Vehicle control device and vehicle

Abstract

To provide a vehicle control device having a high level of security.SOLUTION: A vehicle control device includes an operation unit, a first light receiving and emitting unit, and a control unit. The operation unit includes a steering wheel with a rim, a hub, and spokes. The rim is connected to the hub via the spokes. The first light receiving and emitting unit is provided along a surface of the hub. The first light receiving and emitting unit includes a first light emitting element and a first light receiving element. The first light emitting element has a function of emitting light in a first wavelength range. The first light receiving element has a function of receiving light in the first wavelength range and converting the light into an electrical signal. The first light emitting element and the first light receiving element are arranged side by side on the same plane. The first light receiving and emitting unit has a function of outputting first light receiving data to the control unit. The control unit has a function of acquiring first biological information of a driver from the first light receiving data and executing first processing according to the first biological information.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD OF THE INVENTION An aspect of the present invention relates to a control device for a moving body such as a vehicle, a light emitting and receiving device, a biosensor, and a display device.

[0002] Note that one embodiment of the present invention is not limited to the above technical field. Examples of the technical field of one embodiment of the present invention disclosed in this specification and the like include semiconductor devices, display devices, light-emitting devices, power storage devices, memory devices, electronic devices, lighting devices, input devices, input / output devices, driving methods thereof, and manufacturing methods thereof. A semiconductor device refers to any device that can function by utilizing semiconductor characteristics. [Background technology]

[0003] The theft of automobiles and other vehicles has been occurring one after another, and there is a demand for improved security against theft.

[0004] Furthermore, for drivers who are driving a vehicle, drowsiness is one of the most common causes of accidents, and various methods for monitoring the driver's wakefulness have been studied. For example, Patent Document 1 discloses a technology for determining the driver's activity level from the vehicle's acceleration and the driver's heart rate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-312653 Summary of the Invention [Problem to be solved by the invention]

[0006] An object of one embodiment of the present invention is to provide a vehicle control device with a high level of security.An object of one embodiment of the present invention is to provide a vehicle control device with high safety.An object of one embodiment of the present invention is to provide a vehicle control device with high convenience.An object of one embodiment of the present invention is to monitor a driver's state without making the driver aware of it.An object of one embodiment of the present invention is to provide a vehicle control device, a vehicle control method, or the like having a novel configuration.

[0007] An object of one embodiment of the present invention is to provide a new electronic device, a mobile object, a vehicle, an apparatus, a system, a program, or a method that utilizes biometric information.An object of one embodiment of the present invention is to provide an electronic device, a mobile object, a vehicle, an apparatus, a system, a program, or a method that has a novel configuration.An object of one embodiment of the present invention is to alleviate at least one of the problems of the prior art.

[0008] Note that the description of these problems does not preclude the existence of other problems. Note that one embodiment of the present invention does not necessarily solve all of these problems. Note that problems other than these can be extracted from the description of the specification, drawings, claims, etc. [Means for solving the problem]

[0009] One aspect of the present invention is a vehicle control device having an operation unit, a first light receiving and emitting unit, and a control unit. The operation unit has a steering wheel having a rim, a hub, and spokes. The rim is connected to the hub via the spokes. The first light receiving and emitting unit is provided along the surface of the hub. The first light receiving and emitting unit has a first light emitting element and a first light receiving element. The first light emitting element has a function of emitting light in a first wavelength range. The first light receiving element has a function of receiving light in the first wavelength range and converting it into an electrical signal. The first light emitting element and the first light receiving element are arranged side by side on the same plane. The first light receiving and emitting unit has a function of outputting first light receiving data to the control unit. The control unit has a function of acquiring first biometric information of the driver from the first light receiving data and executing a first process according to the first biometric information.

[0010] In the above, the first biometric information is preferably fingerprint, vein, or palm print information, and the first process is preferably driver authentication processing.

[0011] In any of the above, it is preferable that the first light receiving and emitting unit has a function of displaying an image and a function as a touch sensor.

[0012] In any of the above, it is preferable that the device further includes a second light receiving / emitting unit. The second light receiving / emitting unit is provided along the surface of the rim. The second light receiving / emitting unit includes a second light emitting element and a second light receiving element, and the second light emitting element has the function of emitting light in a second wavelength range. Furthermore, it is preferable that the second light receiving element has the function of receiving light in the second wavelength range and converting it into an electrical signal.

[0013] In the above, the second light receiving and emitting unit preferably has a function of sequentially outputting the second light receiving data to the control unit, and the control unit preferably has a function of acquiring second biometric information of the driver from the second light receiving data and executing a second process according to the second biometric information.

[0014] In the above, the second biological information is preferably one or more of a pulse wave, a heart rate, a pulse rate, and an arterial blood oxygen saturation. In this case, the second process is preferably a warning process for the driver.

[0015] In any of the above, it is preferable that the light in the second wavelength range includes infrared light.

[0016] In any of the above, it is preferable that the light in the first wavelength range includes visible light or infrared light.

[0017] In any of the above, the first light-emitting element preferably has a laminated structure in which a first electrode, a first organic layer, and a common electrode are laminated. Furthermore, the first light-receiving element preferably has a laminated structure in which a second electrode, a second organic layer, and a common electrode are laminated. In this case, it is preferable that the first organic layer includes a light-emitting layer, and the second organic layer includes a photoelectric conversion layer, and the light-emitting layer and the photoelectric conversion layer each include a different organic compound. Furthermore, it is preferable that the first electrode and the second electrode are provided separately on the same plane, and the common electrode is provided to cover the first organic layer and the second organic layer.

[0018] In addition, in the above, it is preferable that the angle formed between the bottom surface and the side surface of each of the first organic layer and the second organic layer is 60 degrees or more and 120 degrees or less, and that the side surface of the first organic layer and the side surface of the second organic layer are arranged opposite to each other.

[0019] Another aspect of the present invention is a vehicle including any one of the vehicle control devices and a display device. In this case, it is preferable that the display device has a display unit with a curved surface, and the display unit is provided along a dashboard or a pillar. [Effects of the Invention]

[0020] According to one aspect of the present invention, it is possible to provide a vehicle control device with a high level of security, a highly safe vehicle control device, a highly convenient vehicle control device, a driver's state can be monitored without the driver being aware of it, or a vehicle control device or vehicle control method having a novel configuration.

[0021] According to one aspect of the present invention, it is possible to provide a new electronic device, mobile object, vehicle, device, system, program, or method that utilizes biometric information. One aspect of the present invention is possible to provide an electronic device, mobile object, vehicle, device, system, program, or method having a novel configuration. One aspect of the present invention is possible to at least alleviate at least one of the problems of the prior art.

[0022] Note that the description of these effects does not preclude the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. Note that effects other than these can be extracted from the description in the specification, drawings, claims, etc. [Brief explanation of the drawings]

[0023] [Figure 1] FIG. 1 is a diagram illustrating an example of the configuration of a vehicle. [Figure 2] FIG. 2 is a diagram illustrating an example of the configuration of a vehicle. [Figure 3] Fig. 3A is a diagram showing an example of the configuration of a vehicle, and Figs. 3B to 3D are diagrams showing an example of the configuration of a display unit. [Figure 4] Fig. 4A is a diagram showing an example of the configuration of a vehicle, and Figs. 4B to 4E are diagrams showing an example of the configuration of a display unit. [Figure 5] 5A to 5D are diagrams illustrating an example of the configuration of a vehicle control device. [Figure 6] FIG. 6 is a diagram illustrating an example of the configuration of a vehicle control device. [Figure 7] 7A and 7B are diagrams illustrating an example of the configuration of a vehicle control device. [Figure 8]8A and 8B are diagrams illustrating an example of the configuration of a vehicle control device. [Figure 9] 9A to 9D are diagrams illustrating an example of the configuration of a vehicle control device. [Figure 10] 10A to 10D are diagrams showing an example of the configuration of a vehicle control device, and Fig. 10E to 10G are diagrams showing an example of the configuration of pixels of a light emitting and receiving unit. [Figure 11] FIG. 11 is a flowchart illustrating an example of a method for operating the vehicle control device. [Figure 12] FIG. 12 is a flowchart illustrating an example of a method for operating the vehicle control device. [Figure 13] FIG. 13 is a flowchart illustrating an example of a method for operating the vehicle control device. [Figure 14] 14A and 14B are diagrams showing configuration examples of a display device. [Figure 15] 15A to 15C are diagrams showing configuration examples of a display device. [Figure 16] Figures 16A, 16B, and 16D are cross-sectional views showing examples of display devices, Figures 16C and 16E are diagrams showing example images, and Figures 16F to 16H are top views showing example pixels. [Figure 17] 17A is a cross-sectional view showing an example of the configuration of a display device, and FIGS. 17B to 17D are top views showing examples of pixels. [Figure 18] 18A is a cross-sectional view showing an example of the configuration of a display device, and FIGS. 18B to 18I are top views showing an example of a pixel. [Figure 19] 19A to 19F are diagrams showing configuration examples of a light-emitting device. [Figure 20] 20A and 20B are diagrams showing configuration examples of a light emitting device and a light receiving device. [Figure 21] 21A and 21B are diagrams showing configuration examples of a display device. [Figure 22] 22A to 22D are diagrams showing configuration examples of a display device. [Figure 23] 23A to 23C are diagrams showing configuration examples of a display device. [Figure 24] 24A to 24D are diagrams showing configuration examples of a display device. [Figure 25] 25A to 25F are diagrams showing configuration examples of a display device. [Figure 26] 26A to 26F are diagrams showing configuration examples of a display device. [Figure 27] FIG. 27 is a diagram illustrating an example of the configuration of a display device. [Figure 28] 28A is a cross-sectional view showing an example of a display device, and FIG 28B is a cross-sectional view showing an example of a transistor. [Figure 29] Figures 29A to 29F are diagrams showing example pixels, and Figures 29G and 29H are diagrams showing example circuit diagrams of pixels. DETAILED DESCRIPTION OF THE INVENTION

[0024] Hereinafter, embodiments will be described with reference to the drawings. However, it will be readily understood by those skilled in the art that the embodiments can be implemented in many different ways and that various changes in form and details can be made without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the following description of the embodiments.

[0025] In the configuration of the invention described below, the same parts or parts having similar functions are denoted by the same reference numerals in different drawings, and repeated explanations thereof will be omitted. In addition, when referring to similar functions, the same hatch pattern may be used and no particular reference numeral may be assigned.

[0026] In the drawings described in this specification, the size of each component, the thickness of a layer, or an area may be exaggerated for clarity, and therefore, the drawings are not necessarily limited to the scale.

[0027] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components and do not limit the number.

[0028] (Embodiment 1) In this embodiment, a vehicle according to one embodiment of the present invention and a vehicle control device that can be applied to the vehicle will be described.

[0029] [Vehicle configuration example] Fig. 1 shows an example of the configuration of a vehicle 50 equipped with a display unit 51 and a steering wheel 41. Fig. 1 shows an example of a right-hand drive vehicle, but this is not particularly limited. For example, in the case of a left-hand drive vehicle, the left and right arrangement of the configuration shown in Fig. 1 is reversed.

[0030] 1 shows a dashboard 52, a steering wheel 41, a windshield 54, a camera 55, an air vent 56, a passenger door 58a, a driver door 58b, etc., which are arranged around the driver's seat and the passenger seat. The display unit 51 is provided across the left and right sides of the dashboard 52.

[0031] 1 shows an example in which one display unit 51 formed using two display panels (display panel 60a, display panel 60b) is provided along dashboard 52. Display panel 60a and display panel 60b are arranged on dashboard 52 so that the seam between them is not visible or so that the width of the seam is 2 cm or less, preferably 1 cm or less. In FIG. 1, the boundary between display panel 60a and display panel 60b is indicated by a dashed line.

[0032] The display unit 51 is preferably provided with a touch sensor or a non-contact proximity sensor, or is preferably capable of gesture operation using a separately provided camera or the like.

[0033] The steering wheel 41 has a light receiving / emitting unit 20. The light receiving / emitting unit 20 has a function of emitting light and a function of capturing an image. The light receiving / emitting unit 20 can acquire biometric information such as the driver's fingerprint, palm print, or vein pattern, and the driver can be authenticated based on the biometric information. Therefore, only drivers who have been registered in advance can start the vehicle, thereby realizing a vehicle with an extremely high level of security.

[0034] The display panels 60a and 60b may be flexible. The display panels 60a and 60b can be processed into complex shapes, which makes it easy to realize a configuration in which the display unit 51 is provided along a curved surface such as the dashboard 52, and a configuration in which the display area of ​​the display unit 51 is not provided on the connection portion of the steering wheel 41, instruments such as meters, or the air vent 56.

[0035] Furthermore, multiple cameras 55 for capturing images of the rear and lateral conditions may be installed outside the vehicle. While FIG. 1 shows an example in which the camera 55 is installed instead of the side mirror, both a side mirror and a camera may be installed. As the camera 55, a CCD camera, a CMOS camera, or the like may be used. Furthermore, an infrared camera may be used in combination with these cameras. The output level of an infrared camera increases as the temperature of the subject increases, making it possible to detect or extract living organisms such as people and animals.

[0036] The image captured by the camera 55 can be output to either or both of the display unit 51 and the light-emitting and receiving unit 20. The vehicle 50 can assist the driver in driving the vehicle using the display unit 51 or the light-emitting and receiving unit 20. For example, by capturing an image of the rear and lateral situation with a wide angle of view using the camera 55 and displaying the image on the display unit 51 or the light-emitting and receiving unit 20, the driver can see the blind spot, thereby preventing accidents from occurring.

[0037] Furthermore, discontinuity in the image at the seam between display panel 60a and display panel 60b may be compensated for by image processing, etc. This makes it possible to display an image with an inconspicuous seam, thereby improving the visibility of display unit 51 while driving.

[0038] Furthermore, a range image sensor may be provided on the roof of the vehicle, and an image obtained by the range image sensor may be displayed on the display unit 51. The range image sensor may be an image sensor, a LIDAR (Light Detection and Ranging), or the like. By displaying the image obtained by the image sensor and the image obtained by the range image sensor on the display unit 51, more information can be provided to the driver, and driving assistance can be provided.

[0039] Display unit 51 may also have the function of displaying map information, traffic information, television images, DVD images, etc. For example, display panel 60a and display panel 60b can be used as a single display screen to display large map information. The number of display panels can be increased depending on the images to be displayed.

[0040] FIG. 2 shows an example in which the number of display panels is increased. In FIG. 2, the display unit 51 is provided across the dashboard, front console, and left and right pillars. Although FIG. 2 shows an example in which the display unit 51 is configured with eight display panels (display panels 60a to 60h), the number of display panels is not limited to this and may be seven or less, or nine or more. The display panels 60c and 60d are provided in positions corresponding to the center console. The display panels 60e and 60f are provided on the far side of the dashboard as seen from the driver. The display panels 60g and 60h are provided along the pillars. At least one of the display panels 60a to 60h is provided along a curved surface.

[0041] The images displayed on display panels 60a to 60h can be freely set according to the driver's preferences. For example, television images, DVD images, web videos, etc. can be displayed on left display panel 60a, display panel 60e, etc., map information can be displayed on center display panel 60c, etc., speedometers, tachometers, and other instruments can be displayed on driver-side display panels 60b, 60f, etc., and audio equipment can be displayed on display panel 60d, etc., between the driver's seat and passenger seat. In addition, by displaying the external scenery in the driver's line of sight in real time on display panels 60g and 60h mounted on the pillars, a pseudo-pillarless vehicle can be realized, and blind spots can be reduced, resulting in a safer vehicle.

[0042] 2, display units 59a and 59b are provided along the surfaces of passenger door 58a and driver door 58b, respectively. Display units 59a and 59b can each be formed using one or more display panels.

[0043] Display unit 59a and display unit 59b are arranged to face each other, and display unit 51 is provided on dashboard 52 so as to connect the end of display unit 59a with the end of display unit 59b. This means that the driver and passenger in the front seat are surrounded in front and on both sides by display unit 51, display unit 59a, and display unit 59b. For example, by displaying a continuous image on display unit 59a, display unit 51, and display unit 59b, it is possible to provide the driver or passenger with a highly immersive feeling.

[0044] The images displayed on display units 59a and 59b can also be freely set according to the preferences of the driver or passenger. For example, if a child is sitting in the passenger seat, content for children, such as animation, can be displayed on display unit 59a.

[0045] Furthermore, display units 59a and 59b can display images that are linked to the view from the vehicle window, synthesized from images acquired by camera 55 or the like. That is, images that the driver and passengers can see through doors 58a and 58b can be displayed on display units 59a and 59b. This allows the driver and passengers to experience the sensation of floating.

[0046] It is also preferable that at least one of the display panels 60a to 60h is a display panel having an imaging function. Also, a display panel having an imaging function may be applied to one or more of the display panels provided in the display units 59a and 59b.

[0047] For example, when the driver touches the display panel, the vehicle can perform biometric authentication such as fingerprint authentication or palm print authentication. The vehicle may have a function to adjust the environment to suit the driver's preferences when the driver is authenticated by biometric authentication. For example, it is preferable to perform one or more of the following after authentication: adjusting the seat position, adjusting the steering wheel position, adjusting the direction of the camera 55, setting the brightness of the lights, setting the air conditioner, setting the wiper speed (frequency), setting the audio volume, and reading the audio playlist.

[0048] Furthermore, when the driver is authenticated by biometric authentication, the car can be put into a state where it can be driven, for example, with the engine running, or in the case of an electric car, it can be started, which is preferable because it eliminates the need for a key, which was previously required.

[0049] Although the display device surrounding the driver's seat and passenger seat has been described here, a display unit can also be provided in the rear seat so as to surround the passengers. For example, a display unit can be provided on the back of the driver's seat or passenger seat, or along the side of the rear door.

[0050] Furthermore, as shown in FIG. 3A, a spherical display unit 61 may be provided between the front seat and the rear seat. Images can be viewed from any direction on the spherical display unit 61. Therefore, even if multiple people are sitting in the rear seats, there is no need to prepare display devices for each person, and one display unit 61 can be viewed by all people in the rear seats. Furthermore, by rotating the passenger seat backward, the passenger in the passenger seat can also view the display unit 61. Furthermore, when applied to an autonomous vehicle, the driver's seat can also be rotated backward so that the driver can also view the display unit 61.

[0051] The display unit 61 can be formed by bonding together a plurality of display panels 62. Fig. 3B shows a schematic diagram of one display panel, and Fig. 3C shows a schematic diagram of the display unit 61 formed by bonding together a plurality of display panels 62.

[0052] As shown in Fig. 3B, the display unit 61 has a display area 63 and a non-display area 64. A plurality of pixels arranged in a matrix are provided in the display area 63. One or more of wiring, terminals, electrodes, and drive circuits (gate drivers or source drivers) are provided in the non-display area 64. An IC chip or an FPC (Flexible Printed Circuit) may also be mounted in the non-display area.

[0053] As shown in Figure 3C, by bonding multiple display panels 62 together so that the non-display area 64 of one display panel 62 overlaps the display area 63 of another display panel 62, the width of the seam can be reduced, making the seam less visible.

[0054] 3B and 3C show an example in which the display unit 61 is configured using a plurality of display panels 62, but a spherical display unit 61 may also be realized by deforming one large display panel 62.

[0055] Fig. 3D shows a development view of a display panel 62 used in the spherical display unit 61. The display panel 62 shown in Fig. 3D has a shape in which a plurality of the configurations shown in Fig. 3B are joined together in the horizontal direction.

[0056] Furthermore, since the display panel can be provided along various curved surfaces, the shape of the display portion that can be realized by such a display panel is not limited to a spherical shape.

[0057] 4A shows an example of an autonomous vehicle having a hemispherical display unit 61A and a display unit 61B shaped like a combination of a hemisphere and a cylinder inside the vehicle. Hemispherical display unit 61A has a touch sensor or proximity sensor on its surface, and the driver can operate hemispherical display unit 61A to perform various operations such as setting a destination or a route. The driver can also operate display unit 61A to drive the vehicle.

[0058] Fig. 4B shows a schematic diagram of display unit 61B, which has a shape similar to a cylinder with a hemisphere of the same diameter placed on one flat surface. Fig. 4C shows a developed view of display panel 62B used in display unit 61B. Display panel 62B has display area 63 and non-display area 64.

[0059] 4D shows display unit 61C, which has a shape similar to a cylinder with a hemisphere of the same diameter placed on one flat surface, cut in half lengthwise, and the cut surface extended in the normal direction. Also, FIG. 4E shows a developed view of display panel 62C used in display unit 61C.

[0060] [Vehicle control device] Hereinafter, a vehicle control device that can be incorporated into a vehicle according to one embodiment of the present invention will be described with reference to the drawings.

[0061] 5A shows a block diagram of the vehicle control device 10 exemplified below. The vehicle control device 10 includes a light receiving and emitting unit 20, a control unit 30, an operation unit 40, and the like.

[0062] The light receiving and emitting unit 20 has a function of acquiring light receiving data including the driver's biometric information, and a function of outputting the light receiving data to the control unit 30. The control unit 30 has a function of generating (acquiring) data including the driver's biometric information (also referred to as biometric data) based on the light receiving and emitting data supplied from the light receiving and emitting unit 20, and a function of executing various processes based on the biometric data. The operation unit 40 corresponds to an operation means with which the driver operates the vehicle. The operation unit 40 has a light receiving and emitting area of ​​the light receiving and emitting unit 20 provided along the part that the driver holds or touches.

[0063] The light receiving and emitting unit 20 has a function of irradiating light onto, for example, a part of the driver's body and acquiring the reflected light as light reception data. The light receiving and emitting unit 20 can acquire biometric data such as a fingerprint or palm print by capturing an image of a part of the skin. By using the biometric data for authentication, a key (including a smart key) for starting the vehicle becomes unnecessary, and a vehicle can be realized in which the engine (or power source) can be started by biometric authentication without carrying a key.

[0064] Here, since the reflectance of light from human skin changes periodically due to blood flow, pulse wave data can be obtained from the time change in the intensity of reflected light obtained by repeatedly receiving light using the light receiving and emitting unit 20. Various vital signs data can be further obtained from the pulse wave. For example, the heart rate can be obtained from the pulse wave period. Furthermore, arterial blood oxygen saturation (SpO2) can be measured using two sets of received light data obtained using light of different wavelengths (for example, infrared light and red light). Furthermore, stress levels, vascular age, and other information can be obtained from highly accurate pulse waves obtained by increasing the sampling frequency. Other applications include estimating the progression of arteriosclerosis, and estimating blood pressure from separately measured electrocardiograms and pulse waves.

[0065] Biometric data that can be used by the control unit 30 can be broadly divided into vital data and biometric authentication data. Vital data is data related to life information derived from a person's vital activities, such as pulse wave, heart rate, pulse rate, arterial blood oxygen saturation, and blood pressure. On the other hand, biometric data is data derived from a person's physical characteristics and can be used for personal authentication (biometric authentication), such as fingerprints, palm prints, pulse shape (including vein shape and artery shape), iris, and voiceprint. Biometric data can also include data derived from a person's behavioral characteristics (such as the position at which the steering wheel is gripped).

[0066] Visible light, infrared light, or ultraviolet light can be used as the light irradiated onto a part of the driver's body by the light receiving and emitting unit 20. In particular, it is preferable that the light includes infrared light, and preferably near-infrared light. Such light is preferable because it is not visible to the driver and therefore allows imaging to be performed at all times without interfering with the driver's driving.

[0067] 5A, the light receiving and emitting unit 20 has a light emitting element 21, a light receiving element 22, a drive circuit 23, and a readout circuit 24. The control unit 30 has a data generating unit 31, a determining unit 32, a processing unit 33, etc. The operation unit 40 has at least a steering wheel 41. The steering wheel 41 has a rim 42, a hub 43, and spokes 44.

[0068] In the light-emitting and receiving unit 20, the light-emitting element 21 and the light-receiving element 22 are preferably arranged side by side on the same surface. The light-receiving element 22 functions as a photoelectric conversion element that receives incident light and converts it into an electrical signal. The light-receiving element 22 is sensitive to at least a portion of the light emitted by the light-emitting element 21. In particular, it is preferable that the light-emitting element 21 emits light in a wavelength range that includes infrared light, and that the light-receiving element 22 is also sensitive to light in a wavelength range that includes infrared light.

[0069] The light emitted by the light-emitting element 21 preferably includes infrared light, preferably near-infrared light. In particular, near-infrared light having one or more peaks in the wavelength range of 700 nm to 2500 nm is preferably used. In particular, using light having one or more peaks in the wavelength range of 750 nm to 1000 nm is preferable because it broadens the range of materials to be used for the active layer of the light-receiving element 22.

[0070] In particular, it is preferable that the light emitting and receiving unit 20 is provided with a plurality of light emitting elements 21 and a plurality of light receiving elements 22. In this case, it is preferable that the light emitting elements 21 and the light receiving elements 22 are arranged side by side on the same plane. Furthermore, it is preferable that the light emitting elements 21 and the light receiving elements 22 are arranged alternately in one direction or arranged alternately in a matrix.

[0071] The light emitting and receiving unit 20 may have a function of displaying an image by including a light emitting element 21 that emits visible light. In this case, the light emitting and receiving unit 20 may be configured to include a light emitting element that emits visible light and a light emitting element that emits infrared light. In addition, the light emitting and receiving unit 20 preferably functions as a touch panel or a proximity sensor panel.

[0072] It is preferable to use an EL element such as an OLED (Organic Light Emitting Diode) or a QLED (Quantum-dot Light Emitting Diode) as the light-emitting element 21. Examples of light-emitting materials that the EL element has include a material that emits fluorescence (fluorescent material), a material that emits phosphorescence (phosphorescent material), a material that exhibits thermally activated delayed fluorescence (thermally activated delayed fluorescence: TADF material), and an inorganic compound (such as a quantum dot material).

[0073] The light receiving element 22 can be, for example, a pn-type or pin-type photodiode. The light receiving element functions as a photoelectric conversion element that detects incident light and generates an electric charge. The amount of electric charge generated by the photoelectric conversion element is determined according to the amount of incident light. In particular, it is preferable to use an organic photodiode having a layer containing an organic compound as the light receiving element. Organic photodiodes can be easily made thin, lightweight, and large in area, and have a high degree of freedom in shape and design, making them applicable to a variety of devices.

[0074] Furthermore, it is preferable to use an organic compound for the active layer of the light-receiving element 22. In this case, it is preferable to provide one electrode (also called a pixel electrode) of the light-emitting element 21 and the light-receiving element 22 on the same surface. Furthermore, it is more preferable that the other electrode of the light-emitting element 21 and the light-receiving element 22 be an electrode (also called a common electrode) formed of one continuous conductive layer. Furthermore, it is more preferable that the light-emitting element 21 and the light-receiving element 22 have a common layer. This can simplify the manufacturing process for manufacturing the light-emitting element 21 and the light-receiving element 22, reduce manufacturing costs, and improve manufacturing yield.

[0075] The drive circuit 23 has a circuit that controls the light emission of the light-emitting element 21 and a circuit that controls the light reception of the light-receiving element 22. For example, when the light-receiving and light-emitting unit 20 has a configuration in which a plurality of pixels, each including the light-emitting element 21 and the light-receiving element 22, are arranged in a matrix, the drive circuit 23 includes a pixel circuit, a scanning line drive circuit, a signal line drive circuit, etc., which the pixels have.

[0076] The readout circuit 24 has a function of generating light reception data based on the electrical signal output by the light receiving element 22 and outputting the data to the control unit 30. For example, the readout circuit 24 includes an amplifier circuit, an AD conversion circuit, etc. The light reception data output from the readout circuit 24 to the control unit 30 is preferably digital data.

[0077] Light emitted from the light-emitting element 21 is reflected by an object that touches or approaches the light-receiving / emitting surface of the light-receiving / emitting unit 20, and is incident on the light-receiving element 22. The light-receiving element 22 outputs an electrical signal corresponding to the amount of incident light. This makes it possible to detect contact with or approach of an object. Alternatively, the light-receiving / emitting unit 20 may be equipped with a touch sensor or proximity sensor of another type, such as a capacitance type, a resistive film type, or a surface acoustic wave type.

[0078] The data generation unit 31 has a function of generating biological data to be output to the determination unit 32 from the light reception data input from the light receiving and emitting unit 20.

[0079] Examples of vital data, which is a type of biometric data, include pulse wave, heart rate, and other data generated from time-series data including data sampled within a certain period of time, or various data calculated from pulse waves. Also, image data such as fingerprints, palm prints, and veins generated from still images can be used as biometric data and are included in biometric data.

[0080] The determination unit 32 has a function of determining whether or not to cause the processing unit 33 to execute processing, based on the biometric data supplied from the data generation unit 31. The determination unit 32 also has a function of selecting processing to be executed by the processing unit 33, based on the biometric data.

[0081] The light receiving and emitting unit 20 and the data generating unit 31 can periodically and continuously acquire various vital data or biometric data, so that the judgment unit 32 can use this vital data or biometric data for personal authentication, driver condition management, etc.

[0082] For example, biometric data that can be obtained using visible light and infrared light include fingerprints, palm prints, vein patterns, pulse waves, respiratory rates, pulse rates, oxygen saturation levels, blood sugar levels, and triglyceride concentrations. Other biometric data that can be obtained include facial expressions, complexions, pupils, voiceprints, and body temperature. Using such a variety of biometric data is preferable because it allows for a comprehensive assessment of the user's health condition.

[0083] Each of the measured multiple pieces of biometric data can be individually determined to be normal or abnormal, and processing can be determined based on the multiple determination results. Alternatively, the driver's condition can be determined for each of the measured multiple pieces of biometric data (for example, determining whether the pulse rate is high, low, or normal based on the value), and processing can be determined based on the multiple determination results. Such a method has the advantage that the basis for the obtained determination results is clear.

[0084] Alternatively, feature amounts may be extracted from all measured biometric data, and processing may be determined based on the feature amounts. This method makes it easy to make decisions based on the correlation between multiple pieces of biometric data, rather than just individual pieces of biometric data.

[0085] As a classifier or discriminator for determining processing from various biological data, it is preferable to use a machine learning model trained by machine learning, which can be broadly divided into supervised machine learning, unsupervised machine learning, outlier detection, and the like.

[0086] Supervised machine learning techniques include K-nearest neighbors, naive Bayes classifiers, decision trees, support vector machines, random forests, neural networks, etc. In particular, neural networks are suitable for extracting features from multiple pieces of information, as they can learn during the feature extraction stage.

[0087] Feature extraction methods used in unsupervised machine learning include principal component analysis (PCA) and non-negative matrix factorization (NMF), while classifiers include k-means clustering and DBSCAN.

[0088] A supervised machine learning model and an unsupervised machine learning model may be combined to determine the acquired multiple pieces of biometric data. In this case, labels used in other supervised machine learning models may be used as labels for each classification obtained by the unsupervised machine learning model.

[0089] Outlier detection detects whether the acquired biometric data or the feature values ​​obtained from one or more biometric data are outliers that fall outside the normal range. When an outlier is detected, it is estimated that the driver's condition is likely to be out of the normal range.

[0090] Models for detecting outliers include k-nearest neighbors, local outlier factor, one-class SVM, and Mahalanobis distance. Using multidimensional data that combines various pieces of information is effective for outlier detection. False positives can be prevented by performing outlier detection based on multiple pieces of information. Furthermore, if the biometric data is information that changes over time depending on the user's condition (e.g., pulse rate, respiratory rate), methods such as the sliding window-based nearest neighbor method, dynamic time warping (DTW), and singular spectral transform may also be used. Furthermore, if the biometric information changes periodically, deviations from the prediction model may be detected using methods such as long short-term memory (LSTM).

[0091] The determination unit 32 may also have a function of executing a process (authentication process) in which the fingerprint, palm print, or blood vessel shape information input from the data generation unit 31 is compared with pre-stored fingerprint, palm print, or blood vessel shape information of the driver to determine whether they match. The authentication process executed by the determination unit 32 may use, for example, a template matching method or a pattern matching method that compares two images and uses their similarity. Alternatively, the fingerprint authentication process may be performed by inference using machine learning. In this case, it is particularly preferable that the authentication process be performed by inference using a neural network.

[0092] The processing unit 33 has a function of executing various processes depending on the result of the determination unit 32.

[0093] For example, when the determination unit 32 authenticates the driver based on biometric information such as the driver's fingerprint, palm print, or vein pattern, the processing unit 33 can transition the vehicle to a drivable state (also referred to as an idling state). In addition, when the driver is authenticated by the determination unit 32, the processing unit 33 may execute processing to adjust the in-vehicle environment to suit the driver's preferences. For example, after authentication, the processing unit 33 preferably executes one or more of the following: adjusting the seat position, adjusting the steering wheel position, adjusting the orientation of the side mirrors and rearview mirror, setting the brightness of the lights, setting the air conditioner, setting the speed and frequency of the wipers, setting the audio volume, and reading an audio playlist.

[0094] Furthermore, when the determination unit 32 determines the level of wakefulness of the driver, the processing unit 33 executes processing according to the level. For example, to encourage the driver to wake up, the processing unit 33 may change the brightness of the lights inside the vehicle, play audio, or spray a scent. Furthermore, when it is determined that the driver is unable to drive, the processing unit 33 may execute processing such as changing the vehicle's driving mode to an emergency automatic driving mode, flashing the hazard lights, moving the vehicle to the shoulder of the road, and contacting the police, an ambulance, an insurance company, etc.

[0095] The determination unit 32 may also have a function to determine whether or not alcohol has been consumed based on the biological data, or a function to determine whether or not an attack of heart disease or the like has occurred.

[0096] Furthermore, the determination unit 32 may have a function of constantly monitoring whether or not the driver is gripping the steering wheel 41. Depending on the type (level) of autonomous driving, it may be required to always grip the steering wheel 41. Therefore, for example, when the determination unit 32 determines that the driver has taken their hands off the steering wheel 41, the processing unit 33 may execute a process of warning the driver to grip the steering wheel 41.

[0097] The steering wheel 41 has a rim 42 that functions as a grip for the driver and has an annular shape. The hub 43 is connected to an axis (shaft) extending from the vehicle and is located in the center of the steering wheel 41. The spokes 44 are parts that connect the rim 42 and the hub 43. There may be one spoke 44, but two or more spokes are preferred because they increase the strength of the steering wheel 41. For example, it is preferred that multiple spokes 44 (typically two to four) are provided radially from the hub 43 as the center.

[0098] The hub 43 and the spokes 44 may be provided with an operation switch or an operation panel (touch panel).

[0099] In addition to the steering wheel 41, the operation unit 40 may have operation levers such as a column shift and a paddle shift, and operation levers for turn signals, wipers, and the like.

[0100] Here, it is preferable that a portion of the light receiving and emitting unit 20 is provided on the surface of the hub 43. This allows the driver to get in the car and acquire data for authentication by simply touching or holding their finger or palm over the surface of the hub 43. It is also preferable that a portion of the light receiving and emitting unit 20 is provided along the surface of the rim 42 of the steering wheel 41. This allows light reception data from part of the palm of the driver's hand to be acquired when the driver grips the rim 42.

[0101] [Configuration Example 1-1] 5B shows a perspective view of an example of a steering wheel 41 equipped with the light receiving and emitting unit 20. In FIG. 5B, a part of a shaft 45 connected to a hub 43 is also clearly shown.

[0102] FIG. 5B shows an example in which the light emitting and receiving unit 20 is provided on the driver side surface of the hub 43.

[0103] The right side of FIG. 5B shows an enlarged view of a portion of the light-emitting and receiving unit 20. In the light-emitting and receiving unit 20, three light-emitting elements 21 and one light-receiving element 22 form a unit (pixel), a total of four of which are arranged in a matrix. For example, a pixel may be configured to include three types of light-emitting elements 21, i.e., red, green, and blue, and a light-receiving element 22 that is sensitive to visible light. Alternatively, a pixel may be configured to include four types of light-emitting elements, i.e., a light-emitting element that emits infrared light in addition to the red, green, and blue light-emitting elements, and a light-receiving element 22 that is sensitive to infrared light or to both infrared light and visible light. Note that the arrangement of the light-emitting elements 21 and the light-receiving elements 22 is not limited to this, and various arrangement methods may be employed.

[0104] For example, biometric information such as a fingerprint, palm print, and vein pattern can be acquired and used for authentication using the light receiving and emitting unit 20. Fig. 5C shows a state in which the index finger of a hand 35 is touching the light receiving and emitting unit 20. Fig. 5D shows a state in which the palm of a hand 35 is held over the light receiving and emitting unit 20.

[0105] The light emitting and receiving unit 20 provided in the hub 43 may have a function of displaying an image and a function of detecting a touch operation or a gesture operation. For example, the light emitting and receiving unit 20 may function as a touch panel. This allows various information to be displayed on the light emitting and receiving unit 20. For example, the light emitting and receiving unit 20 may be used as a display unit of a navigation system.

[0106] [Configuration Example 1-2] FIG. 6 shows an example in which light emitting and receiving parts are provided along the surface of the spokes 44.

[0107] 6, of the three spokes 44, the lower spoke 44 is provided with the light receiving and emitting unit 20b, the left spoke 44 is provided with multiple light receiving and emitting units 20c, and the right spoke 44 is provided with multiple light receiving and emitting units 20d. Note that the number of spokes 44 and the number of light receiving and emitting units are not limited to this and can be changed appropriately depending on the purpose.

[0108] The light emitting and receiving units 20b, 20c, and 20d each have a configuration in which a light emitting element and a light receiving element are arranged side by side, similar to the light emitting and receiving unit 20.

[0109] For example, fingerprint information of the driver can be acquired by the light receiving and emitting unit 20b and authentication can be performed using this information. Fig. 6 shows a state in which the fingers of a hand 35 are held over the light receiving and emitting unit 20b.

[0110] Preferably, the light receiving and emitting units 20c and 20d each function as a touch sensor. By touching the light receiving and emitting units 20c and 20d, the driver can operate the vehicle's navigation system, audio system, call system, etc. Also, the light receiving and emitting units 20c and 20d may be configured to enable various operations, such as adjusting the rearview mirror, adjusting the side mirrors, turning on / off and adjusting the brightness of the interior lights, and opening and closing the windows.

[0111] Furthermore, it is preferable that the light emitting and receiving units 20b, 20c, and 20d each include a light emitting element that emits visible light. Alternatively, they may include both a light emitting element that emits visible light and a light emitting element that emits infrared light. This allows the location of the light emitting and receiving units to be indicated to the driver even at night. Alternatively, concave and convex portions may be provided on the surfaces of the light emitting and receiving units 20b, 20c, and 20d or in the vicinity thereof to indicate the location of the light emitting and receiving units.

[0112] [Configuration Example 1-3] 7A shows an example in which the light emitting and receiving unit 20a is provided along the surface of an annular rim 42. The rim 42 is processed so that the surface located in front of the driver is flat, and the light emitting and receiving unit 20a is provided along this flat surface.

[0113] 7A shows an enlarged view of a portion of the light-emitting and receiving unit 20a. The light-emitting and receiving unit 20a has light-emitting elements 21 and light-receiving elements 22 arranged alternately in a matrix. The arrangement of the light-emitting elements 21 and light-receiving elements 22 is not limited to this, and various arrangement methods can be used. For example, similar to the light-emitting and receiving unit 20, multiple types of light-emitting elements that emit visible light may be included.

[0114] 7B shows the driver holding the rim 42 with his left hand 35L and right hand 35R. At this time, the light-emitting element 21 emits light and the light-receiving element 22 receives it, allowing images to be captured of a portion of the palm of each of the driver's left hand 35L and right hand 35R. Because the light-emitting and receiving unit 20a has an annular upper surface shape similar to the surface of the rim 42, it is possible to always capture images no matter where on the rim 42 the left hand 35L and right hand 35R are holding the rim 42.

[0115] The light emitting and receiving unit 20a is disposed on the driver's side surface of the rim 42, so that the light emitting and receiving unit 20a is located within the driver's field of vision. In this case, by using a light emitting element that emits infrared light as the light emitting element 21, it is possible to capture images without causing the driver to feel dazzled.

[0116] Note that a light-emitting element that emits visible light may be used as the light-emitting element 21. In that case, it is important to reduce the luminance of the light emitted during imaging to a level that does not dazzle the driver. For example, it is preferable to reduce the luminance of the light-emitting element 21 at night compared to during the day.

[0117] FIG. 8A shows an example of a schematic cross-sectional view of the rim 42.

[0118] The rim 42 has a member 42a and a member 42b. The member 42b is translucent. The light receiving and emitting unit 20a is located inside the rim 42 and is provided along a part of the member 42b. The light receiving and emitting unit 20a can emit light 25 through the translucent member 42b. Furthermore, reflected light 25r reflected by the object passes through the member 42b and enters the light receiving and emitting unit 20a.

[0119] 8A, a part of the surface of member 42b (the surface that comes into contact with the hand) is flat. This allows the imaging surface to be flat, so that when capturing an image used for authentication, such as a fingerprint, palm print, or blood vessel shape, an image with little distortion can be captured.

[0120] 8B, the surface may be curved. This allows the cross section of the rim 42 to be annular, making it easier for the driver to grip the rim 42 without feeling uncomfortable compared to a flat surface. Also, a part of the member 42b can function as a lens.

[0121] 8A and 8B, the light emitting and receiving unit 20a is preferably attached to a flat surface, which eliminates the need to provide flexibility to the light emitting and receiving unit 20a, thereby reducing manufacturing costs.

[0122] [Configuration Example 1-4] The steering wheel 41 shown in FIG. 9A is an example in which the light emitting and receiving parts 20a are provided along the outer periphery of the rim .

[0123] Figure 9B shows a schematic cross-sectional view of the rim 42 taken along the cutting plane A shown in Figure 9A. Figure 9B roughly corresponds to Figure 8A rotated 90 degrees clockwise.

[0124] 9A and 9B, a strip-shaped light emitting and receiving unit 20a is attached along a member 42b. Since the light emitting and receiving unit 20a needs to be attached to a curved surface, it is preferable that the unit be flexible. For example, the light emitting and receiving unit 20a preferably uses an organic resin as a base material on which the light emitting element 21 and the light receiving element 22 are supported. Alternatively, the base material may be thin glass or the like that is flexible.

[0125] [Configuration Example 1-5] The steering wheel 41 shown in FIG. 9C is an example in which the light emitting and receiving units 20a are arranged on most of the surface of the rim .

[0126] FIG. 9D shows a schematic cross-sectional view of the rim 42. The rim 42 has members 42a and 42b. Member 42a is located on the rear side of the rim 42 (the side opposite the driver's side). The light receiving and emitting unit 20a is provided along the inner surface of member 42b. The inner surface of member 42b is a curved surface (a three-dimensional curved surface) that is not developable, and the light receiving and emitting surface of the light receiving and emitting unit 20a also forms a three-dimensional curved surface. Therefore, when the light receiving and emitting unit 20a is attached along the inner surface of member 42a, it is preferable that the light receiving and emitting unit 20a be stretchable. For example, it is preferable that the light emitting and receiving unit 20a uses an elastic material such as rubber as a base material on which the light emitting element 21 and the light receiving element 22 are supported.

[0127] The configuration shown in Figure 9C allows for a larger imageable area, improving the sensitivity of the image. For example, when estimating a pulse wave from the time-dependent change in skin reflectance, higher sensitivity is preferable because it increases measurement accuracy. Furthermore, fingerprints, palm prints, blood vessel shapes, and other elements used for authentication can be captured over a wider area, improving the accuracy of authentication.

[0128] [Configuration Example 1-6] 10A is an example in which the light emitting and receiving unit 20 provided on the hub 43 has substantially the same shape (circular in this case) as the outer shape of the hub 43. By providing the light emitting and receiving unit 20 over substantially the entire surface of the hub 43 in this way, the design can be improved compared to when the light emitting and receiving unit 20 is rectangular.

[0129] FIG. 10B shows a state in which the palm of a hand 35 is held over the light emitting and receiving unit 20.

[0130] The surface of the hub 43 may be curved. In this case, as with the member 42b illustrated in Fig. 8B, a configuration may be adopted in which a translucent protective member covering the light-emitting and receiving surface has a curved surface, and the light-emitting and receiving surface of the light-emitting and receiving unit 20 is flat. Alternatively, the light-emitting and receiving surface of the light-emitting and receiving unit 20 may be curved. In this case, the light-emitting and receiving surface of the light-emitting and receiving unit 20 may be a developable surface or a three-dimensional curved surface.

[0131] 10C shows an example in which the light emitting and receiving unit 20 is provided to cover the surface of the hub 43, which has an asymmetrical shape in the up-down direction. The light emitting and receiving unit is provided not only on the surface on the driver side of the hub 43, but also on the side surfaces.

[0132] Fig. 10D shows a developed view of a display panel 70 that can be used in the light receiving and emitting unit 20 shown in Fig. 10C. The display panel 70 has a display area 71a in the center, and rectangular display areas 71b to 71e on each of its four sides. Drive circuits 72x and 72y are connected to the display areas 71b to 71e. Three holes 73 through which the spokes 44 pass are provided in the display areas 71c to 71e.

[0133] In configuration examples 1-3 to 1-6, the rim 42 and the hub 43 are each provided with a light-emitting and receiving unit, and therefore the information acquired by the light-emitting and receiving unit 20a provided on the rim 42 may be different from the information acquired by the light-emitting and receiving unit 20 provided on the hub 43. For example, the light-emitting and receiving unit 20 acquires an image for authentication as information, and the light-emitting and receiving unit 20a acquires information on the change in skin reflectance over time. In this case, the light-emitting and receiving unit 20 needs to capture a high-resolution image, so the light-receiving elements 22 are arranged at a high density. On the other hand, the light-emitting and receiving unit 20a does not require high resolution, so the light-receiving elements 22 are arranged at a lower density than the light-emitting and receiving unit 20. In this way, the configuration of the light-emitting and receiving unit can be changed depending on the information to be acquired.

[0134] 10A and 10B, the light receiving and emitting unit 20a provided on the rim 42 is shown as having the same configuration as in FIG. 7A etc., but is not limited to this and the configuration shown in FIG. 9A or 9C can also be applied.

[0135] Furthermore, in the above description, the light emitting and receiving units 20 provided on the rim 42 are all provided in a continuous manner along the circumferential direction of the rim 42, but the light emitting and receiving units 20 do not necessarily have to have a continuous annular shape, and may have an arc-shaped upper surface that follows the surface of the rim 42. In other words, there may be portions in the circumferential direction of the rim 42 where no light emitting and receiving units 20 are provided. Furthermore, multiple light emitting and receiving units 20 may be arranged along the surface of the rim 42. In this case, the multiple light emitting and receiving units 20 may be arranged so that two adjacent light emitting and receiving units 20 overlap each other, thereby forming a continuous light emitting and receiving region along the circumferential direction of the rim 42.

[0136] [Configuration example of light receiving and emitting unit] Below, a configuration example of a light emitting and receiving unit including two or more types of light emitting elements will be described. In the light emitting and receiving unit exemplified below, the light emitting elements can be used not only as a light source for capturing images but also for displaying images. In other words, the light emitting and receiving unit exemplified below also functions as a display unit. Such a light emitting and receiving unit can be applied to the light emitting and receiving unit 20 and the light emitting and receiving units 20a to 20d, etc.

[0137] 10E to 10G show enlarged views of the light emitting and receiving unit.

[0138] 10E includes a light-emitting element 21B that emits blue light, a light-emitting element 21IR that emits infrared light, and a light-receiving element 22. The light-receiving element 22 is a photoelectric conversion element that is sensitive to at least infrared light. The light-receiving element 22 may be sensitive to both blue and infrared light.

[0139] The light emitting / receiving unit shown in Fig. 10E can display a blue image, light up in blue, etc. Blue light is preferable because it is less dazzling and does not interfere with driving even when it is turned on at night. Note that the light emitting element that emits visible light provided in the light emitting / receiving unit is not limited to a light emitting element that emits blue light, and light emitting elements of other colors such as red and green may also be used.

[0140] 10F includes a light emitting element 21R that emits red light, a light emitting element 21G that emits green light, a light emitting element 21B that emits blue light, a light emitting element 21IR that emits infrared light, and a light receiving element 22. The light receiving element 22 is a photoelectric conversion element that is sensitive to at least infrared light. The light receiving element 22 may further be sensitive to at least one of red, blue, and green light.

[0141] The light emitting and receiving unit shown in Fig. 10F can display a full-color image. Furthermore, even when no image is displayed, i.e., when no visible light is emitted from the light emitting and receiving unit, imaging can be performed using infrared light.

[0142] 10G includes a light emitting element 21R that emits red light, a light emitting element 21G that emits green light, a light emitting element 21B that emits blue light, and a light receiving element 22. The light receiving element 22 is sensitive to at least one of red, blue, and green.

[0143] The light receiving and emitting unit shown in FIG. 10G has the function of capturing images using visible light as a light source, rather than infrared light. It can also display full-color images. Furthermore, since the light emitting element 21IR is not provided, as compared to FIG. 10F, it is possible to arrange pixels at a higher density, allowing for capturing higher-resolution images. Alternatively, since the area of ​​the light receiving element can be increased, the sensitivity of the light receiving element can be improved. Alternatively, since the area of ​​each light emitting element can be increased, the brightness of the emitted light can be increased.

[0144] [Example of operation] An example of a method of operation of the vehicle control device 10 according to one aspect of the present invention will now be described.

[0145] Fig. 11 is a flowchart relating to the operation of the vehicle control device 10. The flowchart shown in Fig. 11 includes steps S0 to S6.

[0146] First, in step S0, the operation starts.

[0147] In step S1, light reception data is acquired by the light receiving and emitting unit 20, etc. Specifically, the light emitting element 21 is caused to emit light, the light is received by the light receiving element 22, and the light reception data is read out by the readout circuit 24. Also, in step S1, the light reception data may be output from the readout circuit 24 to the control unit 30.

[0148] In step S2, the data generation unit 31 extracts biometric data. Specifically, the data generation unit 31 generates necessary biometric data from the received light data supplied from the light receiving and emitting unit 20. For example, vital data such as pulse wave waveform data, heart rate, pulse rate, blood oxygen saturation, blood pressure, stress level, blood glucose level, body temperature, triglyceride concentration, and blood alcohol concentration can be generated. Furthermore, biometric data such as fingerprints, palm prints, and blood vessel shapes can also be generated.

[0149] In step S3, the determination unit 32 determines whether or not to execute the process. If the process is to be executed, the process proceeds to step S4. If the process is not to be executed, the process returns to step S1.

[0150] In step S3, the determination unit 32 can make a determination based on the above-mentioned biometric data. Alternatively, the determination unit 32 may make a determination based on two or more of the above-mentioned biometric data.

[0151] In step S4, the processing unit 33 executes the process.

[0152] In step S5, it is determined whether or not to end the operation. If the operation is to be ended based on the processing executed by the processing unit 33, the process proceeds to step S6 and ends. If the operation is not to be ended (the operation is to be continued), the process returns to step S1.

[0153] The above is a description of an example of the operation method.

[0154] In the above-described driving method example, various data can be used as biometric data that can be used for the determination by the determination unit 32. Furthermore, there are a wide variety of processes that can be executed by the processing unit 33 based on the determination by the determination unit 32. An example of such a process will be described below.

[0155] Fig. 12 shows a flowchart of an operation for executing authentication processing based on biometric data and putting the vehicle into a drivable state (idling state). In the flowchart shown in Fig. 12, steps S2 to S4 in Fig. 11 are replaced with steps S12 to S14.

[0156] In step S12, the data generating unit 31 extracts image data such as fingerprints, palm prints, and vein patterns as biometric data.

[0157] In step S13, authentication processing is executed. For example, the fingerprint, palm print, or vein pattern information acquired in step S12 is compared with the driver's pre-registered biometric information to determine whether they match. This determination can be made using an authentication method such as a pattern matching method that does not use a machine learning model, or authentication that uses a machine learning model. If the user is authenticated (authentication OK), the process proceeds to step S14; if the user is not authenticated, the process returns to step S1.

[0158] If authentication is not possible in step S13, there is a risk of theft, so security measures may be taken, such as sounding an alarm, reporting to the police and providing the current location and an image of the culprit, or locking the vehicle doors to prevent escape.

[0159] In step S14, the vehicle can be brought into a state where it can be driven (idling state). In addition, as described above, a process for preparing the in-vehicle environment to suit the driver's preferences may be executed.

[0160] This concludes the description of the flowchart in FIG.

[0161] Fig. 13 shows a flowchart of the operation of determining the driver's wakefulness state and warning the driver if there is a risk of drowsy driving. In the flowchart shown in Fig. 13, steps S2 to S4 in Fig. 11 are replaced with steps S22 to S24.

[0162] In step S22, the data generating unit 31 extracts the heart rate as vital data.

[0163] In step S23, the determination unit 32 determines whether the wakefulness level is below a certain level based on the change in heart rate. If the wakefulness level is below the certain level, the process proceeds to step S24. On the other hand, if the wakefulness level exceeds the certain level, the process returns to step S1.

[0164] For example, the determination unit 32 can estimate the driver's alertness level from a slowing of the heart rate itself, a change in the fluctuation of the heart rate, and the like.

[0165] In step S24, the processing unit 33 performs a warning process for the driver. The warning process can make the driver aware of a decrease in alertness level or encourage the driver to be alert by providing a stimulus to the driver's vision, hearing, touch, or smell. Specific examples of the process performed by the processing unit 33 include playing a sound, increasing the volume, vibrating the seat, seat belt, steering wheel, etc., changing the brightness inside the vehicle, opening a window, and dispersing a fragrance from an aroma diffuser.

[0166] This concludes the description of the flowchart in FIG.

[0167] If the level of arousal is too high, it can be determined that the driver is in an excited state, and processing can be executed to make the driver aware of the situation or to calm the driver down.

[0168] In this way, the vehicle control device according to one aspect of the present invention can monitor various physical conditions of the driver and changes therein from vital data obtainable by the light receiving and emitting unit, and can execute various processes according to the driver's condition so as to continue safe driving or to avoid danger.

[0169] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0170] (Embodiment 2) In this embodiment, a configuration example of a stacked panel, which is one mode of a display panel that can be easily enlarged, and its application example will be described with reference to the drawings.

[0171] One embodiment of the present invention is a display panel that can be enlarged by arranging multiple display panels so that they partially overlap. Of the two overlapping display panels, at least the display panel located on the display surface side (upper side) has a portion that is adjacent to the display section and transmits visible light. Pixels of the lower display panel and the portion of the upper display panel that transmits visible light are arranged to overlap. This allows images displayed on the two display panels to be displayed continuously and seamlessly when viewed from the display surface side (in a plan view).

[0172] For example, one embodiment of the present invention is a stacked panel including a first display panel and a second display panel. The first display panel has a first region, which includes a first pixel and a second pixel. The second display panel has a second region, a third region, and a fourth region. The second region includes a third pixel, and the third region has a function of transmitting visible light, and the fourth region has a function of blocking visible light. The second pixel of the first display panel and the third region of the second display panel overlap each other. The aperture ratio of the second pixel is preferably larger than that of the first pixel.

[0173] The display device including the light-emitting element and the light-receiving element exemplified above can be used for one or both of the first display panel and the second display panel. In other words, it can be said that at least one of the first pixel, the second pixel, and the third pixel has a light-emitting element and a light-receiving element.

[0174] More specifically, for example, the following configuration can be adopted.

[0175] [Configuration example 1] [Display panel] FIG. 14A is a schematic top view of a display panel 500 included in a display device according to one embodiment of the present invention.

[0176] The display panel 500 includes a display area 501, an area 510 that transmits visible light, and an area 520 that has a portion that blocks visible light, both adjacent to the display area 501. Fig. 18A shows an example in which an FPC (Flexible Printed Circuit) 512 is provided on the display panel 500.

[0177] Here, even when the display panel 500 is a standalone unit, it is possible to display an image in the display area 501. Furthermore, even when the display panel 500 is a standalone unit, it is possible to capture an image using the display area 501.

[0178] The region 510 may be provided with, for example, a pair of substrates constituting the display panel 500 and a sealant for sealing a display element sandwiched between the pair of substrates. In this case, a material that is translucent to visible light is used for the members provided in the region 510.

[0179] The region 520 is provided with wirings that are electrically connected to pixels included in the display region 501, for example. In addition to such wirings, driver circuits (scanning line driver circuits, signal line driver circuits, etc.) for driving the pixels, protective circuits, and other circuits may also be provided. The region 520 also includes a region provided with terminals (also referred to as connection terminals) that are electrically connected to the FPC 512, and wirings that are electrically connected to the terminals.

[0180] For detailed descriptions of examples of cross-sectional configurations of the display panel, other embodiments can be cited.

[0181] [Laminated panel] A stacked panel 550 according to one embodiment of the present invention includes a plurality of the above-described display panels 500. Figure 14B shows a schematic top view of a stacked panel 550 including three display panels.

[0182] In the following description, when distinguishing between display panels, components included in display panels, or components related to display panels, letters will be added after their reference numerals. Unless otherwise specified, the letter "a" will be added to the display panel and its components that are located at the bottom (opposite the display surface) of multiple display panels that are partially overlapped with each other, and letters will be added in alphabetical order after the reference numerals of one or more display panels and their components that are located above it. Unless otherwise specified, even when describing a configuration including multiple display panels, the letters will be omitted when describing matters common to each display panel or component.

[0183] The stacked panel 550 shown in FIG. 14B includes a display panel 500a, a display panel 500b, and a display panel 500c.

[0184] Display panel 500b is disposed so that a portion thereof overlaps the upper side (display surface side) of display panel 500a. Specifically, display region 501a of display panel 500a and region 510b of display panel 500b that transmits visible light overlap, and display region 501a of display panel 500a and region 520b of display panel 500b that shields visible light do not overlap.

[0185] Furthermore, display panel 500c is disposed such that a portion thereof overlaps the upper side (display surface side) of display panel 500b. Specifically, display region 501b of display panel 500b and region 510c of display panel 500c that transmits visible light overlap, and display region 501b of display panel 500b and region 520c of display panel 500c that shields visible light do not overlap.

[0186] Since region 510b, which transmits visible light, is superimposed on display region 501a, the entire display region 501a can be viewed from the display surface side. Similarly, since region 510c is superimposed on display region 501b, the entire display region 501b can be viewed from the display surface side. Therefore, the region in which display region 501a, display region 501b, and display region 501c are seamlessly arranged can be used as display region 551 of stacked panel 550.

[0187] The stacked panel 550 can expand the display area 551 by the number of display panels 500. In this case, by using display panels with an imaging function (i.e., display panels having pixels each having a light-emitting element and a light-receiving element) for all the display panels 500, the entire display area 551 can be used as an imaging area.

[0188] However, without being limited to this, a display panel having an imaging function and a display panel not having an imaging function (for example, not having a light receiving element) may be combined. For example, a display panel having an imaging function may be applied only to a necessary portion, and a display panel not having an imaging function may be applied to other portions.

[0189] [Configuration example 2] Although FIG. 14B shows a configuration in which a plurality of display panels 500 are arranged overlapping in one direction, a plurality of display panels 500 may be arranged overlapping in two directions, that is, the vertical direction and the horizontal direction.

[0190] Fig. 15A shows an example of a display panel 500 having a different shape of region 510 from that of Fig. 14A. In the display panel 500 shown in Fig. 15A, regions 510 that transmit visible light are arranged along two sides of a display region 501.

[0191] Fig. 15B shows a schematic perspective view of a stacked panel 550 in which two display panels 500 shown in Fig. 15A are arranged vertically and two horizontally. Fig. 15C is a schematic perspective view of stacked panel 550 as seen from the opposite side to the display surface side.

[0192] 15B and 15C, a region along the short side of display region 501a of display panel 500a overlaps with a portion of region 510b of display panel 500b. Also, a region along the long side of display region 501a of display panel 500a overlaps with a portion of region 510c of display panel 500c. Also, region 510d of display panel 500d overlaps with a region along the long side of display region 501b of display panel 500b and a region along the short side of display region 501c of display panel 500c.

[0193] Therefore, as shown in FIG. 15B, a region in which display region 501a, display region 501b, display region 501c, and display region 501d are seamlessly arranged can be used as display region 551 of stacked panel 550.

[0194] Here, it is preferable that the pair of substrates used in the display panel 500 be made of a flexible material, thereby making the display panel 500 flexible. This allows, for example, as shown in FIG. 15B and FIG. 15C , when an FPC 512a or the like is provided on the display surface side, a portion of the display panel 500a on the side where the FPC 512a is provided to be curved, and the FPC 512a can be arranged to overlap the underside of the display region 501b of the adjacent display panel 500b. As a result, the FPC 512a can be arranged without physically interfering with the rear surface of the display panel 500b. Furthermore, since the thickness of the FPC 512a does not need to be considered when overlapping and bonding the display panels 500a and 500b, the difference in height between the upper surface of the region 510b of the display panel 500b and the upper surface of the display region 501a of the display panel 500a can be reduced. As a result, it is possible to prevent the edge of the display panel 500b located above the display region 501a from being visible.

[0195] Furthermore, by providing flexibility to each display panel 500, display panel 500b can be gently curved so that the height of the upper surface of display region 501b of display panel 500b matches the height of the upper surface of display region 501a of display panel 500a. Therefore, the heights of the display regions can be made uniform except for the vicinity of the area where display panels 500a and 500b overlap, thereby improving the display quality of images displayed in display region 551 of stacked panel 550.

[0196] Although the relationship between the display panel 500a and the display panel 500b has been described above as an example, the same applies to the relationship between two adjacent display panels.

[0197] Furthermore, it is preferable that the thickness of the display panel 500 is thin in order to reduce the step between two adjacent display panels 500. For example, it is preferable that the thickness of the display panel 500 is 1 mm or less, preferably 300 μm or less, and more preferably 100 μm or less.

[0198] Furthermore, a substrate (for example, the second substrate in the first embodiment) may be provided to protect the display region 551 of the stacked panel 550. In this case, the substrate may be provided for each display panel, or one substrate may be provided across multiple display panels.

[0199] Although a configuration in which four display panels 500 are stacked is shown here, an extremely large stacked panel can be created by increasing the number of display panels 500. Furthermore, by changing the arrangement of the multiple display panels 500, the contour shape of the display area of ​​the stacked panel can be made into various shapes, such as a circle, an ellipse, or a polygon. Furthermore, by arranging the display panels 500 three-dimensionally, a stacked panel having a display area with a three-dimensional shape can be realized.

[0200] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0201] (Embodiment 3) In this embodiment, a light emitting and receiving device according to one embodiment of the present invention will be described. The display device exemplified below can be suitably used for the light emitting and receiving portion of the vehicle control device described in Embodiment 1.

[0202] The light-emitting and receiving portion of the light-emitting and receiving device of one embodiment of the present invention includes a light-receiving element (also referred to as a light-receiving device) and a light-emitting element (also referred to as a light-emitting device). The light-emitting and receiving portion has a function of displaying an image using the light-emitting element. Furthermore, the light-emitting and receiving portion has one or both of an imaging function and a detection function using the light-receiving element. Therefore, the light-emitting and receiving device of one embodiment of the present invention can also be expressed as a display device, and the light-emitting and receiving portion can also be expressed as a display portion.

[0203] Alternatively, the light-emitting and receiving device of one embodiment of the present invention may have a structure including a light-emitting and receiving element (also referred to as a light-emitting and receiving device) and a light-emitting element.

[0204] First, a light receiving and emitting device having a light receiving element and a light emitting element will be described.

[0205] A light-emitting and receiving device of one embodiment of the present invention includes a light-receiving element and a light-emitting element in a light-receiving and light-emitting portion. In the light-emitting and receiving device of one embodiment of the present invention, the light-emitting and receiving portion includes light-emitting elements arranged in a matrix, and an image can be displayed by the light-receiving and light-emitting portion. The light-receiving and light-emitting portion also includes light-receiving elements arranged in a matrix, and the light-receiving and light-emitting portion has one or both of an imaging function and a detection function. The light-emitting and receiving portion can be used as an image sensor, a touch sensor, or the like. That is, by detecting light in the light-emitting and receiving portion, an image can be captured and a touch operation of an object (such as a finger or a pen) can be detected. Furthermore, the light-emitting and receiving device of one embodiment of the present invention can use the light-emitting element as a light source for a sensor. Therefore, a light-receiving portion and a light source do not need to be provided separately from the light-emitting and receiving device, and the number of components in an electronic device can be reduced.

[0206] In the light-emitting and receiving device of one embodiment of the present invention, when light emitted by a light-emitting element included in the light-emitting and receiving unit is reflected (or scattered) by an object, the light-receiving element can detect the reflected light (or scattered light). This makes it possible to capture images, detect touch operations, and the like even in dark places.

[0207] The light-emitting element included in the light-emitting and receiving device of one embodiment of the present invention functions as a display element (also referred to as a display device).

[0208] As the light-emitting element, it is preferable to use an EL element (also called an EL device) such as an OLED or QLED. Examples of light-emitting substances contained in EL elements include fluorescent materials, phosphorescent materials, and thermally activated delayed fluorescence (TADF materials). As the light-emitting substance contained in EL elements, not only organic compounds but also inorganic compounds (quantum dot materials, etc.) can be used. Furthermore, LEDs such as micro LEDs can also be used as light-emitting elements.

[0209] A light-receiving and light-emitting device according to one embodiment of the present invention has a function of detecting light using a light-receiving element.

[0210] When the light receiving element is used in an image sensor, the light receiving and emitting device can capture an image using the light receiving element. For example, the light receiving and emitting device can be used as a scanner.

[0211] An electronic device to which the light-emitting and receiving device of one embodiment of the present invention is applied can acquire data related to biometric information such as a fingerprint or palm print by using a function as an image sensor. That is, a biometric authentication sensor can be built into the light-emitting and receiving device. The built-in biometric authentication sensor in the light-emitting and receiving device can reduce the number of components in the electronic device compared to a case in which a biometric authentication sensor is provided separately from the light-emitting and receiving device, thereby enabling the electronic device to be made smaller and lighter.

[0212] Furthermore, when the light receiving element is used as a touch sensor, the light receiving and emitting device can detect a touch operation of an object using the light receiving element.

[0213] The light receiving element can be, for example, a pn-type or pin-type photodiode. The light receiving element functions as a photoelectric conversion element (also called a photoelectric conversion device) that detects light incident on the light receiving element and generates electric charge. The amount of electric charge generated by the light receiving element is determined based on the amount of light incident on the light receiving element.

[0214] In particular, it is preferable to use an organic photodiode having a layer containing an organic compound as the light-receiving element. Organic photodiodes can be easily made thin, lightweight, and large in area, and have a high degree of freedom in shape and design, making them applicable to a variety of devices.

[0215] In one embodiment of the present invention, an organic EL element (also referred to as an organic EL device) is used as a light-emitting element, and an organic photodiode is used as a light-receiving element. The organic EL element and the organic photodiode can be formed on the same substrate. Therefore, the organic photodiode can be built into a display device using the organic EL element.

[0216] If all the layers constituting the organic EL element and the organic photodiode were to be fabricated separately, the number of film formation processes would be enormous. However, since the organic photodiode has many layers that can be configured in common with the organic EL element, the layers that can be configured in common can be formed in one go, thereby suppressing the increase in film formation processes.

[0217] For example, one of the pair of electrodes (common electrode) can be a layer common to the light-receiving element and the light-emitting element. Furthermore, for example, at least one of the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer can be a layer common to the light-receiving element and the light-emitting element. By having a common layer for the light-receiving element and the light-emitting element in this way, the number of film formations and the number of masks can be reduced, thereby reducing the manufacturing process and manufacturing costs of the light-receiving and light-emitting device. Furthermore, a light-receiving and light-emitting device having a light-receiving element can be manufactured using existing manufacturing equipment and manufacturing methods for display devices.

[0218] Next, a light emitting / receiving device having a light emitting / receiving element and a light emitting / receiving element will be described. Note that the description of the same functions, actions, effects, etc. as those described above may be omitted.

[0219] In the light-emitting and receiving device of one embodiment of the present invention, the subpixels that exhibit one of the colors have light-emitting and light-emitting elements instead of light-emitting elements, and the subpixels that exhibit the other colors have light-emitting elements. The light-emitting and light-emitting elements have both a function of emitting light (light-emitting function) and a function of receiving light (light-receiving function). For example, when a pixel has three subpixels, namely, a red subpixel, a green subpixel, and a blue subpixel, at least one subpixel has a light-emitting and light-emitting element, and the other subpixels have light-emitting elements. Therefore, the light-emitting and receiving portion of the light-emitting and receiving device of one embodiment of the present invention has a function of displaying an image using both the light-emitting and light-emitting elements and the light-emitting elements.

[0220] By using a light-receiving / light-emitting element that serves as both a light-emitting element and a light-receiving element, a pixel can be given a light-receiving function without increasing the number of sub-pixels included in the pixel. This allows one or both of an imaging function and a detection function to be added to the light-receiving / light-emitting portion of the light-receiving / light-emitting device while maintaining the aperture ratio of the pixel (aperture ratio of each sub-pixel) and the resolution of the light-receiving / light-emitting device. Therefore, the light-receiving / light-emitting device of one embodiment of the present invention can have a higher pixel aperture ratio and can easily achieve higher resolution than a device in which sub-pixels having light-emitting elements are provided separately from sub-pixels having light-emitting elements.

[0221] In a light-emitting and receiving device according to one embodiment of the present invention, light-emitting and receiving elements and light-emitting elements are arranged in a matrix in a light-emitting and receiving portion, and an image can be displayed in the light-emitting and receiving portion. The light-emitting and receiving portion can be used for an image sensor, a touch sensor, or the like. The light-emitting and receiving device according to one embodiment of the present invention can use the light-emitting element as a light source for the sensor. Therefore, imaging and detection of touch operations can be performed even in a dark place.

[0222] Light-emitting and receiving elements can be fabricated by combining an organic EL element and an organic photodiode. For example, a light-emitting and receiving element can be fabricated by adding an active layer of an organic photodiode to the layered structure of an organic EL element. Furthermore, a light-emitting and receiving element fabricated by combining an organic EL element and an organic photodiode can suppress an increase in the number of film-forming steps by simultaneously depositing layers that can be configured in common with the organic EL element.

[0223] For example, one of the pair of electrodes (common electrode) may be a layer common to the light-emitting and light-emitting elements. Also, for example, at least one of the hole injection layer, hole transport layer, electron transport layer, and electron injection layer may be a layer common to the light-emitting and light-emitting elements.

[0224] Note that the layers of the light emitting / receiving element may have different functions depending on whether the light emitting / receiving element functions as a light receiving element or a light emitting element. In this specification, the components are referred to based on their functions when the light emitting / receiving element functions as a light emitting element.

[0225] The light-emitting and receiving device of this embodiment has a function of displaying an image using a light-emitting element and a light-emitting and receiving element. That is, the light-emitting element and the light-emitting and receiving element function as display elements.

[0226] The light emitting and receiving device of this embodiment has a function of detecting light using a light emitting and receiving element, which can detect light having a shorter wavelength than light emitted by the light emitting and receiving element itself.

[0227] When the light emitting and receiving elements are used in an image sensor, the light emitting and receiving device of the present embodiment can capture an image using the light emitting and receiving elements. When the light emitting and receiving elements are used in a touch sensor, the light emitting and receiving device of the present embodiment can detect a touch operation of an object using the light emitting and receiving elements.

[0228] The light-receiving / light-emitting element functions as a photoelectric conversion element. The light-receiving / light-emitting element can be fabricated by adding an active layer of a light-receiving element to the configuration of the light-emitting element. For example, the active layer of a pn-type or pin-type photodiode can be used for the light-receiving / light-emitting element.

[0229] In particular, it is preferable to use an organic photodiode active layer having a layer containing an organic compound as the light-receiving / light-emitting element. Organic photodiodes can be easily made thin, lightweight, and large in area, and have a high degree of freedom in shape and design, making them applicable to a variety of devices.

[0230] A display device, which is an example of a light-emitting and receiving device according to one embodiment of the present invention, will be described in more detail below with reference to the drawings.

[0231] [Display device configuration example 1] [Configuration Example 1-1] 16A is a schematic diagram of a display panel 200. The display panel 200 includes a substrate 201, a substrate 202, a light receiving element 212, a light emitting element 211R, a light emitting element 211G, a light emitting element 211B, a functional layer 203, and the like.

[0232] The light-emitting element 211R, the light-emitting element 211G, the light-emitting element 211B, and the light-receiving element 212 are provided between the substrate 201 and the substrate 202. The light-emitting element 211R, the light-emitting element 211G, and the light-emitting element 211B emit red (R), green (G), or blue (B) light, respectively. Note that hereinafter, when there is no need to distinguish between the light-emitting element 211R, the light-emitting element 211G, and the light-emitting element 211B, they may be referred to as the light-emitting element 211.

[0233] The display panel 200 has a plurality of pixels arranged in a matrix. Each pixel has one or more sub-pixels. Each sub-pixel has one light-emitting element. For example, a pixel may have three sub-pixels (e.g., three colors of R, G, and B, or three colors of yellow (Y), cyan (C), and magenta (M)), or four sub-pixels (e.g., four colors of R, G, B, and white (W), or four colors of R, G, B, and Y). Each pixel also has a light-receiving element 212. The light-receiving element 212 may be provided in all pixels or in some of the pixels. Alternatively, one pixel may have multiple light-receiving elements 212.

[0234] 16A shows a state in which finger 220 touches the surface of substrate 202. A portion of the light emitted by light-emitting element 211G is reflected at the contact point between substrate 202 and finger 220. A portion of the reflected light is then incident on light-receiving element 212, thereby making it possible to detect that finger 220 has touched substrate 202. In other words, display panel 200 can function as a touch panel.

[0235] The functional layer 203 has a circuit for driving the light-emitting element 211R, the light-emitting element 211G, and the light-emitting element 211B, and a circuit for driving the light-receiving element 212. The functional layer 203 is provided with switches, transistors, capacitors, wiring, and the like. Note that when the light-emitting element 211R, the light-emitting element 211G, the light-emitting element 211B, and the light-receiving element 212 are driven by a passive matrix method, a configuration without switches, transistors, and the like may be adopted.

[0236] It is preferable that the display panel 200 has a function of detecting the fingerprint of a finger 220. Fig. 16B is a schematic enlarged view of a contact portion when the finger 220 is in contact with the substrate 202. Fig. 16B also shows light emitting elements 211 and light receiving elements 212 arranged alternately.

[0237] A fingerprint is formed by concave and convex portions of finger 220. Therefore, the convex portions of the fingerprint are in contact with substrate 202 as shown in FIG.

[0238] Light reflected from a surface, interface, etc. can be classified as specular reflection or diffuse reflection. Specular reflection is highly directional light, in which the angle of incidence and the angle of reflection are the same, while diffuse reflection is low-directional light, in which the intensity is less dependent on the angle. The diffuse reflection component is dominant in the light reflected from the surface of the finger 220. On the other hand, the specular reflection component is dominant in the light reflected from the interface between the substrate 202 and the atmosphere.

[0239] The intensity of light reflected by the contact or non-contact surface between finger 220 and substrate 202 and incident on light receiving element 212 located directly below them is the sum of specularly reflected light and diffusely reflected light. As described above, at the concave portions of finger 220, substrate 202 and finger 220 do not come into contact, so specularly reflected light (indicated by solid arrows) is dominant, whereas at the convex portions, they come into contact, so diffusely reflected light (indicated by dashed arrows) from finger 220 is dominant. Therefore, the intensity of light received by light receiving element 212 located directly below the concave portions is higher than that of light receiving element 212 located directly below the convex portions. This makes it possible to capture an image of the fingerprint of finger 220.

[0240] A clear fingerprint image can be obtained by arranging the light receiving elements 212 at an interval smaller than the distance between two convex portions of a fingerprint, preferably the distance between adjacent concave and convex portions. Since the distance between concave and convex portions of a human fingerprint is approximately 200 μm, for example, the interval between the light receiving elements 212 is 400 μm or less, preferably 200 μm or less, more preferably 150 μm or less, even more preferably 100 μm or less, and even more preferably 50 μm or less, and is 1 μm or more, preferably 10 μm or more, and more preferably 20 μm or more.

[0241] An example of a fingerprint image captured by display panel 200 is shown in Fig. 16C. In Fig. 16C, the outline of finger 220 is indicated by a dashed line and the outline of contact area 221 is indicated by a dashed line within imaging range 223. Within contact area 221, a fingerprint 222 with high contrast can be captured due to differences in the amount of light incident on light receiving element 212.

[0242] The display panel 200 can also function as a touch panel or a pen tablet. Fig. 16D shows a state in which the tip of a stylus 225 is in contact with the substrate 202 and is slid in the direction of the dashed arrow.

[0243] As shown in Figure 16D, the diffuse reflected light scattered by the tip of stylus 225 and the contact surface of substrate 202 is incident on light receiving element 212 located at the part overlapping with the contact surface, thereby enabling the position of the tip of stylus 225 to be detected with high accuracy.

[0244] 16E shows an example of a trajectory 226 of the stylus 225 detected by the display panel 200. The display panel 200 is capable of detecting the position of a detectable object such as the stylus 225 with high positional accuracy, and therefore is also capable of performing high-resolution drawing in drawing applications and the like. Furthermore, unlike when a capacitance-type touch sensor, an electromagnetic induction-type touch pen, or the like is used, the position of even a highly insulating detectable object can be detected, and therefore the material of the tip of the stylus 225 is not a factor, and various writing implements (for example, a brush, a glass pen, a feather pen, etc.) can be used.

[0245] 16F to 16H show an example of a pixel that can be applied to the display panel 200. FIG.

[0246] 16F and 16G each have a red (R) light-emitting element 211R, a green (G) light-emitting element 211G, a blue (B) light-emitting element 211B, and a light-receiving element 212. The pixel has a pixel circuit for driving the light-emitting element 211R, the light-emitting element 211G, the light-emitting element 211B, and the light-receiving element 212, respectively.

[0247] Fig. 16F shows an example in which three light-emitting elements and one light-receiving element are arranged in a 2 x 2 matrix. Fig. 16G shows an example in which three light-emitting elements are arranged in a row, and one horizontally elongated light-receiving element 212 is arranged below them.

[0248] 16H is an example of a pixel having a white (W) light-emitting element 211W. Here, four light-emitting elements are arranged in a row, and a light-receiving element 212 is arranged below them.

[0249] The pixel configuration is not limited to the above, and various arrangement methods can be adopted.

[0250] [Configuration Example 1-2] In the following, an example of a configuration including a light-emitting element that emits visible light, a light-emitting element that emits infrared light, and a light-receiving element will be described.

[0251] The display panel 200A shown in Fig. 17A has a light-emitting element 211IR in addition to the configuration exemplified in Fig. 16A. The light-emitting element 211IR is a light-emitting element that emits infrared light IR. In this case, it is preferable to use an element that can receive at least the infrared light IR emitted by the light-emitting element 211IR as the light-receiving element 212. It is more preferable to use an element that can receive both visible light and infrared light as the light-receiving element 212.

[0252] As shown in FIG. 17A, when a finger 220 touches the substrate 202, infrared light IR emitted from the light-emitting element 211IR is reflected by the finger 220, and a portion of the reflected light is incident on the light-receiving element 212, thereby obtaining position information of the finger 220.

[0253] 17B to 17D show examples of pixels that can be applied to the display panel 200A.

[0254] Fig. 17B shows an example in which three light-emitting elements are arranged in a row, and below them, light-emitting element 211IR and light-receiving element 212 are arranged side by side. Fig. 17C shows an example in which four light-emitting elements including light-emitting element 211IR are arranged in a row, and below them, light-receiving element 212 is arranged.

[0255] FIG. 17D shows an example in which three light emitting elements and a light receiving element 212 are arranged on all four sides with a light emitting element 211IR at the center.

[0256] In the pixels shown in FIGS. 17B to 17D, the positions of the light-emitting elements and the light-emitting elements and the light-receiving elements can be interchanged.

[0257] [Configuration Example 1-3] In the following, an example of a configuration including a light-emitting element that emits visible light and a light-receiving / light-emitting element that emits visible light and receives visible light will be described.

[0258] The display panel 200B shown in FIG. 18A includes a light-emitting element 211B, a light-emitting element 211G, and a light-receiving / light-emitting element 213R. The light-receiving / light-emitting element 213R functions as a light-emitting element that emits red (R) light and as a photoelectric conversion element that receives visible light. FIG. 18A shows an example in which the light-receiving / light-emitting element 213R receives green (G) light emitted by the light-emitting element 211G. The light-receiving / light-emitting element 213R may also receive blue (B) light emitted by the light-emitting element 211B. The light-receiving / light-emitting element 213R may also receive both green light and blue light.

[0259] For example, it is preferable that the light receiving / emitting element 213R receives light with a shorter wavelength than the light it emits. Alternatively, the light receiving / emitting element 213R may be configured to receive light with a longer wavelength than the light it emits (for example, infrared light). The light receiving / emitting element 213R may be configured to receive light with a wavelength similar to the light it emits, but in that case, it may also receive the light it emits, which could reduce the light emission efficiency. Therefore, it is preferable that the light receiving / emitting element 213R is configured so that the peak of the emission spectrum and the peak of the absorption spectrum do not overlap as much as possible.

[0260] In addition, the light emitted by the light emitting / receiving element is not limited to red light. Furthermore, the light emitted by the light emitting element is not limited to a combination of green light and blue light. For example, the light emitting / receiving element may be an element that emits green or blue light and receives light of a wavelength different from the light it emits.

[0261] In this way, by having the light emitting / receiving element 213R function as both a light emitting element and a light receiving element, the number of elements arranged in one pixel can be reduced, which makes it easier to achieve higher definition, a higher aperture ratio, and higher resolution.

[0262] 18B to 18I show an example of a pixel that can be applied to the display panel 200B.

[0263] Fig. 18B shows an example in which the light emitting / receiving element 213R, the light emitting element 211G, and the light emitting element 211B are arranged in a row. Fig. 18C shows an example in which the light emitting element 211G and the light emitting element 211B are arranged alternately in the vertical direction, and the light emitting / receiving element 213R is arranged next to them.

[0264] FIG. 18D shows an example in which three light-emitting elements (light-emitting element 211G, light-emitting element 211B, and light-emitting element 211X) and one light-receiving / light-emitting element are arranged in a 2×2 matrix. Light-emitting element 211X is an element that emits light other than R, G, and B. Examples of light other than R, G, and B include white (W), yellow (Y), cyan (C), magenta (M), infrared light (IR), and ultraviolet light (UV). When light-emitting element 211X emits infrared light, it is preferable that the light-receiving / light-emitting element has a function of detecting infrared light or a function of detecting both visible light and infrared light. The wavelength of light detected by the light-receiving / light-emitting element can be determined depending on the application of the sensor.

[0265] FIG. 18E shows two pixels. An area including three elements surrounded by dotted lines corresponds to one pixel. Each pixel has a light-emitting element 211G, a light-emitting element 211B, and an optical element 213R. In the left pixel shown in FIG. 18E, the light-emitting element 211G is arranged in the same row as the optical element 213R, and the light-emitting element 211B is arranged in the same column as the optical element 213R. In the right pixel shown in FIG. 18E, the light-emitting element 211G is arranged in the same row as the optical element 213R, and the light-emitting element 211B is arranged in the same column as the optical element 211G. In the pixel layout shown in FIG. 18E, the optical element 213R, the light-emitting element 211G, and the light-emitting element 211B are arranged repeatedly in both odd-numbered and even-numbered rows, and in each column, optical elements or optical elements emitting light of different colors are arranged in the odd-numbered and even-numbered rows.

[0266] Figure 18F shows four pixels in a Pentile arrangement, with two adjacent pixels having light-emitting or light-receiving elements that emit two different colors of light. Figure 18F also shows the top view of the light-emitting or light-receiving elements.

[0267] The upper left pixel and lower right pixel shown in Fig. 18F have a light emitting / receiving element 213R and a light emitting element 211G. The upper right pixel and lower left pixel have a light emitting element 211G and a light emitting element 211B. That is, in the example shown in Fig. 18F, a light emitting element 211G is provided in each pixel.

[0268] The top surface shapes of the light-emitting element and light-receiving / light-emitting element are not particularly limited and may be circular, elliptical, polygonal, polygonal with rounded corners, etc. Figure 18F etc. shows an example in which the top surface shapes of the light-emitting element and light-receiving / light-emitting element are squares (diamonds) tilted at approximately 45 degrees. Note that the top surface shapes of the light-emitting element and light-receiving / light-emitting element for each color may be different from each other, or may be the same for some or all of the colors.

[0269] Furthermore, the sizes of the light-emitting regions (or light-receiving and light-emitting regions) of the light-emitting elements and light-receiving and light-emitting elements of each color may be different from each other, or may be the same for some or all colors. For example, in FIG. 18F, the area of ​​the light-emitting region of the light-emitting element 211G provided in each pixel may be smaller than the light-emitting regions (or light-receiving and light-emitting regions) of the other elements.

[0270] Fig. 18G is a modified example of the pixel array shown in Fig. 18F. Specifically, the configuration in Fig. 18G is obtained by rotating the configuration in Fig. 18F by 45 degrees. Although Fig. 18F has been described as having two elements per pixel, it can also be understood that one pixel is made up of four elements, as shown in Fig. 18G.

[0271] Fig. 18H is a modified example of the pixel array shown in Fig. 18F. The upper left pixel and lower right pixel shown in Fig. 18H have light emitting / receiving elements 213R and light emitting elements 211G. The upper right pixel and lower left pixel have light emitting / receiving elements 213R and light emitting elements 211B. That is, in the example shown in Fig. 18H, each pixel is provided with a light emitting / receiving element 213R. Because each pixel is provided with a light emitting / receiving element 213R, the configuration shown in Fig. 18H can capture images with higher resolution than the configuration shown in Fig. 18F. This can improve the accuracy of biometric authentication, for example.

[0272] FIG. 18I is a modified example of the pixel array shown in FIG. 18H, and is obtained by rotating the pixel array by 45 degrees.

[0273] In FIG. 18I, a description will be given assuming that one pixel is composed of four elements (two light-emitting elements and two light-receiving and light-emitting elements). In this way, one pixel has multiple light-receiving and light-emitting elements with a light-receiving function, allowing for imaging with high resolution. This can improve the accuracy of biometric authentication. For example, the resolution of imaging can be set to the root double of the resolution of display.

[0274] A display device to which the configuration shown in Figure 18H or Figure 18I is applied has p (p is an integer of 2 or more) first light-emitting elements, q (q is an integer of 2 or more) second light-emitting elements, and r (r is an integer greater than p and greater than q) light-receiving and light-emitting elements. p and r satisfy r = 2p. Furthermore, p, q, and r satisfy r = p + q. One of the first light-emitting elements and the second light-emitting element emits green light, and the other emits blue light. The light-receiving and light-emitting element emits red light and has a light-receiving function.

[0275] For example, when detecting a touch operation using a light-emitting / receiving element, it is preferable that the light emitted from the light source is less visible to the user. Because blue light is less visible than green light, it is preferable that a light-emitting element that emits blue light be used as the light source. Therefore, it is preferable that the light-emitting / receiving element has a function of receiving blue light. However, this is not limited to this, and the light-emitting element used as the light source can be appropriately selected depending on the sensitivity of the light-emitting / receiving element.

[0276] As described above, pixels with various arrangements can be applied to the display device of this embodiment mode.

[0277] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0278] (Fourth embodiment) In this embodiment, a light-emitting element (also referred to as a light-emitting device) and a light-receiving element (also referred to as a light-receiving device) that can be used for the light-emitting and receiving device of one embodiment of the present invention will be described.

[0279] In this specification, etc., a device fabricated using a metal mask or FMM (fine metal mask, high-resolution metal mask) may be referred to as a device with an MM (metal mask) structure. Also, in this specification, etc., a device fabricated without using a metal mask or FMM may be referred to as a device with an MML (metal maskless) structure.

[0280] In this specification, a structure in which different light-emitting layers are formed or different light-emitting layers are painted for each color light-emitting device (here, blue (B), green (G), and red (R)) may be referred to as an SBS (Side By Side) structure. In this specification, a light-emitting device that can emit white light may be referred to as a white light-emitting device. In addition, a white light-emitting device can be combined with a colored layer (for example, a color filter) to form a full-color display device.

[0281] [Light-emitting device] Light-emitting devices can be broadly divided into single structures and tandem structures. A single-structure device has one light-emitting unit between a pair of electrodes, and the light-emitting unit preferably includes one or more light-emitting layers. When two light-emitting layers are used to obtain white light emission, the two light-emitting layers can be selected so that the emission colors of the two light-emitting layers are complementary to each other. For example, by making the emission color of the first light-emitting layer and the emission color of the second light-emitting layer complementary to each other, a configuration in which the entire light-emitting device emits white light can be obtained. When three or more light-emitting layers are used to obtain white light emission, the emission colors of the three or more light-emitting layers can be combined to produce a configuration in which the entire light-emitting device emits white light.

[0282] A tandem-structure device preferably has two or more light-emitting units between a pair of electrodes, and each light-emitting unit preferably includes one or more light-emitting layers. By using light-emitting layers that emit light of the same color in each light-emitting unit, the brightness per given current can be increased, and the device can be made more reliable than a single-structure light-emitting device. To obtain white light emission in a tandem structure, the light from the light-emitting layers of the multiple light-emitting units can be combined to obtain white light emission. The combination of light-emitting colors that can produce white light emission is the same as in the single-structure configuration. In a tandem-structure device, it is preferable to provide an intermediate layer, such as a charge-generating layer, between the multiple light-emitting units.

[0283] Furthermore, when comparing the above-mentioned white light-emitting device (single structure or tandem structure) with a light-emitting device having an SBS structure, the light-emitting device having an SBS structure can reduce power consumption compared to the white light-emitting device. If you want to keep power consumption low, it is preferable to use a light-emitting device having an SBS structure. On the other hand, the manufacturing process of a white light-emitting device is simpler than that of a light-emitting device having an SBS structure, so it is preferable because it can reduce manufacturing costs or increase manufacturing yields.

[0284] <Example of light-emitting device configuration> As shown in FIG. 19A, the light-emitting device has an EL layer 790 between a pair of electrodes (a lower electrode 791 and an upper electrode 792). The EL layer 790 can be composed of multiple layers, such as a layer 720, a light-emitting layer 711, and a layer 730. The layer 720 can have, for example, a layer containing a substance with high electron injection properties (electron injection layer) and a layer containing a substance with high electron transport properties (electron transport layer). The light-emitting layer 711 contains, for example, a light-emitting compound. The layer 730 can have, for example, a layer containing a substance with high hole injection properties (hole injection layer) and a layer containing a substance with high hole transport properties (hole transport layer).

[0285] A structure having layer 720, light-emitting layer 711, and layer 730 provided between a pair of electrodes can function as a single light-emitting unit, and the structure of FIG. 19A is referred to as a single structure in this specification.

[0286] 19B shows a modified example of the EL layer 790 of the light-emitting device shown in Fig. 19A. Specifically, the light-emitting device shown in Fig. 19B has a layer 730-1 on a lower electrode 791, a layer 730-2 on the layer 730-1, a light-emitting layer 711 on the layer 730-2, a layer 720-1 on the light-emitting layer 711, a layer 720-2 on the layer 720-1, and an upper electrode 792 on the layer 720-2. For example, when the lower electrode 791 is an anode and the upper electrode 792 is a cathode, the layer 730-1 functions as a hole injection layer, the layer 730-2 functions as a hole transport layer, the layer 720-1 functions as an electron transport layer, and the layer 720-2 functions as an electron injection layer. Alternatively, when the lower electrode 791 is used as a cathode and the upper electrode 792 is used as an anode, the layer 730-1 functions as an electron injection layer, the layer 730-2 functions as an electron transport layer, the layer 720-1 functions as a hole transport layer, and the layer 720-2 functions as a hole injection layer. Such a layer structure allows carriers to be efficiently injected into the light-emitting layer 711, and makes it possible to increase the efficiency of carrier recombination within the light-emitting layer 711.

[0287] As shown in FIGS. 19C and 19D, a configuration in which a plurality of light-emitting layers (light-emitting layers 711, 712, 713) are provided between layer 720 and layer 730 is also a variation of the single structure.

[0288] 19E and 19F, a configuration in which a plurality of light-emitting units (EL layer 790a, EL layer 790b) are connected in series via an intermediate layer (charge generating layer) 740 is referred to as a tandem structure in this specification. Note that, although the configuration shown in FIGS. 19E and 19F is referred to as a tandem structure in this specification and the like, this is not limiting, and for example, the tandem structure may also be referred to as a stack structure. Note that by using a tandem structure, a light-emitting device capable of emitting light with high brightness can be obtained.

[0289] In FIG. 19C, light-emitting layers 711, 712, and 713 may be made of light-emitting materials that emit light of the same color.

[0290] Furthermore, different light-emitting materials may be used for the light-emitting layer 711, the light-emitting layer 712, and the light-emitting layer 713. For example, white light can be obtained by the light emitted from the light-emitting layer 711, the light-emitting layer 712, and the light-emitting layer 713. FIG. 19D shows an example in which a colored layer 795 that functions as a color filter is provided. When white light passes through the color filter, light of a desired color can be obtained.

[0291] 19E, the same light-emitting material may be used for the light-emitting layer 711 and the light-emitting layer 712. Alternatively, light-emitting materials that emit different light may be used for the light-emitting layer 711 and the light-emitting layer 712. When the light emitted by the light-emitting layer 711 and the light emitted by the light-emitting layer 712 are complementary colors, white light is obtained. FIG. 19F shows an example in which a colored layer 795 is further provided.

[0292] 19C, 19D, 19E, and 19F, the layer 720 and the layer 730 may have a laminated structure made up of two or more layers, as shown in FIG. 19B.

[0293] 19D, the same light-emitting material may be used for light-emitting layer 711, light-emitting layer 712, and light-emitting layer 713. Similarly, in FIG. 19F, the same light-emitting material may be used for light-emitting layer 711 and light-emitting layer 712. In this case, by applying a color conversion layer instead of colored layer 795, light of a desired color different from the light-emitting material can be obtained. For example, by using a blue light-emitting material for each light-emitting layer and transmitting blue light through the color conversion layer, light with a longer wavelength than blue (e.g., red, green, etc.) can be obtained. For the color conversion layer, a fluorescent material, a phosphorescent material, or quantum dots can be used.

[0294] A structure in which different light-emitting layers (here, blue (B), green (G), and red (R)) are created for each light-emitting device is sometimes called an SBS (Side By Side) structure.

[0295] The light-emitting device can emit light of red, green, blue, cyan, magenta, yellow, or white, depending on the material of the EL layer 790. The color purity can be further improved by providing the light-emitting device with a microcavity structure.

[0296] A light-emitting device that emits white light preferably has a configuration in which the light-emitting layer contains two or more types of light-emitting materials. To obtain white light emission, it is sufficient to select light-emitting materials such that the light emitted by each of the two or more light-emitting materials has a complementary color relationship. For example, by making the color of the light emitted by the first light-emitting layer and the color of the light emitted by the second light-emitting layer complementary, a light-emitting device that emits white light as a whole can be obtained. The same applies to light-emitting devices having three or more light-emitting layers.

[0297] The light-emitting layer preferably contains two or more light-emitting materials that emit light of R (red), G (green), B (blue), Y (yellow), O (orange), etc. Alternatively, it is preferable that the light-emitting layer contains two or more light-emitting materials, and the light emitted by each of the light-emitting materials contains spectral components of two or more colors of R, G, and B.

[0298] [Light receiving device] 20A shows a cross-sectional schematic view of light-emitting device 750R, light-emitting device 750G, light-emitting device 750B, and light-receiving device 760. Light-emitting device 750R, light-emitting device 750G, light-emitting device 750B, and light-receiving device 760 have top electrode 792 as a common layer.

[0299] Light-emitting device 750R includes pixel electrode 791R, layer 751, layer 752, light-emitting layer 753R, layer 754, layer 755, and upper electrode 792. Light-emitting device 750G includes pixel electrode 791G and light-emitting layer 753G. Light-emitting device 750B includes pixel electrode 791B and light-emitting layer 753B.

[0300] The layer 751 includes, for example, a layer containing a substance with a high hole-injecting property (hole-injecting layer), the layer 752 includes, for example, a layer containing a substance with a high hole-transporting property (hole-transporting layer), the layer 754 includes, for example, a layer containing a substance with a high electron-transporting property (electron-transporting layer), and the layer 755 includes, for example, a layer containing a substance with a high electron-injecting property (electron-injecting layer).

[0301] Alternatively, a structure in which the layer 751 includes an electron-injecting layer, the layer 752 includes an electron-transporting layer, the layer 754 includes a hole-transporting layer, and the layer 755 includes a hole-injecting layer may be used.

[0302] 20A, the layer 751 and the layer 752 are separately illustrated, but the present invention is not limited to this. For example, when the layer 751 has a function as both a hole injection layer and a hole transport layer, or when the layer 751 has a function as both an electron injection layer and an electron transport layer, the layer 752 may be omitted.

[0303] Light-emitting layer 753R of light-emitting device 750R contains a light-emitting material that emits red light, light-emitting layer 753G of light-emitting device 750G contains a light-emitting material that emits green light, and light-emitting layer 753B of light-emitting device 750B contains a light-emitting material that emits blue light. Light-emitting device 750G and light-emitting device 750B have a configuration in which light-emitting layer 753R of light-emitting device 750R is replaced with light-emitting layer 753G and light-emitting layer 753B, respectively, and are otherwise similar in configuration to light-emitting device 750R.

[0304] The layers 751, 752, 754, and 755 may have the same configuration (material, film thickness, etc.) for each color light-emitting device, or may have different configurations.

[0305] The light-receiving device 760 includes a pixel electrode 791PD, a layer 761, a layer 762, a layer 763, and an upper electrode 792. The light-receiving device 760 may have a configuration without a hole injection layer and an electron injection layer.

[0306] The layer 762 includes an active layer (also called a photoelectric conversion layer), which has the function of absorbing light in a specific wavelength band and generating carriers (electrons and holes).

[0307] The layer 761 and the layer 763 each have, for example, either a hole transport layer or an electron transport layer. When the layer 761 has a hole transport layer, the layer 763 has an electron transport layer. On the other hand, when the layer 761 has an electron transport layer, the layer 763 has a hole transport layer.

[0308] In addition, the light receiving device 760 may have the pixel electrode 791PD as the anode and the upper electrode 792 as the cathode, or the pixel electrode 791PD as the cathode and the upper electrode 792 as the anode.

[0309] 20B is a modified example of FIG. 20A. In FIG. 20B, the layer 755 is provided in common between each light-emitting element and each light-receiving element, similar to the upper electrode 792. In this case, the layer 755 can be called a common layer. By providing one or more common layers between each light-emitting element and each light-receiving element in this way, the manufacturing process can be simplified, and therefore the manufacturing cost can be reduced.

[0310] Here, layer 755 functions as an electron injection layer or a hole injection layer for light-emitting device 750R etc., and functions as an electron transport layer or a hole transport layer for light-receiving device 760. Therefore, layer 763 functioning as an electron transport layer or a hole transport layer may not be provided in light-receiving device 760 shown in FIG. 20B.

[0311] [Light-emitting device] Here, a specific example of the configuration of the light-emitting device will be described.

[0312] The light-emitting device has at least a light-emitting layer. The light-emitting device may further have, in addition to the light-emitting layer, a layer containing a substance with high hole-injection properties, a substance with high hole-transport properties, a hole-blocking material, a substance with high electron-transport properties, an electron-blocking material, a substance with high electron-injection properties, an electron-blocking material, or a bipolar substance (a substance with high electron-transport properties and high hole-transport properties).

[0313] The light-emitting device can be made of either a low-molecular-weight compound or a high-molecular-weight compound, and may contain an inorganic compound. The layers constituting the light-emitting device can be formed by a method such as vapor deposition (including vacuum vapor deposition), transfer, printing, inkjet printing, or coating.

[0314] For example, the light-emitting device may have, in addition to the light-emitting layer, one or more of a hole-injection layer, a hole-transport layer, a hole-blocking layer, an electron-blocking layer, an electron-transport layer, and an electron-injection layer.

[0315] The hole injection layer is a layer that injects holes from the anode into the hole transport layer and contains a material with high hole injection properties, such as an aromatic amine compound and a composite material containing a hole transport material and an acceptor material (electron acceptor material).

[0316] The hole transport layer is a layer that transports holes injected from the anode by the hole injection layer to the light emitting layer. The hole transport layer is a layer that contains a hole transport material. The hole transport material is a material having a concentration of 1×10 -6 cm 2 A material having a hole mobility of 1 / Vs or more is preferred. Note that other materials can also be used as long as they have a higher hole transporting property than electron transporting property. As the hole transporting material, a material having a high hole transporting property, such as a π-electron-rich heteroaromatic compound (e.g., a carbazole derivative, a thiophene derivative, a furan derivative, etc.) or an aromatic amine (a compound having an aromatic amine skeleton), is preferred.

[0317] The electron transport layer is a layer that transports electrons injected from the cathode by the electron injection layer to the light emitting layer. The electron transport layer is a layer that contains an electron transporting material. The electron transporting material is a material having a molecular weight of 1×10 -6 cm 2 A substance having an electron mobility of 1 / Vs or more is preferred. Note that other substances can also be used as long as they have a higher electron transporting property than holes. Examples of electron-transporting materials that can be used include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, and metal complexes having a thiazole skeleton, as well as oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives having a quinoline ligand, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, and other π-electron-deficient heteroaromatic compounds including nitrogen-containing heteroaromatic compounds.

[0318] The electron injection layer is a layer that injects electrons from the cathode to the electron transport layer and contains a material with high electron injection properties. Examples of the material with high electron injection properties include alkali metals, alkaline earth metals, and compounds thereof. Examples of the material with high electron injection properties include a composite material containing an electron transport material and a donor material (electron donor material).

[0319] Examples of the electron injection layer include lithium, cesium, ytterbium, lithium fluoride (LiF), cesium fluoride (CsF), calcium fluoride (CaF), 8-(quinolinolato)lithium (abbreviation: Liq), 2-(2-pyridyl)phenolatolithium (abbreviation: LiPP), 2-(2-pyridyl)-3-pyridinolatolithium (abbreviation: LiPPy), 4-phenyl-2-(2-pyridyl)phenolatolithium (abbreviation: LiPPP), and lithium oxide (LiO xThe electron injection layer may be formed of an alkali metal, an alkaline earth metal, such as cesium carbonate, or a compound thereof. The electron injection layer may have a stacked structure of two or more layers. For example, the stacked structure may have a structure in which lithium fluoride is used in the first layer and ytterbium is provided in the second layer.

[0320] Alternatively, the electron injection layer may be formed using a material having electron transport properties. For example, a compound having an unshared electron pair and an electron-deficient heteroaromatic ring may be used as the material having electron transport properties. Specifically, a compound having at least one of a pyridine ring, a diazine ring (pyrimidine ring, pyrazine ring, pyridazine ring), and a triazine ring may be used.

[0321] The organic compound having an unshared electron pair preferably has a lowest unoccupied molecular orbital (LUMO) of -3.6 eV to -2.3 eV. Generally, the highest occupied molecular orbital (HOMO) level and the LUMO level of an organic compound can be estimated by cyclic voltammetry (CV), photoelectron spectroscopy, optical absorption spectroscopy, inverse photoelectron spectroscopy, or the like.

[0322] Examples of organic compounds with lone electron pairs include 4,7-diphenyl-1,10-phenanthroline (abbreviated as BPhen), 2,9-bis(naphthalen-2-yl)-4,7-diphenyl-1,10-phenanthroline (abbreviated as NBPhen), diquinoxalino[2,3-a:2',3'-c]phenazine (abbreviated as HATNA), and 2,4,6-tris[3'-(pyridin-3-yl)biphenyl-3-yl]-1,3,5-triazine (abbreviated as TmPPYTz). NBPhen has a higher glass transition temperature (Tg) and better heat resistance than BPhen.

[0323] The light-emitting layer is a layer containing a light-emitting substance. The light-emitting layer can contain one or more light-emitting substances. As the light-emitting substance, a substance that emits light of a color such as blue, purple, blue-purple, green, yellow-green, yellow, orange, or red is appropriately used. Furthermore, a substance that emits near-infrared light can also be used as the light-emitting substance.

[0324] Examples of light-emitting materials include fluorescent materials, phosphorescent materials, TADF materials, and quantum dot materials.

[0325] Examples of fluorescent materials include pyrene derivatives, anthracene derivatives, triphenylene derivatives, fluorene derivatives, carbazole derivatives, dibenzothiophene derivatives, dibenzofuran derivatives, dibenzoquinoxaline derivatives, quinoxaline derivatives, pyridine derivatives, pyrimidine derivatives, phenanthrene derivatives, and naphthalene derivatives.

[0326] Examples of phosphorescent materials include organometallic complexes (particularly iridium complexes) having a 4H-triazole skeleton, a 1H-triazole skeleton, an imidazole skeleton, a pyrimidine skeleton, a pyrazine skeleton, or a pyridine skeleton; organometallic complexes (particularly iridium complexes) having a phenylpyridine derivative having an electron-withdrawing group as a ligand; platinum complexes; and rare earth metal complexes.

[0327] The light-emitting layer may contain one or more organic compounds (host materials, assist materials, etc.) in addition to a light-emitting substance (guest material). One or more organic compounds may be a hole-transporting material or an electron-transporting material, or both. Alternatively, a bipolar material or a TADF material may be used as the one or more organic compounds.

[0328] The light-emitting layer preferably contains, for example, a phosphorescent material and a hole-transporting material and an electron-transporting material that are a combination that easily forms an exciplex. This configuration allows for efficient emission using Exciplex-Triplet Energy Transfer (ExTET), which is energy transfer from the exciplex to the light-emitting material (phosphorescent material). By selecting a combination that forms an exciplex that emits light that overlaps with the wavelength of the lowest-energy absorption band of the light-emitting material, the energy transfer becomes smooth, allowing for efficient emission. This configuration simultaneously enables high efficiency, low-voltage operation, and long life of the light-emitting device.

[0329] [Light receiving device] The active layer of the light-receiving device includes a semiconductor. Examples of the semiconductor include inorganic semiconductors such as silicon and organic semiconductors containing organic compounds. In this embodiment, an example in which an organic semiconductor is used as the semiconductor of the active layer is shown. By using an organic semiconductor, the light-emitting layer and the active layer can be formed by the same method (for example, vacuum deposition), which is preferable because it allows the use of a common manufacturing device.

[0330] The active layer is made of n-type semiconductor material, such as fullerene (e.g., C 60 , C 70 Examples of electron-accepting organic semiconductor materials include fullerene derivatives and other fullerenes. Fullerenes have a soccer ball-like shape, which is energetically stable. Fullerenes have deep (low) HOMO and LUMO levels. Because fullerenes have a deep LUMO level, they have extremely high electron-accepting (acceptor) properties. Normally, when the π-electron conjugation (resonance) spreads on a plane, as in benzene, the electron-donating (donor) properties increase, but because fullerenes have a spherical shape, they have high electron-accepting properties despite the large spread of π-electrons. High electron-accepting properties allow charge separation to occur quickly and efficiently, making them useful as light-receiving devices. C 60 , C 70 Both have a wide absorption band in the visible light region, especially C 70 is C 60It is preferable because it has a larger π-electron conjugated system and a broad absorption band in the long wavelength region compared to [6,6]-Phenyl-C71-butyric acid methyl ester (abbreviation: PC70BM), [6,6]-Phenyl-C61-butyric acid methyl ester (abbreviation: PC60BM), and 1',1'',4',4''-Tetrahydro-di[1,4]methanonaphthaleno[1,2:2',3',56,60:2'',3''][5,6]fullerene-C60 (abbreviation: ICBA).

[0331] Furthermore, examples of n-type semiconductor materials include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, metal complexes having a thiazole skeleton, oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, naphthalene derivatives, anthracene derivatives, coumarin derivatives, rhodamine derivatives, triazine derivatives, and quinone derivatives.

[0332] Examples of p-type semiconductor materials for the active layer include electron-donating organic semiconductor materials such as copper(II) phthalocyanine (CuPc), tetraphenyldibenzoperiflanthene (DBP), zinc phthalocyanine (ZnPc), tin phthalocyanine (SnPc), and quinacridone.

[0333] Examples of p-type semiconductor materials include carbazole derivatives, thiophene derivatives, furan derivatives, compounds having an aromatic amine skeleton, etc. Examples of p-type semiconductor materials include naphthalene derivatives, anthracene derivatives, pyrene derivatives, triphenylene derivatives, fluorene derivatives, pyrrole derivatives, benzofuran derivatives, benzothiophene derivatives, indole derivatives, dibenzofuran derivatives, dibenzothiophene derivatives, indolocarbazole derivatives, porphyrin derivatives, phthalocyanine derivatives, naphthalocyanine derivatives, quinacridone derivatives, polyphenylenevinylene derivatives, polyparaphenylene derivatives, polyfluorene derivatives, polyvinylcarbazole derivatives, polythiophene derivatives, etc.

[0334] The HOMO level of the electron-donating organic semiconductor material is preferably shallower (higher) than the HOMO level of the electron-accepting organic semiconductor material, and the LUMO level of the electron-donating organic semiconductor material is preferably shallower (higher) than the LUMO level of the electron-accepting organic semiconductor material.

[0335] It is preferable to use a spherical fullerene as the electron-accepting organic semiconductor material and a planar organic semiconductor material as the electron-donating organic semiconductor material. Molecules with similar shapes tend to aggregate together, and when molecules of the same type aggregate, the energy levels of their molecular orbitals become close, which can improve carrier transport properties.

[0336] For example, the active layer is preferably formed by co-evaporating an n-type semiconductor and a p-type semiconductor, or may be formed by laminating an n-type semiconductor and a p-type semiconductor.

[0337] The light-receiving device may further include, as a layer other than the active layer, a layer containing a substance with high hole-transporting properties, a substance with high electron-transporting properties, a bipolar substance (a substance with high electron-transporting properties and high hole-transporting properties), etc. Furthermore, without being limited to the above, the light-receiving device may further include a layer containing a substance with high hole-injecting properties, a hole-blocking material, a material with high electron-injecting properties, an electron-blocking material, etc.

[0338] The light-receiving device can be made of either a low-molecular-weight compound or a high-molecular-weight compound, and may contain an inorganic compound. The layers constituting the light-receiving device can be formed by a method such as vapor deposition (including vacuum vapor deposition), transfer, printing, inkjet printing, or coating.

[0339] For example, polymer compounds such as poly(3,4-ethylenedioxythiophene) / poly(styrenesulfonic acid) (PEDOT / PSS) and inorganic compounds such as molybdenum oxide and copper iodide (CuI) can be used as hole transporting or electron blocking materials. Furthermore, inorganic compounds such as zinc oxide (ZnO) and organic compounds such as polyethyleneimine ethoxylate (PEIE) can be used as electron transporting or hole blocking materials. The light-receiving device may have, for example, a mixed film of PEIE and ZnO.

[0340] In addition, the active layer can be made of a polymer compound such as Poly[[4,8-bis[5-(2-ethylhexyl)-2-thienyl]benzo[1,2-b:4,5-b']dithiophene-2,6-diyl]-2,5-thiophenediyl[5,7-bis(2-ethylhexyl)-4,8-dioxo-4H,8H-benzo[1,2-c:4,5-c']dithiophene-1,3-diyl]]polymer (abbreviated as PBDB-T) or a PBDB-T derivative, which functions as a donor. For example, an acceptor material can be dispersed in PBDB-T or a PBDB-T derivative.

[0341] The active layer may also contain a mixture of three or more materials. For example, in order to broaden the absorption wavelength range, a third material may be mixed in addition to an n-type semiconductor material and a p-type semiconductor material. In this case, the third material may be a low-molecular-weight compound or a high-molecular-weight compound.

[0342] This concludes the description of the light receiving device.

[0343] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0344] (Embodiment 5) In this embodiment, a structural example of a light-emitting device or a display device that can be used as a light-emitting and receiving device according to one embodiment of the present invention will be described.

[0345] One embodiment of the present invention is a display device having a light-emitting element (also referred to as a light-emitting device) and a light-receiving element (also referred to as a light-receiving device). For example, a full-color display device can be realized by having three types of light-emitting elements that emit red (R), green (G), and blue (B) light, respectively.

[0346] In one embodiment of the present invention, EL layers and an EL layer and an active layer are processed into fine patterns by photolithography without using a shadow mask such as a metal mask. This makes it possible to realize a display device with high definition and a large aperture ratio, which have been difficult to achieve until now. Furthermore, because the EL layers can be separately formed, a display device with extremely vivid images, high contrast, and high display quality can be realized.

[0347] While it is difficult to achieve a distance of less than 10 μm between different color EL layers or between an EL layer and an active layer using a metal mask, the above method allows for this distance to be reduced to 3 μm or less, 2 μm or less, or even 1 μm or less. For example, by using an exposure device designed for LSIs, the distance can be reduced to 500 nm or less, 200 nm or less, 100 nm or less, or even 50 nm or less. This significantly reduces the area of ​​the non-light-emitting region that may exist between two light-emitting elements or between a light-emitting element and a light-receiving element, enabling the aperture ratio to approach 100%. For example, the aperture ratio can be 50% or more, 60% or more, 70% or more, 80% or more, or even 90% or more, but less than 100%.

[0348] Furthermore, the size of the EL layer and active layer itself can be made much smaller than when a metal mask is used. For example, when a metal mask is used to separately form an EL layer, the thickness of the island-shaped EL layer varies between the center and edges, resulting in a smaller effective area that can be used as the light-emitting region relative to the overall area of ​​the EL layer. In contrast, with the above-described fabrication method, the island-shaped EL layer is formed by processing a film deposited to a uniform thickness, making the thickness uniform. Therefore, even if the size of the EL layer is minute, almost the entire area can be used as the light-emitting region. Therefore, the above-described fabrication method can achieve both high definition and a high aperture ratio.

[0349] Organic films formed using a fine metal mask (FMM) often have a very small taper angle (e.g., greater than 0 degrees and less than 30 degrees), with the thickness decreasing toward the edge. Therefore, organic films formed using an FMM have a continuous top and side surface, making it difficult to clearly identify the side surface. On the other hand, one embodiment of the present invention has an EL layer processed without using an FMM, resulting in a clear side surface. In particular, one embodiment of the present invention preferably has a portion where the EL layer has a taper angle of 30 degrees or more and 120 degrees or less, preferably 60 degrees or more and 120 degrees or less.

[0350] In this specification, the term "tapered end of an object" means that the angle between the side (surface) and the surface (bottom) at the end is greater than 0 degrees and less than 90 degrees, and the cross-sectional shape has a continuous increase in thickness from the end. The taper angle is the angle between the bottom (surface) and the side (surface) at the end of the object.

[0351] A more specific example will be described below.

[0352] 21A shows a schematic top view of display device 100. Display device 100 has a plurality of red light-emitting elements 90R, green light-emitting elements 90G, blue light-emitting elements 90B, and light-receiving elements 90S on a substrate 101. In FIG. 21A, to easily distinguish between the light-emitting elements, the symbols R, G, B, and S are assigned within the light-emitting regions of the light-emitting elements or light-receiving elements.

[0353] The light-emitting elements 90R, 90G, 90B, and light-receiving elements 90S are arranged in a matrix. Fig. 21A shows a configuration in which two elements are alternately arranged in one direction. Note that the arrangement of the light-emitting elements is not limited to this, and other arrangements such as a stripe arrangement, an S-stripe arrangement, a delta arrangement, a Bayer arrangement, or a zigzag arrangement may also be used, or a pentile arrangement, diamond arrangement, or the like may also be used.

[0354] 21A also shows a connection electrode 111C that is electrically connected to the common electrode 113. The connection electrode 111C is given a potential (for example, an anode potential or a cathode potential) to be supplied to the common electrode 113. The connection electrode 111C is provided outside the display area where the light-emitting elements 90R and the like are arranged. In addition, in FIG. 21A, the common electrode 113 is shown by a dashed line.

[0355] The connection electrodes 111C can be provided along the periphery of the display area. For example, they may be provided along one side of the periphery of the display area, or they may be provided over two or more sides of the periphery of the display area. That is, if the top surface of the display area has a rectangular shape, the top surface of the connection electrodes 111C can have a strip-like, L-shaped, U-shaped (square bracket-shaped), quadrangular, or the like shape.

[0356] Fig. 21B is a schematic cross-sectional view corresponding to dashed dotted lines A1-A2 and C1-C2 in Fig. 21A. Fig. 21B shows a schematic cross-sectional view of light-emitting element 90B, light-emitting element 90R, light-receiving element 90S, and connection electrode 111C.

[0357] The light emitting element 90G, which is not shown in the schematic cross-sectional view, can have the same configuration as the light emitting element 90B or the light emitting element 90R, and the same explanations as those of the light emitting element 90B or the light emitting element 90R can be applied hereinafter.

[0358] The light-emitting element 90B has a pixel electrode 111, an organic layer 112B, an organic layer 114, and a common electrode 113. The light-emitting element 90R has a pixel electrode 111, an organic layer 112R, an organic layer 114, and a common electrode 113. The light-receiving element 90S has a pixel electrode 111, an organic layer 115, an organic layer 114, and a common electrode 113. The organic layer 114 and the common electrode 113 are provided in common to the light-emitting element 90B, the light-emitting element 90R, and the light-receiving element 90S. The organic layer 114 can also be referred to as a common layer. The pixel electrodes 111 are provided spaced apart between each light-emitting element and between the light-emitting element and the light-receiving element.

[0359] The organic layer 112R contains a light-emitting organic compound that emits at least red light. The organic layer 112B contains a light-emitting organic compound that emits at least blue light. The organic layer 115 contains a photoelectric conversion material that is sensitive to visible light or infrared light wavelengths. The organic layers 112R and 112B can each be referred to as an EL layer.

[0360] Organic layer 112R, organic layer 112B, and organic layer 115 may each have one or more of an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer. Organic layer 114 may be configured without an emitting layer. For example, organic layer 114 has one or more of an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer.

[0361] Here, it is preferable that the uppermost layer in the stacked structure of organic layers 112R, 112B, and 115, i.e., the layer in contact with organic layer 114, is a layer other than the light-emitting layer. For example, it is preferable that an electron injection layer, an electron transport layer, a hole injection layer, a hole transport layer, or a layer other than these is provided to cover the light-emitting layer, and that layer is in contact with organic layer 114. In this way, when fabricating each light-emitting element, the reliability of the light-emitting element can be improved by protecting the upper surface of the light-emitting layer with another layer.

[0362] The pixel electrode 111 is provided for each element. The common electrode 113 and the organic layer 114 are provided as a continuous layer common to each light-emitting element. A conductive film that is transparent to visible light is used for either each pixel electrode or the common electrode 113, and a conductive film that is reflective is used for the other. By making each pixel electrode transparent and the common electrode 113 reflective, a bottom-emission display device can be obtained. Conversely, by making each pixel electrode reflective and the common electrode 113 transparent, a top-emission display device can be obtained. Note that by making both each pixel electrode and the common electrode 113 transparent, a dual-emission display device can be obtained.

[0363] An insulating layer 131 is provided to cover the end of the pixel electrode 111. The end of the insulating layer 131 is preferably tapered. In this specification and the like, a tapered end of an object means that the angle formed between the surface and the surface on which the object is formed in the end region is greater than 0 degrees and less than 90 degrees, and the object has a cross-sectional shape in which the thickness increases continuously from the end.

[0364] Furthermore, by using an organic resin for the insulating layer 131, the surface can be made gently curved, which improves the coverage of the film formed on the insulating layer 131.

[0365] Materials that can be used for the insulating layer 131 include, for example, acrylic resin, polyimide resin, epoxy resin, polyamide resin, polyimideamide resin, siloxane resin, benzocyclobutene resin, phenol resin, and precursors of these resins.

[0366] Alternatively, an inorganic insulating material may be used for the insulating layer 131. Examples of the inorganic insulating material that can be used for the insulating layer 131 include oxides or nitrides such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, aluminum oxide, aluminum oxynitride, and hafnium oxide. In addition, yttrium oxide, zirconium oxide, gallium oxide, tantalum oxide, magnesium oxide, lanthanum oxide, cerium oxide, neodymium oxide, and the like may also be used.

[0367] As shown in FIG. 21B, between the light-emitting elements emitting different colors and between the light-emitting element and the light-receiving element, two organic layers are spaced apart, with a gap between them. In this manner, organic layer 112R, organic layer 112B, and organic layer 115 are preferably arranged so as not to contact each other. This effectively prevents current from flowing through two adjacent organic layers, which would otherwise cause unintended light emission. This allows for increased contrast and a display device with high display quality.

[0368] The organic layers 112R, 112B, and 115 preferably have a taper angle of 30 degrees or more. The organic layers 112R, 112G, and 112B preferably have an angle between the side surface (surface) and the bottom surface (surface to be formed) at the end of each of the organic layers 112R, 112G, and 112B of 30 degrees or more and 120 degrees or less, preferably 45 degrees or more and 120 degrees or less, and more preferably 60 degrees or more and 120 degrees or less. Alternatively, the organic layers 112R, 112G, and 112B preferably each have a taper angle of 90 degrees or nearly so (for example, 80 degrees or more and 100 degrees or less).

[0369] A protective layer 121 is provided on the common electrode 113. The protective layer 121 has a function of preventing impurities such as water from diffusing from above into each light-emitting element.

[0370] The protective layer 121 may have, for example, a single-layer structure or a multilayer structure including at least an inorganic insulating film. Examples of the inorganic insulating film include oxide films or nitride films such as a silicon oxide film, a silicon oxynitride film, a silicon nitride oxide film, a silicon nitride film, an aluminum oxide film, an aluminum oxynitride film, and a hafnium oxide film. Alternatively, the protective layer 121 may be made of a semiconductor material such as indium gallium oxide or indium gallium zinc oxide.

[0371] Furthermore, a laminated film of an inorganic insulating film and an organic insulating film can also be used as the protective layer 121. For example, a configuration in which an organic insulating film is sandwiched between a pair of inorganic insulating films is preferable. Furthermore, it is preferable that the organic insulating film functions as a planarizing film. This allows the upper surface of the organic insulating film to be flat, improving the coverage of the inorganic insulating film thereon and enhancing the barrier properties. Furthermore, since the upper surface of the protective layer 121 is flat, when a structure (e.g., a color filter, a touch sensor electrode, or a lens array) is provided above the protective layer 121, the influence of uneven shapes caused by the structure below can be reduced, which is preferable.

[0372] In the connection portion 130, a common electrode 113 is provided in contact with the connection electrode 111C, and a protective layer 121 is provided to cover the common electrode 113. Also, an insulating layer 131 is provided to cover the end of the connection electrode 111C.

[0373] The following describes a configuration example of a display device that is partially different from the configuration in Fig. 21B. Specifically, an example in which the insulating layer 131 is not provided will be described.

[0374] 22A to 22C show an example in which the side surface of the pixel electrode 111 and the side surface of the organic layer 112R, the organic layer 112B, or the organic layer 115 are substantially aligned.

[0375] 22A, organic layer 114 is provided to cover the top and side surfaces of organic layer 112R, organic layer 112B, and organic layer 115. Organic layer 114 prevents pixel electrode 111 and common electrode 113 from coming into contact with each other and causing an electrical short circuit.

[0376] 22B shows an example in which an insulating layer 125 is provided in contact with the side surfaces of the organic layer 112R, the organic layer 112G, and the organic layer 112B, as well as the pixel electrode 111. The insulating layer 125 can effectively prevent an electrical short between the pixel electrode 111 and the common electrode 113 and a leakage current therebetween.

[0377] The insulating layer 125 can be an insulating layer containing an inorganic material. For example, an inorganic insulating film such as an insulating oxide film, a nitride insulating film, an oxynitride insulating film, or a nitride oxide insulating film can be used for the insulating layer 125. The insulating layer 125 may have a single-layer structure or a stacked-layer structure. Examples of oxide insulating films include a silicon oxide film, an aluminum oxide film, a magnesium oxide film, an indium gallium zinc oxide film, a gallium oxide film, a germanium oxide film, an yttrium oxide film, a zirconium oxide film, a lanthanum oxide film, a neodymium oxide film, a hafnium oxide film, and a tantalum oxide film. Examples of nitride insulating films include a silicon nitride film and an aluminum nitride film. Examples of oxynitride insulating films include a silicon oxynitride film and an aluminum oxynitride film. Examples of nitride oxide insulating films include a silicon nitride oxide film and an aluminum nitride oxide film. In particular, by using an inorganic insulating film such as an aluminum oxide film, a hafnium oxide film, or a silicon oxide film formed by an ALD method for the insulating layer 125, an insulating layer 125 with few pinholes and excellent protection of the organic layer can be formed.

[0378] In this specification and elsewhere, an oxynitride refers to a material whose composition contains more oxygen than nitrogen, and a nitride oxide refers to a material whose composition contains more nitrogen than oxygen. For example, silicon oxynitride refers to a material whose composition contains more oxygen than nitrogen, and silicon nitride oxide refers to a material whose composition contains more nitrogen than oxygen.

[0379] The insulating layer 125 can be formed by a sputtering method, a CVD method, a PLD method, an ALD method, etc. The insulating layer 125 is preferably formed by an ALD method, which has good coverage.

[0380] 22C, a resin layer 126 is provided between two adjacent light-emitting elements or between a light-emitting element and a light-receiving element to fill the gap between two opposing pixel electrodes and the gap between two opposing organic layers. The resin layer 126 can flatten the surfaces on which the organic layer 114, common electrode 113, etc. are formed, thereby preventing the common electrode 113 from being disconnected due to insufficient coverage of the step between adjacent light-emitting elements.

[0381] An insulating layer containing an organic material can be suitably used as the resin layer 126. For example, the resin layer 126 can be made of acrylic resin, polyimide resin, epoxy resin, imide resin, polyamide resin, polyimideamide resin, silicone resin, siloxane resin, benzocyclobutene-based resin, phenolic resin, or precursors of these resins. Alternatively, the resin layer 126 can be made of organic materials such as polyvinyl alcohol (PVA), polyvinyl butyral, polyvinylpyrrolidone, polyethylene glycol, polyglycerin, pullulan, water-soluble cellulose, or alcohol-soluble polyamide resin. Alternatively, the resin layer 126 can be made of a photosensitive resin. The photosensitive resin can be a photoresist. The photosensitive resin can be a positive-type material or a negative-type material.

[0382] Furthermore, by using a colored material (for example, a material containing a black pigment) for the resin layer 126, the layer may be provided with the function of blocking stray light from adjacent pixels and suppressing color mixing.

[0383] 22D, an insulating layer 125 and a resin layer 126 are provided on the insulating layer 125. The insulating layer 125 prevents the organic layer 112R etc. from contacting the resin layer 126, and therefore impurities such as moisture contained in the resin layer 126 can be prevented from diffusing into the organic layer 112R etc., resulting in a highly reliable display device.

[0384] In addition, a reflective film (e.g., a metal film containing one or more selected from silver, palladium, copper, titanium, aluminum, etc.) may be provided between the insulating layer 125 and the resin layer 126, and a mechanism for improving the light extraction efficiency may be provided by reflecting the light emitted from the light-emitting layer with the reflective film.

[0385] 23A to 23C show an example in which the width of the pixel electrode 111 is larger than the width of the organic layer 112R, the organic layer 112B, or the organic layer 115. The organic layer 112R, etc. are provided inside the edge of the pixel electrode 111.

[0386] 23A shows an example in which an insulating layer 125 is provided. The insulating layer 125 is provided to cover the side surfaces of the organic layers of the light-emitting element or the light-receiving element, and part of the upper surface and the side surfaces of the pixel electrode 111.

[0387] 23B shows an example in which a resin layer 126 is provided. The resin layer 126 is located between two adjacent light-emitting elements or between a light-emitting element and a light-receiving element, and is provided so as to cover the side surfaces of the organic layer and the upper and side surfaces of the pixel electrode 111.

[0388] 23C shows an example in which both the insulating layer 125 and the resin layer 126 are provided. The insulating layer 125 is provided between the organic layer 112R etc. and the resin layer 126.

[0389] 24A to 24D show examples where the width of pixel electrode 111 is smaller than the width of organic layer 112R, organic layer 112B, or organic layer 115. Organic layer 112R, etc., extends outward beyond the edge of pixel electrode 111.

[0390] 24B shows an example having an insulating layer 125. The insulating layer 125 is provided in contact with the side surfaces of the organic layers of two adjacent light-emitting elements. Note that the insulating layer 125 may be provided to cover not only the side surfaces of the organic layer 112R etc. but also part of the upper surface.

[0391] 24C shows an example having a resin layer 126. The resin layer 126 is located between two adjacent light-emitting elements, and is provided so as to cover part of the side and upper surfaces of the organic layer 112R, etc. Note that the resin layer 126 may be configured to contact the side surfaces of the organic layer 112R, etc., but not cover the upper surfaces.

[0392] 24D shows an example in which both the insulating layer 125 and the resin layer 126 are provided. The insulating layer 125 is provided between the organic layer 112R etc. and the resin layer 126.

[0393] Here, an example of the structure of the resin layer 126 will be described.

[0394] The flatter the upper surface of the resin layer 126, the better. However, depending on the unevenness of the surface on which the resin layer 126 is formed, the conditions under which the resin layer 126 is formed, and the like, the surface of the resin layer 126 may have a concave or convex shape.

[0395] 25A to 26F show enlarged views of an end portion of a pixel electrode 111R of a light emitting element 90R, an end portion of a pixel electrode 111G of a light emitting element 90G, and their vicinity. An organic layer 112G is provided on the pixel electrode 111G.

[0396] 25A, 25B, and 25C show enlarged views of the resin layer 126 and its vicinity when the upper surface of the resin layer 126 is flat. FIG. 25A shows an example where the width of the organic layer 112R, etc. is larger than that of the pixel electrode 111. FIG. 25B shows an example where these widths are approximately the same. FIG. 25C shows an example where the width of the organic layer 112R, etc. is smaller than that of the pixel electrode 111.

[0397] 25A, since the organic layer 112R is provided to cover the end of the pixel electrode 111, it is preferable that the end of the pixel electrode 111 has a tapered shape. This improves the step coverage of the organic layer 112R, resulting in a highly reliable display device.

[0398] 25D, 25E, and 25F show examples in which the upper surface of the resin layer 126 is concave. In this case, concave portions that reflect the concave upper surface of the resin layer 126 are formed on the upper surfaces of the organic layer 114, the common electrode 113, and the protective layer 121.

[0399] 26A, 26B, and 26C show an example in which the upper surface of the resin layer 126 is convex. In this case, convex portions that reflect the convex upper surface of the resin layer 126 are formed on the upper surfaces of the organic layer 114, the common electrode 113, and the protective layer 121.

[0400] 26D, 26E, and 26F show examples in which part of resin layer 126 covers the upper end and part of the upper surface of organic layer 112R and the upper end and part of the upper surface of organic layer 112G. In this case, insulating layer 125 is provided between resin layer 126 and the upper surface of organic layer 112R or organic layer 112G.

[0401] 26D, 26E, and 26F show an example in which a portion of the upper surface of the resin layer 126 is concave. In this case, the organic layer 114, the common electrode 113, and the protective layer 121 are formed with concave and convex shapes that reflect the shape of the resin layer 126.

[0402] The above is a description of the configuration example of the resin layer.

[0403] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0404] (Sixth embodiment) In this embodiment, a structural example of a display device that can be used as a light-emitting and receiving device of one embodiment of the present invention will be described. Here, a display device that can display an image will be described, but the display device can also be used as a light-emitting and receiving device by using a light-emitting element as a light source.

[0405] The display device of the present embodiment can be a high-resolution display device or a large-sized display device. Therefore, the display device of the present embodiment can be used in electronic devices having relatively large screens, such as television devices, desktop or notebook personal computers, computer monitors, digital signage, and large game machines such as pachinko machines, as well as in the display units of digital cameras, digital video cameras, digital photo frames, mobile phones, portable game machines, smartphones, wristwatch-type terminals, tablet terminals, personal digital assistants, and sound reproduction devices.

[0406] [Display device 400] FIG. 27 shows a perspective view of display device 400, and FIG. 28A shows a cross-sectional view of display device 400.

[0407] Display device 400 has a configuration in which substrate 452 and substrate 451 are bonded together. In Fig. 27, substrate 452 is clearly indicated by a dashed line.

[0408] The display device 400 includes a display unit 462, a circuit 464, wiring 465, etc. Fig. 27 shows an example in which an IC 473 and an FPC 472 are mounted on the display device 400. Therefore, the configuration shown in Fig. 13 can also be said to be a display module including the display device 400, an IC (integrated circuit), and an FPC.

[0409] The circuit 464 can be, for example, a scanning line driver circuit.

[0410] The wiring 465 has a function of supplying signals and power to the display portion 462 and the circuit 464. The signals and power are input to the wiring 465 from the outside via the FPC 472 or input to the wiring 465 from the IC 473.

[0411] 27 shows an example in which an IC 473 is provided on a substrate 451 by a COG (Chip On Glass) method or a COF (Chip on Film) method. The IC 473 may be, for example, an IC having a scanning line driver circuit or a signal line driver circuit. Note that the display device 400 and the display module may not include an IC. Alternatively, the IC may be mounted on an FPC by a COF method or the like.

[0412] 28A shows an example of a cross section of display device 400, where a part of a region including FPC 472, a part of circuit 464, a part of display unit 462, and a part of a region including a connection portion are cut away. Fig. 28A shows an example of a cross section of display unit 462, where a region including light-emitting element 430b that emits green light (G) and light-receiving element 440 that receives reflected light (L) is cut away.

[0413] The display device 400 shown in FIG. 28A includes a transistor 252, a transistor 260, a transistor 258, a light-emitting element 430b, a light-receiving element 440, and the like between a substrate 453 and a substrate 454.

[0414] The light emitting element 430b and the light receiving element 440 may be any of the light emitting elements or light receiving elements exemplified above.

[0415] Here, when a pixel of a display device has three types of subpixels having light-emitting elements that emit light of different colors, the three subpixels may include subpixels of three colors: red (R), green (G), and blue (B), or subpixels of three colors: yellow (Y), cyan (C), and magenta (M). When a pixel of a display device has four subpixels, the four subpixels may include subpixels of four colors: R, G, B, and white (W), or subpixels of four colors: R, G, B, and Y. Alternatively, the subpixels may include light-emitting elements that emit infrared light.

[0416] Furthermore, the light receiving element 440 may be a photoelectric conversion element sensitive to light in the red, green, or blue wavelength range, or a photoelectric conversion element sensitive to light in the infrared wavelength range.

[0417] The substrate 454 and the protective layer 416 are bonded together via an adhesive layer 442. The adhesive layer 442 is provided to overlap the light emitting element 430b and the light receiving element 440, respectively, and a solid sealing structure is applied to the display device 400. A light-shielding layer 417 is provided on the substrate 454.

[0418] The light-emitting element 430b and the light-receiving element 440 each have a conductive layer 411a, a conductive layer 411b, and a conductive layer 411c as pixel electrodes. The conductive layer 411b is reflective to visible light and functions as a reflective electrode. The conductive layer 411c is transparent to visible light and functions as an optical adjustment layer.

[0419] A conductive layer 411a included in the light-emitting element 430b is connected to a conductive layer 272b included in the transistor 260 through an opening provided in the insulating layer 264. The transistor 260 has a function of controlling driving of the light-emitting element. On the other hand, the conductive layer 411a included in the light-receiving element 440 is electrically connected to a conductive layer 272b included in the transistor 258. The transistor 258 has a function of controlling the timing of exposure using the light-receiving element 440, for example.

[0420] An EL layer 412G or a photoelectric conversion layer 412S is provided to cover the pixel electrode. An insulating layer 421 is provided in contact with the side surfaces of the EL layer 412G and the photoelectric conversion layer 412S, and a resin layer 422 is provided to fill the recesses in the insulating layer 421. An organic layer 414, a common electrode 413, and a protective layer 416 are provided to cover the EL layer 412G and the photoelectric conversion layer 412S. By providing the protective layer 416 to cover the light-emitting element, impurities such as water can be prevented from entering the light-emitting element, thereby improving the reliability of the light-emitting element.

[0421] Light G emitted by light emitting element 430b is emitted toward substrate 452. Light receiving element 440 receives light L incident through substrate 452 and converts it into an electrical signal. Substrate 452 is preferably made of a material that is highly transparent to visible light.

[0422] The transistor 252, the transistor 260, and the transistor 258 are all formed over a substrate 451. These transistors can be manufactured using the same material and the same process.

[0423] Note that the transistor 252, the transistor 260, and the transistor 258 may be fabricated to have different structures. For example, transistors may be fabricated with or without a back gate, or transistors may be fabricated with different materials and / or thicknesses of semiconductors, gate electrodes, gate insulating layers, source electrodes, and drain electrodes.

[0424] The substrate 453 and the insulating layer 262 are bonded together by an adhesive layer 455 .

[0425] The display device 400 is manufactured by first bonding a fabrication substrate provided with the insulating layer 262, the transistors, the light-emitting elements, the light-receiving elements, and the like to a substrate 454 provided with a light-shielding layer 417 with an adhesive layer 442. Then, the fabrication substrate is peeled off and a substrate 453 is attached to the exposed surface, thereby transferring each component formed on the fabrication substrate to the substrate 453. The substrate 453 and the substrate 454 are preferably flexible. This can increase the flexibility of the display device 400.

[0426] A connection portion 254 is provided in a region of the substrate 453 where the substrate 454 does not overlap. In the connection portion 254, a wiring 465 is electrically connected to the FPC 472 via a conductive layer 466 and a connection layer 292. The conductive layer 466 can be obtained by processing the same conductive film as the pixel electrode. This allows the connection portion 254 and the FPC 472 to be electrically connected via the connection layer 292.

[0427] The transistor 252, the transistor 260, and the transistor 258 each include a conductive layer 271 functioning as a gate, an insulating layer 261 functioning as a gate insulating layer, a semiconductor layer 281 including a channel formation region 281i and a pair of low-resistance regions 281n, a conductive layer 272a connected to one of the pair of low-resistance regions 281n, a conductive layer 272b connected to the other of the pair of low-resistance regions 281n, an insulating layer 275 functioning as a gate insulating layer, a conductive layer 273 functioning as a gate, and an insulating layer 265 covering the conductive layer 273. The insulating layer 261 is located between the conductive layer 271 and the channel formation region 281i. The insulating layer 275 is located between the conductive layer 273 and the channel formation region 281i.

[0428] The conductive layer 272a and the conductive layer 272b are each connected to the low-resistance region 281n through an opening provided in the insulating layer 265. One of the conductive layer 272a and the conductive layer 272b functions as a source, and the other functions as a drain.

[0429] 28A shows an example in which the top surface and side surfaces of the semiconductor layer are covered with an insulating layer 275. The conductive layer 272a and the conductive layer 272b are connected to the low-resistance region 281n through openings provided in the insulating layer 275 and the insulating layer 265, respectively.

[0430] On the other hand, in the transistor 259 shown in FIG. 28B, the insulating layer 275 overlaps with the channel formation region 281i of the semiconductor layer 281 but does not overlap with the low-resistance region 281n. For example, the structure shown in FIG. 28B can be manufactured by processing the insulating layer 275 using the conductive layer 273 as a mask. In FIG. 28B, the insulating layer 265 is provided to cover the insulating layer 275 and the conductive layer 273, and the conductive layer 272a and the conductive layer 272b are each connected to the low-resistance region 281n through openings in the insulating layer 265. Furthermore, an insulating layer 268 may be provided to cover the transistor.

[0431] The structure of the transistor included in the display device of this embodiment is not particularly limited. For example, a planar transistor, a staggered transistor, an inverted staggered transistor, or the like can be used. Furthermore, either a top-gate transistor or a bottom-gate transistor structure may be used. Alternatively, gates may be provided above and below a semiconductor layer in which a channel is formed.

[0432] The transistors 252, 260, and 258 each have a structure in which a semiconductor layer in which a channel is formed is sandwiched between two gates. The two gates may be connected and the same signal may be supplied to drive the transistor. Alternatively, the threshold voltage of the transistor may be controlled by applying a potential for controlling the threshold voltage to one of the two gates and a potential for driving the other.

[0433] The crystallinity of a semiconductor material used for a semiconductor layer of a transistor is not particularly limited, and any of an amorphous semiconductor, a single-crystal semiconductor, and a semiconductor having crystallinity other than single crystal (a microcrystalline semiconductor, a polycrystalline semiconductor, or a semiconductor having a crystalline region in part) may be used. The use of a single-crystal semiconductor or a crystalline semiconductor is preferable because it can suppress deterioration of transistor characteristics.

[0434] The semiconductor layer of the transistor preferably includes a metal oxide (also referred to as an oxide semiconductor). That is, the display device of this embodiment preferably includes a transistor using a metal oxide for a channel formation region (hereinafter referred to as an OS transistor).

[0435] The band gap of the metal oxide used for the semiconductor layer of the transistor is preferably 2 eV or more, more preferably 2.5 eV or more. Use of a metal oxide with a wide band gap can reduce the off-state current of the OS transistor.

[0436] The metal oxide preferably contains at least indium or zinc, and more preferably contains indium and zinc. For example, the metal oxide preferably contains indium, M (where M is one or more selected from gallium, aluminum, yttrium, tin, silicon, boron, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, and cobalt), and zinc. In particular, M is preferably one or more selected from gallium, aluminum, yttrium, and tin, and more preferably gallium. Note that a metal oxide containing indium, M, and zinc may be referred to as an In-M-Zn oxide hereinafter.

[0437] When the metal oxide is an In-M-Zn oxide, the atomic ratio of In in the In-M-Zn oxide is preferably equal to or greater than the atomic ratio of M. Examples of atomic ratios of metal elements in such In-M-Zn oxides include compositions in which In:M:Zn=1:1:1 or thereabouts, In:M:Zn=1:1:1.2 or thereabouts, In:M:Zn=2:1:3 or thereabouts, In:M:Zn=3:1:2 or thereabouts, In:M:Zn=4:2:3 or thereabouts, In:M:Zn=4:2:4.1 or thereabouts, In:M:Zn=5:1:3 or thereabouts, In:M:Zn=5:1:6 or thereabouts, In:M:Zn=5:1:7 or thereabouts, In:M:Zn=5:1:8 or thereabouts, In:M:Zn=6:1:6 or thereabouts, and In:M:Zn=5:2:5 or thereabouts, etc. Note that "nearby compositions" includes a range of ±30% of the desired atomic ratio. By increasing the atomic ratio of indium in the metal oxide, the on-state current, field-effect mobility, and the like of a transistor can be increased.

[0438] For example, when describing a composition with an atomic ratio of In:Ga:Zn=4:2:3 or thereabout, this includes a case where, when In is taken as 4, Ga is 1 to 3 and Zn is 2 to 4. Furthermore, when describing a composition with an atomic ratio of In:Ga:Zn=5:1:6 or thereabout, this includes a case where, when In is taken as 5, Ga is more than 0.1 and 2 or less and Zn is 5 to 7 or less. Furthermore, when describing a composition with an atomic ratio of In:Ga:Zn=1:1:1 or thereabout, this includes a case where, when In is taken as 1, Ga is more than 0.1 and 2 or less and Zn is more than 0.1 and 2 or less.

[0439] The In content in the In-M-Zn oxide may be less than the M content. Examples of atomic ratios of metal elements in such In-M-Zn oxides include In:M:Zn=1:3:2 or a composition close to it, In:M:Zn=1:3:3 or a composition close to it, and In:M:Zn=1:3:4 or a composition close to it. Increasing the M atomic ratio in the metal oxide increases the band gap of the In-M-Zn oxide, thereby improving its resistance to negative bias stress testing under light irradiation. Specifically, it reduces the change in threshold voltage or shift voltage (Vsh) measured in a negative bias temperature illumination stress (NBTIS) test of a transistor. The shift voltage (Vsh) is defined as the Vg at which the tangent to the maximum slope of the drain current (Id)-gate voltage (Vg) curve of the transistor intersects with the line at Id=1 pA.

[0440] Alternatively, the semiconductor layer of the transistor may contain silicon, such as amorphous silicon or crystalline silicon (such as low-temperature polysilicon or single-crystal silicon).

[0441] In particular, low-temperature polysilicon has relatively high mobility and can be formed over a glass substrate, and therefore can be suitably used in display devices. For example, a transistor using low-temperature polysilicon for a semiconductor layer can be used as the transistor 252 in the driver circuit, and a transistor using an oxide semiconductor for a semiconductor layer can be used as the transistor 260 and the transistor 258 provided in the pixel.

[0442] Alternatively, the semiconductor layer of the transistor may include a layered material that functions as a semiconductor. A layered material is a general term for a group of materials that have a layered crystal structure. A layered crystal structure is a structure in which layers formed by covalent or ionic bonds are stacked via bonds weaker than covalent or ionic bonds, such as van der Waals forces. A layered material has high electrical conductivity within a unit layer, that is, high two-dimensional electrical conductivity. By using a material that functions as a semiconductor and has high two-dimensional electrical conductivity in the channel formation region, a transistor with a large on-state current can be provided.

[0443] Examples of the layered material include graphene, silicene, and chalcogenides. Chalcogenides are compounds containing chalcogen (elements belonging to Group 16). Examples of chalcogenides include transition metal chalcogenides and Group 13 chalcogenides. Specific examples of transition metal chalcogenides applicable to the semiconductor layer of a transistor include molybdenum sulfide (typically MoS2), molybdenum selenide (typically MoSe2), molybdenum tellurium (typically MoTe2), tungsten sulfide (typically WS2), tungsten selenide (typically WSe2), tungsten tellurium (typically WTe2), hafnium sulfide (typically HfS2), hafnium selenide (typically HfSe2), zirconium sulfide (typically ZrS2), and zirconium selenide (typically ZrSe2).

[0444] The transistors included in the circuit 464 may have the same structure as or different from the transistors included in the display portion 462. The transistors included in the circuit 464 may all have the same structure or may have two or more types of structures. Similarly, the transistors included in the display portion 462 may all have the same structure or may have two or more types of structures.

[0445] At least one insulating layer covering the transistor is preferably made of a material that is resistant to the diffusion of impurities such as water and hydrogen. This allows the insulating layer to function as a barrier layer. With this structure, it is possible to effectively prevent impurities from diffusing into the transistor from the outside, thereby improving the reliability of the display device.

[0446] It is preferable to use an inorganic insulating film for each of the insulating layers 261, 262, 265, 268, and 275. Examples of the inorganic insulating film that can be used include a silicon nitride film, a silicon oxynitride film, a silicon oxide film, a silicon nitride oxide film, an aluminum oxide film, and an aluminum nitride film. Alternatively, a hafnium oxide film, an yttrium oxide film, a zirconium oxide film, a gallium oxide film, a tantalum oxide film, a magnesium oxide film, a lanthanum oxide film, a cerium oxide film, and a neodymium oxide film may also be used. Two or more of the above-described inorganic insulating films may be stacked.

[0447] Here, organic insulating films often have lower barrier properties than inorganic insulating films. Therefore, it is preferable that the organic insulating film has an opening near the edge of the display device 400. This can prevent impurities from entering from the edge of the display device 400 through the organic insulating film. Alternatively, the organic insulating film may be formed so that the edge of the organic insulating film is located inside the edge of the display device 400, so that the organic insulating film is not exposed at the edge of the display device 400.

[0448] An organic insulating film is suitable for the insulating layer 264, which functions as a planarizing layer. Materials that can be used for the organic insulating film include acrylic resin, polyimide resin, epoxy resin, polyamide resin, polyimideamide resin, siloxane resin, benzocyclobutene resin, phenol resin, and precursors of these resins.

[0449] It is preferable to provide a light-shielding layer 417 on the surface of substrate 454 facing substrate 453. In addition, various optical members can be arranged on the outside of substrate 454. Examples of optical members include a polarizing plate, a retardation plate, a light diffusion layer (such as a diffusion film), an anti-reflection layer, and a light-collecting film. In addition, an antistatic film that suppresses the adhesion of dust, a water-repellent film that makes it difficult for dirt to adhere, a hard coat film that suppresses the occurrence of scratches during use, an impact absorbing layer, etc. may be arranged on the outside of substrate 454.

[0450] Fig. 28A shows a connection portion 278. The common electrode 413 and a wiring are electrically connected at the connection portion 278. Fig. 28A shows an example in which the same layered structure as that of the pixel electrode is applied to the wiring.

[0451] The substrate 453 and the substrate 454 can each be made of glass, quartz, ceramic, sapphire, resin, metal, alloy, semiconductor, or the like. A material that transmits light is used for the substrate on the side from which light from the light-emitting element is extracted. Using a flexible material for the substrate 453 and the substrate 454 can increase the flexibility of the display device. Alternatively, a polarizing plate may be used for the substrate 453 or the substrate 454.

[0452] Substrates 453 and 454 can be made of polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, acrylic resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin (nylon, aramid, etc.), polysiloxane resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyurethane resin, polyvinyl chloride resin, polyvinylidene chloride resin, polypropylene resin, polytetrafluoroethylene (PTFE) resin, ABS resin, cellulose nanofiber, etc. One or both of substrates 453 and 454 may be made of glass having a thickness sufficient to provide flexibility.

[0453] When a circularly polarizing plate is superimposed on a display device, it is preferable that the display device has a substrate with high optical isotropy. A substrate with high optical isotropy has small birefringence (or a small amount of birefringence).

[0454] The absolute value of the retardation (phase difference) of a substrate having high optical isotropy is preferably 30 nm or less, more preferably 20 nm or less, and even more preferably 10 nm or less.

[0455] Examples of films with high optical isotropy include triacetyl cellulose (TAC, also known as cellulose triacetate) films, cycloolefin polymer (COP) films, cycloolefin copolymer (COC) films, and acrylic films.

[0456] Furthermore, when a film is used as a substrate, the film may absorb water, causing deformation such as wrinkles in the display panel. Therefore, it is preferable to use a film with low water absorption for the substrate. For example, it is preferable to use a film with a water absorption rate of 1% or less, more preferably 0.1% or less, and even more preferably 0.01% or less.

[0457] The adhesive layer can be made of various curable adhesives, such as photo-curable adhesives (e.g., ultraviolet curable), reactive curable adhesives, thermosetting adhesives, and anaerobic adhesives. Examples of such adhesives include epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, and EVA (ethylene vinyl acetate) resin. Materials with low moisture permeability, such as epoxy resin, are particularly preferred. Two-component resins may also be used. Adhesive sheets, etc., may also be used.

[0458] The connection layer 292 may be made of an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), or the like.

[0459] Materials that can be used for conductive layers such as the gate, source, and drain of a transistor, as well as various wirings and electrodes that constitute a display device include metals such as aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten, and alloys containing these metals as main components, etc. Films containing these materials can be used as a single layer or a stacked layer structure.

[0460] Examples of light-transmitting conductive materials include conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide containing gallium, or graphene. Alternatively, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, and titanium, or alloy materials containing such metal materials, can be used. Alternatively, nitrides of such metal materials (e.g., titanium nitride) can be used. When using metal materials or alloy materials (or their nitrides), it is preferable to thin them sufficiently to ensure light-transmitting properties. A stacked film of the above materials can also be used as the conductive layer. For example, a stacked film of an alloy of silver and magnesium and indium tin oxide is preferable because it can enhance conductivity. These can also be used for conductive layers such as various wirings and electrodes constituting a display device, and for conductive layers (conductive layers functioning as pixel electrodes or common electrodes) of light-emitting elements.

[0461] Examples of insulating materials that can be used for each insulating layer include resins such as acrylic resin and epoxy resin, and inorganic insulating materials such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, and aluminum oxide.

[0462] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be combined as appropriate with other configuration examples or drawings.

[0463] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0464] (Embodiment 7) In this embodiment, an example of a display device including a light-receiving device or the like according to one embodiment of the present invention will be described.

[0465] In the display device of this embodiment, a pixel may be configured to have multiple types of subpixels having light-emitting devices that emit light of different colors. For example, a pixel may be configured to have three types of subpixels. Examples of the three subpixels include subpixels of red (R), green (G), and blue (B), or subpixels of yellow (Y), cyan (C), and magenta (M). Alternatively, a pixel may be configured to have four types of subpixels. Examples of the four subpixels include subpixels of R, G, B, and white (W), or subpixels of R, G, B, and Y.

[0466] There are no particular limitations on the arrangement of the sub-pixels, and various methods can be applied, including, for example, a stripe arrangement, an S-stripe arrangement, a matrix arrangement, a delta arrangement, a Bayer arrangement, and a pentile arrangement.

[0467] Examples of the top surface shape of the sub-pixel include polygons such as triangles, quadrilaterals (including rectangles and squares), and pentagons, as well as polygons with rounded corners, ellipses, circles, etc. The top surface shape of the sub-pixels here corresponds to the top surface shape of the light-emitting region of the light-emitting device.

[0468] In a display device having a light-emitting device and a light-receiving device in each pixel, the pixel has a light-receiving function, so that it is possible to detect contact or proximity of an object while displaying an image. For example, instead of displaying an image using all of the sub-pixels of the display device, some of the sub-pixels can emit light as a light source, other sub-pixels can detect light, and the remaining sub-pixels can display the image.

[0469] The pixel shown in FIGS. 29A, 29B, and 29C includes subpixels G, B, R, and PS.

[0470] A stripe arrangement is applied to the pixels shown in Fig. 29A, and a matrix arrangement is applied to the pixels shown in Fig. 29B.

[0471] The pixel array shown in FIG. 29C has a configuration in which three subpixels (subpixel R, subpixel G, and subpixel S) are vertically arranged next to one subpixel (subpixel B).

[0472] The pixel shown in FIGS. 29D, 29E, and 29F has a subpixel G, a subpixel B, a subpixel R, a subpixel IR, and a subpixel PS.

[0473] 29D, 29E, and 29F show examples in which one pixel is arranged across two rows. The top row (first row) has three subpixels (subpixel G, subpixel B, and subpixel R), and the bottom row (second row) has two subpixels (one subpixel PS and one subpixel IRS).

[0474] In Figure 29D, three vertically elongated subpixels G, B, and R are arranged horizontally, with a subpixel PS and a horizontally elongated subpixel IR arranged horizontally below them. In Figure 29E, two horizontally elongated subpixels G and R are arranged vertically, with a vertically elongated subpixel B arranged horizontally next to them, and a horizontally elongated subpixel IR and a vertically elongated subpixel PS arranged horizontally below them. In Figure 29F, three vertically elongated subpixels R, G, and B are arranged horizontally, with a horizontally elongated subpixel IR and a vertically elongated subpixel PS arranged horizontally below them. Figures 29E and 29F show the case where the area of ​​the subpixel IR is the largest and the area of ​​the subpixel PS is approximately the same as that of the other subpixels.

[0475] The layout of the sub-pixels is not limited to the configurations shown in FIGS. 29A to 29F.

[0476] Subpixel R has a light-emitting device that emits red light. Subpixel G has a light-emitting device that emits green light. Subpixel B has a light-emitting device that emits blue light. Subpixel IR has a light-emitting device that emits infrared light. Subpixel PS has a light-receiving device. The wavelength of light detected by subpixel PS is not particularly limited, but it is preferable that the light-receiving device of subpixel PS is sensitive to light emitted by the light-emitting device of subpixel R, subpixel G, subpixel B, or subpixel IR. For example, it is preferable to detect one or more of light in wavelength ranges such as blue, purple, blue-purple, green, yellow-green, yellow, orange, and red, and light in the infrared wavelength range.

[0477] The light-receiving area of ​​the subpixel PS is smaller than the light-emitting area of ​​the other subpixels. The smaller the light-receiving area, the narrower the imaging range, which makes it possible to suppress blurring in the imaging results and improve resolution. Therefore, by using the subpixel PS, high-definition or high-resolution imaging can be performed. For example, the subpixel PS can be used to capture images for personal authentication using fingerprints, palm prints, irises, pulse patterns (including vein patterns and artery patterns), faces, etc.

[0478] The subpixel PS can also be used as a touch sensor (also called a direct touch sensor) or a near-touch sensor (also called a hover sensor, hover touch sensor, non-contact sensor, or touchless sensor). For example, it is preferable for the subpixel PS to detect infrared light, which enables touch detection even in dark places.

[0479] Here, a touch sensor or near-touch sensor can detect the proximity or contact of an object (such as a finger, hand, or pen). A touch sensor can detect an object when the display device and the object are in direct contact with each other. A near-touch sensor can detect an object even if the object does not touch the display device. For example, a configuration in which the display device can detect an object when the distance between the display device and the object is in the range of 0.1 mm to 300 mm, preferably 3 mm to 50 mm, is preferable. This configuration makes it possible to operate the display device without the object directly touching it, in other words, to operate the display device in a contactless (touchless) manner. This configuration reduces the risk of the display device becoming dirty or scratched, or makes it possible to operate the display device without the object directly touching dirt (e.g., dust, viruses, etc.) attached to the display device.

[0480] In order to capture high-resolution images, it is preferable that the sub-pixels PS be provided in all pixels of the display device. On the other hand, when used in a touch sensor or near-touch sensor, the sub-pixels PS do not require high accuracy compared to when capturing images of fingerprints, etc., so it is sufficient to provide the sub-pixels PS in only some of the pixels of the display device. By making the number of sub-pixels PS in the display device smaller than the number of sub-pixels R, etc., the detection speed can be increased.

[0481] FIG. 29G shows an example of a pixel circuit of a sub-pixel having a light-receiving device, and FIG. 29H shows an example of a pixel circuit of a sub-pixel having a light-emitting device.

[0482] 29G includes a light receiving device PD, a transistor M11, a transistor M12, a transistor M13, a transistor M14, and a capacitance element C2. Here, an example is shown in which a photodiode is used as the light receiving device PD.

[0483] The anode of the light-receiving device PD is electrically connected to the wiring V1, and the cathode is electrically connected to one of the source and drain of the transistor M11. The gate of the transistor M11 is electrically connected to the wiring TX, and the other of the source and drain is electrically connected to one electrode of the capacitor C2, one of the source and drain of the transistor M12, and the gate of the transistor M13. The gate of the transistor M12 is electrically connected to the wiring RES, and the other of the source and drain is electrically connected to the wiring V2. The source and drain of the transistor M13 is electrically connected to the wiring V3, and the other of the source and drain is electrically connected to one of the source and drain of the transistor M14. The gate of the transistor M14 is electrically connected to the wiring SE, and the other of the source and drain is electrically connected to the wiring OUT1.

[0484] A constant potential is supplied to the wiring V1, the wiring V2, and the wiring V3. When the light-receiving device PD is driven in a reverse bias, a potential higher than the potential of the wiring V1 is supplied to the wiring V2. The transistor M12 is controlled by a signal supplied to the wiring RES and has a function of resetting the potential of a node connected to the gate of the transistor M13 to the potential supplied to the wiring V2. The transistor M11 is controlled by a signal supplied to the wiring TX and has a function of controlling the timing at which the potential of the node changes depending on the current flowing through the light-receiving device PD. The transistor M13 functions as an amplifying transistor that outputs according to the potential of the node. The transistor M14 is controlled by a signal supplied to the wiring SE and functions as a selection transistor that reads out an output according to the potential of the node to an external circuit connected to the wiring OUT1.

[0485] 29H includes a light-emitting device EL, a transistor M15, a transistor M16, a transistor M17, and a capacitor C3. Here, a light-emitting diode is used as the light-emitting device EL. It is particularly preferable to use an organic EL element as the light-emitting device EL.

[0486] The transistor M15 has a gate electrically connected to a wiring VG, one of its source and drain electrically connected to a wiring VS, and the other of its source and drain electrically connected to one electrode of the capacitor C3 and the gate of the transistor M16. One of the source and drain of the transistor M16 is electrically connected to a wiring V4, and the other is electrically connected to the anode of the light-emitting device EL and one of the source and drain of the transistor M17. The transistor M17 has a gate electrically connected to a wiring MS, and the other of its source and drain electrically connected to a wiring OUT2. The cathode of the light-emitting device EL is electrically connected to a wiring V5.

[0487] A constant potential is supplied to the wiring V4 and the wiring V5. The anode side of the light-emitting device EL can be set to a high potential, and the cathode side can be set to a lower potential than the anode side. The transistor M15 is controlled by a signal supplied to the wiring VG and functions as a selection transistor for controlling the selection state of the pixel circuit PIX2. The transistor M16 also functions as a drive transistor that controls the current flowing through the light-emitting device EL depending on the potential supplied to its gate. When the transistor M15 is in a conductive state, the potential supplied to the wiring VS is supplied to the gate of the transistor M16, and the light emission brightness of the light-emitting device EL can be controlled depending on the potential. The transistor M17 is controlled by a signal supplied to the wiring MS and has the function of outputting the potential between the transistor M16 and the light-emitting device EL to the outside via the wiring OUT2.

[0488] Here, it is preferable that the transistors M11, M12, M13, and M14 included in the pixel circuit PIX1, and the transistors M15, M16, and M17 included in the pixel circuit PIX2 are transistors that use a metal oxide (oxide semiconductor) in the semiconductor layer in which the channel is formed.

[0489] A transistor using a metal oxide, which has a wider band gap and a lower carrier density than silicon, can achieve an extremely small off-state current. Therefore, the small off-state current allows charge stored in a capacitor connected in series with the transistor to be held for a long period of time. Therefore, it is preferable to use a transistor including an oxide semiconductor for the transistor M11, the transistor M12, and the transistor M15, which are connected in series with the capacitor C2 or the capacitor C3. Furthermore, by using a transistor including an oxide semiconductor for other transistors as well, manufacturing costs can be reduced.

[0490] Alternatively, the transistors M11 to M17 may be transistors in which silicon is used as a semiconductor in which a channel is formed. In particular, using silicon with high crystallinity, such as single crystal silicon or polycrystalline silicon, is preferable because high field-effect mobility can be achieved and higher-speed operation is possible.

[0491] Alternatively, a structure may be used in which at least one of the transistors M11 to M17 includes an oxide semiconductor and the remaining transistors include silicon.

[0492] Although the transistors are shown as n-channel transistors in FIGS. 29G and 29H, p-channel transistors can also be used.

[0493] The transistors of the pixel circuit PIX1 and the transistors of the pixel circuit PIX2 are preferably formed side by side on the same substrate. In particular, it is preferable that the transistors of the pixel circuit PIX1 and the transistors of the pixel circuit PIX2 are mixed and periodically arranged in one region.

[0494] It is also preferable to provide one or more layers having transistors and / or capacitors at positions overlapping the light-receiving device PD or the light-emitting device EL, thereby reducing the effective area occupied by each pixel circuit and realizing a high-definition light-receiving section or display section.

[0495] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0496] (Embodiment 8) In this embodiment, a metal oxide (also referred to as an oxide semiconductor) that can be used for the OS transistor described in the above embodiment will be described.

[0497] The metal oxide used in the OS transistor preferably contains at least indium or zinc, and more preferably contains indium and zinc. For example, the metal oxide preferably contains indium, M (where M is one or more selected from gallium, aluminum, yttrium, tin, silicon, boron, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, and cobalt), and zinc. In particular, M is preferably one or more selected from gallium, aluminum, yttrium, and tin, and more preferably gallium.

[0498] Furthermore, the metal oxide can be formed by a sputtering method, a chemical vapor deposition (CVD) method such as a metal organic chemical vapor deposition (MOCVD) method, or an atomic layer deposition (ALD) method.

[0499] Hereinafter, an oxide containing indium (In), gallium (Ga), and zinc (Zn) will be described as an example of a metal oxide. Note that an oxide containing indium (In), gallium (Ga), and zinc (Zn) may be referred to as an In-Ga-Zn oxide.

[0500] <Classification of crystal structures> Examples of the crystalline structure of oxide semiconductors include amorphous (including completely amorphous), c-axis-aligned crystalline (CAAC), nanocrystalline (nc), cloud-aligned composite (CAC), single crystal, and polycrystal.

[0501] The crystalline structure of a film or substrate can be evaluated using an X-ray diffraction (XRD) spectrum. For example, it can be evaluated using an XRD spectrum obtained by GIXD (Grazing-Incidence XRD) measurement. The GIXD method is also called the thin film method or the Seemann-Bohlin method. In the following, the XRD spectrum obtained by GIXD measurement may be simply referred to as the XRD spectrum.

[0502] For example, in the case of a quartz glass substrate, the peak shape of the XRD spectrum is nearly symmetrical. On the other hand, in the case of an In-Ga-Zn oxide film having a crystalline structure, the peak shape of the XRD spectrum is asymmetrical. The asymmetrical peak shape of the XRD spectrum clearly indicates the presence of crystals in the film or substrate. In other words, if the peak shape of the XRD spectrum is not symmetrical, the film or substrate cannot be said to be in an amorphous state.

[0503] The crystalline structure of a film or substrate can be evaluated by a diffraction pattern (also called a nanobeam electron diffraction pattern) observed by nanobeam electron diffraction (NBED). For example, a halo is observed in the diffraction pattern of a quartz glass substrate, confirming that the quartz glass is in an amorphous state. Furthermore, a spot-like pattern is observed in the diffraction pattern of an In-Ga-Zn oxide film formed at room temperature, rather than a halo. Therefore, it is presumed that an In-Ga-Zn oxide film formed at room temperature is neither single-crystal nor polycrystalline, nor in an amorphous state, but is in an intermediate state, and it cannot be concluded that it is in an amorphous state.

[0504] <<Structure of oxide semiconductor>> Note that oxide semiconductors may be classified differently from the above when focusing on their structures. For example, oxide semiconductors are divided into single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors. Examples of non-single-crystal oxide semiconductors include the above-mentioned CAAC-OS and nc-OS. Non-single-crystal oxide semiconductors include polycrystalline oxide semiconductors, amorphous-like oxide semiconductors (a-like OSs), amorphous oxide semiconductors, and the like.

[0505] Here, the above-mentioned CAAC-OS, nc-OS, and a-like OS will be described in detail.

[0506] [CAAC-OS] CAAC-OS is an oxide semiconductor having multiple crystalline regions, each with its c-axis aligned in a specific direction. The specific direction can be the thickness direction of the CAAC-OS film, the normal direction to the surface on which the CAAC-OS film is formed, or the normal direction to the surface of the CAAC-OS film. A crystalline region is a region with periodic atomic arrangement. If the atomic arrangement is considered as a lattice arrangement, a crystalline region can also be a region with a uniform lattice arrangement. Furthermore, CAAC-OS has a region where multiple crystalline regions are connected in the ab-plane direction, and the region may have distortion. Note that distortion refers to a location where the lattice arrangement changes between a region with a uniform lattice arrangement and a region with a different uniform lattice arrangement in the region where multiple crystalline regions are connected. In other words, CAAC-OS is an oxide semiconductor with a c-axis aligned but no clear orientation in the ab-plane direction.

[0507] Each of the multiple crystalline regions is composed of one or more minute crystals (crystals with a maximum diameter of less than 10 nm). When a crystalline region is composed of one minute crystal, the maximum diameter of the crystalline region is less than 10 nm. When a crystalline region is composed of many minute crystals, the size of the crystalline region may be several tens of nm.

[0508] In the In-Ga-Zn oxide, the CAAC-OS tends to have a layered crystal structure (also referred to as a layered structure) in which a layer containing indium (In) and oxygen (hereinafter referred to as an In layer) and a layer containing gallium (Ga), zinc (Zn), and oxygen (hereinafter referred to as a (Ga,Zn) layer) are stacked. Note that indium and gallium are mutually substituted. Therefore, the (Ga,Zn) layer may contain indium. The In layer may contain gallium. The In layer may contain zinc. The layered structure is observed as a lattice image in a high-resolution transmission electron microscope (TEM) image, for example.

[0509] When the CAAC-OS film is subjected to structural analysis using, for example, an XRD apparatus, a peak indicating c-axis orientation is detected at or near 2θ=31° in out-of-plane XRD measurement using θ / 2θ scan. Note that the position of the peak indicating c-axis orientation (2θ value) may vary depending on the type and composition of the metallic elements constituting the CAAC-OS.

[0510] For example, in the electron diffraction pattern of a CAAC-OS film, multiple bright spots are observed, and the spots are observed at positions that are point-symmetric with respect to the spot of the incident electron beam that has passed through the sample (also called the direct spot).

[0511] When the crystalline region is observed from the specific direction, the lattice arrangement within the crystalline region is basically a hexagonal lattice, but the unit cell is not necessarily a regular hexagon and may be non-regular hexagonal. The distortion may also have a pentagonal, heptagonal, or other lattice arrangement. In the CAAC-OS, no clear grain boundaries are observed even near the distortion. This indicates that the formation of grain boundaries is suppressed by the distortion of the lattice arrangement. This is thought to be because the CAAC-OS can tolerate distortion due to the lack of close-packed oxygen atom arrangement in the ab-plane direction and the change in interatomic bond distance caused by metal atom substitution.

[0512] A crystal structure with clear grain boundaries is called polycrystalline. Grain boundaries act as recombination centers, trapping carriers and potentially causing a decrease in the on-state current and field-effect mobility of a transistor. Therefore, CAAC-OS, which lacks clear grain boundaries, is one of the crystalline oxides with a crystal structure suitable for use in the semiconductor layer of a transistor. Zn is preferred for use in CAAC-OS. For example, In-Zn oxide and In-Ga-Zn oxide are suitable because they can suppress the generation of grain boundaries more effectively than In oxide.

[0513] CAAC-OS is an oxide semiconductor with high crystallinity and no clear crystal grain boundaries. Therefore, it can be said that the CAAC-OS is less susceptible to a decrease in electron mobility due to crystal grain boundaries. Furthermore, since the crystallinity of an oxide semiconductor can be reduced by impurities or defects, the CAAC-OS can be said to be an oxide semiconductor with few impurities and defects (such as oxygen vacancies). Therefore, oxide semiconductors with CAAC-OS have stable physical properties. Therefore, oxide semiconductors with CAAC-OS are heat-resistant and highly reliable. Furthermore, the CAAC-OS is stable even under high temperatures (so-called thermal budgets) during the manufacturing process. Therefore, using a CAAC-OS for an OS transistor can increase the flexibility of the manufacturing process.

[0514] [nc-OS] The nc-OS has periodic atomic arrangement in a microscopic region (e.g., a region of 1 nm to 10 nm, particularly a region of 1 nm to 3 nm). In other words, the nc-OS has microcrystalline structures. The size of the microcrystalline structures is, for example, 1 nm to 10 nm, particularly 1 nm to 3 nm, and therefore these microcrystalline structures are also called nanocrystalline structures. Furthermore, the nc-OS exhibits no regularity in the crystal orientation between different nanocrystalline structures. Therefore, the entire film lacks orientation. Therefore, depending on the analytical method, the nc-OS may be indistinguishable from an a-like OS or an amorphous oxide semiconductor. For example, when a structural analysis of an nc-OS film is performed using an XRD system, no peaks indicating crystallinity are detected in out-of-plane XRD measurements using θ / 2θ scanning. Furthermore, when an nc-OS film is subjected to electron diffraction (also known as selected-area electron diffraction) using an electron beam with a probe diameter larger than that of nanocrystalline structures (e.g., 50 nm or larger), a halo-like diffraction pattern is observed. On the other hand, when electron diffraction (also called nanobeam electron diffraction) is performed on an nc-OS film using an electron beam with a probe diameter close to or smaller than the size of the nanocrystals (for example, 1 nm to 30 nm), an electron diffraction pattern can be obtained in which multiple spots are observed within a ring-shaped region centered on the direct spot.

[0515] [a-like OS] The a-like OS is an oxide semiconductor having a structure between the nc-OS and the amorphous oxide semiconductor. The a-like OS has a pore or low-density region. That is, the a-like OS has lower crystallinity than the nc-OS and CAAC-OS. Furthermore, the a-like OS has a higher hydrogen concentration in the film than the nc-OS and CAAC-OS.

[0516] <<Oxide semiconductor structure>> Next, the above-mentioned CAC-OS will be described in detail, which relates to the material composition.

[0517] [CAC-OS] CAC-OS is a material structure in which elements constituting a metal oxide are unevenly distributed in a size range of 0.5 nm to 10 nm, preferably 1 nm to 3 nm, or a similar size range. Hereinafter, a metal oxide in which one or more metal elements are unevenly distributed and the regions containing the metal elements are mixed in a size range of 0.5 nm to 10 nm, preferably 1 nm to 3 nm, or a similar size range, is also referred to as a mosaic or patch state.

[0518] Furthermore, CAC-OS has a mosaic structure in which the material is separated into first and second regions, and the first regions are distributed throughout the film (hereinafter also referred to as a cloud structure). That is, CAC-OS is a composite metal oxide having a structure in which the first and second regions are mixed.

[0519] Here, the atomic ratios of In, Ga, and Zn to the metal elements constituting the CAC-OS in the In-Ga-Zn oxide are denoted as [In], [Ga], and [Zn], respectively. For example, in the CAC-OS in the In-Ga-Zn oxide, the first region is a region where [In] is larger than [In] in the composition of the CAC-OS film. The second region is a region where [Ga] is larger than [Ga] in the composition of the CAC-OS film. Alternatively, for example, the first region is a region where [In] is larger than [In] in the second region and [Ga] is smaller than [Ga] in the second region. The second region is a region where [Ga] is larger than [Ga] in the first region and [In] is smaller than [In] in the first region.

[0520] Specifically, the first region is a region whose main component is indium oxide, indium zinc oxide, or the like. The second region is a region whose main component is gallium oxide, gallium zinc oxide, or the like. In other words, the first region can be rephrased as a region whose main component is In. The second region can be rephrased as a region whose main component is Ga.

[0521] It should be noted that there are cases where a clear boundary between the first region and the second region cannot be observed.

[0522] In addition, CAC-OS in In-Ga-Zn oxide refers to a material structure containing In, Ga, Zn, and O, in which some regions primarily composed of Ga and other regions primarily composed of In are randomly arranged in a mosaic pattern. Therefore, it is presumed that CAC-OS has a structure in which metal elements are distributed nonuniformly.

[0523] CAC-OS can be formed, for example, by a sputtering method under conditions where the substrate is not intentionally heated. When forming CAC-OS by a sputtering method, any one or more of an inert gas (typically argon), oxygen gas, and nitrogen gas may be used as the deposition gas. The lower the flow rate of oxygen gas relative to the total flow rate of deposition gas during deposition, the better. For example, the flow rate of oxygen gas relative to the total flow rate of deposition gas during deposition is set to 0% or more and less than 30%, preferably 0% or more and 10% or less.

[0524] Furthermore, for example, in the case of CAC-OS in an In-Ga-Zn oxide, EDX mapping obtained using EDX (Energy Dispersive X-ray spectroscopy) confirms that the CAC-OS has a structure in which a region containing In as a main component (first region) and a region containing Ga as a main component (second region) are unevenly distributed and mixed.

[0525] Here, the first region has higher conductivity than the second region. That is, the flow of carriers through the first region causes the metal oxide to exhibit conductivity. Therefore, the first region is distributed in a cloud-like manner in the metal oxide, thereby achieving a high field-effect mobility (μ).

[0526] On the other hand, the second region has higher insulating properties than the first region. That is, the second region is distributed in the metal oxide, thereby suppressing leakage current.

[0527] Therefore, when CAC-OS is used in a transistor, the conductivity due to the first region and the insulating property due to the second region act complementarily, thereby providing the CAC-OS with a switching function (the ability to turn on / off). In other words, CAC-OS has a conductive function in part of the material and an insulating function in part of the material, and the material as a whole functions as a semiconductor. By separating the conductive function from the insulating function, both functions can be maximized. Therefore, by using CAC-OS in a transistor, a high on-current (I on ), high field-effect mobility (μ), and good switching behavior can be achieved.

[0528] Furthermore, a transistor using CAC-OS has high reliability, making it ideal for various semiconductor devices such as display devices.

[0529] Oxide semiconductors have a variety of structures, each with different characteristics. The oxide semiconductor of one embodiment of the present invention may include two or more of an amorphous oxide semiconductor, a polycrystalline oxide semiconductor, an a-like OS, a CAC-OS, an nc-OS, and a CAAC-OS.

[0530] <Transistors containing oxide semiconductors> Next, a case where the oxide semiconductor is used in a transistor will be described.

[0531] By using the oxide semiconductor for a transistor, a transistor with high field-effect mobility and high reliability can be realized.

[0532] For the transistor, an oxide semiconductor with a low carrier concentration is preferably used. For example, the carrier concentration of the oxide semiconductor is 1×10 17 cm -3 Less than 1 × 10 15 cm -3 or less, more preferably 1 × 10 13 cm -3Less than or equal to 1×10 11 cm -3 or less, more preferably 1 × 10 10 cm -3 Less than 1 x 10 -9 cm -3 That is all. Note that in order to reduce the carrier concentration of an oxide semiconductor film, the impurity concentration in the oxide semiconductor film may be reduced to reduce the density of defect states. In this specification and the like, a semiconductor having a low impurity concentration and a low density of defect states is referred to as a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor. Note that an oxide semiconductor having a low carrier concentration may also be referred to as a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor.

[0533] Furthermore, a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has a low density of defect states, and therefore the density of trap states may also be low.

[0534] Furthermore, charges trapped in the trap states of an oxide semiconductor take a long time to dissipate and may behave like fixed charges. Therefore, a transistor in which a channel formation region is formed in an oxide semiconductor with a high density of trap states may have unstable electrical characteristics.

[0535] Therefore, reducing the impurity concentration in the oxide semiconductor is effective for stabilizing the electrical characteristics of a transistor. Furthermore, in order to reduce the impurity concentration in the oxide semiconductor, it is preferable to also reduce the impurity concentration in adjacent films. Examples of impurities include hydrogen, nitrogen, alkali metals, alkaline earth metals, iron, nickel, and silicon. Note that impurities in an oxide semiconductor refer to, for example, elements other than the main components constituting the oxide semiconductor. For example, an element with a concentration of less than 0.1 atomic % can be considered an impurity.

[0536] <Impurities> Here, the influence of each impurity in an oxide semiconductor will be described.

[0537] When an oxide semiconductor contains silicon or carbon, which is one of the Group 14 elements, defect levels are formed in the oxide semiconductor. Therefore, the concentration of silicon or carbon in the oxide semiconductor and the concentration of silicon or carbon near the interface with the oxide semiconductor (concentration obtained by secondary ion mass spectrometry (SIMS)) are calculated to be 2×10 18 atoms / cm 3 Less than or equal to 2 x 10 17 atoms / cm 3 The following applies.

[0538] Furthermore, when an oxide semiconductor contains an alkali metal or alkaline earth metal, defect levels may be formed and carriers may be generated. Therefore, a transistor using an oxide semiconductor containing an alkali metal or alkaline earth metal is likely to have normally-on characteristics. Therefore, when the concentration of the alkali metal or alkaline earth metal in the oxide semiconductor obtained by SIMS is 1×10 18 atoms / cm 3 Less than or equal to 2 x 10 16 atoms / cm 3 Do the following:

[0539] Furthermore, when nitrogen is contained in an oxide semiconductor, electrons serving as carriers are generated, the carrier concentration increases, and the semiconductor is likely to become n-type. As a result, a transistor using an oxide semiconductor containing nitrogen as a semiconductor tends to have normally-on characteristics. Alternatively, when nitrogen is contained in an oxide semiconductor, trap states may be formed. As a result, the electrical characteristics of the transistor may become unstable. For this reason, the nitrogen concentration in the oxide semiconductor obtained by SIMS is set to 5×10 19 atoms / cm 3 Less than 5 x 10 18 atoms / cm 3 Less than or equal to 1×10 18 atoms / cm 3 Less than 5 × 10, more preferably 17 atoms / cm 3 Do the following:

[0540] Furthermore, hydrogen contained in an oxide semiconductor may react with oxygen bonded to a metal atom to form water, which may form an oxygen vacancy. When hydrogen enters the oxygen vacancy, electrons serving as carriers may be generated. Furthermore, some of the hydrogen may bond with oxygen bonded to a metal atom to generate electrons serving as carriers. Therefore, a transistor using an oxide semiconductor containing hydrogen is likely to have normally-on characteristics. For this reason, it is preferable to reduce the amount of hydrogen in the oxide semiconductor as much as possible. Specifically, the hydrogen concentration in the oxide semiconductor obtained by SIMS is measured to be 1×10 20 atoms / cm 3 Less than 1 x 10 19 atoms / cm 3 less than 5 × 10 18 atoms / cm 3 less than 1×10 18 atoms / cm 3 Make it less than.

[0541] When an oxide semiconductor with sufficiently reduced impurities is used for a channel formation region of a transistor, stable electrical characteristics can be obtained.

[0542] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification. [Explanation of symbols]

[0543] 10: vehicle control device, 20a to 20d: light receiving and emitting unit, 20: light receiving and emitting unit, 21B: light emitting element, 21G: light emitting element, 21IR: light emitting element, 21R: light emitting element, 21: light emitting element, 22: light receiving element, 23: drive circuit, 24: readout circuit, 25r: reflected light, 25: light, 30: control unit, 31: data generation unit, 32: determination unit, 33: processing unit, 35L: left hand, 35R: right hand, 35: hand, 40: operation unit, 41: steering wheel, 42a: member, 4 2b: member, 42: rim, 43: hub, 44: spoke, 45: shaft, 50: vehicle, 51: display unit, 52: dashboard, 54: windshield, 55: camera, 56: air vent, 58a: door, 58b: door, 59a: display unit, 59b: display unit, 60a to 60h: display panel, 61A to 61C: display unit, 61: display unit, 62B: display panel, 62C: display panel, 62: display panel, 63: display area, 64: non-display area,

Claims

1. a steering wheel having a rim, a hub, and spokes; the rim is connected to the hub via the spokes; The rim has a light receiving and emitting portion, the light receiving and emitting unit has a light emitting element and a light receiving element, The light emitting element and the light receiving element are arranged side by side on the same plane, the light-emitting element has a laminated structure in which a first electrode, a first organic layer, a common layer, and a common electrode are laminated; the light-receiving element has a laminated structure in which a second electrode, a second organic layer, the common layer, and the common electrode are laminated; the first organic layer includes an emitting layer; the second organic layer includes a photoelectric conversion layer, the light-emitting layer and the photoelectric conversion layer each contain different organic compounds, a first insulating layer between the light emitting element and the light receiving element, and a second insulating layer provided on the first insulating layer; the first insulating layer has a region in contact with a side surface of the first electrode, a region in contact with a side surface of the first organic layer, a region in contact with a side surface of the second electrode, a region in contact with a side surface of the second organic layer, and a region in contact with a lower surface of the common layer; The second insulating layer has an area that contacts the lower surface of the common layer.

2. The vehicle control device according to claim 1 ; A vehicle having a display device, the display device has a display unit with a curved surface, The display unit is provided along the dashboard or pillar. vehicle.

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