Display device

Abstract

To provide a novel human interface with excellent operability, a novel information processing device with excellent operability, or a novel information processing device and a novel display device or the like, for example.SOLUTION: There are provided, an input / output device to which image information is supplied and which supplies detection information, and a calculation device which supplies the image information and to which the detection information is supplied. The input / output device includes a detection unit that detects an object that interrupts display on a plurality of display units or one display unit for displaying display information, and includes one region where the one display unit and the detection unit are disposed, another region where another display unit is disposed, and a bent part held between the one region and another region. The calculation device includes a calculation unit, and a storage unit that stores programs to be executed by the calculation unit.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] One aspect of the present invention is a method for processing and displaying image information, a program, and a program recorded thereon. In particular, one aspect of the present invention relates to an information processing device having a display unit. Image information processing and display method for displaying an image including information processed by a processing device, and a display unit A program for displaying an image including processed information on an information processing device equipped with the program, and The present invention relates to an information processing device having a recording medium on which a program is recorded.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. The technical field of one aspect relates to an article, a method, or a manufacturing method. One aspect of the present invention is a process, machine, manufacture, or composition. Therefore, the invention disclosed herein more specifically relates to The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, Examples include their driving methods and their manufacturing methods. [Background technology]

[0003] In addition, the social infrastructure related to information transmission methods has been improved. This allows for a wide range of information to be transmitted. It is possible to acquire, process, or transmit information using information processing devices not only at work or at home but also on the go. It has become.

[0004] In this context, portable information processing devices have been actively developed.

[0005] For example, portable information processing devices are often carried around while in use, and if they are dropped, they can be damaged unexpectedly. Forces may be applied to the information processing device and the display device used therein. As an example of a display device, the adhesion between the structure separating the light-emitting layer and the second electrode layer is improved. The configuration is known (Patent Document 1).

[0006] For example, a mobile phone characterized in that a display device is disposed on the front surface and upper portion of the housing in the longitudinal direction. A mobile phone is known (Patent Document 2). [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-190794 [Patent Document 2] Japanese Patent Application Laid-Open No. 2010-153813 Summary of the Invention [Problem to be solved by the invention]

[0008] One aspect of the present invention is to provide a novel human interface with excellent operability. Another object of the present invention is to provide a novel information processing device with excellent operability. Alternatively, one of the objects is to provide a novel information processing device, a novel display device, etc. do.

[0009] The description of these problems does not preclude the existence of other problems. It is not necessary for the present invention to solve all of these problems. The above will be made clear from the description, drawings, claims, etc. It is possible to extract other issues from the descriptions in the patent, claims, etc. [Means for solving the problem]

[0010] In one aspect of the present invention, a first detection information is provided by receiving first image information and second image information. an input / output device that supplies first image information and second image information and provides first detection information; and a computing unit to which the information is supplied.

[0011] The input / output device includes a first display unit that receives and displays the first image information, a second image A second display unit that receives and displays information, and a display unit that detects an obstruction to the display on the first display unit. a first detection unit that supplies first detection information and a first area in which a first display unit is disposed; a second region in which a second display unit is disposed, and a second region sandwiched between the first region and the second region. It has a first bend.

[0012] The calculation device includes a calculation unit and a storage unit that stores a program to be executed by the calculation unit. The calculation unit generates first image information or second image information based on the first detection information. do.

[0013] The information processing device according to one aspect of the present invention includes an input / output device that receives image information and supplies detection information. The input / output device has a display information input / output device and a calculation device that supplies image information and receives detection information. a plurality of display units that display information and a detection unit that detects an obstruction to the display of one of the display units; One area where one display unit and one detection unit are arranged, another area where another display unit is arranged, and The calculation device includes a calculation unit and a bending portion sandwiched between the first region and the second region. and a storage unit that stores a program to be executed by the generating image information based on the detection information provided from the one area and / or the other area; As a result, a novel information processing device can be provided.

[0014] In one embodiment of the present invention, the input / output device detects an object blocking a display on the second display unit and a second detection unit that supplies the detection information; and a calculation unit that receives the second detection information and performs calculation. The calculation unit calculates the first image information or the second image information based on the first detection information or / and the second detection information. and / or generates second image information.

[0015] The information processing device according to one embodiment of the present invention further includes a second display unit and a second display unit. A second detection unit detects anything that obstructs the display of the display unit, and a second display unit and a second detection unit are arranged. and a second area provided with the second detection signal. Image information can be generated based on the information and displayed on an input / output device. It is possible to provide an information processing device.

[0016] In addition, one aspect of the present invention is a method for manufacturing a mobile phone, comprising: The information processing device is capable of:

[0017] The information processing device according to the aspect of the present invention can be folded or unfolded. This allows the size of the first area to be adjusted for portability. As a result, new information can be obtained. An information processing device can be provided.

[0018] In addition, one aspect of the present invention is a method for detecting a first detection information by receiving first image information and second image information. an input / output device that supplies first image information and second image information and detects the first detected information; and a computing unit to which the information is supplied.

[0019] The input / output device includes a terminal section to which the first image information and the second image information are supplied, a first a first display unit that receives and displays the image information of the first image; a second display unit that receives and displays the image information of the second image; Detects an obstruction to the display of the second display unit and the first display unit and supplies first detection information. a first region in which the first detection unit and the first display unit are arranged, and a second region in which the second display unit is arranged; The second region, the third region in which the terminal portion is arranged, and the third region sandwiched between the first region and the second region. a first bent portion and a second bent portion sandwiched between the first region and the third region, The regions provide first image information and second image information, and the first region provides the first image information. and a second image information is supplied, and the second area supplies the second image information. Information will be provided.

[0020] The calculation unit generates first image information or second image information based on the first detection information. It is an information processing device that

[0021] The information processing device according to one embodiment of the present invention includes a first area where a first display unit is arranged, a second area where a second display unit is arranged, and a a second region in which a display portion is arranged, a third region in which a terminal portion is arranged, and a first region and a second region a first bent portion sandwiched between the first region and the third region; and a second bent portion sandwiched between the first region and the third region. Thus, the terminal unit supplies the first image information and the second image information. The first area displays the first image information and provides the second image information, and the second area displays the second image information. As a result, a novel information processing device can be provided.

[0022] In one embodiment of the present invention, an input / output device supplies first position information and second position information. The calculation device is supplied with the first position information and the second position information, and the input / output device is a first location information input unit that supplies location information; and a second location information input unit that supplies second location information. and an input unit, and the first area has a first position information input unit at a position overlapping with the first display unit. The second area includes a second position information input unit at a position overlapping the second display unit. , the above-mentioned information processing device.

[0023] The information processing device according to the aspect of the present invention is configured to display a first positional information in which the first area overlaps with the first display unit. and a second position information input unit whose second area overlaps with the second display unit. This allows image information to be generated based on the position information supplied from one information input unit. The information can be displayed on the first display unit or the second display unit. We can provide a management device.

[0024] In one aspect of the present invention, a program is a first program for acquiring initial information including status information. a second step of allowing interrupt processing; and a third step of acquiring predetermined information. Step 1, if the status information is the first status, go to step 5, if the status information is the second status, go to step 6, If the status is 4th step go to 6th step and based on the information 1st image a fifth step of generating information and displaying the first image information on the first display unit; a sixth step of generating second image information using the image data and displaying the second image information on a second display unit. If an end command is issued in the interrupt process, the process proceeds to step 8. If the result is not successful, the seventh step proceeds to the third step, and the eighth step ends. The information processing device includes:

[0025] The interrupt process then proceeds to a ninth step of acquiring the first detection information and the second detection information. and a tenth step of determining candidate information based on the first detection information and the second detection information. If the candidate information is different from the status information, go to step 12. If the candidate information is the same as the status information, go to step 13. If so, proceed to step 9. If so, proceed to step 11. Update the status information to the candidate information. The method includes a twelfth step, and a thirteenth step of returning from the interrupt processing.

[0026] The information processing device according to the aspect of the present invention further includes a program for processing the first detection information and the second detection information. Steps for obtaining information and determining candidate information, and if the status information differs from the candidate information The method includes updating the status information to candidate information, and and generating and displaying image information including predetermined information. By setting the image information generated based on the status information, an image including predetermined information is created. As a result, a novel information processing device can be provided. [Effects of the Invention]

[0027] According to one aspect of the present invention, a novel human interface with excellent operability can be provided. Alternatively, a novel information processing device with excellent operability can be provided. It is possible to provide a novel display device and a novel display device. Note that the description of these effects may be omitted if other effects exist. However, it is not necessary for one embodiment of the present invention to have all of these effects. It is not necessary to have the above effects. Effects other than these will be obvious from the description, drawings, claims, etc. It is clear that the invention has other effects than these, and the description, drawings, claims, etc. It is possible to extract it. [Brief explanation of the drawings]

[0028] [Figure 1] FIG. 1 is a block diagram illustrating a configuration of an information processing device according to an embodiment. [Figure 2] FIG. 1 is a schematic diagram illustrating a configuration of an information processing device according to an embodiment. [Figure 3] FIG. 1 is a schematic diagram illustrating a configuration of an information processing device according to an embodiment. [Figure 4] FIG. 1 is a block diagram illustrating a configuration of an information processing device according to an embodiment. [Figure 5] FIG. 1 is a schematic diagram illustrating a configuration of an information processing device according to an embodiment. [Figure 6] FIG. 1 is a schematic diagram illustrating a configuration of an information processing device according to an embodiment. [Figure 7] FIG. 3 is a flow diagram illustrating a program stored in a storage unit of the information processing device according to the embodiment. [Figure 8] FIG. 3 is a flow diagram illustrating a program stored in a storage unit of the information processing device according to the embodiment. [Figure 9] 1A and 1B are diagrams illustrating a configuration of a touch panel that can be used in an information processing device according to an embodiment. [Figure 10] 1A and 1B are diagrams illustrating a configuration of a touch panel that can be used in an information processing device according to an embodiment. [Figure 11] 1A and 1B are diagrams illustrating a configuration of a touch panel that can be used in an information processing device according to an embodiment. [Figure 12] 1A and 1B are diagrams illustrating a configuration of a touch panel that can be used in an information processing device according to an embodiment. [Figure 13] 1A to 1C are diagrams illustrating a method for manufacturing a bendable device according to an embodiment. [Figure 14] 1A to 1C are diagrams illustrating a method for manufacturing a bendable device according to an embodiment. [Figure 15]1A to 1C are diagrams illustrating a method for manufacturing a bendable device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0029] An information processing device according to one embodiment of the present invention includes an input / output device that receives image information and supplies detection information. The input / output device has a calculation unit that supplies image information and receives detection information. The display device includes a plurality of display units and a detection unit that detects an obstruction to the display of one of the display units, One area where a display unit and a detection unit are arranged, another area where another display unit is arranged, and one The calculation device has a curved portion sandwiched between the area and another area. and a storage unit that stores a program to be executed.

[0030] This allows image information to be generated based on the detection information supplied from the first area, and As a result, a novel and easy-to-use display can be achieved. A new information processing device that can provide a human interface or has excellent operability Alternatively, a novel information processing device, a novel display device, etc. can be provided.

[0031] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiments, and various changes and modifications may be made in the form and details thereof without departing from the spirit and scope of the present invention. It will be readily understood by those skilled in the art that the present invention can be achieved by the following embodiments. It should not be construed as being limited to the contents of the description. The same reference numerals are used in different drawings to denote the same parts or parts having similar functions. A repeated explanation will be omitted.

[0032] (Embodiment 1) In this embodiment, a configuration of an information processing device according to one embodiment of the present invention will be described with reference to FIGS. 1 and 2. Explain with reference to the above.

[0033] FIG. 1 is a block diagram illustrating a configuration of an information processing device 100 according to one embodiment of the present invention.

[0034] FIG. 2A is a schematic diagram illustrating the appearance of an information processing device 100 of one embodiment of the present invention. 2B is a cross-sectional view illustrating the structure of the cross section taken along the line X1-X2 shown in FIG. 2A. .

[0035] FIG. 2(C-1) shows a position information input unit and a display unit that can be applied to the information processing device 100. 1 is a schematic diagram illustrating the appearance of a portion. FIG.

[0036] FIG. 2(C-2) illustrates the appearance of a proximity sensor 142 that can be applied to the position information input unit. FIG.

[0037] FIG. 2(D) is a cross-sectional view of the proximity sensor 142 taken along the cutting line X3-X4 shown in FIG. 2(C-2). FIG. 2 is a cross-sectional view illustrating the structure.

[0038] <Configuration example 1 of information processing device> The information processing device 100 described in this embodiment processes first image information V1 and second image information V2. an input / output device 120 that receives the first detection information V2 and supplies the first image information V1; a computing unit 110 which supplies the first and second image information V2 and receives the first detection information S1; , (see Figure 1).

[0039] The input / output device 120 receives the first image information V1 and displays it on the first display unit 1. 30(1), a second display unit 130(2) that receives and displays the second image information V2, a first detection unit for detecting an object obstructing the display of the display unit 130(1) and supplying first detection information S1; The input / output device 120 includes a first display unit 130(1) and a second display unit 130(2). and a first area 120(1) in which the first detection unit 150(1) is arranged, a second display unit 13 0(2) and the first area 120(1) and the second area 120(2). The first bending portion 120c(1) is sandwiched between the first bending portion 120c(2) and the second bending portion 120c(3) (FIGS. 1 and 2(A)). and Figure 2(B)).

[0040] The calculation device 110 stores a calculation unit 111 and a program to be executed by the calculation unit 111. The calculation unit 111 then calculates the value of the first detection information S1 based on the first detection information S1. , the first image information V1 or the second image information V2 is generated (see FIG. 1).

[0041] The information processing device according to one aspect of the present invention includes an input / output device that receives image information and supplies detection information. The input / output device 120 supplies image information and receives detection information from the calculation device 110. The device 120 detects an obstruction to the display of a plurality of display units that display information and one of the display units. a region in which one display unit and the detection unit are arranged, and a region in which another display unit is arranged The computing device further includes a bent portion sandwiched between the first and second regions. The computer includes a calculation unit and a storage unit that stores a program to be executed by the calculation unit. This allows image information to be generated based on the detection information supplied from one area, As a result, a novel information processing device can be provided. Cut.

[0042] The input / output device 120 supplies the first position information L1 and the second position information L2. The device 110 may be configured to receive first location information L1 and second location information L2. (See Figure 1).

[0043] The input / output device 120 is provided with a position information input unit 140 that can supply position information. For example, the first area 120(1) may be a first area overlapping the first display unit 130(1). The second area 120(2) may include a second position information input section 140(1). A second position information input unit 140(2) may be provided that overlaps the display unit 130(2).

[0044] The first location information input unit 140(1) supplies the first location information L1 and the second location information input unit 140(2) supplies the first location information L2. The output unit 140(2) may provide second position information L2.

[0045] The information processing device 100 exemplified in this embodiment receives position information from a position information input unit. and displaying the image information on the first display unit or the second display unit. As a result, a novel information processing device can be provided.

[0046] Also, an input / output unit 145 that supplies and receives information, and a communication unit that supplies and receives communication information COM. The device may also include a signal receiving unit 160.

[0047] The arithmetic unit 110 also includes a transmission line 114 for supplying and receiving information, and a The device may have an input / output interface 115.

[0048] The individual elements that make up the information processing device will be described below. It is not possible to separate them exactly, and one component may also be another component or may contain parts of another component. .

[0049] For example, a touch panel in which a touch sensor is superimposed on a display unit is the display unit 130 and , and also serves as a position information input unit 140.

[0050] In this embodiment, the position information input unit 140 is placed on the display surface side of the display unit 130. The following description will be given taking as an example a touch sensor having a configuration, but the configuration is not limited to this. The display unit 130 may be placed on the detection surface side of the information input unit 140. The position information input unit 30 and the position information input unit 140 may have an integrated structure. The touch panel may be either a cell-type touch panel or an in-cell-type touch panel.

[0051] Overall composition The information processing device 100 includes an input / output device 120 and a calculation device 110 (see FIG. 1).

[0052] Input / output devices The input / output device 120 includes a display unit 130 and a detection unit 150. The input / output device 120 includes a first Image information V1 and second image information V2 are supplied, and first detection information S1 and second detection information S2 are The knowledge information S2 is supplied.

[0053] The input / output device 120 includes a position information input unit 140, an input / output unit 145, and a communication unit 160. and

[0054] The input / output device 120 includes a first region 120(1), a second region 120(2), a first bent portion 120c(1) and a second bending portion 120c(2) (FIGS. 2(A) and 2(B) )reference).

[0055] "Bend" The area with the largest curvature between the first area 120(1) and the second area 120(2) The place where the change occurs is the first bent portion 120c(1). For example, when the input / output device 120 is It has a curved surface including a region 120(1) and a second region 120(2), and the first region 120( When the first bent portion 120c(1) and the second region 120(2) are continuous, the first bent portion 120c(1) is The curvature radius of the bent part is 10 mm. Preferably, it is 8 mm or less, more preferably 5 mm or less, and particularly preferably 4 mm or less. be.

[0056] The first bending portion 120c(1) and / or the second bending portion 120c(2) have a display unit and A position information input section may be provided over the display section. This allows the second position information L2 to be input. Instead, the first bent portion 120c(1) and / or the second bent portion 120c(2) provide Location information may also be used.

[0057] "The First Zone" The first area 120(1) includes a first display unit 130(1) and a first detection unit 150(1). Equipped with.

[0058] The first area 120(1) may also include a first position information input section 140(1). stomach.

[0059] The Second Realm The second area 120(2) includes a second display section 130(2).

[0060] The second area 120(2) includes a second detection unit that detects an object that obstructs the display of the second area. 150(2) and / or a second position information input unit 140(2).

[0061] FIG. 2B shows an example in which there are two second regions 120(2), but the present invention is not limited to this. The input / output device 12 may have only one second area 120(2) or three or more second areas 120(2). Included in 0.

[0062] For example, two second regions 120(2) may be arranged to face each other (see FIG. 2( The distance between the two second regions 120(2) is preferably set to, for example, 17 cm or less. Preferably, the distance is 9 cm or less, and more preferably, 7 cm or less. The position information input unit 140(1) specifies a wide range of position information using the thumb of the hand holding the device. It is possible.

[0063] 《Display section》 The display unit 130 is not particularly limited as long as it can display the supplied image information (see FIG. 2 (See (C-1)).

[0064] The display unit 130 includes a first display unit 130(1) and a second display unit 130(2).

[0065] The first display unit 130(1) displays the supplied first image information V1, and the second display unit 1 30(2) displays the second image information V2 supplied.

[0066] The first display unit 130(1) and the second display unit 130(2) are driven as an integrated display unit. For example, a configuration may be adopted in which one driver circuit supplies a signal for selecting a scanning line.

[0067] The first display unit 130(1) and the second display unit 130(2) are driven as different display units. For example, a drive circuit may be provided for each display unit, and each drive circuit may A signal for selecting a scanning line may be supplied to the display unit.

[0068] For example, when the information processing device 100 is in a standby state, only the second display unit 130(2) is driven. Then, the driving of the first display unit 130(1) may be stopped. By stopping the driving, it is possible to reduce power consumption.

[0069] In addition, the flexible portion 120c(1) is bent at a position where it overlaps with the first bent portion 120c(1). A display unit having such a function can be used for the display unit 130. Typical configuration examples will be described in the fourth, fifth and sixth embodiments.

[0070] 《Detection Unit》 The detection unit 150 detects the state of the information processing device 100 and its surroundings and supplies detection information. (See Figure 1.)

[0071] The detection unit 150 includes a first detection unit 150(1), and the first detection unit includes a first display unit 130. The first detector 150(1) detects anything that obstructs the display of the first display unit 1. The first detection information S1 includes information on whether the display of the display 30(1) is blocked or not.

[0072] For example, various detection elements such as a photoelectric conversion element, an image pickup element, a magnetic sensor, a proximity sensor, etc. This can be applied to the detection unit 150(1).

[0073] Specifically, the intensity of light incident from the side where the first display unit 130(1) displays image information is The photoelectric conversion element 150PD is disposed in the first region 120(1) so as to detect the See A).

[0074] As a result, the first region of the photoelectric conversion element 150PD protects the information processing device 100. It can detect when the device is covered with a case, cover, clothing, etc.

[0075] The location where the first detection unit 150(1) is arranged is not limited to the first region 120(1). Any other location may be used as long as it can detect anything that obstructs the display of the first display unit 130(1). For example, it may be placed in a second area, or information provided by another device may be used as the first detection information. May be used for S1.

[0076] Specifically, a detection element with a sufficiently wide detection range using a fisheye lens is placed in the second area. Alternatively, the image captured by a surveillance camera may be used as the first detection unit 150(1). may be acquired from a communication network and used as the first detection information S1.

[0077] The detection unit 150 detects, for example, acceleration, direction, pressure, and GPS (Global Positioning System). ionizing system) signals, temperature, humidity, etc., and provide that information. Good too.

[0078] <<Location information input section>> The position information input unit 140 detects an object in the vicinity and inputs the position information of the object in the vicinity to the calculation device 1. 10. The position information input unit 140 is disposed closer to the user than the display unit 130. In this case, the position information input unit 140 is translucent.

[0079] For example, the user of the information processing device 100 may bring a finger, a palm, or the like close to the position information input unit 140. This allows various operation commands to be sent to the information processing device 100. For example, It is possible to supply operating instructions, including an instruction to terminate the program.

[0080] For example, proximity sensors 142 are arranged in a matrix on a flexible substrate 141 to input position information. The force section 140 may be configured (see Figures 2(C-1), 2(C-2), and 2(D)). .

[0081] The position information input unit 140 includes a first position information input unit 140(1) and a second position information input unit 140(2). 40(2).

[0082] The first location information input unit 140(1) supplies the first location information L1 and the second location information input unit 140(2) supplies the first location information L2. The output unit 140(2) supplies the second position information L2.

[0083] The first position information input unit 140(1) and the second position information input unit 140(2) are integrated into one position. It may also be driven as an information input unit.

[0084] The position information input unit 140 is divided into a first position information input unit 140(1) and a second position information input unit 14 0(2) and drive each of them partially. In other words, the second position information The input unit 140(2) may be driven independently of the first position information input unit 140(1). .

[0085] The X1-X2 direction is the row direction, and the direction intersecting the row direction is the column direction. The first position information input section 140(1) and the second position information input section 140(2) are crossed in the row direction. A plurality of scanning lines extending in the column direction, a plurality of signal lines extending in the column direction, and a voltage applied to one scanning line and one signal line. The electromagnetically connected proximity sensors 142 are arranged in a matrix.

[0086] a proximity sensor connected to a first signal line disposed in the first position information input unit 140(1); , a proximity sensor connected to a second signal line disposed in the second position information input unit 140(2) and may be driven independently to partially drive the position information input unit 140.

[0087] Specifically, when only the first position information input unit 140(1) is used, Only the proximity sensor connected to the first signal line is driven.

[0088] Specifically, when only the second position information input unit 140(2) is used, Only the proximity sensor connected to the second signal line is driven.

[0089] The scanning line is a line between the first position information input unit 140(1) and the second position information input unit 140(2). ), the proximity sensor disposed in the first position information input unit 140(1) and the The proximity sensors disposed in the second position information input unit 140(2) are driven at different times.

[0090] For example, when the housing 101 of the information processing device 100 is held by hand, Even if only the position information input unit 140(1) is driven and the driving of the second position information input unit is stopped, By stopping the driving of the second position information input unit 140(2), the information processing device 1 The second position information input unit 140(2) that detects the hand holding the 00 supplies the second position information. This can reduce malfunctions caused by the signal L2.

[0091] For example, the power consumed by the first position information input unit 140(1) and the power consumed by the second position information input unit The total power consumed by the first position information input unit 140(2) is If the force is greater than the force, the second position information input unit 14 Alternatively, only the first position information input unit 0(2) may be driven, and the driving of the first position information input unit may be stopped. By stopping the driving of the information input unit 140(1), it is possible to reduce power consumption.

[0092] The proximity sensor 142 is a sensor that can detect proximity or contact (for example, a finger or a palm). For example, a capacitance element or an image sensor can be applied. The substrate with the image sensor is called a capacitive touch sensor, and the substrate with the image sensor is called an optical touch sensor. It is possible to do so.

[0093] The flexible substrate 141 can be made of a resin having a thickness sufficient to provide flexibility. Examples of such materials include polyester, polyolefin, polyamide (nylon, aramid, etc.), Examples of the resin include polyimide, polycarbonate, and acrylic resin.

[0094] In addition, typical substrates that do not have flexibility include glass substrates, quartz substrates, and semiconductor substrates. etc. can be used.

[0095] In addition, the flexible portion 120c(1) is bent at a position where it overlaps with the first bent portion 120c(1). The position information input unit 140 can be used as the position information input unit 140. Specific configuration examples applicable to the present invention will be described in the fourth, fifth and sixth embodiments. The following will be explained.

[0096] Communications Department The communication unit 160 transmits the information COM supplied by the arithmetic unit 110 to a device external to the information processing device 100. It also acquires and provides information COM from external devices or communication networks. Provide.

[0097] The information COM can include various commands in addition to audio information, image information, etc. For example, An operation for causing the calculation unit 111 to generate or erase the first image information V1 and the second image information V2 It may contain instructions.

[0098] Communication means for connecting to external devices or communication networks, such as a hub, router, or modem can be applied to the communication unit 160. Note that the connection method is not limited to a wired method, but may be a wireless method (for example, Radio waves or infrared rays may also be used.

[0099] 《Input / output section》 For example, cameras, microphones, read-only external storage, external storage, scanners, speakers A printer or the like can be used as the input / output unit 145 (see FIG. 1).

[0100] Specifically, a digital camera, a digital video camera, etc. can be used as the camera. do.

[0101] A hard disk or removable memory can be used as the external storage unit. , CD-ROM, DVD-ROM, etc. can be used as the read-only external storage unit.

[0102] 《Arithmetic device》 The arithmetic device 110 includes a calculation unit 111 and a storage unit 112. The arithmetic device 110 includes a first Image information V1 and second image information V2 are supplied, and first detection information S1 and second detection information S2 are supplied. The information S2 is provided (see FIG. 1).

[0103] For example, the computing device 110 may generate a first image including an image to be used for operating the information processing device 100. image information V1 and second image information V2.

[0104] The first image information V1 is displayed on the first display unit 130(1), and the second image information V2 is displayed on the second display unit 130(2).

[0105] The computing device 110 is also configured to receive first position information L1 and second position information L2. For example, the first display unit 13 of the first position information input unit 140(1) may have a configuration. By touching the position where the image for operation displayed in 0(1) overlaps with the image for operation, The user can provide the operation command associated with the image to the computing device 110. The position information input unit 140(2) is displayed on the second display unit 130(2) for use in the operation. By touching the position where the image overlaps with the image with a finger, the user can perform the operation associated with the image. Instructions can be provided to the computing device 110 .

[0106] The arithmetic unit 110 also has a transmission line 114 and an input / output interface 115. Good too.

[0107] 《Arithmetic section》 The calculation unit 111 executes a program stored in the storage unit 112. For example, When the position information associated with the position where the image to be displayed is supplied, the calculation unit 111 A program that has been previously associated with the image is executed.

[0108] 《Memory Department》 The storage unit 112 stores a program to be executed by the calculation unit 111 .

[0109] An example of a program executed by the arithmetic unit 110 will be described in the third embodiment. do.

[0110] Input / output interface / transmission path Input / output interface 115 provides and is supplied with information.

[0111] The transmission line 114 can supply information, and the calculation unit 111, the memory unit 112, and the input / output interface The interface 115 is supplied with information. The output interface 115 can provide information, and the transmission line 114 provides information. will be done.

[0112] The information processing device 100 includes an arithmetic unit 110, an input / output unit 120, a housing 101, (See FIG. 2(B)).

[0113] 《Case》 The housing 101 protects the arithmetic unit 110 and other components from external stress.

[0114] The housing 101 can be made of metal, plastic, glass, ceramics, or the like.

[0115] <Configuration example 2 of information processing device> Another configuration of the information processing device of one embodiment of the present invention will be described with reference to FIG.

[0116] FIG. 3 is a diagram illustrating the configuration of an information processing device 100B according to an embodiment of the present invention.

[0117] 3A-1 and 3A-2 are perspective views of a data processing device 100B of one embodiment of the present invention. 3(A-2) is a perspective view of FIG. 3(A-1) as seen from the rear side. ) is a top view.

[0118] FIG. 3B shows a position information input unit 140 and a position information input unit 140 that can be applied to the information processing device 100B. 1 is a schematic diagram illustrating the appearance of a display unit 130. FIG.

[0119] FIG. 3C is a diagram illustrating a state in which the information processing device 100B is used.

[0120] The information processing device 100B described in this embodiment blocks the display of the second display unit 130(2). The second detection unit 150(2) detects the object and supplies second detection information S2. This differs from the information processing device 100 described with reference to FIG. The above description will be used in detail for parts where a similar configuration can be used.

[0121] In the information processing device 100B described in this embodiment, the input / output device 120 is a second display unit 1 a second detection unit 15 that detects an object obstructing the display of the display unit 30(2) and supplies second detection information S2; Equipped with 0(2).

[0122] The arithmetic unit 110 is also supplied with second detection information S2.

[0123] The calculation unit 111 also calculates the temperature based on the first detection information S1 and / or the second detection information S2. Thus, the first image information V1 and / or the second image information V2 is generated.

[0124] The information processing device 100B described in this embodiment performs the following operations based on the detection information supplied from one area. Based on the information, image information can be generated and displayed on an input / output device. A processing device can be provided.

[0125] When the second area 120(2) is placed in a breast pocket of a garment with the second area 120(2) facing upward, the user The text and image information displayed in the area 120(2) can be easily read while the device is still in the pocket. This can be easily confirmed (see Figure 3(C)).

[0126] For example, the second area 120( 2) can be observed from above.

[0127] The information processing device 100B includes a vibration sensor and a vibration sensor that detects vibrations. The device has a storage device that stores a program for switching to a mode for rejecting incoming calls based on the received signal. This allows the user to lightly tap the information processing device 100B over their clothes to vibrate it. By providing this, the device can be put into a mode in which incoming calls are rejected.

[0128] 《Display section》 The display unit 130 is not particularly limited as long as it can display the supplied image information (see FIG. 3). For example, a display unit applicable to the information processing device 100 may be referred to as an information processing device 100B. can be applied to.

[0129] The display unit 130 includes a first display unit 130(1) and a second display unit 130(2). , a plurality of second display units 130(2) may be provided.

[0130] The first display unit 130(1) displays the supplied first image information V1, and the second display unit 1 30(2) displays the second image information V2 supplied.

[0131] The first display unit 130(1) and the second display unit 130(2) are driven as an integrated display unit. For example, a configuration may be adopted in which one driver circuit supplies a signal for selecting a scanning line.

[0132] The first display unit 130(1) and the second display unit 130(2) are driven as different display units. For example, a drive circuit may be provided for each display unit, and each drive circuit may A signal for selecting a scanning line may be supplied to the display unit.

[0133] For example, when the information processing device 100B is in a standby state, only the second display unit 130(2) is driven. The first display unit 130(1) may be stopped by moving the power switch 130(1) to the ON position. By stopping the driving of the LED, power consumption can be reduced.

[0134] The first bent portion 120c(1) and the second bent portion 120c(2) are bent at positions where they overlap. A flexible display unit that can be bent can be used for the display unit 130. Specific configuration examples applicable to the display unit 130 are described in the fourth embodiment, the fifth embodiment, and the sixth embodiment. This will be explained in form 6.

[0135] 《Detection Unit》 The detection unit 150 detects the state of the information processing device 100B and its surroundings and supplies detection information. (See Figure 1, Figure 3(A-1) and Figure 3(A-2)).

[0136] The detection unit 150 includes a first detection unit 150(1) and a second detection unit 150(2). The first detector detects anything blocking the display of the first display unit 130(1), and the second detector detects anything blocking the display of the second display unit 130(2). The first detector 150(1) detects anything that obstructs the display of the display unit 130(2). First detection information S1 including information on whether the display of the first display unit 130(1) is blocked or not The second detection unit 150(2) detects a state in which the display on the second display unit 130(2) is blocked. The second detection information S2 includes information on whether or not the second display unit is provided. In this case, the information includes information as to whether the display of any one of the second display units is blocked or not.

[0137] A detection element that can be applied to the first detection unit 150(1) can be applied to the second detection unit 150(2). For example, a light source arranged to detect an object obstructing the display of the second display unit 130(2) may be used. The electric conversion element can be applied to the second detection unit 150(2).

[0138] Specifically, the first region 120(1) detects the intensity of light incident from the display side. As shown, the photoelectric conversion element 150PD(1) is disposed in the first region 120(1), and the second display unit 1 30(2) is a photoelectric conversion element 150P so as to detect the intensity of light incident from the display side. D(2) is placed in the second region 120(2) (see FIG. 3(A-1) or FIG. 3(A-2)). (see).

[0139] As a result, the first region including the photoelectric conversion element 150PD(1) of the information processing device 100B and / or a second region including the photoelectric conversion element 150PD(2) is the information processing device 100B. It can detect when the device is covered with a protective case, cover, clothing, etc.

[0140] Furthermore, the detection unit 150 may be configured to detect objects that obstruct the display of other display units.

[0141] <<Location information input section>> The location information input unit 140 is not particularly limited as long as it can supply location information (see FIG. 3( For example, a position information input unit applicable to the information processing device 100 may be Applicable to 00B.

[0142] In addition, the flexible portion 120c(1) is bent at a position where it overlaps with the first bent portion 120c(1). The position information input unit 140 can be used as the position information input unit 140. Specific configuration examples applicable to the present invention will be described in the fourth, fifth and sixth embodiments. The following will be explained.

[0143] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0144] (Embodiment 2) In this embodiment, a configuration of an information processing device according to one embodiment of the present invention will be described with reference to FIGS. 4 and 5. Explain with reference to the above.

[0145] FIG. 4 shows a display unit 130 and a position information input unit 140 included in an information processing device 100C according to an embodiment of the present invention. 140 and the detection unit 150 are different from the information processing device 100 described in FIG. Figure.

[0146] FIG. 5 is a diagram illustrating the configuration of an information processing device 100C according to an embodiment of the present invention.

[0147] FIG. 5(A-1) is a top view of the information processing device 100C in an unfolded state, and FIG. 5(A-2) is a top view of the information processing device 100C in an unfolded state. ) is a bottom view of the information processing device 100C in an unfolded state.

[0148] 5B is a side view of the information processing device 100C, and FIG. 5C is a cross-sectional view of the information processing device 100C taken along the cutting line Y in FIG. 5A. 1-Y2 is a side view including a cross section.

[0149] FIG. 6 is a diagram illustrating the information processing device 100C in a folded state. 6(A-1) and 6(A-2), the display area of ​​the first area 120(1) is folded inward. 6(B-1) and 6(B-2) are side views illustrating the state in which the first region 120(1) is folded so that the display unit is on the outside.

[0150] <Configuration example 3 of information processing device> In the information processing device 100C described in this embodiment (see FIG. 4), the input / output device 120 is a first The image information V1 (V1 includes V1a and V1b) and the second image information V2 are supplied. The first location information L1 (L1 includes L1a and L1b) and the second location information L2 , the first detection information S1 (S1 includes S1a and S1b) and the second detection information S2 In terms of supplying the information, the first display unit 130(1) is the display unit 130(1a) and the display unit 130(1). b), the first position information input unit 140(1) is provided with the position information input unit 140(1a) and and the position information input unit 140(1b), and the first detection unit 150(1) is the detection unit 15 1. The first area 120(1) is provided with a folding section 120(1a) and a detecting section 150(1b). The point that it has an input / output device that can be in a folded state or in a deployed state is shown in FIG. It is different from the information processing device 100 described in the first embodiment. The above description will be used in detail for the parts where a similar configuration can be used. .

[0151] The input / output device 120 comprises a first area 120(1) and a second area 120(2). The first region 120(1) comprises a region 120(1a) and a region 120(1b). 120(1) can be folded between region 120(1a) and region 120(1b) ( See Figure 4).

[0152] The area 120(1a) includes a display unit 130(1a) and a position information input unit 140(1a), The area 120(1b) includes a display section 130(1b) and a position information input section 140(1b) ( See Figures 4 and 5(C)).

[0153] The second area 120(2) includes a display section 130(2) and a position information input section 140(2). include.

[0154] The detection unit 150 includes the detection unit 150(1a), the detection unit 150(1b), and the detection unit 150(2). The detection unit 150(1a) detects an object that obstructs the display of the display unit in the area 120(1a). The detector 150(1b) is provided in the housing 15a so that it can detect the presence of the object. The display unit is provided on the housing 15b so that it can detect anything that obstructs the display (see FIG. 5(A- See 1).

[0155] The information processing device 100 is folded in half so that the detection unit 150(1a) is on the inside. The side view of C is shown in Figure 6(A-1) and Figure 6(A-2). The display in area 120(1a) faces area 120(1b), and the display in area 120(1a) is not blocked by area 120(1b). Moreover, the display of the area 120(1b) is blocked by the area 120(1a).

[0156] The second area 120(2) of the information processing device 100C in the folded state is shown in FIG. The display can be directed in one direction as shown by the arrow in (A-1).

[0157] The detector 150(1a) provides a signal that the first region 120(1) is folded inward. Based on the detection information S1a and / or the detection information S1b supplied by the detection unit 150(1b), Then, the driving of the part of the first display unit 130(1) where the display is blocked is performed. This can reduce power consumption.

[0158] In addition, the information processing device is folded in two so that the detection unit 150(1a) is on the outside. 100C is shown in FIG. 6(B-1) and FIG. 6(B-2). The back surface of the region 120(1a) is the region The area 120(1a) or the area 120(1b) faces the back of the area 120(1b). The display is not obscured by other areas.

[0159] The first area 120(1) of the information processing device 100C in the folded state is shown in FIG. It can be displayed in three directions as shown by the arrows in (B-2). 120(2) can be used to display in one other direction.

[0160] The detection information S1a supplied by the detection unit 150(1a), the detection information S2a supplied by the detection unit 150(1b), Based on the information S1b or the detection information provided by the gravity sensor or the gyro sensor, The posture of the information processing device 100C can be known. Based on the above, a portion of the first area 120(1) that is not required for display is determined, and its driving is stopped. This can reduce power consumption.

[0161] The information processing device 100C is a second device that can be folded or unfolded. This allows the size of the first area to be portably As a result, new information can be obtained. An information processing device can be provided.

[0162] The information processing device 100C is also supplied with the first image information V1 and the second image information V2. and an input / output device 120 for supplying the first detection information S1, and a first image information V1 and a second image information V2. and a calculation unit 110 that receives the image information V2 and the first detection information S1 (see FIG. See 4).

[0163] The input / output device 120 includes a terminal section to which the first image information V1 and the second image information V2 are supplied. 125, a first display unit 130(1) that receives and displays the first image information V1, a second display unit 130(2) that receives and displays the first image information V1, The second display unit 130(2) receives and displays the image information V2, and the first display unit 130 (1) A first detection unit 150 ( 1) (Fig. 4, Fig. 5(C)).

[0164] The input / output device 120 also includes a first area 120( 1), a second area 120(2) in which a second display unit 130(2) is arranged, and a terminal unit 125 The third region 120(3) is arranged in the first region 120(1) and the second region 120(2). The first bent portion 120c(1) is sandwiched between the first region 120(1) and the third region The second bent portion 120c(2) is sandwiched between the regions 120(3) (FIG. 5(C)).

[0165] The third area 120(3) provides the first image information V1 and the second image information V2. The first area 120(1) is supplied with the first image information V1 and the second image information V2. The second area 120(2) is supplied with the second image information V2. (Figure 5(D)).

[0166] The calculation unit 111 calculates the first image information V1 or the second image information V2 based on the first detection information S1. Generate information V2.

[0167] The information processing device 100C has a first area 120(1) in which a first display unit 130(1) is arranged. ), a second area 120(2) in which a second display unit 130(2) is arranged, and a terminal unit 125. The third region 120(3) is placed in the first region 120(1) and the second region 120(2). The first bent portion 120c(1) and the first region 120(1) and the third region 120(1) are sandwiched between them. 20(3) and includes a second bent portion 120c(2). The terminal 125 supplies the first image information V1 and the second image information V2, and the first area 1 20(1) displays the first image information V1 and provides the second image information V2, and the second area 1 20(2) can display the second image information V2. As a result, a novel information processing device We can provide placement.

[0168] The individual elements that make up the information processing device 100C will be described below. The components cannot be clearly separated, and one component may serve as another component or may contain parts of another component. There is a match.

[0169] The information processing device 100C has a foldable housing and a first area 12 The fact that 0 (1) can be folded is different from the information processing device described in the first embodiment. The different configurations are described in detail here, and where similar configurations can be used, The above description is incorporated herein by reference.

[0170] Overall composition The information processing device 100C has an input / output device 120, which is in an unfolded state. and a first region 120(1) that can be folded. The output device 120 has a first region 120(1) and a second region 120(2) sandwiching a first bent portion 120c(1). The second region 120(2) has a second bent portion 120c( 2) and a third region 120 (3) (see FIGS. 4 and 5). The first region 120(1), the second region 120(2), and the third region 120(3) are arranged in the The first region 120(1) is divided into the second region 120(2) and the third region 120(3). and is electrically connected.

[0171] The first region 120(1) can be in an unfolded state and a folded state. and is held in a foldable housing.

[0172] It should be noted that the detector 150(1a) and the detector 150(1b) may be provided.

[0173] 《Case》 The housing allows the first region 120(1) to be unfolded or folded.

[0174] For example, flexible housings 13a and 13b and flexible housings 13a and 13b may be used. The information processing device 100C has housings 15a and 15b that are less flexible than the housings 15a and 15b.

[0175] Flexible members or hinges can be used in foldable housings. In addition to the method using the user's hands, springs, electric motors such as motors, piezo elements, etc. The housing may be opened and closed in this manner.

[0176] Specifically, resin, rubber, silicone rubber, etc. can be used for the flexible member. Alternatively, metals, alloys, engineering plastics, etc. can be used for the hinges. .

[0177] Furthermore, the information processing device 100C may include a more rigid housing than a foldable housing. good.

[0178] The housing 13a does not block the display of the first area 120(1) and the second area 120(2). (See FIG. 5(A-1)), and the display unit 130 and the position information input unit 140 are mounted in a housing. The sensor 13 is disposed between the housing 13a and the housing 13b (see FIG. 5(B)).

[0179] The housing 13a and the housing 13b connect the housing 15a and the housing 15b (FIG. 5(A-1) and See Figure 5(A-2)).

[0180] The housing 15a has a shape that does not block the display of the first area 120(1) (see FIG. 5(A-1) and and Figure 5(C)).

[0181] The housing 15a houses the arithmetic unit 110. The arithmetic unit 110 receives the first image information V1 and the second image information V2. The second image information V2 is supplied to the image sensor 1, and the first detection information S1 is supplied to the image sensor 1.

[0182] The housing 15b is arranged so as not to obstruct the display of the first area 120(1) and the second area 120(2). Specifically, the housing 15a has an opening so as not to block the display of the first area 120(1). The housing 15b has an opening so as not to block the display in the second area 120(2). It has an opening on the right hand side.

[0183] The user of the information processing device 100C can see the display of the second area 120(2) on the left side. The user can then change the way he holds the information processing device 100C so that it is positioned in the same position as the user.

[0184] In addition, based on the detection information relating to the orientation of the information processing device 100C supplied by the detection unit 150, , the first image information V1 or the second image information V2 may be generated. It is possible to display an appropriate image according to the orientation of the hand holding the processing device 100C. The user holds the housing 15a with his left hand and uses his right hand to input position information into the second area 120(2). 140(2) can provide location information.

[0185] <<Display and location information input section>> The input / output device 120 includes a first area 120(1) that can be folded. The first area 120(1) includes a first display unit 130(1) and a first detection unit 150(1). Prepare.

[0186] For example, a flexible substrate and a thin film element formed on the flexible substrate may be used. The input / output device can be used as the input / output device 120 .

[0187] The foldable input / output device is divided into a first area 120(1) and a second area 120(2). ), the first region 120(1) and the second region 120(2) are integrally formed. It should be noted that a specific structure applicable to the foldable input / output device 120 is Examples will be described in the fourth, fifth and sixth embodiments.

[0188] The input / output device 120 has a terminal portion 125 in the third region 120(3). (3) is supplied with the first image information V1 and the second image information V2, and the first detection information S1 The terminal portion 125 supplies the electrical current (see FIG. 5(D)).

[0189] The input / output device 120 has a plurality of wirings. For example, the wiring 126 is electrically connected to the terminal portion 125. The terminals are connected to each other, and can supply a signal, a power supply potential, or the like to the terminals.

[0190] Specifically, the wiring in the third region 120(3) receives the first image information V1 and The second image information V2 is supplied to the first area 120(1). The wiring supplies the supplied second image information V2 to the second area 120(2).

[0191] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0192] (Embodiment 3) In this embodiment, a configuration of an information processing device according to one embodiment of the present invention will be described with reference to FIGS. 7 and 8. Explain with reference to the above.

[0193] 7 is a flowchart illustrating a program for an information processing device according to one embodiment of the present invention. 7 is a flowchart illustrating the interrupt processing of the program described using FIG.

[0194] <Configuration example 1 of information processing device> The information processing devices 100 to 100C described in this embodiment are configured by the following steps: The device includes a storage unit 112 that stores a program including the above-mentioned functions.

[0195] First Step In the first step, initial information including status information is acquired (FIG. 7(S1)).

[0196] Obtain initial information to be used in later steps. For example, use predetermined information for status information. Alternatively, the detection information supplied by the detection unit may be used.

[0197] Second Step In the second step, interrupt processing is permitted (FIG. 7(S2)). The arithmetic unit 111 that is permitted to process an interrupt can receive an execution command for the interrupt process. Then, the arithmetic unit 111 that has received the execution command for the interrupt process executes the main process. For example, the execution instruction for the interrupt process is The calculation unit 111 receives the event and executes the interrupt process, and stores the execution result. After that, the calculation unit 111 returns to the main processing from the interrupt processing. can be resumed based on the execution result of the interrupt process.

[0198] The third step In the third step, predetermined information is acquired (FIG. 7(S3)).

[0199] Predetermined information that will be the basis for the first image information or the second image information to be generated in a later step For example, the size of the first region 120(1) or the second region 120(2) is the smallest. It also acquires image and text information before optimization. The command or information provided is reflected in the third and subsequent steps.

[0200] The Fourth Step In the fourth step, if the status information is the first status, proceed to the fifth step. If the status is the second, proceed to the sixth step (FIG. 7(S4)).

[0201] For example, the value determined based on the first detection information S1 supplied by the first detection unit 150(1) is When the display of the status information in the first area 120(1) is not obstructed, Step 6 is performed when the display of the first area 120(1) is blocked. Proceed to step 1.

[0202] The fifth step In the fifth step, first image information V1 is generated based on the information obtained in the third step. and displays the first image information V1 on the first display unit 130(1) (FIG. 7(S5)). .

[0203] For example, a first image arranged so that text information is displayed in one or more lines. The information V1 is generated by changing the orientation, size, or setting of the first display unit 130(1). It can also be generated based on the user's preferred design.

[0204] Step 6 In the sixth step, the second image information V2 is generated based on the information obtained in the third step. The second image information V2 is generated and displayed on the second display unit 130(2) (FIG. 7(S6)).

[0205] For example, the second image information V2 is generated so that text information is displayed in a flowing manner. The direction, size, or speed of the part 130(2) can be set by the user. Cut.

[0206] The Seventh Step In the seventh step, if a termination command is supplied in the interrupt process, the eighth step If the supply is not successful, the process proceeds to the third step (FIG. 7 (S7)).

[0207] The Eighth Step In the eighth step, the process ends (FIG. 7(S8)).

[0208] <<Interrupt Processing>> The interrupt process also includes the following steps:

[0209] The 9th Step In the ninth step, the first detection information S1 and the second detection information S2 are acquired (see FIG. 8(T9)).

[0210] Specifically, the first detection information S supplied by the first detection unit 150(1) is measured using a timer or the like. The second detection information S2 supplied by the first and second detection units 150(2) is acquired.

[0211] The Tenth Step In the tenth step, candidate information is determined based on the first detection information S1 (FIG. 8( T10).

[0212] The 11th Step In the eleventh step, if the candidate information is different from the status information, the twelfth step If they are the same, proceed to the ninth step (FIG. 8 (T11)).

[0213] The 12th Step In the twelfth step, the status information is updated to the candidate information (FIG. 8 (T12)).

[0214] For example, if there is a change in the first detection information S1, the status information is updated.

[0215] The 13th Step In the thirteenth step, the process returns from the interrupt process (FIG. 8 (T13)).

[0216] In interrupt processing, the updated status information is reflected in the third step and onwards. In addition, if an end command is issued during interrupt processing, the eighth Proceed to step and finish.

[0217] In the information processing device according to the aspect of the present invention, a program acquires first detection information and generates candidate information. and if the status information is different from the candidate information, determining the status information. updating the candidate information to include predetermined information based on the updated status information; and a step of generating and displaying image information. The image containing the status information can be displayed in the area set based on the status information. As a result, a novel information processing device can be provided.

[0218] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0219] (Fourth embodiment) In this embodiment, the display unit 130 and the position information input unit of the information processing device according to one embodiment of the present invention are For a configuration of a bendable touch panel that can be applied to 140, see FIG. 9. He explains while doing so.

[0220] FIG. 9A illustrates a structure of a touch panel that can be used in a data processing device of one embodiment of the present invention. FIG.

[0221] FIG. 9B is a cross-sectional view taken along the cutting lines AB and CD in FIG. 9A.

[0222] FIG. 9C is a cross-sectional view taken along the line EF in FIG. 9A.

[0223] <Explanation of top view> A touch panel 300 exemplified in this embodiment includes a display portion 301 (see FIG. 9A). .

[0224] The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. The imaging pixels 308 are It is possible to detect a finger or the like touching the display unit 301. A touch sensor can be configured using the above.

[0225] The pixel 302 includes a plurality of sub-pixels (for example, the sub-pixel 302R), each of which includes a light-emitting element and a The pixel circuit is capable of supplying power to drive the light emitting element.

[0226] The pixel circuit includes wiring that can supply a selection signal and wiring that can supply an image signal. The wiring is electrically connected to the wiring.

[0227] The touch panel 300 also includes a scan line driving circuit that can supply a selection signal to the pixel 302. a signal line driver circuit 303g(1) capable of supplying an image signal to the pixel 302; Equipped with 303s(1).

[0228] The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

[0229] The imaging pixel circuit has wiring that can supply a control signal and a power supply potential. It is electrically connected to the wiring that can be used.

[0230] The control signal may be, for example, a pixel circuit for reading out a recorded image signal. a signal that can initialize the imaging pixel circuit; and a signal that can initialize the imaging pixel circuit. Examples of such signals include signals that can determine the time at which the signal is detected.

[0231] The touch panel 300 includes an imaging pixel drive circuit that can provide control signals to the imaging pixels 308. The image pickup circuit 303 includes a line 303g(2) and an image pickup signal line drive circuit 303s(2) that reads out image pickup signals.

[0232] <Explanation of the cross-sectional view> The touch panel 300 includes a substrate 310 and an opposing substrate 370 that faces the substrate 310. (See Figure 9(B)).

[0233] By applying a flexible material to the substrate 310 and the opposing substrate 370, flexibility can be achieved. It can be provided to the touch panel 300.

[0234] When the flexible touch panel 300 is deformed, the The functional element is placed approximately at the center of the substrate 310 and the opposing substrate 370. This is preferable because it is possible to suppress deformation of the functional element.

[0235] It is also preferable to use materials having approximately the same linear expansion coefficient for the substrate 310 and the counter substrate 370. For example, if the linear expansion coefficient of a material is 1 x 10 -3 / K or less, preferably 5×10 -5 / K or less , more preferably 1 × 10 -5 It is best if it is / K or less.

[0236] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide Amide, polycarbonate or acrylic, urethane, epoxy or siloxane bonded The substrate 310 and the counter substrate 370 can be made of a material containing a resin having such properties.

[0237] The substrate 310 includes a flexible substrate 310b and a barrier film that prevents impurities from diffusing into the light-emitting element. 310a and a resin layer 310c that bonds the substrate 310b and the barrier film 310a are laminated. It is a laminated body.

[0238] The opposing substrate 370 is made up of a flexible base material 370b and a burr that prevents impurities from diffusing into the light emitting element. The laminate of the barrier film 370a and the resin layer 370c that bonds the substrate 370b and the barrier film 370a It is a layered body (see FIG. 9(B)).

[0239] The sealing material 360 bonds the opposing substrate 370 and the substrate 310 together. It has a refractive index higher than that of air and also serves as a layer with an optical bonding function. The light emitting element (for example, the first light emitting element 350R) is disposed between the substrate 310 and the opposing substrate 370. .

[0240] 《Pixel configuration》 The pixel 302 has a subpixel 302R, a subpixel 302G, and a subpixel 302B (FIG. 9( Also, the subpixel 302R includes a light-emitting module 380R, and the subpixel 302G includes a light-emitting module 380R. The subpixel 302B comprises a light-emitting module 380G, and the subpixel 302B comprises a light-emitting module 380B.

[0241] For example, the subpixel 302R provides power to the first light-emitting element 350R and the second light-emitting element 350R. (See FIG. 9B) The light emitting module 380R includes a first light emitting element 350R and an optical element (for example, a 1 colored layer 367R).

[0242] The first light emitting element 350R includes a first lower electrode 351R, an upper electrode 352, a first lower electrode Between 351R and the upper electrode 352, there is a layer 353 containing a light-emitting organic compound (FIG. 9(C) )reference).

[0243] The layer 353 containing a light-emitting organic compound includes a light-emitting unit 353a, a light-emitting unit 353b, and a light-emitting layer 353c. An intermediate layer 354 is provided between the light-emitting unit 353a and the light-emitting unit 353b.

[0244] The light emitting module 380R has a first colored layer 367R on the counter substrate 370. The colored layer Any material may be used as long as it transmits light having a specific wavelength, such as red, green, or blue. Alternatively, a material that selectively transmits light emitted by a light-emitting element can be used. Alternatively, a region that is transparent as it is may be provided.

[0245] For example, the light emitting module 380R includes a first light emitting element 350R and a first color layer 367R. It has a sealant 360 in contact with it.

[0246] The first colored layer 367R is located so as to overlap the first light emitting element 350R. A part of the light emitted by the light emitting element 350R is guided by the sealing layer which also functions as an optical bonding layer. The light is transmitted through the material 360 and the first colored layer 367R and is incident on the light emitting module as shown by the arrow in the figure. It is ejected outside the Lu 380R.

[0247] <<Display panel configuration>> The touch panel 300 has a light-shielding layer 367BM on the counter substrate 370. is provided so as to surround the colored layer (for example, the first colored layer 367R).

[0248] The touch panel 300 includes an anti-reflection layer 367p at a position overlapping the display unit 301. The blocking layer 367p may be, for example, a circular polarizer.

[0249] The touch panel 300 includes an insulating film 321. The insulating film 321 covers the transistor 302t. The insulating film 321 serves as a layer for flattening unevenness caused by the pixel circuit. In addition, it is possible to suppress the diffusion of impurities into the transistor 302t, etc. An insulating film in which layers capable of being formed are stacked can be applied to the insulating film 321.

[0250] The touch panel 300 has a light emitting element (for example, a first light emitting element 350R) disposed on an insulating film 321. Has.

[0251] The touch panel 300 has a partition wall 328 overlapping the end of the first lower electrode 351R, and the partition wall 328 is formed on the insulating film 32. 1 (see FIG. 9C). In addition, the distance between the substrate 310 and the counter substrate 370 is controlled. Spacers 329 are provided on the partition walls 328 .

[0252] <Configuration of Image Signal Line Driving Circuit> The image signal line driver circuit 303s(1) includes a transistor 303t and a capacitor 303c. The driver circuit can be formed on the same substrate as the pixel circuit in the same process.

[0253] <<Image pixel configuration>> The imaging pixel 308 converts light incident on the photoelectric conversion element 308p and the photoelectric conversion element 308p into a The imaging pixel circuit includes a transistor 308t. include.

[0254] For example, a pin-type photodiode can be used as the photoelectric conversion element 308p.

[0255] Other Configurations The touch panel 300 includes wiring 311 through which signals can be supplied, and terminals 319 are disposed. It is provided on the line 311. It is possible to supply signals such as image signals and synchronization signals. The FPC 309 ( 1 ) is electrically connected to the terminal 319 .

[0256] In addition, a printed wiring board (PWB) may be attached to the FPC309(1). .

[0257] The transistors formed in the same process are referred to as transistors 302t and 303t. , and transistors such as transistor 308t.

[0258] A transistor having a structure such as a bottom gate type or a top gate type can be used.

[0259] Various semiconductors can be used in transistors. For example, oxide semiconductors, single-crystal silicon, polysilicon, Polysilicon or amorphous silicon can be used.

[0260] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0261] (Embodiment 5) In this embodiment, a foldable display device that can be applied to a data processing device of one embodiment of the present invention will be described. The configuration of such a touch panel will be described with reference to FIGS.

[0262] FIG. 10A is a perspective view of a touch panel 500 exemplified in this embodiment. For clarity, representative components are shown in FIG. 10. FIG. 10(B) shows the diagonal view of the touch panel 500. FIG.

[0263] FIG. 11 is a cross-sectional view of the touch panel 500 taken along line X1-X2 of FIG. 10(A).

[0264] The touch panel 500 includes a display unit 501 and a touch sensor 595 (see FIG. 10(B)). The touch panel 500 also includes a substrate 510, a substrate 570, and a substrate 590. It should be noted that the substrates 510, 570 and 590 are all flexible.

[0265] The display unit 501 includes a substrate 510, a plurality of pixels on the substrate 510, and a display device for supplying signals to the pixels. The display panel 503 includes a plurality of wirings 511 that can be connected to the image signal line driver circuit 503s(1), and an image signal line driver circuit 503s(1). The plurality of wirings 511 are routed to the outer periphery of the substrate 510, and some of them form terminals 519. The terminal 519 is electrically connected to the FPC 509(1).

[0266] <Touch sensor> The substrate 590 includes a touch sensor 595 and a plurality of electrodes electrically connected to the touch sensor 595. The wiring 598 is arranged around the periphery of the substrate 590, and some of the wiring 598 is This terminal is electrically connected to the FPC 509(2). In FIG. 10(B), for clarity, the substrate 590 is provided on the rear surface side (the surface side facing the substrate 510). The electrodes and wiring of the touch sensor 595 are shown by solid lines.

[0267] As the touch sensor 595, for example, a capacitance type touch sensor can be applied. The methods include a surface capacitance method and a projected capacitance method.

[0268] Projected capacitive touch panels are classified into self-capacitance and mutual-capacitance types, which differ mainly in their drive methods. The mutual capacitance method is preferable because it allows simultaneous multi-point detection.

[0269] In the following, when a projected capacitive touch sensor is applied, Fig. 10(B) is used. This will be used to explain.

[0270] In addition, various sensors that can detect the proximity or contact of a detection target such as a finger are applied. It is possible.

[0271] The projected capacitive touch sensor 595 has an electrode 591 and an electrode 592. 91 is electrically connected to one of the plurality of wirings 598, and the electrode 592 is electrically connect to one of the others.

[0272] As shown in FIGS. 10(A) and 10(B), the electrode 592 is a plurality of electrodes repeatedly arranged in one direction. It has a shape in which quadrilaterals are connected at their corners.

[0273] The electrode 591 is quadrilateral and is repeatedly arranged in a direction intersecting the direction in which the electrode 592 extends. It is being done.

[0274] The wiring 594 electrically connects the two electrodes 591 that sandwich the electrode 592. It is preferable that the area of ​​the intersection of 592 and wiring 594 be as small as possible. This reduces the area of ​​the region where no electrodes are provided, and reduces variations in transmittance. Therefore, unevenness in brightness of light passing through the touch sensor 595 can be reduced.

[0275] The shapes of the electrodes 591 and 592 are not limited to this, and various shapes are possible. For example, The electrodes 591 are arranged so that there are as few gaps as possible between them, and the electrodes 59 are connected to each other via an insulating layer. 2 may be provided at intervals so as to leave an area that does not overlap with the electrode 591. At this time, a dummy electrode electrically isolated from the two adjacent electrodes 592 is placed between them. Providing a pole is preferable because it can reduce the area of ​​the region with different transmittance.

[0276] The configuration of the touch sensor 595 will be described with reference to FIG.

[0277] The touch sensor 595 includes a substrate 590, electrodes 591 arranged in a staggered pattern on the substrate 590, and The electrode 592, the electrode 591, and the insulating layer 593 covering the electrode 592, and the adjacent electrode 591 are Electrically connecting wiring 594 is provided.

[0278] The resin layer 597 is formed by bonding the substrate 590 to the substrate 590 so that the touch sensor 595 overlaps the display portion 501. It is attached to 570.

[0279] The electrode 591 and the electrode 592 are formed using a light-transmitting conductive material. Conductive materials that can be used include indium oxide, indium tin oxide, indium zinc oxide, Conductive oxides such as zinc oxide and zinc oxide doped with gallium can be used. Alternatively, a film containing graphene may be used. The film containing graphene may be formed in a film shape, for example. The film containing graphene oxide can be formed by reducing the film. and methods of applying heat.

[0280] After forming a film of a light-transmitting conductive material on a substrate 590 by a sputtering method, By using various patterning techniques such as lithography, unnecessary parts are removed to form the electrode 591. and electrode 592 can be formed.

[0281] The insulating layer 593 may be made of a resin such as acrylic or epoxy, or a silicon dioxide film. In addition to resins with oxane bonds, silicon oxide, silicon oxynitride, aluminum oxide, etc. Any inorganic insulating material can be used.

[0282] An opening reaching the electrode 591 is provided in the insulating layer 593, and a wiring 594 is formed on the adjacent electrode 5 91 is electrically connected. The transparent conductive material can increase the aperture ratio of the touch panel. Therefore, it can be suitably used for the wiring 594. A material with higher conductivity can be used preferably for the wiring 594 because it can reduce electrical resistance. Cut.

[0283] One electrode 592 extends in one direction, and a plurality of electrodes 592 are provided in a stripe pattern.

[0284] The wiring 594 is provided to intersect with the electrodes 592 .

[0285] A pair of electrodes 591 are provided with one electrode 592 sandwiched therebetween, and wiring 594 connects the pair of electrodes 591. Electrically connected.

[0286] The plurality of electrodes 591 do not necessarily need to be arranged in a direction perpendicular to one electrode 592. The angle between the first and second electrodes may be less than 90 degrees.

[0287] One wiring 598 is electrically connected to the electrode 591 or the electrode 592. The wiring 598 may be made of, for example, aluminum, gold, platinum, silver, Nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium Metallic materials such as aluminum and alloy materials containing such metallic materials can be used.

[0288] Note that an insulating layer is provided to cover the insulating layer 593 and the wiring 594 to protect the touch sensor 595. It is possible.

[0289] Furthermore, the connection layer 599 electrically connects the wiring 598 and the FPC 509(2).

[0290] The connection layer 599 may be made of various anisotropic conductive films (ACFs). Conductive Film) and Anisotropic Conductive Paste (ACP) Pic Conductive Paste) can be used.

[0291] The resin layer 597 is transparent. For example, a thermosetting resin or an ultraviolet curing resin may be used. Specifically, resins having acrylic, urethane, epoxy, or siloxane bonds can be used. Resins such as fats can be used.

[0292] <Display section> The display unit 501 includes a plurality of pixels arranged in a matrix. It includes a pixel circuit that drives the element.

[0293] In this embodiment, an organic electroluminescence element that emits white light is used as a display element. Although a case where it is applied will be described, the display element is not limited to this.

[0294] For example, organic electroluminescence (OLED) devices emit different colors of light so that each sub-pixel emits a different color of light. A light-emitting element may be applied to each sub-pixel.

[0295] In addition to organic electroluminescence elements, electrophoresis methods, electronic powder methods, and electro Display elements that display using the trowetting method (also called electronic ink), shutter Various display devices, including MEMS display devices using the optical interference method, and liquid crystal devices, are available. The display element can be used as a display element. It can also be applied to displays, reflective liquid crystal displays, direct-view liquid crystal displays, etc. When realizing a semi-transmissive or reflective LCD display, the pixel voltage A part or all of the electrodes may be made to function as a reflective electrode. For example, A part or all of the pixel electrodes may be made of aluminum, silver, or the like. Furthermore, in this case, it is also possible to provide a memory circuit such as an SRAM below the reflective electrode. This further reduces power consumption. A suitable configuration can be selected from a variety of pixel circuits.

[0296] In addition, the display unit may be an active matrix type having active elements in the pixels, or A passive matrix system that does not have active elements can be used.

[0297] In the active matrix system, the active element (active element, nonlinear element) is a transistor. Use not only transistors but also various active elements (active elements, nonlinear elements) For example, MIM (Metal Insulator Metal) or TF It is also possible to use a thin film diode (D). Since the number of manufacturing steps is small, it is possible to reduce manufacturing costs and improve yields. Alternatively, these elements can improve the aperture ratio due to their small size, It is possible to achieve low power consumption and high brightness.

[0298] Active elements (active elements, non-linear elements) other than the active matrix type It is also possible to use a passive matrix type that does not use active elements (active elements Since it does not use nonlinear elements, there are fewer manufacturing steps, which reduces manufacturing costs and improves yield. Alternatively, active elements (active elements, nonlinear elements) can be used. Therefore, the aperture ratio can be improved, and it is possible to achieve low power consumption or high brightness. can be done.

[0299] A flexible material can be suitably used for the substrate 510 and the substrate 570 .

[0300] Materials that suppress impurity permeation can be suitably used for the substrates 510 and 570. For example, if the water vapor permeability is 10 -5 g / m2 ·day or less, preferably 10 -6 g / m 2 Materials with a shelf life of 10 days or less can be suitably used.

[0301] Materials with approximately the same linear expansion coefficient can be suitably used for the substrates 510 and 570. For example, if the linear expansion coefficient is 1×10 -3 / K or less, preferably 5×10 -5 / K or less, better Preferably 1 x 10 -5 A material having a solubility of 0.1 kJ / K or less can be suitably used.

[0302] The substrate 510 includes a flexible substrate 510b and a barrier film that prevents impurities from diffusing into the light-emitting element. 510a and a resin layer 510c that bonds the substrate 510b and the barrier film 510a are laminated. It is a laminated body.

[0303] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide Amide, polycarbonate or acrylic, urethane, epoxy or siloxane bonded A material containing a resin having such properties can be used for the resin layer 510c.

[0304] The substrate 570 includes a flexible substrate 570b and a barrier film that prevents impurities from diffusing into the light-emitting element. 570a and a laminate of a resin layer 570c that bonds the substrate 570b and the barrier film 570a is.

[0305] The sealing material 560 bonds the substrate 570 and the substrate 510 together. The sealing material 560 is larger than air. In addition, when light is extracted to the sealing material 560 side, the sealing material 560 has an optical The layer also serves as a layer having a function of effectively bonding the pixel circuit and the light-emitting element (for example, the first light-emitting element). 550R) is between substrate 510 and substrate 570.

[0306] 《Pixel configuration》 The pixel includes a sub-pixel 502R, which comprises a light-emitting module 580R.

[0307] The subpixel 502R supplies power to the first light-emitting element 550R and the second light-emitting element 550R. The light emitting module further includes a pixel circuit including a transistor 502t. 580R includes a first light emitting element 550R and an optical element (for example, a first color layer 567R). can.

[0308] The first light emitting element 550R includes a lower electrode, an upper electrode, and a light emitting active layer between the lower electrode and the upper electrode. The layer includes an organic compound.

[0309] The light emitting module 580R has a first colored layer 567R in the direction in which light is extracted. The light emitting element may transmit light having a specific wavelength, such as red, green, or blue. It is to be noted that in other sub-pixels, a material that selectively transmits light that is emitted can be used. A region that transmits light emitted by the optical element as it is may be provided.

[0310] In addition, when the sealing material 560 is provided on the side from which light is extracted, the sealing material 560 It contacts the optical element 550R and the first colored layer 567R.

[0311] The first colored layer 567R is located so as to overlap the first light emitting element 550R. A part of the light emitted by the light emitting element 550R is transmitted through the first colored layer 567R and is reflected by the light emitting element 550R as indicated by the arrows in the figure. The light is emitted to the outside of the light emitting module 580R in the direction of the mark.

[0312] <<Display Configuration>> The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. It is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0313] The display unit 501 includes an anti-reflection layer 567p at a position overlapping the pixels. As the polarizer, for example, a circular polarizer can be used.

[0314] The display portion 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. The insulating film 521 is used as a layer for flattening unevenness caused by the pixel circuit. In addition, a laminated film including a layer capable of suppressing the diffusion of impurities can be applied to the insulating film 521. This prevents the reliability of the transistor 502t and the like from being affected by impurity diffusion. The decline can be suppressed.

[0315] The display unit 501 has a light-emitting element (for example, a first light-emitting element 550R) on an insulating film 521. .

[0316] The display portion 501 has a partition wall 528 on the insulating film 521, which overlaps with an edge of the lower electrode. A spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528 .

[0317] <Configuration of Scanning Line Driving Circuit> The scanning line driving circuit 503g(1) includes a transistor 503t and a capacitor 503c. In addition, the driver circuit can be formed on the same substrate as the pixel circuit in the same process.

[0318] Other Configurations The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is connected to the wiring 511. 1. In addition, F PC 509(1) is electrically connected to terminal 519.

[0319] In addition, a printed wiring board (PWB) may be attached to the FPC509(1). .

[0320] The display section 501 has wiring such as scanning lines, signal lines, and power lines. You can be there.

[0321] Specifically, aluminum, chromium, copper, tantalum, titanium, molybdenum, and tungsten , a metal element selected from nickel, yttrium, zirconium, silver, or manganese, An alloy containing the above-mentioned metal elements or an alloy combining the above-mentioned metal elements is used. In particular, aluminum, chromium, copper, tantalum, titanium, molybdenum, It is preferable that the alloy contains one or more elements selected from the group consisting of copper and manganese. Gold is suitable for microfabrication using wet etching methods.

[0322] Specifically, a two-layer structure in which a titanium film is laminated on an aluminum film, a titanium nitride film on a titanium nitride film, Two-layer structure with a tungsten film laminated on a titanium nitride film, two-layer structure with a tungsten film laminated on a titanium nitride film, a two-layer structure in which a tungsten film is laminated on a titanium film or a tungsten nitride film; A three-layer structure in which an aluminum film is layered on top of the titanium film, and a titanium film is then formed on top of that. etc. can be used.

[0323] Specifically, titanium, tantalum, tungsten, molybdenum, chromium, etc. are deposited on an aluminum film. an alloy film of one or more selected from the group consisting of silicon, neodymium, and scandium, or a nitride film; A laminated structure in which chemical films are laminated can be used.

[0324] Alternatively, a light-transmitting conductive material containing indium oxide, tin oxide, or zinc oxide may be used. good.

[0325] <Display unit variation 1> Various transistors can be applied to the display portion 501 .

[0326] A structure in which a bottom-gate transistor is applied to the display portion 501 is shown in FIG. and is illustrated in FIG. 11(B).

[0327] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. The present invention can be applied to the transistors 502t and 503t.

[0328] For example, at least indium (In), zinc (Zn) and M (Al, Ga, Ge, Y, In-M-Zn oxide containing metals such as Zr, Sn, La, Ce or Hf Preferably, the film contains both In and Zn.

[0329] Stabilizers include gallium (Ga), tin (Sn), hafnium (Hf), and aluminum. Aluminum (Al) or zirconium (Zr). Also, other stabilizers The lanthanides are lanthanum (La), cerium (Ce), and praseodymium (P r), neodymium (Nd), samarium (Sm), europium (Eu), gadolinium ( Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium Er, Thulium, Ytterbium, Lutetium, etc. .

[0330] Examples of oxide semiconductors that form the oxide semiconductor film include In-Ga-Zn oxides, I n-Al-Zn oxide, In-Sn-Zn oxide, In-Hf-Zn oxide, In -La-Zn oxide, In-Ce-Zn oxide, In-Pr-Zn oxide, In- Nd-Zn oxide, In-Sm-Zn oxide, In-Eu-Zn oxide, In-G d-Zn oxide, In-Tb-Zn oxide, In-Dy-Zn oxide, In-Ho -Zn-based oxides, In-Er-Zn-based oxides, In-Tm-Zn-based oxides, In-Yb- Zn-based oxide, In-Lu-Zn-based oxide, In-Sn-Ga-Zn-based oxide, In-H f-Ga-Zn oxide, In-Al-Ga-Zn oxide, In-Sn-Al-Zn oxide Oxides, In-Sn-Hf-Zn oxides, In-Hf-Al-Zn oxides, In-G A-series oxides can be used.

[0331] Here, the In-Ga-Zn oxide is a material containing In, Ga, and Zn as main components. It means oxide, and the ratio of In, Ga, and Zn does not matter. Other metal elements may also be included.

[0332] For example, a semiconductor layer containing polycrystalline silicon crystallized by a process such as laser annealing. is applied to the transistor 502t and the transistor 503t shown in FIG. 11(B). It is possible.

[0333] A structure in which a top-gate transistor is applied to the display portion 501 is shown in FIG. Illustrated.

[0334] For example, polycrystalline silicon or a single crystal silicon film transferred from a single crystal silicon substrate, etc. The semiconductor layer including the transistor 502t and the transistor 502t shown in FIG. Can be applied to 03t.

[0335] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0336] (Sixth embodiment) In this embodiment, a foldable display device that can be applied to a data processing device of one embodiment of the present invention will be described. The configuration of such a touch panel will be described with reference to FIG.

[0337] FIG. 12 is a cross-sectional view of touch panel 500B.

[0338] In the touch panel 500B described in this embodiment, transistors receive supplied image information. The touch sensor is provided on the display unit 501, and the touch sensor is provided on the substrate of the display unit. 510 side is different from the touch panel 500 described in the fifth embodiment. The different configurations are described in detail here, and where similar configurations can be used, The above description is incorporated herein by reference.

[0339] <Display section> The display unit 501 includes a plurality of pixels arranged in a matrix. It includes a pixel circuit that drives the element.

[0340] 《Pixel configuration》 The pixel includes a sub-pixel 502R, which comprises a light-emitting module 580R.

[0341] The subpixel 502R supplies power to the first light-emitting element 550R and the second light-emitting element 550R. The pixel circuit includes a transistor 502t that can

[0342] The light emitting module 580R includes a first light emitting element 550R and an optical element (e.g., a first color layer 567R).

[0343] The first light emitting element 550R includes a lower electrode, an upper electrode, and a light emitting active layer between the lower electrode and the upper electrode. The layer includes an organic compound.

[0344] The light emitting module 580R has a first colored layer 567R in the direction in which light is extracted. The light emitting element may transmit light having a specific wavelength, such as red, green, or blue. It is to be noted that in other sub-pixels, a material that selectively transmits light that is emitted can be used. A region that transmits light emitted by the optical element as it is may be provided.

[0345] The first colored layer 567R is located so as to overlap the first light emitting element 550R. The light-emitting element 550R shown in FIG. 1 emits light toward the side where the transistor 502t is provided. As a result, a part of the light emitted by the first light emitting element 550R is transmitted through the first colored layer 567R. The light is then emitted to the outside of light emitting module 580R in the direction of the arrow shown in the figure.

[0346] <<Display Configuration>> The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. It is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0347] The display portion 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. The insulating film 521 is used as a layer for flattening unevenness caused by the pixel circuit. In addition, a laminated film including a layer capable of suppressing the diffusion of impurities can be applied to the insulating film 521. This can prevent, for example, the formation of a color due to impurities diffusing from the first color layer 567R. This can prevent the reliability of the transistor 502t and the like from decreasing.

[0348] <Touch sensor> The touch sensor 595 is provided on the substrate 510 side of the display unit 501 (see FIG. 12(A)). (see).

[0349] The resin layer 597 is located between the substrate 510 and the substrate 590, and is connected to the display unit 501 and the touch sensor 59 Glue 5 together.

[0350] <Display unit variation 1> Various transistors can be applied to the display portion 501 .

[0351] A structure in which a bottom-gate transistor is applied to the display portion 501 is shown in FIG. and is illustrated in FIG. 12(B).

[0352] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. The present invention can be applied to the transistors 502t and 503t. A pair of gate electrodes are provided above and below the region where the transistor channel is formed. This can suppress fluctuations in transistor characteristics and improve reliability. .

[0353] For example, a semiconductor layer containing polycrystalline silicon or the like is formed into a transistor 50 shown in FIG. 2t and transistor 503t.

[0354] A structure in which a top-gate transistor is applied to the display portion 501 is shown in FIG. Illustrated.

[0355] For example, a semiconductor layer including polycrystalline silicon or a transferred single-crystal silicon film is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown in FIG. Cut.

[0356] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0357] (Embodiment 7) In this embodiment, the present invention can be applied to a data processing device, an electronic device, or the like according to one embodiment of the present invention. A method for making a foldable device will now be described with reference to FIGS. 13-15. Examples of bendable devices include display devices, light-emitting devices, and input devices. Examples of input devices include touch sensors and touch panels. Examples of display devices include organic EL panels and lighting devices. Examples include light-emitting devices, organic EL panels, and liquid crystal display devices. In some cases, the device is equipped with an input device function such as a touch sensor. On the opposing substrate (for example, a substrate on which no transistor is provided) of a display device or a light-emitting device In some cases, a touch sensor is provided. A touch sensor is provided on a substrate (for example, a substrate on which a transistor is provided). Alternatively, a counter substrate of a display device or a light-emitting device and a In some cases, a touch sensor is provided on the element substrate.

[0358] First, a peeling layer 703 is formed on a fabrication substrate 701, and a layer to be peeled 705 is formed on the peeling layer 703. In addition, a separation layer 723 is formed on the formation substrate 721, and the separation layer 72 A layer to be peeled 725 is formed on the substrate 3 (FIG. 13(B)).

[0359] For example, when a tungsten film is used as a peeling layer, the tungsten film is coated with N2O or the like. Plasma treatment is performed using a gas containing oxygen, or annealing is performed in a gas atmosphere containing oxygen. Alternatively, a tungsten oxide film can be formed by sputtering or the like in a gas atmosphere containing oxygen. A tungsten oxide film is formed between the tungsten film and the peeled layer by using an oxidation method such as It is possible.

[0360] At the time of the peeling and transposition process, the tungsten oxide film has a composition of tungsten oxide. It is preferable that the composition contains a large amount of tungsten oxide with an oxygen to tungsten ratio of less than 3. In the homologous series of stainless steel, WnO(3n-1) and WnO(3n-2), The N2O plasma treatment is effective in reducing the amount of heat generated by the metal. By forming a tungsten oxide film, the layer to be peeled off can be peeled off from the substrate with a small force. This can be done.

[0361] Alternatively, a tungsten oxide film can be formed directly without forming a tungsten film. For example, a sufficiently thin tungsten film is subjected to plasma treatment with a gas containing oxygen. Furthermore, the annealing treatment is performed in a gas atmosphere containing oxygen, and the annealing treatment is performed in a gas atmosphere containing oxygen. By forming a tungsten oxide film by a method such as sputtering, only the tungsten oxide film can be peeled off. It may also be formed as a separation layer.

[0362] At this time, the interface between the tungsten film and the tungsten oxide film or the inside of the tungsten oxide film When the tungsten oxide film is separated from the peeled layer, the tungsten oxide film may remain on the peeled layer side. The remaining tungsten nitride film may adversely affect the characteristics of the transistor. Therefore, after the step of separating the peeling layer from the layer to be peeled, the step of removing the tungsten oxide film is performed. It is preferable that the above-mentioned method for removing the film from the substrate does not necessarily require the use of N2O plasma. Since no processing is required, it is possible to eliminate the process of removing the tungsten oxide film. In this case, the device can be fabricated more easily.

[0363] Another aspect of the present invention is a method for depositing a tungsten film having a thickness of 0.1 nm or more and less than 200 nm on a substrate. A membrane is used.

[0364] In addition to tungsten, the peeling layer may contain molybdenum, titanium, vanadium, tantalum, silicon, etc. Films containing silicon, aluminum, or alloys thereof may also be used. The release layer is not limited to an inorganic film, but may be a film such as polyimide. An organic film may also be used.

[0365] When organic resin is used for the release layer, if low-temperature polysilicon is used as the active layer, The process must be carried out at temperatures below 350°C. Therefore, dehydration for silicon crystallization is required. The process includes a silicon bake, hydrogenation for terminating defects in silicon, and activation of doped regions. On the other hand, when inorganic films are used, the film formation is difficult. The temperature is not limited to 350°C, making it possible to demonstrate excellent properties.

[0366] When an organic resin is used for the peeling layer, damage to the organic resin and functional elements occurs due to laser irradiation during crystallization. However, if an inorganic film is used for the release layer, such a problem can be avoided. This is preferable because it does not occur.

[0367] In addition, when an organic resin is used for the peeling layer, the organic resin is removed by laser irradiation for peeling the resin. This may cause poor contact at the contact points of terminals such as FPCs. It is difficult to peel and transpose functional elements with many terminals, such as high-resolution displays, with a high yield. When an inorganic film is used for the release layer, there are no such restrictions, and high-definition discs can be produced. Even for functional elements with many terminals, such as sprays, it is possible to peel and transpose them with high yield. be.

[0368] In the method for peeling a functional element from a substrate according to one embodiment of the present invention, an insulating layer or a transistor is formed on a fabrication substrate. In this case, high-temperature polysilicon is used for the semiconductor layer. In this case, conventional high temperature polysilicon lines can be used to maintain device operation. It is possible to mass-produce semiconductor devices that are fast, have high gas barrier properties, and are highly reliable. In this case, the insulating layer and transistor formed in a process at 600°C or less are used. The insulating layer with high gas barrier properties is formed on the top and bottom of the organic EL element under film formation conditions of 600°C or less. This prevents impurities such as moisture from entering the organic EL element or semiconductor layer. This suppresses the occurrence of peeling, and provides significantly higher reliability than when organic resins are used for the peeling layer. Therefore, a light emitting device with high light emission can be realized.

[0369] Alternatively, an insulating layer or a transistor can be formed on the substrate at a temperature of 500° C. or less. In this case, low-temperature polysilicon or oxide semiconductor can be used for the semiconductor layer, and conventional low-temperature polysilicon Mass production is possible using a silicon production line. In this case, the process temperature is below 500℃. By using insulating layers and transistors formed by An insulating layer with high gas barrier properties formed under the following film forming conditions can be disposed. The organic resin is used as a peeling layer, and impurities such as moisture are prevented from entering the organic EL element and the semiconductor layer. In comparison with the case where a light emitting device using a semiconductor device or the like is used, a light emitting device with extremely high reliability can be realized.

[0370] Alternatively, it is possible to form an insulating layer or a transistor on a substrate at 400° C. or less. In this case, amorphous silicon or oxide semiconductor can be used for the semiconductor layer, and Mass production is possible using an amorphous silicon production line. By using the insulating layer and transistor formed by the following process, An insulating layer with high gas barrier properties formed under film formation conditions of 400°C or less can be placed underneath. This prevents impurities such as moisture from getting into the organic EL element and semiconductor layer, and facilitates peeling. Compared to using organic resins for the separation layer, this allows for the realization of a highly reliable light-emitting device. Cut.

[0371] Next, the fabrication substrate 701 and the fabrication substrate 721 are placed so that the surfaces on which the peeled layers are formed face each other. The bonding layer 707 and the frame-shaped bonding layer 711 are used to bond the substrate 100 to the substrate 100. The frame-shaped bonding layer 711 is hardened (FIG. 13(C)). After providing the frame-shaped bonding layer 711 and the bonding layer 707 inside the frame-shaped bonding layer 711, The substrate 701 and the substrate 721 for preparation are placed opposite each other and bonded together.

[0372] The bonding of the fabrication substrate 701 and the fabrication substrate 721 is preferably carried out in a reduced pressure atmosphere. stomach.

[0373] In FIG. 13C, the peeling layer 703 and the peeling layer 723 are different in size. However, as shown in FIG. 13(D), a release layer of the same size may be used.

[0374] The bonding layer 707 overlaps the peeling layer 703, the layer to be peeled 705, the layer to be peeled 725, and the peeling layer 723. The end of the bonding layer 707 is positioned so that the edge of the peeling layer 703 or the peeling layer 723 It is preferable that the edge be located inside at least one edge (the edge that is to be peeled off first from the substrate). This can prevent the formation substrate 701 and the formation substrate 721 from being strongly adhered to each other, This can prevent a decrease in yield in the peeling step.

[0375] Next, a first peeling starting point 741 is formed from the substrate by irradiation with laser light (FIG. 14( A), (B)).

[0376] The fabrication substrate 701 and the fabrication substrate 721 may be peeled from either one of them. In this case, the film may be peeled off from a substrate on which a large release layer is formed, or from a substrate on which a small release layer is formed. The device may be peeled off from the plate. When the device is fabricated, it may be peeled off from the substrate on which the device is formed, or from the other substrate. Here, an example in which the formation substrate 701 is peeled off first is shown.

[0377] The laser beam penetrates the cured bonding layer 707 or the cured frame-shaped bonding layer 711 and the peeled layer 7 The area where the bonding layer 707 overlaps with the peeling layer 703 is irradiated. The case where the frame-shaped bonding layer 711 is in an uncured state is shown as an example. 07 is irradiated with laser light (see arrow P3 in FIG. 14(A)).

[0378] By removing a part of the layer to be peeled 705, a starting point 741 for the first peeling from the substrate can be formed. (See the area surrounded by the dotted line in FIG. 14(B)). At this time, not only the peeled layer 705 but also the peeled layer Other layers of the release layer 705, the release layer 703, and the bonding layer 707 may be removed.

[0379] The laser light is preferably applied from the substrate side on which the peeling layer to be peeled is provided. When the laser beam is irradiated to the region where the peeling layer 703 and the peeling layer 723 overlap, By forming cracks only in the layer 705 to be peeled out of the layer 725 to be peeled, a substrate can be selectively produced. The peeling layer 701 and the peeling layer 703 can be peeled off (see the area surrounded by the dotted line in FIG. 14(B)). ).

[0380] When the region where the peeling layer 703 and the peeling layer 723 overlap is irradiated with laser light, the peeling layer 703 side The starting point for peeling from the substrate is formed on both the layer to be peeled 705 and the layer to be peeled 725 on the peeling layer 723 side. If this occurs, it may become difficult to selectively peel off one of the fabrication substrates. Therefore, the irradiation conditions of the laser beam are limited so that cracks can be generated only in one of the layers to be peeled. The method for forming the first peeling starting point 741 from the first substrate may be a method for forming the first peeling starting point 741 from the first substrate by using a laser beam. The method for forming the mark is not limited to irradiation with light, but may be formed by a sharp blade such as a cutter.

[0381] Then, the peeled layer 705 and the fabrication substrate 7 are separated from the formed substrate by the first peeling starting point 741. 14C and 14D). 01 to the fabrication substrate 721.

[0382] The peeled layer 705 separated from the fabrication substrate 701 in the step shown in FIG. 14(D) and the substrate 731 The substrates are bonded together using a bonding layer 733, and the bonding layer 733 is cured (FIG. 15(A)).

[0383] Next, a starting point 743 for a second peeling from the substrate is formed using a sharp blade such as a cutter. (FIGS. 15B and 15C) The starting point 743 of the second peeling from the substrate can be formed by a cutter or the like. It is not limited to any sharp blade, and may be formed by laser light irradiation or the like.

[0384] If the substrate 731 on the side where the peeling layer 723 is not provided can be cut with a blade or the like, , a cut may be made in the bonding layer 733 and the peeled layer 725 (arrow P in FIG. 15(B)). 5). This removes a part of the layer to be peeled 725, forming the starting point 7 of the second peeling from the substrate. 43 can be formed (see the area surrounded by the dotted line in FIG. 15(C)).

[0385] As shown in FIGS. 15B and 15C, the formation substrate 721 and the substrate 731 overlap with the peeling layer 723. When the substrate 721 and the substrate 722 are bonded together by the bonding layer 733 in a region where the bonding layer 733 is not bonded, The high adhesion of the 731 side reduces the yield of the subsequent peeling process from the substrate. Therefore, a frame-shaped cut is made in the region where the hardened bonding layer 733 and the peeling layer 723 overlap. It is preferable to form a solid line-shaped starting point 743 for the second peeling from the substrate by inserting a recess. This can increase the yield of the process of peeling the substrate.

[0386] Then, the layer to be peeled 725 and the fabrication substrate 7 are separated from the starting point 743 of the second peeling from the formed substrate. 15(D) . As a result, the peeled layer 725 is separated from the fabrication substrate 721. It can be transferred to a substrate 731 .

[0387] For example, a film that is firmly anchored on an inorganic film such as a tungsten film using N2O plasma When forming a tungsten oxide film, it is possible to achieve relatively high adhesion during film formation. After that, when the starting point of peeling is formed, cleavage occurs from there, and the peeled layer is easily peeled off. It is possible to transfer the substrate from the fabrication substrate to the substrate.

[0388] In addition, a liquid such as water is allowed to penetrate into the interface between the peeling layer 723 and the peeled layer 725, and the fabrication substrate 72 The liquid may be separated from the peeling layer 723 and the peeled layer 725 by capillary action. By penetrating between the layers 725, static electricity generated when peeling from the substrate is transferred to the peeled layer 725. This may have a negative effect on the functional elements such as FETs contained in the semiconductor device (e.g., the semiconductor device may be destroyed by static electricity). This can suppress problems such as

[0389] In addition, when applying physical force to a bond called MOW (M is any element) to break the bond, When liquid seeps into the gap, the bond becomes M-OH HO-W. The greater distance can facilitate separation.

[0390] The liquid may be sprayed in the form of mist or vapor. Examples of the liquid include pure water and organic solvents. can be used in neutral, alkaline, or acidic aqueous solutions, or in aqueous solutions containing dissolved salts. A liquid may also be used.

[0391] The temperature of the liquid and the substrate during mechanical peeling is preferably between room temperature and 120°C. It is recommended to set the temperature at 60°C or higher and 90°C or lower.

[0392] In the above-described method for peeling from a substrate according to one embodiment of the present invention, a sharp blade or the like is used to peel the film from the substrate. A second peeling starting point 743 is formed to make the peeling layer and the peeled layer easy to peel from each other, This improves the yield of the process of peeling from the substrate. can.

[0393] In addition, a pair of substrates each having a peeled layer formed thereon are bonded together in advance, and then the Each substrate can be peeled off and the substrates that make up the device you want to make can be bonded together. Therefore, when bonding the peeled layer, the substrates to be fabricated are bonded together, which have low flexibility. This allows for more accurate alignment of the substrates than when bonding flexible substrates together. It can be improved.

[0394] In one embodiment of the present invention, a method for peeling an oxide layer from a substrate includes applying heat to a peeled layer provided on an oxide layer. The first and second layers are provided so as to release hydrogen by heating. The hydrogen released from the delamination reduces the WO3 in the oxide layer, forming an oxide layer containing a large amount of WO2. As a result, the peelability from the substrate can be improved. .

[0395] This embodiment mode may be implemented by appropriately combining with other embodiment modes and examples described in this specification. This can be done. [Explanation of symbols]

[0396] L1 First location information L2 Second location information S1 First detection information S1a detection information S1b Detection Information S2 Second detection information V1 First image information V2 Second image information 13a enclosure 13b Case 15a housing 15b housing 100 Information processing device 100B Information processing device 100C Information processing equipment 101 Case 110 Arithmetic equipment 111 Arithmetic section 112 Storage section 114 Transmission Line 115 Input / Output Interface 120 Input / Output Devices 120(1) First Area 120(1a) area 120(1b) area 120(2) Second Area 120(3) Third Area 120c bent part 125 Terminal section 126 Wiring 130 Display section 140 Location information input section 141 Circuit Board 142 Proximity Sensor 145 Input / output section 150 Detection unit 150PD photoelectric conversion element 160 Communications Department 300 touch panel 301 Display section 302 pixels 302B subpixel 302G subpixel 302R subpixel 302t transistor 303c capacity 303g(1) Scanning line driver circuit 303g(2) Imaging pixel drive circuit 303s(1) Image signal line driver circuit 303s(2) Image signal line driver circuit 303t transistor 308 imaging pixels 308p photoelectric conversion element 308t transistor 309 FPC 310 Substrate 310a Barrier film 310b board 310c resin layer 311 Wiring 319 terminal 321 Insulating Film 328 Bulkhead 329 Spacer 350R light emitting element 351R lower electrode 352 Upper electrode 353 layers 353a Light Emitting Unit 353b Lighting unit 354 Middle Class 360 Encapsulating material 367BM light shielding layer 367p anti-reflection layer 367R colored layer 370 Opposing substrate 370a Barrier film 370b base material 370c resin layer 380B Light Emitting Module 380G light emitting module 380R Light Emitting Module 500 touch panel 500B Touch Panel 501 Display section 502R subpixel 502t transistor 503c capacity 503g Scanning line driver circuit 503t transistor 509 FPC 510 board 510a Barrier film 510b board 510c resin layer 511 Wiring 519 terminal 521 Insulating film 528 Bulkhead 550R light emitting element 560 Encapsulating material 567BM light shielding layer 567p anti-reflection layer 567R colored layer 570 PCB 570a Barrier film 570b board 570c ​​resin layer 580R Light Emitting Module 590 PCB 591 Electrode 592 Electrode 593 Insulating Layer 594 Wiring 595 Touch Sensor 597 Resin layer 598 Wiring 599 Connection Layer 701 Fabricated board 703 Peeling layer 705 Peeling layer 707 Bonding layer 711 Frame-shaped bonding layer 721 Fabrication board 723 Peeling layer 725 Peeling layer 731 Circuit Board 733 Bonding layer 741 Origin of the first detachment 743 Origin of the second detachment

Claims

1. A display device including a display panel having a first display area, a second display area, and a third display area located between the first display area and the second display area and capable of being bent with its display surface facing inward, a first member disposed on the rear surface side of the display panel and overlapping with the first display area; a second member disposed on the rear surface side of the display panel and overlapping with the second display area; a third member that is disposed on a rear surface side of the display panel and that overlaps with the first display area, the second display area, and the third display area; the third member is foldable together with the third display area; the third member has a portion located between the first member and the display panel and a portion located between the second member and the display panel, the display panel has a terminal area; the terminal region is disposed on the opposite side of the third member from the display panel, A display device, wherein at least a portion of the first member is disposed between the terminal region and the third member.

2. A display device including a display panel having a first display area, a second display area, and a third display area located between the first display area and the second display area and capable of being bent with its display surface facing inward, a first member disposed on the rear surface side of the display panel and overlapping with the first display area; a second member disposed on the rear surface side of the display panel and overlapping with the second display area; a third member that is disposed on a rear surface side of the display panel and that overlaps with the first display area, the second display area, and the third display area; the third member is foldable together with the third display area; the third member has a portion located between the first member and the display panel and a portion located between the second member and the display panel, the display panel has a terminal area and a bent portion, the terminal area and the first display area are connected via the bent portion, the terminal region is disposed on the opposite side of the third member from the display panel, A display device, wherein at least a portion of the first member is disposed between the terminal region and the third member.

3. A display device including a display panel having a first display area, a second display area, and a third display area located between the first display area and the second display area and capable of being bent with its display surface facing inward, a first member disposed on the rear surface side of the display panel and overlapping with the first display area; a second member disposed on the rear surface side of the display panel and overlapping with the second display area; a third member that is disposed on a rear surface side of the display panel and that overlaps with the first display area, the second display area, and the third display area; the third member is foldable together with the third display area; the third member has a portion located between the first member and the display panel and a portion located between the second member and the display panel, the display panel has a terminal area and a bent portion, the terminal area and the first display area are connected via the bent portion, the bent portion has a portion that does not overlap with the third member, the terminal region is disposed on the opposite side of the third member from the display panel, A display device, wherein at least a portion of the first member is disposed between the terminal region and the third member.

4. A display device including a display panel having a first display area, a second display area, and a third display area located between the first display area and the second display area and capable of being bent with its display surface facing inward, a first member disposed on the rear surface side of the display panel and overlapping with the first display area; a second member disposed on the rear surface side of the display panel and overlapping with the second display area; a third member that is disposed on a rear surface side of the display panel and that overlaps with the first display area, the second display area, and the third display area; the third member is foldable together with the third display area; the third member has a portion located between the first member and the display panel and a portion located between the second member and the display panel, the display panel has a terminal area and a bent portion, the terminal area and the first display area are connected via the bent portion, the bent portion has a portion that does not overlap with the third member, The terminal region is disposed on the opposite side of the third member from the display panel.

5. the terminal area overlaps with the first display area; 5. The display device according to claim 1.

6. The display panel is an organic EL panel.

6. The display device according to claim 1.

7. the display panel includes a wiring area between the terminal area and the first display area; 7. The display device according to claim 1.

Images