Solder connection method and solder connection device for multi-core cable

Abstract

To facilitate solder connection between conductor wires of a multi-core cable and electrodes of an electronic component.SOLUTION: A solder connection device 16 for a multi-core cable comprises: an upper collet 7 having three V-grooves 7a in which three conductor wires 3 are disposed; a pressing member that presses exposed portions 4 of the three conductor wires 3 against the three V-grooves 7a; and a lower collet 13 that supports a sensor chip 10 provided with three electrode pads 10a. In a state where the exposed portions 4 of the three conductor wires 3 are pressed against the three V-grooves 7a by the pressing member, a load is applied to the three conductor wires 3 and the sensor chip 10 by the upper collet 7 and the lower collet 13, thereby performing solder connection between the exposed portions 4 of the three conductor wires 3 and the three electrode pads 10a of the sensor chip 10.SELECTED DRAWING: Figure 17

Description

[Technical Field]

[0001] The present invention relates to a method and device for soldering a multi-core cable. [Background technology]

[0002] Patent Document 1 describes an example of the structure of a multi-core cable with a pressure sensor, in which a sensor chip such as a pressure sensor and the conductor wires of the multi-core cable are soldered together. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 9,391,002 Summary of the Invention [Problem to be solved by the invention]

[0004] The multi-core cable with pressure sensor described in Patent Document 1 is manufactured by aligning the conductor wires of the multi-core cable with the electrode pads of the sensor chip and connecting them by soldering.

[0005] However, if the conductor wires are deformed or thermally expanded during solder heating, it becomes difficult to align the conductor wires of the multi-core cable with the electrode pads of the sensor chip.

[0006] In particular, in the case of a sensor chip, the pad pitch is very small, so it is difficult to match the pitch between the conductor lines with the pad pitch of the sensor chip.

[0007] Furthermore, the collet that supports the conductor wires is heated from room temperature to the solder melting temperature during soldering, which causes the conductor wires to heat up and expand, making it difficult to maintain the alignment of multiple conductor wires.

[0008] SUMMARY OF THE INVENTION An object of the present invention is to provide a method and apparatus for soldering a multi-core cable, which can easily perform soldering between the conductor wires of the multi-core cable and the electrodes of an electronic component. [Means for solving the problem]

[0009] The method for soldering a multi-core cable of the present invention is a method for soldering a multi-core cable including a plurality of conductor wires each covered with a covering layer, and includes the steps of: (a) supporting the covering layer located on both sides of the exposed portions of the plurality of conductor wires in the multi-core cable in a state in which a portion of the covering layer has been removed to expose a portion of each of the plurality of conductor wires; (b) arranging the exposed portions of the plurality of conductor wires in a plurality of first grooves of a first collet; (c) cutting the plurality of conductor wires at the exposed portions while pressing the plurality of conductor wires against the plurality of first grooves; and (d) maintaining the state in which the exposed portions of the plurality of conductor wires are arranged in the plurality of first grooves, solder-connecting the exposed portions of the plurality of conductor wires to a plurality of electrodes of an electronic component.

[0010] In one aspect of the present invention, in step (a), the coating layer on both sides of the exposed portion is placed in a plurality of second grooves formed in two support members, and the coating layer is supported by the two support members, and the exposed portions of the plurality of conductor wires are aligned by the support members arranged on both sides of the exposed portions.

[0011] In one aspect of the present invention, after step (a), adhesive is applied to the exposed portions of the plurality of conductor wires, and after the adhesive is applied, in step (b), the exposed portions of the plurality of conductor wires are placed in the plurality of first grooves of the first collet, and before step (c), the adhesive is hardened while the plurality of conductor wires are pressed against the plurality of first grooves.

[0012] In one aspect of the present invention, the step (c) includes the step of, after cutting the plurality of conductor wires, maintaining a state in which the plurality of conductor wires are pressed against the plurality of first grooves.

[0013] In one aspect of the present invention, in step (d), the exposed portions of the multiple conductor wires are maintained in the multiple first grooves of the first collet, which has been preheated, while the electronic component is placed on a second collet, which is located opposite the first collet and has been preheated, and a load is applied to the multiple conductor wires and the electronic component by the first collet and the second collet, thereby soldering the exposed portions of the multiple conductor wires to the multiple electrodes of the electronic component.

[0014] In one aspect of the present invention, the multi-core cable is a twisted wire in which the multiple conductor wires are twisted, the electronic component is a semiconductor chip, and the exposed portions of the multiple conductor wires are solder-connected to the multiple electrodes of the semiconductor chip with the multiple conductor wires untwisted.

[0015] In one aspect of the present invention, the installation pitch of the plurality of first grooves of the first collet, the installation pitch of the plurality of second grooves of the support member, and the installation pitch of the plurality of electrodes of the semiconductor chip are the same.

[0016] The solder connection device for a multi-core cable of the present invention is a solder connection device for a multi-core cable including a plurality of conductor wires each coated with a coating layer, and includes: a first collet having a plurality of first grooves that accommodate exposed portions of the conductor wires from which a portion of the coating layer has been removed; a pressing member that presses the exposed portions of the conductor wires into the plurality of first grooves; and a second collet that is arranged opposite the first collet and supports an electronic component having a plurality of electrodes.With the exposed portions of the conductor wires pressed against the plurality of first grooves by the pressing member, a load is applied to the conductor wires and the electronic component by the first collet and the second collet, thereby soldering the exposed portions of the conductor wires to the electrodes of the electronic component.

[0017] In one aspect of the present invention, the multi-core cable further includes a support member that supports the coating layers located on both sides of the exposed portions of the multiple conductor wires, and the support member has multiple second grooves, and the coating layers of each of the conductor wires are placed in the multiple second grooves to align the exposed portions of the multiple conductor wires using the support member.

[0018] In one embodiment of the present invention, the device further includes a cutter that cuts the multiple conductor wires, and the cutter cuts the exposed portions of the multiple conductor wires while the exposed portions of the multiple conductor wires are aligned by the support member and pressed against the multiple first grooves by the pressing member. [Effects of the Invention]

[0019] According to the present invention, the conductor wires of the multi-core cable and the electrodes of the electronic component can be easily soldered together. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a partial side view showing the structure of a multi-core cable used in the solder connection method for a multi-core cable of the present invention. [Figure 2] 2 is a partial perspective view showing a solder connection structure between the multi-core cable and the sensor chip shown in FIG. 1. FIG. [Figure 3] FIG. 3 is a partial cross-sectional view of the solder connection structure shown in FIG. 2. [Figure 4] 2 is a cross-sectional view of a single cable in the multi-core cable shown in FIG. 1. [Figure 5] 1 is a partial perspective view showing a state in which a multi-core cable is supported by a support block in a solder connection of the multi-core cable of the present invention; FIG. [Figure 6] 6 is a cross-sectional view showing a support structure for a multi-core cable using a V-groove in the support block shown in FIG. 5. FIG. [Figure 7] 1 is a partial plan view showing a state in which an adhesive is applied to a multi-core cable in a solder connection of the multi-core cable of the present invention. [Figure 8]10 is a partial perspective view showing a state in which a multi-core cable coated with adhesive is pressed against an upper collet in the solder connection of the multi-core cable of the present invention. FIG. [Figure 9] FIG. 9 is a partial perspective view showing a state in which UV rays are irradiated onto the adhesive in the state shown in FIG. 8. [Figure 10] FIG. 10 is a partial side view showing the UV irradiation state shown in FIG. 9. [Figure 11] 11 is a partial cross-sectional view showing the structure of a cross section taken along line AA in FIG. 10. [Figure 12] 1 is a partial side view showing a cutting state in which an exposed portion of a conductor wire of a multi-core cable is cut by a cutter in a solder connection of the multi-core cable of the present invention. FIG. [Figure 13] 10 is a partial side view showing a state in which the multi-core cable of the present invention is pressed against the upper collet after cutting. FIG. [Figure 14] 10 is a partial side view showing a state in which the lower collet is lifted toward the upper collet in the solder connection of the multi-core cable of the present invention. FIG. [Figure 15] 10 is a partial side view showing a state in which a load is applied to the multi-core cable and the sensor chip by the upper collet and the lower collet in the solder connection of the multi-core cable of the present invention. FIG. [Figure 16] FIG. 16 is an enlarged partial side view showing the load-applied state of FIG. [Figure 17] 17 is a partial cross-sectional view showing the structure of a cross section taken along line BB in FIG. 16. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, an embodiment of the method and apparatus for soldering a multi-core cable according to the present invention will be described. In the following description, the same reference numerals will be used in principle for the same or substantially the same configurations, elements, etc.

[0022] <Multi-core cable configuration and solder connection structure with sensor chip> The multi-core cable 1 of this embodiment shown in Figs. 1 to 4 is composed of, for example, three electric wires 2 as shown in Fig. 1. As shown in Fig. 4, each of the electric wires 2 constituting the multi-core cable 1 is composed of a conductor wire 3 and a coating layer 5 that coats the conductor wire 3. The coating layer 5 is made of an insulator and covers the periphery of the conductor wire 3. In other words, the multi-core cable 1 has three conductor wires 3, each coated with a coating layer 5. For example, a silver-plated copper alloy wire is used as the conductor wire 3. The coating layer 5 is made of, for example, a fluororesin that has high heat resistance.

[0023] 1, the multi-core cable 1 of this embodiment is a twisted wire. That is, the multi-core cable 1 is a twisted wire in which three electric wires 2 are twisted. Therefore, when soldering the multi-core cable 1 to an electronic component, the conductor wires 3 of each electric wire 2 of the multi-core cable 1 are soldered to the electrodes of the electronic component, and therefore the multi-core cable 1 is treated as being in a state in which the twisting of the three conductor wires 3 is untwisted before soldering to the electronic component.

[0024] That is, when the multi-core cable 1 is soldered to an electronic component, the soldering is performed with the three electric wires 2 (conductor wires 3) untwisted. However, in the untwisted state, the electric wires have a tendency to twist. Therefore, it is very difficult to align each electric wire 2 in the multi-core cable 1 with each electrode of the electronic component when the electric wires have a tendency to twist.

[0025] Here, an electronic component to which the multi-core cable 1 is soldered will be described. In this embodiment, a case where the electronic component is a semiconductor chip will be described. In addition, in this embodiment, a sensor chip 10 formed with a pressure detection element will be described as an example of a semiconductor chip.

[0026] 2, the sensor chip 10 has three electrode pads (electrodes) 10a to which the conductor wires 3 of the three electric wires 2 of the multi-core cable 1 are solder-connected. In the sensor-equipped multi-core cable, the three electrode pads 10a of the sensor chip 10 and the conductor wires 3 of the three electric wires 2 of the multi-core cable 1 are solder-connected by solder 14, as shown in FIG.

[0027] The three electrode pads 10a of the sensor chip 10 are spaced very closely, for example, with a pad pitch of about 0.1 mm. However, the three conductor wires 3 of the multi-core cable 1 that are solder-connected to these three electrode pads 10a have a tendency to twist. Therefore, it is very difficult to align the three electrode pads 10a of the sensor chip 10, which have a pad pitch of about 0.1 mm, with the three conductor wires 3 of the multi-core cable 1 that have a tendency to twist, when soldering them together.

[0028] <About the soldering device for multi-core cables> A multi-core cable solder connection device 16 of this embodiment is a device for soldering a multi-core cable 1 including three conductor wires 3, each coated with a coating layer 5. The multi-core cable solder connection device 16 shown in FIGS. 14 and 15 will be described. The multi-core cable solder connection device 16 includes a support block (support member) 6 shown in FIG. 13 that supports the coating layers 5 located on both sides of the exposed portions 4 of the three conductor wires 3 of the multi-core cable 1, and an upper collet (first collet) 7 shown in FIG. 17 that has three first grooves in which the exposed portions 4 of the three conductor wires 3 are disposed. That is, the upper collet 7 includes three V-grooves (first grooves) 7a in which the exposed portions 4 of the three conductor wires 3 can be disposed, respectively. The V-grooves 7a are V-shaped grooves that can accommodate the exposed portions 4 of the conductor wires 3 and support the exposed portions 4. Here, the exposed portions 4 are portions where the conductor wires 3 are exposed by removing part of the coating layer 5.

[0029] 5, the multi-core cable solder connection device 16 can align the exposed portions 4 of the three conductor wires 3 by supporting the coating layers 5 located on both sides of the exposed portions 4 of the three conductor wires 3 of the multi-core cable 1 with support blocks 6 arranged on both sides of the exposed portions 4. The coating layer 5 is held by gripping parts (not shown) arranged outside the support blocks 6, which pull it to both sides and apply tension to the multi-core cable 1.

[0030] The multi-core cable solder connection device 16 also has a pressure bar (pressing member) 8 that presses the conductor wire 3 against the three V-grooves 7a of the upper collet 7, and a lower collet (second collet) 13 that is arranged opposite the upper collet 7 and is capable of supporting a sensor chip 10 equipped with three electrode pads 10a.

[0031] As a result, with the exposed portions 4 of the three conductor wires 3 aligned by the support block 6 shown in Figure 5, it is possible to press the exposed portions 4 of the three conductor wires 3 against the three V-grooves 7a of the upper collet 7 by the presser bar 8, as shown in Figure 11.

[0032] The upper collet 7 and the lower collet 13 are heater collets that can be heated.

[0033] This aligns the exposed portions 4 of the three conductor wires 3 and presses the exposed portions 4 of the conductor wires 3 against the V-groove 7a of the upper collet 7. With this state, the heated upper collet 7 and lower collet 13 apply a load to the conductor wires 3 and the sensor chip 10, soldering the exposed portions 4 of the conductor wires 3 to the electrode pads 10a of the sensor chip 10.

[0034] 5 and 6, the support block 6 that supports the multi-core cable 1 has three V-grooves (second grooves) 6a. This allows the covering layers 5 of the electric wires 2 of the multi-core cable 1 to be placed in the respective V-grooves 6a of the support blocks 6 arranged on both sides of the exposed portions 4 of the conductor wires 3 of the multi-core cable 1, and these covering layers 5 to be supported by the support blocks 6 on both sides of the exposed portions 4, thereby making it possible to align the exposed portions 4 of the three conductor wires 3.

[0035] In addition, the multi-core cable solder connection device 16 further has a double-edged razor (cutter) 12 that cuts the exposed portion 4 of the conductor wire 3 of the multi-core cable 1 shown in Figure 12, which is placed in the V-groove 7a of the upper collet 7.

[0036] As a result, the exposed portions 4 of the three conductor wires 3 are aligned by the support block 6, and with the exposed portions 4 of the conductor wires 3 of the multi-core cable 1 pressed against the V-groove 7a of the upper collet 7 by the presser bar 8, it is possible to cut the exposed portions 4 of the conductor wires 3 of the multi-core cable 1 with the double-edged razor 12. However, the multi-core cable solder connection device 16 does not necessarily have to have the double-edged razor 12.

[0037] <How to solder a multi-core cable> A multi-core cable 1 is prepared in which three electric wires 2 are twisted together to form a twisted wire as shown in Figure 1, and the three electric wires 2 of this multi-core cable 1 are untwisted and arranged so that the three electric wires 2 are lined up horizontally.

[0038] On the other hand, a sensor chip 10 is prepared in which three electrode pads 10a are arranged at intervals of about 0.1 mm as shown in Fig. 2. Solder 14 shown in Fig. 3 is applied to each of the three electrode pads 10a of the sensor chip 10.

[0039] Next, as shown in Figure 5, in a multi-core cable 1 in which a portion of each of three conductor wires 3 is exposed, the coating layers 5 located on both sides of the exposed portions 4 of the three conductor wires 3 are supported by support blocks 6 arranged on both sides of the exposed portions 4 of each conductor wire 3.

[0040] Specifically, two support blocks 6, each having three V-grooves (second grooves) 6a, are prepared, and the coating layer 5 on both sides of the exposed portion 4 is placed in the three V-grooves 6a of each of the two support blocks 6, thereby supporting the multi-core cable 1 with the two support blocks 6. In this way, the support blocks 6 arranged on both sides of the exposed portion 4 of the multi-core cable 1 support the coating layer 5, thereby aligning the exposed portions 4 of the three conductor wires 3. Note that it is preferable that the installation pitch of the three V-grooves 6a of the support blocks 6 is the same as the installation pitch of the three electrode pads 10a of the sensor chip 10 (the pad pitch of the electrode pads 10a). In addition, the coating layer 5 is held by a holding portion (not shown) arranged outside the support blocks 6, thereby applying tension to the multi-core cable 1.

[0041] Next, as shown in FIG. 7, adhesive is applied to the exposed portions 4 of the three conductor wires 3 of the multi-core cable 1. Specifically, the adhesive is applied to the exposed portions 4 near the boundary between the exposed portions 4 and the coating layer 5. As an example of the adhesive, a UV adhesive 9 is used. The UV adhesive 9 is a UV-curable epoxy adhesive.

[0042] After applying the UV adhesive 9, the exposed portions 4 of the three conductor wires 3 of the multi-core cable 1 are placed in the three V-grooves 7a of the upper collet 7, as shown in Fig. 8, and the three conductor wires 3 are pressed into the three V-grooves 7a in this state. That is, the three conductor wires 3 of the multi-core cable 1 are pressed into the three V-grooves 7a of the upper collet 7 by a presser bar 8. It is preferable that the installation pitch of the three V-grooves 7a of the upper collet 7 is the same as the installation pitch of the three electrode pads 10a of the sensor chip 10.

[0043] Then, the UV adhesive 9 is cured with the three conductor wires 3 of the multi-core cable 1 pressed against the upper collet 7 by the pressure bar 8. Specifically, as shown in FIGS. 9 to 11 , with the three conductor wires 3 of the multi-core cable 1 pressed against the upper collet 7 by the pressure bar 8, UV light 11a is irradiated onto the UV adhesive 9 from the UV light source head 11, thereby curing the UV adhesive 9. That is, as shown in FIG. 11 , with the exposed portions 4 of the three conductor wires 3 placed in the three V-grooves 7a of the upper collet 7, a load P1 is applied to the upper collet 7 by the pressure bar 8. Furthermore, with the load P1 applied by the pressure bar 8, the UV adhesive 9 is cured by irradiating UV light 11a from the UV light source head 11 onto the UV adhesive 9, as shown in FIGS. 9 and 10 .

[0044] As a result, the UV adhesive 9 applied to the exposed portions 4 of the three conductor wires 3 is hardened, and the exposed portions 4 of the three conductor wires 3 are hardened at the same pitch as the installation pitch of the three V-grooves 7a of the upper collet 7. In other words, the three conductor wires 3 can maintain the pitch between each other with high precision, and are hardened at the same pitch as the installation pitch of the three electrode pads 10a of the sensor chip 10.

[0045] Next, as shown in Figure 12, the exposed portions 4 of the three conductor wires 3 are placed in the three V-grooves 7a of the upper collet 7, and the three conductor wires 3 are pressed into the three V-grooves 7a by the presser bar 8. Then, with the three conductor wires 3 fixed with UV adhesive 9 at the same pitch as the placement pitch of the three V-grooves 7a, the three conductor wires 3 are cut at the exposed portions 4 with a double-edged razor 12. That is, the coating layers 5 on both sides of the exposed portions 4 are supported by the support blocks 6, and thus the exposed portions 4 of the three conductor wires 3 are aligned, and with the three conductor wires 3 fixed with the UV adhesive 9, the exposed portions 4 are cut.

[0046] At this time, the conductor wire 3 is cut by the double-edged razor 12 at a position in the exposed portion 4 slightly deviated from the upper collet 7 .

[0047] Furthermore, after the three conductor wires 3 are cut, as shown in Figure 13, the presser bar 8 is moved to a position in the exposed portion 4 slightly removed from the upper collet 7, and the three conductor wires 3 are kept pressed against the three V-grooves 7a by the presser bar 8 at that position. That is, to prevent the three conductor wires 3 from coming out of the three V-grooves 7a, the presser bar 8 presses the three conductor wires 3 toward the upper collet 7 at a position removed from the upper collet 7. When the conductor wires 3 are released from tension after being cut, they tend to come out of the V-grooves 7a due to their twisted nature, but by pressing the three conductor wires 3 toward the upper collet 7 by the presser bar 8, the conductor wires 3 can be prevented from coming out of the V-grooves 7a.

[0048] Next, as shown in Figures 14 to 17, while maintaining the exposed portions 4 of the three conductor wires 3 positioned in the three V-grooves 7a of the upper collet 7, the exposed portions 4 of the three conductor wires 3 of the multi-core cable 1 are soldered to the three electrode pads 10a of the sensor chip 10.

[0049] When soldering the multi-core cable 1 to the sensor chip 10, the upper collet 7 and the lower collet 13 are preheated. Specifically, before aligning the three conductor wires 3 with the three electrode pads 10a of the sensor chip 10, they are heated to a temperature that does not melt the solder 14 applied to the electrode pads 10a of the sensor chip 10. For example, the upper collet 7 is heated to a temperature of 280°C, and the lower collet 13 is heated to a temperature of about 250°C.

[0050] 14, while maintaining the state in which the exposed portions 4 of the three conductor wires 3 are placed in the three V-grooves 7a of the upper collet 7, which has been preheated to approximately 280°C, the sensor chip 10 is placed on the lower collet 13, which has been preheated to approximately 250°C. At this time, solder 14 has been applied in advance to the electrode pads 10a of the sensor chip 10. The solder 14 is, for example, a lead-free gold-tin solder. By placing the conductor wires 3 in the V-grooves 7a of the preheated upper collet 7, the conductor wires 3 are also heated in advance, which reduces the effects of thermal expansion of the conductor wires 3 after alignment.

[0051] As shown in Figure 17, the sensor chip 10 is positioned on the upper surface of the lower collet 13 using a jig 15, and is then supported by suction on the upper surface of the lower collet 13 by evacuating the air through the hole 13a.

[0052] Next, the lower collet 13 on which the sensor chip 10 is mounted is raised toward the upper collet 7. That is, the lower collet 13 is moved upward toward the upper collet 7 Q1.

[0053] Thereafter, the exposed portions 4 of the three conductor wires 3 are aligned with the three electrode pads 10a of the sensor chip 10, and the three conductor wires 3 are brought into contact with the three electrode pads 10a, as shown in FIGS. 15 and 16 . Here, the three conductor wires 3 are pressed against the three electrode pads 10a of the sensor chip 10. Then, a load is applied to the sensor chip 10 and the three conductor wires 3 by the upper collet 7 and the lower collet 13, soldering the exposed portions 4 of the three conductor wires 3 to the three electrode pads 10a of the sensor chip 10. At this time, the upper collet 7 is further heated. At this time, the upper collet 7 is heated until it reaches approximately 300°C, and a load is applied to the sensor chip 10 and the conductor wires 3 by the upper collet 7 and the lower collet 13 to melt the solder 14, thereby soldering the three conductor wires 3 to the three electrode pads 10a.

[0054] <Effects of this embodiment> According to the multi-core cable solder connection method and solder connection device of this embodiment, three V-grooves 7a are formed in the upper collet 7 that supports the three conductor wires 3, and solder connection is performed with the three conductor wires 3 housed in these three V-grooves 7a and pressed against the V-grooves 7a by the presser bar 8. This makes it easy to align the three conductor wires 3 with the three electrode pads 10a of the sensor chip 10. As a result, solder connection between the conductor wires 3 of the multi-core cable 1 and the electrode pads 10a of the sensor chip 10 can be easily performed.

[0055] Furthermore, since the upper collet 7 is provided with a V-shaped groove 7a for accommodating the conductor wires 3 of the multi-core cable 1, the upper collet 7 can easily grip the conductor wires 3.

[0056] Furthermore, by supporting the multi-core cable 1 with support blocks 6 arranged on both sides of its exposed portion 4 and aligning the exposed portions 4 of the three conductor wires 3, it is possible to make it easier to fit the conductor wires 3 into the V-groove 7a.

[0057] Furthermore, by fixing the shape of the three conductor wires 3 with the UV adhesive 9 while the three conductor wires 3 are housed in the three V-grooves 7a, it is possible to suppress pitch deviation of the three conductor wires 3.

[0058] Furthermore, by providing the upper collet 7 with the V-shaped grooves 7a for accommodating the conductor wires 3, it is possible to prevent the conductor wires 3 from being displaced when the sensor chip 10 contacts the electrode pads 10a.

[0059] Furthermore, even after the multi-core cable 1 is cut by the double-edged razor 12, the three conductor wires 3 are kept pressed against the three V-grooves 7a of the upper collet 7 by the presser bar 8. This prevents the three conductor wires 3 from coming off the three V-grooves 7a even if the three conductor wires 3 have a tendency to twist, and keeps the three conductor wires 3 housed in the three V-grooves 7a.

[0060] As a result, when aligning the three conductor wires 3 with the three electrode pads 10a of the sensor chip 10, this alignment can be easily performed.

[0061] Because the multi-core cable 1 is a twisted wire, the soldering work is performed while untwisting the three conductor wires 3 and forcing the twist to be corrected, but the twist makes it difficult to align the wires with the electrode pads 10a of the sensor chip 10. In particular, after the conductor wires 3 are cut, the multi-core cable 1 is released from tension, and the twist makes it easy for the conductor wires 3 to come out of the V-groove 7a. However, by using the pressure bar 8 to press the conductor wires 3 into the V-groove 7a, it is possible to prevent the conductor wires 3 from coming out.

[0062] Furthermore, the pad pitch of the electrode pads 10a of the sensor chip 10 is very small, for example, 0.1 mm or less, making it very difficult to align the twisted conductor wires 3 with the electrode pads 10a of the sensor chip 10.

[0063] Therefore, in the method for soldering the multi-core cable 1 of this embodiment, the three conductor wires 3 are soldered to the three electrode pads 10a of the sensor chip 10 while they are housed in the three V-grooves 7a of the upper collet 7, which makes it easy to align the three conductor wires 3 with the three electrode pads 10a of the sensor chip 10. This makes it easy to solder the conductor wires 3 of the multi-core cable 1 to the electrode pads 10a of the sensor chip 10.

[0064] The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the present invention. For example, although the multi-core cable 1 has been described as being composed of three electric wires 2, each having a conductor wire 3, the number of electric wires 2 included in the multi-core cable 1 may be two or more.

[0065] Furthermore, the electronic component to which the conductor wires 3 of the multi-core cable 1 are soldered may be an electronic component other than the sensor chip 10. [Explanation of symbols]

[0066] 1 multi-core cable 2 electric wire 3 Conductor wire 4 Exposed part 5 Covering layer 6 Support block (support member) 6a V groove (2nd groove) 7 Upper collet (first collet) 7a V groove (1st groove) 8 Presser bar (pressing member) 9 UV adhesive (adhesive) 10 Sensor chips (semiconductor chips, electronic components) 10a Electrode pad (electrode) 11 UV light source head 11a UV 12 Double-edged razor (cutter) 13 Lower collet (second collet) 13a Hole 14 Solder 15 Jig 16 Solder connection device P1 load Q1 Move

Claims

1. A method for soldering a multi-core cable including a plurality of conductor wires each covered with a covering layer, comprising: (a) supporting the covering layer located on both sides of the exposed portions of the plurality of conductor wires in the multi-core cable from which a portion of the covering layer has been removed and a portion of each of the plurality of conductor wires has been exposed; (b) placing the exposed portions of the plurality of conductor wires in a plurality of first grooves of a first collet; (c) cutting the conductor wires at the exposed portions while the conductor wires are pressed against the first grooves; (d) soldering the exposed portions of the conductor wires to a plurality of electrodes of an electronic component while maintaining the exposed portions of the conductor wires in the plurality of first grooves; A method for soldering a multi-core cable, comprising:

2. The method for soldering a multi-core cable according to claim 1, In the step (a), the coating layer on both sides of the exposed portion is placed in a plurality of second grooves formed in two support members, and the coating layer is supported by the two support members, and the exposed portions of the plurality of conductor wires are aligned by the two support members.

3. 3. The method for soldering a multi-core cable according to claim 2, A method for soldering a multi-core cable, comprising: after step (a), applying an adhesive to the exposed portions of the plurality of conductor wires; after applying the adhesive, in step (b), arranging the exposed portions of the plurality of conductor wires in the plurality of first grooves of the first collet; and before step (c), hardening the adhesive while the plurality of conductor wires are pressed against the plurality of first grooves.

4. The method for soldering a multi-core cable according to claim 3, The (c) step includes a step of maintaining a state in which the plurality of conductor wires are pressed against the plurality of first grooves after cutting the plurality of conductor wires.

5. The method for soldering a multi-core cable according to claim 4, In the step (d), the exposed portions of the plurality of conductor wires are maintained in the plurality of first grooves of the first collet, which has been preheated, while the electronic component is placed on a second collet, which is provided opposite the first collet and has been preheated; and a load is applied to the plurality of conductor wires and the electronic component by the first collet and the second collet, thereby soldering the exposed portions of the plurality of conductor wires to the plurality of electrodes of the electronic component.

6. 3. The method for soldering a multi-core cable according to claim 2, The multi-core cable is a twisted wire in which the plurality of conductor wires are twisted together, the electronic component is a semiconductor chip, A method for soldering a multi-core cable, comprising soldering the exposed portions of the conductor wires to the electrodes of the semiconductor chip while the conductor wires are untwisted.

7. 7. The method for soldering a multi-core cable according to claim 6, A method for soldering a multi-core cable, wherein the installation pitch of the plurality of first grooves of the first collet, the installation pitch of the plurality of second grooves of the support member, and the installation pitch of the plurality of electrodes of the semiconductor chip are the same.

8. A solder connection device for a multi-core cable including a plurality of conductor wires each covered with a covering layer, a first collet having a plurality of first grooves for accommodating exposed portions of the plurality of conductor wires from which portions of the coating layer have been removed; a pressing member that presses the exposed portions of the plurality of conductor wires against the plurality of first grooves; a second collet disposed opposite the first collet and supporting an electronic component having a plurality of electrodes; and A multi-core cable solder connection device in which, with the exposed portions of the plurality of conductor wires pressed against the plurality of first grooves by the pressing member, the first collet and the second collet apply a load to the plurality of conductor wires and the electronic component to solder-connect the exposed portions of the plurality of conductor wires to the plurality of electrodes of the electronic component.

9. 9. The solder connection device for a multi-core cable according to claim 8, the wiring harness further includes support members for supporting the coating layers located on both sides of the exposed portions of the plurality of conductor wires; the support member has a plurality of second grooves; a solder connection device for a multi-core cable, the device placing the coating layer of each of the conductor wires in the second grooves and aligning the exposed portions of the conductor wires with the support member;

10. 10. The solder connection device for a multi-core cable according to claim 9, a cutter for cutting the plurality of conductor wires; a solder connection device for a multi-core cable, wherein the exposed portions of the plurality of conductor wires are aligned by the support member and pressed against the plurality of first grooves by the pressing member, and the exposed portions of the plurality of conductor wires are cut by the cutter.

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