Image sensor packaging method and structure

Abstract

The present invention discloses a packaging method and a packaging structure for an image sensor, which relates to the technical field of semiconductor packaging. The packaging method specifically includes dispensing a filling rubber, which is sprayed onto the lead wires using atomized filling rubber at high frequency, and coating the surface of the lead wires until the outside of the lead wires is completely covered with the filling rubber. Then, when the filling rubber on the surface of the lead wires is not yet cured, the liquid filling rubber is filled toward the filling chamber until the liquid level of the filling rubber is higher than the maximum height of all the leads. The packaging method for an image sensor provided by the present invention solves the problem in the prior art that the leads are easily broken when the finished image sensor is shaken. The leads in the packaging structure for an image sensor manufactured by the packaging method for an image sensor provided by the present invention are more stably fixed by the filling rubber and are less likely to break.

Description

[Technical field]

[0001] The present invention relates to the field of semiconductor packaging technology, and more particularly to a packaging method and structure for an image sensor. [Background technology]

[0002] Image sensors are the core devices of digital imaging equipment, and can convert optical image signals into electronic signals for processing. In order to protect the image sensor chip, ensure its stable operation for a long time, and maintain good detection sensitivity for a long time, it is necessary to design a stable and reliable package structure. When mounting an image sensor, on the one hand, it is necessary to protect the light-receiving area of ​​the sensor chip; on the other hand, it is necessary to protect the electrical connection lines between the sensor and the external circuit, and prevent external elements from affecting the normal acquisition and processing of the sensor signal.

[0003] In the prior art, for example, the image sensor packaging structure and packaging method disclosed in Chinese Patent Application No. 201910414621.7 injects a first filling rubber directly from vertically above the leads, providing a relatively stable and reliable packaging structure. Summary of the Invention [Problem to be solved by the invention]

[0004] The defects of the conventional packaging method are as follows: the first filling rubber has a relatively high viscosity, so that after the first filling rubber is injected vertically above the lead wire, the first filling rubber will split after contacting the lead wire, and the first filling rubber cannot be completely attached to the lead wire at the portion where the lead wire faces away from the injection direction of the first filling rubber, which causes the lead wire to be filled in the cavity of the first filling rubber, and the first filling rubber cannot completely cover the lead wire. The cited documents do not provide a method to solve this problem, and after the filling is completed by the conventional method and the first filling rubber is completely solidified, the lead wire may vibrate in the cavity and break. [Means for solving the problem]

[0005] In view of the above technical problems, the image sensor packaging method provided by the present invention can more stably fix the leads in the image sensor packaging structure.

[0006] To achieve the above objectives, the technical solutions adopted in the present invention are as follows: The image sensor packaging method provided by the present invention includes the following steps: S1: provide a substrate, the substrate has a first surface and a second surface opposite to the first surface; S2: attach the image sensor to the substrate, i.e., fix the lower surface of the image sensor to the first surface of the substrate; S3: fix a transparent cover plate above the image sensor, the transparent cover plate is fixed to the edge region of the light-receiving region of the image sensor by a supporting side wall, and form a sealed light-transmitting area between the transparent cover plate and the image sensor; S4: electrically connect the image sensor to the substrate, i.e., electrically connect the first surface of the substrate and the upper surface of the image sensor through a plurality of lead wires, and the lead wires for electrical connection are located outside the light-transmitting area; S5: provide a side plate, and the side plate is provided around the border of the substrate and sealed, and the plurality of lead wires are all located within a filling chamber surrounded by the substrate and the side plate. S6: Distribute filling rubber, distributing filling rubber into the filling chamber defined by the inside of the side plate, above the first surface of the substrate, and the outside of the supporting side wall. The upper surface of the filling rubber is not higher than the top surface of the transparent cover plate. Wherein, distributing the filling rubber in S6 includes the following: S61: Use atomized filling rubber to inject onto the lead wires by high frequency, and paint the surface of the lead wires until the outside of the lead wires is completely covered with the filling rubber. S62: After performing step S61, when the filling rubber on the surface of the lead wires is not yet cured, fill the liquid filling rubber toward the filling chamber until the liquid level of the filling rubber is higher than the maximum height of all the leads and not higher than the top surface of the transparent cover plate.

[0007] The image sensor packaging method provided by the present invention preferably further includes step S63 after step S62: filling a second filling rubber vertically above the filling rubber filled in step S62 until the upper surface of the second filling rubber is flush with the top surface of the transparent cover plate. The filling rubber is an epoxy resin. The second filling rubber is a thermosetting sealant that is opaque to light.

[0008] In the image sensor packaging method provided by the present invention, the supporting sidewalls are preferably distributed on the upper surface of the image sensor surrounding the outside of the light-receiving area of ​​the image sensor, and the supporting sidewalls have a uniform height.

[0009] The image sensor packaging method provided by the present invention preferably electrically connects the image sensor to the substrate before or after the transparent cover plate is fixed to the image sensor.

[0010] The image sensor packaging method provided by the present invention preferably selects UV adhesive or heat curing sealant as supporting sidewall, and fixes the transparent cover plate above the image sensor during curing process.

[0011] In the image sensor packaging method provided by the present invention, preferably, in step S61, the atomized filling rubber is produced by an epoxy resin atomizing device. The epoxy resin atomizing device includes two nozzles used to spray epoxy resin mist. The mouths of the two nozzles are arranged opposite to each other. The lead wires leave gaps between the image sensor and the board, except for two pins connected to the image sensor and the board respectively. The height of the nozzles is lower than the highest part of the lead wires. The epoxy resin mist sprayed from the nozzles can penetrate through the gaps. A plurality of lead wires are provided on one side of the image sensor. The distance between the two nozzles is longer than the sum of the distances between all adjacent lead wires on one side of the image sensor.

[0012] The image sensor package structure manufactured by the image sensor packaging method provided by the present invention includes the substrate, the image sensor, the transparent cover plate, the supporting side wall, a plurality of the lead wires, the side plate, and the filling rubber. The substrate includes the first surface and the second surface. The second surface faces the first surface. The image sensor is fixed to the substrate. The image sensor includes a light receiving area, and a surface of the image sensor on which the light receiving area is provided is an upper surface of the image sensor, and a surface facing the upper surface is a lower surface of the image sensor. The transparent cover plate is bonded to the upper side of the image sensor. The image sensor receives a sensing signal through the transparent cover plate. A surface bonded to the transparent cover plate is a bottom surface of the transparent cover plate, and a surface facing the bottom surface of the transparent cover plate is a top surface of the transparent cover plate. The supporting side wall is bonded to the transparent cover plate and the image sensor, respectively, to form a sealed light-transmitting area between the transparent cover plate and the light receiving area of ​​the image sensor. The supporting side wall is fixedly installed around the upper surface outside the light receiving area of ​​the image sensor. The lead wires electrically connect the substrate and the image sensor, and the lead wires are distributed outside the supporting side wall. A side plate is fixed around the substrate to seal the substrate, and the lead wires are all located inside the filling chamber surrounded by the substrate and the side plate. The side of the side plate adjacent to the filling chamber is the inside. The filling rubber is filled in the filling chamber formed by the inside of the side plate, above the first surface of the substrate, and the outside of the supporting side wall. The filling rubber is divided into two layers, inner and outer. The filling rubber of the inner layer completely covers the outside of the lead wires. The filling rubber of the outer layer covers the filling rubber of the inner layer and the lead wires inside without any gaps. The liquid level of the filling rubber of the outer layer is higher than all of the lead wires. The upper surface of the filling rubber of the outer layer is not higher than the top surface of the transparent cover plate. Effect of the Invention

[0013] The above technical solution has the following advantages or beneficial effects: The present invention discloses a packaging method and a packaging structure for an image sensor, which relates to the technical field of semiconductor packaging, and the packaging method for an image sensor includes the following steps: S1: provide a substrate, the substrate has a first surface and a second surface opposite to the first surface; S2: attach an image sensor to the substrate, i.e., fix the lower surface of the image sensor to the first surface of the substrate; S3: fix a transparent cover plate above the image sensor, the transparent cover plate is fixed to the edge region of the light-receiving region of the image sensor by a supporting side wall, and form a sealed light-transmitting area between the transparent cover plate and the image sensor; S4: electrically connect the image sensor to the substrate, i.e., electrically connect the first surface of the substrate and the upper surface of the image sensor through a plurality of lead wires, and the electrical connection lead wires are located outside the light-transmitting area; S5: provide a side plate, and the side plate is provided around the border of the substrate to be sealed, and the plurality of lead wires are all located within a filling chamber surrounded by the substrate and the side plate. S6: Distribute filling rubber, distributing the filling rubber into a filling chamber formed by the inside of the side plate, above the first surface of the substrate, and the outside of the supporting side wall. The upper surface of the filling rubber is not higher than the top surface of the transparent cover plate. Wherein, distributing the filling rubber in S6 includes the following: S61: Use atomized filling rubber to inject onto the lead wires by high frequency, and paint the surface of the lead wires until the outside of the lead wires is completely covered with the filling rubber. S62: After performing step S61, when the filling rubber on the lead wire surface is not yet cured, fill the liquid filling rubber toward the filling chamber until the liquid level of the filling rubber is higher than the maximum height of all the leads and not higher than the top surface of the transparent cover plate. The image sensor packaging method provided by the present invention solves the problem in the prior art that the leads in the image sensor packaging structure are easily broken when the finished image sensor shakes because the filling rubber does not sufficiently cover the leads. The present invention stably fixes the leads in the image sensor packaging structure by the filling rubber. [Brief description of the drawings]

[0014] The present invention and its features, configurations and advantages will become more apparent by describing in detail non-limiting embodiments with reference to the following drawings. In addition, in all drawings, similar components are given similar reference numerals and descriptions are omitted as appropriate. The drawings are not intended to be drawn to scale, and the focus is on illustrating the gist of the present invention. [Figure 1] 1 is a schematic diagram of a package structure of an image sensor manufactured by a method for packaging an image sensor according to a first embodiment of the present invention; [Diagram 2] FIG. 4 is a schematic diagram of the epoxy resin atomizing device in the image sensor packaging method according to the first embodiment of the present invention when coating the bottom of the leads. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Specifically, the features in the examples and examples of the present application can be combined with each other unless they are inconsistent. Specifically, it should be noted that the terms used in this specification are used only to describe specific embodiments and are not intended to limit the exemplary embodiments of the present application.

[0016] In particular, the terms "comprising" and / or "including," when used herein, should be understood to indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0017] Terms such as "center," "top," "bottom," "left," "right," "vertical," "horizontal," "inside," "outside," and the like, indicate orientations or positions based on those shown in the figures, and are intended merely to facilitate and simplify the description of the invention, and do not indicate or imply that the devices or elements shown must be configured or operate in a particular orientation, and therefore are not to be construed as limiting the invention.

[0018] The appearance of terms such as "first", "second", "third" etc. is for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0019] The appearance of terms such as "attached", "coupled" and "connected" shall be interpreted in a broad sense, such as fixed, detachable, or integral, unless otherwise specified or limited. The connection may be mechanical or electrical. It may be directly connected, indirectly connected through an intermediate medium, or internal communication between two elements. The meaning of the above terms in the present invention can be fully understood by those skilled in the art.

[0020] The technical solutions in the embodiments of the present invention will be described below in conjunction with the accompanying drawings in the embodiments of the present invention, but the described embodiments are only some of the embodiments of the present invention, not all of the embodiments. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed, but merely represents selected embodiments of the present invention. All other embodiments that can be obtained by those skilled in the art based on the embodiments of the present invention without creative labor are within the scope of the present invention.

[0021] Example 1 In the prior art, during the assembly process of the image sensor packaging structure, the filling rubber is directly filled, so that after the filling rubber contacts the lead wire, it is blocked by the lead wire and moves away from the direction of the filling rubber, and cavities are likely to appear between the filling rubber and the lead wire. After the assembly of the image sensor packaging structure is completed, the lead wire in the image sensor packaging structure is not sufficiently covered with the filling rubber, and the lead wire not covered with the filling rubber is fragile and is likely to induce breakage of the lead wire in an environment where the image sensor of the product is shaken. The image sensor packaging method provided in embodiment 1 of the present invention includes the following steps, as shown in Figures 1-2. S1: Provide a substrate 1, said substrate 1 having a first surface and a second surface opposite to the first surface. S2: The image sensor 2 is attached to the substrate 1, that is, the lower surface of the image sensor 2 is fixed to the first surface of the substrate 1. S3: The transparent cover plate 3 is fixed above the image sensor 2, and the transparent cover plate 3 is fixed to the edge region of the light-receiving area of ​​the image sensor 2 by the supporting side walls 4, forming a sealed light-transmitting area between the transparent cover plate 3 and the image sensor 2. S4: Electrically connect the image sensor 2 to the substrate 1, i.e., electrically connect the first surface of the substrate 1 and the upper surface of the image sensor 2 via a plurality of lead wires 5, and the lead wires 5 for electrical connection are located outside the light-transmitting area. S5: Provide a side plate 6, and seal the side plate 6 around the border of the substrate 1, so that all of the leads 5 are located within a filling chamber surrounded by the substrate 1 and the side plate 6. S6: Dispense filling rubber 7 into a filling chamber defined by the inner side of the side plate 6, above the first surface of the substrate 1, and the outer side of the supporting side wall 4. The upper surface of the filling rubber 7 is not higher than the top surface of the transparent cover plate 3. Distributing the filled rubber in S6 includes: S61: Use atomized filling rubber to inject it onto the lead wire 5 with high frequency, and paint the surface of the lead wire 5 until the outside of the lead wire 5 is completely covered with the filling rubber. S62: After performing step S61, when the filling rubber 7 on the surface of the lead wires 5 has not yet hardened, fill the liquid filling rubber 7 toward the filling chamber until the liquid level of the filling rubber 7 is higher than the maximum height of all the lead wires 5 and not higher than the top surface of the transparent cover plate 3.

[0022] The image sensor packaging method provided by the first embodiment of the present invention uses atomized filling rubber to paint the connecting lead between the substrate 1 and the image sensor 2, and then, when the filling rubber on the outside of the lead has not yet fully hardened, pour in liquid filling rubber to fill the filling chamber inside the side plate 6, above the first surface of the substrate 1, and outside the supporting side wall 4. Since the atomized filling rubber and the liquid filling rubber are made of the same material, the liquid filling rubber can be more easily attached to the filling rubber on the surface of the lead 5 when it flows, which avoids the lead and the filling rubber from being unable to adhere tightly to the surface of the lead 5 due to the different structural properties of the lead. Among them, the atomized filling rubber is used to spray onto the lead by high frequency to paint the surface of the lead, and the high frequency makes the atomized filling rubber squirt out at a relatively high speed and hit the surface of the lead, the purpose of which is to make the atomized filling rubber contact the lead 5 at a higher speed, so that the filling rubber can be more easily attached to the surface of the lead, and the efficiency of the atomized filling rubber adhering to the surface of the lead 5 is further improved. In this way, the moving speed of the filling mist is too slow and the time it takes to completely cover the surface of the lead wire 5 is too long, so that the filling mist on the surface of the lead wire 5 is thoroughly cured, and the seamless connection between the filling rubber coated on the surface of the lead wire 5 and the liquid filling rubber filled later can be avoided. The reason why high frequency is not used directly to high-speed filling mist is that, on the one hand, the continuous filling mist may rapidly gather on the liquid filling rubber, which is unfavorable to covering the surface of the lead wire 5 with the filling rubber, and on the other hand, if the atomized filling rubber is simply sprayed from the pipe at high speed, the lead wire may be subjected to the impact force of the continuous atomized filling rubber, which may cause tilting. If the filling rubber is sprayed onto the lead wire through the high-frequency stage, the impact force received by the lead wire is reduced due to the existence of a gap between the impact forces, thus appropriately reducing the impact force received by the lead wire, and thus reducing the situation in which the filling rubber collides with the lead wire to deform it. Compared to the conventional technology, in this embodiment, the outside of the lead wire is sufficiently covered with filled rubber, and there is no cavity between the lead wire 5 and the filled rubber 7, so that the lead wire 5 is less likely to vibrate and break within the cavity formed by the filled rubber 7.

[0023] The image sensor packaging method provided in the first embodiment of the present invention solves the problem in the prior art that the lead wires in the image sensor packaging structure are easily broken when the finished image sensor is shaken because the lead wires are not sufficiently covered with the filling rubber. The present invention can more stably fix the lead wires in the image sensor packaging structure with the filling rubber.

[0024] As a preferred embodiment, the present invention further includes step S63 after step S62: filling the second filling rubber 8 vertically upward into the filling rubber 7 filled in step S62 until the upper surface of the second filling rubber 8 is flush with the top surface of the transparent cover plate 3. The filling rubber 7 is epoxy resin. The second filling rubber 8 is a heat-curable sealant that does not transmit light. As in the prior art, after the filling rubber 7 is cured, the second filling rubber 8 is provided above the filling rubber 7, and since the second filling rubber 8 does not transmit light, it can prevent the light irradiated into the filling chamber from irradiating the image sensor 2. At the same time, the upper surface of the second filling rubber 8 is at the same height as the transparent cover plate, so that the upper surface of the final outline of the package structure can be made into a plane, and the transparent cover plate is less likely to fall off the supporting side wall 4 due to lateral pressure. Wherein, the supporting side wall 4 is distributed on the upper surface of the image sensor 2 surrounding the outer side of the light receiving area of ​​the image sensor 2, and the supporting side wall 4 has a uniform height. Among them, the supporting sidewalls 4 are distributed along the outer edge of the light-receiving area of ​​the image sensor 2 and have a uniform height, so that the supporting sidewalls can more easily make the image sensor flatly fit with the external optical element after packaging (the transparent cover plate 3 is attached to the light source, and the surface of the light-receiving area of ​​the image sensor 2 can be perpendicular to the incident direction of the external light source, so that the image sensor 2 can better receive the light source).

[0025] In this embodiment, the image sensor 2 and the substrate 1 are electrically connected before the transparent cover plate 3 is fixed to the image sensor 2 or after the transparent cover plate 3 is fixed to the image sensor 2. The image sensor 2 and the substrate 1 may be electrically connected via the lead wires 5 before the transparent cover plate 3 is assembled or after the transparent cover plate 3 is assembled.

[0026] In order to enable the supporting side walls 4 to be fixed to the image sensor 2, in this embodiment, as a preferred example, a UV curable adhesive or a heat curable adhesive is selected as the supporting side walls 4, and the transparent cover plate 3 is fixed above the image sensor 2 while the filling rubber 7 is curing. Since the supporting side walls 4 are themselves adhesive, adhesion and curing are performed simultaneously when the supporting side walls 4 are attached to the image sensor 2, and the fixing efficiency can be improved.

[0027] In order to achieve full coverage of the surface of the lead wire 5, the epoxy resin mist is sprayed, and as a preferred method, in this embodiment, atomized filling rubber is generated by the epoxy resin atomizing device 9 in step S61. The epoxy resin atomizing device 9 includes two nozzles 91 for spraying the epoxy resin mist. The mouths of the two nozzles 91 are arranged opposite to each other. Except for the two pins of the lead wire 5 that are respectively connected to the image sensor 2 and the substrate 1, the other parts of the lead wire 5 leave gaps between the image sensor 2 and the substrate 1. The height of the nozzle 91 is lower than the highest part of the lead wire 5. The epoxy resin mist from the nozzle 91 can pass through the gaps. A plurality of lead wires 5 are arranged on one side of the image sensor 2. The distance between the two nozzles 91 is longer than the sum of the distances between all adjacent lead wires 5 on one side of the image sensor 2. The epoxy resin atomizing device 9 belongs to the prior art, and it is common to use high pressure to push out the epoxy resin liquid, and the epoxy resin liquid is sprayed from the atomizing nozzle. In this embodiment, a gap is left between the lead wire 5 and the image sensor 2, which prevents the non-end point of the lead wire 5 from contacting the image sensor and interfering with other contact points of the lead wire and the image sensor, but the lead wire 5 is close to the image sensor 2, and the spray tube cannot be extended vertically below the lead wire 5, so the epoxy resin atomizing device 9 in this embodiment includes two nozzles 91, which spray in opposite directions. Since the height of the nozzles 91 is lower than the maximum height of the lead wire, the sprayed epoxy resin mist collides with the bottom of the lead wire 5, and the part of the mist that collides moves vertically upward and moves to the highest bottom of the lead wire 5, and the atomized epoxy resin flows along the bottom of the lead wire 5 after contacting the bottom of the lead wire. Therefore, by covering the entire bottom of the lead wire 5, the bottom of the lead wire 5, which is the most difficult to spray with epoxy resin, is also covered with the filling rubber. Combined with a normal vertical downward spray nozzle, the spray can be used to fully cover the lead wires, which is beneficial for the adhesion of the subsequent liquid epoxy resin and the lead wires after the epoxy resin mist is sprayed, and the lead wires are fully covered with the filling rubber without forming cavities around the lead wires.

[0028] The package structure of the image sensor finally manufactured by using the method includes a substrate 1, an image sensor 2, a transparent cover plate 3, a supporting side wall 4, a plurality of lead wires 5, a side plate 6, and a filling rubber. The substrate 1 includes a first surface and a second surface. The second surface is opposite to the first surface. The image sensor 2 is fixed to the substrate 1. The image sensor 2 includes a light receiving area, and the surface of the image sensor 2 where the light receiving area is located is the upper surface of the image sensor 2, and the surface opposite to the upper surface is the lower surface of the image sensor 2. The transparent cover plate 3 is bonded to the upper side of the image sensor 2. The image sensor 2 receives a sensing signal through the transparent cover plate 3. The surface bonded to the transparent cover plate 3 is the bottom surface of the transparent cover plate 3, and the surface opposite to the bottom surface of the transparent cover plate 3 is the top surface of the transparent cover plate 3. The supporting side wall 4 is bonded to the transparent cover plate 3 and the image sensor 2 respectively, forming a sealed light-transmitting area between the transparent cover plate 3 and the light receiving area of ​​the image sensor 2. The supporting side wall 4 is fixedly installed around the upper surface of the image sensor 2 outside the light receiving area. A plurality of lead wires 5 electrically connect the substrate and the image sensor, and the plurality of lead wires 5 are distributed on the outside of the supporting side wall 4. The side plate 6 is fixed around the substrate 1 to seal it, and the plurality of lead wires 5 are all located in a filling chamber surrounded by the substrate 1 and the side plate 6. The side of the side plate 6 adjacent to the filling chamber is the inside. The filling rubber is filled in the filling chamber formed by the inside of the side plate, above the first surface of the substrate, and the outside of the supporting side wall. The filling rubber is divided into two layers, inner and outer. The filling rubber of the inner layer completely covers the outside of the lead wires. The filling rubber of the outer layer covers the filling rubber of the inner layer and the lead wires inside without any gaps. The liquid level of the filling rubber of the outer layer is higher than all of the lead wires. The upper surface of the filling rubber of the outer layer is not higher than the top surface of the transparent cover plate.

[0029] As described above, the present invention discloses a packaging method and packaging structure for an image sensor, which relates to the technical field of semiconductor packaging, and the packaging method for an image sensor includes the following steps: S1: provide a substrate, the substrate has a first surface and a second surface opposite to the first surface; S2: attach an image sensor to the substrate, i.e., fix the lower surface of the image sensor to the first surface of the substrate; S3: fix a transparent cover plate above the image sensor, the transparent cover plate is fixed to the edge region of the light-receiving region of the image sensor by a supporting side wall, and form a sealed light-transmitting area between the transparent cover plate and the image sensor; S4: electrically connect the image sensor to the substrate, electrically connect the first surface of the substrate and the upper surface of the image sensor through a plurality of lead wires, and the lead wires for electrical connection are located outside the light-transmitting area; S5: provide a side plate, and the side plate is provided to surround the border of the substrate and sealed, and the plurality of lead wires are all located within a filling chamber surrounded by the substrate and the side plate. S6: Distribute filling rubber, distributing filling rubber into a filling chamber formed by the inside of the side plate, above the first surface of the substrate, and the outside of the supporting side wall. The upper surface of the filling rubber is not higher than the top surface of the transparent cover plate. Wherein, distributing the filling rubber in S6 includes the following: S61: Use atomized filling rubber to inject onto the lead wires by high frequency, and paint the surface of the lead wires until the outside of the lead wires is completely covered with the filling rubber. S62: After performing step S61, when the filling rubber on the lead wire surface is not yet cured, fill the liquid filling rubber toward the filling chamber until the liquid level of the filling rubber is higher than the maximum height of all the leads and not higher than the top surface of the transparent cover plate. The image sensor packaging method provided by the present invention solves the problem in the prior art that the leads in the image sensor packaging structure are easily broken when the finished image sensor shakes because the filling rubber does not sufficiently cover the leads. The present invention can stably fix the leads in the image sensor packaging structure by the filling rubber.

[0030] The above description is merely a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structural transformation made by utilizing the contents of the specification and accompanying drawings of the present invention, or application directly or indirectly to other related technical fields, is all included in the patent protection scope of the present invention.

Claims

1. 1. A method for packaging an image sensor, comprising the steps of: S1: Providing a substrate, the substrate having a first surface and a second surface opposite to the first surface; S2: affixing the image sensor to the substrate, i.e., fixing the lower surface of the image sensor to a first surface of the substrate; S3: Fix a transparent cover plate above the image sensor, and the transparent cover plate is fixed to the edge region of the light-receiving area of ​​the image sensor by a supporting side wall, forming a sealed light-transmitting area between the transparent cover plate and the image sensor; S4: electrically connecting the image sensor to the substrate, i.e. electrically connecting a first surface of the substrate and an upper surface of the image sensor through a plurality of leads, and the leads for electrical connection are located outside the light-transmitting area; S5: Providing a side plate, and providing the side plate to surround and seal the boundary of the substrate, and positioning all of the plurality of leads within a filling chamber surrounded by the substrate and the side plate; S6: Dispensing a filling rubber, dispensing the filling rubber into the filling chamber defined by the inside of the side plate, above the first surface of the base plate, and the outside of the supporting side wall, and the upper surface of the filling rubber is not higher than the top surface of the transparent cover plate; Distributing the filled rubber during S6 includes: S61: Using atomized filling rubber, spray the lead wire with high frequency, and paint the surface of the lead wire until the outside of the lead wire is completely covered with the filling rubber; S62: After performing step S61, when the filling rubber on the surface of the lead wires has not yet hardened, the liquid filling rubber is filled toward the filling chamber until the liquid level of the filling rubber is higher than the maximum height of all the lead wires and not higher than the top surface of the transparent cover plate.

2. Further, step S63 is included after step S62, Fill a second filling rubber vertically above the filling rubber filled in step S62 until the upper surface of the second filling rubber is flush with the top surface of the transparent cover plate; 2. The method of claim 1, wherein the first filling rubber is an epoxy resin, and the second filling rubber is a light-opaque thermosetting sealant.

3. 2. The method of claim 1, wherein the supporting sidewalls are distributed on the upper surface of the image sensor surrounding an outer side of the light-receiving area of ​​the image sensor, and the supporting sidewalls have a uniform height.

4. 2. The method of claim 1, further comprising electrically connecting the image sensor to the substrate before or after the transparent cover plate is secured to the image sensor.

5. 2. The method of claim 1, further comprising selecting a UV adhesive or a heat curing sealant as the supporting side wall, and fixing the transparent cover plate above the image sensor during the curing process.

6. In step S61, the atomized filling rubber is produced by an epoxy resin atomizing device, the epoxy resin atomizing device includes two nozzles for ejecting epoxy resin mist; The mouths of the two nozzles are disposed opposite each other, the lead wire has two pins respectively connected to the image sensor and the substrate, and the other part of the lead wire leaves a gap between the image sensor and the substrate; The height of the nozzle is lower than the highest part of the lead wire, 3. The method of claim 2, wherein a plurality of leads are provided on one side of the image sensor, and the distance between two of the nozzles is greater than the sum of the distances between all adjacent leads on one side of the image sensor.

7. An image sensor package structure manufactured by the image sensor packaging method according to any one of claims 1 to 6, the substrate, the image sensor, the transparent cover plate, the supporting side wall, a plurality of the lead wires, the side plate, and the filling rubber; the substrate includes a first surface and a second surface, the second surface facing the first surface; the image sensor is fixed to the substrate, the image sensor includes a light receiving area, a surface of the image sensor on which the light receiving area is provided is an upper surface of the image sensor, and a surface opposite to the upper surface is a lower surface of the image sensor, the transparent cover plate is attached above the image sensor, the image sensor receives a sensing signal through the transparent cover plate, a surface attached to the transparent cover plate is a bottom surface of the transparent cover plate, and a surface opposite to the bottom surface of the transparent cover plate is a top surface of the transparent cover plate; the supporting sidewall is bonded to the transparent cover plate and the image sensor, respectively, to form a sealed light-transmitting area between the transparent cover plate and the light-receiving area of ​​the image sensor, the supporting sidewall is fixedly installed around an outer upper surface of the light-receiving area of ​​the image sensor; The plurality of lead wires electrically connect the substrate and the image sensor, and the plurality of lead wires are distributed on an outer side of the supporting side wall; the side plate is fixed to surround and seal the boundary of the substrate, and the plurality of leads are all located within the filling chamber surrounded by the substrate and the side plate, and the side of the side plate adjacent to the filling chamber is an inner side; the filling rubber is filled in the filling chamber defined by the inside of the side plate, above the first surface of the substrate, and the outside of the supporting side wall, the filling rubber is divided into two layers, inner and outer, the filling rubber of the inner layer completely covers the outside of the lead wires, the filling rubber of the outer layer covers the filling rubber of the inner layer and the internal lead wires without any gaps, the liquid level of the filling rubber of the outer layer is higher than all of the lead wires, and an upper surface of the filling rubber of the outer layer is not higher than a top surface of the transparent cover plate.

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