Mechanically enhanced electrical package having long interconnect members - Patents.com

Abstract

The electrical package may include a substrate having a first side and a second side opposite the first side. One or more electrical components attached to the substrate and a plurality of conductive interconnect members may be coupled to the second side of the substrate. At least one of the interconnect members may have an elongated shape having a length greater than a width. The interconnect member on which the elongated shape is located may be at or adjacent to one of the corners. The interconnect members may be arranged as a grid, with the first interconnect members each occupying a single grid cell and the second interconnect members each occupying at least two grid cells. The second interconnect members may have the shape of two first interconnect members joined by a bridge portion.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 296,424, entitled "PACKAGES WITH ELONGATED INTERCONNECT MEMBERS," filed January 4, 2022, U.S. Provisional Patent Application No. 63 / 296,425, entitled "PACKAGES WITH REINFORCED INTERCONNECT MEMBERS," filed January 4, 2022, and U.S. Provisional Patent Application No. 63 / 305,985, entitled "MECHANICALLY REINFORCED ELECTRICAL PACKAGES," filed February 2, 2022, the contents of each of which are incorporated by reference in their entirety herein.

[0002] background Technical Field TECHNICAL FIELD Embodiments of the present disclosure relate to packaging circuit devices, such as radio frequency modules, that may be mounted on a circuit board, and more particularly, to packaging circuit devices having interconnect members of different shapes or sizes. [Background technology]

[0003] 2. Description of Related Art Circuit devices such as radio frequency modules can be mounted in package modules. Such devices can be connected to a motherboard (e.g., of an electronic device) via solder joints (e.g., solder balls). Mechanical shock tests (e.g., drop tests) are often performed to test the connections between the motherboard and the circuit devices (e.g., the connections provided by the solder joints). When the size of the pads on the circuit board (e.g., motherboard) in the electronic device is reduced (e.g., to reduce the size of the electronic device), this requires a corresponding reduction in the size of the connections in the package attached to the circuit board, and the stresses during testing can increase the rate of package breakage. Summary of the Invention [Means for solving the problem]

[0004] Summary of Certain Inventive Aspects Each claimed innovation has several aspects, no single one of which is solely responsible for its desirable attributes. Without limiting the scope of the claims, some prominent features of the disclosure will now be discussed briefly.

[0005] Various embodiments disclosed herein may relate to an electrical package that may include a substrate having a first side and a second side opposite the first side, one or more electrical components attached to the substrate, and a plurality of conductive interconnect members coupled to the second side of the substrate, At least one of the interconnect members may have an elongated shape having a length greater than a width.

[0006] The one or more electrical components can be attached to a first side of the substrate. The one or more additional electrical components can be attached to a second side of the substrate. The electrical package can include a mold structure that extends across at least a portion of the second side of the substrate and / or at least partially surrounds the one or more additional electrical components. The electrical package can include a mold structure that extends across at least a portion of the first side of the substrate and / or at least partially surrounds the one or more electrical components. The substrate can have a generally rectangular shape with four corners in a plan view. The interconnect member on which the elongated shape is located can be at or proximate one of the corners. The other interconnect member can have a generally circular shape in a plan view and can be disposed inwardly from one of the corners. The substrate can have a corner and the interconnect member closest to the corner can have an elongated shape. The plurality of interconnect members can have a generally circular shape with a substantially uniform diameter in a plan view. At least one of the interconnect members having an elongated shape may have a width substantially equal to a diameter of the circular interconnect member and a length at least twice the diameter of the circular interconnect member. The interconnect member having an elongated shape may be the interconnect member furthest from the center of the package. The at least one interconnect member having an elongated shape may have a length L substantially equal to n·W+(n-1)·G, where n is a positive integer, W is the width of the interconnect member, and G is the distance between adjacent interconnect members. The interconnect members may be arranged in a grid, where groups of interconnect members each occupy a single grid cell, and the interconnect members having an elongated shape occupy at least two grid cells arranged in a linear fashion. The package may be a two-sided molded package.

[0007] Various embodiments disclosed herein may relate to an electrical package that may include a substrate having a first side and a second side opposite the first side, one or more electrical components attached to the substrate, a plurality of first conductive interconnect members coupled to the second side of the substrate and having a substantially uniform width, and at least one second conductive interconnect member having a width substantially the same as the substantially uniform width of the first interconnect members and a length greater than or equal to the combined length of two of the first interconnect members.

[0008] The one or more electrical components may be attached to a first side of the substrate. The one or more additional electrical components may be attached to a second side of the substrate. The electrical package may include a mold structure extending across at least a portion of the second side of the substrate and / or at least partially surrounding the one or more additional electrical components. The electrical package may include a mold structure extending across at least a portion of the first side of the substrate and / or at least partially surrounding the one or more electrical components. The substrate may have a generally rectangular shape having four corners in a plan view. The at least one second interconnect member may be located at or proximate to at least one of the corners. The first interconnect member may have a generally circular shape in a plan view. At least one of the second interconnect members may be an interconnect member furthest from a center of the package. At least one interconnect member having an elongated shape may have a length L substantially equal to n·W+(n-1)·G, where n is a positive integer, W is the width of the first interconnect member, and G is the distance between adjacent first interconnect members. The interconnect members may be arranged as a grid, with each first interconnect member occupying a single grid cell and each second interconnect member occupying at least two grid cells. The second interconnect member may have the shape of two first interconnect members joined by a bridge portion. The second interconnect member may have a generally capsule shape. The package may be a two-sided molded package.

[0009] Various embodiments disclosed herein may relate to an electrical package that may include a substrate having a first side and a second side opposite the first side, one or more electrical components attached to the substrate, and a plurality of conductive interconnect members arranged in a two-dimensional array on the second side of the substrate. Each of the plurality of interconnect members may occupy one array location. At least one of the interconnect members may occupy at least two array locations.

[0010] The one or more electrical components may be attached to a first side of the substrate. The one or more additional electrical components may be attached to a second side of the substrate. The electrical package may include a mold structure extending across at least a portion of the second side of the substrate and / or at least partially surrounding the one or more additional electrical components. The electrical package may include a mold structure extending across at least a portion of the first side of the substrate and / or at least partially surrounding the one or more electrical components. The package may be a two-sided molded package. The interconnect member occupying one array location may have a generally circular shape. The substrate may have a generally rectangular shape having four corners in a plan view. The at least one interconnect member occupying at least two array locations may be located at or proximate to at least one of the corners. The at least one interconnect member occupying at least two array locations may be the interconnect member furthest from a center of the package. At least one interconnect member occupying at least two array locations may have a length L substantially equal to n·W+(n-1)·G, where n is a positive integer, W is the width of the interconnect member, and G is the distance between adjacent interconnect members. The second interconnect member may have a generally capsule shape.

[0011] Various embodiments disclosed herein may relate to an electrical package that may include a substrate having a first side, a second side opposite the first side, and at least one corner. One or more electrical components may be attached to the substrate. A plurality of conductive interconnect members may be coupled to the second side of the substrate. At least one of the interconnect members may be closest to the corner and may have a larger size than an inner interconnect member located further inward from the corner.

[0012] The one or more electrical components may be attached to a first side of the substrate. The one or more additional electrical components may be attached to a second side of the substrate. The electrical package may include a mold structure extending across at least a portion of the second side of the substrate and / or at least partially surrounding the one or more additional electrical components. The electrical package may include a mold structure extending across at least a portion of the first side of the substrate and / or at least partially surrounding the one or more electrical components. At least some of the inner interconnect members may have a generally circular shape. At least one interconnect member closest to a corner may have a generally capsule shape. The interconnect members may be arranged as a grid. At least some of the inner interconnect members may occupy a single grid cell. The interconnect member closest to a corner may occupy at least two grid cells.

[0013] Various embodiments disclosed herein may relate to an electrical package that may include a substrate having a first side and a second side opposite the first side, one or more electrical components attached to the substrate, and a plurality of conductive interconnect members coupled to the second side of the substrate. At least one of the interconnect members furthest from a center of the substrate may have a larger size than other interconnect members located closer to the center.

[0014] The one or more electrical components may be attached to a first side of the substrate. The one or more additional electrical components may be attached to a second side of the substrate. The electrical package may include a mold structure extending across at least a portion of the second side of the substrate and / or at least partially surrounding the one or more additional electrical components. The electrical package may include a mold structure extending across at least a portion of the first side of the substrate and / or at least partially surrounding the one or more electrical components. At least some of the other interconnect members may have a generally circular shape. The at least one interconnect member furthest from the center may have a generally capsule shape. The at least one interconnect member furthest from the center may be located at or proximate to a corner of the package. The interconnect members may be arranged as a grid, with at least some of the other interconnect members each occupying a single grid cell and the interconnect member furthest from the center occupying at least two grid cells.

[0015] BRIEF DESCRIPTION OF THE DRAWINGS Embodiments of the present disclosure will now be described, by way of non-limiting examples, with reference to the accompanying drawings, in which: [Brief description of the drawings]

[0016] [Figure 1] 1 is a cross-sectional schematic diagram of an example electrical package. [Diagram 2] 1 is a cross-sectional schematic diagram of an example of an electrical package and associated circuit board. [Diagram 3] FIG. 2 is a plan view of a second side of an example package. [Figure 4] FIG. 2 illustrates an exemplary interconnect member. [Diagram 5] 11A-11C illustrate additional exemplary interconnect members. [Figure 6] FIG. 2 is a plan view of a second side of an example package. [Figure 7] FIG. 2 is a plan view of a second side of an example package. [Figure 8]FIG. 2 is a plan view of a second side of an example package. [Figure 9] 1A-1D illustrate fabrication steps of an exemplary method for manufacturing an electrical package. [Figure 10] 1A-1D illustrate fabrication steps of an exemplary method for manufacturing an electrical package. [Figure 11] 1A-1D illustrate fabrication steps of an exemplary method for manufacturing an electrical package. [Figure 12] 1A-1D illustrate fabrication steps of an exemplary method for manufacturing an electrical package. [Figure 13] 1A-1D illustrate fabrication steps of an exemplary method for manufacturing an electrical package. [Figure 14] 1A-1D illustrate fabrication steps of an exemplary method for manufacturing an electrical package. [Figure 15] 11A-11C illustrate additional or alternative fabrication steps for a method of manufacturing an electrical package. [Figure 16] 11A-11C illustrate additional or alternative fabrication steps for a method of manufacturing an electrical package. [Figure 17] 11A-11C illustrate additional or alternative fabrication steps for a method of manufacturing an electrical package. [Figure 18] FIG. 2 is a schematic block diagram of a package module including a filter. [Figure 19] FIG. 2 is a schematic block diagram of a package module including a filter. [Figure 20A] 1 is a schematic block diagram of a wireless communication device including a filter. [Figure 20B] 1 is a schematic block diagram of a wireless communication device including a filter. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Detailed Description The following description of specific embodiments presents various descriptions of specific embodiments. However, the innovations described herein can be embodied in many different ways, for example, as defined and encompassed by the claims. In this description, reference is made to the drawings, in which like reference numbers may indicate identical or functionally similar elements. It will be understood that the elements depicted in the drawings are not necessarily drawn to scale. Furthermore, it will be understood that a particular embodiment can include more elements than are depicted in the drawings and / or a subset of the elements depicted in the drawings. Furthermore, some embodiments can incorporate any suitable combination of features from two or more drawings.

[0018] Aspects and embodiments described herein relate to an electrical package, preferably a double-sided electrical package, for coupling to a separate circuit board. The electrical package can be a double-sided molded electrical package, although in some embodiments other package types can be used. Aspects and embodiments described herein provide an alternative to the use of traditional array electrical connections (e.g., solder joints) to facilitate coupling of the electrical package to such a separate circuit board. The package can have different sized electrical connectors, some electrical connectors being larger than others. For example, larger electrical connectors can be used at or near corners or edges of the package, which can provide improved mechanical performance when the electrical package is subjected to shock forces (e.g., drops) experienced during validation testing (e.g., mechanical shock testing), during shipping, or during operational use of the package. In some embodiments, the larger electrical connector can also provide improved thermal properties (e.g., for dissipating heat). In some embodiments, the larger electrical connector can withstand more current and can be used for higher power signals. The larger electrical connector can have an elongated shape that can accommodate at least two of the smaller electrical connectors linearly interconnected.

[0019] FIG. 1 illustrates a cross-sectional schematic diagram of an example of an electrical package 100. The electrical package can have a substrate 102 (e.g., a packaging substrate), which can be in a generally planar form. The packaging substrate 102 can be, for example, a laminate substrate. The substrate 102 can have a first side 102a and a second side 102b, which can be opposite the first side 102a. One or more electrical components 104a-104d can be mounted on or above the first side 102a of the substrate 102. The one or more electrical components 104a-104d can include one or more dies (e.g., semiconductor dies), integrated circuits, filters, amplifiers (e.g., low noise, power), switches, memories, processors, transceivers, control circuits, other circuit components, or any other suitable electrical elements. The electrical components 104a-104d can be surface mounted on the substrate 102, although any suitable mounting technique can be used. In some cases, electrical components 104a-104d (e.g., die or integrated circuit 104a) may be electrically coupled to pads on substrate 102 by interconnect members (not shown in FIG. 1). Solder joints (e.g., solder balls) may be used to attach the components to substrate 102, although wire bonds, or any other suitable connectors, may also be used.

[0020] A first mold structure or material 106 can extend across at least a portion of the first surface 102a of the substrate 102. The first mold structure 106 can include (e.g., be formed from) an epoxy material, although any suitable mold material can be used. The first mold structure 106 can completely or partially surround the surface of the one or more electrical components 104a-104d. The first mold structure 106 can extend partially or completely over the one or more electrical components 104a-104d. The one or more electrical components 104a-104d can be completely or partially encapsulated below an outer surface of the first mold structure 106. In some implementations, an upper portion of one or more of the electrical components 104a-104d can be flush with the outer surface of the first mold structure 106 or can extend beyond the outer surface of the first mold structure 106. One or more electrical components 104a-104d may be exposed as the case may be, or may be covered by a first mold structure 106.

[0021] At least one electrical component 108 may be mounted on or above the second side 102b of the substrate 102. The package 100 may be a double-sided package. The electrical component 108 may include at least one die or integrated circuit, but one or more filters, amplifiers, switches, memory elements, processors, transceivers, control circuits, or any suitable electrical component 108 may be used. Although FIG. 1 shows a single component 108, in some implementations, multiple components 108 may be mounted on the second side 102b of the substrate 102. In some implementations, the package 100 may include circuitry to facilitate transmission and / or reception of radio frequency (RF) signals. In some embodiments, the at least one electrical component 108 may include a flip chip. The electrical component 108 may be coupled to the substrate 102 (e.g., electrically connected to a pad on the substrate) by an interconnect member 109 (e.g., solder ball, solder joint, metal connection post, pin). Wire bonds or other suitable electrical connections may be used. The electrical components 108 may be surface mounted on the substrate 102, although any suitable mounting technique may be used.

[0022] A second mold structure or material 110 can extend across at least a portion of the second side 102b of the substrate 102. The second mold structure 110 can include (e.g., be formed from) an epoxy material, although any suitable mold material can be used. The second mold structure 110 can completely or partially surround a side of the at least one electrical component 108. The second mold structure 110 can extend partially or entirely across the at least one electrical component 108. The at least one electrical component 108 can be completely or partially encapsulated below an outer surface of the second mold structure 110. In some implementations, an upper portion of the at least one electrical component 108 can be flush with the outer surface of the second mold structure 110 or can extend beyond the outer surface of the second mold structure 110. The at least one electrical component 108 can be exposed or covered by the second mold structure 110 as the case may be.

[0023] Either or both of the mold structures 106 and 110 can be configured to facilitate radio frequency shielding of at least some of the electrical components 104a-104d and 108. In some cases, additional shielding components or layers can be used. The package 100 can be a shielded package. Either or both of the first mold structure 106 and the second mold structure 110 can help protect the electrical components (104a-d and 108) attached to the substrate 102 from shock loads (e.g., drops) encountered during validation testing, shipping or operational use. The shock loads can be dissipated throughout the first mold structure 106 and / or the second mold structure 110, thereby helping to reduce the forces experienced by the electrical components 104a-d, 108.

[0024] In some implementations, either or both of the mold structures 106 and 110 may be omitted. The package may be a double-sided ball grid array package, although any suitable configuration may be used. In some embodiments, at least one electrical component 108 on the second side 102b of the substrate 102 may be omitted. In some cases, a single-sided package may be used.

[0025] The package 100 may include a plurality of interconnect members 112 on or above the second surface 102b of the substrate 102. The interconnect members 112 may be solder balls, solder joints, metal connection posts, conductive pins, or any other suitable conductive elements. The interconnect members 112 may be arranged in an array or grid. The interconnect members 112 may be generally ball-shaped, or may be formed as generally cylindrical, or may have any other suitable shape. The interconnect members 112 may be made of any suitable conductive material, such as solder, copper, aluminum, silver, gold, or the like. The interconnect members 112 may extend through the second mold structure 110. The interconnect members 112 may protrude beyond the outer surface of the mold structure 110. However, in other embodiments, the interconnect members 112 may be substantially flush with the outer surface of the second mold structure 110. The interconnect members may be electrically connected to pads or other contacts on the substrate 102, which may be coupled to the electrical components 104a-d, 108. By way of example, the substrate 102 may be a printed circuit board (PCB) and may have electrical paths for delivering power and / or signals between the electrical components 104a-d, 108 and the interconnect members 112.

[0026] The package 100 may include interconnect members 112 of different sizes and shapes. Two types of interconnect members 112a and 112b are shown in FIG. 1. The packager 110 may include a first interconnect member 112a and a second interconnect member 112b, which may be larger than the first interconnect member 112a. As discussed herein, the larger interconnect member 112b may provide improved mechanical reliability, such as during mechanical shock testing (e.g., drop testing) or during use.

[0027] 2 illustrates a cross-sectional schematic diagram of an exemplary system 200 including an exemplary package 100 facing a circuit board 202 (e.g., phone board, motherboard) to which the package 100 is attached. The circuit board 202 may itself form part of an electronic device, such as a wireless device. By way of example, the wireless device may take the form of a mobile phone, a tablet computer, a smart watch, a laptop computer, etc. The circuit board 202 may have one or more pads 204 disposed thereon (e.g., attached thereto, formed thereon). The pads 204 may be made of a metal or another suitable material that provides electrical and / or thermal conductivity between the interconnect member 112 and the circuit board 202.

[0028] Package 100 is attached to circuit board 202 via connections between interconnect members 112 and pads 204. For example, at least a portion of interconnect members 112 can be deposited / melted onto pads 204 (e.g., by applying heat to interconnect members 112 and causing the interconnect members to reflow). Power and / or signals can be transmitted between package 100 (e.g., electrical components 104a-104d and 108) and circuit board 202 (e.g., other electrical components or packages attached to circuit board 202) through pads 204, through interconnect members 112, and through conductive paths within package substrate 102 (e.g., PCB). The package 100 can be attached to the circuit board 202 such that the bottom surface of the second mold structure 110 is spaced (e.g., by a gap) from the surface of the circuit board 202, thereby reducing (e.g., preventing) damage to the electrical component 108 due to displacement of the package 100 relative to the circuit board 204 (e.g., due to bending or dropping the circuit board 202 to which the package 100 is attached, or dropping an electronic device, such as a smartphone, incorporating the circuit board 204 and package 100).

[0029] In some embodiments, the pads 204 can have a substantially uniform size (e.g., width or diameter) 208, which can be substantially equal to (e.g., match) the size (e.g., width or diameter) of the first or smaller interconnect member 112a (e.g., at the widest portion, if ball-shaped). The first or smaller interconnect member 112a can be aligned with a corresponding pad 204. In some embodiments, the second or larger interconnect member 112b can be aligned with, cover, and / or connect to two of the pads 204 (as shown on the left side of FIG. 2). In some embodiments, the circuit board 202 can have a first pad 204a that can be aligned with the first interconnect member 112a and a second pad 204b that can be larger than the first pad 204a and can be aligned with the second larger interconnect member 112b (as shown on the right side of FIG. 2). The circuit board 202 can have elongated pads 204b that can substantially match the shape of the elongated interconnect members 112b discussed herein. As an example, the first pad 204a can have a generally circular shape and width or diameter 208, and the second pad 204b can have an elongated shape that can substantially match the shape of the second interconnect member 112b, as discussed herein. The second pad 204b can have a width 208 that is substantially the same as the first pad 204a, and a length 210 that is longer than the width 208 of the first pad 204a. In some embodiments, every elongated interconnect member 112b can be interfaced with a corresponding elongated pad 204b. The two pads 204a on the left side of FIG. 2 can be replaced with elongated pads 204b that can have substantially the same footprint as the second interconnect member 112b.

[0030] 3 illustrates a bottom view of an exemplary package 100 that may be similar to the package 100 of FIGS. 1 and 2. The package 100 may have a plurality of exposed interconnect members 112. The second mold structure 110 may be between the interconnect members 112. The interconnect members 112 may be generally arranged as a grid or array, and the package 100 may have one or more sparse regions 116 that do not have interconnect members 112. The one or more sparse regions 116 may have at least one electrical component 108 that is not visible in FIG. 3 because it is covered by the mold structure 110.

[0031] As mentioned above, the package 100 can have a plurality of first interconnect members 112a and one or more second interconnect members 112b, which can be larger than the first interconnect members 112a. The first interconnect members 112a can have a generally circular shape. The second interconnect members 112b can be elliptical. The second interconnect members 112b can have a generally capsule shape with semicircular ends joined by a generally rectangular bridge portion. The semicircular ends can have a shape and location corresponding to where the corresponding first interconnect members 112a enter into the grid. The end portions (e.g., semicircular ends) of the second interconnect members 112b can have substantially the same radius of curvature as the first or single interconnect members 112a. The second (e.g., double) interconnect members 112b can be the same size and shape as the two first interconnect members 112a joined by the bridge portion.

[0032] FIG. 4 shows one second interconnection member 112b and two first interconnection members 112a. The second interconnection member 112b can be a double interconnection member having the shape of two single interconnection members joined by a bridge portion. The first interconnection member 112a can have a width or diameter 118. The first interconnection member 112a (e.g., a single interconnection member) can be circular in shape, such that the length and width 118 are substantially identical. The first interconnection members 112a can have a uniform size (e.g., substantially the same width or diameter 118 as taken at the widest portion of a ball-shaped interconnection member). The first interconnection members 112a can be arranged in a grid or array. The first interconnection members 112a can be spaced apart by gaps having widths 120. The second interconnection member 112b can have an elongated shape with a length 124 that is greater than its width 122. The width 122 of the second interconnect member 112b can be substantially the same as the width 118 of the first interconnect member 112a. The length 124 of the dual interconnect member 112b can be substantially the same as the combined length 126 of two first interconnect members 112a (e.g., adjacent to each other in a grid or array). The length 124 of the dual interconnect member 112b can be substantially equal to the distance 126 from a first end of the first single interconnect member 112a to a second end of the second single interconnect member 112a, the second end being opposite the first end. The length 124 of the dual interconnect member 112b can be substantially equal to the width of the first single interconnect member 112a plus the width 120 of the gap between the interconnect members 112a plus the width of the second single interconnect member 112a. One or more second interconnect members 112b can be spaced apart from adjacent interconnect members 112a, 112b by a gap of substantially the same width 120 as the gap between adjacent single or first interconnect members 112a.

[0033] Various sizes of elongated interconnect members can be used, such as double, triple, quadruple interconnect members, etc. FIG. 5 shows an example of a triple interconnect member 112c and three single interconnect members 112a. The triple interconnect member 112c can have the shape of three single interconnect members arranged in a linear fashion and joined by bridge portions. The width 128 of the triple interconnect member 112c can be substantially the same as the width 118 of the single interconnect member 112a. The length 130 of the triple interconnect member 112c can be substantially the same as the combined length 132 of the three single interconnect members 112a (e.g., arranged in a linear fashion). 5, the length 130 of the triple interconnect member 112c can be substantially equal to a distance 132 from a first end of the first single interconnect member 112a to a second end of the third single interconnect member 112a, where the second end is opposite the first end and the second single interconnect member 112a is between the first single interconnect member and the third single interconnect member. The length 130 of the triple interconnect member 112c can be substantially equal to a width of the first single interconnect member 112a plus a width 120 of the first gap between the interconnect members 112a plus a width of the second single interconnect member 112a plus a width 120 of the second gap between the interconnect members 112a plus a width of the third single interconnect member 112a. A variety of longer elongated interconnect members can be used that can have a length L substantially defined by the formula L=n·W+(n-1)·G, where n is a positive integer, W is the width of a single interconnect member (and / or elongated interconnect member), and G is the width of the gap between adjacent interconnect members. The length 124 of the second interconnect member 112b can be at least two times, at least three times, at least four times, at least five times, at least six times, or any value or range therebetween, that is the width or diameter 118 of the first interconnect member 112a.

[0034] When package 100 is subjected to mechanical shock testing, stress applied to interconnect members 112 may increase with distance from the center of package 100. Thus, interconnect members 112 at the corners of package 100 may experience higher levels of stress from mechanical shock testing and therefore are more likely to fail (e.g., exhibit cracks within interconnect members 112, between interconnect members 112 and pads 204, and / or between interconnect members 112 and pads or other connection points on substrate 102) compared to interconnect members 112 closer to the center of package 100. With reference to FIG. 3, corner interconnect members 112 (e.g., solder joints) experience greater stress during mechanical shock testing than interconnect members 112 in central regions of the package. The rate of failure of a package such as package 100 from mechanical shock testing or other shocks can be significantly reduced by increasing the mechanical strength of at least some (e.g., some, but not all) of the interconnect members and / or connections to the interconnect members. Thus, some embodiments may use second or elongated interconnect members 112b for portions of the package 100 that experience more stress upon dropping. For example, the interconnect members at the corners of the package 100 may use second or elongated interconnect members 112b. In some embodiments, the interconnect members furthest from the center of the package 100 may use second or elongated interconnect members 112b. In FIG. 3, the dashed line indicates the distance from the center of the package 100 to the interconnect member at the top right corner of the package. In some embodiments, connectors that are further from the center of the package 100 than a threshold distance may use second or elongated interconnect members 112b. For example, in FIG. 3, an additional dual interconnect member 112b is used adjacent to the interconnect member 112b at the corner. The additional elongated interconnect member 112b may be used at or near the corner region of the package 100, such as when a lower threshold distance from the center of the package 100 is used. As shown, the substrate 102 may have a generally rectangular shape having four corners in a plan view.Other suitable shapes may be used, such as other polygons with corners.

[0035] FIG. 6 illustrates another example of a second side (e.g., bottom side) of a package 100 that can have similar features to other packages 100 disclosed herein. The package 100 can include a plurality of single interconnect members 112a that can be arranged in a grid or array. The package 100 can include one or more double interconnect members 112b. The package 100 can include one or more triple interconnect members 112b. The package 100 can include one or more quadruple interconnect members 112b. Longer interconnect members can be used, such as five, six, seven, eight, or corresponding to the size of the single interconnect members 112a arranged in a more linear fashion. The embodiment of FIG. 6 can include more long interconnect members in the corner regions compared to the embodiment of FIG. 5. For example, the embodiment of FIG. 6 can be the result of applying a smaller threshold distance from the center of the package 100 to determine where to apply the long interconnect members 112b-112d. In some cases, larger package sizes may use more elongated interconnect members 112b-112d, such as reaching further inward from the corners.

[0036] In some embodiments, the location of the sparse regions 116 can affect the placement or use of the elongated interconnect members 112b-112d. For example, a sparse region 116 near a corner can make that corner more susceptible to breakage in the event of a drop. Conversely, a corner region without a sparse region 116 nearby can have more interconnect members 112, which can improve impact energy distribution and reduce the likelihood of breakage at that corner. The elongated interconnect members 112b-112d (or more of them) can be used in one or more corners or regions on the package near the sparse regions 116. In Figures 3 and 6, the elongated interconnect members 112b-112d are used in all four corners. In some embodiments, the elongated interconnect members 112b-112d can be used only in the top left corner, which is the corner closest to the sparse region 116 in Figures 3 and 6. In some cases, elongated interconnect members 112b-112d may be used in all corners except the bottom right corner of Figures 3 and 6, which may be furthest from the sparse region 116. Different distributions of elongated interconnect members 112b-112d may be used to suit different packages 100.

[0037] In some embodiments, the long interconnect members 112b can be used at locations away from the corners of the package 100. For example, in some cases, the long interconnect members 112b can be used for higher power signals or more current than the single or circular interconnect members 112a. Also, in some cases, the long interconnect members 112b can be used for thermal properties, such as heat dissipation, which can be applied to any suitable location on the package 100. The package 100 can have the long interconnect members 112b, with one or more single or circular interconnect members 112a disposed between the long interconnect members 112b and the interconnect members at the corners of the package. In the example of FIG. 6, a first inner long interconnect member 112b is disposed near the bottom of the sparse region 116 and a second inner long interconnect member 112b is disposed near the right side of the sparse region 116. Either or both of these elongate interconnect members 112b may be used to transmit relatively high power signals to and from the package 100, such as to and from at least one electrical component 108. Alternatively or additionally, either or both of these elongate interconnect members 112b may be used to increase heat dissipation (e.g., from at least one electrical component 108, 104a-104d).

[0038] The interconnect members 112 may be arranged as a grid or two-dimensional array having multiple grid locations or cells. First or single interconnect members 112a may each occupy one grid cell or one array location. Second or elongated interconnect members 112b-112d may each occupy two or more grid cells or array locations, such as arranged in a line. For example, double interconnect member 112b may cover two adjacent grid cells or array locations, triple interconnect member 112c may cover three grid cells or array locations (e.g., arranged along a line), etc.

[0039] When multiple array locations are covered by a single interconnect member, the array locations have a shared signal. In some cases, adjacent grid locations can be associated with different signals (e.g., one for ground and the other for an input voltage), resulting in the elongated interconnect member not matching with the adjacent grid locations. In some embodiments, multiple grid locations associated with the elongated interconnect members 112b-112d can carry redundant signals (e.g., redundant grounds). For example, a first electrical path (e.g., through the substrate 102) can couple the first grid location to a contact (e.g., a pin or pad) on the electrical component 104a-104d, 108 configured to receive or output a particular type of signal (e.g., ground, or power input, or a particular control signal). A second electrical path (e.g., also through the substrate 102) may also couple the second grid location to a contact (e.g., a pin or pad) on an electrical component 104a-104d, 108 (the same component or a different component) configured to receive or output the same particular type of signal (e.g., ground, or power input, or a particular control signal). The elongated interconnect member 112b-112d may provide the same signal to both grid locations. Pads 204 on the circuit substrate 200 associated with multiple grid locations covered by the elongated interconnect members 112b-112d may be configured to provide or receive the same signal (e.g., ground, or power input, or a particular control signal).

[0040] The elongated interconnect members 112b-d can be used in a variety of package types. The package 100 can be a double-sided molded package, as described herein. In some implementations, the package 100 can be a double-sided ball grid array package. As shown in FIG. 7, in some implementations, the second mold structure 100 can be omitted. The electrical components 108a-c on the second side 102b of the substrate 102 can be exposed or not covered by mold material. In some cases, the electrical components 108a-c can have caps or shields (e.g., individually). In some implementations, the package 100 can have a single-sided package, and the electrical components 108 on the second side 102b of the substrate 102 can be omitted, for example, as shown in FIG. 8.

[0041] 9-14 show exemplary fabrication steps for use in manufacturing a package such as package 100. FIG. 9 shows that electrical components 104a-104d are attached to a first side 102a of a substrate 102. The electrical components 104a-104d can be attached by an array of solder joints or other interconnect members (not shown) or by any suitable means of surface mount technology such as wire bonding. FIG. 10 shows that a first mold structure 106 can be applied over the first side 102a of the substrate 102, such as to encapsulate the electrical components 104a-104d under the outer surface of the first mold structure or layer 106. In some embodiments, the steps shown in FIGS. 9 and 10 may be performed after the fabrication steps shown in FIGS. 11-14. In some embodiments, the steps of FIGS. 9 and 10 may be performed by a different fabrication process to provide a suitable panel already including electrical components 104a-104d and first mold structure 106.

[0042] FIG. 11 illustrates that portions of conductive material are formed on the second surface 102b of the substrate 102 to provide at least a portion of the interconnect member 112. The portions of conductive material can be formed in locations that form a grid or array. The grid or array can have sparse regions that are devoid of portions of conductive material, such as to provide space for at least one electrical component 108. Some of the portions of conductive material can be formed in or covering a single grid location (e.g., to form a single or circular interconnect member 112a). Some of the portions of conductive material can be formed in or covering a plurality of grid locations that can be linearly arranged (e.g., to form elongated interconnect members 112b-112d). The portions of conductive material can be formed as pillars, which can have a generally circular cross-sectional shape for the single interconnect member 112a and a generally capsule-shaped cross-sectional shape for the elongated interconnect members 112b-112d. In some cases, the portions of conductive material can be formed as balls (e.g., solder balls). The portions of conductive material can be substantially ball-shaped. A single solder ball may be used for the single interconnect member 112a. A variety of suitable solder joint configurations may be used. Solder lines, which may be substantially encapsulated, may be formed to provide the elongated interconnect members 112b-112d. The second surface 102b of the substrate 102 may have pads or other electrical contacts. The portions of conductive material may be formed over or in contact with the pads. The portions of conductive material associated with the single interconnect member 112a may be formed over or in contact with a single pad. The portions of conductive material associated with the elongated interconnect members 112b-112d may be formed over or in contact with multiple pads (e.g., arranged in a linear fashion). In some cases, the pads on the substrate 102 may have different shapes to accommodate different types of interconnect members 112, with some elongated pads covering multiple grid locations.The elongated interconnect members 112b-112d can be formed by printing solder paste onto elongated substrate pads and then placing multiple solder balls within the solder paste (e.g., in a linear arrangement). The multiple solder balls can be reflowed, which can result in the multiple solder balls being interlocked together. After reflow, the solder balls and paste can form the elongated interconnect members 112b-112d. The elongated interconnect members 112b-112d can be overmolded and exposed by downstream processes.

[0043] 11 also shows that at least one electrical component 108 is attached to the second side 102b of the substrate 102. The electrical component 108 may be attached by an array of solder joints or other interconnect members 109, or by any suitable means of surface mount technology, such as wire bonding. In some implementations, the electrical component 108 may be a flip chip.

[0044] 12 shows that a second mold structure 110 can be applied over the second side 102b of the substrate 102, such as to encapsulate the electrical component 108 under an outer surface of the second mold structure or layer 110. Portions of the conductive material can be covered by the second mold structure. The second mold material can fill gaps between portions of the conductive material.

[0045] 13 illustrates that a portion of the second mold structure 110 can be removed (e.g., by ablation or grinding) to expose the portion of conductive material. In some cases, grinding can be used to progressively remove a thin layer of the second mold structure 110. In some cases, a thin layer of the portion of conductive material can be removed by the grinding process. Once the grinding step is complete, the exterior surface of the second mold structure 110 can be substantially flush with the ends of the portion of conductive material.

[0046] FIG. 14 illustrates that additional conductive material can be added to the ends of the portions of conductive material to form the interconnect member 112. The additional conductive material can be solder or any other suitable material. The additional conductive material can be the same material as the conductive material (e.g., solder) formed in FIG. 11 or a different conductive material. In some embodiments, the base conductive material formed in FIG. 11 can have a higher melting temperature than the additional conductive material. The additional conductive material (e.g., solder) can have a lower melting temperature than the base conductive material (e.g., copper, nickel, gold, or silver). The additional conductive material can protrude beyond the outer surface of the second mold structure 110. The additional conductive material can facilitate subsequent bonding of the package to a circuit board. The additional conductive material can be reflowed, for example, to melt onto a pad on the circuit board. In some embodiments, the additional conductive material formed in FIG. 14 can be omitted and the package of FIG. 13 can be used as a completed package. In some cases, a group of multiple packages can be formed together into a strip or array. The individual packages can be separated, such as after fabrication.

[0047] Many variations are possible. In some embodiments, no additional conductive material is added in FIG. 14, but previously formed conductive material may be reflowed to reshape the conductive material to form the interconnect member 112. In some implementations, the reflow may reshape the conductive material such that a portion protrudes past the exterior surface of the second mold structure 110. In some implementations, the reflow may form a gap between the interconnect member 112 and the second mold structure 110. A grinding or other removal process may remove a portion of the conductive material (e.g., a solder joint) such that the conductive material is no longer generally spherical, and the reflow may reshape the conductive material into a new, smaller generally spherical shape that may provide a gap between the conductive material and the second mold structure 110.

[0048] In some embodiments, the grinding step of FIG. 13 can be omitted. FIG. 15 illustrates that a portion of the second mold structure 110 can be removed (e.g., by laser ablation) to form wells in the second mold structure 110 at the location of each of the interconnect members 112. The conductive material can be exposed by and recessed into the wells, for example, such that an end face is visible when looking into the well. Laser ablation or a similar process can be used to locally remove material of the second mold structure 110 to form each well, thereby exposing the conductive material. In some embodiments, the device of FIG. 15 can be used as a completed package.

[0049] FIG. 16 illustrates that additional conductive material can be added to the ends of the portions of conductive material to form the interconnect member 112. The additional conductive material can be solder or any other suitable material. The additional conductive material can be the same material as the conductive material (e.g., solder) formed in FIG. 11 or a different conductive material. In some embodiments, the base conductive material formed in FIG. 11 can have a higher melting temperature than the additional conductive material. The additional conductive material (e.g., solder) can have a lower melting temperature than the base conductive material (e.g., copper, nickel, gold, or silver). The additional conductive material can protrude beyond the outer surface of the second mold structure 110. In some cases, the additional conductive material can be substantially flush with the outer surface of the second mold structure 110. The additional conductive material can facilitate subsequent bonding of the package to a circuit board. The additional conductive material can be reflowed, for example, to melt onto a pad on the circuit board.

[0050] 17, in some embodiments, laser ablation or a similar process may be performed to locally remove mold material near each array of interconnect members 112 (e.g., solder joints) to define a moat or channel 136 surrounding each of the interconnect members 112. The laser ablation step of FIG. 15 may optionally remove mold material laterally past the ends of the conductive material to form the moat or channel 136. In some implementations, laser ablation may be performed to form the moat or channel 136 after the additional conductive material is formed in FIG. 16. In some embodiments, the moat or channel 136 may be omitted.

[0051] FIG. 18 is a schematic block diagram of a module 300 including a filter 392 that may have an acoustic wave device. The module 300 includes a filter 392 that includes an acoustic wave device, a switch 394, a power amplifier 395, and a radio frequency (RF) coupler 396. The power amplifier 395 may amplify a radio frequency signal. The switch 394 may selectively electrically couple an output of the power amplifier 395 to the filter 392. The filter 392 may be a bandpass filter. The filter 392 may be included in a duplexer or other multiplexer. The RF coupler 396 may be a directional coupler or any other suitable RF coupler. The RF coupler 396 may sample a portion of the RF power in the transmit signal path and provide an indication of the RF power. The RF coupler 396 may be coupled to the transmit signal path at any suitable point, such as between the output of the power amplifier 395 and the input to the switch 394. The module 300 may include a package surrounding the illustrated elements, for example, as disclosed in connection with various embodiments described herein. The filter 392 having acoustic wave resonators may be disposed on a common packaging substrate 397 with the other illustrated elements of the module 300. The packaging substrate 397 may be, for example, a laminate substrate.

[0052] 19 is a schematic block diagram of a module 350 including a filter 302 including one or more acoustic wave devices. As shown, the module 350 includes a power amplifier 395, a switch 394, a filter 302, an antenna switch 304, a switch 305, a low noise amplifier 306, and a control circuit 307.

[0053] The power amplifier 395 can receive a radio frequency signal from the transmit port TX. In some cases, a switch can electrically connect a selected one of the multiple transmit ports to the input of the power amplifier 395. The power amplifier 395 can operate in an envelope tracking mode and / or an average power tracking mode. The switch 394 can be a multi-throw radio frequency switch configured to electrically connect the output of the power amplifier 395 to one or more selected transmit filters of the filter 302. The switch 394 can be a band select switch configured to electrically connect the output of the power amplifier 395 to a transmit filter of a particular frequency band.

[0054] The filter 302 may be an acoustic wave filter. One or more resonators in any of the filters 302 may include multi-layer IDT electrodes. In certain applications, all acoustic resonators of one or more filters of the filter 302 include multi-layer IDT electrodes. The filter 302 may include multiple duplexers and / or other multiplexers. Alternatively or additionally, the filter 302 may include one or more standalone transmit filters and / or one or more standalone receive filters. The filter 302 may include at least four duplexers in some applications. According to some other applications, the filter 302 may include at least eight duplexers.

[0055] As shown, the filter 302 is electrically connected to an antenna switch 304. The antenna switch 304 can be a multi-throw radio frequency switch configured to electrically connect one or more of the filters 302 to an antenna port ANT of the module 350. In some applications, the antenna switch 304 can include at least 8 throws. In certain applications, the antenna switch 304 can include at least 10 throws.

[0056] The switch 305 can electrically connect a selected one of the filters to the low noise amplifier 306. The low noise amplifier 106 is configured to amplify the received radio frequency signal and provide an output to a receive port RX. Optionally, another switch can be electrically coupled between the low noise amplifier 306 and the receive port RX.

[0057] The illustrated module 350 also includes control circuitry 307. The control circuitry 307 may perform any suitable control functions for the module 350. The module 350 may include packaging that encloses the illustrated elements, for example, as disclosed in connection with various embodiments described herein.

[0058] 20A is a schematic block diagram of a wireless communication device 410 including a filter 413 having an acoustic wave device. The wireless communication device 410 may be any suitable wireless communication device. For example, the wireless communication device 410 may be a mobile phone, such as a smartphone. As shown, the wireless communication device 410 includes an antenna 411, an RF front end 412, an RF transceiver 414, a processor 415, a memory 416, and a user interface 417. The antenna 411 may transmit RF signals provided by the RF front end 412. The antenna 411 may provide received RF signals to the RF front end 412 for processing.

[0059] The RF front end 412 may include one or more power amplifiers, one or more low noise amplifiers, one or more RF switches, one or more receive filters, one or more transmit filters, one or more duplexing filters, one or more filters in a multiplexer, one or more filters in a diplexer or other frequency multiplexing circuit, or any suitable combination thereof. The RF front end 412 may transmit and receive RF signals associated with any suitable communications standard.

[0060] The RF transceiver 414 may provide RF signals to the RF front end 412 for amplification and / or other processing. The RF transceiver 414 may also process RF signals provided by a low noise amplifier of the RF front end 412. The RF transceiver 414 is in communication with the processor 415. The processor 415 may be a baseband processor. The processor 415 may provide any suitable baseband processing functionality for the wireless communication device 410. The memory 416 may be accessed by the processor 415. The memory 416 may store any suitable data for the wireless communication device 410. The processor 415 is also in communication with a user interface 417. The user interface 417 may be any suitable user interface, such as a display.

[0061] FIG. 20B is a schematic block diagram of a wireless communication device 420 including a radio frequency front end 412 having a filter 413 and a diversity receive module 422 having a filter 423, according to one embodiment. The wireless communication device 420 is similar to the wireless communication device 410 of FIG. 12A, except that the wireless communication device 420 also includes a diversity receive function. As illustrated in FIG. 20B, the wireless communication device 420 includes a diversity antenna 421, a diversity module 422 configured to process signals received by the diversity antenna 421 and including a filter 423, and a transceiver 424 in communication with both the radio frequency front end 422 and the diversity receive module 422. The filter 423 may include one or more acoustic wave resonators having any suitable interdigitated transducer (IDT). The filter 423 may include one or more acoustic wave resonators having any suitable IDT electrode. The wireless communication devices 410 and 420 may include packages according to various embodiments disclosed herein.

[0062] Any of the embodiments described above may be implemented in association with a mobile device, such as a cellular handset. The principles and advantages of the embodiments may be used in any system or apparatus, such as any uplink wireless communication device, that may benefit from any of the embodiments described herein. The teachings herein are applicable to a variety of systems. While the present disclosure includes several exemplary embodiments, the teachings described herein may be applied to a variety of structures. Any of the principles and advantages discussed herein may be implemented in association with an RF circuit configured to process signals within a frequency range of about 30 kilohertz (kHz) to 300 gigahertz (GHz), such as a frequency range of about 450 MHz to 8.5 GHz. The acoustic wave resonator may be included in a filter configured to filter radio frequency signals in a fifth generation (5G) new radio (NR) operating band within Frequency Range 1 (FR1). A filter configured to filter radio frequency signals in a 5G NR operating band may include one or more acoustic wave resonators. FR1 may be, for example, 410 MHz to 7.125 GHz, as specified in the current 5G NR specification. A filter configured to filter radio frequency signals within a fourth generation (4G) long term evolution (LTE) operating band may include one or more acoustic wave resonators.

[0063] Aspects of the present disclosure can be implemented in various electronic devices. Examples of electronic devices can include, but are not limited to, consumer electronic products, components of consumer electronic products such as packaged radio frequency modules, uplink wireless communication devices, wireless communication infrastructure, electronic test equipment, and the like. Examples of electronic devices can include, but are not limited to, mobile phones such as smartphones, wearable computing devices such as smart watches or earpieces, telephones, televisions, computer monitors, computers, modems, handheld computers, laptop computers, tablet computers, microwave ovens, refrigerators, vehicle electronics systems such as automotive electronics systems, stereo systems, digital music players, radios, cameras such as digital cameras, portable memory chips, washing machines, dryers, washer-dryers, copiers, facsimile machines, scanners, multifunction peripherals, watches, clocks, and the like. Electronic devices can also include unfinished products.

[0064] Unless the context clearly requires otherwise, throughout this specification and the claims, words such as "comprise," "comprising," "include," "including," and the like, are to be interpreted in an inclusive sense, such as "including, but not limited to," as opposed to an exclusive or exhaustive sense. The term "coupled," as generally used herein, refers to two or more elements that may be directly connected or connected by one or more intermediate elements. Similarly, the term "connected," as generally used herein, refers to two or more elements that may be directly connected or connected by one or more intermediate elements. Furthermore, the words "herein," "above," "below," and words of similar import, when used in this application, shall refer to this application as a whole and not to any particular portions of this application. Where the context permits, words in the above detailed description using the singular or plural number may also include the plural or singular number, respectively. The word "or" in connection with a list of two or more items covers all of the following interpretations of that word: any of the items in the list, all of the items in the list, and any combination of the items in the list.

[0065] Additionally, conditional language used herein, such as "can," "could," "may," "for example," "etc.," and the like, unless specifically stated otherwise or understood otherwise within the context in which it is used, is generally intended to convey that certain embodiments include certain features, elements, and / or conditions, while other embodiments do not. Thus, such conditional language is generally not intended to imply that the features, elements, and / or conditions are in any way required for one or more embodiments.

[0066] Although specific embodiments have been described, these embodiments are presented as examples only and are not intended to limit the scope of the present disclosure. Indeed, the novel apparatus, method and system described herein may be embodied in a variety of other forms. Furthermore, various omissions, substitutions and modifications of the forms of the methods and systems described herein may be made without departing from the spirit of the present disclosure. Any suitable combination of elements and operations of the various embodiments described above may be combined to provide further embodiments. The appended claims and their equivalents are intended to cover such forms or modifications as fall within the scope and spirit of the present disclosure.

Claims

1. 1. An electrical package comprising: a substrate having a first surface and a second surface opposite the first surface; one or more electrical components attached to the substrate; a plurality of conductive interconnect members coupled to the second surface of the substrate, the plurality of conductive interconnect members including at least one of the interconnect members having an elongated shape having a length greater than a width; An electrical package comprising:

2. 10. The electrical package of claim 1, wherein the one or more electrical components are attached to the first side of the substrate and having one or more additional electrical components attached to the second side of the substrate.

3. The electrical package of claim 2 further comprising a mold structure extending across at least a portion of said second surface of said substrate and at least partially surrounding said one or more additional electrical components.

4. The electrical package of claim 3 further comprising a mold structure extending across at least a portion of said first surface of said substrate and at least partially surrounding said one or more electrical components.

5. 2. The electrical package of claim 1, wherein the substrate has a generally rectangular shape having four corners in a plan view, and the interconnect member having the elongated shape is positioned at or adjacent to one of the corners.

6. 6. The electrical package of claim 5, wherein another of said interconnect members has a generally circular shape in plan and is disposed inwardly from one of said corners.

7. 2. The electrical package of claim 1, wherein said substrate has a corner, and said interconnect member nearest said corner has said elongated shape.

8. 2. The electrical package of claim 1 , wherein a plurality of said interconnect members have a generally circular shape with a substantially uniform diameter in a plan view, and wherein at least one of said interconnect members having said elongated shape has a width substantially equal to the diameter of said circular interconnect member and a length that is at least twice the diameter of said circular interconnect member.

9. 2. The electrical package of claim 1, wherein the interconnect member having the elongated shape is the interconnect member furthest from a center of the package.

10. 2. The electrical package of claim 1, wherein the at least one interconnect member having the elongated shape has a length L substantially equal to n·W+(n-1)·G, where n is a positive integer, W is a width of the interconnect member, and G is a distance between adjacent interconnect members.

11. 2. The electrical package of claim 1 , wherein the interconnect members are arranged in a grid, with each group of the interconnect members occupying a single grid cell, and the interconnect members having the elongated shape occupying at least two grid cells arranged in a linear fashion.

12. 10. The electrical package of claim 1, wherein said package is a double-sided molded package.

13. 1. An electrical package comprising: a substrate having a first surface and a second surface opposite the first surface; one or more electrical components attached to the substrate; a plurality of first conductive interconnect members coupled to the second surface of the substrate and having a substantially uniform width; at least one second conductive interconnect member having a width substantially the same as the substantially uniform width of the first interconnect member and a length equal to or greater than the combined length of two of the first interconnect members; An electrical package comprising:

14. 14. The electrical package of claim 13, wherein the one or more electrical components are attached to the first side of the substrate and having one or more additional electrical components attached to the second side of the substrate.

15. 15. The electrical package of claim 14, further comprising a mold structure extending across at least a portion of the second surface of the substrate and at least partially surrounding the one or more additional electrical components.

16. 16. The electrical package of claim 15, further comprising a mold structure extending across at least a portion of said first surface of said substrate and at least partially surrounding said one or more electrical components.

17. 14. The electrical package of claim 13, wherein the substrate has a generally rectangular shape in a plan view having four corners, and the at least one second interconnect member is positioned at or adjacent to at least one of the corners.

18. 14. The electrical package of claim 13, wherein the first interconnect member has a generally circular shape in a plan view.

19. 14. The electrical package of claim 13, wherein at least one of the second interconnect members is an interconnect member furthest from a center of the package.

20. 14. The electrical package of claim 13, wherein the at least one interconnect member having the elongated shape has a length L substantially equal to n·W+(n-1)·G, where n is a positive integer, W is the width of the first interconnect member, and G is the distance between adjacent first interconnect members.

21. 14. The electrical package of claim 13, wherein the interconnect members are arranged as a grid, with each of the first interconnect members occupying a single grid cell and each of the second interconnect members occupying at least two grid cells.

22. 14. The electrical package of claim 13, wherein the second interconnect member has the shape of two of the first interconnect members joined by a bridge portion.

23. 14. The electrical package of claim 13, wherein the second interconnect member has a generally capsule shape.

24. 14. The electrical package of claim 13, wherein the package is a double-sided molded package.

25. 1. An electrical package comprising: a substrate having a first surface and a second surface opposite the first surface; one or more electrical components attached to the substrate; a plurality of conductive interconnect members arranged in a two-dimensional array on the second surface of the substrate, the plurality of interconnect members each occupying one array location, and at least one of the interconnect members occupying at least two array locations; An electrical package comprising:

26. 26. The electrical package of claim 25, wherein the one or more electrical components are attached to the first side of the substrate and having one or more additional electrical components attached to the second side of the substrate.

27. 27. The electrical package of claim 26, further comprising a mold structure extending across at least a portion of said second surface of said substrate and at least partially surrounding said one or more additional electrical components.

28. 30. The electrical package of claim 27, further comprising a mold structure extending across at least a portion of said first surface of said substrate and at least partially surrounding said one or more electrical components.

29. 26. The electrical package of claim 25, wherein said package is a double-sided molded package.

30. 26. The electrical package of claim 25, wherein the interconnect member occupying one array location has a generally circular shape.

31. 26. The electrical package of claim 25, wherein the substrate has a generally rectangular shape having four corners in a plan view, and the at least one interconnect member occupying at least two array locations is positioned at or adjacent to at least one of the corners.

32. 26. The electrical package of claim 25, wherein the at least one interconnect member occupying at least two array locations is the interconnect member furthest from a center of the package.

33. 26. The electrical package of claim 25, wherein the at least one interconnect member occupying at least two array locations has a length L substantially equal to n·W+(n-1)·G, where n is a positive integer, W is the width of the interconnect member, and G is the distance between adjacent interconnect members.

34. 26. The electrical package of claim 25, wherein the second interconnect member has a generally capsule shape.

35. 1. An electrical package comprising: a substrate having a first surface, a second surface opposite the first surface, and at least one corner; one or more electrical components attached to the substrate; a plurality of conductive interconnect members coupled to the second surface of the substrate, the plurality of conductive interconnect members including at least one of the interconnect members closest to the corner having a size greater than an inner interconnect member located further inward from the corner; An electrical package comprising:

36. 36. The electrical package of claim 35, wherein the one or more electrical components are attached to the first side of the substrate and having one or more additional electrical components attached to the second side of the substrate.

37. 37. The electrical package of claim 36, further comprising a mold structure extending across at least a portion of said second surface of said substrate and at least partially surrounding said one or more additional electrical components.

38. 40. The electrical package of claim 37, further comprising a mold structure extending across at least a portion of said first surface of said substrate and at least partially surrounding said one or more electrical components.

39. 36. The electrical package of claim 35, wherein at least some of said inner interconnect members have a generally circular shape.

40. 36. The electrical package of claim 35, wherein the at least one interconnect member nearest the corner has a generally capsule shape.

41. 36. The electrical package of claim 35, wherein the interconnect members are arranged as a grid, with at least some of the inner interconnect members occupying a single grid cell and the interconnect members nearest the corners occupying at least two grid cells.

42. 1. An electrical package comprising: a substrate having a first surface and a second surface opposite the first surface; one or more electrical components attached to the substrate; a plurality of conductive interconnect members coupled to the second surface of the substrate, the plurality of conductive interconnect members including at least one of the interconnect members furthest from a center of the substrate and having a size larger than other of the interconnect members located closer to the center; An electrical package comprising:

43. 43. The electrical package of claim 42, wherein the one or more electrical components are attached to the first side of the substrate and having one or more additional electrical components attached to the second side of the substrate.

44. 44. The electrical package of claim 43, further comprising a mold structure extending across at least a portion of said second surface of said substrate and at least partially surrounding said one or more additional electrical components.

45. 45. The electrical package of claim 44, further comprising a mold structure extending across at least a portion of said first surface of said substrate and at least partially surrounding said one or more electrical components.

46. 43. The electrical package of claim 42 wherein at least some of said other said interconnect members have a generally circular shape.

47. 43. The electrical package of claim 42, wherein the at least one interconnect member furthest from the center has a generally capsule shape.

48. 43. The electrical package of claim 42 wherein the at least one interconnect member furthest from the center is located at or proximate to a corner of the package.

49. 43. The electrical package of claim 42, wherein the interconnect members are arranged as a grid, with at least some of the other interconnect members occupying a single grid cell and the interconnect member furthest from the center occupying at least two grid cells.

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