Exposure apparatus for print circuit board, and method for producing print circuit board

Abstract

To provide an exposure apparatus for a print circuit board that generates no chip on a resist board, and a method for producing a print circuit board.SOLUTION: An exposure apparatus for a print circuit board includes a first roller, an exposure part, a second roller, and a third roller. The first roller sends out a laminate including a substrate, a resist layer, and a support layer. The resist layer is on the substrate. The support layer is on the resist layer. The exposure part is disposed at the downstream side of the first roller, and exposes to the resist layer. The second roller is disposed at the upstream side of the exposure part, and winds up the support layer from the laminate. The third roller is disposed at the downstream side of the exposure part, and winds up the laminate from which the support layer is wound.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an exposure apparatus for a printed wiring board and a method for manufacturing a printed wiring board. [Background technology]

[0002] Japanese Patent Application Laid-Open No. 2015-222370 (Patent Document 1) describes a roll-to-roll exposure apparatus. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-222370 Summary of the Invention [Problem to be solved by the invention]

[0004] A resist layer whose properties change when exposed to light is provided on a substrate. If a support layer containing a lubricant is provided on the resist layer, the lubricant in the support layer diffuses light when the resist layer is exposed to light. This can result in chipping of the resist layer.

[0005] An object of the present disclosure is to provide an exposure apparatus for a printed wiring board and a method for manufacturing a printed wiring board that does not cause chipping in the resist layer. [Means for solving the problem]

[0006] The exposure device for printed wiring boards according to the present disclosure includes a first roller, an exposure unit, a second roller, and a third roller. The first roller feeds a laminate including a substrate, a resist layer, and a support layer. The resist layer is on the substrate. The support layer is on the resist layer. The exposure unit is located downstream of the first roller and exposes the resist layer. The second roller is located upstream of the exposure unit and winds up the support layer from the laminate. The third roller is located downstream of the exposure unit and winds up the laminate with the support layer wound up. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to provide an exposure apparatus for a printed wiring board and a method for manufacturing a printed wiring board that does not cause chipping in the resist layer. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic side view of the printed wiring board exposure apparatus according to the first embodiment. [Figure 2] FIG. 2 is a schematic cross-sectional view of the laminate taken at point A1 in FIG. [Figure 3] FIG. 3 is a schematic cross-sectional view of the laminate taken at point B1 shown in FIG. [Figure 4] FIG. 4 is a schematic cross-sectional view of the laminate taken at point C1 in FIG. [Figure 5] FIG. 5 is a schematic side view of the printed wiring board exposure apparatus according to the first embodiment. [Figure 6] FIG. 6 is a schematic cross-sectional view of the laminate taken at point A2 in FIG. [Figure 7] FIG. 7 is a schematic cross-sectional view of the laminate taken at point B2 in FIG. [Figure 8] FIG. 8 is a schematic cross-sectional view of the laminate taken at point C2 in FIG. [Figure 9] FIG. 9 is a flow diagram schematically showing a method for manufacturing a printed wiring board according to the second embodiment. [Figure 10]FIG. 10 is a schematic side view of the printed wiring board exposure apparatus according to the third embodiment. [Figure 11] FIG. 11 is a schematic cross-sectional view of the laminate taken at point A1 in FIG. [Figure 12] FIG. 12 is a schematic cross-sectional view of the laminate taken at point B1 shown in FIG. [Figure 13] FIG. 13 is a schematic cross-sectional view of the laminate taken at point C1 in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] [Summary of the embodiments of the present disclosure] First, an overview of the embodiment of the present disclosure will be described.

[0010] (1) The exposure device for printed wiring boards according to the present disclosure includes a first roller, an exposure unit, a second roller, and a third roller. The first roller feeds a laminate including a substrate, a resist layer, and a support layer. The resist layer is on the substrate. The support layer is on the resist layer. The exposure unit is located downstream of the first roller and exposes the resist layer. The second roller is located upstream of the exposure unit and winds the support layer from the laminate. The third roller is located downstream of the exposure unit and winds the laminate with the wound support layer. This allows the support layer to be wound from the laminate before the laminate is transported to the exposure unit. Therefore, when the resist layer is exposed, diffuse reflection of light due to the lubricant contained in the support layer does not occur. As a result, chipping of the resist layer can be prevented.

[0011] (2) According to the exposure device for printed wiring boards relating to (1) above, the peel strength between the resist layer and the support layer may be set to a first value. The tension acting on the support layer when winding the support layer from the laminate may be set to a second value. The tension acting on the laminate with the support layer wound up may be set to a third value. The first value may be smaller than both the second value and the third value. This allows the support layer to be smoothly wound up from the laminate before the laminate is transported to the exposure unit.

[0012] (3) The exposure apparatus for printed wiring boards according to (2) above may include a first electrostatic sensor and a second electrostatic sensor. The first electrostatic sensor may measure the amount of static electricity in the support layer being wound up by the second roller. The second electrostatic sensor may measure the amount of static electricity in the laminate around which the support layer has been wound up. This allows the support layer to be wound up more smoothly from the laminate before the laminate is transported to the exposure section.

[0013] (4) In the exposure device for printed wiring boards according to (3) above, the second and third values ​​may be controlled based on the amounts of static electricity measured by the first and second electrostatic sensors, thereby allowing the support layer to be wound up more smoothly from the laminate before the laminate is transported to the exposure unit.

[0014] (5) The exposure device for printed wiring boards according to any one of (1) to (4) above may include a fourth roller. The fourth roller may be located upstream of the exposure unit and downstream of the first roller. The fourth roller may change the direction in which the laminate is transported. The resist layer may not be in contact with the fourth roller. This prevents the fourth roller from damaging the resist layer.

[0015] (6) The exposure apparatus for printed wiring boards according to any one of (1) to (5) above may include a fifth roller. The fifth roller may be disposed downstream of the exposure unit. The fifth roller may deliver spacers onto the resist layer. This prevents the resist layer from coming into contact with other components constituting the laminate when the laminate is taken up by the third roller.

[0016] (7) The method for manufacturing a printed wiring board according to the present disclosure may use the exposure apparatus for a printed wiring board according to any one of (1) to (6) above, thereby obtaining a printed wiring board free from circuit defects caused by chipping in the resist layer.

[0017] [Details of the embodiments of the present disclosure] Next, the details of the embodiments of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference numerals, and the description thereof will not be repeated.

[0018] (First embodiment) <Printed wiring board exposure equipment> First, the configuration of the exposure apparatus 100 for printed wiring boards according to the first embodiment when exposing the resist layer 11a on the first main surface 10a will be described (see FIGS. 1 to 4).

[0019] 1 is a schematic side view of a printed wiring board exposure apparatus 100 according to the first embodiment. The exposure apparatus 100 is an exposure apparatus for manufacturing printed wiring boards.

[0020] 1, the exposure apparatus 100 includes a first roller R1, a second roller R2, a third roller R3, a fourth roller R4, a fifth roller R5, a sixth roller R6, a seventh roller R7, a first electrostatic sensor 2a, a second electrostatic sensor 2b, a tension controller 3, and an exposure unit 4. The exposure apparatus 100 is a roll-to-roll type exposure apparatus in which the laminate 1 fed from the first roller R1 is taken up by the third roller R3.

[0021] The first roller R1 feeds out the laminate 1 wound in a roll. Specifically, the first roller R1 feeds out the laminate 1 by rotating around the axis of the first roller R1. The third roller R3 winds up the laminate 1 into a roll. Specifically, the third roller R3 winds up the laminate 1 by rotating around the axis of the third roller R3. In FIG. 1, the axis of the first roller R1 and the axis of the third roller R3 each extend in a direction perpendicular to the paper surface. In FIG. 1, the axis of the first roller R1 and the axis of the third roller R3 each rotate in a clockwise direction, for example. In this way, the laminate 1 is transported from the first roller R1 to the third roller R3.

[0022] In the exposure device 100, the direction in which the laminate 1 is transported is referred to as the downstream side to indicate the positional relationship between the first roller R1, the second roller R2, the third roller R3, the fourth roller R4, the fifth roller R5, the sixth roller R6, the seventh roller R7, and the exposure unit 4. The direction opposite to the downstream side is referred to as the upstream side. In other words, the third roller R3 is disposed downstream of the first roller R1. From a different perspective, the first roller R1 is disposed upstream of the third roller R3.

[0023] Next, the configuration of the laminate 1 at point A1 will be described. Figure 2 is a schematic cross-sectional view of the laminate 1 at point A1 shown in Figure 1. As shown in Figure 2, the laminate 1 wound around the first roller R1 includes a substrate 10, resist layers 11a and 11b, and support layers 12a and 12b.

[0024] The substrate 10 has a first main surface 10a and a second main surface 10b. The first main surface 10a is located opposite the second main surface 10b. The first main surface 10a faces the inside of the first roller R1. In other words, the second main surface 10b faces the outside of the first roller R1. The substrate 10 has a conductive layer on the surface side of an insulating substrate such as a resin. The conductive layer may be a metal mainly composed of copper, or a heterogeneous metal layer such as nickel or chromium may be present at the interface between the insulating layer and the conductive layer. The substrate 10 may be flexible.

[0025] Resist layers 11a and 11b are on the substrate 10. Specifically, the resist layer 11a is on the first main surface 10a. The resist layer 11b is on the second main surface 10b. The resist layers 11a and 11b are made of a photosensitive resin whose properties change when exposed to light such as ultraviolet light.

[0026] The support layers 12a and 12b are on the resist layers 11a and 11b. Specifically, the support layer 12a is on the resist layer 11a. The support layer 12b is on the resist layer 11b. The support layers 12a and 12b are films for protecting the resist layers 11a and 11b. The support layers 12a and 12b may be made of a resin such as polyester. The support layers 12a and 12b contain a lubricant to provide external lubricity.

[0027] Thus, in the exposure apparatus 100 according to the first embodiment, the laminate 1 at point A1 is a five-layer laminate in which the support layer 12a, resist layer 11a, substrate 10, resist layer 11b, and support layer 12b are stacked in this order.

[0028] When the resist layer 11a is exposed to light in the exposure unit 4, the lubricant causes diffuse reflection of light. As a result, chips may occur in the resist layer 11a. If chips exist in the resist layer 11a, circuit defects due to the chips will occur when a printed wiring board is manufactured.

[0029] Therefore, the support layer 12a is taken up by the second roller R2 before the laminate 1 is transported to the exposure unit 4. As shown in Fig. 1, the second roller R2 is disposed downstream of the first roller R1 and upstream of the exposure unit 4. The second roller R2 takes up the support layer 12a from the laminate 1 transported from the first roller R1.

[0030] Meanwhile, the laminate 1 with the support layer 12a wound up (a four-layer laminate in which the resist layer 11a, the substrate 10, the resist layer 11b, and the support layer 12b are laminated in this order) is transported to the exposure unit 4. Specifically, the exposure unit 4 is arranged downstream of the first roller R1 and upstream of the third roller R3. The fourth roller R4 is arranged downstream of the first roller R1 and upstream of the exposure unit 4. The fourth roller R4 transports the laminate 1 with the support layer 12a wound up to the exposure unit 4.

[0031] The fourth roller R4 changes the direction in which the laminate 1 is transported. Specifically, the transport direction of the laminate 1 is changed from diagonally upward left to horizontally left. The fourth roller R4 rotates around its axis, transporting the laminate 1 on which the support layer 12a is wound from the first roller R1 to the exposure unit 4. In FIG. 1, the axis of the fourth roller R4 extends along a direction perpendicular to the paper surface. In FIG. 1, the rotation direction of the fourth roller R4 is, for example, counterclockwise. In other words, the rotation direction of the fourth roller R4 is opposite to the rotation direction of the first roller R1.

[0032] The laminate 1 with the support layer 12a wound thereon is transported to the exposure unit 4 so that the support layer 12b faces the fourth roller R4. From a different perspective, the unexposed resist layer 11a is positioned farther from the substrate 10 than the fourth roller R4. In other words, the resist layer 11a is not in contact with the fourth roller R4. As a result, the laminate 1 is transported to the exposure unit 4 without the fourth roller R4 damaging the resist layer 11a before the exposure unit 4 exposes the resist layer 11a.

[0033] As shown in FIG. 1, the exposure unit 4 includes a stand 41 , a stage moving unit 42 , an elevation mechanism 43 , a stage 44 , a projection lens 45 , a mask 46 , and a light source 47 .

[0034] 3 is a schematic cross-sectional view of the laminate 1 taken at point B1 in FIG. 3. As shown in FIG. 3, the laminate 1 includes a substrate 10, resist layers 11a and 11b, and a support layer 12b. The first main surface 10a faces the light source 47. The second main surface 10b faces the stage 44. In other words, the projection lens 45, the mask 46, and the light source 47 are disposed in the region of the substrate 10 where the resist layer 11a is located.

[0035] 1, the projection lens 45 is disposed at a distance from the resist layer 11a of the laminate 1. The mask 46 is disposed at a position farther from the laminate 1 than the projection lens 45. The light source 47 is disposed at a position farther from the laminate 1 than the mask 46. As a result, the mask 46 does not come into direct contact with the resist layer 11a, and therefore the resist layer 11a is not damaged.

[0036] The base 41, the stage moving unit 42, the lifting mechanism 43, and the stage 44 are arranged in an area where the resist layer 11b is located when viewed from the substrate 10. The base 41 has the stage moving unit 42, the lifting mechanism 43, and the stage 44 mounted thereon.

[0037] The laminate 1 conveyed from the fourth roller R4 is held by the stage 44 adsorbing the rear surface (support layer 12b) of the laminate 1. The stage 44 holds the laminate 1 flat.

[0038] The lifting mechanism 43 is connected to the stage 44. The stage 44 can be raised and lowered by the lifting mechanism 43. The stage 44 holds the stack 1 as the lifting mechanism 43 raises and lowers the stage 44. The stack 1 held on the stage 44 is scanned by the stage moving unit 42.

[0039] Light is irradiated from the light source 47 onto the mask 46. The light is, for example, ultraviolet light. A pattern is drawn on the mask 46. The projection lens 45 projects the pattern drawn on the mask 46 onto the first main surface 10a of the substrate 10. As a result, the circuit pattern is transferred to the resist layer 11a on the first main surface 10a of the substrate 10. In this manner, the exposure unit 4 exposes the resist layer 11a. Because the support layer 12a is wound up by the second roller R2 before the laminate 1 is transported to the exposure unit 4, diffuse reflection of light due to the lubricant contained in the support layer 12a does not occur when the resist layer 11a is exposed. As a result, chips do not occur in the resist layer 11a, and circuit defects caused by such chips do not occur.

[0040] The laminate 1 held by the stage 44 is exposed by the stage moving unit 42 in a step-and-repeat manner.

[0041] The laminate 1, whose resist layer 11a has been exposed, is transported to the third roller R3. Specifically, the third roller R3 is disposed downstream of the exposure unit 4. The sixth roller R6 is disposed downstream of the exposure unit 4 and upstream of the third roller R3. In other words, the exposure unit 4 is disposed downstream of the fourth roller R4 and upstream of the sixth roller R6. The sixth roller R6 transports the laminate 1, whose resist layer 11a has been exposed, to the third roller R3.

[0042] The sixth roller R6 changes the direction in which the laminate 1 is transported. Specifically, the sixth roller R6 rotates about its axis to transport the laminate 1, on which the resist layer 11a has been exposed, from the exposure unit 4 to the third roller R3. In FIG. 1, the axis of the sixth roller R6 extends along a direction perpendicular to the paper surface. In FIG. 1, the rotation direction of the sixth roller R6 is, for example, counterclockwise. In other words, the rotation direction of the sixth roller R6 is the same as the rotation direction of the fourth roller R4. The rotation direction of the sixth roller R6 may be opposite to the rotation direction of the third roller R3.

[0043] The resist layer 11a is adhesive. Therefore, when the laminate 1 is wound around the third roller R3, a spacer 13a is placed on the resist layer 11a before the laminate 1 is conveyed to the third roller R3 so that the resist layer 11a does not come into contact with other components of the laminate 1 (e.g., the support layer 12b). Specifically, as shown in FIG. 1, the fifth roller R5 is disposed downstream of the sixth roller R6 and upstream of the third roller R3. The fifth roller R5 delivers the spacer 13a to the laminate 1 conveyed from the sixth roller R6.

[0044] The spacers 13a and 13b (see FIGS. 4 and 8) may be made of resin such as polyethylene terephthalate, polyethylene, or polypropylene. The spacers 13a and 13b may be made of clean paper that generates little dust. The spacers 13a and 13b may be treated with a release agent to prevent them from sticking to other members constituting the laminate 1.

[0045] The configuration of the laminate 1 at point C1 shown in Fig. 1 will be described. Fig. 4 is a schematic cross-sectional view of the laminate 1 at point C1 shown in Fig. 1. The first main surface 10a faces the inside of the third roller R3. In other words, the second main surface 10b faces the outside of the third roller R3.

[0046] In this way, the laminate 1 has a five-layer structure in which the spacer 13a, resist layer 11a, substrate 10, resist layer 11b, and support layer 12b are laminated in this order, and is taken up by the third roller R3.

[0047] As shown in FIG. 1, when the resist layer 11a on the first main surface 10a is exposed, the seventh roller R7 that winds up the spacers 13b is not used.

[0048] Next, the configuration of the exposure apparatus 100 for printed wiring boards according to the first embodiment will be described (see FIGS. 5 to 8) when exposing the resist layer 11a and then exposing the resist layer 11b on the second main surface 10b. Fig. 5 is a schematic side view of the exposure apparatus 100 for printed wiring boards according to the first embodiment.

[0049] The third roller R3 around which the laminate 1 shown in FIG. 1 is wound is disposed at the first roller R1 in FIG.

[0050] In Fig. 5, the direction of rotation of the axis of the first roller R1 is, for example, counterclockwise. In other words, the direction of rotation of the axis of the first roller R1 in Fig. 5 is opposite to the direction of rotation of the axis of the first roller R1 in Fig. 1. In this way, the laminate 1 is transported from the first roller R1 to the third roller R3.

[0051] The structure of the laminate 1 at point A2 shown in FIG. 5 will be described. FIG. 6 is a schematic cross-sectional view of the laminate 1 at point A2 shown in FIG. 5. As shown in FIG. 6, the laminate 1 wound around the first roller R1 is a five-layer laminate in which a spacer 13a, a resist layer 11a, a substrate 10, a resist layer 11b, and a support layer 12b are stacked in this order. The first main surface 10a faces the inside of the first roller R1. In other words, the second main surface 10b faces the outside of the first roller R1. The resist layer 11a is exposed, and the resist layer 11b is not exposed.

[0052] When the resist layer 11b is exposed to light, the lubricant contained in the support layer 12b diffuses the light. As a result, chipping may occur in the resist layer 11b. Therefore, before the laminate 1 is transported to the exposure unit 4, the support layer 12b is taken up by the second roller R2. As shown in FIG. 5, the second roller R2 is disposed downstream of the first roller R1 and upstream of the exposure unit 4. The second roller R2 takes up the support layer 12a from the laminate 1 transported from the first roller R1.

[0053] Here, the spacer 13a may be wound by the seventh roller R7 from the laminate 1 conveyed from the first roller R1. As shown in Fig. 5, the seventh roller R7 is disposed downstream of the first roller R1 and upstream of the exposure unit 4.

[0054] Meanwhile, the laminate 1 with the support layer 12b and the spacers 13a wound up (a laminate with a three-layer structure in which the resist layer 11a, the substrate 10, and the resist layer 11b are stacked in this order) is transported to the exposure unit 4. The fourth roller R4 transports the laminate 1 with the support layer 12b and the spacers 13a wound up to the exposure unit 4.

[0055] The laminate 1 is transported to the exposure unit 4 so that the resist layer 11a faces the fourth roller R4. From a different perspective, the unexposed resist layer 11b is positioned farther from the fourth roller R4 than the substrate 10. In other words, the resist layer 11b is not in contact with the fourth roller R4. As a result, the laminate 1 is transported to the exposure unit 4 without the fourth roller R4 damaging the resist layer 11b before the exposure unit 4 exposes the resist layer 11b.

[0056] 7 is a schematic cross-sectional view of the laminate 1 taken at point B2 in FIG. 5. As shown in FIG. 5, the laminate 1 includes a substrate 10 and resist layers 11a and 11b. The second main surface 10b faces the light source 47. The first main surface 10a faces the stage 44. In other words, the projection lens 45, the mask 46, and the light source 47 are disposed in the region of the substrate 10 where the resist layer 11b is located.

[0057] 5, the projection lens 45 is disposed at a distance from the laminate 1. The mask 46 is disposed at a position farther from the laminate 1 than the projection lens 45. The light source 47 is disposed at a position farther from the laminate 1 than the mask 46. As a result, the mask 46 does not come into direct contact with the resist layer 11b, and therefore the resist layer 11b is not damaged.

[0058] The base 41, the stage moving unit 42, the lifting mechanism 43, and the stage 44 are arranged in an area where the resist layer 11a is located when viewed from the substrate 10. The laminate 1 transported from the fourth roller R4 is held by the stage 44 adsorbing the back surface (resist layer 11a) of the laminate 1.

[0059] Light is irradiated from the light source 47 onto the mask 46. A pattern is drawn on the mask 46. The projection lens 45 projects the pattern drawn on the mask 46 onto the second main surface 10b of the substrate 10. As a result, the circuit pattern is transferred to the resist layer 11b on the second main surface 10b of the substrate 10. In this way, the exposure unit 4 exposes the resist layer 11b.

[0060] Although the exposure apparatus 100 for printed wiring boards according to the present disclosure has been exemplified by a projection exposure method using the projection lens 45, a direct exposure method may also be used in which pre-created pattern data can be directly transferred to the photoresist on the substrate 10 without using the mask 46. Also, a proximity exposure method may be used in which a gap is provided between the mask 46 and the substrate 10 and exposure is performed without using the projection lens 45.

[0061] The laminate 1 with the resist layer 11b exposed is transported to the third roller R3. The sixth roller R6 transports the laminate 1 with the resist layer 11b exposed to the third roller R3.

[0062] The resist layer 11b is adhesive. Therefore, when the laminate 1 is wound up by the third roller R3, spacers 13b are placed on the resist layer 11b before the laminate 1 is conveyed to the third roller R3 to prevent the resist layer 11b from coming into contact with other components of the laminate 1. The fifth roller R5 delivers the spacers 13b to the laminate 1 conveyed from the sixth roller R6.

[0063] The configuration of the laminate 1 at point C2 shown in Fig. 5 will be described. Fig. 8 is a schematic cross-sectional view of the laminate 1 at point C2 shown in Fig. 5. The second main surface 10b faces the inside of the third roller R3. In other words, the first main surface 10a faces the outside of the third roller R3.

[0064] In this way, the laminate 1 has a four-layer structure in which the spacer 13b, resist layer 11b, substrate 10, and resist layer 11a are laminated in this order, and is taken up by the third roller R3. In this way, a printed wiring board can be obtained in which the resist layers 11a and 11b arranged on both sides of the substrate 10 are exposed.

[0065] <Tension controller operation> Next, a description will be given of the operation of the tension controller 3. Here, a description will be given of the operation of the tension controller 3 when the resist layer 11a on the first main surface 10a is exposed to light.

[0066] 1, tension controller 3 controls the torque applied to each of first roller R1, third roller R3, and third roller R4. Specifically, tension controller 3 controls the tension acting on support layer 12a when supporting layer 12a is wound up from laminate 1, based on the torque applied to each of first roller R1 and second roller R2. Tension controller 3 controls the tension acting on laminate 1 (a four-layer laminate in which resist layer 11a, substrate 10, resist layer 11b, and supporting layer 12b are stacked in this order) around which supporting layer 12a has been wound, based on the torque applied to each of first roller R1 and third roller R3.

[0067] In order to peel the support layer 12a from the resist layer 11a, it is necessary to peel it off with a force equal to or greater than the peel strength P. The peel strength P between the resist layer 11a and the support layer 12a is measured as follows.

[0068] The resist layer 11a and the support layer 12a on the resist layer 11a are cut into strips with a width of 20 mm. For example, double-sided tape is attached to a bake board. The surface of the resist layer 11a opposite to the surface on which the support layer 12a is disposed (the surface to be attached to the substrate 10) is attached to the double-sided tape. The peeling speed is set to 50 mm / min, and the support layer 12a is peeled off from the resist layer 11a in a direction 180 degrees to the adhesive surface where the resist layer 11a is attached to the double-sided tape. In this way, the peel strength P between the resist layer 11a and the support layer 12a is measured as the force applied when peeling the support layer 12a from the resist layer 11a.

[0069] Here, the peel strength P between the resist layer 11a and the support layer 12a is defined as a first value N1. The tension acting on the support layer 12a when the support layer 12a is wound up from the laminate 1 is defined as a second value N2. The tension acting on the laminate 1 with the support layer 12a wound up is defined as a third value N3.

[0070] The tension controller 3 controls the torques of the first roller R1, the third roller R3, and the second roller R2 so that the first value N1 is smaller than each of the second value N2 and the third value N3. In this way, the support layer 12a is smoothly wound from the laminate 1 before the laminate 1 is transported to the exposure unit 4. Furthermore, the support layer 12a wound from the laminate 1 is not wound in the transport direction of the laminate 1. Furthermore, the laminate 1 with the support layer 12a wound around it is not wound in the transport direction of the support layer 12a.

[0071] The tension controller 3 may control the torque applied to the second roller R2 in consideration of the winding diameter of the support layer 12a around the second roller R2, and in this manner, the second value N2 may be controlled.

[0072] The tension controller 3 may control the torque applied to the third roller R3 in consideration of the winding diameter of the laminate 1 at the third roller R3, and in this manner, the third value N3 may be controlled.

[0073] For example, when the second value N2 is the first reference value Ts of the tension acting on the support layer 12a when winding the support layer 12a from the laminate 1, and the third value N3 is the second reference value Tp of the tension acting on the laminate 1 from which the support layer 12a has been wound, the formulas (1) and (2) are satisfied.

[0074]

number

[0075]

number

[0076] The peel strength P between the resist layer 11a and the support layer 12a may be, for example, 0.001 N / cm or more and 0.3 N / cm or less. The first reference value Ts may be, for example, 0.01 N / cm or more and 2.0 N / cm or less. The second reference value Tp may be, for example, 0.01 N / cm or more and 2.0 N / cm or less.

[0077] When the support layer 12a is peeled off from the laminate 1, the amount of static electricity contained in the support layer 12a and the amount of static electricity contained in the laminate 1 change. As a result, the effective peel strength P between the resist layer 11a and the support layer 12a changes. Therefore, the tension controller 3 may control the second value N2 and the third value N3 based on the amount of static electricity in the support layer 12a taken up by the second roller R2 and the amount of static electricity in the laminate 1 around which the support layer 12a is taken up.

[0078] As shown in FIG. 1, the first electrostatic sensor 2a is disposed between the first roller R1 and the second roller R2. The first electrostatic sensor 2a measures the amount of static electricity in the support layer 12a being wound by the second roller R2. The second electrostatic sensor 2b is disposed between the first roller R1 and the fourth roller R4. The second electrostatic sensor 2b measures the amount of static electricity in the laminate 1 around which the support layer 12a is wound. The second electrostatic sensor 2b may be disposed between the fourth roller R4 and the exposure unit 4, between the exposure unit 4 and the sixth roller R6, or between the sixth roller R6 and the third roller R3.

[0079] The first electrostatic sensor 2a calculates a first measurement voltage X based on the amount of static electricity in the support layer 12a wound around the second roller R2. The second electrostatic sensor 2b calculates a second measurement voltage Y based on the amount of static electricity in the laminate 1 around which the support layer 12a is wound. The units of the first measurement voltage X and the second measurement voltage Y are kV.

[0080] When the first measurement voltage X is a positive value, the second measurement voltage Y is a negative value. On the other hand, when the second measurement voltage Y is a positive value, the first measurement voltage X is a negative value. The first measurement voltage X and the second measurement voltage Y depend on the measurement distance to the object whose amount of static electricity is to be measured. Therefore, the first measurement voltage X and the second measurement voltage Y may be corrected based on the measurement distance measured using the distance sensor.

[0081] As described above, the second value N2 and the third value N3 are controlled by the tension controller 3 based on the amounts of static electricity measured by the first electrostatic sensor 2a and the second electrostatic sensor 2b so as to satisfy the formulas (3) and (4).

[0082]

number

[0083]

number

[0084] Each of the first coefficient A1 and the second coefficient A2 may be equal to or greater than 0.01 N / (cm·kV) and equal to or less than 0.5 N / (cm·kV).

[0085] In this way, even if the substantial peel strength P between the resist layer 11a and the support layer 12a changes, the support layer 12a taken up from the laminate 1 will not be rolled up in the conveyance direction of the laminate 1. Furthermore, the laminate 1 with the support layer 12a taken up will not be rolled up in the conveyance direction of the support layer 12a.

[0086] When the resist layer 11b on the second main surface 10b is exposed, the second value N2 and the third value N3 are controlled by the tension controller 3 in a similar manner.

[0087] (Second embodiment) Next, a method for manufacturing a printed wiring board according to the second embodiment will be described.

[0088] Fig. 9 is a flow diagram schematically illustrating a method for manufacturing a printed wiring board according to the second embodiment. As shown in Fig. 9, the method for manufacturing a printed wiring board according to the second embodiment mainly includes a step (S1a) of feeding out a laminate from a first roller, a step (S2a) of winding up the support layer from the laminate, a step (S3a) of exposing the resist layer, a step (S4a) of feeding out a spacer, and a step (S5a) of winding up the laminate around a second roller.

[0089] First, a step (S1a) of feeding the laminate from a first roller is performed. For example, the laminate 1 shown in FIG. 2 is wound in a roll shape around the first roller R1. The first roller R1 feeds the laminate 1. The laminate 1 fed from the first roller R1 is transported to an exposure unit 4.

[0090] Next, a step (S2a) of winding up the support layer from the laminate is carried out. The second roller R2 winds up the support layer 12a from the laminate 1 conveyed from the first roller R1. As a result, the support layer 12a is wound up by the second roller R2 before the laminate 1 is conveyed to the exposure unit 4, so that when the resist layer 11a is exposed, diffuse reflection of light due to the lubricant contained in the support layer 12a does not occur. As a result, chipping does not occur in the resist layer 11a, and circuit defects caused by such chipping do not occur.

[0091] The fourth roller R4 may be disposed downstream of the first roller R1 and upstream of the exposure unit 4. The fourth roller R4 transports the laminate 1 with the support layer 12a wound thereon from the first roller R1 to the exposure unit 4. The resist layer 11a may not be in contact with the fourth roller R4. As a result, the laminate 1 is transported to the exposure unit 4 without the fourth roller R4 damaging the resist layer 11a before the exposure unit 4 exposes the resist layer 11a.

[0092] Next, the step (S3a) of exposing the resist layer is carried out. In the laminate 1 conveyed from the first roller R1, the exposure unit 4 exposes the resist layer 11a.

[0093] Next, a spacer feeding step (S4a) is performed. Before the laminate 1 is transported from the exposure unit 4 to the third roller R3, spacers 13a are placed on the resist layer 11a. The fifth roller R5 feeds the spacers 13a to the laminate 1 being transported from the sixth roller R6.

[0094] Next, a step (S5a) of winding the laminate onto a second roller is carried out. The laminate 1 with the support layer 12a wound thereon is then wound onto a third roller R3.

[0095] In this manner, using the printed wiring board exposure apparatus 100, the laminate 1 can be obtained as a printed wiring board that is free from circuit defects caused by chipping of the resist layer 11a.

[0096] The method for manufacturing a printed wiring board using the exposure apparatus 100 for printed wiring boards has been described above when exposing the resist layer 11a on the first main surface 10a of the substrate 10. However, when exposing the resist layer 11b on the second main surface 10b of the substrate 10, the method for manufacturing a printed wiring board according to the second embodiment may further include a step (S1b) of feeding the laminate from the first roller, a step (S2b) of winding the support layer from the laminate, a step (S3b) of exposing the resist layer, a step (S4b) of feeding the spacer, and a step (S5b) of winding the laminate around the second roller.

[0097] First, a step (S1b) of feeding the laminate from the first roller is carried out. The third roller R3, on which the laminate 1 shown in FIG. 1 is wound, is placed on the first roller R1 shown in FIG. 5. The laminate 1 shown in FIG. 6 is wound in a roll shape around the first roller R1. The first roller R1 feeds the laminate 1. The laminate 1 fed from the first roller R1 is transported to the exposure unit 4.

[0098] Next, a step (S2b) of winding up the support layer from the laminate is carried out. The second roller R2 winds up the support layer 12b from the laminate 1 conveyed from the first roller R1. As a result, since the support layer 12b is wound up by the second roller R2 before the laminate 1 is conveyed to the exposure unit 4, diffuse reflection of light due to the lubricant contained in the support layer 12b does not occur when the resist layer 11b is exposed. As a result, no chipping occurs in the resist layer 11b, and circuit defects caused by such chipping do not occur. Note that the spacer 13a may also be wound up from the laminate 1 conveyed from the first roller R1.

[0099] The fourth roller R4 may be disposed downstream of the first roller R1 and upstream of the exposure unit 4. The fourth roller R4 transports the laminate 1, on which the spacer 13a and the support layer 12b are wound, from the first roller R1 to the exposure unit 4. The resist layer 11b may not be in contact with the fourth roller R4. As a result, the laminate 1 is transported to the exposure unit 4 without the fourth roller R4 damaging the resist layer 11b before the exposure unit 4 exposes the resist layer 11b.

[0100] Next, the step (S3b) of exposing the resist layer is carried out. In the laminate 1 conveyed from the first roller R1, the exposure unit 4 exposes the resist layer 11b.

[0101] Next, a spacer feeding step (S4b) is performed. Before the laminate 1 is transported from the exposure unit 4 to the third roller R3, the spacers 13b are placed on the resist layer 11b. The fifth roller R5 feeds the spacers 13b to the laminate 1 being transported from the sixth roller R6.

[0102] Next, a step (S5b) of winding the laminate onto a second roller is carried out. The laminate 1 with the support layer 12b wound thereon is then wound onto a third roller R3.

[0103] In this way, using the exposure apparatus 100 for printed wiring boards, the laminate 1 can be obtained as a printed wiring board that does not suffer from circuit defects caused by chipping of the resist layers 11a and 11b on both sides of the substrate 10.

[0104] (Third embodiment) <Printed wiring board exposure equipment> Next, the configuration of a printed wiring board exposure apparatus 100 according to a third embodiment will be described. The printed wiring board exposure apparatus 100 according to the third embodiment differs from the printed wiring board exposure apparatus 100 according to the first embodiment mainly in that there is no resist layer 11b or support layer 12b on the second main surface 10b of the substrate 10, but in other respects it is similar to the printed wiring board exposure apparatus 100 according to the first embodiment. Below, the configuration that differs from the printed wiring board exposure apparatus 100 according to the first embodiment will be mainly described.

[0105] Fig. 10 is a schematic side view of a printed wiring board exposure apparatus 100 according to a third embodiment. Fig. 11 is a schematic cross-sectional view of the laminate at point A1 shown in Fig. 10. As shown in Fig. 10, the exposure apparatus 100 does not necessarily have the seventh roller R7.

[0106] 11, the laminate 1 wound around the first roller R1 includes a substrate 10, a resist layer 11a, and a support layer 12a. The resist layer 11a is on the first main surface 10a. The support layer 12a is on top of the resist layer 11a. Thus, in the exposure apparatus 100 according to the third embodiment, the laminate 1 at point A1 is a three-layer laminate in which the support layer 12a, the resist layer 11a, and the substrate 10 are stacked in this order.

[0107] The support layer 12a is taken up by the second roller R2 before the laminate 1 is transported to the exposure unit 4. Meanwhile, the laminate 1 with the support layer 12a taken up (a two-layer laminate in which the resist layer 11a and the substrate 10 are laminated in this order) is transported to the exposure unit 4. The fourth roller R4 transports the laminate 1 with the support layer 12a taken up to the exposure unit 4.

[0108] The laminate 1 is transported to the exposure unit 4 so that the second main surface 10b of the substrate 10 faces the fourth roller R4. That is, the resist layer 11a is not in contact with the fourth roller R4. As a result, the laminate 1 is transported to the exposure unit 4 without the fourth roller R4 damaging the resist layer 11a before the exposure unit 4 exposes the resist layer 11a.

[0109] Fig. 12 is a schematic cross-sectional view of the laminate 1 taken at point B1 in Fig. 10. As shown in Fig. 12, the laminate 1 includes a substrate 10 and a resist layer 11a.

[0110] The substrate 10 of the laminate 1 transported from the fourth roller R4 is held by the stage 44. The stage 44 holds the substrate 10 flat while adsorbing it. The exposure unit 4 exposes the resist layer 11a. Because the support layer 12a is taken up by the second roller R2 before the laminate 1 is transported to the exposure unit 4, diffuse reflection of light due to the lubricant contained in the support layer 12a does not occur when the exposure unit 4 exposes the resist layer 11a. As a result, chips do not occur in the resist layer 11a, and circuit defects caused by such chips do not occur.

[0111] The laminate 1 with the resist layer 11a exposed is transported to the third roller R3. The sixth roller R6 may transport the laminate 1 with the resist layer 11a exposed to the third roller R3.

[0112] Before the laminate 1 is conveyed to the third roller R3, spacers 13a are placed on the resist layer 11a. The fifth roller R5 delivers the spacers 13a to the laminate 1 conveyed from the sixth roller R6.

[0113] Fig. 13 is a schematic cross-sectional view of the laminate 1 taken up at point C1 in Fig. 10. The first main surface 10a faces the inside of the third roller R3. That is, the second main surface 10b faces the outside of the third roller R3. In this way, the laminate 1 has a three-layer structure in which the spacer 13a, the resist layer 11a, and the substrate 10 are stacked in this order, and is taken up by the third roller R3.

[0114] In this way, an in-process printed wiring board can be obtained in which resist layer 11a arranged on first main surface 10a of substrate 10 is exposed.

[0115] Next, the effects of the exposure apparatus 100 for printed wiring boards according to the present disclosure will be described. A roll-to-roll exposure apparatus 100 for printed wiring boards exposes resist layers 11a and 11b arranged on a substrate 10. However, if a support layer 12a is present on the resist layer 11a during exposure, the lubricant contained in the support layer 12a will cause diffuse reflection of light. As a result, chips may occur in the resist layer 11a. If chips occur in the resist layer 11a, circuit defects will occur due to the chips.

[0116] The printed wiring board exposure apparatus 100 according to the present disclosure includes a first roller R1, an exposure unit 4, a second roller R2, and a third roller R3. The first roller R1 feeds out a laminate 1 including a substrate 10, a resist layer 11a, and a support layer 12a. The resist layer 11a is on the substrate 10. The support layer 12a is on the resist layer 11a. The exposure unit 4 is located downstream of the first roller R1 and exposes the resist layer 11a. The second roller R2 is located upstream of the exposure unit 4 and winds up the support layer 12a from the laminate 1. The third roller R3 is located downstream of the exposure unit 4 and winds up the laminate 1 with the wound support layer 12a. Because the support layer 12a is wound up from the laminate 1 before the laminate 1 is transported to the exposure unit 4, diffuse reflection of light due to the lubricant contained in the support layer 12a is not generated during exposure. As a result, chipping does not occur in the resist layer 11a.

[0117] According to the printed wiring board exposure apparatus 100 of the present disclosure, the peel strength P between the resist layer 11a and the support layer 12a may be set to a first value N1. The tension acting on the support layer 12a when winding the support layer 12a from the laminate 1 may be set to a second value N2. The tension acting on the laminate 1 around which the support layer 12a has been wound may be set to a third value N3. The first value N1 may be smaller than both the second value N2 and the third value N3. This allows the support layer 12a to be smoothly wound from the laminate 1 before the laminate 1 is transported to the exposure unit 4. Furthermore, the support layer 12a wound from the laminate 1 is not wound in the transport direction of the laminate 1. Furthermore, the laminate 1 around which the support layer 12a has been wound is not wound in the transport direction of the support layer 12a.

[0118] The exposure apparatus 100 for printed wiring boards according to the present disclosure may include a first electrostatic sensor 2a and a second electrostatic sensor 2b. The first electrostatic sensor 2a may measure the amount of static electricity in the support layer 12a being wound around the second roller R2. The second electrostatic sensor 2b may measure the amount of static electricity in the laminate 1 around which the support layer 12a has been wound. This allows the support layer 12a to be smoothly wound around the laminate 1 before the laminate 1 is transported to the exposure unit 4. Furthermore, the support layer 12a wound around the laminate 1 is prevented from being wound up in the transport direction of the laminate 1. Furthermore, the laminate 1 around which the support layer 12a has been wound up is prevented from being wound up in the transport direction of the support layer 12a.

[0119] According to the exposure apparatus 100 for printed wiring boards of the present disclosure, the second value N2 and the third value N3 may be controlled based on the amounts of static electricity measured by the first electrostatic sensor 2a and the second electrostatic sensor 2b. This allows the support layer 12a to be smoothly wound up from the laminate 1 before the laminate 1 is transported to the exposure unit 4. Furthermore, the support layer 12a wound up from the laminate 1 is prevented from being wound up in the transport direction of the laminate 1. Furthermore, the laminate 1 with the support layer 12a wound up around it is prevented from being wound up in the transport direction of the support layer 12a.

[0120] The printed wiring board exposure apparatus 100 according to the present disclosure may include a fourth roller R4. The fourth roller R4 may be arranged upstream of the exposure unit 4 and downstream of the first roller R1. The fourth roller R4 may change the direction in which the laminate 1 is transported. The resist layer 11a may not be in contact with the fourth roller R4. This prevents the fourth roller R4 from scratching the resist layer 11a.

[0121] The printed wiring board exposure apparatus 100 according to the present disclosure may include a fifth roller R5. The fifth roller R5 may be disposed downstream of the exposure unit 4. The fifth roller R5 may deliver spacers 13a onto the resist layer 11a. This prevents the resist layer 11a from coming into contact with other components of the laminate 1 when the laminate 1 is taken up by the third roller R3.

[0122] The method for manufacturing a printed wiring board according to the present disclosure may use the above-described exposure apparatus for a printed wiring board 100. This makes it possible to obtain a printed wiring board that is free from circuit defects caused by chipping of the resist layer 11a.

[0123] In the printed wiring board obtained by the printed wiring board manufacturing method according to the present disclosure, a circuit pattern may be formed using a subtractive method, a semi-additive method, a full-additive method, or the like, and it is more effective to use a semi-additive method or a full-additive method, which are more susceptible to the shape of defects in the resist layers 11a and 11b.

[0124] The embodiments and examples disclosed herein are illustrative in all respects and should not be considered limiting. The scope of the present disclosure is defined by the claims, not the above description, and is intended to include any modifications within the scope of the claims and meanings equivalent to the claims. [Explanation of symbols]

[0125] 1. Laminate 2a First electrostatic sensor 2b Second electrostatic sensor 3 Tension Controller 4 Exposure section 10 Substrate 10a First principal surface 10b Second principal surface 11a Resist layer 11b Resist layer 12a Support layer 12b Support layer 13a Spacer 13b Spacer 41 Mounting stand 42 Stage moving part 43 Lifting mechanism 44 Stages 45 Projection Lens 46 Mask 47 Light source 100 Exposure device for printed wiring boards A1 First coefficient A2 Second coefficient N1 First value N2 Second value N3 Third value P Peel strength R1 First roller R2 Second roller R3 Third roller R4 4th roller R5 5th Roller R6 6th Roller R7 7th Roller Tp second standard value Ts First standard value X First measurement voltage Y Second measurement voltage

Claims

1. a first roller that delivers a laminate including a substrate, a resist layer on the substrate, and a support layer on the resist layer; an exposure unit that is disposed downstream of the first roller and exposes the resist layer; a second roller disposed upstream of the exposure unit and configured to wind up the support layer from the laminate; a third roller disposed downstream of the exposure unit and configured to wind up the laminate on which the support layer is wound.

2. a peel strength between the resist layer and the support layer is a first value; a tension acting on the support layer when the support layer is wound up from the laminate is set to a second value; When the tension acting on the laminate with the support layer wound thereon is a third value, 2. The exposure apparatus for a printed wiring board according to claim 1, wherein said first value is smaller than said second value and said third value.

3. a first static electricity sensor that measures the amount of static electricity in the support layer being wound by the second roller; 3. The exposure apparatus for a printed wiring board according to claim 2, further comprising: a second static electricity sensor for measuring the amount of static electricity in the laminate on which the support layer is wound.

4. 4. The exposure apparatus for a printed wiring board according to claim 3, wherein the second value and the third value are controlled based on the amounts of static electricity measured by the first electrostatic sensor and the second electrostatic sensor.

5. a fourth roller disposed upstream of the exposure unit and downstream of the first roller; the fourth roller changes the direction in which the laminate is conveyed, 5. The exposure apparatus for a printed wiring board according to claim 1, wherein the resist layer is not in contact with the fourth roller.

6. a fifth roller disposed downstream of the exposure unit; 5. The exposure apparatus for a printed wiring board according to claim 1, wherein the fifth roller delivers spacers onto the resist layer.

7. A method for manufacturing a printed wiring board, using the exposure apparatus for a printed wiring board according to any one of claims 1 to 4.

8. A method for manufacturing a printed wiring board, using the exposure apparatus for a printed wiring board according to claim 5.

9. A method for manufacturing a printed wiring board, using the exposure apparatus for a printed wiring board according to claim 6.

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