System and method for infrasound effect compensation based on haptic feedback, and storage medium

Abstract

The present invention provides a system and method for infrasonic acoustic compensation based on haptic feedback, and a storage medium. The infrasonic acoustic compensation system based on haptic feedback includes a response module for detecting a user's infrasonic acoustic compensation operation and outputting a control command when the infrasonic acoustic compensation operation is detected, a processing module for processing an audio signal to be played according to the control of the control command and obtaining an infrasonic signal from the audio signal, and a vibration module for generating a corresponding vibration according to the driving of the infrasonic signal. The present invention generates a virtual infrasonic acoustic compensation effect in the user's brain, which compensates for the shortcoming of the prior art that a large amount of low-frequency band below 100Hz is lost when a user listens to music or watches videos on a mobile phone, and greatly improves the user's audio and visual experience.

Description

[Technical field]

[0001] The present invention relates to the field of haptic feedback technology, and in particular to a system and method for compensating infrasonic acoustic effects based on haptic feedback, and a storage medium. [Background technology]

[0002] In the related art, the resonant frequency of a mobile phone's speaker (SPK) is usually about 500 Hz, and audio signals in the low-frequency band below 100 Hz cannot be fully reproduced by the SPK. When a user listens to music or watches videos through a mobile phone, a lot of the ultra-low frequency band below 100 Hz is lost, which greatly affects the user's audio and visual experience.

[0003] Therefore, it is necessary to design a method for reproducing low-frequency audio signals. Summary of the Invention [Problem to be solved by the invention]

[0004] In order to solve the problem of poor user audio and visual experience caused by the inability of SPK to reproduce low-frequency band audio signals in the related art, the present invention aims to provide an infrasonic acoustic effect compensation system and method, and a storage medium based on tactile feedback. [Means for solving the problem]

[0005] In order to solve the above technical problems, a first aspect of an embodiment of the present invention provides an infrasonic acoustic effect compensation system based on haptic feedback, including: a response module that detects a user's infrasonic acoustic effect compensation operation and outputs a control command when the infrasonic acoustic effect compensation operation is detected; a processing module that processes an audio signal to be played back based on the control of the control command and obtains an infrasonic signal from the audio signal; and a vibration module that generates corresponding vibrations based on the driving of the infrasonic acoustic effect compensation operation.

[0006] A second aspect of the embodiment of the present invention provides a method for infrasonic acoustic effect compensation based on haptic feedback, including: a response module detecting a user's infrasonic acoustic effect compensation operation, and outputting a control command when the infrasonic acoustic effect compensation operation is detected; a processing module processing an audio signal waiting to be played back based on the control of the control command, and obtaining an infrasonic signal from the audio signal; and a vibration module generating corresponding vibration based on driving the infrasonic acoustic effect compensation operation.

[0007] A third aspect of an embodiment of the present invention provides a computer readable storage medium having a computer program stored thereon, the computer program being adapted to execute the method for infrasound effect compensation according to the second aspect when invoked by a control and processor. Effect of the Invention

[0008] From the above description, in comparison with the prior art, the present invention has the following advantages.

[0009] The response module, the processing module and the vibration module jointly constitute an infrasonic acoustic compensation system based on haptic feedback. In practical application, the response module senses the user's infrasonic acoustic compensation operation, and outputs a control command when the infrasonic acoustic compensation operation is sensed. Then, the processing module processes the audio signal waiting to be played according to the control of the control command, and obtains an infrasonic signal from the audio signal. Finally, the vibration module generates a corresponding vibration according to the driving of the infrasonic signal. The generated vibration is transmitted to the user's brain through the user's body (such as the palm, cheek, etc.), and then generates a virtual infrasonic acoustic compensation effect, which compensates for the shortcoming of the prior art that a lot of low-frequency bands below 100Hz are lost when the user listens to music or watches videos on a mobile phone, and greatly improves the user's audio and visual experience. [Brief description of the drawings]

[0010] In order to more clearly describe the technical solutions in the related art or the embodiments of the present invention, the following briefly describes the accompanying drawings used in the description of the related art or the embodiments of the present invention. It is clear that the accompanying drawings in the following description are only a part of the embodiments of the present invention and are not all of them, and other drawings can be obtained without the creative efforts of those skilled in the art.

[0011] [Figure 1] This is the frequency response curve of the SPK of a mobile phone. [Diagram 2] FIG. 1 is a principle diagram of an infrasound effect compensation system according to an embodiment of the present invention; [Diagram 3] FIG. 1 is a first block diagram of an infrasonic acoustic effect compensation system according to an embodiment of the present invention. [Figure 4] FIG. 2 is a second type block diagram of an infrasound effect compensation system according to an embodiment of the present invention. [Diagram 5] FIG. 3 is a third block diagram of an infrasound effect compensation system according to an embodiment of the present invention. [Figure 6] FIG. 4 is a fourth type block diagram of an infrasound effect compensation system according to an embodiment of the present invention. [Figure 7] 2 is a flowchart of an infrasonic acoustic effect compensation method according to an embodiment of the present invention. [Figure 8] FIG. 1 is a block diagram of a computer-readable storage medium according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] In order to make the objectives, technical solutions and advantages of the present invention clearer and easier to understand, the present invention will be described clearly and in detail below with reference to the embodiments of the present application and the accompanying drawings. In the specification, the same or similar symbols indicate the same or similar components or components having the same or similar functions. The embodiments of the present invention described below are only intended to interpret the present invention and are not intended to limit the present invention. That is, it should be understood that all other embodiments obtained by those skilled in the art without creative labor based on the embodiments of the present invention are also within the scope of protection of the present application. Furthermore, the technical features related to the various embodiments of the present invention described below can be combined with each other as long as they do not cause contradictions between them.

[0013] FIG. 1 is a frequency response curve of a mobile phone SPK. The resonant frequency of the mobile phone SPK is usually about 500 Hz (as shown by the solid line in FIG. 1), and audio signals in the low frequency band below 100 Hz (as shown by the dashed line in FIG. 1) cannot be completely reproduced by the SPK. When a user listens to music or watches a video through a mobile phone, a lot of the infrasonic band below 100 Hz is lost, which greatly affects the user's audio and visual experience. Therefore, an embodiment of the present invention provides an infrasonic acoustic effect compensation system based on haptic feedback. The infrasonic acoustic effect compensation system compensates for the drawback of the prior art that a lot of the low frequency band below 100 Hz is lost when a user listens to music or watches a video on a mobile phone. The infrasonic acoustic effect compensation system will be described in detail below.

[0014] 2 is a principle diagram of an infrasonic acoustic compensation system according to an embodiment of the present invention. The infrasonic acoustic compensation system includes a response module 100, a processing module 200, and a vibration module 300. The response module 100 detects a user's infrasonic acoustic compensation operation, and outputs a control command when the infrasonic acoustic compensation operation is detected. The processing module 200 processes an audio signal to be played according to the control of the control command, thereby obtaining an infrasonic signal from the audio signal. The vibration module 300 generates a corresponding vibration according to the driving of the infrasonic signal.

[0015] It should be noted that in the embodiment of the present invention, the response module 100, the processing module 200 and the vibration module 300 jointly constitute an infrasonic acoustic compensation system based on haptic feedback. In practical application, the response module 100 senses the user's infrasonic acoustic compensation operation, and outputs a control command when the infrasonic acoustic compensation operation is sensed. Then, the processing module 200 processes the audio signal waiting to be played according to the control of the control command, and obtains an infrasonic signal from the audio signal. Finally, the vibration module 300 generates a corresponding vibration according to the driving of the infrasonic signal, and the generated vibration is transmitted to the user's brain through the user's body (e.g., palm, cheek, etc.), and then generates a virtual infrasonic enhancement effect, which compensates for the shortcoming of the prior art that a lot of low-frequency bands below 100Hz are lost when the user listens to music or watches videos on a mobile phone, and greatly improves the user's audio and visual experience.

[0016] In some embodiments, as shown in the block diagrams of the infrasonic sound effect compensation system in FIGS. 3 to 6, the response module 100 includes a mobile phone content interface 110 and a control command unit 120. The mobile phone content interface 110 can be understood as an interface displayed in a mobile phone screen, including but not limited to interfaces related to various video-type APPs and music-type APPs, and a infrasonic sound effect compensation switch 111 can be floatingly installed in the mobile phone content interface 110. When a user needs to obtain an infrasonic sound effect enhancement, the infrasonic sound effect compensation switch 111 can be used to turn on / off the infrasonic sound effect compensation function by touch operation, and thus adjust the compensation strength of the infrasonic sound effect. For example, the infrasonic sound effect compensation function can be turned on / off by clicking the infrasonic sound effect compensation switch 111, or the compensation strength of the infrasonic sound effect can be adjusted by sliding the infrasonic sound effect compensation switch 111. These touch operations of the user on the infrasonic acoustic effect compensation switch 111 are the infrasonic acoustic effect compensation operations, and after the user performs a touch operation on the infrasonic acoustic effect compensation switch 111 (after the user's infrasonic acoustic effect compensation operation is detected), the control command unit 120 generates a corresponding control command based on the touch operation and transmits the generated control command to the processing module 200. Furthermore, after receiving the control command from the control command unit 120, the processing module 200 obtains an infrasonic signal from the audio signal in a predetermined form based on the control of the control command, and transmits the obtained infrasonic signal to the vibration module 300, so that the vibration module 300 generates a corresponding vibration based on the driving of the infrasonic acoustic effect signal, and the generated vibration is transmitted to the user's brain via the user's body.

[0017] In some embodiments, as shown in the first type block diagram of the infrasonic acoustic effect compensation system in FIG. 3, the processing module 200 includes a processing chip 210 and a power amplifier (i.e., the infrasonic amplifier 220 in FIG. 3). The processing chip 210 is pre-installed with a low-pass filter 211, and performs low-pass filtering on the audio signal waiting to be played through the low-pass filter 211 based on the control of the control command, to obtain an infrasonic signal from the audio signal. The infrasonic amplifier 220 amplifies the infrasonic signal from the processing chip 210 and transmits it to the vibration module 300. In this embodiment, the cutoff frequency of the low-pass filter 211 is 100 Hz.

[0018] As an embodiment, as shown in the second type block diagram of the infrasonic acoustic compensation system in FIG. 4, the processing module 200 includes a processing chip 210 and a low-pass filter circuit 230. The processing chip 210 acquires an audio signal waiting to be reproduced based on the control of the control command. The low-pass filter circuit 230 performs low-pass filtering on the audio signal from the processing chip 210, acquires an infrasonic signal from the audio signal, and transmits the infrasonic signal to the vibration module 300. In this embodiment, the cutoff frequency of the low-pass filter circuit 230 is 100 Hz. Note that, in both this embodiment and the previous embodiment, the infrasonic signal is acquired by performing low-pass filtering on the audio signal, but the low-pass filtering in this embodiment is hardware circuit filtering, that is, a separate low-pass filter circuit 230 is provided outside the processing chip 210. This is different from the previous embodiment in which the low-pass filter 211 is integrated into the processing chip 210. In addition, in other embodiments, the low-pass filter circuit 230 may be integrated into the vibration module 300, but is not limited thereto.

[0019] As an embodiment, as shown in the third block diagram of the infrasonic acoustic effect compensation system in FIG. 5, the processing module 200 includes a pre-processing unit 240, a processing chip 210, and a power amplifier (i.e., the infrasonic amplifier 220 in FIG. 5). The pre-processing unit 240 identifies and extracts a preset type of target signal (e.g., a special beat signal such as a tapping sound) from an audio signal waiting to be played based on the control of the control command, and converts it into an infrasonic signal. The processing chip 210 obtains the infrasonic signal from the pre-processing unit 240. The infrasonic amplifier 220 amplifies the infrasonic signal from the processing chip 210 and transmits it to the vibration module 300. As described above, the present embodiment is different from the previous two embodiments, and in this embodiment, the infrasonic signal is not obtained by performing low-pass filtering on the audio signal, but is instead identified and extracted from the audio signal, and the extracted preset type of target signal is converted into an infrasonic signal, so that the infrasonic enhancement effect can be further enhanced.

[0020] As an embodiment, as shown in the fourth type block diagram of the infrasonic acoustic compensation system in FIG. 6, the infrasonic signal may be a mono signal or a two-channel signal. When the infrasonic signal is a two-channel signal, it includes a left infrasonic sub-signal and a right infrasonic sub-signal. In this case, the infrasonic amplifier 220 includes a left infrasonic amplifier 221 for amplifying the left infrasonic sub-signal and a right infrasonic amplifier 222 for amplifying the right infrasonic sub-signal. The vibration module 300 includes a left vibration unit 310 and a right vibration unit 320, where the left vibration unit 310 generates a corresponding vibration based on the driving of the left infrasonic sub-signal, and the right vibration unit 320 generates a corresponding vibration based on the driving of the right infrasonic sub-signal.

[0021] It should be noted that the above embodiment is merely a preferred embodiment of the present invention, and is not intended to be limiting. Those skilled in the art can flexibly set the embodiment of the present invention as necessary based on the embodiment of the present invention. As can be seen from the different block diagrams of the infrasonic acoustic compensation system shown in Figures 3 to 6, the embodiment of the present invention has the infrasonic enhancement and reproduction function, and also has normal stereo reproduction. All the solid arrows in Figures 3 to 6 represent the infrasonic enhancement channel, and all the dashed arrows represent the normal stereo channel. In the embodiment of the present invention, the description of the normal stereo is omitted.

[0022] 7 is a flow chart of an infrasonic acoustic compensation method according to an embodiment of the present invention. The embodiment of the present invention further provides an infrasonic acoustic compensation method based on haptic feedback, which is used in the infrasonic acoustic compensation system, and includes the following steps 701 to 703:

[0023] Step 701: the response module detects a user's operation for compensating for infrasonic acoustic effects, and outputs a control command when the operation for compensating for infrasonic acoustic effects is detected.

[0024] In an embodiment of the present invention, when a user needs to obtain an infrasonic enhancement effect, a predetermined infrasonic sound effect compensation operation is performed. The response module 100 detects the user's infrasonic sound effect compensation operation, and outputs a control command when the infrasonic sound effect compensation operation is detected.

[0025] In step 702, the processing module processes the audio signal to be played back according to the control of the control instruction, and obtains an infrasonic signal from the audio signal.

[0026] In an embodiment of the present invention, after the response module 100 outputs a control command, the processing module 200 processes the audio signal waiting to be played based on the control of the control command, obtains an infrasonic signal from the audio signal, and sends the obtained infrasonic signal to the vibration module 300.

[0027] Step 703, the vibration module generates a corresponding vibration based on the driving of the extremely low frequency signal.

[0028] In the embodiment of the present invention, after the processing module 200 obtains the infrasonic signal, the vibration module 300 generates corresponding vibration according to the driving of the infrasonic signal, and the generated vibration is transmitted to the user's brain through the user's body, and then generates a virtual infrasonic enhancement effect, which compensates for the shortcoming that the low-frequency band below 100Hz is largely lost when the user listens to music or watches videos on the mobile phone in the prior art, and greatly improves the user's audio-visual experience. In addition, the description of the infrasonic acoustic effect compensation method can be referred to the relevant description of the infrasonic acoustic effect compensation system above, and therefore will not be described in the embodiment of the present invention.

[0029] 8 is a block diagram of a computer-readable storage medium according to an embodiment of the present invention. The embodiment of the present invention further provides a computer-readable storage medium 800, which stores a computer program 810, which executes the infrasonic acoustic effect compensation method according to the embodiment of the present invention when the computer program 810 is called by a control and processor.

[0030] The steps of a method or algorithm described in the embodiments disclosed herein may be performed in hardware, in software modules executed by a processor, or a combination of both. The software modules may be located in random memory (RAM), memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.

[0031] In the above embodiment, the present invention may be realized in whole or in part by software, hardware, firmware or any combination thereof. When the present invention is realized using software, the whole or in part may be realized in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed by a computer, the above-mentioned processes or functions of the present invention are generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from one website site, computer, server or data center to another website site, computer, server or data center by wire (e.g., coaxial cable, fiber optic, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.). The computer-readable storage medium may be any available medium accessible by a computer or a data storage device such as a server, data center integrated with one or more available media. The media available may be magnetic media (floppy disks, hard disks, magnetic tapes), optical media (eg, DVDs), or semi-semiconductor media (eg, Solid State Disks), and the like.

[0032] It should be noted that each embodiment of the present invention is described in order, focusing on the differences between each embodiment and the other embodiments, and that it is sufficient to refer to each other for the identical or similar parts of each embodiment. The product embodiments are similar to the method embodiments, so the description is simplified, and it is sufficient to refer to the method embodiments for the relevant parts.

[0033] It should be noted that in the present invention, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another, and do not necessarily require or imply such an actual relationship or order between those entities or operations. Also, the terms "comprise", "include", or other variations are intended to be non-exclusively inclusive, and a process, method, article, or device that includes a set of elements includes not only those elements, but also other elements not expressly listed, as well as elements inherent in those processes, methods, articles, or devices. If further limited, an element defined by "comprises" does not exclude the presence of additional identical elements in the process, method, article, or device that includes the element.

[0034] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined in the present invention may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not intended to be limited to these embodiments shown in the present invention, but is to be accorded the widest scope consistent with the principles and novel features disclosed in the present invention.

Claims

1. 1. A haptic feedback based infrasound effect compensation system, comprising: a response module for detecting an infrasonic effect compensation operation by a user and outputting a control command when the infrasonic effect compensation operation is detected; a processing module that processes an audio signal to be played back under the control of the control command and obtains an infrasonic signal from the audio signal; and a vibration module that generates a corresponding vibration based on the driving of the infrasonic signal.

2. the processing module comprises a processing chip and a power amplifier; a low-pass filter is mounted on the processing chip, and the processing chip performs low-pass filtering on the audio signal waiting to be reproduced by the low-pass filter based on the control of the control command, and obtains an infrasonic signal from the audio signal; 2. The infrasonic acoustic compensation system according to claim 1, wherein the power amplifier amplifies the infrasonic signal and transmits it to the vibration module.

3. the processing module comprises a processing chip and a low-pass filter circuit; The processing chip acquires an audio signal to be played back under the control of the control command, The infrasonic acoustic effect compensation system of claim 1, characterized in that the low-pass filter circuit performs low-pass filtering on the audio signal from the processing chip, obtains an infrasonic signal from the audio signal, and transmits the infrasonic signal to the vibration module.

4. The processing module includes a pre-processing unit, a processing chip, and a power amplifier; a pre-processing unit for identifying and extracting a target signal of a preset type from the audio signal to be reproduced under the control of the control command, and converting the target signal into an infrasonic signal; The processing chip receives the infrasonic signal from the pre-processing unit; 2. The infrasonic acoustic compensation system according to claim 1, wherein a power amplifier amplifies the infrasonic signal from the processing chip and transmits it to the vibration module.

5. The infrasonic signal is a mono signal or a two-channel signal, and when the infrasonic signal is a two-channel signal, the infrasonic signal includes a left infrasonic sub-signal and a right infrasonic sub-signal, and the vibration module includes a left vibration unit and a right vibration unit; The infrasonic acoustic effect compensation system according to any one of claims 2 to 4, characterized in that the left vibration unit generates a corresponding vibration based on driving the left infrasonic sub-signal, and the right vibration unit generates a corresponding vibration based on driving the right infrasonic sub-signal.

6. A method for infrasound compensation based on haptic feedback for use in an infrasound compensation system, comprising: The infrasound compensation system includes a response module, a processing module, and a vibration module; The infrasonic acoustic effect compensation method includes: The response module detects an infrasonic acoustic effect compensation operation by a user, and outputs a control command when the infrasonic acoustic effect compensation operation is detected; The processing module processes the audio signal to be played back under the control of the control instruction to obtain an infrasonic signal from the audio signal; The method for compensating for infrasonic acoustic effects, further comprising: a vibration module generating a corresponding vibration based on the driving of the infrasonic signal.

7. the processing module comprises a processing chip and a power amplifier; The processing chip is equipped with a low-pass filter; The processing module processes the audio signal waiting to be reproduced under the control of the control command, and outputs an infrasonic signal from the audio signal. The processing chip performs low-pass filtering on the audio signal to be reproduced by the low-pass filter under the control of the control instruction, and obtains an infrasonic signal from the audio signal; 7. The method for compensating for infrasound effects according to claim 6, further comprising: a power amplifier amplifying the infrasound signal and transmitting the amplified infrasound signal to the vibration module.

8. the processing module comprises a processing chip and a low-pass filter circuit; The processing module processes an audio signal to be reproduced under the control of the control command, and obtains an infrasonic signal from the audio signal. The processing chip acquires an audio signal to be played back under the control of the control instruction; The infrasonic acoustic effect compensation method of claim 6, further comprising: the low-pass filter circuit performing low-pass filtering on the audio from the processing chip to obtain an infrasonic signal from the audio signal; and transmitting the infrasonic signal to the vibration module.

9. The processing module includes a pre-processing unit, a processing chip, and a power amplifier; The processing module processes an audio signal to be reproduced under the control of the control command, and obtains an infrasonic signal from the audio signal. The pre-processing unit identifies and extracts a target signal of a preset type from the audio signal to be reproduced according to the control of the control command, and converts the target signal into an infrasonic signal; The processing chip acquires the infrasonic signal from the pre-processing unit; 7. The method of claim 6, further comprising: a power amplifier amplifying the infrasonic signal from the processing chip and transmitting the signal to the vibration module.

10. The infrasonic signal is a mono signal or a two-channel signal, and when the infrasonic signal is a two-channel signal, the infrasonic signal includes a left infrasonic sub-signal and a right infrasonic sub-signal, and the vibration module includes a left vibration unit and a right vibration unit; The vibration module generates a corresponding vibration based on the driving of the extremely low frequency signal, The left vibration unit generates a corresponding vibration according to driving the left infrasonic sub-signal; The infrasonic acoustic effect compensation method according to any one of claims 7 to 9, further comprising: generating a corresponding vibration in the right vibration unit based on driving the right infrasonic sub-signal.

11. 1. A computer-readable storage medium, comprising: The computer-readable storage medium stores a computer program; A storage medium, characterized in that, when the computer program is called by a control and processor, it executes the infrasonic acoustic effect compensation method according to any one of claims 6 to 10.

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