Optical element and manufacturing method of optical element

Abstract

To provide an optical element capable of improving an optical characteristic and ensuring reliability, and a manufacturing method of the optical element.SOLUTION: An optical element 1 includes a wiring layer 10, an optical semiconductor element 20 disposed on the wiring layer 10, a wire 30 connecting the wiring layer 10 and the optical semiconductor element 20, a sealing layer 40 disposed on the wiring layer 10, an optical member 50 disposed on a surface 40a of the sealing layer 40, and an adhesive layer 60 disposed between the sealing layer 40 and the optical member 50. The optical member 50 includes a sheet part 51 disposed on the adhesive layer 60 and a lens part 52 formed on the sheet part 51. A thickness T4 of the lens part 52 in a thickness direction of the wiring layer 10 is larger than the sum of a thickness T3 of the sheet part 51 and a thickness T5 of the adhesive layer 60. When viewed in the thickness direction of the wiring layer 10, an end part 31 of the wire 30 connected to the wiring layer 10 is located inside an outer edge 52e of the lens part 52.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an optical element and a method for manufacturing an optical element. [Background technology]

[0002] Patent Document 1 discloses an optical element including a photodiode, an IC chip, a sealing resin that seals the photodiode and the IC chip, and a lens portion formed on the surface of the sealing resin that faces the photodiode. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2005 / 071759 Summary of the Invention [Problem to be solved by the invention]

[0004] In the optical element described above, it is conceivable to form a large lens portion in order to improve the optical characteristics. However, as the lens portion becomes larger, the volume of the resin member consisting of the lens portion and the encapsulating resin increases. This increases stress due to, for example, expansion or contraction of the resin member caused by temperature changes. Such increased stress may affect the electrical connection of the optical semiconductor element encapsulated by the encapsulating resin. For example, if the optical semiconductor element is connected to other components, such as a wiring layer, by wires, the stress may cause the wires to peel off from the other components or cause the wires to break, resulting in an inability to properly maintain the electrical connection.

[0005] An object of the present invention is to provide an optical element that can improve optical characteristics and ensure reliability, and a method for manufacturing such an optical element. [Means for solving the problem]

[0006] The optical element of the present invention is [1] "an optical element comprising: a wiring layer; an optical semiconductor element disposed on the wiring layer; a wire electrically connecting the wiring layer and the optical semiconductor element; a sealing layer disposed on the wiring layer so as to seal the optical semiconductor element; an optical member disposed on the surface of the sealing layer opposite the wiring layer; and an adhesive layer disposed between the sealing layer and the optical member, wherein the optical member has a sheet portion disposed on the adhesive layer and a lens portion formed on the sheet portion, the thickness of the lens portion in the thickness direction of the wiring layer being greater than the sum of the thickness of the sheet portion and the thickness of the adhesive layer, and when viewed from the thickness direction of the wiring layer, the end of the wire connected to the wiring layer is located inside the outer edge of the lens portion."

[0007] In the optical element, the thickness of the lens portion in the thickness direction of the wiring layer is greater than the sum of the thickness of the sheet portion and the thickness of the adhesive layer, and when viewed from the thickness direction of the wiring layer, the end of the wire connected to the wiring layer is located inside the outer edge of the lens portion. This allows the lens portion to be formed large, thereby improving the optical characteristics of the optical element. Furthermore, in the optical element, a sealing layer is disposed on the wiring layer to seal the optical semiconductor element, an optical element is disposed on the sealing layer, and an adhesive layer is disposed between the sealing layer and the optical element. That is, the optical element having the lens portion is formed separately from the sealing layer that seals the optical semiconductor element. This prevents the volume of the sealing layer from changing even when the lens portion is formed large, thereby preventing increased stress due to expansion or contraction of the sealing layer due to temperature changes. This prevents stress-induced peeling of the wire from the wiring layer and wire breakage, thereby maintaining stable electrical connection of the optical semiconductor element. Furthermore, in the optical element, the optical element has a sheet portion disposed on the adhesive layer and a lens portion formed on the sheet portion. This increases the adhesion area of ​​the optical member with the adhesive layer compared to when the lens portion is directly disposed on the sealing layer, and allows the optical member to be stably adhered to the sealing layer. Therefore, the optical element can improve optical characteristics and ensure reliability.

[0008] The optical element of the present invention may be [2] "the optical element according to the above [1], wherein the thickness of the sheet portion is smaller than the thickness of the sealing layer." In this case, the distance from the lens portion formed on the sheet portion to the optical semiconductor element can be reduced, thereby improving the optical characteristics of the optical element.

[0009] The optical element of the present invention may be [3] "the optical element according to [1] or [2] above, in which the thickness of the sheet portion is smaller than the thickness of the optical semiconductor element." In this case, the thickness of the lens portion can be designed to be large while the thickness of the sheet portion can be reduced. That is, the optical characteristics of the optical element can be improved by increasing the size of the lens portion, and the optical characteristics can also be further improved by reducing the distance from the lens portion formed on the sheet portion to the optical semiconductor element.

[0010] The optical element of the present invention may be [4] "the optical element according to any one of [1] to [3] above, wherein the outer edge of the sheet portion is located inside the outer edge of the sealing layer when viewed from the thickness direction of the wiring layer." In this case, the adhesion area between the sealing layer and the adhesive layer can be reduced, and the optical properties of the optical element can be improved.

[0011] The optical element of the present invention may be [5] "the optical element according to any one of [1] to [4] above, in which, when viewed in the thickness direction of the wiring layer, the outer edge of the sheet portion coincides with the outer edge of the adhesive layer." In this case, since the sheet portion is not larger than the adhesive layer, it is possible to prevent voids from forming between the sheet portion and the sealing layer, and it is possible to suppress deterioration of the optical properties of the optical element due to voids. Furthermore, since the sheet portion is not smaller than the adhesive layer, it is possible to suppress deterioration of the optical properties of the optical element caused by the portion of the adhesive layer protruding from the sheet portion.

[0012] The optical element of the present invention may be [6] "the optical element according to any one of [1] to [5] above, wherein the outer edge of the sheet portion has a rectangular shape when viewed from the thickness direction of the wiring layer." In this case, when the optical member is placed on the sealing layer during the manufacturing process of the optical element, the optical member can be accurately aligned using the rectangular outer edge of the sheet portion as a reference, for example, by image recognition.

[0013] The optical element of the present invention may be [7] "the optical element according to any one of [1] to [6] above, wherein the width of the lens portion when viewed in the thickness direction of the wiring layer is greater than the thickness of the lens portion in the thickness direction of the wiring layer." In this case, for example, it is possible to efficiently focus light incident on the lens portion onto the optical semiconductor element while reducing the height of the lens portion (achieving miniaturization).

[0014] The optical element of the present invention may be [8] "the optical element according to any one of [1] to [7] above, wherein, when viewed from the thickness direction of the wiring layer, the lens portion has a first portion and a second portion positioned to sandwich the lens portion on a first line segment that is a line segment that runs from one point on the outer edge of the sheet portion, passes through the center of the lens portion, and reaches another point on the outer edge of the sheet portion, the first portion having the shortest distance from the one point to the other point, and the width of the lens portion on the first line segment is greater than the sum of the widths of the first portion and the second portion on the first line segment." In this case, the lens portion can be formed large while reducing the bonding area between the sealing layer and the adhesive layer, thereby improving the optical characteristics of the optical element.

[0015] The optical element of the present invention may be [9] "the optical element according to any one of [1] to [8] above, wherein, when viewed in the thickness direction of the wiring layer, the lens portion has a third portion and a fourth portion positioned to sandwich the lens portion on a second line segment that is a line segment that extends from one point on the outer edge of the sheet portion, passes through the center of the lens portion, and reaches another point on the outer edge of the sheet portion, and the distance from the one point to the other point is greatest, and the width of the lens portion on the second line segment is greater than the sum of the widths of the third portion and the fourth portion on the second line segment." In this case, the lens portion can be formed large while reducing the bonding area between the sealing layer and the adhesive layer, thereby improving the optical characteristics of the optical element.

[0016] The optical element of the present invention may be

[10] "the optical element according to any one of [1] to [9] above, wherein the thickness of the lens portion in the thickness direction of the wiring layer is at least twice the sum of the thickness of the sheet portion and the thickness of the adhesive layer." In this case, the lens portion is formed large, which further improves the optical properties of the optical element.

[0017] The optical element of the present invention may be

[11] "the optical element according to any one of the above [1] to

[10] , wherein the thickness of the lens portion in the thickness direction of the wiring layer is at least five times the sum of the thickness of the sheet portion and the thickness of the adhesive layer." In this case, the lens portion is formed large, which further improves the optical properties of the optical element.

[0018] The optical element of the present invention may be

[12] "the optical element according to any one of the above [1] to

[11] , wherein the thickness of the lens portion in the thickness direction of the wiring layer is 8 times or more the sum of the thickness of the sheet portion and the thickness of the adhesive layer." In this case, the lens portion is formed large, which further improves the optical properties of the optical element.

[0019] The optical element of the present invention may be

[13] "the optical element according to any one of the above [1] to

[12] , wherein the sheet portion is formed integrally with the lens portion." In this case, the lens portion is not misaligned with respect to the sheet portion, thereby ensuring the reliability of the optical element.

[0020] The method for manufacturing an optical element of the present invention is

[14] "a method for manufacturing an optical element, comprising the steps of: preparing a wiring layer; arranging an optical semiconductor element on the wiring layer; electrically connecting the wiring layer and the optical semiconductor element with wires; arranging an encapsulating layer on the wiring layer that encapsulates the optical semiconductor element; preparing an optical element having a sheet portion and a lens portion formed on the sheet portion, the sheet portion having a film-like adhesive layer attached to the surface of the sheet portion opposite the lens portion; and adhering the optical element to the surface of the encapsulating layer opposite the wiring layer with the adhesive layer, wherein when the optical element is adhered to the encapsulating layer, the thickness of the lens portion in the thickness direction of the wiring layer is greater than the sum of the thickness of the adhesive layer and the thickness of the sheet portion, and when viewed from the thickness direction of the wiring layer, the end of the wire connected to the wiring layer is located inside the outer edge of the lens portion."

[0021] According to the above-described method for manufacturing an optical element, for the reasons described above, it is possible to manufacture an optical element that can improve optical characteristics and ensure reliability. Furthermore, in the above-described method for manufacturing an optical element, the optical element is adhered to the sealing layer by a film-like adhesive layer. This allows the optical element to be more stably positioned on the sealing layer than when the optical element is adhered by, for example, a liquid adhesive. In this respect, the above-described method for manufacturing an optical element also allows the manufacture of an optical element that can improve optical characteristics and ensure reliability.

[0022] The method for manufacturing an optical element of the present invention may be

[15] "the method for manufacturing an optical element according to the above

[14] , wherein the step of preparing the optical member includes a step of obtaining a plurality of optical members, each of which is the optical member, by cutting a lens sheet including a plurality of portions each corresponding to the optical member." In this case, when the optical member is bonded to the sealing layer, the singulated optical member can be accurately positioned on the sealing layer.

[0023] The method for manufacturing an optical element of the present invention may be

[16] "the method for manufacturing an optical element according to the above

[15] , wherein the step of preparing the optical member includes, in this order: a step of attaching an adhesive sheet to the lens sheet, the adhesive sheet including a plurality of portions each corresponding to the adhesive layer; and a step of cutting the adhesive sheet and the lens sheet to obtain a plurality of optical members, each of which is the optical member, and a plurality of adhesive layers, each of which is the adhesive layer, with the adhesive layers attached to the optical members." In this case, optical members to which adhesive layers are attached can be efficiently obtained.

[0024] The optical element manufacturing method of the present invention may be

[17] "the optical element manufacturing method according to the above

[16] , wherein the step of attaching the adhesive sheet to the lens sheet is a step of attaching a die attach film including the adhesive sheet to the lens sheet." In this case, the lens sheet can be cut appropriately. [Effects of the Invention]

[0025] According to the present invention, it is possible to provide an optical element that can improve optical characteristics and ensure reliability, and a method for manufacturing such an optical element. [Brief explanation of the drawings]

[0026] [Figure 1] FIG. 1 is a perspective view of an optical element according to an embodiment. [Figure 2] 2 is a cross-sectional view of the optical element taken along line II-II shown in FIG. 1. FIG. [Figure 3] FIG. 2 is a plan view of the optical element shown in FIG. [Figure 4] 1A to 1C are diagrams illustrating a method for manufacturing an optical element. [Figure 5] 1A to 1C are diagrams illustrating a method for manufacturing an optical element. [Figure 6] 1A to 1C are diagrams illustrating a method for manufacturing an optical element. [Figure 7] 1A to 1C are diagrams illustrating a method for manufacturing an optical element. [Figure 8] 1A to 1C are diagrams illustrating a method for manufacturing an optical element. [Figure 9] 1A to 1C are diagrams illustrating a method for manufacturing an optical element. DETAILED DESCRIPTION OF THE INVENTION

[0027] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each drawing, the same or corresponding parts are designated by the same reference numerals, and redundant explanations will be omitted. [Configuration of optical element 1]

[0028] 1, 2, and 3, the optical element 1 includes a wiring layer 10, an optical semiconductor element 20, a pair of wires 30, a sealing layer 40, an optical member 50, and an adhesive layer 60. Hereinafter, the thickness direction of the wiring layer 10 will be referred to as the Z-axis direction, a direction perpendicular to the Z-axis direction will be referred to as the X-axis direction, and a direction perpendicular to the Z-axis and X-axis directions will be referred to as the Y-axis direction.

[0029] The wiring layer 10 is a layer electrically connected to the optical semiconductor element 20. The wiring layer 10 may be, for example, a wiring board formed containing glass epoxy, or a rewiring layer formed containing an insulating material. The wiring layer 10 has a surface (main surface) 10a perpendicular to the Z-axis direction. The wiring layer 10 has wiring 11. The wiring 11 is electrically connected to the optical semiconductor element 20 via wires 30. The wiring 11 has an exposed portion (terminal portion) on the surface 10a, and the terminal portion is physically connected to the wires 30. The wiring layer 10 has a rectangular parallelepiped shape. When viewed from the Z-axis direction, the outer edge 10e of the wiring layer 10 has a rectangular shape. The rectangular shape includes a square shape and a rectangular shape in which adjacent sides have different lengths.

[0030] The optical semiconductor element 20 is disposed on the surface 10a of the wiring layer 10. The optical semiconductor element 20 is a light receiving element or a light emitting element. The light receiving element may be a photodiode. The light emitting element may be an LD (Laser Diode) or an LED (Light Emitting Diode). The optical axis of light incident on the optical semiconductor element 20 or light emitted from the optical semiconductor element 20 may be along the Z-axis direction. The optical semiconductor element 20 is disposed at a position overlapping with the center of the surface 10a when viewed from the Z-axis direction. The optical semiconductor element 20 has a rectangular parallelepiped shape. The thickness direction of the optical semiconductor element 20 is along the Z-axis direction. When viewed from the Z-axis direction, the outer edge of the optical semiconductor element 20 has a rectangular shape.

[0031] Each of the pair of wires 30 electrically connects the wiring layer 10 and the optical semiconductor element 20. Each wire 30 is curved so as to be convex toward the side opposite the wiring layer 10 (the side where the optical semiconductor element 20 is located relative to the wiring layer 10). Each wire 30 has an end 31 connected to the wiring layer 10 and an end 32 connected to the optical semiconductor element 20. The end 31 is connected to the wiring 11 on the surface 10a. The end 32 is connected to the wiring of the optical semiconductor element 20 on the surface 20a of the optical semiconductor element 20 opposite the wiring layer 10.

[0032] The encapsulating layer 40 is disposed on the surface 10a of the wiring layer 10 so as to encapsulate the optical semiconductor element 20. The thickness direction of the encapsulating layer 40 is along the Z-axis direction. The encapsulating layer 40 encapsulates the optical semiconductor element 20 and the pair of wires 30. The encapsulating layer 40 is formed of a material that transmits light incident on the optical semiconductor element 20 or light emitted from the optical semiconductor element 20. The encapsulating layer 40 may be formed of a resin material that is optically transparent.

[0033] The encapsulating layer 40 has a pair of surfaces 40a, 40b perpendicular to the Z-axis direction. The surface 40a is the surface of the encapsulating layer 40 opposite the wiring layer 10. The surface 40a is in contact with the adhesive layer 60, which will be described later. The surface 40b is the surface of the encapsulating layer 40 facing the wiring layer 10. The surface 40b is in contact with the surface 10a of the wiring layer 10. When viewed from the Z-axis direction, the outer edge 40e of the encapsulating layer 40 has a rectangular shape. When viewed from the Z-axis direction, the outer edge 40e of the encapsulating layer 40 coincides with the outer edge 10e of the wiring layer 10. When viewed from the Z-axis direction, the shape of the outer edge 40e of the encapsulating layer 40 is the same as the shape of the outer edge 10e of the wiring layer 10. The surface 40b is in contact with the entire surface 10a except for the area where the optical semiconductor element 20 is disposed and the area where the end 31 of the wire 30 is connected.

[0034] The optical member 50 is disposed on the surface 40a of the sealing layer 40 via an adhesive layer 60. The optical member 50 has a sheet portion 51 disposed on the adhesive layer 60 and a lens portion 52 formed on the sheet portion 51. The sheet portion 51 is formed integrally with the lens portion 52. The optical member 50 (the sheet portion 51 and the lens portion 52) is formed of a material that transmits light incident on the optical semiconductor element 20 or light emitted from the optical semiconductor element 20. The optical member 50 may be formed of a resin material having optical transparency. The refractive index of the material forming the optical member 50 may be smaller than the refractive index of the material forming the sealing layer 40.

[0035] The sheet portion 51 is disposed on the surface 40a of the sealing layer 40 via the adhesive layer 60. The thickness direction of the sheet portion 51 is along the Z-axis direction. The sheet portion 51 has a pair of surfaces 51a and 51b perpendicular to the Z-axis direction. The surface 51a is the surface of the sheet portion 51 opposite the wiring layer 10. The surface 51b is the surface of the sheet portion 51 facing the wiring layer 10. When viewed from the Z-axis direction, the outer edge 51e of the sheet portion 51 has a rectangular shape. When viewed from the Z-axis direction, the outer edge 51e of the sheet portion 51 is located inside the outer edge 40e of the sealing layer 40. When viewed from the Z-axis direction, the outer edge 51e is located closer to the lens portion 52 than the outer edge 40e. When viewed from the Z-axis direction, the size of the sheet portion 51 is smaller than the size of the sealing layer 40.

[0036] The lens portion 52 is formed on the surface 51a of the sheet portion 51. When the optical semiconductor element 20 is a light-receiving element, the lens portion 52 may be a portion that condenses light incident on the optical element 1 onto the optical semiconductor element 20. When the optical semiconductor element 20 is a light-emitting element, the lens portion 52 may be a portion that collimates light emitted from the optical semiconductor element 20. In this example, the lens portion 52 is an aspheric lens. The surface 52a of the lens portion 52 opposite the sheet portion 51 is curved so as to be convex toward the side opposite the sheet portion 51 and has a vertex P. The surface 52a may be a paraboloid (paraboloid of revolution). When viewed from the Z-axis direction, the outer edge 52e of the lens portion 52 has a circular shape. The outer edge 52e is the boundary between the sheet portion 51 and the lens portion 52 and is the connection portion between the surface 51a and the surface 52a. When viewed from the Z-axis direction, the outer edge 51e of the sheet portion 51 is larger than the outer edge 52e of the lens portion 52. That is, when viewed from the Z-axis direction, the outer edge 51e is located outside the outer edge 52e.

[0037] The adhesive layer 60 is disposed between the sealing layer 40 and the optical member 50. The thickness direction of the adhesive layer 60 is along the Z-axis direction. The adhesive layer 60 is disposed on the surface 40a of the sealing layer 40. The adhesive layer 60 bonds the sealing layer 40 and the optical member 50. The adhesive layer 60 is in contact with the surface 40a of the sealing layer 40 and the surface 51b of the sheet portion 51. The adhesive layer 60 is formed of a material that transmits light incident on the optical semiconductor element 20 or light emitted from the optical semiconductor element 20. The adhesive layer 60 may be formed of a light-transmitting resin material. The adhesive layer 60 may be a film-like adhesive sheet or a cured liquid adhesive.

[0038] When viewed from the Z-axis direction, the outer edge 60e of the adhesive layer 60 has a rectangular shape. When viewed from the Z-axis direction, the outer edge 60e of the adhesive layer 60 is located inside the outer edge 40e of the sealing layer 40. When viewed from the Z-axis direction, the outer edge 60e is located closer to the lens unit 52 than the outer edge 40e. When viewed from the Z-axis direction, the size of the adhesive layer 60 is smaller than the size of the sealing layer 40. The outer edge portion of the surface 40a is exposed from the adhesive layer 60. When viewed from the Z-axis direction, the outer edge 60e of the adhesive layer 60 coincides with the outer edge 51e of the sheet unit 51. When viewed from the Z-axis direction, the shape of the outer edge 60e of the adhesive layer 60 is the same as the shape of the outer edge 51e of the sheet unit 51. The adhesive layer 60 is in contact with the entire surface 51b. The adhesive layer 60 is disposed throughout the entire space between the sheet unit 51 and the sealing layer 40. In other words, no air layer (gap) is formed between the sheet unit 51 and the sealing layer 40.

[0039] As shown in FIG. 2, the optical semiconductor element 20 has a thickness T1. In this example, thickness T1 is the height in the Z-axis direction from the surface of the optical semiconductor element 20 on the wiring layer 10 side to surface 20a. Thickness T1 may be 0.2 mm or more and 0.4 mm or less. The encapsulating layer 40 has a thickness T2. In this example, thickness T2 is the height in the Z-axis direction from surface 40b to surface 40a of the encapsulating layer 40. Thickness T2 may be 0.35 mm or more and 0.7 mm or less. Thickness T2 is uniform, and the height in the Z-axis direction from surface 40a to surface 40a is constant.

[0040] The sheet portion 51 has a thickness T3. In this example, the thickness T3 is the height in the Z-axis direction from the surface 51b to the surface 51a of the sheet portion 51. The thickness T3 may be 0.5 mm or less. The lens portion 52 has a thickness T4. The thickness T4 is the thickness of the lens portion 52 in the Z-axis direction. In this example, the thickness T4 is the height in the Z-axis direction from the surface 51a of the sheet portion 51 to the vertex P. The thickness T4 may be 1 mm or more.

[0041] The adhesive layer 60 has a thickness T5. In this example, the thickness T5 is the height in the Z-axis direction from the surface of the adhesive layer 60 that contacts the surface 40a of the sealing layer 40 to the surface of the adhesive layer 60 that contacts the surface 51b of the sheet portion 51. The thickness T5 may be the height in the Z-axis direction from the surface 40a of the sealing layer 40 to the surface 51b of the sheet portion 51. The thickness T5 may be 0.1 mm or less.

[0042] The thickness T4 of the lens portion 52 is greater than the thickness T3 of the sheet portion 51. The thickness T4 of the lens portion 52 is greater than the thickness T5 of the adhesive layer 60. The thickness T4 of the lens portion 52 is greater than the sum of the thickness T3 of the sheet portion 51 and the thickness T5 of the adhesive layer 60. The thickness T4 of the lens portion 52 may be two or more times, five or more times, or eight or more times the sum of the thickness T3 of the sheet portion 51 and the thickness T5 of the adhesive layer 60.

[0043] The thickness T4 of the lens portion 52 may be designed to be much larger than the thicknesses of other portions of the optical element 1. For example, the thickness T4 of the lens portion 52 may be larger than the thickness T2 of the sealing layer 40, or may be larger than the sum of the thickness T2 of the sealing layer 40, the thickness T5 of the adhesive layer 60, and the thickness T3 of the sheet portion 51. Furthermore, when the thickness of the wiring layer 10 is defined as thickness T6, the thickness T4 of the lens portion 52 may be larger than the thickness T6 of the wiring layer 10. The thickness T4 of the lens portion 52 may be larger than the sum of the thickness T6 of the wiring layer 10 and the thickness T2 of the sealing layer 40. The thickness T4 of the lens portion 52 may be larger than the sum of the thickness T6 of the wiring layer 10, the thickness T2 of the sealing layer 40, the thickness T5 of the adhesive layer 60, and the thickness T3 of the sheet portion 51.

[0044] The thickness T3 of the sheet portion 51 is smaller than the thickness T2 of the encapsulating layer 40. The thickness T3 of the sheet portion 51 may be 50% or less of the thickness T2 of the encapsulating layer 40, or may be 30% or less of the thickness T2 of the encapsulating layer 40. The thickness T3 of the sheet portion 51 is smaller than the thickness T1 of the optical semiconductor element 20. The thickness T3 of the sheet portion 51 may be 80% or less of the thickness T1 of the optical semiconductor element 20, or may be 50% or less.

[0045] When viewed from the Z-axis direction, the outer edge 52e of the lens portion 52 is positioned so as to surround the entire optical semiconductor element 20 and each wire 30. When viewed from the Z-axis direction, the end 31 of each wire 30 connected to the wiring layer 10 and the end 32 connected to the optical semiconductor element 20 are positioned inside the outer edge 52e. When viewed from the Z-axis direction, the lens portion 52 has a center C. In this example, the center C coincides with the vertex P of the lens portion 52. The end 31 of each wire 30 is positioned closer to the outer edge 52e (farther from the center C) than the end 32.

[0046] FIG. 3 shows a first line segment L1 and a second line segment L2. When viewed from the Z-axis direction, the first line segment L1 is a line segment that runs from a point on the outer edge 51e of the sheet portion 51, passes through the center C of the lens portion 52, and reaches another point on the outer edge 51e, and is the line segment that has the shortest distance from the one point to the other point. In this example, the first line segment L1 runs along one side (the side along the Y-axis direction) of the rectangular outer edge 51e. When viewed from the Z-axis direction, the second line segment L2 is a line segment that runs from a point on the outer edge 51e, passes through the center C, and reaches another point on the outer edge 51e, and is the line segment that has the longest distance from the one point to the other point. In this example, the second line segment L2 is a diagonal line of the outer edge 51e, and is inclined with respect to the X-axis and Y-axis directions.

[0047] The sheet portion 51 has a first portion 55 and a second portion 56. The first portion 55 and the second portion 56 are located between an outer edge 51e of the sheet portion 51 and an outer edge 52e of the lens portion 52. The first portion 55 and the second portion 56 are located on a first line segment L1 so as to sandwich the lens portion 52 therebetween. When viewed from the Z-axis direction, the first portion 55 and the second portion 56 do not overlap with the lens portion 52.

[0048] The sheet portion 51 has a third portion 57 and a fourth portion 58. The third portion 57 and the fourth portion 58 are located between an outer edge 51e of the sheet portion 51 and an outer edge 52e of the lens portion 52. The third portion 57 and the fourth portion 58 are located on the second line segment L2 so as to sandwich the lens portion 52 therebetween. When viewed from the Z-axis direction, the third portion 57 and the fourth portion 58 do not overlap with the lens portion 52.

[0049] The lens portion 52 has a width W1 on the first line segment L1 and a width W2 on the second line segment L2. In this example, the outer edge 52e of the lens portion 52 is circular, so the width W1 and the width W2 are the same size. The width W1 and the width W2 are equal to the diameter of the lens portion 52 (the diameter of the outer edge 52e) when viewed from the Z-axis direction. Each of the width W1 and the width W2 is greater than the thickness T4 of the lens portion 52.

[0050] The first portion 55 has a width W55 on the first line segment L1. The second portion 56 has a width W56 on the first line segment L1. The width W1 of the lens portion 52 is greater than the sum of the widths W55 and W56. The width W1 of the lens portion 52 may be two or more times, or four or more times, the sum of the widths W55 and W56.

[0051] The third portion 57 has a width W57 on the second line segment L2. The fourth portion 58 has a width W58 on the second line segment L2. The width W2 of the lens portion 52 is greater than the sum of the widths W57 and W58. The width W2 of the lens portion 52 may be 1.2 times or more, or 1.5 times or more, the sum of the widths W57 and W58. [Method of manufacturing optical element 1]

[0052] A method for manufacturing the optical semiconductor element 20 will be described with reference to FIGS. 4 to 9. An example of manufacturing a plurality of optical elements 1 collectively will be described below. First, as shown in FIG. 4, a substrate 100 is prepared. The substrate 100 includes a plurality of wiring portions 101, each corresponding to a wiring layer 10. The "wiring portions corresponding to the wiring layer" are portions that will become the wiring layer 10 after the cutting process of the substrate 100. The process of preparing the substrate 100 corresponds to the process of preparing the wiring layer 10. The plurality of wiring portions 101 are arranged in a lattice pattern on the substrate 100, and boundaries L11 (dicing lines) are set between adjacent wiring portions 101. The substrate 100 is cut (diced) along the boundaries L11 in a later cutting process. Each wiring portion 101 has a surface 101a that will become the surface 10a of the wiring layer 10 after the cutting process. Wiring 11 is formed on the wiring portion 101, and the wiring 11 has an exposed portion (terminal portion) on the surface 101a.

[0053] Next, a plurality of optical semiconductor elements 20 are arranged on the substrate 100. In this example, one optical semiconductor element 20 is arranged on the surface 101a of each wiring portion 101. As described above, the wiring portion 101 is a portion that will become the wiring layer 10 after the cutting step. The step of arranging the optical semiconductor elements 20 on the wiring portion 101 corresponds to the step of arranging the optical semiconductor elements 20 on the wiring layer 10.

[0054] Next, the wiring portion 101 and the optical semiconductor element 20 are electrically connected by wires 30. In this example, a pair of wires 30 connects one wiring portion 101 and one corresponding optical semiconductor element 20. One end of each wire 30 is connected to a terminal portion of the wiring 11 of the wiring portion 101. The other end of each wire 30 is connected to the wiring of the optical semiconductor element 20. The step of electrically connecting the wiring portion 101 and the optical semiconductor element 20 by wires 30 corresponds to the step of electrically connecting the wiring layer 10 and the optical semiconductor element 20 by wires 30.

[0055] Next, a base material 400 that encapsulates the optical semiconductor elements 20 is placed on the base material 100. In this example, the base material 400 is placed so that it covers the multiple optical semiconductor elements 20 and multiple wires 30 arranged on the base material 100. The base material 400 includes multiple encapsulating portions 401, each corresponding to the encapsulating layer 40. The "encapsulating portions corresponding to the encapsulating layer" are portions that will become the encapsulating layer 40 after the cutting process of the base material 400. Each encapsulating portion 401 encapsulates one optical semiconductor element 20 and a pair of wires 30 in their entirety. The step of placing the base material 400 on the base material 100 corresponds to the step of placing the encapsulating layer 40 on the wiring layer 10. The multiple encapsulating portions 401 are arranged in a lattice pattern on the base material 400. A boundary L11 (dicing line) that is common to the wiring portion 101 is set between adjacent encapsulating portions 401. The base material 400 is cut (diced) along the boundary L11 in a subsequent cutting process.

[0056] Next, an optical member 50 having an adhesive layer 60 attached thereto is prepared. In the process of preparing the optical member 50 having an adhesive layer 60 attached thereto, first, a lens sheet 500 is prepared as shown in FIG. 5. The lens sheet 500 includes a plurality of optical portions 501, each of which corresponds to an optical member 50. The "optical portions corresponding to the optical members" are portions that will become the optical members 50 after the lens sheet 500 is cut. The plurality of optical portions 501 are arranged in a grid pattern on the lens sheet 500, and boundaries L12 (dicing lines) are set between adjacent optical portions 501. The lens sheet 500 is cut (diced) along the boundaries L12 in a later cutting process. Each optical portion 501 has a sheet portion 51 and a lens portion 52.

[0057] Next, a die attach film (DAF) 600 is attached to the lens sheet 500. As shown in FIG. 6 , the DAF 600 has a film-like adhesive sheet 600a and a support sheet 600b that supports the adhesive sheet 600a. The adhesive sheet 600a and the support sheet 600b are laminated together. The DAF 600 is attached to the lens sheet 500 so that the lens sheet 500, the adhesive sheet 600a, and the support sheet 600b are laminated in this order. With the DAF 600 attached to the lens sheet 500, each lens portion 52 is located on the opposite side of the adhesive sheet 600a with respect to the corresponding sheet portion 51. That is, the adhesive sheet 600a is attached to the surface 51b of each sheet portion 51 opposite to the lens portion 52.

[0058] The adhesive sheet 600a includes a plurality of adhesive portions 601, each of which corresponds to an adhesive layer 60. The "adhesive portions corresponding to adhesive layers" are portions that will become the adhesive layers 60 after the adhesive sheet 600a is cut. The plurality of adhesive portions 601 are positioned in a grid pattern on the adhesive sheet 600a. A boundary L12 (dicing line) that is common to the lens sheet 500 is set between adjacent adhesive portions 601. The adhesive sheet 600a will be cut (diced) along the boundary L12 in a later cutting process.

[0059] 7, the lens sheet 500 and the adhesive sheet 600a are cut (divided) together along the boundary L12. The cutting may be performed using a dicing blade DB. The optical members 50 and the adhesive layer 60 are then peeled off from the support sheet 600b. This results in a plurality of optical members 50 and a plurality of adhesive layers 60, each with the adhesive layer 60 attached to the optical member 50.

[0060] Next, as shown in FIG. 8 , multiple optical members 50 are arranged on the substrate 400. One optical member 50 is bonded to the surface of each sealing portion 401 opposite the wiring portion 101 using an adhesive layer 60. As described above, the sealing portion 401 corresponds to the sealing layer 40, and the wiring portion 101 corresponds to the wiring layer 10. Therefore, this step of arranging multiple optical members 50 on the substrate 400 corresponds to the step of bonding the optical members 50 to the surface 40a of each sealing layer 40 opposite the wiring layer 10 using the adhesive layer 60. When viewed from the thickness direction of the substrate 100 (wiring layer 10), each optical member 50 is arranged so that the end 31 of each wire 30 is located inside the outer edge 52e of the lens portion 52. The optical members 50 may be arranged using a die bonder. The optical members 50 may be positioned using image recognition based on the outer edge 51e of the sheet portion 51 and the outer edge of the optical semiconductor element 20. Next, a dicing tape 700 is attached to the surface 100b of the base material 100 opposite to the base material 400.

[0061] 9, the base material 100 and the base material 400 are cut (divided) together along the boundary L11. The cutting may be performed using, for example, a dicing blade DB. Then, the wiring layer 10 is peeled off from the dicing tape 700. This results in obtaining a plurality of optical elements 1. This completes the manufacturing process for the optical element 1. [Action and effect]

[0062] In the optical element 1, the thickness T4 of the lens portion 52 in the Z-axis direction is greater than the sum of the thickness T3 of the sheet portion 51 and the thickness T5 of the adhesive layer 60. When viewed from the Z-axis direction, the end 31 of the wire 30 connected to the wiring layer 10 is located inside the outer edge 52e of the lens portion 52. This allows the lens portion 52 to be formed large, thereby improving the optical characteristics of the optical element 1. In addition, in the optical element 1, the sealing layer 40 is disposed on the wiring layer 10 to seal the optical semiconductor element 20, the optical member 50 is disposed on the sealing layer 40, and the adhesive layer 60 is disposed between the sealing layer 40 and the optical member 50. In other words, the optical member 50 having the lens portion 52 is formed separately from the sealing layer 40 that seals the optical semiconductor element 20. As a result, even if the lens portion 52 is formed large, the volume of the sealing layer 40 does not change, and therefore stress caused by expansion or contraction of the sealing layer 40 due to temperature changes does not increase. This makes it possible to suppress peeling of the wires 30 from the wiring layer 10 and breakage of the wires 30 caused by stress, thereby maintaining stable electrical connection of the optical semiconductor element 20. Furthermore, in the optical element 1, the optical member 50 has a sheet portion 51 disposed on the adhesive layer 60 and a lens portion 52 formed on the sheet portion 51. This increases the bonding area between the optical member 50 and the adhesive layer 60 compared to when the lens portion 52 is disposed directly on the sealing layer 40, allowing the optical member 50 to be stably bonded to the sealing layer 40. Therefore, the optical element 1 can improve optical characteristics and ensure reliability.

[0063] Furthermore, in the optical element 1, the optical element 50 has the sheet portion 51, which allows for greater flexibility in designing the bonding surface of the optical element 50 with the adhesive layer 60. Because the shape of the adhesive layer 60 changes depending on the shape of the sealing layer 40, the bonding surface of the optical element 50 with the adhesive layer 60 needs to be appropriately designed in order to properly bond the optical element 50 to the adhesive layer 60. In the optical element 1, the optical element 50 has the sheet portion 51, which includes a surface 51b that bonds with the adhesive layer 60. Therefore, in the optical element 1, the shape of the bonding surface of the optical element 50 with the adhesive layer 60 can be appropriately designed by changing the shape of the sheet portion 51 without changing the shape of the lens portion 52. Therefore, the optical element 50 can be stably bonded to the sealing layer 40. Therefore, the optical element 1 can improve optical characteristics and ensure reliability.

[0064] Furthermore, in the optical element 1, when the refractive index of the material forming the optical member 50 is smaller than the refractive index of the material forming the sealing layer 40 (when the relationship "refractive index of air < ​​refractive index of the optical member 50 < refractive index of the sealing layer 40" holds), the optical characteristics of the optical element 1 can be improved. Specifically, compared to when external light is incident on the sealing layer 40 directly without passing through the optical member 50, when light is incident on the sealing layer 40 via an optical member 50 (sheet portion 51) having a refractive index lower than that of the sealing layer 40, the reflectance of light on the surface of the sealing layer 40 (surface reflectance) is reduced, and the light collection efficiency of the optical member 50 can be improved.

[0065] In conventional optical elements, the encapsulating layer and the lens portion are integrally formed, so the stress generated at the center of the encapsulating layer (where the lens portion is formed) is greater than the stress generated at the outer edge of the encapsulating layer (where the lens portion is not formed). Therefore, to prevent the wires from peeling off or breaking due to stress, the ends of the wires connected to the wiring layer must be positioned away from the center of the encapsulating layer. In contrast, in the optical element 1, the thickness T2 of the encapsulating layer 40 is uniform, and the height in the Z-axis direction from one surface 40a of the encapsulating layer 40 to the other surface 40a is constant. Therefore, a constant stress is generated in the encapsulating layer 40 regardless of the distance from the center. Therefore, there is no restriction on the position at which the ends of the wires connected to the wiring layer are positioned, improving the design freedom of the optical element 1.

[0066] In the optical element 1, the thickness T3 of the sheet portion 51 is smaller than the thickness T2 of the sealing layer 40. This reduces the distance from the lens portion 52 formed on the sheet portion 51 to the optical semiconductor element 20, thereby improving the optical characteristics of the optical element 1. Designing the thickness T3 of the sheet portion 51 to be small prevents the focal length of the optical member 50 from becoming smaller. If the thickness T3 of the sheet portion 51 is large, the refractive index of the sheet portion 51 may cause the focal length of the optical member 50 to become smaller. To resolve this, measures such as increasing the curvature of the lens portion 52 would be necessary, reducing the design freedom of the lens portion 52. However, in the optical element 1, the thickness T3 of the sheet portion 51 is small, thereby improving the design freedom of the lens portion 52 while maintaining the optical characteristics.

[0067] In the optical element 1, the thickness T3 of the sheet portion 51 is smaller than the thickness T1 of the optical semiconductor element 20. This allows the thickness T3 of the sheet portion 51 to be reduced while the thickness T4 of the lens portion 52 is designed to be large. That is, the optical characteristics of the optical element 1 are improved by increasing the size of the lens portion 52, and the optical characteristics can also be further improved by reducing the distance from the lens portion 52 formed on the sheet portion 51 to the optical semiconductor element 20.

[0068] In the optical element 1, when viewed from the Z-axis direction, the outer edge 51e of the sheet portion 51 is located inside the outer edge 40e of the sealing layer 40. This reduces the bonding area between the sealing layer 40 and the adhesive layer 60, thereby improving the optical properties of the optical element 1.

[0069] In the optical element 1, when viewed from the Z-axis direction, the outer edge 51e of the sheet portion 51 coincides with the outer edge 60e of the adhesive layer 60. Because the sheet portion 51 is not larger than the adhesive layer 60, it is possible to prevent a gap from being formed between the sheet portion 51 and the sealing layer 40, and it is possible to suppress a deterioration in the optical properties of the optical element 1 due to the gap. Furthermore, because the sheet portion 51 is not smaller than the adhesive layer 60, it is possible to suppress a deterioration in the optical properties of the optical element 1 caused by a portion of the adhesive layer 60 protruding from the sheet portion 51.

[0070] In the optical element 1, the outer edge 51e of the sheet portion 51 has a rectangular shape when viewed from the Z-axis direction. This allows for accurate alignment of the optical element 50 using the rectangular outer edge of the sheet portion 51 as a reference, for example, by image recognition, when placing the optical member 50 on the sealing layer 40 during the manufacturing process of the optical element 1.

[0071] In the optical element 1, the width (width W1, width W2) of the lens portion 52 when viewed from the Z-axis direction is larger than the thickness T4 of the lens portion 52 in the Z-axis direction. This allows, for example, the height of the lens portion 52 to be reduced (while achieving miniaturization), while efficiently focusing light incident on the lens portion 52 onto the optical semiconductor element 20. When the optical semiconductor element 20 is a light-receiving element, it is generally desirable to focus the incident light at a single point because the size of the optical semiconductor element 20 is small. In the optical element 1, the lens portion 52 is an aspherical lens whose width is larger than the thickness T4, and therefore the incident light can be appropriately focused.

[0072] In the optical element 1, when viewed from the Z-axis direction, the sheet portion 51 has a first portion 55 and a second portion 56 positioned to sandwich the lens portion 52 on a first line segment L1, which is a line segment that runs from one point on the outer edge 51e of the sheet portion 51 to another point on the outer edge 51e of the sheet portion 51, passing through the center C of the lens portion 52, and having the shortest distance from the one point to the other point. The width W1 of the lens portion 52 on the first line segment L1 is greater than the sum of the width W55 of the first portion 55 and the width W56 of the second portion 56 on the first line segment L1. This allows the lens portion 52 to be formed large while reducing the bonding area between the sealing layer 40 and the adhesive layer 60, thereby improving the optical characteristics of the optical element 1.

[0073] In the optical element 1, when viewed from the Z-axis direction, the sheet portion 51 has a third portion 57 and a fourth portion 58 positioned to sandwich the lens portion 52 on a second line segment L2, which is a line segment that extends from one point on the outer edge 51e of the sheet portion 51 to another point on the outer edge 51e of the sheet portion 51, passing through the center C of the lens portion 52, and having the longest distance from the one point to the other point. The width W2 of the lens portion 52 on the second line segment L2 is greater than the sum of the width W57 of the third portion 57 and the width W58 of the fourth portion 58 on the second line segment L2. This allows the lens portion 52 to be formed large while reducing the bonding area between the sealing layer 40 and the adhesive layer 60, thereby improving the optical characteristics of the optical element 1.

[0074] In the optical element 1, the thickness T4 of the lens portion 52 may be two or more times, five or more times, or eight or more times the sum of the thickness T3 of the sheet portion 51 and the thickness T5 of the adhesive layer 60. In this case, the lens portion is formed large, which can further improve the optical characteristics of the optical element.

[0075] In the optical element 1, the sheet portion 51 is formed integrally with the lens portion 52. This prevents the lens portion 52 from being misaligned with respect to the sheet portion 51, ensuring the reliability of the optical element 1.

[0076] For the reasons described above, the manufacturing method for the optical element 1 makes it possible to manufacture an optical element 1 that can improve optical characteristics and ensure reliability. Furthermore, in the manufacturing method for the optical element 1, the optical member 50 is adhered to the sealing layer 40 by a film-like adhesive layer 60 (adhesive sheet 600a). This allows the optical member 50 to be more stably disposed on the sealing layer 40 than when the optical member 50 is adhered by, for example, a liquid adhesive. Specifically, a film-like adhesive layer generally requires less time to harden than a liquid adhesive and is less likely to shrink or change in shape during hardening. Therefore, by using the film-like adhesive layer 60, the optical member 50 can be accurately adhered to the sealing layer 40. In this respect, the manufacturing method for the optical element 1 makes it possible to manufacture an optical element 1 that can improve optical characteristics and ensure reliability.

[0077] In the manufacturing method of the optical element 1, the step of preparing the optical member 50 includes a step of obtaining a plurality of optical members 50, each of which is an optical member 50, by cutting a lens sheet 500 including a plurality of optical portions 501, each of which corresponds to an optical member 50. This allows the singulated optical members 50 to be accurately positioned on the sealing layer 40 when the optical members 50 are bonded to the sealing layer 40. For example, if the pitch of the plurality of optical portions 501 in the lens sheet 500 differs from the pitch of the plurality of optical semiconductor elements 20 arranged on the substrate 100, there is a risk that the optical semiconductor elements 20 and the optical portions 501 will not be properly aligned if the lens sheet 500 is placed on the substrate 400 without cutting. However, by cutting the lens sheet 500 to obtain singulated optical members 50 as in the manufacturing method of the optical element 1 described above, the optical members 50 can be properly aligned without being affected by the difference in pitch.

[0078] In the manufacturing method of the optical element 1, the step of preparing the optical member 50 includes, in this order, a step of attaching an adhesive sheet 600a including a plurality of adhesive portions 601 to a lens sheet 500, and a step of cutting the adhesive sheet 600a and the lens sheet 500 to obtain a plurality of optical members 50 and a plurality of adhesive layers 60 with the adhesive layers 60 attached to the optical members 50. This allows the optical members 50 with the adhesive layers 60 attached to be efficiently obtained. Furthermore, in the manufacturing method of the optical element 1 described above, the optical member 50 with the adhesive layers 60 attached is lifted using, for example, a die bonder and placed on the base material 400. Therefore, the optical member 50 can be easily placed on the base material 400 without lifting up the laminate of the base material 100 and the base material 400, which has a size larger than that of the optical member 50.

[0079] In the method for manufacturing the optical element 1, the step of attaching the adhesive sheet 600a to the lens sheet 500 is a step of attaching the DAF 600 including the adhesive sheet 600a to the lens sheet 500. This allows the lens sheet 500 to be cut appropriately. [Variations]

[0080] The present invention is not limited to the above-described embodiment. The thickness T3 of the sheet portion 51 may be equal to or greater than the thickness T1 of the optical semiconductor element 20. The thickness T3 of the sheet portion 51 may be equal to or greater than the thickness T2 of the encapsulating layer 40. When viewed from the Z-axis direction, the outer edge 51e of the sheet portion 51 may coincide with the outer edge 40e of the encapsulating layer 40. When viewed from the Z-axis direction, the sheet portion 51 may have the same size as the encapsulating layer 40. When viewed from the Z-axis direction, the outer edge 51e of the sheet portion 51 may be located outside the outer edge 40e. When viewed from the Z-axis direction, the sheet portion 51 may be larger than the encapsulating layer 40.

[0081] When viewed from the Z-axis direction, the outer edge 51e of the sheet portion 51 may be located inside the outer edge 60e of the adhesive layer 60. When viewed from the Z-axis direction, the sheet portion 51 may be smaller than the adhesive layer 60. When viewed from the Z-axis direction, the outer edge 51e of the sheet portion 51 may be located outside the outer edge 60e of the adhesive layer 60. When viewed from the Z-axis direction, the sheet portion 51 may be larger than the adhesive layer 60.

[0082] When viewed from the Z-axis direction, the outer edge 51e of the sheet portion 51 does not have to have a rectangular shape, and may have a circular shape, an elliptical shape, or a polygonal shape other than a rectangle. The width of the lens portion 52 when viewed from the Z-axis direction may be equal to or less than the thickness T4 of the lens portion 52 in the Z-axis direction. The lens portion 52 may be a spherical lens.

[0083] The width W1 of the lens portion 52 on the first line segment L1 may be equal to the sum of the width W55 of the first portion 55 and the width W56 of the second portion 56 on the first line segment L1, or may be smaller than the sum of the widths W55 and W56. The width W2 of the lens portion 52 on the second line segment L2 may be equal to the sum of the width W57 of the third portion 57 and the width W58 of the fourth portion 58 on the second line segment L2, or may be smaller than the sum of the widths W57 and W58.

[0084] In the process of preparing the optical members, the lens sheet 500 may be cut to obtain a plurality of optical members 50, and then the adhesive layer 60 may be adhered to each of the optical members 50. In other words, the lens sheet 500 and the adhesive sheet 600a do not have to be cut at the same time. The adhesive sheet 600a does not have to be included in the DAF 600. For example, the adhesive sheet 600a alone, not laminated on the support sheet 600b, may be attached to the lens sheet 500.

[0085] In the above embodiment, the entire lens portion 52 is formed in a substantially hemispherical shape, but the lens portion 52 may further have another portion (for example, a cylindrical light guide) located between the substantially hemispherical portion and the sheet portion 51. The lens portion 52 is the entire portion formed on the sheet portion 51 and thicker than the sheet portion 51. For example, if the lens portion 52 has a light guide, the thickness T4 of the lens portion 52 is the sum of the thickness of the substantially hemispherical portion and the thickness of the light guide. [Explanation of symbols]

[0086] 1...optical element, 10...wiring layer, 40e, 51e, 52e, 60e...outer edge, 20...optical semiconductor element, 40a, 51b...surface, 30...wire, 31...end, 40...sealing layer, 50...optical member, 51...sheet portion, 52...lens portion, 55...first portion, 56...second portion, 57...third portion, 58...fourth portion, 60...adhesive layer, 500...lens sheet, 600...die attach film (DAF), 600a...adhesive sheet, C...center.

Claims

1. a wiring layer; an optical semiconductor element disposed on the wiring layer; a wire electrically connecting the wiring layer and the optical semiconductor element; a sealing layer disposed on the wiring layer so as to seal the optical semiconductor element; an optical member disposed on a surface of the sealing layer opposite to the wiring layer; an adhesive layer disposed between the sealing layer and the optical member, the optical member has a sheet portion disposed on the adhesive layer and a lens portion formed on the sheet portion, a thickness of the lens portion in a thickness direction of the wiring layer is greater than a sum of a thickness of the sheet portion and a thickness of the adhesive layer, When viewed from the thickness direction of the wiring layer, the end of the wire connected to the wiring layer is located inside the outer edge of the lens portion. Optical elements.

2. The thickness of the sheet portion is smaller than the thickness of the sealing layer. The optical element according to claim 1 .

3. The thickness of the sheet portion is smaller than the thickness of the optical semiconductor element.

3. The optical element according to claim 1.

4. When viewed from the thickness direction of the wiring layer, the outer edge of the sheet portion is located inside the outer edge of the sealing layer.

3. The optical element according to claim 1.

5. When viewed from the thickness direction of the wiring layer, an outer edge of the sheet portion coincides with an outer edge of the adhesive layer.

3. The optical element according to claim 1.

6. When viewed from the thickness direction of the wiring layer, the outer edge of the sheet portion has a rectangular shape.

3. The optical element according to claim 1.

7. a width of the lens portion when viewed in the thickness direction of the wiring layer is greater than a thickness of the lens portion in the thickness direction of the wiring layer; 3. The optical element according to claim 1.

8. When viewed from the thickness direction of the wiring layer, the sheet portion has a first portion and a second portion positioned to sandwich the lens portion on a first line segment that extends from a point on an outer edge of the sheet portion through a center of the lens portion to another point on the outer edge of the sheet portion and that has a minimum distance from the one point to the other point, a width of the lens portion on the first line segment is greater than a sum of a width of the first portion and a width of the second portion on the first line segment; 3. The optical element according to claim 1.

9. When viewed from the thickness direction of the wiring layer, the sheet portion has a third portion and a fourth portion positioned to sandwich the lens portion on a second line segment that extends from a point on the outer edge of the sheet portion through the center of the lens portion to another point on the outer edge of the sheet portion and that has a maximum distance from the one point to the other point, a width of the lens portion on the second line segment is greater than a sum of a width of the third portion and a width of the fourth portion on the second line segment; 3. The optical element according to claim 1.

10. the thickness of the lens portion in the thickness direction of the wiring layer is at least twice the sum of the thickness of the sheet portion and the thickness of the adhesive layer; 3. The optical element according to claim 1.

11. the thickness of the lens portion in the thickness direction of the wiring layer is five times or more the sum of the thickness of the sheet portion and the thickness of the adhesive layer; 3. The optical element according to claim 1.

12. the thickness of the lens portion in the thickness direction of the wiring layer is eight times or more the sum of the thickness of the sheet portion and the thickness of the adhesive layer; 3. The optical element according to claim 1.

13. The sheet portion is integrally formed with the lens portion.

3. The optical element according to claim 1.

14. providing a wiring layer; a step of disposing an optical semiconductor element on the wiring layer; a step of electrically connecting the wiring layer and the optical semiconductor element with a wire; a step of disposing an encapsulation layer on the wiring layer to encapsulate the optical semiconductor element; preparing an optical member having a sheet portion and a lens portion formed on the sheet portion, with a film-like adhesive layer attached to a surface of the sheet portion opposite to the lens portion; and adhering the optical member to a surface of the sealing layer opposite to the wiring layer with the adhesive layer, In a state where the optical member is adhered to the sealing layer, a thickness of the lens portion in a thickness direction of the wiring layer is greater than a sum of a thickness of the adhesive layer and a thickness of the sheet portion; When viewed from the thickness direction of the wiring layer, the end of the wire connected to the wiring layer is located inside the outer edge of the lens portion. A method for manufacturing an optical element.

15. the step of preparing the optical member includes a step of obtaining a plurality of optical members, each of which is the optical member, by cutting a lens sheet including a plurality of portions each corresponding to the optical member; The method for manufacturing an optical element according to claim 14 .

16. The step of preparing the optical member includes: attaching an adhesive sheet to the lens sheet, the adhesive sheet including a plurality of portions each corresponding to the adhesive layer; and a step of cutting the adhesive sheet and the lens sheet to obtain a plurality of optical members each of which is the optical member and a plurality of adhesive layers each of which is the adhesive layer, with the adhesive layers attached to the optical members, in this order. The method for manufacturing an optical element according to claim 15 .

17. the step of attaching the adhesive sheet to the lens sheet is a step of attaching a die attach film including the adhesive sheet to the lens sheet. The method for manufacturing an optical element according to claim 16 .

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