Substrate processing device, substrate processing method, and storage medium

Abstract

To reduce the amount of a solvent to be used for cleaning the inside of a pipe for drainage.SOLUTION: A substrate processing device is a device for applying predetermined processing to a substrate. The substrate processing device comprises: a holding part which holds the substrate when applying liquid processing using a process liquid to the substrate; a cup which is disposed so as to enclose the holding part and receives the process liquid; a pipe for drainage which guides the process liquid which is used for the liquid processing to the outside of the substrate processing device; a connection pipe which guides the process liquid from the cup to the pipe for drainage; and an air-tight part which maintains a state where a gas is not circulated between the pipe for drainage and the connection pipe. The inside of the pipe for drainage is maintained in such an atmosphere of a solvent that the process liquid can be removed.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus, a substrate processing method, and a storage medium. [Background technology]

[0002] Patent document 1 discloses a liquid treatment device that includes a main drainage pipe for draining liquid from a liquid treatment unit, and a plurality of drainage branch pipes that branch off from the main drainage pipe for each of the liquid treatment units and are connected to each of the liquid treatment units. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-142404 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a substrate processing apparatus, a substrate processing method, and a storage medium that are useful for reducing the amount of solvent used to clean the inside of a drainage pipe. [Means for solving the problem]

[0005] A substrate processing apparatus according to one aspect of the present disclosure is an apparatus for performing a predetermined process on a substrate. The substrate processing apparatus includes a holder for holding a substrate when the substrate is subjected to a liquid process using a processing liquid, a cup surrounding the holder for receiving the processing liquid, a drainage pipe for conducting the processing liquid after the liquid process to the outside of the substrate processing apparatus, a connection pipe for conducting the processing liquid from the cup to the drainage pipe, and an airtight section for maintaining a state in which gas does not circulate between the drainage pipe and the connection pipe. The interior of the drainage pipe is maintained in an atmosphere of a solvent capable of removing the processing liquid. [Effects of the Invention]

[0006] According to the present disclosure, there are provided a substrate processing apparatus, a substrate processing method, and a storage medium that are useful for reducing the amount of solvent used to clean the inside of a drainage pipe. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view schematically showing an example of a substrate processing apparatus. [Figure 2] FIG. 2 is a front view schematically showing an example of the substrate processing apparatus. [Figure 3] FIG. 3 is a schematic diagram showing an example of a liquid treatment apparatus. [Figure 4] FIG. 4 is a schematic diagram showing an example of a drainage device. [Figure 5] FIG. 5 is a schematic diagram showing an example of a drainage device. [Figure 6] FIG. 6 is a schematic diagram showing an example of the airtight part. [Figure 7] FIG. 7 is a schematic diagram showing an example of the airtight part. [Figure 8] FIG. 8 is a schematic diagram showing an example of the airtight part. [Figure 9] FIG. 9 is a block diagram illustrating an example of a hardware configuration of the control device. [Figure 10] 10(a) and 10(b) are flowcharts showing an example of a processing flow executed by the control device. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, a wafer processing system as a substrate processing apparatus according to the present embodiment will be described with reference to the drawings. In this specification, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0009] Hereinafter, a wafer processing system as a substrate processing apparatus according to the present embodiment will be described with reference to the drawings. In this specification, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0010] <Wafer processing system> First, the configuration of a wafer processing system according to this embodiment will be described. Figures 1 and 2 are a plan view and a front view, respectively, that schematically show the configuration of a wafer processing system 1. The wafer processing system 1 is an apparatus that performs predetermined processing on a wafer W (substrate). In this embodiment, the wafer processing system 1 is described as an example of a photolithography processing system that performs a resist film forming process and a development process on the wafer W.

[0011] 1, the wafer processing system 1 includes a cassette station 2 into which a cassette C containing a plurality of wafers W is loaded and unloaded, and a processing station 3 equipped with a plurality of various processing devices that perform predetermined processing on the wafers W. The wafer processing system 1 has a configuration in which the cassette station 2, the processing station 3, and an interface station 4 that transfers the wafers W between them and an exposure device (not shown) adjacent to the opposite side of the processing station 3 are integrally connected. Note that, as shown in FIG. 1, two processing stations 3 are installed between the cassette station 2 and the interface station 4, but one, or three or more processing stations may be installed.

[0012] Cassette station 2 is provided with a plurality of cassette mounting tables 21 and wafer transfer devices 22 and 23. Cassette station 2 uses wafer transfer device 22 or 23 to transfer wafers between cassette C placed on mounting table 12 and processing station 3. To this end, wafer transfer devices 22 and 23 are each provided with a drive mechanism having movement paths in each direction, such as the horizontal direction (X direction and Y direction), the vertical direction (Z direction), and around the vertical axis (θ direction), as needed, and may also be provided with a drive mechanism having movement paths in all directions. At least one of wafer transport devices 22 and 23 is capable of transferring wafers to and from cassette C, and is also capable of transferring wafers to and from processing station 3. Note that the transfer of wafers to and from processing station 3 refers to, for example, transferring wafers to and from third block G3, which includes a transfer device accessible by wafer transport device 33 in processing station 3, which will be described later. Third block G3 may include multiple transfer devices (not shown) arranged vertically.

[0013] An inspection device (not shown) for inspecting the wafer W may be provided at a position accessible to either the wafer transfer device 22 or 23.

[0014] The processing station 3 is provided with multiple blocks, e.g., three blocks G1, G2, and G4 (first, second, and fourth blocks). Also, as shown in FIG. 2, multiple layers 31 each including the first and second blocks G1 and G2 are stacked vertically. For example, the first block G1 is provided on the front side of the processing station 3 (the negative X-direction side in FIG. 1), and the second block G2 is provided on the back side of the processing station 3 (the positive X-direction side in FIG. 1). The fourth block G4 is provided on the interface station 4 side of the processing station 3 (the positive Y-direction side in FIG. 1) or at a connection portion with another adjacent processing station 3. The fourth block G4 may be provided with multiple transfer devices arranged vertically. The aforementioned third block G3 may also be provided within the processing station 3.

[0015] The first block G1 includes a plurality of processing devices, such as a patterning film forming device and a development processing device (both not shown). The patterning film forming device may include, for example, a resist film forming device and an anti-reflection film forming device. For example, a plurality of processing devices may be arranged in a horizontal line, and the number, arrangement, and type of these processing devices may be selected arbitrarily.

[0016] In these patterning film forming apparatuses and developing treatment apparatuses, for example, a predetermined processing liquid or a predetermined gas is supplied onto the wafer W. In this manner, the patterning film forming apparatus forms a resist film used as a mask when forming a pattern on an underlying film, or forms an anti-reflection film for efficiently performing a light irradiation process, such as an exposure process. Meanwhile, in the developing treatment apparatus, a portion of the exposed resist film is removed to form an uneven shape as the mask. A liquid treatment apparatus U1 that performs liquid treatment using a processing liquid for forming a resist film may be disposed in the first block G1 as an example of a patterning film forming apparatus.

[0017] For example, in the second block G2, heat treatment devices (not shown) that perform heat treatment such as heating and cooling of the wafer W are arranged in a vertical and horizontal direction. Also, in the second block G2, although neither is shown, a hydrophobization treatment device that performs a hydrophobization treatment to improve the adhesion of the resist liquid to the wafer W, and a peripheral exposure device that exposes the peripheral portion of the wafer W are arranged in a vertical and horizontal direction (Z direction in FIG. 2). The number and arrangement of these heat treatment devices, hydrophobization treatment devices, and peripheral exposure devices can also be selected as desired.

[0018] 1, a wafer transfer area 32 is formed in an area sandwiched between a first block G1 and a second block G2 in a plan view. In the wafer transfer area 32, for example, a wafer transfer device 33 is disposed.

[0019] The wafer transfer device 33 has a transfer arm that is movable in, for example, the Y direction, the front-to-rear direction, the θ direction, and the up-and-down direction. The wafer transfer device 33 moves within the wafer transfer area 32 and can transfer the wafer W to predetermined devices in the surrounding first block G1, second block G2, third block G3, and fourth block G4. When there are multiple processing stations 3 as shown in FIG. 1, the wafer transfer device 33 provided in the processing station 3 located on the interface station 4 side can transfer the wafer W to predetermined devices in the first, second, and fourth blocks G1, G2, and G3, as well as the fifth block G5 described below.

[0020] A plurality of wafer transfer devices 33 are arranged one above the other, for example, as shown in FIG. 2. One wafer transfer device 33 can transfer wafers W to a predetermined device located at the height of the upper layers 31 among the multiple layers 31 stacked one above the other. Another wafer transfer device 33 can transfer wafers W to a predetermined device located at the height of multiple layers 31 located below the above layers 31. A plurality of wafer transfer areas 32 are provided to enable such transfer of wafers W. Note that the number of wafer transfer devices 33 and the number of layers 31 corresponding to one wafer transfer device 33 can be selected arbitrarily, such as by providing a wafer transfer device 33 for each layer 31.

[0021] The wafer transfer area 32, the first block G1, or the second block G2 may also include a shuttle transfer device (not shown). The shuttle transfer device linearly transfers the wafer W between a space adjacent to one side of the processing station 3 and another space adjacent to the opposite side.

[0022] The interface station 4 is provided with a fifth block G5 equipped with multiple transfer devices and wafer transfer devices 41 and 42. The interface station 4 uses the wafer transfer device 41 or 42 to transfer the wafer W between the fifth block G5, where the wafer W is transferred by the wafer transfer device 33, and the exposure device. To this end, the wafer transfer devices 41 and 42 are each provided with a drive mechanism having movement paths in various directions, such as the horizontal direction (X direction, Y direction), the vertical direction (Z direction), and around the vertical axis (θ direction), as needed, or may be provided with a drive mechanism having movement paths in all directions. At least one of the wafer transfer devices 41 and 42 can support the wafer W and transfer the wafer W between the transfer device in the fifth block G5 and the exposure device.

[0023] A cleaning device for cleaning the surface of the wafer W and the aforementioned peripheral exposure device may be provided in the interface station 4 at a position accessible to either of the wafer transfer devices 41 and 42 .

[0024] The inspection device may be provided in cassette station 2 as described above, but it may also be provided in processing station 3 and interface station 4 at a position accessible to any of the transport arms (33, 41, 42 in Figure 1 or Figure 2) provided inside each station.

[0025] The wafer processing system 1 described above is provided with a control device 100. The control device 100 is, for example, a computer and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of wafers W in the wafer processing system 1. The program storage unit also stores a program for controlling the operation of drive systems such as the various processing devices and transport devices described above to perform wafer processing in the wafer processing system 1. The program may be recorded on a computer-readable storage medium H and installed into the control device 100 from the storage medium H. The storage medium H may include a ROM, RAM, or hard disk, but the structure and type are not limited and may be temporary or non-temporary. The control device 100 may include components for storing, reading, and executing programs for performing wafer processing and for performing related communications. Each component may be located inside or outside the wafer processing system 1. The control device 100 may be one or more circuits, or may be provided as an integrated unit or as separate units.

[0026] <Wafer Processing System Operation> The wafer processing system 1 is configured as described above. Next, an example of wafer processing performed using the wafer processing system 1 configured as described above will be described.

[0027] First, a cassette C containing a plurality of wafers W is carried into cassette station 2 of wafer processing system 1 and placed on cassette mounting table 21. Next, each wafer W in cassette C is sequentially removed by wafer transfer device 22 or 23 and transferred to a transfer device in third block G3.

[0028] The wafer W transferred to the transfer device in the third block G3 is supported by the wafer transfer device 33 and transferred to a hydrophobization treatment device provided in the second block G2, where hydrophobization treatment is performed. The wafer W is then transferred by the wafer transfer device 33 to a resist film forming device (e.g., liquid processing device U1) where a resist film is formed on the wafer W, and then transferred to a heat treatment device where a pre-bake treatment is performed, and then transferred to the transfer device in the fifth block G5. When there are multiple processing stations 3 as shown in FIGS. 1 and 2, the wafer W is temporarily placed in the transfer device in the fourth block G4 before being transferred to the transfer device in the fifth block G5, and then transferred between multiple wafer transfer devices 33. If necessary, the wafer W may also be transferred by the wafer transfer device 33 to a peripheral exposure device where exposure treatment is performed on the peripheral portion of the wafer.

[0029] The wafer W transferred to the delivery device in the fifth block G5 is transferred to the exposure device by wafer transfer devices 41 and 42, and is exposed to a predetermined pattern. Note that the wafer W may be cleaned in a cleaning device before the exposure process.

[0030] The exposed wafer W is transferred to a transfer device in the fifth block G5 by wafer transfer devices 41 and 42. Thereafter, the wafer W is transferred to a heat treatment device by wafer transfer device 33, where it is subjected to post-exposure baking.

[0031] The wafer W that has been subjected to post-exposure baking is transferred by the wafer transfer device 33 to a developing treatment device and developed. After development is completed, the wafer W is transferred by the wafer transfer device 33 to a heat treatment device and subjected to post-baking.

[0032] Thereafter, the wafer W is transferred by the wafer transfer device 33 to the delivery device in the third block G3, and then transferred by the wafer transfer device 22 or 23 in the cassette station 2 to the cassette C on the predetermined cassette mounting table 21. In this way, a series of photolithography steps is completed.

[0033] It should be noted that the wafer processing system of the present disclosure is not limited to the configuration and operation described above. For example, in the above-described embodiment, the wafer processing system is directly connected to the exposure apparatus, and the wafer W is transferred between the interface station 4 and the exposure apparatus. However, the wafer processing system does not have to be directly connected to the exposure apparatus. In that case, for example, the wafer W is transferred from the cassette station 2 to the processing station 3, where it is subjected to the necessary processing, and then transferred back to the cassette station 2 for removal from the system. Furthermore, unnecessary processing equipment listed above may not be provided in the wafer processing system, or processing may not be performed in that equipment.

[0034] (Specific example of liquid treatment device) Next, a specific example of the liquid processing apparatus U1 will be described with reference to Fig. 3. The liquid processing apparatus U1 supplies a processing liquid for forming a resist film (hereinafter referred to as "processing liquid L1") to the wafer W to form a coating of the processing liquid L1. The processing liquid L1 is a chemical liquid for forming a resist coating on the surface Wa of the wafer W. The coating of the processing liquid L1 formed by the liquid processing apparatus U1 is heat-treated to form a resist film in a film-formed state. The liquid processing apparatus U1 has a housing 49, a spinning holder 50, a liquid supply unit 60, and a cleaning bath 80.

[0035] Housing 49 houses at least some of the various components included in liquid processing apparatus U1. Housing 49 is configured to allow wafers W to be loaded and unloaded therein. For example, a side wall of housing 49 is formed with a loading / unloading port for loading and unloading wafers W. Wafer W is loaded into housing 49 through the loading / unloading port by wafer transfer device 33, and is also unloaded out of housing 49 through the loading / unloading port.

[0036] The rotary holder 50 is configured to hold and rotate the wafer W. The rotary holder 50 includes a rotary drive unit 52, a shaft 53, and a holder 54.

[0037] The rotation drive unit 52 operates based on an operation signal from the control device 100 to rotate the shaft 53. The rotation drive unit 52 includes a power source such as an electric motor. The holder 54 is provided at the tip of the shaft 53. The wafer W is placed on the upper surface of the holder 54. The holder 54 holds the wafer W when performing liquid processing on the wafer W using the processing liquid L1. The holder 54 is configured to hold the wafer W approximately horizontally, for example, by suction. The holder 54 rotates the wafer W around a central axis (rotation axis) Ax1 that is perpendicular to the surface Wa of the wafer W while the wafer W is in an approximately horizontal position.

[0038] The liquid supply unit 60 supplies the processing liquid L1 to the front surface Wa of the wafer W held by the spin holder 50. The liquid supply unit 60 includes a liquid source 61, a pipe 62, a holding base 63, a nozzle 64, and a nozzle driver 65. The liquid source 61 is a supply source of the processing liquid L1. The pipe 62 connects the liquid source 61 and the nozzle 64 and guides the processing liquid L1 from the liquid source 61 to the nozzle 64. A valve is provided in the pipe 62, and the valve opens and closes based on an operation signal from the control device 100.

[0039] The holding base 63 is configured to hold a nozzle 64. The nozzle 64 is capable of discharging a processing liquid L1. When the nozzle 64 is positioned above the wafer W held by the rotating holder 50, the nozzle 64 discharges the processing liquid L1 from the liquid source 61 toward the surface Wa of the wafer W. The nozzle driving unit 65 is connected to the holding base 63. The nozzle driving unit 65 is configured to move the holding base 63 horizontally or vertically based on an operation signal from the control device 100. The nozzle 64 moves in conjunction with the movement of the holding base 63.

[0040] Liquid supply unit 60 may include one or more other nozzles other than nozzle 64. The one or more other nozzles may be held on holding base 63 together with nozzle 64. When one or more other nozzles are provided in addition to nozzle 64, liquid supply unit 60 may be configured to supply a plurality of different types of processing liquids, including processing liquid L1, to wafer W.

[0041] The cup 70 is disposed to surround the holder 54 and is a member that receives the processing liquid L1. The cup 70 forms a processing space S1 that is open at its upper end. When the wafer W is placed in the processing space S1, the processing liquid L1 is supplied to the wafer W. The cup 70 receives the processing liquid L1 after it has been supplied to the wafer W by the liquid supply unit 60. The cup 70 is configured to collect the processing liquid L1 that splashes around from the outer periphery of the wafer W that is being rotated by the rotary holder 50. A drain port 71 and an exhaust port 72 are provided at the bottom of the cup 70.

[0042] The drain port 71 is an opening for discharging the processing liquid L1 collected by the cup 70 to the outside of the cup 70 (outside of the processing space S1). A drainage device that guides the processing liquid L1 to the outside of the wafer processing system 1 is connected to the drain port 71. Details of the drainage device will be described later. The exhaust port 72 is an opening for discharging gas within the cup 70 to the outside of the cup 70 (outside of the processing space S1). For example, gas generated in association with the supply of the processing liquid L1 to the wafer W is discharged from the exhaust port 72. A pipe 79 may be connected to the exhaust port 72 for guiding the gas after being discharged from the cup 70 via the exhaust port 72 to the outside of the wafer processing system 1.

[0043] The cleaning bath 80 is a component that cleans the nozzle 64 with cleaning liquid. In the cleaning bath 80, the processing liquid L1 may be ejected from the nozzle 64. The cleaning bath 80 is disposed at a position different from the cup 70 inside the housing 49. In a plan view (viewed vertically from above), the cleaning bath 80 is disposed so as not to overlap with the cup 70. The cleaning bath 80 includes a container that can hold cleaning liquid for cleaning the nozzle 64. The container of the cleaning bath 80 forms a space S2 with an open top, and the cleaning liquid is stored in the space S2. The nozzle 64 is cleaned by immersing at least a portion of the nozzle 64 in the cleaning liquid stored in the cleaning bath 80.

[0044] A drain port is formed at the bottom of the container of the cleaning bath 80 for discharging the processing liquid L1 and the cleaning liquid discharged from the nozzles 64. A pipe is connected to the drain port for guiding the processing liquid L1 discharged from the nozzles 64 and the cleaning liquid after being used to clean the nozzles 64 from the space S2 of the cleaning bath 80 to the outside of the wafer processing system 1.

[0045] 3 shows one rotating holder 50 and one cup 70 corresponding to that rotating holder 50, liquid processing apparatus U1 may have two rotating holders 50 and two cups 70. One set of rotating holder 50 and cup 70 and another set of rotating holder 50 and cup 70 are arranged in different positions. Nozzle 64 may be movable between a position where it can eject processing liquid L1 onto wafer W held by holder 54 of one rotating holder 50 and a position where it can eject processing liquid L1 onto wafer W held by holder 54 of another rotating holder 50.

[0046] (Drainage device) As shown in FIG. 4, the wafer processing system 1 includes a liquid drainage device 110. The liquid drainage device 110 is a device that drains at least the processing liquid L1 to the outside of the wafer processing system 1. The liquid drainage device 110 drains the processing liquid L1 collected in at least one cup 70 to the outside of the wafer processing system 1. The liquid drainage device 110 may drain the processing liquid L1 collected in each of two or more cups 70 to the outside of the wafer processing system 1. The two or more cups 70 may include two or more cups 70 included in one liquid processing device U1, or may include one or more cups 70 included in one liquid processing device U1 and one or more other cups 70 included in another liquid processing device U1.

[0047] In the example shown in FIG. 4, the drainage device 110 drains the processing liquid L1 from two cups 70 of each of two liquid processing devices U1 arranged on two vertically adjacent layers 31 (four cups 70 in total). Note that the cleaning bath 80 is omitted from FIG. 4. Focusing on the liquid processing device U1 located on the upper layer, another liquid processing device U1 exists as a separate processing device on the layer 31 located on the lower layer. Therefore, it is difficult to arrange a portion of the piping for directing the processing liquid L1 from the cups 70 of the liquid processing device U1 located on the upper layer to the outside of the wafer processing system 1 inside the layer 31 located on the lower layer. Therefore, in the example shown in FIG. 4, at least a portion of the piping included in the drainage device 110 is arranged approximately horizontally.

[0048] Specific examples of the liquid drainage device 110 will be described below with reference to FIGS. 5 to 8. For ease of explanation, a case will be described in which processing liquid L1 from two cups 70 provided in one liquid processing device U1 is drained out of the wafer processing system 1. In the following explanation, one of the two cups 70 will be referred to as "cup 70A," and the other cup 70 will be referred to as "cup 70B." The liquid drainage device 110 illustrated in FIG. 5 drains out of the wafer processing system 1 not only the processing liquid L1 from each of the cups 70A and 70B, but also the cleaning liquid used for cleaning in the cleaning bath 80 provided in the liquid processing device U1.

[0049] The drainage device 110 includes a drainage pipe 112, a connection pipe 120A, a connection pipe 120B, and a connection pipe 122. In this disclosure, the terms "upstream" and "downstream" are used based on the direction in which a liquid containing the processing liquid L1 flows. In the drainage device 110, the liquid containing the processing liquid L1 moves from upstream to downstream. The connection pipe 120A and the connection pipe 120B may be collectively referred to as the "connection pipe 120."

[0050] The drainage pipe 112 is a pipe that guides the processing liquid L1 after being used in the liquid processing in the liquid processing device U1 to the outside of the wafer processing system 1. The processing liquid L1 after the liquid processing is introduced into the drainage pipe 112 from each of the cups 70A and 70B, and the processing liquid L1 and the cleaning liquid are introduced into the drainage pipe 112 from the cleaning bath 80.

[0051] At least a portion of the drainage pipe 112 is disposed approximately horizontally. In the present disclosure, "a pipe is disposed approximately horizontally" refers to a state in which the angle (elevation angle) of the central axis of the pipe with respect to the horizontal plane is -5° to +5°. The angle of the approximately horizontally disposed portion of the drainage pipe 112 with respect to the horizontal plane may be -3° to +3°, -2° to +2°, or -1° to +1°. The approximately horizontal portion of the drainage pipe 112 may be disposed so that the upstream side is higher than the downstream side.

[0052] The connection pipe 120A is a pipe that guides the processing liquid L1 from the cup 70A to the drainage pipe 112. The upstream end of the connection pipe 120A is connected to the drainage port 71 provided in the cup 70A. The processing liquid L1 is discharged from the downstream end of the connection pipe 120A. The connection pipe 120A is provided so that the processing liquid L1 discharged from the downstream end of the connection pipe 120A is introduced into the drainage pipe 112.

[0053] The connection pipe 120B is a pipe that guides the processing liquid L1 from the cup 70B to the drainage pipe 112. The upstream end of the connection pipe 120B is connected to the drainage port 71 provided in the cup 70B. The processing liquid L1 is discharged from the downstream end of the connection pipe 120B. The connection pipe 120B is provided so that the processing liquid L1 discharged from the downstream end of the connection pipe 120B is introduced into the drainage pipe 112.

[0054] The connection pipe 122 is a pipe that guides a liquid containing the processing liquid L1 from the cleaning bath 80 to the drainage pipe 112. The upstream end of the connection pipe 122 is connected to a drainage port provided in the cleaning bath 80. The liquid containing the processing liquid L1 is discharged from the downstream end of the connection pipe 122. The connection pipe 122 is provided so that the liquid containing the processing liquid L1 discharged from the downstream end of the connection pipe 122 is introduced into the drainage pipe 112.

[0055] 5, an introduction point for the treatment liquid L1 from the connection pipe 120A, an introduction point for the liquid containing the treatment liquid L1 from the connection pipe 122, and an introduction point for the treatment liquid L1 from the connection pipe 120B are arranged in this order from the upstream side in the flow path of the drainage pipe 112. These introduction points may be arranged in an order different from that shown in FIG.

[0056] The drainage device 110 includes one or more airtight portions 200. In the example shown in Fig. 5, the drainage device 110 includes four airtight portions 200. The airtight portions 200 are provided at the connection points between the drainage pipe 112 and other pipes, and are configured to allow liquid to move between the outside and inside of the drainage pipe 112 at the connection points and to prevent gas from flowing from the outside to the inside of the drainage pipe 112.

[0057] One airtight part 200 is disposed corresponding to the cup 70A. For ease of explanation, the airtight part 200 corresponding to the cup 70A will be referred to as the "airtight part 200A." The airtight part 200A maintains a state in which gas does not flow between the drainage pipe 112 and the connection pipe 120A. The airtight part 200A is configured to prevent gas from flowing from the drainage pipe 112 to the connection pipe 120A and to prevent gas from flowing from the connection pipe 120A to the drainage pipe 112. The airtight part 200A also allows the processing liquid L1 to flow from the connection pipe 120A to the drainage pipe 112.

[0058] One airtight part 200 is disposed corresponding to the cup 70B. For ease of explanation, the airtight part 200 corresponding to the cup 70B will be referred to as the "airtight part 200B." The airtight part 200B maintains a state in which gas does not flow between the drainage pipe 112 and the connection pipe 120B. The airtight part 200B is configured to prevent gas from flowing from the drainage pipe 112 to the connection pipe 120B and to prevent gas from flowing from the connection pipe 120B to the drainage pipe 112. The airtight part 200B also allows the processing liquid L1 to flow from the connection pipe 120B to the drainage pipe 112.

[0059] As described above, the drainage device 110 is provided with the connection pipes 120 and the airtight portions 200 corresponding to the plurality of cups 70, respectively. The processing liquid L1 discharged from each of the plurality of cups 70 is introduced into the drainage pipe 112 via the corresponding connection pipes 120 and airtight portions 200.

[0060] One airtight section 200 is arranged corresponding to the cleaning bath 80. For ease of explanation, the airtight section 200 corresponding to the cleaning bath 80 will be referred to as the "airtight section 200C." The airtight section 200C (second airtight section) maintains a state in which gas does not flow between the drainage pipe 112 and the connection pipe 122 (second connection pipe). The airtight section 200C is configured to prevent gas from flowing from the drainage pipe 112 to the connection pipe 122 and to prevent gas from flowing from the connection pipe 122 to the drainage pipe 112. In addition, the airtight section 200C allows liquid including the treatment liquid L1 to flow from the connection pipe 122 to the drainage pipe 112.

[0061] The liquid drainage device 110 is connected to the liquid drainage facility 300. For example, the downstream end of the liquid drainage pipe 112 of the liquid drainage device 110 is connected to the pipe of the liquid drainage facility 300. The liquid drainage facility 300 is a facility that collects liquid drained from a plurality of devices including the wafer processing system 1. The plurality of devices including the wafer processing system 1 may include other wafer processing systems 1, and the liquid drained into the liquid drainage facility 300 may include chemical liquids other than the processing liquid L1. A liquid including the processing liquid L1 is introduced into the liquid drainage facility 300 from the downstream end of the liquid drainage pipe 112.

[0062] One airtight part 200 is disposed at the connection point between the drainage equipment 300 and the drainage pipe 112. For ease of explanation, the airtight part 200 disposed at the connection point will be referred to as the "airtight part 200D." The airtight part 200D (second airtight part) maintains a state in which gas does not flow between the drainage pipe 112 and the drainage equipment 300. The airtight part 200D is configured to not allow gas to flow from the drainage pipe 112 to the drainage equipment 300, and not allow gas to flow from the drainage equipment 300 to the drainage pipe 112. In addition, the airtight part 200D allows liquid including the treatment liquid L1 to flow from the drainage pipe 112 to the drainage equipment 300.

[0063] 6 shows a specific example of the airtight part 200 arranged corresponding to the cup 70A or 70B. The drainage device 110 may include a joint part 114 and a cover member 116. The joint part 114 is provided in the flow path of the drainage pipe 112 at a location where the processing liquid L1 is introduced from the connection pipe 120. A part of the drainage pipe 112 and another part of the drainage pipe 112 are connected via the joint part 114. The joint part 114 is formed in a cylindrical shape with a bottom so that the processing liquid L1 can be received from the connection pipe 120. The joint part 114 forms a space that is open upward. The joint part 114 includes a bottom wall and a side wall extending upward from the outer edge of the bottom wall.

[0064] An end of the drainage pipe 112 located upstream of the joint portion 114 penetrates the side wall and is connected to the space within the joint portion 114. An end of the drainage pipe 112 located downstream of the joint portion 114 penetrates the side wall and is connected to the space within the joint portion 114. The liquid flowing from upstream of the joint portion 114 moves through a part of the drainage pipe 112, the joint portion 114, and another part of the drainage pipe 112. The treatment liquid L1 introduced from the connection pipe 120 into the joint portion 114 moves to a part of the drainage pipe 112 connected downstream of the joint portion 114 after being introduced into the joint portion 114.

[0065] The lid member 116 is provided at the upper end of the joint part 114 so as to prevent outside air from flowing into the space within the joint part 114. The connection pipe 120 passes through the lid member 116 so that the downstream end of the connection pipe 120 is positioned in the space within the joint part 114.

[0066] The airtight section 200 stores a liquid containing the solvent L2, thereby maintaining a state in which gas does not circulate between the drainage pipe 112 and the connection pipe 120. The solvent L2 is a solvent that can remove the processing liquid L1. The solvent L2 is, for example, an organic solvent such as thinner. When the processing liquid L1 solidifies and adheres inside the pipe, the solidified processing liquid L1 can be removed (dissolved) by circulating the solvent L2 inside the pipe.

[0067] The airtight part 200 may include a container 202. The container 202 is disposed in a space formed between the joint part 114 and the lid member 116. The container 202 stores a liquid including the solvent L2. The container 202 is cylindrical with a bottom that forms a space that is open upward. The container 202 is formed so that when the amount of liquid stored in the container 202 exceeds a predetermined level, a portion of the liquid is discharged to the outside of the container 202. For example, a discharge port or a notch for discharge is formed in the side wall of the container 202. The container 202 may be fixed to the lid member 116.

[0068] The downstream end of the connection pipe 120 is arranged so as to be immersed in the liquid containing the solvent L2 stored in the container 202. The portion including the downstream end of the connection pipe 120 may extend in the vertical direction. The liquid containing the solvent L2 is stored in the container 202 so that the opening provided at the downstream end of the connection pipe 120 is lower than the upper surface of the liquid. The liquid containing the solvent L2 enters the downstream end of the connection pipe 120.

[0069] As described above, a liquid containing solvent L2 is stored in container 202, and the downstream end of connection pipe 120 is immersed in the liquid, whereby the space inside connection pipe 120 and the space inside drainage pipe 112 (space inside joint 114) are blocked by the liquid inside container 202. The liquid inside container 202 prevents the gas inside connection pipe 120 from circulating into the space inside drainage pipe 112. It can also be said that the liquid inside container 202 seals or seals the connection point between connection pipe 120 and drainage pipe 112 (joint 114).

[0070] The airtight part 200 is arranged so that the liquid containing the solvent L2 discharged from the container 202 is introduced into the drainage pipe 112. The processing liquid L1 discharged from the cup 70 flows into the container 202 through the connection pipe 120. When the processing liquid L1 flows into the container 202, the liquid level in the container 202 rises, and a portion of the liquid in the container 202 is discharged into the joint part 114 and introduced into the drainage pipe 112. As a result, at least a portion of the solvent L2 stored in the container 202 is introduced into the drainage pipe 112. The processing liquid L1 introduced into the container 202 from the connection pipe 120 is mixed with the solvent L2.

[0071] 7 and 8 show specific examples of the airtight part 200 arranged corresponding to the cup 70A or 70B. In the example shown in FIGS. 7 and 8, a container 202 is arranged inside the drainage pipe 112, not in the joint part 114. The container 202 is fixed to the inner wall of the drainage pipe 112 via a fixing member, for example. FIG. 7 schematically illustrates a state when the processing liquid L1 is not being discharged from the cup 70. The liquid stored in the container 202 blocks the space inside the connection pipe 120 from the space inside the drainage pipe 112.

[0072] 8 schematically illustrates a state in which the processing liquid L1 is being discharged from the cup 70. In the example illustrated in FIG. 8, when the processing liquid L1 is discharged into the container 202 through the connection pipe 120, the liquid in the container 202 overflows, and the overflowing liquid is introduced into a pool of liquid accumulated on the inner wall of the drainage pipe 112.

[0073] 5, the airtight part 200 (airtight part 200C) located between the connection pipe 122 connected to the cleaning bath 80 and the drainage pipe 112 may also have the structure exemplified in Fig. 6 or 7. In the airtight part 200C, the downstream end of the connection pipe 122 is immersed in the liquid in the container 202.

[0074] The airtight part 200 (airtight part 200D) located between the downstream end of the drainage pipe 112 and the drainage equipment 300 may also have the structure exemplified in Fig. 6 or 7. In the airtight part 200D, the downstream end of the drainage pipe 112 is immersed in the liquid in the container 202. Furthermore, the liquid drained from the container 202 is introduced into the pipe of the drainage equipment 300, rather than into the drainage pipe 112.

[0075] In the drainage device 110 configured as described above, the sealing by the airtight section 200 prevents gas (air) from flowing into the drainage pipe 112 from outside the drainage pipe 112. As a result, the inside of the drainage pipe 112 is maintained in an atmosphere of the solvent L2 (e.g., a thinner atmosphere). In this case, the volatilized components of the solvent L2 remain inside the drainage pipe 112 without flowing out to the outside. As a result, the processing liquid L1 introduced into the drainage pipe 112 is less likely to dry and solidify inside the drainage pipe 112, and is discharged to the drainage equipment 300 together with the solvent L2.

[0076] The drainage device 110 may include one or more solvent replenishment units 130. When two or more airtight units 200 are provided, one solvent replenishment unit 130 is provided corresponding to each of the two or more airtight units 200. The solvent replenishment unit 130 can replenish the airtight unit 200 with the solvent L2. The solvent replenishment unit 130 is configured to be able to supply the solvent L2 into the container 202 of the airtight unit 200 (see also FIGS. 6 to 8). The solvent replenishment unit 130 may supply the solvent L2 into the container 202 through a portion of a pipe whose downstream end is immersed in the liquid in the container 202. The one or more solvent replenishment units 130 may replenish the solvent L2 so that the solvent L2 remains in the drainage pipe 112 even when an idle state in which no liquid is drained from the cup 70 and the cleaning bath 80 continues.

[0077] Focus is now made on the airtight section 200 between the connection pipe 120 and the drainage pipe 112. The surface of the liquid in the downstream end of the connection pipe 120 is exposed to the atmosphere (open air) outside the drainage pipe 112 via the interior of the connection pipe 120. Therefore, if an idle state continues in which the processing liquid L1 is not discharged from the cup 70 through the connection pipe 120, the level of the liquid in the downstream end of the connection pipe 120 gradually drops. As a result, the level of the liquid in the container 202 also drops. If the level of the liquid in the container 202 drops below the position of the opening at the downstream end of the connection pipe 120, the sealed state (hermetic state) created by the liquid in the container 202 will be released. To avoid this, the solvent refilling unit 130 supplies the solvent L2 to the container 202 based on an operation signal from the control device 100 so that the solvent L2 is refilled into the container 202.

[0078] The drainage device 110 may include an open line 140. The open line 140 is a line that can open the inside of the drainage pipe 112 to the atmosphere (open air). The open line 140 is provided with an on-off valve 140a. The on-off valve 140a opens and closes based on an operation signal from the control device 100, switching between a state in which the open line 140 opens the inside of the drainage pipe 112 and a state in which the open line 140 does not open the inside of the drainage pipe 112. For example, the open line 140 opens the inside of the drainage pipe 112 to the atmosphere during a period that overlaps with at least a portion of a period in which the solvent refilling unit 130 is refilling the container 202 of the airtight unit 200 with the solvent L2.

[0079] By opening the inside of the drainage pipe 112 through the release line 140, the state in which the inside of the drainage pipe 112 is maintained in the solvent L2 atmosphere is temporarily released. In this way, maintaining the inside of the drainage pipe 112 in the solvent atmosphere does not necessarily mean that the solvent atmosphere is always maintained while the wafer processing system 1 is operating.

[0080] The drainage device 110 may include a solvent supply unit 150. The solvent supply unit 150 is a unit capable of supplying the solvent L2 to the upstream end of the drainage pipe 112. The solvent L2 supplied by the solvent supply unit 150 flows through the inside of the drainage pipe 112 to the drainage equipment 300. This cleans the inside of the drainage pipe 112. The solvent supply unit 150 may supply the solvent L2 at a large flow rate from the upstream end to the inside of the drainage pipe 112 so that the entire inside of the drainage pipe 112 is cleaned. Each connecting pipe of the drainage device 110 may be provided with a member for preventing the solvent L2 from flowing back into the cup 70 and the cleaning bath 80 while the inside of the drainage pipe 112 is being cleaned with the solvent L2 from the solvent supply unit 150.

[0081] The number of cups 70 from which the liquid is drained by the liquid drainage device 110 and the number of cleaning baths 80 are not limited to the example shown in Fig. 5. The processing liquid L1 may be drained from one cup 70 to the drainage pipe 112 of the liquid drainage device 110, or the processing liquid L1 may be drained from three or more cups 70. The liquid from the cleaning bath 80 does not have to be drained to the drainage pipe 112, and the liquid from two or more cleaning baths 80 may be drained to the drainage pipe 112. The processing liquid L1 may be drained to the drainage pipe 112 from cups 70 provided in two or more liquid processing devices U1, respectively.

[0082] (Control device hardware configuration) Fig. 9 is a block diagram illustrating a hardware configuration of the control device 100. As shown in Fig. 9, the control device 100 includes a circuit 101. The circuit 101 includes a processor 102, a memory 103, a storage 104, a timer 105, and an input / output port 106.

[0083] The storage 104 is composed of one or more non-volatile memory devices such as a flash memory or a hard disk. The storage 104 stores a program for causing the wafer processing system 1 (apparatus) to execute a substrate processing method, which will be described later. The memory 103 is composed of one or more volatile memory devices such as a random access memory. The memory 103 temporarily stores a program loaded from the storage 104.

[0084] Processor 102 is composed of one or more arithmetic devices such as a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). Processor 102 executes a program loaded into memory 103. The results of calculations by processor 102 are temporarily stored in memory 103. Timer 105 measures elapsed time by counting clock pulses. Input / output port 106 inputs and outputs electrical signals between liquid processing device U1, liquid drainage device 110, etc. in response to a request from processor 102.

[0085] <Substrate processing method> Next, an example of a substrate processing method for performing a predetermined process on a wafer W using the wafer processing system 1 will be described. This substrate processing method includes a liquid processing step, a discharge step, and a maintenance step. The liquid processing step includes performing a liquid process using a processing liquid L1 on the wafer W while the wafer W is held in a holder 54 surrounded by a cup 70. The discharge step includes discharging the processing liquid L1 after being used in the liquid processing step to the outside of the wafer processing system 1 via the drainage pipe 112 and the connection pipe 120. The maintenance step includes maintaining a state in which no gas flows between the drainage pipe 112 and the connection pipe 120, while maintaining the interior of the drainage pipe 112 in an atmosphere of a solvent L2 capable of removing the processing liquid L1.

[0086] The control device 100 may control the drainage device 110 so that the maintenance step is also performed during a period in which the discharge step is performed. The control device 100 may control the drainage device 110 so that the maintenance step is performed during a period that overlaps with at least a portion of a period in which the discharge step is not performed.

[0087] The substrate processing method may include a replenishing step. The replenishing step includes replenishing the solvent L2 from the solvent replenishing unit 130 to the airtight unit 200. Fig. 10(a) illustrates a series of processes executed by the control device 100 in the replenishing step.

[0088] The control device 100 executes step S11 when an idle state in which no liquid is being drained from any of the cups 70 or other components is initiated for the drainage pipe 112 of the drainage device 110. In step S11, for example, the control device 100 waits until a predetermined time has elapsed since the idle state was initiated. The predetermined time is set in advance to a time shorter than the time it takes for the seal of the airtight portion 200 by the liquid containing the solvent L2 to be broken.

[0089] Next, the control device 100 executes step S12. In step S12, for example, the control device 100 switches the on-off valve 140a of the release line 140 from a closed state to an open state so as to release the atmosphere in the drainage pipe 112 to the atmosphere. Next, the control device 100 executes step S13. In step S13, for example, the control device 100 controls the solvent refilling unit 130 so as to refill the container 202 of the airtight unit 200 with the solvent L2.

[0090] Next, the control device 100 executes step S14. In step S14, for example, the control device 100 switches the on-off valve 140a from an open state to a closed state so as to stop the state in which the inside of the drainage pipe 112 is open to the atmosphere. By executing step S14, the inside of the drainage pipe 112 returns to a state in which the atmosphere of the solvent L2 is maintained.

[0091] When the drainage device 110 is provided with two or more airtight sections 200, the control device 100 may execute the series of processes of steps S11 to S14 for each airtight section 200. In this case, a predetermined time for step S11 may be set for each airtight section 200. The control device 100 may execute the series of processes of steps S11 to S14 for two or more airtight sections 200. In this case, in step S13, solvent L2 is supplied from two or more solvent replenishment sections 130 to two or more airtight sections 200.

[0092] The substrate processing method may include a cleaning step. The cleaning step includes supplying the solvent L2 from the upstream end of the drainage pipe 112 by the solvent supply unit 150 so as to clean the inside of the drainage pipe 112. Fig. 10(b) illustrates a series of processes executed by the control device 100 in the cleaning step.

[0093] The control device 100 executes step S21 when an idle state in which no liquid is being discharged from any of the components such as the cups 70 is entered into the drainage pipe 112. In step S21, for example, the control device 100 waits until a user input from an operator instructing cleaning of the inside of the drainage pipe 112 is input to the control device 100. For example, a worker such as an operator of the wafer processing system 1 observes the state of the drainage pipe 112 and instructs cleaning of the inside of the drainage pipe 112.

[0094] Next, the control device 100 executes step S22. In step S22, for example, the control device 100 controls the drainage device 110 to close each of the connection pipes 120 and 122 in order to prevent backflow of the solvent L2 from the drainage pipe 112 to components such as the cup 70. Next, the control device 100 executes step S23. In step S23, for example, the control device 100 controls the solvent supply unit 150 to supply the solvent L2 into the drainage pipe 112 to perform cleaning.

[0095] <Modification> Although the description has been given of the case where the drainage device 110 discharges the processing liquid L1, which is a chemical liquid for forming a resist film, the drainage device 110 may discharge processing liquids other than the chemical liquid for forming a resist film, outside the wafer processing system 1. The solvent used for sealing the airtight section 200 may be selected depending on the type of chemical liquid discharged by the drainage device 110. In one example of the various examples described above, at least some of the matters described in the other examples may be combined.

[0096] Summary of this disclosure The present disclosure includes the following configurations and methods (1) to (13).

[0097] [1] A substrate processing apparatus (1) for performing a predetermined process on a substrate (W), comprising: a holder (54) for holding the substrate (W) when performing a liquid process on the substrate (W) using a processing liquid (L1); a cup (70) arranged to surround the holder (54) and for receiving the processing liquid (L1); a drainage pipe (112) for guiding the processing liquid (L1) after use in the liquid process to the outside of the substrate processing apparatus (1); and the cups (70, 70A, 70B). a connecting pipe (120, 120A, 120B) for guiding a processing liquid (L1) from the drain pipe (112) to a drain pipe (112), and an airtight section (200, 200A, 200B) for preventing gas from passing between the drain pipe (112) and the connecting pipe (120, 120A, 120B), wherein the inside of the drain pipe (112) is maintained in an atmosphere of a solvent (L2) capable of removing the processing liquid (L1). Another possible method for draining the treatment liquid is to guide the treatment liquid discharged from the cup to a drainage facility through the drainage pipe without sealing the internal space of the drainage pipe. In this method, outside air flows into the drainage pipe, causing the treatment liquid to dry and solidify inside the pipe, and the solidified treatment liquid adheres to the inner wall of the pipe. Since solidification on the inner wall of the pipe can cause clogging, it is necessary to supply a large amount of solvent such as thinner into the inside of the drainage pipe for cleaning. In contrast, in the substrate processing apparatus (1), the interior of the drainage pipe (112) is maintained in a solvent (L2) atmosphere. This makes it difficult for the processing liquid (L1) discharged into the drainage pipe (112) to dry and solidify, reducing the amount of solidified processing liquid (L1) adhering to the inner wall of the pipe. As a result, the amount of solvent used to clean the interior of the drainage pipe can be reduced. Therefore, the substrate processing apparatus (1) is useful for reducing the amount of solvent (L2) used to clean the interior of the drainage pipe.

[0098] [2] The substrate processing apparatus (1) according to the above [1], wherein the processing liquid (L1) is a chemical liquid for forming a resist coating on the surface (Wa) of the substrate (W). The inventors' experiments revealed that even if a relatively large amount of thinner was supplied as a solvent, resist solution residue was observed several hours after the resist solution was discharged into the drainage pipe exposed to the atmosphere. This confirmed that a large amount of solvent is required to remove the solidified resist solution remaining in the drainage pipe. On the other hand, in the substrate processing apparatus (1), the resist solution is less likely to solidify inside the drainage pipe (112). Therefore, the amount of solvent (L2), such as thinner, used to wash away the residue from the resist solution can be reduced.

[0099] [3] The substrate processing apparatus (1) according to the above [1], wherein the airtight section (200, 200A, 200B) stores a liquid containing a solvent (L2) to maintain a state in which gas does not circulate between the drainage pipe (112) and the connection pipe (120, 120A, 120B). In this case, the drainage pipe (112) can be sealed without impeding the inflow of the treatment liquid (L1) from the connection pipe (120) to the drainage pipe (112).

[0100] [4] The substrate processing apparatus (1) according to [3] above, wherein the airtight section (200, 200A, 200B) includes a container (202) for storing the liquid, and a downstream end of the connecting pipe (120) is positioned so as to be immersed in the liquid in the container (202). In this case, the interior of the connection pipe (120) is separated from the interior of the drainage pipe (112) by the liquid stored in the container (202), thereby preventing outside air from entering the drainage pipe (112).

[0101] [5] The substrate processing apparatus (1) according to [4] above, wherein the airtight section (200, 200A, 200B) is arranged so that the liquid discharged from the container (202) is introduced into the drainage pipe (112). In this case, the treatment liquid (L1) discharged from the cup (70) can be smoothly guided to the drainage pipe (112) while the drainage pipe (112) is kept sealed.

[0102] [6] The substrate processing apparatus (1) according to any one of the above [3] to [5], further comprising a solvent replenishing section (130) capable of replenishing the airtight section (200, 200A, 200B) with the solvent (L2). A part of the liquid containing the solvent (L2) stored in the airtight section (200) is exposed to the outside air through the connection pipe (120). Therefore, if the treatment liquid (L1) is not discharged for a long period of time, the liquid sealing of the airtight section (200) may be broken. In response to this, by replenishing the solvent (L2) using the solvent replenishing section (130), it is possible to prevent the sealing structure from failing to function due to a part of the liquid being exposed to the outside air.

[0103] [7] The substrate processing apparatus (1) according to any one of the above [1] to [6], wherein at least a part of the drainage pipe (112) is arranged substantially horizontally. From the viewpoint of discharging the processing liquid (L2) downstream, it is preferable to incline the drainage pipe (112). On the other hand, from the viewpoint of making the substrate processing apparatus (1) more compact, at least a portion of the drainage pipe (112) may be arranged substantially horizontally. In the substantially horizontally arranged portion, the processing liquid (L1) remains, and solidification due to drying becomes a greater problem. In other words, it becomes necessary to clean the inside of the drainage pipe (112) with a solvent at shorter intervals. Therefore, it is even more advantageous to maintain a solvent atmosphere inside the drainage pipe (112), as in the present substrate processing apparatus (1).

[0104] [8] The substrate processing apparatus (1) according to any one of the above [1] to [7], further comprising a solvent supply unit (150) capable of supplying a solvent (L2) to an upstream end of the drainage pipe (112). In this case, even if the treatment liquid (L1) solidifies and adheres to the inner wall of the drainage pipe (112), the adhered solid can be removed.

[0105] [9] The substrate processing apparatus (1) according to any one of the above items [1] to [8], further comprising: a cleaning bath (80) for cleaning nozzles (64) capable of discharging a processing liquid (L1); a second connection pipe (122) for guiding a liquid containing the processing liquid (L1) from the cleaning bath (80) to a drainage pipe (112); and a second airtight section (200, 200C) for maintaining a state in which gas does not circulate between the drainage pipe (112) and the second connection pipe (122). In this case, the drainage pipe (112) can be sealed while also draining the liquid from the cleaning bath (80).

[0106]

[10] The substrate processing apparatus (1) according to any one of the above items [1] to [8], wherein a downstream end of the drainage pipe (112) is connected to a drainage facility (300) that collects drainage from a plurality of devices including the substrate processing apparatus (1), and the substrate processing apparatus (1) further comprises a second airtight section (200, 200D) that maintains a state in which gas does not circulate between the drainage pipe (112) and the drainage facility (300). In this case, even if air attempts to flow into the drainage pipe (112) due to the drainage facility (300), this is blocked by the second airtight portion (200, 200D), thereby making it possible to more reliably seal the drainage pipe (112).

[0107]

[11] The substrate processing apparatus (1) according to any one of the above [1] to

[10] , comprising a plurality of cups (70) including a cup (70), and a connection pipe (120) and an airtight section (200) are provided corresponding to each of the plurality of cups (70). In this case, the treatment liquid (L1) can be discharged from a plurality of cups (70), which not only reduces the amount of solvent used but also allows the treatment liquid (L1) to be discharged efficiently.

[0108]

[12] A substrate processing method for performing a predetermined process on a substrate (W) using a substrate processing apparatus (1), the method comprising: performing liquid processing on the substrate (W) using a processing liquid (L1) while the substrate (W) is held in a holding section (54) surrounded by a cup (70); discharging the processing liquid (L1) used in the liquid processing to the outside of the substrate processing apparatus (1) through a connection pipe (120) connected to the cup (70) and a drainage pipe (112); and maintaining an atmosphere of a solvent (L2) capable of removing the processing liquid (L1) inside the drainage pipe (112) while maintaining a state in which gas does not circulate between the drainage pipe (112) and the connection pipe (120). This substrate processing method, like the substrate processing apparatus (1), is useful for reducing the amount of solvent (L2) used to clean the inside of the drainage pipe.

[0109]

[13] A computer-readable storage medium storing a program for causing an apparatus to execute the substrate processing method described in

[12] above. [Explanation of symbols]

[0110] 1...wafer processing system, W...wafer, Wa...surface, U1...liquid processing device, L1...processing liquid, 54...holding unit, 64...nozzle, 70, 70A, 70B...cup, 80...cleaning bath, 110...liquid drainage device, 112...liquid drainage piping, 120, 120A, 120B, 122...connecting piping, 130...solvent replenishment unit, 150...solvent supply unit, 200, 200A, 200B, 200C, 200D...airtight unit, 202...container, L2...solvent, 300...liquid drainage equipment.

Claims

1. A substrate processing apparatus that performs a predetermined process on a substrate, a holder that holds the substrate when the substrate is subjected to a liquid treatment using a treatment liquid; a cup disposed to surround the holder and configured to receive the treatment liquid; a drainage pipe for guiding the processing liquid after being used in the liquid processing to the outside of the substrate processing apparatus; a connecting pipe for guiding the treatment liquid from the cup to the drainage pipe; an airtight portion that maintains a state in which gas does not flow between the drainage pipe and the connection pipe, The inside of the drainage pipe is maintained in an atmosphere of a solvent capable of removing the treatment liquid. Substrate processing equipment.

2. the processing liquid is a chemical liquid for forming a resist film on the surface of the substrate; The substrate processing apparatus according to claim 1 .

3. the airtight portion stores the liquid containing the solvent, thereby maintaining a state in which gas does not circulate between the drainage pipe and the connection pipe. The substrate processing apparatus according to claim 1 .

4. the airtight portion includes a container that stores the liquid, a downstream end of the connecting pipe is arranged to be immersed in the liquid in the container; The substrate processing apparatus according to claim 3 .

5. The airtight portion is arranged so that the liquid discharged from the container is introduced into the drainage pipe. The substrate processing apparatus according to claim 4 .

6. Further provided is a solvent replenishing unit capable of replenishing the solvent to the airtight unit. The substrate processing apparatus according to any one of claims 3 to 5.

7. At least a portion of the drainage pipe is disposed substantially horizontally. The substrate processing apparatus according to any one of claims 1 to 5.

8. The system further includes a solvent supply unit capable of supplying the solvent to an upstream end of the drainage pipe. The substrate processing apparatus according to any one of claims 1 to 5.

9. a cleaning bath for cleaning a nozzle capable of ejecting the treatment liquid; a second connection pipe for introducing a liquid containing the treatment liquid from the cleaning bath to the drainage pipe; a second airtight portion that maintains a state in which gas does not flow between the drainage pipe and the second connection pipe, The substrate processing apparatus according to any one of claims 1 to 5.

10. a downstream end of the drainage pipe is connected to a drainage facility that collects drainage liquids from a plurality of devices including the substrate processing device; the substrate processing apparatus further includes a second airtight part that maintains a state in which gas does not flow between the drainage pipe and the drainage equipment; The substrate processing apparatus according to any one of claims 1 to 5.

11. a plurality of cups including the cup; The connection pipe and the airtight portion are provided corresponding to each of the plurality of cups. The substrate processing apparatus according to any one of claims 1 to 5.

12. A substrate processing method for performing a predetermined process on a substrate using a substrate processing apparatus, comprising: performing a liquid treatment on the substrate using a treatment liquid while the substrate is held on a holder surrounded by a cup; discharging the processing liquid after the liquid processing to the outside of the substrate processing apparatus through a connection pipe connected to the cup and a liquid discharge pipe; maintaining an atmosphere of a solvent capable of removing the treatment liquid inside the drainage pipe while maintaining a state in which gas does not flow between the drainage pipe and the connection pipe; Substrate processing method.

13. A computer-readable storage medium storing a program for causing an apparatus to execute the substrate processing method according to claim 12.

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