Molding apparatus

Abstract

To reduce a height of a protrusion formed on a resin base material due to positioning while accurately positioning a sheet material.SOLUTION: A molding apparatus 10 comprises a lower mold 20 and an upper mold 40. The lower mold 20 comprises: a lower mold body 21; a positioning pin 23 configured to be lifted / lowered with respect to the lower mold body 21, and to position a sheet material 98 by being protruded above an upper surface of a lower molding surface 22 and being inserted into a positioning hole of the sheet material 98 placed on the upper surface of the lower molding surface 22; and a changing mechanism 30 configured so as to change the protrusion height of the positioning pin 23 from the upper surface of the lower molding surface 22. The changing mechanism 30 can change the protrusion height of the positioning pin 23 between a first height during molding and a second height H2 at a placing time when placing the sheet material 98 on the upper surface of the lower molding surface 22. The second height H2 is higher than the first height.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a molding apparatus. [Background technology]

[0002] Patent Document 1 discloses an ion exchanger that performs ion exchange in a coolant for a fuel cell. The ion exchanger disclosed in Patent Document 1 includes a housing and a cartridge. The housing has a cylindrical side wall with an upper opening. An inlet pipe and an outlet pipe are connected to the lower part of the side wall. An internal thread is formed on the inner peripheral surface of the upper part of the side wall.

[0003] The cartridge includes a cap that is screwed onto the upper opening of the side wall of the housing to close the upper opening. The cap has a cylindrical body. The outer circumferential surface of the body is formed with a male thread that meshes with the female thread.

[0004] The cartridge includes a tube member extending vertically inside the body. An upper ring member is integrally molded at the upper end of the tube member, protruding in a direction perpendicular to the axis of the tube member. A lower ring member is attached to the lower end of the tube member, protruding in a direction perpendicular to the axis of the tube member. The outer periphery of the upper ring member is fitted into the inner periphery of the upper end of the body, and the outer periphery of the lower ring member is fitted into the inner periphery of the lower end of the body of the cap, thereby assembling the tube member inside the cap.

[0005] The upper ring portion and the lower ring member each have an opening that allows the coolant to pass in the vertical direction. A mesh is provided on the upper surface of the upper ring member to cover the opening. A mesh is provided on the lower surface of the lower ring member to cover the opening. The mesh is configured to allow the coolant to pass through but prevent the ion exchange resin from passing through. Ion exchange resin is filled between the upper ring portion and the lower ring member and between the outer peripheral surface of the tube member and the inner peripheral surface of the body of the cap.

[0006] Conventionally, the lower ring member has a resin substrate having an opening and a mesh embedded in the resin substrate and covering the opening. The resin substrate is molded by injecting molten resin into a cavity of a molding device with the mesh inserted into the cavity. When inserting the mesh into the cavity, the mesh is positioned by inserting a positioning pin that protrudes upward from the top surface of the lower mold of the molding device into a positioning hole formed in the mesh. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2021-137736 Summary of the Invention [Problem to be solved by the invention]

[0008] The mesh is formed by punching a sheet drawn from a roll into a circular shape. This results in the mesh being warped. If the protruding height of the positioning pins is increased in order to accurately position the warped mesh, the positioning pins may result in an increased height of the protrusions formed on the resin substrate.

[0009] Furthermore, this problem is not limited to molding devices that mold ring components that constitute ion exchangers, but also occurs in molding devices that mold resin products that have a resin substrate with an opening and a flexible sheet material that is embedded in the resin substrate and covers the opening. [Means for solving the problem]

[0010] A molding apparatus for solving the above problem is used to manufacture a resin product having a resin substrate with an opening and a flexible sheet material that is embedded in the resin substrate and covers the opening, and molds the resin substrate with the sheet material inserted therein. The molding apparatus includes a lower mold having a lower molding surface, and an upper mold configured to be able to move up and down above the lower mold and having an upper molding surface that forms a cavity for molding the resin substrate together with the lower molding surface. The lower mold includes a lower mold body having the lower molding surface and configured to be able to move up and down relative to the lower mold body. and a positioning pin that protrudes upward from the upper surface of the lower molding surface and is configured to be inserted into a positioning hole in the sheet material placed on the upper surface of the lower molding surface to position the sheet material; and a change mechanism that is configured to be able to change the protruding height of the positioning pin from the upper surface of the lower molding surface, wherein the change mechanism is configured to be able to change the protruding height of the positioning pin between a first height during molding and a second height when the sheet material is placed on the upper surface of the lower molding surface, and the second height is higher than the first height.

[0011] According to this configuration, since the changing mechanism is provided, when the sheet material is placed on the upper surface of the lower forming surface, the positioning pins are set to a second height that is higher than the first height during forming. This makes it easier for the positioning pins to be inserted into the positioning holes of the sheet material even when the sheet material is significantly warped, allowing for accurate positioning of the sheet material.

[0012] Furthermore, according to the above configuration, when the resin base material is molded, the positioning pins are at a first height that is lower than the second height when placed, thereby reducing the height of the protrusions formed on the resin base material due to the positioning pins protruding from the upper surface of the lower molding surface.

[0013] Therefore, the sheet material can be accurately positioned, and the height of the convex portions formed on the resin base material due to the positioning can be reduced. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a cross-sectional view of an ion exchange cartridge including a lower ring member molded by a molding apparatus according to one embodiment. [Figure 2] FIG. 2 is a perspective view of the lower ring member of FIG. [Figure 3] FIG. 3 is a perspective view of a sheet material that constitutes the lower ring member of FIG. [Figure 4] FIG. 4 is a plan view of a molding device according to one embodiment. [Figure 5] FIG. 5 is a cross-sectional view taken along line 5-5 in FIG. 4, showing a state in which the upper die is in the middle of descending. [Figure 6] FIG. 6(a) is a side view focusing on the locking member in the unlocked position, and FIG. 6(b) is a side view focusing on the locking member in the locked position. [Figure 7] FIG. 7 is a cross-sectional view corresponding to FIG. 5, showing a state in which a sheet material is placed on the lower molding surface of the lower mold in the mold-open state. [Figure 8] FIG. 8 is a cross-sectional view corresponding to FIG. 5, showing the state in which the molds are clamped. [Figure 9] FIG. 9 is a cross-sectional view corresponding to FIG. 5, showing a state in which the ejector plate has risen and the lower ring member has been removed. DETAILED DESCRIPTION OF THE INVENTION

[0015] An embodiment will be described below with reference to the drawings. The molding apparatus 10 of this embodiment molds a resin base material 88 of a lower ring member 87 that constitutes a cartridge 80 of an ion exchanger for a fuel cell. The lower ring member 87 corresponds to the resin product according to the present invention.

[0016] The cartridge 80 of the ion exchanger will be described with reference to FIGS. <Cartridge 80> As shown in FIG. 1, the cartridge 80 contains an ion exchange resin that performs ion exchange with the coolant, and includes a cap 81, a tube member 84, and a lower ring member 87.

[0017] The cap 81 has a cylindrical body 82 that extends in the vertical direction. The tube member 84 extends in the vertical direction inside the body portion 82. An upper ring portion 85 that protrudes in a direction perpendicular to the axis of the tube member 84 (the left-right direction in FIG. 1) is integrally formed at the upper end of the tube member 84.

[0018] The lower ring member 87 is attached to the lower end of the tube member 84 and protrudes in a direction perpendicular to the axis of the tube member 84 . In the cartridge 80, the outer periphery of the upper ring portion 85 is fitted into the inner periphery of the upper end of the body portion 82 of the cap 81, and the outer periphery of the lower ring member 87 is fitted into the inner periphery of the lower end of the body portion 82.

[0019] As shown in FIG. 2, the lower ring member 87 has a resin base material 88 having an opening 94 that allows the coolant to pass through in the vertical direction, and a flexible sheet material 98 that is embedded in the resin base material 88 and covers the opening 94.

[0020] The resin base material 88 has an inner ring portion 89, an outer ring portion 90 that surrounds the inner ring portion 89 from the outer peripheral side, and a plurality of connecting portions 93 that extend radially of the inner ring portion 89 and connect the lower end of the inner ring portion 89 to the lower end of the outer ring portion 90. In this embodiment, six connecting portions 93 are provided at equal intervals in the circumferential direction of the inner ring portion 89.

[0021] An outer peripheral groove 91 is provided on the outer peripheral surface of the outer ring portion 90. The outer peripheral groove 91 accommodates an O-ring that provides a seal between the outer ring portion 90 and the inner peripheral surface of the body portion 82 of the cap 81, and is provided around the entire circumference of the outer ring portion 90.

[0022] The resin base material 88 has ribs 95 protruding from the upper surfaces of the connecting portions 93. The ribs 95 extend radially of the inner ring portion 89 and connect the outer peripheral surface of the inner ring portion 89 to the inner peripheral surface of the outer ring portion 90. The ribs 95 are provided on three of the six connecting portions 93. More specifically, between connecting portions 93 on which ribs 95 are provided in the circumferential direction of the inner ring portion 89, one connecting portion 93 on which no rib 95 is provided is provided.

[0023] An insertion hole 92 that passes through the connecting portion 93 in the vertical direction is provided at the connecting portion between the connecting portion 93 and the outer ring portion 90, where the rib 95 is not provided. A protrusion 83 provided at the lower end of the body portion 82 of the cap 81 is inserted into the insertion hole 92 (see FIG. 1).

[0024] The connecting portion 93 on which the rib 95 is provided is provided with a protrusion 96 that protrudes upward from the connecting portion 93. The protrusions 96 protrude on both sides of the rib 95 in the circumferential direction of the inner ring portion 89. The protrusion height of the protrusion 96 from the upper surface of the connecting portion 93 is smaller than the protrusion height of the rib 95 from the upper surface of the connecting portion 93.

[0025] Inside the protrusion 96, a recess 97 having a circular cross section and opening to the lower surface of the connecting portion 93 is provided. 2 and 3, the sheet material 98 is configured to allow the coolant to pass through but to prevent the ion exchange resin from passing through. The sheet material 98 in this embodiment is a metal mesh.

[0026] The sheet material 98 is provided on the lower surface of the lower ring member 87 . As shown in Fig. 3, the sheet material 98 is substantially disk-shaped. The sheet material 98 has a circular center hole 99. The sheet material 98 has a plurality of positioning holes 100. In this embodiment, three positioning holes 100 are provided at equal intervals in the circumferential direction of the sheet material 98. The positioning holes 100 are circular holes. The positioning holes 100 are positioned on the same axis as the recessed portion 97 of the resin base material 88.

[0027] The upper ring portion 85 has a resin base material having an opening (not shown in the drawing) that allows the coolant to pass through in the vertical direction, and a flexible sheet material 86 that is embedded in the resin base material and covers the opening. The sheet material 86 has a configuration similar to that of the sheet material 98 of the lower ring member 87, and is provided on the upper surface of the upper ring portion 85.

[0028] As shown in FIG. 1, an ion exchange resin (not shown) is filled in the space formed between the upper ring portion 85 and the lower ring member 87 of the cartridge 80, and between the outer surface of the tube member 84 and the inner surface of the body portion 82 of the cap 81.

[0029] <Forming equipment 10> As shown in FIGS. 4, 5, and 7 to 9, the molding device 10 molds the resin base material 88 with the sheet material 98 inserted therein.

[0030] 5 and 7 to 9, molding apparatus 10 includes a lower mold 20 having a lower molding surface 22, and an upper mold 40 having an upper molding surface 42 that is configured to be able to move up and down above lower mold 20. Lower molding surface 22 and upper molding surface 42 form a cavity C for molding lower ring member 87 (see FIG. 8).

[0031] (Lower mold 20) As shown in FIGS. 5 and 7 to 9, the lower mold 20 includes a lower mold body 21, a positioning pin 23, an ejector plate 24, a return pin 27, and a changing mechanism 30.

[0032] The lower mold body 21 has a mold plate and a metal mold. The lower mold body 21 has a lower molding surface 22. The positioning pin 23 is configured to be able to move up and down relative to the lower mold body 21. The positioning pin 23 extends in the vertical direction and is inserted into a hole that penetrates the lower mold body 21 in the vertical direction.

[0033] The positioning pins 23 are configured to protrude upward from the lower molding surface 22 and to be inserted into positioning holes 100 in the sheet material 98 placed on the lower molding surface 22, thereby positioning the sheet material 98. Although not shown in the figures, in this embodiment, three positioning pins 23 are provided corresponding to the three positioning holes 100 in the sheet material 98.

[0034] The ejector plate 24 is configured to be able to move up and down below the lower mold body 21. The ejector plate 24 of this embodiment is configured by a plurality of plates that are stacked in the vertical direction.

[0035] The lower ends of ejector pins 25 extending in the vertical direction are fixed to the ejector plate 24. The lower ends of the ejector pins 25 are sandwiched in the vertical direction between the two plates that make up the ejector plate 24. The ejector pins 25 are inserted into holes that penetrate the lower die body 21 in the vertical direction.

[0036] The return pin 27 is configured to be able to move up and down relative to the lower mold body 21, and to be able to protrude and retract upward from the upper surface of the lower mold body 21. The return pin 27 extends in the vertical direction, and is inserted into a hole that passes through in the vertical direction through a portion of the lower mold body 21 that is located on the outer periphery of the lower molding surface 22. The return pin 27 is configured to descend when pressed by the lower surface of the descending upper mold 40.

[0037] The changing mechanism 30 is configured to be able to change the protruding height of the positioning pin 23 from the lower molding surface 22 . The changing mechanism 30 is configured to be able to change the protruding height of the positioning pin 23 between a first height H1 (see FIG. 8) when the resin base material 88 is being molded and a second height H2 (see FIG. 5) when the sheet material 98 is being placed on the lower molding surface 22. The second height H2 is higher than the first height H1.

[0038] The changing mechanism 30 includes a movable plate 31 and a locking member 33 . The movable plate 31 is configured to be able to move up and down below the lower mold body 21. The movable plate 31 is disposed between the lower mold body 21 and the ejector plate 24 in the vertical direction. The movable plate 31 in this embodiment is configured by a plurality of plates that overlap in the vertical direction.

[0039] The lower end of the positioning pin 23 is fixed to the movable plate 31. The lower end of the positioning pin 23 is sandwiched between the two plates that make up the movable plate 31 in the vertical direction.

[0040] As shown in FIG. 5, the locking member 33 is configured to lock the movable plate 31 when the protruding height of the positioning pin 23 is the second height H2. Specifically, the movable plate 31 is configured to rise until the protruding height of the positioning pins 23 reaches the second height H2 by being pressed by the rising ejector plate 24. In this embodiment, the movable plate 31 rises until the upper surface of the movable plate 31 approaches the lower surface of the mold plate of the lower mold body 21. Then, when the upper surface of the movable plate 31 approaches the lower surface of the mold plate of the lower mold body 21, the protruding height of the positioning pins 23 reaches the second height H2.

[0041] As shown in FIG. 8, the locking member 33 is configured to move from a locking position where it locks the movable plate 31 to a non-locking position where it does not lock the movable plate 31 when pressed by the descending return pin 27.

[0042] The lower end of a pushing portion 26 that pushes upward the lower end of the return pin 27 is fixed to the ejector plate 24. The pushing portion 26 is a pin that extends in the vertical direction directly below the return pin 27 and protrudes upward from the ejector plate 24. The lower end of the pushing portion 26 is sandwiched in the vertical direction between the two plates that make up the ejector plate 24.

[0043] Here, the configuration of the lower mold 20, focusing on the locking member 33, will be described in detail with reference to FIG. 6(a) and 6(b), a fixing member 32 is fixed to the lower surface of the lower mold body 21 on the outer circumferential side of the movable plate 31. The fixing member 32 is provided with a stepped bolt hole 32a that penetrates in a direction perpendicular to the up-down direction (the left-right direction in FIGS. 6(a) and 6(b)).

[0044] A support bolt 35 is inserted through the bolt hole 32a so as to be slidable in the perpendicular direction. A male screw 35a is provided at the tip of the support bolt 35. The male screw 35a is screwed into a female screw hole 33b formed in the locking member 33.

[0045] The locking member 33 is configured to be movable relative to the fixed member 32, that is, in a direction perpendicular to the lower mold body 21. A biasing member 36 is provided between the fixed member 32 and the locking member 33 to bias the locking member 33 toward the locking position where the movable plate 31 is locked. The biasing member 36 is a coil spring. A support bolt 35 is inserted through the biasing member 36.

[0046] The locking member 33 has a contact surface 33 a configured to be able to contact the lower surface of the movable plate 31 . A restricting member 29 for restricting the descent of the return pin 27 is fixed to the lower part of the lower die body 21 .

[0047] The restricting member 29 is provided directly above the locking member 33. The restricting member 29 has an accommodation portion 29a that opens upward. The restricting member 29 is provided with a through-hole 29b that extends in the up-down direction and penetrates from the bottom surface of the accommodation portion 29a to the lower end surface of the restricting member 29.

[0048] The return pin 27 has an expanded diameter portion 27a. A portion of the return pin 27 below the expanded diameter portion 27a is inserted into the through-hole 29b. The expanded diameter portion 27a abuts against a restricting surface 29c, which is the bottom surface of the accommodating portion 29a, thereby restricting the descent of the return pin 27 (FIG. 6(a)). That is, the return pin 27 is configured to be able to move up and down above the position where the expanded diameter portion 27a abuts against the restricting surface 29c.

[0049] The lower end of the return pin 27 has a first inclined surface 28. The first inclined surface 28 is inclined so that the closer it is to the movable plate 31 in the orthogonal direction, the lower it is positioned. The locking member 33 has a second inclined surface 34 that is aligned with the first inclined surface 28 of the return pin 27 and faces the first inclined surface 28 in the up-down direction.

[0050] The return pin 27 is configured to move downwards by the first inclined surface 28 of the return pin 27, thereby moving the locking member 33 from the locking position (see FIGS. 5, 6(b), 7, and 9) to the non-locking position (see FIGS. 6(a) and 8). The return pin 27 is also configured to be pushed upwards by the pushing portion 26, thereby allowing the locking member 33 to move from the non-locking position to the locking position by the biasing force of the biasing member 36.

[0051] (upper mold 40) As shown in FIGS. 5 and 8, the upper die 40 includes an upper die body 41, a pressing pin 44, and an upper biasing member 45.

[0052] The upper mold body 41 includes a mold plate and a mold die. The upper mold body 41 includes an upper molding surface . The upper mold body 41 is provided with a receiving hole 43 that extends in the vertical direction and opens to the upper molding surface 42 .

[0053] The pressing pin 44 is provided inside the accommodation hole 43. The pressing pin 44 is configured to be able to move up and down relative to the upper mold body 41 and to be able to appear and disappear below the upper molding surface 42, thereby pressing the sheet material 98 against the lower mold body 21. More specifically, the pressing pin 44 is configured to press down the portion of the sheet material 98 that is exposed by the opening 94 of the resin base material 88.

[0054] The upper biasing member 45 is provided inside the accommodation hole 43 and biases the pressing pin 44 downward. The upper biasing member 45 of this embodiment is a coil spring. Next, a procedure for manufacturing the lower ring member 87 by molding the resin base material 88 using the molding apparatus 10 of this embodiment will be described.

[0055] 7, in a mold-open state in which the upper mold 40 is separated from the lower mold 20, the return pin 27 protrudes upward from the upper surface of the lower mold body 21. When the movable plate 31 is close to the lower surface of the lower mold body 21, it is locked by the locking member 33. The protruding height of the positioning pin 23 is set to a second height H2. In addition, the ejector plate 24 is separated downward from the movable plate 31, and the upper ends of the ejector pins 25 are located on the same plane as the lower molding surface 22.

[0056] In this state, the sheet material 98 is placed on the lower molding surface 22 of the lower mold 20. At this time, the positioning pins 23, which are set to the second height H2, are inserted into the positioning holes 100, thereby positioning the sheet material 98.

[0057] As shown in FIG. 5, when the upper die 40 is lowered, the lower ends of the pressing pins 44 press the sheet material 98 against the lower molding surface 22 . When the upper die 40 is further lowered, the pressing pin 44 is pressed by the lower die body 21 and retreats into the accommodation hole 43 while compressing the upper biasing member 45 .

[0058] Furthermore, when the return pin 27 is pressed by the lower surface of the descending upper mold body 41 and thus descends, the first inclined surface 28 of the return pin 27 presses the second inclined surface 34 of the locking member 33. As a result, the locking member 33 moves away from the movable plate 31 while compressing the biasing member 36, and the locking member 33 moves from the locking position to the unlocking position.

[0059] As a result, the movable plate 31 is released from the locked state by the locking member 33, so that the movable plate 31 descends under its own weight, and as a result, the protruding height of the positioning pin 23, whose lower end is fixed by the movable plate 31, becomes the first height H1.

[0060] As shown in Figure 8, when the mold is clamped and the lower surface of the upper mold body 41 abuts against the upper surface of the lower mold body 21, the lower molding surface 22 and the upper molding surface 42 form a cavity C for molding the resin substrate 88.

[0061] In this state, molten resin is injected into the cavity C to form the resin base material 88. Subsequently, after the resin base material 88 has cooled and hardened, the upper mold 40 is raised.

[0062] 9, by raising the ejector plate 24, the ejector pins 25 are caused to protrude upward from the lower molding surface 22. As a result, the resin base material 88 is pushed out by the ejector pins 25, and the lower ring member 87 is removed from the lower mold 20.

[0063] At this time, the movable plate 31 is pressed by the rising ejector plate 24, so that the protruding height of the positioning pin 23 becomes the second height H2. Furthermore, the return pin 27 rises due to being pressed by the pushing portion 26 of the rising ejector plate 24. This allows the locking member 33 to move from the unlocked position to the locked position due to the biasing force of the biasing member 36. Then, the movable plate 31 is locked by the locking member 33.

[0064] In this state, the locking member 33 locks the movable plate 31, so that the protruding height of the positioning pin 23 is maintained at the second height H2 even after the ejector plate 24 is lowered.

[0065] <Operation of this embodiment> According to the forming apparatus 10 of this embodiment, since the changing mechanism 30 is provided, when the sheet material 98 is placed on the lower forming surface 22, the positioning pins 23 are at a second height H2 that is higher than the first height H1 during forming. This makes it easier for the positioning pins 23 to be inserted into the positioning holes 100 of the sheet material 98 even when the sheet material 98 is significantly warped, so that the sheet material 98 can be accurately positioned.

[0066] Furthermore, when molding the resin base material 88, the positioning pins 23 are at a first height H1 that is lower than the second height H2 when placed. This allows the height of the protrusions 96 formed on the resin base material 88 due to the positioning pins 23 protruding from the lower molding surface 22 to be reduced.

[0067] <Effects of this embodiment> (1) The lower mold 20 is equipped with a change mechanism 30 configured to be able to change the protruding height of the positioning pins 23 from the lower molding surface 22. The change mechanism 30 is configured to be able to change the protruding height of the positioning pins 23 between a first height H1 during molding and a second height H2 when the sheet material 98 is placed on the lower molding surface 22. The second height H2 is higher than the first height H1.

[0068] According to this configuration, the effects of the above-described embodiment are achieved, and the sheet material 98 can be positioned accurately, while the height of the protrusions 96 formed on the resin base material 88 due to the positioning can be reduced.

[0069] (2) The lower mold 20 includes an ejector plate 24 and a return pin 27. The changing mechanism 30 includes a movable plate 31 and a locking member 33. The movable plate 31 is configured to be pressed by the rising ejector plate 24, thereby rising until the protruding height of the positioning pin 23 reaches the second height H2. The locking member 33 is configured to be pressed by the descending return pin 27, thereby moving from a locking position where the movable plate 31 is locked to a non-locking position where the movable plate 31 is not locked.

[0070] With this configuration, when the lower ring member 87 is removed from the lower molding surface 22, the rising ejector plate 24 presses the movable plate 31, causing the protruding height of the positioning pin 23 to become the second height H2. In this state, the locking member 33 locks the movable plate 31, so the protruding height of the positioning pin 23 is maintained at the second height H2 even after the ejector plate 24 is lowered.

[0071] Furthermore, according to the above configuration, when the upper mold 40 descends prior to molding the resin base material 88, the return pin 27 is pressed by the lower surface of the descending upper mold body 41, causing the locking member 33 to move from the locked position to the unlocked position. This releases the state in which the movable plate 31 is locked by the locking member 33, causing the movable plate 31 to descend under its own weight, and as a result, the protruding height of the positioning pin 23, the lower end of which is fixed by the movable plate 31, becomes the first height H1.

[0072] In this way, by using the existing components such as the ejector plate 24 and the return pin 27 as a driving source, the protruding height of the positioning pin 23 can be changed between the first height H1 and the second height H2.

[0073] (3) The ejector plate 24 has a pushing portion 26. The locking member 33 is configured to be movable in a direction perpendicular to the up-down direction. The changing mechanism 30 includes a biasing member 36 that biases the locking member 33 toward the locked position. The lower end of the return pin 27 has a first inclined surface 28. The locking member 33 has a second inclined surface 34 that is aligned with the first inclined surface 28 and faces the first inclined surface 28 in the up-down direction. The return pin 27 is configured to move downward by pressing the second inclined surface 34 with the first inclined surface 28, thereby moving the locking member 33 from the locked position to the unlocked position. The return pin 27 is configured to be pushed upward by the pushing portion 26, thereby allowing the locking member 33 to move from the unlocked position to the locked position due to the biasing force of the biasing member 36.

[0074] With this configuration, when the lower ring member 87 is removed from the lower molding surface 22, the return pin 27 rises as it is pressed by the pushing portion 26 of the rising ejector plate 24. This allows the locking member 33 to move from the unlocked position to the locked position due to the biasing force of the biasing member 36. Then, the locking member 33 locks the movable plate 31.

[0075] Furthermore, when the upper mold 40 descends prior to molding the resin base material 88, the return pin 27 is pressed by the lower surface of the descending upper mold body 41, and as the return pin 27 descends, the first inclined surface 28 presses downward the second inclined surface 34 of the locking member 33. This causes the locking member 33 to move from the locked position to the unlocked position.

[0076] In this way, according to the above configuration, by setting the first inclined surface 28 and the second inclined surface 34 on the return pin 27 and the locking member 33, respectively, the changing mechanism 30 can be easily realized.

[0077] (4) The upper die 40 includes an upper die body 41 , a presser pin 44 , and an upper biasing member 45 . According to this configuration, the pressing pin 44 is biased downward by the upper biasing member 45, so that in the mold open state in which the upper mold body 41 is spaced upward from the lower mold body 21, the pressing pin 44 protrudes downward from the underside of the upper mold body 41.

[0078] When the upper die 40 descends prior to molding the resin base material 88, the pressing pins 44 press the sheet material 98 against the lower molding surface 22. As a result, the lower surface of the upper die body 41 is pressed against the lower molding surface 22 with any warpage of the sheet material 98 corrected.

[0079] Therefore, the work of removing the warp from the sheet material 98 can be reduced or omitted. <Modification> This embodiment can be modified as follows: This embodiment and the following modifications can be combined and implemented within the scope of technical compatibility.

[0080] The holding pin 44 and the upper biasing member 45 may be omitted. Even in this case, the effects (1) to (3) of the above embodiment can be achieved. In the above embodiment, the locking member 33 is moved from the locked position to the unlocked position by the force of the first inclined surface 28 of the return pin 27 pressing against the second inclined surface 34 of the locking member 33, but the present invention is not limited to this. The locking member 33 may not have the first inclined surface 28 as long as it is pressed by the descending return pin 27 to move from the locked position to the unlocked position.

[0081] The positioning pins 23 are not limited to those that are drivingly connected to the ejector plate 24 and the return pins 27. In other words, the positioning pins 23 may be raised and lowered by an actuator that is independent of the ejector plate 24 and the return pins 27.

[0082] The molding device 10 according to the present invention is not limited to molding the resin base material 88 that constitutes the lower ring member 87, but can also be embodied as a device that molds the resin base material of a tube member 84 having an upper ring portion 85.

[0083] The molding apparatus 10 according to the present invention is not limited to molding the resin substrate of the lower ring member 87 or the tube member 84 that constitute the cartridge 80 of the ion exchanger. In other words, it may be used to manufacture a resin product having a resin substrate with an opening and a flexible sheet material that is embedded in the resin substrate and covers the opening, and may mold the resin substrate with the sheet material inserted. In this case, the sheet material may be any flexible material and is not limited to a metal mesh. [Explanation of symbols]

[0084] 10…Forming equipment 20…Lower mold 21...Lower die body 21A…template 21B...Mold 22…Lower molding surface 23...Locating pin 24...Ejector plate 25...Ejector pin 26...Pushing part 27...Return pin 27a... Expanded diameter part 28...First slope 29...Regulatory member 29a... Storage area 29b...Through hole 29c...Regulatory aspects 30...Change mechanism 31... Movable plate 32...Fixing member 32a...Bolt hole 33...Locking member 33a…Abutment surface 33b...female thread 34…Second slope 35...Support bolt 36... Urging member 40…Upper mold 41...Upper mold body 42…Upper molding surface 43...Housing hole 44...Press pin 45...Upper biasing member 80...Cartridge 81...Cap 82...Torso 83…Protrusion 84...Tube member 85...Upper ring part 86...Sheet material 87...Lower ring member 88...Resin substrate 89...Inner ring part 90...Outer ring part 91...Peripheral groove 92...Through hole 93...Connection part 94...Opening 95...Ribs 96...Convex part 97...recess 98...Sheet material 99…Center hole 100...Positioning hole

Claims

1. A molding device used in the manufacture of a resin product having a resin substrate having an opening and a flexible sheet material embedded in the resin substrate and covering the opening, the molding device molding the resin substrate with the sheet material inserted therein, a lower mold having a lower molding surface; an upper mold configured to be able to move up and down above the lower mold and having an upper molding surface that forms a cavity for molding the resin base material together with the lower molding surface; The lower mold is a lower mold body having the lower molding surface; a positioning pin configured to be able to move up and down relative to the lower mold body, protruding upward from the lower molding surface, and configured to be inserted into a positioning hole of the sheet material placed on the lower molding surface to position the sheet material; a change mechanism configured to change the protruding height of the positioning pin from the lower molding surface, the changing mechanism is configured to change the protruding height of the positioning pin between a first height during molding and a second height during placement of the sheet material on the lower molding surface, The second height is greater than the first height. Molding equipment.

2. The lower mold is an ejector plate configured to be able to move up and down below the lower mold body; a return pin that is capable of rising and falling relative to the lower mold body, that can appear and disappear from the upper surface of the lower mold body, and that is configured to descend by being pressed by the lower surface of the descending upper mold, The change mechanism is a movable plate configured to be able to move up and down below the lower mold body and to which a lower end of the positioning pin is fixed; a locking member configured to lock the movable plate when the protruding height of the positioning pin is at the second height, the movable plate is configured to rise when pressed by the rising ejector plate until the protruding height of the positioning pin becomes the second height, The locking member is configured to move from a locking position where the movable plate is locked to a non-locking position where the movable plate is not locked by being pressed by the descending return pin. The molding apparatus of claim 1 .

3. the ejector plate has a pushing portion that pushes the lower end of the return pin upward; The locking member is configured to be movable in an orthogonal direction perpendicular to the up-down direction, the change mechanism includes a biasing member that biases the locking member toward the locking position, The lower end of the return pin has a first inclined surface, the locking member has a second inclined surface that is aligned with the first inclined surface and faces the first inclined surface in the up-down direction, The return pin is configured to move the locking member from the locking position to the unlocking position by pressing the second inclined surface downward with the first inclined surface as it descends, and to allow the locking member to move from the unlocking position to the locking position by the biasing force of the biasing member as it rises as it is pressed by the pushing portion. The molding apparatus according to claim 2 .

4. The upper mold is an upper mold body having the upper molding surface; a pressing pin that is movable up and down relative to the upper mold body and that is configured to be able to protrude and retract downward from the lower surface of the upper mold body and press the sheet material against the lower molding surface; an upper biasing member that biases the pressing pin downward, The molding apparatus according to any one of claims 1 to 3.

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