Method for manufacturing a smart ring and a smart ring manufactured by the method

Abstract

A method for manufacturing a smart ring and a smart ring manufactured by the same are disclosed. An outer cover processing step (S110) for processing an outer cover 100 having a ring shape and accommodating a sensor / communication module of the smart ring of the present invention; a sensor / communication module manufacturing step (S120) for manufacturing a sensor / communication module 200 including a sensor module for sensing a biosignal of a smart ring user; an outer cover and sensor / communication module combination manufacturing step (S200) for accommodating the sensor / communication module 200 inside the ring shape of the outer cover 100 to form a ring-shaped outer cover and sensor / communication module combination; an inner molding processing step (S300) for generating an inner molding part 300 having a hole of a preset shape for a finger of a smart ring user inside the ring-shaped outer cover and sensor / communication module combination; and a sensing window forming step (S400) for forming a sensing window, which is a part that passes a signal or light required for the sensor module to sense a biosignal of a smart ring user, on the inner surface of the inner molding part 300. The inner molding part processing step (S300) is characterized in that after filling the entire inner area of ​​the ring-shaped combination body with a molding material, a hole of a preset shape is cut in the center of the filled molding material to generate the inner molding part 300.

Description

[Technical field]

[0001] The present invention relates to a smart ring, and more particularly to a manufacturing method for a smart ring that uses a sensor module to measure various body activities and conditions, and a smart ring manufactured thereby. [Background technology]

[0002] As the average life expectancy of modern people increases, they are more interested in their health than ever before. This interest has led to the invention of devices that can continuously manage your health on a daily basis, breaking the stereotype that you should only see a doctor when you are sick.

[0003] Many of the above-mentioned devices, called wearable devices, emphasize portability and can be worn and carried around freely like clothing, watches, or glasses. Examples of such wearable devices include smart glasses, smart watches, and ring-shaped wearable devices.

[0004] Among these, US Patent US9861314B2, which is prior art regarding a ring-shaped wearable device, discloses a wearable electronic device and a manufacturing method thereof.

[0005] This prior art discloses a molded body of a moldable ceramic material including an inner surface, an outer surface, and at least one cavity disposed on the inner surface and having a depth, an electronic component disposed in the cavity and having a thickness smaller than the depth of the cavity, and a method of manufacturing a smart ring, which includes forming a coating of an epoxy material along the inner surface of the smart ring to cover the electronic component and the cavity on the inner surface of the body molded using a prior art molding device and molding method.

[0006] A smart ring manufactured according to the prior art manufacturing method using the above-mentioned prior art molding system embodies a predetermined inner shape and size of the smart ring according to the fixed shape and size of the inner surface of the already molded body.

[0007] As a result, according to the conventional smart ring manufacturing methods, including the conventional manufacturing methods, when it is necessary to change or move the circuit components, form or change the position of a protrusion such as a sensor on the inner surface of the smart ring, or change the shape and size of the inside of the smart ring according to a design intent other than the above, in order to newly mold and produce a body having a different inner shape and size, it is necessary to prepare multiple molding parts such as the mold of the molding device and their settings according to the different inner shape and size. Therefore, the conventional smart ring manufacturing methods, including the conventional manufacturing methods, have a problem of being difficult to meet various requirements regarding the inner shape and size of the smart ring.

[0008] In addition, in order to realize smart rings with inner surfaces of various shapes and sizes using conventional smart ring manufacturing methods, including prior art manufacturing methods, the number of pieces of equipment such as molds and coating devices increases proportionately, and individual setting up of these equipment requires additional time, resulting in the problem of increased time and cost for developing and manufacturing smart rings of various shapes and sizes.

[0009] Furthermore, when molding an epoxy material along the inner surface of a smart ring using a conventional smart ring manufacturing method including a prior art manufacturing method and a molding device used therein, the transparency of the inner surface of the smart ring is determined by the surface condition of the inner surface molding part of the molding device, and there is a limit to how much transparency can be adjusted, so a separate polishing process is required to make the surface of the product beautiful, which leads to problems such as reduced product quality and complicated manufacturing processes, resulting in inefficiencies.

[0010] Furthermore, when molding an epoxy material along the inner surface of a smart ring using the conventional molding device and molding method shown in Figure 11, the area of ​​the epoxy injection part, which acts as an outlet for air bubbles that occur in the injected epoxy, is small, so it takes a long time to remove the air bubbles or they cannot be removed sufficiently, resulting in a decrease in product quality. [Prior art documents] [Patent documents]

[0011] [Patent Document 1] US Patent US9861314B2 (2018. 01. 09.) Summary of the Invention [Problem to be solved by the invention]

[0012] Therefore, the present invention aims to solve the above-mentioned problems of the conventional technology, meet various requirements regarding the inner shape and size of smart rings, and provide a new method for manufacturing a smart ring that reduces the time and cost required for developing and manufacturing smart rings of various shapes and sizes, and a smart ring manufactured through the same.

[0013] In addition, depending on the embodiment, it is easy to adjust the transparency of the entire inner surface of the smart ring or a portion of the inner surface, thereby improving product quality in terms of transparency and streamlining the production process, and the objective is to provide a new method for manufacturing a smart ring and a smart ring manufactured using this method.

[0014] In addition, depending on the embodiment, it is easy to adjust the transparency of the entire inner surface of the smart ring or a portion of the inner surface, so that it is possible to precisely process the portion that passes the signal or light necessary for the sensor module to sense the smart ring user's biosignal by simply surface treating the inner surface.This aims to provide a new method for manufacturing a smart ring that can improve the accuracy of the sensor module's biosignal detection and streamline related production processes, and a smart ring manufactured using this method.

[0015] Furthermore, an object of the present invention is to provide a new method for manufacturing a smart ring that can reduce the time required to remove air bubbles contained in a molding when forming the inner surface of the smart ring, and can sufficiently remove the air bubbles, and a smart ring manufactured by the same. [Means for solving the problem]

[0016] In order to achieve the above object, in one aspect, the present invention relates to a method for manufacturing a smart ring, which includes an outer cover processing step (S110) for processing an outer cover part 100 having a ring shape of a smart ring and accommodating a sensor / communication module; a sensor / communication module fabrication step (S120) for fabricating a sensor / communication module 200 including a sensor module for sensing a biosignal of a smart ring user; an outer cover part and sensor / communication module combination fabrication step (S200) for accommodating the sensor / communication module 200 inside the ring shape of the outer cover part 100 to form a ring-shaped outer cover part and sensor / communication module combination; an inner molding part processing step (S300) for generating an inner molding part 300 having a hole of a preset shape in which a finger of a smart ring user fits inside the ring-shaped outer cover part and sensor / communication module combination; and a sensing window forming step (S400) for forming a sensing window, which is a part that passes a signal or light necessary for the sensor module to sense the biosignal of a smart ring user, on an inner surface of the inner molding part 300. The inner molding part processing step (S300) is characterized in that after filling the entire inner area of ​​the ring-shaped combination body with molding material, a hole of a preset shape is cut in the center of the filled molding material to generate the inner molding part 300.

[0017] Preferably, the molding member of the inner molding part 300 is a transparent thermosetting plastic.

[0018] In addition, preferably, in the outer cover part processing step (S110), the outer cover part 100 includes an outer cover body 110 having a ring shape, an upper flange 120 provided at the upper end of the outer cover body 110, and a lower flange 130 provided at the lower end of the outer cover body 110, and is processed to form a ring-shaped storage space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130.

[0019] Here, in the sensor / communication module manufacturing step (S120), it is preferable to manufacture the sensor / communication module 200 in a ring shape by combining each component thereof so that it can be accommodated in the ring-shaped accommodation space.

[0020] Furthermore, preferably, the inner molding part processing step (S300) includes a molding part injection / hardening step of injecting and hardening a molding part into the entire inner region of the ring-shaped combination of the outer cover part and the sensor / communication module, and removing the molding device, a horizontal cutting step of cutting a molding part protruding from one or more of the upper and lower surfaces of the ring-shaped combination of the sensor / communication module in which the entire inner region is filled with the hardened molding part, and a vertical cutting step of machining a hole of a predetermined shape in the center of the filled molding part of the ring-shaped combination of the sensor / communication module in which the entire inner region free of protrusions is filled with the molding part.

[0021] Here, it is preferable to further include a rounding process of forming a rounded portion 320 by rounding at least one of the upper end and the lower end of the molded portion body 310 of the inner molded portion 300 .

[0022] In addition, preferably, the sensing window formation process (S400) involves applying a clear coating with adjusted transparency to the entire inner surface of the inner molding part 300 to form a sensing window 330, which is a transparent or translucent part that passes the signal or light necessary to sense a biosignal at the position corresponding to the sensor module.

[0023] Furthermore, preferably, the sensing window forming process (S400) involves applying a clear coating with adjusted transparency to a portion of the inner molding part 300 corresponding to the position of the sensor module, and forming a sensing window 330, which is a portion that passes through the signal or light required to sense a biological signal, corresponding to the clear-coated portion of the sensor module.

[0024] Here, the sensing window formation process (S400) preferably includes a masking process of attaching a masking member to a portion of the smart ring to be processed that is not to be clear coated, a primer coating process of applying a primer coating liquid to the inner surface of the inner molding part 300 where the clear coating is to be performed to form a primer layer, a process of applying a clear coating liquid having an adjusted transparency to the dried primer layer to form a clear coating layer, and a drying and masking removal process of drying the clear coating layer and removing the masking member.

[0025] In addition, preferably, the molding device includes an outer lower frame 410, an inner lower frame 420 coupled to an upper portion of the outer lower frame 410 and into which a lower region of the combination of the outer cover part 100 and the sensor / communication module 200 is inserted and coupled, an inner upper frame 430 disposed on an upper portion of the inner lower frame 420 and into which an upper region of the combination of the outer cover part 100 and the sensor / communication module 200 is inserted and coupled, and which serves as an injection passage for a molding material, and an outer upper frame 440 disposed on an upper portion of the inner upper frame 430 to fix the inner upper frame so that it does not spread or separate. The outer cover part 100 is molded by the molding device. The inner lower frame 420 includes a position guide 140 that guides the inner lower frame 420 to be positioned at a set position of 400. A first position guide protrusion 423 is provided on an outer wall of the inner lower frame 420 on the same vertical line as the position guide 140 and the second position guide protrusion 434, and a second position guide protrusion 434 is provided on an outer wall of the inner upper frame 430 on the same vertical line as the position guide 140 and the first position guide protrusion 423. During the molding material injection / curing process, the coupling positions of the outer cover part 100, the inner lower frame 420 and the inner upper frame 430 are guided using the position guide 140, the first position guide protrusion 423 and the second position guide protrusion 434.

[0026] In another aspect, the present invention relates to a smart ring, which includes an outer cover part 100 having a ring shape of the smart ring and accommodating a sensor / communication module; a sensor / communication module 200 accommodated in the outer cover part 100 and including a sensor module for detecting a biosignal of a smart ring user; and an inner molding part 300 having a hole of a preset shape into which a finger of a smart ring user fits, wherein the outer cover part 100 and the sensor / communication module 200 are combined to form a ring-shaped outer cover part and sensor / communication module combination, and the inner molding part 300 is characterized in that a molding material is filled in the entire inner area of ​​the ring-shaped combination, and then a hole of a preset shape is cut and molded in the center of the filled molding material.

[0027] Preferably, the outer cover part 100 includes a ring-shaped outer cover body 110, an upper flange 120 provided at the upper end of the outer cover body 110, and a lower flange 130 provided at the lower end of the outer cover body 110, forming a ring-shaped accommodation space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130, and the sensor / communication module 200 is accommodated and coupled in the ring-shaped space.

[0028] Here, it is preferable that the sensor / communication module 200 is manufactured in a ring shape corresponding to the ring-shaped accommodation space surrounded by the inner surfaces of the upper flange 120 and the lower flange 130, and is accommodated and coupled in the ring-shaped space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130.

[0029] It is preferable that the sensor / communication module 200 includes a base body 211 having a semicircular shape, a connection portion 212 having a semicircular shape and thinner than the base body 211, one side of which is connected to the base body 211 and the other side of which is connected to the plurality of PCB assemblies 215a, 215b, 215c, a plurality of PCB assemblies 215a, 215b, 215c having one side connected to the connection portion 212, a bending member 216 connecting the PCB assemblies 215a, 215b, 215c, and a connection member having one side connected to the base body 211 and the other side connected to the plurality of PCB assemblies 215a, 215b, 215c.

[0030] Furthermore, preferably, the outer cover part 100 includes a position guide 140 for guiding the outer cover part 100 to be placed at a set position of the molding device 400 .

[0031] Moreover, preferably, the molding material forming the inner mold section 300 is a hardened, clear, thermoset plastic.

[0032] Here, it is preferable that a sensing window 330, which is a part that passes through the signal or light necessary for the sensor module to sense the biosignal of the smart ring user, is formed on all or part of the wall surface of the hole created by cutting the inner surface of the inner molding part 300.

[0033] Here, the sensing window 330 is preferably a portion of the inner surface of the inner molding part 300, the transparency of which is improved by a clear coating layer at a position corresponding to the sensor module.

[0034] Also, preferably, the sensor module includes an optical blood flow measurement sensor, and the sensing window 330 is a transparent or translucent portion having improved transparency by clear coating at positions corresponding to the positions of the light emitting portion and the light receiving portion of the optical blood flow measurement sensor as corresponding positions of the sensor module. Effect of the Invention

[0035] According to the present invention as described above, it is possible to provide a new smart ring manufacturing method that satisfies various requirements regarding the inner shape and size of the smart ring and reduces the time and cost required for developing and manufacturing smart rings of various shapes and sizes, and a smart ring manufactured through this method.

[0036] According to the new smart ring manufacturing method of the present invention, the entire inner ring area of ​​the combination of the ring-shaped outer cover part 100 and the sensor / communication module 200 is filled with molding material, and then a hole of a predetermined shape is machined in the center of the filled molding material to generate the inner molding part 300. Therefore, even without changing the molding equipment, it is possible to realize various inner shapes and sizes of smart rings through the inner molding part processing process, which includes a simple cutting process.

[0037] In addition, the new smart ring manufacturing method of the present invention and the smart ring manufactured thereby make it easy to adjust the transparency of the entire inner surface of the smart ring or only a portion of the inner surface, thereby improving product quality related to transparency and streamlining the production process.

[0038] In some embodiments, by improving the transparency of all or part of the inner surface of the smart ring through surface treatment of the inner surface, such as clear coating, it is possible to precisely process the portions that allow the signals or light necessary for the sensor module to sense the smart user's biosignals to pass through, thereby improving the accuracy of the sensor module's biosignal sensing and streamlining related production processes.

[0039] In addition, depending on the embodiment, the transparency and the area to which the transparency adjustment is applied can be precisely controlled by adjusting the composition of the clear coating liquid and masking to improve the transparency.

[0040] Furthermore, in the new smart ring manufacturing method of the present invention, the molding device performing the molding member injection / hardening process of the inner molding part processing step (S300) can increase the external exposed area of ​​the molding member due to the wide injection hole 431a area in the inner frame structure, providing a large area for the air bubbles to escape when removing the air bubbles generated by the use of the molding member material, making it easier to remove the air bubbles and allowing for faster and more efficient removal of the air bubbles compared to the conventional molding device with a small injection hole area and a small external exposed area, thereby improving work efficiency and improving product quality related to transparency. [Brief description of the drawings]

[0041] [Figure 1] 4 is a flowchart of a method for manufacturing a smart ring according to one embodiment of the present invention. [Diagram 2] FIG. 2 is a perspective view showing a smart ring according to one embodiment manufactured by the method of FIG. 1. [Diagram 3] 2 is a perspective view showing another embodiment of a smart ring manufactured by the method of FIG. 1. FIG. [Figure 4] FIG. 2 is an exploded oblique view for explaining the configuration of a smart ring according to an embodiment of the present invention, and an embodiment of a part preparation process (S100) and a cover part and sensor / communication module combination manufacturing process (S200). [Diagram 5] 11A to 11C are diagrams for explaining an embodiment of the inner molded portion processing step (S300) of the present invention. [Figure 6] FIG. 2 is a diagram for explaining an embodiment of the sensing window forming step (S400) of the present invention. [Figure 7] FIG. 11 is a diagram for explaining another embodiment of the sensing window forming step (S400) of the present invention. [Figure 8] FIG. 2 is a perspective view showing a molding apparatus used in manufacturing a smart ring according to an embodiment of the present invention. [Figure 9] FIG. 9 is an exploded perspective view of the molding apparatus of FIG. 8. [Figure 10]FIG. 10 is a cross-sectional view of the molding apparatus of FIG. [Figure 11] FIG. 1 is a diagram of a prior art molding apparatus. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0042] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings, in which: FIG.

[0043] It should be understood that the various embodiments of the present invention are different from one another, but are not necessarily mutually exclusive. For example, a particular shape, structure, or characteristic described herein in connection with one embodiment may be embodied in other embodiments without departing from the spirit or scope of the present invention.

[0044] Furthermore, it should be understood that the location or arrangement of individual components within each embodiment may be changed without departing from the spirit and scope of the present invention. Therefore, the following detailed description is not intended to be taken in a limiting sense, and the scope of the present invention is limited only by the appended claims, along with the full scope of equivalents that such claims are entitled to, if properly interpreted. Like reference characters in the drawings refer to the same or similar features throughout the various aspects.

[0045] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification can be used in a commonly understood sense by a person having ordinary knowledge in the technical field to which the present invention belongs. In addition, terms defined in commonly used dictionaries are not interpreted ideally or excessively unless clearly defined otherwise.

[0046] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention.

[0047] Fig. 1 is a flow chart of a method for manufacturing a smart ring according to an embodiment of the present invention, Fig. 2 is a perspective view showing a smart ring of one embodiment manufactured by the method of Fig. 1, and Fig. 3 is a perspective view showing a smart ring of another embodiment manufactured by the method of Fig. 1. Fig. 4 is an exploded perspective view for explaining the configuration of the smart ring according to the embodiment of the present invention and an embodiment of a parts preparation step (S100) and a cover part and sensor / communication module combination manufacturing step (S200).

[0048] 1, the method for manufacturing the smart ring of the present invention includes a parts preparation process (S100) including an outer cover processing process (S110) and a sensor / communication module manufacturing process (S120), an outer cover and sensor / communication module combination manufacturing process (S200), an inner molded part processing process (S300), and a sensing window forming process (S400). After the sensing window forming process (S400) is completed, a general finishing process (S500) such as removing impurities and polishing is performed, completing the manufacturing method for the smart ring 1 of the present invention.

[0049] As shown in Figures 2 and 3, the sensor / communication module 200 includes a sensor module 214, and the portion of the inner surface of the inner molded part 300 corresponding to the position where the sensor module 214 is installed is made transparent, and a sensing window 330, which is a portion that passes through the signals or light necessary for the sensor module to sense the biosignals of the smart ring user, is formed on the inner surface of the inner molded part 300 in a manufacturing method for the smart ring 1.

[0050] Referring to Figures 2 and 3, the smart ring 1 manufactured by the manufacturing method of the smart ring 1 of the present invention has, as its basic components, an outer cover part 100 having a ring shape of the smart ring and accommodating a sensor / communication module, a sensor / communication module 200 including a sensor module that detects the biosignals of the smart ring wearer, and an inner molded part 300 having a hole of a pre-set shape inside the combination of the ring-shaped outer cover part 100 and the sensor / communication module 200 into which the finger of the smart ring user fits.

[0051] The inner surface of the inner molding portion 300 is formed with a sensing window, which is a portion that passes signals or light necessary for the sensor module 214 to sense the biosignals of the smart ring user.

[0052] In the embodiment of Figure 2, the entire inner molded part 300 is treated to be transparent to form a sensing window 330, and in the embodiment of Figure 3, only a portion of the inner surface of the inner molded part 300 corresponding to the position of the sensor module 214 is treated to be transparent to form the sensing window 330.

[0053] 2 to 4, in the outer cover processing step (S110) of the component preparation step (S100), the outer cover 100 having a ring shape of a smart ring and accommodating a sensor / communication module is processed and manufactured. In this embodiment, the outer cover 100 may be made of a metal material including titanium or medical stainless steel.

[0054] However, in some embodiments, the material is not limited to metal, and the material may be ceramic, plastic, wood, or other various materials, and the processing method may be selected from known processing methods appropriate for the material.

[0055] 4, the detailed configuration of the outer cover part 100 processed in this embodiment will be described. The outer cover part 100 in this embodiment is made of a metal material including titanium and medical stainless steel, and includes a ring-shaped outer cover body 110, an upper flange 120 provided at the upper end of the outer cover body 110, and a lower flange 130 provided at the lower end of the outer cover body 110. The outer cover body 110 is processed to form a ring-shaped accommodation space surrounded by the inner surfaces of the upper flange 120 and the lower flange 130, and the sensor / communication module 200 is accommodated and coupled in the ring-shaped space.

[0056] In this embodiment, the outer cover part 100 further includes a position guide 140 that guides the outer cover body 110 to be disposed at a set position of the molding device 400 described below. The position guide 140 of the outer cover part 100 guides the outer cover body 110 to be disposed at a set position of the molding device 400, thereby improving the accuracy and efficiency of the inner molded part processing process, reducing the defective rate, and improving product quality.

[0057] The position guide 140 may be formed as a flat area on the outer wall of the outer cover body 110 as shown in FIG. 4, or may be formed in the form of a groove or protrusion in addition to the flat area depending on the embodiment.

[0058] 2 to 4, in the sensor / communication module manufacturing step (S120) of the component preparation step 100, a sensor / communication module 200 including a sensor module for detecting a biosignal of a smart ring user is manufactured. In this embodiment, a sensor module 214, a battery, and a plurality of PCB assemblies 215a, 215b, and 215c each having electronic circuits such as a communication module are connected by a bending member 216.

[0059] In this embodiment, the sensor module 214 includes an optical blood flow measurement sensor, which can measure the blood flow information of the wearer of the smart ring, and can measure biometric information such as heart rate, oxygen saturation, etc. through the blood flow information.

[0060] Referring to FIG. 4, the detailed configuration of the sensor / communication module 200 manufactured in this embodiment may include a sensing / communication unit 210 and a mounting unit 220, and may further include a bracket unit 230.

[0061] 4, the sensor / communication module 200 can be manufactured in a ring shape corresponding to the ring-shaped accommodation space surrounded by the inner surfaces of the upper flange 120 and the lower flange 130 so that it can be accommodated and coupled at once in the ring-shaped space surrounded by the inner surfaces of the outer cover body 110 and the upper flange 120 and the lower flange 130. In the sensor / communication module manufacturing process (S120) of the part preparation process 100, each component part described later is combined to manufacture the sensor / communication module in a ring shape that can be accommodated in the ring-shaped accommodation space.

[0062] For this reason, the sensing / communication unit 210 includes a base body 211 having a semicircular shape, a connection portion 212 having a semicircular shape and thinner than the base body 211, one side of which is connected to the base body 211 and the other side of which is connected to the plurality of PCB assemblies 215a, 215b, 215c, a plurality of PCB assemblies 215a, 215b, 215c, one side of which is connected to the connection portion 212, a bending member 216 connecting between the PCB assemblies 215a, 215b, 215c, and a connection member having one side connected to the base body 211 and the other side connected to the plurality of PCB assemblies 215a, 215b, 215c, and the plurality of PCB assemblies 215a, 215b, 215c are provided with a sensor module 214, a battery, a communication module, and other required electronic circuits arranged on the plurality of PCB assemblies 215a, 215b, 215c. In this embodiment, the sensor module 214 is provided on the central PCB assembly 215b and includes an optical blood flow measurement sensor that uses light to measure heart rate, oxygen saturation, etc. at a body part through which an artery passes, such as a fingertip.

[0063] In this embodiment, the bracket portion 230 is further included which is coupled to the connection portion 212 and the connection member 213, and the bracket portion 230 protects the multiple PCB assemblies 215 and the sensor module 214, the battery, and the communication module provided thereon, and enables the multiple PCB assemblies 215a, 215b, and 215c to be installed in accurate positions.

[0064] As shown in FIG. 4 , the mounting portion 220 of the sensor / communication module 200 includes an inner mounting member 221 attached to the inner wall of the sensing / communication portion 210 to protect the sensor modules 214, battery, communication modules and other required electronic circuits of the multiple PCB assemblies 215, a first mounting member 222 coupled to the connection portion 212 to connect the third body 233 of the bracket portion 230 to the connection portion 212, a second mounting member 223 attached to the outer wall of the base body 211 to attach the base body 211 to the inner wall of the outer cover body 110, and a third mounting member 224 coupled to the region of the connection member 213 to attach the second body 232 of the bracket portion 230 to the region of the connection member 213.

[0065] The bracket portion 230 of the sensor / communication module 200 is attached to the sensing / communication portion 210 by the mounting portion 220 described above, and can protect the sensor modules 214, batteries, communication modules and other necessary electronic circuits of the multiple PCB assemblies 215.

[0066] In this embodiment, the bracket portion 230 is provided at a position corresponding to the multiple PCB assemblies 215 as shown in FIG. 4, and includes a first body 231 having a first hole 231a in which a central first PCB assembly 215b in which the sensor module 214 is provided is disposed, a second body 232 having a second hole 232a in which a right second PCB assembly 215a is disposed, and a third body 233 having a third hole 233a in which a left third PCB assembly 215c is disposed.

[0067] In this embodiment, the overall outer wall shape of the bracket portion 230 may have a semicircular shape, as shown in FIG.

[0068] The outer cover part and sensor / communication module combination manufacturing process (S200) involves accommodating the sensor / communication module 200 inside the ring shape of the processed outer cover part 100 to form a ring-shaped combination, and in this embodiment, the accommodated sensor / communication module 200 is attached and fixed to the inner wall of the outer cover body 110 via the second mounting member 223 of the mounting part 220 of the sensor / communication module 200.

[0069] The inner molded part processing step (S300) creates an inner molded part 300 having a hole of a preset shape inside the ring-shaped combination body into which the finger of the smart ring user fits.

[0070] The inner molding part processing step (S300) of the present invention is performed in a novel manner in which the entire inner area of ​​the ring-shaped combination of the outer cover part and the sensor / communication module is filled with molding material, and then a hole of a preset shape is cut in the center of the filled molding material to generate the inner molding part 300.

[0071] The inner molding part 300 is manufactured by molding a molding member made of a transparent material, which can produce a coated transparent or translucent part by applying a clear coating to enhance transparency after molding.

[0072] As a transparent molding material, a transparent thermosetting plastic such as a transparent hard epoxy can be used.

[0073] FIG. 5 is a diagram for explaining an embodiment of the inner molded portion processing step (S300) of the present invention.

[0074] Referring to FIG. 5, the inner molding part processing process (S300) of this embodiment includes a molding material injection / curing process in which a molding material is injected into the entire inner area of ​​the ring-shaped combination of the outer cover part and the sensor / communication module using the molding device of the embodiment of the present invention shown in FIGS. 8 to 10, the molding material is cured, and the molding device is removed.

[0075] By carrying out the molding material injection / curing process, a ring-shaped combined sensor / communication module is obtained in which the entire inner region is filled with the hardened molding material, as shown in Figure 5(a), and then a horizontal cutting process is carried out to cut off the molding material protrusions that protrude from one or more of the upper or lower surfaces of the ring-shaped combined sensor / communication module in which the entire inner region is filled with the hardened molding material.

[0076] As a result of carrying out the above horizontal cutting process, a ring-shaped combination of sensor / communication modules is obtained in which the entire inner area free of protrusions is filled with the hardened molding material, as shown in FIG. 5(b).

[0077] A vertical cutting process is then performed to machine a hole of a preset shape in the center of the filled molding material of the ring-shaped combination of the sensor / communication module, whose entire inner area free of protrusions is filled with molding material.

[0078] As a result of carrying out the vertical cutting step, an inner molded part body 310 having an inner vertical surface is formed as shown in FIG. 5(c).

[0079] Then, a rounded portion processing step is performed in which at least one of the upper end portion and the lower end portion of the molded portion body 310 is rounded to form the rounded portion 320.

[0080] As a result of the execution of the rounded portion processing step, an inner molded portion 300 consisting of a molded portion body 310 and a rounded portion 320 as shown in FIG. 5(d) is formed.

[0081] The horizontal cutting process, vertical cutting process, and rounding process can be performed by CNC machining.

[0082] The sensing window forming process (S400) is a process of forming a sensing window, which is a portion that transmits signals or light required for the sensor module to sense the biosignals of the smart ring user, on the inner surface of the inner molding part 300. This is a process of processing all or a part of the inner surface of the inner molding part 300, i.e., the wall surface of the hole created by cutting, so that signals or light can pass through.

[0083] In this embodiment, a clear coating layer is formed on all or part of the inner surface of the inner molding part 300, which is the processed cut surface of the hardened transparent material molding member, to improve transparency, thereby forming a part optimized for the transmission of signals and light, allowing the transmission of signals and light transmitted and received by the sensor module.

[0084] In the present invention, a clear coating with adjusted transparency is applied to all or part of the inner surface of the inner molding part 300, and the position of the sensor module, i.e., if an optical blood flow measurement sensor is included, the position corresponding to the positions of the light emitting part and the light receiving part of the optical blood flow measurement sensor is clear coated, and a transparent or translucent part with high transparency is generated as a sensing window 330.

[0085] In the present invention, the areas to which the clear coating is applied can be adjusted by selectively masking the areas not to be clear coated prior to clear coating, so that the coated transparent or translucent areas can be used to create a sensing window (330) by easily applying clear coating to the desired location and range and increasing transparency.

[0086] In addition, the transparency of the clear-coated portion can be adjusted by adjusting the type and composition ratio of various known clear coating liquids, so that a transparent or translucent sensing window 330 having a transparency optimized for the characteristics of the sensor module can be produced.

[0087] The sensing window formation process (S400) includes a masking process in which a masking member is attached to the portion of the smart ring to be processed that is not to be clear coated, a primer coating process in which a primer coating liquid is applied to the inner surface of the inner molding part 300 to be clear coated to form a primer layer, a process in which a clear coating liquid having an adjusted transparency is applied to the dried primer layer to form a clear coating layer, and a drying and masking removal process in which the clear coating layer is dried and the masking member is removed. The portion to be clear coated can be adjusted by adjusting the range and shape of the masking according to each embodiment.

[0088] FIG. 6 is a diagram for explaining one embodiment of the sensing window forming step (S400) of the present invention, and FIG. 7 is a diagram for explaining another embodiment of the sensing window forming step (S400) of the present invention.

[0089] In the sensing window forming step (S400) of the embodiment of Fig. 6, a clear coating with adjusted transparency is applied to the entire inner surface of the inner molding part 300, and a sensing window 330 is formed, which is a transparent or semi-transparent part that transmits a signal or light required for sensing a biosignal at a position corresponding to the sensor module. In this embodiment, the sensing window 330 of the embodiment of Fig. 2 is formed.

[0090] Referring to FIG. 6, the sensing window formation process (S400) of this embodiment includes a masking process in which a masking member is attached to the outer cover portion, which is the portion of the smart ring to be processed in FIG. 6(a), which is not to be clear coated; a primer coating process in which a primer coating liquid is applied to the entire inner surface of the inner molded part 300 where the clear coating is to be performed, i.e., the surface of the molded part body 310 and the rounded part 320, to form a primer layer; a process in which a clear coating liquid with adjusted transparency is applied to the dried primer layer to form a clear coating layer; and a drying and masking removal process in which the clear coating layer is dried and the masking member is removed.

[0091] As a result, as shown in FIG. 6(e), of the entire inner surface of the inner molding part 300 that has been made transparent or semi-transparent by the clear coating, a portion corresponding to the position of the sensor module is formed as a sensing window 330.

[0092] 7, the sensing window forming process (S400) performs clear coating with controlled transparency only on a portion of the inner molding part 300 corresponding to the position of the sensor module, and forms the sensing window 330, which is a portion that transmits a signal or light required for sensing a biosignal, in the clear-coated portion corresponding to the sensor module. In this embodiment, the sensing window 330 of the embodiment of FIG. 3 is formed.

[0093] Referring to FIG. 7, the sensing window formation process (S400) of this embodiment includes a masking process in which a masking material is attached to the outer cover part and the part of the inner molded part 300 corresponding to the position of the sensor module, which are the parts of the smart ring to be processed in FIG. 7(a), which are not clear coated; a primer coating process in which a primer coating liquid is applied to the surface of the inner molded part 300 where the clear coating is to be performed to form a primer layer; a process in which a clear coating liquid having an adjusted transparency is applied to the dried primer layer to form a clear coating layer; and a drying and masking removal process in which the clear coating layer is dried and the masking material is removed.

[0094] As a result, as shown in FIG. 7( e ), only the portion of the inner molding part 300 that is made transparent or semi-transparent by the clear coating and corresponds to the position of the sensor module is formed as a sensing window 330 .

[0095] In this embodiment, various paints can be used as the primer coating, and in this embodiment, the product names Eureka Primer #152 or UVILUX PRIMER #100-3 (NY) can be used.

[0096] For clear coating, the mixing ratio of the luminous paint and non-luminous paint can be adjusted to adjust the transparency, so that the ratio of luminous paint to non-luminous paint can be 10:0 to make it completely transparent, or the ratio of luminous paint to non-luminous paint can be 5:5 to make it semi-transparent, allowing for the realization of the desired level of transparency.

[0097] In this embodiment, the product HNP-UTT #3003(P) CLEAR, whose main component is acrylic polyol resin, or the product HNP-UVT #6011 CLEAR, whose main component is modified acrylic oligomers, or the product Ubichem CVM890SH Top Coat Oil Light (Improved), whose main component is reactive monomers, can be selectively used as the luminous paint, and the product HNP-UTT #3003(P) MATT, whose main component is acrylic polyol resin, or the product HNP-UTT#3003(P) CLEAR, whose main component is acrylic polyol resin, can be selectively used as the non-luminous paint.

[0098] Prior to the masking process, a static elimination process can be performed to neutralize the static electricity charged on the outer cover part 100 using ions, i.e., to consume the accumulated static electricity using ions, thereby removing foreign matter such as dust from the surface of the outer cover part 100.

[0099] In order to carry out the molding material injection / curing process of the inner molding part processing step (S300) of the new smart ring manufacturing method of the present invention described above, a molding device according to one embodiment of the present invention described below, which is different from the conventional molding device of Figure 11, has been developed and used.

[0100] FIG. 8 is a perspective view showing a molding apparatus used in manufacturing a smart ring according to an embodiment of the present invention, FIG. 9 is an exploded perspective view of the molding apparatus of FIG. 8, and FIG. 10 is a cross-sectional view of the molding apparatus of FIG.

[0101] 8 to 10, the molding device 400 used in the inner molding part processing step (S300) of the manufacturing method of the smart ring of the present invention includes an outer lower frame 410, an inner lower frame 420 which is connected to the upper part of the outer lower frame 410 and into which the lower region of the combination of the outer cover part 100 and the sensor / communication module 200 described above is inserted and connected, an inner upper frame 430 which is disposed on the upper part of the inner lower frame 420 and into which the upper region of the combination of the outer cover part 100 and the sensor / communication module 200 is inserted and connected and which serves as an injection passage for the molding material, and an outer upper frame 440 which is disposed on the upper part of the inner upper frame 430 to fix the inner upper frame so that it does not spread or separate.

[0102] A first position guide protrusion 423 is provided on the outer wall of the inner lower frame 420 on the same vertical line as the position guide 140 and the second position guide protrusion 434, and a second position guide protrusion 434 is provided on the outer wall of the inner upper frame 430 on the same vertical line as the position guide 140 and the first position guide protrusion 423, which guides the joining positions of the outer cover part 100, the inner lower frame 420 and the inner upper frame 430 during the molding material injection / curing process.

[0103] 8 to 10, the outer lower frame 410 has an outer lower groove 411 on the upper surface thereof as shown in Fig. 9, and an inner lower flange 421 of the inner lower frame 420 can be fitted and coupled to the outer lower groove 411. As a result, the inner lower frame 420 can be fixed without spreading or being separated during the molding operation.

[0104] In this embodiment, the outer lower frame 410 may be constructed of materials including steel, stainless steel, or plastic materials, which may also be applied to the inner lower frame 420 .

[0105] The inner lower frame 420 may be fitted and coupled to the outer lower groove 411 of the outer lower frame 410 to support a lower region of the combination of the outer cover part 100 and the sensor / communication module 200 .

[0106] In this embodiment, as shown in FIGS. 9 and 10, an inner lower flange 421 is provided at the lower part of the inner lower frame 420, and this inner lower flange 421 can be detachably fitted and coupled to the outer lower groove 411.

[0107] In addition, in this embodiment, an inner groove 422 is provided on the upper surface of the inner lower frame 420, as shown in Figures 9 and 10, and the lower region of the combination of the outer cover part 100 and the sensor / communication module 200 can be fitted and coupled into this inner groove 422.

[0108] Furthermore, in this embodiment, a first position guide protrusion 423 may be provided on the outer wall of the inner lower frame 420, as shown in Fig. 9. In this embodiment, the first position guide protrusion 423 is provided on the same vertical line as the position guide 140 of the outer cover part 100 and the second position guide protrusion 434 of the inner upper frame 430 described above, as shown in Fig. 9, and can conveniently guide the coupling position between the outer cover part 100 and the inner upper frame 430.

[0109] In this embodiment, the inner lower frame 420 may be made of a material containing silicon so that the inner lower frame 420 can be easily separated from the outer lower frame 410 after the molding member is hardened by being in close contact with the surface of the outer lower frame 410 so that the resin does not flow down and contaminate the outer lower frame 410 when the molding member containing transparent hard epoxy is injected. In this embodiment, the silicon may have a hardness of 60 to 70 degrees.

[0110] The inner upper frame 430 supports the upper region of the combination of the outer cover part 100 and the sensor / communication module 200, and allows a molding material to be injected into the inside of the outer cover part 100.

[0111] In this embodiment, as shown in Figures 9 and 10, the inner upper frame 430 includes an injection post 431 provided at the upper part thereof as an injection passage for the molding material, an injection position protrusion 432 provided on the inner wall of the injection post 431 to guide the upper injection height limit of the molding material filled inside the injection post 431, an inner upper flange 433, 120 provided at the lower part of the inner upper frame 430 to be fitted and coupled to an outer upper groove 441 of the outer upper frame 440, and a second position guide protrusion 434 provided on the outer wall of the inner upper frame 430 and aligned vertically with the position guide 140 and the first position guide protrusion 423 to conveniently guide the coupling position of the inner upper frame 430.

[0112] 9 and 10, the injection post 431 is provided with an injection hole 431a, through which the molding material can be injected into the outer cover part 100 to which the sensor / communication module 200 is coupled and then hardened. In addition, in this embodiment, a post guide 431b is provided on the outer wall of the injection post 431 as shown in FIG. 9, and the post guide 431b can be provided on the same vertical line as the second position guide protrusion 434, the position guide 140, and the first position guide protrusion 423.

[0113] As shown in FIG. 9, the outer upper frame 440 is detachably fitted and coupled to the inner upper flange 433 via the outer upper groove 441, thereby preventing the inner upper frame 430 from spreading or separating during molding.

[0114] The molding device 400 of the present embodiment as described above, compared to the conventional molding device of Fig. 11, can increase the external exposed area of ​​the molding member with the wide injection hole 431a area in the inner frame structure proceeding through the entire molding, and therefore provides a large area for the air bubbles to escape when removing the air bubbles generated due to the use of the molding member material, making it easier to remove the air bubbles, and can remove the air bubbles quickly and efficiently compared to the conventional molding device having a small injection hole area and a small external exposed area, thereby improving the work efficiency and the quality of the product related to transparency.

[0115] The molding member injection / curing step of the inner molding part processing step (S300) can be performed by first injecting a molding member containing epoxy into the combination of the outer cover part 100 and the sensor / communication module 200 using the molding device 400 of the above embodiment, and then curing the molding member. When the epoxy is cured, each component of the molding device 400 is removed, and the combination of the outer cover part 100 and the sensor / communication module 200 filled with the cured epoxy molding as the molding member as shown in Fig. 5(a) can be obtained. Then, the inner molding part processing step (S300) is completed through the inner molding part processing step (S300) described with reference to Figs. 5 and 6.

[0116] Meanwhile, the smart ring 1 according to the present embodiment manufactured by the above-mentioned method includes, as shown in Figures 2 and 3, an outer cover part 100 having a ring shape of a smart ring and accommodating a sensor / communication module, a sensor / communication module 200 including a sensor module accommodated in the outer cover part 100 and detecting the biosignals of the smart ring user, and an inner molding part 300 having a hole of a preset shape into which the finger of the smart ring user fits, and the outer cover part 100 and the sensor / communication module 200 are combined to form a ring-shaped outer cover part and sensor / communication module combination, and the inner molding part 300 is formed by filling the entire inner area of ​​the ring-shaped combination with a molding material, and then cutting and processing a hole of a preset shape in the center of the filled molding material.

[0117] Referring to FIG. 4, the outer cover part 100 includes a ring-shaped outer cover body 110, an upper flange 120 provided at the upper end of the outer cover body 110, and a lower flange 130 provided at the lower end of the outer cover body 110, and forms a ring-shaped accommodation space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130, and the sensor / communication module 200 can be accommodated and coupled in the ring-shaped space.

[0118] Here, the sensor / communication module 200 is manufactured in a ring shape corresponding to the ring-shaped accommodation space surrounded by the inner surfaces of the upper flange 120 and the lower flange 130, and is accommodated and coupled in the ring-shaped space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130.

[0119] In this embodiment, the sensor / communication module 200 includes a base body 211 having a semicircular shape, a connection portion 212 having a semicircular shape and thinner than the base body 211, one side of which is connected to the base body 211 and the other side of which is connected to a plurality of PCB assemblies 215a, 215b, 215c, a plurality of PCB assemblies 215a, 215b, 215c having one side connected to the connection portion 212, a bending member 216 connecting the PCB assemblies 215a, 215b, 215c, and a connection member having one side connected to the base body 211 and the other side connected to the plurality of PCB assemblies 215a, 215b, 215c.

[0120] In addition, the outer cover part 100 includes a position guide 140 for guiding the outer cover part 100 to be placed at a set position of the molding device 400 .

[0121] Furthermore, the molding material that forms the inner molded portion 300 is a hardened, transparent, thermosetting plastic.

[0122] Here, a sensing window 330, which is a part that passes through the signal or light necessary for the sensor module to sense the biosignal of the smart ring user, can be formed on all or part of the wall surface of the hole created by cutting the inner surface of the inner molding part 300.

[0123] Here, the sensing window 330 may be a portion having improved transparency by a clear coating layer at a position corresponding to the sensor module on the inner surface of the inner molding part 300, or the sensor module may have an optical blood flow measuring sensor, and the sensing window 330 may be a transparent or translucent portion having improved transparency by clear coating at a position corresponding to the positions of the light emitting part and the light receiving part of the optical blood flow measuring sensor as the corresponding position of the sensor module.

[0124] Therefore, the present invention is not limited to the described embodiments, and it is obvious to those skilled in the art to which the present invention pertains that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, such modifications and variations should be included in the scope of the claims of the present invention. [Explanation of symbols]

[0125] 1: Smart Ring 100: Outer cover part 110: Outer cover body 120: Upper flange 130: Lower flange 140: Location Guide 200: Sensor / Communication Module 210: Sensing / Communication Department 211: Base body 212: Connection 213: Connection member 214: Sensor module 215: PCB Assembly 216: Bending parts 220: Mounting part 221: Inner mounting member 222: First mounting member 223: Second mounting member 224: Third mounting member 230: Bracket part 231: First Body 231a: 1st hall 232: Second Body 232a: 2nd hall 233: Third Body 233a: 3rd hall 300:Inner molding part 310: Molded body 320: Rounding section 330: Sensing window 400: Molding equipment 410: Outer lower frame 411: Outer lower groove 420: Inner lower frame 421: Inner lower flange 422: Inner groove 423: First position guide protrusion 430: Inner upper frame 431: Injection post 431a: Injection hole 431b: Post Guide 432: Injection position protrusion 433: Inner upper flange 434: Second position guide protrusion 440: Outer upper frame 441: Outside upper groove

Claims

1. In a method for manufacturing a smart ring, An outer cover part processing step (S110) for processing and manufacturing an outer cover part 100 having a ring shape of the smart ring and accommodating a sensor / communication module; A sensor / communication module manufacturing process (S120) for manufacturing a sensor / communication module 200 including a sensor module for detecting a biosignal of a smart ring user; an outer cover part and a sensor / communication module combination fabrication process (S200) for forming a ring-shaped outer cover part and a sensor / communication module combination by accommodating the sensor / communication module 200 inside the ring-shaped outer cover part 100; An inner molding processing step (S300) for generating an inner molding 300 having a hole of a preset shape into which a finger of a smart ring user fits inside the ring-shaped outer cover part and the sensor / communication module combination; and A sensing window forming step (S400) is included, which forms a sensing window on the inner surface of the inner molding part 300, the sensing window being a part through which a signal or light necessary for the sensor module to sense a biosignal of a smart ring user passes; The inner molding part processing step (S300) is a method for manufacturing a smart ring, characterized in that a molding material is filled into the entire inner area of ​​the ring-shaped combination body, and then a hole of a predetermined shape is cut in the center of the filled molding material to generate the inner molding part 300.

2. In claim 1, A method for manufacturing a smart ring, wherein the molding member of the inner molding part 300 is a transparent thermosetting plastic.

3. In claim 1, The outer cover part processing step (S110) is a method for manufacturing a smart ring, characterized in that the outer cover part 100 includes an outer cover body 110 having a ring shape, an upper flange 120 provided at the upper end of the outer cover body 110, and a lower flange 130 provided at the lower end of the outer cover body 110, and is processed to form a ring-shaped storage space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130.

4. In claim 3, The sensor / communication module manufacturing process (S120) is a method for manufacturing a smart ring, characterized in that each component of the sensor / communication module 200 is combined to manufacture it into a ring shape that can be accommodated in the above-mentioned ring-shaped accommodation space.

5. In claim 1, The inner molding processing process (S300) is a molding member injection / hardening process for injecting a molding member into the entire inner region of the ring-shaped combination of the outer cover part and the sensor / communication module, hardening the molding member, and removing the molding device; A horizontal cutting process for cutting a molding member protruding from one or more of the upper and lower surfaces of a ring-shaped combination of a sensor / communication module in which the entire inner region is filled with the hardened molding member; and A method for manufacturing a smart ring, comprising a vertical cutting process for machining a hole of a predetermined shape in the center of a filled molding material of a ring-shaped combination of a sensor / communication module, the entire inner area of ​​which is free of protrusions, filled with molding material.

6. In claim 5, The method for manufacturing a smart ring further includes a rounding process for forming a rounded portion 320 by rounding at least one of the upper end and the lower end of the molded portion body 310 of the inner molded portion 300.

7. In claim 2, The sensing window formation process (S400) is a method for manufacturing a smart ring, characterized in that a clear coating with adjusted transparency is applied to the entire inner surface of the inner molding part 300, forming a sensing window 330, which is a transparent or translucent part that allows the signal or light necessary for the position corresponding to the sensor module to pass through for sensing biological signals.

8. In claim 2, The sensing window forming process (S400) is a method for manufacturing a smart ring, which is characterized in that a clear coating with adjusted transparency is applied to a portion of the inner molding part 300 corresponding to the position of the sensor module, and the corresponding portion of the clear-coated sensor module forms a sensing window 330, which is a part that passes through the signals or light necessary to sense biological signals.

9. In claim 7 or 8, The sensing window forming step (S400) includes the steps of: A method for manufacturing a smart ring, comprising: a masking process for attaching a masking member to a portion of the smart ring to be processed that is not to be clear-coated; a primer coating process for forming a primer layer by applying a primer coating liquid to the inner surface of the inner molding part 300 where the clear coating is to be performed; a process for forming a clear coating layer by applying a clear coating liquid having an adjusted transparency to the dried primer layer; and a drying and masking removal process for drying the clear coating layer and removing the masking member.

10. In claim 5, The molding device includes an outer lower frame 410, an inner lower frame 420 coupled to an upper portion of the outer lower frame 410 and into which a lower region of the combination of the outer cover part 100 and the sensor / communication module 200 is inserted and coupled, an inner upper frame 430 disposed on an upper portion of the inner lower frame 420 and into which an upper region of the combination of the outer cover part 100 and the sensor / communication module 200 is inserted and coupled, and which serves as an injection passage for a molding material, and an outer upper frame 440 disposed on an upper portion of the inner upper frame 430 to fix the inner upper frame 430 so that it does not spread or separate. The outer cover part 100 includes a position guide 140 for guiding the outer cover part 100 to be placed at a set position of the molding device 400. A first position guide protrusion 423 is provided on the outer wall of the inner lower frame 420 on the same vertical line as the position guide 140 and the second position guide protrusion 434. A second position guide protrusion 434 is provided on the outer wall of the inner upper frame 430 in the same vertical line as the position guide 140 and the first position guide protrusion 423. A method for manufacturing a smart ring, characterized in that in the molding material injection / curing process, the position guide 140, the first position guide protrusion 423 and the second position guide protrusion 434 are used to guide the joining positions of the outer cover part 100, the inner lower frame 420 and the inner upper frame 430.

11. In the smart ring, An outer cover part 100 having a ring shape of a smart ring and housing a sensor / communication module; A sensor / communication module 200 that is housed in the outer cover part 100 and includes a sensor module for sensing a biosignal of a smart ring user; and The smart ring includes an inner molding 300 having a hole of a pre-defined shape that fits over the user's finger; The outer cover part 100 and the sensor / communication module 200 are combined to form a ring-shaped outer cover part and sensor / communication module combination, and the inner molding part 300 fills the entire inner area of ​​the ring-shaped combination with molding material, and then cuts and molds a hole of a predetermined shape in the center of the filled molding material.

12. In claim 11, The outer cover part 100 includes a ring-shaped outer cover body 110, an upper flange 120 provided at the upper end of the outer cover body 110, and a lower flange 130 provided at the lower end of the outer cover body 110, forming a ring-shaped storage space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130, and a sensor / communication module 200 is stored and coupled in the ring-shaped space, making this a smart ring.

13. In claim 12, The sensor / communication module 200 is manufactured in a ring shape corresponding to the ring-shaped storage space surrounded by the inner surfaces of the upper flange 120 and the lower flange 130, and is accommodated and coupled to the outer cover body 110 and the ring-shaped space surrounded by the inner surfaces of the upper flange 120 and the lower flange 130, forming a smart ring.

14. In claim 13, The sensor / communication module 200 is a smart ring characterized by including: a base body 211 having a semicircular shape; a connection portion 212 having a semicircular shape and thinner than the base body 211, one side of which is connected to the base body 211 and the other side of which is connected to a plurality of PCB assemblies 215a, 215b, 215c; a plurality of PCB assemblies 215a, 215b, 215c, one side of which is connected to the connection portion 212; a bending member 216 connecting the PCB assemblies 215a, 215b, 215c; and a connection member having one side connected to the base body 211 and the other side connected to the plurality of PCB assemblies 215a, 215b, 215c.

15. In claim 11, The smart ring is characterized in that the outer cover part 100 includes a position guide 140 for guiding the outer cover part 100 to be placed at a set position in the molding device 400.

16. In claim 11, A smart ring characterized in that the molding member forming the inner molding portion 300 is a hardened transparent thermosetting plastic.

17. In claim 16, A smart ring characterized in that a sensing window 330 is formed on all or part of the wall surface of a hole created by cutting the inner surface of the inner molding part 300, which is a part that passes through the signals or light necessary for the sensor module to sense the biosignals of the smart ring user.

18. In claim 17, The sensing window 330 is a portion of the inner surface of the inner molded part 300, the transparency of which is improved by a clear coating layer at a position corresponding to the sensor module.

19. In claim 17 or 18, The sensor module includes an optical blood flow measurement sensor, and the sensing window 330 is a transparent or translucent portion having improved transparency by clear coating at positions corresponding to the positions of the light emitting portion and the light receiving portion of the optical blood flow measurement sensor as corresponding positions of the sensor module.

Images