Liquid-cooled radiator integrated with both liquid pump bi-circulation

Abstract

To provide a liquid-cooled radiator integrated with both liquid pump bi-circulation.SOLUTION: A liquid-cooled radiator integrated with both liquid pump bi-circulation includes a heat-radiation parallel pipe 100, two liquid pumps 40, and a liquid-cooled head 50. The heat-radiation parallel pipe has two sets of liquid circulation flow systems. The two liquid pumps are used to encourage liquid in both sets of liquid circulation flow systems to be able to circulate independently. The liquid cooling head is coupled to a bottom part of the heat-radiation parallel pipe to allow all of the liquid in the liquid circulation flow system of both sets of the heat-radiation parallel pipes to flow into the liquid cooling head to provide cooling to a processor and to carry the heat of the processor to a parallel pipe assembly 30 to dissipate the heat.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to the technical field of liquid cooling radiators, and more particularly to a dual-liquid pump, dual-circulation integrated liquid cooling radiator that is installed on a processor to perform cooling. [Background technology]

[0002] There are two types of radiators for computer processors: air-cooled radiators and liquid-cooled radiators. The liquid-cooled head (cold plate) of a liquid-cooled radiator is attached to cover the surface of the processor, and the cold liquid passes through the liquid-cooled head to remove heat during operation of the processor. The heated hot liquid is then circulated through a heat-dissipating parallel pipe (radiator), where it dissipates heat and cools down, becoming cold liquid, which then flows back to the liquid-cooled head, thereby achieving higher cooling and heat dissipation efficiency than an air-cooled radiator.

[0003] Conventional all-in-one liquid cooling radiators have the advantages of being relatively small in volume and easy to install, and as shown in Patent Documents 1 and 2, for example, they have a liquid pump attached to a heat dissipation parallel pipe and a liquid cooling head attached to the bottom of the heat dissipation parallel pipe. When they are installed in a computer, the liquid cooling head is attached to the surface of the processor, and the liquid pump is used to circulate the internal liquid through the liquid cooling head, thereby achieving the functions of cooling and dissipating heat from the processor. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Chinese Patent No. 116931698(B) Specification [Patent Document 2] Taiwan Patent Application Publication No. 202347085(A) Summary of the Invention [Problem to be solved by the invention]

[0005] When a liquid cooling radiator is in operation, it can only cool the processor by relying on a liquid pump to circulate the liquid through the liquid cooling head. As the liquid pump ages, its rotation speed slows, reducing its cooling and heat dissipation efficiency, something that users often fail to realize. If the liquid pump fails completely, the entire liquid cooling radiator will no longer function, making it impossible to power on the computer. Therefore, the challenge the present invention actively addresses is how to ensure that the entire liquid cooling radiator continues to operate even when the liquid pump in the liquid cooling radiator ages or fails, thereby avoiding user inconvenience or computer failure. The present invention has been made in light of the above, and its objective is to provide a liquid cooling radiator. [Means for solving the problem]

[0006] To solve the problems of the prior art, the dual liquid pump dual circulation integrated liquid cooling radiator provided by the present invention provides a preferred technical solution through the dual circulation flow path structure of the heat dissipation parallel pipe and the dual liquid pump design. The two liquid pumps independently circulate the liquid in the dual circulation flow paths of the heat dissipation parallel pipe to reach the liquid cooling head at the bottom, thereby simultaneously cooling and dissipating heat for the processor.

[0007] At the same time, through the design of the flow path structure inside the liquid cooling head, the present invention allows both liquid pumps to independently circulate the liquid and encourage it to flow into the liquid cooling head, and the liquids can be mixed together when they flow into the liquid cooling head, which is used to cool and dissipate heat for the processor. [Effects of the Invention]

[0008] During the use of the present invention, even if one of the liquid pumps slows down due to aging or fails completely, another liquid pump can still be used to continue operating the integrated liquid cooling radiator, ensuring that the liquid cooling radiator has the functions of cooling and heat dissipation.

[0009] The flow path structure design inside the liquid cooling head of the present invention allows the cooling liquid to circulate evenly throughout the inside of the liquid cooling head, and both liquid circulation systems jointly achieve the functions of cooling and heat dissipation for the processor.

[0010] The present invention uses two liquid pump designs to improve the flow rate and volume of liquid passing through the liquid cooling head, effectively solving the cooling efficiency issues required when overclocking or operating at high speeds on a processor. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a perspective view showing a preferred embodiment of the present invention; [Figure 2] 1 is an exploded perspective view showing a preferred embodiment of the present invention; [Figure 3] 1 is an exploded perspective view showing a preferred embodiment of the present invention; [Figure 4] 1 is a front cross-sectional view showing a preferred embodiment of the present invention. [Figure 5] FIG. 2 is an exploded perspective top view showing the first fluid box and two fluid pumps of the present invention. [Figure 6] FIG. 2 is an exploded bottom perspective view showing the first fluid box and two fluid pumps of the present invention. [Figure 7] 1 is an exploded perspective view showing a liquid pump according to the present invention; [Figure 8] FIG. 2 is an exploded perspective view showing the second liquid box and liquid cooling head of the present invention. [Figure 9] 1 is an exploded perspective view showing a liquid cooling head according to the present invention; [Figure 10] FIG. 2 is a diagram showing the internal flow path of the liquid-cooled head body of the present invention. [Figure 11]1 is a plan view showing a liquid-cooled head according to the present invention; [Figure 12] FIG. 10 is a side cross-sectional view showing how the cooling liquid in the second liquid box of the present invention flows into the liquid cooling head. [Figure 13] FIG. 10 is a side cross-sectional view showing the flow of thermal liquid into the second liquid box in the liquid cooling head of the present invention. [Figure 14] FIG. 2 is a plan view showing a circular parallel pipe insertion hole of the present invention. [Figure 15] FIG. 2 is a plan view showing an oval parallel pipe insertion hole of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] As shown in Figures 1 and 2, the dual liquid pump dual circulation integrated liquid cooling radiator of the present invention is mounted on a computer processor for cooling and heat dissipation. A preferred embodiment of the liquid cooling radiator includes a heat dissipation parallel pipe 100, two liquid pumps 40, and a liquid cooling head 50. Fans 70 can be connected to one or both sides of the heat dissipation parallel pipe 100 to dissipate heat.

[0013] 3 and 4, the heat-dissipating parallel pipe 100 includes a first liquid box 10, a second liquid box 20, and a parallel pipe assembly 30, all made of an aluminum alloy. Referring to FIGS. 5 and 6, the interior of the first liquid box 10 is divided into four cavities, specifically, into two first cavities 12 via a first partition plate 11. A second partition plate 13 is installed within each first cavity 12, dividing the cavity 12 into a liquid inlet chamber 14 and a liquid outlet chamber 15. The first partition plate 11 and the second partition plate 13 are preferably welded to the inner wall of the first liquid box 10, thereby forming two liquid inlet chambers 14 and two liquid outlet chambers 15 arranged side by side. Of these, a liquid pump base 16 is formed in each first cavity 12, and each liquid pump base 16 has a liquid pump chamber 161, a liquid inlet hole 162 communicating with the liquid pump chamber 161 and the liquid inlet chamber 14, and a liquid outlet hole 163 communicating with the liquid pump chamber 161 and the liquid outlet chamber 15, and each second partition plate 13 has a recess 131, which matches the surface of the liquid pump base 16.

[0014] 5 and 6, more specifically, the first liquid box 10 is composed of a rectangular first box body 17 and a first box lid 18. The first partition plate 11 and both second partition plates 13 are placed into the first box body 17 from the open end, and the edges of the first partition plate 11 and the second partition plate 13 are welded to the inner wall of the first box body 17. The bottom wall of the first box body 17 is provided with a number of parallel pipe insertion holes 171, which are rectangular holes, circular holes (see FIG. 14), or elliptical holes (see FIG. 15). The first box lid 18 covers the opening of the first box body 17. The liquid pump base 16 is provided on the inner surface of the first box lid 18, and a liquid pump chamber 161 recessed into the liquid pump base 16 is provided on the outer surface of the first box lid 18. Of these, the liquid pump base 16 is preferably integrally molded with or assembled to the inner wall of the first cavity 12 of the first liquid box 10, and the liquid pump chamber 161 is recessed into the liquid pump base 16 from the outer surface of the first liquid box 10. The liquid inlet hole 162 is a circular hole located in the center of the liquid pump chamber 161 and is connected to the liquid inlet chamber 14, and the liquid outlet hole 163 is located on one side of the liquid pump chamber 161 and is connected to the liquid outlet chamber 15. In addition, the first box lid 18 is provided with a liquid inlet hole 181 and a screw used to close the liquid inlet hole 181, so that the coolant can be injected into the heat-dissipating parallel pipe 100 through the liquid inlet hole 181.

[0015] 4 and 8, the interior of the second liquid box 20 is also divided into four cavities, specifically, into two second cavities 22 via a third partition plate 21, and a fourth partition plate 23 is installed within each second cavity 22 to divide it into a hot liquid chamber 24 and a cold liquid chamber 25. The third partition plate 21 and the fourth partition plate 23 are welded to the inner wall of the second liquid box 20, thereby forming two hot liquid chambers 24 and two cold liquid chambers 25. Of these, the hot liquid chamber 24 is provided with at least one first hot liquid outlet 241 (both front and rear first hot liquid outlets 241 as shown in the figure) that communicates with the liquid cooling head 50, and a first cold liquid outlet 251 that communicates with the liquid cooling head 50 is provided in the middle of the cold liquid chamber 25. Specifically, the second liquid box 20 is composed of a rectangular second box body 26 and a second box lid 27. The third partition plate 21 and both fourth partition plates 23 are placed into the second box body 26 from the open end, and the edges of the third partition plate 21 and the fourth partition plate 23 are welded to the inner wall of the second box body 26. A first hot liquid outlet 241 and a first cold liquid inlet 251 are provided in the bottom wall of the second box body 26. The second box lid 27 covers the opening of the second box body 26, and a number of parallel pipe insertion holes 271 are provided in the top wall of the second box lid 27. The parallel pipe insertion holes 271 are rectangular, circular, or elliptical.

[0016] 3 and 4, the parallel pipe assembly 30 includes a number of first parallel pipes 31, a number of second parallel pipes 32, and a number of heat dissipation fins 33. One end of each of the first parallel pipes 31 is inserted into a selected parallel pipe insertion hole 171 of the first liquid box 10, connecting it to the liquid inlet chambers 14 of both first cavities 12, and the other end is inserted into a selected parallel pipe insertion hole 271 of the second liquid box 20, connecting it to the thermal liquid chambers 24 of both second cavities 22. One end of each of the second parallel pipes 32 is inserted into the other parallel pipe insertion holes 171 of the first liquid box 10, connecting it to the liquid outlet chambers 15 of both first cavities 12, and the other end is inserted into the other parallel pipe insertion holes 271 of the second liquid box 20, connecting it to the coolant chambers 25 of both second cavities 22. Thus, in the present invention, the two liquid circulation systems composed of the heat dissipation parallel pipes 100 convert the liquid in each liquid circulation system into hot liquid, which cools the processor as it flows through the liquid cooling head 50. The hot liquid dissipates heat through a cycle consisting of the first parallel pipe 31 and the second parallel pipe 32, becoming coolant, and then re-enters the liquid cooling head 50, cooling and dissipating heat through this circulating flow. The first parallel pipe 31 and the second parallel pipe 32 are pipes with rectangular cross sections corresponding to the parallel pipe insertion holes 171, 271, but may also be pipes with circular or elliptical cross sections.

[0017] 4 to 7, two liquid pumps 40 are respectively installed in the liquid pump chambers 161 of the two first cavities 12 of the heat dissipation parallel pipe 100, and the two liquid pumps 40 are used to independently circulate the liquid in the two liquid circulation systems of the heat dissipation parallel pipe 100. A specific flow circuit is shown in FIG. 12, in which the coolant passing through the liquid cooling head 50 cools the processor and becomes hot liquid, which then flows into the two hot liquid chambers 24 of the second liquid box 20, passes through the multiple first parallel pipes 31 again, and flows to the two liquid inlet chambers 14 of the first liquid box 10. The liquid pump 40 again sucks the liquid into the liquid pump chamber 161 via the liquid inlet hole 162, and then pushes it again into both liquid outlet chambers 15 via the liquid outlet holes 163.The liquid then passes through the multiple second parallel pipes 32 again and flows into both cold liquid chambers 25 of the second liquid box 20, and the hot liquid passes through the first parallel pipe 31 and the second parallel pipe 32 of the parallel pipe assembly 30 to dissipate heat and become cold liquid, which then re-enters the liquid cooling head 50 to cool the processor.

[0018] 7, the preferred embodiment of the liquid pump 40 includes a liquid pump casing 41, a stator 42, and a rotor 43. The liquid pump casing 41 includes an end cap 411 that is screwed into the recess 19 on the outer surface of the first liquid box 10 to seal the liquid pump chamber 161. The liquid pump casing 41 includes an annular chamber 412 on its outer surface and a rotor chamber 413 on its inner surface. The annular chamber 412 is connected to the rotor chamber 413. The stator 42 is installed in the annular chamber 412 of the liquid pump casing 41 and includes a motor coil 421 that drives the rotor 43. The rotor 43 is rotatably installed in the rotor chamber 413 and has a number of fan blades 431 protruding outside the rotor chamber 413, and the fan blades 431 can be rotated into the liquid pump chamber 161, allowing the liquid in the liquid inlet chamber 14 to be sucked in through the liquid inlet hole 162 and then pushed into both liquid outlet chambers 15 again through the liquid outlet hole 163.

[0019] 9 to 11, the liquid cooling head 50 is an element used to contact and cool a processor, and includes a liquid cooling head main body 51 and a heat dissipation base 52. The liquid cooling head main body 51 is fixed to the bottom surface of the second liquid box 20 via screws, and the bottom surface of the liquid cooling head main body 51 is provided with an upwardly recessed liquid chamber 511, two second cooling liquid inlets 512 that respectively communicate with the two first cooling liquid inlets 251, and two second hot liquid outlets 513 that respectively communicate with the two first hot liquid outlets 241. The heat dissipation base 52 has a bottom plate 521 and a number of micro-channels 522 formed on the top surface of the bottom plate 521. The bottom plate 521 is fastened to the bottom surface of the liquid-cooled head main body 51 via screws, and seals and closes the liquid chamber 511, positioning the numerous micro-channels 522 within the liquid chamber 511, enabling balanced cooling (heat exchange) with the cooling liquid flowing through the micro-channels 522.

[0020] The liquid cooling head 50 preferably further includes a liquid partition plate 53, which is installed in the liquid chamber 511 of the liquid cooling head body 51. The liquid partition plate 53 has strip-shaped through-holes 531 at the middle and both sides thereof, and the flow directions of the above-mentioned multiple micro-channels 522 are perpendicular to the strip-shaped through-holes 531, so that the cooling liquid flows evenly through the strip-shaped through-holes 531 in the middle of the liquid partition plate 53 into the center of the multiple micro-channels 522, and then passes through the multiple micro-channels 522 again and flows toward the both sides toward the strip-shaped through-holes 531 on both sides of the liquid partition plate 53, thereby achieving the effect of cooling the heat dissipation base 52 sufficiently and evenly. The top wall of the liquid chamber 511 of the liquid cooling head main body 51 has a downward protrusion 514, and a strip-shaped groove 515 is recessed upward into the protrusion 514. Both second cooling liquid inlets 512 are connected to the strip-shaped groove 515, and a continuous annular flow passage 516 is formed between the periphery of the protrusion 514 and the four inner walls of the liquid chamber 511. Both second hot liquid outlets 513 are connected to the annular flow passage 516.

[0021] Referring to Figures 4 and 12, when the liquid flows, the cold liquid in both cold liquid chambers 25 of the second liquid box 20 passes through the first cold liquid inlet 251 and the second cold liquid inlet 512 respectively and enters the liquid chamber 511 of the liquid cooling head 50, and the cold liquid again flows through the strip-shaped through-holes 531 and the middle strip-shaped through-holes 531 of the liquid partition plate 53 into the multiple micro-channels 522 on the heat dissipation base 52, and becomes hot liquid used to cool (exchange heat) the processor. Referring again to Figure 13, the hot liquid flows to the surrounding annular flow passage 516, then again flows through both second hot liquid outlets 513 to the hot liquid chambers 24 of the second liquid box 20, and then flows through the above-mentioned multiple first parallel pipes 31 to the first liquid box 10, and again flows through the multiple second parallel pipes 32 to the two cold liquid chambers 25 of the second liquid box 20 (see Figures 4 and 12), thereby completing one cycle including cooling and heat dissipation.

[0022] 1 to 3, two outer casings 60 are provided between the first fluid box 10 and the second fluid box 20 of the heat-dissipating parallel pipe 100, and the two outer casings 60 are located on either side of the parallel pipe assembly 30. Fans 70 may be fastened between the two outer casings 60 on the front and rear sides of the heat-dissipating parallel pipe 100, respectively, so that air is blown through the parallel pipe assembly 30 by the fans 70 and passes through the first parallel pipe 31 and the second parallel pipe 32, thereby enabling rapid heat dissipation.

[0023] When the present invention is used, the two liquid pumps 40 circulate the liquid in the two liquid circulation systems of the heat dissipation parallel pipe 100, respectively, to the liquid cooling head 50. When one liquid pump 40 deteriorates or fails, the liquid can still be circulated to the liquid cooling head 50 by the liquid cooling system of the other liquid pump 40, ensuring that the liquid cooling radiator maintains its cooling and heat dissipation functions. The structural design of the micro-channels 522 of the liquid cooling head 50, the strip-shaped through holes 531 of the liquid partition plate 53, and the annular flow passage 516 of the present invention allows all the liquid in the dual liquid circulation systems to flow into the liquid cooling head 50 and fill the entire micro-channels 522, so that the liquid circulation systems of the two liquid pumps 40 can achieve the cooling and heat dissipation functions for the entire processor. The present invention has two liquid pumps and a dual liquid circulation system, which can improve the flow rate and volume of liquid passing through the liquid cooling head 50, effectively solving the required cooling efficiency when the processor is overclocked or operating at high speed. [Explanation of symbols]

[0024] 100 heat dissipation parallel tubes 10 First Liquid Box 11 First partition 12 First cavity 13 Second partition 131 recess 14 Liquid entry chamber 15 Ejection chamber 16 Liquid pump base 161 Liquid pump room 162 Liquid inlet 163 Liquid drainage hole 17 First Box Body 171 Parallel pipe insertion hole 18 First box lid 181 Liquid injection hole 19 Concave depression 20 Second Liquid Box 21 Third partition 22 Second cavity 23 Fourth partition 24 Thermal liquid chamber 241 1st hot liquid outlet 25 Cold liquid chamber 251 First coolant inlet 26 Second box body 27 Second box lid 271 Parallel pipe insertion hole 30 Parallel pipe assembly 31 1st parallel pipe 32 2nd parallel pipe 33 Heat dissipation fin 40 Liquid Pump 41 Liquid pump casing 411 End Cap 412 Annular chamber 413 Rotor Room 42 Stator 421 Motor coil 43 Rotor 431 Fan blades 50 liquid cooling head 51 Liquid cooling head body 511 Liquid chamber 512 Second coolant inlet 513 2nd hot liquid outlet 514 Protrusion 515 Strip groove 516 Annular flow path 52 Heat dissipation base 521 Bottom plate 522 Microchannel 53 Liquid partition 531 Striped hole 60 outer casing 70 fans

Claims

1. A dual-liquid pump dual circulation integrated liquid cooling radiator comprising a heat dissipation parallel pipe, two liquid pumps, and a liquid cooling head, the heat dissipation parallel pipe has a first liquid box, a second liquid box, and a parallel pipe assembly, the first liquid box has a first partition plate that divides the interior into two first cavities, and a second partition plate that divides the interior into a liquid inlet chamber and a liquid outlet chamber is installed within each of the first cavities, and a liquid pump base is formed within each of the first cavities, and each of the liquid pump bases has a liquid pump chamber, a liquid inlet hole communicating with the liquid pump chamber and the liquid inlet chamber, and a liquid outlet hole communicating with the liquid pump chamber and the liquid outlet chamber, the second liquid box has a third partition plate dividing the interior thereof into two second cavities, and a fourth partition plate dividing the interior thereof into a hot liquid chamber and a cold liquid chamber is installed in each of the second cavities, the hot liquid chamber is provided with at least one first hot liquid outlet communicating with the liquid cooling head, and the cold liquid chamber is provided with a first cold liquid outlet communicating with the liquid cooling head, and the parallel pipe assembly includes a number of first parallel pipes and a number of second parallel pipes parallel to each other, and heat dissipation fins, One end of each of the first parallel pipes is connected to the first liquid chambers of the two first cavities, and the other end is connected to the hot liquid chambers of the two second cavities. One end of each of the second parallel pipes is connected to the outlet liquid chambers of the two first cavities, and the other end is connected to the cold liquid chambers of the two second cavities. The two liquid pumps are respectively mounted in the liquid pump chambers of the two first cavities, and the two liquid pumps respectively urge the hot liquid in the two hot liquid chambers of the second liquid box to flow through the multiple first parallel pipes to the two inlet chambers of the first liquid box, and then flow from each inlet chamber back into each liquid pump chamber, and then flow again to the two outlet chambers of the first liquid box, and then flow again through the multiple second parallel pipes to the two cold liquid chambers of the second liquid box, dissipating heat from the hot liquid to become cold liquid through the parallel pipe assembly; a liquid cooling head coupled to the bottom surface of the second liquid box, the liquid cooling head having a liquid cooling head main body and a heat dissipation base, the top surface of the liquid cooling head main body being coupled to the bottom surface of the second liquid box, the bottom surface of the liquid cooling head main body being provided with a liquid chamber recessed upward, two second cooling liquid inlets respectively communicating with the two first cooling liquid inlets, and two second hot liquid outlets respectively communicating with the two first hot liquid outlets; the heat dissipation base being coupled to the bottom surface of the liquid cooling head main body, and having a bottom plate sealingly closing the liquid chamber, and a number of micro-channels formed on the top surface of the bottom plate, the number of micro-channels being positioned within the liquid chamber.

2. 2. The dual liquid pump dual circulation integrated liquid cooling radiator of claim 1, characterized in that the liquid cooling head includes a liquid partition plate installed in the liquid chamber of the liquid cooling head body, and strip-shaped through holes are provided in the middle and both sides of the liquid partition plate, and the cooling liquid flows through the strip-shaped through holes into the multiple micro-channels on the heat dissipation base.

3. 3. The dual liquid pump dual circulation integrated liquid cooling radiator of claim 2, characterized in that the top wall of the liquid chamber of the liquid cooling head body has a downward protrusion, and the protrusion has a strip groove recessed upward, the two second cooling liquid inlets each communicate with the strip groove, a continuous annular flow passage is formed between the periphery of the protrusion and the four circumferential inner walls of the liquid chamber, and the two second hot liquid outlets each communicate with the annular flow passage.

4. The dual liquid pump dual circulation integrated liquid cooling radiator of claim 1, characterized in that the liquid pump base is integrally molded or assembled to the inner wall of the first cavity of the first liquid box, the liquid pump chamber is recessed into the liquid pump base from the outer surface of the first liquid box, the liquid inlet hole is a circular hole located at the center of the liquid pump chamber, and the liquid outlet hole is located on one side of the liquid pump chamber.

5. 4. The dual liquid pump dual circulation integrated liquid cooling radiator of claim 3, characterized in that each of the liquid pump chambers comprises a liquid pump casing fastened to the outer surface of the first liquid box via screws, a stator, and a rotor, the liquid pump casing sealingly closing the liquid pump chamber, the liquid pump casing having an annular chamber on its outer surface and a rotor chamber on its inner surface, the stator being installed in the annular chamber of the liquid pump casing and having a motor coil used to drive the rotor, the rotor being rotatably installed in the rotor chamber and having a number of fan blades that rotate into the liquid pump chamber.

6. 2. The dual liquid pump dual circulation integrated liquid cooling radiator according to claim 1, wherein two outer housings are provided on both sides of the parallel pipe assembly between the first liquid box and the second liquid box of the heat dissipation parallel pipe, and fans are fastened between the two outer housings on both the front and rear sides of the heat dissipation parallel pipe.

7. 2. The dual liquid pump dual circulation integrated liquid cooling radiator according to claim 1, wherein the first partition plate and the second partition plate are respectively welded to the inside of the first liquid box, and the third partition plate and the fourth partition plate are respectively welded to the inside of the second liquid box.

8. 8. The dual-liquid pump dual circulation integrated liquid cooling radiator according to claim 7, wherein each of the second partition plates has a recess that matches the surface of the liquid pump base.

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