Electronic component, high-frequency module, and communication device

Abstract

To provide an electronic component with improved connection reliability between pillar electrodes and electrodes of a mounting substrate.SOLUTION: An electronic component 50 includes a substrate 51 and a pillar electrode 61. The substrate 51 has a first main surface 511. The pillar electrode 61 protrudes from the first main surface 511 of the substrate 51 in a thickness direction D1 of the substrate 51. The pillar electrode 61 is disposed between the first main surface 511 of the substrate 51 and a bump electrode 70. The pillar electrode 61 has a second main surface 62 and an outer peripheral surface 63. The second main surface 62 is in contact with the bump electrode 70. The outer peripheral surface 63 is connected to the second main surface 62 and the first main surface 511 of the substrate 51. The pillar electrode 61 has a groove 64 provided in the second main surface 62 of the pillar electrode 61. A bottom 65 of the groove 64 is connected to the outer peripheral surface 63 of the pillar electrode 61.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an electronic component, a high-frequency module, and a communication device, and more particularly to an electronic component having a pillar electrode, a high-frequency module including the electronic component, and a communication device including the high-frequency module. [Background technology]

[0002] Patent Document 1 discloses an electronic component having pillar electrodes. The electronic component disclosed in Patent Document 1 has the pillar electrodes as terminals. A recess is provided on the main surface of the pillar electrode, and solder (bump electrodes) is provided on the main surface of the pillar electrode with the recess provided. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-152646 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the electronic component disclosed in Patent Document 1, if gas is generated from the flux or the like when the solder melts, the gas bubbles may accumulate in the recesses on the main surface of the pillar electrode, causing a gap between the pillar electrode and the electrode to which it is connected. Because there is no solder in the gap, when the electronic component is placed on the mounting board, poor electrical connection between the electronic component and the mounting board and a deterioration in the function of the heat dissipation path may occur, resulting in a deterioration in the function of the electronic component.

[0005] An object of the present invention is to provide an electronic component, a high-frequency module, and a communication device that have improved connection reliability between pillar electrodes and electrodes of a mounting substrate. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present invention includes a substrate and a pillar electrode. The substrate has a first main surface. The pillar electrode protrudes from the first main surface of the substrate in a thickness direction of the substrate. The pillar electrode is disposed between the first main surface of the substrate and a bump electrode. The pillar electrode has a second main surface and an outer peripheral surface. The second main surface is in contact with the bump electrode. The outer peripheral surface is connected to the second main surface. The pillar electrode has a groove provided in the second main surface of the pillar electrode. The bottom of the groove is connected to the outer peripheral surface of the pillar electrode.

[0007] A high-frequency module according to one aspect of the present invention includes the electronic component and a mounting board, the electronic component being disposed on the mounting board.

[0008] A communication device according to one aspect of the present invention includes the high-frequency module and a signal processing circuit, the signal processing circuit being connected to the high-frequency module. [Effects of the Invention]

[0009] According to an electronic component, a high-frequency module, and a communication device according to an aspect of the present invention, it is possible to improve the connection reliability between the pillar electrode and the electrode of the mounting substrate. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a partial plan view of the high-frequency module according to the first embodiment. [Figure 2] FIG. 2 is a partial cross-sectional view of the high-frequency module, and corresponds to the X1-X1 cross section of FIG. [Figure 3] Fig. 3A is a cross-sectional view of a main part of the electronic component according to embodiment 1. Fig. 3B is a plan view of a main part of the electronic component. [Figure 4] FIG. 4 is a cross-sectional view of a main part of the electronic component. [Figure 5] FIG. 5 is a circuit configuration diagram of a communication device including the high-frequency module. [Figure 6]FIG. 6 is a circuit diagram of a power amplifier in the electronic device. [Figure 7] Fig. 7A is a cross-sectional view of a main part of an electronic component according to embodiment 2. Fig. 7B is a plan view of a main part of the electronic component. [Figure 8] Fig. 8A is a cross-sectional view of a main part of an electronic component according to embodiment 3. Fig. 8B is a plan view of a main part of the electronic component. [Figure 9] Fig. 9A is a cross-sectional view of a main part of an electronic component according to embodiment 4. Fig. 9B is a plan view of a main part of the electronic component. [Figure 10] FIG. 10 is a cross-sectional view of a main part of the electronic component. [Figure 11] Fig. 11A is a cross-sectional view of a main part of an electronic component according to embodiment 5. Fig. 11B is a plan view of a main part of the electronic component. [Figure 12] Fig. 12A is a cross-sectional view of a main part of an electronic component according to embodiment 6. Fig. 12B is a plan view of a main part of the electronic component. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, electronic components, high-frequency modules, and communication devices according to embodiments will be described with reference to the drawings. The drawings referred to in the following embodiments are all schematic diagrams, and the ratios of the sizes and thicknesses of the components in the drawings do not necessarily reflect the actual dimensional ratios.

[0012] (Embodiment 1) (1) Electronic Components The electronic component 50 is disposed on the mounting substrate 2 as shown in FIGS. 1 and 2. The electronic component 50 is, for example, an IC chip including a transistor. More specifically, the electronic component 50 includes any one of a switch 110 (see FIG. 5), a low-noise amplifier 152 (see FIG. 5), and a power amplifier 151 (see FIG. 5). More specifically, if the electronic component 50 includes the power amplifier 151, the electronic component 50 includes a transistor Q1 (see FIG. 6) included in the power amplifier 151. Note that if the electronic component 50 includes a transistor included in the low-noise amplifier 152, the electronic component 50 includes a transistor (not shown) included in the low-noise amplifier 152. Furthermore, if the electronic component 50 includes the switch 110, the electronic component 50 includes a transistor (not shown) included in the switch 110. Furthermore, the electronic component 50 may include, for example, an acoustic wave vibrator included in the transmit filter 131 or an acoustic wave vibrator included in the receive filter 132. The acoustic wave vibrator includes, for example, one of a SAW (Surface Acoustic Wave) vibrator and a BAW (Bulk Acoustic Wave) vibrator.

[0013] As shown in FIG. 3A , the electronic component 50 includes a substrate 51 and a plurality of connection electrodes 60 (only one is shown in FIG. 3A ). The plurality of connection electrodes 60 are arranged on a main surface 511 of the substrate 51. The main surface 511 corresponds to a first main surface of the present disclosure. Each of the plurality of connection electrodes 60 includes a pillar electrode 61 and a bump electrode 70. The pillar electrode 61 is arranged between the main surface 511 of the substrate 51 and the bump electrode 70.

[0014] (1.1) Connection electrode As shown in FIGS. 3A, 3B, and 4, the multiple connection electrodes 60 are arranged on the main surface 511 of the substrate 51. FIG. 3A corresponds to the X1-X1 cross section of FIG. 3B. FIG. 4 corresponds to the X2-X2 cross section of FIG. 3B. Note that in FIGS. 3A and 4, hatching indicating cross sections of the pillar electrodes 61 and bump electrodes 70 of the connection electrodes 60 is omitted. The main surface 511 faces the mounting substrate 2 (see FIGS. 1 and 2) when the electronic component 50 is arranged on the mounting substrate 2. More specifically, the electronic component 50 has multiple electrodes 53 (only one electrode 53 is shown in FIGS. 3A and 4) on the main surface 511 of the substrate 51, and the multiple connection electrodes 60 are connected to the multiple electrodes 53 in a one-to-one relationship. Note that an insulating layer 52 is arranged on the main surface 511 of the substrate 51 in areas where the multiple connection electrodes 60 are not arranged.

[0015] Each of the plurality of connection electrodes 60 is a columnar electrode extending in the thickness direction D1 of the substrate 51.

[0016] Each of the plurality of connection electrodes 60 includes a pillar electrode 61 and a bump electrode 70. Note that the bump electrode 70 is omitted in Fig. 3B.

[0017] The pillar electrodes 61 extend in the thickness direction D1 of the substrate 51. The pillar electrodes 61 have a shape that is elongated in, for example, a direction perpendicular to the direction D1. More specifically, the pillar electrodes 61 have a shape that is elongated in, for example, a direction D2 perpendicular to the direction D1. This makes it possible to efficiently dissipate heat from the electronic component 50 to the mounting substrate 2 via the pillar electrodes 61. Furthermore, the electrical resistance of the pillar electrodes 61 can be reduced.

[0018] In particular, when the pillar electrode 61 is connected to one of the electrodes of the transistor Q1 (see FIG. 6) included in the electronic component 50, it becomes possible to efficiently dissipate heat from the transistor Q1 to the mounting substrate 2. More specifically, the pillar electrode 61 is connected to the emitter of the transistor Q1.

[0019] The pillar electrode 61 has a main surface 62 at a first end in the direction D1. A bump electrode 70 is disposed on the main surface 62 of the pillar electrode 61. That is, the main surface 62 of the pillar electrode 61 is in contact with the bump electrode 70. The main surface 62 corresponds to the second main surface of the present disclosure. A second end of the pillar electrode 61 in the direction D1 is connected to the electrode 53. The pillar electrode 61 has an outer circumferential surface 63 connected to the two main surfaces 62. In other words, the outer circumferential surface 63 of the pillar electrode 61 is connected to the main surfaces 62.

[0020] The material of the pillar electrode 61 is a conductive material, and the melting point of the material of the pillar electrode 61 is higher than the melting point of the material of the bump electrode 70. More specifically, the pillar electrode 61 is formed of a material that does not soften at a temperature at which the material of the bump electrode 70 melts, for example, at the temperature inside a reflow furnace. The material of the pillar electrode 61 is, for example, copper, gold, or an alloy thereof.

[0021] The bump electrodes 70 are arranged on the main surfaces 62 of the pillar electrodes 61 before the electronic component 50 is placed on the mounting substrate 2. The material of the bump electrodes 70 is, for example, solder. The bump electrodes 70 melt when the electronic component 50 is placed on the mounting substrate 2, and connect the mounting substrate 2 and the electronic component 50 together. More specifically, the bump electrodes 70 that melt when the electronic component 50 is placed on the mounting substrate 2 transform into solder 71 that mechanically and electrically connects the plurality of electrodes 23 arranged on the main surface 21 of the mounting substrate 2 to the plurality of pillar electrodes 61 in a one-to-one relationship, as shown in FIG. 2 .

[0022] (1.2) Pillar electrode As shown in Figures 3A, 3B, and 4, the pillar electrode 61 has a groove 64 having a depth in direction D1. The groove 64 of the pillar electrode 61 is formed on a main surface 62 of the pillar electrode 61. The groove 64 is, for example, linear in a plan view from direction D1. The groove 64 extends, for example, in direction D2, which is the longitudinal direction of the pillar electrode 61. The pillar electrode 61 has a bottom 65 of the groove 64. The bottom 65 of the groove 64 is, for example, flat. Here, "the bottom 65 of the groove 64 is flat" includes not only the case where the bottom 65 of the groove 64 is completely flat, but also the case where it has minute irregularities.

[0023] A bottom 65 of the groove 64 of the pillar electrode 61 is connected to the outer peripheral surface 63 of the pillar electrode 61. More specifically, the pillar electrode 61 has an opening 66, which is an end of the groove 64, formed on the outer peripheral surface 63. This prevents bubbles from being trapped in the solder 71 between the pillar electrode 61 and the electrode 23 of the mounting substrate 2, even if bubbles are generated from the flux or the like when the electronic component 50 is placed on the mounting substrate 2. More specifically, the distance between the bottom 65 of the groove 64 of the pillar electrode 61 and the electrode 23 of the mounting substrate 2 in the direction D1 is longer than the distance between the main surface 62 of the pillar electrode 61 and the electrode 23 of the mounting substrate 2, and therefore bubbles are likely to enter the groove 64. Furthermore, because the groove 64 is connected to the outer peripheral surface 63 of the pillar electrode 61, bubbles are likely to move in the direction D2 in which the groove 64 extends and be released from the opening 66 to the outside of the solder 71. That is, when the electronic component 50 is placed on the mounting board 2, voids in the solder 71 due to air bubbles are less likely to occur, and the connection reliability between the pillar electrodes 61 and the mounting board 2 is improved.

[0024] Furthermore, the bottom 65 of the groove 64 of the pillar electrode 61 is connected to the outer peripheral surface 63 of the pillar electrode 61 at two or more locations (two locations in FIGS. 3A and 3B ). More specifically, the bottom 65 of the groove 64 of the pillar electrode 61 is connected to the outer peripheral surface 63 of the pillar electrode 61 at each of both ends in the direction D2. Therefore, even if air bubbles are generated when the electronic component 50 is placed on the mounting substrate 2, no voids will be generated in the solder 71 if the air bubbles move to one of the two openings 66 at both ends of the groove 64. This makes it even more unlikely that voids will be generated in the solder 71 due to air bubbles when the electronic component 50 is placed on the mounting substrate 2.

[0025] (2) High-frequency module As shown in FIG. 5 , the high-frequency module 1 is used in, for example, a communication device 100. The communication device 100 is, for example, a mobile phone such as a smartphone. Note that the communication device 100 is not limited to being a mobile phone and may be, for example, a wearable terminal such as a smartwatch. The high-frequency module 1 is a high-frequency module that is compatible with, for example, the 4G (fourth generation mobile communication) standard, the 5G (fifth generation mobile communication) standard, etc. The 4G standard is, for example, the 3GPP (Third Generation Partnership Project, registered trademark) LTE (Long Term Evolution, registered trademark) standard. The 5G standard is, for example, the 5G NR (New Radio) standard. The high-frequency module 1 is compatible with, for example, carrier aggregation and dual connectivity.

[0026] (2.1) Circuit configuration of high-frequency module The circuit configuration of the high-frequency module 1 according to the first embodiment will be described below with reference to FIG.

[0027] 5 , the high-frequency module 1 according to the first embodiment includes a plurality of external connection terminals 10, a switch 110, matching circuits 121 and 122, a transmission filter 131, a reception filter 132, matching circuits 141 and 142, a power amplifier 151, and a low-noise amplifier 152. The plurality of external connection terminals 10 include an antenna terminal 11, a signal input terminal 12, and a signal output terminal 13.

[0028] The high-frequency module 1 according to the first embodiment includes an electronic component 50. The electronic component 50 includes, for example, a transistor Q1. More specifically, the electronic component 50 includes, for example, the transistor Q1 as part of a power amplifier 151.

[0029] Moreover, the electronic component 50 according to the first embodiment includes, for example, a part of the transmitting filter 131 or a part of the receiving filter 132.

[0030] (2.1.1) Power Amplifier The power amplifier 151 is an amplifier that amplifies a transmission signal. The power amplifier 151 has an input terminal (not shown) and an output terminal (not shown). The input terminal of the power amplifier 151 is connected to the signal processing circuit 17 via the signal input terminal 12. The output terminal of the power amplifier 151 is connected to the transmission filter 131 via the matching circuit 141.

[0031] As shown in FIG. 6, the power amplifier 151 includes a transistor Q1. The transistor Q1 has a plurality of electrodes. The transistor Q1 is, for example, a bipolar transistor, and the plurality of electrodes include a base electrode BS1, an emitter electrode EM1, and a collector electrode CO1. The base electrode BS1 is connected to, for example, an input terminal of the power amplifier 151. The emitter electrode EM1 is connected to, for example, a ground electrode. The collector electrode CO1 is connected to, for example, an output terminal of the power amplifier 151.

[0032] (2.1.2) Transmission filter The transmit filter 131 is a filter that passes a transmit signal. The transmit filter 131 is, for example, an acoustic wave filter including a plurality of series arm resonators and a plurality of parallel arm resonators. The acoustic wave filter is, for example, a SAW (Surface Acoustic Wave) filter that uses surface acoustic waves. The transmit filter 131 has an input terminal (not shown) and an output terminal (not shown). The input terminal of the transmit filter 131 is connected to the output terminal of the power amplifier 151 via a matching circuit 141. The output terminal of the transmit filter 131 is connected to the switch 110 via a matching circuit 121.

[0033] (2.1.3) Low-noise amplifier The low-noise amplifier 152 is an amplifier that amplifies a received signal. The low-noise amplifier 152 has an input terminal (not shown) and an output terminal (not shown). The output terminal of the low-noise amplifier 152 is connected to the signal processing circuit 17 via the signal output terminal 13. The input terminal of the low-noise amplifier 152 is connected to the receiving filter 132 via the matching circuit 142. The low-noise amplifier 152 includes, for example, a transistor as a signal amplification element.

[0034] (2.1.4) Receive Filter The receive filter 132 is a filter that passes a receive signal. The receive filter 132 is, for example, an acoustic wave filter including multiple series arm resonators and multiple parallel arm resonators. The acoustic wave filter is, for example, a SAW filter that uses surface acoustic waves. The receive filter 132 has an input terminal (not shown) and an output terminal (not shown). The input terminal of the receive filter 132 is connected to the switch 110 via a matching circuit 122. The output terminal of the receive filter 132 is connected to the output terminal of the low-noise amplifier 152 via a matching circuit 142.

[0035] (2.1.5) Switch The switch 110 selects whether the transmit filter 131 or the receive filter 132 is to be connected to the antenna terminal 11. The switch 110 has a common terminal 111 and a plurality of (two in the illustrated example) selection terminals 112 and 113. The common terminal 111 is connected to the antenna terminal 11. The selection terminal 112 is connected to the transmit filter 131 via a matching circuit 121. The selection terminal 113 is connected to the receive filter 132 via a matching circuit 122. The switch 110 includes, for example, a transistor as a switching element.

[0036] (2.1.6) Matching circuit The matching circuit 121 is a circuit for achieving impedance matching between the output terminal of the transmission filter 131 and the selection terminal 112 of the switch 110. The matching circuit 121 includes at least one of one or more capacitors and one or more inductors.

[0037] The matching circuit 122 is a circuit for achieving impedance matching between the selection terminal 113 of the switch 110 and the input terminal of the receive filter 132. The matching circuit 122 includes at least one of one or more capacitors and one or more inductors.

[0038] The matching circuit 141 is a circuit for achieving impedance matching between the output terminal of the power amplifier 151 and the input terminal of the transmission filter 131. The matching circuit 141 includes at least one of one or more capacitors and one or more inductors.

[0039] The matching circuit 142 is a circuit for achieving impedance matching between the output terminal of the receive filter 132 and the input terminal of the low-noise amplifier 152. The matching circuit 142 includes at least one of one or more capacitors and one or more inductors.

[0040] (2.2) Structure of high-frequency module The structure of the high-frequency module 1 according to the first embodiment will be described below with reference to the drawings.

[0041] The high-frequency module 1 according to the first embodiment includes a mounting substrate 2 and an electronic component 50, as shown in FIGS.

[0042] (2.2.1) Mounting board 2, the mounting substrate 2 has a main surface 21 and a main surface 22. The main surface 21 and the main surface 22 face each other in direction D1, which is the thickness direction of the mounting substrate 2. The mounting substrate 2 has, for example, a rectangular shape when viewed from the direction D1 in a plan view.

[0043] An electronic component 50 is disposed on the main surface 21 of the mounting substrate 2. The mounting substrate 2 includes a plurality of electrodes 23 disposed on the main surface 21. The plurality of electrodes 23 are electrically connected to the electronic component 50 disposed on the main surface 21 of the mounting substrate 2.

[0044] On the main surface 22 of the mounting substrate 2, for example, a plurality of external connection terminals (not shown) are arranged.

[0045] The mounting substrate 2 is, for example, a multilayer substrate including multiple dielectric layers and multiple conductive layers. The multiple dielectric layers and multiple conductive layers are stacked in direction D1. The multiple conductive layers are formed in a predetermined pattern determined for each layer. Each of the multiple conductive layers includes one or multiple conductor portions in a plane perpendicular to direction D1. The material of each conductive layer is, for example, copper. The multiple conductive layers include a ground electrode to which a ground potential is applied. The mounting substrate 2 is, for example, an LTCC (Low Temperature Co-fired Ceramics) substrate.

[0046] (3) Communications equipment As shown in FIG. 5, the communication device 100 includes a high-frequency module 1, a signal processing circuit 17, and an antenna 16.

[0047] The antenna 16 is connected to the antenna terminal 11 of the high-frequency module 1. The antenna 16 has a transmitting function of emitting a transmission signal output from the high-frequency module 1 as radio waves, and a receiving function of receiving a reception signal from outside as radio waves and outputting it to the high-frequency module 1.

[0048] The signal processing circuit 17 includes an RF signal processing circuit 171 and a baseband signal processing circuit 172. The signal processing circuit 17 processes signals passing through the high-frequency module 1. More specifically, the signal processing circuit 17 processes transmission signals and reception signals.

[0049] The RF signal processing circuit 171 is, for example, an RFIC (Radio Frequency Integrated Circuit). The RF signal processing circuit 171 performs signal processing on a high frequency signal.

[0050] The RF signal processing circuit 171 performs signal processing such as up-conversion and amplification on the transmission signal transmitted from the baseband signal processing circuit 172, and outputs the processed transmission signal to the high-frequency module 1. The RF signal processing circuit 171 also performs signal processing such as amplification and down-conversion on the reception signal output from the high-frequency module 1, and outputs the processed reception signal to the baseband signal processing circuit 172.

[0051] The baseband signal processing circuit 172 is, for example, a BBIC (Baseband Integrated Circuit). The baseband signal processing circuit 172 performs predetermined signal processing on a transmission signal from outside the signal processing circuit 17. The received signal processed by the baseband signal processing circuit 172 is used, for example, as an image signal for image display or as an audio signal for telephone calls.

[0052] The RF signal processing circuit 171 also functions as a control unit that controls the connection of the switch 110 included in the high-frequency module 1 based on the transmission and reception of high-frequency signals (transmission signal, reception signal). Specifically, the RF signal processing circuit 171 switches the connection of the switch 110 of the high-frequency module 1 using a control signal (not shown). The control unit may be provided outside the RF signal processing circuit 171, and may be provided in the high-frequency module 1 or the baseband signal processing circuit 172, for example.

[0053] (4) Effects The electronic component 50 according to the first embodiment includes a substrate 51 and a pillar electrode 61. The substrate 51 has a main surface 511. The pillar electrode 61 protrudes from the main surface 511 of the substrate 51 in a thickness direction D1 of the substrate 51. The pillar electrode 61 is disposed between the main surface 511 of the substrate 51 and a bump electrode 70. The pillar electrode 61 has a main surface 62 and an outer peripheral surface 63. The main surface 62 is in contact with the bump electrode 70. The outer peripheral surface 63 is connected to the main surface 62. The pillar electrode 61 has a groove 64 provided in the main surface 62 of the pillar electrode 61. A bottom 65 of the groove 64 is connected to the outer peripheral surface 63 of the pillar electrode 61. As a result, the electronic component 50 according to the first embodiment can improve the connection reliability between the pillar electrode 61 and the electrode 23 of the mounting substrate 2.

[0054] Furthermore, in electronic component 50 according to embodiment 1, bottom 65 of groove 64 is connected to outer peripheral surface 63 of pillar electrode 61 at two or more locations. This makes it even less likely that voids will form in the solder that forms bump electrode 70 after melting, thereby further improving the connection reliability between pillar electrode 61 and electrode 23 of mounting substrate 2.

[0055] Furthermore, in the electronic component 50 according to the first embodiment, the pillar electrodes 61 are elongated in a direction D2 perpendicular to the thickness direction D1 of the substrate 51. This improves the heat dissipation from the electronic component 50 to the mounting substrate 2 on which the electronic component 50 is mounted. Furthermore, by reducing the electrical resistance of the pillar electrodes 61, it is possible to reduce the degradation of the electrical characteristics of the electronic component 50.

[0056] The electronic component 50 according to the first embodiment further includes a transistor Q1 having a plurality of electrodes. The pillar electrode 61 is connected to an emitter electrode EM1, which is one of the plurality of electrodes of the transistor Q1. As a result, the electronic component 50 according to the first embodiment can reduce degradation of electrical characteristics when the emitter of the transistor Q1 of the electronic component 50 is grounded. Furthermore, efficient heat dissipation from the transistor Q1, which is a heat-generating component of the electronic component 50, is possible.

[0057] Moreover, the high-frequency module 1 according to the first embodiment includes an electronic component 50 and a mounting substrate 2. The electronic component 50 is disposed on the mounting substrate 2. As a result, the high-frequency module 1 according to the first embodiment can improve the connection reliability of the pillar electrodes 61.

[0058] Moreover, the communication device 100 according to the first embodiment includes a high-frequency module 1 and a signal processing circuit 17. The signal processing circuit 17 is connected to the high-frequency module 1. As a result, according to the communication device 100 according to the first embodiment, it is possible to improve the connection reliability of the pillar electrodes 61 in the high-frequency module 1.

[0059] (Embodiment 2) (1) Composition The electronic component 50 according to the second embodiment includes a pillar electrode 61a shown in FIGS. 7A and 7B instead of the pillar electrode 61. The pillar electrode 61a has a groove 64 that has a different shape from the groove 64 of the pillar electrode 61 of the electronic component 50 according to the first embodiment. FIG. 7A corresponds to the X3-X3 cross section of FIG. 7B. Note that, as in FIG. 3A, hatching indicating a cross section of the pillar electrode 61a and the bump electrode 70 is omitted in FIG. 7A. As in FIG. 3B, the bump electrode 70 is omitted in FIG. 7B.

[0060] 7A, in the pillar electrode 61a, the bottom 65 of the groove 64 includes a first bottom surface 65a and a second bottom surface 65b. Each of the first bottom surface 65a and the second bottom surface 65b is, for example, a flat surface.

[0061] Each of the first bottom surface 65a and the second bottom surface 65b is inclined with respect to the main surface 62. More specifically, the first bottom surface 65a includes a portion 67a and a portion 67b. The portion 67a is, for example, a portion where the first bottom surface 65a and the second bottom surface 65b are connected. The portion 67b is, for example, close to the opening 66, which is a portion where the first bottom surface 65a and the outer peripheral surface 63 of the pillar electrode 61a are connected. In the first bottom surface 65a, the distance between the portion 67b and the main surface 62 is longer than the distance between the portion 67a and the main surface 62.

[0062] The second bottom surface 65b includes a portion 67a and a portion 67c. The portion 67c is, for example, close to an opening 66, which is a portion where the second bottom surface 65b and the outer peripheral surface 63 of the pillar electrode 61a are connected. Similarly, in the second bottom surface 65b, the distance between the portion 67c and the main surface 62 is longer than the distance between the portion 67a and the main surface 62. The portion 67a corresponds to the second portion of the present disclosure, and the portion 67b or the portion 67c corresponds to the first portion of the present disclosure. In the groove portion 64, the distance between the opening 66, which is a portion where the outer peripheral surface 63 and the bottom 65 are connected, and the portion 67b is shorter than the distance between the opening 66 and the portion 67a. In the groove portion 64, the distance between the opening 66 and the portion 67c is shorter than the distance between the opening 66 and the portion 67a. That is, the groove 64 is deeper as it approaches the outer circumferential surface 63 and shallower as it is farther from the outer circumferential surface 63 .

[0063] Therefore, in electronic component 50 according to embodiment 2, even if bubbles are generated from the flux or the like when electronic component 50 is placed on mounting board 2, the bubbles are likely to enter groove 64. Furthermore, groove 64 has a shape that is deeper the closer it is to opening 66, so that bubbles are likely to move along groove 64 to opening 66. That is, in electronic component 50 according to embodiment 2, when electronic component 50 is placed on mounting board 2, voids in solder 71 due to bubbles are even less likely to occur.

[0064] (2) Effects In the electronic component 50 according to the second embodiment, the bottom 65 of the groove 64 includes a portion 67a and portions 67b and 67c. The distance between the portion 67a and the main surface 62 is shorter than the distance between the portion 67b and the main surface 62. The distance between the portion 67a and the main surface 62 is also shorter than the distance between the portion 67c and the main surface 62. As a result, in the electronic component 50 according to the second embodiment, when the electronic component 50 is placed on the mounting substrate 2, bubbles are more likely to move along the groove 64, improving the connection reliability between the pillar electrodes 61 and the mounting substrate 2.

[0065] Furthermore, in the electronic component 50 according to the second embodiment, in the groove 64, the distance between a portion 67b and a point 66 where the outer peripheral surface 63 of the pillar electrode 61a and the bottom 65 of the groove 64 are connected is shorter than the distance between the portion 66 and the portion 67a. Furthermore, in the electronic component 50 according to the second embodiment, the distance between a portion 66 where the outer peripheral surface 63 of the pillar electrode 61a and the bottom 65 of the groove 64 are connected and a portion 67c is shorter than the distance between the portion 66 and the portion 67a. As a result, in the electronic component 50 according to the second embodiment, when the electronic component 50 is placed on the mounting substrate 2, air bubbles are easily pushed out along the groove 64 to the outer peripheral surface 63 of the pillar electrode 61a. This further improves the connection reliability between the pillar electrode 61 and the mounting substrate 2.

[0066] (Embodiment 3) (1) Composition The electronic component 50 according to the third embodiment includes a pillar electrode 61b shown in FIGS. 8A and 8B instead of the pillar electrode 61. The pillar electrode 61b has a groove 64 that has a different shape from the groove 64 of the pillar electrode 61 of the electronic component 50 according to the first embodiment. FIG. 8A corresponds to the X4-X4 cross section of FIG. 8B. Note that, as in FIG. 3A, hatching indicating a cross section of the pillar electrode 61b and the bump electrode 70 is omitted in FIG. 8A. As in FIG. 3B, the bump electrode 70 is omitted in FIG. 8B.

[0067] 8A, in the pillar electrode 61b, the bottom 65 of the groove 64 is stepped. More specifically, the bottom 65 of the groove 64 includes a bottom surface 65c, two bottom surfaces 65d, two bottom surfaces 65e, and two bottom surfaces 65f. Each of the bottom surfaces 65c to 65f is, for example, a flat surface.

[0068] The bottom surfaces 65c to 65f are arranged in the following order in direction D2: bottom surface 65f, bottom surface 65e, bottom surface 65d, bottom surface 65c, bottom surface 65d, bottom surface 65e, bottom surface 65f. The two bottom surfaces 65f are equally distant from the main surface 62. The two bottom surfaces 65e are equally distant from the main surface 62. The two bottom surfaces 65d are equally distant from the main surface 62. The distances from the main surface 62 to the bottom surfaces 65c, 65d, 65e, and 65f increase in this order. Specifically, the distance between the bottom surface 65d and the main surface 62 is longer than the distance between the bottom surface 65c and the main surface 62. The distance between the bottom surface 65e and the main surface 62 is longer than the distance between the bottom surface 65d and the main surface 62. Furthermore, the distance between bottom surface 65f and main surface 62 is longer than the distance between bottom surface 65e and main surface 62. Bottom surface 65f corresponds to the first portion and first bottom surface of the present disclosure. Bottom surface 65e corresponds to the second portion and second bottom surface of the present disclosure. Bottom surface 65d corresponds to the third bottom surface of the present disclosure.

[0069] In the electronic component 50 according to the third embodiment, even if bubbles are generated from the flux or the like when the electronic component 50 is placed on the mounting board 2, the bubbles easily enter the grooves 64. Moreover, the grooves 64 are shaped so that they are deeper the closer they are to the openings 66, and therefore the bubbles easily move along the grooves 64 to the openings 66. That is, in the electronic component 50, voids in the solder 71 caused by bubbles are less likely to occur, and the connection reliability between the pillar electrodes 61b and the mounting board 2 is improved.

[0070] Furthermore, in electronic component 50 according to embodiment 3, bottom 65 of groove 64 is stepped. Therefore, groove 64 can be easily formed by, for example, etching the material of pillar electrode 61b using multiple photomasks.

[0071] (2) Effects In the electronic component 50 according to the third embodiment, the bottom 65 of the groove 64 includes a bottom surface 65f that is a plane including the portion 65f, and a bottom surface 65e that is a plane including the portion 65e. As a result, in the electronic component 50 according to the third embodiment, when the electronic component 50 is placed on the mounting substrate 2, air bubbles are easily pushed out along the groove 64 toward the outer peripheral surface 63 of the pillar electrode 61b. This further improves the adhesion between the pillar electrode 61 and the mounting substrate 2.

[0072] Furthermore, in the electronic component 50 according to the third embodiment, the bottom 65 of the groove 64 further includes a bottom surface 65d that is a flat surface that is located at a smaller distance from the main surface 62 of the pillar electrode 61b than the distance between the portion 65e and the main surface 62 of the pillar electrode 61b. As a result, in the electronic component 50 according to the third embodiment, when the electronic component 50 is placed on the mounting substrate 2, air bubbles are easily pushed out along the groove 64 toward the outer peripheral surface 63 of the pillar electrode 61b. This further improves the adhesion between the pillar electrode 61 and the mounting substrate 2.

[0073] (Embodiment 4) (1) Composition The electronic component 50 according to the fourth embodiment includes a pillar electrode 61c shown in FIGS. 9A, 9B, and 10 instead of the pillar electrode 61. The pillar electrode 61c has a groove 64 that has a different shape from the groove 64 of the pillar electrode 61 of the electronic component 50 according to the first embodiment. FIG. 9A corresponds to the X5-X5 cross section of FIG. 9B. FIG. 10 corresponds to the X6-X6 cross section of FIG. 9B. Note that, as in FIGS. 3A and 4, hatching indicating cross sections of the pillar electrode 61a and the bump electrode 70 is omitted in FIGS. 9A and 10. As in FIG. 3B, the bump electrode 70 is omitted in FIG. 9B.

[0074] 9A and 9B, in the pillar electrode 61c, the groove 64 includes a first groove 64a and a plurality of (three in FIGS. 9A and 9B) second grooves 64b. Note that, in FIG. 9B, the bump electrode 70 is omitted, as in FIG. 3B.

[0075] The first groove 64a extends in direction D2, which is the longitudinal direction of the pillar electrode 61c. At both ends in direction D2, the bottom 65 of the first groove 64a is connected to the outer circumferential surface 63. That is, the pillar electrode 61c has openings 66a at both ends in direction D2 where the first groove 64a opens to the outer circumferential surface 63.

[0076] 9A, 9B, and 10, each of the second grooves 64b extends in a direction intersecting direction D2. More specifically, each of the second grooves 64b extends in direction D3, which is perpendicular to directions D1 and D2. The bottoms 65 of each of the second grooves 64b are connected to the outer circumferential surface 63 at both ends in direction D3. That is, the pillar electrode 61c has a plurality of openings 66b at both ends in direction D3, where the second grooves 64b open to the outer circumferential surface 63.

[0077] As a result, in the electronic component 50 according to the fourth embodiment, the bottoms 65 of the grooves 64 of the pillar electrodes 61c are connected to the outer peripheral surface 63 at multiple positions. Furthermore, in the electronic component 50 according to the fourth embodiment, the grooves 64 have a first groove 64a and a second groove 64b that intersects with the first groove 64a. Therefore, in the electronic component 50 according to the fourth embodiment, when the electronic component 50 is placed on the mounting substrate 2, air bubbles are less likely to remain in the melted solder of the bump electrodes 70. That is, in the electronic component 50, when the electronic component 50 is placed on the mounting substrate 2, voids in the solder 71 due to air bubbles are less likely to occur, improving the connection reliability between the pillar electrodes 61 and the mounting substrate 2.

[0078] (2) Effects In the electronic component 50 according to the fourth embodiment, the groove 64 includes a first groove 64a and a second groove 64b. The first groove 64a extends in the longitudinal direction D2 of the pillar electrode 61c. The second groove 64b intersects with the first groove 64a. The bottom 65 of the first groove 64a and the bottom 65 of the second groove 64b are each connected to the outer peripheral surface 63 of the pillar electrode 61c. As a result, in the electronic component 50 according to the fourth embodiment, voids in the solder 71 due to air bubbles are less likely to occur when the electronic component 50 is placed on the mounting substrate 2, improving the connection reliability between the pillar electrode 61 and the mounting substrate 2.

[0079] (Embodiment 5) The electronic component 50 according to the fifth embodiment includes a pillar electrode 61d shown in FIGS. 11A and 11B instead of the pillar electrode 61. The pillar electrode 61d has a groove 64 that has a different shape from the groove 64 of the pillar electrode 61 of the electronic component 50 according to the first embodiment. FIG. 11A corresponds to the X7-X7 cross section of FIG. 11B. Note that, as in FIG. 3A, hatching indicating a cross section of the pillar electrode 61d and the bump electrode 70 is omitted in FIG. 11B, as in FIG. 3B. Furthermore, as in FIG. 3B, the bump electrode 70 is omitted in FIG. 11B.

[0080] In the pillar electrode 61d, similarly to the pillar electrode 61c of the electronic component according to the fourth embodiment, the groove 64 includes a first groove 64a and a plurality of (three in FIGS. 11A and 11B) second grooves 64b.

[0081] The first groove 64a extends in direction D2, which is the longitudinal direction of the pillar electrode 61d. At both ends in direction D2, the bottom 65 of the first groove 64a is connected to the outer circumferential surface 63. That is, the pillar electrode 61d has openings 66a at both ends in direction D2 where the first groove 64a opens to the outer circumferential surface 63.

[0082] In the pillar electrode 61d, the first groove 64a is deeper as it is closer to the opening 66, and shallower as it is farther from the opening 66, similar to the groove 64 of the pillar electrode 61a. More specifically, the bottom of the first groove 64a includes a plurality of bottom surfaces 65g, a plurality of bottom surfaces 65h, and a plurality of bottom surfaces 65i. The plurality of bottom surfaces 65g are, for example, flat surfaces at a constant distance from the main surface 62, and are connected to the bottom of the second groove 64b. Each of the plurality of bottom surfaces 65h is, for example, a flat surface, and has a slope such that the distance between the portion in contact with the opening 66a or the bottom surface 65g and the main surface 62 is longer than the distance between the portion in contact with the bottom surface 65i and the main surface 62. Each of the plurality of bottom surfaces 65i is, for example, a flat surface, and has a slope such that the distance between the portion in contact with the opening 66a or the bottom surface 65g and the main surface 62 is longer than the distance between the portion in contact with the bottom surface 65h and the main surface 62. That is, the first groove 64a becomes deeper the closer it is to the opening 66a or the intersection of the first groove 64a and the second groove 64b, and becomes shallower the farther it is from the intersection.

[0083] As a result, in the electronic component 50 according to the fifth embodiment, when the electronic component 50 is placed on the mounting substrate 2, air bubbles are less likely to remain in the solder melted by the bump electrodes 70. For example, if an air bubble occurs inside or near the second groove 64b, the air bubble is likely to move along the second groove 64b to the opening 66b because the depth of the second groove 64b is greater than or equal to the depth of the first groove 64a. Furthermore, if an air bubble occurs inside or near the first groove 64a, the air bubble is likely to move along the first groove 64a to the opening 66a or the second groove 64b because the depth of the first groove 64a is deeper the closer it is to the opening 66a or the second groove 64b. As described above, air bubbles inside the second groove 64b are likely to move along the second groove 64b to the opening 66b, so regardless of the position of the air bubble, the air bubble is less likely to remain in the solder.

[0084] Therefore, the electronic component 50 according to the fifth embodiment can enjoy the effects of both the electronic component 50 according to the second embodiment and the electronic component 50 according to the fourth embodiment.

[0085] (Embodiment 6) The electronic component 50 according to the sixth embodiment includes a pillar electrode 61e shown in FIGS. 12A and 12B instead of the pillar electrode 61. The pillar electrode 61e has a groove 64 that has a different shape from the groove 64 of the pillar electrode 61 of the electronic component 50 according to the first embodiment. FIG. 12A corresponds to the X8-X8 cross section of FIG. 12B. Note that, as in FIG. 3A, hatching indicating a cross section of the pillar electrode 61e and the bump electrode 70 is omitted in FIG. 12A. As in FIG. 3B, the bump electrode 70 is also omitted in FIG. 12B.

[0086] In pillar electrode 61e, similar to pillar electrode 61c of electronic component 50 according to embodiment 4, groove 64 includes first groove 64a and multiple (three in FIGS. 12A and 12B) second grooves 64b.

[0087] The first groove 64a extends in direction D2, which is the longitudinal direction of the pillar electrode 61e. At both ends in direction D2, the bottom 65 of the first groove 64a is connected to the outer circumferential surface 63. That is, the pillar electrode 61e has openings 66a at both ends in direction D2 where the first groove 64a opens to the outer circumferential surface 63.

[0088] In the pillar electrode 61e, like the grooves 64 of the pillar electrode 61a, the first grooves 64a are deeper as they are closer to the opening 66 and shallower as they are farther from the opening 66. More specifically, the bottom 65 of the first groove 64a includes a plurality of bottom surfaces 65g, a plurality of bottom surfaces 65j, and a plurality of bottom surfaces 65k. In the pillar electrode 61e, the bottom surfaces 65j, 65k, and 65j are arranged in this order between the two bottom surfaces 65g in the direction D2. The plurality of bottom surfaces 65g are, for example, flat surfaces at a constant distance from the main surface 62 and are connected to the bottom 65 of the second groove 64b. Each of the plurality of bottom surfaces 65j is, for example, a flat surface, and the distance between the bottom surface 65j and the main surface 62 is shorter than the distance between the bottom surface 65g and the main surface 62. Each of the plurality of bottom surfaces 65k is, for example, a flat surface, and the distance between the bottom surface 65k and the main surface 62 is shorter than the distance between the bottom surface 65j and the main surface 62. That is, the first groove portion 64a becomes deeper as it approaches the opening 66a or the intersection of the first groove portion 64a and the second groove portion 64b, and becomes shallower as it moves away.

[0089] As a result, in the electronic component 50 according to the sixth embodiment, when the electronic component 50 is placed on the mounting substrate 2, air bubbles are less likely to remain in the solder melted by the bump electrodes 70. For example, if an air bubble occurs inside or near the second groove 64b, the air bubble is likely to move along the second groove 64b to the opening 66b because the depth of the second groove 64b is greater than or equal to the depth of the first groove 64a. Furthermore, if an air bubble occurs inside or near the first groove 64a, the air bubble is likely to move along the first groove 64a to the opening 66a or the second groove 64b because the depth of the first groove 64a is deeper the closer it is to the opening 66a or the second groove 64b. As described above, air bubbles inside the second groove 64b are likely to move along the second groove 64b to the opening 66b, so regardless of the position of the air bubble, the air bubble is less likely to remain in the solder.

[0090] Therefore, the electronic component 50 according to the sixth embodiment can enjoy the effects of both the electronic component 50 according to the third embodiment and the electronic component 50 according to the fourth embodiment.

[0091] (Variation) Modifications of the embodiment will be described below.

[0092] In the electronic component 50 according to the first to sixth embodiments, the pillar electrodes 61 to 61e may be provided with, for example, a plurality of grooves extending in the longitudinal direction of the pillar electrodes 61 to 61e. Also, the pillar electrodes 61 to 61e may be provided with, for example, a plurality of grooves extending in a direction intersecting the longitudinal direction of the pillar electrodes 61 to 61e.

[0093] Furthermore, in the electronic component 50 according to the first to sixth embodiments, the shape of the pillar electrodes 61 to 61e in plan view from direction D1 may be any shape, such as a circle, a rectangle, etc. Furthermore, the shape of the pillar electrodes 61 to 61e in plan view from direction D1 does not have to be elongated.

[0094] In the electronic components 50 according to the second and fifth embodiments, the bottoms 65 of the grooves 64 of the pillar electrodes 61a and 61d may include curved surfaces.

[0095] Furthermore, in electronic components 50 according to embodiments 3 and 6, grooves 64 of pillar electrodes 61b and 61e or bottoms 65 of first grooves 64a do not need to be symmetrical in direction D2. For example, bottoms 65 of grooves 64 may have a stepped shape in part.

[0096] In the electronic component 50 according to the first to sixth embodiments, the pillar electrodes 61 to 61e may be connected to, for example, the base electrode or collector electrode of the transistor Q1. The transistor Q1 may be a field-effect transistor, and the pillar electrodes 61 to 61e may be connected to one of the gate electrode, source electrode, or drain electrode of the transistor Q1. The electronic component 50 may also include a transistor that is part of the low-noise amplifier 152 or the switch 110.

[0097] (Aspect) The electronic component (50) according to the first aspect includes a substrate (51) and pillar electrodes (61-61e). The substrate (51) has a first main surface (511). The pillar electrodes (61-61e) protrude from the first main surface (511) of the substrate (51) in a thickness direction (D1) of the substrate (51). The pillar electrodes (61-61e) are disposed between the first main surface (511) of the substrate (51) and a bump electrode (70). The pillar electrodes (61-61e) have a second main surface (62) and an outer peripheral surface (63). The second main surface (62) is in contact with the bump electrode (70). The outer peripheral surface (63) is connected to the second main surface (62). The pillar electrodes (61 to 61e) have grooves (64) provided in the second main surfaces (62) of the pillar electrodes (61 to 61e). The bottoms (65) of the grooves (64) are connected to the outer peripheral surfaces (63) of the pillar electrodes (61 to 61e).

[0098] According to the electronic component (50) of the above aspect, it is possible to improve the connection reliability of the pillar electrodes (61-61e).

[0099] In the electronic component (50) according to the second aspect, in the first aspect, the bottom (65) of the groove (64) is connected to the outer circumferential surface (63) of the pillar electrode (61-61e) at two or more points.

[0100] According to the electronic component (50) of the above aspect, voids are further unlikely to occur in the fused bump electrodes (70), and therefore the connection reliability of the pillar electrodes (61-61e) can be further improved.

[0101] In the electronic component (50) according to the third aspect, in the first or second aspect, the pillar electrodes (61-61e) are elongated in a direction (D2) perpendicular to the thickness direction (D1) of the substrate (51).

[0102] The electronic component (50) according to the above aspect improves heat dissipation from the electronic component (50) to the mounting board (2) on which the electronic component (50) is mounted. Furthermore, the electronic component (50) according to the above aspect reduces the electrical resistance of the pillar electrodes (61-61e), thereby making it possible to reduce degradation of the electrical characteristics of the electronic component (50).

[0103] The electronic component (50) according to a fourth aspect is the third aspect, further including a transistor (Q1). The transistor (Q1) has a plurality of electrodes. The pillar electrodes (61-61e) are connected to one (EM1) of the plurality of electrodes of the transistor (Q1).

[0104] The electronic component (50) according to the above aspect can reduce deterioration in the electrical characteristics of the electronic component (50). Furthermore, the electronic component (50) according to the above aspect improves heat dissipation from the transistor (Q1) included in the electronic component (50).

[0105] In an electronic component (50) according to a fifth aspect, in any one of the first to fourth aspects, the grooves (64) include a first groove (64a) and a second groove (64b). The first groove (64a) extends in the longitudinal direction (D2) of the pillar electrodes (61c; 61e). The second groove (64b) intersects with the first groove (64a). A bottom (65) of the first groove (64a) and a bottom (65) of the second groove (64b) are each connected to the outer circumferential surface (63) of the pillar electrodes (61c; 61e).

[0106] In the electronic component (50) according to a sixth aspect, in any of the first to fifth aspects, the bottom (65) of the groove (64) includes a first portion (67b, 67c; 65f) and a second portion (67b; 65e). The distance between the first portion (67a, 67c; 65f) and the second main surface (62) of the pillar electrode (61a; 61b; 61d; 61e) is longer than the distance between the second portion (67a; 65e) and the second main surface (62) of the pillar electrode (61a; 61b; 61d; 61e).

[0107] According to the electronic component (50) of the above aspect, when the electronic component (50) is mounted on the mounting board (2), the bubbles are more likely to move along the grooves (64), thereby improving the adhesion between the pillar electrodes (61a; 61b; 61d; 61e) and the mounting board (2).

[0108] In an electronic component (50) according to a seventh aspect, in the sixth aspect, the bottom (65) of the groove (64) includes a first bottom surface (65f) and a second bottom surface (65e). The first bottom surface (65f) is a plane including the first portion (65f). The second bottom surface (65e) is a plane including the second portion (65e).

[0109] According to the electronic component (50) of the above aspect, when the electronic component (50) is mounted on the mounting board (2), the bubbles are more likely to move along the grooves (64), thereby improving the adhesion between the pillar electrodes (61a; 61b; 61d; 61e) and the mounting board (2).

[0110] In the electronic component (50) according to the eighth aspect, in the seventh aspect, the bottom (65) of the groove portion (64) further includes a third bottom surface (65d) that is a flat surface whose distance from the second main surface (62) of the pillar electrode (61b) is smaller than the distance between the second portion (65e) and the second main surface (62) of the pillar electrode (61b).

[0111] According to the electronic component (50) of the above aspect, when the electronic component (50) is mounted on the mounting substrate (2), the air bubbles are more likely to move along the grooves (64), thereby improving the adhesion between the pillar electrodes (61a; 61b; 61d; 61e) and the mounting substrate (2).

[0112] In the electronic component (50) according to the ninth aspect, in any of the sixth to eighth aspects, the distance between the point (66) where the outer peripheral surface (63) of the pillar electrode (61a; 61b; 61d; 61e) and the bottom (65) of the groove (64) are connected and the first portion (67b, 67c) is shorter than the distance between the point (66) and the second portion (67a).

[0113] According to the electronic component (50) of the above aspect, when the electronic component (50) is mounted on the mounting substrate (2), the air bubbles are easily pushed out along the grooves (64) toward the outer circumferential surfaces (63) of the pillar electrodes (61a; 61b; 61d; 61e), thereby further improving the adhesion between the pillar electrodes (61a; 61b; 61d; 61e) and the mounting substrate (2).

[0114] A high-frequency module (1) according to a tenth aspect includes an electronic component (50) according to any one of the first to ninth aspects and a mounting board (2). The mounting board (2) has the electronic component (50) arranged thereon.

[0115] According to the high-frequency module (1) of the above aspect, it is possible to improve the connection reliability of the pillar electrodes (61).

[0116] A communication device (100) according to an eleventh aspect includes the high-frequency module (1) according to the tenth aspect and a signal processing circuit (17). The signal processing circuit (17) is connected to the high-frequency module (1).

[0117] According to the communication device (100) of the above aspect, it is possible to improve the connection reliability of the pillar electrodes (61) in the high-frequency module (1). [Explanation of symbols]

[0118] 1. High frequency module 2 Mounting board 21 Main surface 22 Main Surface 23 electrodes 50 Electronic Components 51 PCB 511 Main surface (first main surface) 52 Insulating layer 53 Electrode 60 connecting electrode 61, 61a, 61b, 61c, 61d, 61e pillar electrodes 62 Main surface (second main surface) 63 Outer surface 64 Groove 64a First groove 64b Second groove 65 Bottom 65a Bottom (1st bottom) 65b Bottom (2nd bottom) 65c bottom 65d Bottom (3rd bottom) 65e Bottom (2nd bottom, 2nd part) 65f Bottom (1st bottom, 1st part) 65g, 65h, 65i, 65j, 65k bottom 66 Openings (locations) 66a, 66b opening Part 67a (second part) Part 67b (Part 1) 67c part (1st part) 70 Bump electrode 100 Communication equipment 10 External connection terminal 11 Antenna terminal 12 Signal input terminal 13 Signal output terminal 16 Antenna 17 Signal processing circuit 171 RF signal processing circuit 172 Baseband signal processing circuit 110 Switch 111 Common terminal 112, 113 selection terminals 121, 122, 141, 142 matching circuit 131 Outbound Filter 132 Receive Filter 151 Power Amplifier 152 Low-Noise Amplifier Q1 transistor BS1 Base electrode CO1 collector electrode EM1 emitter electrode D1 direction D2 direction D3 Direction

Claims

1. a substrate having a first major surface; a pillar electrode protruding from the first main surface of the substrate in a thickness direction of the substrate and disposed between the first main surface of the substrate and a bump electrode, The pillar electrodes are a second main surface in contact with the bump electrode; an outer circumferential surface connected to the second main surface, the pillar electrode has a groove portion provided in the second main surface of the pillar electrode, a bottom of the groove portion connected to the outer circumferential surface of the pillar electrode; Electronic components.

2. a bottom of the groove portion connected to the outer circumferential surface of the pillar electrode at two or more points; The electronic component according to claim 1 .

3. The pillar electrode has an elongated shape in a direction perpendicular to the thickness direction of the substrate. The electronic component according to claim 1 or 2.

4. further comprising a transistor having a plurality of electrodes; the pillar electrode is connected to any one of a plurality of electrodes of the transistor; The electronic component according to claim 3 .

5. The groove portion is a first groove portion extending in a longitudinal direction of the pillar electrode; a second groove portion intersecting the first groove portion, a bottom of the first groove portion and a bottom of the second groove portion are each connected to the outer circumferential surface of the pillar electrode; The electronic component according to claim 3 .

6. the bottom of the groove includes a first portion and a second portion; a distance between the first portion and the second main surface of the pillar electrode is longer than a distance between the second portion and the second main surface of the pillar electrode; The electronic component according to claim 1 or 2.

7. The bottom of the groove is a first bottom surface that is a plane including the first portion; a second bottom surface that is a plane including the second portion, The electronic component according to claim 6.

8. the bottom of the groove further includes a third bottom surface that is a flat surface whose distance from the second main surface of the pillar electrode is smaller than a distance between the second portion and the second main surface of the pillar electrode. The electronic component according to claim 7.

9. In the groove, a distance between a point where the outer peripheral surface of the pillar electrode and the bottom of the groove are connected and the first portion is shorter than a distance between the point and the second portion. The electronic component according to claim 6.

10. The electronic component according to claim 1 or 2; a mounting substrate on which the electronic components are arranged, High frequency module.

11. The high-frequency module according to claim 10; a signal processing circuit connected to the high-frequency module; Communication equipment.

Images