of the lower electrode. It is disposed on the veneer 521 .

[0297] The lower electrode sandwiches a layer containing a light-emitting organic compound between the lower electrode and the upper electrode to form a light-emitting element (e.g., The pixel circuit supplies power to the light emitting element.

[0298] Also, a spacer for controlling the distance between the base material 16 and the second base material 510 is provided on the partition wall 528. .

[0299] <Configuration of the Scanning Line Driving Circuit> The scanning line driving circuit 503g(1) includes a transistor 503t and a and a capacitor 503c. The transistors of the pixel circuit are formed on the same substrate in the same process. A transistor capable of performing this function can be used in the driver circuit.

[0300] <Converter CONV> Converts the detection signal DATA supplied by the detection unit 20U and outputs it to FPC1 Various circuits that can supply the converter CONV can be used (see Figure 1). 4(A) and Fig. 15(A)).

[0301] For example, transistor M4 can be used for converter CONV.

[0302] <Other Configurations> The display unit 501 includes an anti-reflection layer 567p at a position overlapping the pixels. The stop layer 567p may be, for example, a circular polarizer.

[0303] The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is connected to the wiring 511. 1. In addition, F PC2 is electrically connected to terminal 519.

[0304] Incidentally, a printed wiring board (PWB) may be attached to the FPC 2.

[0305] The display portion 501 has wiring such as scanning lines, signal lines, and power supply lines. It can be used.

[0306] Specifically, aluminum, chromium, copper, tantalum, titanium, molybdenum, and tungsten , a metal element selected from nickel, yttrium, zirconium, silver, or manganese, An alloy containing the above-mentioned metal elements or an alloy combining the above-mentioned metal elements is used. In particular, aluminum, chromium, copper, tantalum, titanium, molybdenum, It is preferable that the alloy contains one or more elements selected from the group consisting of copper and manganese. Gold is suitable for microfabrication using wet etching methods.

[0307] Specifically, a two-layer structure in which a titanium film is laminated on an aluminum film, a titanium nitride film on a titanium nitride film, Two-layer structure with a tungsten film laminated on a titanium nitride film, two-layer structure with a tungsten film laminated on a titanium nitride film, a two-layer structure in which a tungsten film is laminated on a titanium film or a tungsten nitride film; A three-layer structure in which an aluminum film is layered on top of the titanium film, and a titanium film is then formed on top of that. etc. can be used.

[0308] Specifically, titanium, tantalum, tungsten, molybdenum, chromium, etc. are deposited on an aluminum film. an alloy film of one or more selected from the group consisting of silicon, neodymium, and scandium, or a nitride film; A laminated structure in which chemical films are laminated can be used.

[0309] Alternatively, a light-transmitting conductive material containing indium oxide, tin oxide, or zinc oxide may be used. good.

[0310] <Modifications of the Display> Various transistors can be applied to the display 501.

[0311] A configuration in which a bottom gate transistor is applied to the display portion 501 is shown in FIG. This is illustrated in FIG. 15(B).

[0312] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is shown in FIG. The present invention can be applied to the transistors 502t and 503t.

[0313] For example, a semiconductor layer containing polycrystalline silicon crystallized by a process such as laser annealing. is applied to the transistor 502t and the transistor 503t shown in FIG. It is possible.

[0314] A configuration in which a top-gate transistor is applied to the display portion 501 is shown in FIG. Illustrated.

[0315] For example, polycrystalline silicon or a single crystal silicon film transferred from a single crystal silicon substrate, etc. The semiconductor layer including the transistor 502t and the transistor 502t shown in FIG. Can be applied to 03t.

[0316] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0317] (Embodiment 5) In this embodiment, a detection element that can be used for the detection unit of the input / output device of one embodiment of the present invention is described. The configuration and driving method of the sensing circuit will be described with reference to FIG.

[0318] FIG. 16 illustrates the configuration and driving method of the detection circuit 19 and the converter CONV according to one embodiment of the present invention. This is an explanatory diagram.

[0319] FIG. 16(A) is a circuit diagram illustrating the configuration of the detection circuit 19 and the converter CONV according to one embodiment of the present invention. 16(B-1) and 16(B-2) are timing diagrams for explaining the driving method. This is a chart.

[0320] In one embodiment of the present invention, the detection circuit 19 has a gate electrically connected to the first electrode 21 of the detection element C. The first electrode is electrically connected to a wiring VPI that can supply a ground potential, for example. The first transistor M1 is connected to the first gate of the power supply (see FIG. 16(A)).

[0321] The gate is electrically connected to a scanning line G1 that can supply a selection signal. The electrode is electrically connected to the second electrode of the first transistor M1, and the second electrode is, for example, a detection a second transistor electrically connected to a signal line DL capable of supplying a detection signal DATA; The configuration may include a station M2.

[0322] The gate is electrically connected to a wiring RES that can supply a reset signal. The first electrode is electrically connected to the first electrode 21 of the sensing element C, and the second electrode is connected to, for example, a ground potential. a third transistor M3 electrically connected to a wiring VRES that can supply a voltage; It may be configured to include:

[0323] The capacitance of the sensing element C increases when an object comes close to the first electrode 21 or the second electrode 22, for example. or the distance between the first electrode 21 and the second electrode 22 changes. As a result, the detector 20B supplies a detection signal DATA based on the change in capacitance of the detector element C. It is possible.

[0324] Also, the detector 20B is configured to generate a control signal capable of controlling the potential of the second electrode of the detector element C. The wiring CS is provided to supply

[0325] The first electrode 21 of the detection element C, the gate of the first transistor M1, and the third transistor M2 are connected to each other. The node to which the first electrode of the transistor is electrically connected is called node A.

[0326] The lines VRES and VPI can supply, for example, a ground potential, and the lines VPO and The wiring BR can supply, for example, a high power supply potential.

[0327] The wiring RES can supply a reset signal, and the scanning line G1 can supply a selection signal. The wiring CS supplies a control signal for controlling the potential of the second electrode 22 of the sensing element. It is possible.

[0328] The signal line DL can supply the detection signal DATA, and the terminal OUT can supply the detection signal DA A converted signal can be provided based on the TA.

[0329] In addition, various circuits that can convert the detection signal DATA and supply it to the terminal OUT are available. , can be used for the converter CONV. For example, the converter CONV can be electrically connected to the detection circuit 19. By connecting them in series, a source follower circuit or a current mirror circuit can be configured. It may be possible to do so.

[0330] Specifically, a converter CONV using a transistor M4 is used to create a source follower circuit. It should be noted that the first to third transistors M1 to M3 can be configured as follows (see FIG. 16A). Even if a transistor that can be manufactured using the same process as transistor M3 is used for transistor M4, good.

[0331] The transistors M1 to M3 each include a semiconductor layer. A compound semiconductor or an oxide semiconductor can be used for the semiconductor layer. Semiconductors containing gallium arsenide, semiconductors containing indium, or oxide semiconductors containing indium can be applied.

[0332] Note that the structure of a transistor in which an oxide semiconductor is used for a semiconductor layer is Explain in detail.

[0333] <Method of Driving the Detection Circuit 19> A method of driving the detection circuit 19 will be described. Step 1: In the first step, the third transistor is made conductive and then made non-conductive. A reset signal is supplied to the gate, and the potential of the first electrode of the detection element C is set to a predetermined potential ( See period T1 in Figure 16(B-1).

[0334] Specifically, the reset signal is supplied to the wiring RES. The transistor sets the potential of the node A to, for example, the ground potential (see FIG. 16A).

[0335] <Second Step> In the second step, the second transistor M2 is made conductive. A selection signal is supplied to the gate, and the second electrode of the first transistor is electrically connected to the signal line DL. To be continued.

[0336] Specifically, a selection signal is supplied to the scanning line G1. The second electrode of the first transistor M2 is electrically connected to the signal line DL (see FIG. 16). (See (B-1) Period T2).

[0337] <Third Step> In the third step, a control signal is supplied to the second electrode of the sensing element C. A potential that varies based on the control signal and the capacitance of the detection element C is applied to the first transistor M1 Supply to the gate.

[0338] Specifically, a rectangular control signal is supplied to the wiring CS. The voltage supplied to the sensing element C increases the potential of the node A based on the capacitance of the sensing element C (Fig. 16(B-1) See the second half of period T2).

[0339] For example, if the sensing element C is placed in the air, the sensing element will have a higher dielectric constant than the air. When the second electrode 22 of the sensing element C is placed close to the first electrode 22 of the sensing element C, the capacitance of the sensing element C appears to be large. do.

[0340] As a result, the change in the potential of node A caused by the rectangular control signal is The noise level is smaller than when the objects are not placed close together (see the solid line in Figure 16(B-2)). .

[0341] <<Fourth Step>> In the fourth step, the potential of the gate of the first transistor M1 is The signal resulting from the change is supplied to the signal line DL.

[0342] For example, the change in the current caused by the change in the potential of the gate of the first transistor M1 is transmitted to the signal line D Supply to L.

[0343] The converter CONV converts a change in the current flowing through the signal line DL into a change in voltage and supplies it.

[0344] <<Fifth Step>> In the fifth step, a selection is made to make the second transistor non-conductive. A select signal is supplied to the gate.

[0345] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0346] (Sixth embodiment) In this embodiment, a laminated lithium ion secondary battery is manufactured using a film as an exterior body. The stacked lithium ion secondary battery is manufactured as shown in FIG. This is equivalent to Lee 117.

[0347] First, a sheet made of a flexible substrate is prepared. The sheet is a laminate, and the metal film is The adhesive layer (also called a heat seal layer) is used on one or both sides. The adhesive layer is a heat-sealable resin film containing polypropylene, polyethylene, etc. In this embodiment, the sheet has a nylon resin on the surface of an aluminum foil, The back of the foil is made of acid-resistant polypropylene film and the metal foil is laminated with polypropylene film. A sheet is used, and the sheet is cut to prepare a film 31 shown in FIG.

[0348] Then, the film 31 is embossed to form irregularities on the film surface, and the film is visually recognized. In this case, the sheet is cut and then embossed. The following example shows the order in which the sheet is embossed before being cut, and then Alternatively, the sheet may be cut after being folded and thermocompressed.

[0349] Embossing is a type of press processing, in which an embossing roll with an uneven surface is used. The embossing roll is pressed against the film to form irregularities on the film surface that correspond to the irregularities of the embossing roll. The embossing roll is a roll with a pattern engraved on its surface. The use of an embossing roll is not limited to an embossing roll, and an embossing plate may also be used. The method is not limited to embossing, and it is sufficient to form a relief on a part of the film.

[0350] In this embodiment, the film 31 is provided with a pattern by providing concaves and convexes on both sides thereof, and the film 31 is Fold it in the middle, overlap the two corners that sandwich the bent part, and seal the three sides with an adhesive layer. The structure will be as follows.

[0351] Next, the film 31 is folded to the state shown in FIG. 19(A).

[0352] As shown in FIG. 19(B), the secondary battery is made up of a positive electrode current collector 32, a separator 33, The positive electrode current collector 32 and the negative electrode current collector 34 are stacked. The current collectors are stainless steel, gold, platinum, zinc, iron, nickel, copper, aluminum, and titanium. Metals such as tantalum and tantalum alloys, which are highly conductive and are carriers of lithium, etc. Materials that do not alloy with ions can be used. Also, silicon, titanium, neodymium, Aluminum alloys with added elements such as scandium and molybdenum that improve heat resistance Alternatively, a metal element that reacts with silicon to form silicide can be used. The metal element that reacts with silicon to form silicide is zirconium. , titanium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten The current collectors are available in foil, plate (sheet), mesh, Shapes such as cylindrical, coil, punched metal, and expanded metal can be used as appropriate. It is preferable to use a current collector having a thickness of 10 μm or more and 30 μm or less. For the sake of simplicity, the total area of ​​the positive electrode current collector 32, the separator 33, and the negative electrode current collector 34 is Although an example of combining layers into one and storing them in an exterior body has been shown, it is possible to increase the capacity of the secondary battery. In order to achieve this, multiple combinations are stacked and housed in an exterior body. 3 may be used by folding or in a bag shape.

[0353] Then, two lead electrodes 36 having a sealing layer 35 shown in FIG. 19(C) are prepared. The electrode 36 is also called a lead terminal, and is used to connect the positive or negative electrode of the secondary battery to the outside of the exterior film. It is provided to give out.

[0354] Then, one lead electrode and the protruding portion of the positive electrode current collector 32 are electrically connected by ultrasonic welding or the like. Then, the other lead electrode and the protruding portion of the negative electrode current collector 34 are connected by ultrasonic welding or the like. This provides electrical connection.

[0355] Then, two sides of the film 31 are heat-pressed to leave one side for the electrolyte. During the thermocompression bonding, the sealing layer 35 provided on the lead terminal also melts, forming a seal with the lead terminal. The film 31 is fixed between the film 31 and the substrate 30. Then, the desired A quantity of electrolyte is dropped onto the inside of the bag-shaped film 31. Finally, the film is heat-pressed. The remaining edge of the film is sealed by thermocompression bonding.

[0356] In this way, the secondary battery 40 shown in FIG. 19(D) can be fabricated.

[0357] The obtained secondary battery 40 has a pattern with projections and depressions on the surface of the film 31 that serves as the exterior body. In addition, the area of ​​the dotted line and the end face in FIG. 19(D) is the thermocompression bonding area 37, and The surface has a pattern with concaves and convexes. The concaves and convexes in the thermocompression bonded area 37 are smaller than those in the central area. It can relieve the stress that is applied when the secondary battery is bent. By using a structure that cushions the battery, when the secondary battery is bent or deformed (such as when the exterior body is ) Long-term reliability can be ensured without damage.

[0358] FIG. 19(E) shows an example of a cross section taken along the chain line AB in FIG. 19(D).

[0359] As shown in FIG. 19(E), the unevenness of the film 31 is such that the area overlapping with the positive electrode current collector 32 and the area overlapping with the heat 19(E), the positive electrode current collector 32, the positive electrode active material The negative electrode active material layer 38, the separator 33, the negative electrode active material layer 39, and the negative electrode current collector 34 are stacked in this order. The film is sandwiched between folded films 31 and further sealed at the edges with adhesive layers 41. The other space contains an electrolyte 42 .

[0360] Examples of the positive electrode active material used in the positive electrode active material layer 38 include composite oxides having an olivine-type crystal structure, a layered rock salt-type crystal structure, or a spinel-type crystal structure. As the positive electrode active material, for example, compounds such as LiFeO2, LiCoO2, LiNiO2, LiMn2O4, V2O5, Cr2 O5, and MnO2 are used. [[ID=&]]

[0361] Alternatively, a composite material (general formula LiMPO4 (M is one or more of Fe(II), Mn(II), Co(II), Ni(II))) can be used. Representative examples of the general formula LiMPO4 include LiFePO4, LiNiPO4, LiCoPO4, LiMnPO4, LiFe a a Ni b PO4, LiFe a Co b PO4, LiFe a Mn b PO4, LiNi a Co b PO4, LiNi a Mn b PO4 (a + b is 1 or less, 0 < a < 1, 0 < b < 1), LiF e c Ni d Co e PO4, LiFe c Ni<000​​​​​​​​​​​​​​​​​​​​​​​​​​ Or, the general formula Li (2-j) MSiO4 (M is Fe(II), Mn(II), Co( A composite material such as one or more of Ni(II), Ni(II), 0≦j≦2) can be used. Formula Li (2-j) A typical example of MSiO4 is Li (2-j) FeSiO4, Li (2 -j) NiSiO4, Li (2-j) CoSiO4, Li (2-j) MnSiO4, Li (2-j) Fe k Ni l SiO4, Li (2-j) Fe k Co l SiO4, Li (2-j ) Fe k Mn l SiO4, Li (2-j) Ni k Co l SiO4, Li (2-j) Ni k Mn l SiO4 (k+l is 1 or less, 0 <k<1、0<l<1)、Li (2-j) Fe m N i n Co q SiO4, Li (2-j) Fe m Ni n Mn q SiO4, Li (2-j) Ni m Co n Mn q SiO4 (m+n+q is 1 or less, 0 <m<1、0<n<1、0<q<1) , Li (2-j) Fe r Ni s Co t Mn u SiO4 (r+s+t+u is less than 1, 0 <r <1. Lithium compounds such as 0 < s < 1, 0 < t < 1, 0 < u < 1 can be used as materials. This is possible.

[0363] Also, as the positive electrode active material, A x M2(XO4)3 (A = Li, Na, Mg, M = Fe, M n, Ti, V, Nb, Al, X = S, P, Mo, W, As, Si) represented by the general formula can be used. As the NASICON-type compound, there are Fe2(MnO4) 3, Fe2(SO4)3, Li3Fe2(PO4)3, etc. Also, as the positive electrode active material Li2MPO4F, Li2MP2O7, Li5MO4 (M = Fe, Mn) represented by the general formula compounds, perovskite-type fluorides such as NaFeF3, FeF3, metal chalcogenides (sulfides, selenides, tellurides) such as TiS2, Mo S2, oxides having an inverse spinel-type crystal structure such as LiMVO4, vanadium oxide-based (V2O5, V6O LiV3O8, etc.), manganese oxides, organic sulfur compounds, etc. can be used as materials. <00023​​​​​​​​​​​​​​​​​​​​​​​​The electrolytic solution 42 uses a material having carrier ions as an electrolyte. Typical examples of the electrolyte include: Examples include LiPF6, LiClO4, LiAsF6, LiBF4, LiCF3SO3, and Li These include lithium salts such as Li(CF3SO2)2N and Li(C2F5SO2)2N. The electrolyte may be used alone or in any combination and ratio of two or more. good.

[0367] In addition, the carrier ions are alkali metal ions other than lithium ions, alkaline earth metal ions, etc. In the case of metal ions, the electrolyte is an alkali metal ion instead of lithium in the above lithium salt. alkali metals (e.g., sodium and potassium), alkaline earth metals (e.g., calcium, Strontium, barium, beryllium, magnesium, etc.) may also be used.

[0368] The solvent of the electrolyte is a material that allows carrier ions to be transported. As the solvent, an aprotic organic solvent is preferred. Representative examples of the aprotic organic solvent include: Ethylene carbonate (EC), propylene carbonate, dimethyl carbonate, diene Diethyl carbonate (DEC), γ-butyrolactone, acetonitrile, dimethoxyethane , tetrahydrofuran, etc., and one or more of these can be used. By using a polymer material that gels as a solvent for the electrolyte, safety against leakage etc. is improved. Furthermore, it is possible to make the storage battery thinner and lighter. Representative polymer materials that can be gelled are Examples include silicone gel, acrylic gel, acrylonitrile gel, polyethylene oxide There are also other materials such as polypropylene oxide, fluorine-based polymers, etc. In order to achieve this, one or more ionic liquids (room-temperature molten salts) that are flame-retardant and non-volatile are used. Even if the internal temperature of the battery rises due to an internal short circuit or overcharging, the battery will not explode or catch fire. Ionic liquids are salts in a fluid state, and the ionic mobility Ionic liquids have high conductivity. Ionic liquids contain cations and anions. For example, ionic liquids containing ethylmethylimidazolium (EMI) cations or N-methylimidazolium (N-methylimidazolium) cations are used. PP 13 ) cation-containing ionic liquids.

[0369] In addition, instead of the electrolyte solution, solid electrolytes containing inorganic materials such as sulfides and oxides, and P A solid electrolyte containing a polymer material such as EO (polyethylene oxide) can be used. When a solid electrolyte is used, there is no need to install a separator or spacer. Since the entire pond can be solidified, there is no risk of leakage, dramatically improving safety.

[0370] The negative electrode active material of the negative electrode active material layer 39 may be formed by dissolving and depositing lithium or by depositing lithium ions. Materials that allow insertion and desorption of ions can be used, such as lithium metal, carbon-based materials, and alloy-based materials. Materials etc. can be used.

[0371] Lithium metal has a low oxidation-reduction potential (-3.045 V vs. the standard hydrogen electrode) and is lightweight and and high specific capacity per volume (3860mAh / g and 2062mAh / cm, respectively) 3 ) is therefore preferable.

[0372] Carbon materials include graphite, easily graphitizable carbon (soft carbon), and non-graphitizable carbon (hard carbon). Examples include carbon nanotubes, graphene, and carbon black.

[0373] Graphite includes mesocarbon microbeads (MCMB), coke-based artificial graphite, and pitch. These include artificial graphite such as spheroidized artificial graphite, and natural graphite such as spheroidized natural graphite.

[0374] When lithium ions are inserted into graphite (when lithium-graphite intercalation compounds are formed), It exhibits a potential as low as that of lithium metal (0.1 to 0.3 V vs. Li / Li + ).child This allows lithium-ion secondary batteries to exhibit high operating voltages. , relatively high capacity per unit volume, small volume expansion, inexpensive, and comparable to lithium metal This is preferable because it has advantages such as higher safety compared to the conventional method.

[0375] As a negative electrode active material, it is possible to carry out charge-discharge reactions by alloying and dealloying reactions with lithium. When the carrier ion is a lithium ion, the material can be Examples include Al, Si, Ge, Sn, Pb, Sb, Bi, Ag, Au, Zn, Cd, There are materials containing at least one of In, Ga, etc. These elements have low affinity to carbon. The amount is large, and silicon in particular has a dramatically high theoretical capacity of 4200mAh / g. It is preferable to use silicon as the negative electrode active material. Materials using such an element include: For example, Mg2Si, Mg2Ge, Mg2Sn, SnS2, V2Sn3, FeSn2, C oSn2, Ni3Sn2, Cu6Sn5, Ag3Sn, Ag3Sb, Ni2MnSb, C eSb3, LaSn3, La3Co2Sn7, CoSb3, InSb, SbSn, etc. .

[0376] In addition, as the negative electrode active material, SiO, SnO, SnO2, titanium oxide (TiO2, etc.), lithium Sodium titanium oxide (Li4Ti5O 12 etc.), lithium-graphite intercalation compounds, (Li x C6 etc.), niobium oxide (Nb2O5 etc.), tungsten oxide (WO2 etc.), molybdenum oxide ( Oxides such as MoO2 can be used.

[0377] In addition, the negative electrode active material is a composite nitride of lithium and transition metals, which has a Li3N structure. Li 3-x M x N (M=Co, Ni, Cu) can be used. For example, Li 2.6 Co 0.4 N3 has a large charge / discharge capacity (900mAh / g, 1890mAh / cm 3 ) And preferable.

[0378] When a composite nitride of lithium and a transition metal is used, the negative electrode active material contains lithium ions, The positive electrode active material is a combination of materials such as V2O5 and Cr3O8 that do not contain lithium ions. It is preferable that a material containing lithium ions is used as the positive electrode active material. By first removing the lithium ions contained in the positive electrode active material, As the lithium-transition metal nitride, a complex nitride of lithium and a transition metal can be used.

[0379] In addition, a material that undergoes a conversion reaction can also be used as the negative electrode active material. , cobalt oxide (CoO), nickel oxide (NiO), iron oxide (FeO), etc. A transition metal oxide that does not undergo an alloying reaction with the negative electrode active material may be used. Further materials that undergo a reaction include Fe2O3, CuO, Cu2O, RuO2, and Cr2O Third order oxide, CoS0.89 , NiS, CuS and other sulfides, Zn3N2, Cu3N, G Nitrides such as e3N4, phosphides such as NiP2, FeP2, CoP3, FeF3, BiF3 This also occurs with fluorides such as those mentioned above. Since the potential of the fluorides is high, they are not suitable for use as positive electrode active materials. That's fine.

[0380] In addition to the above-mentioned negative electrode active material, the negative electrode active material layer 39 contains a material for improving the adhesion of the active material. The negative electrode active material layer 39 may contain a binder, a conductive additive for increasing the conductivity of the negative electrode active material layer 39, and the like. stomach.

[0381] The secondary battery is configured such that, for example, the thickness of the separator 33 is about 25 μm, and the thickness of the positive electrode current collector 32 is about 2 0 μm or more and about 40 μm or less, the positive electrode active material layer 38 is about 100 μm, and the negative electrode active material layer 39 is about 1 The thickness of the film 31 is 00 μm, and the thickness of the negative electrode current collector 34 is about 20 μm or more and about 40 μm or less. The thickness is 0.113 mm. Note that the adhesive layer 41 is only partially shown in FIG. 19(E). Although the film is not heat-sealed, a polypropylene layer is provided on the surface of the film 31. Only the adhered portion becomes the adhesive layer 41.

[0382] FIG. 19(E) shows an example in which the lower side of the film 31 is fixed and pressed. In this case, the upper side is bent significantly, forming a step. When multiple combinations of the above laminated layers are provided between the layers, for example, eight or more, the step becomes large. This may cause excessive stress on the upper film 31. There is also a risk of the edge of the film becoming misaligned with the edge of the lower film. To prevent misalignment of the surface, a step is also provided on the lower film, and the thermocompression bonding area 37 is The pressure may be applied so that the pressure is applied to the center in the thickness direction, thereby equalizing the stress.

[0383] Here, the flow of current during charging of the secondary battery will be explained using FIG. 19(F). When a secondary battery is considered as a closed circuit, the movement of lithium ions and the flow of current are in the same direction. In secondary batteries that use lithium, the anode and cathode are connected by charging and discharging. The cathode (electrode) is switched, and the oxidation reaction and reduction reaction are switched. The electrode with a higher reaction potential is called the positive electrode, and the electrode with a lower reaction potential is called the negative electrode. In this case, even during charging, discharging, or when a reverse pulse current is applied, Even when an electric current flows through the positive electrode, it is called the "positive electrode" or "+ electrode (plus electrode)" and the negative electrode is called the "negative electrode" or "-electrode (minus electrode)". When the terms anode (positive electrode) and cathode (negative electrode) are used, the difference between charging and discharging is Therefore, the anode and cathode are often used interchangeably. The term "anode" (negative electrode) is not used in this specification. When using the terms "positive electrode" or "cathode," specify whether it is charging or discharging, and It will also be noted whether it corresponds to a positive pole (positive electrode) or a negative pole (negative electrode).

[0384] A charger is connected to the two terminals shown in FIG. 19(F), and the secondary battery 40 is charged. As the charging of the battery 40 progresses, the potential difference between the electrodes increases. 0 toward the positive electrode current collector 32, and then, in the secondary battery 40, The negative electrode current collector 34 flows from the negative electrode current collector 34 to the external terminal of the secondary battery 40. The direction of the current flowing towards the positive side is the positive direction. It's exciting.

[0385] In this embodiment, an example in which the present invention is applied to a lithium ion secondary battery is shown. One embodiment of the present invention is not limited to this. Various secondary batteries, for example, lead acid batteries, lithium ion batteries, Polymer secondary battery, nickel-metal hydride battery, nickel-cadmium battery, nickel- Suitable for iron batteries, nickel-zinc batteries, silver oxide-zinc batteries, solid-state batteries, air batteries, etc. Alternatively, the present invention can be applied to various power storage devices, for example. It can also be applied to primary batteries, capacitors, lithium ion capacitors, etc.

[0386] (Embodiment 7) In this embodiment, an example that is partially different from the first embodiment is shown in FIG.

[0387] As shown in FIG. 25(A), an example is shown in which three batteries are different in size and arrangement.

[0388] FIG. 25A is a plan view showing an example of the positional relationship between the display unit 816 and each battery. There are.

[0389] The curve of the display shown by the dotted line in FIG. 25(A) is between the battery 812 and the battery 817. 25(a) is located between the battery 817 and the battery 853. A) The bending point 816d of the display unit and the hinge 813 are shown by the dotted line. The 816's display area is approximately 9.2 inches in size.

[0390] In this embodiment, the distance between the battery 817 and the battery 853 is The distance between the battery 817 and the battery 12 is wider than that between the battery 817 and the other The area is smaller than that of the battery 817. Also, the battery 853 is It is fixed to the display unit 816 with adhesive or the like, and also serves to support a part of the display unit 816. As a result, the battery 812 and the battery 817 are fixed to the display unit 816. Therefore, when the electronic device is bent, the display part is bent smoothly at the bending part 816e. In addition, the battery 853 and the battery 817 are fixed to the display unit 816. Therefore, when the electronic device is bent, it bends smoothly at the bending point 816d of the display. It can be done.

[0391] The configuration of the display unit is also different from that of the first embodiment. The display unit does not have a side roll portion. The display unit is bent at a bending point 816d to reduce its size. When the display unit is bent, the area around the bent portion 816d of the display unit becomes the side roll portion.

[0392] In addition, magnets are installed in multiple places on the housing to hold it in place when it is bent and made smaller. do.

[0393] FIG. 25(B) shows a cross section of FIG. 25(A), and when the electronic device is unfolded, each part This shows the relative positions of the positions.

[0394] This embodiment mode can be freely combined with other embodiment modes.

[0395] (Embodiment 8) In this embodiment, a touch panel that can be applied to a display panel included in an electronic device of one embodiment of the present invention is described. An example of a method for driving the panel will be described with reference to the drawings.

[0396] [Example of sensor detection method] FIG. 26(A) is a block diagram showing the configuration of a mutual capacitance type touch sensor. In (A), a pulse voltage output circuit 601 and a current detection circuit 602 are shown. In (A), an electrode 621 to which a pulse voltage is applied and an electrode 622 to which a change in current is detected are arranged. These are shown as six wires, X1-X6 and Y1-Y6, respectively. A) illustrates a capacitance 603 formed by overlapping an electrode 621 and an electrode 622. The functions of electrode 621 and electrode 622 may be interchangeable.

[0397] The pulse voltage output circuit 601 is a circuit for applying pulses to the X1-X6 wirings in order. When a pulse voltage is applied to the wirings X1-X6, the electrodes 6 forming the capacitance 603 An electric field is generated between the electrodes 21 and 622. The electric field generated between the electrodes is reduced by the capacitance 60 due to shielding or the like. This changes the mutual capacitance of the sensor 3, and is used to detect the proximity or contact of an object to be detected. It is possible.

[0398] The current detection circuit 602 detects the current flowing through the wirings Y1 to Y6 due to the change in mutual capacitance at the capacitor 603. This is a circuit for detecting changes in current. The wiring of Y1-Y6 detects the proximity of the object to be detected, or The detected current value does not change if there is no contact, but the proximity or contact of the object to be detected When the mutual capacitance decreases due to the current flowing through the resistor, a decrease in the current value is detected. This can be done using an integrating circuit or the like.

[0399] Next, FIG. 26(B) shows the input of the mutual capacitance type touch sensor shown in FIG. 26(A). The timing chart of the output waveform is shown in FIG. 26(B). In FIG. 26(B), when the object to be detected is not detected ( Two cases are shown: when the object is detected (touched) and when the object is not detected (touched). For the wiring of Y1-Y6, the waveform is shown as a voltage value corresponding to the detected current value. There are.

[0400] A pulse voltage is applied to the wires X1-X6 in order, and the The waveform in the Y6 wiring changes. When there is no proximity or contact of the object to be detected, X1-X6 The waveforms of Y1-Y6 change uniformly according to the change in the voltage of the wiring. Or, at the contact point, the current value decreases, and the corresponding voltage waveform also changes. (The arrow in Figure 26(B)).

[0401] In this way, by detecting the change in mutual capacitance, the proximity or contact of the object to be detected can be detected. It is possible.

[0402] In addition, in FIG. 26(A), a panel in which only a capacitor 603 is provided at the intersection of the wiring as a touch sensor is used. The configuration of a passive type touch sensor has been shown, but an active type with a transistor and a capacitor may also be used. The touch sensor shown in FIG. 27 is an example of a sensor included in an active type touch sensor. 1 shows an example of a capacitor circuit.

[0403] The sensor circuit includes a capacitor 603, a transistor 611, a transistor 612, and a transistor The transistor 613 has a gate to which a signal G2 is applied, and a source or A voltage VRES is applied to one of the drains, and the other is connected to one electrode of the capacitor 603 and the transistor. The transistor 611 is electrically connected to the gate of the transistor 611. One is electrically connected to one of the source and drain of the transistor 612, and the other is connected to a voltage V The transistor 612 receives a signal G2 at its gate and a signal G3 at its source or drain. The other electrode of the capacitor 603 is electrically connected to the wiring ML. can be obtained.

[0404] Next, the operation of the sensor circuit will be described. First, the signal G2 is output from the transistor 613. When a potential that turns on the transistor 611 is applied, the gate of the transistor 611 is connected to the node A potential corresponding to the voltage VRES is applied to node n. By applying a potential that turns off 613, the potential of the node n is maintained.

[0405] Next, the mutual capacitance of the capacitor 603 changes when a detected object such as a finger approaches or touches the sensor. As a result, the potential of the node n changes from VRES.

[0406] The read operation applies a potential to the signal G1 that turns on the transistor 612. The current flowing through the transistor 611 in accordance with the potential of the node n, that is, the current flowing through the wiring ML, is By detecting this current, it is possible to detect the proximity or contact of an object to be detected. can.

[0407] The transistors 611, 612, and 613 have channels It is preferable to use a transistor in which an oxide semiconductor is used for a semiconductor layer to be formed. By applying such a transistor to the transistor 613, the potential of the node n It is possible to maintain VRES for a long period of time, and the operation of supplying VRES to node n again ( This reduces the frequency of the refresh operation.

[0408] [Example of display device driving method] FIG. 28(A) is a block diagram showing an example of the configuration of a display device. indicates the gate drive circuit GD, the source drive circuit SD, and the pixel pix. ), the gate lines x_1 to x_m (m is a natural number) electrically connected to the gate drive circuit GD. ), and source lines y_1 to y_n (n is a natural number) electrically connected to the source driver circuit SD. Correspondingly, the pixels pix are assigned the codes (1,1) to (n,m).

[0409] Next, FIG. 28(B) shows the gate lines and source lines in the display device shown in FIG. 28(A). 28(B) is a timing chart of signals applied to the line. The data signal is rewritten and not rewritten. Note that periods such as blanking periods are not taken into consideration in FIG. 28(B).

[0410] When rewriting the data signal every frame period, the gate lines x_1 to x_m are During the horizontal scanning period 1H, when the scanning signal is at H level, A data signal D is applied to the source lines y_1 to y_n of the columns.

[0411] If the data signal is not rewritten every frame, the In the horizontal scanning period 1H, the scanning signal applied to the source lines y_1 to y_n of each column is stopped. Stop the data signal from being transmitted.

[0412] A driving method that does not rewrite data signals for each frame period is particularly This is particularly effective when an oxide semiconductor is used as the semiconductor layer in which the channel is formed as a transistor. A transistor using an oxide semiconductor is different from a transistor using a semiconductor such as silicon. It is possible to make the off-state current extremely small compared to that of a transistor. To retain the data written in the previous period without rewriting the data signal every time For example, the gradation of a pixel can be maintained for 1 second or more, preferably 5 seconds or more. do.

[0413] [Example of display device and touch sensor driving method] 29(A) to (D) show an example of the touch sensor described in FIG. 26(A) and (B). When the display device described in FIGS. 28(A) and 28(B) is driven for 1 second, 29A is a diagram illustrating the operation of a display device during successive frame periods. The frame period of the touch sensor is set to 16.7 ms (frame frequency: 60 Hz). The frame period is set to 16.7 ms (frame frequency: 60 Hz). .

[0414] In the touch panel of this embodiment, the operations of the display device and the touch sensor are independent of each other. Therefore, the touch detection period can be set in parallel with the display period. As shown in the figure, one frame period of both the display device and the touch sensor is set to 16.7 ms (frame The frame frequency of the touch sensor and the display device can be set to 60Hz. For example, as shown in FIG. 29B, in one frame period of the display device, is set to 8.3 ms (frame frequency: 120 Hz), and one frame period of the touch sensor It is also possible to set the frame rate to 16.7 ms (frame frequency: 60 Hz). The frame frequency of the display device may be set to 33.3 ms (frame frequency: 30 Hz). .

[0415] The display device is also configured to be switchable in frame frequency, so that the frame rate can be adjusted when displaying moving images. Increase the frame rate (for example, 60Hz or higher or 120Hz or higher) to minimize the effect of static image display. In this case, reduce the frame frequency (for example, 60Hz or less, 30Hz or less, or 1Hz or less). ) can reduce the power consumption of the display device. The frequency can be switched between standby and when a touch is detected. They may be different.

[0416] The touch panel of the present embodiment also allows rewriting of data signals in the display device. By retaining the data rewritten in the previous period without performing this, one frame period can be extended to 16.7m. Therefore, as shown in FIG. 29(C), The frame period is set to 1 sec. (frame frequency: 1 Hz), and the touch sensor The frame period can also be set to 16.7 ms (frame frequency: 60 Hz).

[0417] Furthermore, when the touch panel of this embodiment is driven as shown in FIG. 29(C), Therefore, as shown in FIG. 29(D), the touch sensor can be driven continuously. When the touch sensor detects the proximity or contact of an object to be detected, the data on the display device is It is also possible to rewrite the data signal.

[0418] Here, the data signal of the display device is rewritten during the sensing period of the touch sensor. When the display device is driven, noise is transmitted to the touch sensor, causing the Therefore, it is necessary to rewrite the data signal of the display device. It is preferable to drive the touch sensor so that the period is shifted from the sensing period of the touch sensor.

[0419] In FIG. 30(A), the rewriting of the data signal of the display device and the sensing of the touch sensor are performed. 30B shows an example in which the rewriting of the data signal of the display device is performed alternately. This example shows that the touch sensor performs sensing once for every two touch actions. This is not limited to this, but the touch sensor sensing is performed once every three or more rewrite operations. The following configuration may also be used.

[0420] In addition, a transistor used in a pixel of a display device may have an oxide layer in a semiconductor in which a channel is formed. When a nitride semiconductor is used, the off-state current can be reduced significantly, making it possible to write data signals. Specifically, the frequency of data signal rewriting can be reduced. After the data signal is written, a sufficiently long pause can be provided before the next data signal is rewritten. The pause period can be, for example, 0.5 seconds or more, 1 second or more, or 5 seconds or more. The upper limit of the pause period depends on the capacitance connected to the transistor and the leakage current of the display element, etc. For example, it may be limited to 1 minute or less, 10 minutes or less, 1 hour or less, or 1 day or less. It is possible.

[0421] FIG. 30(C) shows an example in which the data signal of the display device is rewritten once every five seconds. In FIG. 30(C), the display device rewrites the data signal and then writes the next data signal. A pause period is provided during which the operation is stopped until the rewrite operation. The touch sensor operates at a frame frequency of iHz (i is the frame frequency of the display device or higher, here 0 As shown in Figure 30(C), the touch sensor The sensing is performed during the rest period and not during the period when the data signal of the display device is rewritten. This is preferable because it is possible to improve the sensitivity of the touch sensor. As shown in the figure, the data signal of the display device is rewritten and the touch sensor is sensed at the same time. This allows the driving signals to be simplified.

[0422] In addition, during the pause period when the data signal of the display device is not rewritten, the signal to the drive circuit is It is possible to stop the supply of only the signal, or to stop the supply of the power supply potential in addition to this. Power consumption can be reduced.

[0423] The touch panel described in this embodiment mode is, for example, a display device and a touch panel provided on two flexible substrates. The touch sensor is sandwiched between the display device and the touch sensor, and the distance between the display device and the touch sensor is extremely short. At this time, noise generated when the display device is driven is easily transmitted to the touch sensor, Although there is a risk that the sensitivity of the touch sensor may decrease, the driving method exemplified in this embodiment is By using this technology, it is possible to realize a touch panel that is both thin and has high detection sensitivity.

[0424] (Embodiment 9) In this embodiment, a touch panel that can be applied to a display panel included in an electronic device of one embodiment of the present invention is described. An example of the panel configuration and driving method will be described with reference to the drawings.

[0425] [Touch panel configuration] FIG. 31 is a block diagram showing an example of the configuration of a touch panel to be exemplified below. As shown in the figure, the touch panel 90 includes a display device 900, a control circuit 910, a counter circuit 920, It has a touch sensor 950.

[0426] The touch panel 90 receives an image signal (Video) which is digital data, and a display device. A synchronization signal (SYNC) is input to control the rewriting of the screen of the device 900. Examples of signals include a horizontal synchronization signal (Hsync), a vertical synchronization signal (Vsync), and There is a reference clock signal (CLK), etc.

[0427] The display device 900 includes a display unit 901, a gate driver 902, and a source driver 903. The display unit 901 has a plurality of pixels PIX. The pixels PIX in the same row are shared The pixels PIX in the same column are connected to the gate driver 902 by the gate line L_X. It is connected to the source driver 903 by a source line L_Y.

[0428] The display device 900 includes a high-level voltage (VH), a low-level voltage (VL), and a power supply. High power supply voltage (VDD) and low power supply voltage (VSS) are supplied as voltages. The voltage (hereinafter referred to as VH) is supplied to each pixel PIX of the display unit 901 via a line L_H. A low level voltage (hereinafter referred to as VL) is supplied to the display via a line L_L. The signal is supplied to each pixel PIX of the unit 901.

[0429] The source driver 903 processes the input image signal, generates a data signal, and outputs the source signal. The gate driver 902 outputs a data signal to the line L_Y. A scanning signal for selecting the pixel PIX is output to the gate line L_X.

[0430] The pixel PIX is a switch whose electrical connection with the source line L_Y is controlled by a scanning signal. When the switching element is turned on, a current flows from the source line L_Y to the pixel PIX. The data signal is written.

[0431] The control circuit 910 is a circuit for controlling the entire touch panel 90. It includes a circuit for generating control signals for the constituent circuits.

[0432] The control circuit 910 controls the gate driver 902 and the source driver 903 in response to a synchronization signal (SYNC). The gate driver 902 has a control signal generating circuit that generates a control signal for the gate driver 903. The control signals include a start pulse (GSP) and a clock signal (GCLK). The control signals for the switch driver 903 include a start pulse (SSP), a clock signal (SCL For example, the control circuit 910 may generate clock signals (GCLK, SCLK) , generate multiple clock signals with the same period but shifted phases.

[0433] The control circuit 910 also receives an image signal (Video ) to the source driver 903.

[0434] The control circuit 910 also controls the sensor signal (S_touch) input from the touch sensor 950. ch) is input, and the image signal is corrected according to the sensor signal. Although it differs depending on the sensor signal, image processing according to the touch is performed.

[0435] The source driver 903 is connected to a digital / analog conversion circuit 904 (hereinafter referred to as a DA conversion circuit The DA conversion circuit converts the image signal into an analog signal, and converts it into a data signal. Generate.

[0436] If the image signal input to the touch panel 90 is an analog signal, the control circuit The signal is converted into a digital signal at 910 and output to the display device 900 .

[0437] The image signal is made up of image data for each frame. The control circuit 910 processes the image data. Based on the information obtained by this processing, the output of the image signal to the source driver 903 is controlled. Therefore, the control circuit 910 processes the image data to generate a frame image. The motion detector 911 detects motion from image data for each object. In this case, the image signal is corrected based on the image data according to the sensor signal. .

[0438] When the motion detector 911 determines that there is motion, the control circuit 910 On the other hand, if it is determined that there is no movement, the control circuit 910 stops the output of the image signal to the source driver 903. If there is any movement again, If so, the output of the image signal is resumed.

[0439] The control circuit 910 determines whether or not a moving image is displayed (moving image display) based on the determination of the motion detection unit 911. The first mode is for displaying a still image (a moving image), and the second mode is for displaying a still image (a moving image). The display on the display unit 901 can be controlled by switching between two modes. For example, if the vertical synchronization signal (Vsync) is 60Hz, the frame frequency must be set to 60Hz or less. The second mode is a mode in which the vertical synchronization signal (Vsync) is 60 Hz, this is a mode in which the frame frequency is less than 60 Hz.

[0440] In the second mode, the frame frequency is set in advance according to the voltage holding characteristics of the pixel. For example, if the motion detection unit 911 determines that there is no motion for a certain period of time, When the output of the image signal to the source driver 903 is stopped, the pixel PIX is written. Therefore, the voltage corresponding to the gradation of the image signal will decrease. The voltage corresponding to the gray level is written at each frame frequency period (also called refresh). It is desirable to perform this refresh timing (also known as the refresh rate). For example, the counter circuit 920 counts the H level of the vertical synchronization signal (Vsync) The configuration may be such that the process is carried out at regular intervals based on the number of users (obtained by counting).

[0441] When the refresh rate is set to once per second by the counter circuit 920, If the frequency of the vertical sync signal (Vsync) is 60Hz, Based on the count signal (Count) obtained by counting the H level 60 times, the refresh If the refresh rate is set to once every 5 seconds, the vertical sync signal If the frequency of the vertical sync signal (Vsync) is 60Hz, The refresh rate is calculated based on the count signal (Count) obtained by counting the bell 300 times. The counter circuit 920 may also receive a sensor signal from the touch sensor 950. When a signal is input, the second mode is forcibly changed to the first mode in response to the sensor signal. A switchable configuration may also be used.

[0442] There are no particular restrictions on the image processing for motion detection performed by the motion detection unit 911. For example, a motion detection method may be to use the difference between image data of two consecutive frames. There is a way to obtain minute data. The difference data obtained can be used to determine whether there is movement or not. There are also methods for detecting motion vectors.

[0443] The touch sensor 950 can apply the operation and structure described in the above embodiment. do.

[0444] In this embodiment, the operation of the display device and the operation of the touch sensor 950 are independent of each other. Therefore, the touch sensing period can be set in parallel with the display period. Therefore, even if the control circuit 910 is configured to switch between the first mode and the second mode, The operation of the display device 900 and the touch sensor 95 can be controlled independently. 0, and the rewriting operation of the data signal of the display device 900 and the touch sensor 950 are synchronized. By performing the sensing operations at different periods, the sensitivity of the sensing can be increased.

[0445] [Pixel configuration example] 32A is a circuit diagram showing an example of the configuration of a pixel PIX. It includes TR1, a transistor TR2, a light-emitting element EL, and a capacitive element Cap.

[0446] The transistor TR1 is electrically connected between the source line L_Y and the gate of the transistor TR1. It functions as a switching element that controls the The transistor TR2 is a transistor for controlling the current flowing through the light emitting element EL. It functions as a switching element.

[0447] The transistors TR1 and TR2 have semiconductors in which channels are formed. It is preferable to use an oxide semiconductor.

[0448] The light-emitting element EL has an EL layer containing a light-emitting organic compound sandwiched between two electrodes. The brightness of the light emitted from the light-emitting element changes depending on the current flowing between the two electrodes. One electrode of the transistor is supplied with a low-level voltage from the wiring L_L, and the other electrode is supplied with a low-level voltage from the transistor A high-level voltage is applied from the line L_H via TR2.

[0449] The capacitance element Cap has a function of holding the potential of the gate of the transistor TR2.

[0450] FIG. 32(B) shows an example of a pixel PIX having a liquid crystal element. It has a capacitor TR, a liquid crystal element LC, and a capacitance element Cap.

[0451] The transistor TR is a switch that controls the electrical connection between the liquid crystal element LC and the source line L_Y. The gate of the gate electrode is controlled to be on or off by a scanning signal input from the gate electrode.

[0452] Note that an oxide semiconductor is used as a semiconductor in which a channel is formed in the transistor TR. It is preferable.

[0453] The liquid crystal element LC has two electrodes and liquid crystal. The liquid crystal is induced by the action of an electric field between these two electrodes. The orientation changes depending on the application of the transistor TR. The electrode connected to the source line L_Y corresponds to the pixel electrode, and the electrode to which Vcom is applied corresponds to the pixel electrode. It corresponds to the common line L_com.

[0454] The capacitance element Cap is connected in parallel with the liquid crystal element LC. The electrode corresponds to the electrode connected to the source or drain of the transistor TR, and the other electrode of the capacitance element The electrode corresponds to the capacitance line L_cap to which the capacitance line voltage is applied.

[0455] Here, examples in which a liquid crystal element LC or a light-emitting element EL is used as a display element will be described. However, one aspect of the present invention is not limited thereto.

[0456] For example, in this specification, a display element, a display device which is a device having a display element, a light-emitting device, A light-emitting device, which is a device having an element and a light-emitting element, can be used in various forms or in various The display element, the display device, the light-emitting element or the light-emitting device can have, for example, EL (electroluminescence) elements (EL elements containing organic and inorganic materials, organic EL elements) LEDs (white LEDs, red LEDs, green LEDs, blue LEDs, etc.) , transistors (transistors that emit light according to current), electron-emitting devices, liquid crystal devices, electrons Ink, electrophoretic element, grating light valve (GLV), plasma display (PDP), display element using MEMS (microelectromechanical systems) Digital Micromirror Device (DMD), DMS (Digital MicroShutter) MIRASOL (registered trademark), IMOD (Interference Modulation shutter-type MEMS display elements, optical interference-type MEMS display elements, Using electrowetting elements, piezoelectric ceramic displays, and carbon nanotubes In addition to these, it has at least one of an electric or magnetic display element. The display medium has a contrast, brightness, reflectance, transmittance, etc. that change depending on the effect. An example of a display device using an EL element is an EL display. An example of a display device using emission elements is a field emission display (FE D) or SED type flat panel display (SED: Surface-conductive n Electron-emitter Display) etc. An example of such a display device is a liquid crystal display (transmissive liquid crystal display, semi-transmissive liquid crystal display, etc.). Displays, reflective LCD displays, direct-view LCD displays, projection LCD displays An example of a display device using electronic ink or electrophoretic elements is the There are also semi-transmissive and reflective LCD displays. In this case, a part or all of the pixel electrodes should be arranged to function as a reflective electrode. For example, a part or the whole of the pixel electrode may contain aluminum, silver, etc. Furthermore, in this case, a memory circuit such as an SRAM should be installed under the reflective electrode. This makes it possible to further reduce power consumption.

[0457] For example, in this specification, an active matrix type having active elements in pixels, or Alternatively, a passive matrix system in which pixels do not have active elements can be used.

[0458] In the active matrix system, the active element (active element, nonlinear element) is a transistor. By using not only transistors but also various active elements (active elements, nonlinear elements), For example, MIM (Metal Insulator Metal) or T It is also possible to use FD (Thin Film Diode) and other elements. Since the number of manufacturing steps is small, it is possible to reduce manufacturing costs and improve yields. Alternatively, these elements can improve the aperture ratio due to their small size. This makes it possible to achieve low power consumption and high brightness.

[0459] Other than the active matrix type, active elements (active elements, nonlinear elements) It is also possible to use a passive matrix type that does not use active elements (active elements). Since it does not use any nonlinear elements, there are fewer manufacturing steps, which reduces manufacturing costs and improves yield. Alternatively, active elements (active elements, non-linear elements) can be used. Since the aperture ratio is not increased, it is possible to achieve low power consumption or high brightness. This can be done.

[0460] [Touch panel driving method example] Hereinafter, the first mode for displaying moving images and the second mode for displaying still images will be explained with reference to the timing chart shown in FIG. The operation of the touch panel 90 for displaying in the second mode for displaying still images will now be described. 3, a vertical synchronization signal (Vsync) and a source line L_Y from the source driver 903 1 shows the signal waveform of the data signal (Vdata) output to

[0461] As an example, FIG. 33 shows a case where a moving image is displayed, then a still image is displayed, and then a moving image is displayed again. 1 is a timing chart of the touch panel 90. Here, the timing chart for the first k frames is Assume that there is motion in the image data. Next, from the (k+1)th frame to the (k+3)th frame Assume that there is no movement in the image data up to the (k+4)th frame. Assume that there is movement in k, where k is an integer greater than or equal to 2.

[0462] During the first moving image display period, the motion detector 911 detects motion in the image data of each frame. Therefore, the touch panel 90 operates in the first mode. In 10, the frame frequency is set to be equal to or higher than the vertical sync signal frequency, here frame frequency f1. Then, the image signal (Video) is output to the source driver 903. The output of the data signal (Vdata) to the source line L_Y is continuously performed by the output of the data signal (Vdata). The length of one frame period during the moving image display period is expressed as 1 / f1 (seconds).

[0463] Next, during the still image display period, the motion detection unit 911 performs image processing for motion detection. Therefore, it is determined that there is no movement in the image data of the (k+1)th frame. 0 operates in the second mode. The control circuit 910 controls the frame frequency to the vertical sync signal The frequency is less than the frame frequency f2 in this case, and is output to the source driver 903. The source driver 903 controls the output of the data signal (Vdata) to the source line L_Y. The length of one frame period during the still image display period is 1 / f2 (seconds) )

[0464] The source driver 903 can output the data signal (Vdata) intermittently. Therefore, the control signal (start pulse) to the gate driver 902 and the source driver 903 The gate driver 9 may also be supplied intermittently with the gate driver 9 (signal, clock signal, etc.). 02 and source driver 903 can be stopped.

[0465] In the second mode, the data signal (Vdata) is output to the intermittent source line L_Y. As an example, as shown in FIG. At this point, the control circuit 910 controls the gate driver 902 and the source driver 903. The image signal VIDE is output to the source driver 903 at a frame frequency of f2. The source driver 903 outputs the data signal (Vdata ), that is, the data signal (Vdat a) is output to the source line L_Y. In this way, during the still image display period, The input data signal (Vdata) is repeatedly applied to the source line L_Y every 1 / f2 (seconds). Therefore, the voltage corresponding to the gradation of the image signal of the same image is refreshed. By refreshing periodically, the gray scale deviation caused by the voltage drop can be prevented. This reduces flicker caused by the above and provides a touch panel with improved display quality. It is possible.

[0466] Then, in the control circuit 910, the motion detection unit 911 determines that there is motion in the image data. The system operates in the second mode until a result is obtained or a sensor signal is input.

[0467] Then, the motion detector 911 detects motion in the image data from the (k+4)th frame onwards. If it is determined that the touch panel 90 is in the first mode, the control circuit 910 operates in the first mode again. So, let's set the frame frequency to be equal to or higher than the vertical sync signal frequency, here frame frequency f1. , and outputs an image signal (Video) to the source driver 903. 03 is to continuously output the data signal (Vdata) to the source line L_Y. .

[0468] The touch panel described in this embodiment mode is, for example, a display device and a touch panel provided on two flexible substrates. The touch sensor is sandwiched between the display device and the touch sensor, and the distance between the display device and the touch sensor is extremely short. At this time, noise generated when the display device is driven is easily transmitted to the touch sensor, Although there is a risk that the sensitivity of the touch sensor may decrease, the driving method exemplified in this embodiment is By using this technology, it is possible to realize a touch panel that is both thin and has high detection sensitivity.

[0469] Note that the content (or even a part of the content) described in one embodiment may be used in conjunction with that embodiment. Other content (or even part of content) described in the above, and / or one or more other implementations The content (or part of the content) described in the form of You can do things like:

[0470] The contents described in the embodiments are explained in detail in each embodiment using various drawings. This refers to the content that is stated or the content that is stated using the text in the specification.

[0471] In addition, a drawing (or a part thereof) described in one embodiment may be different from another part of the drawing, Another figure (or a part thereof) described in the embodiment, and / or one or more By combining with the figure (or a part thereof) described in another embodiment of the present invention , and many more diagrams can be constructed.

[0472] In addition, regarding the contents not specified in the drawings or text in the specification, Alternatively, the upper limit of a certain value can be set. When a numerical range is listed, such as a lower limit, you can narrow the range arbitrarily. Or, by excluding one point within the scope, one aspect of the invention that excludes part of the scope is defined. As a result, for example, the prior art can be included within the technical scope of one aspect of the present invention. It can be stipulated that it will not be included.

[0473] As a specific example, a circuit diagram using first to fifth transistors in a circuit is shown below. In that case, the circuit does not have a sixth transistor. Alternatively, the circuit may be defined as an invention that does not have a capacitance element. Furthermore, it is possible to specify that the circuit has a specific connection structure. The invention can be configured by specifying that the semiconductor device does not have a sixth transistor. Alternatively, it is specified that the circuit does not have a capacitive element having a specific connection structure. For example, the gate of the first transistor is connected to the gate of the second transistor. It is possible to define the invention as not having a sixth transistor. Alternatively, for example, a capacitor element having a first electrode connected to the gate of the third transistor may be provided. It is possible to define the invention as not having

[0474] As another example, for a certain value, for example, "a certain voltage is 3V or more and 10V or less." In that case, for example, if a certain voltage is -2V, It is possible to specify one aspect of the invention as "excluding cases where the voltage is greater than or equal to 1 V and less than or equal to 1 V." For example, one aspect of the invention may be defined as excluding cases where a certain voltage is 13 V or higher. It is also possible to define the invention as requiring that the voltage be between 5V and 8V. It is possible to define the invention as having a voltage of approximately 9V. For example, the voltage is between 3V and 10V, but excluding the case where it is 9V. It is also possible to define an invention as follows: Even if it is stated that "it is preferable that these conditions are met" or "it is preferable that these conditions are met," , and certain values ​​are not limited to those descriptions. That is, "preferred," "preferred," etc. However, even if it is described as such, it is not necessarily limited to such description.

[0475] As another specific example, regarding a certain value, for example, "a certain voltage is preferably 10V" may be used. In that case, for example, if a certain voltage is between -2V and 1V, It is possible to define one aspect of the invention as "except when One aspect of the invention can be defined as excluding cases where the voltage is 13V or higher.

[0476] Another example is when describing the properties of a substance, for example, "a certain film is an insulating film." In that case, it is assumed that the insulating film is an organic insulating film. Alternatively, for example, the insulating film may be an inorganic insulating film. It is possible to define one aspect of the invention as excluding the case where the membrane is a velum. It is possible to define one aspect of the invention as excluding cases where the film is a conductive film. For example, it is possible to define one aspect of the invention as excluding cases where the film is a semiconductor film. It is Noh.

[0477] As another example, regarding a certain laminated structure, for example, "a certain film is present between film A and film B" In that case, for example, if the film is a stack of four or more layers, Or, for example, it is possible to define the invention as excluding the case of a film A and its It is possible to define the invention as excluding cases where a conductive film is provided between the film and the .

[0478] It should be noted that one aspect of the invention described in this specification etc. may be carried out by various people. However, the implementation may involve multiple people. For example, in the case of a transmission and reception system, Company A manufactures and sells the transmitter, and Company B manufactures the receiver. Another example is a device that has a transistor and a light-emitting element. In the case of a light-emitting device, the semiconductor device in which the transistor is formed is manufactured and sold by Company A. Company B then purchases the semiconductor device and deposits a light-emitting element on it. In some cases, the light-emitting device is completed after the manufacturing process.

[0479] In such a case, the inventor may claim patent infringement against either Company A or Company B. In other words, it is possible to create an embodiment of the invention that is only implemented by Company A. It is possible to construct an invention that is only implemented by Company B as a separate invention. In addition, it is possible to assert patent infringement against Company A or Company B. It can be determined that one aspect of the invention is clear and described in the present specification, etc. For example, in the case of a transmission and reception system, there are descriptions for only the transmitter and only the receiver. Even if the description of this case is not included in the present specification, the transmitter alone constitutes one aspect of the invention. The receiver alone can constitute an aspect of another invention, and one aspect of those inventions can be is clear and can be judged to be described in the present specification etc. Another example is In the case of a light-emitting device having a transistor and a light-emitting element, the transistor is formed The present invention is not limited to the description of only a semiconductor device having a light emitting element or the description of only a light emitting device having a light emitting element. Even if not specified in the specification, one embodiment of the invention can be realized by a semiconductor device having a transistor formed therein. One embodiment of the present invention can be configured by a light-emitting device having only a light-emitting element. Therefore, it is considered that one aspect of the invention is clear and described in the present specification, etc. can be done.

[0480] In this specification, the terms "active elements" and "passive elements" are used interchangeably. For all terminals of elements such as capacitors and resistors, the connection destination must be specified. However, a person skilled in the art may be able to compose an aspect of the invention. Even if the destination is not specified, one aspect of the invention can be said to be clear. When the content is described in this specification, etc., one aspect of the invention that does not specify the connection destination is In particular, if the terminals are connected to multiple If such a case is considered, there is no need to limit the connection destination of the terminal to a specific location. Therefore, there are active elements (transistors, diodes, etc.) and passive elements (capacitance elements, resistance elements, etc.) By specifying the connection destinations of only some of the terminals possessed by a device, etc., It may be possible to configure one aspect.

[0481] In this specification and the like, if at least the connection destination of a certain circuit is specified, it is understood by those skilled in the art. It may be possible for a person skilled in the art to identify an invention. A person skilled in the art may be able to identify an invention by at least specifying the function. In other words, if the function is specified, it can be said that one aspect of the invention is clear. It may be possible to determine that one aspect of the invention is described in the present specification. Therefore, even if the function of a circuit is not specified, specifying the connection destination can be considered an aspect of an invention. The present invention is disclosed as an embodiment of the present invention. Even if the connection destination of a certain circuit is not specified, if the function is specified, it can be considered as one aspect of the invention. What is disclosed can constitute an aspect of the invention.

[0482] In this specification, etc., in a drawing or text that describes one embodiment, It is possible to extract a part of it and use it to constitute an aspect of the invention. If a drawing or text describing a certain part is included, the drawing or text of that part is omitted. The above content is also disclosed as one aspect of the invention and constitutes one aspect of the invention. Therefore, one aspect of the invention is clear. For example, active elements (transistors, diodes, etc.), wiring, passive elements (capacitance elements, Resistance elements, etc.), conductive layers, insulating layers, semiconductor layers, organic materials, inorganic materials, components, devices, and operating methods In drawings or text that describe singular or multiple methods, manufacturing methods, etc., It is possible to extract and configure one aspect of the invention. For example, N pieces (N is From a circuit diagram consisting of M (integer) circuit elements (transistors, capacitors, etc.), M is an integer, and it is possible to extract circuit elements (such as transistors, capacitive elements, etc.) where M < N to form one aspect of the invention. As another example, from a cross-sectional view composed of N (N is an integer) layers, it is possible to extract M (M is an integer, M < N) layers to form one aspect of the invention. As yet another example, from a flowchart composed of N (N is an integer) elements, it is possible to extract M (M is an integer, M < N) elements to form one aspect of the invention. As yet another example, from a sentence described as "A has B, C, D, E, or F", it is possible to arbitrarily extract some elements to form one aspect of the invention such as "A has B and E", "A has E and F", "A has C, E, and F", or "A has B, C, D, and E". Moreover, in this specification, etc., when at least one specific example is described in a figure or sentence described in a certain embodiment, those skilled in the art can easily understand that it is possible to derive the upper concept of that specific example. Therefore, when at least one specific example is described in a figure or sentence described in a certain embodiment, the upper concept of that specific example is also disclosed as one aspect of the invention and can form one aspect of the invention. And it can be said that that aspect of the invention is clear. In addition, in this specification, etc., at least the content described in the figure (even a part of the figure) is disclosed as one aspect of the invention and can form one aspect of the invention. Therefore, for a certain content, if it is described in the figure, even if it is not described using a sentence 、発明の一態様を構成することが可能であると言える。 れるフローチャートから、M個(Mは整数で、M<N)の要素を抜き出して、発明の一態 様を構成することは可能である。さらに別の例としては、「Aは、B、C、D、E、また は、Fを有する」と記載されている文章から、一部の要素を任意に抜き出して、「Aは、 BとEとを有する」、「Aは、EとFとを有する」、「Aは、CとEとFとを有する」、 [[ID=ID=16]]または、「Aは、BとCとDとEとを有する」などの発明の一態様を構成することは可能 である。

[0483] なお、本明細書等においては、ある一つの実施の形態において述べる図または文章におい て、少なくとも一つの具体例が記載される場合、その具体例の上位概念を導き出すことは 、当業者であれば容易に理解される。したがって、ある一つの実施の形態において述べる 図または文章において、少なくとも一つの具体例が記載される場合、その具体例の上位概 念も、発明の一態様として開示されているものであり、発明の一態様を構成することが可 能である。そして、その発明の一態様は、明確であると言える。

[0484] 、発明の一態様として開示されているものであり、発明の一態様を構成することが可能で ある。したがって、ある内容について、図に記載されていれば、文章を用いて述べていな​ However, the content is disclosed as one aspect of the invention and constitutes one aspect of the invention. Similarly, even if a part of the drawings is taken out, it can be regarded as one embodiment of the invention. This is disclosed as an embodiment of the present invention. It can be said that one aspect of the invention is clear. [Explanation of symbols]

[0485] 1 FPC 2 FPC 4 FPC 5 FPC 10. Cabinet 11. Housing 12. Case 13 Hinge 14 Window section 16 Base material 16a Barrier film 16b Base material 16c resin layer 17 Protective base material 17p protective layer 19 Detection circuit 20B Detector 20U detection unit 21 electrodes 22 electrodes 23 Insulating layer 31 Film 32 Positive electrode current collector 33 Separator 34 Negative electrode current collector 35 Sealing layer 36 Lead electrodes 37 Thermocompression bonding area 38 Cathode active material layer 39 Negative electrode active material layer 40 Secondary battery 41 Adhesive layer 42 Electrolyte 90 Touch Panel 100 Input Device 110 devices 111 CPU 112 Battery 113 Regulator 114 Radio receiving unit 115 Control Module 116 Display section 116a Side roll section 116b Side roll section 116c Side roll section 117 Battery 118 Regulator 119 Display driver circuit 120 Radio receiver 121 Display Module 125 System Department 127 Power management circuit 128 Radio transmitter 129 Radio transmitter 140 Circuit Board 141 Lead electrode 142 Part of the drive circuit 143 Flexible Film 144 Flexible Film 150 Radio transmitter 152 Touch Sensor 153 Battery 154 Regulator 156 Touch input unit 159 Sensor driver circuit 160 Bending position sensor 201 Fabricated substrate 203 Peeling layer 205 Peeling layer 207 Bonding layer 211 Bonding layer 221 Fabrication substrate 223 Peeling layer 225 Peeling layer 226 Insulating Layer 231 Substrate 233 Bonding layer 401 Electrode 402 EL layer 403 Electrode 404 Bonding layer 404a Bonding layer 404b Bonding layer 405 Insulation Layer 407 Bonding layer 420 Flexible substrate 422 Adhesive layer 424 Insulating Layer 426 Adhesive layer 428 Flexible substrate 431 Light blocking layer 432 Colored layer 435 Conductive Layer 441 Conductive Layer 442 Conductive layer 443 Insulation Layer 444 Flexible substrate 445 FPC 450 Organic EL element 453 Overcoat 454 transistor 455 transistor 457 Conductive Layer 463 Insulating Layer 465 Insulation Layer 467 Insulating Layer 491 Light-emitting part 493 Drive circuit section 495 FPC 496 Spacer 497 Connections 500 I / O devices 501 Display section 502 pixels 502B subpixel 502G subpixel 502R subpixel 502t transistor 503c capacity 503g Scanning line driver circuit 503t transistor 510 Base material 510a Barrier film 510b base material 510c resin layer 511 Wiring 519 terminal 521 Insulating film 528 Bulkhead 550R light emitting element 560 Encapsulating material 567p anti-reflection layer 580R Light Emitting Module 601 Pulse voltage output circuit 602 Current detection circuit 603 capacity 611 Transistor 612 Transistor 613 Transistor 621 Electrode 622 Electrode 717 Battery 718 Regulator 753 Battery 754 Regulator 812 Battery 813 Hinge 816 Display section 817 Battery 853 Battery 900 Display device 901 Display section 902 Gate Driver 903 Source Driver 904 Digital / Analog Conversion Circuit 910 Control circuit 911 detection unit 920 Counter Circuit 950 Touch Sensor 1700 curved surface 1701 Plane 1702 Curve 1703 Radius of curvature 1704 Center of curvature 1800 Center of curvature 1801 Film 1802 radius of curvature 1803 Film 1804 radius of curvature 1805 layers

Claims

1. a display unit having at least one bent portion; a first housing and a second housing connected to each other via a hinge and supporting the display unit at the folding portion so that the display unit is foldable; a first secondary battery housed in the first housing; a second secondary battery housed in the second housing; a receiving circuit for wirelessly charging the first and second secondary batteries; The first and second secondary batteries are controlled so as to be simultaneously chargeable. mobile phone.

2. 2. The mobile phone according to claim 1, further comprising a sensor provided on an outer periphery of said display unit, said sensor detecting that said display unit is folded at said folding portion.

3. 3. The mobile phone according to claim 1, wherein the amounts of power in the first and second secondary batteries can be monitored.

4. The mobile phone according to claim 1 , wherein data on the remaining amounts of power of the first and second secondary batteries can be acquired periodically or continuously.

5. The mobile phone according to claim 1 , wherein the degree of deterioration of the first and second secondary batteries can be monitored.

6. The mobile phone according to claim 1 , having a mode in which the display unit is folded at the folding portion to be compact, and a mode in which the display unit is in an unfolded state.

7. The mobile phone according to claim 1 , wherein when the display unit is folded at the folding portion, an image in a display area that is hidden by the folding is not displayed.

8. the display unit is a display panel having an organic EL element and a touch panel function, The first and second secondary batteries each contain, as a positive electrode active material, LiCoO having a layered rock salt crystal structure. ２ 8. A mobile phone according to any one of claims 1 to 7, comprising:

Images