Machining device

The processing device automatically adjusts and positions the support unit relative to the cutting edge, preventing damage and ensuring safe operation by setting a threshold distance and issuing alarms.

JP2025176454APending Publication Date: 2025-12-04DISCO CORP
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Patent Information

Application Number
JP2024082625
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-05-21
Publication Date
2025-12-04

AI Technical Summary

Technical Problem

Current detection mechanisms for cutting blades require manual operation to position the support part, which can lead to damage if moved too far and contact the cutting edge.

Method used

A processing device with a detection mechanism that automatically adjusts and positions the support unit relative to the cutting edge, using a control system to set a threshold distance and issue alarms when the support unit approaches too close to the cutting edge.

Benefits of technology

Ensures reliable positioning of the support unit without damaging the cutting edge, preventing contact and enhancing operational safety.

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Abstract

To provide a machining device capable of surely positioning a support portion supporting a light emitting portion and a light receiving portion at a predetermined position without damaging a cutting edge of a cutting blade.SOLUTION: A machining device 1 includes: a chuck table for holding a workpiece; a cutting unit 20 including a spindle 23 on which a cutting blade 21 having a cutting edge 211 for cutting the workpiece is mounted; a detection mechanism 60 including a light emitting portion 62 facing one surface 213 side of the cutting edge 211, a light receiving portion 63 facing the other surface 214 side of the cutting edge 211, a support portion 61 for supporting the light emitting portion 62 and the light receiving portion 63, and a moving portion 64 for positioning the support portion 61 at a predetermined position; and a control unit 100, where a position of the support portion 61 allowed to approach the cutting edge 211 the most is stored as a predetermined threshold value in a storage portion 102, the support portion 61 is moved by the moving portion 64, and when the position of the support portion 61 approaches the cutting edge more than the predetermined threshold value, a notification is issued.SELECTED DRAWING: Figure 3
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Description

[Technical Field]

[0001] The present invention relates to a processing device. [Background technology]

[0002] Silicon wafers (hereinafter referred to as workpieces) have multiple devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) formed on their surface. After the backside is ground to a specified thickness, the wafer is divided into individual devices using a cutting machine, and these devices are used in electrical equipment such as mobile phones and personal computers.

[0003] In the step of dividing the substrate into individual devices, a cutting blade is attached to the tip of the spindle of a cutting device, and the substrate is divided into individual devices by cutting.

[0004] The tip of the spindle is equipped with a cutting blade and a blade cover equipped with a nozzle for supplying cutting water to the workpiece.

[0005] Furthermore, if there is an abnormality in the annular cutting edge of the cutting blade, problems such as breakage of the cutting blade or breakage of the workpiece may occur when processing the workpiece.

[0006] For this reason, a technique has been put into practical use in which a blade cover is provided with a detection mechanism for detecting abnormalities in the cutting blade (see, for example, Patent Document 1).

[0007] The detection mechanism shown in Patent Document 1 and other publications is composed of an emitting unit arranged opposite one side of the annular cutting edge of the cutting blade in the thickness direction, a light receiving unit arranged opposite the other side of the annular cutting edge in the thickness direction and receiving light irradiated from the emitting means, a support unit that supports the emitting unit and the light receiving unit, and a moving unit that positions the support unit (the emitting unit and the light receiving unit) at a predetermined position.

[0008] The detection mechanism is used by operating the moving part to move the support part in the vertical direction, thereby positioning the support part at a predetermined position. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-051092 Summary of the Invention [Problem to be solved by the invention]

[0010] In the current state of the art, the above-mentioned detection mechanism requires an operator to manually operate the moving part to move it up and down and position the support part at a predetermined position.

[0011] Therefore, for example, the above-mentioned detection mechanism has a problem in that if the moving part is moved downward too far, the cutting edge of the cutting blade comes into contact with the support part and is damaged.

[0012] An object of the present invention is to provide a processing device that can reliably position a support part that supports a light emitting part and a light receiving part at a predetermined position without damaging the cutting edge of the cutting blade. [Means for solving the problem]

[0013] In order to solve the above-mentioned problems and achieve the object, the processing device of the present invention is a processing device that is a processing device that is a processing device that is a chuck table that holds a workpiece, a cutting unit including a spindle on which a cutting blade having an annular cutting edge that cuts the workpiece is mounted, a light-emitting unit arranged facing one side of the annular cutting edge in the thickness direction, a light-receiving unit arranged facing the other side of the annular cutting edge in the thickness direction and receiving light irradiated from the light-emitting unit, a support unit that supports the light-emitting unit and the light-receiving unit, and a moving unit that positions the support unit at a predetermined position, and is equipped with a detection mechanism that detects the state of the annular cutting edge, and a control means, wherein the position of the support unit that is allowed to come closest to the cutting edge is stored in the control means as a predetermined threshold, the moving unit moves the support unit, and an alarm is issued when the position of the support unit comes closer to the cutting edge than the predetermined threshold.

[0014] The processing device may be provided with a display screen, and the display screen may display whether the support portion should be moved closer to or farther away from the cutting edge. [Effects of the Invention]

[0015] The present invention has the effect of being able to reliably position the support portion that supports the light-emitting portion and the light-receiving portion at a predetermined position without damaging the cutting edge of the cutting blade. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a processing device according to the first embodiment. [Figure 2] FIG. 2 is a perspective view showing the cutting unit shown in FIG. [Figure 3] FIG. 3 is a front view schematically showing an example of the configuration of a detection mechanism of the processing apparatus shown in FIG. [Figure 4] FIG. 4 is a front view schematically showing a state in which the support portion of the detection mechanism shown in FIG. 3 is positioned at a predetermined position. [Figure 5]FIG. 5 is a front view showing an example of a display on the display screen of the display unit when the support portion of the detection mechanism shown in FIG. 3 is positioned at a predetermined position. DETAILED DESCRIPTION OF THE INVENTION

[0017] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0018] [Embodiment 1] A processing device according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of the configuration of the processing device according to the first embodiment. FIG. 2 is a perspective view showing the cutting unit shown in FIG. 1. FIG. 3 is a front view schematically showing an example of the configuration of the detection mechanism of the processing device shown in FIG. 1. FIG. 4 is a front view schematically showing a state in which the support part of the detection mechanism shown in FIG. 3 is positioned at a predetermined position. FIG. 5 is a front view showing an example of the display on the display screen of the display unit when the support part of the detection mechanism shown in FIG. 3 is positioned at a predetermined position.

[0019] (workpiece) 1 according to the first embodiment is a cutting device that cuts a workpiece 200. In the first embodiment, the workpiece 200 to be processed by the processing device 1 shown in Fig. 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, the substrate of which is silicon, gallium arsenide, SiC (silicon carbide), or the like.

[0020] 1, a workpiece 200 has a surface 201 on which a plurality of planned division lines 202 are set, which intersect (orthogonal in the first embodiment), and devices 203 are formed in each of a plurality of regions partitioned by the planned division lines 202. The devices 203 are, for example, integrated circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integrations), or various types of memories (semiconductor memory devices).

[0021] In the first embodiment, the workpiece 200 has a central portion of a disk-shaped tape 205 having a diameter larger than that of the workpiece 200 adhered to a back surface 204 thereof, and a ring-shaped frame 206 adhered to the outer edge of the tape 205, and is supported by the frame 206. In the first embodiment, the workpiece 200, while supported by the frame 206, is cut along the planned division lines 202 and divided into individual devices 203.

[0022] (Processing equipment) The processing device 1 is a cutting device that holds a workpiece 200 on a chuck table 10 and cuts (corresponding to processing) the workpiece 200 along a planned division line 202 with a cutting blade 21. As shown in Fig. 1, the processing device 1 includes the chuck table 10 that suction-holds the workpiece 200 on a holding surface 11, a cutting unit 20 that cuts the workpiece 200 held on the chuck table 10 with the cutting blade 21, an imaging unit 30 that images the workpiece 200 held on the chuck table 10, and a control unit 100 that is a control means.

[0023] 1, the processing apparatus 1 also includes a moving unit 40 that moves the chuck table 10 and the cutting unit 20 relative to one another. The moving unit 40 includes at least an X-axis moving unit 41, which is a processing feed unit that processes and feeds the chuck table 10 in the X-axis direction parallel to the horizontal direction, a Y-axis moving unit 42, which is an indexing feed unit that indexes and feeds the cutting unit 20 in the Y-axis direction that is parallel to the horizontal direction and perpendicular to the X-axis direction, a Z-axis moving unit 43, which is a cutting feed unit that cuts and feeds the cutting unit 20 in the Z-axis direction that is parallel to the vertical direction and perpendicular to both the X-axis and Y-axis directions, and a rotational moving unit 44 that rotates the chuck table 10 around an axis parallel to the Z-axis direction.

[0024] 1, the processing device 1 is a so-called facing dual type cutting device that has two cutting units 20, i.e., a two-spindle dicer. The movement units 40 of the processing device 1 have two Y-axis movement units 42 and two Z-axis movement units 43, and these two Y-axis movement units 42 and Z-axis movement units 43 correspond to the cutting units 20, respectively.

[0025] The X-axis movement unit 41 is installed in the device main body 2, and moves the chuck table 10 together with the rotation movement unit 44 in the X-axis direction, which is the processing feed direction, thereby relatively feeding the chuck table 10 and the cutting unit 20 along the X-axis. The Y-axis movement unit 42 is installed on a gate-shaped support frame 3 erected from the device main body 2, and moves the corresponding cutting unit 20 in the Y-axis direction, which is the indexing feed direction, thereby relatively feeding the chuck table 10 and the cutting unit 20 along the Y-axis.

[0026] The Z-axis moving unit 43 is installed on a moving frame 4 which is moved in the Y-axis direction by the Y-axis moving unit 42, and moves the corresponding cutting unit 20 in the Z-axis direction, which is the cutting feed direction, thereby cutting the chuck table 10 and the cutting unit 20 relatively along the Z-axis direction.

[0027] The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 each include a well-known ball screw rotatably mounted about its axis, a well-known motor for rotating the ball screw about its axis, and a well-known guide rail for supporting the chuck table 10 or the cutting unit 20 movably in the X-axis, Y-axis, or Z-axis direction. The rotational moving unit 44 includes a well-known motor for rotating the chuck table 10 about its axis.

[0028] The chuck table 10 is disk-shaped, and its holding surface 11 for holding the workpiece 200 is made of porous ceramic or the like. The chuck table 10 is movable in the X-axis direction by an X-axis movement unit 41 between a processing area below the cutting unit 20 and a load / unload area spaced from below the cutting unit 20 where the workpiece 200 is loaded and unloaded, and is rotatable about an axis parallel to the Z-axis direction by a rotation movement unit 44. The holding surface 11 of the chuck table 10 is connected to a vacuum suction source (not shown), and is sucked by the vacuum suction source to suction-hold the workpiece 200 placed on the holding surface 11. A plurality of clamps 12 for clamping a frame 206 are provided around the periphery of the chuck table 10.

[0029] The cutting units 20 are processing units to which a cutting blade 21 that cuts a workpiece 200 held by the chuck table 10 is detachably attached. Each cutting unit 20 is attached to a second moving frame 5 that is movable in the Z-axis direction by a corresponding Z-axis moving unit 43, and is provided so as to be movable in the Y-axis direction by a Y-axis moving unit 42 relative to the workpiece 200 held by the chuck table 10, and is also provided so as to be movable in the Z-axis direction by the Z-axis moving unit 43. The cutting units 20 can position the cutting blade 21 at any position on the holding surface 11 of the chuck table 10 by the Y-axis moving unit 42 and the Z-axis moving unit 43.

[0030] The cutting unit 20 includes a cutting blade 21, a spindle housing 22 attached to the lower end of the second moving frame 5 and movable in the Y-axis and Z-axis directions by a Y-axis moving unit 42 and a Z-axis moving unit 43, a spindle 23 serving as a rotating shaft mounted on the spindle housing 22 and rotatable about its axis, a spindle motor (not shown) that rotates the spindle 23 about its axis, a cutting water supply nozzle 24 that supplies cutting water to the cutting blade 21, and a blade cover 25 attached to the tip surface of the spindle housing 22 and covering at least the upper part of the cutting blade 21.

[0031] The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape that cuts the workpiece 200. In the first embodiment, the cutting blade 21 has at least an annular cutting edge 211 that cuts the workpiece 200, as shown in FIGS. 2 and 3. The cutting edge 211 is made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material such as metal or resin, and is formed to a predetermined thickness. In the first embodiment, the cutting blade 21 is a so-called hub blade that includes the cutting edge 211 and an annular base 212 to which the cutting edge 211 is fixed at its outer edge, as shown in FIGS. 2 and 3. However, in the present invention, the cutting blade 21 may be a so-called washer blade that includes only the annular cutting edge 211.

[0032] The spindle housing 22 is attached to the lower end of the second moving frame 5, and is supported by the Z-axis moving unit 43 so as to be movable in the Z-axis direction, and is supported by the Y-axis moving unit 42 via the Z-axis moving unit 43 and the moving frame 4 so as to be movable in the Y-axis direction. The spindle housing 22 accommodates the spindle 23 except for its tip, as well as a spindle motor (not shown), and supports the spindle 23 so as to be rotatable about its axis.

[0033] The cutting blade 21 is detachably attached to the tip of the spindle 23. The spindle 23 is rotated by a spindle motor (not shown), and the cutting blade 21 is attached to the tip of the spindle 23. The axes of the spindle 23 and the cutting blade 21 of the cutting unit 20 are parallel to the Y-axis direction.

[0034] The imaging unit 30 captures an image of the workpiece 200 held by the chuck table 10 and acquires the captured image. The imaging unit 30 is fixed to the cutting unit 20 so as to move integrally with the cutting unit 20. The imaging unit 30 includes an imaging element that captures an image of the area to be cut of the workpiece 200 held by the chuck table 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 30 captures an image of the workpiece 200 held by the chuck table 10 and acquires an image for performing alignment between the workpiece 200 and the cutting blade 21, and outputs the acquired image to the control unit 100.

[0035] The machining apparatus 1 also includes an X-axis position detection unit (not shown) for detecting the position of the chuck table 10 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction, and a Z-axis position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit can be configured with a linear scale parallel to the X-axis direction or the Y-axis direction, and a read head. The Z-axis position detection unit detects the position of the cutting unit 20 in the Z-axis direction using motor pulses.

[0036] The X-axis position detection unit, Y-axis position detection unit, and Z-axis position detection unit output the position of the chuck table 10 in the X-axis direction and the position of the cutting unit 20 in the Y-axis direction or the Z-axis direction to the control unit 100. The angle detection unit outputs the angle from a reference position around the axis of the chuck table 10 to the control unit 100. In the first embodiment, the position of each component of the processing device 1 in the X-axis direction, Y-axis direction, and Z-axis direction is determined based on a predetermined reference position (not shown).

[0037] The processing device 1 also includes a cassette elevator 50 on which a cassette 6 containing the workpiece 200 before and after cutting is placed and which moves the cassette 6 in the Z-axis direction, a cleaning unit 51 which cleans the workpiece 200 after cutting, and a transport unit (not shown) which transports the workpiece 200 between the cassette 6, the chuck table 10, and the cleaning unit 51.

[0038] 2 and 3, the processing device 1 is provided with a detection mechanism 60 that detects the state of the annular cutting edge 211 of the cutting blade 21. As shown in FIG. 3, the detection mechanism 60 is provided with a support unit 61, a light-emitting unit 62, a light-receiving unit 63, a moving unit 64, and a detection unit 65.

[0039] The support part 61 is attached to the blade cover 25 by the moving part 64 so as to be movable along the radial direction of the cutting edge 211 of the cutting blade 21. In the first embodiment, the support part 61 is attached to the upper part of the blade cover 25 so as to be movable in the Z-axis direction. When attached to the blade cover 25, the support part 61 integrally includes a pair of positioning parts 611 that position the cutting edge 211 of the cutting blade 21 between them, and a connecting part 612 that connects the upper ends of the positioning parts 611 together. In the first embodiment, the support parts 61 position the cutting edge 211 of the cutting blade 21 between them along the Y-axis direction.

[0040] The light-emitting unit 62 is provided at the lower end of one positioning portion 611 of the support portion 61 and includes a light-emitting window 621 disposed facing one surface 213 of the annular cutting edge 211 in the Y-axis direction, and a light-emitting element 623 that emits light 66 (shown in FIGS. 3 and 4) through an optical fiber 622 to the light-emitting window 621 and irradiates the light 66 toward the one surface 213 of the cutting edge 211 through the light-emitting window 621. In the first embodiment, as shown in FIG. 4, the light-emitting unit 62 has a width 661 in the Z-axis direction and irradiates parallel light 66 parallel to the Y-axis direction toward the one surface 213 of the cutting edge 211.

[0041] The light receiving unit 63 is provided at the lower end of the other positioning portion 611 of the support portion 61 and includes a light receiving window 631 arranged facing the other surface 214 of the annular cutting edge 211 in the Y-axis direction, and a light receiving element 633 that transmits light 66 received from the light receiving window 631 through an optical fiber 632, receives the light 66 received through the light receiving window 631, and outputs information according to the amount of light 66 received to the control unit 100. The light emitting unit 62 and the light receiving unit 63 are supported by the support portion 61 by providing the light emitting window 621 and the light receiving window 631 at the lower end of the positioning portion 611.

[0042] The moving unit 64 positions the support unit 61 at a predetermined position relative to the cutting edge 211 of the cutting blade 21. In the first embodiment, the moving unit 64 is a bolt that is screwed into a screw hole 251 that passes through the upper end of the blade cover 25 along the Z-axis direction and has a lower end that is attached to the support unit 61 so as to be rotatable about its axis. The moving unit 64 is rotated about its axis by an operator or the like to move the support unit 61 in the Z-axis direction relative to the blade cover 25 and change the position of the support unit 61 relative to the blade cover 25, i.e., the cutting edge 211 of the cutting blade 21.

[0043] Furthermore, the moving unit 64 is operated by an operator before cutting the workpiece 200, so that the position of the support unit 61 in the Z-axis direction is set to a predetermined position shown by a solid line in Fig. 4. In the first embodiment, the predetermined position shown in Fig. 4 is a position where the entire light 66 emitted by the light emitting unit 62 is blocked by the cutting blade 21 and is not received by the light receiving unit 63, and where the distance between the upper end of the light 66 emitted by the light emitting unit 62 and the upper end of the cutting edge 211 of the cutting blade 21 is a predetermined distance 662.

[0044] The detection unit 65 detects the position of the support part 61 relative to the blade cover 25, i.e., the cutting edge 211 of the cutting blade 21. In the first embodiment, the detection unit 65 is an imaging unit that is attached to the tip surface of the spindle housing 22 and includes an imaging element that images the lower end of the other positioning part 611 of the support part 61. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element.

[0045] The detection unit 65 captures an image of the lower end of the other positioning portion 611 of the support portion 61 and outputs the captured image to the control unit 100, thereby detecting the radial, i.e., Z-axis, position of the cutting edge 211 relative to the blade cover 25 of the support portion 61, i.e., the cutting edge 211 of the cutting blade 21.

[0046] The control unit 100 controls each component of the processing device 1 and causes the processing device 1 to perform processing operations on the workpiece 200. The control unit 100 is a computer having an arithmetic processing device with a microprocessor such as a CPU (central processing unit), a storage device with memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the processing device 1 to each component of the processing device 1 via the input / output interface device.

[0047] The control unit 100 is connected to a display unit 110 configured with a liquid crystal display device or the like having a display screen 111 that displays the status of the machining operation and captured images, an input unit (not shown) that the operator uses to register machining conditions, and the like, and an alarm unit 120. That is, the machining apparatus 1 is equipped with the display unit 110, the input unit, and the alarm unit 120. The input unit is configured with at least one of a touch panel provided on the display screen 111 of the display unit 110 and an external input device such as a keyboard. The alarm unit 120 emits at least one of sound and light to alert the operator.

[0048] 1 and other figures, the control unit 100 includes a control unit 101 and a storage unit 102. The control unit 101 controls each component of the processing device 1 to cause the processing device 1 to perform a processing operation on the workpiece 200.

[0049] The memory unit 102 stores, as a predetermined threshold value, the position of the support unit 61 that is allowed to come closest to the cutting edge 211, as shown by the dashed line in Fig. 4. The position of the support unit 61 that is allowed to come closest to the cutting edge 211, as shown by the dashed line in Fig. 4, is a position where the connecting portion 612 of the support unit 61 is spaced from the outer edge of the cutting edge 211 of the cutting blade 21 and does not contact the outer edge of the cutting edge 211 of the cutting blade 21. The position of the support unit 61 that is allowed to come closest to the cutting edge 211, as shown by the dashed line in Fig. 4, is a position where there is a possibility that the connecting portion 612 of the support unit 61 will come into contact with the cutting edge 211 of the cutting blade 21 if it comes closer to the cutting edge 211 of the cutting blade 21 than the position of the support unit 61 shown by the dashed line in Fig. 4 described above. 4. The position of the support portion 61 that is permitted to come closest to the cutting edge 211, shown by the dashed line in FIG. 4, is closer to the cutting edge 211 of the cutting blade 21 than the predetermined position shown by the solid line in FIG.

[0050] The functions of the control unit 101 are realized by the aforementioned arithmetic processing unit performing arithmetic processing in accordance with a computer program stored in a storage device, and the functions of the storage unit 102 are realized by the aforementioned storage device.

[0051] (Machining operation) Next, the machining operation of the above-mentioned machining device will be described. In the first embodiment, in the machining device 1, a cassette 6 containing a plurality of workpieces 200 is placed on the cassette elevator 50, and the control unit 100 receives machining conditions input by an operator from an input unit or the like and registers them in the memory unit 102. The machining conditions include the position of the support part 61 that is allowed to come closest to the cutting edge 211, as described above, and the memory unit 102 stores the position of this support part 61 as a predetermined threshold value in the memory unit 102 of the control unit 100.

[0052] In the processing device 1, the control unit 101 of the control unit 100 irradiates light from the light-emitting window 621 of the light-emitting unit 62 to the light-receiving window 631 of the light-receiving unit 63 while the operator operates the moving unit 64 to gradually bring the support unit 61 closer to the cutting blade 21, and the position of the support unit 61 is adjusted as follows: In the processing device 1, the detection unit 65 detects the position of the support unit 61 based on the image acquired when the operator operates the moving unit 64 to gradually bring the support unit 61 closer to the cutting blade 21 while the control unit 101 of the control unit 100 irradiates light from the light-emitting window 621 of the light-emitting unit 62 to the light-receiving window 631 of the light-receiving unit 63.

[0053] In the processing apparatus 1, when the light-receiving unit 63 stops receiving the light 66 emitted from the light-emitting unit 62, the control unit 101 of the control unit 100 detects the position of the support unit 61 at which the light-receiving unit 63 stops receiving the light 66 emitted from the light-emitting unit 62 based on the image acquired by the detection unit 65, and stores the position in the memory unit 102. When the control unit 101 of the control unit 100 irradiates light from the light-emitting window 621 of the light-emitting unit 62 to the light-receiving window 631 of the light-receiving unit 63 while the operator operates the moving unit 64 to gradually bring the support unit 61 closer to the cutting blade 21, if the position of the support unit 61 detected by the detection unit 65 is farther away from the cutting edge 211 of the cutting blade 21 than the predetermined position described above, the display screen 111 of the display unit 110 displays an arrow 112, shown by a dashed line in FIG. 5, on its display screen 111, indicating that the moving unit 64 is rotating in a direction to bring the support unit 61 closer to the cutting edge 211 of the cutting blade 21, as shown in FIG. 5. In the example shown in Figure 5, the arrow 112 is circumferentially centered on the mark 113 indicating the moving part 64 and is oriented in the same direction as the rotation direction of the moving part 64 when the support part 61 is brought closer to the cutting edge 211.

[0054] Furthermore, in the processing apparatus 1, when the operator operates the moving unit 64 to gradually bring the support unit 61 closer to the cutting blade 21 while the control unit 101 of the control unit 100 is irradiating light from the light-emitting window 621 of the light-emitting unit 62 to the light-receiving window 631 of the light-receiving unit 63, if the position of the support unit 61 detected by the detection unit 65 becomes closer to the cutting edge 211 of the cutting blade 21 than the predetermined position described above, an arrow 114 shown by a two-dot chain line in FIG. 5 is displayed on the display screen 111 of the display unit 110, indicating that the moving unit 64 is rotating in a direction that moves the support unit 61 away from the cutting edge 211 of the cutting blade 21, as shown in FIG. 5. In the example shown in FIG. 5, the arrow 114 is oriented in the circumferential direction around the mark 113 indicating the moving unit 64 and is oriented in the same direction as the rotation of the moving unit 64 when moving the support unit 61 away from the cutting edge 211.

[0055] In this way, when the control unit 101 of the control unit 100 adjusts the position of the support part 61, the processing apparatus 1 causes the display screen 111 of the display unit 110 to display whether the support part 61 should be moved closer to or farther away from the cutting edge 211. Furthermore, when the control unit 101 of the control unit 100 irradiates light from the light-emitting window 621 of the light-emitting part 62 to the light-receiving window 631 of the light-receiving part 63 while the operator operates the moving part 64 to gradually bring the support part 61 closer to the cutting blade 21, if the position of the support part 61 detected by the detection part 65 is at the predetermined position described above, the processing apparatus 1 does not display either of the arrows 112 and 114 shown in FIG. 5 on the display screen 111 of the display unit 110. In this way, when the control unit 101 of the control unit 100 determines that the position of the support part 61 is located at a predetermined position, the processing device 1 does not display on the display screen 111 of the display unit 110 whether to move the support part 61 closer to or farther away from the cutting edge 211.

[0056] In addition, in embodiment 1, when the control unit 101 of the control unit 100 of the processing device 1 determines whether the support part 61 is closer to the cutting edge 211 than the predetermined position described above, the control unit 101 determines this by calculating the movement distance of the support part 61 from the position where the light receiving part 63 stored in the memory part 102 no longer receives light from the light emitting part 62 based on the position of the support part 61 detected based on the image captured by the detection unit 65.

[0057] In addition, when the control unit 101 of the control unit 100 irradiates light from the light-emitting window 621 of the light-emitting unit 62 to the light-receiving window 631 of the light-receiving unit 63 while the operator operates the moving unit 64 to gradually bring the support unit 61 closer to the cutting blade 21, if the position of the support unit 61 detected by the detection unit 65 becomes closer to the cutting edge 211 than the position of the support unit 61 that is allowed to be closest to the cutting edge 211, as shown by the dashed line in Figure 4 described above, the processing device 1 activates the alarm unit 120 to alert the operator. In this way, when the control unit 101 of the control unit 100 irradiates light from the light-emitting window 621 of the light-emitting unit 62 to the light-receiving window 631 of the light-receiving unit 63 while the operator operates the moving unit 64 to gradually bring the support unit 61 closer to the cutting blade 21, the processing device 1 moves the support unit 61 using the moving unit 64, and issues an alert when the position of the support unit 61 comes closer to the cutting edge 211 than the position of the support unit 61 that is allowed to come closest to the cutting edge 211, as shown by the dashed line in Figure 4.

[0058] After the position of the support part 61 has been adjusted, the processing device 1 starts the processing operation when the control part 101 of the control unit 100 receives a processing start command input by the operator from an input unit or the like. In the first embodiment, when the processing operation starts, the control part 101 of the control unit 100 starts rotating the spindle 23 of the cutting unit 20, i.e., the cutting blade 21, and starts supplying cutting water from the cutting water supply nozzle 24 to the cutting blade 21.

[0059] In the first embodiment, in the processing operation, the control unit 101 of the control unit 100 of the processing apparatus 1 controls the cassette elevator 50, the transport unit, etc. to take out one workpiece 200 before cutting from the cassette 6 and place the back surface 204 of the workpiece 200 on the holding surface 11 of the chuck table 10 positioned in the carry-in / out area. In the first embodiment, in the processing operation, as shown in FIG. 4 , the control unit 101 of the control unit 100 suction-holds the back surface 204 of the workpiece 200 on the holding surface 11 of the chuck table 10 positioned in the carry-in / out area, and clamps the frame 206 with the clamp unit 12.

[0060] In the first embodiment, in the machining operation, the control unit 101 of the control unit 100 controls the moving unit 40 to position the chuck table 10 holding the workpiece 200 in the machining area, and causes the imaging unit 30 to capture an image of the workpiece 200 to perform alignment. In the first embodiment, in the machining operation, the control unit 101 of the control unit 100 controls the moving unit 40 and the like to relatively move the cutting edge 211 of the cutting blade 21 and the chuck table 10 along the planned division line 202, while causing the cutting edge 211 of the cutting blade 21, which has rotated around its axis, to cut into the planned division line 202 until it reaches the tape 205, thereby cutting the planned division line 202.

[0061] In the first embodiment, in the machining operation, the control unit 101 of the control unit 100 cuts all of the planned division lines 202 of the workpiece 200 held on the chuck table 10 and divides the workpiece 200 into devices 203, and then moves the workpiece 200 divided into each device 203 toward the carry-in / out area, and releases the suction holding by the holding surface 11 and the clamping by the clamp unit 12 in the carry-in / out area. In the first embodiment, in the machining operation, the control unit 101 of the control unit 100 controls the transport unit to transport the workpiece 200 from the chuck table 10 to the cleaning unit 51, and after cleaning by the cleaning unit 51, the transport unit stores the cut workpiece 200 in the cassette 6. In the first embodiment, in the machining operation, the processing apparatus 1 ends the machining operation when it cuts all of the workpieces 200 in the cassette 6.

[0062] Furthermore, during the machining operation, the control unit 101 of the control unit 100 of the machining device 1 periodically determines whether the amount of light 66 received by the light receiving unit 63 has changed by a predetermined value or more, based on information corresponding to the amount of light 66 received from the light receiving unit 63. When the control unit 101 of the control unit 100 determines that the amount of light 66 received by the light receiving unit 63 has not changed by a predetermined value or more, the machining device 1 continues the machining operation. When the control unit 101 of the control unit 100 periodically determines that the amount of light 66 received by the light receiving unit 63 has changed by a predetermined value or more, the machining device 1 determines that the cutting edge 211 has been damaged, stops the machining operation, and activates the alarm unit 120 to notify the operator.

[0063] As described above, the processing device 1 of embodiment 1 stores the position of the support part 61 that is allowed to come closest to the cutting edge 211 as a predetermined threshold value in the memory part 102 of the control unit 100, and moves the support part using the moving part, and issues an alert when the position of the support part comes closer to the cutting edge 211 than the position of the support part 61 that is allowed to come closest to the cutting edge 211, thereby preventing the support part 61 from coming into contact with the cutting edge 211.

[0064] As a result, the processing device 1 according to embodiment 1 has the advantage of being able to reliably position the support portion 61 that supports the light-emitting portion 62 and the light-receiving portion 63 at a predetermined position without damaging the cutting edge 211 of the cutting blade 21.

[0065] In addition, the processing device 1 of embodiment 1 displays on the display screen 111 of the display unit 110 whether to move the support portion 61 closer to or farther away from the cutting edge 211, so that the support portion 61 can be easily positioned at a predetermined position.

[0066] The present invention is not limited to the above-described embodiment, and can be implemented in various modifications without departing from the gist of the present invention. [Explanation of symbols]

[0067] 1 Processing equipment 10 Chuck table 20 Cutting unit 21 Cutting blade 23 Spindle 60 Detection mechanism 61 Support part 62 Light-emitting part 63 Light receiving part 64 Moving Part 66 light 100 Control unit (control means) 111 Display screen 200 Workpiece 211 cutting edge 213 One Side 214 The Other Side

Claims

1. A processing device, a chuck table for holding the workpiece; a cutting unit including a spindle to which a cutting blade having an annular cutting edge for cutting the workpiece is attached; a light emitting portion disposed opposite one side of the annular cutting edge in a thickness direction; a light receiving portion disposed opposite the other side of the annular cutting edge in the thickness direction and configured to receive the light emitted from the light emitting portion; a support portion that supports the light emitting portion and the light receiving portion; a moving unit that positions the support unit at a predetermined position; a detection mechanism for detecting the state of the annular cutting edge, A control means is provided, The position of the support portion that is allowed to come closest to the cutting edge is stored in the control means as a predetermined threshold value, The support part is moved by the moving part, and a notification is issued when the position of the support part becomes closer to the cutting edge than the predetermined threshold value. Processing equipment.

2. The processing device includes a display screen; displaying on the display screen whether to move the support portion closer to or farther from the cutting edge; The processing device according to claim 1.

Citation Information

Patent Citations

  • Cutting blade detecting mechanism for cutting device

    JP2012051092A