Process kit enclosure system

Abstract

To provide a holding system and an enclosure system for holding process kit rings.SOLUTION: A process kit enclosure system includes surfaces to enclose an interior volume, a support structure 230A including fins 232A, a support structure 230B including fins 232B, and a front interface to interface with a load port of a wafer processing system. The fins are set to be sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each process kit ring 242 is secured to one of the process kit ring carriers and enables transfer of a process kit ring carrier securing a process kit ring from the process kit enclosure system into the wafer processing system and automated transfer thereof from the wafer processing system into the process kit enclosure system.SELECTED DRAWING: Figure 2A

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate to an apparatus and method for process kit ring replacement in a processing chamber (e.g., one used in a wafer processing system), and more particularly to an enclosure for holding the process kit ring.

[0002] In semiconductor processing and other electronics processing, platforms using robotic arms are often used to transport objects, such as wafers, between processing chambers, from a storage area (e.g., a front-opening unified pod (FOUP)) to a processing chamber, from a processing chamber to a storage area, etc. A processing system, such as a wafer processing system, has one or more processing chambers for processing substrates. Gases can be used to etch the substrate in the processing chamber (e.g., the substrate can be etched while electrostatically clamped in place in the etching chamber). One or more process kit rings can surround the substrate (e.g., to protect one or more portions of the processing chamber, substrate, etc.). For example, a circular component called an edge ring or process kit ring can be positioned just outside the outer diameter of the substrate to prevent the etchant chemistry from etching the top surface of the chuck (e.g., an electrostatic chuck) that supports the substrate. Process kit rings can be fabricated from several different materials and can have various shapes, which affect the process uniformity near the process kit ring. During processing, the process kit ring etchs over time, resulting in changes in shape and process uniformity.

[0003] To address changes in processing uniformity due to process kit ring degradation, process kit rings are replaced on a scheduled basis. Traditionally, to replace a process kit ring, an operator opens the processing chamber to access the internal process kit ring, manually removes and replaces the process kit ring, and closes the processing chamber. While the processing chamber is open, the processing chamber and processing system may become contaminated with cells, hair, dust, etc. The processing chamber and / or processing system then undergoes a recertification process, which may remove the processing chamber and / or processing system from operation for several days to several weeks. This impacts line yield, scheduling, quality (e.g., to accommodate the addition of variables to the system), etc. Overview

[0004] The following is a simplified summary of the disclosure to provide a basic understanding of some aspects of the disclosure. This summary is not an extensive overview of the disclosure. It is not intended to identify key or critical elements of the disclosure, nor to delineate the scope or scope of particular implementations of the disclosure. Its sole purpose is to present some concepts of the disclosure in a simplified form as a prelude to the more detailed description that is presented later.

[0005] In one aspect of the present disclosure, the process kit enclosure system further includes a plurality of surfaces at least partially enclosing an interior volume of the process kit enclosure system. The process kit enclosure system further includes a first support structure including a first plurality of substantially horizontal fins. The process kit enclosure system further includes a second support structure including a second plurality of substantially horizontal fins. The first plurality of substantially horizontal fins and the second plurality of substantially horizontal fins are sized and spaced to hold a plurality of process kit ring carriers and a plurality of process kit rings within the interior volume of the process kit enclosure system. Each of the plurality of process kit rings can be secured to one of the plurality of process kit ring carriers. The process kit enclosure system further includes a front interface coupled to one or more of the plurality of surfaces and interfacing the process kit enclosure system with a load port of a wafer processing system. The process kit enclosure system enables a first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system to a wafer processing system, and a second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system to the process kit enclosure system.

[0006] In another aspect of the present disclosure, a method includes interfacing a front interface of a process kit enclosure system with a load port of a wafer processing system. The process kit enclosure system includes a plurality of process kit ring carriers and a plurality of process kit rings within an interior volume of the process kit enclosure system. The interior volume is surrounded by a plurality of surfaces of the process kit enclosure system to which the front interface is coupled. Each of the plurality of process kit rings is secured to one of the plurality of process kit ring carriers. Each of the plurality of process kit ring carriers is positioned on a corresponding first substantially horizontal fin of a first plurality of substantially horizontal fins of a first support structure and a corresponding second substantially horizontal fin of a second plurality of substantially horizontal fins of a second support structure. The method further includes performing a first automated transfer of the first process kit ring carrier securing the first process kit ring from the process kit enclosure system to the wafer processing system using a robotic arm. The method further includes performing a second automated transfer of a second process kit ring carrier, which secures a used second process kit ring, from the wafer processing system to the process kit enclosure system using the robot arm or the additional robot arm.

[0007] In another aspect of the present disclosure, a process kit enclosure system includes a plurality of surfaces at least partially enclosing an interior volume of the process kit enclosure system. The process kit enclosure system further includes a first support structure disposed within the interior volume. The process kit enclosure system further includes a second support structure disposed within the interior volume. The process kit enclosure system further includes an empty process kit ring carrier disposed on a first substantially horizontal fin of the first support structure and a second substantially horizontal fin of the second support structure. The process kit enclosure system further includes a plurality of process kit ring carriers disposed on corresponding substantially horizontal fins of the first support structure and the second support structure. The plurality of process kit ring carriers can be positioned above the empty process kit ring carrier within the process kit enclosure system. A corresponding process kit ring can be secured to each of the plurality of process kit ring carriers. The process kit enclosure system further includes a placement verification wafer disposed on a third substantially horizontal fin of the first support structure and a fourth substantially horizontal fin of the second support structure. The placement verification wafer is positioned above a plurality of process kit ring carriers within the process kit enclosure system. [Brief explanation of the drawings]

[0008] The present disclosure is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like references indicate like elements. It should be noted that different references to "one" or "an" embodiment in the present disclosure are not necessarily to the same embodiment, and such references mean at least one. [Figure 1] 1 illustrates a processing system according to one aspect of the present disclosure. [Figure 2A] FIG. 1 illustrates a front view of a process kit enclosure system in accordance with certain embodiments. [Figure 2B] 1 illustrates a top view of a process kit enclosure system in accordance with certain embodiments. [Figure 2C]FIG. 1 illustrates a side view of a process kit enclosure system in accordance with certain embodiments. [Figure 2D] 1 illustrates a bottom view of a process kit enclosure system in accordance with certain embodiments. [Figure 2E] 1 illustrates a rear view of a process kit enclosure system in accordance with certain embodiments. [Figure 2F] 1 illustrates a support structure and retention device of a process kit enclosure system in accordance with certain embodiments. [Figure 3A] 1 illustrates a cross-sectional view of the content on a fin of a support structure of a process kit enclosure system in accordance with certain embodiments. [Figure 3B] 1 illustrates a cross-sectional view of a process kit ring disposed on a process kit ring carrier on a fin of a support structure of a process kit enclosure system in accordance with certain embodiments. [Figure 3C] 1 illustrates a top view of a process kit ring carrier on a fin of a support structure of a process kit enclosure system in accordance with certain embodiments. [Figure 3D] 1 illustrates a top view of a retaining device and a process kit ring disposed on a process kit ring carrier on a fin of a support structure of a process kit enclosure system in accordance with certain embodiments. [Figure 3E] 1 illustrates a top view of a holding device that secures a process kit ring disposed on a process kit ring carrier on a fin of a support structure of a process kit enclosure system in accordance with certain embodiments. [Figure 4A] 1 illustrates a cross-sectional view of the content on a fin of a support structure of a process kit enclosure system in accordance with certain embodiments. [Figure 4B] 1 illustrates a cross-sectional view of a process kit ring disposed on a process kit ring carrier on a fin of a support structure of a process kit enclosure system in accordance with certain embodiments. [Figure 4C] 1 illustrates a top view of a process kit ring carrier on a fin of a support structure of a process kit enclosure system in accordance with certain embodiments. [Figure 4D] 1 illustrates a top view of a retaining device and a process kit ring disposed on a process kit ring carrier on a fin of a support structure of a process kit enclosure system in accordance with certain embodiments. [Figure 4E] 1 illustrates a top view of a holding device that secures a process kit ring disposed on a process kit ring carrier on a fin of a support structure of a process kit enclosure system in accordance with certain embodiments. [Figure 4F] ~ [Figure 4I] 1 illustrates a cross-sectional view of the contents and fins of a process kit enclosure system in accordance with certain embodiments. [Figure 5] 1 illustrates a method for process kit ring replacement in a processing chamber according to certain embodiments. Detailed Description of the Embodiments

[0009] Embodiments described herein relate to a process kit enclosure system. A process kit ring can surround a substrate and / or a portion of a substrate support assembly in a processing chamber to protect components of the processing chamber (e.g., protect the substrate support assembly). When a substrate is etched by an etchant chemistry, the process kit ring can degrade over time. A degraded process kit ring can lead to processing non-uniformities (e.g., non-uniformity of the processed substrate, non-uniformity of the process, etc.). To avoid the non-uniformities, the process kit ring must be replaced periodically. Traditionally, the processing chamber is opened to replace the process kit ring. After opening, the processing chamber undergoes a lengthy re-qualification process. The re-qualification process impacts line yield, scheduling, quality, user time, energy usage, etc.

[0010] The devices, systems, and methods disclosed herein enable automated exchange of process kit rings (e.g., without opening a process chamber) using a process kit enclosure system (e.g., a front-opening unified pod (FOUP) configured to contain one or more process kit rings). The process kit enclosure system can include a surface that at least partially encloses an interior volume of the process kit enclosure system. For example, the process kit enclosure system can include sidewalls, a top cover, a bottom, and a door. The process kit enclosure system can include a front interface (e.g., a door frame, etc.) that interfaces with a load port (e.g., a port of a factory interface) of a wafer processing system. A door can be attached to the front interface of the process kit enclosure system for transfer, and the door can be removed to engage the front interface with the load port. The process kit enclosure system can include a first support structure including a first substantially horizontal fin and a second support structure including a second substantially horizontal fin. The first substantially horizontal fin and the second substantially horizontal fin may be sized and spaced to hold contents (e.g., one or more process kit rings, an empty process kit ring carrier, a process kit ring positioned on a process kit ring carrier, a placement-enabled wafer, etc.) The process kit enclosure system may enable automated transfer of contents (e.g., a new process kit ring secured on a process kit ring carrier, etc.) to a wafer processing system and automated transfer of contents (e.g., a used process kit ring secured in a process kit ring carrier) from a wafer processing system to the process kit enclosure system.

[0011] The devices, systems, and methods disclosed herein are advantageous over conventional solutions. The process kit enclosure system can interface with a load port of a wafer processing system to enable the replacement of a process kit ring without opening the process chamber and without a subsequent recertification process for the process chamber. The load port can be configured to accept various types of enclosure systems, such as a front-opening unified pod (FOUP). The load port can seal the front interface of the process kit enclosure system to prevent contamination to the wafer processing system (factory interface) and to prevent harmful gases from being exhausted from the wafer processing system (factory interface). The process kit enclosure system can include an empty process kit ring carrier for a robot arm of the wafer processing system to remove a used process kit ring from the wafer processing system and place it in the process kit enclosure system. The process kit enclosure system can include a process kit ring that the robot arm can use to replace a used process kit ring in the wafer processing system. The process kit enclosure system can include a placement verification wafer that the robot arm can use to verify the placement of the process kit ring. The process kit enclosure system can enable process kit ring removal, process kit ring replacement, and verification of process kit ring placement without opening the process chamber installed in the processing system and without going through the traditional recertification process. Using the process kit enclosure system to replace the process kit ring has less impact on line yield, scheduling, quality, user time, energy usage, etc. than traditional solutions.

[0012] 1 illustrates a processing system 100 (e.g., a wafer processing system) according to one aspect of the present disclosure. The processing system 100 includes a factory interface 101 coupled to a cassette (e.g., a FOUP) 102 and including a plurality of load ports 128 that may move wafers and / or other substrates into and out of the processing system 100. The factory interface may include a process kit enclosure system 130 (e.g., a cassette, a FOUP, etc.) coupled to the load port 128 and that moves contents 110, such as process kit rings, into and out of the processing system 100.

[0013] The load port 128 may include a front interface that forms a vertical opening. The load port 128 may also have a horizontal surface. The FOUP may have a front interface that forms a vertical opening. The FOUP's front interface may be sized to interface with the front interface of the load port 128 (e.g., the FOUP's vertical opening may be approximately the same size as the load port 128's vertical opening). The FOUP may be placed on the horizontal surface of the load port 128, and the FOUP's vertical opening may be aligned with the load port 128's vertical opening. The FOUP's front interface may be interconnected (e.g., clamped, secured, sealed) with the front interface of the load port 128. The FOUP's bottom plate (e.g., base plate) may have features that engage with the load port's horizontal surface (e.g., load features such as recesses that engage with load port kinematic pin features, load port datum pin clearances, and / or FOUP docking tray latch clamp features). Additionally, the process kit enclosure system 130 has a front interface sized to interface with the front interface of the load port 128. The process kit enclosure system 130 can be positioned on the horizontal surface of the load port 128, with the vertical opening of the process kit enclosure system 130 aligned with the vertical opening of the load port 128. The process kit enclosure system 130 can interconnect with the front interface of the load port 128. The process kit enclosure system 130 has a base plate with features that engage with the horizontal surface of the load port 128. The process kit enclosure system 130 can interface with the same load port 128 used for FOUPs and cassettes containing wafers.

[0014] Additionally, the process kit enclosure system 130 can contain one or more items of contents 110 (e.g., one or more process kit rings, empty process kit ring carriers, process kit rings positioned on process kit ring carriers, placement verification wafers, etc.) For example, the process kit enclosure system 130 can be coupled to the factory interface 101 (e.g., load port 128), which allows for automated transfer of process kit rings on process kit ring carriers to the processing system 100 for replacement of used process kit rings.

[0015] The processing system 100 may also include first vacuum ports 103a, 103b coupling the factory interface 101 to each of the degassing chambers 104a, 104b. Second vacuum ports 105a, 105b may be coupled to each of the degassing chambers 104a, 104b and disposed between the degassing chambers 104a, 104b and the transfer chamber 106, facilitating transfer of wafers and contents 110 (e.g., process kit rings) to the transfer chamber 106. In some embodiments, the processing system 100 includes and / or uses one or more degassing chambers 104 and a corresponding number of vacuum ports 103, 105 (e.g., the processing system 100 may include a single degassing chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transfer chamber 106 may include multiple processing chambers 107 (e.g., four processing chambers 107, a size processing chamber, etc.) disposed around and coupled to it. The processing chambers 107 are coupled to the transfer chamber 106 via respective ports 108 (e.g., slit valves, etc.). In some embodiments, the factory interface 101 is at a higher pressure (e.g., atmospheric pressure) and the transfer chamber 106 is at a lower pressure. Each degassing chamber 104 (e.g., load lock, pressure chamber) can have a first door (e.g., first vacuum port 103) to seal the degassing chamber 104 from the factory interface 101 and a second door (e.g., second vacuum port 105) to seal the degassing chamber 104 from the transfer chamber 106. Contents can be transferred from the factory interface 101 to the degassing chamber 104 while the first door is open and the second door is closed. The first door is closed, the pressure in the degassing chamber is reduced to match that of the transfer chamber 106, the second door is opened, and the contents can be removed from the degassing chamber 104. Local center finding (LCF) can be used to organize the contents within the transfer chamber 106 (before entering the process chamber 107, after leaving the process chamber 107).

[0016] The processing chambers 107 may include one or more of an etch chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), an anneal chamber, etc. Some processing chambers 107 (e.g., etch chambers, etc.) may include process kit rings (e.g., edge rings, process rings, support rings, sliding rings, quartz rings, etc.) therein, which must be replaced from time to time. While conventional systems involve an operator disassembling the processing chamber to replace the process kit ring, the processing system 100 is configured to facilitate the operator replacing the process kit ring without disassembling the processing chamber 107.

[0017] The factory interface 101 includes a factory interface robot 111. The factory interface robot 111 can include a robot arm and can be or include a Selective Compliance Assembly Robot Arm (SCARA, e.g., a two-link SCARA robot, a three-link SCARA robot, a four-link SCARA robot, etc.). The factory interface robot 111 can include an end effector at the end of the robot arm. The end effector can be configured to lift and handle certain objects, such as wafers. Alternatively, the end effector can be configured to handle objects, such as process kit rings (edge ​​rings). The factory interface robot 111 can be configured to transport objects between cassettes 102 (e.g., FOUPs) and stations 104a, 104b.

[0018] The transfer chamber 106 includes a transfer chamber robot 112. The transfer chamber robot 112 may include a robot arm with an end effector at the end of the robot arm. The end effector may be configured to handle a particular object, such as a wafer. The transfer chamber robot 112 may be a SCARA robot, but in some embodiments may have fewer links and / or fewer degrees of freedom than the factory interface robot 111.

[0019] The controller 109 controls various aspects of the processing system 100. The controller 109 may be and / or include a computing device (e.g., a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc.). The controller 109 may include one or more processing devices, which may be general-purpose processing devices (e.g., a microprocessor, a central processing unit, etc.). More specifically, the processing device may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor that executes other instruction sets or a processor that executes a combination of instruction sets. The processing device may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc. The controller 109 may include a data storage device (e.g., one or more disk drives and / or solid-state drives), a main memory, a static memory, a network interface, and / or other components. The controller 109 can execute instructions to perform any one or more of the methods or processes described herein. The instructions can be stored in a computer-readable storage medium, which can include a main memory, a static memory, a secondary storage device, and / or a processing device (during execution of the instructions). The controller 109, in embodiments, can receive signals from and send controls to a factory interface robot 111 and a wafer transfer chamber robot 112.

[0020] FIG. 1 schematically illustrates the transfer of contents 110 (e.g., a process kit ring coupled to a process kit ring carrier) to a processing chamber 107. According to one aspect of the present disclosure, the contents 110 are removed from a process kit enclosure system 130 via a factory interface robot 111 in a factory interface 101. The factory interface robot 111 transfers the contents 110 to each of the degassing chambers 104a, 104b via one of the first vacuum ports 103a, 103b. A transfer chamber robot 112 disposed in a transfer chamber 106 removes the contents 110 from one of the degassing chambers 104a, 104b via a second vacuum port 105a or 105b. The transfer chamber robot 112 moves the contents 110 to the transfer chamber 106, where the contents 110 can be transferred to a processing chamber 107 via each of the ports 108. Although not explicitly shown in FIG. 1, the transfer of contents 110 may include the transfer of process kit rings placed on process kit ring carriers, the transfer of empty process kit ring carriers, the transfer of placement verification wafers, etc.

[0021] While FIG. 1 illustrates one example of the transfer of contents 110, other examples are contemplated. For example, it is contemplated that the process kit enclosure system 130 may be coupled to the transfer chamber 106 (e.g., via a load port in the transfer chamber 106). From the transfer chamber 106, the contents 110 may be loaded into the processing chamber 107 by the transfer chamber robot 112. Further, the contents 110 may be loaded onto a substrate support pedestal (SSP). Additional SSPs may be positioned in communication with the factory interface 101 opposite the illustrated SSP. It is contemplated that processed contents 110 (e.g., used process kit rings) may be removed from the processing system 100 in a manner reverse to any of the methods described herein. When utilizing multiple process kit enclosure systems 130, or a combination of process kit enclosure systems 130 and SSPs, it is contemplated that one SSP or process kit enclosure system 130 can be used for unprocessed contents 110 (e.g., new process kit rings) and other SSPs or process kit enclosure systems 130 can be used to receive processed contents 110 (e.g., used process kit rings).

[0022] In some embodiments, a process kit ring secured to an upper surface of a process kit ring carrier can be stored in the process kit enclosure system 130, and the factory interface robot 111 can insert its end effector into the process kit enclosure system 130 below the process kit ring carrier, lift the process kit ring carrier, remove it from the process kit enclosure system 130, and transport the process kit ring secured to the process kit ring carrier on the robot within the processing system. In some embodiments, the process kit ring is stored within the process kit enclosure system 200 (e.g., without being secured to a process kit ring carrier). The factory interface robot 111 can retrieve an empty process kit ring carrier from within the processing system 100 or the process kit enclosure system 130, use the empty process kit ring carrier to remove a process kit ring from the process kit enclosure system 130, and transport the process kit ring secured to the process kit ring carrier within the processing system 100. In some embodiments, the factory interface robot 111 can remove the process kit ring from the process kit enclosure system 130 and transport the process kit ring within the processing system 100 without the use of a process kit ring carrier.

[0023] 2A illustrates a front view of a process kit enclosure system 200, according to certain embodiments, which can be used to securely hold a process kit ring 242 and allow for replacement of the process kit ring 242 within a wafer processing system (e.g., processing system 100 of FIG. 1).

[0024] The process kit enclosure system 200 includes surfaces that at least partially enclose an interior volume 202 of the process kit enclosure system 200. The surfaces of the process kit enclosure system 200 that enclose the interior volume 202 may include one or more sidewalls 210 (e.g., a right sidewall 210A, a left sidewall 210B, etc.), a bottom 212, a base plate 214, a top cover 216, a door frame 250 (see FIG. 2C), and a door 252 (see FIG. 2C). The door 252 of the process kit enclosure system 200 may be removable. For example, the door 252 may be attached to the process kit enclosure system 200 for transportation of the process kit enclosure system 200. The door 252 can be removed from the process kit enclosure system 200 to expose a front interface (e.g., door frame 250) of the process kit enclosure system 200 that is coupled to one or more surfaces of the process kit enclosure system 200, allowing the process kit enclosure system 200 to interface with a load port of a wafer processing system.

[0025] The process kit enclosure system 200 may meet one or more FOUP standards (e.g., size, weight, interface, handle clearance, etc.). For example, the process kit enclosure system 200 may interface with a load port of a wafer processing system as a substrate FOUP. The process kit enclosure system 200 may have a weight of less than 35 pounds (lbs) so that it can be lifted by one person. The process kit enclosure system 200 may meet one or more Semiconductor Manufacturing Devices and Materials International (SEM) standards (e.g., FOUP door per SEMI E15.1, dock on a load port per SEMI 47.1, placement on kinematic pins per SEMI E57, etc.).

[0026] One or more support structures 230 may be included in the interior volume 202 of the process kit enclosure system 200. In some embodiments, two support structures 230 are disposed in the interior volume 202 to support the contents (e.g., contents 110 in FIG. 1 ). In some embodiments, three support structures 230 are disposed in the interior volume 202 to support the contents (e.g., contents 110 in FIG. 1 ) (see, e.g., FIGS. 4C-E). In some embodiments, four support structures 230 are disposed in the interior volume 202 to support the contents (e.g., contents 110 in FIG. 1 ) (see, e.g., FIGS. 3C-E). Other numbers of support structures may also be used.

[0027] In some embodiments, the support structures 230 are comb-shaped structures. The support structures 230 can be made of plastic (e.g., polyethylene), and reinforcing material can be disposed within the support structures 230 (e.g., carbon fiber fillers, one or more vertical rods of reinforcing material running through the support structures, etc.). Each support structure 230 can include one or more fins 232 (e.g., substantially horizontal fins) to support the contents. Each item of content can be supported by two or more fins (e.g., fin 232A on support structure 230A and fin 232B on support structure 230B) that are substantially horizontal and substantially parallel to one another. The support structures 230 support the contents, allowing an end effector on a robotic arm of a wafer processing system to insert beneath the contents and lift and withdraw the contents from the process kit enclosure system 200.

[0028] In embodiments, the process kit enclosure system 200 may include two, three, or four support structures 230. The upper surfaces of the support structures 230 may be coupled to one another by bridge brackets 234 (see FIG. 2F). The lower surfaces of the support structures 230 may be coupled to the base plate 214. The upper surfaces of the fins 232 may include features (e.g., indentations, recesses) for interfacing with surfaces adjacent the periphery (e.g., sidewalls, lower surface) of the process kit ring carrier 240. For example, the upper surface of each fin 232 may have a recess, and the process kit ring carrier 240 may be positioned in the recess. In some embodiments, the fins 232 support the corners of the process kit ring carrier 240 (e.g., where the periphery transitions from curved to flat).

[0029] The fins 232 of the support structure 230 can be sized and spaced to provide clearance between the top surface of the process kit ring 242 and the bottom surface of the fins 232 directly above the process kit ring 242, which can accommodate the height of the fin 232 recess, the droop and tolerance of the robot arm, and the tolerance between the fins.

[0030] The interior volume 202 of the process kit enclosure system 200 can include at least one process kit ring 242 (e.g., supported by corresponding fins 232 of the support structure 230) for automated transfer to a wafer processing system. A robotic arm can remove the process kit ring 242 from the process kit enclosure system 200 and automatically transfer the process kit ring 242 to a process chamber of the wafer processing system. The robotic arm can remove a used process kit ring from the process chamber and automatically transfer it to the process kit enclosure system 200.

[0031] The process kit ring 242 in the process kit enclosure system 200 may be secured to an upper surface of the process kit ring carrier 240. A robotic arm may remove the process kit ring 242 from the process kit enclosure system 200 by inserting an end effector into the process kit enclosure system 200 beneath the process kit ring carrier 240, lifting the process kit ring carrier 240 and the process kit ring 242 (e.g., by contacting at least a portion of the upper surface of the end effector with at least a portion of the lower surface of the process kit ring carrier 240), and removing the process kit ring carrier 240 with the process kit ring 242 secured to its upper surface. The space between the fins 242 of the support structure 230A and the fins 232 of the support structure 230 may allow the end effector to enter and lift the contents spanning from the fins 232 of the support structure 230A to the fins 232 of the support structure 230B without contacting the fins 232.

[0032] As described herein, a process kit ring 242 on a process kit ring carrier 240 may refer to one or more process kit rings disposed on the process kit ring carrier 240. For example, the process kit ring 242 may include two or more edge rings, processing rings, support rings, sliding rings, quartz rings, etc. disposed on the process kit ring carrier 240.

[0033] In some embodiments, the process kit ring 242 can be placed directly on the fins 232, and a robot arm can retrieve the process kit ring carrier 240 (e.g., from within the wafer processing system) and lift the process kit ring 242. In some embodiments, the robot arm can lift the process kit ring 242 without using the process kit ring carrier 240. One or more process kit rings 242 can be placed on each process kit ring carrier 240. For example, two or three process kit rings 242 can be nested within one another on the process kit ring carrier 240 (e.g., a first process kit ring of a first diameter, a second process kit ring of a second diameter sized to fit within the first process kit ring, and a third process kit ring of a third diameter sized to fit within the second process kit ring).

[0034] Each support structure 230 may include a plurality of fins 232 sized and spaced to retain contents within the interior volume 202 of the process kit enclosure system 200. For example, one or more sets of substantially parallel fins 232 of the support structure 230 may support an empty process kit ring carrier 240 (e.g., a first set of substantially parallel fins 232 may support empty process kit ring carrier 240A, and a second set of substantially parallel fins 232 may support empty process kit ring carrier 240B). One or more sets of substantially parallel fins 232 of the support structure 230 may support a process kit ring carrier 240 with a process kit ring 242 secured thereto. In some embodiments, the support structure 230 may support one, two, three, four, five, six, seven, eight, or some other number of process kit ring carriers 240 with corresponding process kit rings 242 secured thereto. In some embodiments, the fins 232 of the support structure 230 hold process kit ring carriers 240 with corresponding process kit rings 242 secured to the process kit ring carriers 240, equaling the number of process chambers in the wafer processing system. For example, if the wafer processing system has six process chambers, the process kit enclosure system 200 may include six process kit rings 242 (e.g., secured to corresponding process kit ring carriers 240). If the wafer processing system has eight process chambers, the process kit enclosure system 200 may include eight process kit rings 242 (e.g., secured to corresponding process kit ring carriers 240).

[0035] The set of substantially parallel fins 232 of the support structure 230 can support a placement verification wafer 244 (e.g., a multi-feature wafer). In some embodiments, the placement verification wafer 244 can be similar in size to a wafer to be processed by a processing system. The placement verification wafer 244 can be placed on the set of substantially parallel fins 232 to enable automated transfer of the placement verification wafer 244 to a wafer processing system to verify the placement of the process ring kit 242 in the wafer processing system. The fins used to support the placement verification wafer 244 can have a different spacing and / or size than the fins used to support the process kit ring and / or process kit ring carrier.

[0036] Each set of substantially parallel fins 232 can form a slot for supporting its contents. One or more lower slots (e.g., lowest slots) of the process kit enclosure system 200 can each support an empty process kit ring carrier 240. An upper slot (e.g., top slot) of the process kit enclosure system 200 can support a placement verification wafer 244. One or more middle slots (e.g., above the empty process kit ring carrier 240 and below the placement verification wafer 244) can each support a process kit ring carrier 240 that supports a process kit ring 242. One or more sets of substantially parallel fins 232 (e.g., slots for process kit rings 242 on the process kit ring carrier 240) can include a corresponding process kit ring orientation bracket. Each process kit ring orientation bracket can have one or more protrusions (e.g., pins, etc.) that engage with a flat portion of the inner surface of the process kit ring 242 to constrain movement (e.g., rotation, movement in the x and y directions, etc.) of the process kit ring 242. One or more protrusions on the process kit ring 242 and one or more features (eg, pin contacts, recesses, etc.) on the process kit ring carrier 240 can constrain the movement of the process kit ring 242 .

[0037] The robot arm can remove contents (e.g., an empty process kit ring carrier 240, a process kit ring carrier 240 securing a process kit ring 242) from the lower slot and place used contents (e.g., a used process kit ring from a wafer processing system) in the empty lower slot to prevent contamination from the used contents from falling onto other contents (e.g., a new process kit ring 242, a placement verification wafer 244, etc.). For example, one or more robot arms can remove an empty process kit ring carrier 240A from a first slot, use the empty process kit ring carrier 240A to retrieve the used process kit ring, and replace it with a new, full process kit ring carrier 240A and the supported used process kit ring in the first slot. Next, the robot arm can remove a new process kit ring 242C secured to the process kit ring carrier 240C from a third slot above the first and second slots, place the process kit ring 242C in a process chamber, and return the empty process kit ring carrier 240C to the third slot. This process can be repeated with process kit ring carrier 240B and process kit ring 242D and process kit ring carrier 240D, etc., for the next process kit ring change, and so on.

[0038] The upper section of the process kit enclosure system 200 can include clean process kit rings 242, and the lower section can include dirty process kit rings 242 and empty process kit ring carriers 240. In some embodiments, the process kit enclosure system 200 includes one or more physical dividers. The upper and lower sections can be separated by a physical divider to avoid contamination. In some embodiments, dirty process kit rings 242 can be inserted into the process kit enclosure system 200 below the clean process kit rings 242. In some embodiments, a first process kit enclosure system 200 can be used for dirty process kit rings 242 and empty process kit ring carriers, and a second process kit enclosure system 200 can be used for clean process kit rings 242.

[0039] To transport the process kit enclosure system 200, one or more handles 122 can be coupled to a corresponding surface (e.g., an exterior surface, sidewall 210) of the process kit enclosure system 200. For example, handle 222A can be coupled to sidewall 210A, and handle 222B can be coupled to sidewall 210B. The handles 222 can be configured to manually lift and transport the process kit enclosure system 200. In some embodiments, to transport the process kit enclosure system 200, an overhead transport (OHT) flange is coupled to an exterior surface (e.g., top cover 216) of the process kit enclosure system 200.

[0040] The process kit enclosure system 200 may include registration features 220 (e.g., coupled to or integral with the bottom surface 212). The registration features 220 may be used for robot calibration. The registration features 220 may block a robotic wafer mapper. The registration features 220 may allow the process kit enclosure system 200 to be identified as a non-wafer enclosure system (e.g., as not a conventional FOUP that carries wafers). The registration features 220 may allow the process kit enclosure system 200 to be identified as a process kit enclosure system 200. The registration features may allow identification of a particular process kit enclosure system 200 or the type of contents of the process kit enclosure system 200. For example, the registration features 220 may indicate that the process kit enclosure system 200 supports a process kit ring 242 disposed on a process kit ring carrier 240. In some embodiments, the registration feature 220 is a simple tab, peg, protrusion, or the like. A factory interface robot is configured to perform wafer mapping of the contents within the FOUP to determine the number of wafers in the FOUP, wafer placement, etc. However, the process kit ring and process kit ring carrier may be in an unexpected location different from where wafers are typically placed. To perform wafer mapping, the robot arm may move an end effector or other wafer mapper head to the bottom of the process kit enclosure system 200 to begin the wafer mapping process. However, the end effector and / or mapper head may encounter a registration feature 220 and terminate the wafer mapping process.The presence of the registration feature 220 can provide a signal to the controller 190 indicating that the process kit enclosure system 200 is engaged with a load port rather than a conventional wafer-containing FOUP. In some embodiments, the process kit enclosure system 200 includes the registration feature 220 (e.g., a FOUP type recognition feature via FI (front interface) robot mapping) and / or an auto-calibration feature (e.g., an FI robot auto-calibration feature). The registration feature 220 can be located near the door frame 250, and the auto-calibration feature can protrude from near the center of the interior bottom surface of the process kit enclosure system 200 (e.g., near the base plate 214).

[0041] In some embodiments, one or more surfaces of the process kit enclosure system 200 include a transparent window 218 that allows for visual observation of the process kit ring carrier 240 and the process kit ring 242. For example, the back of the process kit enclosure system 200 can include a window 218 (see, e.g., FIGS. 2A and 2E) and / or the top cover 216 of the process kit enclosure system 200 can include a window 218 (see, e.g., FIG. 2B). The window allows an operator to visually inspect the contents of the process kit enclosure system to determine, for example, that the process kit rings and / or process kit ring carriers are properly stored therein.

[0042] Contents entering the process kit enclosure system 200 from the wafer processing system may have corrosive materials (e.g., hydrogen bromide (HBr)) thereon. The process kit enclosure system 200 may be sealed to the load port of the wafer processing system to prevent leakage of corrosive materials from the wafer processing system and the process kit enclosure system 200. The process kit enclosure system 200 may be sealed to the load port of the wafer processing system to clean the process kit enclosure system (e.g., decontaminate internal surfaces and features). Any electronics associated with (e.g., positioned or coupled to) the process kit enclosure system (e.g., battery, communications, sensors, microcontroller unit (MCU), etc.) may be sealed.

[0043] The material of the process kit enclosure system 200 can be compatible with corrosive materials (e.g., HBr). For example, the material of the process kit enclosure system 200 can include one or more of polyethylene, acrylonitrile ethylene propylene diene monomer (AEPDM), ethylene propylene diene monomer (EPDM), perfluoroelastomer (FFKM) (e.g., Chemraz™), fluoroelastomer material (FKM) (e.g., Viton™), and / or polytetrafluoroethylene (PTFE) (e.g., Teflon™). The process kit enclosure system 200 can include purge ports (e.g., in the base plate 114, etc.). The purge ports can be used for nitrogen purging (e.g., N2 purging). For example, after a used process kit ring 242 is transferred into the process kit enclosure system 200, the purge ports can be used to clean contaminants from the process kit enclosure system 200 (e.g., by sending nitrogen gas into the process kit enclosure system 200 to evacuate HBr, etc., from the process kit enclosure system 200). One or more first purge ports can be used to push gas into the process kit enclosure system 200, and one or more second purge ports can be used to remove gas from the process kit enclosure system 200. In some embodiments, the process kit enclosure system 200 does not have purge ports.

[0044] The base plate 214 of the process kit enclosure system 200 may include features (e.g., locating pins, mounting holes) that allow the underside of the support structure 230 to engage with the base plate 214 (e.g., the bottom surface 212 may form corresponding holes for engaging the support structure 230 with the base plate 214).

[0045] The base plate 214 can include features (e.g., bearing surfaces) that allow a lower surface of the holding device 260 (see, e.g., FIG. 2F) to engage (e.g., rotatably couple) with the base plate 214.

[0046] The base plate 214 may include features (eg, mounting holes) that allow the bottom surface 212 of the process kit enclosure system 200 to engage with the base plate 214 .

[0047] The base plate 214 may include features (e.g., locating pins, mounting holes) to allow a door frame to engage with the base plate 214 (e.g., a sidewall of the door frame engages with a sidewall of the base plate 214). The base plate 214 may include features (e.g., auto-teaching mounting holes, FOUP docking track latch clamp features, load port kinematic pin features, load port datum pin clearance, FOUP presence switch features, etc.) to dock the process kit enclosure system 200 onto a wafer processing system (e.g., attaching the base plate 214 to a surface proximate to a load port).

[0048] The front interface of the process kit enclosure system 200 can include a door frame 250 (see FIG. 2C; FIG. 2A may not show the door frame 250). The door frame 250 can include features (recesses) that allow the door frame 250 to engage with the base plate 214. The door frame 250 can include features that allow the door frame 250 to engage with the side wall 210 of the process kit enclosure system 200 (e.g., threaded inserts such as screws that are inserted into channels through the door frame and engage with the side wall 210). The door frame 250 can have features that allow the process kit enclosure system 200 to seal to a load port (e.g., sealed load port side clamp features, recesses that receive clamps from the load port). The door frame 250 and / or the door 252 can include features for coupling to each other.

[0049] The process kit enclosure system 200 may include a surface for partially enclosing the interior volume 202. A portion of the surface may form an enclosure component that is a rectangular prism (e.g., a cube) with a transparent window 218 and cutouts for features. The enclosure component may include a bottom surface 212, sidewalls 210A-B, a front lip, a top lip, and a rear lip. The front lip of the enclosure component may interface with a door frame. The top lip of the enclosure component may mate with the top cover 216. The top lip of the enclosure component may have a cutout for inserting the support structure 230 into the interior volume 202. The rear lip of the enclosure component may mate with the window 218. The bottom surface 212 may include a feature for coupling to a holding device (e.g., a holding device bottom pivot pin). The bottom surface 212 may include a feature (e.g., a cutout) that allows the support structure 230 to be attached to a base plate 214. The bottom surface 212 can be coupled to a registration feature 220 (e.g., a process kit enclosure system 200 recognition feature). In some embodiments, the registration feature 220 and the bottom surface 212 are integral with one another.

[0050] FIG. 2B illustrates a top view of a process kit enclosure system 200, in accordance with certain embodiments.

[0051] The top cover 216 of the process kit enclosure system 200 may include an upper surface and one or more flanges. The top cover 216 may include a docking offset flange for docking to a load port. The top surface of the top cover 216 may have a window cutout for a transparent window 218. The top surface of the top cover 216 may be coupled to the enclosure components by one or more fasteners (e.g., captive thumbscrews). The holding devices 260 may be taller than the top cover 216 and may be captured by features (e.g., recesses) on the top surface of the top cover 216. The base (e.g., lower portion) of each holding device 260 is pinned, allowing the holding device 260 to rotate about the z-axis (e.g., for removal for docking to a load port). Each holding device 260 may have features (e.g., approximately horizontal fins) that prevent contents from spilling out of the recesses in the fins 232 of the support structure 230. Two holding devices with an angular pitch (e.g., not 180 degrees) may be provided. A feature (e.g., a recess) on the top surface of the top cover 216 can be sized to receive a retention feature in a locked position (e.g., a first rotated state) or an unlocked position (e.g., a second rotated state, removed, etc.).

[0052] In some embodiments, the top cover 216 has a docking position (e.g., a docking flange on the same side as the door frame) and a transport position (e.g., a docking flange on the same side as the rear window 218). Fasteners can be used to remove the top cover 216 in a first position and attach the top cover 216 in a second position. In the transport position, features (e.g., recesses) on the top cover 216 can only accept the holding device 260 in the locked position. Features (e.g., recesses) on the top cover 216 in the docking position can only accept the holding device 260 in the unlocked position. In some embodiments, the locked position rotates the holding device 260 to secure content to the fins 232 of the support structure 230. In some embodiments, the unlocked position rotates the holding device 260 to not secure content to the fins 232 of the support structure 230. In some embodiments, the unlocked position removes the retention device 260 from the interior volume 202 of the process kit enclosure system 200 (eg, removes the retention device 260 before attaching the top cover 216 to the docking position).

[0053] In some embodiments, the top cover 216 includes a transparent window 218 to provide visual recognition of the contents on the support structure. In some embodiments, the top cover 216 does not include a transparent window 218.

[0054] 2C shows a side view of the process kit enclosure system 200, according to certain embodiments. A door frame 250 may be coupled to the side wall 210 and the base plate 214. A door 252 may be coupled to the door frame 250 for transport of the process kit enclosure system 200. The door 252 may be removed from the process kit enclosure system 200 to load contents into the process kit enclosure system 200. The door 252 may be removed from the process kit enclosure system 200 to couple the process kit enclosure system 200 to a load port.

[0055] 2D shows a bottom view of the process kit enclosure system 200, according to certain embodiments. A base plate 214 may be disposed at the bottom of the process kit enclosure system 200. The base plate 214 may interface (e.g., have features that interface) with one or more features of a wafer processing system proximate a loading port (e.g., kinetic pins, clamps, etc.). The base plate 214 may be coupled to one or more load port presence sensors, load port coupling interfaces, recesses, etc.

[0056] 2E shows a rear view of process kit enclosure system 200, according to certain embodiments. In some embodiments, a transparent window 218 is coupled to the rear lip of the enclosure component of process kit enclosure system 200 to provide visual recognition of the contents on support structure 230. In some embodiments, the rear of the process kit enclosure does not include transparent window 218 (e.g., instead of a rear lip, the enclosure component can include a rear sidewall 210C).

[0057] FIG. 2F illustrates the support structure 230 and the holding device 260 of the process kit enclosure system 200, according to certain embodiments.

[0058] Content supported on the fins 232 of the support structure 230 can be restrained during transport. For example, one or more retention devices 260 can secure each of the process kit rings 242 to a corresponding one of the process kit ring carriers 240 and can further secure each of the process kit ring carriers 240 within the process kit enclosure system 200 during transport of the process kit enclosure system 200. A lockout feature (e.g., of the retention device) can block engagement of the process kit enclosure system 200 with a load port of a wafer processing system in response to the one or more retention devices 260 being in a locked position. The lockout feature can allow engagement of the process kit enclosure system 200 with a load port in response to the retention device 260 being in an unlocked position (e.g., removed or not engaging a top surface of the content). In some embodiments, coupling the door 252 to the process kit enclosure system 200 allows the holding device 260 to be placed in a fixed position, and removing the door 252 from the process kit enclosure system 200 allows the holding device 260 to be placed in an unlocked position. In some embodiments, to interface (e.g., engage, dock, etc.) the front interface of the process kit enclosure system 200 with a load port, the door 252 is removed, the top cover 216 is removed, the holding device 260 is placed in an unlocked position (e.g., detached, rotated), and the top cover is installed in a docking position (e.g., rotated from its original transport position). The process kit enclosure system 200 cannot be docked unless the top cover 216 is in the docking position, and the top cover 216 cannot be installed in the docking position unless the holding device 260 is in the unlocked position.To transport the process kit enclosure system 200, the top cover 216 is removed, the holding device 260 is placed in a fixed position (e.g., inserted into the interior volume 202 and / or rotated), the top cover 216 is attached to the transport position (e.g., if the holding device 260 is not in the fixed position, the top cover 216 may not be attached to the transport position), and the door 252 may be coupled to the process kit enclosure system 200 (e.g., when the top cover 216 is in the transport position, the door 252 cannot be attached). The holding device 260 can be rotated to the fixed position to secure the process kit ring carrier 240. The holding device 260 can also be rotated to an unlocked position to unlock each of the multiple process kit ring carriers 240.

[0059] The process kit ring carrier 240 and the process kit ring 242 secured thereto may be held (e.g., by one or more holding devices 260) to minimize movement of the process kit ring carrier 240 and the process kit ring 242. The process kit ring carrier 240 and / or the process kit ring 242 may be held by one or more of the following: friction; vacuum pads and pilot check valves; passive edge grips; passive self-aligning; semi-active edge grips (e.g., a comb or lever rotated by a human or machine, a variable height adjustable comb to support varying process kit ring sizes (e.g., predetermined or variable)); closure of the door 252 to actuate the holding device 260; clamping the carrier with a lever couple when the process kit ring carrier 240 is seated due to the weight of the process kit ring carrier 240 and the process kit ring 242; one or more pneumatic clamps; and / or a sensor powered by an actuator and a lever actuated by the holding device 260.

[0060] In some embodiments, the process kit enclosure system 200 (e.g., the support structure 230 and / or the holding device) can capture six degrees of freedom (e.g., x-translation, y-translation, z-translation, x-rotation, y-rotation, and z-rotation) of the process kit ring carrier 240 and / or the process kit ring 242. The process kit ring 242 can be constrained in x-translation, y-translation, and z-rotation by features (e.g., buttons, protrusions) on the process kit ring carrier 240. The process kit ring 242 can be constrained in z-translation, x-rotation, and y-rotation by gravity. In response to the process kit ring 242 being effectively fully constrained at the top surface of the process kit ring carrier 240 (e.g., by features on the process kit ring carrier 240 and gravity), the process kit enclosure system 200 (e.g., the support structure 230 and / or the holding device 260) can be used to support and constrain the process kit ring carrier 240.

[0061] The process kit ring carrier 240 can have a periphery that includes two opposing curved edges and two flat edges that are substantially parallel to each other (e.g., parallel edges, straight edges). The support structure 230 can support the process kit ring carrier 240 at the flat edges.

[0062] In some embodiments, the holding device 260 can capture six degrees of freedom of the process kit ring carrier 240 and the process kit ring 242. In some embodiments, the support structure 230 and the holding device 260 can capture six degrees of freedom of the process kit ring carrier 240 and the process kit ring 242.

[0063] In some embodiments, the process kit enclosure system 200 includes a microcontroller and a battery for securely securing the contents on the support structure 230. For example, the microcontroller can place (e.g., rotate) the holding device 260 in a fixed position (e.g., in response to an input that the process kit enclosure system 200 is to be transported) and can place (e.g., rotate) the holding device 260 in a non-fixed position (e.g., in response to an input that the process kit enclosure system 200 is to be docked).

[0064] In some embodiments, the fins 262 of the holding device 260 can secure content of different heights. For example, the fins 262 can secure an empty process kit ring carrier 240 to the first set of fins 232 of the support structure (e.g., during transport of the process kit enclosure system 200 to a loading port), and the fins 262 can secure a used process kit ring on the process kit ring carrier 240 on the first set of fins 232 of the support structure (e.g., during transport of the process kit enclosure system 200 from the loading port after replacing one or more process kit rings). For example, the fins 262 can be mass hooks that adjust for different heights of content on the fins 232 of the support structure 230.

[0065] FIG. 3A illustrates a cross-sectional view of content (e.g., a process kit ring carrier 340 (e.g., process kit ring carrier 240 in FIG. 2A) or a placement verification wafer 344 (e.g., placement verification wafer 244 in FIG. 2A)) on a fin 332 (e.g., fin 232 in FIG. 2A) of a support structure 330 (e.g., support structure 230 in FIG. 2A) of a process kit enclosure system 300 (e.g., process kit enclosure system 200 in FIG. 2A) in accordance with certain embodiments. The fin 332 can form a recess, and content can be disposed in the recess. In some embodiments, an upper surface of the content includes a protrusion for coupling with the process kit ring 342 (e.g., process kit ring 242).

[0066] 3B shows a cross-sectional view of a process kit ring 342 disposed on a process kit ring carrier 340 on a fin 332 of a support structure 330 of a process kit enclosure system 300, according to certain embodiments. The process kit ring 342 can be constrained in x-translation, y-translation, and z-rotation by protrusions on the process kit ring carrier 340. The process kit ring 342 can be constrained in z-translation, x-rotation, and z-rotation by gravity.

[0067] 3C shows a top view of a process kit ring carrier 340 on fins 332 of a support structure 330 of a process kit enclosure system 300, according to certain embodiments. The process kit ring carrier 340 can be placed on the fins 332 manually or by a robotic arm. In some embodiments, the process kit enclosure system 300 can include four support structures 330, each with a corresponding fin 332.

[0068] 3D illustrates a top view of a retaining device 360 ​​(e.g., retaining device 260 of FIG. 2F) and a process kit ring 342 disposed on a process kit ring carrier 340 on fins 332 of a support structure 330 of a process kit enclosure system 300, according to certain embodiments. The top surface of the process kit ring carrier 340 can have one or more protrusions (e.g., one protrusion per fin 332). The one or more protrusions can capture a degree of freedom (e.g., limit movement) of the process kit ring 342.

[0069] 3E illustrates a top view of a holding device 360 ​​securing a process kit ring 342 disposed on a process kit ring carrier 340 on fins 332 of a support structure 330 of a process kit enclosure system 300, according to certain embodiments. The holding device 360 ​​can be rotated so that the lower surface of the holding device 360 ​​(e.g., the lower surface of the fins 362 of the holding device 360) is above the contents of the fins 332. In some embodiments, the holding device 360 ​​is in contact with the upper surface of the contents on the fins 332. For example, the fins 362 of the holding device 360 ​​may be in contact with the upper surface of the process kit ring 342. In some embodiments, the holding device 360 ​​is positioned above the contents, thereby preventing the contents from falling off the fins 332. For example, the distance between the lower surface of the fins 362 of the holding device 360 ​​and the upper surface of the process kit ring 342 can be less than the height of a protrusion above the upper surface of the process kit ring carrier 340.

[0070] 4A-I illustrate content disposed on one or more fins 432 of a process kit enclosure system 400 according to certain embodiments. In some embodiments, the content (e.g., a process kit ring carrier 440, a placement verification wafer 444) has a flat bottom surface on a first plane and one or more features (e.g., protrusions, pads) extending from the first plane. For example, the process kit ring carrier 440 can have one or more pads that wrap from the sides of the process kit ring carrier 440 to the bottom surface of the process kit ring carrier 440. Each fin 432 can have a recess (e.g., a slot) that receives a feature (e.g., a pad) of the process kit ring carrier 440. In some embodiments, only the features of the process kit ring carrier 440 engage the fins 432 (e.g., the flat bottom surface of the process kit ring carrier 440 does not engage the fins 432). In some embodiments, recesses in the fins 432 (which receive the pads of the process kit ring carrier 440) limit the movement of the process kit ring carrier 440 in the x and y directions.

[0071] FIG. 4A illustrates a cross-sectional view of content (e.g., a process kit ring carrier 440 (e.g., process kit ring carrier 240 of FIG. 2A) or a placement verification wafer 444 (e.g., placement verification wafer 244 of FIG. 2A)) on a fin 432 (e.g., fin 232 of FIG. 2A) of a support structure 430 (e.g., support structure 230 of FIG. 2A) of a process kit enclosure system 400 (e.g., process kit enclosure system 200 of FIG. 2A) in accordance with certain embodiments. The fin 432 can form a first recess, and content can be disposed in the first recess. The fin 432 can form a second recess that mates with the process kit ring 442 (e.g., process kit ring 242).

[0072] 4B shows a cross-sectional view of a process kit ring 442 disposed on a process kit ring carrier 440 on a fin 432 of a support structure 430 of a process kit enclosure system 400, according to certain embodiments. The process kit ring 442 may be constrained in x-translation, y-translation, and z-rotation by a second recess in the fin 432 of the support structure 430. The process kit ring 442 may be constrained in z-translation, x-rotation, and y-rotation by gravity. The process kit ring carrier 440 may have a slot 452. The slot may correspond to a registration feature of the process kit ring 442 (e.g., a flat interior sidewall surface or other registration feature of the process kit ring 442). In some embodiments, the fin 432 may be sized and shaped (e.g., have corresponding features) to constrain movement of the process kit ring 442. For example, the fin 432 may have a second recess sized to receive the process kit ring 442. In some embodiments, the process kit ring orientation bracket can have one or more protrusions (e.g., pins) that engage with registration features (e.g., flat interior sidewall surfaces) of the process kit ring 442 to constrain movement of the process kit ring 442.

[0073] 4C shows a top view of a process kit ring carrier 440 on fins 432 of a support structure 430 of a process kit enclosure system 400, according to certain embodiments. The process kit ring carrier 440 can be placed on the fins 432 manually or by a robotic arm. In some embodiments, the process kit enclosure system 400 can include three support structures 430, each with a corresponding fin 432. In some embodiments, each fin of the support structure forms a first recess, and one fin of the support structure 430 forms a second recess. The process kit ring carrier 800 can be placed on one or more fins 894 (e.g., two fins, three fins, four fins, etc.).

[0074] 4D illustrates a top view of a retaining device 460 (e.g., retaining device 260 of FIG. 2F ) and a process kit ring 442 disposed on a process kit ring carrier 440 on a fin 432 of a support structure 430 of a process kit enclosure system 400, according to certain embodiments. A portion of the process kit ring 442 can be disposed within a second recess in the fin 432 of the support structure 430. The second recess formed by the fin 432 can capture a degree of freedom (e.g., constrain movement) of the process kit ring 442.

[0075] 4E illustrates a top view of a holding device 460 securing a process kit ring 442 disposed on a process kit ring carrier 440 on fins 432 of a support structure 430 of a process kit enclosure system 400, according to certain embodiments. In some embodiments, the holding device 460 can be rotated so that the lower surface of the holding device 460 (e.g., the lower surface of the fins 462 of the holding device 460) is above the contents of the fins 432. In some embodiments, the holding device 460 is in contact with the upper surface of the contents on the fins 432. For example, the fins 462 of the holding device 460 can be in contact with the upper surface of the process kit ring 442. In some embodiments, the holding device 460 is positioned above the contents to prevent the contents from falling off the fins 432. For example, the distance between the lower surface of the fins 462 of the holding device 460 and the upper surface of the process kit ring 442 can be less than the height to be overcome to remove the process kit ring 242 from the second recess. In some embodiments, the holding device 460 can be placed in a non-secure position (e.g., rotated, rotated and removed, etc.) to transport the contents (e.g., process kit ring carrier 440 and / or process kit ring 442 thereon) into a processing system. In some embodiments, the holding device 460 can pivot to secure the process kit ring carrier 800 and / or the process kit ring 820 in response to a portion of the process kit ring carrier 800 engaging the holding device.

[0076] 4F-I show cross-sectional views of the contents (e.g., process kit ring carrier 440) and fins 432 of process kit enclosure system 400, according to certain embodiments. In some embodiments, holding device 460 may be a pivoting clamp. When the contents (e.g., process kit carrier 440) are not on fin 894, the center of gravity of holding device 896 may cause the clamping portion of holding device 896 to be oriented to receive the contents (e.g., the clamping portion of holding device 896 may be oriented upward, as shown in FIGS. 4F and 4H). When the contents (e.g., the process kit ring carrier 440 with or without the process kit ring 442 thereon) are lowered onto the fins 432, the process kit ring carrier 440 engages the holding device 460 (e.g., with a clamping portion of the holding device 460) and pivots the holding device 460 to a fixed position (e.g., a first portion of the clamping portion of the holding device 460 above the process kit ring carrier 440 and a second portion of the clamping portion of the holding device 460 below the process kit ring carrier 440). In some embodiments, the clamping portion of the holding device 460 can be sized to receive one or more of the placement verification wafer 444, the process kit ring carrier 440, or the process kit ring 442 (e.g., the process kit ring 442 disposed on the process kit ring carrier 440). The process kit ring carrier 440 can have one or more features (e.g., pads, feet, etc.) where a corresponding feature engages with each of the fins 432 (e.g., a recess in each of the fins 432). The one or more features may be the only portion of the process kit ring carrier 440 that engages with the fins 432 .

[0077] FIG. 5 illustrates a method 500 for process kit ring replacement in a processing chamber, according to certain embodiments. Although shown in a particular sequence or order, unless otherwise specified, the order of the processes can be varied. Therefore, the illustrated embodiment should be understood as an example only, and the illustrated processes can be performed in a different order, and some processes can be performed in parallel. Furthermore, in various embodiments, one or more processes may be omitted. Thus, not all processes are required in all embodiments.

[0078] The contents can be disposed within the interior volume of the process kit enclosure system. The contents can be disposed on fins of a support structure (e.g., a comb structure) disposed within the interior volume of the process kit enclosure system. The contents can include one or more process kit ring carriers (e.g., empty or with process kit rings disposed on the process kit ring carrier), process kit rings (e.g., disposed on fins of a support structure and disposed on a process kit ring carrier), or placement verification wafers. The contents can be manually loaded into the process kit enclosure system, or loading of the contents into the process kit enclosure system can be automated (e.g., using a robotic arm).

[0079] In block 502, contents may be secured within the process kit enclosure system by placing one or more retaining devices of the process kit enclosure system in a secured position. The retaining device may be rotated to secure the contents to the fins of the support structure (e.g., to prevent the contents from falling or to prevent the contents from going over its features). For example, the top cover may be removed from the process kit enclosure system, the retaining device inserted into the interior volume of the process kit enclosure system so that the base of the retaining device engages with pins at the bottom of the interior surface (and / or base plate), and the retaining device rotated so that the fins of the retaining device are above the contents on the fins of the support structure, and the top cover may be reinstalled to the process kit enclosure system. The top cover may not be reinstalled unless the retaining device is rotated so that it is above the contents of the support structure (e.g., a non-rotated retaining device may block top cover attachment; a retaining device in a secured position may align with a recess; whereas a retaining device in an unlocked position may not align with the recess).

[0080] In block 504, the process kit enclosure system can be transported to a wafer processing system. The process kit enclosure system can be transported manually using one or more handles. Transport of the process kit enclosure system can also be automated using handles (e.g., sidewall handles, OHT, etc.). A cart with robotic forks can be used to pull the process kit enclosure system from or place it on a load port.

[0081] The contents may be unlocked within the process kit enclosure system by placing one or more retention devices of the process kit enclosure system in an unlocked position at block 506. In one embodiment, the top cover is removed, the retention devices are rotated to an unlocked position (e.g., so that they are not above the contents of the support structure), removed from the interior volume, and the top cover is reinstalled.

[0082] In block 508, a front interface of the process kit enclosure system can be interfaced with a load port of a wafer processing system. For example, a clamp can secure a door frame of the process kit enclosure system to the load port. The front interface of the process kit enclosure system and the load port can be sealed (e.g., air sealed).

[0083] In block 510, the robot arm may remove a first process kit ring carrier from the process kit enclosure system. The first process kit ring carrier may be empty. The robot arm may remove the first process kit ring carrier from a lower slot (e.g., a lower slot or a slot above a used process kit ring). The first process kit ring carrier may be the lowest empty process kit ring carrier in the process kit enclosure system. The robot arm may transport the first process kit ring carrier to a wafer processing system.

[0084] At block 512, a used process kit ring from a processing chamber of a wafer processing system may be placed onto a first process kit ring carrier. Lift pins (e.g., process kit ring lift pins) in the processing chamber may lift the used process kit ring, a robot arm may position the first process kit ring carrier below the used process kit ring, and the lift pins may lower to place the used process kit ring onto the first process kit ring carrier.

[0085] At block 514, the robot arm can insert the used process kit ring secured to the first process kit ring carrier into the process kit enclosure system. The robot arm can place the used process kit ring secured to the first process kit ring carrier into the slot (e.g., the lower slot) from which the first process kit ring carrier was removed.

[0086] At block 516, the robot arm may remove the new process kit ring secured to the second process kit ring carrier from the process kit enclosure system. The new process kit ring secured to the second process kit ring carrier may be in an upper slot of the process kit enclosure system above the lower slot corresponding to the first process kit ring carrier. The new process kit ring secured to the second process kit ring carrier may be in the lowest slot of all new process kit rings in the process kit enclosure system (e.g., there may be no new process kit rings below the new process kit ring secured to the second process kit ring carrier).

[0087] A new process kit ring may be placed in the processing chamber at block 518. The robot arm may transport the new process kit ring secured to the second process kit ring carrier to the processing chamber, lift pins (e.g., process kit ring lift pins) in the processing chamber may lift the new process kit ring from the second process kit ring carrier, the robot arm may retract the process kit ring carrier from the processing chamber, and the lift pins may lower the new process kit ring into position within the processing chamber.

[0088] At block 520, the robot arm may insert a second process kit ring carrier (now empty) into the process kit enclosure system. The robot arm may insert the second process kit ring carrier into the same slot from which the new process kit ring secured to the second process kit ring carrier was removed.

[0089] In block 522, a placement verification wafer can be transferred from the process kit enclosure system to verify the placement of a new process ring in a processing chamber of the wafer processing system. The placement verification wafer can be placed in a slot above the used process kit ring. The placement verification wafer can be placed in a slot at the top of the process kit enclosure system. A robot arm can remove the placement verification wafer and verify the placement of a new process ring.

[0090] Prior to transporting the process kit enclosure system for removal from the wafer processing system, the contents are secured within the process kit enclosure system by placing one or more retention devices of the process kit enclosure system in a secured position. In one embodiment, the top cover is removed, the retention device is placed within the interior volume, the retention device is rotated to a secured position (e.g., above the contents on the support structure), and the top cover is reinstalled. The front interface of the process kit enclosure system may be unlocked from the load port of the wafer processing system (e.g., if the clamp securing the door frame of the process kit enclosure system to the load port is unlocked). The door of the process kit enclosure system may be attached to the door frame after the process kit enclosure system is unlocked from the load port.

[0091] The above description has directed to numerous specific details, such as particular systems, components, methods, etc., to provide a thorough understanding of some embodiments of the present disclosure. However, it will be apparent to those skilled in the art that at least some embodiments of the present disclosure may be practiced without these specific details. In other instances, well-known components or methods have not been described in detail or have been presented in simple block diagram form to avoid unnecessarily obscuring the present disclosure. Thus, the specific details described are merely exemplary. Particular embodiments may vary from these exemplary details and still be considered within the scope of the present disclosure.

[0092] References throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment. Thus, the appearances of the phrase "one embodiment" or "an embodiment" in various places throughout this specification do not necessarily all refer to the same embodiment. Furthermore, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or." When the term "about" or "approximately" is used herein, it is intended to mean that the nominal value presented is accurate to within ±10%.

[0093] Although the operations of the methods herein are shown and described in a particular order, the order of the operations of each method may be changed, such that certain operations may be performed in reverse order, or such that certain operations may be performed, at least in part, concurrently with other operations. In alternative embodiments, the instructions or sub-operations of separate operations may be intermittent and / or alternating.

[0094] It is understood that the above description is intended to be illustrative, and not limiting. Many other embodiments will become apparent to those skilled in the art upon reading and understanding the above description. The scope of the disclosure should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

1. 1. A process kit enclosure system comprising: a plurality of walls at least partially enclosing an interior volume of the process kit enclosure system, the walls including a bottom wall; a support structure extending substantially perpendicularly from the bottom wall within the interior volume; 1. A process kit enclosure system comprising: a fin extending substantially horizontally from a support structure, the fin having an upper surface forming a first recess configured to accommodate a process kit ring carrier and a second recess configured to receive a process kit ring positioned above the process kit ring carrier.

2. 10. The process kit enclosure system of claim 1, wherein an upper surface of the fin forms a protrusion between the first recess and the second recess, and a sidewall of the protrusion is configured to engage a registration feature of the process kit ring.

3. The process kit enclosure system of claim 2 , wherein the registration feature is a substantially planar interior sidewall surface.

4. Process Kit Ring Carrier a substantially flat bottom surface disposed in a first plane; 10. The process kit enclosure system of claim 1, wherein the first recess is configured to receive at least one of the one or more features extending from the substantially planar bottom surface.

5. The process kit enclosure system of claim 4 , wherein the one or more features include a pad or a protrusion.

6. a second support structure extending substantially perpendicularly from the bottom wall within the interior volume; a second fin extending substantially horizontally from the second support structure for supporting the process kit ring carrier; a third support structure extending substantially perpendicularly from the bottom wall within the interior volume; 10. The process kit enclosure system of claim 1, further comprising a third fin extending substantially horizontally from the third support structure for supporting the process kit ring carrier.

7. 10. The process kit enclosure system of claim 1, further comprising a retaining device configured to rotate such that a lower surface of a corresponding pin of the retaining device is positioned above the process kit ring.

8. 1. A process kit enclosure system comprising: a plurality of walls at least partially enclosing an interior volume of the process kit enclosure system, the walls including a bottom wall; a support structure extending from the bottom wall within the interior volume; fins extending from the sides of the support structure to support the contents; A process kit enclosure system comprising a retaining device secured to a fin, the retaining device configured to rotate in response to content being placed on the fin to secure the content.

9. The process kit enclosure system of claim 8 , wherein the holding device is a pivot clamp.

10. 10. The process kit enclosure system of claim 8, wherein in response to the content not being on the fin, a center of gravity of the holding device causes a clamping portion of the holding device to rotate upward to accept the content.

11. 10. The process kit enclosure system of claim 8, wherein in response to the content being on the fin, the clamping portion of the holding device rotates to a secured position, with a first portion of the clamping portion of the holding device positioned above the content and a second portion of the clamping portion of the holding device positioned below the content.

12. Contents include process kit ring carrier, The process kit ring is placed on the process kit ring carrier; 10. The process kit enclosure system of claim 8, wherein the process kit ring is positioned above the fin in response to the process kit ring carrier being positioned on the fin.

13. The content is a substantially flat bottom surface disposed in a first plane; 10. The process kit enclosure system of claim 8, comprising one or more features extending from the substantially planar bottom surface, at least one of the one or more features being disposed on a fin.

14. The process kit enclosure system of claim 13 , wherein the one or more features include a pad or a protrusion.

15. A holding device comprising: a swivel configured to rotationally couple to the fins of the process kit enclosure system; A holding device comprising a clamping portion having a first portion configured to be positioned above the content in response to the content being on the fin, and a second portion configured to be positioned below the content in response to the content being on the fin.

16. 16. The holding device of claim 15, wherein the holding device is configured to rotate in response to content placed on the fin to secure the content.

17. 16. The holding device of claim 15, wherein in response to content not being on the fins, the center of gravity of the holding device causes the clamping portion to rotate and orient upward to receive the content.

18. The holding device of claim 15 , wherein the contents include a process kit ring carrier.

19. The holding device of claim 15 , wherein the contents include a verification wafer.

20. The holding device of claim 15, wherein the holding device is a pivot clamp.

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