Liquid cooling device and heat dissipation assembly structure using the same

Abstract

To provide a liquid cooling device and a heat dissipation assembly structure using the same, which are publicly available for cooling a plurality of heating electronic devices arranged in an elongated manner.SOLUTION: In a heat dissipation assembly structure 1, a liquid cooling device 3 includes a bottom cover 30 and a base housing 2. The base housing is rectangular, and includes: an inflow chamber 21; an outflow chamber 22; flow dividing chambers 41a to 41c; a partition wall 20; first through holes 23a to 23c; second through holes; and a flow dividing structure. The inflow chamber and the outflow chamber are disposed between a bottom surface of a base and the bottom cover. A plurality of diverting chambers are provided on a top surface. The plurality of first through holes and the plurality of second through holes are disposed along a Y-axis direction so as to be adjacent to two long side sides facing each other. Each diversion chamber communicates with an inflow chamber and communicates with the outflow chamber via the second through hole. The flow dividing structure is disposed on the bottom cover or the first surface to achieve a uniform flow rate of the parallel flow paths.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a heat dissipation assembly structure, and more particularly to a liquid cooling device with a flow dividing structure that can provide uniform flow paths for multiple heat-generating electronic devices arranged in an elongated manner, thereby effectively improving heat dissipation efficiency, and a heat dissipation assembly structure using the same. [Background technology]

[0002] Conventional electronic devices are often combined with heat dissipation assembly structures to dissipate internal heat. High-power modules used in inverters often generate high heat, so they need to be combined with water-cooled heat dissipation assembly structures to achieve effective heat dissipation.

[0003] Traction inverters for automotive motors typically contain three high-power modules arranged in a slender structure. The combined water-cooled heat dissipation module often employs a serial flow path design. The cooling fluid enters the heat exchange chamber through the inlet flow path, then passes through multiple fins in a continuous sequence to dissipate heat before finally exiting through the outlet flow path. While this design is simple, it results in higher temperatures at downstream fins, reducing the reliability of downstream power modules. Furthermore, the continuous fin design significantly increases the system's working fluid impedance and reduces its flow rate. A key challenge in this field is how to design the flow paths of liquid cooling devices and build a heat dissipation assembly structure suitable for multiple heat-generating electronic devices arranged in a slender structure.

[0004] Therefore, the present invention provides a liquid cooling device and a heat dissipation assembly structure using the same, which introduces a flow division structure into multiple parallel flow paths to effectively reduce the temperature difference between multiple electronic devices in the heat dissipation assembly structure and the impedance of the cooling fluid, thereby eliminating the shortcomings of the prior art. Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a liquid cooling device and a heat dissipation assembly structure using the same, which introduces a flow division structure into multiple parallel flow paths to effectively reduce the temperature difference between multiple electronic devices in a heat dissipation assembly structure and the impedance of the cooling fluid.

[0006] Another object of the present invention is to provide a liquid cooling device and a heat dissipation assembly structure using the same. To meet the heat dissipation requirements of multiple electronic devices arranged in a single direction, the liquid cooling device employs a parallel flow path design in an elongated base housing. The top surface of the base housing is partitioned into multiple diverter chambers connected to heat dissipation fins thermally coupled to the multiple electronic devices, and the bottom surface of the base housing is partitioned into an inlet chamber and an outlet chamber by a partition wall. The diverter structure allows the cooling fluid from the inlet chamber to be evenly divided and enter the diverter chambers through multiple through-holes on the adjacent long sides, before merging with the outlet chamber and being discharged through the through-holes on the other long sides. The diverter chambers form multiple lateral flow paths corresponding to the through-holes on the two long sides, and the lateral flow paths are connected in parallel between the inlet chamber and the outlet chamber, allowing the multiple electronic devices to individually dissipate heat with equal flow rates of cooling fluid. Because the flow direction of the multiple lateral channels is perpendicular to the extension direction of the long sides, rather than being designed along the extension direction of the long sides, a short-path design is adopted in which the lateral channels of the multiple diversion chambers are located between the two opposing long sides of the elongated base housing, thereby shortening the channel length and achieving the goal of improving uniform heat dissipation performance. This allows the cooling channel inlets and cooling channel outlets to provide cooling fluid inlet and outlet ports at different ends of the long sides. Furthermore, the through-holes arranged and extending along the two opposing long sides have the same width as the diversion chambers communicating between them. The multiple channels formed are evenly diverted by at least one diversion structure. This allows the electronic devices corresponding to the multiple diversion chambers in the heat dissipation assembly structure to have similar heat dissipation conditions, quickly and evenly removing heat generated by the multiple electronic devices, effectively improving overall heat dissipation efficiency. [Means for solving the problem]

[0007] To achieve the above object, the present invention provides a liquid cooling device comprising a base housing, an upper cover, and a bottom cover. The base housing has an elongated rectangular shape and includes a first side, a second side, a third side, a fourth side, a first surface, and a second surface, the first and second sides being disposed opposite each other and extending along a first direction. The base housing comprises an inlet chamber, an outlet chamber, a plurality of diverter chambers, a partition wall, a plurality of first through-holes, a plurality of second through-holes, and at least one diverter structure. The bottom cover is spatially opposite the first surface and connected to the first side, the second side, the third side, and the fourth side. The inlet chamber is disposed between the first surface and the bottom cover. The outlet chamber is disposed between the first surface and the bottom cover. The plurality of diverter chambers are disposed on the second surface and configured to be thermally coupled to the plurality of fins. The partition wall is disposed between the inlet chamber and the outlet chamber and connected between the first surface and the bottom cover. The plurality of first through-holes are provided adjacent to the first side surface, arranged along a first direction, and respectively communicate between the inlet chamber and the plurality of diverter chambers. The plurality of second through-holes are provided adjacent to the second side surface, arranged along the first direction, and respectively communicate between the outlet chamber and the plurality of diverter chambers. The plurality of diverter chambers correspond to the plurality of first through-holes adjacent to the first side surface and the plurality of second through-holes adjacent to the second side surface. At least one diverter structure is provided on the bottom cover and protrudes toward the inlet chamber or the outlet chamber to provide a diverter function. The cooling fluid enters the plurality of diverter chambers through the inlet chamber and the plurality of first through-holes, respectively. After heat exchange with the plurality of fins, the cooling fluid enters the plurality of diverter chambers through the plurality of diverter chambers and the plurality of second through-holes, respectively, and is then discharged.

[0008] In one embodiment, the liquid cooling device further comprises a cooling channel inlet and a cooling channel outlet, the cooling channel inlet being provided through the bottom cover and communicating with the inlet chamber, and the cooling channel outlet being provided through the bottom cover and communicating with the outlet chamber.

[0009] In one embodiment, at least one flow diversion structure is circular and is positioned on the centerline between any two adjacent first through holes or the centerline between any two adjacent second through holes to provide a flow diversion function.

[0010] In one embodiment, the at least one flow shunting structure is elongate, spaced apart from the partition wall, and extends along a second direction perpendicular to the first direction.

[0011] In one embodiment, the at least one flow shunting structure is constituted by an irregular bend in the septum.

[0012] In one embodiment, the plurality of first through holes and the plurality of second through holes are both slotted holes and extend along the first direction.

[0013] In one embodiment, the liquid cooling device further comprises an upper cover, the upper cover having a top surface and a bottom surface facing each other, the heat dissipation surface being provided on the upper surface, the bottom surface being connected to the first side, the second side, the third side, the fourth side, and the second surface of the base housing to form a plurality of diverter chambers, and the plurality of fins being accommodated in the plurality of diverter chambers and extending from the bottom surface toward the second surface.

[0014] In one embodiment, the number of the plurality of flow division chambers, the number of the plurality of first through-holes, and the number of the plurality of second through-holes are equal to M, where M is an integer and M≧2.

[0015] In one embodiment, the plurality of flow distribution chambers, the plurality of first through-holes, and the plurality of second through-holes form M flow paths, and the flow paths of the M flow paths are perpendicular to the first direction.

[0016] To achieve the above object, the present invention further provides a liquid cooling device including a base housing. The base housing has an elongated rectangular shape and has a first side, a second side, a third side, a fourth side, a first surface, and a second surface, the first and second sides being arranged opposite each other and extending along a first direction. The base housing includes an inlet chamber, an outlet chamber, a plurality of diverter chambers, a partition wall, a plurality of first through-holes, a plurality of second through-holes, and at least one diverter structure. The inlet chamber is provided on the first surface. The outlet chamber is provided on the first surface. The diverter chambers are provided on the second surface and configured to be thermally coupled to the plurality of fins. The partition wall is provided between the inlet chamber and the outlet chamber. The plurality of first through-holes are provided adjacent to the first side and arranged along the first direction, each communicating between the inlet chamber and the diverter chamber. The plurality of second through-holes are provided adjacent to the second side surface and are arranged along the first direction, respectively communicating between the outflow chamber and the plurality of diverter chambers, and the plurality of diverter chambers correspond to the plurality of first through-holes at locations adjacent to the first side surface and the plurality of second through-holes at locations adjacent to the second side surface. At least one diverter structure is provided on the first surface, disposed in the inflow chamber or the outflow chamber, or connected to the partition wall to provide a diverter function. The cooling fluid enters the plurality of diverter chambers through the inflow chamber and the plurality of first through-holes, respectively, and, after heat exchange with the plurality of fins, enters the plurality of diverter chambers and the plurality of second through-holes, respectively, into the outflow chamber and is then discharged.

[0017] In one embodiment, the liquid cooling device further comprises a cooling channel inlet and a cooling channel outlet, the cooling channel inlet being adjacent to the third side and communicating with the inlet chamber, and the cooling channel outlet being adjacent to the fourth side and communicating with the outlet chamber.

[0018] In one embodiment, the liquid cooling device further includes a bottom cover, the bottom cover being connected to the first side, the second side, the third side, the fourth side, and the first surface of the base housing and connected to the partition wall to form an inlet chamber and an outlet chamber, and the cooling channel inlet and the cooling channel outlet are provided through the bottom cover.

[0019] In one embodiment, one end of the at least one flow dividing structure is connected to the partition wall and the other end extends along a second direction perpendicular to the first direction.

[0020] In one embodiment, at least one flow diversion structure is circular and is positioned on the centerline between any two adjacent first through holes or the centerline between any two adjacent second through holes to provide a flow diversion function.

[0021] In one embodiment, the at least one flow shunting structure is elongate, spaced apart from the partition wall, and extends along a second direction perpendicular to the first direction.

[0022] In one embodiment, the at least one flow shunting structure is constituted by an irregular bend in the septum.

[0023] In one embodiment, the plurality of first through holes and the plurality of second through holes are both elongated holes and extend along the first direction.

[0024] In one embodiment, the liquid cooling device further comprises a top cover, the top cover having a top surface and a bottom surface opposite each other, the bottom surface being connected to the first side, the second side, the third side, the fourth side, and the second surface of the base housing to form a plurality of diverter chambers, a plurality of fins being housed within the plurality of diverter chambers and extending from the bottom surface toward the second surface, and a heat dissipation surface being provided on the top surface that is thermally coupled to the plurality of fins.

[0025] In one embodiment, the number of the plurality of flow division chambers, the number of the plurality of first through-holes, and the number of the plurality of second through-holes are equal to M, where M is an integer and M≧2.

[0026] To achieve the above object, the present invention further provides a heat dissipation assembly structure including a liquid cooling device and a plurality of electronic devices. The liquid cooling device includes a base housing and a bottom cover. The base housing has a first side, a second side, a third side, a fourth side, a first surface, and a second surface, the first and second sides being arranged opposite each other and extending along a first direction. The base housing includes an inlet chamber, an outlet chamber, a plurality of diverter chambers, a partition wall, a plurality of first through-holes, a plurality of second through-holes, and at least one diverter structure. The bottom cover is spatially opposite the first surface and connected to the first side, the second side, the third side, and the fourth side. The inlet chamber is disposed between the first surface and the bottom cover. The outlet chamber is disposed between the first surface and the bottom cover. The diverter chambers are disposed on the second surface and configured to be thermally coupled to a plurality of fins. The fins are connected to a heat dissipation surface. The partition is disposed between the inlet chamber and the outlet chamber, with one end connected to the third side of the partition being adjacent to the second side and the other end connected to the fourth side of the partition being adjacent to the first side. The first through-holes are disposed adjacent to the first side and arranged along the first direction, respectively communicating between the inlet chamber and the plurality of diverter chambers. The second through-holes are disposed adjacent to the second side and arranged along the first direction, respectively communicating between the outlet chamber and the plurality of diverter chambers, with the plurality of diverter chambers corresponding to the first through-holes at locations adjacent to the first side and the plurality of second through-holes at locations adjacent to the second side. At least one diverter structure is disposed on the bottom cover or the first surface and protrudes toward the inlet chamber or the outlet chamber to provide a diverter function. The plurality of electronic devices are provided on the heat dissipation surface, arranged along a first direction, and thermally coupled to the plurality of fins, and the cooling fluid enters the plurality of diversion chambers respectively through the inflow chamber and the plurality of first through holes, and exchanges heat with the plurality of fins to dissipate heat from the plurality of electronic devices, and then the cooling fluid flows from the plurality of diversion chambers to the outflow chamber through the plurality of second through holes. [Brief explanation of the drawings]

[0027] The following detailed description of the present invention and the schematic diagrams of the embodiments are intended to enable those skilled in the art to fully understand the above content, but are not intended to limit the present invention.

[0028] [Figure 1] 1 is a perspective structural view of a heat dissipation assembly structure according to a first embodiment of the present invention; [Figure 2] 1 is a perspective structural view of a heat dissipation assembly structure according to a first embodiment of the present invention;

[0029] [Figure 3] 1 is a structural exploded view of a heat dissipation assembly structure according to a first embodiment of the present invention; [Figure 4] 1 is a structural exploded view of a heat dissipation assembly structure according to a first embodiment of the present invention;

[0030] [Figure 5] 3 is a schematic diagram showing the flow direction of a cooling fluid on a first surface of the liquid cooling device according to the first embodiment of the present invention. FIG.

[0031] [Figure 6] 3 is a schematic view showing the flow direction of a cooling fluid on a second surface of the liquid cooling device according to the first embodiment of the present invention. FIG.

[0032] [Figure 7] FIG. 4 is an exploded view of a heat dissipation assembly structure according to a second embodiment of the present invention. [Figure 8] FIG. 4 is an exploded view of a heat dissipation assembly structure according to a second embodiment of the present invention.

[0033] [Figure 9] FIG. 10 is a schematic view showing the flow direction of a cooling fluid on a first surface of a liquid cooling device according to a second embodiment of the present invention.

[0034] [Figure 10] FIG. 10 is a structural exploded view of a heat dissipation assembly structure according to a third embodiment of the present invention.

[0035] [Figure 11] FIG. 10 is a schematic view showing the flow direction of a cooling fluid on a first surface of a liquid cooling device according to a third embodiment of the present invention.

[0036] [Figure 12] FIG. 10 is an exploded view of a heat dissipation assembly structure according to a fourth embodiment of the present invention.

[0037] [Figure 13] FIG. 10 is a schematic view showing the flow direction of a cooling fluid on a first surface of a liquid cooling device according to a fourth embodiment of the present invention.

[0038] [Figure 14] 10A and 10B show examples of different flow dividing structures in the liquid cooling device of the present invention. [Figure 15] 10A and 10B show examples of different flow dividing structures in the liquid cooling device of the present invention. [Figure 16] 10A and 10B show examples of different flow dividing structures in the liquid cooling device of the present invention.

[0039] [Figure 17] FIG. 10 is a perspective structural view of a heat dissipation assembly structure according to a fifth embodiment of the present invention. [Figure 18] FIG. 10 is a perspective structural view of a heat dissipation assembly structure according to a fifth embodiment of the present invention.

[0040] [Figure 19] FIG. 10 is an exploded view of a heat dissipation assembly structure according to a fifth embodiment of the present invention. [Figure 20] FIG. 10 is an exploded view of a heat dissipation assembly structure according to a fifth embodiment of the present invention.

[0041] [Figure 21] FIG. 10 is a schematic view showing the flow direction of a cooling fluid on a first surface of a liquid cooling device according to a fifth embodiment of the present invention.

[0042] [Figure 22] FIG. 10 is a schematic view showing the flow direction of the cooling fluid on the second surface of the liquid cooling device according to the fifth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0043] Several exemplary embodiments illustrating the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention may have various modifications in different aspects without departing from the scope of the present invention, and that the description and drawings are intended to be illustrative in nature and not limiting. For example, in the following description of the present invention, when a first feature is described as being located on or above a second feature, this includes embodiments in which the located first feature is in direct contact with the second feature, and also includes embodiments in which an additional feature is located between the first feature and the second feature, thereby preventing the first feature from being in direct contact with the second feature. Furthermore, duplicate reference numerals and / or symbols may be used in different embodiments of the present invention. This duplication is for the sake of brevity and clarity and is not intended to limit the relationship between each embodiment and / or the external structure. Spatial terms, such as "above," "below," "top," "bottom," and similar terms, may be used to simply describe the relationship of a component or feature to another component or feature in the drawings. In addition to the orientation shown in the drawings, spatial terms are used to include different orientations of the device during use or operation. The device may be positioned differently (e.g., rotated 90 degrees or at another orientation), and the spatial terms used should be interpreted accordingly. Furthermore, when a component is referred to as being "connected" or "coupled" to another component, it may be directly connected or coupled to the other component, or intervening components may be present. While the broad range of numerical ranges and parameters in this disclosure are approximations, the specific examples describe numerical values ​​as precisely as possible. Furthermore, while terms such as "first," "second," etc. may be used to describe different components in the claims, it should be understood that these components should not be limited by these terms, and that the components described in the embodiments may be represented by different component symbols. These terms are used to distinguish between different components.For example, a first component could be termed a second component, and similarly, a second component could be termed a first component, without departing from the scope of the embodiments. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0044] 1 and 2 are perspective structural views of a heat dissipation assembly structure according to a first embodiment of the present invention. FIGS. 3 and 4 are structural exploded views of the heat dissipation assembly structure according to the first embodiment of the present invention. FIG. 5 is a schematic diagram illustrating the flow direction of a cooling fluid on a first surface of a liquid cooling device according to the first embodiment of the present invention. FIG. 6 is a schematic diagram illustrating the flow direction of a cooling fluid on a second surface of a liquid cooling device according to the first embodiment of the present invention. Please refer to FIGS. 1 to 6. In this embodiment, the present invention provides a heat dissipation assembly 1 including an elongated liquid cooling device 3 and multiple electronic devices 9a, 9b, and 9c. The liquid cooling device 3 mainly includes an elongated rectangular base housing 2, a top cover 40, and a bottom cover 30. In this embodiment, the base housing 2 has a first side 11, a second side 12, a third side 13, a fourth side 14, a first surface 101, and a second surface 102. The first side 11 and the second side 12 are arranged opposite each other and are long sides extending along a first direction, such as the Y-axis. The third side surface 13 and the fourth side surface 14 are short sides arranged opposite each other and connected between the first side surface 11 and the second side surface 12. The first surface 101 and the second surface 102 are the bottom surface and the top surface of the base housing 2, respectively, and are two surfaces that face each other. In this embodiment, the distance between the first side surface 11 and the second side surface 12 (i.e., width) is smaller than the distance between the third side surface 13 and the fourth side surface 14 (i.e., length), thereby forming an elongated rectangular base housing 2. In other words, the lengths of the long sides of the first side surface 11 and the second side surface 12 are longer than the lengths of the short sides of the third side surface 13 and the fourth side surface 14. In this embodiment, the base housing 2 includes an inflow chamber 21, an outflow chamber 22, a plurality of diversion chambers 41a, 41b, and 41c, a partition wall 20, a plurality of first through holes 23a, 23b, and 23c, a plurality of second through holes 24a, 24b, and 24c, at least one diversion structure 33a and 33b, a cooling channel inlet 31, and a cooling channel outlet 32. In this embodiment, the bottom cover 30 is spatially opposite the first surface 101 and is connected to the first side surface 11, the second side surface 12, the third side surface 13, and the fourth side surface 14. The inflow chamber 21 is provided between the first surface 101 and the bottom cover 30.The outflow chamber 22 is located between the first surface 101 and the bottom cover 30. The partition wall 20 is located between the inflow chamber 21 and the outflow chamber 22 and is connected between the first surface 101 and the bottom cover 30. In this embodiment, one surface of the bottom cover 30 is assembled with the first side surface 11, the second side surface 12, the third side surface 13, the fourth side surface 14, and the first surface 101 of the base housing 2 and connected to the partition wall 20 to form the inflow chamber 21 and the outflow chamber 22. The cooling channel inlet 31 and the cooling channel outlet 32 ​​are provided through the bottom cover 30. In this embodiment, the cooling channel inlet 31 is located adjacent to the third side surface 13 and communicates with the inflow chamber 21. The cooling channel outlet 32 ​​is located adjacent to the fourth side surface 14 and communicates with the outflow chamber 22. Of course, the present invention is not limited to the method of assembling the bottom cover 30 and the base housing 2. After the bottom cover 30 is assembled with the elongated rectangular base housing 2, the partition wall 20 divides the space of the first surface 101 into an inlet chamber 21 and an outlet chamber 22, which are symmetrical to each other. Of course, the present invention is not limited to this. In this embodiment, the liquid cooling device 3 forms multiple diverter chambers 41a, 41b, and 41c by, for example, assembling the top cover 40 with the base housing 2. The top cover 40 has opposing top and bottom surfaces. The heat dissipation surfaces 43 corresponding to the electronic devices 9a, 9b, and 9c are located on the top surface of the top cover 40. The bottom surface of the top cover 40 is assembled with the first side 11, second side 12, third side 13, fourth side 14, and second surface 102 of the base housing 2 to form the multiple diverter chambers 41a, 41b, and 41c. The present invention is not limited to the method of assembling the top cover 40 with the base housing 2.

[0045] In this embodiment, the fins 42 are provided, for example, on the bottom surface of the top cover 40, are housed in the flow dividing chambers 41a, 41b, and 41c, and extend from the bottom surface of the top cover 40 toward the second surface 102. In another embodiment, the fins 42 are provided, for example, on the second surface 102, are connected to the top cover 40, and are thermally coupled to the heat dissipation surface 43 on the top surface. Of course, the present invention is not limited to this. By assembling the top cover 40 and the base housing 2, the flow dividing chambers 41a, 41b, and 41c are configured to be provided on the second surface 102 and thermally coupled to the fins 42. The fins 42 are also connected to the heat dissipation surface 43 and dissipate heat from the electronic devices 9a, 9b, and 9c thereon.

[0046] In this embodiment, the multiple first through holes 23a, 23b, and 23c are provided adjacent to the first side surface 11, arranged along the first direction (i.e., the Y-axis direction), and communicate between the inlet chamber 21 and the multiple diversion chambers 41a, 41b, and 41c, respectively. The multiple second through holes 24a, 24b, and 24c are provided adjacent to the second side surface 12, arranged along the first direction (i.e., the Y-axis direction), and communicate between the outlet chamber 22 and the multiple diversion chambers 41a, 41b, and 41c, respectively. The multiple diversion chambers 41a, 41b, and 41c correspond to the multiple first through holes 23a, 23b, and 23c at locations adjacent to the first side surface 11, and correspond to the multiple second through holes 24a, 24b, and 24c at locations adjacent to the second side surface 12. The number of the multiple flow-dividing chambers 41a, 41b, 41c, the number of the multiple first through-holes 23a, 23b, 23c, and the number of the multiple second through-holes 24a, 24b, 24c are all equal, three. The flow-dividing chamber 41a, the first through-hole 23a, and the second through-hole 24a form a flow path F1. The flow-dividing chamber 41b, the first through-hole 23b, and the second through-hole 24b form a flow path F2. The flow-dividing chamber 41c, the first through-hole 23c, and the second through-hole 24c form a flow path F3. The three flow paths F1, F2, and F3 are connected in parallel between the inflow chamber 21 and the outflow chamber 22, and the flow paths of the three flow paths F1, F2, and F3 are perpendicular to the first direction (the Y-axis direction) and parallel to the X-axis direction.

[0047] In this embodiment, the flow diverting structures 33a and 33b are provided on one side of the bottom cover 30 and protrude toward the inlet chamber 21. For example, they may be configured to be close to the first surface 101 but not in contact with the first surface 101. The flow diverting structures 33a and 33b may have, for example, a rectangular shape, and their extension lengths in the second direction (i.e., the X-axis direction) may be adjusted according to actual needs. One end of the flow diverting structures 33a and 33b contacts the partition wall 20, and the other end of the flow diverting structures 33a and 33b extends along a second direction parallel to the X-axis, which is perpendicular to the first direction. Thus, the flow diverting structure 33a provides a flow diverting function for the adjacent first through-holes 23a and 23b. The flow diverting structure 33b provides a flow diverting function for the adjacent first through-holes 23b and 23c. In the present invention, by installing the flow-dividing structures 33a and 33b, the parallel flow paths F1, F2, and F3 can better meet the heat dissipation requirements of the multiple electronic devices 9a, 9b, and 9c arranged in a single direction. In other embodiments, even if one of the flow-dividing structures 33a and 33b is omitted, a uniform flow can be formed and the parallel flow paths F1, F2, and F3 can meet the heat dissipation requirements of the multiple electronic devices 9a, 9b, and 9c arranged in a single direction.

[0048] In this embodiment, the electronic devices 9a, 9b, and 9c are, for example, three power devices used in a multi-phase inverter and configured to output a driving current for a motor. Because each power device must have input and output electrical connections, they must be arranged in a single direction and electrically connected to the outside along the two long sides of the heat dissipation assembly structure 1. To meet the heat dissipation requirements of the multiple electronic devices 9a, 9b, and 9c arranged in a single direction, the multiple electronic devices 9a, 9b, and 9c are mounted on the heat dissipation surface 43, arranged along a first direction (i.e., the Y-axis direction), and thermally coupled to the multiple fins 42. If the multiple electronic devices 9a, 9b, and 9c are power devices of the multi-phase inverter, they may be electrically connected to the outside via the first side surface 11 or the second side surface 12. Of course, the present invention is not limited to this. In this embodiment, after the cooling fluid enters the inlet chamber 21 through the cooling channel inlet 31, the flow-diverting structures 33a and 33b in the inlet chamber 21 divide the cooling fluid evenly and allow it to pass through the first through-holes 23a, 23b, and 23c into the respective diversion chambers 41a, 41b, and 41c. The cooling fluid in the diversion chambers 41a, 41b, and 41c exchanges heat with the fins 42 to dissipate heat from the respective electronic devices 9a, 9b, and 9c. The cooling fluid then passes through the second through-holes 24a, 24b, and 24c to merge with the outlet chamber 22 and finally exits through the cooling channel outlet 32.

[0049] In this embodiment, the multiple diversion chambers 41a, 41b, 41c form multiple lateral flow paths F1, F2, F3 corresponding to the first through holes 23a, 23b, 23c in the first side surface 11 and the second through holes 24a, 24b, 24c in the second side surface 12. Due to the flow diversion effect of the diversion structures 33a, 33b, the multiple lateral flow paths F1, F2, F3 are connected in parallel between the inlet chamber 21 and the outlet chamber 22, allowing the cooling fluid to flow at equal flow rates to dissipate heat from the multiple electronic devices 9a, 9b, 9c, respectively. Because the flow paths of the lateral channels F1, F2, and F3 are perpendicular to the long sides, i.e., the extension direction of the first and second side faces 11 and 12, a short-path design is adopted rather than along the long sides. This allows the lateral channels F1, F2, and F3 of the branch chambers 41a, 41b, and 41c to flow along the shortest paths within the elongated base housing 2, shortening the channel length and achieving the goal of improving uniform heat dissipation performance. This allows the cooling channel inlet 31 and the cooling channel outlet 32 ​​to provide cooling fluid inlet and outlet from different ends of the long sides, such as the ends adjacent to the third and fourth side faces 13 and 14. In this embodiment, the first through holes 23a, 23b, and 23c and the second through holes 24a, 24b, and 24c are all slotted holes extending along the first direction (i.e., the Y-axis direction). The first through holes 23a, 23b, 23c and the second through holes 24a, 24b, 24c and the diversion chambers 41a, 41b, 41c have the same width W in the first direction. Due to the uniform flow paths F1, F2, F3 formed and the diversion structures 33a, 33b, the electronic devices 9a, 9b, 9c corresponding to the diversion chambers 41a, 41b, 41c in the heat dissipation assembly structure 1 can have similar heat dissipation conditions, and the heat generated from the electronic devices 9a, 9b, 9c can be quickly and uniformly removed, effectively improving the overall heat dissipation efficiency.

[0050] 7 and 8 are exploded views of the heat dissipation assembly structure according to a second embodiment of the present invention. FIG. 9 is a schematic diagram showing the flow direction of a cooling fluid on the first surface of the liquid cooling device according to the second embodiment of the present invention. In this embodiment, the heat dissipation assembly structure 1a and the liquid cooling device 3a are similar in structure to those of the heat dissipation assembly structure 1 and the liquid cooling device 3 shown in FIGS. 1 to 6. The same reference numerals denote the same components, structures, and functions, and their descriptions are omitted here. Please refer to FIGS. 6 to 9. In this embodiment, the flow diverting structures 25a and 25b are provided on the first surface 101 of the base housing 2a and located within the outflow chamber 22. The flow diverting structures 25a and 25b protrude from the first surface 101, for example, but not limited to, in contact with the bottom cover 30. The flow diverting structures 25a and 25b are, for example, rectangular, and their extension lengths in the second direction (i.e., the X-axis direction) can be adjusted according to actual needs. One end of the flow-diverting structures 25a, 25b is connected to the partition wall 20, and the other end of the flow-diverting structures 25a, 25b extends along a second direction parallel to the X-axis, perpendicular to the first direction. Thus, the flow-diverting structure 25a provides a flow-diverting function for the adjacent second through-holes 24a, 24b. The flow-diverting structure 25b provides a flow-diverting function for the adjacent second through-holes 24b, 24c. In the present invention, by providing the flow-diverting structures 25a, 25b, the parallel flow paths F1, F2, F3 can better meet the heat dissipation requirements of multiple electronic devices 9a, 9b, 9c arranged in a single direction. In other embodiments, the flow-diverting structures 25a, 25b can be moved to the inlet chamber 21, or either of the flow-diverting structures 25a, 25b can be omitted, and still achieve uniform flow diverting, so that the parallel flow paths F1, F2, F3 can meet the heat dissipation requirements of multiple electronic devices 9a, 9b, 9c arranged in a single direction.

[0051] FIG. 10 is an exploded view of a heat dissipation assembly structure according to a third embodiment of the present invention. FIG. 11 is a schematic diagram showing the flow direction of a cooling fluid on the first surface of the liquid cooling device according to the third embodiment of the present invention. In this embodiment, the heat dissipation assembly structure 1b and the liquid cooling device 3b are similar in structure to the heat dissipation assembly structure 1 and the liquid cooling device 3 shown in FIGS. 1 to 6. The same reference numerals denote the same components, structures, and functions, and their descriptions are omitted here. See FIGS. 6, 10, and 11. In this embodiment, the partition wall 20a of the base housing 2b is irregularly curved to separate the inlet chamber 21 and the outlet chamber 22. The irregularly curved partition wall 20a provides a flow-dividing function for the first through-holes 23a, 23b, and 23c or the second through-holes 24a, 24b, and 24c, allowing the parallel flow paths F1, F2, and F3 to meet the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction. In other words, the at least one diverting structure 25c can be formed, for example, by irregularly bending the partition wall 20a. In this embodiment, after the cooling fluid enters the inlet chamber 21 through the cooling channel inlet 31, the at least one diverting structure 25c in the inlet chamber 21 diverges the cooling fluid evenly and allows it to pass through the first through-holes 23a, 23b, and 23c into the diverting chambers 41a, 41b, and 41c, respectively. The cooling fluid in the diverting chambers 41a, 41b, and 41c exchanges heat with the fins 42 to dissipate heat from the electronic devices 9a, 9b, and 9c. The cooling fluid then passes through the second through-holes 24a, 24b, and 24c, respectively, to merge into the outlet chamber 22 and finally exit through the cooling channel outlet 32. Of course, the present invention is not limited to this example.

[0052] FIG. 12 is an exploded view of a heat dissipation assembly structure according to a fourth embodiment of the present invention. FIG. 13 is a schematic diagram showing the flow direction of a cooling fluid on a first surface of a liquid cooling device according to the fourth embodiment of the present invention. In this embodiment, the heat dissipation assembly structure 1c and the liquid cooling device 3c are similar in structure to the heat dissipation assembly structures 1, 1a and the liquid cooling devices 3, 3a shown in FIGS. 1 to 9. The same reference numerals denote the same components, structures, and functions, and their descriptions are omitted here. See FIGS. 6, 7, 12, and 13. In this embodiment, the present invention provides a heat dissipation assembly 1c including an elongated liquid cooling device 3c and multiple electronic devices 9a, 9b, and 9c. The liquid cooling device 3c mainly includes an elongated rectangular base housing 2c, an upper cover 40, and a bottom cover 30. In this embodiment, the base housing 2c has a first side 11, a second side 12, a third side 13, a fourth side 14, a first surface 101, and a second surface 102. The first side surface 11 and the second side surface 12 are arranged opposite each other and are long sides extending along a first direction such as the Y-axis. The third side surface 13 and the fourth side surface 14 are arranged opposite each other and are short sides connected between the first side surface 11 and the second side surface 12, respectively. The first surface 101 and the second surface 102 are the bottom surface and the top surface of the base housing 2c, respectively, and are two surfaces facing each other. In this embodiment, the distance between the first side surface 11 and the second side surface 12 (i.e., width) is smaller than the distance between the third side surface 13 and the fourth side surface 14 (i.e., length), thereby forming an elongated rectangular base housing 2c. In other words, the lengths of the long sides of the first side surface 11 and the second side surface 12 are longer than the lengths of the short sides of the third side surface 13 and the fourth side surface 14. In this embodiment, the integrated base housing 2c includes an inlet chamber 21, an outlet chamber 22, a plurality of branch chambers 41a, 41b, and 41c, a partition wall 20, a plurality of first through holes 23a, 23b, and 23c, a plurality of second through holes 24a, 24b, and 24c, at least one branch structure 25a and 25b, a cooling channel inlet 31, and a cooling channel outlet 32. In this embodiment, the inlet chamber 21 is provided on the first surface 101 and spatially faces the first side surface 11 and the third side surface 13.The outflow chamber 22 is provided on the first surface 101 and spatially faces the second side surface 12 and the fourth side surface 14. The partition wall 20 is provided between the inflow chamber 21 and the outflow chamber 22. One end of the partition wall 20, connected to the third side surface 13, is close to the second side surface 12, and the other end of the partition wall 20, connected to the fourth side surface 14, is close to the first side surface 11. In this embodiment, the bottom cover 30 is assembled with the first side surface 11, the second side surface 12, the third side surface 13, the fourth side surface 14, and the first surface 101 of the base housing 2c and connected to the partition wall 20 to form the inflow chamber 21 and the outflow chamber 22. The cooling channel inlet 31 and the cooling channel outlet 32 ​​are provided through the bottom cover 30. In this embodiment, the cooling channel inlet 31 is provided adjacent to the third side surface 13 and communicates with the inflow chamber 21. The cooling channel outlet 32 ​​is located adjacent to the fourth side surface 14 and communicates with the outflow chamber 22. Of course, the present invention is not limited to the method of assembling the bottom cover 30 and the base housing 2c. After the bottom cover 30 is assembled with the elongated rectangular base housing 2c, the partition wall 20 divides the space of the first surface 101 into the inflow chamber 21 and the outflow chamber 22, which are symmetrical to each other. In this embodiment, the liquid cooling device 3c forms multiple branch chambers 41a, 41b, and 41c by assembling, for example, the top cover 40 and the base housing 2c. The top cover 40 has a top surface and a bottom surface facing each other, and a heat dissipation surface 43 corresponding to the electronic devices 9a, 9b, and 9c is disposed on the top surface of the top cover 40. The bottom surface of the top cover 40 is assembled with the first side surface 11, the second side surface 12, the third side surface 13, the fourth side surface 14, and the second surface 102 of the base housing 2c to form a plurality of flow dividing chambers 41a, 41b, and 41c. The present invention is not limited to the method of assembling the top cover 40 and the base housing 2c.

[0053] In this embodiment, the fins 42 are provided, for example, on the bottom surface of the top cover 40, are housed in the flow-dividing chambers 41a, 41b, and 41c, and extend from the bottom surface of the top cover 40 toward the second surface 102. In another embodiment, the fins 42 are provided, for example, on the second surface 102, are connected to the top cover 40, and are thermally coupled to the heat-dissipating surface 43 on the top surface. Of course, the present invention is not limited to this. By assembling the top cover 40 and the base housing 2c, the flow-dividing chambers 41a, 41b, and 41c are configured to be provided on the second surface 102 and thermally coupled to the fins 42. The fins 42 are also connected to the heat-dissipating surface 43 and dissipate heat from the electronic devices 9a, 9b, and 9c thereon.

[0054] In this embodiment, the multiple first through holes 23a, 23b, and 23c are provided adjacent to the first side surface 11, arranged along the first direction (i.e., the Y-axis direction), and communicate between the inlet chamber 21 and the multiple diversion chambers 41a, 41b, and 41c, respectively. The multiple second through holes 24a, 24b, and 24c are provided adjacent to the second side surface 12, arranged along the first direction (i.e., the Y-axis direction), and communicate between the outlet chamber 22 and the multiple diversion chambers 41a, 41b, and 41c, respectively. The multiple diversion chambers 41a, 41b, and 41c correspond to the multiple first through holes 23a, 23b, and 23c at locations adjacent to the first side surface 11, and correspond to the multiple second through holes 24a, 24b, and 24c at locations adjacent to the second side surface 12. The number of the multiple flow-dividing chambers 41a, 41b, 41c, the number of the multiple first through-holes 23a, 23b, 23c, and the number of the multiple second through-holes 24a, 24b, 24c are all equal, three. The flow-dividing chamber 41a, the first through-hole 23a, and the second through-hole 24a form a flow path F1. The flow-dividing chamber 41b, the first through-hole 23b, and the second through-hole 24b form a flow path F2. The flow-dividing chamber 41c, the first through-hole 23c, and the second through-hole 24c form a flow path F3. The three flow paths F1, F2, and F3 are connected in parallel between the inflow chamber 21 and the outflow chamber 22, and the flow paths of the three flow paths F1, F2, and F3 are perpendicular to the first direction (the Y-axis direction) and parallel to the X-axis direction.

[0055] In this embodiment, the flow-dividing structures 25a, 25b are provided on the first surface 101 and positioned within the inlet chamber 21. One end of the flow-dividing structures 25a, 25b is connected to the partition wall 20, and the other end of the flow-dividing structures 25a, 25b extends along a second direction parallel to the X-axis, perpendicular to the first direction. Thus, the flow-dividing structure 25a provides a flow-dividing function for the adjacent first through-holes 23a, 23b. The flow-dividing structure 25b provides a flow-dividing function for the adjacent first through-holes 23b, 23c. In this embodiment, the provision of the flow-dividing structures 25a, 25b allows the parallel flow paths F1, F2, F3 to better meet the heat dissipation requirements of multiple electronic devices 9a, 9b, 9c arranged in a single direction.

[0056] In this embodiment, the electronic devices 9a, 9b, and 9c are, for example, three power devices used in a multi-phase inverter and configured to output a driving current for a motor. Because each power device must have input and output electrical connections, they must be arranged in a single direction and electrically connected to the outside along the two long sides of the heat dissipation assembly structure 1c. To meet the heat dissipation requirements of the multiple electronic devices 9a, 9b, and 9c arranged in a single direction, the multiple electronic devices 9a, 9b, and 9c are mounted on the heat dissipation surface 43, arranged along a first direction (i.e., the Y-axis direction), and thermally coupled to the multiple fins 42. If the multiple electronic devices 9a, 9b, and 9c are power devices of the multi-phase inverter, they may be electrically connected to the outside via the first side surface 11 or the second side surface 12. Of course, the present invention is not limited to this. In this embodiment, after the cooling fluid enters the inlet chamber 21 through the cooling channel inlet 31, the flow-diverting structures 25a, 25b in the inlet chamber 21 divide the cooling fluid evenly and allow it to pass through the first through-holes 23a, 23b, and 23c into the respective diversion chambers 41a, 41b, and 41c. The cooling fluid in the diversion chambers 41a, 41b, and 41c exchanges heat with the fins 42 to dissipate heat from the respective electronic devices 9a, 9b, and 9c. The cooling fluid then passes through the second through-holes 24a, 24b, and 24c to merge with the outlet chamber 22 and finally exits through the cooling channel outlet 32.

[0057] In this embodiment, the multiple diversion chambers 41a, 41b, 41c form multiple lateral flow paths F1, F2, F3 corresponding to the first through holes 23a, 23b, 23c in the first side surface 11 and the second through holes 24a, 24b, 24c in the second side surface 12. Due to the flow diversion effect of the diversion structures 25a, 25b, the multiple lateral flow paths F1, F2, F3 are connected in parallel between the inlet chamber 21 and the outlet chamber 22, allowing the cooling fluid to flow at equal flow rates to dissipate heat from the multiple electronic devices 9a, 9b, 9c, respectively. Because the flow paths of the lateral channels F1, F2, and F3 are perpendicular to the long sides, i.e., the first and second side faces 11 and 12, a short-path design is adopted rather than along the long sides. This allows the lateral channels F1, F2, and F3 of the branch chambers 41a, 41b, and 41c to flow along the shortest paths within the elongated base housing 2c, shortening the channel length and achieving the goal of improving uniform heat dissipation performance. This allows the cooling channel inlet 31 and the cooling channel outlet 32 ​​to provide cooling fluid inlet and outlet from different ends of the long sides, such as the ends adjacent to the third and fourth side faces 13 and 14. In this embodiment, the first through holes 23a, 23b, and 23c and the second through holes 24a, 24b, and 24c are all slotted holes extending along the first direction (i.e., the Y-axis direction). The first through holes 23a, 23b, 23c and the second through holes 24a, 24b, 24c and the diversion chambers 41a, 41b, 41c have the same width W in the first direction. Due to the uniform flow paths F1, F2, F3 formed and the diversion structures 25a, 25b, the electronic devices 9a, 9b, 9c corresponding to the diversion chambers 41a, 41b, 41c in the heat dissipation assembly structure 1c can have similar heat dissipation conditions, and the heat generated from the electronic devices 9a, 9b, 9c can be quickly and uniformly removed, effectively improving the overall heat dissipation efficiency.

[0058] In this embodiment, the flow-dividing structures 25a and 25b are, for example, rectangular, and their extension lengths in the second direction (i.e., the X-axis direction) can be adjusted according to actual needs. In other embodiments, even if one of the flow-dividing structures 25a and 25b is omitted, uniform flow can be formed, and as a result, the parallel flow paths F1, F2, and F3 can meet the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction. Figure 14 shows a second example of a flow-dividing structure in a liquid cooling device of the present invention. In this embodiment, the structure of the base housing 2d is similar to that of the base housing 2c shown in Figures 12 and 13, and the same reference numerals represent the same components, structures, and functions, and their descriptions are omitted here. See Figures 6, 12, and 14. In this embodiment, the base housing 2d includes a flow-dividing structure 25b and a flow-dividing structure 25d. The flow-dividing structure 25b and the flow-dividing structure 25d are arranged in the inlet chamber 21 and the outlet chamber 22, respectively. The flow-dividing structure 25b disposed in the inlet chamber 21 has one end connected to the partition wall 20 and the other end extending toward the first side surface 11 in the second direction (i.e., the X-axis direction). This structure provides a flow-dividing function for the adjacent first through-holes 23b and 23c, helping to equalize the flow rates of the flow paths F2 and F3. The flow-dividing structure 25d disposed in the outlet chamber 22 has one end connected to the partition wall 20 and the other end extending toward the second side surface 12 in the second direction (i.e., the X-axis direction). This structure provides a flow-dividing function for the adjacent second through-holes 24a and 24b, helping to equalize the flow rates of the flow paths F1 and F2. In the present invention, the installation of the flow-dividing structures 25b and 25d can evenly divide the flow rates of the parallel flow paths F1, F2, and F3, thereby meeting the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction.

[0059] FIG. 15 shows a third embodiment of the flow dividing structure in the liquid cooling device of the present invention. In this embodiment, the structure of the base housing 2e is similar to that of the base housing 2c shown in FIGS. 12 and 13. The same reference numerals denote the same components, structures, and functions, and their descriptions are omitted here. See FIGS. 6, 12, 13, and 15. In this embodiment, the base housing 2e includes a flow dividing structure 25e and a flow dividing structure 25f. The flow dividing structures 25e and 25f are both provided in the inlet chamber 21 but are not connected to the partition wall 20. In this embodiment, both the flow dividing structures 25e and 25f are circular. The flow dividing structure 25e is located on the center line between two adjacent first through holes 23a and 23b. The flow dividing structure 25f is located on the center line between two adjacent first through holes 23b and 23c. In other embodiments, the flow-diverting structure 25e may be disposed in the outflow chamber 22 on the centerline between two adjacent second through-holes 24a and 24b, or the flow-diverting structure 25f may be disposed in the outflow chamber 22 on the centerline between two adjacent second through-holes 24b and 24c. The placement of the flow-diverting structures 25e and 25f can be adjusted according to actual needs, and the present invention is not limited thereto. In the present invention, the placement of the flow-diverting structures 25e and 25f can evenly divide the flow rates of the parallel flow paths F1, F2, and F3 to meet the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction.

[0060] FIG. 16 shows a fourth embodiment of a flow diversion structure in a liquid cooling device according to the present invention. In this embodiment, the structure of a base housing 2f is similar to that of the base housing 2c shown in FIGS. 12 and 13. The same reference numerals denote the same components, structures, and functions, and their descriptions are omitted here. See FIGS. 6, 12, 13, and 16. In this embodiment, the base housing 2f includes a flow diversion structure 25g and a flow diversion structure 25h. The flow diversion structures 25g and 25h are both provided in the inlet chamber 21, but are not connected to the partition wall 20; they are connected only to the first surface 101 or the bottom cover 30. In this embodiment, the flow diversion structures 25g and 25h have a thin, elongated shape and are spaced apart from the partition wall 20. The flow diversion structure 25g extends along the center line of two adjacent first through holes 23a and 23b. The flow diversion structure 25f extends along the center line of two adjacent first through holes 23b and 23c. In other words, the flow-dividing structures 25g and 25h each extend along a second direction (i.e., the X-axis direction) perpendicular to the first direction. In the present invention, the flow-dividing structures 25g and 25h are provided to evenly divide the flow rates of the parallel flow paths F1, F2, and F3, thereby meeting the heat dissipation requirements of the multiple electronic devices 9a, 9b, and 9c arranged in a single direction. The placement of the flow-dividing structures 25g and 25h can be adjusted according to actual needs, and the present invention is not limited thereto.

[0061] 17 and 18 are perspective structural views of a heat dissipation assembly structure according to a fifth embodiment of the present invention. FIGS. 19 and 20 are structural exploded views of the heat dissipation assembly structure according to the fifth embodiment of the present invention. FIG. 21 is a schematic diagram showing the flow direction of a cooling fluid on a first surface of a liquid cooling device according to the fifth embodiment of the present invention. FIG. 22 is a schematic diagram showing the flow direction of a cooling fluid on a second surface of a liquid cooling device according to the fifth embodiment of the present invention. In this embodiment, the heat dissipation assembly structure 1d and the liquid cooling device 3d are similar in structure to the heat dissipation assembly structure 1c and the liquid cooling device 3c shown in FIGS. 12 and 13, and the same reference numerals denote the same components, structures, and functions, and their descriptions are omitted here. In this embodiment, the heat dissipation assembly structure 1d includes an elongated liquid cooling device 3d and at least two electronic devices 9a and 9b. The base housing 2g of the liquid cooling device 3d includes at least two distribution chambers 41a, 41b, at least two first through-holes 23a, 23b, at least two second through-holes 24a, 24b, and at least one distribution structure 25. The distribution chambers 41a, 41b, the first through-holes 23a, 23b, and the second through-holes 24a, 24b correspond to each other and are equal in number to the number of electronic devices 9a, 9b. In another embodiment, the number of distribution chambers 41a, 41b, the first through-holes 23a, 23b, the second through-holes 24a, 24b, and the electronic devices 9a, 9b is M, where M is an integer and M≧2. In other words, the plurality of flow dividing chambers 41a, 41b, the plurality of first through holes 23a, 23b, and the plurality of second through holes 24a, 24b form M flow paths F1, F2, and the flow path directions of the M flow paths F1, F2 are perpendicular to the first direction (i.e., the Y-axis direction). The number of flow dividing structures 25 is N, where N is an integer and N≧1, and it is particularly preferable that N+1=M.

[0062] In this embodiment, the flow shunt structure 25 is provided on the first surface 101, disposed within the inflow chamber 21, and connected to the partition wall 20 to provide a flow shunting function for any two adjacent first through-holes 23a, 23b. In other embodiments, the flow shunt structure 25 is disposed within the inflow chamber 21 or the outflow chamber 22, or is spaced apart from the partition wall 20 to provide a flow shunting function for any two adjacent first through-holes 23a, 23b or any two adjacent second through-holes 24a, 24b. Due to the flow shunting effect of the flow shunt structure 25, multiple lateral flow paths F1, F2 are connected in parallel between the inflow chamber 21 and the outflow chamber 22, allowing the heat of the multiple electronic devices 9a, 9b to be dissipated with an equal flow rate of cooling fluid. Because the flow directions of the lateral channels F1, F2 are perpendicular to the extension direction of the first side surface 11 and the second side surface 12, the lateral channels F1, F2 of the diverter chambers 41a, 41b flow along the shortest path within the elongated base housing 2g, shortening the channel length and achieving the goal of improving uniform heat dissipation performance. This allows the cooling fluid to enter the inlet chamber 21 through the cooling channel inlet 31 adjacent to the third side surface 13. The diverter structure 25 evenly distributes the flow through the channels F1, F2, ensuring that the electronic devices 9a, 9b corresponding to the diverter chambers 41a, 41b in the heat dissipation assembly structure 1d have similar heat dissipation conditions. This allows the heat generated by the electronic devices 9a, 9b to be quickly and uniformly removed, effectively improving overall heat dissipation efficiency. Of course, the number of the flow-diverting structures 25 corresponds to the number of the flow-diverting chambers 41a, 41b, the first through-holes 23a, 23b, the second through-holes 24a, 24b, and the electronic devices 9a, 9b, and can be adjusted according to actual needs. The present invention is not limited thereto, and the details will not be repeated here.

[0063] As described above, the present invention provides a liquid cooling device and a heat dissipation assembly structure using the same, which effectively reduces the temperature difference and cooling fluid impedance of multiple electronic devices within the heat dissipation assembly structure by introducing a flow diversion structure into multiple parallel flow paths. To meet the heat dissipation requirements of multiple electronic devices arranged in a single direction, the liquid cooling device provides a parallel flow path design in an elongated base housing. The top surface of the base housing is partitioned into multiple flow diversion chambers connected to heat dissipation fins thermally coupled to the multiple electronic devices, and the bottom surface of the base housing is partitioned into an inlet chamber and an outlet chamber by a partition wall. The flow diversion structure allows the cooling fluid from the inlet chamber to be evenly divided and then enter the multiple flow diversion chambers through multiple through-holes on the adjacent long sides, before merging with the outlet chamber and discharging through the through-hole on the other long side. The multiple flow diversion chambers form multiple horizontal flow paths corresponding to the through-holes on the two long sides, and the multiple horizontal flow paths are connected in parallel between the inlet chamber and the outlet chamber, allowing the multiple electronic devices to individually dissipate heat with equal flow rates of cooling fluid. Because the flow direction of the multiple lateral channels is perpendicular to the extension direction of the long sides, rather than being designed along the extension direction of the long sides, a short-path design is adopted in which the lateral channels of the multiple diversion chambers are located between the two opposing long sides of the elongated base housing, thereby shortening the channel length and achieving the goal of improving uniform heat dissipation performance. This allows the cooling channel inlets and cooling channel outlets to provide cooling fluid inlet and outlet ports at different ends of the long sides. Furthermore, the through-holes arranged and extending along the two opposing long sides have the same width as the diversion chambers communicating between them. The multiple channels formed are evenly diverted by at least one diversion structure. This allows the electronic devices corresponding to the multiple diversion chambers in the heat dissipation assembly structure to have similar heat dissipation conditions, quickly and evenly removing heat generated by the multiple electronic devices, effectively improving overall heat dissipation efficiency.

[0064] The present invention may be modified in various ways by those skilled in the art without departing from the scope defined by the claims. [Explanation of symbols]

[0065] 1, 1a, 1b, 1c, 1d: Heat dissipation assembly structure 2, 2a, 2b, 2c, 2d, 2e, 2f, 2g: Base housing 3, 3a, 3b, 3c, 3d: Liquid cooling device 101: 1st surface 102:Second surface 11:1st side 12:Second side 13:Third side 14:Fourth side 20, 20a: Bulkhead 21: Inlet chamber 22: Outflow chamber 23a, 23b, 23c: 1st through hole 24a, 24b, 24c: 2nd through hole 25, 25a, 25b, 25c, 25d, 25e, 25f, 25g, 25h: Divided structure 30: Bottom cover 31: Cooling channel inlet 32: Cooling channel outlet 33a, 33b: Separate flow structure 40: Upper cover 41a, 41b, 41c: Flow dividing chambers 42: Finn 43: Heat dissipation surface 9a, 9b, 9c: Electronic devices F1, F2, F3: Flow paths W: Width X, Y, Z: Axes

Claims

1. 1. A liquid cooling device comprising a base housing and a bottom cover, the base housing has a first side, a second side, a third side, a fourth side, a first surface, and a second surface, the first side and the second side being disposed opposite each other and extending along a first direction; the bottom cover is spatially opposite the first surface and connected to the first side surface, the second side surface, the third side surface, and the fourth side surface; the base housing includes an inlet chamber, an outlet chamber, a plurality of diversion chambers, a partition wall, a plurality of first through-holes, a plurality of second through-holes, and at least one diversion structure; the inlet chamber is disposed between the first surface and the bottom cover; the outflow chamber is disposed between the first surface and the bottom cover; the plurality of flow distribution chambers are disposed on the second surface and configured to be thermally coupled to a plurality of fins; the partition is disposed between the inlet chamber and the outlet chamber and is connected between the first surface and the bottom cover; the plurality of first through holes are provided adjacent to the first side surface, are arranged along the first direction, and communicate between the inlet chamber and the plurality of diversion chambers, respectively; the plurality of second through holes are provided adjacent to the second side surface, are arranged along the first direction, and communicate between the outflow chamber and the plurality of diversion chambers, respectively; the plurality of diversion chambers correspond to the plurality of first through holes at locations adjacent to the first side surface, and correspond to the plurality of second through holes at locations adjacent to the second side surface; the at least one flow-diverting structure is provided on the bottom cover and protrudes toward the inflow chamber or the outflow chamber to provide a flow-diverting function, wherein the cooling fluid enters the plurality of flow-diverting chambers through the inflow chamber and the plurality of first through-holes respectively, and after heat exchange with the plurality of fins, the cooling fluid enters the plurality of flow-diverting chambers through the plurality of second through-holes respectively and the outflow chamber, and then is discharged; Liquid cooling device.

2. Further comprising a cooling channel inlet and a cooling channel outlet; the cooling channel inlet extends through the bottom cover and communicates with the inlet chamber; The cooling channel outlet is provided through the bottom cover and communicates with the outflow chamber. The liquid cooling device of claim 1 .

3. 2. The liquid cooling device of claim 1, wherein the at least one flow diversion structure is circular and disposed on a centerline between any two adjacent first through-holes or a centerline between any two adjacent second through-holes to provide a flow diversion function.

4. The liquid cooling device according to claim 1 , wherein the at least one flow dividing structure is elongated, disposed apart from the partition wall, and extends along a second direction perpendicular to the first direction.

5. The liquid cooling apparatus of claim 1 , wherein the at least one flow dividing structure is formed by an irregular bend in the partition wall.

6. The liquid cooling device according to claim 1 , wherein the plurality of first through holes and the plurality of second through holes are both elongated holes extending along the first direction.

7. Further comprising a top cover; the upper cover has a top surface and a bottom surface facing each other, the bottom surface being connected to the first side, the second side, the third side, the fourth side, and the second surface of the base housing to form the plurality of diverter chambers, the plurality of fins being housed in the plurality of diverter chambers and extending from the bottom surface toward the second surface, and the top surface being provided with a heat dissipation surface thermally coupled to the plurality of fins; The liquid cooling device of claim 1 .

8. The liquid cooling device of claim 1 , wherein the number of the plurality of flow distribution chambers, the number of the plurality of first through-holes, and the number of the plurality of second through-holes are equal to M, where M is an integer and M≧2.

9. 9. The liquid cooling device of claim 8, wherein the plurality of diversion chambers, the plurality of first through holes, and the plurality of second through holes form M flow paths, and the flow paths of the M flow paths are perpendicular to the first direction.

10. 1. A liquid cooling device comprising a base housing, the base housing has a first side, a second side, a third side, a fourth side, a first surface, and a second surface, the first side and the second side being disposed opposite each other and extending along a first direction; the base housing includes an inlet chamber, an outlet chamber, a plurality of diversion chambers, a partition wall, a plurality of first through-holes, a plurality of second through-holes, and at least one diversion structure; the inlet chamber is disposed in the first surface; the outflow chamber is disposed in the first surface; the plurality of flow distribution chambers are disposed on the second surface and configured to be thermally coupled to a plurality of fins; the partition is disposed between the inlet chamber and the outlet chamber; the plurality of first through holes are provided adjacent to the first side surface, are arranged along the first direction, and communicate between the inlet chamber and the plurality of diversion chambers, respectively; the plurality of second through holes are provided adjacent to the second side surface, are arranged along the first direction, and communicate between the outflow chamber and the plurality of diversion chambers, respectively; the plurality of diversion chambers correspond to the plurality of first through holes at locations adjacent to the first side surface, and correspond to the plurality of second through holes at locations adjacent to the second side surface; the at least one flow-dividing structure is provided on the first surface, disposed in the inflow chamber or the outflow chamber, or connected to the partition wall, to provide a flow-dividing function, wherein the cooling fluid enters the plurality of flow-dividing chambers through the inflow chamber and the plurality of first through-holes, respectively, and after heat exchange with the plurality of fins, the cooling fluid enters the outflow chamber through the plurality of flow-dividing chambers and the plurality of second through-holes, respectively, and is then discharged; Liquid cooling device.

11. Further comprising a cooling channel inlet and a cooling channel outlet; the cooling channel inlet is disposed adjacent the third side and communicates with the inlet chamber; the cooling channel outlet is disposed adjacent the fourth side and communicates with the outflow chamber. The liquid cooling device of claim 10.

12. a bottom cover; the bottom cover is connected to the first side, the second side, the third side, the fourth side, and the first surface of the base housing and to the partition wall to form the inlet chamber and the outlet chamber, and the cooling channel inlet and the cooling channel outlet are provided through the bottom cover.

12. The liquid cooling device of claim 11.

13. The liquid cooling apparatus of claim 10 , wherein one end of the at least one flow dividing structure is connected to the partition wall and the other end extends along a second direction perpendicular to the first direction.

14. 11. The liquid cooling device of claim 10, wherein the at least one flow diversion structure is circular and disposed on a centerline between any two adjacent first through-holes or a centerline between any two adjacent second through-holes to provide a flow diversion function.

15. The liquid cooling device of claim 10 , wherein the at least one flow dividing structure is elongated, disposed apart from the partition wall, and extends along a second direction perpendicular to the first direction.

16. The liquid cooling apparatus of claim 10 , wherein the at least one flow dividing structure is formed by an irregular bend in the partition wall.

17. The liquid cooling device according to claim 10 , wherein the plurality of first through holes and the plurality of second through holes are both elongated holes extending along the first direction.

18. Further comprising a top cover; the upper cover has a top surface and a bottom surface facing each other, the bottom surface being connected to the first side, the second side, the third side, the fourth side, and the second surface of the base housing to form the plurality of diverter chambers, the plurality of fins being housed in the plurality of diverter chambers and extending from the bottom surface toward the second surface, and the top surface being provided with a heat dissipation surface thermally coupled to the plurality of fins; The liquid cooling device of claim 10.

19. 11. The liquid cooling apparatus of claim 10, wherein the number of the plurality of flow distribution chambers, the number of the plurality of first through-holes, and the number of the plurality of second through-holes are equal to M, where M is an integer and M>2.

20. A heat dissipation assembly structure comprising a liquid cooling device and a plurality of electronic devices, The liquid cooling device includes a base housing and a bottom cover; the base housing has a first side, a second side, a third side, a fourth side, a first surface, and a second surface, the first side and the second side being disposed opposite each other and extending along a first direction, the bottom cover being spatially opposite the first surface and connected to the first side, the second side, the third side, and the fourth side; the base housing includes an inlet chamber, an outlet chamber, a plurality of diversion chambers, a partition wall, a plurality of first through-holes, a plurality of second through-holes, and at least one diversion structure; the inlet chamber is disposed between the first surface and the bottom cover; the outflow chamber is disposed between the first surface and the bottom cover; the plurality of flow distribution chambers are disposed on the second surface and configured to be thermally coupled to a plurality of fins; the partition is disposed between the inlet chamber and the outlet chamber and is connected between the first surface and the bottom cover; the plurality of first through holes are provided adjacent to the first side surface, are arranged along the first direction, and communicate between the inlet chamber and the plurality of diversion chambers, respectively; the plurality of second through holes are provided adjacent to the second side surface, are arranged along the first direction, and communicate between the outflow chamber and the plurality of diversion chambers, respectively; the plurality of diversion chambers correspond to the plurality of first through holes at locations adjacent to the first side surface, and correspond to the plurality of second through holes at locations adjacent to the second side surface; the at least one flow-diverting structure is provided on the bottom cover or the first surface and protrudes toward the inlet chamber or the outlet chamber to provide a flow-diverting function; the plurality of electronic devices are mounted on the heat dissipation surface, arranged along the first direction, and thermally coupled with the plurality of fins; a cooling fluid passes through the inflow chamber and the plurality of first through-holes into the plurality of diversion chambers, respectively, and exchanges heat with the plurality of fins to dissipate heat from the plurality of electronic devices; and then the cooling fluid flows from the plurality of diversion chambers to the outflow chamber through the plurality of second through-holes; Heat dissipation assembly structure.

Images