Jig and manufacturing method

Abstract

To correct warpage of a substrate while suppressing floating of a frame from a surface of the substrate.SOLUTION: Provided is a jig that corrects a warpage of a substrate having electronic components and a frame mounted on its surface, and the jig includes a first jig arranged on the back side of the substrate and having a first pressing portion, and a second jig arranged on the front side of the substrate and having a second pressing portion. The first jig and the second jig are brought relatively close to each other, and the back side of the substrate is pressed by the first pressing portion, and the top surface of the frame is pressed by the second pressing portion, thereby correcting the warpage of the substrate.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a jig and a manufacturing method. [Background technology]

[0002] 2. Description of the Related Art It has been known that when electronic components are soldered to a substrate by reflow soldering, warping of the substrate occurs due to differences in thermal properties between the electronic components, the substrate, and the solder.

[0003] Therefore, the following Patent Document 1 discloses a technology relating to a board correction mechanism provided in a flow soldering device, in which a board that has warped is corrected and flattened by clamping the board from above and below using a backup pin and a correction pin. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-307235 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the technology of Patent Document 1, the backup pin and the correction pin are used to clamp the position on the board so that they do not interfere with the electronic components, so if a frame is provided on the board to cover the electronic components, there is a risk that the frame may float up. [Means for solving the problem]

[0006] The jig of one embodiment is a jig for correcting warpage of a substrate having electronic components and a frame mounted on its surface, and comprises a first jig arranged on the back side of the substrate and having a first pressing portion, and a second jig arranged on the front side of the substrate and having a second pressing portion.The first jig and the second jig are brought relatively close to each other, and the first pressing portion presses the back side of the substrate, and the second pressing portion presses the top surface of the frame, thereby correcting the warpage of the substrate. [Effects of the Invention]

[0007] According to one embodiment of the jig, it is possible to correct the warpage of the substrate while suppressing the frame from floating up from the surface of the substrate. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view of an external appearance of a module according to an embodiment; [Figure 2] Schematic cross-sectional view of a jig and a module according to an embodiment. [Figure 3] 1 is a schematic cross-sectional view illustrating a pressing operation of a substrate by a jig according to an embodiment; [Figure 4] FIG. 10 is a diagram illustrating an example of a pressing position of a frame by a jig according to an embodiment; [Figure 5] A flowchart showing an example of a procedure for a module manufacturing method according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] An embodiment will be described below with reference to the drawings. For convenience, in the following description, the X-axis direction in the drawings will be referred to as the front-to-rear direction, the Y-axis direction in the drawings will be referred to as the left-to-right direction, and the Z-axis direction in the drawings will be referred to as the up-to-down direction. The positive X-axis direction will be referred to as the forward direction, the positive Y-axis direction will be referred to as the rightward direction, and the positive Z-axis direction will be referred to as the upward direction. These directions indicate relative positional relationships within the device and do not limit the installation direction or operation direction of the device. Devices with the same relative positional relationships within the device, even if they have different installation directions or operation directions, are all within the scope of the present invention.

[0010] (Configuration of module 200) FIG. 1 is a perspective view of the appearance of a module according to an embodiment.

[0011] 1 is an example of a "device having a substrate on which electronic components and a frame are mounted on its surface." Module 200 is a small information processing device capable of implementing various functions (e.g., a calculation function, a wireless communication function, a memory function, etc.). For example, module 200 functions as a control device for another device by being mounted in another device (e.g., an on-board device mounted in a vehicle such as an automobile).

[0012] 1, module 200 is configured to be able to realize various functions by mounting a plurality of electronic components 211 (ICs, etc.) on surface 210A of flat resin substrate 210. Substrate 210 is a horizontal, flat resin member that is rectangular in plan view from above (positive direction of the Z axis).

[0013] 1, the module 200 also includes a frame 212. The frame 212 is made of a metal plate, is thin in the vertical direction (Z-axis direction), and is a rectangular parallelepiped member with an open bottom.

[0014] The frame 212 has a top surface 212A that is horizontally flat and rectangular when viewed from above (positive Z-axis direction), and four side wall portions 212B that are vertical walls and hang down from each of the four sides of the top surface 212A.

[0015] Before the bending process, each of the four side wall portions 212B is located on the same plane as the top surface portion 212A, and as a result of the bending process, it is bent downward (in the negative direction of the Z axis) at a right angle at the connection portion with the top surface portion 212A (i.e., the four sides of the top surface portion 212A), thereby becoming vertical.

[0016] In a first reflow process in the manufacturing method of module 200, substrate 210 on which multiple electronic components 211 are placed is placed in a reflow furnace and heated. As a result, each of multiple electronic components 211 is soldered to surface 210A of substrate 210.

[0017] In the second reflow step in the manufacturing method of module 200, substrate 210 with frame 212 placed thereon is placed in a reflow furnace and heated. This causes the lower edge of each of four side wall portions 212B of frame 212 to be soldered to surface 210A of substrate 210. As a result, multiple electronic components 211 mounted on surface 210A of substrate 210 are covered by frame 212.

[0018] The frame 212 has a plurality of openings 212C formed in the top surface 212A, and by attaching a metal cover (not shown) that covers the entire top surface 212A, the plurality of openings 212C are blocked, and the plurality of electronic components 211 can be completely covered.

[0019] Furthermore, frame 212 has a plurality of inner walls 212D within the space surrounded by four side walls 212B. Each of inner walls 212D is provided hanging downward from the edge of opening 212C in top surface 212A. Inner walls 212D are provided to block the space between adjacent electronic components 211, mainly to suppress the influence of radio waves between adjacent electronic components 211.

[0020] Before the bending process, each of the multiple inner wall portions 212D is located on the same plane as the top surface portion 212A, and through the bending process, it is bent downward (in the negative direction of the Z axis) at a right angle at the connection portion with the top surface portion 212A (i.e., the edge portion of the opening portion 212C), thereby becoming vertical.

[0021] In addition to the lower edge portions of the four side wall portions 212B of the frame 212, the lower edge portions of the plurality of inner wall portions 212D of the frame 212 are also soldered to the surface 210A of the substrate 210 by reflow soldering. This increases the strength of the frame 212 as a whole and makes it possible to suppress deformation of the frame 212, such as dents.

[0022] (Configuration of jig 100) Fig. 2 is a cross-sectional schematic diagram of a jig 100 and a module 200 according to one embodiment. The jig 100 shown in Fig. 2 is a tool for correcting warpage of the substrate 210 when the frame 212 is soldered by reflow to the surface 210A of the substrate 210 included in the module 200 in the second reflow step described above.

[0023] 2, the jig 100 includes a first jig 110 and a second jig 120. The first jig 110 and the second jig 120 are both rigid bodies made of metal material, and are not easily deformed even when stress and heat are applied.

[0024] The first jig 110 is disposed on the rear surface 210B side (negative side of the Z axis) of the substrate 210. The first jig 110 has a horizontal, flat base 111 and a plurality of first pressing pins 112 extending upward (positive direction of the Z axis) from an upper surface 111A of the base 111 toward the rear surface 210B of the substrate 210. The plurality of first pressing pins 112 are an example of a "first pressing portion."

[0025] The second jig 120 is disposed on the surface 210A side (positive side of the Z axis) of the substrate 210. The second jig 120 has a horizontal, flat base 121 and a plurality of second pressing pins 122 extending downward (negative direction of the Z axis) from the lower surface 121A of the base 121 toward the surface 210A of the substrate 210. The plurality of second pressing pins 122 are an example of a "second pressing portion."

[0026] As an example, the first pressing pin 112 and the second pressing pin 122 have a cylindrical shape with a circular flat tip surface, but are not limited to this, and the first pressing pin 112 and the second pressing pin 122 may have other columnar shapes.

[0027] The jig 100 is configured so that the first jig 110 and the second jig 120 can move toward and away from each other. In the example shown in Fig. 2, a guide rod 114 provided on the first jig 110 is inserted into a guide hole 121B formed in a base 121 of the second jig 120, whereby the first jig 110 is supported by the second jig 120 so as to be movable in the up-down direction (Z-axis direction). Thus, the jig 100 is configured so that the first jig 110 and the second jig 120 can move toward and away from each other as the first jig 110 moves in the up-down direction (Z-axis direction). The jig 100 also includes a drive unit and a control unit (not shown), and the drive unit can move the first jig 110 in the up-down direction (Z-axis direction) under the control of the control unit.

[0028] Here, in the first jig 110, each of the multiple first pressing pins 112 is provided at a position where it can press the rear surface 210B of the substrate 210. Also, in the second jig 120, each of the multiple second pressing pins 122 is provided at a position where it can press the outer periphery of the top surface 212A of the frame 212 (i.e., on the side wall 212B).

[0029] Furthermore, the substrate 210 has a plurality of positioning holes 210C. Furthermore, the first jig 110 has a plurality of positioning pins 113. Each of the plurality of positioning pins 113 extends upward (in the positive direction of the Z axis) from the upper surface 111A of the base 111 toward the positioning hole 210C, and positions the substrate 210 by being inserted into the positioning hole 210C. For this reason, each of the plurality of positioning pins 113 is longer in the up-down direction (in the Z axis direction) than the first pressing pin 112.

[0030] As an example, the positioning pin 113 has a cylindrical shape, and the positioning hole 210C has a circular shape with approximately the same size as the outer diameter of the positioning pin 113. As a result, the jig 100 according to one embodiment can restrict the substrate 210 from moving in all 360° directions in the horizontal direction by inserting the positioning pin 113 into the positioning hole 210C.

[0031] The second jig 120 also includes a plurality of third pressing pins 123 extending downward (in the negative Z-axis direction) from the lower surface 121A of the base 121 toward the surface 210A of the substrate 210. In the second jig 120, each of the plurality of third pressing pins 123 is provided at a position where it can press against the inner wall portion 212D of the top surface 212A of the frame 212.

[0032] As an example, the third pressing pin 123 has a cylindrical shape and a tip end surface having a circular flat shape, but is not limited to this, and the third pressing pin 123 may have other columnar shapes.

[0033] (Pressing Operation of the Substrate 210 by the Jig 100) FIG. 3 is a cross-sectional view showing a pressing operation of the substrate 210 by the jig 100 according to one embodiment.

[0034] As shown in FIG. 3, the jig 100 according to one embodiment can correct warpage of the substrate 210 by bringing the first jig 110 and the second jig 120 relatively close to each other, pressing the back surface 210B of the substrate 210 with the first pressing pin 112 of the first jig 110, and pressing the outer periphery (i.e., on the side wall portion 212B) of the top surface 212A of the frame 212 with the second pressing pin 122 of the second jig 120.

[0035] In particular, the outer periphery of the top surface 212A of the frame 212 has high strength due to the side wall 212B provided on the lower side, so deformation such as dents in the frame 212 when pressed by the second pressing pin 122 can be suppressed.

[0036] Furthermore, as shown in FIG. 3, the jig 100 according to one embodiment can further correct the warpage of the substrate 210 by further pressing the portion on the inner wall portion 212D of the top surface portion 212A of the frame 212 with the third pressing pin 123 of the second jig 120.

[0037] In particular, the portion above inner wall portion 212D on top surface 212A of frame 212 is strong due to inner wall portion 212D being provided on the underside, and therefore deformation such as dents in frame 212 when pressed by third pressing pin 123 can be suppressed.

[0038] 3, in the jig 100 according to one embodiment, the first pressing pin 112, the second pressing pin 122, and the third pressing pin 123 are all provided in positions facing the first pressing pin 112. That is, in the jig 100 according to one embodiment, the number of first pressing pins 112 is equal to the total number of second pressing pins 122 and third pressing pins 123.

[0039] As a result, the jig 100 according to the embodiment can more reliably transmit the force of clamping the substrate 210 between the first pressing pin 112, the second pressing pin 122, and the third pressing pin 123 to the substrate 210.

[0040] However, the present invention is not limited to this, and the jig 100 according to one embodiment may have a different number of first pressing pins 112 from the total number of second pressing pins 122 and third pressing pins 123. For example, the number of first pressing pins 112 may be greater than the total number of second pressing pins 122 and third pressing pins 123, so that the substrate 210 is stably supported by the multiple first pressing pins 112.

[0041] Furthermore, as shown in FIG. 3, the jig 100 according to one embodiment uses a first pressing pin 112 and a second pressing pin 122, which have a small contact area with the substrate 210 and the frame 212, as examples of the "first pressing portion" and the "second pressing portion," thereby suppressing the thermal effect of the jig 100 on the substrate 210 and the frame 212.

[0042] (An example of a position where the jig 100 presses the frame 212) 4 is a plan view of module 200 according to an embodiment, illustrating an example of a pressing position of frame 212 by jig 100 according to an embodiment. Note that opening 212C in top surface 212A of frame 212 is not shown in FIG.

[0043] In Fig. 4, pressing position P1 indicates the pressing position by second pressing pin 122. As shown in Fig. 4, pressing position P1 is provided on a relatively strong outer periphery of top surface 212A of frame 212. In particular, in the example shown in Fig. 4, as a preferred example, pressing position P1 is provided at each of the four corners on the outer periphery of top surface 212A of frame 212.

[0044] As another preferred example, pressing positions P1 may be provided at the midpoints of the four sides (i.e., above the midpoints of the four side wall portions 212B) on the outer periphery of top surface portion 212A of frame 212. Furthermore, a plurality of pressing positions P1 may be additionally provided on the outer periphery of top surface portion 212A of frame 212.

[0045] 4, pressing position P2 indicates the pressing position by third pressing pin 123. As shown in FIG. 4, pressing position P2 is provided on inner wall portion 212D, which has a relatively high strength, on top surface portion 212A of frame 212. In particular, in the example shown in FIG. 4, as a preferred example, one pressing position P2 is provided for all inner wall portions 212D. Furthermore, in the example shown in FIG. 4, as a more preferred example, pressing position P2 is provided at a position on inner wall portion 212D close to the center of frame 212.

[0046] 4, restriction position P3 is the arrangement position of the positioning pins 113. In the example shown in Fig. 4, two positioning pins 113 are arranged on the outside of each of the four corners of the frame 212, and the two positioning pins 113 are abutted against each of the two side surfaces of the frame 212 that form the corners of the frame 212. In this way, the jig 100 according to one embodiment uses the eight positioning pins 113 to restrict movement of the frame 212 in the horizontal direction (X-axis direction and Y-axis direction) during reflow.

[0047] As described above, the multiple positioning pins 113 may be provided on the first jig 110, extend upward (in the positive direction of the Z axis) from the upper surface 111A of the base 111 of the first jig 110, and penetrate the positioning holes 210C of the substrate 210. In this case, the multiple positioning pins 113 can restrict the substrate 210 from moving in the horizontal direction (in the X axis direction and the Y axis direction) in addition to the frame 212 during reflow.

[0048] Alternatively, the multiple positioning pins 113 may be provided on the second jig 120, extend downward (in the negative Z-axis direction) from the lower surface 121A of the base 121 of the second jig 120, and abut against the side surface of the frame 212. In this case, the multiple positioning pins 113 can restrict the frame 212 from moving in the horizontal direction (X-axis direction and Y-axis direction) during reflow.

[0049] (Procedure for manufacturing module 200) FIG. 5 is a flowchart showing an example of the procedure of a method for manufacturing the module 200 according to an embodiment.

[0050] First, a plurality of electronic components 211 are placed on the surface 210A of the substrate 210 (step S501: electronic component placement step).

[0051] Next, the substrate 210 is placed in a reflow furnace, whereby the electronic components 211 are soldered to the surface 210A of the substrate 210 (step S502: first reflow process).

[0052] Next, the frame 212 is placed on the surface 210A of the substrate 210 (step S503: frame placement step).

[0053] Next, the substrate 210 is placed between the first jig 110 and the second jig 120 of the jig 100 (step S504: substrate placement step). Specifically, the substrate 210 is placed on a plurality of first pressing pins 112 provided on the first jig 110.

[0054] Next, by bringing the first jig 110 and the second jig 120 closer to each other, the substrate 210 and the frame 212 are pressed by the first pressing pin 112 of the first jig 110 and the multiple second pressing pins 122 and multiple third pressing pins 123 of the second jig 120 (step S505: pressing process).

[0055] Next, the substrate 210 is placed in a reflow furnace to solder the frame 212 to the surface 210A of the substrate 210 and simultaneously correct any warpage of the substrate 210 (step S506: second reflow process).

[0056] 5, it is possible to correct the warpage of the substrate 210 while suppressing the lifting of the frame 212 from the surface 210A of the substrate 210. Furthermore, according to the manufacturing method shown in Fig. 5, it is possible to simultaneously mount the frame 212 and correct the warpage of the substrate 210, thereby suppressing an increase in the number of processes.

[0057] As described above, the jig 100 according to one embodiment is a jig 100 for correcting warpage of a substrate 210 having electronic components 211 and a frame 212 mounted on a surface 210A thereof, and includes a first jig 110 arranged on the back surface 210B side of the substrate 210 and having a first pressing portion, and a second jig 120 arranged on the front surface 210A side of the substrate 210 and having a second pressing portion, and corrects warpage of the substrate 210 by bringing the first jig 110 and the second jig 120 closer to each other and pressing the back surface 210B of the substrate 210 with the first pressing portion and pressing the top surface 212A of the frame 212 with the second pressing portion.

[0058] As a result, the jig 100 according to the embodiment can correct the warpage of the substrate 210 while suppressing the frame 212 from rising up from the surface 210A of the substrate 210.

[0059] Furthermore, as a result, the jig 100 according to one embodiment can simultaneously mount the frame 212 and correct the warpage of the substrate 210, thereby preventing an increase in the number of steps in the manufacturing method of the module 200.

[0060] In particular, in one embodiment of the jig 100, the first jig 110 has, as a first pressing portion, a plurality of first pressing pins 112 extending toward the back surface 210B of the substrate 210, and the second jig 120 has, as a second pressing portion, a plurality of second pressing pins 122 extending toward the front surface 210A of the substrate 210. The first jig 110 and the second jig 120 are brought relatively close to each other, and the plurality of first pressing pins 112 press against the back surface 210B of the substrate 210, and the plurality of second pressing pins 122 press against the outer periphery of the top surface 212A of the frame 212, thereby correcting the warpage of the substrate 210.

[0061] As a result, the jig 100 according to one embodiment can use the multiple second pressing pins 122 to press the outer periphery of the top surface 212A of the frame 212, which has a relatively high strength, thereby suppressing deformation of the frame 212, such as dents.

[0062] Furthermore, by using the first pressure pin 112 and the second pressure pin 122, the jig 100 according to one embodiment can make the contact area between the jig 100 and the substrate 210 and the frame 212 relatively small, thereby suppressing the thermal effect of the jig 100 on the substrate 210 and the frame 212.

[0063] Although one embodiment of the present invention has been described in detail above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention described in the claims.

[0064] For example, in the above embodiment, the columnar first pressing pin 112 and second pressing pin 122 are used as an example of the "first pressing portion" and the "second pressing portion", but the present invention is not limited to this.

[0065] For example, the "first pressing portion" may be one or more first pressing members having a flat pressing surface, and the one or more first pressing members may be used to press the rear surface 210B of the substrate 210 partially or entirely.

[0066] Furthermore, for example, one or more second pressing members having a flat pressing surface may be used as the "second pressing portion," and the top surface portion 212A of the frame 212 may be pressed partially or entirely by the one or more second pressing members.

[0067] Furthermore, for example, instead of providing the frame 212 on the substrate 210, the module 200 may be configured such that a "cover" having the same configuration as the frame 212 (i.e., a configuration having a top surface portion and side wall portions) is provided on the substrate 210. In this case, the "first jig" and the "second jig" may be brought relatively close to each other, and the "first pressing portion" of the "first jig" may press the back surface 210B of the substrate 210, and the "second pressing portion" of the "second jig" may press the "top surface portion" of the "cover", thereby correcting the warpage of the substrate 210. [Explanation of symbols]

[0068] 100 Jig 110 First Jig 111 Base 111A Top 112 First pressing pin 113 Locating pin 120 Second Jig 121 Base 121A Bottom side 122 Second pressing pin 123 Third pressure pin 200 modules 210 Substrate 210A surface 210B back side 210C Positioning hole 211 Electronic Components 212 slots 212A Top section 212B Side wall part 212C opening 212D Inner wall

Claims

1. A jig for correcting warpage of a substrate on which electronic components and a frame are mounted, a first jig disposed on the rear surface side of the substrate and having a first pressing portion; a second jig disposed on the front surface side of the substrate and having a second pressing portion; Equipped with The first jig and the second jig are brought relatively close to each other, and the first pressing portion presses the back surface of the substrate, and the second pressing portion presses the top surface of the frame, thereby correcting the warpage of the substrate. A jig characterized by:

2. the first jig has, as the first pressing portion, a plurality of first pressing pins extending toward the rear surface of the substrate; the second jig has, as the second pressing portion, a plurality of second pressing pins extending toward the surface of the substrate; The first jig and the second jig are brought relatively close to each other, and the rear surface of the substrate is pressed by the plurality of first pressing pins, and the outer periphery of the top surface of the frame is pressed by the plurality of second pressing pins, thereby correcting the warpage of the substrate. The jig according to claim 1 .

3. the frame has an inner wall portion that is provided on the inside of the outer periphery of the top surface portion and hangs down from the top surface portion, The second jig includes a third pressing pin that presses a portion of the top surface of the frame where the inner wall portion is provided. The jig according to claim 2 .

4. the substrate has a positioning hole; The first jig has positioning pins that extend toward the positioning holes and are inserted into the positioning holes to position the substrate. The jig according to claim 2 .

5. the second jig has a plurality of positioning pins extending toward the surface of the substrate; The horizontal movement of the frame is restricted by bringing each of the positioning pins into contact with a side surface of the frame. The jig according to claim 2 .

6. A method for manufacturing a device having a substrate on which electronic components and a frame are mounted, comprising: a reflow process of soldering the frame to the surface of the substrate by reflow; In the reflow process, a first jig having a first pressing portion is disposed on the back surface side of the substrate; a second jig having a second pressing portion is disposed on the front surface side of the substrate; The first jig and the second jig are brought relatively close to each other, and the first pressing portion presses the back surface of the substrate, and the second pressing portion presses the top surface of the frame, thereby correcting the warpage of the substrate. A manufacturing method characterized by:

7. A jig for correcting warpage of a substrate on which electronic components and a cover are mounted, a first jig disposed on the rear surface side of the substrate and having a first pressing portion; a second jig disposed on the front surface side of the substrate and having a second pressing portion; Equipped with The first jig and the second jig are brought relatively close to each other, and the first pressing portion presses the back surface of the substrate, and the second pressing portion presses the top surface of the cover, thereby correcting the warpage of the substrate. A jig characterized by:

8. A method for manufacturing a device having a substrate on which an electronic component and a cover are mounted, comprising: a reflow process of soldering the cover to the surface of the substrate by reflow; In the reflow process, a first jig having a first pressing portion is disposed on the back surface side of the substrate; a second jig having a second pressing portion is disposed on the front surface side of the substrate; The first jig and the second jig are brought relatively close to each other, and the first pressing portion presses the back surface of the substrate, and the second pressing portion presses the top surface of the cover, thereby correcting the warpage of the substrate. A manufacturing method characterized by:

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