Component crimping device and component crimping method

Abstract

To provide a component crimping device that can suppress a decrease in mounting accuracy.SOLUTION: A component crimping device 100 includes a mounting portion 12a on which a substrate 2 having a component 3 arranged with its main surface 3a facing the substrate 2 is mounted via an anisotropic conductive film 4, a crimping unit 21 including a crimping tool 33 having a pressing surface 33a and a heater 35 for heating the crimping tool 33, a moving mechanism 12b that moves the mounting portion 12a, and a control unit 310 that controls the moving mechanism 12b and the crimping unit 21, and the pressing surface 33a has a fourth region A4 and a fifth region A5 that press the component 3 in thermocompression bonding, and a recess 33b located between the fourth region A4 and the fifth region A5, and the control unit 310 causes the moving mechanism 12b to move the mounting portion 12a such that the third region A3 and the recess 33b overlap, and then causes the crimping unit 21 to perform thermocompression bonding of the component 3 to the substrate 2.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a component crimping device and a component crimping method for crimping a component onto a substrate. [Background technology]

[0002] Conventionally, there is a component bonding device that bonds components such as a drive circuit to a substrate. Patent Document 1 discloses a bonding method in which, when mounting an integrated circuit (IC) component on an electrode provided on a flat panel display, the IC component is bonded using an anisotropic conductive adhesive or film as an intermediary, and the temperature of the preheated IC component is sensed by a sensor to determine that it has reached a predetermined temperature, and then the IC component is mounted on the flat panel display. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 8-330393 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, the number of bumps (bump electrodes) on components such as ICs has been increasing. When a component has a large number of bumps, the bumps on the component can affect the mounting accuracy when the component is pressure-bonded to the substrate, causing the component to not be pressure-bonded in the correct position on the substrate.

[0005] The present invention provides a component crimping device and the like that can suppress a decrease in mounting accuracy. [Means for solving the problem]

[0006] A component compression bonding apparatus according to one aspect of the present invention is an apparatus for thermocompression bonding a component having a main surface including a first region in which a plurality of first bump electrodes are arranged, a second region in which a plurality of second bump electrodes are arranged, and a third region located between the first region and the second region in which no bump electrodes are arranged, to a substrate via an anisotropic conductive film, the component compression bonding apparatus comprising: a mounting section on which the substrate, on which the component is arranged so that the main surface faces the substrate via the anisotropic conductive film, is mounted; and a compression bonding tool having a pressing surface. a crimping unit having a heater for heating the crimping tool, a moving mechanism for moving the placement unit, and a control unit for controlling the moving mechanism and the crimping unit, wherein the pressing surface has fourth and fifth regions for pressing the component in the thermocompression bonding, and a recess located between the fourth and fifth regions, and the control unit causes the moving mechanism to move the placement unit so that the third region and the recess overlap, and then causes the crimping unit to perform the thermocompression bonding of the component to the substrate.

[0007] A component compression bonding method according to one aspect of the present invention is a component compression bonding method carried out by a component compression bonding apparatus that thermocompresses a component having a main surface including a first region in which a plurality of first bump electrodes are arranged, a second region in which a plurality of second bump electrodes are arranged, and a third region located between the first region and the second region in which no bump electrodes are arranged, to a substrate via an anisotropic conductive film, the component compression bonding apparatus comprising: a substrate on which the component is arranged so that the main surface faces the substrate via the anisotropic conductive film; a crimping unit including a mounting unit to be mounted on a substrate, a crimping tool having a pressing surface, and a heater to heat the crimping tool; and a moving mechanism to move the mounting unit, wherein the pressing surface has fourth and fifth regions that press the component in the thermocompression bonding, and a recessed portion located between the fourth and fifth regions, and the component crimping method includes causing the moving mechanism to move the mounting unit so that the third region and the recessed portion overlap, and then causing the crimping unit to perform the thermocompression bonding of the component to the substrate. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a component crimping device and the like that can suppress a decrease in mounting accuracy. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a block diagram showing the configuration of a component crimping device according to an embodiment. [Figure 2] FIG. 2 is a perspective view showing a specific configuration of the thermocompression bonding mechanism according to the embodiment. [Figure 3] FIG. 3 is a side view showing a specific configuration of the thermocompression bonding mechanism according to the embodiment. [Figure 4] FIG. 4 is a diagram showing components according to the embodiment. [Figure 5] FIG. 5 is a diagram showing a crimping tool according to an embodiment. [Figure 6] FIG. 6 is a diagram for explaining the positional relationship between a component and a pressure bonding tool in a thermocompression bonding process of a component compression bonding apparatus according to an embodiment. [Figure 7] FIG. 7 is a diagram for explaining the thermocompression bonding process of the component compression bonding device according to the embodiment. [Figure 8] FIG. 8 is a flowchart showing a component crimping method according to an embodiment. [Figure 9] FIG. 9 is a diagram for explaining the component crimping method according to the embodiment. [Figure 10] FIG. 10 is a side view showing a crimping tool according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that each of the embodiments described below represents a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangements and connection forms, steps, and step sequences shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not recited in the independent claims of the present invention will be described as optional components.

[0011] Furthermore, each figure is a schematic diagram and is not necessarily an exact illustration. Therefore, for example, the scales of the figures do not necessarily match. Furthermore, in each figure, substantially the same components are given the same reference numerals, and redundant explanations are omitted or simplified.

[0012] In this specification and drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional Cartesian coordinate system. The X-axis and Y-axis are perpendicular to each other and perpendicular to the Z-axis. In the following embodiments, the positive direction of the Z-axis may be referred to as the upward direction, and the negative direction of the Z-axis may be referred to as the downward direction.

[0013] Furthermore, in this specification, terms indicating the relationship between elements, such as parallel or perpendicular, terms indicating the shape of elements, such as rectangle or straight line, and numerical ranges are not expressions that express only strict meanings, but expressions that include a substantially equivalent range, for example, a difference of about several percent. Furthermore, numerical values ​​such as depth in this embodiment are merely examples, and other numerical values ​​may be used.

[0014] (Embodiment) [composition] First, the configuration of the component crimping device according to the embodiment will be described.

[0015] Fig. 1 is a block diagram showing a component crimping device 100 according to an embodiment. Fig. 2 is a perspective view showing a specific configuration of a thermocompression bonding mechanism 200 according to an embodiment. Fig. 3 is a side view showing a specific configuration of the thermocompression bonding mechanism 200 according to an embodiment.

[0016] The component bonding apparatus 100 is an apparatus for bonding (more specifically, thermocompression bonding) a component 3 to a substrate 2. The component bonding apparatus 100 is part of a component mounting system for producing, for example, display panels. In the component mounting system, for example, an anisotropic conductive film 4 (see FIG. 7) such as an ACF (Anisotropic Conductive Film) is attached to an electrode portion 510 (see FIG. 7) provided on the substrate 2, the component 3 is arranged (pre-compression bonded) to the substrate 2 via the anisotropic conductive film 4, and the pre-compression bonded substrate 2 and component 3 are thermocompression bonded together. The mounting system includes, for example, an attachment apparatus for bonding the anisotropic conductive film 4 to the substrate 2, a pre-compression bonding apparatus for arranging (pre-compression bonding) the component 3 to the substrate 2 via the anisotropic conductive film 4, and a final bonding apparatus for thermocompression bonding (final bonding) the component 3 to the substrate 2. For example, the component bonding apparatus 100 is a final bonding apparatus included in the mounting system.

[0017] The component pressure-bonding device 100 performs final pressure-bonding on the substrate 2 and the component 3, which are carried out from an upstream device (e.g., a pre-pressure bonding device) to the placement unit 12a by, for example, a substrate transport device (not shown). The substrate 2 to which the component 3 has been final pressure-bonded is then transported by, for example, the substrate transport device to a downstream device (e.g., an unloader).

[0018] The substrate 2 may be, for example, a flexible substrate made of resin, etc. The substrate 2 may also be a display panel using a glass substrate, etc.

[0019] Examples of the component 3 include flexible components such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuits), or IC chips.

[0020] Fig. 4 is a diagram showing a component 3 according to an embodiment. Specifically, Fig. 4(a) is a diagram showing the component 3 when viewed from above, showing a main surface 3a on which a plurality of first bump electrodes 500 and a plurality of second bump electrodes 501 are arranged. Fig. 4(b) is a diagram showing the component 3 when viewed from the side. Note that in Fig. 4, the bump electrodes (specifically, the first bump electrodes 500 and the second bump electrodes 501) provided on the component 3 are shown hatched for the sake of explanation, although this does not show a cross section.

[0021] The component 3 has a main surface 3a including a first region A1 in which a plurality of first bump electrodes 500 are arranged, a second region A2 in which a plurality of second bump electrodes 501 are arranged, and a third region A3 located between the first region A1 and the second region A2 in which no bump electrodes are arranged.

[0022] The number of bump electrodes arranged in the first region A1 and the second region A2 is not particularly limited. In this embodiment, the number of first bump electrodes 500 arranged in the first region A1 is greater than the number of second bump electrodes 501 arranged in the second region A2.

[0023] In this embodiment, the first bump electrodes 500 are arranged in four rows in a staggered pattern in the first region A1. Meanwhile, in this embodiment, the second bump electrodes 501 are arranged in a row in the second region A2. For example, the first bump electrodes 500 are arranged such that the spacing between them and the spacing between them are at least partially different.

[0024] The component 3 is placed on the substrate 2 so that the main surface 3a faces the substrate 2. When the component 3 is thermocompression bonded to the substrate 2, the back surface 3b facing the main surface 3a (i.e., the surface opposite to the main surface 3a) is pressed against the crimping unit 21 (specifically, the crimping tool 33 provided in the crimping unit 21).

[0025] The component bonding apparatus 100 includes a thermocompression bonding mechanism 200 and a control device 300.

[0026] The thermocompression bonding mechanism 200 is a mechanical unit that thermocompresses the substrate 2 and the component 3 together. For example, the thermocompression bonding mechanism 200 is controlled by the control device 300 (specifically, the control unit 310) to thermocompression bond the component 3 to the substrate 2. In this embodiment, the thermocompression bonding mechanism 200 includes a base 11, a substrate positioning unit 12, a gate-shaped frame 13, a backup stage 14, a touch panel 16, a compression bonding unit 21, a protective sheet supply unit 22, a unit support unit 23, and an alignment camera 50. The substrate positioning unit 12 includes a placement unit 12a and a movement mechanism 12b. The compression bonding unit 21 includes an elevation motor 31, an elevation base 32, a compression bonding tool 33, a pressure cylinder 34, and a heater 35. The protective sheet supply unit 22 includes a case 41, a supply reel 42, a guide roller 44, a feed roller 45, a pinch roller 46, a biasing spring 46S, and a drive motor 47.

[0027] The thermocompression bonding mechanism 200 is provided with a substrate positioning unit 12 on the negative Y-axis side of a base 11, and a gate-shaped frame 13 and a backup stage 14 on the negative Y-axis side of the substrate positioning unit 12. An alignment camera 50 is also provided on the base 11 for locating the position of the substrate 2 at a predetermined position. A touch panel 16 is provided on the positive Y-axis side of the base 11 as an input / output device used by an operator.

[0028] The board positioning unit 12 is a mechanism for positioning the board 2 on which components 3 have been pre-mounted at a predetermined position, and is equipped with a mounting unit 12a that holds the board 2 in a horizontal position, and a moving mechanism 12b that moves the mounting unit 12a in three dimensions while maintaining the horizontal position.

[0029] The placement portion 12a is a stage (table) on which the substrate 2 is placed. Specifically, the substrate 2 on which the components 3 are arranged is placed with the anisotropic conductive film 4 interposed therebetween so that the main surface 3a faces the substrate 2. For example, the substrate 2 transported by the above-described substrate transport device is placed on the placement portion 12a in a state in which the end portion on which the components 3 are placed protrudes. In this manner, the placement portion 12a has a holding surface on which the substrate 2 is placed in a state in which the end portion, which is the outer edge of the substrate 2, protrudes from the placement portion 12a (more specifically, in a state in which the end portion does not overlap with the placement portion 12a in a top view). The end portion of the substrate 2 is supported by the backup stage 14 when the components 3 are pressure-bonded to the substrate 2.

[0030] The mounting portion 12a may be provided with a suction mechanism that suctions the substrate 2 onto the holding surface. For example, an opening (e.g., a through-hole) is formed in the holding surface, and the mounting portion 12a suctions and holds the substrate 2 on the holding surface. For example, a suction device that sucks air through the opening to suck the substrate 2 onto the holding surface may be connected to the opening, and the suction device may suck the air, thereby suctioning and holding the substrate 2 on the holding surface. The suction mechanism may have, for example, a vacuum pump that sucks air, a vacuum pipe that connects the vacuum pump and the opening, and a valve for controlling suction.

[0031] The control unit 310, which will be described later, controls the valve to switch whether or not the suction mechanism generates a suction force on the holding surface, that is, whether or not the suction mechanism suctions the edge of the substrate 2.

[0032] The valve provided in the suction mechanism may be, for example, a solenoid valve for switching on and off the suction of air, or a pressure adjustment valve (so-called pressure regulator) for switching the suction force (adsorption force).

[0033] Alternatively, the placement portion 12a may not have the above-described opening or the like on the holding surface, and the substrate 2 may be simply placed on the holding surface 111, thereby holding the substrate 2 on the holding surface.

[0034] The placement unit 12a is provided so as to be movable by, for example, a movement mechanism 12b.

[0035] The moving mechanism 12b is a mechanism for moving the mounting unit 12a. For example, the mounting unit 12a and the moving mechanism 12b form a three-axis stage. The moving mechanism 12b is realized by, for example, a conveyor configured to be able to move the mounting unit 12a arbitrarily on the XY plane and to be able to move up and down in the Z-axis direction.

[0036] The moving mechanism 12b moves the mounting portion 12a on which the substrate 2 is mounted, thereby moving the end of the substrate 2 above (more specifically, directly above) the backup stage .

[0037] The gate-shaped frame 13 has a horizontal section 13a that extends in the X-axis direction above the center of the base 11. A pressure-bonding section 21 is provided on the underside of the horizontal section 13a. The backup stage 14 is provided below the pressure-bonding section 21 and extends in the X-axis direction. A protective sheet supply section 22 is provided between the pressure-bonding section 21 and the backup stage 14. The protective sheet supply section 22 is configured to be detachably installed on a unit support section 23 that is provided on the base 11.

[0038] The crimping unit 21 includes a lifting base 32 that moves up and down by the operation of a lifting motor 31. A plurality of (four in this embodiment) crimping tools 33 are provided on the lifting base 32, lined up in the X-axis direction. Each crimping tool 33 is positioned directly above the backup stage 14, and is individually raised and lowered by a pressure cylinder 34 provided corresponding to each crimping tool 33. Each crimping tool 33 has a built-in heater 35.

[0039] The heater 35 is a heater for heating the crimping tool 33. The crimping tool 33 is heated by the heater 35, and the crimping tool 33 presses the component 3 against the substrate 2, thereby thermocompression-bonding the component 3 to the substrate 2. The heater 35 is realized by, for example, a heating wire or a Peltier element.

[0040] FIG. 5 is a diagram showing a crimping tool 33 according to an embodiment.

[0041] Specifically, Fig. 5(a) is a diagram showing the crimping tool 33 when viewed from above, showing a pressing surface 33a that is disposed so as to face the component 3 during thermocompression bonding and presses the component 3 (more specifically, the protective sheet 43). Fig. 5(b) is a diagram showing the crimping tool 33 when viewed from the side.

[0042] The crimping tool 33 has a pressing surface 33a for pressing the component 3. The pressing surface 33a is the surface (facing surface) of the crimping tool 33 that faces the component 3 during thermocompression bonding. The pressing surface 33a also has a fourth region A4 and a fifth region A5 that press the component 3 during thermocompression bonding, and a recess 33b located between the fourth region A4 and the fifth region A5 (a sixth region A6).

[0043] The recess 33b is a groove provided in the pressing surface 33a. The recess 33b causes the pressing surface 33a to be uneven in the fourth region A4, the fifth region A5, and the sixth region A6, and thus creates a step. As a result, when pressing the component 3 during, for example, thermocompression bonding, the fourth region A4 and the fifth region A5 come into contact with the component 3 (more specifically, the protective sheet 43), but the sixth region A6 where the recess 33b is located does not come into contact with the component 3 (more specifically, the protective sheet 43).

[0044] The depth of the recesses 33b may be any depth and is not particularly limited, and is, for example, about 10 to 50 μm.

[0045] The protective sheet supply unit 22 is a mechanism that supplies a protective sheet 43 between the crimping tool 33 and the component 3 during thermocompression bonding. The protective sheet supply unit 22 is provided with a plurality of supply reels 42 (four in this embodiment, corresponding to the number of crimping tools 33) inside a case 41 that forms the outer shell. Each supply reel 42 holds the protective sheet 43 in a rolled state, and is provided inside the case 41, lined up in the X-axis direction with its rotation axis facing the X-axis direction. A plurality of guide rollers 44 are provided in the center of the case 41 in the Y-axis direction. Furthermore, a feed roller 45 and a plurality of pinch rollers 46 (four in this embodiment, corresponding to the number of supply reels 42) are provided inside the case 41 on the positive side of the Y-axis.

[0046] The guide rollers 44 guide the protective sheet 43 pulled out in the positive direction of the Y axis from each supply reel 42 so that the protective sheet 43 assumes a substantially horizontal position in the center of the case 41. The central portion located directly below the crimping tool 33 is the portion where the crimping tool 33 presses the component 3 via the protective sheet 43 when the crimping tool 33 presses the component 3, as will be described later.

[0047] The feed roller 45 is arranged with its rotation axis facing the X-axis direction, and is in contact with a portion of the protective sheet 43 that is further toward the Y-axis positive side than the guide roller 44, which is located furthest toward the Y-axis positive side.

[0048] The four pinch rollers 46 are disposed on the positive side of the Y-axis of the feed roller 45, and are aligned in the X-axis direction with their respective rotation axes facing the X-axis direction. Each pinch roller 46 is biased in the positive direction of the Y-axis by a biasing spring 46S, thereby pressing the protective sheet 43 against the feed roller 45 and bringing it into close contact with the sheet.

[0049] A drive motor 47 is provided outside the case 41 as roller drive means for driving and rotating the feed roller 45. When the drive motor 47 drives and rotates the feed roller 45 around the X axis (arrow A in FIG. 3), the protective sheet 43 is pulled in the positive direction of the Y axis by the feed roller 45, pulled out from the supply reel 42, and fed in the positive direction of the Y axis. After passing the feed roller 45, the protective sheet 43 is guided below the feed roller 45 and discharged below the case 41 without being taken up by the feed roller 45.

[0050] In the thermocompression bonding operation of the component 3 by the thermocompression bonding mechanism 200, first, the drive motor 47 controlled by the control unit 310 rotates the feed roller 45 so that the portion of the protective sheet 43 pulled out from each supply reel 42 that is pressed by the crimping tool 33 becomes an unused portion.

[0051] Next, the lift motor 31 controlled by the control unit 310 is operated to lift the lift base 32, and each crimping tool 33 is positioned at its initial position above the protective sheet 43. Once each crimping tool 33 is positioned at its initial position, the control unit 310 moves the mounting unit 12a holding the substrate 2 using the movement mechanism 12b, and positions the substrate 2 so that the component 3 previously mounted on the substrate 2 via the anisotropic conductive film 4 is located below the corresponding crimping tool 33 (in other words, above the backup stage 14).

[0052] Once the substrate 2 is positioned, the control unit 310 controls the pressure cylinders 34 to cause the pressure cylinders 34 to press down the compression tools 33 from their initial positions. As a result, the compression tools 33 descend from above the protective sheet 43 and press the components 3 together with the protective sheet 43 onto the substrate 2. During this pressing, the components 3 are pressed together with the substrate 2 against the backup stage 14, and the anisotropic conductive film 4 is heated through the components 3 by the heaters 35 built into the compression tools 33. As a result, the components 3 are thermocompression-bonded (mainly compressed) to the substrate 2. When the compression tool 33 presses the components 3 onto the substrate 2, the protective sheet 43 is interposed between the compression tool 33 and the components 3, so the compression tool 33 does not come into contact with the anisotropic conductive film 4, and no part of the anisotropic conductive film 4 adheres to the compression tool 33.

[0053] When the component 3 is pressed against the substrate 2 by the crimping tool 33, the control unit 310 controls the pressure cylinder 34 to raise the crimping tool 33 and return it to its initial position. Then, once the crimping tool 33 is positioned at its initial position, the control unit 310 controls the drive motor 47 to rotate the feed roller 45, thereby pulling out a predetermined amount (length) of protective sheet 43 from the supply reel 42, thereby performing a renewal operation for the protective sheet 43. In the renewal operation, the control unit 310 controls the protective sheet supply unit 22 to feed the portion of the protective sheet 43 that was pressed by the crimping tool 33 during the previous crimping operation in the positive direction of the Y axis, and rotates the feed roller 45 by a preset rotation angle so that the unused portion of the protective sheet 43 becomes the new pressed portion. After the renewal operation for the protective sheet 43 is completed, the positioning of the substrate 2 and the pressing of the component 3 by the crimping tool 33 are repeatedly performed as described above.

[0054] The control device 300 is a computer that controls mechanisms such as the moving mechanism 12b, the pressure bonding unit 21, and the protective sheet supply unit 22 that are included in the thermocompression bonding mechanism 200.

[0055] The control device 300 is realized by a communication interface for communicating with mechanisms such as the moving mechanism 12b, the compression unit 21, and the protective sheet supply unit 22 included in the thermocompression bonding mechanism 200, a nonvolatile memory storing a program, a volatile memory that is a temporary storage area for executing the program, an input / output port for transmitting and receiving signals, and a processor that executes the program. The communication interface may be realized, for example, by an antenna and a wireless communication circuit that enables wireless communication, or by a connector to which a communication line is connected that enables wired communication.

[0056] The control device 300 includes a control unit 310 and a storage unit 320 .

[0057] The control unit 310 is a processing unit that controls mechanisms such as the moving mechanism 12b, the pressure bonding unit 21, and the protective sheet supply unit 22 included in the thermocompression bonding mechanism 200. The control unit 310 includes, for example, a processor such as a CPU (Central Processing Unit) and a memory that stores a control program executed by the processor.

[0058] For example, the control unit 310 causes the movement mechanism 12b to move the placement unit 12a so that the third region A3 and the recessed portion 33b overlap, and then causes the compression bonding unit 21 to thermocompression bond the component 3 to the substrate 2. Specifically, the control unit 310 first controls the movement mechanism 12b to move the placement unit 12a so that the third region A3 and the recessed portion 33b overlap. For example, the control unit 310 controls the movement mechanism 12b based on the image capture result of the alignment camera 50 to cause the movement mechanism 12b to move the placement unit 12a so that the third region A3 and the recessed portion 33b overlap in a top view. Furthermore, the control unit 310 controls the protection sheet supply unit 22 to supply the protection sheet 43 between the component 3 and the compression bonding tool 33. Furthermore, the control unit 310 causes the pressure bonding tool 33 to press the component 3 via the protective sheet 43, thereby causing the pressure bonding unit 21 to perform thermocompression bonding of the component 3 to the substrate 2.

[0059] Note that control unit 310 may cause crimping unit 21 to thermocompression-bond component 3 to substrate 2 by causing crimping tool 33 to press component 3 without protective sheet 43 in between. In this case, component crimping apparatus 100 does not need to include protective sheet supply unit 22.

[0060] Fig. 6 is a diagram illustrating the positional relationship between the component 3 and the crimping tool 33 in thermocompression bonding performed by the component crimping apparatus 100 according to the embodiment. Fig. 7 is a diagram illustrating thermocompression bonding performed by the component crimping apparatus 100 according to the embodiment.

[0061] As shown in Figures 6 and 7, for example, the control unit 310 controls the moving mechanism 12b to move the placement unit 12a so that, when viewed from above, the first area A1 and the fourth area A4 overlap, the second area A2 and the fifth area A5 overlap, and the third area A3 and the sixth area A6 overlap.

[0062] Note that "areas overlapping in top view" not only means that the positions of the areas completely match in top view, but also includes cases where there is a non-overlapping area in top view, for example, a few percent, such as 5%, of the size (e.g., area) of the areas. Furthermore, the areas may be the same or different in size and shape. For example, when the areas are different in size and shape, one area may be included in the other area in top view.

[0063] When mounting portion 12a is moved so that first region A1 overlaps fourth region A4, second region A2 overlaps fifth region A5, and third region A3 overlaps sixth region A6 in a top view, for example, first bump electrode 500 of component 3 and electrode portion 510 of substrate 2 are arranged to face each other. Also, second bump electrode 501 of component 3 and electrode portion 511 of substrate 2 are arranged to face each other. In this way, when component pressure-bonding apparatus 100 thermocompresses component 3 and substrate 2 together, first bump electrode 500 and electrode portion 510 are electrically connected directly or via conductive particles contained in anisotropic conductive film 4, and second bump electrode 501 and electrode portion 510 are electrically connected directly or via conductive particles contained in anisotropic conductive film 4.

[0064] The storage unit 320 is a storage device that stores various types of information. For example, the storage unit 320 stores threshold information such as a thermocompression bonding time used when thermocompression bonding the component 3 to the substrate 2. The storage unit 320 is realized by, for example, an HDD (Hard Disk Drive) or a semiconductor memory.

[0065] [Processing Procedure] Next, a description will be given of a processing procedure of the component crimping apparatus 100 according to the embodiment. The component crimping apparatus 100 executes, for example, the component crimping method described below.

[0066] Fig. 8 is a flowchart showing a component crimping method according to an embodiment, and Fig. 9 is a diagram for explaining the component crimping method according to an embodiment.

[0067] First, the control unit 310 controls a substrate transport device (not shown) to receive, from an upstream device (for example, a pre-compression bonding device), the substrate 2 on which the components 3 are arranged with the main surface 3a facing the substrate 2 via the anisotropic conductive film 4, and place the received substrate 2 on the placement unit 12a (S110 and FIG. 9(a)). Note that step S110 may be executed by the equipment and control device of a mounting system including the component compression bonding device 100. The substrate transport device may be provided in the component compression bonding device 100, or in the mounting system.

[0068] Next, the control unit 310 controls the moving mechanism 12b to move the mounting unit 12a so that the third region A3 and the recess 33b overlap (S120 and FIG. 9(b)). For example, the control unit 310 causes the alignment camera 50 to capture an image of an alignment mark (not shown) provided on the substrate 2, identifies the position of the substrate 2 based on the image generated by the image capture, and moves the mounting unit 12a based on the identified position of the substrate 2 so that at least a part of the third region A3 and the recess 33b overlap in a top view.

[0069] Next, control unit 310 controls crimping unit 21 to cause crimping unit 21 (specifically, crimping tool 33) to thermocompression bond component 3 to substrate 2 (S130). Specifically, control unit 310 controls heater 35 to heat crimping tool 33 to a predetermined temperature, and causes crimping tool 33 to press back surface 3b of component 3 against protection sheet 43, thereby causing crimping tool 33 to thermocompression bond component 3 to substrate 2.

[0070] The control unit 310 controls the protective sheet supply unit 22 to slightly move the position of the protective sheet 43 each time step S130 is executed, for example, so that the protective sheet 43 comes into contact with the crimping tool 33 at a position that has never come into contact with the crimping tool 33 during thermocompression bonding.

[0071] The timing at which the control unit 310 controls the heater 35 to heat the crimping tool 33 may be arbitrary and is not particularly limited. In step S130, the control unit 310 may control the heater 35 so that the crimping tool 33 reaches a predetermined temperature when the control unit 310 causes the crimping tool 33 to thermocompression bond the component 3 to the substrate 2. The control unit 310 may also control the heater 35 so that the temperature of the crimping tool 33 maintains the predetermined temperature, or may control the heater 35, for example, to stop the heater 35, so as to lower the temperature of the crimping tool 33 every time thermocompression bonding of the component 3 to the substrate 2 is performed.

[0072] The predetermined temperature may be determined arbitrarily and is not particularly limited.

[0073] The substrate 2 to which the components 3 have been thermocompression bonded is transported, for example, by a substrate transport device to a downstream device (for example, an unloader).

[0074] [Variations] FIG. 10 is a side view showing a crimping tool 33 according to a modified example.

[0075] A low thermal conductive member 36 is provided in a recess 33b provided on a pressing surface 33a of a crimping tool 33 according to the modified example.

[0076] The low thermal conductivity member 36 is disposed in the recess 33b and has a lower thermal conductivity than the fourth region A4 and the fifth region A5.

[0077] The crimping tool 33 is made of a metal material such as SUS (Steel Use Stainless). The low thermal conductive member 36 is made of a ceramic material such as Si. The low thermal conductive member 36 may be made of any material as long as it has a lower thermal conductivity than the fourth region A4 and the fifth region A5.

[0078] As shown in FIG. 10, the low thermal conductivity member 36 is disposed so as to be flush with the pressing surfaces in the fourth area A4 and the fifth area A5, for example.

[0079] Note that the low thermal conductive member 36 does not have to be disposed flush with the pressing surface 33a in the fourth region A4 and the fifth region A5. For example, the low thermal conductive member 36 may be provided in the recess 33b on the pressing surface 33a of the crimping tool 33 so as to be recessed relative to the pressing surface 33a in the fourth region A4 and the fifth region A5. In other words, the low thermal conductive member 36 may be provided in the sixth region A6 where the recess 33b is provided so as not to come into contact with the component 3 during thermocompression bonding.

[0080] [Effects, etc.] Below, examples of techniques that can be obtained from the disclosure of this specification will be given, and the effects and the like that can be obtained from the exemplified techniques will be described.

[0081] The first technique is a component pressure-bonding device 100 that thermocompresses a component 3 having a main surface 3a including a first region A1 where a plurality of first bump electrodes 500 are arranged, a second region A2 where a plurality of second bump electrodes 501 are arranged, and a third region A3 located between the first region A1 and the second region A2 where no bump electrodes are arranged, to a substrate 2 via an anisotropic conductive film 4. The component pressure-bonding device 100 includes a mounting section 12a on which the substrate 2 on which the component 3 is arranged is placed so that the main surface 3a faces the substrate 2 via the anisotropic conductive film 4, a pressure-bonding tool 33 having a pressing surface 33a, and a pressure-bonding device 33 that applies pressure to the pressure-bonding tool 33. a moving mechanism 12b that moves the mounting portion 12a; and a control unit 310 that controls the moving mechanism 12b and the crimping portion 21, wherein the pressing surface 33a has a fourth area A4 and a fifth area A5 that press the component 3 in thermocompression bonding, and a recess 33b located between the fourth area A4 and the fifth area A5, and the control unit 310 causes the moving mechanism 12b to move the mounting portion 12a so that the third area A3 and the recess 33b overlap, and then causes the crimping portion 21 to thermocompression bond the component 3 to the substrate 2.

[0082] In recent years, components 3 such as ICs have evolved, and the number of bump electrodes included in the components 3 has increased. The bump electrodes are arranged, for example, in multiple rows or in a staggered arrangement.

[0083] Here, the inventors of the present application have noticed that as the number of bump electrodes increases, a phenomenon occurs in which the mounting accuracy of the component 3 on the substrate 2 becomes unstable after thermocompression bonding.

[0084] During thermocompression bonding, the conductive particles contained in the anisotropic conductive film 4 flow. When the component 3 is pressed by the compression tool 33 during thermocompression bonding, the anisotropic conductive film 4 is pressed against the component 3, causing the conductive particles to flow outward so as to spread throughout the entire surface. Here, in areas where the gap between the bump electrodes is narrow, the flow of the conductive particles becomes poor, and the conductive particles end up pushing against the bump electrodes. This is thought to result in issues such as unstable mounting accuracy.

[0085] In particular, if the number of bump electrodes arranged in the first region A1 and the second region A2, the spacing between the bump electrodes, and / or the arrangement of the bump electrodes differ in the component 3 that is subjected to pressure during thermocompression bonding, conductive particles located near the center of the component 3 in a top view may press against the bump electrodes in areas where the distance between the bump electrodes is narrow. In other words, when the bump electrodes are pressed outward, the force with which the conductive particles press against the component 3 differs between the first region A1 and the second region A2. This causes the component 3 to shift from its desired position. Given the demand for smaller components 3, it is desirable to be able to suppress a decrease in mounting accuracy without widening the spacing between the bump electrodes of the component 3.

[0086] Therefore, the inventors discovered that, during thermocompression bonding, which affects the flow of conductive particles, component 3 is heated at different times rather than all at once. Specifically, component compression bonding apparatus 100 has recesses 33b formed on pressing surface 33a. The rest of pressing surface 33a comes into direct contact with component 3 (specifically, via protective sheet 43) during thermocompression bonding. Meanwhile, the portion of pressing surface 33a where recesses 33b are formed (sixth region A6) does not come into direct contact with component 3 (specifically, via protective sheet 43) during thermocompression bonding. Therefore, during thermocompression bonding, sixth region A6 where recesses 33b are formed on pressing surface 33a serves as a temperature rise delay region, and the temperature rise of component 3 is suppressed more than in the rest of pressing surface 33a where recesses 33b are formed. This is thought to prevent all of the conductive particles contained in anisotropic conductive film 4 from flowing at once during thermocompression bonding. Therefore, it is believed that by providing recess 33b on pressing surface 33a, the force with which the conductive particles press against the bump electrode during thermocompression bonding can be reduced compared to when recess 33b is not provided on pressing surface 33a.

[0087] As described above, with component crimping apparatus 100, when component 3 is pressed onto substrate 2 by crimping tool 33 during thermocompression bonding, the temperature rise in third region A3 caused by heater 35 can be delayed compared to the temperature rise in first region A1 and second region A2. Therefore, component crimping apparatus 100 can prevent a decrease in mounting accuracy. In other words, component crimping apparatus 100 can improve the mounting quality of component 3 and increase productivity.

[0088] A second technique is the component crimping device 100 according to the first technique, further including a low thermal conductivity member 36 that is disposed in the recess 33b and has a lower thermal conductivity than the fourth region A4 and the fifth region A5.

[0089] This allows the temperature rise in the low thermal conductive member 36 to be delayed compared to the fourth region A4 and the fifth region A5 when the heater 35 heats the crimping tool 33. Therefore, by performing thermocompression bonding at an appropriate timing after the heater 35 starts heating the crimping tool 33, the temperature rise in the third region A3 can be delayed compared to the temperature rise in the first region A1 and the second region A2. Therefore, the component crimping device 100 can suppress a decrease in mounting accuracy.

[0090] Technology 3 is the component crimping device 100 according to Technology 1 or 2, further including a protective sheet supply unit 22 that supplies a protective sheet 43 between the crimping tool 33 and the component 3, and the control unit 310 causes the crimping tool 33 to press the component 3 via the protective sheet 43, thereby causing the crimping unit 21 to perform thermocompression bonding of the component 3 to the substrate 2.

[0091] This prevents the anisotropic conductive film 4 from adhering to the pressure bonding tool 33 during thermocompression bonding.

[0092] The fourth technique is a component compression bonding method performed by a component compression bonding apparatus 100, which thermocompresses a component 3 having a main surface 3a including a first region A1 in which a plurality of first bump electrodes 500 are arranged, a second region A2 in which a plurality of second bump electrodes 501 are arranged, and a third region A3 located between the first region A1 and the second region A2 in which no bump electrodes are arranged, to a substrate 2 via an anisotropic conductive film 4. The component compression bonding apparatus 100 has a mounting section 12a on which the substrate 2 on which the component 3 is arranged is mounted so that the main surface 3a faces the substrate 2 via the anisotropic conductive film 4, and a pressing surface 33a. The component bonding method includes a crimping unit 21 including a crimping tool 33 for pressing a component 3 and a heater 35 for heating the crimping tool 33, and a moving mechanism 12b for moving the placing unit 12a, wherein the pressing surface 33a has a fourth area A4 and a fifth area A5 for pressing the component 3 in thermocompression bonding, and a recess 33b located between the fourth area A4 and the fifth area A5, and the component crimping method includes causing the moving mechanism 12b to move the placing unit 12a so that the third area A3 and the recess 33b overlap (S120), and then causing the crimping unit 21 to perform thermocompression bonding of the component 3 to the substrate 2 (S130).

[0093] This provides the same effects as the component crimping device 100 described in the first technique.

[0094] These comprehensive or specific aspects may be realized as a system, a method, an integrated circuit, a computer program, or a non-transitory recording medium such as a computer-readable CD-ROM, or may be realized as any combination of a system, a method, an integrated circuit, a computer program, and a recording medium.

[0095] (Other embodiments) Although the component crimping device according to the present embodiment has been described above based on the above embodiment, the present invention is not limited to the above embodiment.

[0096] For example, the control device 300 may be a computer dedicated to controlling each device included in the component crimping device 100, or may be a computer that also controls each device included in a mounting system that includes the component crimping device 100.

[0097] Also, for example, in the above embodiment, all or some of the components of the control device 300 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a HDD or semiconductor memory.

[0098] Furthermore, the components of the control device 300 may be configured with one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

[0099] The one or more electronic circuits may include, for example, a semiconductor device, an IC, or an LSI (Large Scale Integration). The IC or LSI may be integrated on a single chip or on multiple chips. Although we refer to them as ICs or LSIs here, they may be called system LSIs, VLSIs (Very Large Scale Integration), or ULSIs (Ultra Large Scale Integration) depending on the degree of integration. Also, a field programmable gate array (FPGA), which is programmed after the LSI is manufactured, can be used for the same purpose.

[0100] In addition, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art would think of, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope of the present invention. [Industrial Applicability]

[0101] The component crimping device according to the present invention can be used as a component crimping device for crimping components onto a substrate. [Explanation of symbols]

[0102] 2 boards 3 parts 3a Main surface 3b back side 4 Anisotropic conductive film 11 Foundation 12 PCB positioning section 12a Placement section 12b Moving mechanism 13 Gate-type frame 13a Horizontal section 14 Backup Stage 16 Touch Panel 21 Crimping section 22 Protective sheet supply unit 23 Unit support part 31 Lifting motor 32 Lifting base 33a Pressing surface 33b Recess 33 Crimping Tools 34 Pressure Cylinder 35 Heater 36 Low thermal conductivity materials 41 cases 42 Supply reel 43 Protective Sheet 44 Guide roller 45 Feed roller 46 Pinch roller 46S bias spring 47 Drive motor 50 Alignment camera 100 Component crimping device 200 Thermocompression mechanism 300 control device 310 Control Unit 320 Storage section 500 First bump electrode 501 Second bump electrode 510, 511 Electrode section

Claims

1. A component compression bonding apparatus that thermocompresses a component having a main surface including a first region in which a plurality of first bump electrodes are arranged, a second region in which a plurality of second bump electrodes are arranged, and a third region located between the first region and the second region in which no bump electrodes are arranged, to a substrate via an anisotropic conductive film, a mounting portion on which the substrate on which the components are arranged is mounted so that the main surface faces the substrate via the anisotropic conductive film; a crimping unit including a crimping tool having a pressing surface and a heater for heating the crimping tool; a moving mechanism that moves the placement unit; a control unit that controls the moving mechanism and the crimping unit, the pressing surface has a fourth region and a fifth region that press the component during the thermocompression bonding, and a recessed portion located between the fourth region and the fifth region; The control unit The moving mechanism moves the placement unit so that the third region and the recessed portion overlap, causing the compression bonding unit to perform the thermocompression bonding of the component to the substrate; Component crimping device.

2. The heat sink further includes a low thermal conductivity member disposed in the recess and having a thermal conductivity lower than that of the fourth region and the fifth region. The component crimping device according to claim 1 .

3. Further, a protective sheet supply unit is provided to supply a protective sheet between the crimping tool and the component, the control unit causes the crimping tool to press the component via the protective sheet, thereby causing the crimping unit to perform the thermocompression bonding of the component to the substrate. The component crimping device according to claim 1 or 2.

4. A component compression bonding method performed by a component compression bonding apparatus, which thermocompresses a component having a main surface including a first region in which a plurality of first bump electrodes are arranged, a second region in which a plurality of second bump electrodes are arranged, and a third region located between the first region and the second region in which no bump electrodes are arranged, to a substrate via an anisotropic conductive film, The component crimping device includes: a mounting portion on which the substrate on which the components are arranged is mounted so that the main surface faces the substrate via the anisotropic conductive film; a crimping unit including a crimping tool having a pressing surface and a heater for heating the crimping tool; a moving mechanism that moves the placement unit, the pressing surface has a fourth region and a fifth region that press the component during the thermocompression bonding, and a recessed portion located between the fourth region and the fifth region; In the component crimping method, The moving mechanism moves the placement unit so that the third region and the recessed portion overlap, causing the compression bonding unit to perform the thermocompression bonding of the component to the substrate; Part crimping method.

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