Apparatus, system and method for calibrating a laser device - Patents.com

Abstract

According to the invention, there is provided an apparatus (1) for calibrating a laser device, which is designed for freely positioning a working laser beam in a predefined working range, comprising a sensor plate (3) with one or more sensor fields (5) for positioning in the working area, a multi-hole plate gauge (4) with one or more calibration openings (6), at least one or more calibration openings (6) being respectively positioned in the area of ​​at least one or more sensor fields (5), and a pilot laser device for providing a pilot laser beam along the path of the working laser beam for calibrating the laser device.

Description

[Technical field]

[0001] The present invention relates to an apparatus, system and method for calibrating a laser device that is designed for freely positioning a working laser beam in a predetermined working area. [Background technology]

[0002] 3D printing makes it possible to manufacture a wide variety of three-dimensional components with complex shapes. The three-dimensional workpiece is built up layer by layer. The construction is computer-controlled (CAD) from one or more liquid or solid materials according to specified dimensions and shapes. Physical or chemical hardening or melting processes take place during the construction. Typical materials for 3D printing are plastics, synthetic resins, ceramics and metals.

[0003] 3D printing is a generative or additive manufacturing process. The most important 3D printing techniques are selective laser melting (SLM) and electron beam melting (EBM) for metals, and selective laser sintering (SLS) for polymers, ceramics and metals.

[0004] Another production process is selective melting and solidification. In this type of process, metal powder or metal wires are melted and solidified in layers so that three-dimensional parts can be produced. The size of the melt pool formed is small because the energy input using a laser beam is locally limited. This allows complex structures to be produced. The corresponding processes are marketed as laser engineered net shaping (LENS), direct metal deposition (DMD), laser additive manufacturing (LAM), selective laser melting (SLM), or laser metal deposition (LMD).

[0005] In selective laser sintering (SLS / LMF), a layer of powder material is applied to a working surface (build platform). The loose powder is selectively melted by a laser beam. Depending on the material used, the powder particles bond within the layer and with the layer below. Two fundamental directions of development can be distinguished for the production of metal parts. In addition to the direct solidification of metal powder materials using laser radiation (direct metal laser sintering), the production of metal parts using a combination of SLS of plastic-coated metal powders with subsequent heat treatment (IMLS) was established at an early stage.

[0006] Direct metal laser sintering (DMLS) uses single- or multi-component metallic materials. In particular, DMLS multi-component powders made of different alloying elements are used. The lower melting point components of the powder are melted by the laser beam and flow around the higher melting point components, which act as structuring agents.

[0007] In electron beam melting (EBM), the process sequence essentially corresponds to that of laser-based processes. Loose metal powder, either in a powder bed or via a nozzle or wire, is melted at specific points and then solidified to the desired shape. The energy required for this is supplied by an electron beam. The process is usually carried out in a vacuum chamber filled with an inert gas.

[0008] In electron beam melting, similar to selective laser melting (SLM), high energy is applied to melt the component materials. The energy is not provided by a high-powered laser, but by an intense electron beam that is deflected and positioned using a powerful magnetic coil. The electron beam melting process must be carried out under a high vacuum. This severely limits the installation space available for equipment performing selective electron beam melting.

[0009] In recent years, processes have been developed that improve the processing of single-component metallic materials, for example a corresponding process is commercially available under the name Selective Laser Melting (SLM).

[0010] In contrast to selective laser sintering (SLS), selective laser melting (SLM) uses a laser beam to introduce significantly more energy into a powder bed, resulting in the actual melting of the material in the affected areas. Compared to the SLS process, this produces denser, more homogeneous objects.

[0011] Laser cladding is a type of cladding in which a surface is applied to a workpiece by melting and simultaneously applying almost any material. This may be done in powder form, for example metal powder, or with a welding rod or strip. In laser cladding, the heat source is a high-power laser, mainly diode or fiber lasers, and previously also CO2 and Nd:YAG lasers.

[0012] In laser cladding with powder, a laser usually heats the workpiece in a defocused manner and melts it locally. At the same time, an inert gas mixed with fine metal powder is pumped in. The metal powder melts at the heated points and bonds with the metal of the workpiece. In addition to metal powders, ceramic powder materials can also be used, especially hard materials. Laser cladding with wire or tape works similarly to the powder process, but uses wire or tape as the filler material.

[0013] Thus, additive manufacturing processes use a powder bed, powder feed or wire feed, and then these starting materials are melted using a laser beam, electron beam, plasma / arc, and then solidified. Furthermore, additive manufacturing processes use inert or active gases as process gases.

[0014] One of the goals of the aforementioned additive manufacturing processes is to ensure the most efficient energy input possible so as to achieve a safe manufacturing process and high quality parts.

[0015] In these processes, attempts are made to minimize the critical effects and processes during the energy input by appropriate measures. In this context, the use of a substrate plate on which the parts are fixed, the process control under an inert gas atmosphere or the use of new scanning strategies to expose the powder with laser energy are known.

[0016] DE 10 2011 006 553 A1 describes a method for determining the focal position or beam profile of a light beam using a pinhole and a downstream detector. Instead of a single pinhole aperture, a pinhole plate with multiple holes, each defining a measurement point, can also be used.

[0017] DE 10 2009 016 585 A1 describes a method and an apparatus for calibrating an irradiation apparatus, in particular an apparatus for the productive production of components, which apparatus is provided with an image conversion plate that is locally illuminated with energetic radiation. The image conversion plate converts the radiation energy into detectable light, which is detected by a detector.

[0018] DE 10 2020 122 670 A1 describes a further device for calibrating an irradiation device, in particular a 3D printing device, which device is provided with a detection element outside the working area for calibrating the position of the light beam. The detection element can have an opening at the rear, in which an optical sensor for detecting the light beam is arranged. DE 10 2020 100 217 A1 describes a method for automatic beam positioning of a laser beam with respect to a nozzle of a laser processing head. Summary of the Invention [Problem to be solved by the invention]

[0019] It is an object of the present invention to provide an apparatus and method for calibrating a laser device, which is adapted for freely positioning a working laser beam in a given working area in order to position the working laser beam with a given accuracy in the working area.

[0020] It is a further object of the present invention to provide an apparatus and method for calibrating a laser device which allows for high reproducibility.

[0021] Additionally, it is an object of the present invention to provide improved apparatus and methods for additive manufacturing to provide easier, faster, and / or higher quality parts.

[0022] It is a further object of the present invention to provide an alternative method for additive manufacturing.

[0023] One or more of these problems are solved by the features of the independent patent claims. Advantageous embodiments are given in the dependent claims. [Means for solving the problem]

[0024] According to the invention, an apparatus for calibrating a laser device is provided, which is designed for freely positioning a working laser beam in a predefined working area, comprising a sensor plate with one or more sensor fields for placement in the working area, a multi-aperture plate gauge with a number of calibration path openings, each of which is placed in the area of ​​a respective one of the sensor fields, a control device for determining the relative positions of the sensor fields with respect to one another after exposing the sensor fields through the calibration path openings of the multi-aperture plate gauge, and a pilot laser device for providing a pilot laser beam along the path of the working laser beam in order to calibrate the laser device by scanning the pilot laser beam with the sensor fields.

[0025] When calibrating the laser device by sensor fields whose relative positions with respect to one another are determined, the multi-hole plate gauge may be placed on or removed from the sensor plate. Since the relative positions of the sensor fields are determined, the relative position of a pilot laser beam directed at one of the sensor fields with respect to other positions of pilot laser beams directed at the same or different sensor fields is determined by the sensor fields.

[0026] The laser device is preferably a laser device of a device for additive manufacturing of parts. Alternatively, however, other laser devices, for example for laser cutting, laser drilling, etc., can also be calibrated within the scope of the present invention with the device according to the invention. These devices have in common that the working laser beam of the laser device can be moved along a working area in order to carry out a given working process in the working area. The working area is preferably a building platform of the device for additive manufacturing.

[0027] In the context of the present invention, a laser device is understood to be a processing head which is preferably connected to a laser or a device for providing a laser beam for emitting a laser beam or has its own laser or a device for providing a laser beam for emitting a laser beam. In the context of the present invention, unless otherwise stated, a laser beam is understood to mean a laser beam section which is emitted from the processing head in the direction of the processing area.

[0028] The invention is based on the realization that in a laser device with several processing heads, each of which emits a laser beam, the relative positioning of the processing heads relative to one another must be set very accurately, but the absolute positioning of all processing heads in the working area is not very important. In a device for additive manufacturing of parts, it is irrelevant for the part whether it is manufactured in a given position in the working area or slightly shifted in this respect. However, it is extremely important that the individual parts of the part are positioned accurately relative to one another. It is therefore possible to calibrate the laser device using a sensor plate and a multi-hole plate gauge, which are designed independently of the laser device. During the calibration process, first both the sensor plate and the multi-hole plate gauge are inserted into the laser device to pre-calibrate the sensor plate, so that the relative positions of the sensor fields relative to one another are known. The multi-hole plate gauge is then removed. How the sensor plate is positioned relative to the laser device is of secondary importance, but the sensor plate must maintain its exact position in the laser device during the calibration process. The only important thing is that the sensor plate maintain its position during the calibration process so that the individual work heads can be accurately calibrated relative to each other.

[0029] The use of a combination of a sensor plate with multiple sensor fields and a multi-aperture plate gauge forms a very precise calibration device in a simple manner. A sensor plate with multiple sensor fields is usually a printed circuit board on which scanning cameras with multiple areas are arranged, each forming a sensor field. Such a printed circuit board may be slightly distorted due to the material. This distortion is mainly temperature dependent. Therefore, the relative positioning of the sensor fields is not always very precise. By arranging or positioning the multi-aperture plate gauge with multiple calibration paths, each of which is arranged in one area of ​​the sensor field, initially only the areas of the sensor fields are used to calibrate the laser device, which are arranged in a precise local relationship to each other due to the precise arrangement of the calibration paths of the multi-aperture plate gauge. Thus, initially only the areas of the sensor fields in a precise local relationship to each other are accessible by the multi-aperture plate gauge, whereby the relative positions of the sensor fields can be determined based on this local relationship known through the multi-aperture plate gauge. Since the pre-calibration first determines the position of the sensor fields relative to each other, the calibration of the laser beams can be carried out with the resolution provided by the sensor fields and is not bound to the diameter of the calibration aperture, in contrast to the methods and devices from the prior art mentioned above. Since the sensor fields generally have pixels that are much smaller than the calibration aperture, a resolution defined by the size of the pixels of the sensor fields can be achieved. The device can therefore be used to precisely measure both the position of the respective pilot laser beam and the area where it strikes the respective sensor field. The latter can be used to optimize the focusing of the pilot laser beam.

[0030] Thus, when the working heads of the laser device are calibrated using the area of ​​the sensor field specified by the multi-aperture plate gauge, they can be positioned in a precise local relationship to each other. In other words, this means that the combination of the sensor plate and the multi-aperture plate gauge forms a common uniform coordinate system in which all the working heads are calibrated. This coordinate system defined by the sensor plate and the multi-aperture plate gauge can therefore be called the common principal coordinate system.

[0031] In particular, it is provided that the diameter of the pilot laser beam is smaller than the corresponding calibration aperture. Since the local reference of the sensor field is known, it is possible to determine the position of the pilot laser beam with a higher resolution than specified by the diameter of the calibration aperture. The resolution is then limited only by the size of the pixels of the sensor field, and conventional camera chips such as CMOS or CCD sensors are significantly smaller than the size of the calibration aperture. Thus, the typical size of the pixels of the sensor field is 2 μm×2 μm or less, preferably 1.5 μm×1.5 μm or less. The diameter of the calibration aperture is preferably at least 2 mm, in particular at least 3 mm or at least 5 mm. The area of ​​the calibration aperture therefore includes a plurality of pixels of the sensor field.

[0032] The sensor plate is designed to experience similar distortions as the build platform and / or the parts being fabricated on the build platform due to the thermal effects of the working laser beam.

[0033] The aperture plate is made from a highly stable material or a material with high mechanical strength so that the apertures do not change position even under thermal stress and are positioned in a precise relationship to each other to achieve a high level of accuracy. The calibration apertures are mapped onto the sensor field of the sensor plate.

[0034] Thus, according to the invention, it is provided that a pilot laser beam is used to calibrate the working laser beam. A sensor plate is placed on the working area of ​​the laser device, in particular on the build platform of the device for additive manufacturing. A multi-hole plate gauge is then placed on this sensor plate. The sensor fields of the sensor plate are then exposed through the calibrated openings of the multi-hole plate gauge in order to determine the relative positions of the sensor fields with respect to each other. The pilot laser beam is then positioned on the sensor field based on the control information by the laser device through the calibrated openings of the multi-hole plate gauge. Thus, the pilot laser beam is directed on the sensor field through a plurality of calibrated openings, with the control information forming a target value. Now, a plurality of actual measured values ​​of the position information of the pilot laser beam are detected by the sensor field. These actual measured values ​​are then compared with the corresponding target values ​​of the position information for different positions or locations of the pilot laser beam, and the respective deviations are determined.

[0035] To control the laser device, the working laser beam is positioned in the working range by the control information, and according to the invention, the determined deviation is used as a correction value for determining the control information. A correction function is generated based on a comparison of the actual values ​​and the target values ​​of the position information of the working laser beam in order to interpolate the determined values ​​over the working range.

[0036] Furthermore, it is provided that all sensor fields are covered by a multi-aperture plate gauge, whereby a calibration opening is located in the area of ​​each sensor field.

[0037] This means that for every sensor field of a sensor plate or a sensor arrangement, one aperture or a single multi-aperture plate gauge is provided.

[0038] The sensor fields are arranged in the edge regions of the sensor plate.

[0039] During use, the greatest distortions due to the thermal energy introduced by the laser device occur at the working area and / or edge areas of the build platform of the additive manufacturing device, so it may be sufficient to simply determine the corresponding positions at the edge areas of the working area, which makes the device cost-effective.

[0040] The corresponding sensor devices in the sensor field are preferably capable of detecting the position with an accuracy of a few μ, or even of 1 μ.

[0041] Preferably, approximately 10 to 50, or 15 to 40, in particular 20 to 30, sensor fields are arranged on the sensor plate.

[0042] A laser device for providing a working laser beam is also provided.

[0043] The laser device may be, for example, a fiber laser. The laser may emit laser light with a power output of at least 200 watts, or at least 300 watts, up to 400 watts, or up to 600 watts, or up to 800 watts, or up to 1000 watts, or up to 1200 watts.

[0044] The pilot laser device may be part of the laser device or may be designed as a separate pilot laser device.

[0045] For example, a laser manufactured by IPG Photonics, available as part number P21-010106, YLR Series SLED 3.0, can be used as the laser device. Such a laser device can output a working laser beam and a pilot laser beam.

[0046] The pilot laser beam is preferably designed as a focused laser beam and has a power output of approximately 0.1 Watts.

[0047] The pilot laser beam may be formed, for example, by coupling less light into the laser generator of the laser apparatus and / or by using beam splitters, polarizing filters, beam blocks, deflecting mirrors, or by providing a laser with a controllable pump stage that can turn off the pump stage.

[0048] Therefore, both the working laser beam and the pilot laser beam can use the same fiber of the fiber laser.

[0049] Furthermore, the laser device can have multiple processing heads connected to a common laser for emitting the laser beam in multiplex mode. Alternatively, the laser device can have multiple processing heads, each with its own laser (singleplex). These two types of embodiments of the laser device with multiple processing heads for emitting the laser beam are referred to as multi-laser devices in the context of the present invention.

[0050] In such a multi-laser device, the lasers of the processing heads are initially each referenced with respect to their own coordinate system in the X / Y plane, i.e. each processing head is assigned an individual coordinate system, which means that each laser of the processing head has its own coordinate system.

[0051] By calibrating the position or location of the lasers of the processing head with the device according to the present invention, all lasers of the processing head can be referenced with respect to a common principal coordinate system, so that they are then calibrated with respect to a common principal coordinate system in the working area.

[0052] During calibration, in order to calibrate the multi-laser device or the multiple lasers of the multi-laser device to this primary coordinate system, each processing head moves its laser beam to at least one, and preferably multiple, points in its own reference coordinate system that are mapped to corresponding points of the uniform primary coordinate system defined by the calibration device. In this way, all lasers of the processing head are aligned with respect to the uniform primary coordinate system.

[0053] Additionally, the processing heads are aligned or adjusted such that the optical axis of each of the laser beams of the processing heads is perpendicular to the working area of ​​the build platform or processing surface, and because of the perpendicular laser beams, calibration can be performed independent of the plane, so that the distance of the processing heads, and therefore the corresponding laser beams, changes.

[0054] The optical axes of all the multiple laser beams are aligned perpendicular to the surface of the build platform, which means that a change in the vertical (Z coordinate) distance of the laser device from the sensor plate will change the position of the laser beams on the corresponding sensor fields of the sensor plate or build platform.

[0055] In addition, a measuring device is provided with a corresponding sensor for measuring the diameter of the laser beam. The diameter of the laser beam can be, for example, at least 30 μm, in particular at least 50 μm or at least 100 μm. The diameter of the laser beam is preferably 2 mm or less, in particular 1 mm or less, or 500 μm or less.

[0056] Not only can a single laser in the processing head of a laser machine be calibrated, but multiple lasers in a laser machine can be calibrated and aligned with respect to each other.

[0057] Therefore, in the present invention, not only can one laser device having one laser be calibrated in the processing area, but multiple lasers of the processing head can be calibrated in their respective processing areas, so that multiple lasers of the processing head of the multi-laser device are also calibrated relative to each other in the processing area.

[0058] The sensor device may comprise a printed circuit board, a CMOS sensor and preferably electronic network connections.

[0059] The ends of the multi-aperture plate gauge that define the calibration path opening may be acutely angled and / or tapered such that the multi-aperture plate gauge is thinned at least in the region of the calibration path opening.

[0060] In this way, parallax errors can be avoided.

[0061] The diameter of the calibration opening can be approximately 4-5 mm smaller than the area of ​​the corresponding sensor field of the CMOS sensor.

[0062] The area of ​​the calibration opening may be smaller than the area of ​​the corresponding sensor field of the sensor device.

[0063] In particular, the calibration openings are arranged in a grid or array with spacings between 50mm and 500mm.

[0064] Since the area of ​​the calibration opening is smaller than the area of ​​the corresponding sensor field, the multi-hole plate gauge is easily positioned.

[0065] The sensor plate and / or the multi-aperture plate gauge may have a centering device for centering it over the working area.

[0066] The working area is preferably a build platform of an apparatus for additive manufacturing. It is therefore provided that the sensor plate is centrally positioned and aligned on such a build platform by the first centering device.

[0067] The multi-hole plate gauge is centered on the sensor plate using a second centering device.

[0068] A tube aperture facing the laser device is located at each of the calibration apertures. Such tube apertures can be used to generate uniform diffuse light (dark field light) in the area of ​​the sensor field.

[0069] Further, according to the present invention, there is provided a system for calibrating a laser device, the system comprising an apparatus for calibrating a laser device as described above, and an apparatus for additive manufacturing having a plurality of processing heads for irradiating laser beams.

[0070] In the context of the present invention, an apparatus for additive manufacturing is understood to be an apparatus for building up three-dimensional parts layer by layer using a powder bed, powder feed or also a wire feed, which serves as starting material and is melted by a laser beam or also an electron beam, or also by a plasma or an electric arc. For additive manufacturing apparatuses, generative manufacturing processes are therefore mentioned at the beginning of the description (3D printing: melting and solidification (as laser engineered net shaping (LENS), direct metal deposition (DMD) or as laser additive manufacturing (LAM)), local sintering or melting (selective laser sintering (SLS)), metal laser sintering (DMLS), metal laser sintering (IMLS), electron beam melting (EBM), powder bed based laser beam fusion laser powder bed fusion (LPBF) or laser cladding).

[0071] Furthermore, according to the invention, a method for calibrating a laser device adapted for freely positioning a working laser beam in a predefined working area is provided, which method can use an apparatus for calibrating a laser device as shown above, placing a sensor plate over the working area, the sensor plate having a plurality of sensor fields; arranging a multi-aperture plate gauge on the sensor plate, the multi-aperture plate gauge having a plurality of calibrating apertures arranged in a predetermined arrangement relative to one another, each of the apertures being located in the region of a sensor field; exposing the sensor fields of the sensor plate through calibration openings of a multi-hole plate gauge to determine the relative positions of the sensor fields with respect to one another; positioning the pilot laser beam on the sensor fields based on control information by the laser device such that the pilot laser beam is directed to a plurality of sensor fields, the control information for positioning the pilot laser beam forming a target value; detecting a plurality of actual measurements of position information of the pilot laser beam by the sensor field; comparing these actual measurements with corresponding target values ​​of position information from different positions or locations of the pilot laser beam; and Steps to determine each deviation Includes.

[0072] The advantages of the method according to the invention correspond analogously to those described above with respect to the device for calibrating a laser device. When calibrating a laser device, a multi-aperture plate gauge can be placed on the sensor plate. In this case, the sensor field is freely accessible only in the area of ​​the calibration opening and can be used to calibrate the laser device. However, preferably, the multi-aperture plate gauge is removed for calibrating the laser device so that the entire sensor field is available for calibrating the laser device.

[0073] The sensor field is illuminated with the multi-hole plate gauge in place using a pilot laser beam or another light source. Suitable light sources are in particular light sources that emit diffuse light, for example dark field light sources.

[0074] In particular, the method is designed for multiple lasers of a processing head of a multi-laser machine, positioning a pilot laser beam onto the sensor field through a calibrated opening of the multi-hole plate gauge based on control information by the laser device such that the pilot laser beam is directed onto the sensor field, the control information forming a target value; detecting a plurality of actual measurements of position information of the pilot laser beam by the sensor field; comparing these actual measurements with corresponding target values ​​of position information from different positions or locations of the pilot laser beam; determining respective deviations for each laser beam of the processing head; and Calibrating the laser beams of the processing head of the multi-laser device relative to one another in the processing area. It is provided that the following is carried out.

[0075] In addition, the invention provides a method for controlling a laser beam for a system such as above, in which the working laser beam is positioned in the working area by means of control information, characterized in that the determined deviation is used as a correction value for determining the control information.

[0076] A correction function can be generated based on a comparison of actual and target values ​​of the position information of the working laser beam to interpolate the determined correction values ​​over the working range.

[0077] The invention is explained in more detail below with reference to embodiments shown in the drawings. [Brief description of the drawings]

[0078] [Figure 1] 1 is a schematic perspective exploded view of an apparatus according to the invention for calibrating a laser device; [Diagram 2] FIG. 2 is a schematic side view of a calibrated opening in a multi-hole plate gauge of the apparatus. [Diagram 3] FIG. 1 is a schematic perspective view of a tubular orifice for a calibrated opening of a multi-hole plate gauge of the apparatus. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0079] The device 1 for calibrating a laser device according to the invention is explained in more detail below (FIGS. 1 to 3). The device 1 is designed for freely positioning a working laser beam in a predefined working area. The working area is preferably a build platform 2 of a device for additive manufacturing (not shown).

[0080] The apparatus 1 comprises a sensor plate 3 and a multi-aperture plate gauge 4 .

[0081] Furthermore, the device 1 comprises a pilot laser device (not shown) for providing a pilot laser beam along the beam path of the working laser beam for calibrating the laser device. Preferably, the pilot laser device is an integral part of the laser device (not shown) for the device for additive manufacturing or such a laser device is designed to provide a pilot laser beam. Alternatively, the pilot laser device may also be an independent laser device.

[0082] The sensor plate 3 has an approximately rectangular shape. In the edge region of the sensor plate 3, in this design example, twelve sensor devices with corresponding sensor fields 5 are arranged all around the periphery.

[0083] The sensor plate 3 is made from a material that has a similar warp as a corresponding build platform of an apparatus for additive manufacturing, such as a corresponding additively manufactured part.

[0084] According to this design example, the sensor fields 5 are arranged in the edge region of the sensor plate. Another suitable number of sensor fields 5 or sensor devices can also be used here. For example, at least 4 or 6 or 8 or 10 or 12 or 14 or 16 or 18 or 20 or 22 or 24 or 26 or 28 or 30 sensor fields and up to 32 or 34 or 36 or 38 or 40 or 42 or 44 or 46 or 48 or 50 sensor fields 5 can be provided. Alternatively, the individual sensor fields 5 can also be arranged in a grid or in an array at approximately the same distance from each other.

[0085] The sensor plate 3 is made from a printed circuit board and the sensor device or sensor field 5 is formed by a CMOS sensor.

[0086] Furthermore, the sensor plate 3 has a network connection (not shown) for connection to a corresponding data network.

[0087] The sensor plate 3 has a centering device (not shown), e.g. a dowel pin, to center it in the work area or build platform 2. This fixes the sensor plate to the laser device during the calibration process.

[0088] The multi-aperture plate gauge 4 also has a generally rectangular shape. In addition, calibration openings 6 are formed in the multi-aperture plate gauge 4, the number of which corresponds to the number of sensor fields 5 of the sensor plate 3. Thus, the calibration openings 6 are arranged in the multi-aperture plate gauge 4 in correspondence with the positions of the sensor fields 5 of the sensor plate 3.

[0089] Since the multi-aperture plate gauge 4 is made from a material that has a high inherent stiffness or is very stable and therefore has high mechanical strength, the multi-aperture plate gauge 4 will not or will only slightly distort when thermal energy is applied, and this is highly advantageous since the calibration opening 6 will always be located at the same position or location relative to the build platform.

[0090] Corresponding calibration openings 6 in the multi-hole plate gauge 4 are appropriately mapped to the sensor fields 5 of the sensor plate 3 during use.

[0091] To each of the sensor fields 5 is assigned at least one calibration opening 6 of the multi-hole plate gauge 4 , so that in the area of ​​each sensor field 5 a calibration opening 6 is located.

[0092] The edges or boundaries of the multi-hole plate gauge 4 that define the calibration opening 6 are sharp-edged or thinned to avoid parallax errors.

[0093] Additionally and / or alternatively, the calibration opening 6 or the ends of the multi-hole plate gauge 4 surrounding the calibration opening 6 may be tapered towards the sensor field 5 to also avoid parallax errors (Figure 2).

[0094] The area of ​​the calibration openings 6 is smaller than the area of ​​the corresponding sensor fields 5 such that the calibration openings 6 are completely covered by the respective sensor fields 5. In this way, the calibration openings 6 can be easily positioned or aligned according to the sensor fields 5 of the sensor plate 3.

[0095] In addition, a tubular diaphragm 7 can be placed in each of the calibration openings 6 facing the laser device (FIG. 3). A uniform diffuse light (dark field light) is generated in the area of ​​the sensor field 5 by the tubular diaphragm 7.

[0096] A system according to the invention for calibrating a laser device (not shown) comprises the above-described device 1 for calibrating a laser device and an apparatus for additive manufacturing. The additive manufacturing device may be an apparatus corresponding to one of the above-described additive manufacturing processes. Such an apparatus comprises a number of processing heads for emitting a laser beam each.

[0097] Furthermore, according to the invention, a method for calibrating a laser device designed for freely positioning a working laser beam in a predefined working range is provided, which method uses the above-described device 1 for calibrating a laser device.

[0098] The procedure includes the following steps.

[0099] First, the sensor plate 3 is placed on the working area, in particular on the build platform 2 of the apparatus for additive manufacturing (S1). The sensor plate is aligned and centered on the build platform using a centering device.

[0100] Next, a multi-hole plate gauge 4 is placed on the sensor plate 3, the multi-hole plate gauge 4 having several calibration through-holes 6 arranged in a predetermined arrangement relative to one another (S2).

[0101] Now the sensor fields 5 are exposed. In order to determine the relative positions of the sensor fields 5 with respect to one another, exposure is performed through the calibration openings 6 of the multi-hole plate gauge 4 (S3). All the calibration openings 6 are mapped onto the respective sensor fields 5.

[0102] Next, a pilot laser beam is positioned (S4) on the sensor field based on the control information by the laser device through the calibration openings 6 of the multi-hole plate gauge 4. In this way, the pilot laser beam is directed onto the sensor field through a number of calibration openings 6. The corresponding control information forms a target value.

[0103] The sensor field 5 is used to detect a number of actual measurements of the position information of the pilot laser beam (S5).

[0104] Finally, these actual measurements are compared with corresponding target values ​​of the position information for different positions or locations of the pilot laser beam (S6).

[0105] Based on these values, the respective deviation of the target value from the actual value can be determined (S7).

[0106] Additionally, the invention provides a method for controlling a laser beam using a system as described above, in which the working laser beam is positioned at the working area using control information, for determining the control information the deviations determined by the method for calibrating the laser device are used as correction values.

[0107] A correction function is generated based on a comparison of the actual and target values ​​of the position information of the working laser beam, the correction function being used to interpolate the determined values ​​across the working range.

[0108] Instead of an apparatus for additive manufacturing, the apparatus according to the invention can also be provided for calibrating a laser beam, for example for a laser cutting apparatus or the like.

[0109] The key elements of a laser cutting device or laser beam cutting machine are the laser beam source, the laser beam guide and the processing head (focusing optics) which contains the cutting nozzle. The beam leaving the laser beam source is guided via a fiber optic cable to the near infrared (Nd:YAG laser, fiber laser, disk laser) or in the case of CO2 lasers via a deflection mirror to the focusing optics at the processing point. The focusing optics focus the laser beam into a focal point, thereby generating the intensity required for cutting.

[0110] Systems using CO2 lasers usually consist of a fixed laser beam source and so-called flying optics. A mirror telescope ensures a constant raw beam diameter on the focusing lens over the entire processing area. This is necessary so that the beam emerging from the laser has a constant divergence. Different beam lengths for different processing locations change the raw beam diameter on the lens without compensation by a reflecting telescope. This results in different numerical apertures and intensities.

[0111] Beam guidance between the optical resonator (laser beam source) and the focusing optics is realized by water-cooled mirrors, if necessary. The mirrors are coated with gold or molybdenum and made of single crystal silicon or pure copper. On the other hand, laser radiation in the wavelength range of approximately 1 μm (Nd:YAG laser, fiber laser, disk laser) can also be guided over long distances using fiber optic cables.

[0112] To obtain an orientation-independent cutting quality, a phase-rotating mirror is placed between the resonator and the telescope for the linearly polarized laser beam.

[0113] The jet is focused through a so-called cutting nozzle, usually made from copper, which also directs the blow or process gases to the processing area. [Explanation of symbols]

[0114] 1 device 2. Building Platform 3 Sensor Plate 4 Multi-hole plate gauge 5 Sensor Field 6 Calibration Aperture 7 Tubular diaphragm

Claims

1. A device (1) for calibrating a laser device, which is designed for freely positioning a working laser beam in a predefined working range, comprising: a sensor plate (3) having a plurality of sensor fields (5) for placement in a working area; a multi-aperture plate gauge (4) having a plurality of calibration openings (6), each of the plurality of calibration openings (6) being disposed in one region of the sensor field (5); a control device for determining the relative positions of the sensor fields (5) with respect to each other after exposing the sensor fields (5) through the calibrated openings (6) of the multi-hole plate gauge (4); a pilot laser device for providing a pilot laser beam along a path of the working laser beam for calibrating the laser device by scanning the pilot laser beam through the sensor field; An apparatus (1).

2. 2. The device (1) according to claim 1, characterized in that all sensor fields (5) are covered by the multi-aperture plate gauge (4) so ​​that a calibration opening (6) is arranged in the area of ​​each sensor field (5).

3. 3. The device (1) according to claim 1 or 2, characterized in that the sensor field (5) is arranged in an edge region of the sensor plate (3).

4. Apparatus (1) according to any one of claims 1 to 3, characterised in that the laser device is designed to provide a working laser beam.

5. 5. The device (1) according to claim 4, characterized in that the pilot laser device is either part of the laser device or is designed as a separate pilot laser device.

6. Device (1) according to any one of the preceding claims, characterized in that the sensor plate (3) comprises a printed circuit board, a CMOS sensor and / or a CCD sensor and preferably electronic network connections.

7. 7. Apparatus (1) according to any one of claims 1 to 6, characterized in that the ends of the multi-aperture plate gauge (4) surrounding the calibration opening (6) are acute and / or conical, such that the multi-aperture plate is thin, at least in the region of the calibration opening (6), so as to avoid parallax errors.

8. The device (1) according to any one of claims 1 to 7, characterized in that the area of ​​the calibration path openings (6) is smaller than the area of ​​the corresponding sensor fields (5) of the sensor plate (3), the calibration path openings (6) being preferably arranged in a grid with a spacing of 50 mm to 500 mm.

9. The device (1) according to any one of the preceding claims, characterized in that the sensor plate (3) and / or the multi-hole plate gauge (4) have a centering device for centralizing them in the working area.

10. The device (1) according to any one of claims 1 to 9, characterized in that a tubular diaphragm (7) oriented towards the laser device is arranged at each of the calibration openings (6) in order to generate a uniformly diffused light in the area of ​​the sensor field (5).

11. A device (1) for calibrating a laser device according to any one of claims 1 to 10, An apparatus (1) for additive manufacturing, the apparatus (1) for additive manufacturing comprising a plurality of processing heads for emitting respective laser beams; 1. A system for calibrating a laser device, comprising:

12. A method for calibrating a laser device adapted for freely positioning a working laser beam in a predefined working area, in particular with a device (1) according to any one of claims 1 to 10, comprising: placing a sensor plate (3) on said working area, said sensor plate having a plurality of sensor fields (5); - arranging a multi-aperture plate gauge (4) on said sensor plate (3), said multi-aperture plate gauge (4) having a number of calibrated openings (6) arranged in a predetermined arrangement relative to one another, each of which is arranged in the region of a sensor field; exposing the sensor fields (5) of the sensor plate (3) through the calibrated openings (6) of the multi-hole plate gauge (4) to determine the relative positions of the sensor fields (5) with respect to each other; positioning a pilot laser beam on the basis of control information by a laser device such that the pilot laser beam is directed towards a plurality of sensor fields (5), the control information for positioning the pilot laser beam forming a target value; detecting a plurality of actual measurements of the position information of the pilot laser beam by means of the sensor field (5); comparing these actual measurements with corresponding target values ​​of position information for different positions of the pilot laser beam to determine respective deviations; A method comprising:

13. 13. A method according to claim 12, characterized in that the determined deviation is used as a correction value for determining the control information for positioning a work laser beam.

14. 14. The method according to claim 13, characterized in that a correction function is generated based on a comparison of actual values ​​of the position information of the working laser beam with target values ​​in order to interpolate the determined values ​​over the working range.

15. The method is designed for multiple laser beams from a processing head of a multi-laser device, further comprising: determining respective deviations for each laser beam of the processing head; and calibrating the laser beams of the processing head of the multi-laser device relative to one another within a processing area; The method according to any one of claims 12 to 14, characterized in that the following is carried out:

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