Electronic system assembly using thermal interface pads and related assembly methods - Patents.com
A star-shaped thermal interface pad that transforms into a rectangle upon pressure application addresses the issue of TIM expansion into prohibited areas, ensuring complete IC chip coverage and reliable connections, thus improving heat dissipation and electrical integrity.
Patent Information
- Application Number
- JP2024541142
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-01-14
- Filing Date
- 2023-01-10
- Publication Date
- 2025-01-24
AI Technical Summary
Conventional thermal interface materials (TIM) used in IC chip assemblies often extend into prohibited areas, causing electrical and mechanical interference, such as short circuits and unreliable connections, due to their expansion during assembly, which affects heat performance and reliability.
The use of a star-shaped thermal interface pad that expands from a star shape to a rectangular shape upon application of pressure, ensuring it remains outside the prohibited areas and effectively covers the IC chip area without interfering with adjacent components.
This solution ensures complete coverage of the IC chip area while preventing interference with adjacent parts, maintaining reliable electrical connections and enhancing heat dissipation.
Smart Images
Figure 2025502115000001_ABST
Abstract
Claims
1. 1. A method for thermally bonding components in an integrated circuit (IC) assembly, comprising: providing a thermal interface pad between two components in an IC assembly, the thermal interface pad being in the shape of a multi-pointed star; applying pressure to at least one of the two components of the IC assembly such that the thermal interface pad thermally couples the two components together, the application of pressure causing the thermal interface pad to expand and change its shape from the star shape to another shape; A method comprising:
2. The method of claim 1 , wherein the star is a four-pointed star.
3. The method of claim 1 , wherein the thermal interface pad is rectangular in shape after the application of the pressure.
4. The method of claim 1 , wherein the two components include an integrated circuit chip and a cooling solution.
5. The method of claim 4 , wherein the thermal interface pad is outside a keep-out area around a connector after applying the pressure, and the connector is disposed around a periphery of the integrated circuit chip.
6. The method of claim 5 , wherein the connector comprises a pogo pin.
7. The method of claim 4 , wherein the integrated circuit chip is a voltage regulation module.
8. 5. The method of claim 4, further comprising compressing a plurality of additional star-shaped thermal interface pads disposed between each additional integrated circuit chip and the cooling solution.
9. 1. A method for thermally bonding components in an integrated circuit (IC) assembly, comprising: providing a thermal interface pad between two components in an IC assembly; applying pressure to at least one of two components of the IC assembly such that the two components are thermally coupled by the thermal interface pad, the application of pressure causing the thermal interface pad to expand and change a shape of the thermal interface pad from a first shape to a rectangular shape, the thermal interface pad being spaced from a connector interface for connecting to one of the two components after application of pressure; A method comprising:
10. The method of claim 9 , wherein the first shape is a star.
11. The method of claim 9 , wherein the first shape is a four-pointed star.
12. The method of claim 9 , wherein the first shape is symmetrical.
13. 10. The method of claim 9, wherein the rectangular shape of the thermal interface pad is outside of a keep-out area around a connector area after applying the pressure, the connector area being located at the periphery of one of the two components.
14. The method of claim 13 , wherein each of the connector regions includes a plurality of pogo pins.
15. The method of claim 13 , wherein the two components include an integrated circuit chip and a cooling solution.
16. The method of claim 15 , wherein the integrated circuit chip is a voltage regulation module.
17. 1. An electronic assembly manufactured by a process comprising: providing a thermal interface pad between the integrated circuit chip and the cooling solution, the thermal interface pad being in the shape of a multi-pointed star; applying pressure to thermally couple the integrated circuit chip to the cooling solution through the thermal interface pad, the application of pressure causing the thermal interface pad to expand and change its shape from the star shape to a rectangle; 2. An electronic assembly comprising:
18. 20. The electronic assembly of claim 17, further comprising a connector interface around a periphery of the integrated circuit chip, the thermal interface pad being outside a keep-out area around the connector interface after application of the pressure.
19. 20. The electronic assembly of claim 17, wherein the integrated circuit chip comprises a voltage regulation module.
20. 20. The electronic assembly of claim 17, wherein the cooling solution comprises a cold plate.