Pressurizing device and pressurizing method

Abstract

To provide a pressurizing device and a pressurizing method that can prevent a workpiece from being misaligned relative to a substrate.SOLUTION: A pressurizing device includes: a stage 10 having a substrate placement area 11 for directly or indirectly placing a substrate 2 thereon; and a balloon 20 for pressurizing the substrate 2. The balloon 20 has an expansion portion 22 that expands inside a fixed end 21a. The expansion portion 22 has an inner expansion portion 23 that expands inside the substrate placement area 11 toward the substrate 2, and an outer expansion portion 24 that expands toward the stage 10 outside the substrate placement area 11. In a cross section perpendicular to the stage 10, an expansion region 50 is formed downward from a position corresponding to the upper surface of the substrate 2 between the fixed end 21a and the substrate placement area 11, extending, for expanding the outer expansion portion 24 downward from the position corresponding to the upper surface of the substrate 2. In a direction perpendicular to the stage 10, a height of the expansion region 50 is 2.5 mm or less.SELECTED DRAWING: Figure 2B

Description

[Technical Field]

[0001] The present disclosure relates to a pressure device for applying pressure to a substrate and a pressure method for applying pressure to a substrate. [Background technology]

[0002] A technique for joining a workpiece to a substrate by pressurizing the substrate with an elastic body that expands like a balloon has been known (see, for example, Patent Document 1). With this technique, the load variation on the workpiece is reduced compared to when the substrate is pressurized with a rigid body such as metal, and the workpiece is uniformly pressurized by the elastic body. As a result, the joining accuracy of the workpiece to the substrate can be made uniform. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-288926 Summary of the Invention [Problem to be solved by the invention]

[0004] When a substrate is pressurized by a balloon-shaped elastic body, the expansion of the elastic body causes a force (shear stress) to act on the substrate in a direction parallel to the substrate, which can cause a problem in that the workpiece placed on the substrate is displaced in a direction parallel to the substrate due to the shear stress.

[0005] The present disclosure provides a pressure device and a pressure method that can prevent a workpiece from being misaligned relative to a substrate. [Means for solving the problem]

[0006] A pressure applying device according to a first aspect of the present disclosure includes: a stage having a substrate placement area for directly or indirectly placing a substrate; a balloon fixed by a fixing member above the stage and pressurizing the substrate; The balloon has a fixed end portion fixed by the fixing member and an inflation portion that inflates inside the fixed end portion, the expansion section has an inner expansion section that expands toward the substrate inside the substrate placement area and an outer expansion section that expands toward the stage outside the substrate placement area, an expansion region is formed between the fixed end portion and the substrate placement region in a cross section perpendicular to the stage, the expansion region being formed downward from a position corresponding to an upper surface of the substrate, and for expanding the outer expansion portion downward from the position corresponding to the upper surface of the substrate; In a direction perpendicular to the stage, the height of the expansion region is 2.5 mm or less.

[0007] In a pressurizing device according to a first aspect of the present disclosure, the expansion section includes an inner expansion section that expands toward the substrate inside the substrate placement area and an outer expansion section that expands toward the stage outside the substrate placement area. In a cross section perpendicular to the stage, an expansion region is formed between the fixed end and the substrate placement area, extending downward from a position corresponding to the upper surface of the substrate. This expansion region allows the outer expansion section to expand downward from the position corresponding to the upper surface of the substrate. Therefore, the balloon pressurizes the substrate above the substrate placement area via the inner expansion section. Additionally, the balloon directly or indirectly pressurizes the stage via the outer expansion section in the expansion region. In particular, in the pressurizing device according to the present disclosure, the height of the expansion region in a direction perpendicular to the stage is 2.5 mm or less. Therefore, when the outer expansion section directly or indirectly pressurizes the stage in the expansion region, it expands by 2.5 mm or less in a direction perpendicular to the stage. The present inventors discovered that by setting the expansion width of the outer expansion section to 2.5 mm or less, shear stress is less likely to act on the substrate via the inner expansion section. This solves the problem of the workpiece being displaced in a direction parallel to the substrate due to shear stress.

[0008] A pressure applying device according to a second aspect of the present disclosure includes: a stage having a substrate placement area for directly or indirectly placing a substrate; a balloon fixed by a fixing member above the stage and pressurizing the substrate; The balloon has a fixed end portion fixed by the fixing member and an inflation portion that inflates inside the fixed end portion, the expansion section has an inner expansion section that expands toward the substrate inside the substrate placement area and an outer expansion section that expands toward the stage outside the substrate placement area, an expansion region is formed between the fixed end portion and the substrate placement region in a cross section perpendicular to the stage, the expansion region being formed downward from a position corresponding to an upper surface of the substrate, and for expanding the outer expansion portion downward from the position corresponding to the upper surface of the substrate; The ratio of the width of the expansion region in a direction parallel to the stage to the height of the expansion region in a direction perpendicular to the stage is 43.3 or greater.

[0009] In a pressurizing device according to a second aspect of the present disclosure, the ratio of the width of the expansion region in a direction parallel to the stage to the height of the expansion region in a direction perpendicular to the stage is 43.3 or greater. Therefore, when the expansion region directly or indirectly pressurizes the stage, the outer expansion section expands in directions parallel and perpendicular to the stage at a ratio equal to or greater than the above. Thus, even when the ratio of the expansion width of the outer expansion section in a direction parallel to the stage to the expansion width of the outer expansion section in a direction perpendicular to the stage is 43.3 or greater, the present inventors have found that shear stress is less likely to act on the substrate via the inner expansion section. This solves the problem of the workpiece being misaligned in a direction parallel to the substrate due to shear stress.

[0010] The pressurizing method of the present disclosure includes: a step of bringing a balloon for pressurizing a substrate placed directly or indirectly in a substrate placement area of ​​a stage into contact with the substrate; and inflating the balloon while the balloon is in contact with the substrate, The balloon inflates toward the substrate inside the substrate placement area, and inflates toward the stage outside the substrate placement area.

[0011] In the pressurization method disclosed herein, a balloon expands toward the substrate inside the substrate placement area and toward the stage outside the substrate placement area. The present inventors discovered that by expanding the balloon toward the stage outside the substrate placement area, shear stress is less likely to act on the substrate through the portion of the balloon that abuts against the substrate. This solves the problem of the workpiece being misaligned in a direction parallel to the substrate due to shear stress. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a cross-sectional view of a pressure device according to a first embodiment. [Figure 2A] 2A is a partially enlarged cross-sectional view of the pressure device shown in FIG. [Figure 2B] FIG. 2B is a partially enlarged cross-sectional view of the balloon shown in FIG. 2A when inflated. [Figure 3A] FIG. 3A is a cross-sectional view for explaining the operation of the pressure device shown in FIG. [Figure 3B] FIG. 3B is a cross-sectional view for explaining a subsequent operation of the pressure device shown in FIG. 3A. [Figure 3C] FIG. 3C is a cross-sectional view for explaining a subsequent operation of the pressure device shown in FIG. 3B. [Figure 4] FIG. 4 is a cross-sectional view of the pressure device of the second embodiment. [Figure 5A] 5A is a partially enlarged cross-sectional view of the pressure device shown in FIG. [Figure 5B] FIG. 5B is a partially enlarged cross-sectional view of the balloon shown in FIG. 5A when inflated. [Figure 6] FIG. 6 is a cross-sectional view of a pressure device according to the third embodiment. [Figure 7] FIG. 7 is a plan view of the substrate, the support member, and the plate-like member shown in FIG. [Figure 8A]8A is a partially enlarged cross-sectional view of the pressure device shown in FIG. [Figure 8B] FIG. 8B is a partially enlarged cross-sectional view of the balloon shown in FIG. 8A when inflated. [Figure 9A] FIG. 9A is a cross-sectional view showing the simulation results of the distribution of stress generated in the balloon. [Figure 9B] FIG. 9B is a cross-sectional view showing the simulation results of the distribution of stress generated in the balloon. [Figure 10] FIG. 10 is a cross-sectional view of a pressure device according to the fourth embodiment. [Figure 11A] 11A is a partially enlarged cross-sectional view of the pressure device shown in FIG. [Figure 11B] FIG. 11B is a partially enlarged cross-sectional view of the balloon shown in FIG. 11A when inflated. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that the contents shown in the drawings are merely schematic and illustrative for understanding the present disclosure, and the appearance and dimensional ratios may differ from the actual product. Furthermore, the present disclosure is not limited to the following embodiments.

[0014] (First embodiment) 1 is an apparatus for joining a workpiece placed on a substrate 2 to the substrate 2 by applying pressure to the substrate 2. In the present disclosure, the workpiece is, for example, a chip component constituting an electronic component such as a resistor, a capacitor, a coil, or an IC (semiconductor), a light-emitting element such as an LED element, or other chip component, or other element.

[0015] The material constituting the substrate 2 is not particularly limited, but may be, for example, a glass epoxy material. The substrate 2 may be made of glass such as SiO2 or Al2O3. The substrate 2 may also be made of elastomers such as polyimide, polyamide, polypropylene, polyether ether ketone, urethane, silicone, polyethylene terephthalate, and polyethylene naphthalate, or glass wool.

[0016] A conductive bonding material may be formed on the surface of the substrate 2. The conductive bonding material has the property of being hardened by heating, for example, and can electrically and mechanically connect the workpiece to the substrate 2 by anisotropic conductive particle connection, bump pressure connection, or the like. The conductive bonding material is not particularly limited, but may be, for example, ACF, ACP, NCF, or NCP.

[0017] The pressurizing device 1 includes a stage 10, a balloon 20, a head 30, and a fixing member 40. The stage 10 includes a substrate placement area 11 for directly or indirectly placing a substrate 2 thereon. In this embodiment, the substrate 2 is directly placed in the substrate placement area 11 so as to be in contact with the upper surface of the stage 10. Therefore, the substrate placement area 11 corresponds to the contact surface between the substrate 2 and the stage 10, and the area of ​​the substrate placement area 11 is equal to the area of ​​the substrate 2 in a planar view. As will be described later, a support member (see support member 60 in FIG. 4) for placing the substrate 2 may be placed between the substrate 2 and the upper surface of the stage 10, or the substrate 2 may be indirectly placed in the substrate placement area 11 via the support member. In this case, the substrate placement area 11 corresponds to the contact surface between the support member and the stage 10, and the area of ​​the substrate placement area 11 is equal to the area of ​​the support member in a planar view.

[0018] The stage 10 may be provided with a heat source for heating the substrate 2. By heating the substrate 2 with the heat source, the bonding strength of the workpiece to the substrate 2 can be increased.

[0019] The fixing member 40 is provided above the stage 10 and fixes the outer edge (end) of the balloon 20. The number of fixing members 40 may be one or more. The fixing members 40 fix the balloon 20 by clamping the outer edge of the balloon 20. However, the configuration in which the fixing member 40 fixes the balloon 20 is not limited to the configuration shown in FIG. 1. For example, the outer edge of the balloon 20 may be adhered or bonded to the fixing member 40, thereby fixing the balloon 20 to the fixing member 40.

[0020] In the following, axes that are parallel to the upper surface of the stage 10 and perpendicular to each other are referred to as the X-axis and Y-axis. Furthermore, an axis perpendicular to the upper surface of the stage 10 is referred to as the Z-axis. The X-axis, Y-axis, and Z-axis are perpendicular to each other. The X-axis is an axis along which one fixed end of the balloon 20 fixed by the fixing member 40 faces the other fixed end. In the present disclosure, the positive side of the Z-axis is referred to as the upper side, and the negative side of the Z-axis is referred to as the lower side. However, the upper side in the Z-axis direction does not necessarily coincide with the upper side in the vertical direction. Furthermore, the lower side in the Z-axis direction does not necessarily coincide with the lower side in the vertical direction.

[0021] In the present disclosure, "parallel" does not only refer to strict parallelism, but also includes a state in which there is an error of ±Δθ° (not particularly limited, for example, Δθ=3) or less from strict parallelism. Furthermore, "perpendicular" does not only refer to strict perpendicularity, but also includes a state in which there is an error of ±Δθ° (not particularly limited, for example, Δθ=3) or less from strict perpendicularity.

[0022] Furthermore, the term "equal" does not only refer to a state in which the physical quantities of the objects being compared are exactly equal, but also includes a state in which there is an error of ±Δ% or less (not particularly limited, for example, Δ=7, 5, or 3) between the physical quantities of the objects being compared.

[0023] The head 30 is provided above the stage 10 and moves up and down relative to the stage 10. In this embodiment, the stage 10 moves upward toward the head 30, but the head 30 may also move downward toward the stage 10. The head 30 has, as an example, a main body 31, a gas supply hole 32, a gas supply pipe 33, a convex portion 34, and a space 35. The convex portion 34 protrudes downward from both sides of the main body 31 in the X-axis direction. A fixing member 40 is provided on the convex portion 34. The balloon 20 is fixed to the convex portion 34 above the stage 10 via the fixing member 40. The space 35 is a closed space surrounded by the main body 31, the convex portion 34, and the balloon 20.

[0024] The gas supply hole 32 is a through-hole that penetrates the main body 31. A gas supply pipe 33 is connected to the gas supply hole 32. Gas for inflating the balloon 20 can be supplied to the space 35 through the gas supply pipe 33. The gas supplied to the space 35 through the gas supply pipe 33 is not particularly limited, but may be, for example, air, helium, nitrogen, carbon dioxide, hydrogen, oxygen, or the like.

[0025] The balloon 20 is a pressurizing member for pressurizing the substrate 2. When gas is supplied to the space 35 and the space 35 is pressurized, the balloon 20 expands (elastically deforms) in a convex shape toward the stage 10. When the gas is discharged from the space 35 and the space 35 is depressurized, the balloon 20 contracts and returns to its pre-expansion shape. The material constituting the balloon 20 is not particularly limited, but may be an elastic body such as rubber or resin. The width of the balloon 20 in the X-axis direction is larger than the width of the substrate 2 in the X-axis direction, and the width of the balloon 20 in the Y-axis direction is larger than the width of the substrate 2 in the Y-axis direction. The thickness of the balloon 20 is not particularly limited, but is 0.5 mm or more and 5.0 mm or less. Although the thickness of the balloon 20 is shown as being thinner than the thickness of the substrate 2, it may be equal to or thicker than the thickness of the substrate 2.

[0026] Balloon 20 has fixed end 21a, fixed end 21b, and inflation portion 22. Fixed ends 21a and 21b are located at the outer edge of balloon 20. Fixed ends 21a and 21b are fixed (clamped) by fixing member 40 and do not contribute to the inflation and deflation of balloon 20. When viewed from the Y-axis direction, fixed end 21a is formed at one end of balloon 20 in the X-axis direction, and fixed end 21b is formed at the other end of balloon 20 in the X-axis direction. Fixed end 21a and fixed end 21b may be formed continuously or discontinuously.

[0027] The expansion section 22 is located between the fixed ends 21a and 21b when viewed from the Y-axis direction, and expands and contracts inside the fixed ends 21a and 21b. The expansion section 22 is a part that contributes to the expansion and contraction of the balloon 20.

[0028] The expansion portion 22 has an inner expansion portion 23 and an outer expansion portion 24. The inner expansion portion 23 expands toward the substrate 2 inside the substrate placement area 11. When the expansion portion 22 expands, the inner expansion portion 23 abuts against the substrate 2 (and / or the workpiece on the substrate 2) and applies pressure to the substrate 2 (and / or the workpiece on the substrate 2). As a result, the workpiece is pressed against the substrate 2 by the expanded inner expansion portion 23 and is bonded to the substrate 2 by the pressure force applied by the inner expansion portion 23. In this embodiment, the inner expansion portion 23 expands and contracts while abutting against the upper surface of the substrate 2, although this is not particularly limited.

[0029] The outer expansion section 24 expands toward the stage 10 outside the substrate placement area 11. When the expansion section 22 expands, the outer expansion section 24 does not pressurize the substrate 2, but rather abuts against the upper surface of the stage 10 and presses the upper surface of the stage 10. However, as will be described later, if a plate-shaped member (see plate-shaped member 70 in FIG. 6) is placed on the upper surface of the stage 10 outside the substrate placement area 11, the outer expansion section 24 presses the plate-shaped member.

[0030] As shown in FIG. 1, when the inflation portion 22 is not inflated, the width of the inner inflation portion 23 in the X-axis direction is wider than the width of the outer inflation portion 24 in the X-axis direction, but it may be the same as or narrower than that.

[0031] As shown in FIG. 2A, in a cross section perpendicular to the stage 10, an expansion region 50 is formed between the fixed end 21a and the substrate placement region 11. An expansion region 50 is also formed between the fixed end 21b (FIG. 1) and the substrate placement region 11. The expansion region 50 is formed downward from a position corresponding to the upper surface of the substrate 2 (at the same height as the upper surface of the substrate 2). In this embodiment, the expansion region 50 is formed in the Z-axis direction from a position corresponding to the upper surface of the substrate 2 to the upper surface of the stage 10.

[0032] The expansion region 50 is a region for expanding the outer expansion portion 24 downward from a position corresponding to the upper surface of the substrate 2. As shown in FIG. 2B , when the expansion portion 22 expands, at least a portion of the outer expansion portion 24 expands downward within the expansion region 50. As a result, at least a portion of the outer expansion portion 24 is disposed along the upper surface of the stage 10 and abuts against the upper surface of the stage 10. For example, the outer expansion portion 24 may abut against an area (in a cross-sectional view) of 30% or more, 50% or more, 70% or more, or 90% or more of the upper surface of the stage 10 between the fixed end 21a and the substrate placement region 11. The outer expansion portion 24 is recessed within the expansion region 50, and at least a portion of the outer expansion portion 24 is positioned below the position corresponding to the upper surface of the substrate 2.

[0033] As shown in FIGS. 2A and 2B , the height H of the expansion region 50 in the direction perpendicular to the stage 10 (Z-axis direction) is 2.5 mm or less. Therefore, the outer expansion portion 24 expands downward within the expansion region 50 by a maximum of 2.5 mm or less, which corresponds to the height H of the expansion region 50. In this manner, in this embodiment, the downward expansion width of the outer expansion portion 24 is limited to the above-mentioned numerical range so that the outer expansion portion 24 does not expand excessively downward between the fixed end portion 21 a and the substrate placement region 11. In this embodiment, the height H of the expansion region 50 corresponds to the thickness of the substrate 2. The thickness of the substrate 2 is not particularly limited, but is, for example, 0.1 mm or more and 2.5 mm or less. The width of the substrate 2 in the X-axis direction is not particularly limited, but is, for example, 400 mm or more and 1400 mm or less. The width of the substrate 2 in the Y-axis direction is not particularly limited, but is, for example, 300 mm or more and 1300 mm or less.

[0034] The width W of the expansion region 50 in a direction parallel to the stage 10 (X-axis direction) corresponds to the distance along the X-axis from the fixed end 21a to the substrate placement region 11 (or the outer edge of the substrate 2). The ratio W / H of the width W of the expansion region 50 in a direction parallel to the stage 10 (X-axis direction) to the height H of the expansion region 50 in a direction perpendicular to the stage 10 (Z-axis direction) is 43.3 or greater. Therefore, the outer expansion portion 24 can expand laterally and downward within the expansion region 50 so that the ratio W / H of the width W to the height H of the expansion region 50 is 43.3 or greater. As described above, in this embodiment, the lateral and downward expansion widths of the outer expansion portion 24 are limited to the above numerical range so that the outer expansion portion 24 does not expand excessively downward relative to the fixed end 21a and the substrate placement region 11. The ratio W / H of the width W to the height H of the expansion region 50 is not particularly limited, but may be, for example, 43.3 or greater and 110 or less. In FIG. 2A, due to space limitations, the ratio W / H of the width W to the height H of the expansion region 50 is shown smaller than the above-mentioned range of values.

[0035] In this embodiment, although not particularly limited, the height H of the expansion region 50 is 2.5 mm or less, and the ratio W / H of the width W to the height H of the expansion region 50 is 43.3 or more. However, if the height H of the expansion region 50 is 2.5 mm or less, the ratio W / H of the width W to the height H of the expansion region 50 does not necessarily have to be 43.3 or more. Also, if the ratio W / H of the width W to the height H of the expansion region 50 is 43.3 or more, the height H of the expansion region 50 does not necessarily have to be 2.5 mm or less.

[0036] Next, a method for pressurizing the substrate 2 by the pressure device 1 will be described with reference to Figures 3A to 3C. As shown in Figure 3A, the substrate 2 on which a workpiece is mounted is placed in the substrate placement area 11 of the stage 10. In this embodiment, the substrate 2 is directly placed in the substrate placement area 11 on the upper surface of the stage 10. The substrate 2 may also be indirectly placed in the substrate placement area 11 on the upper surface of the stage 10, for example, via a support member for placing the substrate 2.

[0037] 3B, when the stage 10 moves upward, the inner inflatable portion 23 of the balloon 20 comes into contact with the upper surface of the substrate 2 (or the workpiece on the substrate 2). However, the inner inflatable portion 23 may also come into contact with the substrate 2 when the head 30 moves downward.

[0038] As shown in FIG. 3C , with the inner inflation portion 23 in contact with the substrate 2, gas is supplied to the space 35 through the gas supply pipe 33. This causes the inflation portion 22 of the balloon 20 to inflate. More specifically, the inner inflation portion 23 inflates toward the substrate 2 inside the substrate placement area 11. Furthermore, the outer inflation portion 24 inflates toward the upper surface of the stage 10 inside the inflation area 50 outside the substrate placement area 11. When the outer inflation portion 24 inflates, the substrate 2 is sandwiched on both sides in the X-axis direction by the outer inflation portions 24 located outside the substrate placement area 11.

[0039] At least a portion of the expanded outer expansion portion 24 is disposed along the upper surface of the stage 10 and abuts against the upper surface of the stage 10. Furthermore, with the outer expansion portion 24 expanded inside the expansion region 50, the expanded inner expansion portion 23 presses the substrate 2 and presses the workpiece against the substrate 2. As a result, the workpiece is bonded to the substrate 2.

[0040] As shown in FIGS. 2A and 2B , in the pressurizing device 1 of this embodiment, the expansion section 22 has an inner expansion section 23 that expands toward the substrate 2 inside the substrate placement area 11 and an outer expansion section 24 that expands toward the stage 10 outside the substrate placement area 11. In a cross section perpendicular to the stage 10, an expansion region 50 is formed between the fixed end 21 a and the substrate placement area 11, extending downward from a position corresponding to the upper surface of the substrate 2. The expansion region 50 allows the outer expansion section 24 to expand downward from the position corresponding to the upper surface of the substrate 2. Therefore, the balloon 20 pressurizes the substrate 2 via the inner expansion section 23 above the substrate placement area 11. Additionally, the balloon 20 pressurizes the stage 10 directly or indirectly (directly in this embodiment) via the outer expansion section 24 in the expansion region 50. In particular, in the pressurizing device 1 of this embodiment, the height H of the expansion region 50 in the direction perpendicular to the stage 10 is 2.5 mm or less. Therefore, when the stage 10 is directly or indirectly pressurized in the expansion region 50, the outer expansion section 24 expands by 2.5 mm or less in a direction perpendicular to the stage 10. In this way, it has been discovered that by setting the expansion width of the outer expansion section 24 to 2.5 mm or less, shear stress is less likely to act on the substrate 2 via the inner expansion section 23. This solves the problem of the workpiece being misaligned in a direction parallel to the substrate 2 due to shear stress.

[0041] Furthermore, in the pressurizing device 1 of this embodiment, the ratio of the width W of the expansion region 50 in the direction parallel to the stage 10 to the height H of the expansion region 50 in the direction perpendicular to the stage 10 is 43.3 or more. Therefore, when the expansion region 50 directly or indirectly pressurizes the stage 10, the outer expansion section 24 expands in directions parallel and perpendicular to the stage 10 by the above ratio or more. Thus, it has been found that even when the ratio of the expansion width of the outer expansion section 24 in the direction parallel to the stage 10 to the expansion width of the outer expansion section 24 in the direction perpendicular to the stage 10 is 43.3 or more, shear stress is less likely to act on the substrate 2 via the inner expansion section 23. This solves the problem of the workpiece being misaligned in the direction parallel to the substrate 2 due to shear stress.

[0042] Furthermore, in the pressurization method of this embodiment, the balloon 20 expands toward the substrate 2 inside the substrate placement area 11, and also expands toward the stage 10 outside the substrate placement area 11. It has been discovered that by expanding the balloon 20 toward the stage 10 outside the substrate placement area 11, shear stress is less likely to act on the substrate 2 via the portion of the balloon 20 that abuts against the substrate placement area 11 (inner expansion portion 23). This solves the problem of the workpiece being misaligned in a direction parallel to the substrate 2 due to shear stress.

[0043] (Second embodiment) The pressure applying device 1A of the second embodiment shown in Fig. 4 has the same configuration as the pressure applying device 1 of the first embodiment, except for the following points. The same reference numerals are used to designate parts that overlap with the pressure applying device 1 of the first embodiment, and detailed descriptions thereof will be omitted.

[0044] The pressure device 1A differs from the pressure device 1 of the first embodiment in that it further includes a support member 60 for placing the substrate 2. The support member 60 is placed in the substrate placement area 11. The support member 60 is made up of a plate-shaped member (base).

[0045] The support member 60 is placed directly on the upper surface of the stage 10 so as to be in contact with the upper surface of the stage 10. Therefore, the substrate placement area 11 corresponds to the contact surface between the support member 60 and the stage 10, and the area of ​​the substrate placement area 11 is equal to the area of ​​the support member 60 in a planar view. In a planar view, the area of ​​the support member 60 is larger than the area of ​​the substrate 2, but may be equal to the area of ​​the substrate 2. The upper surface of the support member 60 is a flat surface parallel to the upper surface of the stage 10.

[0046] The material constituting the support member 60 is not particularly limited, but examples thereof include metals such as aluminum, copper, and stainless steel, ceramics such as silicon carbide, silicon nitride, aluminum nitride, and aluminum oxide, glass, and resin. The support member 60 is preferably made of a material that is less likely to deform when pressurized.

[0047] As shown in FIG. 5A , the expansion region 50 is formed between the fixed end 21 a and the substrate placement region 11, from a position corresponding to the upper surface of the substrate 2 placed on the support member 60 to the upper surface of the stage 10. In a direction perpendicular to the stage 10 (the Z-axis direction), the height H of the expansion region 50 corresponds to the sum of the thickness of the substrate 2 and the thickness of the support member 60. The thickness of the support member 60 is not particularly limited, but is, for example, 0.1 mm to 5.0 mm. The width of the support member 60 in the X-axis direction is not particularly limited, but is, for example, 500 mm to 1500 mm. The width of the support member 60 in the Y-axis direction is not particularly limited, but is, for example, 400 mm to 1400 mm. The width W of the expansion region 50 in a direction parallel to the stage 10 (the X-axis direction) corresponds to the distance along the X-axis from the fixed end 21 a to the outer edge of the support member 60.

[0048] In this embodiment, the height H of the expansion region 50 in the direction perpendicular to the stage 10 (Z-axis direction) is also 2.5 mm or less. Furthermore, the ratio W / H of the width W of the expansion region 50 in the direction parallel to the stage 10 (X-axis direction) to the height H of the expansion region 50 in the direction perpendicular to the stage 10 (Z-axis direction) is 43.3 or greater. Therefore, as shown in FIG. 5B , the outer expansion portion 24 expands downward within the expansion region 50 by a maximum of 2.5 mm or less, which corresponds to the height H of the expansion region 50 (the sum of the height of the substrate 2 and the height of the support member 60). Furthermore, the outer expansion portion 24 can expand sideways and downward within the expansion region 50 so that the ratio W / H of the width W to the height H of the expansion region 50 is 43.3 or greater.

[0049] As shown in FIGS. 5A and 5B, the pressurizing device 1A is disposed in the substrate placement area 11 and further includes a support member 60 for placing the substrate 2 thereon. The expansion region 50 is formed from a position corresponding to the upper surface of the substrate 2 placed on the support member 60 to the upper surface of the stage 10. By placing the substrate 2 on the support member 60, the height H of the expansion region 50 can be adjusted according to the height of the support member 60. By optimizing the height H of the expansion region 50, the shear stress acting on the substrate 2 can be minimized.

[0050] (Third embodiment) The pressure applying device 1B of the second embodiment shown in Fig. 6 has the same configuration as the pressure applying device 1A of the second embodiment, except for the following points. The same reference numerals are used to designate parts that overlap with the pressure applying device 1A of the second embodiment, and detailed descriptions thereof will be omitted.

[0051] The pressure device 1B differs from the pressure device 1A of the second embodiment in that it further includes a plate-shaped member 70 arranged outside the substrate placement area 11. The plate-shaped member 70 is a frame that surrounds the substrate placement area 11. As shown in FIG. 7, the outer and inner peripheries of the plate-shaped member 70 are rectangular, but the outer and / or inner peripheries of the plate-shaped member 70 may be elliptical, circular, square, other polygonal, or other shapes. The plate-shaped member 70 may be formed by combining multiple plate pieces (for example, plate pieces that are rectangular in plan view).

[0052] As shown in FIG. 8A, the width Wf of the plate-shaped member 70 in the X-axis direction is smaller than the distance along the X-axis from the fixed end 21a to the outer edge of the support member 60 (the width W of the expansion region 50 in the X-axis direction), but it may be equal to this. The plate-shaped member 70 is disposed directly on the upper surface of the stage 10 so as to be in contact with the upper surface of the stage 10. However, another plate-shaped member may be disposed between the plate-shaped member 70 and the upper surface of the stage 10. The plate-shaped member 70 may also be configured as a part of the stage 10; for example, the plate-shaped member 70 may be configured as a convex portion formed on the surface of the stage 10. The upper surface of the plate-shaped member 70 is a flat surface parallel to the upper surface of the stage 10.

[0053] As shown in Figure 7, a gap 80 is formed between the plate-like member 70 and the substrate placement area 11. The width of the gap 80 is not particularly limited, but is, for example, 1 mm or more and 10 mm or less. In this embodiment, the outer periphery of the substrate placement area 11 corresponds to the outer periphery of the support member 60. In Figure 7, reference numeral 3 denotes a workpiece placed on the substrate 2.

[0054] The material constituting the plate-like member 70 is not particularly limited, but examples thereof include metals such as aluminum, copper, and stainless steel, ceramics such as silicon carbide, silicon nitride, aluminum nitride, and aluminum oxide, glass, and resin. The plate-like member 70 is preferably made of a material that is only slightly deformed by pressure.

[0055] As shown in FIG. 8A , the expansion region 50 is formed between the fixed end 21 a and the substrate placement region 11, from a position corresponding to the upper surface of the substrate 2 placed on the support member 60 to the upper surface of the plate-shaped member 70. In a direction perpendicular to the stage 10 (Z-axis direction), the height H of the expansion region 50 corresponds to the value obtained by subtracting the thickness of the plate-shaped member 70 from the sum of the thicknesses of the substrate 2 and the support member 60. The thickness of the plate-shaped member 70 is not particularly limited, but is, for example, 0.1 mm or more and 6.0 mm or less. In this embodiment, the thickness of the plate-shaped member 70 is thinner than the sum of the thicknesses of the substrate 2 and the support member 60. The width W of the expansion region 50 in a direction parallel to the stage 10 (X-axis direction) corresponds to the distance along the X-axis from the fixed end 21 a to the outer edge of the support member 60.

[0056] In this embodiment, the height H of the expansion region 50 in the direction perpendicular to the stage 10 (Z-axis direction) is also 2.5 mm or less. Furthermore, the ratio W / H of the width W of the expansion region 50 in the direction parallel to the stage 10 (X-axis direction) to the height H of the expansion region 50 in the direction perpendicular to the stage 10 (Z-axis direction) is 43.3 or greater. Therefore, as shown in FIG. 8B , the outer expansion portion 24 expands downward within the expansion region 50 by a maximum of 2.5 mm or less, which corresponds to the height of the expansion region 50 (the sum of the height of the substrate 2 and the height of the support member 60 minus the thickness of the plate-like member 70). Furthermore, the outer expansion portion 24 can expand sideways and downward within the expansion region 50 so that the ratio W / H of the width W to the height H of the expansion region 50 is 43.3 or greater.

[0057] At least a portion of the outer inflatable portion 24 is disposed along the upper surface of the plate-shaped member 70 and abuts against the upper surface of the plate-shaped member 70. At least a portion of the plate-shaped member 70 is pressurized by the outer inflatable portion 24. For example, the outer inflatable portion 24 may abut against an area (in cross-sectional view) of 30% or more, 50% or more, 70% or more, or 90% or more of the upper surface of the plate-shaped member 70 between the fixed end portion 21a and the board placement area 11.

[0058] As shown in FIGS. 8A and 8B , the pressure device 1B is disposed in the substrate placement area 11 and includes a support member 60 for placing the substrate 2 thereon, and a plate-like member 70 disposed outside the substrate placement area 11 so as to be pressurized by the outer expansion section 24. The expansion region 50 is formed from a position corresponding to the upper surface of the substrate 2 placed on the support member 60 to the upper surface of the plate-like member 70. By placing the substrate 2 on the support member 60, the height of the expansion region 50 can be adjusted according to the height of the support member 60. Furthermore, by placing the plate-like member 70 outside the substrate placement area 11, the height of the expansion region 50 can be adjusted according to the height of the plate-like member 70. Optimizing the height of the expansion region 50 can minimize the shear stress acting on the substrate 2.

[0059] 9A and 9B are cross-sectional views showing the results of a simulation of the distribution of stress occurring in the balloon 20. In the simulation shown in FIG. 9A, a plate-like member 70 having a thickness of 2.0 mm is placed on the upper surface of the stage 10 (not shown) outside the substrate placement area 11. In the simulation shown in FIG. 9B, a plate-like member 70 having a thickness of 2.5 mm is placed on the upper surface of the stage 10 (not shown) outside the substrate placement area 11. In the simulation shown in FIG. 9A, the height H (FIG. 8A) of the expansion region 50 is 1.7 mm, whereas in the simulation shown in FIG. 9B, the height H of the expansion region 50 is 1.2 mm. In FIGS. 9A and 9B, the magnitude of the stress occurring in the balloon 20 is represented by the spacing between the hatched lines. The narrower the spacing between the hatched lines, the greater the stress occurring in the balloon 20, and the wider the spacing between the hatched lines, the smaller the stress occurring in the balloon 20.

[0060] 9A and 9B, a relatively large stress is generated in the outer expansion portion 24, while a relatively small stress is generated in the inner expansion portion 23. Therefore, shear stress is less likely to act on the substrate 2 via the inner expansion portion 23, preventing the workpiece from being displaced in a direction parallel to the substrate 2. In addition, by using the plate-like member 70 to lower the height H of the expansion region 50, the shear stress acting on the substrate 2 can be further reduced.

[0061] 7, the plate-like member 70 is a frame that surrounds the substrate placement area 11. Therefore, the plate-like member 70 can be placed in all directions outside the substrate placement area 11. This makes it possible to adjust the height of the expansion area 50 in all directions outside the substrate placement area 11.

[0062] Furthermore, a gap 80 is formed between the plate-shaped member 70 and the substrate placement area 11. Therefore, when the substrate 2 is placed directly or indirectly in the substrate placement area 11 of the stage 10, the substrate 2 is less likely to come into contact with the plate-shaped member 70 (particularly the inner periphery of the plate-shaped member 70).

[0063] (Fourth embodiment) 10 has the same configuration as the pressurizing device 1B of the third embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the pressurizing device 1B of the third embodiment, and detailed descriptions thereof will be omitted.

[0064] The pressure device 1C differs from the pressure device 1B of the third embodiment in that the substrate 2 is placed directly on the upper surface of the stage 10. As shown in Fig. 11, the width Wf of the plate-like member 70 in the X-axis direction is smaller than the distance along the X-axis from the fixed end 21a to the outer edge of the substrate 2 (the width W of the expansion region 50 in the X-axis direction), but may be equal to this. The thickness of the plate-like member 70 in this embodiment is thinner than the thickness of the substrate 2.

[0065] The expansion region 50 is formed between the fixed end 21a and the substrate placement region 11, from a position corresponding to the upper surface of the substrate 2 placed on the stage 10 to the upper surface of the plate-like member 70. In a direction perpendicular to the stage 10 (Z-axis direction), the height H of the expansion region 50 corresponds to the value obtained by subtracting the thickness of the plate-like member 70 from the thickness of the substrate 2. The width W of the expansion region 50 in a direction parallel to the stage 10 (X-axis direction) corresponds to the distance along the X-axis from the fixed end 21a to the outer edge of the substrate 2.

[0066] In this embodiment, too, the height H of the expansion region 50 in the direction perpendicular to the stage 10 (Z-axis direction) is 2.5 mm or less. The ratio W / H of the width W of the expansion region 50 in the direction parallel to the stage 10 (X-axis direction) to the height H of the expansion region 50 in the direction perpendicular to the stage 10 (Z-axis direction) is 43.3 or greater. Therefore, as shown in FIG. 11B , the outer expansion portion 24 expands downward within the expansion region 50 by a maximum of 2.5 mm or less, which corresponds to the height of the expansion region 50 (the height of the substrate 2 minus the thickness of the plate-like member 70). The outer expansion portion 24 can expand laterally and downward within the expansion region 50 so that the ratio W / H of the width W to the height H of the expansion region 50 is 43.3 or greater.

[0067] 11A and 11B, the pressurizing device 1C has a plate-like member 70 arranged outside the substrate placement area 11 so as to be pressurized by the outer expansion section 24. The expansion area 50 is formed from a position corresponding to the upper surface of the substrate 2 to the upper surface of the plate-like member 70. By arranging the plate-like member 70 outside the substrate placement area 11, the height of the expansion area 50 can be adjusted according to the height of the plate-like member 70. By optimizing the height of the expansion area 50, the shear stress acting on the substrate 2 can be minimized.

[0068] The present disclosure is not limited to the above-described embodiments and can be modified in various ways within the scope of the present disclosure. For example, in the above-described embodiments, the height H of the expansion region 50 is 2.5 mm or less, and the ratio W / H of the width W to the height H of the expansion region 50 is 43.3 or more. However, the height H of the expansion region 50 may be 2.5 mm or less, or the ratio W / H of the width W to the height H of the expansion region 50 may be 43.3 or more.

[0069] In the third and fourth embodiments, the gap 80 shown in Fig. 7 is not essential and may be omitted. That is, the plate-like member 70 shown in Fig. 6 may be in contact with the outer edge of the support member 60. Moreover, the plate-like member 70 shown in Fig. 10 may be in contact with the outer edge of the substrate 2. [Example]

[0070] The present disclosure will be described below based on more detailed examples, but the present disclosure is not limited to these examples.

[0071] Example A1 A pressurizing device 1A of the second embodiment shown in Fig. 4 was prepared. A support member 60 was placed in the substrate placement area 11 of the stage 10, and a substrate 2 having a plurality of workpieces placed thereon was placed on the support member 60. The inner expansion portion 23 of the balloon 20 was brought into contact with the substrate 2, and gas was supplied to the space 35 through the gas supply pipe 33 to expand the balloon 20 (expansion portion 22). Then, the balloon 20 (inner expansion portion 23) pressurized the substrate 2 placed on the support member 60.

[0072] The height H of the expansion region 50 was set to 1.0 mm by adjusting the thickness of the support member 60 shown in FIG. 5A. Then, the magnitude of the shear stress that the substrate 2 received from the balloon 20 (inner expansion portion 23) was measured. The rate of occurrence of misalignment of the workpiece relative to the substrate 2 due to shear stress was calculated, and the rate of occurrence of misalignment was evaluated based on the calculated value. A rate of misalignment of 0% was marked as ◯, and a rate of misalignment greater than 0% was marked as ×. The results are shown in Table 1.

[0073] Example A2 The same evaluation as in Example A1 was carried out, except that the height H of the expansion region 50 was changed to 1.5 mm. The results are shown in Table 1.

[0074] Example A3 The same evaluation as in Example A1 was carried out, except that the height H of the expansion region 50 was changed to 2.0 mm. The results are shown in Table 1.

[0075] Example A4 The same evaluation as in Example A1 was carried out, except that the height H of the expansion region 50 was changed to 2.5 mm. The results are shown in Table 1.

[0076] Comparative Example A1 The same evaluation as in Example A1 was carried out, except that the height H of the expansion region 50 was changed to 3.0 mm. The results are shown in Table 1.

[0077] Comparative example A2 The same evaluation as in Example A1 was carried out, except that the height H of the expansion region 50 was changed to 3.5 mm. The results are shown in Table 1.

[0078] Comparative example A3 The same evaluation as in Example A1 was carried out, except that the height H of the expansion region 50 was changed to 3.7 mm. The results are shown in Table 1.

[0079] Example B1 The same evaluation as in Example A1 was performed, except that the ratio W / H of the width W to the height H of the expandable region 50 was set to 43.3 by adjusting the thickness and width of the support member 60 shown in Figure 5A. The results are shown in Table 2.

[0080] Example B2 The same evaluation as in Example B1 was carried out, except that the ratio W / H of the width W to the height H of the expandable region 50 was set to 55. The results are shown in Table 2.

[0081] Example B3 The same evaluation as in Example B1 was carried out, except that the ratio W / H of the width W to the height H of the expandable region 50 was set to 65. The results are shown in Table 2.

[0082] Example B4 The same evaluation as in Example B1 was carried out, except that the ratio W / H of the width W to the height H of the expandable region 50 was set to 73.3. The results are shown in Table 2.

[0083] Example B4 The same evaluation as in Example B1 was carried out, except that the ratio W / H of the width W to the height H of the expandable region 50 was set to 86.7. The results are shown in Table 2.

[0084] Example B4 The same evaluation as in Example B1 was carried out, except that the ratio W / H of the width W to the height H of the expandable region 50 was set to 110. The results are shown in Table 2.

[0085] Comparative Example B1 The same evaluation as in Example B1 was carried out, except that the ratio W / H of the width W to the height H of the expandable region 50 was set to 13.5. The results are shown in Table 2.

[0086] Comparative example B2 The same evaluation as in Example B1 was carried out, except that the ratio W / H of the width W to the height H of the expandable region 50 was set to 20. The results are shown in Table 2.

[0087] Comparative Example B3 The same evaluation as in Example B1 was carried out, except that the ratio W / H of the width W to the height H of the expandable region 50 was set to 29.7. The results are shown in Table 2.

[0088] Comparative example B4 The same evaluation as in Example B1 was carried out, except that the ratio W / H of the width W to the height H of the expandable region 50 was set to 35.1. The results are shown in Table 2.

[0089] [Table 1]

[0090] [Table 2]

[0091] As shown in Tables 1 and 2, it was confirmed that in Examples A1 to A4 and B1 to B6, the incidence of workpiece misalignment with respect to the substrate 2 was 0%. This revealed that by setting the height H of the expansion region 50 to 2.5 mm or less, as in Examples A1 to A4, it was possible to prevent the problem of the workpiece being misaligned with respect to the substrate 2 due to the influence of shear stress. It was also revealed that when the ratio W / H of the width W to the height H of the expansion region 50 was set to 43.3 or more, as in Examples B1 to B6, it was possible to prevent the problem of the workpiece being misaligned with respect to the substrate 2 due to the influence of shear stress. [Explanation of symbols]

[0092] 1, 1A to 1C...Pressure device 2...Substrate 10...Stage 11...Board placement area 20...Balloon 21a, 21b…Fixed end 22...Expansion section 23...Inner expansion section 24...Outer expansion part 30...head 31...Main body 32...Gas supply hole 33...Gas supply pipe 34...Convex part 35…Space 40...Fixing member 50...Expansion region 60...Support member 70...Plate-shaped member 80...gap

Claims

1. a stage having a substrate placement area for directly or indirectly placing a substrate; a balloon fixed by a fixing member above the stage and pressurizing the substrate; The balloon has a fixed end portion fixed by the fixing member and an inflation portion that inflates inside the fixed end portion, the expansion section has an inner expansion section that expands toward the substrate inside the substrate placement area and an outer expansion section that expands toward the stage outside the substrate placement area, an expansion region is formed between the fixed end portion and the substrate placement region in a cross section perpendicular to the stage, the expansion region being formed downward from a position corresponding to an upper surface of the substrate, and for expanding the outer expansion portion downward from the position corresponding to the upper surface of the substrate; A pressure applying device, wherein the height of the expansion region in a direction perpendicular to the stage is 2.5 mm or less.

2. a stage having a substrate placement area for directly or indirectly placing a substrate; a balloon fixed by a fixing member above the stage and pressurizing the substrate; The balloon has a fixed end portion fixed by the fixing member and an inflation portion that inflates inside the fixed end portion, the expansion section has an inner expansion section that expands toward the substrate inside the substrate placement area and an outer expansion section that expands toward the stage outside the substrate placement area, an expansion region is formed between the fixed end portion and the substrate placement region in a cross section perpendicular to the stage, the expansion region being formed downward from a position corresponding to an upper surface of the substrate, and for expanding the outer expansion portion downward from the position corresponding to the upper surface of the substrate; A pressurizing device, wherein the ratio of the width of the expansion region in a direction parallel to the stage to the height of the expansion region in a direction perpendicular to the stage is 43.3 or more.

3. a support member disposed in the substrate placement area for placing the substrate; 3. The pressure device according to claim 1, wherein the expansion region is formed from a position corresponding to the upper surface of the substrate placed on the support member to an upper surface of the stage.

4. a plate-like member disposed outside the board placement area so as to be pressurized by the outer expansion portion; 3. The pressure device according to claim 1, wherein the expansion region is formed from a position corresponding to the upper surface of the substrate to the upper surface of the plate-like member.

5. The pressure device according to claim 4 , wherein the plate-like member is a frame that surrounds the substrate placement area.

6. The pressure device according to claim 4 , wherein a gap is formed between the plate-like member and the substrate placement area.

7. a support member disposed in the substrate placement area for placing the substrate thereon; and a plate-like member disposed outside the substrate placement area so as to be pressurized by the outer expansion portion, 3. The pressure device according to claim 1, wherein the expansion region is formed from a position corresponding to the upper surface of the substrate placed on the support member to the upper surface of the plate-like member.

8. 3. The pressure device according to claim 1, wherein the stage has a heat source for heating the substrate.

9. a step of bringing a balloon for pressurizing a substrate placed directly or indirectly in a substrate placement area of ​​a stage into contact with the substrate; and inflating the balloon while the balloon is in contact with the substrate, A pressurizing method in which the balloon is inflated toward the substrate inside the substrate placement area and toward the stage outside the substrate placement area.

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