Multi-directional antenna module employing surface mounted antennas to support multi-directional antenna patterns and related manufacturing methods

Abstract

A multi-directional antenna module employing surface mounted antennas to support multi-directionality in an antenna pattern, and associated manufacturing methods. The antenna module includes an RFIC package including one or more RFICs for supporting radio frequency (RF) communications, and a package substrate including one or more metallization layers, with metal interconnects formed in the package substrate for routing signals between the RFICs and the multiple antennas. To provide multi-directionality in the antenna radiation pattern, a first antenna is provided coupled to the package substrate and oriented in a first plane, and a second antenna is provided coupled to the package substrate and oriented in a second plane orthogonal to the first plane. In one embodiment, the second antenna is packaged in an antenna package including an external metal pad that orients the second antenna in the second plane when surface mounted to the package substrate.

Description

Claiming priority

[0001] Priority Application

[0001] This application claims priority to U.S. patent application Ser. No. 17 / 653,061, filed March 1, 2022, entitled "MULTI-DIRECTIONAL ANTENNA MODULES EMPLOYING A SURFACE-MOUNT ANTENNA(S) TO SUPPORT ANTENNA PATTERN MULTI-DIRECTIONALITY, AND RELATED FABRICATION METHODS," the entire contents of which are incorporated herein by reference. [Technical field]

[0002] I. Field of Disclosure

[0002] The field of the disclosure relates to antenna modules (also referred to as "antenna-in-package" (AiP(s)) that include a radio frequency (RF) integrated circuit (IC) (RFIC) coupled to an antenna via a package substrate. [Background technology]

[0003] II. Background

[0003] Modern smartphones and other portable devices have expanded the use of various wireless links using various technologies in various radio frequency bands. For example, fifth generation (5G) cellular networks, commonly referred to as 5G New Radio (NR), include frequencies in the range of 24.25 to 86 gigahertz (GHz), with the lower 19.25 GHz (24.25 GHz to 43.5 GHz) being more likely to be used for mobile devices. This frequency spectrum for 5G communications is in the millimeter wave (mmWave) or millimeter band range. mmWave allows for higher data rates than lower frequencies, such as those used for Wi-Fi and current cellular networks.

[0004]

[0004] Mobile devices and other portable devices designed to support millimeter wave communication signals incorporate radio frequency (RF) transceivers that support the millimeter wave spectrum. To support the integration of the RF transceiver in the device, the RF transceiver can be integrated into an RF integrated circuit (IC) (RFIC) that is provided as part of an antenna module. The RFIC is realized in an RFIC semiconductor die ("die"). The antenna module is also referred to as an "antenna in package" (AiP). A conventional antenna module includes an RFIC package including one or more RFICs, a power management IC (PMIC), and passive electrical components (e.g., inductors, capacitors, etc.) mounted on one side of a package substrate as a support structure. The package substrate supports a metallization structure for providing chip-to-chip and external signal interfaces to the RFIC package. The package substrate also includes one or more antennas electrically coupled to the RFIC package through the metallization structure of the package substrate to be able to receive and radiate electrical RF signals as electromagnetic (EM) signals. The packaging substrate may include multiple antennas, also referred to as an antenna array, to provide signal coverage in a larger desired area around the antenna module.

[0005]

[0005] In order to reduce the overall size of the antenna module, it may be desirable to minimize the area consumed by the antenna in the antenna module. However, the antenna module also needs to have a sufficient radiation pattern to achieve the desired RF performance depending on the desired application. In this regard, a patch antenna is a low-profile antenna that can be employed in the antenna module. Also, if the antenna module is designed to support multiple-input multiple-output (MIMO) communication applications, additional antennas are provided in the antenna module to support multiple MIMO signal streams, but at the expense of increasing the size of the antenna module. Summary of the Invention

[0006]

[0006] Aspects disclosed in the "Description of Embodiments" include a multi-directional antenna module employing a surface-mounted antenna to support multi-directionality of an antenna pattern. Related manufacturing methods are also disclosed. The antenna module is designed to be mounted and coupled to an application circuit board of an electronic device (e.g., a millimeter (mm) wave communication device) to provide RF communication capabilities to the electronic device. The antenna module includes an RFIC package including one or more RFICs for supporting transmission and reception of radio frequency (RF) signals. The antenna module also includes a package substrate including one or more metallization layers, each disposed in a corresponding first plane (e.g., a horizontal plane), each including a metal interconnect for routing signals between the RFIC and an antenna coupled to the package substrate. In an exemplary aspect, a first antenna (e.g., a first patch antenna) is coupled to the package substrate and electrically coupled to the RFIC through the package substrate to provide the first antenna. The antenna element of the first antenna is disposed in a second plane (e.g., horizontal) parallel to the package substrate such that the first antenna has a first antenna radiation pattern in a first direction (e.g., vertical) generally orthogonal to the package substrate. To provide additional antenna radiation pattern directivity, the antenna module also includes a second antenna (e.g., a second patch antenna) coupled to the package substrate such that its antenna element is disposed in a third plane (e.g., vertical) oriented orthogonal to the package substrate. In this manner, the second antenna has a second antenna radiation pattern in a second direction (e.g., horizontal) orthogonal to the first direction (e.g., vertical) of the first antenna radiation pattern of the first antenna. Thus, the second antenna is coupled to the package substrate such that the orientation of its antenna element is orthogonal to the orientation of the first antenna, thereby providing the antenna module with multi-directional antenna radiation patterns.

[0007]

[0007] In an exemplary embodiment, the packaging substrate of the antenna module does not need to be flexible or bent as a way to orient the first and second antennas in orthogonal planes to each other to achieve a multi-directional antenna radiation pattern. In an exemplary embodiment, the packaging substrate of the antenna module is not bent so that its metallization layers extend in parallel planes in the same direction. The first antenna is packaged such that its first antenna element is oriented in a second plane (e.g., horizontal) when the first antenna is bonded to a metallization layer in the packaging substrate. The second antenna is packaged such that its second antenna element is oriented in a third (e.g., vertical) plane when the second antenna is bonded to a metallization layer in the packaging substrate. In this way, the first and second antennas are packaged such that they are automatically oriented orthogonal to each other when bonded to the packaging substrate. Therefore, the corresponding first and second antenna radiation patterns of the first and second antennas are in corresponding first and second directions that are substantially orthogonal to each other, thereby providing multi-directionality of the antenna radiation patterns of the antenna module. The antenna performance of the second antenna can be adjusted in design by controlling the size of the second antenna elements. In the case of the second antenna including multiple second antenna elements separated by a dielectric and configured to electromagnetically (EM) couple to each other, the antenna performance of the second antenna can be controlled by adjusting the distance between the multiple second antenna elements in design.

[0008]

[0008] As a non-limiting example, the antenna elements of the first antenna and the second antenna of the antenna module can be patch antennas, each including one or more corresponding metal patches as their antenna elements. In this example, the first antenna is packaged in the first antenna package such that when the first antenna package is coupled to the package substrate, the first metal patch of the first antenna is oriented in a second plane (e.g., a horizontal plane) parallel to the package substrate. Also in this example, the second antenna is packaged in the second antenna package such that when the second antenna package is coupled to the package substrate, the second metal patch of the second antenna is oriented in a second plane (e.g., a horizontal plane) parallel to the package substrate. In one example, the second antenna package of the second antenna includes a metal pad as a part of the antenna feedline, exposed on an outer surface of the second antenna package and intersecting with a third plane (e.g., a vertical plane) of the second metal patch. The metal pad is coupled to the second metal patch. In this way, when the second metal pad is oriented to be coupled to the package substrate, the second metal patch of the second antenna is automatically oriented in a third plane (e.g., vertical plane) perpendicular to the second plane (e.g., horizontal plane) of the first metal patch of the first antenna. This provides multi-directionality in the first antenna radiation pattern and the second antenna radiation pattern of the first antenna and the second antenna in the antenna module. As another example, the metal pad of the second antenna package of the second antenna can be surface mounted to the package substrate as a surface mount technology (SMT) for electrically coupling the second antenna to the package substrate.

[0009]

[0009] In another exemplary aspect, the package substrate of the antenna module can be attached to an application circuit substrate of an electronic device such that a first outer surface of the package substrate is coupled to the application circuit substrate and a portion of the package substrate extends beyond an edge of the circuit substrate. A first antenna package of a first antenna can be coupled to a second outer surface of the package substrate opposite the first outer surface. A second antenna package of a second antenna can be coupled to a portion of the first and second outer surfaces of the package substrate that extends beyond an edge of the circuit substrate, such that the second antenna package can be disposed in an open space adjacent to the application circuit substrate so as not to interfere with the space consumed by the application circuit substrate. In this manner, the second antenna package is disposed in an open space adjacent to the application circuit substrate to minimize the area impact of the antenna module when disposed in an electronic device.

[0010]

[0010] In this regard, in one exemplary embodiment, an antenna module is provided. The antenna module includes a package substrate disposed in a first plane, the package substrate including a plurality of metallization layers parallel to each other. The antenna module also includes a first antenna including a first antenna package. The first antenna package includes a first antenna element disposed in a second plane parallel to the first plane, and a first external metal interconnect coupled to the first antenna element and at least one first metallization layer of the plurality of metallization layers. The antenna module also includes a second antenna including a second antenna package. The second antenna package includes a second antenna element disposed in a third plane orthogonal to the second plane, and a second external metal interconnect coupled to the second antenna element and at least one second metallization layer of the plurality of metallization layers. The antenna module also includes an RFIC package coupled to the at least one first metallization layer and the at least one second metallization layer for electrically coupling the RFIC to the first antenna element and the second antenna element.

[0011]

[0011] In another exemplary aspect, a method for manufacturing an antenna module having a plurality of antennas for providing a multi-directional antenna radiation pattern is provided. The method includes preparing a package substrate disposed in a first plane, including forming a plurality of metallization layers parallel to each other. The method also includes preparing a first antenna, including preparing a first antenna package comprising a first antenna element disposed in a second plane parallel to the first plane and a first external metal interconnect coupled to the first antenna element. The method also includes coupling the first external metal interconnect to at least one first metallization layer of the plurality of metallization layers of the package substrate. The method also includes preparing a second antenna, including preparing a second antenna package comprising a second antenna element disposed in a third plane orthogonal to the second plane and a second external metal interconnect coupled to the second antenna element. The method also includes coupling the second external metal interconnect to at least one second metallization layer of the plurality of metallization layers of the package substrate. The method also includes coupling the RFIC package to the at least one first metallization layer and the at least one second metallization layer of the package substrate to electrically couple the RFIC to the first antenna element and the second antenna element.

[0012]

[0012] In another exemplary aspect, an electronic device is provided. The electronic device comprises a circuit board including a first side, a second side opposite the first side, a third side adjacent to the first side and the second side, and a fourth side adjacent to the first side and the second side and opposite the third side. The electronic device also comprises an antenna module including a package substrate disposed in a horizontal first plane, a first antenna disposed in a second plane parallel to the first plane, and a second antenna disposed in a third plane perpendicular to the second plane. The antenna module also includes a radio frequency integrated circuit (RFIC) package coupled to the package substrate for electrically coupling the RFIC to the first antenna and the second antenna. The package substrate of the antenna module further includes a first section coupled to the first side of the circuit board and a second section extending horizontally beyond a vertical plane of the third side of the circuit board extending in a vertical direction perpendicular to the horizontal direction. The first antenna is coupled to a first section of the package substrate and the second antenna is coupled to a second section of the package substrate. [Brief description of the drawings]

[0013] [Figure 1]

[0013] A side view of an antenna module in the form of a radio frequency (RF) integrated circuit (IC) (RFIC) package including a package substrate supporting a patch antenna, the patch antenna being formed horizontally within a metallization layer of the package substrate. [Figure 2A]

[0014] 1A and 1B are side cross-sectional and perspective views, respectively, of an exemplary electronic device including a multi-directional antenna module including a first antenna coupled to a package substrate in a first orientation to have a first antenna radiation pattern in a first direction relative to the package substrate, and a second antenna that, when the antenna package is coupled to the package substrate, forces a second orientation of the second antenna to provide a second antenna radiation pattern in a second direction orthogonal to the first orientation to support a multi-directional antenna radiation pattern. [Figure 2B] 1A and 1B are side cross-sectional and perspective views, respectively, of an exemplary electronic device including a multi-directional antenna module including a first antenna coupled to a package substrate in a first orientation to have a first antenna radiation pattern in a first direction relative to the package substrate, and a second antenna that, when the antenna package is coupled to the package substrate, forces a second orientation of the second antenna to provide a second antenna radiation pattern in a second direction orthogonal to the first orientation to support a multi-directional antenna radiation pattern. [Figure 3A]

[0015] 2C are side cross-sectional views of a first antenna package of a first antenna and a second antenna package of a second antenna coupled to a packaging substrate of the multi-directional antenna module of FIGS. 2A and 2B, respectively. [Figure 3B] 2C are side cross-sectional views of a first antenna package of a first antenna and a second antenna package of a second antenna coupled to a packaging substrate of the multi-directional antenna module of FIGS. 2A and 2B, respectively. [Figure 4]

[0016] FIG. 13 is a side cross-sectional view of another electronic device including a multi-directional antenna module including a first antenna coupled in a first orientation to a non-bent portion of the package substrate to have a first antenna radiation pattern in a first direction relative to the package substrate, and a second antenna coupled to a bent portion of the package substrate to provide a second antenna radiation pattern in a second direction orthogonal to the first direction. [Diagram 5]

[0017] FIG. 4 is a cross-sectional side view of another exemplary electronic device including a multi-directional antenna module similar to that of FIGS. 2A and 2B, but in which a first antenna and a second antenna are coupled to the same outer metallization layer of a package substrate. [Figure 6]

[0018] 2A-3B and 5, including a first antenna coupled to a package substrate in a first orientation to have a first antenna radiation pattern in a first direction relative to the package substrate, and a second antenna, where the antenna package, when coupled to the package substrate, forces a second orientation of the second antenna to provide a second antenna radiation pattern in a second direction orthogonal to the first direction to support a multi-directional antenna radiation pattern. [Figure 7]

[0019] 2A-3B and 5, including a first antenna coupled to a package substrate in a first orientation to have a first antenna radiation pattern in a first direction relative to the package substrate, and a second antenna, the second antenna forcing a second orientation of the second antenna to provide a second antenna radiation pattern in a second direction orthogonal to the first direction when the antenna package is coupled to the package substrate, to support a multi-directional antenna radiation pattern. A flowchart showing another exemplary manufacturing process for manufacturing a multi-directional antenna module, including the antenna module of FIG. [Figure 8A]

[0020] 8 illustrates an exemplary manufacturing stage during the manufacture of a multi-directional antenna module manufactured according to the manufacturing process of FIG. 7. [Figure 8B] 8 illustrates an exemplary manufacturing stage during the manufacture of a multi-directional antenna module manufactured according to the manufacturing process of FIG. 7. [Figure 8C] 8 illustrates an exemplary manufacturing stage during the manufacture of a multi-directional antenna module manufactured according to the manufacturing process of FIG. 7. [Figure 8D] 8 illustrates an exemplary manufacturing stage during the manufacture of a multi-directional antenna module manufactured according to the manufacturing process of FIG. 7. [Figure 9]

[0021] 6 and 7. A multi-directional antenna module including a first antenna coupled to a package substrate in a first orientation to have a first antenna radiation pattern in a first direction relative to the package substrate, and a second antenna that, when the antenna package is coupled to the package substrate, forces a second orientation of the second antenna to provide a second antenna radiation pattern in a second direction orthogonal to the first direction to support a multi-directional antenna radiation pattern. FIG. 6 is a block diagram of an exemplary wireless communication device including a multi-directional antenna module, including but not limited to the multi-directional antenna modules of FIGS. 2A-3B, 5, and 8A-8D, and according to any of the manufacturing processes of FIGS. [Figure 10]

[0022] 6 and 7. A multi-directional antenna module including a first antenna coupled to a package substrate in a first orientation to have a first antenna radiation pattern in a first direction relative to the package substrate, and a second antenna, the second antenna forcing a second orientation of the second antenna to provide a second antenna radiation pattern in a second direction orthogonal to the first direction when the antenna package is coupled to the package substrate to support a multi-directional antenna radiation pattern, the multi-directional antenna module including, but not limited to, the multi-directional antenna modules of FIGS. 2A-3B, 5, and 8A-8D, and according to any of the manufacturing processes of FIGS. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014]

[0023] Several exemplary aspects of the present disclosure will now be described with reference to the drawings. The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any aspect described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other aspects.

[0015]

[0024] The embodiments disclosed in the Detailed Description of the Invention include a multi-directional antenna module employing a surface-mounted antenna to support multi-directionality of the antenna pattern. Related manufacturing methods are also disclosed. The antenna module is designed to be mounted and coupled to an application circuit board of an electronic device (e.g., a millimeter (mm) wave communication device) to provide RF communication capabilities to the electronic device. The antenna module includes an RFIC package including one or more RFICs to support transmission and reception of radio frequency (RF) signals. The antenna module also includes a package substrate including one or more metallization layers, each disposed in a corresponding first plane (e.g., a horizontal plane), each including a metal interconnect for routing signals between the RFIC and an antenna coupled to the package substrate. In an exemplary embodiment, a first antenna (e.g., a first patch antenna) is coupled to the package substrate and electrically coupled to the RFIC through the package substrate to provide the first antenna. The antenna element of the first antenna is disposed in a second plane (e.g., horizontal) parallel to the package substrate such that the first antenna has a first antenna radiation pattern in a first direction (e.g., vertical) generally orthogonal to the package substrate. To provide additional antenna radiation pattern directivity, the antenna module also includes a second antenna (e.g., a second patch antenna) coupled to the package substrate such that its antenna element is disposed in a third plane (e.g., vertical) oriented orthogonal to the package substrate. In this manner, the second antenna has a second antenna radiation pattern in a second direction (e.g., horizontal) orthogonal to the first direction (e.g., vertical) of the first antenna radiation pattern of the first antenna. Thus, the second antenna is coupled to the package substrate such that the orientation of its antenna element is orthogonal to the orientation of the first antenna, thereby providing the antenna module with multi-directional antenna radiation patterns.

[0016]

[0025] In an exemplary embodiment, the packaging substrate of the antenna module does not need to be flexible or bent as a way to orient the first and second antennas in orthogonal planes relative to one another to achieve a multi-directional antenna radiation pattern, as discussed in more detail below. In an exemplary embodiment, the packaging substrate of the antenna module is not bent such that its metallization layers extend in parallel planes in the same direction. The first antenna is packaged such that its first antenna element is oriented in a second plane (e.g., horizontal) when the first antenna is bonded to a metallization layer in the packaging substrate. The second antenna is packaged such that its second antenna element is oriented in a third (e.g., vertical) plane when the second antenna is bonded to a metallization layer in the packaging substrate. In this manner, the first and second antennas are packaged such that they are automatically oriented orthogonal to one another when bonded to the packaging substrate. Therefore, the corresponding first and second antenna radiation patterns of the first and second antennas are in corresponding first and second directions that are substantially orthogonal to each other, thereby providing multi-directionality of the antenna radiation patterns of the antenna module. The antenna performance of the second antenna can be adjusted during design by controlling the size of the second antenna elements. In the case of a second antenna including a plurality of second antenna elements separated by a dielectric and configured to electromagnetically (EM) couple to each other, the antenna performance of the second antenna can be controlled by adjusting the distance between the plurality of second antenna elements during design.

[0017]

[0026] Before discussing an embodiment of a multi-directional antenna module including a first antenna and a second antenna coupled to a package substrate in orthogonal first and second orientations to have corresponding first and second antenna radiation patterns that are orthogonal to each other for multi-directivity, an RFIC package in the form of an antenna module that does not have a multi-directional antenna radiation pattern will first be described with reference to Fig. 1. An embodiment of a multi-directional antenna module including a first antenna and a second antenna coupled to a package substrate in orthogonal first and second orientations to have corresponding first and second antenna radiation patterns that are orthogonal to each other for multi-directivity to support RF communications will be discussed below starting with Fig. 2A.

[0018]

[0027] In this regard, Fig. 1 is a diagram of an antenna module 100 that is an RFIC package. The antenna module 100 includes an antenna substrate 102 that supports antenna elements (e.g., patch antenna elements and / or dipole antenna elements) for supporting RF communications. The antenna module 100 includes an IC die layer 106 disposed in a horizontal plane (plane along the X and Y axes) that includes an RFIC die 108 that includes an encapsulated RF transceiver IC. The RFIC die 108 may also include a power management IC (PMIC). The IC die layer 106 is mounted to a package substrate 110 that provides a support structure for the IC die layer 106, and the package substrate 110 also provides an interconnect structure for coupling the RFIC die 108 to other components and circuits in the antenna module 100. An electromagnetic interference (EMI) shield 109 is disposed around the RFIC die 108 and other components in the IC die layer 106. In this embodiment, the package substrate 110 includes a metallization substrate 112 adjacent to the IC die layer 106. The metallization substrate 112 includes a plurality of substrate metallization layers 114, each of which includes metal interconnects 116 (e.g., pads, vertical interconnect access (vias), traces, lines) formed therein to provide interconnect structures that facilitate interconnections to provide an electrical interface between the RFIC die 108 and other components and circuits in the antenna module 100. Die interconnects 118 couple the RFIC die 108 to the metal interconnects 116 in the metallization substrate 112. The metallization substrate 112 can be a coreless substrate. The substrate metallization layers 114 can be formed as separate substrate layers that are laminated together to form the metallization substrate 112. In this embodiment, the metallization substrate 112 is coupled to a core substrate 120 as part of the package substrate 110.The core substrate 120 also includes one or more metallization layers 122 including metal interconnects 124 that are coupled to vertical interconnect accesses (vias) 126 (e.g., metal pillars) that are coupled to metal interconnects 116 in adjacent metallization substrates 112 to provide electrical connectivity between the metallization substrate 112 and the core substrate 120.

[0019]

[0028] 1, the package substrate 110 in the antenna module 100 also includes an antenna substrate 102. The antenna substrate 102 is coupled to the core substrate 120 such that the core substrate 120 is disposed between the antenna substrate 102 and the metallization substrate 112 in the vertical direction (Z-axis direction) in this embodiment. The antenna substrate 102 also includes one or more metallization layers 128 including metal interconnects 130 coupled to vias 132 coupled to metal interconnects 124 in the core substrate 120. The antenna substrate 102 includes four antennas 134(1)-134(4) in this embodiment including metal patches electrically coupled to the RFIC die 108 via interconnections between the antennas 134(1)-134(4) and the corresponding metallization substrates 112, the core substrate 120, and the metal interconnects 116, 124, 130 in the antenna substrate 102. In this embodiment, each antenna 134(1)-134(4) is a patch antenna that includes an antenna element in the form of a first metal patch 136(1)-136(4) adjacent to the core substrate 120 and a second metal patch 138(1)-138(4) disposed below the corresponding first metal patch 136(1)-136(4). The first metal patches 136(1)-136(4) are coupled to the RFIC die 108 through vias 132 and metal interconnects 130, 124, 116 that function as antenna feedlines. The second metal patches 138(1)-138(4) are not in contact with the first metal patches 136(1)-136(4), but are configured to be electromagnetically (EM) coupled to the first metal patches 136(1)-136(4) when the first metal patches 136(1)-136(4) receive an RF signal to be radiated. Similarly, when the second metal patches 138(1)-138(4) are energized by a received RF signal, the second metal patches 138(1)-138(4) are EM coupled to the first metal patches 136(1)-136(4) by the received RF signal.

[0020]

[0029] The first metal patches 136(1)-136(4) and the second metal patches 138(1)-138(4) of the corresponding antennas 134(1)-134(4) are low-profile structures with corresponding radiation pattern directions 140(1)-140(4) in the antenna module 100 that are primarily vertical (Z-axis direction). However, the antennas 134(1)-134(4) do not provide radiation patterns oriented in the Y-axis or Z-axis directions of the antenna module 100 as shown in FIG. 1. It may be desirable to provide the antenna module 100 with the capability of having additional antenna radiation patterns for enhanced antenna coverage. Also, when the antenna module 100 is used for multiple-input multiple-output (MIMO) communication applications, additional antennas must be provided in the antenna module 100 to support multiple MIMO signal streams, further increasing the package size of the antenna module 100 in an undesirable manner.

[0021]

[0030] In order to provide an antenna module including a multi-directional antenna radiation pattern, a multi-directional antenna module 200 is provided in FIG. 2A and FIG. 2B. FIG. 2A shows a side cross-sectional view of the multi-directional antenna module 200. FIG. 2B shows a perspective view of the multi-directional antenna module 200. The multi-directional antenna module 200 is also referred to herein as an "antenna module 200". As shown in FIG. 2A, the antenna module 200 is incorporated in an electronic device 202 in this embodiment. The electronic device 202 includes a circuit board 204, which may be an application circuit board including a processor and / or other electronic circuitry for performing a particular application. In this embodiment, it is desired to provide wireless RF communication capabilities to the electronic device 202. Therefore, in this regard, the antenna module 200 is provided and communicatively coupled to the circuit board 204 and the electronic circuitry within the circuit board 204 to provide RF communication capabilities. The antenna module 200 includes an RFIC 206, which may be, for example, an RF system-in-package (SiP) that includes RF circuitry configured to transmit and / or receive RF signals. For example, the RFIC 206 may include circuitry that supports a communication protocol (e.g., fifth generation (5G)) that specifies the needs for wireless communication in millimeter (mm) waves.

[0022]

[0031] 2A and 2B, the RFIC 206 is coupled to a package substrate 208 disposed within a first horizontal plane P1 along the X-axis and Y-axis. As shown in FIG. 2A, the package substrate 208 includes a plurality of metallization layers 210(1)-210(3) disposed parallel to one another within the horizontal plane along the X-axis and Y-axis. Each of the metallization layers 210(1)-210(3) includes a corresponding metal interconnect 212(1)-212(3) (e.g., metal pads, metal lines, metal traces, vertical interconnect access (vias)) formed therein. The metal interconnects 212(1)-212(3) provide an interconnect structure that facilitates interconnections to provide an electrical interface between the RFIC 206 and other components within the antenna module 200. The RFIC 206 is electrically coupled to metal interconnects 212(1) in the metallization layer 210(1) of the package substrate 208, which is the outer metallization layer 210(1) of the package substrate 208, via external interconnects 214. In this manner, signals can be carried to and from the RFIC 206 via the external metal interconnects 214 (e.g., solder balls, ball grid array (BGA) interconnects), and can also be carried to the metallization layers 210(1)-201(3) in the package substrate 208 for routing to an antenna coupled to the package substrate 208.

[0023]

[0032] In this regard, as will be discussed in more detail below and shown in FIG. 2A and FIG. 2B, the antenna module 200 of this embodiment includes two antennas as a first antenna 216(1) and a second antenna 216(2). By providing the first antenna 216(1) and the second antenna 216(2) in the antenna module 200, the antenna module 200 is provided with multi-directionality of the antenna radiation pattern. As shown in FIG. 2A, the first antenna 216(1) is provided in a first antenna package 218(1) including an exposed external metal interconnect 220(1) electrically coupled to the package substrate 208. The external metal interconnect 220(1) of the first antenna package 218(1) is coupled to a metallization layer 210(1) as an outer metallization layer of a first side 221 of the package substrate 208 to couple the first antenna 216(1) to the package substrate 208. An external metal interconnect 220(2) of the second antenna package 218(2) is coupled to metallization layer 210(3) as an outer metallization layer on a second side 224 of the package substrate 208 for coupling the second antenna 216(2) to the package substrate 208. In this embodiment, the second antenna 216(2) is coupled to the second side 224 of the package substrate 208 opposite the first side 221 of the package substrate 208 to which the RFIC 206 and the first antenna 216(1) are coupled. The RFIC 206 is electrically coupled to the first antenna 216(1) and the second antenna 216(2) via a signal routing path formed by the metal interconnects 212(1)-212(3) in the metallization layers 210(1)-210(3) of the package substrate 208.

[0024]

[0033] 2A , as discussed in more detail below, the first antenna package 218(1) of the first antenna 216(1) is oriented to be coupled to the package substrate 208 of the antenna module 200 such that the first antenna 216(1) is oriented to have a first antenna radiation pattern 222(1) in a generally vertical direction (Z-axis direction) perpendicular to the horizontal plane P1 of the package substrate 208. To provide multi-directionality of the antenna radiation pattern in the antenna module 200, the second antenna package 218(2) of the second antenna 216(2) is oriented to be coupled to the package substrate 208 of the antenna module 200 such that the second antenna 216(2) is oriented to have a second antenna radiation pattern 222(2) in a generally horizontal direction (X-axis direction) parallel to the horizontal plane P1 of the package substrate 208. In this manner, the first antenna 216(1) and the second antenna 216(2) have antenna radiation patterns 222(1), 222(2) that are oriented in generally different directions, thereby providing antenna radiation pattern versatility in the antenna module 200.

[0025]

[0034] 3A and 3B are provided to show and discuss more exemplary details of the first antenna 216(1) and second antenna 216(2) of FIGs. 2A and 2B and their orientation and connectivity to the package substrate 208. FIG. 3A is a cross-sectional side view of a first antenna package 218(1) of the first antenna 216(1) coupled to the package substrate 208 of the antenna module 200 of FIGs. 2A and 2B. FIG. 3B is a cross-sectional side view of a second antenna package 218(1) of the second antenna 216(1) coupled to the package substrate 208 of the antenna module 200 of FIGs. 2A and 2B.

[0026]

[0035] 3A, first antenna package 218(1) of first antenna 216(1) is coupled to metallization layer 210(1) on first side 221 of package substrate 208 via external metal interconnect 220(1). External metal interconnect 220(1) is shown in this example as being coupled to metal interconnect 212(1) in metallization layer 210(1) as well as to external metal interconnect 300(1) (e.g., a solder bump) formed in contact with metal interconnect 212(1) in metallization layer 210(1). In this example, first antenna 216(1) includes four patch antennas 304(1)-304(4). Each patch antenna 304(1)-304(4) includes two antenna elements 306(1)(1)-306(2)(4) (also generally referred to as "antenna elements 306"). An antenna element is a metallic component capable of radiating RF energy and receiving radiated RF energy. In this embodiment, the antenna elements 306(1)(1)-306(2)(4) are metallic patches, which are metallic structures with a planar or substantially planar shape. Each of the antenna elements 306(1)(1)-306(1)(4) is disposed in a second horizontal plane P2 (in the X-axis and Y-axis directions) and is directly coupled to an external metallic interconnect 300(1) of the first antenna package 218(1), which forms part of the antenna feedline for the corresponding antenna element 306(1)(1)-306(1)(4). Antenna elements 306(2)(1)-306(2)(4) are disposed in a third horizontal plane P3 (in the X-axis and Y-axis directions) separated from corresponding antenna elements 306(1)(1)-306(2)(4) by a distance D1 by dielectric layer 308. Antenna elements 306(2)(1)-306(2)(4) are configured to be EM coupled to corresponding antenna elements 306(1)(1)-306(1)(4) upon receiving a transmit RF signal from RFIC 206, which is to be wirelessly transmitted and radiated via antenna elements 306(2)(1)-306(2)(4).Antenna elements 306(1)(1)-306(1)(4) are configured to be EM coupled to corresponding antenna elements 306(2)(1)-306(2)(4) when antenna elements 306(2)(1)-306(2)(4) receive an RF signal as a received signal to be distributed to RFIC 206 via package substrate 208.

[0027]

[0036] 3A , the first antenna package 218(1) is configured such that the antenna elements 306(1)(1)-306(2)(4) are oriented in a second horizontal plane P2 and a third horizontal plane P3 that are parallel to the first horizontal plane P1 of the package substrate 208 when the first antenna package 218(1) is coupled to the package substrate 208. This orientation forces the first antenna radiation pattern 222(1) of the antenna elements 306(2)(1)-306(2)(4) of the first antenna 216(1) to be in a vertical direction (Z-axis direction) perpendicular to the horizontal plane P1 of the package substrate 208.

[0028]

[0037] The second antenna 216(2) and its second antenna package 218(2) are shown in more detail in FIG. 3B. As shown in FIG. 3B, the second antenna 216(2) includes a patch antenna 310. The patch antenna 310 includes two antenna elements 312(1), 312(2) (also generally referred to as "312") in the form of metal patches. The antenna elements 312(1), 312(2) are disposed in corresponding vertical planes P4, P5 (in the X-axis and Z-axis directions), respectively. The antenna element 312(1) is directly coupled to an external metal interconnect 220(2) of the second antenna package 218(2), which forms part of the antenna feedline for the patch antenna 310. As described above, by orienting the antenna elements 312(1), 312(2) in corresponding vertical planes P4, P5, a second antenna radiation pattern 222(2) of the second antenna 216(2) is defined to be orthogonal to the first antenna radiation pattern 222(1) of the first antenna 216(1) to provide multi-directionality of the antenna radiation patterns in the antenna module 200. A dielectric layer 313 is interposed between the antenna elements 312(1), 312(2). The antenna element 312(2) is configured to be EM coupled to the antenna element 312(1) upon the antenna element 312(1) receiving a transmit RF signal from the RFIC 206, which is to be wirelessly transmitted and radiated via the antenna element 312(2) in the second antenna radiation pattern 222(1). Antenna element 312(2) is also configured to be EM coupled to antenna element 312(1) when antenna element 312(2) receives an RF signal as a receive signal that is delivered to RFIC 206 via package substrate 208.

[0029]

[0038] It should be noted that additional antenna elements forming other patch antennas, not shown, may be provided in the second antenna package 218(2). For example, one of the metal interconnects 220(2) of the second antenna package 218(2) in FIG. 3B is shown as unbonded, but the metal interconnect 220(2) in the form of a metal pad is bonded to another antenna element, not shown, that is behind the cross-sectional view of FIG. 3B.

[0030]

[0039] 3B, to provide multi-directionality for the antenna module 200, it is desirable to provide that the second antenna package 218(2) is configured to couple its metal interconnect 220(2) to the package substrate 208 in a manner that forces the orientation of the antenna elements 312(1), 312(2) in their vertical planes P4, P5. However, unlike the antenna elements 306(1)(1)-306(2)(4) in the first antenna package 218(1) shown in FIG. 3A, which are oriented in horizontal planes P2, P3 parallel to the package substrate 208, the antenna elements 312(1), 312(2) of the second antenna 216(2) are oriented in vertical planes P4, P5 perpendicular to the package substrate 208. Therefore, in this embodiment, the external metal interconnect 220(2), which is used to couple the second antenna package 218(1) of the second antenna 216(2) to the metallization layer 210(3) on the second side 224 of the package substrate 208, is provided in the form of a metal pad. The external metal interconnect 220(2) in the form of a metal pad is exposed from the outer surface 314 of the second antenna package 218(2). The fact that the external metal interconnect 220(2) is a metal pad provides a sufficient metal surface area for coupling to the package substrate 208 and allows flexibility in the coupling of the antenna elements 312(1), 312(2) of the second antenna 216(2), which are oriented in the vertical planes P4, P5 perpendicular to the package substrate 208. The external metal interconnect 220(2) coupled to the antenna element 312(1) may extend to have a first metal portion 316(1) that intersects with a corresponding vertical plane P4 of the antenna element 312(1) and a second metal portion 316(2) that extends in a direction perpendicular to the vertical plane P4 of the antenna element 312(1) and does not intersect with the vertical plane P4 of the antenna element 312(1). In this embodiment, the external metal interconnect 220(2) is coupled to a metal interconnect 212(3) of the metallization layer 210(3) of the package substrate 208 via a metal contact 318 that is coupled to the external metal interconnect 220(2).For example, the external metal interconnects 220(2) may be in the form of metal pads, allowing the second antenna package 218(2) to be surface mounted to the package substrate 208, such as using surface mount technology (SMT).

[0031]

[0040] 2A and 2B, in the embodiment of the antenna module 200, the second antenna package 218(2) is coupled to a second side 224 of the package substrate 208, opposite the first side 221 to which the first antenna package 218(1) is coupled. This may be advantageous for saving space and height because the package substrate 208 extends horizontally (in the X-axis direction) beyond the circuit board 204, thereby allowing the second antenna package 218(2) to be located adjacent to a side 226 of the circuit board 204, which has additional area. If the second antenna package 218(2) were coupled to the first side 226 of the package substrate 208, the overall height of the electronic device 202 in the vertical direction (in the Z-axis direction) may be increased. In this regard, the circuit board 204 has a first side 226, a second side 228 opposite the first side, a third side 230 adjacent to the package substrate 208 and adjacent to the first side 226 and the second side 228, and a fourth side 232 opposite the third side 230 and adjacent to the first side 226 and the second side 228. This arrangement results from the package substrate 208 having a first section 234 coupled to the third side 230 of the circuit board 204 and a second section 236 extending in a horizontal direction (X-axis direction) beyond the vertical plane P6 of the third side 226 of the circuit board 204, which extends in a vertical direction (Z-axis direction). The first section 234 of the package substrate is coupled to the third side 230 of the circuit board 204. An external metal interconnect 220(1) of a first antenna package 218(1) is bonded to a metallization layer 210(1) in a first section 234 of the package substrate 208. An external metal interconnect 220(2) of a second antenna package 218(2) is bonded to a metallization layer 210(3) in a first section 236 of the package substrate 208.

[0032]

[0041] Another way to provide for the first and second antennas to be coupled to the package substrate in mutually orthogonal orientations for multi-directionality is to provide for the package substrate to be flexible. This is shown in the exemplary antenna module 400 of FIG. 4. FIG. 4 shows a side cross-sectional view of another multi-directional antenna module 400, also referred to herein as "antenna module 400". As shown in FIG. 4, the antenna module 400 is incorporated in an electronic device 402 in this example. The electronic device 402 includes a circuit board 404, which may be an application circuit board including a processor and / or other electronic circuitry for performing a particular application. The antenna module 400 includes an RFIC 406, which may be an RF system-in-package (SiP), including RF circuitry configured to transmit and / or receive RF signals. The RFIC 406 is coupled to a bent package substrate 408 having a first section 410(1) disposed in a first horizontal plane P7 in the X-axis and Y-axis directions and a second section 410(2) disposed in a second vertical plane P8 in the X-axis and Z-axis directions by being bent approximately 90 degrees from the first section 410(1). This creates a curved section 410(3) in the package substrate 408 between the first section 410(1) and the second section 410(2) because the package substrate 408 has a minimum bend radius R1 to avoid damaging the package substrate 408. This allows both the first antenna 416(1) coupled to the first section 410(1) of the package substrate 408 and the second antenna 416(2) coupled to the second section 410(2) to be coupled to the package substrate 408 in the same orientation. For example, the first antenna 416(1) and the second antenna 416(2) can both be similar to the first antenna 216(1) in the antenna module 200 of FIGS. 2A and 2B.However, because the second antenna 416(2) is attached to the bent section 410(3) of the package substrate 408, this causes the second antenna 416(2) to be oriented orthogonal to the first antenna 416(1) and to have corresponding orthogonal antenna radiation patterns 422(1), 422(2).

[0033]

[0042] Continuing to refer to FIG. 4, the antenna module 400 of FIG. 4 has multi-directional antenna radiation patterns 422(1), 422(2) of the first antenna 416(1) and the second antenna 416(2), but it is difficult to precisely control the bending of the package substrate 408 during manufacturing. The combined height H1 of the package substrate 408 and the second antenna 416(2) in the vertical direction (Z-axis direction) is also increased because the height H1 must take into account and include the height H2 of the curved section 410(3), which cannot support the mounting of a portion of the second antenna 416(1). The second antenna 416(2) is coupled to a flat portion of the second curved section 410(3) of the package substrate 408. The height H1 can be reduced by reducing the height H3 of the second antenna 416(2), but this may reduce the antenna performance of the second antenna 416(2) in an undesirable manner. Furthermore, because the package substrate 408 is flexible, a ground plane for the second antenna 416(2), which is formed in the curved section 410(3) of the package substrate 408, may have to include air gaps (e.g., a mesh structure) to allow the package substrate 408 to flex without damaging such ground plane. This may also result in the ground plane configured for the second antenna 416(2) resulting in reduced antenna performance of the second antenna 416(2).

[0034]

[0043] Other orientations of the antenna module 200 of Figures 2A and 2B are possible that do not have a bent package substrate 208, but provide for the first and second antenna packages 218(1) and 218(2) of corresponding first and second antennas 216(1), 216(2) to be coupled to the package substrate 208 and disposed orthogonally to one another. For example, Figure 5 is a side view of the same circuit board 204 provided in the electronic device 202 of Figures 2A and 2B. In the alternative electronic device 504 of FIG. 5, a multi-directional antenna module 500 is provided that is similar to the antenna module 200 of FIGs. 2A and 2B, but in which the first antenna packages 218(1) and second antenna packages 218(2) of corresponding first and second antennas 216(1) and 216(2) are coupled to the same side 221 of the package substrate 208, and therefore to the same metallization layer 210(1) of the package substrate 208. Elements common to the antenna module 500 of FIG. 5 and the antenna module 200 of FIGs. 2A and 2B are indicated with common element numbers in FIGs. 2A, 2B, and 5. The above description of such common elements is also applicable to the antenna module 500 of FIG. 5 and will not be described again.

[0035]

[0044] There are various ways in which multi-directional antenna modules, including the antenna modules 200, 500 of Figures 2A-3B and 5, can be formed and manufactured, including the antenna modules of Figures 2A-3B and 5, which include a first antenna coupled to a package substrate in a first orientation to have a first antenna radiation pattern in a first direction relative to the package substrate, and a second antenna that, when the antenna package is coupled to the package substrate, forces a second orientation of the second antenna to provide a second antenna radiation pattern in a second direction orthogonal to the first direction to support the multi-directional antenna radiation pattern. In this regard, Figure 6 is a flow chart illustrating an exemplary manufacturing process 600 for manufacturing such a multi-directional antenna. The manufacturing process 600 of Figure 6 is discussed with respect to the antenna module 200 of Figures 2A and 2B as an example embodiment.

[0036]

[0045] In this regard, as shown in FIG. 6, a manufacturing process 600 includes preparing a package substrate 208 disposed in a first plane P1, which includes forming a plurality of metallization layers 210(1)-210(3) parallel to one another (block 602 of FIG. 6). The manufacturing process 600 also includes preparing a first antenna 216(1), which includes preparing a first antenna package 218(1) including a first antenna element 306 disposed in a second plane P2 parallel to the first plane P1 and a first external metal interconnect 220(1) coupled to the first antenna element 306 (block 604 of FIG. 6). The manufacturing process 600 also includes coupling the first external metal interconnect 220(1) to at least one first metallization layer 210(1)-210(3) of the plurality of metallization layers 210(1)-210(3) of the package substrate 208 (block 606 of FIG. 6 ). The manufacturing process 600 also includes preparing a second antenna 216(2), which includes providing a second antenna package 218(2) comprising a second antenna element 312(1) disposed in a third plane P4 orthogonal to the second plane P2 and a second external metal interconnect 220(2) coupled to the second antenna element 312 (block 608 of FIG. 6 ). The manufacturing process 600 also includes coupling the second external metal interconnect 220(2) to at least one second metallization layer 210(1)-210(3) of the plurality of metallization layers 210(1)-210(3) of the package substrate 208 (block 610 of FIG. 6 ). The manufacturing process 600 also includes coupling the RFIC 206 to the at least one first metallization layer 210(1)-210(3) and the at least one second metallization layer 210(1)-210(3) of the package substrate 208 to electrically couple the RFIC 206 to the first antenna element 306 and the second antenna element 312 (block 612 of FIG. 6 ).

[0037]

[0046] Other manufacturing methods are also possible. For example, Fig. 7 is another exemplary manufacturing process 700 for manufacturing an antenna module, such as the antenna module 200 of Fig. 2A and Fig. 2B and the antenna module 500 of Fig. 5, according to the manufacturing steps 800A-800D of Fig. 8A-8D. Next, 800A-800D of Fig. 8A-8D according to the exemplary manufacturing process 700 of Fig. 7 will be discussed with respect to the antenna module 200 of Fig. 2A and Fig. 2B as an example.

[0038]

[0047] In this regard, as shown in the exemplary manufacturing stage 800A of FIG. 8A, the first step in the manufacturing process 700 is to prepare a package substrate 208 (block 702 of FIG. 7). The package substrate 208 can be formed as multiple metallization layers 210(1)-210(3) stacked on top of each other. The package substrate 208 can be formed as one or more redistribution layers (RDLs). The package substrate 208 can be a core substrate or a coreless substrate. The package substrate 208 can include one or more buried trace substrate (ETS) layers in which metal interconnects are embedded within corresponding insulating layers.

[0039]

[0048] As shown in the exemplary manufacturing stage 800B of FIG. 8B, the next step in the manufacturing process 700 is to bond the RFIC 206 to the metallization layer 210(1) of the package substrate 208 (block 704 of FIG. 7). As shown in the exemplary manufacturing stage 800C of FIG. 8C, the next step in the manufacturing process 700 is to bond the first antenna 216(1), and more specifically, its first antenna package 218(1), to the metallization layer 210(1) of the package substrate 208 (block 706 of FIG. 7). As discussed above, this involves bonding the metal interconnect 220(1) of the first antenna package 218(1) to the metal interconnect 212(1) of the metallization layer 210(1) of the package substrate 208. As shown in the exemplary manufacturing stage 800D of FIG. 8D, the next step in the manufacturing process 700 is to bond the second antenna 216(2), and more specifically, its second antenna package 218(2), to the metallization layer 210(3) of the package substrate 208 such that the second antenna 216(2) is oriented orthogonal to the first antenna 216(1) (block 708 of FIG. 7). As discussed above, this involves bonding the metal interconnect 220(2) of the second antenna package 218(2) to the metal interconnect 212(3) of the metallization layer 210(3) of the package substrate 208. The metal interconnect 220(2) may be a metal pad that is surface mounted to the package substrate 208.

[0040]

[0049] A multi-directional antenna module including a first antenna coupled to a package substrate in a first orientation to have a first antenna radiation pattern in a first direction relative to the package substrate, and a second antenna, the second antenna forcing a second orientation of the second antenna to provide a second antenna radiation pattern in a second direction orthogonal to the first direction when the antenna package is coupled to the package substrate to support a multi-directional antenna radiation pattern, including but not limited to the multi-directional antenna modules of FIGS. 2-3B and 8A-8D and according to any of the manufacturing processes of FIGS. 6 and 7, may be provided or integrated in any wireless communication device and / or processor-based device. Examples include, but are not limited to, set-top boxes, entertainment units, navigation devices, communication devices, fixed position data units, mobile position data units, global positioning system (GPS) devices, mobile phones, cellular phones, smartphones, Session Initiation Protocol (SiP) phones, tablets, phablets, servers, computers, portable computers, mobile computing devices, wearable computing devices (e.g., smart watches, health or fitness trackers, eyewear, etc.), desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, automobiles, vehicle components, avionics systems, drones, and multicopters.

[0041]

[0050] 9 illustrates an exemplary wireless communication device 900 including a multi-directional antenna module 902 including a first antenna coupled to a package substrate in a first orientation to have a first antenna radiation pattern in a first direction relative to the package substrate, and a second antenna that, when the antenna package is coupled to the package substrate, forces a second orientation of the second antenna to provide a second antenna radiation pattern in a second direction orthogonal to the first direction to support a multi-directional antenna radiation pattern, including but not limited to the multi-directional antenna modules of FIGS. 2-3B, 5, and 8A-8D, and according to any of the manufacturing processes of FIGS. 6 and 7. The wireless communication device 900 may include or be provided in any of the devices mentioned above, as examples. As illustrated in FIG. 9, the wireless communication device 900 includes a transceiver 904 and a data processor 906. The data processor 906 may include memory for storing data and program codes. The transceiver 904 includes a transmitter 908 and a receiver 910 supporting bidirectional communication. In general, the wireless communication device 900 may include any number of transmitters 908 and / or receivers 910 for any number of communication systems and frequency bands. All or a portion of the transceiver 904 may be implemented on one or more analog ICs, RFICs, mixed-signal ICs, etc.

[0042]

[0051] The transmitter 908 or receiver 910 may be implemented using a super-heterodyne architecture or a direct-conversion architecture. In a super-heterodyne architecture, the signal is frequency converted between RF and baseband in multiple stages, e.g., for the receiver 910, from RF to an intermediate frequency (IF) in one stage and then from IF to baseband in another stage. In a direct-conversion architecture, the signal is frequency converted between RF and baseband in one stage. The super-heterodyne and direct-conversion architectures may use different circuit blocks and / or have different requirements. In the wireless communication device 900 of FIG. 9, the transmitter 908 and receiver 910 are implemented using a direct-conversion architecture.

[0043]

[0052] For the transmit path, a data processor 906 processes data to be transmitted and provides I and Q analog output signals to a transmitter 908. In the exemplary wireless communication device 900, the data processor 906 includes digital-to-analog converters (DACs) 912(1), 912(2) for converting digital signals generated by the data processor 906 into I and Q analog output signals, e.g., I and Q output currents, for further processing.

[0044]

[0053] Within transmitter 908, low pass filters 914(1), 914(2) filter the I and Q analog output signals, respectively, to remove undesired signals resulting from previous digital-to-analog conversion. Amplifiers (AMPs) 916(1), 916(2) amplify the signals from low pass filters 914(1), 914(2), respectively, to provide I and Q baseband signals. An upconverter 918 upconverts the I and Q baseband signals using I and Q LO signals from a transmit (TX) local oscillator (LO) signal generator 922 via mixers 920(1), 920(2) to provide an upconverted signal 924. A filter 926 filters upconverted signal 924 to remove undesired signals resulting from frequency upconversion as well as noise in the receive frequency band. A power amplifier (PA) 928 amplifies the upconverted signal 924 from filter 926 to obtain a desired output power level and provides a transmit RF signal. The transmit RF signal is routed through a duplexer or switch 930 and transmitted via an antenna 932.

[0045]

[0054] In the receive path, an antenna 932 receives a signal transmitted by a base station and provides a receive RF signal, which is routed through a duplexer or switch 930 and provided to a low noise amplifier (LNA) 934. The duplexer or switch 930 is designed to operate using a specific RX to TX duplexer frequency separation such that the receive (RX) signal is separated from the TX signal. To obtain a desired RF input signal, the receive RF signal is amplified by the LNA 934 and filtered by a filter 936. Downconversion mixers 938(1), 938(2) mix the output of the filter 936 with an I RX LO signal and a Q RX LO signal (i.e., LO_I and LO_Q) from an RX LO signal generator 940 to generate an I baseband signal and a Q baseband signal. The I and Q baseband signals are amplified by AMPs 942(1), 942(2) and further filtered by low pass filters 944(1), 944(2) to obtain I and Q analog input signals, which are provided to data processor 906. In this embodiment, data processor 906 includes analog-to-digital converters (ADCs) 946(1), 946(2) for converting the analog input signals to digital signals that can be further processed by data processor 906.

[0046]

[0055] In the wireless communication device 900 of FIG. 9, a TX LO signal generator 922 generates an I TX LO signal and a Q TX LO signal used for frequency up-conversion, while a RX LO signal generator 940 generates an I RX LO signal and a Q RX LO signal used for frequency down-conversion. Each LO signal is a periodic signal having a particular fundamental frequency. A TX phase-locked loop (PLL) circuit 948 receives timing information from the data processor 906 and generates a control signal used to adjust the frequency and / or phase of the TX LO signal from the TX LO signal generator 922. Similarly, a RX PLL circuit 950 receives timing information from the data processor 906 and generates a control signal used to adjust the frequency and / or phase of the RX LO signal from the RX LO signal generator 940.

[0047]

[0056] 10 illustrates an embodiment of a processor-based system 1000. A component of the processor-based system 1000 is an IC 1002. Some or all of the ICs 1002 in the processor-based system 1000 may include a multi-directional antenna module 1004 including a first antenna coupled to a package substrate in a first orientation to have a first antenna radiation pattern in a first direction relative to the package substrate, and a second antenna that, when the antenna package is coupled to the package substrate, forces a second orientation of the second antenna to provide a second antenna radiation pattern in a second direction orthogonal to the first direction to support a multi-directional antenna radiation pattern, including but not limited to the multi-directional antenna modules of FIGS. 2-3B, 5, and 8A-8D, and according to any of the manufacturing processes of FIGS. 6 and 7. In this embodiment, the processor-based system 1000 may be formed as a system-on-chip (SoC) 1006 including the multi-directional antenna module 1004. The processor-based system 1000 includes a CPU 1008 including one or more processors 1010, which may also be referred to as a CPU core or processor core. The CPU 1008 may have a cache memory 1012 coupled to the CPU 1008 for quick access to temporarily stored data. The CPU 1008 is coupled to a system bus 1014, which may interconnect master and slave devices included within the processor-based system 1000. As is well known, the CPU 1008 communicates with these other devices by exchanging address, control, and data information via the system bus 1014. For example, the CPU 1008 may communicate bus transaction requests to a memory controller 1016, which is an example of a slave device. Although not shown in FIG. 10, multiple system buses 1014 may be provided, with each system bus 1014 constituting a different fabric.

[0048]

[0057] Other master and slave devices may be connected to the system bus 1014. As shown in FIG. 10, these devices may include, by way of example, a memory system 1020 including a memory controller 1016 and a memory array 1018, one or more input devices 1022, one or more output devices 1024, one or more network interface devices 1026, and one or more display controllers 1028. Each of the memory system 1020, the one or more input devices 1022, the one or more output devices 1024, the one or more network interface devices 1026, and the one or more display controllers 1028 may be provided in the same IC package or in different IC packages. The input devices 1022 may include any type of input device, including, but not limited to, input keys, switches, audio processors, and the like. The output devices 1024 may include any type of output device, including, but not limited to, audio indicators, video indicators, other visual indicators, and the like. The network interface device 1026 may be any device configured to enable the exchange of data with the network 1030. The network 1030 may be any type of network, including, but not limited to, a wired or wireless network, a private or public network, a local area network (LAN), a wireless local area network (WLAN), a wide area network (WAN), a BLUETOOTH™ network, and the Internet. The network interface device 1026 may be configured to support any type of communication protocol desired.

[0049]

[0058] The CPU 1008 may also be configured to access a display controller 1028 via the system bus 1014 to control information sent to one or more displays 1032. The display controller 1028 sends information to be displayed to the display 1032 via one or more video processors 1034, which process the information to be displayed into a suitable format for the display 1032. The display controller 1028 and the video processor 1034 may be included in the same or different IC packages, and as an example, may be included in the same or different IC package that includes the CPU 1008. The display 1032 may include any type of display, including, but not limited to, a cathode ray tube (CRT), a liquid crystal display (LCD), a plasma display, a light emitting diode (LED) display, etc.

[0050]

[0059] Those skilled in the art will further appreciate that the various exemplary logic blocks, modules, circuits, and algorithms described in connection with the aspects disclosed herein can be implemented as electronic hardware, as instructions stored in a memory or another computer-readable medium and executed by a processor or other processing device, or as a combination of both. The memories disclosed herein can be of any type and size and can be configured to store any type of information desired. To clearly illustrate this interchangeability, various exemplary components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. How such functionality is implemented depends on the specific application, design choices, and / or design constraints imposed on the overall system. Those skilled in the art can implement the described functionality in various ways for each specific application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

[0051]

[0060] The various example logic blocks, modules, and circuits described in connection with the aspects disclosed herein may be implemented or performed using a processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof, designed to perform the functions described herein. A processor may be a microprocessor, but alternatively, a processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration).

[0052]

[0061] Aspects disclosed herein may be embodied in hardware and / or instructions stored in the hardware and may reside in, for example, a random access memory (RAM), a flash memory, a read only memory (ROM), an electrically programmable ROM (EPROM), an electrically erasable programmable ROM (EEPROM), a register, a hard disk, a removable disk, a CD-ROM, or any other form of computer readable medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium. Alternatively, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a remote station. Alternatively, the processor and the storage medium may reside as separate components in a remote station, a base station, or a server.

[0053]

[0062] It should also be noted that the operational steps described in any of the exemplary aspects herein are described to provide examples and discussion. The described operations may be performed in many different sequences other than the sequence shown. Furthermore, an operation described in a single operational step may actually be performed in several different steps. Furthermore, one or more operational steps discussed in the exemplary aspects may be combined. It should be understood that the operational steps shown in the flow chart diagrams may be modified in many different ways, as would be readily apparent to one of ordinary skill in the art. Those skilled in the art will also appreciate that information and signals may be represented using any of a wide variety of technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips, as may be referred to throughout the above description, may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0054]

[0063] The above description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other variations. Thus, the disclosure is not intended to be limited to the embodiments and designs described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0055]

[0064] Example implementations are described in the following numbered aspects / clauses. 1. An antenna module comprising: a package substrate disposed in a first plane, the package substrate including a plurality of parallel metallization layers; a first antenna including a first antenna package, a first antenna element disposed in a second plane parallel to the first plane; a first antenna including a first external metal interconnect coupled to the first antenna element and to at least a first metallization layer of the plurality of metallization layers; a second antenna including a second antenna package, a second antenna element disposed in a third plane orthogonal to the second plane; a second antenna including a second external metal interconnect coupled to the second antenna element and to at least a second metallization layer of the plurality of metallization layers; and a radio frequency integrated circuit (RFIC) package coupled to at least one first metallization layer and at least one second metallization layer for electrically coupling the RFIC to the first antenna element and the second antenna element. 2. a first antenna element having a first radiation pattern configured to radiate a radio frequency (RF) signal in a first direction orthogonal to a first plane; a second antenna element having a second radiation pattern configured to radiate RF signals in a second direction parallel to the first plane; 2. Antenna module according to clause 1. 3. The second antenna package further includes an outer surface; a second external metal interconnect including a metal pad disposed on an outer surface of the second antenna package; a metal contact coupled to the metal pad and the at least one second metallization layer for coupling the second antenna element to the RFIC; Antenna modules as specified in clauses 1 and 2. 4. The antenna module of clause 3, wherein the metal pad includes a first metal portion that intersects with the third plane of the second antenna element. 5. the metal pad further includes a second metal portion extending in a direction perpendicular to the third plane of the second antenna element and not intersecting the third plane of the second antenna element; a metal contact is coupled to the second metal portion of the metal pad for coupling the second antenna element to the at least one second metallization layer; Antenna modules as specified in clauses 3 and 4. 6. The antenna module of any of clauses 1 and 2, wherein at least a portion of the second external metallic interconnect intersects with the third plane of the second antenna element. 7. The antenna module of any of clauses 1 to 7, wherein the second antenna element includes a second metal patch. 8. A second antenna package, an additional second antenna element disposed in a fourth plane parallel to the third plane of the second antenna element; 8. The antenna module of clause 7, further comprising at least one dielectric layer disposed between the second antenna element and the additional second antenna element. 9. The antenna module of clause 8, wherein an additional second antenna element is configured to be electromagnetically (EM) coupled to the second antenna element in response to the second antenna element radiating a radio frequency (RF) signal received on the second external metallic interconnect. 10. The antenna module of any of clauses 1-9, wherein the first antenna element includes a first metal patch. 11. A first antenna package comprising: an additional first antenna element disposed in a fourth plane parallel to the second plane of the first antenna element; 11. The antenna module of clause 10, further comprising at least one dielectric layer disposed between the first antenna element and the additional first antenna element. 12. The antenna module of any of clauses 10 and 11, wherein the first external metal interconnect comprises a solder bump. 13. A plurality of metallization layers a first outer metallization layer disposed on a first side of the package substrate; a second outer metallization layer disposed on a second side of the package substrate opposite the first side; a first external metal interconnect is coupled to the first outer metallization layer and thereby to the at least one first metallization layer; a second external metal interconnect is coupled to the second outer metallization layer and thereby to the at least one second metallization layer; An antenna module according to any one of clauses 1 to 12. 14. A plurality of metallization layers a first outer metallization layer disposed on a first side of the package substrate; a second outer metallization layer disposed on a second side of the package substrate opposite the first side; a first external metal interconnect is coupled to the first outer metallization layer and thereby to the at least one first metallization layer; a second external metal interconnect is coupled to the first outer metallization layer and thereby to at least one second metallization layer; An antenna module according to any one of clauses 1 to 12. 15. The antenna module of any of clauses 1-14, wherein the antenna module is integrated into a device selected from the group consisting of a set-top box, an entertainment unit, a navigation device, a communications device, a fixed location data unit, a mobile location data unit, a global positioning system (GPS) device, a mobile phone, a cellular phone, a smartphone, a session initiation protocol (SIP) phone, a tablet, a phablet, a server, a computer, a portable computer, a mobile computing device, a wearable computing device, a desktop computer, a personal digital assistant (PDA), a monitor, a computer monitor, a television, a tuner, a radio, a satellite radio, a music player, a digital music player, a portable music player, a digital video player, a video player, a digital video disc (DVD) player, a portable digital video player, an automobile, a vehicle component, an avionics system, a drone, and a multicopter. 16. A method of manufacturing an antenna module having multiple antennas for providing a multi-directional antenna radiation pattern, comprising: providing a package substrate disposed in a first plane, the package substrate including forming a plurality of metallization layers parallel to one another; providing a first antenna, the first antenna package including a first antenna element disposed in a second plane parallel to the first plane and a first external metallic interconnect coupled to the first antenna element; coupling a first external metal interconnect to at least a first metallization layer of a plurality of metallization layers of a package substrate; providing a second antenna, the second antenna package including a second antenna element disposed in a third plane orthogonal to the second plane and a second external metallic interconnect coupled to the second antenna element; coupling a second external metal interconnect to at least a second metallization layer of the plurality of metallization layers of the package substrate; and coupling a radio frequency integrated circuit (RFIC) to at least one first metallization layer and at least one second metallization layer of a package substrate to electrically couple the RFIC to the first antenna element and the second antenna element. 17. The second antenna package further includes an outer surface; a second external metal interconnect including a metal pad disposed on an outer surface of the second antenna package; coupling the second external metal interconnect to the at least one second metallization layer includes coupling metal contacts to the metal pads and the at least one second metallization layer for coupling the second antenna element to the RFIC. Methodology of Article 16. 18. the metal pad includes a first metal portion intersecting the third plane of the second antenna element and a second metal portion extending in a direction perpendicular to the third plane of the second antenna element and not intersecting the third plane of the second antenna element; coupling the second external metal interconnect to the at least one second metallization layer includes coupling a metal contact to the second metal portion of the metal pad and to the at least one second metallization layer for coupling the second antenna element to the RFIC. Methodology of Clause 17. 19. The method of any of clauses 16-18, wherein the second antenna element includes a second metal patch. 20. The method of clause 19, wherein providing the second antenna package further includes providing an additional second antenna element disposed in a fourth plane parallel to the third plane of the second antenna element. 21. The method of clause 20, wherein providing the second antenna package further comprises providing at least one dielectric layer between the second antenna element and the additional second antenna element. twenty two. forming a plurality of metallization layers parallel to one another; forming a first outer metallization layer disposed on a first side of a package substrate; forming a second outer metallization layer disposed on a second side of the package substrate opposite the first side; coupling the first external metal interconnect to the at least one first metallization layer includes coupling the first external metal interconnect to a first outer metallization layer; bonding the second external metal interconnect to the at least one first metallization layer includes bonding the second external metal interconnect to a second outer metallization layer; Any of the methods set out in clauses 16 to 21. twenty three. forming a plurality of metallization layers parallel to one another; forming a first outer metallization layer disposed on a first side of a package substrate; forming a second outer metallization layer disposed on a second side of the package substrate opposite the first side; coupling the first external metal interconnect to the at least one first metallization layer includes coupling the first external metal interconnect to a first outer metallization layer; bonding the second external metal interconnect to the at least one first metallization layer includes bonding the second external metal interconnect to the first outer metallization layer; Any of the methods set out in clauses 16 to 21. 24. An electronic device comprising: a circuit board including a first side, a second side opposite the first side, a third side adjacent the first side and the second side, and a fourth side adjacent the first side and the second side and opposite the third side; 1. An antenna module, comprising: a package substrate disposed in a horizontal first plane; a first antenna disposed in a second plane parallel to the first plane; a second antenna disposed in a third plane orthogonal to the second plane; an antenna module including a radio frequency integrated circuit (RFIC) package, the RFIC package coupled to a package substrate for electrically coupling the RFIC to the first antenna and the second antenna; The package substrate is a first section coupled to a first side of the circuit board; a second section extending horizontally beyond a vertical surface of a third side of the circuit board extending in a vertical direction perpendicular to the horizontal direction; a first antenna coupled to the first section of the package substrate; a second antenna coupled to the second section of the package substrate; Electronic devices. 25. The electronic device of clause 24, wherein a second antenna is disposed adjacent to a third side of the circuit board. 26. the package substrate includes a plurality of metallization layers each extending horizontally and parallel to one another; The first antenna includes a first antenna package, the first antenna package comprising: a first antenna element disposed in a second plane parallel to the first plane; a first external metallic interconnect coupled to the first antenna element; The second antenna includes a second antenna package, the second antenna package comprising: a second antenna element disposed in a third plane orthogonal to the second plane; a second external metallic interconnect coupled to the second antenna element; a first antenna coupled to the first section of the package substrate with a first external metal interconnect further coupled to at least one first metallization layer of the plurality of metallization layers in the first section of the package substrate; a second antenna is coupled to the second section of the package substrate with a second external metal interconnect further coupled to at least one second metallization layer of the plurality of metallization layers in the second section of the package substrate; an RFIC package coupled to the at least one first metallization layer and the at least one second metallization layer for electrically coupling the RFIC to the first antenna element and the second antenna element; Any electronic device covered by clauses 24 and 25. 27. A plurality of metallization layers a first outer metallization layer disposed on a first side of the package substrate; a second outer metallization layer disposed on a second side of the package substrate opposite the first side; a first external metal interconnect is coupled to the at least one first metallization layer by being coupled to a first outer metallization layer in a first section of the package substrate; a second external metal interconnect is coupled to a second outer metallization layer within the first section of the package substrate, and thereby coupled to the at least one second metallization layer; Article 26 Electronic Devices. 28. A plurality of metallization layers a first outer metallization layer disposed on a first side of the package substrate; a second outer metallization layer disposed on a second side of the package substrate opposite the first side; a first external metal interconnect is coupled to the at least one first metallization layer by being coupled to a first outer metallization layer in a first section of the package substrate; a second external metal interconnect is coupled to the first outer metallization layer in the first section of the package substrate and thereby coupled to the at least one second metallization layer; Article 26 Electronic Devices.

Claims

1. 1. An antenna module, comprising: a package substrate disposed in a first plane, the package substrate including a plurality of parallel metallization layers, the package substrate being unbent; a first antenna including a first antenna package, a first antenna element disposed in a second plane parallel to the first plane; a first antenna including: a first external metal interconnect coupled to the first antenna element and to at least one first metallization layer of the plurality of metallization layers; a second antenna including a second antenna package, a second antenna element disposed in a third plane orthogonal to the second plane; a second antenna including: a second external metal interconnect coupled to the second antenna element and to at least one second metallization layer of the plurality of metallization layers; a radio frequency integrated circuit (RFIC) package coupled to the at least one first metallization layer and the at least one second metallization layer for electrically coupling the RFIC to the first antenna element and the second antenna element; the second antenna package further includes an outer surface; the second external metal interconnect includes a metal pad disposed on the outer surface of the second antenna package; The antenna module is a metal contact coupled to the metal pad and the at least one second metallization layer for coupling the second antenna element to the RFIC, wherein the metal pad includes a first metal portion that intersects the third plane of the second antenna element; a second metal portion extending in a direction perpendicular to the third plane of the second antenna element and not intersecting the third plane of the second antenna element; the metal contact is coupled to the second metal portion of the metal pad for coupling the second antenna element to the at least one second metallization layer.

2. the first antenna element has a first radiation pattern configured to radiate a radio frequency (RF) signal in a first direction orthogonal to the first plane; the second antenna element has a second radiation pattern configured to radiate RF signals in a second direction parallel to the first plane; The antenna module according to claim 1 .

3. The antenna module of claim 1 , wherein at least a portion of the second external metallic interconnect intersects the third plane of the second antenna element.

4. The second antenna element includes a second metal patch, preferably the second antenna package: an additional second antenna element disposed in a fourth plane parallel to the third plane of the second antenna element; and at least one dielectric layer disposed between the second antenna element and the additional second antenna element, preferably 2. The antenna module of claim 1, wherein the additional second antenna element is configured to be electromagnetically (EM) coupled to the second antenna element in response to the second antenna element radiating a radio frequency (RF) signal received on the second external metallic interconnect.

5. The antenna module of claim 1 , wherein the first antenna element comprises a first metal patch.

6. The first antenna package comprises: an additional first antenna element disposed in a fourth plane parallel to the second plane of the first antenna element; The antenna module of claim 5 , further comprising: at least one dielectric layer disposed between the first antenna element and the additional first antenna element.

7. The antenna module of claim 5 , wherein the first external metal interconnect comprises a solder bump.

8. the plurality of metallization layers: a first outer metallization layer disposed on a first side of the package substrate; a second outer metallization layer disposed on a second side of the package substrate opposite the first side; the first external metal interconnect is coupled to the first outer metallization layer and thereby to the at least one first metallization layer; the second external metal interconnect is coupled to the second outer metallization layer and thereby to the at least one second metallization layer; The antenna module according to claim 1 .

9. the plurality of metallization layers: a first outer metallization layer disposed on a first side of the package substrate; a second outer metallization layer disposed on a second side of the package substrate opposite the first side; the first external metal interconnect is coupled to the first outer metallization layer and thereby to the at least one first metallization layer; the second external metal interconnect is coupled to the first outer metallization layer and thereby to the at least one second metallization layer; The antenna module according to claim 1 .

10. 10. The antenna module of claim 1 integrated within a device selected from the group consisting of a set-top box, an entertainment unit, a navigation device, a communications device, a fixed location data unit, a mobile location data unit, a Global Positioning System (GPS) device, a mobile phone, a cellular phone, a smartphone, a Session Initiation Protocol (SIP) phone, a tablet, a phablet, a server, a computer, a portable computer, a mobile computing device, a wearable computing device, a desktop computer, a personal digital assistant (PDA), a monitor, a computer monitor, a television, a tuner, a radio, a satellite radio, a music player, a digital music player, a portable music player, a digital video player, a video player, a digital video disc (DVD) player, a portable digital video player, an automobile, a vehicle component, an avionics system, a drone, and a multicopter.

11. The antenna module is mounted on a circuit board including a first side, a second side opposite the first side, a third side adjacent to the first side and the second side, and a fourth side adjacent to the first side and the second side and opposite the third side; The package substrate is a first section coupled to the first side of the circuit board; a second section extending in a vertical direction perpendicular to the horizontal direction beyond a vertical surface of the third side of the circuit board, the second section extending in the horizontal direction; the first antenna package is coupled to the first section of the package substrate; the second antenna package is coupled to the second section of the package substrate, preferably The antenna module of claim 1 , wherein the second antenna package is disposed adjacent to the third side of the circuit board.

12. 1. A method of manufacturing an antenna module having multiple antennas for providing a multi-directional antenna radiation pattern, comprising: providing a package substrate disposed in a first plane, the package substrate including forming a plurality of metallization layers parallel to one another, wherein the package substrate is not bent; providing a first antenna, the first antenna package comprising a first antenna element disposed in a second plane parallel to the first plane and a first external metal interconnect coupled to the first antenna element; coupling the first external metal interconnect to at least one first metallization layer of the plurality of metallization layers of the package substrate; providing a second antenna, including providing a second antenna package comprising a second antenna element disposed in a third plane orthogonal to the second plane and a second external metal interconnect coupled to the second antenna element; coupling the second external metal interconnect to at least one second metallization layer of the plurality of metallization layers of the package substrate; coupling a radio frequency integrated circuit (RFIC) package to the at least one first metallization layer and the at least one second metallization layer of the package substrate to electrically couple the RFIC to the first antenna element and the second antenna element; the second antenna package further includes an outer surface; the second external metal interconnect includes a metal pad disposed on the outer surface of the second antenna package; coupling the second external metal interconnect to the at least one second metallization layer includes coupling metal contacts to the metal pad and the at least one second metallization layer to couple the second antenna element to the RFIC; the metal pad includes a first metal portion that intersects with the third plane of the second antenna element, and a second metal portion that extends in a direction perpendicular to the third plane of the second antenna element and does not intersect with the third plane of the second antenna element; the coupling of the second external metal interconnect to the at least one second metallization layer comprises coupling the metal contact to the second metal portion of the metal pad and to the at least one second metallization layer to couple the second antenna element to the RFIC.

13. The second antenna element includes a second metal patch, preferably Preferably, providing the second antenna package further comprises providing an additional second antenna element disposed in a fourth plane parallel to the third plane of the second antenna element, 13. The method of claim 12, wherein providing the second antenna package further comprises providing at least one dielectric layer between the second antenna element and the additional second antenna element.

14. forming the plurality of parallel metallization layers; forming a first outer metallization layer disposed on a first side of the package substrate; forming a second outer metallization layer disposed on a second side of the package substrate opposite the first side; coupling the first external metal interconnect to the at least one first metallization layer includes coupling the first external metal interconnect to the first outer metallization layer; bonding the second external metal interconnect to the at least one first metallization layer includes bonding the second external metal interconnect to the second outer metallization layer. The method of claim 12.

15. forming the plurality of parallel metallization layers; forming a first outer metallization layer disposed on a first side of the package substrate; forming a second outer metallization layer disposed on a second side of the package substrate opposite the first side; coupling the first external metal interconnect to the at least one first metallization layer includes coupling the first external metal interconnect to the first outer metallization layer; bonding the second external metal interconnect to the at least one first metallization layer includes bonding the second external metal interconnect to the first outer metallization layer. The method of claim 12.

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