Substrate processing method, substrate processing device, and computer program

Abstract

To provide a substrate processing method capable of accurately processing a substrate in response to the number of substrates, a substrate processing device, and a program.SOLUTION: A substrate processing method includes: Step S2 of acquiring substrate number information 312 indicating the number of substrates W included a lot; Step S3 of selecting relationship information 41n corresponding to the number of substrates W indicated by substrate count information 312 from a plurality of pieces of relationship information 41n each indicating relationship between the number of substrates W and a correction value of a processing time of the substrate W; Step S4 of acquiring a correction value corresponding to the number of substrates W indicated by the wafer number information 312 from the selected relationship information 41n; Step S5 of correcting the processing time of the substrate W based on the acquired correction value so as to make the processing time shorter than a processing time in a case where the number of substrates W in the lot is maximum; and Step S7 of processing the substrate W using a process liquid in a processing tub 100 based on the corrected processing time of the substrate W.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to a substrate processing method, a substrate processing apparatus, and a computer program. [Background technology]

[0002] The substrate processing apparatus described in Patent Document 1 places a plurality of substrates in a heated phosphoric acid solution. The etching process is carried out by immersing the substrates all at once. The processing time determination unit counts the number of substrates to be processed at once by a counter and a processing time determination unit. The number of counted substrates is calculated by referring to the relationship between the number of substrates and the processing time stored in advance in the storage unit. The processing time is determined according to the [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-296506 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the substrate processing apparatus described in Patent Document 1, five substrates are treated as one unit. The number of boards can be varied from the smallest unit (1 to 5 boards) to the largest unit (46 to 50 boards), The correction amount of the processing time increases linearly.

[0005] According to the inventor's intensive research, the correction amount of the processing time from the minimum number of substrates to the maximum number of substrates can be When increasing linearly, the amount of etching of the substrate varies depending on the number of substrates. For example, when etching a substrate, it is necessary to If the etching amount is too large, the substrate may have to be discarded.

[0006] The present invention has been made in view of the above-mentioned problems, and its object is to provide a method for manufacturing a substrate mounting apparatus according to the number of substrates. A substrate processing method, a substrate processing apparatus, and a computer program capable of processing the substrate with high accuracy The purpose is to provide a program. [Means for solving the problem]

[0007] According to one aspect of the present invention, a substrate processing method includes: At least one substrate is treated by immersing it in the treatment solution. The processing method includes a step of acquiring substrate number information indicating the number of the substrates included in the lot; , a plurality of pieces of relationship information each indicating the relationship between the number of substrates and the correction value of the processing time of the substrate From the above, relationship information corresponding to the number of substrates indicated by the substrate number information is selected. and selecting from the selected relationship information the a step of acquiring a correction value according to the number of substrates; The processing time is shortened based on the acquired correction value. a step of correcting the processing time of the substrate; and performing the processing based on the corrected processing time of the substrate. treating the substrate with the treatment liquid in a bath.

[0008] In one aspect of the present invention, in the substrate processing method, each of the plurality of pieces of relationship information includes: It is preferable that the correction value be a function showing the relationship between the number of substrates and the correction value for the processing time of the substrates. .

[0009] In one aspect of the present invention, in the substrate processing method, the plurality of pieces of relationship information are Preferably, the substrate is defined by a plurality of different reference points. The method may further include a step of receiving input of a plurality of reference point correction value information for respectively defining the reference points. Preferably, each of the plurality of pieces of reference point correction value information is a reference point correction value for the substrate that defines the corresponding reference point. It is preferable to indicate the correction value of the processing time.

[0010] In one aspect of the present invention, the substrate processing method further comprises: It is preferable that the method further includes the step of accepting input of setting information.

[0011] In one aspect of the present invention, the substrate processing method includes: It is preferable that the method further includes a step of accepting input of invalid setting information to be invalidated.

[0012] In one aspect of the present invention, in the substrate processing method, the plurality of pieces of relationship information are Preferably, the substrate is defined by a plurality of different reference points. Further comprising a step of receiving input of a plurality of reference point substrate number information for determining each reference point. Preferably, each of the plurality of pieces of reference point substrate number information is a log that defines the corresponding reference point. It is preferable to indicate the number of said substrates in the set.

[0013] In one aspect of the present invention, in the substrate processing method, the number of the substrates in the lot is When the maximum number of substrates is indicated, the correction value for the substrate processing time is preferably zero. In each of the plurality of pieces of relationship information, the smaller the number of the substrates, the greater the correction of the processing time for the substrates. In the step of correcting, the number of the substrates in the lot is preferably The substrate processing time indicated by the substrate number information is calculated from the substrate processing time when the maximum number of substrates is indicated. The processing time of the substrates can be corrected by subtracting the correction value according to the number of substrates. preferable.

[0014] In one aspect of the present invention, in the substrate processing method, Preferably, the correction value is set in accordance with the arrangement of the substrate in the processing bath. In the step of correcting, the processing time of the substrate is corrected based on the set correction value. It is preferable that:

[0015] In one aspect of the present invention, in the substrate processing method, When the substrate is placed in the processing bath in a first placement state, the substrate after correction the processing time of the substrate arranged in the standard arrangement state is shorter than the corrected processing time of the substrate arranged in the standard arrangement state. In this way, a correction value for the processing time of the substrate arranged in the first arrangement state is preferably set. The reference position is preferably a position where the substrates are continuously arranged in a predetermined direction in the processing bath. and are arranged at equal intervals in an area including the center of the maximum board arrangement area in the predetermined direction. In this state, the distance between the adjacent substrates indicates a first distance. It is preferable that the maximum substrate placement area is a region where the number of substrates in the lot is equal to the maximum number of substrates. When the number is a number, it preferably indicates an area where the substrate is arranged. The substrates are arranged at equal intervals in the predetermined direction in the processing bath, and adjacent A state in which the gap between the opposing substrates indicates a second distance that is greater than the first distance. It is preferable that there is.

[0016] In one aspect of the present invention, in the substrate processing method, When the substrate is placed in the processing bath in a second placement state, the substrate after correction the processing time of the substrate arranged in the standard arrangement state is longer than the corrected processing time of the substrate arranged in the standard arrangement state. In this way, a correction value for the processing time of the substrate arranged in the second arrangement state is preferably set. The reference position is preferably a position where the substrates are continuously arranged in a predetermined direction in the processing bath. and are arranged at equal intervals in an area including the center of the maximum board arrangement area in the predetermined direction. In this state, the distance between the adjacent substrates indicates a first distance. It is preferable that the maximum substrate placement area is a region where the number of substrates in the lot is equal to the maximum number of substrates. When the number is a number, it preferably indicates an area where the substrate is arranged. The plurality of substrates in the lot are divided into a first group of substrates and a second group of substrates in the processing bath. It is preferable that the first substrate group and the second substrate group are arranged in the above-mentioned manner. It is preferable that the first group of substrates is not arranged in the center of the maximum substrate arrangement area. It is preferable that the second group is disposed in one end region of the maximum arrangement region in the predetermined direction. The group of boards is preferably arranged in the other end area in the predetermined direction of the maximum board arrangement area. In each of the first substrate group and the second substrate group, two or more of the substrates are The substrates are arranged at equal intervals along a predetermined direction, and the interval between the adjacent substrates is equal to or smaller than the first distance. It is preferable that the state indicates separation.

[0017] In one aspect of the present invention, in the substrate processing method, When the substrate is placed in the processing bath in a third arrangement state, the substrate after correction the processing time of the substrate arranged in the standard arrangement state is longer than the corrected processing time of the substrate arranged in the standard arrangement state. In this way, a correction value for the processing time of the substrate arranged in the third arrangement state is preferably set. The reference position is preferably a position where the substrates are continuously arranged in a predetermined direction in the processing bath. and are arranged at equal intervals in an area including the center of the maximum board arrangement area in the predetermined direction. In this state, the distance between the adjacent substrates indicates a first distance. It is preferable that the maximum substrate placement area is a region where the number of substrates in the lot is equal to the maximum number of substrates. It is preferable that the third arrangement state indicates an area where the substrate is arranged when the third arrangement state is a number. The plurality of substrates in the lot are either a first group of substrates or a second group of substrates in the processing bath. It is preferable that the first substrate group and the second substrate group are disposed on either one of the first and second substrate groups. Preferably, the first substrate group is not arranged in the center of the maximum substrate arrangement area. It is preferable that the substrate is disposed in one end area in the predetermined direction of the maximum arrangement area of ​​the substrate. The second substrate group is arranged in the other end area of ​​the maximum substrate arrangement area in the predetermined direction. In each of the first substrate group and the second substrate group, two or more of the substrates are preferably The substrates are arranged at equal intervals along the predetermined direction, and the interval between the adjacent substrates is It is preferable that the state indicates the first distance.

[0018] In one aspect of the present invention, in a substrate processing method, the processing time of the substrate before correction is Preferably, the period is divided into a plurality of step periods. Based on the correction value, the step period is set to a period during which the chemical solution is replenished. Preferably, the step duration for processing the substrate is corrected. The period of the steps preferably includes a step of replenishing the treatment tank with the chemical solution.

[0019] In one aspect of the present invention, in the substrate processing method, the step of correcting The correction value is equally or proportionally distributed to two or more step periods during which the chemical solution is replenished. It is preferable to correct the two or more step periods by allocating the time.

[0020] In one aspect of the present invention, in a substrate processing method, each of the plurality of lots comprises: It is preferable that the treatment is carried out in a plurality of the treatment tanks. Preferably, a plurality of bath-dependent correction values ​​are assigned. It is preferable to indicate a correction value for correcting the processing time of the substrate according to the processing characteristics of the processing bath. In the correction step, the previous correction value is calculated based on the acquired correction value and the tank-dependent correction value. It is preferable to correct the processing time of the substrate.

[0021] According to another aspect of the present invention, a substrate processing apparatus processes at least one substrate for each lot. The substrate processing apparatus includes a processing bath, a substrate holding unit, a memory unit, and a selection unit. The processing tank stores the processing liquid. The substrate holder includes: The substrate is held and immersed in the processing liquid. The selection unit stores information on the number of substrates indicating the number of substrates to be processed. Among a plurality of pieces of relationship information indicating the relationship with the correction value of the substrate processing time, The correction unit selects relationship information according to the number of substrates indicated by the information. From the relationship information, correction is performed according to the number of substrates indicated by the substrate number information. The processing time is longer than the processing time when the number of substrates in the lot is the maximum. The processing time of the substrate is corrected based on the correction value so as to shorten the immersion time. the substrate is immersed in the processing liquid according to the corrected processing time of the substrate. The substrate holder is controlled.

[0022] According to yet another aspect of the present invention, a computer program is provided for executing a substrate processing method on a computer. The substrate processing method includes: Therefore, by immersing the substrate in the processing solution stored in the processing tank, the substrate can be processed for each lot. The computer program processes the plates. a step of acquiring substrate number information indicating the number of the substrates to be processed, The substrate number information is selected from a plurality of pieces of relationship information indicating the relationship with the correction value of the substrate processing time. a step of selecting relationship information according to the number of the substrates indicated by the From the relationship information, a correction value according to the number of substrates indicated by the substrate number information is obtained. and a process for reducing the processing time by a longer time than when the number of substrates in the lot is the maximum. correcting the processing time of the substrate based on the obtained correction value so as to shorten the processing time; and adjusting the amount of time for immersing the substrate in the processing solution according to the corrected processing time for the substrate. and controlling the substrate holder. [Effects of the Invention]

[0023] According to the present invention, substrates can be processed with high precision according to the number of substrates. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a schematic cross-sectional view showing a substrate processing apparatus according to a first embodiment of the present invention. [Figure 2] 1(a) is a perspective view showing a state before the substrate according to the first embodiment is immersed in a processing liquid, and FIG. 1(b) is a perspective view showing a state after the substrate according to the first embodiment is immersed in a processing liquid. [Figure 3] 4 is a graph showing the relationship between the number of substrates in one lot and the etching rate according to the first embodiment. [Figure 4] FIG. 3 is a diagram showing an example of a plurality of pieces of relationship information according to the first embodiment. [Figure 5] FIG. 2 is a block diagram showing a control device according to the first embodiment. [Figure 6] 1A is a graph showing a plurality of pieces of relationship information corresponding to a first example of recipe information according to embodiment 1. FIG. 1B is a diagram showing the first example of recipe information according to embodiment 1. [Figure 7] 10A is a graph showing a plurality of pieces of relationship information corresponding to a second example of recipe information according to embodiment 1. FIG. 10B is a diagram showing a second example of recipe information according to embodiment 1. [Figure 8] 10A is a graph showing a plurality of pieces of relationship information corresponding to a third example of recipe information according to embodiment 1. FIG. 10B is a diagram showing the third example of recipe information according to embodiment 1. [Figure 9] 10A is a graph showing a plurality of pieces of relationship information corresponding to a fourth example of recipe information according to embodiment 1. FIG. 10B is a diagram showing the fourth example of recipe information according to embodiment 1. [Figure 10] 10A is a graph showing a plurality of pieces of relationship information corresponding to a fifth example of recipe information according to embodiment 1. FIG. 10B is a diagram showing the fifth example of recipe information according to embodiment 1. [Figure 11] 1 is a flowchart showing a substrate processing method according to the first embodiment. [Figure 12] 1(a) is a diagram showing a reference arrangement state of a substrate according to a first modified example of embodiment 1. FIG. 1(b) is a graph showing a plurality of pieces of relationship information corresponding to the reference arrangement state of a substrate according to the first modified example. [Figure 13] 1A is a diagram showing a first arrangement state of a substrate according to a first modified example, and FIG. 1B is a graph showing a plurality of pieces of relationship information corresponding to the first arrangement state of a substrate according to the first modified example. [Figure 14] 1A is a diagram showing a second arrangement state of the substrate according to the first modified example, and FIG. 1B is a graph showing a plurality of pieces of relationship information corresponding to the second arrangement state of the substrate according to the first modified example. [Figure 15] FIG. 10 is a diagram showing recipe information according to a second modified example of the first embodiment. [Figure 16] 10 is a flowchart showing a substrate processing method according to a second modified example. [Figure 17] FIG. 10 is a schematic view showing a substrate processing system according to a second embodiment of the present invention. [Figure 18] FIG. 10 is a diagram showing recipe information according to the second embodiment. [Figure 19] 10 is a flowchart showing a substrate processing method according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0025] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The same reference numerals are used for the corresponding parts and the description will not be repeated. For ease of illustration, the X-axis, Y-axis, and Z-axis are shown as appropriate. The axes are perpendicular to each other, the X and Y axes are parallel to the horizontal direction, and the Z axis is parallel to the vertical direction. .

[0026] (Embodiment 1) A substrate processing apparatus 1 according to a first embodiment of the present invention will be described with reference to FIGS. 1 is a schematic cross-sectional view showing a substrate processing apparatus 1. The substrate processing apparatus 1 shown in FIG. At least one substrate W is treated with the treatment liquid LQ at each time. In other words, N substrates W in one lot can be processed at once. The maximum number of sheets is N. In this specification, "N" is an integer of 2 or more. "N" is, for example, an integer of 10 or more, an integer of 20 or more, an integer of 25 or more, an integer of 40 or more, or It may be an integer of 50 or more. In the first embodiment, an example where N=50 is given. The minimum number of substrates W in the process is one.

[0027] In the first embodiment, the substrate W is a semiconductor wafer. Substrates for plasma displays, field emission displays (Field Emission Displays) FED (Flip-Screen Display) substrates, optical disk substrates, magnetic disk substrates, Magneto-optical disk substrates, photomask substrates, ceramic substrates, or solar cell substrates In the first embodiment, the surface of the substrate W refers to the main surface of the substrate W.

[0028] The substrate processing apparatus 1 includes a processing tank 100, a substrate holder 110, and a plurality of circulating processing liquid supply members. 120, a circulation unit 130, at least one chemical supply unit 140, and a diluent supply unit 150. , a drainage section 160, and a control device 170.

[0029] The processing tank 100 stores the processing liquid LQ. In the example of FIG. 1, the processing liquid LQ is a chemical The chemical solution supply unit 140 supplies the chemical solution to the treatment tank 100. The diluent supply unit 150 supplies the diluent to the treatment tank 100 .

[0030] The chemical solution is, for example, an etching solution. The chemical solution is, for example, dilute hydrofluoric acid (DHF), Hydrofluoric acid (HF), hydrofluoric nitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol) , phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia water, hydrogen peroxide water, organic acids ( For example, citric acid, oxalic acid), organic alkali (for example, TMAH: tetramethylammonium Sulfuric acid / hydrogen peroxide mixture (SPM), ammonia / hydrogen peroxide Primary water mixture (SC1), hydrochloric acid hydrogen peroxide mixture (SC2), isopropyl alcohol ( IPA), surfactants, corrosion inhibitors, or hydrophobizing agents.

[0031] The diluent is typically deionized water. The diluent may be, for example, carbonated water or electrolytic ionized water. , hydrogen water, ozone water, or diluted salt (for example, 10 ppm to 100 ppm) The diluted solution may be an acid solution. The diluted solution is also used as a rinse solution. The rinse solution is the processing solution LQ. , a liquid for washing away by-products and / or foreign matter from the substrate W after processing with the processing liquid LQ. is.

[0032] The substrate holder 110 holds the substrate W and immerses the substrate W in the processing liquid LQ stored in the processing bath 100. The plurality of circulating treatment liquid supply members 120 supply the treatment liquid LQ to the treatment tank 100. The circulation unit 130 circulates the processing liquid LQ stored in the processing tank 100. The drain part 160 supplies the circulating treatment liquid to each of the circulating treatment liquid supply members 120. Discharge LQ.

[0033] Next, details will be described with reference to Figures 1 and 2. As shown in Figure 1, the treatment tank 100 includes: It has a double tank structure including an inner tank 101 and an outer tank 103. The inner tank 101 and the outer tank 103 Each of the inner tanks 101 has an upper opening that opens upward. The outer tank 103 is configured to be able to accommodate a substrate W. The outer tank 103 is provided on the outer surface of the upper opening of the inner tank 101. The processing liquid LQ that has spilled over the upper edge of the inner tank 101 is collected by the outer tank 103.

[0034] The substrate holder 110 holds at least one substrate W. Specifically, the substrate holder 110 can hold N substrates W in one lot. The substrate holder 110 holds the substrate W. The substrate holder 110 is placed in the processing liquid LQ stored in the processing bath 100. The substrates W in one lot are immersed in the processing liquid LQ. It's W.

[0035] FIG. 2(a) is a perspective view showing the state of the substrate holder 110 before the substrate W is immersed in the processing liquid LQ. 2(b) is a perspective view of the substrate holder 110 in a state where the substrate W is immersed in the processing liquid LQ. 2 is a perspective view showing the processing tank 10 in order to avoid overcomplicating the drawing. The processing liquid LQ of 0 is omitted.

[0036] As shown in FIGS. 1 and 2(a), the substrate holding unit 110 includes a main body plate 111 and a plurality of holding members. The main body plate 111 includes a rod 113 and a lifting unit 115. The main body plate 111 is a plate extending in the vertical direction Dz. The holding rod 113 extends from one main surface of the body plate 111 in a first direction D10. The substrates W are aligned in the first direction D10 at intervals and are held by a plurality of holding rods 113. The lower edges of the substrates W are abutted against each other and held in a vertical position.

[0037] The first direction D10 is approximately parallel to the horizontal direction and indicates the arrangement direction of the plurality of substrates W. is substantially perpendicular to the first direction D10. The substrate W is also substantially perpendicular to the second direction D20. The second direction D20 is substantially perpendicular to the first direction D10 and is substantially parallel to the horizontal direction.

[0038] The first direction D10 corresponds to an example of the "predetermined direction" of the present invention.

[0039] The lifting unit 115 can move between a retracted position shown in FIG. 2(a) and a processing position shown in FIG. 2(b). The main body plate 111 is raised and lowered between the two positions. The processing position is located above the processing tank 100 (specifically, the inner tank 101). The substrate W held by the rod 113 is placed in the processing bath 100 (specifically, the inner bath 101). The main body plate 111 is moved from the retracted position to the processing position by the lifting unit 115. As a result, the plurality of substrates W held by the holding rods 113 are immersed in the processing liquid LQ. will be done.

[0040] Returning to FIG. 1, the plurality of circulating treatment liquid supply members 120 are arranged to supply the treatment liquid to the inner tank 101 of the treatment tank 100. The plurality of circulating treatment liquid supply members 120 are arranged inside the inner tank 101 of the treatment tank 100. In this portion, the circulating treatment liquid supply member 120 is disposed at the bottom of the inner tank 101. Specifically, each circulating treatment liquid supply member 120 has a plurality of treatment liquid outlets 121. The circulating treatment liquid supply member 120 supplies the treatment liquid LQ from a plurality of treatment liquid outlets 121 to the inner tank 1. Supply to 01.

[0041] The circulation section 130 includes a pipe 131, a pump 132, a heater 133, a filter 134, and a conditioning The pump 132, heater 133, and filter are included. The valve 134, the adjusting valve 135 and the valve 136 are arranged in this order from the upstream to the downstream of the pipe 131. is positioned towards

[0042] The pipe 131 guides the processing liquid LQ sent out from the processing tank 100 back into the processing tank 100. Specifically, the upstream end of the pipe 131 is connected to the outer tank 114. Therefore, the pipe 131 is The processing liquid LQ is guided from the outer tank 114 to the circulating processing liquid supply member 120. A plurality of circulating treatment liquid supply members 120 are connected.

[0043] The pump 132 sends the processing liquid LQ from the pipe 131 to the plurality of circulating processing liquid supply members 120. Therefore, the circulating treatment liquid supply member 120 circulates the treatment liquid LQ supplied from the pipe 131 to the inner tank 1. 01. The filter 134 filters the treatment liquid LQ flowing through the pipe 131.

[0044] The heater 133 heats the temperature of the processing liquid LQ flowing through the pipe 131. The temperature control unit 133 adjusts the temperature of the processing liquid LQ.

[0045] The adjusting valve 135 adjusts the opening of the pipe 131 to supply the circulating treatment liquid to the plurality of circulating treatment liquid supply members 120. The valve 136 opens and closes the pipe 131.

[0046] The chemical liquid supply unit 140 includes a nozzle 142, a pipe 144, and a valve 146. The nozzle 142 discharges the chemical solution into the outer tank 103. The nozzle 142 is connected to a pipe 144. The chemical solution is supplied from the chemical solution supply source TKA to the pipe 144. The pipe 144 is connected to a valve 146. When the valve 146 is opened, the chemical solution is first discharged from the nozzle 142. It is supplied into the tank 103.

[0047] The diluent supply unit 150 includes a nozzle 152, a pipe 154, and a valve 156. The nozzle 152 discharges the diluted solution into the outer tank 103. The nozzle 152 is connected to a pipe 154. The pipe 154 is supplied with diluent from a diluent supply source TKB. When the valve 156 is opened, the diluted solution is discharged from the nozzle 152. Then, the diluting solution is supplied into the outer tank 103 .

[0048] The drainage section 160 includes a drainage pipe 161 and a valve 163. A drainage pipe 161 is connected to the bottom wall of the container 1. A valve 163 is provided in the drainage pipe 161. When the valve 163 is opened, the processing liquid LQ stored in the inner tank 101 is discharged to the drain. It is discharged to the outside through a pipe 161.

[0049] The control device 170 controls each component of the substrate processing apparatus 1. Specifically, the control device 170 The substrate holder 110, the circulation unit 130, the chemical supply unit 140, the diluent supply unit 150, and The control device 170 controls the drainage unit 160. The control device 170 is, for example, a computer.

[0050] The control device 170 also determines the etching rate based on the relationship between the number of substrates W in one lot and the etching rate. The processing time of the substrate W is corrected accordingly.

[0051] FIG. 3 is a graph showing the relationship between the number of substrates W in one lot and the etching rate. The etching rate is the amount of etching per unit time of the substrate W. The vertical axis of the graph indicates the number of substrates W in one lot. The vertical axis of the graph indicates the etching rate of the substrates W. In Figure 3, the etching time when 50 substrates W, which is the maximum number N in one lot, are processed in a batch is The etching rate is set to 100%, and the etching rate is calculated for each number of substrates W that make up one lot. The processing time with the processing liquid LQ in the processing tank 100 is the number of substrates W in one lot. Regardless, it is the same.

[0052] As shown in FIG. 3, the fewer the number of substrates W in one lot, the higher the etching rate. Therefore, if the processing time is constant regardless of the number of substrates W in one lot, The smaller the value, the greater the amount of etching. This results in over-etching and the target etch In particular, when it is required to etch the substrate W minutely, the target etching amount Even if the amount exceeding the coating amount is minute, the quality of the substrate W is greatly affected.

[0053] Therefore, in the first embodiment, the control device 170 determines whether the number of substrates W in a lot is the maximum number N. The processing time is set shorter as the number of substrates W in one lot is smaller than the processing time when do.

[0054] As an example, the control device 170 may perform processing when the number of substrates W in one lot is the maximum number N. A correction value is determined for the processing time according to the number of substrates W in one lot. The correction value is set to zero or more. The correction value is set to a larger value as the number of substrates W in one lot is smaller. When the number of substrates W in one lot is the maximum number N, the correction value for the processing time of substrates W is zero. Therefore, the control device 170 performs processing when the number of substrates W in one lot is the maximum number N. A correction value corresponding to the number of substrates W is subtracted from the time, and the subtraction result is set as the corrected processing time. The smaller the number of substrates W in one lot, the larger the correction value is set. The fewer the number of substrates W in the processing chamber, the shorter the processing time after correction.

[0055] However, as shown in FIG. 3, the number of substrates W in one lot and the etching rate are not proportional to each other. Therefore, the correction is made at a constant rate from the maximum number of pieces N in one lot to the minimum number (1 piece). Simply increasing the value linearly does not allow for precise etching. In the first embodiment, the relationship between the number of substrates W in one lot and the correction value is as follows: Define multiple relationships depending on the scope.

[0056] Below, the correction value is linearly increased at a constant slope from the maximum number of pieces in one lot, N, to the minimum number (1 piece). In this specification, the monotonically increasing of the correction value may be referred to as a "monotonically increasing correction value." Here, the processing of the substrate W typically refers to an etching process.

[0057] FIG. 4 is a diagram showing an example of a plurality of pieces of relationship information 41n according to the first embodiment. In the above, "n" included in the reference symbol indicates an integer of 1 or more. , are different from each other. In the example of Figure 4, n=1, 2, 3, 4. In other words, Figure 4 is Four pieces of relationship information 411, 412, 413, and 414 are shown.

[0058] The relationship information 411 indicates the relationship between the number x1 of substrates W and the correction value y1 of the processing time of the substrates W. The relationship information 411 indicates whether the number of substrates W in one lot to be processed falls within the number range (M1≧x1 >N). The relationship information 411 is applied when the function "y1 = f(x1)" is included in the Therefore, it is shown.

[0059] The relationship information 412 indicates the relationship between the number x2 of substrates W and the correction value y2 of the processing time for substrates W. The relationship information 412 indicates whether the number of substrates W in one lot to be processed falls within the number range (M2 ≧ x2 > M1). The relationship information 412 is applied when it is included in the function "y2 = f(x2)" is shown by

[0060] The relationship information 413 indicates the relationship between the number x3 of substrates W and the correction value y3 of the processing time for substrates W. The relationship information 413 indicates whether the number of substrates W in one lot to be processed falls within the number range (M3≧x3 >M2). The relationship information 413 is applied when it is included in the function "y3 = f(x3)" is shown by

[0061] The relationship information 414 is a table showing the relationship between the number of substrates W in one lot (M4≧x4>M3). The relationship information 414 shows the relationship between the number x4 of substrates W and the correction value y4 of the processing time of the substrates W. When the number of substrates W in one lot to be processed is within the number range (M4≧x4>M3), The relationship information 414 is represented by the function "y1=f(x4)".

[0062] "N" indicates the maximum number of substrates W in one lot. , "M4" is a natural number less than N. Also, M4 <M3<M2<M1<N、である。

[0063] The function indicating the relationship information 41n can be generalized as yn=f(xn). "n" indicates the number of substrates W in one lot, and "yn" indicates a correction value. The correction value yn is a positive value. Processing when the number of substrates W in one lot is the maximum number N If the time is written as "Tp" and the corrected processing time is written as "Tc", the corrected processing time is is shown by equation (1).

[0064] Tc = Tp - yn ... (1)

[0065] The control device 170 selects the substrates W of one lot to be processed from the plurality of pieces of relationship information 41n. One relationship information 41n is selected according to the number xn of sheets, and Specifically, the control device 170 corrects the processing time of the substrate W based on the selected relationship information. 41n, a correction value yn corresponding to the number xn of substrates W is obtained, and the corrected processing value is calculated from equation (1). Calculate the time.

[0066] Next, the correction of the processing time will be described in detail with reference to Figs. 4 and 5. Fig. 5 shows the control device 5, the control device 170 includes a control unit 171 and , a storage unit 172, an input unit 173, and a display unit 174. The substrate processing apparatus 1 also includes: A substrate detection unit 180 may also be provided.

[0067] The input unit 173 is an input device for inputting various information to the control unit 171. The input unit 173 may be, for example, a keyboard and a pointing device, or a touch panel. be.

[0068] The display unit 174 displays various information. The display unit 174 may be, for example, a liquid crystal display, Or, it is an organic electroluminescence display.

[0069] The control unit 171 controls each component of the substrate processing apparatus 1. The control unit 171 controls the selection unit 21 and The control unit 171 includes a correction unit 22, an immersion control unit 23, and a setting unit 24. The control unit 171 may further include a CPU (Central Processing Unit). This includes processors such as the ng Unit.

[0070] The storage unit 172 stores various data. For example, the storage unit 172 stores lot information 31 and The recipe information 32 defines the processing contents and processing procedures for the substrate W. The recipe information 32 may be displayed on the display unit 174. indicates information about the lot to be processed. The lot information 31 may be displayed on the display unit 174. The lot information 31 includes lot identification information 311 and substrate number information 312. The other information 311 is information for identifying the lot to be processed. , indicates the number of substrates W included in the lot identified by the lot identification information 311. The substrate number information 312 indicates the number of substrates W in one lot. The substrate arrangement information 313 may include the arrangement of the substrates W in the lot. The board layout information 313 will be explained in the first modified example below.

[0071] The storage unit 172 stores various computer programs. For example, the storage unit 172 stores , and stores a computer program 33 for executing the substrate processing method. In the method, at least one substrate is placed for each lot in a processing tank 100 that stores the processing liquid LQ. The substrate W is treated by immersing it in the treatment liquid LQ.

[0072] The storage unit 172 includes a storage device. For example, the storage unit 172 includes a main memory such as a semiconductor memory. The storage unit includes a storage device and auxiliary storage devices such as semiconductor memory and hard disk drives. The storage unit 172 may include a removable medium such as an optical disk. 1 is an example of a non-transitory computer-readable storage medium.

[0073] The processor of the control unit 171 is a computer that stores the information stored in the storage device of the storage unit 172. The control unit 171 executes a program to control each component of the substrate processing apparatus 1. For example, the control unit 171 , the computer program 33 is executed to select the selection unit 21, the correction unit 22, and the immersion control unit 23. and the setting unit 24. The control unit 171 executes the computer program 33. Executing this, a selection unit 21, a correction unit 22, an immersion control unit 23, a setting unit 24, and a counting unit 25 are It may also function as a

[0074] The selection unit 21 acquires the substrate number information 312 from the storage unit 172. is selected from the plurality of pieces of relationship information 41n shown in FIG. 4 by the number of substrates information 312. The relationship information 41n corresponding to the number xn of substrates W to be processed is selected. , compared with the case where the correction value is monotonically increased, the number of substrates W of the number xn indicated by the substrate number information 312 In other words, it is possible to select the relationship information 41n that is more suitable for the processing of the substrates in the processing target lot. It is possible to select the relationship information 41n that is more suitable for the number xn of W sheets.

[0075] The correction unit 22 calculates the number of substrates indicated by the substrate number information 312 from the selected relationship information 41n. Therefore, according to the first embodiment, the correction value yn is obtained according to the number xn of the substrates W to be processed. Compared with the case where the value is monotonically increased, the number of substrates W processed is xn, which is indicated by the substrate number information 312. In other words, the number of substrates W in the lot to be processed xn Therefore, a more suitable correction value yn can be obtained.

[0076] The correction unit 22 adjusts the processing time to be longer than the processing time when the number of substrates W in the lot is the maximum number N. The processing time of the substrate W is corrected based on the obtained correction value yn so that the processing time is shortened. In this case, the correction unit 22 corrects the processing time based on the formula (1). is the processing time for the number of substrates W in a lot compared to the maximum number N. The smaller the number xn of substrates, the shorter the processing time. Therefore, according to the first embodiment, the correction value is monotonically increased. In comparison, a processing time more suitable for processing the number xn of substrates W indicated by the substrate number information 312 is In other words, it is possible to set a processing time that is more suitable for the number xn of substrates W in the processing lot. It can be determined.

[0077] The immersion control unit 23 determines the time during which the substrate W is immersed in the processing liquid LQ according to the corrected processing time for the substrate W. As a result, the substrate holder 110 is controlled so that the corrected processing time for the substrate W is The substrate W is then processed by the processing liquid LQ in the processing bath 100. According to the above, compared to the case where the correction value is monotonically increased, the number of substrates W in the lot to be processed x For example, the substrate W can be processed accurately according to the number n of the lot to be etched. The substrates W can be etched with high precision according to the number xn of the substrates W. Even when minute etching is required, the etching amount is As a result, when the target etching amount is minute, the target etching amount can be suppressed. In addition, the amount of substrates W that are discarded due to the etching amount exceeding the target amount can be reduced. This prevents etching residues from being mixed in excessively with the processing liquid LQ. As a result, the frequency of discarding the processing liquid LQ can be reduced.

[0078] In the first embodiment, each of the plurality of pieces of relationship information 41n is set to the number x of substrates W in one lot. n and the correction value yn for the processing time of the substrate W. It is not necessary to prepare a correction table for each range of the number of sheets W. As a result, the correction value yn The correction table can be easily constructed to obtain the number of substrates W in one lot x 10 is a table showing the relationship between n and the correction value yn of the processing time of the substrate W. In this case, the relationship information 41n is preferably a function, but may also be a correction table. stomach.

[0079] Typically, the relationship information 41n is a linear function represented by the formula (2). " indicates the slope, and "bn" indicates the intercept. In embodiment 1, the slope an indicates a negative value.

[0080] yn=an·xn+bn …(2)

[0081] Furthermore, in the first embodiment, four pieces of relationship information 41n are set. The correction value corresponding to the change in etching rate with respect to the number of plates W (Fig. 3) is calculated using a relatively small number This can be obtained by the relationship information 41n.

[0082] Continuing to refer to FIG. 5, the board detection unit 180 and the counting unit 25 will be described. The substrate detection unit 180 detects the substrates W one by one in the lot to be processed. Every time a substrate W is detected, a substrate detection signal is output to the control unit 171. For example, 180 is an optical sensor, and detects a container ( While moving in the vertical direction Dz in a moving object (not shown), the substrates W are optically detected one by one.

[0083] The counter 25 counts the substrate detection signal output by the substrate detector 180 every time the substrate W is detected. By counting the number of substrates W in the lot to be processed, the counting unit 25 detects the number of substrates W in the lot to be processed. The storage unit 172 stores substrate number information 312 indicating the number of substrates W in the lot to be processed. Furthermore, the counting unit 25 counts the arrangement of the substrates W in the lot to be processed based on the substrate detection signal. In this case, the counting unit 25 may detect the arrangement of the substrates W in the lot to be processed. The board arrangement information 313 shown in FIG.

[0084] Next, an example of the correction value of the processing time will be described with reference to FIGS. 5 and 6. FIG. 6(a) shows the correction value of the processing time. 10 is a graph showing a plurality of pieces of relationship information 41n corresponding to a first example of the chip information 32. The horizontal axis indicates the number of substrates W in one lot. The vertical axis of the graph indicates the correction value ( 6(b) is a diagram showing a first example of the recipe information 32.

[0085] As shown in FIG. 6(a), for example, each of the plurality of pieces of relationship information 41n is represented by a linear function. The plurality of pieces of relationship information 41n are defined by a plurality of reference points Pn that are different from each other. In the example of FIG. 6(a), the plurality of pieces of relationship information 41n are set based on a plurality of mutually different reference points. The reference point Pn is defined by a fixed point P and a reference point P. The reference point Pn is variable.

[0086] Specifically, each of the plurality of pieces of relationship information 41n is defined by one or more reference points Pn. The reference point Pn indicates the end point of the relationship information 41n. 412 to 414 are defined by two reference points Pn. It is defined by the reference point Pn and the fixed point P. The fixed point P is the point where the correction value is zero. The end points of the relationship information 411 are shown.

[0087] The relationship information 41n shown in FIG. 6(a) is defined in the recipe information 32 shown in FIG. It has been done.

[0088] As shown in FIG. 6(b), the recipe information 32 includes relationship definition information 51 and processing condition information. The relationship definition information 51 includes reference point board number information 52 and reference point correction value information 54. The reference point Pn in FIG. 6(a) includes the reference point substrate number information 52 and the reference point correction value information The processing condition information 54 is determined by the processing time information 55 and the processing time correction information 56. 57. The recipe information 32 may include relationship information 41n.

[0089] The plurality of reference point substrate number information 52 defines a plurality of reference points Pn. Each piece of point substrate number information 52 indicates the number of substrates W that define the corresponding reference point Pn. In this case, the number of substrates W indicates the number of substrates W in one lot.

[0090] In detail, each of the relationship information 412 to 414 other than the relationship information 411 is based on two reference points. It is specified by the substrate number information 52. For example, as shown in FIGS. 6(a) and 6(b), The relationship information 412 includes the number M1 and the number M2 indicated by the reference point board number information 52. The relationship information 411 is defined by one reference point board number information 52 and a fixed point base The fixed point substrate number information is the number of substrates W at the fixed point P. For example, the relationship information 411 indicates the maximum number N of boards that is determined by the reference point board number information 52. The number of boards M1 indicated by the fixed point board number information and the maximum number N indicated by the fixed point board number information are specified. can be.

[0091] The plurality of pieces of reference point correction value information 53 respectively define a plurality of reference points Pn. Each of the correction value information 53 indicates a correction value for the processing time of the substrate W that defines the corresponding reference point Pn. In other words, the reference point correction value information 53 is the number of reference point substrates indicated by the reference point substrate number information 52. 4 shows the correction value of the processing time for the substrate W.

[0092] In detail, each of the relationship information 412 to 414 other than the relationship information 411 is based on two reference points. It is defined by the correction value information 53. For example, as shown in FIGS. 6(a) and 6(b), The relationship information 412 includes the correction values ​​Q1 and Q2 indicated by the reference point correction value information 53. The relationship information 411 is defined by one reference point correction value information 53 and a fixed point correction value information 54. The fixed point correction value information is a correction value for the processing time at the fixed point P. For example, the relationship information 411 indicates a certain "zero" indicated by the reference point correction value information 53. The correction value Q1 is specified by the correction value Q2 indicated by the fixed point correction value information and the correction value (zero) indicated by the fixed point correction value information. do.

[0093] The user inputs the numbers M1 to M of the substrates W in the reference point substrate number information 52 using the input unit 173. 4 and the correction values ​​Q1 to Q4 of the reference point substrate number information 52. The setting unit 24 receives input of the numbers M1 to M4 and the correction values ​​Q1 to Q4. M1 to M4 and correction values ​​Q1 to Q4 are set in the recipe information 32. The unit 173 calculates the maximum number N of the fixed point substrate number information and the correction value (zero) of the fixed point correction value information. Enter (b).

[0094] The relationship information 41n is generated by the setting unit 24 by inputting the reference point substrate number information 52, the reference point correction value information Based on information 53, fixed point board number information (maximum number N), and fixed point correction value information (zero), The relationship information 41n is then stored in the storage unit 172.

[0095] For example, the setting unit 24 may determine that the relationship information 412 is a linear function (y2=a2·x2+b2). In this case, the numbers M1 and M2 of the reference point substrate number information 52 and the correction value Q of the reference point correction value information 53 Based on Q1 and Q2, the slope a2 and the intercept b2 are calculated. As a result, the relationship information 414 is It is derived.

[0096] For example, the setting unit 24 may determine that the relationship information 411 is a linear function (y1=a1·x1+b1). In this case, the number M1 of the reference point board number information 52, the maximum number N of the fixed point board number information, Based on the correction value Q1 of the correction value information 53 and the correction value (zero) of the fixed point correction value information, the gradient As a result, the relationship information 411 is derived.

[0097] The processing time information 55 indicates the processing time of the substrate W before correction. 5 indicates the processing time when the number of substrates W in one lot is the maximum number N. This is because when the number of plates W indicates the maximum number N, the correction value is zero.

[0098] The processing time correction information 57 is related to the processing time indicated by the processing time information 55. For example, "valid" indicates that correction processing is to be performed based on the information 41n. "Invalid" indicates that correction processing is not performed.

[0099] Continuing with reference to FIG. 6, a specific example of correction of the processing time will be described. As shown in FIG. 6(a), The number of substrates W in one lot to be processed, as indicated by the substrate number information 312, is 20. If there is, the selection unit 21 selects the relationship information 413 from the plurality of relationship information 411 to 414. Select .

[0100] Then, the correction unit 22 determines from the relationship information 413 that the number of substrates W in one lot is 20. Specifically, the correction unit 22 obtains the correction value (62 seconds) when the relationship information 413 is Enter "20" for the number of substrates W, "x3," in formula (2) shown below, and enter "6" as the correction value, "y3." 2 seconds”.

[0101] Furthermore, the correction unit 22 corrects the processing time indicated by the processing time information 55 of the recipe information 32 shown in FIG. The correction value (62 seconds) is subtracted from the time (500 seconds), and the subtraction result (438 seconds) is used as the corrected processing time. Specifically, the correction unit 22 sets the processing time "Tp" in the formula (1) to "500 Enter "62 seconds" for the correction value "y3" and set the corrected processing time as "Tc". and get "438 seconds".

[0102] As described above with reference to FIGS. 5 and 6, according to the first embodiment, the setting unit 24: Input of a plurality of reference point substrate number information 52 that respectively defines a plurality of reference points Pn is accepted. Therefore, the user can check the performance of the substrate W processed by the substrate processing apparatus 1 (for example, the etching level). By changing the reference point board number information 52 based on the results of the test, the relationship information 41n is As a result, the user can set more appropriate relationship information 41n.

[0103] Furthermore, according to the first embodiment, the setting unit 24 sets a plurality of reference points Pn. The input of the reference point correction value information 53 is accepted. The reference point correction value information 5 is calculated based on the processing results of the substrate W (for example, the etching rate results). 3, the relationship information 41n can be changed. Therefore, more appropriate relationship information 41n can be set.

[0104] Furthermore, according to the first embodiment, the reference point correction value information 53 is based on the relationship information 41n. Defines the range of the number of substrates W. For example, as shown in FIG. 4, The number of substrates W to be processed is greater than the number M1 and is equal to or less than the number M2. By changing the reference point correction value information 53, the relationship information 41n of the substrate W to which the relationship information 41n is applied can be As a result, the user can set more appropriate relationship information 41n. It can be determined.

[0105] Furthermore, according to the first embodiment, when the number of substrates W in one lot is the maximum number N, The correction value of the processing time of the substrate is zero. The smaller the number of substrates W, the larger the correction value for the processing time of the substrates W. The substrate number information 31 is calculated from the processing time of the substrates W when the number of substrates W in the batch indicates the maximum number N. By subtracting the correction value according to the number of substrates W indicated by 2, the processing time of the substrates W can be Therefore, according to the first embodiment, the number of substrates W in one lot is the maximum number N. If there are many batches, the number of batches to be corrected can be reduced when processing multiple batches. As a result, the processing load on the control device 170 can be reduced.

[0106] Next, an example of setting the reference point correction value information 53 will be described with reference to FIGS. 5 to 7. FIG. 7(a) shows 7 is a graph showing a plurality of pieces of relationship information 41n corresponding to the second example of the recipe information 32. 10B is a diagram showing a second example of the recipe information 32. In the second example, the recipe information 32 is based on the standard The correction values ​​of the reference point correction value information 53 are changed from the correction values ​​of the reference point correction value information 53 of the first example shown in FIG. It will be changed.

[0107] 6 and 7, the user can see that the reference point correction value information 5 in the recipe information 32 is 3, the relationship information 41n can be changed.

[0108] For example, the correction values ​​Q1 (=100) and Q2 (=80) of the reference point correction value information 53 in FIG. 6(b) ), Q2 (=50), and Q4 (=10) are respectively used as the reference point correction value information 53 in FIG. Change the correction values ​​to Q1 (=80), Q2 (=70), Q2 (=60), and Q4 (=30). 6(a) and 7(b) are the relationship information 411 to 414. You can change it to 14.

[0109] Specifically, the user inputs the correction value of the reference point correction value information 53 through the input unit 173. The setting unit 24 receives the input of the correction value of the reference point correction value information 53. sets the correction value of the reference point correction value information 53 in the recipe information 32. As a result, the relationship information 41n will be changed.

[0110] Continuing with reference to FIG. 7, a specific example of correction of the processing time will be described. As shown in FIG. 7(a), The number of substrates W in one lot to be processed, as indicated by the substrate number information 312, is 30. If there is, the selection unit 21 selects the relationship information 412 from the plurality of relationship information 411 to 414. Select .

[0111] Then, the correction unit 22 determines from the relationship information 412 that the number of substrates W in one lot is 30. The correction value (48 seconds) is obtained (see formula (2)).

[0112] Furthermore, the correction unit 22 corrects the processing time indicated by the processing time information 55 of the recipe information 32 shown in FIG. The correction value (48 seconds) is subtracted from the time (500 seconds), and the subtraction result (452 ​​seconds) is used as the corrected processing time. The time is set to the processing time (see formula (1)).

[0113] Next, an example of setting the number of pieces of relationship information 41n will be described with reference to FIGS. FIG. 8(a) is a graph showing a plurality of pieces of relationship information 41n corresponding to the third example of the recipe information 32. FIG. 8(b) is a diagram showing a third example of the recipe information 32. In the third example, the relationship information In FIG. 6(a), the number of relationship information 41n is "4". In 8(a), the number of pieces of relationship information 41n is "2".

[0114] The user sets a first specific value for the reference point correction value information 53 shown in FIG. 8(b). As a result, the number of pieces of relationship information 41n can be reduced as shown in FIG. In the third example, the first specific value is zero. In the third example, the correction value of the reference point correction value information 53 is Q3 and Q2 are set to the first specific value. Therefore, the number of pieces of relationship information 41n is ) to "2" in the third example of FIG. 8(a). Then, input of the first specific value is accepted for the correction values ​​Q1 to Q3 of the reference point correction value information 53. It is possible.

[0115] For example, the correction values ​​Q2 (=50) and Q3 (=80) of the reference point correction value information 53 in FIG. 6(b) are respectively the correction values ​​Q2 (=0) and Q3 (=0) of the reference point correction value information 53 in FIG. 8(b). By changing the four pieces of relationship information 411 to 414 in FIG. 6(a) into two pieces of relationship information in FIG. 8(b), The relationship information 411 and 414 can be reduced to the above.

[0116] In this case, the relationship information 414 includes the number M1 indicated by the reference point board number information 52, M4 and the correction values ​​Q1 and Q4 indicated by the reference point correction value information 53. do.

[0117] Specifically, the user inputs, via the input unit 173, one of the plurality of pieces of reference point correction value information 53. The first specific value is input as the reference point correction value information 53 for which the setting of the first specific value is permitted. The setting unit 24 receives an input of a first specific value. The setting unit 24 sets the first specific value as a recipe. As a result, the reference point correction value information 53 The relationship information 41n corresponding to the indicated first specific value is deleted or invalidated. The number of pieces of sexual information 41n can be changed.

[0118] Continuing with reference to FIG. 8, a specific example of correction of the processing time will be described. As shown in FIG. 8(a), The number of substrates W in one lot to be processed, as indicated by the substrate number information 312, is 20. If there is, the selection unit 21 selects the relationship information 414 from the plurality of relationship information 411 and 414. Select .

[0119] Then, the correction unit 22 determines from the relationship information 414 that the number of substrates W in one lot is 20. The correction value (52 seconds) is obtained when the time is reached (see formula (2)).

[0120] Furthermore, the correction unit 22 corrects the processing time indicated by the processing time information 55 of the recipe information 32 shown in FIG. The correction value (52 seconds) is subtracted from the time (500 seconds), and the subtraction result (448 seconds) is used as the corrected processing time. The time is set to the processing time (see formula (1)).

[0121] As described above with reference to FIGS. 5 and 8, according to the first embodiment, the setting unit 24: The input of the first specific value that sets the number of the plurality of pieces of relationship information 41n is accepted. As a result, the number of pieces of relationship information 41n that are more appropriate for the user can be changed. The number of n can be set.

[0122] The first specific value corresponds to an example of the "number setting information" of the present invention.

[0123] Next, the invalid setting of the relationship information 41n will be described with reference to Fig. 5 and Fig. 9. ) is a graph showing a plurality of pieces of relationship information 41n corresponding to the fourth example of the recipe information 32. 9B is a diagram showing a fourth example of the recipe information 32. In the fourth example, all the relationship information 41n is disabled, i.e. no processing time correction is performed.

[0124] The user selects the second specific value as the correction value Q4 of the reference point correction value information 53 shown in FIG. By setting the above, all the relationship information 41n can be invalidated as shown in FIG. 9(a). In other words, the processing time can be corrected independently of the number of substrates W in one lot. In the fourth example of FIG. 9(b), the second specific value is set to zero and no correction is performed. In the fourth example, the second specific value is input for the correction value Q4 of the reference point correction value information 53. It is acceptable.

[0125] For example, as shown in FIG. 9(b), when the correction value Q4 of the reference point correction value information 53 is set to zero, By doing so, all the relationship information 411 to 414 can be invalidated.

[0126] Specifically, the user inputs the correction value Q4 of the reference point correction value information 53 via the input unit 173. The setting unit 24 receives the input of the second specific value. 24 sets the second specified value as the correction value Q4 of the reference point correction value information 53 of the recipe information 32. As a result, all the relationship information 41n is set to be invalid. In this case, the setting unit 24 The processing time correction information 57 is set to "invalid" indicating that correction processing is not performed.

[0127] On the other hand, unless the second specific value is set as the correction value Q4 of the reference point correction value information 53, The setting unit 24 sets the processing time correction information 57 to "valid", which indicates that correction processing is to be performed. do.

[0128] As described above with reference to FIGS. 5 and 9, according to the first embodiment, the setting unit 24: The input of the second specific value that disables the function of correcting the processing time of the substrate W is accepted. The function for correcting the processing time of the substrate W can be disabled, thereby improving user convenience. do.

[0129] The second specific value corresponds to an example of the "invalid setting information" of the present invention.

[0130] Next, an example of setting the reference point board number information 52 will be described with reference to FIGS. 5, 6, and 10. FIG. 10(a) shows a plurality of pieces of relationship information 41n corresponding to the fifth example of the recipe information 32. 10(b) is a diagram showing a fifth example of the recipe information 32. In the fifth example, The number of substrates W in the reference point substrate number information 52 of the recipe information 32 is the reference point of the first example shown in FIG. The number of substrates W in the substrate number information 52 is changed.

[0131] 6 and 10, the user can see that the number of reference point substrates in the recipe information 32 is By changing the information 52, the relationship information 41n can be changed.

[0132] For example, the number of substrates W in the reference point substrate number information 52 in FIG. 6(b) is M2 (=25), M3 ( =13) are respectively converted into the number M2 (= 10), M3 (= 18), the relationship information 412 to 414 in FIG. 6(a) is changed to The relationship information can be changed to the relationship information 412 to 414 in FIG. 10(b).

[0133] Specifically, the user inputs the number of substrates W in the reference point substrate number information 52 using the input unit 173. The setting unit 24 receives the input of the number of substrates W in the reference point substrate number information 52. The setting unit 24 sets the number of substrates W in the reference point substrate number information 52 in the recipe information 32. As a result, the relationship information 41n is changed.

[0134] Continuing with reference to FIG. 10, a specific example of correction of the processing time will be described. In this way, the number of substrates W in one lot to be processed, as indicated by the substrate number information 312, is 20. If the number of pieces of relationship information is 411 to 414, the selection unit 21 selects the relationship information 411 to 414 from the plurality of pieces of relationship information 411 to 414. Select 12.

[0135] Then, the correction unit 22 determines from the relationship information 412 that the number of substrates W in one lot is 20. The correction value (48 seconds) is obtained (see formula (2)).

[0136] Furthermore, the correction unit 22 corrects the processing time indicated by the processing time information 55 of the recipe information 32 shown in FIG. The correction value (48 seconds) is subtracted from the processing time (500 seconds), and the subtraction result (452 ​​seconds) is used as the corrected time. Set to the processing time (see equation (1)).

[0137] Next, the substrate processing method according to the first embodiment will be described with reference to FIGS. 1 is a flowchart showing a substrate processing method according to a first embodiment. In the processing tank 100 storing the processing liquid LQ, at least one substrate W is The substrate W is treated by immersing it in LQ. The substrate W is immersed in the processing liquid LQ stored in the processing bath 100 by the substrate holder 110 that holds the substrate W. The substrates W are processed for each lot by immersing them in the substrate processing apparatus 1. As shown in FIG. 11, the substrate processing method includes steps S1 to S8. Specifically, the control device 170 executes the computer program 33 to perform the process Steps S1 to S8 are executed. 0 executes steps S1 to S8.

[0138] As shown in FIGS. 5 and 11, first, in step S1, the setting unit 24 The setting unit 24 receives the input of the relationship specification information 51 via the The fixed information 5 is set as the recipe information 32.

[0139] For example, in step S1, the setting unit 24 sets a plurality of reference points Pn. Input of reference point correction value information 53 is accepted (FIGS. 6 and 7). For example, in step S1, The setting unit 24 receives an input of a first specific value for setting the number of pieces of relationship information 41n ( For example, in step S1, the setting unit 24 may have a function of correcting the processing time of the substrate W. The input of the second specific value to be invalidated is received (FIG. 9). For example, in step S1, the setting unit 24 receives input of a plurality of reference point substrate number information 52 that respectively defines a plurality of reference points Pn. Attach (Figure 6, Figure 10).

[0140] Next, in step S2, the selection unit 21 selects from the storage unit 172 the Substrate number information 312 indicating the number of substrates W to be processed is acquired.

[0141] Next, in step S3, the selection unit 21 selects the number of substrates W and the processing time of the substrates W. Among the plurality of pieces of relationship information 41n that indicate the relationship with a positive value, The relationship information 41n is selected according to the number of substrates W to be processed.

[0142] Next, in step S4, the correction unit 22 calculates the number of substrates from the selected relationship information 41n. The correction value corresponding to the number of substrates W indicated by the information 312 is acquired. For example, the correction unit 2 2 obtains the correction value from Eq. (2).

[0143] Next, in step S5, the correction unit 22 determines whether the number of substrates W in the lot to be processed is the maximum number. The base value is set based on the obtained correction value so that the processing time is shorter than when N is used. The processing time of the board W is corrected. For example, the correction unit 22 corrects the processing time by using the formula (1). do.

[0144] Next, in step S6, the immersion control unit 23 controls the processing tank 1 to The substrate holder 110 is controlled so as to descend toward the processing liquid LQ of 00. The substrate holder 110 lowers the substrate W toward the processing liquid LQ in the processing bath 100.

[0145] Next, in step S7, the immersion control unit 23 adjusts the substrate W processing time in accordance with the corrected processing time of the substrate W. The substrate holder 110 is controlled so that the substrate W is immersed in the processing liquid LQ. Based on the processing time of the substrate W, the substrate W is processed by the processing liquid LQ in the processing bath 100. For example, the immersion control unit 23 may adjust the time for the substrate W to continue being immersed in the immersion bath in accordance with the corrected processing time. The substrate holder 110 is controlled so as to connect the substrate holder 110 to the substrate holder 110.

[0146] Next, in step S8, the immersion control unit 23 immerses the substrates W of the lot to be processed in the processing bath 1. The substrate holder 110 is controlled so as to lift the substrate from the processing liquid LQ of 00. The holder 110 lifts the substrate W out of the processing liquid LQ in the processing bath 100. The method ends.

[0147] As described above with reference to FIG. 11, according to the substrate processing method of the first embodiment, The relationship information 41n corresponding to the number of substrates W is selected from the number of relationship information 41n. (Step S3) Therefore, compared to the case where the correction value is monotonically increased, the base value of the lot to be processed is It is possible to select the relationship information 41n that is more suitable for the number of boards W. From the information 41n, a correction value according to the number of substrates W is acquired (step S4). Compared with the case where the value of the number of substrates W in the lot to be processed is monotonically increased, the correction value is more suitable for the number of substrates W in the lot to be processed. Then, the processing time is corrected based on the obtained correction value (step S5). The substrate W is processed according to the corrected processing time (step S7). In comparison with the case where the number of substrates W in a lot to be processed is increased, the number of substrates W in a lot to be processed is increased. In particular, even when it is required to etch the substrate W minutely, As a result, the etching amount can be prevented from exceeding the target etching amount. When the etching amount is very small, the amount of substrates W that are discarded due to the etching amount exceeding the target etching amount can be reduced. .

[0148] (First Modification) A first modification of the first embodiment will be described with reference to Figures 5 and 11 to 14. First Modification In this case, the processing time of the substrates W is corrected according to the arrangement of the substrates W in the lot. The first modification is mainly different from the first embodiment described above with reference to FIG. The differences from form 1 will be mainly explained.

[0149] In the first modification, in step S4 of FIG. 11, the correction unit 22 corrects the substrate in the processing bath 100. The correction value is set according to the arrangement of the substrates W. Therefore, the correction value for the processing time of the substrates W is As a result, even if the number of substrates W in one lot is the same, However, if the arrangement of the substrate W is different, the correction value may be different. The correction unit 22 corrects the processing time of the substrate W based on the correction value set in step S4. As a result, according to the first modified example, a correction that reflects the characteristics of the etching rate according to the arrangement of the substrate W is performed. Therefore, the processing time can be corrected depending on the number and arrangement of the substrates W in the processing lot. Accordingly, the substrate W can be processed with even greater precision.

[0150] As an example, one lot of substrates W may be in a first arrangement state, a second arrangement state, or a third arrangement state. When the image is arranged in the reference arrangement state, the correction unit 22 determines whether the image is arranged in the reference arrangement state or not, based on a relationship different from the relationship information 41n in the reference arrangement state. The processing time is corrected based on the relationship information 41nA (FIG. 13) or the relationship information 41nB (FIG. 14). The reference arrangement state is different from the first arrangement state, the second arrangement state, and the third arrangement state.

[0151] Fig. 12(a) is a diagram showing reference position information of the substrate W according to the first modified example. 12), as an example, N / 2 substrates W are held by the holding rods 113. 10(b) shows a plurality of pieces of relationship information 41n corresponding to the reference arrangement state of the substrate W according to the first modified example. The horizontal axis of the graph indicates the number of substrates W in one lot, and the vertical axis of the graph indicates 10 shows the correction value for the processing time of the substrate W.

[0152] As shown in FIG. 12(a), the reference position of the substrate W is when the substrate W is in the processing bath 100. The substrates W are arranged continuously at equal intervals along the first direction D10, and the substrates W are arranged within the maximum substrate arrangement area. In a state where the substrates are arranged in a region including the center portion 11 in the first direction D10 of the region 10, ... and the substrates are arranged in a region including the center portion 11 in the first direction D10 of the region 10. The distance between the plate W and the substrate W is the first distance d1. When the number of substrates W in the processing tank is the maximum number N, the number of substrates W placed in the processing tank 100 is Indicates the area.

[0153] When the state of the substrate W in the lot to be processed indicates the reference arrangement state, the correction unit 22 Based on the relationship information 41n selected from the plurality of relationship information 41n shown in (b), The processing time is corrected. This is the same as in the first embodiment.

[0154] FIG. 13(a) is a diagram showing first arrangement information of the substrate W. In FIG. 13(a), as an example, In this way, N / 2 substrates W are held by the holding rods 113. 10 is a graph showing a plurality of pieces of relationship information 41nA corresponding to the first arrangement state.

[0155] As shown in FIG. 13(a), the first arrangement state of the substrate W is such that the substrate W is The substrates W are arranged at equal intervals along the first direction D10, and the substrates W are arranged at equal intervals along the first direction D10. This is a state in which the distance between the first and second electrodes is a second distance d2 that is greater than the first distance d1 (FIG. 12(a)). The distance d1 is the distance between the substrates W when the number of substrates W in the lot is the maximum number N. equal.

[0156] In step S4 of FIG. 11, the substrate W is placed in the processing bath 100 in the first position. In this case, the correction unit 22 determines whether the processing time of the substrate W after correction is equal to the processing time in the standard arrangement state (FIG. 12(a)). The substrate W is placed in the first placement state so that the processing time is shorter than the corrected processing time of the placed substrate W. A correction value for the processing time of the substrate W is set.

[0157] The reason for this setting is as follows: the substrate W in the first arrangement state Since the substrates W are arranged at intervals less than those in the quasi-arranged state, fresh processing liquid LQ Therefore, the number of substrates W in one lot is the same in the first arrangement state and the standard arrangement state. Even so, the substrate W in the first arrangement state is more easily processed than the substrate W in the reference arrangement state. As a result, the substrate W in the first arrangement state is processed in the same processing time as the substrate W in the reference arrangement state. Therefore, in the first arrangement state, the processing amount may exceed the target processing amount. Correction is performed so that the processing time after correction is shorter than in the case of Even if the number of W sheets is the same, the correction value in the first arrangement state is larger than the correction value in the standard arrangement state. As a result, the substrates W can be processed with even greater precision according to the number of substrates W in the first arrangement state. do.

[0158] For example, as shown in FIG. 13(b), in the first arrangement state, the reference used in the reference arrangement state is The point correction value information 53 is increased by the first value V1. As a result, the relationship used in the first arrangement state The relationship information 41nA has a larger correction value than the relationship information 41n used in the standard arrangement state. In this case, in step S3 of FIG. 11, the selection unit 21 shifts the Among the relationship information 41nA, the relationship according to the number of substrates W indicated by the substrate number information 312 Then, in step S4, the correction unit 22 selects the relationship information 41nA. From the information 41nA, a correction value according to the number of substrates W is obtained. The processing time of the substrate W is corrected based on the obtained correction value.

[0159] Alternatively, for example, the selection unit 21 may select the substrate number information 31 from among the plurality of pieces of relationship information 41n. The correction unit 22 then selects the relationship information 41n according to the number of substrates W indicated by the selection From the selected relationship information 41n, a correction value according to the number of substrates W is acquired. 2 adds the first value V1 to the acquired correction value and sets the result as the new correction value. Then, the correction unit 22 corrects the processing time based on the newly set correction value. do.

[0160] As described above, the correction value is set to be larger than that of the relationship information 41n used in the reference arrangement state. In this way, the relationship information 41nA for the first arrangement state may be created, or the relationship information 41nB for the reference arrangement state may be created. The result of adding the value to the correction value acquired from the relationship information 41n is It may be set to the correction value to be used.

[0161] 14(a) is a diagram showing the second arrangement information of the substrate W. FIG. 14(b) is a diagram showing the first arrangement information of the substrate W. 2 is a graph showing a plurality of pieces of relationship information 41nB corresponding to the arrangement state.

[0162] As shown in FIG. 14(a), the second arrangement state of the substrates W is such that a plurality of substrates W are arranged in the processing bath 100. In FIG. 14, the substrates are divided into a first substrate group G1 and a second substrate group G2. In (a), as an example, each of the first substrate group G1 and the second substrate group G2 includes N / 4 substrates. The first substrate group G1 and the second substrate group G2 are arranged in the center 11 of the maximum substrate arrangement area 10. The first substrate group G1 and the second substrate group G2 are spaced apart in the first direction D10.

[0163] The first substrate group G1 is arranged in one end region 12 in the first direction D10 of the maximum substrate arrangement region 10. The second substrate group G2 is located at the other end of the maximum substrate arrangement area 10 in the first direction D10. 13. In each of the first substrate group G1 and the second substrate group G2, two or more substrates W are arranged at equal intervals along the first direction D10, and the interval between adjacent substrates W is This is the state indicating the distance d1.

[0164] In step S4 of FIG. 11, the correction unit 22 detects whether the substrate W is in the second arrangement position in the processing bath 100. When the substrate W is placed in the standard position state (FIG. 12(a)), the processing time of the substrate W after correction is The substrate W is placed in the second placement state so that the processing time is longer than the corrected processing time of the placed substrate W. A correction value for the processing time of the substrate W is set.

[0165] The reason for this setting is as follows: the substrate W in the second arrangement state is In each of the first substrate group G1 and the second substrate group G2, the substrates W are arranged at equal intervals to those in the reference arrangement state. The first substrate group G1 is placed in one end region 12, and the second substrate group G2 is placed in the other end region 13. The first substrate group G1 and the second substrate group G2 are disposed in the edge region 13. As a result, the substrate W in the second arrangement state may be affected by the convection of the processing liquid LQ. If the substrate W is processed for the same processing time as the substrate W in the standard placement state, the processing amount will not reach the target processing amount. Therefore, in the second arrangement state, the processing time after correction is shorter than in the case of the standard arrangement state. In other words, even if the number of substrates W in a lot is the same, The correction value in the second arrangement state is smaller than the correction value in the reference arrangement state. The substrates W can be processed with even greater precision depending on the number of substrates W in each state.

[0166] For example, as shown in FIG. 14(b), in the second arrangement state, the reference arrangement state is The point correction value information 53 is reduced by the second value V2. As a result, the relationship used in the second arrangement state The relationship information 41nB has a smaller correction value than the relationship information 41n used in the standard arrangement state. In this case, in step S3 of FIG. 11, the selection unit 21 shifts the Among the relationship information 41nB, the relationship according to the number of substrates W indicated by the substrate number information 312 Then, in step S4, the correction unit 22 selects the relationship information 41nB. From the information 41nB, a correction value according to the number of substrates W is obtained. The processing time of the substrate W is corrected based on the obtained correction value.

[0167] Alternatively, for example, the selection unit 21 may select the substrate number information 31 from among the plurality of pieces of relationship information 41n. The correction unit 22 then selects the relationship information 41n according to the number of substrates W indicated by the selection From the selected relationship information 41n, a correction value according to the number of substrates W is acquired. 2 subtracts the second value V2 from the acquired correction value and sets the subtraction result as the new correction value. Then, the correction unit 22 corrects the processing time based on the newly set correction value. .

[0168] As described above, the correction value is set to be smaller than that of the relationship information 41n used in the standard arrangement state. In this way, the relationship information 41nB for the second arrangement state may be created, or may be used in the reference arrangement state. The result of subtracting the value from the correction value acquired from the relationship information 41n is used in the second arrangement state. Alternatively, the correction value may be set to a value that satisfies the above requirement.

[0169] 11, the correction unit 22 detects whether the substrate W is in the first position in the processing bath 100. 3, the processing time of the substrate W after correction is the same as that of the reference placement state (FIG. 12(a) )) is placed in the third placement state so that the corrected processing time of the substrate W placed in The correction value for the processing time of the substrate W to be processed is set for the same reason as in the second arrangement state. .

[0170] The third arrangement state of the substrates W is a state in which the substrates W of a lot are arranged in the processing bath 100 in the order of the first substrate This is a state in which the substrates are arranged in either the group G1 or the second substrate group G2. The correction values ​​used in the second arrangement state are the same as those used in the second arrangement state.

[0171] (Second Modification) A second modification of the first embodiment will be described with reference to Figures 5, 15, and 16. 1 to 11, the processing time of the substrate W is divided into a plurality of step periods. The second modification is different from the first embodiment described above. This article will mainly explain the points that are important.

[0172] 15 is a diagram showing recipe information 32A according to the second modified example. As shown in FIG. In the recipe information 32A, the processing condition information 54 further includes chemical replenishment amount information 56. The replenishment amount information 56 indicates the amount of chemical solution replenished to the processing tank 100. In the example of FIG. The refill amount information 56 indicates the refill amount of the chemical liquid per substrate W. The chemical is replenished by the chemical supply unit 140. The storage unit 172 stores the recipe information 32A. are.

[0173] Furthermore, the processing time before correction indicated by the processing time information 55 is Therefore, the step period Ak of ​​the recipe information 32A indicates the period before correction. In this specification, the "k" included in the reference symbol represents an integer of 1 or more.

[0174] In the example of FIG. 15, k=1, 2, 3, 4, 5. In this case, the processing time information 55 The processing time indicated by is divided into step periods A1 to A5. In at least one step period Ak among the five steps, the chemical solution is treated by the chemical solution supply unit 140. In the example of FIG. 15, the chemical solution is replenished in the treatment tank 100 during step periods A2 and A3. The chemical solution is not replenished all at once, but is replenished in portions for the following reasons: This is to prevent the concentration of the chemical solution from becoming uneven in the treatment tank 100 .

[0175] The correction unit 22 calculates the correction value obtained from the relationship information 41n selected by the selection unit 21. Based on this, the step period Ak set as the period during which the chemical solution is replenished is determined. Therefore, according to the second modification, when the correction value is monotonically increased, Compared with the case where the number of substrates W in the lot to be processed is xn, the step period A2 is more suitable for the number of substrates W in the lot to be processed. In particular, by correcting the step periods A2 and A4 during which the chemical solution is replenished, This effectively prevents the processing amount of the substrate W from exceeding the target processing amount. The loop period Ak may be referred to as a step period Tk.

[0176] Next, a substrate processing method according to a second modified example will be described with reference to FIGS. 16 is a flowchart showing a substrate processing method according to a second modified example. The plate processing method includes steps S21 to S28. Specifically, the control device 170 controls a computer. By executing the computer program 33, steps S21 to S28 are executed. The computer program 33 causes the control device 170 to execute steps S21 to S28. Can.

[0177] As shown in Figure 16, steps S21 to S28 are executed. are the same as steps S1 to S8 in FIG. 1, respectively.

[0178] In particular, in step S25, the correction unit 22 calculates a plurality of The step period Ak is set to the period during which the chemical solution is replenished. Correct.

[0179] In this case, in step S25, the correction unit 22 applies the correction value acquired in step S24 to the By distributing equally or proportionally over two or more step periods Ak to be replenished, Therefore, according to the second modification, the relationship information 41n is The obtained correction value can be distributed to two or more step periods Ak by simple processing.

[0180] Specifically, the correction value acquired in step S24 is uniformly distributed over two or more step periods Ak. If the calculation is to be performed by dividing the total number of the inputs, the correction unit 22 calculates the correction value Yn after the equal distribution by using the formula (3). In formula (3), "yn" indicates the correction value obtained from the relationship information 41n (formula (2) ), and "J" indicates the number of step periods Ak, which are two or more, during which the drug solution is replenished.

[0181] Yn=yn / J …(3)

[0182] In this case, the correction unit 22 calculates the corrected step period Tk using equation (4). In equation (4), “Ak” is the step period before correction indicated by the processing time information 55. "Yn" indicates the correction value after equal distribution shown by equation (3).

[0183] Tk = Ak - Yn …(4)

[0184] A specific example of correction of the step period Ak will be described with reference to FIG. 6(a) and FIG. As shown in (a), the number of substrates W in one lot to be processed indicated by the substrate number information 312 is When the number of pieces of relationship information is 20, the selection unit 21 selects from the plurality of pieces of relationship information 411 to 414 Select the relationship information 413 .

[0185] Then, the correction unit 22 determines from the relationship information 413 that the number of substrates W in one lot is 20. Further, the correction unit 22 acquires the correction value y3 (=62 seconds) when (= 62 seconds) are equally distributed using formula (3), and the correction value Y3 (= 31 seconds) after the equal distribution is In the example of FIG. 15, J=2 in equation (3).

[0186] Furthermore, the correction unit 22 adds a correction value Y3 (=31 seconds) and the time when the chemical solution is replenished to the formula (4). Substituting the step period A2 (= 400 seconds) into the corrected step period T2 (= 369 seconds), In addition, the correction unit 22 adds a correction value Y3 (=31 seconds) and the time it takes for the chemical solution to be replenished to the formula (4). Substituting step period A4 (= 550 seconds), the corrected step period T4 (= 519 seconds) is obtained. ) is obtained.

[0187] On the other hand, the correction value acquired in step S24 is proportionally distributed to two or more step periods Ak. In this case, the correction unit 22 applies the correction value acquired in step S24 to the Proportionally allocate to each step period Ak according to the length of the step period Ak. In this case, the correction unit 22 substitutes the proportionally distributed correction value for "Yn" in the formula (4). By inputting the above, the corrected step period Tk is calculated.

[0188] Hereinafter, when we do not distinguish between equal and proportional distribution, we will refer to "Yn" in formula (4). "n" may be referred to as "allocation adjustment value."

[0189] Returning to FIG. 16, in step S27, the step period Ak without correction and the step period Ak after correction are The substrate W is processed with the processing liquid LQ in the processing bath 100 based on the period Tk. In the example of 5, the step period Ak without correction is the step periods A1, A3, and A5, and The step period Tk after the step S2 is the step period T2, T4. According to Information 32A, the step periods are in the order of A1, T2, A3, T4, and A5. The process proceeds as follows.

[0190] Specifically, step S27 includes steps S271 to S275.

[0191] First, in step S271, the immersion control unit 23 determines the step period of the recipe information 32A. In accordance with the order, the step period Ak or the step period Tk is started. For example, the immersion control section 23 starts a timer that measures the step period Ak or the step period Tk.

[0192] Next, in step S272, the immersion control unit 23 determines whether the timing for replenishing the chemical solution has arrived. That is, the immersion control unit 23 determines whether the step period Tk for replenishing the chemical solution has started. It is determined whether or not

[0193] If it is determined in step S272 that the time to replenish the chemical solution has not arrived (No), That is, when the step period Ak without correction has started, the process proceeds to step S274.

[0194] On the other hand, if it is determined in step S272 that the time for replenishing the chemical solution has arrived (Yes), That is, when the corrected step period Tk starts, the process proceeds to step S273.

[0195] Next, in step S273, the immersion control unit 23 controls the processing tank 100 to replenish the chemical solution. That is, the immersion control unit 23 controls the chemical solution supply unit 140 to adjust the corrected step period T At step k, the chemical supply unit 140 is controlled so as to replenish the chemical solution in the treatment tank 100. As a result, during the corrected step period Tk, the chemical supply unit 140 supplies the chemical to the treatment bath 100. Replenish.

[0196] In this case, the immersion control unit 23 determines whether the amount of chemicals to be replenished is greater than the amount of chemicals to be replenished. The chemical solution replenishment amount (ml / sheet) is multiplied by the number of substrates W indicated by the substrate number information 312. In this case, the total amount of chemical solution replenished during the step period Tk is calculated by The amount of chemical solution replenishment (ml / sheet) during step period Tk is the replenishment amount corresponding to step period Tk. The amount of chemical solution replenished (ml / sheet) in the previous step period Ak is used.

[0197] For example, in the step period T2 after the correction of the step period A2 in FIG. 15, the chemical liquid replenishment amount information The chemical replenishment amount of 56 is 250 (ml / substrate), and the number of substrates W in the substrate number information 312 is 2 If the number of sheets is 0, the total amount of chemical solution replenished is 5000 (ml). For example, in the step of FIG. In the step period T4 after the correction of the step period A4, the chemical liquid replenishment amount information 56 is 300 (ml / sheet), and when the number of substrates W in the substrate number information 312 is 20, the total amount of chemicals The refill volume is 6000 (ml).

[0198] The immersion control unit 23 replenishes the calculated total amount of chemical solution in the treatment tank 1 during each step period Tk. The chemical supply unit 140 is controlled so as to replenish the chemical solution to 00.

[0199] Next, in step S274, the immersion control unit 23 determines the end timing of the ongoing step period. The step period in progress is determined based on the step of the recipe information 32A. According to the order of the step periods, it is a step period Ak or a step period Tk.

[0200] If it is determined in step S274 that the end timing of the step period has not arrived (N o), step S274 is repeated until the end timing arrives.

[0201] On the other hand, if it is determined in step S274 that the end timing of the step period has arrived (Y es), processing proceeds to step S275.

[0202] Next, in step S275, the immersion control unit 23 calculates all the time periods constituting the processing time of the substrate W. Whether a step period (e.g., step periods A1, T2, A3, T4, A5) has ended Determine the following.

[0203] If it is determined in step S275 that all step periods have not ended (No), the process proceed to step S271.

[0204] On the other hand, if it is determined in step S275 that all step periods have ended (Yes), The process proceeds to step S28, and after step S28 is completed, the substrate processing method ends.

[0205] (Embodiment 2) 5 and 17 to 19, a substrate processing system SY according to a second embodiment of the present invention will be described. In the second embodiment, a correction value S reflecting the characteristics of each of the plurality of substrate processing apparatuses 1 is used. In terms of derivation, this is mainly the same as the second modification of the first embodiment described above with reference to FIGS. 15 and 16. The following mainly describes the differences between the second embodiment and the second modified example.

[0206] FIG. 17 is a diagram showing a substrate processing system SYS according to the second embodiment. 10 is a diagram showing recipe information 32B according to form 2. Recipe information 32B is stored in storage unit 172. It has been done.

[0207] As shown in FIG. 17, the substrate processing system SYS includes a plurality of substrate processing apparatuses 1. Each of the substrate processing apparatuses 1 includes a processing bath 100. In the example of FIG. YS includes four substrate processing apparatuses 1. Therefore, the substrate processing system SYS includes four processing apparatuses. As an example, the substrate processing system SYS includes one control device. The substrate processing system SYS includes a plurality of substrate processing apparatuses 1. A plurality of control devices 170 may be provided corresponding to each other.

[0208] In the second embodiment, a plurality of lots 90 are processed in a plurality of processing baths 100A to 100D, respectively. Each of the plurality of lots 90 includes 1 to N substrates W.

[0209] As shown in Fig. 18, the recipe information 32B includes tank-dependent information 58. The tank-dependent information 58 is , including a plurality of tank-dependent correction value information 59. The plurality of tank-dependent correction value information 59 includes a plurality of The tank-dependent correction value information 59 indicates a tank-dependent correction value. The bath-dependent correction value is used to correct the processing time of the substrate W according to the processing characteristics of the corresponding processing bath 100. The processing characteristics are correction values. The processing characteristics relate to the ability (processing capacity) of the processing tank 100 to process the substrate W. For example, the lower the etching rate, the lower the processing capacity.

[0210] Even when the same number of substrates W are processed under the same processing conditions in a plurality of processing tanks 100, Due to the influence of the environment inside and outside the treatment tank 100 and the tolerance of the parts of the treatment tank 100, The processing amount (for example, etching rate) of the substrate W may differ. may differ between treatment tanks 100.

[0211] The correction unit 22 calculates the correction value based on the correction value acquired from the relationship information 41n and the tank-dependent correction value. The processing time of the substrate W is corrected. Therefore, when a plurality of processing tanks 100 are provided, As a result, according to the second embodiment, the processing time can be corrected by reflecting the processing characteristics of the The variation in the amount of processing (e.g., etching amount) of the substrate W among the plurality of processing tanks 100 is suppressed. It can be controlled.

[0212] Below, the tank-dependent correction value will be explained with specific examples. The assigned tank-dependent correction value information 59 is described as tank-dependent correction value information 59A, and the processing tank 100B The tank-dependent correction value information 59 assigned to the tank is written as tank-dependent correction value information 59B, and processing is performed. The tank-dependent correction value information 59 assigned to the tank 100C is recorded as tank-dependent correction value information 59C. The tank-dependent correction value information 59 assigned to the processing tank 100D is stored as the tank-dependent correction value information It may be written as 59D.

[0213] In the second embodiment, one or more of the treatment tanks 100 are set as the reference treatment tank. The reference treatment tank is set to a value where the tank-dependent correction value indicated by the tank-dependent correction value information 59 is zero. In the example of FIG. 18, the treatment tanks 100A and 100B are the reference treatment tanks. In addition, in each tank-dependent correction value information 59, multiple step periods For each Ak, a tank-dependent correction value is set. is set to zero for all step periods Ak.

[0214] The correction unit 22 calculates the corrected step period Uk using equation (5) or equation (6). Equation (5) is the case where correction based on the relationship information 41n is performed for the step period Ak. On the other hand, equation (6) is related to the step period Ak. This is selected by the correction unit 22 when correction based on the relationship information 41n is not performed.

[0215] In equation (5), "Tk" is the step period after correction shown by equation (4) above. "Rk" indicates a tank-dependent correction value, and "Yn" indicates a distribution correction value of equation (4).

[0216] Uk = Tk + Rk = Ak - Yn + Rk … (5) Uk = Ak + Rk …(6)

[0217] For example, the lower the processing capacity of the processing tank 100, the larger the tank-dependent correction value Rk. As a result, the corrected step period Uk is set to a value that is smaller than the processing capacity of the processing tank 100. The lower the value, the longer the setting.

[0218] The tank-dependent correction value Rk of the treatment tank 100 having a lower treatment capacity than the reference treatment tank is The tank-dependent correction value Rk of the semi-treatment tank is larger than that of the treatment tank having low treatment capacity. The tank-dependent correction value Rk of 100 is a positive value. etc.

[0219] On the other hand, the tank-dependent correction value Rk of the treatment tank 100 having a higher treatment capacity than the reference treatment tank is smaller than the tank-dependent correction value Rk of the reference treatment tank. Therefore, it has high treatment capacity characteristics. The tank-dependent correction value Rk of the treatment tank 100 is a negative value. Because it is Ro.

[0220] In the second embodiment, the treatment tank 100A to 100D has the highest treatment capacity. The treatment tanks 100A and 100B are set as reference treatment tanks. Therefore, as shown in FIG. The tank-dependent correction value information 59C and 59D indicates the tank-dependent correction value information of the processing tanks 100C and 100D. The positive value Rk is a positive value. Rk is, for example, the processing amount of the substrates W in the processing tank 100A, which is the reference processing tank (for example, The actual values ​​of the etching rate and the processing amount of the substrates W in the processing baths 100C and 100D (for example, For example, it is determined in advance based on the difference between the actual value of the etching rate and the actual value of the etching rate.

[0221] As shown in FIG. 18, the recipe information 32B includes, for example, a tank dependency for the processing tank 100C. The correction value information 59C includes a tank-dependent correction value R1 (=10 seconds) for the step period A1, The tank-dependent correction value R2 for A2 (= 20 seconds), the tank-dependent correction value R3 for step period A3 (= 30 seconds) ), the bath-dependent correction value R4 (= 40 seconds) for the step period A4, and the bath-dependent correction value R5 (= 40 seconds) for the step period A5. Includes residual correction value R5 (=50 seconds).

[0222] Continuing with reference to FIG. 18, when 20 substrates W are processed in the processing tank 100C, An example of correction will be described. In this case, the relationship information 41n in FIG. 6 is used. The step period A1 is , corrected based on equation (6), and the step period U1 after correction is 160 seconds (=150 + 1 0). The step period A2 is corrected based on the formula (5), and the corrected step period U2 is 389 seconds (=369+20). In this case, "369 seconds" is the step period. T2, and the "step period Ak" of the second modified example described with reference to FIG. 6(a) and FIG. The step period A3 is corrected based on the formula (6). The corrected step period U3 is 200 seconds (=170+30). is corrected based on equation (5), and the step period U4 after correction is 559 seconds (=519 + 40). In this case, "519 seconds" indicates the step period T4, and is shown in FIG. 6(a) and FIG. 15, the second modified example "Specific example of correction of step period Ak" is quoted. The step period A5 is corrected based on equation (6), and the corrected step period U5 is , 200 seconds (=150+50).

[0223] Next, a substrate processing method according to the second embodiment will be described with reference to FIGS. 19 is a flowchart showing a substrate processing method according to the second embodiment. The plate processing method includes steps S41 to S49. By executing the computer program 33, steps S41 to S49 are executed. The computer program 33 causes the control device 170 to execute steps S41 to S49. Can.

[0224] As shown in Figure 19, steps S41 to S44 are executed. are the same as steps S21 to S24 in FIG. 16, respectively.

[0225] In the second embodiment, in step S45, the correction unit 22 calculates the value of the recipe stored in the storage unit 172. From the information 32B (FIG. 18), the treatment tank 100 to be controlled is assigned to one of the plurality of treatment tanks 100. The tank-dependent correction value of the assigned tank-dependent correction value information 59 is acquired.

[0226] Next, in step S46, the correction unit 22 calculates the correction value acquired in step S44 and the The processing time of the substrate W is corrected based on the bath-dependent correction value obtained in 5.

[0227] Specifically, in step S46, the correction unit 22 calculates the correction value acquired in step S44 and the Based on the tank-dependent correction value obtained in 45, each step period Ak is corrected, and each step period after correction is In this case, the correction unit 22 uses the formula (5) or the formula (6).

[0228] Next, in step S47, the immersion control unit 23 determines whether the substrates W of the lot 90 to be processed are The substrate holder 110 is controlled so as to descend toward the processing liquid LQ in the processing bath 100 .

[0229] Next, in step S48, the processing tank 100 is charged with the corrected step period Uk. In this chamber, the substrate W is treated with the treatment liquid LQ.

[0230] Specifically, step S48 includes steps S481 to S485. Steps S481 to S485 are the same as steps S271 to S275 in FIG. This article will mainly explain the points that are important.

[0231] First, in step S481, the immersion control unit 23 executes the steps in accordance with the recipe information 32B. Start the loop period Uk.

[0232] Next, in step S482, the immersion control unit 23 determines whether the timing for replenishing the chemical solution has arrived. Determine whether or not.

[0233] If it is determined in step S482 that the time for replenishing the chemical solution has not come (No), The process proceeds to step S484.

[0234] On the other hand, if it is determined in step S482 that the time for replenishing the chemical solution has arrived (Yes), Processing proceeds to step S483.

[0235] Next, in step S483, the immersion control unit 23 controls the processing tank 100 to replenish the chemical solution. In addition, the chemical supply unit 140 is controlled.

[0236] Next, in step S484, the immersion control unit 23 determines the end time of the ongoing step period Uk. It is determined whether the timing has arrived.

[0237] If it is determined in step S484 that the end timing of the step period Uk has not arrived (No), step S484 is repeated until the end timing arrives.

[0238] On the other hand, if it is determined in step S484 that the end timing of the step period Uk has arrived, (Yes), the process proceeds to step S485.

[0239] Next, in step S485, the immersion control unit 23 calculates all the time periods constituting the processing time of the substrate W. It is determined whether the step period Uk has ended.

[0240] If it is determined in step S485 that all step periods Uk have not ended (No), Processing proceeds to step S481.

[0241] On the other hand, if it is determined in step S485 that all step periods have ended (Yes), The process proceeds to step S49.

[0242] Next, in step S49, the substrate holder 110 transfers the substrate W to the processing liquid LQ This is the same as step S28 in FIG. 16. Finish.

[0243] The embodiments (including modifications) of the present invention have been described above with reference to the drawings. The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. In addition, the components disclosed in the above embodiments can be modified as appropriate. For example, some of the components shown in one embodiment may be replaced with other components. The components of the embodiments may be in addition to, or may be less than, all of the components shown in an embodiment. Some of these components may be omitted from the embodiment.

[0244] In addition, the drawings are presented in a schematic manner, focusing on each component, to facilitate understanding of the invention. The thickness, length, number, spacing, etc. of each component shown in the drawing are for convenience of drawing. In addition, the configuration of each component shown in the above embodiment is an example. Therefore, there is no particular limitation, and various methods can be used within the scope that does not substantially deviate from the effects of the present invention. Of course, changes are possible.

[0245] (1) In the first embodiment (including the modified example) and the second embodiment described with reference to FIGS. 1 to 19, As a suitable example, four pieces of relationship information 411 to 414 and four reference points P1 to P4 will be explained. However, the number of pieces of relationship information 41n and the number of reference points Pn may be 2 or more. For example, the number of pieces of relationship information 41n and the number of reference points Pn are each When the maximum number of substrates W is "N", the number must be an integer between 2 and "N / 2". This is preferable in order to prevent the process from becoming complicated.

[0246] (2) In the first embodiment (including the modified example) and the second embodiment described with reference to FIGS. 1 to 19, , based on the processing time or step period for the maximum number of substrates N, By subtracting the correction value based on the relationship information 41n from the processing time for the board W, The processing time or step period was calculated (see equations (1), (4), and (5)). The correction method is not limited to this. For example, when the minimum number of substrates W (=1) is processed, Based on the time or step period, the relationship with the processing time for the minimum number of substrates W is By adding a correction value based on the characteristic information 41n, the corrected processing time or step period is calculated. In this case, the relationship information 41n may be such that the correction value increases as the number of substrates W increases. Alternatively, for example, the number of substrates W is set to 1 / 2 of the maximum number N. Based on the processing time or step period, the number of substrates W is half the maximum number N. By subtracting or adding a correction value based on the relationship information 41n from or to the processing time, the corrected The processing time or step duration may be calculated.

[0247] (3) In the first embodiment (including the modified examples) described with reference to FIGS. 1 to 14, the recipe information The recipe information 32 may include tank-dependent information 58 shown in FIG. The processing time indicated by the processing time information 55 of 2 is indicated by the bath-dependent correction value information 59. This is corrected by the tank-dependent correction value used.

[0248] For example, the correction unit 22 calculates the corrected processing time Ta using equation (7). ), "Tc" indicates the processing time (equation (1)) corrected based on the relationship information 41n. and "R" indicates the tank-dependent correction value.

[0249] Ta = Tc + R …(7)

[0250] In the first embodiment (including the modified examples) described with reference to FIGS. 1 to 14, the recipe information The information 32 may include chemical liquid replenishment amount information 56 shown in FIG. The unit 23 calculates the chemical replenishment amount (ml / sheet) indicated by the chemical replenishment amount information 56 in accordance with the number of substrates information. By multiplying the number of substrates W indicated by the information 312, the chemical solution amount in the corrected processing time is Then, the immersion control unit 23 calculates the total replenishment amount of the chemical solution after correction. The chemical supply unit 140 is controlled so as to replenish the chemicals in the processing tank 100 during the processing time. As a result, the chemical supply unit 140 replenishes the chemical to the processing bath 100 for the corrected processing time.

[0251] (4) The number of step periods Ak in FIGS. 15 and 18 is not limited to five, but may be any number of two or more. In addition, in FIG. 17, the number of the treatment tanks 100 is not limited to four, but may be two or more. Anything above that is fine. [Industrial Applicability]

[0252] The present invention relates to a substrate processing method, a substrate processing apparatus, and a computer program. and has industrial applicability. [Explanation of symbols]

[0253] 1, 1A-1D Substrate processing equipment 21 Selection section 22 Correction unit 23 Immersion control unit 100 Treatment tank 110 Board holding part 171 Control Unit 172 Memory section W substrate

Claims

1. In a processing tank storing a processing liquid, at least one substrate is immersed in the processing liquid for each lot. A substrate processing method for processing a substrate by immersing the substrate in acquiring substrate number information indicating the number of the substrates included in the lot; a plurality of pieces of relationship information each indicating a relationship between the number of substrates and a correction value for the processing time of the substrate; From the above, relationship information corresponding to the number of substrates indicated by the substrate number information is selected. selecting a From the selected relationship information, the number of substrates indicated by the substrate number information is acquiring a correction value according to the The processing time is shorter than the processing time when the number of substrates in the lot is the maximum. correcting the processing time of the substrate based on the acquired correction value so as to Based on the corrected processing time of the substrate, the processing the substrate; A substrate processing method comprising:

2. Each of the plurality of pieces of relationship information is a relationship between the number of substrates and a correction value of the processing time of the substrate.

2. The substrate processing method according to claim 1, wherein the function indicates a relationship between the two.

3. the plurality of pieces of relationship information are defined by a plurality of reference points that are different from one another; receiving input of a plurality of pieces of reference point correction value information that respectively define the plurality of reference points; Further including, Each of the plurality of pieces of reference point correction value information is a processing time of the substrate that defines the corresponding reference point. The substrate processing method according to claim 2 , wherein the correction value between the first and second values ​​is indicated.

4. further comprising a step of receiving input of number setting information for setting the number of the plurality of pieces of relationship information; 3. The substrate processing method according to claim 1.

5. a step of receiving input of invalid setting information for invalidating a function for correcting the processing time of the substrate; The substrate processing method according to claim 1 or 2, further comprising:

6. the plurality of pieces of relationship information are defined by a plurality of reference points that are different from one another; a step of receiving input of a plurality of pieces of reference point substrate number information that respectively define the plurality of reference points; Further comprising: Each of the plurality of pieces of reference point substrate number information is the The substrate processing method according to claim 2 , further comprising indicating the number of substrates.

7. a correction value for the processing time of the substrate when the number of the substrates in the lot is the maximum number; is zero, In each of the plurality of pieces of relationship information, the smaller the number of the substrates, the shorter the processing time for the substrates. The correction value is large, In the step of correcting, when the number of the substrates in the lot indicates the maximum number, The compensation time is calculated based on the processing time of the substrates according to the number of the substrates indicated by the substrate number information.

3. The method according to claim 1, wherein the processing time of the substrate is corrected by subtracting a positive value. Substrate processing method.

8. In the step of acquiring the correction value, the correction value is determined according to the arrangement of the substrate in the processing bath. Set a positive value, In the step of correcting, the processing time of the substrate is corrected based on the set correction value.

3. The substrate processing method according to claim 1, wherein the substrate is heated to a temperature of 1000.degree.

9. In the step of acquiring the correction value, the substrate is placed in the processing bath in a first position. When the substrate is placed in the standard placement state, the processing time of the substrate after correction is processing the substrate placed in the first placement state so that the processing time is shorter than the corrected processing time; The time correction value is set, The reference arrangement state is a state in which the substrates are arranged in the processing bath at equal intervals in a predetermined direction. and arranged in an area including the center of the maximum board arrangement area in the predetermined direction. a state in which the interval between the adjacent substrates indicates a first distance, The maximum substrate placement area is the area in which the number of substrates in the lot is the maximum number. indicates an area in which the substrate is placed, In the first arrangement state, the substrates are arranged at equal intervals along the predetermined direction in the processing bath. and the distance between the adjacent substrates is greater than the first distance. The substrate processing method according to claim 8 , wherein the second distance is a small value.

10. In the step of acquiring the correction value, the substrate is placed in the processing bath in a second arrangement state. When the substrate is placed in the standard placement state, the processing time of the substrate after correction is The processing time of the substrate placed in the second placement state is longer than the corrected processing time. The time correction value is set, The reference arrangement state is a state in which the substrates are arranged in the processing bath at equal intervals in a predetermined direction. and arranged in an area including the center of the maximum board arrangement area in the predetermined direction. a state in which the interval between the adjacent substrates indicates a first distance, The maximum substrate placement area is the area in which the number of substrates in the lot is the maximum number. indicates an area in which the substrate is placed, The second arrangement state is a state in which the plurality of substrates of the lot are arranged in the processing bath in a first substrate a first group and a second group of substrates, the first substrate group and the second substrate group are not disposed in the center of the maximum substrate arrangement area, The first substrate group is arranged in one end region in the predetermined direction of the maximum substrate arrangement region. 、 The second substrate group is arranged in the other end area of ​​the maximum substrate arrangement area in the predetermined direction. 、 In each of the first substrate group and the second substrate group, two or more of the substrates are arranged in the predetermined direction. The substrates are arranged at equal intervals along the substrate direction, and the interval between adjacent substrates is equal to or larger than the first distance. The substrate processing method according to claim 8 , wherein the substrate processing method is in a state shown in FIG.

11. In the step of acquiring the correction value, the substrate is placed in the processing bath in a third arrangement state. When the substrate is placed in the standard placement state, the processing time of the substrate after correction is The processing time of the substrate placed in the third arrangement state is longer than the corrected processing time. The time correction value is set, The reference arrangement state is a state in which the substrates are arranged in the processing bath at equal intervals in a predetermined direction. and arranged in an area including the center of the maximum board arrangement area in the predetermined direction. a state in which the interval between the adjacent substrates indicates a first distance, The maximum substrate placement area is the area in which the number of substrates in the lot is the maximum number. indicates an area in which the substrate is placed, The third arrangement state is a state in which the plurality of substrates of the lot are arranged in the processing bath in a first substrate the first group or the second group of substrates, the first substrate group and the second substrate group are not disposed in the center of the maximum substrate arrangement area, The first substrate group is arranged in one end region in the predetermined direction of the maximum substrate arrangement region. 、 The second substrate group is arranged in the other end area of ​​the maximum substrate arrangement area in the predetermined direction. 、 In each of the first substrate group and the second substrate group, two or more of the substrates are arranged in the predetermined direction. The substrates are arranged at equal intervals along the substrate direction, and the interval between adjacent substrates is equal to or larger than the first distance. The substrate processing method according to claim 8 , wherein the substrate processing method is in a state shown in FIG.

12. The processing time of the substrate before correction is divided into a plurality of step periods; In the step of correcting, the step of correcting the time period of the plurality of step periods is performed based on the acquired correction value. Correct the step period set during which the chemical solution is replenished, The step of processing the substrate includes:

3. The substrate processing method according to claim 1, further comprising the step of replenishing the chemical solution.

13. In the correction step, the acquired correction value is applied to two or more of the stations to which the chemical solution is replenished. The two or more step periods are adjusted by equally or proportionally allocating the time to the step periods. The substrate processing method according to claim 12 .

14. A plurality of the lots are treated in a plurality of the treatment tanks, respectively; a plurality of tank-dependent correction values ​​are assigned to the plurality of treatment tanks, respectively; The bath-dependent correction value corrects the processing time of the substrate depending on the processing characteristics of the corresponding processing bath. indicates the correction value to be corrected, In the step of correcting, the previous correction value is calculated based on the acquired correction value and the tank-dependent correction value.

3. The substrate processing method according to claim 1, further comprising correcting a processing time for the substrate.

15. A substrate processing apparatus for processing at least one substrate with a processing liquid for each lot. 、 a processing tank for storing the processing liquid; a substrate holder that holds the substrate and immerses the substrate in the processing liquid; a storage unit that stores substrate number information indicating the number of the substrates included in the lot; a plurality of pieces of relationship information each indicating a relationship between the number of substrates and a correction value for the processing time of the substrate; From the above, relationship information corresponding to the number of substrates indicated by the substrate number information is selected. a selection unit for selecting From the selected relationship information, the number of substrates indicated by the substrate number information is A correction value corresponding to the number of substrates in the lot is acquired, and the processing time is set to be shorter than the processing time when the number of substrates in the lot is the maximum number. and correcting the processing time of the substrate based on the correction value so that the processing time is shorter than the correction value. Masabe and The substrate is immersed in the processing liquid according to the corrected processing time of the substrate. an immersion control unit that controls the substrate holding unit; A substrate processing apparatus comprising:

16. A substrate holding unit that holds at least one substrate is used to pre-immerse the substrate in the processing solution stored in the processing tank. By immersing the substrates, the substrate processing method for processing the substrates for each lot is calculated by a computer. A computer program to be executed by a computer, The computer, acquiring substrate number information indicating the number of the substrates included in the lot; a plurality of pieces of relationship information each indicating a relationship between the number of substrates and a correction value for the processing time of the substrate; From the above, relationship information corresponding to the number of substrates indicated by the substrate number information is selected. selecting a From the selected relationship information, the number of substrates indicated by the substrate number information is acquiring a correction value according to the The processing time is shorter than the processing time when the number of substrates in the lot is the maximum. correcting the processing time of the substrate based on the acquired correction value so as to The substrate is immersed in the processing liquid according to the corrected processing time of the substrate. controlling the substrate holder; A computer program that executes

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