Optical waveguide component

Abstract

To provide an optical waveguide component that makes it easy to align an optical waveguide and an optical fiber.SOLUTION: An optical waveguide component is provided, comprising a first support member having a first surface, and an optical waveguide supported by the first support member and provided with a first core having a first end face exposed from the first surface, where the first surface has a plurality of recesses formed thereon.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to optical waveguide components. [Background technology]

[0002] Various techniques have been proposed for optically coupling an optical fiber to an optical waveguide provided on a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2022-509356 [Patent Document 2] Japanese Patent Application Publication No. 2018-040925 [Patent Document 3] Japanese Patent Application Laid-Open No. 2005-326602 Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional techniques, alignment between the optical waveguide and the optical fiber is complicated.

[0005] An object of the present disclosure is to provide an optical waveguide component that allows easy alignment between an optical waveguide and an optical fiber. [Means for solving the problem]

[0006] According to one embodiment of the present disclosure, there is provided an optical waveguide component comprising: a first support member having a first surface; and an optical waveguide supported by the first support member and including a first core having a first end face exposed from the first surface, wherein a plurality of recesses are formed in the first surface. [Effects of the Invention]

[0007] According to the present disclosure, alignment between an optical waveguide and an optical fiber can be easily performed. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a plan view illustrating an optical waveguide component according to an embodiment; [Figure 2] 1 is a cross-sectional view (part 1) illustrating an optical waveguide component according to an embodiment. [Figure 3] FIG. 2 is a cross-sectional view (part 2) illustrating the optical waveguide component according to the embodiment. [Figure 4] 10A to 10C are side views illustrating a method for forming a recess. [Figure 5] 10A to 10C are cross-sectional views illustrating a method for forming a recess. [Figure 6] 10A to 10C are side views illustrating a method for forming a convex portion. [Figure 7] 10A to 10C are cross-sectional views illustrating a method for forming a convex portion. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In this specification and drawings, components having substantially the same functional configurations are designated by the same reference numerals, and redundant description may be omitted.

[0010] [Structure of optical waveguide components] The structure of an optical waveguide component according to an embodiment will be described. Fig. 1 is a plan view illustrating an optical waveguide component according to an embodiment. Figs. 2 and 3 are cross-sectional views illustrating an optical waveguide component according to an embodiment. Fig. 2 corresponds to a cross-sectional view taken along line II-II in Fig. 1. Fig. 3 corresponds to a cross-sectional view taken along line III-III in Fig. 1.

[0011] 1 to 3, an optical waveguide component 1 according to an embodiment includes an optical waveguide substrate 90 and an optical connector 50. The optical waveguide substrate 90 includes a substrate 30, an optical waveguide 10, a first support member 20, and an optical semiconductor chip 40.

[0012] The substrate 30 is, for example, a wiring substrate, and has a wiring pattern (not shown) and electrodes (not shown). The first support member 20 is provided on one main surface 31 of the substrate 30.

[0013] In this embodiment, for convenience, the first support member 20 side is referred to as the upper side or one side, and the opposite side is referred to as the lower side or the other side, with respect to the substrate 30. The upper surface of each part is referred to as the one side or top surface, and the lower surface is referred to as the other side or bottom surface. However, the optical waveguide component 1 can be used upside down or positioned at any angle. Furthermore, a planar view refers to viewing an object from the normal direction of the main surface 31 of the substrate 30, and a planar shape refers to the shape of the object viewed from the normal direction of the main surface 31 of the substrate 30.

[0014] A first support member 20 is fixed to a substrate 30. The first support member 20 has a first portion 21 and a second portion 22. The first portion 21 is fixed to a main surface 31. For example, the first portion 21 is bonded to the main surface 31. An optical waveguide 10 is provided on the first portion 21, and the second portion 22 is provided on the optical waveguide 10. The optical waveguide 10 is sandwiched between the first portion 21 and the second portion 22. The first support member 20 is made of, for example, an organic resin. The material of the first portion 21 and the second portion 22 is, for example, an organic resin such as an epoxy resin or a polyimide resin. The thickness of both the first portion 21 and the second portion 22 is, for example, about 1 mm to 2 mm.

[0015] The first support member 20 has a first surface 25. The first surface 25 is, for example, perpendicular to the main surface 31 of the substrate 30. A plurality of recesses 26 are formed in the first surface 25. For example, two recesses 26 are formed in the first portion 21, and two recesses 26 are formed in the second portion 22. For example, the two recesses 26 formed in the first portion 21 are aligned parallel to the main surface 31, and the two recesses 26 formed in the second portion 22 are aligned parallel to the main surface 31. Furthermore, one recess 26 formed in the first portion 21 and one recess 26 formed in the second portion 22 are aligned perpendicular to the main surface 31, and another recess 26 formed in the first portion 21 and another recess 26 formed in the second portion 22 are aligned perpendicular to the main surface 31. The opening shape of the recesses 26 is circular, and the diameter of the recesses 26 continuously decreases toward the bottom. For example, the wall surface of the recess 26 is inclined at about 7° from an axis perpendicular to the first surface 25. The diameter of the recess 26 on the first surface 25 is, for example, 30 μm to 200 μm. The depth of the recess 26 is, for example, 30 μm to 200 μm.

[0016] The optical waveguide 10 is supported by a first support member 20. The optical waveguide 10 has a first clad layer 11, a plurality of core layers 12, and a second clad layer 13. The optical waveguide 10 is a polymer waveguide. The core layers 12 are an example of a first core.

[0017] The first cladding layer 11 is provided on the first portion 21. The material of the first cladding layer 11 is, for example, an organic resin such as an epoxy resin or a polyimide resin. The thickness of the first cladding layer 11 is, for example, about 10 μm to 30 μm.

[0018] The core layers 12 are provided in a strip shape on the first cladding layer 11. The material of the core layers 12 is, for example, an organic resin such as an epoxy resin or a polyimide resin. For example, the cross section of the core layers 12 perpendicular to the extension direction is rectangular. To obtain a single-mode optical waveguide, the core layers 12 may have a very small cross-sectional area. For example, the width of the core layers 12 is 5 μm to 10 μm, and the height is 5 μm to 10 μm.

[0019] The core layer 12 has a first end face 15 exposed from the first surface 25. For example, the first end face 15 is parallel to the first surface 25. The first end face 15 may also be flush with the first surface 25.

[0020] The second cladding layer 13 is provided on the first cladding layer 11 and the plurality of core layers 12. The second cladding layer 13 covers the plurality of core layers 12. The material of the second cladding layer 13 is, for example, an organic resin such as an epoxy resin or a polyimide resin. The thickness of the second cladding layer 13 is, for example, about 10 μm to 30 μm.

[0021] In the optical waveguide 10, the refractive index of the core layer 12 is higher than the refractive indexes of the first cladding layer 11 and the second cladding layer 13.

[0022] The optical semiconductor chip 40 includes an optical element (not shown) and is flip-chip mounted on the substrate 30. The optical semiconductor chip 40 is provided on the main surface 31. The optical semiconductor chip 40 is disposed on one side in the extension direction of the core layer 12, and the optical element is optically coupled to the optical waveguide 10. The optical element may be either a light-receiving element or a light-emitting element. There may be a step between the portion of the main surface 31 where the first support member 20 is provided and the portion where the optical semiconductor chip 40 is provided.

[0023] The optical connector 50 includes an optical fiber 60, a second support member 70, and a plurality of protrusions 76.

[0024] The second support member 70 is made of, for example, glass. For example, the second support member 70 is a glass block. The second support member 70 is detachable from the first support member 20. The second support member 70 has a second surface 75 that faces the first surface 25 of the first support member 20. The first surface 25 and the second surface 75 may be in direct contact with each other.

[0025] The optical fiber 60 is supported by the second support member 70. The optical fiber 60 has a cladding 61 and a core 62. The core 62 has a second end face 65 exposed from the second surface 75. For example, the second end face 65 is parallel to the second surface 75. The second end face 65 may be flush with the second surface 75. The second end face 65 faces the first end face 15. The first end face 15 and the second end face 65 may be in direct contact with each other. The side surface of the core 62 is covered by the cladding 61. The core 62 is an example of a second core.

[0026] A plurality of protrusions 76 are provided on the second surface 75. The protrusions 76 fit one by one into the recesses 26. The protrusions 76 have a truncated cone shape. The diameter of the protrusions 76 continuously decreases toward the tip. For example, the wall surface of the protrusions 76 is inclined at about 7° from an axis perpendicular to the second surface 75. The diameter of the protrusions 76 on the second surface 75 is, for example, 30 μm to 200 μm. The height of the protrusions 76 is, for example, 30 μm to 200 μm.

[0027] [Method of manufacturing recess] Next, a method for forming the recesses 26 will be described. Fig. 4 is a side view illustrating a method for forming the recesses 26. Fig. 5 is a cross-sectional view illustrating a method for forming the recesses 26. Figs. 5(a) to 5(c) correspond to cross-sectional views taken along line VV in Figs. 4(a) to 4(c), respectively.

[0028] 4(a) and 5(a), a first portion 21, a first cladding layer 11, a plurality of core layers 12, a second cladding layer 13, and a second portion 22 are formed on a main surface 31 of a substrate 30. An optical semiconductor chip 40 may be flip-chip mounted before the formation of the first portion 21, the first cladding layer 11, the plurality of core layers 12, the second cladding layer 13, and the second portion 22.

[0029] 4(b) and 5(b), an excimer laser beam L1 is irradiated onto an area of ​​the first surface 25 where the recesses 26 are to be formed. When irradiating the excimer laser beam L1, for example, alignment is performed with the core layer 12 as a reference.

[0030] As shown in FIGS. 4(c) and 5(c), the regions of the first portion 21 and the second portion 22 irradiated with the excimer laser light L1 are removed, and recesses 26 are formed in the first surface 25.

[0031] [Method of manufacturing the convex part] Next, a method for forming the protrusions 76 will be described. Fig. 6 is a side view illustrating a method for forming the protrusions 76. Fig. 7 is a cross-sectional view illustrating a method for forming the protrusions 76. Figs. 7(a) to 7(c) correspond to cross-sectional views taken along line VII-VII in Figs. 6(a) to 6(c), respectively.

[0032] 6(a) and 7(a), an optical connector 50 is prepared in which the optical fiber 60 and the second support member 70 are integrated and no convex portion 76 is formed. Next, a photosensitive resin film is formed, exposed to light, and developed to form cylindrical protrusions 77 in the areas of the second surface 75 where the convex portion 76 is to be formed.

[0033] 6(b) and 7(b), the outer periphery of the protrusion 77 is irradiated with excimer laser light L2 through a mask 79 having an annular opening 78. When irradiating the excimer laser light L2, for example, alignment is performed using the core 62 of the optical fiber 60 as a reference.

[0034] As shown in FIGS. 6(c) and 7(c), the area of ​​the protrusion 77 that has been irradiated with the excimer laser light L2 is removed, and a convex portion 76 is formed on the second surface 75.

[0035] The optical waveguide component 1 is used by connecting the first support member 20 and the second support member 70 to each other. When connecting, the first surface 25 and the second surface 75 are opposed to each other, and the protrusions 76 are fitted into the recesses 26 one by one. Then, the second support member 70 is fixed to the first support member 20. The second support member 70 can be detachably fixed to the first support member 20 using, for example, a latch mechanism or the like.

[0036] In the optical waveguide component 1, the optical waveguide 10 and the optical fiber 60 can be easily aligned by fitting the protrusions 76 one by one into the recesses 26. For example, the optical waveguide 10 and the optical fiber 60 can be aligned with an accuracy of within 4 μm.

[0037] Furthermore, when the first end face 15 and the second end face 65 are in direct contact with each other, it is possible to keep the transmission loss low between the optical waveguide 10 and the optical fiber 60. However, the first end face 15 and the second end face 65 do not need to be in direct contact with each other, and for example, the second end face 65 may be recessed from the first face 25.

[0038] Although the preferred embodiments have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims. [Explanation of symbols]

[0039] 1. Optical waveguide components 10 Optical waveguide 11 First cladding layer 12 Core Layer 13 Second cladding layer 15 First end surface 20 First support member 21 Part 1 22 Part 2 25 Page 1 26 Recess 30 boards 31 Main Surface 40 Optical semiconductor chip 50 Optical Connector 60 Optical Fiber 61 Clad 62 cores 65 Second end face 70 second support member 75 2nd page 76 Convex part 77 Protrusion 90 Optical waveguide substrate L1, L2 Excimer laser light

Claims

1. a first support member having a first surface; an optical waveguide including a first core supported by the first support member and having a first end face exposed from the first surface; and The optical waveguide component has a plurality of recesses formed on the first surface.

2. 2. The optical waveguide component according to claim 1, wherein the first support member is made of an organic resin.

3. 3. The optical waveguide component according to claim 2, wherein the diameter of the recessed portion continuously decreases toward the bottom.

4. 4. The optical waveguide component according to claim 1, wherein the optical waveguide is a polymer waveguide.

5. having an optical connector, The optical connector comprises: a second support member detachably attached to the first support member and having a second surface facing the first surface; an optical fiber including a second core supported by the second support member and having a second end face exposed from the second surface; a plurality of protrusions provided on the second surface and fitted into the recesses; and The optical waveguide component according to claim 1 , wherein the first end face and the second end face face each other.

6. The optical waveguide component according to claim 5 , wherein the second end face is in direct contact with the first end face.

7. 6. The optical waveguide component according to claim 5, wherein the diameter of the convex portion continuously decreases toward the tip.

8. 6. The optical waveguide component according to claim 5, wherein the second support member is made of glass.

9. a substrate to which the first support member is fixed; an optical semiconductor chip mounted on the substrate and optically coupled to the optical waveguide; The optical waveguide component according to claim 1 , wherein

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