Method, system and apparatus for tape frame substrate cleaning and drying - Patents.com

Abstract

Methods, systems and apparatus are provided for cleaning and drying a tape frame substrate. In some embodiments, an apparatus for supporting a tape frame substrate includes a chuck having a first side and a second side opposite the first side, the first side having a convex surface configured to support a tape frame substrate, and a plurality of channels extending through the chuck and having outlets along the first side, the plurality of channels configured to dispense fluid from the outlets along the convex surface of the first side. In some embodiments, a support system includes a chuck and a holder configured to attach the tape frame substrate to the chuck. The plurality of channels are configured to dispense fluid from the outlets between the tape frame substrate and the convex surface of the chuck when the tape frame substrate is attached to the chuck.

Description

[Technical field]

[0001]

[0001] Embodiments of the present disclosure generally relate to methods, systems, and apparatus for processing substrates. In particular, embodiments of the present disclosure relate to methods, systems, and apparatus for wet cleaning and drying of tape frame substrates. [Background technology]

[0002]

[0002] Substrates undergo various processes during the manufacture of semiconductor integrated circuit devices. Some of these processes include wafer (e.g., substrate) dicing. In wafer dicing, a wafer that has undergone a particular process is placed on a dicing tape and cut or separated into a number of dies or chiplets. After dicing, the front and back surfaces of the tape frame wafer are cleaned, such as by a pressurized nozzle discharging a fluid. Such cleaning is difficult because the thin dies are mechanically fragile and the dies are closely spaced from one another on the dicing tape. For example, a suspended dicing tape can vibrate and / or flex under the pressurized nozzle, generating particles that can cause breakage or damage to the thin dies.

[0003] SUMMARY OF THE DISCLOSURE

[0003] Accordingly, the present inventors have provided an improved method, system, and apparatus for cleaning and drying tape frame substrates. Summary of the Invention

[0004]

[0004] Methods, systems, and apparatus for processing a tape frame substrate are provided herein. In some embodiments, an apparatus for supporting a tape frame substrate includes a chuck having a first side and a second side opposite the first side. The first side has a convex surface configured to support the tape frame substrate. The apparatus also includes a plurality of channels extending through the chuck, the plurality of channels having an outlet along the first side. The plurality of channels are configured to eject a fluid from the outlet along the convex surface of the first side.

[0005] In some embodiments, a system for supporting a tape frame substrate includes a chuck having a first side and a second side opposite the first side. The first side has a convex surface configured to support the tape frame substrate. The system further includes a plurality of channels. The plurality of channels extend through the chuck and have an outlet along the first side. The plurality of channels are configured to eject fluid from the outlet along the convex surface of the first side. The system also includes a holder configured to attach the tape frame substrate to the chuck. The plurality of channels are configured to eject fluid from the outlet and to eject fluid between the tape frame substrate and the convex surface of the chuck when the tape frame substrate is attached to the chuck.

[0006]

[0006] A method of cleaning a tape frame substrate includes attaching the tape frame substrate to a chuck. The chuck has a first side and a second side opposite the first side. The first side has a convex surface configured to support the tape frame substrate. The chuck has a plurality of channels extending through the chuck and having an outlet along the first side. The tape frame substrate has a dicing tape having a first side and a second side, and a plurality of substrates attached to the first side of the dicing tape. The method also includes directing a first fluid through the chuck and ejecting the first fluid from the outlet into a space between the convex surface and the second side of the dicing tape, and directing a second fluid onto the substrates from a fluid source positioned facing the first side of the dicing tape.

[0007]

[0007] Other and further embodiments of the present disclosure are described below.

[0008]

[0008] The embodiments of the present disclosure, briefly summarized above and described in more detail below, can be understood by reference to the exemplary embodiments of the present disclosure illustrated in the accompanying drawings. However, since the present disclosure may admit of other equally effective embodiments, the accompanying drawings depict only typical embodiments of the present disclosure and therefore should not be considered as limiting the scope. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic cross-sectional side view of a support system and tape frame substrate in a first configuration according to several embodiments of the present disclosure. [Diagram 2]

[0010] 2 is a schematic cross-sectional side view of the support system and tape frame substrate of FIG. 1 in a second configuration used during a cleaning and drying process of the second or backside of the tape frame substrate in accordance with multiple embodiments of the present disclosure. [Diagram 3]

[0011] 2 is a schematic cross-sectional side view of the support system and tape frame substrate of FIG. 1 in a third configuration during a cleaning and drying process of a first or front side of the tape frame substrate in accordance with multiple embodiments of the present disclosure. [Figure 4a]

[0012] FIG. 4 is a schematic cross-sectional side view of the support system and tape frame substrate of FIG. 3 in a third configuration having an alternative chuck, in accordance with embodiments of the present disclosure. [Figure 4b]

[0013] FIG. 4 is a schematic cross-sectional side view of the support system and tape frame substrate of FIG. 3 in a third configuration having an alternative chuck, in accordance with embodiments of the present disclosure. [Diagram 5]

[0014] 3 is a schematic cross-sectional side view of the support system and tape frame substrate of FIG. 2 in a second configuration having an alternative chuck, in accordance with embodiments of the present disclosure. [Figure 6]

[0015] 3 is a schematic cross-sectional side view of the support system and tape frame substrate of FIG. 2 in a second configuration having an alternative chuck, in accordance with embodiments of the present disclosure. [Figure 7]

[0016] 3 is a schematic cross-sectional side view of the support system and tape frame substrate of FIG. 2 in a second configuration having an alternative chuck, in accordance with embodiments of the present disclosure. [Figure 8]

[0017] FIG. 4 is a schematic cross-sectional side view of the support system and tape frame substrate of FIG. 3 in a third configuration having an alternative chuck, in accordance with embodiments of the present disclosure. [Figure 9]

[0018] FIG. 4 is a schematic cross-sectional side view of the support system and tape frame substrate of FIG. 3 in a third configuration having an alternative chuck, in accordance with embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010]

[0019] To facilitate understanding, the same reference numbers have been used, where possible, to designate identical elements common to the figures. The figures are not to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0011]

[0020] Provided herein are embodiments of methods, apparatus, and systems for wet cleaning and drying of tape frame substrates. The embodiments of the methods, systems, and apparatus described herein may improve dicing lane cleaning between substrates on a tape frame substrate, reduce particle generation, and mitigate thin die breakage during wet cleaning and drying of the tape frame substrate. The methods, systems, and apparatus described herein may also eliminate the need to flip or otherwise rotate the tape frame substrate for cleaning and drying on both sides of the tape frame substrate.

[0012]

[0021] 1 is a schematic cross-sectional side view of a support system 100 according to one embodiment of the present disclosure. The support system 100 is configured to support a tape frame substrate 200, such as during a wet cleaning and drying method according to the present disclosure.

[0013]

[0022] The tape frame substrate 200 may include a dicing tape 202, a plurality of substrates 204 attached to the dicing tape 202, and a frame 206 connected to the dicing tape 202. In some embodiments, the dicing tape 202 has elastic properties that allow the dicing tape to elastically deform during wet cleaning and drying processes, as described in more detail below. In some embodiments, the dicing tape 202 may be a commercially available dicing tape, such as a series D or G dicing tape available from Lintec Corporation of Tokyo, Japan.

[0014]

[0023] The dicing tape 202 has a front or first side 202a and a back or second side 202b. A plurality of substrates 204 are attached to the front or first side 202a of the dicing tape 202, such as by an adhesive. The substrates 204 are spaced apart by dicing lanes 208. In some embodiments, a frame 206 surrounds the plurality of substrates 204. The frame 206 may extend along or near an outer edge 202c of the dicing tape 202. In some embodiments, the frame 206 is relatively stiff compared to the relatively flexible dicing tape 202. In some embodiments, the frame 206 may be formed of a metal, such as stainless steel.

[0015]

[0024] As a result of dicing or other processing steps, particles 210, 212 may adhere to the tape frame substrate 200. Some particles 210 are shown in the dicing lanes 208 between adjacent substrates 204, and some particles 212 are adhered to the back or second side 202b of the dicing tape 202. As described in more detail below, several embodiments of wet cleaning and drying methods according to the present disclosure may be employed to remove the particles 210, 212.

[0016]

[0025] In FIG. 1, the support system 100 is shown in a first configuration, in which the tape frame substrate 200 is not attached to the support system 100. In the first configuration, the dicing tape 202 is shown in a flat, undeformed configuration with the substrates 204 spaced apart by the width W of the dicing lanes 208. A central axis A extends through the center of the support system 200 and the tape frame substrate 200. Each substrate 204 extends parallel to the axis A from a base 204a at a first side 202a of the dicing tape 202 to a free end 204b axially spaced apart from the base 204a. As used herein, "axial" or "axially" refers to a direction along or parallel to the axis A. In the flat configuration of the dicing tape 202 shown in FIG. 1, the width W of the dicing lanes 208 is relatively constant along the axial direction.

[0017]

[0026] The support system 100 includes a chuck 102 and a holder 104. In some embodiments, the chuck 102 is an upper portion of a pedestal 103. The pedestal 103 may be configured to rotate with the chuck 102 about an axis A. The chuck 102 has a first or front side 102a and a second or back side 102b opposite the first side 102a. A central axis A extends through the center of the chuck 102 between the first side 102a and the second side 102b. In some embodiments, a tape frame substrate 200 is configured to be coaxially aligned with the chuck 102, as shown in FIG. 1 .

[0018]

[0027] The first side 102a of the chuck 102 has a convex surface 106 configured to support the tape frame substrate 200 in a third configuration, for example as shown in FIG. 3. In particular, the convex surface 106 is configured to elastically deform the dicing tape 202 of the tape frame substrate 200, as described in more detail below. The convex surface 106 has a peak at a center 106a and an outer edge 106b. In some embodiments, the convex surface 106 is axisymmetric about an axis A.

[0019]

[0028] The chuck 102 has a number of channels 108 extending through the chuck 102 and having an outlet 110 along the first side 102a. In some embodiments, the channels 108 extend from the first side 102a to the second side 102b. The channels 108 may be fluidly coupled to the fluid channel 105 within the pedestal 103. The channels 108 are configured to eject fluid from the outlet 110 along a convex surface 106 of the first side 102a of the chuck 102. In some embodiments, the fluid is ejected as a laminar outflow along the convex surface 106 from the center 106a of the convex surface 106 to the outer edge 106.

[0020]

[0029] The cross-sectional area of ​​the channels 108 and / or the outlets 110 may be sized based on the cross-sectional area of ​​the substrate 204 of the dicing tape 202. For example, in some embodiments, the outlets 110 may have a smaller cross-sectional area than the cross-sectional area of ​​the respective substrate 204 aligned with the outlets 110 along a direction parallel to the central axis A. This may ensure that the substrate 204 is adequately supported by the convex surface 106 to reduce bending stress or breakage of the substrate during cleaning and drying.

[0021]

[0030] The holder 104 is configured to removably attach the tape frame substrate 200 to the chuck 102. The holder 104 includes fingers 112 configured to engage the frame 206 of the tape frame substrate 200, as shown in Figures 2 and 3, to hold the tape frame substrate 200 against the chuck 102 in either the second or third configuration. In some embodiments, such as the one shown in Figure 2, the holder 104 may be configured as a "soft lock." The "soft lock" is biased to allow a limited amount of relative movement in an axial direction between the frame 206 and the chuck 102, as described in more detail below.

[0022]

[0031] In some embodiments, the frame 206 is circular and the holders 104 are spaced apart from one another around the circular frame 206. Also, in some embodiments, the chuck 102 and holder 104 are configured to rotate together about a central axis A whether or not the tape frame substrate 200 is attached to the chuck 102. Such rotation may be utilized during cleaning or drying of the tape frame substrate 200.

[0023]

[0032] In some embodiments, the support system 100 may also include a locking screw 116 configured to secure the tape frame substrate 200 at a cut 214 (two cuts in a commercially available frame 206) formed in the frame 206 of the tape frame substrate 200. In some embodiments, the locking screw 116 extends from the pedestal 103 to the frame 206. The locking screw 116 is configured to prevent relative rotation between the support system 100 and the tape frame substrate 200 during rotation of the tape frame substrate 200 and support system 100 about the central axis A.

[0024]

[0033] 2 is a schematic cross-sectional side view of a tape frame substrate 200 mounted on the support system 100 in a second configuration for cleaning and / or drying of the backside or second side 202b of a dicing tape 202, in accordance with embodiments of the present disclosure. In one embodiment shown in FIG. 2, the tape frame substrate 200 is mounted on the chuck 102 aligned with a central axis A. The fingers 112 of the holder 104 engage the frame 206 of the tape frame substrate 200, thereby holding the tape frame substrate against the chuck 102.

[0025]

[0034] As mentioned above, in some embodiments, the holder 104 may be configured to allow slight axial displacement of the holder 104 and, consequently, the tape frame substrate during cleaning. For example, during the cleaning process of the second side 202b of the dicing tape 202 shown in FIG. 2, the holder 104 may hold the frame 206 of the tape frame substrate 200. Thereby, the dicing tape 202 may first contact the convex surface 106 and elastically deform around the convex surface 106. Thereby, the dicing tape 202 and the system may assume the third configuration shown in FIG. 3. Nevertheless, during the wet cleaning or drying method of the second side 202b of the dicing tape 202, a fluid (e.g., deionized water or pressurized gas) is directed through the channel 108 to the outlet 110 and between the second side of the dicing tape 202 and the convex surface 106. The dispensed fluid may apply a fluid pressure to the dicing tape 202, overcoming the bias of the soft-lock features of the holder 104 and the weight of the tape frame substrate 200, causing the soft-lock features of the holder 104 to slightly lift the entire tape frame substrate 200 off the convex surface 106, thus assuming the second configuration of the tape frame substrate 200 and system 100 shown in Figure 2. The dispensed fluid may have a pressure of 50 psi to 1000 psi.

[0026]

[0035] In addition to lifting the tape frame substrate 200, the fluid pressure causes elastic deformation of the dicing tape 202. As shown in Figure 2, the fluid pressure causes elastic deformation of the dicing tape 202 with a curvature that corresponds to the curvature of the convex surface 106. Thus, in the second configuration, the fluid acts as a layer that can support the tape frame substrate 200 and can cause the dicing tape 202 to elastically deform.

[0027]

[0036] 2, fluid flows outwardly from the center 106a to the outer edge 106b of the convex surface 106 between the second side 202b of the dicing tape 202 and the convex surface 106. The channels 108 and outlets 110 are configured to effect a flow of the fluid under a laminar flow regime along the convex surface 106 to promote flushing of particles 212 adhered to the second side 202b of the dicing tape 202.

[0028]

[0037] The elastic deformation of the dicing tape 202 caused by the fluid pressure spreads the substrates 204 apart, thereby increasing the width of the dicing lanes 208 in the axial direction. That is, the width of the dicing lanes 208 between the free ends 204b of adjacent substrates 204 is greater than the width between the bases 204a of adjacent substrates 204. In some embodiments, fluid is ejected from the outlets 110 to elastically deform the dicing tape 202 and maintain uniform dicing lanes 208 across the dicing tape 202. As described in more detail below, various parameters, such as channel density, outlet size, shape, and angle, and outlet pressure, are selected or adjusted to achieve uniform elastic deformation of the dicing tape 202 and maintain uniform dicing lanes 208 of the dicing tape 202.

[0029]

[0038] Additionally, the elastic deformation of the dicing tape 202 may reduce vibration of the tape frame substrate 200 when fluid impinges on the dicing tape 202 during cleaning or drying. The increased spacing of the free ends 204b of the substrate 204 and reduced vibration of the tape frame substrate may reduce scraping and damage to the edges of the substrate 204 during cleaning and drying of the second side 202b of the dicing tape 202.

[0030]

[0039] As mentioned above, the arrangement shown in FIG. 2 may be used for wet cleaning and drying of the second side 202b of the dicing tape 202. During wet cleaning, the fluid may be deionized water, while during drying, the fluid may be a pressurized gas, such as nitrogen. Also, in some embodiments, during wet cleaning or drying, the attached tape frame substrate 200 may rotate together with the support system 100 about the central axis A. Meanwhile, pressurized gas flows through the channel 108 and is discharged from the outlet 100 into the space between the convex surface 106 and the second side 202b of the dicing tape 202.

[0031]

[0040] 3 is a schematic cross-sectional side view of the support system and tape frame substrate of FIG. 1 in a third configuration during cleaning and drying of the first or front side of the tape frame substrate according to embodiments of the present disclosure. FIG. 3 shows the tape frame substrate 200 attached to the chuck 102 in a third configuration for cleaning and drying according to embodiments of the present disclosure. In the third configuration, the holder 104 holds the frame 206 of the tape frame substrate 200. The dicing tape 202 thereby engages with the convex surface 106 of the chuck 102 and elastically deforms around the convex surface 106 of the chuck 102. In embodiments, the convex surface 106 is in uniform contact with the dicing tape 202, and the dicing tape 202 conforms to the convex surface 106. As a result of the elastic deformation of the dicing tape 202, the substrate 204 spreads apart. The width of the dicing lane 208 thereby increases in the axial direction. This is similar to the manner described above in the second configuration. Thus, the width of the dicing lanes 208 is greater at the outer edge (free end) 204b than at the base 204a of the substrate 204. The increased width of the dicing lanes 208 exposes the particles 210 within the dicing lanes 208 and facilitates flushing of the particles 210.

[0032]

[0041] In one embodiment shown in FIG. 3, a swinging or otherwise movable fluid source (e.g., nozzle) 300 can be used to dispense a pressurized fluid (e.g., liquid or gas) onto the substrate 204 and dicing tape 202a and into the dicing lanes 208. The dispensed pressurized fluid can have a pressure of 50 psi to 1000 psi. The fluid source 300 is positioned to face the first side 202a of the dicing tape 202. During cleaning, a high-pressure liquid is dispensed from the fluid source 300 and directed into the widened dicing lanes 208 to wash away the particles 210. During drying, a pressurized gas can be dispensed from the fluid source 300 to dry the substrate 204 and the first side 202a of the dicing tape 202, including the dicing lanes 208.

[0033]

[0042] Cleaning and drying the tape frame substrate 200 in the third configuration may stabilize the dicing tape 202 and substrate 204, reducing scraping, breakage, and particle generation of the substrate 204. Pressing the dicing tape 202 against the convex surface 106 of the chuck 102 may reduce the tape frame substrate from vibrating or flexing (apart from compression of the dicing tape 202, discussed below) during cleaning or drying of the substrate 204 and first side 204 of the dicing tape 202, thereby reducing the possibility of scraping, breakage, and particle generation of the substrate 204 during cleaning and drying. Furthermore, the increased width of the dicing lane 208 provided by the widening of the substrate 204 in the third configuration may also reduce scraping and breakage of the substrate during cleaning and drying. The reduced vibration and wider dicing lane may allow the use of high impact cleaning (such as mist or jets) as well as pressurized gas assisted drying of the die without increasing the risk of scraping, cracking, and particle generation of the substrate.

[0034]

[0043] In addition to being elastic, the dicing tape 202 may be slightly compressible in the axial direction. Thus, in the third configuration, when the fluid ejected from the fluid source 300 locally impinges on the tape frame substrate 200, the dicing tape 202 may be compressed and slightly deflected toward the chuck 102. Nevertheless, the convex surface 106 may be designed to have a sufficiently convex curvature to ensure that the width of the dicing lane 208 remains open to prevent rubbing of the edges of the adjacent substrates 204, even if the dicing tape 102 is locally compressed by the fluid ejected by the nozzle 300.

[0035]

[0044] Thus, embodiments of the methods, systems, and apparatus described herein may improve dicing lane cleaning, reduce particle generation, and mitigate thin die breakage during wet cleaning and drying of the tape frame substrate. Additionally, the methods, systems, and apparatus described herein may eliminate the need to flip or otherwise rotate the tape frame substrate for cleaning and drying on both sides of the tape frame substrate.

[0036]

[0045] As described above, the convex surface 106 of the chuck 102 is configured to provide support for the tape frame substrate 200. The convex surface 106 may have various configurations and dimensions. In some embodiments, the convex surface 106 protrudes into at least the area occupied by the substrate 204 to axially support the substrate 204. For example, in one embodiment shown in FIG. 1, the outer edge 106b of the convex surface 106 extends radially with respect to the axis A to the outer edge 202c of the dicing tape 202. Thereby, in the third configuration, the entire dicing tape 202 may contact and be supported by the convex surface 106. In some alternative embodiments, such as that shown in FIG. 4a, the outer edge 106b of the convex surface 106 extends to the outer boundary B of the area occupied by the substrate 204. Also, in some embodiments, such as that shown in FIG. 4b, the outer edge 106b of the convex surface 106 extends between the outer boundary B and the frame 206.

[0037]

[0046] In some embodiments, the convex surface has a peak at the center 106a and extends to the outer edge 106b. In some embodiments, the height of the convex surface, measured as the axial distance between the peak and the outer edge, is up to about 16 mm. Such dimensions allow the convex surface 106 to sufficiently elastically deform the dicing tape 202 in the third configuration without damaging the dicing tape 202 or the substrate 204. In some embodiments, the height of the convex surface 106 may be based on the amount of area of ​​the tape frame substrate 200 that is supported by the convex surface 106. For example, in one embodiment shown in FIG. 1, the height of the convex surface 106 may be up to about 16 mm. In one embodiment shown in FIG. 4a, the height of the convex surface 106 may be up to about 10 mm.

[0038]

[0047] In embodiments, at least one of the channel density (number of channels per unit area), channel size, channel shape, channel exit angle, or exit pressure may be selected to provide uniform fluid pressure under all substrates 204 to maintain a uniform shape of the dicing lanes 208 across the tape frame substrate 200. Also, in embodiments, at least one of the channel density, channel size, channel shape, channel exit angle, or exit pressure may be selected to enable high radial fluid flow rates for better cleaning and drying efficiency with or without assistance of rotation of the tape frame substrate 200 during cleaning or drying. Furthermore, in embodiments, at least one of the channel density, channel size, or channel shape may be selected to provide a smooth convex surface with minimum opening hole size so that the thin substrate 204 is less likely to warp / bow at the outlet 110 during high pressure cleaning and drying of the substrate 204 and the first side 202a of the dicing tape 202.

[0039]

[0048] 1-3, the density of the channels 108 and their outlets 110 in the convex surface 106 is uniform throughout the convex surface 106. In some embodiments, such as that shown in FIG. 5, the density of the channels 108 and outlets 110 may vary throughout the convex surface 106. For example, as shown in FIG. 5, the density of the channels 108 and outlets 110 is higher toward the central axis A of the convex surface 106 than at the outer edge 106b of the convex surface 106. In some embodiments, the density of the outlets may be between 1 and 25 per square centimeter of the convex surface 106.

[0040]

[0049] Additionally, the outlets 110 may have the same or different sizes (e.g., diameters). In one embodiment of the chuck 102 shown in Figures 1-3, the outlets 100 have the same size. In one embodiment of the chuck 102 shown in Figure 6, the outlets 110 have different diameters, with the larger diameter outlets 110 positioned radially closer to the central axis A and the smaller diameter outlets 110 positioned radially away from the central axis A. In some embodiments, the outlets may have a diameter of about 0.5 mm to 3 mm.

[0041]

[0050] The outlets 110 may be oriented in the same direction or in different directions. For example, in some embodiments shown in Figures 1-3, all of the outlets 110 are oriented parallel to each other and to the central axis A. However, in one embodiment shown in Figure 7, the outlets 110 are oriented at different angles that are non-parallel to the central axis A.

[0042]

[0051] 1-3, the channel 108 and the outlet 110 are fully open. In some embodiments, such as those shown in Figures 8 and 9, one or more of the channel 108 and the outlet 110 may have actuatable flow control elements (e.g., valves) for independently controlling flow through the channel 108 and the outlet 110.

[0043]

[0052] For example, Figures 8 and 9 show an embodiment of the chuck 102 including multiple valves 130. In Figures 8 and 9, each valve 130 corresponds to one channel 108. Each valve 130 has a head 132 and a stem 134 extending from the head 132. The head 132 is configured to seal with a valve seat 136 formed in the convex surface 106, such that a face 132a of the head 132 is substantially flush with the convex surface 106. Compared to the open outlet 110 of the embodiments shown in Figures 1-3, the flush face 132a of the head 132 of the valve 130 may provide additional support for the substrate 204 of the tape frame substrate 200 during the cleaning and drying process when the tape frame substrate 200 is in the third configuration, as shown in Figure 9. A smoother convex surface 106 with fewer or smaller outlets 110 may be beneficial in reducing warping / bow of a thin die supported on the channel outlets 110 during high pressure washing and drying of the tape frame substrate 200 when mounted in the third configuration.

[0044]

[0053] In some embodiments, the stem 134 of each valve 130 may extend through a corresponding channel 108 beyond the second side 102b of the chuck 102 and be connected to a stop 138. The stop 138 is configured to limit the axial displacement of the valve 130 relative to the chuck 102. In some embodiments, a biasing element, such as a spring (not shown), may be connected between the stop 138 and the second side 102b of the chuck 102 to bias the head 132 of the valve 130 into a closed or sealed position with the valve seat 136, as shown in FIG.

[0045]

[0054] As shown in Figure 8, during a cleaning or drying process of the second side 202b of the dicing tape 202, the valve 130 can be opened by flowing a fluid through the channel 108 to the first side 102a of the chuck 102 with sufficient pressure to overcome the weight of the valve 130 and / or the bias on the valve 130. In Figure 8, when the valve 130 is opened by flowing a fluid, the head 132 of the valve 130 remains spaced apart from the second side 202b of the dicing tape 202.

[0046]

[0055] While the forgoing is directed to several embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof.

Claims

1. 1. An apparatus for supporting a tape frame substrate, comprising: a chuck having a first side and a second side opposite the first side, the first side having a convex surface configured to support the tape frame substrate; and an apparatus comprising: a plurality of channels extending through the chuck and having outlets along the first side, the plurality of channels configured to eject fluid from the outlets along the convex surface of the first side.

2. 2. The apparatus of claim 1, wherein the convex surface is centered about a central axis extending through the chuck and extends from a peak at a center of the chuck to an outer edge of the chuck and has a height measured along the central axis from the peak to the outer edge, the height being less than about 16 mm.

3. 10. The apparatus of claim 1, wherein the density of the outlets is from 1 to 25 outlets per square centimeter.

4. The device of any one of claims 1 to 3, wherein the outlet has a diameter of about 0.5 mm to about 3 mm.

5. The apparatus of claim 1 , wherein the outlet is configured to direct fluid at a plurality of different angles relative to a central axis extending through the chuck.

6. 4. The apparatus of claim 1, further comprising a plurality of valves coupled to the chuck, each valve corresponding to one of the plurality of channels and configured to open when fluid flows through the channel and close when fluid does not flow through the channel.

7. 7. The apparatus of claim 6, wherein each valve is disposed at the outlet, the valve being substantially flush with the convex surface when in a closed position.

8. 1. A system for supporting a tape frame substrate, comprising: a chuck having a first side and a second side opposite the first side, the first side having a convex surface configured to support the tape frame substrate; a plurality of channels extending through the chuck and having outlets along the first side, the plurality of channels configured to eject fluid from the outlets along the convex surface of the first side; and a holder configured to attach the tape frame substrate to the chuck; the plurality of channels are configured to eject fluid from the outlet between the tape frame substrate and the convex surface of the chuck when the tape frame substrate is attached to the chuck.

9. 9. The system of claim 8, wherein the convex surface is centered about a central axis extending through the chuck and extends from a peak at a center of the chuck to an outer edge of the chuck and has a height measured along the central axis from the peak to the outer edge, the height being less than about 16 mm.

10. The system of claim 8 , wherein the holder is configured to permit limited relative movement along a central axis between the convex surface and the tape frame substrate.

11. The system of claim 8 , wherein the chuck and tape frame substrate and the holder are configured to rotate together about a central axis.

12. 11. The system of claim 8, wherein the density of the outlets is from 1 to 25 per square centimeter.

13. The system of any one of claims 8 to 10, wherein the outlet has a diameter of about 0.5 mm to about 3 mm.

14. 11. The system of claim 8, further comprising a plurality of valves coupled to the chuck, each valve corresponding to one of the plurality of channels and configured to open when fluid flows through the channel and close when fluid does not flow through the channel.

15. 1. A method for cleaning a tape frame substrate, comprising: Attaching a tape frame substrate to a chuck, the chuck having a first side and a second side opposite the first side, the first side having a convex surface configured to support the tape frame substrate, a plurality of channels extending through the chuck and having an outlet along the first side, the tape frame substrate having a dicing tape having a first side and a second side, a plurality of substrates attached to the first side of the dicing tape; directing a first fluid through the chuck and dispensing the first fluid from the outlet into a space between the convex surface and the second side of the dicing tape; and directing a second fluid onto the plurality of substrates from a fluid source positioned facing the first side of the dicing tape.

16. The method of claim 15 , wherein the first fluid and the second fluid comprise at least one of a liquid or a gas.

17. 16. The method of claim 15, wherein the first fluid and the second fluid have a pressure of between 50 psi and 1000 psi.

18. 18. A method according to any one of claims 15 to 17, wherein the first fluid flows within the space under a laminar flow regime.

19. 18. The method of claim 15, wherein the chuck is configured to rotate about a central axis extending through the chuck, and the first fluid and the second fluid are directed while the chuck and the tape frame substrate secured to the chuck are rotating.

20. 18. The method of claim 15, wherein directing the second fluid comprises directing the second fluid into a dicing lane between adjacent ones of the plurality of substrates.

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