Ink-repellent member, ink jet head, and method of producing article

Abstract

To provide an ink-repellent member which is excellent in both sliding resistance and ink resistance, and to provide an ink jet head.SOLUTION: Provided is an ink-repellent member including an underlying portion containing an inorganic oxide, the ink-repellent member having a fluorine compound bonded to a surface of the underlying portion, where the fluorine compound has a chain structure, and is bonded to the surface by forming a phosphonic acid ester structure at each of both ends thereof.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an ink-repellent member, an ink-jet head in an ink-jet recording apparatus, and a method for manufacturing an article. [Background technology]

[0002] Known ink-ejecting devices (hereinafter referred to as inkjet heads) include bubble jets, which use a heater to instantly vaporize ink to propel droplets, and piezo jets, which use a piezoelectric element to propel droplets. To record high-quality images using an inkjet head, ink droplets must be ejected from the nozzles in a straight line along a predetermined direction. However, if droplet residue adheres to the orifice plate surface around the nozzles, the ink droplets may be dragged by the residue during ejection, causing deviations in the ejection direction and resulting in ink droplets flying off course. To prevent droplet residue from adhering to the nozzles, an ink-repellent film is typically provided around the nozzles to act as an ink-repellent member.

[0003] For example, Patent Document 1 discloses that an undercoat film made of an inorganic oxide is provided on the surface of an orifice plate, and a fluorine-containing silane coupling agent (hereinafter also referred to as a fluorine compound) is chemically bonded to the undercoat film to form an ink-repellent film.

[0004] Furthermore, in inkjet heads, the orifice plate surface is generally cleaned using a wiper to remove droplet residue, paper dust, etc. Therefore, the ink-repellent material is required to have ink resistance and abrasion resistance. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-3483 Summary of the Invention [Problem to be solved by the invention]

[0006] As in Patent Document 1, when a fluorine compound is bonded to a base containing an inorganic oxide to form an ink-repellent film, it is generally known to use a fluorine-containing silane coupling agent.

[0007] There is a demand for an ink-repellent member that has an ink-repellent film that is sufficiently coated with an inorganic oxide-containing base and has excellent sliding resistance and ink resistance. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided an ink-repellent material having a base containing an inorganic oxide and a fluorine compound bonded to the surface of the base, wherein the fluorine compound has a chain structure and is bonded to the surface by forming a phosphonate ester structure at both ends.

[0009] According to another aspect of the present invention, there is provided an inkjet head having the ink-repellent member described above, wherein an ejection port for ejecting liquid is arranged on the side of the ink-repellent member where the base and the fluorine compound are provided.

[0010] According to another aspect of the present invention, there is provided a method for manufacturing an article, comprising the step of ejecting a liquid using the inkjet head, wherein the liquid is an ink containing a functional material for forming a functional thin film or a functional element. [Effects of the Invention]

[0011] According to the present invention, it is possible to provide an ink-repellent member and an ink-jet head that are excellent in both sliding resistance and ink resistance. [Brief explanation of the drawings]

[0012] [Figure 1]1A and 1B are a top view and a bottom view, respectively, of an inkjet head 100 according to an embodiment of the present invention, and a partial perspective view showing a cross section taken along line A-A' shown in FIGS. 1A and 1B. [Figure 2] 1 is a schematic diagram showing a state of an ink-repellent member in which a fluorine compound is bonded to the surface of a base according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0013] An ink-repellent member, an inkjet head, and the like according to embodiments of the present invention will be described with reference to the drawings. Hereinafter, terms such as "ink repellency," "ink-repellent film," and "ink-repellent member" will be used, but these terms may be read as "water repellency," "water-repellent film," and "water-repellent member" assuming aqueous ink. Furthermore, since the type and application of liquid do not necessarily need to be limited when implementing the present invention, in the following description, "ink repellency," "ink-repellent film," and "ink-repellent member" may be read as "liquid repellency," "liquid-repellent film," and "liquid-repellent member." The embodiments shown below are merely illustrative, and those skilled in the art may appropriately modify the detailed configurations within the scope of the present invention.

[0014] In the drawings referred to in the following description of the embodiments and examples, elements denoted by the same reference numerals have the same function unless otherwise specified. Furthermore, the notation "XX or more and YY or less" or "XX to YY" indicating a numerical range means a numerical range including the endpoints XX (lower limit) and YY (upper limit) unless otherwise specified. When a numerical range is described in stages, the upper and lower limits of each numerical range can be arbitrarily combined.

[0015] In this specification, the liquid to be handled may be referred to as "ink," but ink is not limited to liquids used to form characters or images. For example, it may be a liquid containing a functional material for forming functional thin films such as electrodes or optical filters, or functional elements such as organic electroluminescence (EL) elements. Furthermore, ejecting and applying a liquid to an object may be referred to as "recording," but recording in this context does not necessarily mean recording information such as characters or images. For example, it also includes applying a liquid to an object to manufacture products such as functional thin films, functional elements, and three-dimensional objects.

[0016] The ink-repellent member of the present invention has a base containing an inorganic oxide and a fluorine compound bonded to the surface of the base, and is characterized in that the fluorine compound has a chain structure and is bonded to the surface by forming a phosphonate ester structure at both ends.

[0017] In this specification, the ink-repellent member refers to a member including a base having a surface to which a fluorine compound is bonded (a member including a base having a fluorine compound bonded to its surface). The ink-repellent member can be used in various devices where ink repellency is desirable, such as devices to which ink may adhere, such as inkjet heads, or machines that use ink, or as components of such devices. The fluorine compound forms an ink-repellent film by bonding to the surface of the base of the member.

[0018] The present inventors have found that if the surface of the base is not sufficiently coated with an ink-repellent film (fluorine compound), the performance of the ink-repellent member may be reduced due to prolonged contact with ink and sliding.The present inventors have also conducted extensive research to obtain an ink-repellent member in which the base containing an inorganic oxide is sufficiently coated with an ink-repellent film and which can maintain ink resistance and sliding resistance for a long period of time.

[0019] As a result, they found that the above object can be achieved by using a fluorine compound having a chain structure and phosphonic acid groups (phosphonic acid structure) at both ends as an ink-repellent film in the manufacture of an ink-repellent member.

[0020] By using a fluorine compound that can bond to the surface of the substrate by forming a phosphonate ester structure at both ends of the chain structure as an ink-repellent film, it is expected that the ink-repellent film will efficiently form a bond with the surface of the substrate. In addition, the phosphonate group has a proton (H + ), which reacts with the oxygen atoms of the inorganic oxide to form hydroxyl groups (OH groups), which are reaction sites for the fluorine compound. This allows the fluorine compound to bond to the surface of the base with high density, while suppressing the formation of voids, making it possible to realize an ink-repellent material with excellent ink resistance and slide resistance.

[0021] (inkjet head) The inkjet head according to the present invention can be an inkjet head having the ink-repellent member according to the present invention, and having ejection ports for ejecting liquid arranged on the side of the ink-repellent member on which the base and the fluorine compound are provided. The configuration of an inkjet head according to one embodiment of the present invention will be described. Fig. 1(a) is a top view of an inkjet head 100 according to this embodiment, and Fig. 1(b) is a bottom view of the inkjet head 100. Fig. 1(c) is a partial perspective view showing a cross section taken along line A-A' shown in Figs. 1(a) and 1(b).

[0022] The inkjet head 100 includes a first flow path substrate 1 as a first member, a second flow path substrate 2 as a second member, an adhesive layer 3, ejection ports 4, ejection energy generating elements 5, an orifice plate 6, electrodes 7, and an ink tank chamber. In this embodiment, the orifice plate 6 can be an ink-repellent member. The ink tank chamber is not shown in Figures 1(a) to 1(c). Furthermore, among the components of the inkjet head, parts that are not directly related to the description of the present invention (such as electrical circuits and wiring) are not shown.

[0023] The first flow path substrate 1 and the second flow path substrate 2, the first flow path substrate 1 and the orifice plate 6, and the second flow path substrate 2 and the ink tank chamber are bonded and integrated via an adhesive layer 3 to form a flow path structure. The flow path structure is formed with a first through-flow path 8, a second through-flow path 9, and a third through-flow path 19, which communicate with each other to form an ink supply path. Note that for convenience of illustration, only a portion of the adhesive layer 3 is shown in Figure 1(c).

[0024] Ink is supplied from an ink tank chamber (not shown) to a liquid flow path 10 through a second through-flow path 9 formed in each of the second flow path substrate 2 and the first flow path substrate 1, and is given ejection energy by an ejection energy generating element 5, causing the ink to be ejected from an ejection port 4. Ink that is not ejected from an ejection port 4 flows back to the ink tank chamber through a first through-flow path 8 formed in the first flow path substrate 1 and a third through-flow path 19 (return circulation path) formed in the second flow path substrate 2.

[0025] The orifice plate 6 has multiple ejection ports 4, but the arrangement (number and position) of the ejection ports 4 is not limited to the illustrated example. The orifice plate 6 has a substrate on its outer surface, i.e., the orifice surface 6a, which is the surface opposite the liquid flow paths 10. A fluorine compound is bonded to the surface of the substrate, forming an ink-repellent film. Note that no ink-repellent film is formed on the ejection ports 4 arranged on the orifice surface 6a. The first flow path substrate 1 has ejection energy generating elements 5 for ejecting liquid at positions corresponding to each ejection port 4. The ejection energy generating elements 5 are driven in response to an electrical signal transmitted from the outside via electrodes 7. Examples of suitable ejection energy generating elements 5 include electrothermal transducers and piezoelectric elements. Silicon is a suitable material for the substrate of the orifice plate 6. However, other materials such as silicon carbide, silicon nitride, various types of glass, such as quartz glass and borosilicate glass, resins, such as polyimide, alumina, and gallium arsenide may also be used. In this embodiment, the orifice plate 6 is an ink-repellent member, but the ink-jet head 100 itself may be an ink-repellent member.

[0026] (Base) The base provided on the outer surface (orifice surface 6a) of the orifice plate 6 shown in FIG. 1 is made of an inorganic oxide.

[0027] The base can form a chemical bond with a fluorine compound having a phosphonic acid group by forming a hydroxyl group on the surface.

[0028] The fluorine compound bonds to the surface of the base, thereby improving the adhesion of the ink-repellent film (fluorine compound). The ink-repellent member may have a substrate, and the substrate may be formed on the substrate as a base film or a base layer. However, if the substrate itself (bulk material) contains an inorganic oxide, the substrate itself may be used as the base.

[0029] As the inorganic oxide, oxides of tantalum, silicon, zirconium, aluminum, titanium, hafnium, cerium, tungsten, niobium, yttrium, indium, strontium, etc. can be used. In this embodiment, the oxide of tantalum will be described as an example.

[0030] Tantalum oxide forms compounds with oxidation numbers of +2 to +5, and among these, tantalum pentoxide is preferred from the viewpoint of forming many hydroxy groups that serve as reaction sites. In addition to tantalum oxide, oxide materials such as silicon oxide, zirconia, alumina, titania, hafnia, cerium oxide, tungsten oxide, niobium oxide, and yttrium oxide may be further contained.

[0031] For example, a base film containing tantalum oxide can be formed on a substrate (e.g., silicon) by sputtering, ion-assisted vapor deposition, atomic layer deposition (ALD), or the like. Among these, ALD is preferred because it allows for the formation of a high-density film. High density further improves ink resistance to alkaline ink.

[0032] When a base film is provided on a substrate as a base, silicon is generally used as the base material of the layer below the base film. In this case, from the viewpoint of protecting the silicon from ink, the thickness of the base film is preferably 10 nm or more, more preferably 50 nm or more. Furthermore, from the viewpoint of suppressing cohesive failure during sliding, the thickness is preferably 300 nm or less, more preferably 200 nm or less.

[0033] (Fluorine compounds) The fluorine compound used in the present invention has a chain structure, and as shown in FIG. 2, both ends of the chain form a phosphonate ester structure and bond to the surface of the substrate containing an inorganic oxide. The fluorine compound used in the production of the ink-repellent member has phosphonic acid groups (phosphonic acid structures) represented by the following formula (1) at both ends to form a phosphonate ester structure, and has at least two phosphonic acid groups in the compound. The fluorine compound forms phosphonate ester structures at both ends and bonds to the surface of the substrate, allowing the fluorine compound to bond to the surface of the substrate at a high density. Furthermore, by having phosphonic acid groups at both ends of the fluorine compound, protons (H + ) and form hydroxyl groups, which are reactive sites, on the surface of the substrate. This is expected to have the effect of forming hydroxyl groups in areas of the substrate surface where hydroxyl groups do not exist, thereby increasing the density of the bond between the fluorine compound and the substrate surface. [ka] (In formula (1), *1 indicates the bonding position in the fluorine compound.)

[0034] That is, the fluorine compound used in the production of the ink-repellent member in the present invention can be represented by, for example, the following formula (F1). [ka] (In formula (F1), R 1 represents a part of the chain structure of a fluorine compound.)

[0035] From the viewpoint of ensuring ink repellency and sliding resistance, the chain structure of the fluorine compound preferably has a main chain structure containing a perfluoropolyether structure (hereinafter also referred to as a PFPE structure) as a part thereof. The fluorine compound preferably has at least one of the following PFPE structures: a structure represented by the following formula (2), a structure represented by the following formula (3), a structure represented by the following formula (4), and a structure represented by the following formula (5). [ka] [ka] [ka] [ka]

[0036] In the formulas (2), (3), (4), and (5), n1, n2, n3, and n4 each independently represent an integer of 1 or more.

[0037] A preferred specific example of the fluorine compound used in the production of the ink-repellent member is a compound represented by the following formula (6). [ka] (In formula (6), x and y each independently represent an integer of 1 or more, and z represents 1 or 2.)

[0038] An example of a compound that can be used as the compound represented by formula (6) is Fluorolink (registered trademark) PFPE F10 (manufactured by Solvay Specialty Polymers, Inc.).

[0039] In the ink-repellent member according to the present invention, the fluorine compound is bonded to the surface of the substrate by forming a phosphonate ester structure at both ends thereof, as shown in the following formula (F2) or formula (F3), respectively. [ka] [ka] (In formulas (F2) and (F3), *1 indicates the bonding position in the fluorine compound, and *2, *3, and *4 indicate the bonding positions with metal atoms or silicon atoms on the surface of the substrate.)

[0040] The number average molecular weight of the fluorine compound is preferably 2000 or more. The number average molecular weight of the fluorine compound is, for example, 19 It can be calculated by F-NMR measurement.

[0041] (Method of manufacturing ink-repellent member) A method for manufacturing an ink-repellent member by forming an ink-repellent film containing a fluorine compound will be described. The method for forming the ink-repellent film by bonding a fluorine compound to the surface of a base material containing an inorganic oxide can be carried out by dehydration condensation.

[0042] First, a base film containing an inorganic oxide is formed on a substrate such as an orifice plate, and hydroxy groups are formed on the surface of the base film. The inorganic oxide can be formed by sputter deposition using an inorganic oxide target, ALD, CVD (chemical vapor deposition), spin coating, or other methods, but is not limited to these.

[0043] As a method for forming hydroxy groups on the surface of an undercoat film containing an inorganic oxide, there is a method in which hydroxy groups are formed by reacting the surface of the undercoat film with moisture.

[0044] Next, a fluorine compound is applied to the surface of the base film on which the hydroxyl groups have been formed. There are no particular limitations on the application method, and examples of the method include vacuum deposition, thermal deposition, spray coating, spin coating, and dip coating.

[0045] Next, a dehydration condensation reaction is carried out between the phosphonic acid groups present at both ends of the fluorine compound and the hydroxyl groups formed on the surface of the underlayer, forming a phosphonate structure between the fluorine compound and the surface of the underlayer. In addition, a proton (H + ) can form hydroxy groups on the surface of the base film.

[0046] The dehydration condensation reaction occurs at room temperature, but can be accelerated by raising the temperature (for example, 100°C to 120°C). The reaction time can be appropriately selected depending on the temperature; for example, the reaction time is about 24 hours at room temperature and about 1 hour at 120°C.

[0047] Subsequently, the orifice plate is washed to remove any remaining unbonded fluorine compound. There are no particular limitations on the washing method, but for example, the orifice plate may be immersed in a fluorine solvent that is compatible with the fluorine compound. Washing is carried out to the extent that it can be visually confirmed that no fluorine compound remains on the base film.

[0048] After the fluorine solvent has dried, the ink resistance and sliding resistance can be evaluated. Since unbonded fluorine compounds can also contribute to high durability, in practice, it is common to use a surface treatment agent without actively removing the unbonded fluorine compounds. However, the unbonded fluorine compounds diffuse into the ink during contact with the ink, and are removed over time. As a result, the underlying surface with low liquid repellency is exposed, leading to a deterioration in the ink repellency. Therefore, when evaluating ink resistance and sliding resistance, removing the unbonded fluorine compounds allows for more accurate evaluation.

[0049] (Production method of article) The method for manufacturing an article according to the present invention includes a step of ejecting a liquid using the inkjet head according to the present invention, wherein the liquid is an ink containing a functional material for forming a functional thin film or a functional element. The article may be an intermediate product or a final product. The method for manufacturing an article according to this embodiment is suitable for manufacturing an article such as an organic light-emitting diode (OLED) panel using an inkjet head. The method for manufacturing an article according to this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article. [Example]

[0050] Example 1 Tantalum pentoxide was deposited to a thickness of 100 nm on a 3-inch silicon substrate using an ALD film formation device. Next, the silicon substrate on which this tantalum pentoxide was formed as the underlayer was subjected to plasma treatment in a plasma treatment apparatus for the purpose of cleaning.

[0051] Next, the silicon substrate with the treated undercoat film surface was immersed in a solution of a fluorine compound, and the surface on which the undercoat film was formed was coated with fluorine compound FC-1. As the fluorine compound FC-1, a compound having a structure represented by formula (6) and a number average molecular weight of 2300 (Fluorolink (registered trademark) PFPE F10 (manufactured by Solvay Specialty Polymers Co., Ltd.)) was used. The fluorine compound was applied by immersing the silicon substrate for 80 minutes in a 1 mM solution prepared by dissolving the fluorine compound in a fluorine solvent (Galden (registered trademark) SV, manufactured by Solvay Specialty Polymers). Next, the silicon substrate coated with the fluorine compound was removed from the solution, air-dried, and then placed in an oven and heated at 120°C for 1 hour to form an ink-repellent film.

[0052] The silicon substrate was then removed from the oven and immersed in a fluorine-containing cleaning solvent for 30 seconds to remove any unbonded fluorine compounds from the surface, resulting in an ink-repellent material. The cleaning was repeated twice using unused fluorine-containing cleaning solvent.

[0053] Example 2 An ink-repellent film was formed and an ink-repellent member was produced in the same manner as in Example 1, except that fluorine compound FC-1 was changed to fluorine compound FC-2. As fluorine compound FC-2, a compound (synthesized) having a structure represented by formula (6) and a number average molecular weight of 1600 was used.

[0054] Example 3 An ink-repellent film was formed in the same manner as in Example 1, except that SiO2 formed on the surface of a Φ3-inch silicon substrate by heating it at 900°C in an oxygen atmosphere was used as a base film, and an ink-repellent member was produced.

[0055] (Comparative Example 1) An ink-repellent film was formed and an ink-repellent member was produced in the same manner as in Example 1, except that the fluorine compound was changed to fluorine compound FC-3, which has a structure represented by the following formula (7) and has a phosphonic acid group at only one end. As fluorine compound FC-3, a compound (synthesized) having a structure represented by the following formula (7) and a number average molecular weight of 1600 was used. [ka] In formula (7), m and n each independently represent an integer of 1 or more;

[0056] The specifications of the ink-repellent members according to Examples 1 to 3 and Comparative Example 1 are summarized in Table 1 below.

[0057] [Table 1]

[0058] Next, the ink resistance and sliding resistance of the produced ink-repellent member will be evaluated. (Evaluation 1: Ink resistance evaluation) The ink resistance of the prepared ink-repellent member was evaluated according to the following procedure. Alkaline dye ink (BCI-7C, manufactured by Canon Inc.) was used as the ink. The ink was placed in a PFA container, and the ink-repellent member on which the ink-repellent film was formed was immersed so that the entire surface was in contact with the ink, and the container was then sealed with a lid. In this state, the container was placed in an oven and maintained at 60°C for one week. The ink-repellent member was then removed and thoroughly washed with water to remove the ink, and the contact angle was measured and evaluated according to the following method.

[0059] (Evaluation 2: Evaluation of sliding resistance) The sliding resistance of the produced ink-repellent member was evaluated using the following procedure. A high-density felt material (CS-7, manufactured by Taber Industries) was attached to a friction and wear tester (FPR-2100, manufactured by Rhesca Co., Ltd.) as the sliding material, and a reciprocating sliding test was performed on the surface of the ink-repellent member on which the ink-repellent film had been formed. The sliding load was 650 g, the sliding width was 10 mm, the linear velocity was 50.8 mm / sec, and the number of sliding cycles was 6,000. The contact angle of the ink-repellent member after sliding was measured and evaluated using the method described below.

[0060] (Contact angle measurement) Using a microcontact angle meter (product name: DM-701, manufactured by Kyowa Interface Science Co., Ltd., analysis software: FAMAS (ver. 3.5.5)), the dynamic receding contact angle θr with pure water is measured under the following conditions, and the results are ranked according to the following criteria. ·Droplet: 2μL (pure water) Receding contact angle: Calculated by the sessile drop method.

[0061] The receding contact angle was measured as follows: 80 contact angles were measured at 15-second intervals after the droplet had landed. Using the contact angle and contact radius (unit: μm) calculated by the software, the following calculations were performed starting from time 0 seconds, and the following steps (A) and (B) were performed. (A) The value of the contact radius R at time t t , the contact radius value R after t+90 secondst+90 When (R t -R t+90 ) 2 The value x was calculated. (B) When the value of x was 200 or less, the process of (A) was repeated, and the contact angle at the time t when the value of x first exceeded 200 was defined as the dynamic receding contact angle θr. A: 100° or more B: 90° or more and less than 100° C: Less than 90°

[0062] The evaluation results of the ink-repellent films according to Examples 1 to 3 and Comparative Example 1 are summarized in Table 2 below.

[0063] [Table 2]

[0064] The reason why Example 1 exhibits better ink resistance and abrasion resistance than Example 3 is the difference in the inorganic oxides contained in the undercoat film. When comparing Ta2O5 and SiO2, Ta2O5 has a higher oxygen ratio. This is presumably why more hydroxyl groups are formed and fluorine compounds are bonded to the surface of the undercoat at a higher density.

[0065] To be practical as an inkjet head (ink-repellent member), the dynamic receding contact angle needs to be 90° or more. Therefore, the ink-repellent members of Examples 1 to 3, which were rated A to B for both ink resistance and sliding resistance, can be said to have better practical properties than the ink-repellent member of Comparative Example 1.

[0066] The disclosure of this embodiment includes the following configurations and methods. (Configuration 1) An ink-repellent member having a base containing an inorganic oxide, and a fluorine compound bonded to a surface of the base, The ink-repellent member is characterized in that the fluorine compound has a chain structure and is bonded to the surface by forming phosphonate ester structures at both ends. (Configuration 2) 2. The ink-repellent member according to claim 1, wherein the inorganic oxide-containing base contains an oxide of tantalum. (Configuration 3) 3. The ink-repellent member according to claim 1, wherein the fluorine compound has a main chain structure containing a perfluoropolyether structure. (Configuration 4) The ink-repellent member according to any one of configurations 1 to 3, characterized in that the fluorine compound has at least one of a structure represented by the following formula (2), a structure represented by the following formula (3), a structure represented by the following formula (4), and a structure represented by the following formula (5). [ka] [ka] [ka] [ka] (In formula (2), formula (3), formula (4), and formula (5), n1, n2, n3, and n4 each independently represent an integer of 1 or more.) (Configuration 5) 5. The ink-repellent member according to any one of configurations 1 to 4, wherein the number average molecular weight of the fluorine compound is 2,000 or more. (Configuration 6) 6. The ink-repellent member according to any one of configurations 1 to 5, comprising a substrate, and the undercoat is provided on the substrate. (Configuration 7) The ink-repellent member according to any one of configurations 1 to 6 is included, An inkjet head, characterized in that an ejection port for ejecting liquid is arranged on the side of the ink-repellent member where the base and the fluorine compound are provided. (Method 1) A method for manufacturing an article, comprising a step of ejecting a liquid using the inkjet head according to Configuration 7, The method for manufacturing an article, wherein the liquid is an ink containing a functional material for forming a functional thin film or a functional element. [Explanation of symbols]

[0067] 1···First flow path substrate / 2···Second flow path substrate / 3···Adhesive layer / 4···Ejection port / 5···Ejection energy generating element / 6···Orifice plate / 6a···Orifice surface / 7···Electrode / 8···First through-flow path / 9···Second through-flow path / 10···Liquid flow path / 19···Third through-flow path / 100···Inkjet head

Claims

1. An ink-repellent member having a base containing an inorganic oxide, and a fluorine compound bonded to a surface of the base, The ink-repellent member is characterized in that the fluorine compound has a chain structure and is bonded to the surface by forming phosphonate ester structures at both ends.

2. 2. The ink-repellent member according to claim 1, wherein the base containing an inorganic oxide contains an oxide of tantalum.

3. The ink-repellent member according to claim 1 , wherein the fluorine compound has a main chain structure containing a perfluoropolyether structure.

4. The ink-repellent member according to claim 1, characterized in that the fluorine compound has at least one of a structure represented by the following formula (2), a structure represented by the following formula (3), a structure represented by the following formula (4), and a structure represented by the following formula (5). 【Chemistry 1】 【Chemistry 2】 【Transformation 3】 【Chemistry 4】 (In formulas (2), (3), (4), and (5), n1, n2, n3, and n4 each independently represent an integer of 1 or more.)

5. 2. The ink-repellent member according to claim 1, wherein the number average molecular weight of the fluorine compound is 2,000 or more.

6. The ink-repellent member according to claim 1 , further comprising a substrate, the undercoat being provided on the substrate.

7. The ink-repellent member according to any one of claims 1 to 6, An inkjet head, characterized in that an ejection port for ejecting liquid is arranged on the side of the ink-repellent member where the base and the fluorine compound are provided.

8. A method for manufacturing an article, comprising a step of ejecting a liquid using the inkjet head according to claim 7, The method for manufacturing an article, wherein the liquid is an ink containing a functional material for forming a functional thin film or a functional element.

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