Substrate transfer device and substrate transfer method

Abstract

To easily grasp and utilize a positional relationship in plan view between a carrier for carrying a substrate and a module.SOLUTION: A substrate transfer method for transferring a substrate using a first transport body and a second transport body that float from the bottom of a substrate transfer area by magnetic force and move laterally while supporting the substrate includes a transport step of transporting the substrate to a predetermined first reference position for the substrate in the module by the first transport body, a receiving step of receiving the substrate at the first reference position for the substrate by the second transport body, and a detection step of moving the second transport body to the predetermined first reference position for the transport body to transport the substrate to a detection unit, and detecting a positional deviation in plan view between the position of the substrate and the predetermined second reference position for the substrate in the detection unit.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present disclosure relates to a substrate transport apparatus and a substrate transport method. [Background technology]

[0002] In the manufacturing process of semiconductor devices, semiconductor wafers (hereinafter referred to as wafers), which serve as substrates, are transported and processed within the equipment. Patent Document 1 shows that this wafer transportation is performed using a transport mechanism that magnetically levitates from the bottom of the equipment. Patent Document 2 also shows that the storage state of the wheels that move the wafer stage installed in the exposure equipment on the floor is controlled by a remote control device (teaching pendant). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-86987 [Patent Document 2] Japanese Patent Application Publication No. 2018-146983 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique for easily grasping and utilizing the positional relationship in a plan view between a transport body that transports a substrate and a module. [Means for solving the problem]

[0005] A substrate transport method according to the present disclosure transports a substrate using a first transport body and a second transport body that are each levitated by magnetic force from the bottom of a substrate transport area and move laterally while supporting the substrate, the method comprising: a transport step of transporting the substrate to a predetermined first reference position for the substrate in the module by the first transport body; a receiving step of receiving the substrate at a first reference position for the substrate by the second transport body; a detection step of moving the second transport body to a predetermined first reference position for the transport body to transport the substrate to a detection unit, and detecting a positional deviation between the position of the substrate and a predetermined second reference position for the substrate in the detection unit; Equipped with. [Effects of the Invention]

[0006] According to the present disclosure, the positional relationship between the transport body that transports the substrate and the module in a plan view can be easily understood and utilized. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a plan view of a substrate processing apparatus to which a substrate transfer device according to an embodiment of the present disclosure is applied; [Figure 2] FIG. 2 is a vertical sectional side view of the substrate processing apparatus. [Figure 3] 2 is a perspective view of a transport body and a bottom of a housing provided in the substrate processing apparatus; FIG. [Figure 4] 3A and 3B are plan views showing the transport body, a substrate, and a stage on which the substrate is placed. [Figure 5] 10 is a flowchart showing each step of completing teaching of the transport body to the processing module 5. FIG. [Figure 6] 10 is an explanatory diagram showing the acquisition of position data for the first reference position for the second transfer body 42 of the load lock module 3A in step S1. FIG. [Figure 7] 10 is an explanatory view showing the transfer of the wafer W to the first reference position for substrates in the processing module 5 by the transfer body 41, which is the first transfer body, in step S2. FIG. [Figure 8] 10 is an explanatory view showing the transfer of the wafer W from the processing module 5 by the transfer body 42 in step S3. FIG. [Figure 9]10 is an explanatory diagram showing the movement of the transfer body 42 to the first reference position for the transfer body, the detection of the amount of deviation between the wafer W and the second reference position for the substrate, and teaching in step S4. FIG. [Figure 10] FIG. 10 is a plan view of the substrate processing apparatus for explaining teaching of the transport body. [Figure 11] FIG. 10 is a plan view of the conveyance body for explaining position correction of the conveyance body performed by teaching. [Figure 12] FIG. 10 is a plan view for explaining a modified example of the teaching. DETAILED DESCRIPTION OF THE INVENTION

[0008] A substrate processing apparatus 1 including a substrate transfer apparatus according to one embodiment of the present disclosure is shown in Figure 1. The substrate processing apparatus 1 is installed in an atmospheric environment and includes a loader module 2, an alignment module 20, load lock modules 3A and 3B, a vacuum transfer module 4, and six processing modules 5. Each processing module 5 processes a wafer W, which is a circular substrate, in a vacuum environment.

[0009] The loader module 2 is a module called an EFEM (Equipment Front End Module), and it loads and unloads wafers W into and from a transfer container C called a FOUP (Front Open Unified Pod) that stores the wafers W. The wafers W unloaded from the transfer container C are taken into the substrate processing apparatus 1. The loader module 2 is long horizontally, and its interior is an atmospheric and normal pressure atmosphere. In the following description, the length direction of the loader module 2 is referred to as the X direction, and the direction perpendicular to the X direction is referred to as the Y direction. These X and Y directions are both horizontal directions. One side and the other side of the X direction will be referred to as the +X side and the -X side, respectively, and one side and the other side of the Y direction will be referred to as the +Y side and the -Y side, respectively.

[0010] On the -Y side of the loader module 2, for example, three container mounting sections 21 for mounting a transfer container C are provided lined up in the X direction. A transfer mechanism 22 is provided within the loader module 2. The transfer mechanism 22 is not configured to be magnetically levitated like the transfer bodies 41 and 42 described below. The transfer mechanism 22 is configured, for example, with a multi-joint arm that is movable up and down and in the X direction, and includes an end effector 23 that supports the backside of the wafer W. The transfer mechanism 22 transfers the wafer W between the transfer container C on the container mounting sections 21, the load lock modules 3A and 3B, and the alignment module 20.

[0011] An alignment module 20 is connected to the loader module 2 on the -X side. This alignment module 20 optically detects the orientation and center position of the wafer W. When the transfer mechanism 22 receives the wafer W from the alignment module 20, the operation of the transfer mechanism 22 is controlled by the control unit 10 (described later) so that the wafer W is oriented in a predetermined direction and the center position of the wafer W is located at a predetermined position on the end effector 23.

[0012] Load lock modules 3A and 3B are provided on the +Y side of the loader module 2, and the load lock modules 3A and 3B are spaced apart from each other in the X direction. The load lock module 3A, which is configured as a detection unit, will be described with reference to the longitudinal side view of FIG. 2. The load lock module 3A includes a housing 30. A gas supply mechanism and an exhaust mechanism are provided to enable supply of N2 (nitrogen) gas to and exhaust of the housing 30, and the interior of the housing 30 can be switched between a normal pressure N2 gas atmosphere and a vacuum atmosphere.

[0013] A stage 31 having a circular shape in a plan view is provided within the housing 30, and the wafer W is placed horizontally on the upper surface of the stage 31. The stage 31 is provided with three lift pins 32 that can be raised and lowered vertically to protrude into and retract from the upper surface of the stage 31. The wafer W can be transferred between the stage 31, the transfer mechanism 22, and later-described transfer bodies 41 and 42 provided in the vacuum transfer module 4 via the lift pins 32.

[0014] A camera 33 is provided on the ceiling of the housing 30 above the stage 31. The field of view of the camera 33 is directed downward, and it can acquire planar image data of the supports 47 of the transport bodies 41 and 42 (described below) moving on the stage 31, and of the wafer W supported by the supports 47. This image data is sent to the control unit 10 and used for teaching the transport bodies 41 and 42, as will be described in detail later. The load lock module 3B is configured in the same manner as the load lock module 3A, except that it does not have this camera 33. A door valve G1 is interposed between each housing 30 of the load lock modules 3A and 3B and the loader module 2, making it possible to separate the atmosphere inside the loader module 2 from the atmosphere inside the housing 30.

[0015] A vacuum transfer module 4 is connected to the load lock modules 3A and 3B on the +Y side. The vacuum transfer module 4 is equipped with a housing 40. The interior of the housing 40 is a substrate transfer area, and is evacuated by an exhaust mechanism (not shown) to create a vacuum atmosphere. Inside the housing 40, transfer bodies 41 and 42 for transferring wafers W are provided, which will be described in detail later. A gate valve G2 is interposed between each housing 30 of the load lock modules 3A and 3B and the housing 40 of the vacuum transfer module 4, making it possible to separate the atmosphere inside the housing 30 from the atmosphere inside the housing 40.

[0016] The six processing modules 5 will now be described. Each processing module 5 includes a processing vessel 50, and the interior of the processing vessel 50 is evacuated to a vacuum atmosphere by an exhaust mechanism (not shown). A stage 31 is provided within the processing vessel 50, similar to the load lock modules 3A and 3B, and is equipped with lift pins 32 on which the wafer W is placed. Note that the stage 31 in each processing module 5 includes a flow path through which a fluid whose temperature is adjusted by, for example, a chiller unit flows, and a heater as a temperature adjustment unit, in order to adjust the temperature of the placed wafer W to a desired temperature for processing.

[0017] The processing chamber 50 is also provided with a gas supply unit (not shown), such as a gas shower head, through which a processing gas is supplied into the processing chamber 50, which is maintained in a vacuum atmosphere. The wafer W, which is placed on the stage 31 and has been temperature-adjusted, is exposed to the processing gas, thereby undergoing a process corresponding to the processing gas. Examples of such processes include etching, film formation, and annealing. A plasma generation mechanism may be provided so that the processing gas is converted into plasma for processing.

[0018] In this example, three processing modules 5 are connected to the -X side and three to the +X side of the vacuum transfer module 4. The three processing modules 5 on the -X side and the three processing modules 5 on the +X side are arranged side by side in the Y direction. A gate valve G3 is interposed between the processing chamber 50 of each processing module 5 and the housing 40 of the vacuum transfer module 4, making it possible to separate the atmosphere inside the housing 40 from the atmosphere inside the processing chamber 50.

[0019] The door valve G1 and gate valves G2 and G3 described above are closed during operation of the substrate processing apparatus 1, except when necessary to transfer wafers W between modules and when necessary for transfer bodies 41 and 42 to access the modules for the purpose of teaching, which will be described later, to separate the atmospheres between the modules. Therefore, the pressure change within the housing 30 of the load lock modules 3A and 3B is performed with the door valve G1 and gate valve G2 closed. Processing in each processing module 5 is performed with the gate valve G3 closed, separating the interior of the processing vessel 50 from the vacuum transfer module 4.

[0020] Furthermore, the load lock modules 3A and 3B, the vacuum transfer module 4, and the six processing modules 5, which can form a vacuum atmosphere inside by exhaust, are configured so that the exhaust can be performed independently of each other. By exhausting each module in this manner, the inside of the processing vessel 50 of the processing module 5 is in a vacuum atmosphere and the inside of the housing 40 of the vacuum transfer module 4 is in an air atmosphere, and the operation described below can be performed.

[0021] Next, the vacuum transfer module 4 will be described in more detail with reference to the perspective view of FIG. 3. A first transfer body, transfer body 41, and a second transfer body, transfer body 42, provided within a housing 40 that defines a substrate transfer area, move laterally while floating above a floor 49 (i.e., the bottom of the substrate transfer area) within the housing 40 due to magnetic force, thereby transferring wafers W. This floating movement prevents dust generation, keeping the interior of the vacuum transfer module 4 and the processing module 5 clean and suppressing processing abnormalities due to the adhesion of foreign matter to the wafers W. As shown schematically in FIG. 3, multiple coils 43 are embedded in the floor 49, distributed laterally. Each coil 43 is individually supplied with power from a power supply unit 44, and the coils 43 generate a magnetic field around them with a strength corresponding to the supplied power. In other words, each coil 43 acts as an electromagnet.

[0022] The movement of the carriers 41 and 42 using the magnetic field is controlled individually. The carriers 41 and 42 have the same configuration, and the carrier 41 shown in FIG. 3 will be described as a representative example. The carrier 41 has a moving body 46 that includes a magnet 45, such as a permanent magnet, inside. This magnet 45 and an energized coil 43 repel each other due to magnetic force, causing the carrier 41 to levitate from the floor 49. By controlling the magnetic field on the floor 49 by switching the coil 43 to which power is supplied or adjusting the amount of power supplied, the carrier 41 can move in the X and Y directions, change its orientation, remain stationary, and change its levitation height above the floor 49 while remaining levitated. Note that the term "movement in the X and Y directions" used here means both separate and simultaneous movements in the X and Y directions.

[0023] A support 47 that horizontally supports the wafer W from below is provided on the side of the movable body 46. By the movement of the movable body 46 described above, the support 47 can be positioned above each stage 31 of the load lock modules 3A and 3B and the processing module 5. Therefore, the wafer W can be transferred between the stage 31 and the support 47 using the lift pins 32 of the stage 31. In this example, the support 47 is configured like a two-pronged fork so as not to interfere with the lift pins 32 during this transfer.

[0024] Regarding the transfer path of the wafer W in the substrate processing apparatus 1, the wafer W loaded from the transfer container C into the loader module 2 is transferred in the following order: alignment module 20 → loader module 2 → load lock module 3A → vacuum transfer module 4. After the wafer W is processed in the processing module 5, it is transferred in the following order: vacuum transfer module 4 → load lock module 3B → loader module 2 → transfer container C. Regarding the transfer between the vacuum transfer module 4 and the processing module 5 in more detail, the apparatus may be configured so that the wafer W is transferred to only one of the six processing modules 5 for processing, or so that the wafer W is transferred to multiple of the six processing modules 5 for processing in sequence. Any of the transfer mechanisms 41 and 42 may be used for transfer between the vacuum transfer module 4, the processing module 5, and the load lock modules 3A and 3B.

[0025] In order to transport and process the wafer W in this manner, teaching (operation instruction) is performed for the transport bodies 41, 42. This teaching will be described below. As described above, the wafer W is transferred between the stage 31 of each module accessed by the transport bodies 41, 42 and the supports 47 of the transport bodies 41, 42. More specifically, the wafer W is sent onto the stage 31 by the transport bodies 41, 42 via the lift pins 32, and the wafer W is received from the stage 31 by the transport bodies 41, 42 via the lift pins 32. Generally speaking, teaching the transport bodies 41, 42 is a process of determining the positions of the transport bodies 41, 42 when transferring the wafer W in this manner.

[0026] A more detailed explanation will be given with reference to the plan view of Figure 4. In the figure, the center position of the wafer W is shown as center point O1. A predetermined position on the support 47 of the transfer bodies 41 and 42 is shown as support center point O2. This support center point O2 is a point that overlaps with the center point O1 of the wafer W when the wafer W is properly placed on the support 47 in a plan view. The center of the upper surface of the stage 31 is set as placement center point O3.

[0027] Through teaching, the positions of the transfer bodies 41 and 42 are determined during transfer so that the support center points O2 of the transfer bodies 41 and 42 coincide with the placement center point O3 of the stage 31 in a planar view. By determining the positions in this manner, the wafer W is placed on the stage 31 so that its center point O1 coincides with the placement center point O3 in a planar view, and is received by the support 47 so that its center point O1 coincides with the support center point O2. Therefore, assuming that an XY coordinate system consisting of X and Y axes along the X and Y directions, respectively, is established in the processing module 5 and the vacuum transfer module 4, teaching the transfer bodies 41 and 42 corresponds to determining the coordinate position of the support center points O2 of the transfer bodies 41 and 42 in that XY coordinate system. To ensure that the wafer W is placed so that its center point O1 coincides with the placement center point O3 of the stage 31 of all processing modules 5, thereby enabling appropriate processing, teaching is performed for each module accessed by the transfer bodies 41 and 42.

[0028] As described above, the conveying bodies 41 and 42 are configured similarly to each other. However, there are unavoidable shape errors during manufacturing and differences in the characteristics of the magnets 45 between the conveying bodies 41 and 42. If the same magnetic field is formed below the conveying bodies 41 and 42, even if the shape error is slight, it is conceivable that the positions of the support center points O2 of the conveying bodies 41 and 42 will be misaligned due to differences in the characteristics of the magnets 45. In other words, because the conveying bodies 41 and 42 are configured to be magnetically levitated, it is conceivable that individual differences may easily occur between the conveying bodies 41 and 42, and therefore teaching is performed for each of the conveying bodies 41 and 42.

[0029] 1 and 3, the control unit 10 will now be described. The control unit 10 is configured by a computer and includes a program and a memory 11. The program has a set of steps that output control signals to each part of the substrate processing apparatus 1 to control the operation of each part so that the above-mentioned transfer and processing of the wafer W and the automatic teaching described below can be performed. The program is stored in the control unit 10 in a storage medium such as a hard disk, compact disc, DVD, or memory card.

[0030] Memory 11 stores data (referred to as position data) specifying the position where the transfer is to be performed for each of transfer bodies 41 and 42, for each module accessed by the transfer bodies. That is, when transfer bodies 41 and 42 transfer wafers W to and from a module, the operation of transfer bodies 41 and 42 is controlled so that the transfer bodies 41 and 42 move to a position corresponding to the position data for that module (i.e., the magnetic field on floor 49 is controlled). Therefore, although teaching of transfer bodies 41 and 42 has been described as determining the position for transferring wafers W to and from a module, more specifically, position data in which support center point O2 coincides with placement center point O3 in a plan view is acquired and stored in memory 11. As described with reference to FIG. 3 , the positions of transfer bodies 41 and 42 change due to changes in the magnetic field on floor 49, and the position data includes, for example, data on how much power to supply to which of multiple coils 43.

[0031] In this substrate processing apparatus 1, after an operator has taught one of the transfer bodies 41 and 42, the other transfer body can be taught automatically. Because of this automation, teaching can be performed while the substrate processing apparatus 1 is operating, i.e., while a vacuum atmosphere is maintained inside the housing 40 of the vacuum transfer module 4 and inside the processing vessel 50 of each processing module 5. While automatic teaching can be performed on either of the transfer bodies 41 and 42, the following description will be given assuming that teaching of the transfer body 42 is performed automatically, with reference to the flowchart in FIG. 5 (showing steps S1 to S4 described below) and the plan views in FIGS. 6 to 10. For convenience of explanation, of the three processing modules 5 on the +X side, the module furthest on the +Y side will be referred to as processing module 5A.

[0032] First, for example, the inside of the housing 40 of the vacuum transfer module 4 and the inside of the processing container 50 of each processing module 5 are open to the outside of the apparatus and are in an atmospheric atmosphere, and the substrate processing apparatus 1 is in a non-operating state. In this state, an operator manually teaches the transfer body 41. That is, the above-mentioned position data (second data) for each of the processing modules 5 and the load lock modules 3A and 3B is acquired for the transfer body 41 and stored in the memory 11.

[0033] The operator also teaches the transfer mechanism 22 of the loader module 2 using an arbitrary method so that the wafer W is properly transferred to and from each module and transfer container C accessed by the transfer mechanism 22. Furthermore, temporary position data is stored in the memory 11 of the control unit 10 as position data for each module on the transfer body 42. In other words, the transfer body 42 is set to a state in which it can be moved to a temporary position for transferring the wafer W. In addition, the position of the placement center point O3 of the stage 31 is identified in image data acquired by the camera 33 of the load lock module 3A.

[0034] Next, the housing 40 of the vacuum transfer module 4 and the processing vessels 50 of each processing module 5 are evacuated to create a vacuum atmosphere, and the substrate processing apparatus 1 begins operation. Thereafter, at any timing, the transfer body 42 moves to a temporary position for transferring the wafer W to the load lock module 3A in accordance with the temporary position data stored for the load lock module 3A. As a result, the support 47 of the transfer body 42 is positioned on the stage 31 of the load lock module 3A, and an image is captured by the camera 33 to obtain image data of the support 47 in a planar view.

[0035] The control unit 10 sequentially detects the support 47 in the image data, identifies the support center point O2, and calculates the amount of deviation in the X and Y directions between the support center point O2 and the placement center point O3 of the stage 31. Then, the position data for the load lock module 3A in the memory 11 is updated (i.e., the provisional position data is changed to the correct position data) so that the deviations in the X and Y directions are corrected. That is, the position of the transfer body 42 when transferring the wafer W to the load lock module 3A is corrected so that the support center point O2 and the placement center point O3 overlap in a plan view, completing teaching of the transfer body 42 to the load lock module 3A (FIG. 6, step S1). Note that step S1 corresponds to a first determination step of determining a first reference position for the transfer body. The position where the support center point O2 overlaps the placement center point O3 is the first reference position for the transfer body. The position data updated in step S1 is the first data.

[0036] Next, the wafer W is transferred from the transfer container C to either the load lock module 3A or 3B via the loader module 2. In this example, it is assumed that the wafer W is transferred to the load lock module 3A. As described above, since the transfer mechanism 22 has already been taught, the wafer W is transferred so that its center point O1 coincides with the placement center point O3 of the load lock module 3A. The transfer body 41 receives the transferred wafer W and transfers it to the processing module 5A. Since the transfer body 41 has already been taught, it moves to a position (a second reference position for the transfer body) where the support center point O2 coincides with the placement center point O3 of the processing module 5A in a plan view.

[0037] The lift pins 32 of the stage 31 of the processing module 5A are raised, and the wafer W is supported by the lift pins 32 instead of the transfer body 41 (step S2). As described above, since the transfer body 41 has already been taught, and the transfer body 41 receives the wafer W in the load lock module 3A with its center point O1 overlapping the placement center point O3, the center point O1 of the wafer W supported on the lift pins 32 overlaps the placement center point O3 of the stage 31 in a planar view (FIG. 7). The position of the wafer W at this time is the first reference position for the substrate.

[0038] The transfer body 41 retreats from the processing module 5A, and then, in accordance with the temporary position data stored for the processing module 5A, the transfer body 42 moves to a temporary position for transferring the wafer W to the processing module 5A, and the supports 47 of the transfer body 42 are positioned below the wafer W. Then, the lift pins 32 are lowered, and the wafer W is now supported by the supports 47 instead of the lift pins 32 (FIG. 8, step S3).

[0039] Thereafter, the transfer body 42 supporting the wafer W moves to a position for transferring the wafer W to the load lock module 3A. Specifically, since teaching for the load lock module 3A has been completed in step S1, the transfer body 42 is positioned at a position where the support center point O2 and the placement center point O3 of the stage 31 overlap in a planar view (first reference position for the transfer body) (FIG. 9). Then, an image is captured by the camera 33, and image data of the wafer W supported by the support body 47 in a planar view is acquired.

[0040] The control unit 10 calculates the center point O1 of the wafer W in the image data and calculates the amount of deviation of the center point O1 in the X and Y directions from, for example, the placement center point O3 of the stage 31. If the position of the wafer W where the center point O1 overlaps the placement center point O3 in a plan view is defined as a second reference position for the substrate, then if the transfer body 42 is taught to the processing module 5A, the wafer W will overlap the second reference position. Therefore, calculating the amount of deviation of the center point O1 of the wafer W from the placement center point O3 using this image data is a calculation of the amount of deviation between the wafer W at the predetermined second reference position and the wafer W at its actual position.

[0041] The amount of deviation calculated from the image data in this manner (assumed to be the deviation of the wafer W) corresponds to the amount of deviation of the support center point O2 of the transfer body 42 from the center point O1 of the wafer W in a planar view when step S3 is performed. As described above, in processing module 5A, the center point O1 of the wafer W overlaps with the placement center point O3, and therefore the amount of deviation of the wafer W corresponds to the amount of deviation of the support center point O2 of the transfer body 42 from the placement center point O3 in a planar view. If the amount of deviation between the placement center point O3 and the support center point O2 is assumed to be the deviation of the transfer position, the controller 10 calculates the deviation of the transfer position.

[0042] The calculation of the amount of deviation of this transfer position will be described with reference to a specific example in Fig. 11. Fig. 11 is a plan view showing both the transfer body 42 when receiving the wafer W from the processing module 5A in step S3 and the transfer body 42 when acquiring image data in the load lock module 3A in step S4. As shown in Fig. 11, the amount of deviation of the wafer W obtained from the image data (the amount of deviation of the center point O1 of the wafer W from the placement center point O3 of the load lock module 3A) is assumed to be L1 in the -X direction and L2 in the -Y direction.

[0043] Due to the relative positions of the load lock module 3A and the processing module 5A relative to the vacuum transfer module 4, the orientation of the transfer body 42 differs by 90° between when the wafer W is received and when the image is captured. From this difference in orientation of the transfer body 42 and the amount of deviation of the wafer W obtained from the image data, it is determined that when the wafer W is received from the processing module 5A, the support center point O2 of the transfer body 42 is shifted by L2 in the -X direction and L1 in the +Y direction relative to the placement center point O3 (= center point O1 of the wafer W). The values ​​L2 in the -X direction and L1 in the +Y direction are calculated as the amount of deviation of the transfer position.

[0044] The position data for the processing module 5A is updated so that the deviation of the transfer position is eliminated. That is, based on the deviation of the wafer W, the provisional position data is changed to the regular position data, and teaching for the processing module 5A is completed (step S4). Specifically, for example, if the deviation of the transfer position is L2 in the -X direction and L1 in the +Y direction as shown in Fig. 10, the support center O2 of the transfer body 42 at the time of transfer is shifted by L2 in the +X direction and L1 in the -Y direction, respectively, and the position data is updated so that it overlaps with the placement center O3 of the processing module 5A.

[0045] Thereafter, steps S2 to S4 are performed on the other processing modules 5 and load lock module 3B other than 5A accessed by the transfer body 42, and teaching is performed on the modules sequentially. Note that, depending on the module to be taught, the relationship between the orientation of the transfer body 42 when receiving the wafer W in step S3 and when imaging is performed in step S4 may differ from that of the processing module 5A described in Fig. 11. In that case, the difference in the orientation relationship is taken into account when calculating the amount of deviation of the transfer position in step S4, and teaching is performed.

[0046] When steps S2 to S4 are performed for all modules accessed by the transfer body 42 and the position data is updated, teaching of the transfer body 42 is completed. After this teaching is completed, when the transfer body 42 transfers the wafer W between the modules, the center point O1 of the wafer W coincides with the center point O3 of the placement of each module in a plan view. Figure 10 shows the state in which the wafer W is being transferred to and from the processing module 5A in this manner.

[0047] The above steps S2 and S3 correspond to a transfer step and a receiving step, respectively. The steps up to the calculation of the deviation amount of the transfer position in step S4 correspond to a detection step, and the subsequent updating of the position data corresponds to a correction step. The deviation amount of the wafer W and the deviation amount of the transfer position acquired in step S4 are data indicating the positional relationship in a plan view between the first reference position for the substrate and the second transfer body when the receiving step is performed.

[0048] As described above, teaching is required for each of the transport bodies 41 and 42, but according to the substrate processing apparatus 1, teaching for one of the transport bodies 41 and 42 is performed automatically, so the man-hours and time required for teaching by an operator can be reduced. The configuration of the substrate processing apparatus 1 can be modified as appropriate, and the number of modules connected to the vacuum transport module can be increased or decreased as appropriate. Teaching is performed for each module accessed by the transport bodies 41 and 42, but an operator only needs to manually teach one of the transport bodies 41 and 42, so the burden on the operator can be reduced even if the number of modules is relatively large.

[0049] Although it has been described that the wafer W supported on the lift pins 32 of the module in step S2 is received by the transfer body 42 in step S3 without being placed on the stage 31, the lift pins 32 may be lowered and the wafer W may be temporarily placed on the stage 31. That is, in step S3, the wafer W that has been processed in the processing module 5 may be received by being placed on the stage 31. That is, the wafer W may be processed while steps S1 to S4 are being performed. Furthermore, steps S1 to S4 are not limited to using a wafer W that is a substrate for manufacturing a semiconductor device, and may be performed using a substrate such as a dummy wafer that has the same shape in plan view as the wafer W and is not intended for manufacturing a semiconductor device.

[0050] Furthermore, although the teaching of the processing module 5A is described as being performed in order from step S1 to step S4, the teaching of the transfer body 42 for the load lock module 3A in step S1 may be performed before the transfer body 42 receives the wafer W from the processing module 5A in step S3. Therefore, step S2 may be performed before step S1.

[0051] As described above, it is preferable that all steps S1 to S4 are performed automatically. However, for example, teaching of the transfer body 42 for the load lock module 3A in step S1 may be performed manually by an operator, as with teaching of the transfer body 41, when teaching of the transfer body 41 is performed. Even if step S1 is performed manually in this way, the number of modules to be manually taught increases by only one, and the burden on the operator can be sufficiently reduced.

[0052] Although the teaching performed at the start of operation of the substrate processing apparatus 1 has been described above, similar teaching is also performed during maintenance after the operation of the substrate processing apparatus 1. Hereinafter, the flow of each operation including teaching will be described using an example of this maintenance in which the transport body 42 is replaced while the apparatus is in operation.

[0053] First, with gate valves G2 and G3 closed, evacuation of the housing 40 of the vacuum transfer module 4 is stopped, and the pressure inside the housing 40 is returned to atmospheric pressure from a preset vacuum pressure for transferring wafers W (hereinafter referred to as the transfer vacuum pressure). An operator removes part of the partition wall that constitutes the housing 40 to access the inside of the housing 40 from outside the apparatus and replaces the transfer body 42. Thereafter, the inside of the housing 40 is evacuated and the transfer vacuum pressure is restored. As described above, there are individual differences between transfer bodies, so teaching is required for a newly used transfer body 42. Thereafter, steps S1 to S4 are carried out in the same manner as when the apparatus was started up, and teaching is performed.

[0054] The replacement of the transfer body 42 and the execution of steps S1 to S4 do not result in the process modules 5 being stopped or the processing chamber 50 being exposed to the atmosphere. Therefore, the process modules 5 are operating from the time the transfer vacuum pressure is released until the transfer vacuum pressure is restored. Specifically, the process modules 5 are operating when the temperature of the stage 31 in the processing chamber 50 is maintained at the same temperature as during wafer W processing, and when the processing chamber 50 is maintained at a vacuum pressure. By operating the process modules 5 in this manner and preserving the processing environment for the wafer W in the processing chamber 50, the wafer W can be quickly transferred to the processing module 5 after the vacuum transfer module 4 is restored to the transfer vacuum pressure, and processing can be resumed. Note that when the transfer vacuum pressure is released, if a wafer W is being processed in the processing chamber 50, the processing can be continued, and the processed wafer W can be removed from the processing chamber 50 once the transfer vacuum pressure is restored.

[0055] Because teaching of the transfer body 42 to the process module 5 can be performed without creating an atmospheric atmosphere inside the process vessel 50, it is not necessary to stop the operation of each process module 5 when performing steps S1 to S4 as described above. Therefore, even if the apparatus is configured so that the transfer bodies 41, 42 are replaced relatively frequently, it is possible to prevent a long period of time during which processing cannot be performed in each process module 5. Furthermore, although the number of process modules 5 provided in the substrate processing apparatus 1 can be increased or decreased as appropriate, when the number of process modules 5 is relatively large, being able to operate the process modules 5 without stopping their operation in this way is particularly effective in ensuring the productivity of the apparatus.

[0056] Below, we will describe variations of each of the steps S1 to S4 described above, but unless otherwise specified, the transport body to be taught is assumed to be the transport body 42, as in the above example. We will now describe a variation of step S1 (teaching the transport body 42 to the load lock module 3A) described in FIG. 6. This step S1 is not limited to using the camera 33. A specific example is using a sensor wafer. This sensor wafer is a device that includes a substrate body having a shape similar to that of the wafer W in a plan view, and a camera provided on the substrate body so as to be able to capture an image of the area above. Then, for example, image data acquired by this camera is transmitted to the control unit 10 wirelessly or via a wired connection.

[0057] The transfer mechanism 22 transfers the sensor wafer from the transfer container C to the load lock module 3A and places it on the stage 31 of the load lock module 3A. Note that the transfer mechanism 22 that performs this transfer has already been taught, and a predetermined point (O4) in the image data acquired by the sensor wafer placed on the stage 31 in this way is a position directly above the center point O3 of the stage 31.

[0058] After the sensor wafer is transported to the load lock module 3A in this manner, the transport body 42 is moved to the delivery position using the provisional position data as described in Fig. 6. Then, the sensor wafer captures an image of the support body 47 of the transport body 42, and image data is acquired. The controller 10 detects the deviation between the support center point O2, identified from the position of the support body 47 in this image data, and the above-mentioned point O4, and updates the position data to eliminate this deviation, thereby completing step S1.

[0059] Let us assume that this sensor wafer is transferred to the processing module 5 and taught in the same way as teaching the load lock module 3A. In this case, the sensor wafer may be affected by the magnetic field as it passes through the vacuum transfer module 4, which could prevent it from operating properly. Furthermore, as described above, in the substrate processing apparatus 1, teaching is performed while the processing module 5 is in operation. However, if the sensor wafer is transferred into the processing module 5 while it is in operation, there is a risk that the sensor wafer may be exposed to the gas in the processing module. This could result in corrosion of the components of the sensor wafer. Therefore, it is effective to teach the processing module 5 using the method described above.

[0060] Another embodiment of step S1 will be described. Door valve G1 is opened, and an operator enters loader module 2, which is in atmospheric air, and visually inspects the interior of load lock module 3A through the opening of door valve G1. Teaching may be performed by checking the position of support 47 of transfer body 42 in load lock module 3A in this state. Note that when transfer body 42 enters load lock module 3A, the interior of vacuum transfer module 4 and the interior of load lock module 3A are in communication, so the interior of vacuum transfer module 4 and the interior of load lock module 3A are in atmospheric air to enable the above-mentioned visual inspection.

[0061] As yet another example, the teaching of step S1 may be performed by providing multiple distance sensors on the side wall of the housing 30 of the load lock module 3A. These distance sensors may include, for example, one that detects the distance in the X direction and one that detects the distance in the Y direction relative to the support 47 of the transfer body 42 that has been moved to the transfer position based on the provisional position data. From the detection results of the distance sensors thus provided, the control unit 10 calculates the position of the support center point O2, calculates the amount of deviation in the X direction and the Y direction between the support center point O2 and the placement center point O3 in a plan view, and performs teaching.

[0062] Note that when step S1 is performed using a distance sensor instead of camera 33, step S4 can also be performed using the distance sensor instead of camera 33. Specifically, for example, in step S4, each distance sensor is used to detect the distance to the wafer W. Then, control unit 10 calculates the position of center point O1 of wafer W from the detection result, and calculates the amount of deviation of wafer W and the amount of deviation of the transfer position from this center point O1 to perform teaching. Note that performing steps S1 and S4 using the same detection equipment (camera 33 and distance sensor) provided in the same module in this way is preferable because it eliminates the need to prepare separate detection equipment for performing steps S1 and S4.

[0063] The detector for performing steps S1 and S4, which includes the camera 33 and distance sensor, may be located anywhere accessible to the transfer bodies 41 and 42. Therefore, the load lock module 3B may serve as the detector. Alternatively, if the substrate processing apparatus is configured such that the alignment module 20 or a connection module is connected to the vacuum transfer module 4, these modules may serve as the detector. The connection module connects the vacuum transfer modules 4 to each other when a plurality of vacuum transfer modules 4 are installed in the apparatus. The connection module includes a housing with a vacuum atmosphere inside and a stage installed within the housing. Unlike the vacuum transfer module 4, no magnetic field is generated on the floor within the housing. Fixed pins are installed on the stage of the connection module, and the wafer W is transferred between the two vacuum transfer modules 4 by the lifting and lowering of the transfer bodies 41 and 42.

[0064] Note that a camera 33 or a distance sensor may be provided in the vacuum transfer module 4, thereby allowing a portion of the vacuum transfer module 4 to function as a detection unit. In this case, a specific point in that area can be treated similarly to the placement center point O3 of the load-lock module 3A. That is, in step S1, teaching is performed so that the support center point O2 of the transfer body 42 coincides with the specific point, and in step S4, the transfer body 42 is moved so that the support center point O2 coincides with the specific point, thereby detecting the amount of misalignment of the wafer W. However, when using the vacuum transfer module 4 as a detection unit, it is preferable to configure the camera 33 and other devices to be shielded from magnetic fields to prevent malfunction of the camera 33 and other devices due to the influence of magnetic fields. Considering this, in order to simplify the device configuration, it is preferable to provide the camera 33 and other devices as a detection unit in each of the above-mentioned modules where no magnetic field is formed on the floor.

[0065] In step S3 described with reference to FIG. 8 , the untaught transfer body 42 is caused to enter the module according to the provisional position data to receive the wafer W. For example, a camera 52 is provided as a detection device near each module to be taught in the vacuum transfer module 4 to acquire image data, and the position of the transfer body 42 is adjusted based on the image data when the transfer body 42 enters the module. In other words, the path of the transfer body 42 relative to the module is changed based on the image data. By adjusting the position in this way, an apparatus configuration may be adopted in which interference with the gate valves G2 and G3 that form the entrances to the modules is more reliably avoided. A distance sensor may be provided as a detection device instead of the camera 52 to detect the position of the transfer body 42 before it enters the module, thereby similarly avoiding interference. Alternatively, a photoelectric sensor such as a fiber sensor or an area sensor may be used as the detection device.

[0066] Next, a modification of step S4 described with reference to FIG. 10 will be described with reference to FIG. 12. In FIG. 12, the support center point of the end effector 23 of the transfer mechanism 22 is also indicated as O2, as are the support centers of the transfer bodies 42 and 43. Step S4 is initiated, and the transfer body 42 transfers the wafer W from the processing module 5A to the load lock module 3A, and the wafer W is placed on the stage 31. At this time, the placement center point O3 of the stage 31 is misaligned with the center point O1 of the wafer W (see the upper part of FIG. 12). The transfer mechanism 22 of the loader module 2 receives the wafer W. Because the transfer mechanism 22 has been taught, the support center point O2 of the transfer mechanism 22 is positioned on the placement center point O3 when receiving the wafer W. Therefore, in a plan view, the center point O1 of the wafer W and the support center point O2 of the transfer mechanism 22 are misaligned by an amount corresponding to the misalignment between the placement center point O3 of the load lock module 3A and the center point O1 of the wafer W.

[0067] The wafer W is then transferred so that the support center O2 of the transfer mechanism 22 coincides with the placement center O3 of the stage 31 of the alignment module 20 (lower part of FIG. 12), and is then placed on the stage 31. Since the wafer W is transferred in this manner, the deviation of the center O1 of the wafer W from the placement center O3 in a plan view corresponds to the deviation of the transfer position (the deviation between the support center O2 of the transfer body 42 and the placement center O3 of the processing module 5A) described in FIG.

[0068] The configuration of the alignment module 20 will now be described. As the stage 31, which is formed to have a diameter smaller than that of the wafer W, rotates once around the vertical axis together with the wafer W, light is emitted from a light-emitting unit provided above or below the peripheral edge of the wafer W to a light-receiving unit provided above or below the other peripheral edge. The light-receiving unit receives the light that passes through the side of the wafer W. From this light-receiving state, the control unit 10 detects the position of the center point O1 of the wafer W and further calculates the amount of deviation between the center point O1 and the placement center point O3 of the alignment module 20. Therefore, it is possible to calculate and teach the amount of deviation of the transfer position described above.

[0069] 12, the alignment module 20 is the detector, and the position of the detector is different from the first reference position for the transfer body (a position within the load lock module 3A) that is predetermined so that the transfer body 42 receives and transfers the wafer W. When the wafer W is transferred to another member (transfer mechanism 22 in the example of FIG. 12) so that the deviation between the transfer body 42 that has moved to the first reference position for the transfer body and the wafer W is preserved, teaching can be performed by detecting the position of the wafer W with the transfer destination of the other member as the detector. However, considering that the position of the wafer W may be misaligned when transferred between the transfer body 42 and the other member, it is preferable to set the position at the detector as the first reference position for the transfer body and perform teaching by detecting the position of the wafer W at that reference position.

[0070] 10 and other figures, in step S4 of the substrate processing apparatus 1, the amount of misalignment of the wafer W and / or the amount of misalignment of the transfer position are calculated based on, for example, image data, and teaching is performed using the amount of misalignment of the transfer position. The apparatus may be configured without this teaching. For example, the control unit 10 may be configured with a display unit that displays the amount of misalignment of the wafer W and / or the amount of misalignment of the transfer position. Then, steps S1 to S4 are performed as maintenance of the substrate processing apparatus 1. However, in step S4, teaching (i.e., updating the position data in the memory 11) is not performed, and the acquired amount of misalignment of the wafer W and / or the amount of misalignment of the transfer position is displayed on the display unit. If an operator determines that the amount of misalignment is large based on the display, the operator may take appropriate measures, such as canceling the formation of the vacuum atmosphere in the vacuum transfer module 4 and the processing module 5 and performing an inspection. Even in this configuration without teaching, the amount of misalignment of the wafer W and the amount of misalignment of the transfer position can be easily obtained, which is preferable because it reduces the burden on the operator in understanding the status of the apparatus.

[0071] It has been described that the transfer bodies 41 and 42 transfer wafers W to and from each module (both receiving wafers W from the module and sending wafers W to the module). However, it is also possible to have only one of the transfer bodies 41 and 42 send wafers W to and receive wafers W from a module, and it is arbitrary how the transfer bodies 41 and 42 are used to transfer wafers W in the vacuum transfer module 4. Therefore, the positions of the transfer bodies 41 and 42 determined in step S4 may be used as positions for only receiving wafers from or only sending wafers to the module. Even if used as positions for only receiving wafers or only sending wafers to and from the module, these positions are positions where both receiving wafers from and sending wafers to the module can be performed, and therefore step S4 determines the transfer positions, i.e., both the receiving position and the sending position.

[0072] The number of transfer bodies in the vacuum transfer module 4 is not limited to two, 41 and 42, and more transfer bodies may be provided. Even if the number of transfer bodies is three or more, after an operator manually teaches one transfer body, the other transfer bodies can be automatically taught. To further explain, the module can be taught by performing steps S1, S3, and S4 for the other transfer bodies (i.e., multiple second transfer bodies). Note that for step S2 (transfer of the wafer W to the first reference position for the substrate) performed by the first transfer body, a transfer body that has already been taught for the module at the time of performing step S2 can be used. That is, a manually taught transfer body may be used, or if any of the other transfer bodies listed above has completed automatic teaching, that transfer body may be used. That is, in this example, the second transfer body may also serve as the first transfer body.

[0073] The modules to be taught are not limited to the process module 5 and the load lock modules 3A and 3B, but may be, for example, the connection modules described above. Furthermore, in the substrate processing apparatus 1, the transfer bodies 41 and 42 move within the housing 40, which is in a vacuum atmosphere, but the apparatus may be configured so that they move within the housing 40, which is in an atmospheric atmosphere. In such a case where the interior of the housing 40 is an atmospheric atmosphere, the atmosphere within the process module 5, which is connected to the housing 40 and to which the wafer W is transferred by the transfer bodies 41 and 42, may also be, for example, an atmospheric atmosphere. Furthermore, the substrates transferred in the present technology are not limited to being circular, but may be rectangular.

[0074] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive, and various omissions, substitutions, modifications, and / or combinations may be made to the above-described embodiments without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0075] W wafer 3A Load Lock Module 4 Vacuum Transfer Module 40 cabinets 41, 42 Carrier 5 Processing Module

Claims

[Claim 1] A substrate transport method for transporting a substrate using a first transport body and a second transport body that each float by magnetic force from the bottom of a substrate transport area and move laterally while supporting the substrate, comprising: a transport step of transporting the substrate to a predetermined first reference position for the substrate in the module by the first transport body; a receiving step of receiving the substrate at a first reference position for the substrate by the second transport body; a detection step of moving the second transport body to a predetermined first reference position for the transport body to transport the substrate to a detection unit, and detecting a positional deviation in a plan view between the position of the substrate and a predetermined second reference position for the substrate in the detection unit; A substrate transport method comprising:

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