Substrate processing systems, apparatus, and methods with factory interface environmental controls

Abstract

To provide electronic device processing systems including environmental control of a factory interface and methods for processing a substrate.SOLUTION: An electronic device processing system 100 has a factory interface 114 having a factory interface chamber 114C, a load lock apparatus 112 coupled to the factory interface 114, one or more substrate carriers 116 coupled to the factory interface, and an environmental control system 118 coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] Related Applications This application claims priority to U.S. Provisional Patent Application No. 61 / 865,046, filed August 12, 2013, and entitled "SUBSTRATE PROCESSING SYSTEMS, APPARATUS, AND METHODS WITH FACTORY INTERFACE ENVIRONMENTAL CONTROLS" (Attorney Docket No. 21149 / USA / L), which is incorporated herein by reference in its entirety for all purposes.

[0002] FIELD Embodiments relate to electronic device manufacturing, and more particularly to equipment front end modules (EFEMs) and apparatus, systems, and methods for processing substrates. [Background technology]

[0003] Electronic device manufacturing systems can include multiple processing chambers arranged around a mainframe housing having a transfer chamber and one or more load lock chambers configured to transfer substrates into the transfer chamber. These systems can employ, for example, a transfer robot that can be housed within the transfer chamber. The transfer robot can be a selectively compliant articulated robot arm (SCARA) robot or the like and can be adapted to transfer substrates between various chambers and one or more load lock chambers. For example, the transfer robot can transfer substrates from processing chamber to processing chamber, from the load lock chamber to processing chamber, and vice versa.

[0004] Processing of substrates in the manufacture of semiconductor components is generally performed in multiple tools, with substrates moved between tools in substrate carriers (such as Front Opening Unified Pods, or FOUPs). The FOUPs may be docked to an EFEM (sometimes referred to as a "Factory Interface, or FI") that includes a load / unload robot operable to transfer substrates between the FOUP and one or more load locks of the tools, thus allowing substrates to pass through for processing. Existing systems may benefit from improvements in efficiency and / or process quality.

[0005] Therefore, systems, apparatus, and methods that provide improved efficiency and / or capacity in processing substrates are desirable. Summary of the Invention

[0006] In one aspect, an electronic device processing system is provided that includes a factory interface including a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operative to monitor or control one of a relative humidity, a temperature, an amount of O, or an amount of inert gas within the factory interface chamber.

[0007] In another aspect, a method for processing substrates in an electronic device processing system is provided, the method including providing a factory interface including a factory interface chamber, one or more substrate carriers docked to the factory interface, a load lock apparatus including one or more load lock chambers coupled to the factory interface, and optionally an access door, and controlling environmental conditions within the factory interface chamber to meet environmental prerequisites.

[0008] In yet another method aspect, a method for processing substrates in an electronic device processing system is provided, the method including providing a factory interface including a factory interface chamber, one or more substrate carriers docked to the factory interface, one or more carrier purge chambers in the factory interface chamber, and one or more load lock chambers coupled to the factory interface, and controlling environmental conditions within the factory interface chamber and the one or more carrier purge chambers.

[0009] Numerous other aspects are provided by the above and other embodiments of the present invention. Other features and aspects of the embodiments of the present invention will become more fully apparent from the following detailed description, the accompanying claims, and the accompanying drawings.

[0010] The drawings described below are for illustrative purposes only and are not necessarily to scale. The drawings are not intended to limit the scope of the present invention in any way. [Brief explanation of the drawings]

[0011] [Figure 1] 1 illustrates a schematic top view of an electronic device processing system including environmental control of a factory interface, according to an embodiment. [Figure 2] 1 shows a flow diagram illustrating a method for processing a substrate in an electronic device processing system, according to an embodiment. [Figure 3] 1 shows a schematic top view of an electronic device processing system including an inert gas recirculation system, according to an embodiment. [Figure 4] 1 shows a schematic top view of another electronic device processing system including environmental control and inert gas recirculation, according to an embodiment. [Figure 5A] 1 illustrates a cross-sectional side view of a carrier purge assembly, according to an embodiment. [Figure 5B] 1 illustrates a front view of a carrier purge assembly, according to an embodiment. [Figure 6]1 shows another flow diagram illustrating a method for processing a substrate in an electronic device processing system, according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] Reference will now be made in detail to the exemplary embodiments of the present disclosure, which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or similar parts throughout the several views. Unless otherwise stated, features of the various embodiments described herein may be combined with each other.

[0013] Electronic device manufacturing can require highly accurate substrate processing as well as very rapid substrate transport between various locations. Specifically, existing systems can transport substrates between FOUPs and load locks, and then into processing chambers. However, existing systems can experience problems when exposed to relatively high humidity, temperature, or other environmental factors, such as excessively high oxygen (O) levels. Specifically, exposure to relatively high humidity levels or relatively high O levels can adversely affect substrate properties.

[0014] According to one or more embodiments of the present invention, an electronic device processing system adapted to provide improved substrate processing is provided. The systems and methods described herein may provide improved efficiency and / or throughput in processing substrates by controlling environmental conditions within a factory interface chamber of a factory interface. The factory interface receives substrates from one or more substrate carriers docked to the factory interface (e.g., docked to the front of the factory interface), and a load / unload robot delivers substrates to one or more load locks coupled to another surface of the factory interface (e.g., the rear of the factory interface). In some embodiments, one or more environmental parameters (e.g., relative humidity, temperature, amount of O2, or amount of inert gas) are monitored, and neither one or more load locks nor any FOUPs docked to the factory interface may be opened unless certain environmental preconditions within the factory interface chamber of the factory interface are met.

[0015] Further details of exemplary method and apparatus embodiments of the present invention are described with reference to Figures 1-6 herein.

[0016] 1 is a schematic diagram of an exemplary embodiment of an electronic device processing system 100 in accordance with one or more embodiments of the present invention. The electronic device processing system 100 may include a mainframe housing 101 having housing walls defining a transfer chamber 102. A transfer robot 103 (shown as a dotted circle) may be housed at least partially within the transfer chamber 102. The transfer robot 103 may be configured and adapted to place or remove a substrate at a target location via actuation of an arm of the transfer robot 103. As used herein, substrate refers to an article used to make electronic devices or circuit components, such as a silica-containing wafer, a patterned wafer, or the like.

[0017] In the illustrated embodiment, the transfer robot 103 may be any suitable type of off-axis robot adapted to service the various twin chambers coupled to and accessible from the transfer chamber 102, such as the robot disclosed in U.S. Patent Publication No. 2010 / 0178147. Other off-axis robots may also be used. An off-axis robot is any robot configuration operable to extend an end effector in a non-radial direction toward or away from the robot's shoulder axis of rotation, which is generally located at the center of the transfer chamber 102.

[0018] The movement of the various arm components of the transfer robot 103 may be controlled by appropriate commands to a drive assembly (not shown) containing multiple drive motors of the transfer robot 103, as instructed by the controller 125. Signals from the controller 125 may cause movement of the various components of the transfer robot 103. Suitable feedback mechanisms may be provided to one or more of the components, such as by various sensors, such as position encoders.

[0019] The transfer robot 103 may include an arm rotatable about a shoulder axis that may be approximately centered within the transfer chamber 102. The transfer robot 103 may include a base adapted to be mounted to a housing wall (e.g., floor) that forms the bottom of the transfer chamber 102. However, the transfer robot 103 may also be ceiling-mounted in some embodiments. The robot 103 may be a dual SCARA robot or other type of dual robot adapted to service twin chambers (e.g., parallel chambers). Other types of process chamber orientations and transfer robots may also be used.

[0020] Rotation of the arm components of the transfer robot 103 may be provided by any suitable drive motor, such as a conventional variable reluctance magnet or permanent magnet electric motor. The arm may be adapted to rotate in the XY plane relative to the base. Any suitable number of arm components and end effectors adapted to carry substrates may be used.

[0021] Additionally, the drive assembly of the transfer robot 103 may, in some embodiments, include Z-axis movement capability. Specifically, the motor housing may be limited in rotation relative to the external housing 161 by a motion limiter. The motion limiter may be two or more linear bearings or other types of bearing or sliding mechanisms that function to constrain rotation of the motor housing relative to the external housing, but allow Z-axis (vertical) movement of the motor housing and connected arm along the vertical direction. Vertical movement is provided by a vertical motor. Rotation of the vertical motor may act to rotate a lead screw within a screw receptacle coupled to or integral with the motor housing. This rotation may be transmitted vertically to the motor housing, which in turn may be transmitted to the arm, one or more attached end effectors, and substrates supported thereon. In some embodiments, a suitable seal may seal between the motor housing and the base, thereby accommodating vertical movement and maintaining a vacuum within the transfer chamber 102.

[0022] The transfer chamber 102 in the illustrated embodiment may be generally square or slightly rectangular in shape and may include a first facet 102A, a second facet 102B opposite the first facet 102A, a third facet 102C, and a fourth facet 102D opposite the third facet 102C. The transfer robot 103 is preferably adapted to simultaneously transfer and / or withdraw dual substrates into and from the set of chambers. The first facet 102A, the second facet 102B, the third facet 102C, and the fourth facet 102D may be generally planar, and entrances to the set of chambers may be located along each facet. However, other suitable shapes of the mainframe housing 101 and other suitable numbers of facets and processing chambers are possible.

[0023] The target location of the transfer robot 103 may be a first set of processing chambers 108A, 108B coupled to the first facet 102A, which may be configured and operable to perform a process on a substrate provided thereto. The process may be any suitable process, such as plasma vapor deposition (PVD) or chemical vapor deposition (CVD), etch, annealing, pre-cleaning, metal or metal oxide removal, etc. Other processes may also be performed on the substrate therein.

[0024] The target position of the transfer robot 103 may also be a second set of processing chambers 108C, 108D, which may be generally opposite the first set of processing chambers 108A, 108B. The second set of processing chambers 108C, 108D may be coupled to the second facet 102B and may be configured and adapted to perform any suitable process on substrates, such as any of the processes described above. Similarly, the target position of the transfer robot 103 may also be a third set of processing chambers 108E, 108F, which may be generally opposite the load lock apparatus 112 coupled to the third facet 102C. The third set of processing chambers 108E, 108F may be configured and adapted to perform any suitable process on substrates, such as any of the processes described above.

[0025] Substrates may be received into the transfer chamber 102 from the factory interface 114 and may exit the transfer chamber 102 to the factory interface 114 through a load lock apparatus 112 coupled to a surface (e.g., a back wall) of the factory interface 114. The load lock apparatus 112 may include one or more load lock chambers (e.g., load lock chambers 112A, 112B, etc.). The load lock chambers 112A, 112B included in the load lock apparatus 112 may be single wafer load lock (SWLL) chambers or multi-wafer chambers. In some embodiments, the load lock apparatus 112 may include a heating platform / apparatus for heating incoming substrates to a temperature above about 200 degrees Celsius so that a degassing process is performed on the substrates before they are transferred from the factory interface 114 into the transfer chamber 102.

[0026] The factory interface 114 may be any enclosure having sidewall surfaces (including a front, a back, two sidewalls, a top, and a bottom) that form a factory interface chamber 114C. One or more load ports 115 may be provided on a surface (e.g., a front) of the factory interface 114 and may be configured and adapted to receive one or more substrate carriers 116 (e.g., front opening unified pods, or FOUPs) therein.

[0027] The factory interface 114 may include a suitable load / unload robot 117 (shown in dotted lines) of conventional construction within its factory interface chamber 114C. The load / unload robot 117 may be configured and operative to remove substrates from one or more substrate carriers 116 when the substrate carrier 116 doors are opened, and to deliver the substrates through the factory interface chamber 116 and into one or more load lock chambers 112A, 112B, such as may be provided within the load lock apparatus 112. Any suitable construction of the load lock apparatus 112 may be used that allows for the transfer of substrates between the transfer chamber 102 and the factory interface chamber 114C.

[0028] The transfer chamber 102 may include slit valves 134 at the entrances / exits to the various processing chambers 108A-108F. Similarly, the load lock chambers 112A, 112B in one or more load lock apparatuses 112 may include internal and external load lock slit valves 136, 138. The slit valves 134, 136, 138 are adapted to open and close when substrates are placed in or removed from the various processing chambers 108A-108F and load lock chambers 112A, 112B. The slit valves 134, 136, 138 may be of any suitable conventional construction, such as L-action slit valves.

[0029] In the illustrated embodiment, the factory interface chamber 114C may be provided with environmental controls to provide an environmentally controlled atmosphere. Specifically, an environmental control system 118 is coupled to the factory interface 114 and operates to monitor and / or control environmental conditions within the factory interface chamber 114C. In some embodiments, at certain times, the factory interface chamber 114C may receive an inert gas therein, such as argon (Ar), nitrogen (N), or helium (He), from an inert gas supply 118A. In other embodiments, or at other times, air (e.g., filtered air) may be provided from an air supply 118B.

[0030] More specifically, the environmental control system 118 may control at least one of the following in the factory interface 114C: 1) relative humidity (RH), 2) temperature (T), 3) amount of O2, or 4) amount of inert gas. Other environmental conditions in the factory interface, such as gas flow rate or pressure, or both, may also be monitored and / or controlled.

[0031] In some embodiments, the environmental control system 118 includes a controller 125. The controller 125 may include a suitable processor, memory, and electronics for receiving inputs from various sensors and controlling one or more valves. In one or more embodiments, the environmental control system 118 may monitor relative humidity (RH) by sensing RH within the factory interface chamber 114C using a relative humidity sensor 130 configured and adapted to sense RH. Any suitable type of relative humidity sensor 130, such as a capacitive sensor, may be used. In some embodiments, the controller 125 monitors RH, and when the measured RH value provided to the controller 125 is above a predetermined RH threshold, the carrier door 116D of one or more substrate carriers 116 coupled to a load port of the factory interface 114 remains closed. When the measured RH value falls below the predetermined RH threshold, the carrier door 116D of the substrate carrier 116 may open. The RH can be reduced by flowing an appropriate amount of inert gas into the factory interface chamber 114C from an inert gas supply 118A of the environmental control system 118. As described herein, the inert gas from the inert gas supply 118A can be argon, N, helium, or mixtures thereof. A supply of dry nitrogen gas (N) can be quite effective. A compressed bulk inert gas with a low HO level (e.g., less than 5 ppm) can be used as the inert gas supply 118A in the environmental control system 118.

[0032] In another aspect, the environmental control system 118 measures the relative humidity value using the relative humidity sensor 130, and if the measured relative humidity value is above a predetermined reference relative humidity value, the external load lock slit valves 138 of one or more load lock apparatuses 112 coupled to the factory interface 114 remain closed. The one or more load lock apparatuses 112 may remain closed until the relative humidity falls below the predetermined reference relative humidity value. As described above, the RH may be reduced by a control signal from the controller 125 to the environmental control system 118 that initiates a flow of an appropriate amount of inert gas from the inert gas supply 118A into the factory interface chamber 114C. In one or more embodiments, the specified reference relative humidity value may be less than 1000 ppm moisture, less than 500 ppm moisture, or even less than 100 ppm moisture, depending on the level of moisture that is acceptable for the particular process being performed in the electronic device processing system 100.

[0033] In some embodiments, the environmental control system 118 of the electronic device processing system 100 may include an air supply 118B coupled to the factory interface chamber 114C. The air supply 118B may be coupled to the factory interface chamber 114C by appropriate conduits and one or more valves. The environmental control system 118 may include an oxygen sensor 132 configured and adapted to sense the level of oxygen (O) within the factory interface chamber 114C. In one embodiment, when an operator initiates an entry request seeking entry into the factory interface chamber 114C, the controller 125 of the environmental control system 118 may initiate the flow of air from the air supply 118B such that at least a portion of the inert gas environment is evacuated and replaced with air. When the level of oxygen detected within the factory interface chamber 114C reaches an appropriate predetermined O2 level, the door interlock 140 that keeps the access door 142 closed may be released, allowing the access door 142 to open (shown in dotted lines), thus allowing personnel to access the factory interface chamber 114C.

[0034] In some embodiments, the factory interface 114 of the electronic device processing system 100 may include a cooling station 144. The cooling station 144 may include one or more platforms, shelves, or other support features upon which one or more substrates 145 exiting the load lock apparatus 112 may rest and cool prior to insertion into the substrate carrier 116.

[0035] In one or more embodiments, a temperature sensor 135 configured and adapted to sense the temperature within the factory interface chamber 114C may be used. In some embodiments, the temperature sensor 135 may be mounted in proximity to the substrate 145. In some embodiments, the temperature sensor 135 may be a directional sensor, such as a laser sensor, that may be used to determine the extent to which the substrate 145 has cooled. This input from the temperature sensor 135 may be used to determine when transfer from the cooling station 144 may occur.

[0036] In the embodiments illustrated herein, the controller 125 may be any suitable controller having a suitable processor, memory, and peripheral components adapted to receive control inputs from various sensors (such as the relative humidity sensor 130, the oxygen sensor 132, and / or the temperature sensor 135) and to implement a closed-loop or other suitable control scheme. In one embodiment, the control scheme may vary the flow rate of gas introduced into the factory interface chamber 114C. In another embodiment, the control scheme may determine when to transfer the substrate 145 into the factory interface chamber 114C.

[0037] 2, one method of processing substrates in an electronic device processing system (such as electronic device processing system 100) is described. The method 200 includes, at 202, providing a factory interface (such as factory interface 114) having a factory interface chamber (such as factory interface chamber 114C), one or more substrate carriers (such as substrate carrier 116) docked to the factory interface, and one or more load lock chambers (such as load lock chambers 112A, 112B) coupled to the factory interface.

[0038] The method 200 includes controlling the environmental conditions to meet the environmental preconditions at 204. For example, controlling the environmental conditions to meet the environmental preconditions may occur before opening one or more substrate carrier doors (such as carrier door 116D) or any one of one or more load lock chambers (e.g., opening the outer load lock slit valve 138 of the load lock chambers 112A, 112B).

[0039] According to one or more embodiments of the present invention, one or more of the carrier door 116D and the external load lock slit valve 138 can be opened when certain environmental preconditions are met. For example, the environmental preconditions can be met, in one example, when the measured relative humidity (RH) level within the factory interface chamber 114C falls below a predetermined relative humidity level threshold (e.g., less than 1000 ppm moisture, less than 500 ppm moisture, less than 100 ppm moisture, or even lower). Other suitable thresholds can also be used depending on the process being performed.

[0040] To meet or fall below a previously unmet environmental precondition, an inert gas (such as dry N2 gas or other inert gas) may be flowed into the factory interface chamber 114C from the inert gas supply 118A. The inert gas supply 118A may be, for example, a suitable canister of pressurized inert gas. The flow rate of the inert gas provided into the factory interface chamber 114C may be monitored by a suitable flow rate sensor (not shown) on the supply line and / or a suitable pressure sensor 133 disposed within the factory interface chamber 114C. Flow rates of 400 SLM or greater may be provided by adjusting a valve coupled to the inert gas supply 118A in response to a control signal provided by the controller 125. A pressure greater than approximately 500 Pa may be maintained within the factory interface chamber 114C. The flow of inert gas (such as N2 or other inert gas) into the factory interface chamber 114C serves to reduce the relative humidity (RH) level, and the carrier door 116D and / or the external load lock slit valves 138 of one or more load lock chambers 112A, 112B can be opened once the relative humidity threshold is met. This helps ensure that substrates in an open substrate carrier 116 and any open load lock chambers 112A, 112B, as well as any substrates passing through the factory interface chamber 114C, are exposed only to an appropriately low humidity environment.

[0041] In another example, the environmental precondition may be met when the measured oxygen (O) level within the factory interface chamber 114C, as sensed by, for example, oxygen sensor 132, falls below a predetermined oxygen threshold level (e.g., less than 50 ppm O, less than 10 ppm O, less than 5 ppm O, or even less than 3 ppm O, or even lower). Other suitable oxygen level thresholds may also be used depending on the process being performed. If the predetermined oxygen threshold level within the factory interface chamber 114C is not met, the controller 125 issues a control signal to a valve coupled to the inert gas supply 118A to flow inert gas into the factory interface chamber 114C until the predetermined oxygen threshold level is met, as determined by the controller 125. Once the predetermined oxygen threshold level is met, the carrier door 116D and / or the external load lock slit valve 138 of one or more load lock chambers 112A, 112B may be opened. This helps ensure that substrates in the open substrate carrier 116 and any open load lock chambers 112A, 112B, as well as any substrates passing through the factory interface chamber 114C, are exposed to relatively low oxygen levels.

[0042] In another example, the environmental precondition may be met when a measured temperature level in the factory interface chamber 114C, such as the temperature of the substrate 145 in the cooling station 144 as sensed by the temperature sensor 135, falls below a predetermined temperature threshold level (e.g., below 100 degrees Celsius or even lower). Once the predetermined temperature threshold level is met, the cooled substrate 145 may be loaded into the substrate carrier 116 for transfer. The cooling station 144 may include a cooling platform, an inert gas flow, or a combination thereof.

[0043] In some embodiments, the access door 142 of the factory interface 114 can be opened only when certain environmental preconditions are met. For example, the environmental preconditions can include achieving an oxygen value within the factory interface chamber 114C that exceeds a predetermined oxygen level value determined to be safe. The oxygen level value can be sensed, for example, by an oxygen sensor 132. The door interlock 140 (e.g., an electromechanical lock) can prevent the access door 142 from opening unless the controller 125 determines that the predetermined oxygen level deemed safe has been met and sends a signal to open the door interlock 140. Otherwise, the environmental preconditions can be met by flowing air from the air supply 118B into the factory interface chamber 114C via a control signal to a valve and flowing inert gas out of the factory interface chamber 114C through an exhaust conduit 150. The air supply 118B can be a supply of filtered air provided by a fan or air pump.

[0044] As shown in FIG. 3 , another embodiment of an electronic device processing system 300 is provided (the mainframe housing, processing chambers, and load lock chambers are not explicitly shown). The environmental control system 318 of the electronic device processing system 300 may include the components previously described, but may also include inert gas recirculation. Specifically, the inert gas may be recycled and reused to provide more efficient environmental control of the factory interface 114. For example, in the illustrated embodiment, inert gas from the factory interface chamber 114C is exhausted from the factory interface chamber 114C through an exhaust conduit 350, filtered through a filter 352, which may be a water-reducing filter and may also perform particulate filtering, and then pumped back into the inert gas supply 118A by a pump 354. The filter 352 may be a water-absorbing filter that may include multiple layers of absorbent material. However, other mechanisms or devices for reducing water content, such as a condenser or other moisture removal device, may also be used. In some embodiments, the inert gas may be cooled.

[0045] In some embodiments, inert gas consumption may be monitored, such as by use of a flow sensor (not shown) in the supply line from the inert gas supply 118A, and the measured flow rate may be correlated to achieving a particular RH value in the factory interface chamber 114C. If the inert gas consumption is outside of predefined limits, then the leak in the factory interface chamber 114C may be stopped, for example, by a message to an operator, a visual indication, an alarm, etc. Optionally, if the pressure in the factory interface chamber 114C is outside of (e.g., below) a predefined limit, then the leak in the factory interface chamber 114C may be stopped in a similar manner as described above.

[0046] 4 illustrates another embodiment of an electronic device processing system 400 that includes an environmental control system 418. In this embodiment, the environmental control system 418 includes combined environmental control for one or more carrier purge chambers 454 and coupled environmental control for a factory interface chamber 414C. Except for the provision of a carrier purge system 452, this embodiment is otherwise similar to the embodiment of FIG.

[0047] The carrier purge system 452, which may be separate and distinct from the environmental control of the factory interface chamber 414C, includes a gas purge system 457. The gas purge system 457 includes an inert gas supply (such as the inert gas supply 118A) and multiple supply conduits and multiple valves coupled thereto. The multiple supply conduits and valves of the gas purge system 457 supply inert gas to the carrier purge chamber 454 at some point in time in response to control signals from the controller 425. For example, a supply of inert gas may be provided to the carrier purge chamber 454 immediately after opening the carrier door 116D of the substrate carrier 116 to purge the environment 562 ( FIG. 5A ) of the substrate carrier 116 and the carrier purge chamber 454 to meet certain environmental prerequisites before transferring the substrate 545 from the substrate carrier 116 into the factory interface chamber 414C.

[0048] Details, components, and operation of the carrier purge system 452 of the factory interface 414 are described below with reference to FIGS. 4 and 5A-5B. The carrier purge system 452 includes a carrier purge housing 556 for each substrate carrier 116, including purge capabilities. Such purge capabilities may be included for some or all of the substrate carriers 116. The carrier purge housing 556 forms a portion of each carrier purge chamber 454. The carrier purge housing 556 may seal against an interior wall (e.g., front wall) 558 surface of the factory interface 114 to form the carrier purge chamber 454. The carrier purge housing 556 remains sealed against the interior wall 558 surface when the carrier door 116D is opened. Any suitable seal, such as a gasket or O-ring, may be used.

[0049] The carrier purge system 452 is adapted to receive the environment 562 of the substrate carrier 116 into the carrier purge chamber 454 upon opening of the substrate carrier door 116D via actuation of a door opener 565 and a door retraction mechanism 567. Once the carrier door 116D is opened, the carrier purge chamber 454 may be purged to prevent the environment 562, which may contain undesirable levels of O2 or moisture, from entering the factory interface chamber 114C. Purging of the carrier purge chamber 454 continues until certain predetermined environmental conditions are met. Purging may be provided via an inert gas provided from a gas purge system 457. One or more diffusers 559 may be included at the outlet from a conduit 557C of the gas purge system 457 that supplies the inert gas into the carrier purge chamber 454.

[0050] The environmental conditions may be based, for example, on a predetermined relative humidity (RH) threshold level and / or a predetermined O2 threshold level. For example, a relative humidity below a predetermined RH threshold level (e.g., less than about 5% moisture to less than about 50,000 ppm moisture) may be required before retracting the carrier purge housing 556 away from the interior wall 558 and lowering the carrier purge housing 556 to allow the load / unload robot 117 to access and remove the substrate 545. If oxygen level is an environmental criterion, then an O2 threshold level below a predetermined threshold level (e.g., less than about 500 ppm O2) may be required before retracting and lowering the carrier purge housing 556. Other predetermined threshold levels may also be used.

[0051] To achieve one or both of these threshold levels, a chamber relative humidity sensor 576 and / or a chamber oxygen sensor 578 may be provided that is interconnected with the controller 425. The chamber relative humidity sensor 576 and / or the chamber oxygen sensor 578 may be on the carrier purge housing 556, in the chamber exhaust conduit 580 in the factory interface chamber 114C, or even outside the factory interface 114, such as on the chamber exhaust conduit 580. Purging with inert gas from the gas purge system 457 may continue until environmental prerequisites are met. In some embodiments, purging for a predefined time or volume based on previously performed experiments may be used to ensure that environmental prerequisites are met.

[0052] During operation, the carrier purge housing 556 encloses a door opener 565. The door opener 565 is adapted to be retractable into the interior space of the carrier purge housing 556. Retraction of the door opener 565 can be via a door retraction mechanism 567, such as a linear slide 569 and a rack and pinion mechanism 570. The rack and pinion mechanism 570 can include a rack 572, a pinion 574, and a drive motor 575 coupled to the pinion 574. A drive signal from the controller 425 to the drive motor 575 causes retraction of the carrier door 116D and mixing of the environment 562 with the environment within the carrier purge chamber 454. As is conventional, an optional door unlock gripping mechanism 573 can be used with the door opener 565 to grip and open the carrier door 116D.

[0053] Retraction of the carrier purge housing 556 from and closure (e.g., sealing) of the interior wall 558 may be provided by a housing drive system 581 and a sliding mechanism 582. The sliding mechanism 582 allows linear movement toward and away from the interior wall 558 relative to a support frame 584 that interfaces with an elevator 585. The housing drive system 581 may include a suitable motor and transmission mechanism to cause movement toward and away from the interior wall 558. In the illustrated embodiment, a rack and pinion mechanism is shown including a housing rack 586, a housing pinion 588, and a housing motor 589 coupled to the carrier purge housing 556. Driving the housing drive motor 589 moves the carrier purge housing 556 horizontally inward or outward relative to the elevator 585 and the interior wall 558.

[0054] Lowering of the carrier purge housing 556 may be provided by an elevator 585. The elevator 585 may include any suitable mechanical structure for providing vertical movement of the carrier purge housing 556. For example, as shown, the elevator 585 includes a linear bearing assembly 590 including a bearing slide 591, a rail 592, and a mounting block 593. The mounting block 593 may secure the rail 592 to the interior wall 558. The bearing slide 591 may be secured to a vertical actuator 594. A vertical actuator rail 595 may also be provided and may be secured to the interior wall 558. Actuation of the vertical actuator 594 causes vertical movement relative to the vertical actuator rail 595, raising or lowering the support frame 584 and the coupled carrier purge housing 556. The vertical actuator 594 may be any suitable type of actuator, such as pneumatic, electric, etc. It should therefore be apparent that operation of the door gripping and unlocking mechanism 573 grips and opens the carrier door 116D, the rack and pinion mechanism 570 retracts the carrier door 116D, the carrier purge system 452 purges the carrier purge chamber 454 to meet environmental prerequisites, the housing drive system 581 retracts the carrier purge housing 556, and the elevator 585 lowers the carrier purge housing 556 and the carrier door 116D so that the load / unload robot 117 can access the substrates 545 in the substrate carrier 116.

[0055] 4, the environmental control system 418 may include the components described above and may also include an inert gas recirculation. For example, inert gas may be exhausted from the factory interface chamber 414C through an exhaust conduit 450 and filtered through a filter 352, which may be a water-reducing filter but may also provide particulate filtering, and may be of the type described above. In this embodiment, the filtered inert gas may be recirculated directly back into the factory interface chamber 414C.

[0056] For example, in the illustrated embodiment, a portion of the exhaust recirculation route may pass through the chamber door 442. For example, exhaust from the factory interface chamber 414C may enter a channel 443 (e.g., a duct) formed in the chamber door 442. The channel 443 may have an inlet from the factory interface chamber 414C at or near the bottom of the chamber door 442 and pass above the filter 352, which in some embodiments may be inside the top of the factory interface chamber 414C. Thus, the channel 443 may be part of the exhaust conduit 450. In some embodiments, a door similar to the chamber door 442, including an interior channel like the channel 443, may be provided on another side of the factory interface 414.

[0057] 6, another method of processing substrates in an electronic device processing system (such as electronic device processing system 400) is described. Method 600 includes, at 602, providing a factory interface (such as factory interface 414) having a factory interface chamber (such as factory interface chamber 114C), one or more substrate carriers (such as substrate carrier 116) docked to the factory interface, one or more carrier purge chambers (such as carrier purge chamber 454) in the factory interface chamber, and one or more load lock chambers (such as load lock chambers 112A, 112B of load lock apparatus 112) coupled to the factory interface.

[0058] The method 600 includes, at 604, controlling environmental conditions in a factory interface (e.g., factory interface 414) and in one or more carrier purge chambers (e.g., carrier purge chamber 454). Controlling environmental conditions in the factory interface may include satisfying environmental preconditions in the factory interface chambers before allowing any one of one or more substrate carrier doors (e.g., carrier door 116D) or any one of one or more load lock chambers (e.g., external load lock slit valve 138 of load lock chambers 112A, 112B) to open. Controlling environmental conditions in one or more carrier purge chambers (e.g., carrier purge chamber 454) may include satisfying certain environmental preconditions (e.g., with respect to an RH threshold level or an O2 threshold level) before unsealing the carrier purge housing 556 via retraction and lowering, similar to the above. Providing such environmental control according to embodiments of the present invention may reduce exposure of substrates 545 exiting the substrate carrier 116 or exiting the load lock chambers 112A, 112B after processing to potentially harmful environmental conditions, such as relatively humid environments or environments with relatively high O2 levels.

[0059] The foregoing description discloses merely exemplary embodiments of the present invention. Modifications of the above-disclosed devices, systems, and methods which fall within the scope of the present invention will be readily apparent to those skilled in the art. Thus, while the present invention has been disclosed in connection with exemplary embodiments, it should be understood that other embodiments may fall within the scope of the present invention, as defined by the following claims.

Claims

1. a factory interface including a factory interface chamber; a load lock device coupled to the factory interface; one or more substrate carriers coupled to the factory interface; coupled to the factory interface and within the factory interface chamber; relative humidity, temperature, O ２ the amount of, or an environmental control system operative to monitor or control one of: Electronic device processing system.

2. The electronic device processing system of claim 1 , comprising a humidity sensor adapted to sense a relative humidity in the factory interface chamber.

3. 10. The electronic device processing system of claim 1, comprising an oxygen sensor adapted to sense an oxygen level in the factory interface chamber.

4. in the factory interface chamber; the relative humidity, The temperature The above O ２ the amount of, or a controller adapted to monitor or control one of the amount of the inert gas; The electronic device processing system of claim 1 .

5. 5. The electronic device processing system of claim 4, wherein the environmental control system comprises an inert gas supply responsive to the controller and adapted to flow a quantity of inert gas into the factory interface chamber.

6. The electronic device processing system of claim 1 , comprising a temperature sensor adapted to sense a temperature within the factory interface chamber.

7. The electronic device processing system of claim 1 , further comprising a carrier purge system in the factory interface.

8. 8. The electronic device processing system of claim 7, wherein the carrier purge system is adapted to receive a carrier environment of the substrate carrier into a carrier purge chamber upon opening of a carrier door of the substrate carrier, and to purge the carrier purge chamber to prevent the carrier environment from entering the factory interface chamber until certain environmental conditions are met.

9. The electronic device processing system of claim 7 , wherein the carrier purge system includes a carrier purge housing sealed to an interior surface of the factory interface chamber, the carrier purge housing forming a carrier purge chamber.

10. 8. The electronic device processing system of claim 7, further comprising a carrier purge housing surrounding a carrier door opener, said carrier door opener adapted to be retractable within said carrier purge housing.

11. 1. A method of processing a substrate in an electronic device processing system, comprising: providing a factory interface, the factory interface comprising: Factory Interface Chamber, one or more substrate carriers docked to the factory interface; a load lock apparatus including one or more load lock chambers coupled to the factory interface; and providing, optionally including an access door; and controlling environmental conditions within the factory interface chamber to meet environmental prerequisites.

12. The environmental preconditions in the factory interface chamber include: Relative humidity below a predefined relative humidity threshold, temperatures below a predefined temperature threshold, Default O ２ Below threshold O ２ the amount of, or an amount of inert gas below a predetermined flow rate threshold.

13. providing a carrier purge system for the factory interface including a carrier purge chamber associated with a substrate carrier; 12. The method of claim 11, comprising controlling an inert gas provided to the carrier purge chamber to purge an environment of the carrier purge chamber simultaneously with opening a carrier door of the substrate carrier.

14. Relative humidity threshold or O ２ 12. The method of claim 11, including retracting the carrier purge housing only when one or both of the level thresholds are met.

15. 1. A method of processing a substrate in an electronic device processing system, comprising: providing a factory interface, the factory interface including a factory interface chamber, one or more substrate carriers docked to the factory interface, one or more carrier purge chambers in the factory interface chamber, and one or more load lock chambers coupled to the factory interface; and controlling environmental conditions within the factory interface chamber and the one or more carrier purge chambers.

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