Thermal Conductivity Probe

Abstract

The present invention relates to an electrically conductive probe, in one embodiment, the electrically conductive probe includes, but is not limited to, at least one heating element, at least one thermal insulator, and at least one thermistor thermally isolated from the at least one heating element by the at least one thermal insulator.

Description

[Technical field]

[0001] This application is a PCT international patent application claiming priority to (i) U.S. Provisional Patent Application No. 63 / 330,776, filed April 14, 2022, entitled Thermal Conductivity Probe (DOCKET GD-P-07); (i) U.S. Provisional Patent Application No. 63 / 460,267, filed April 18, 2023, entitled Thermal Conductivity Probe (DOCKET GD-P-07-01); and (iii) U.S. Nonprovisional Patent Application No. 18 / 207,118, filed June 07, 2023, entitled Thermal Conductivity Probe (DOCKET GD-P-07-01-0000).

[0002] This application claims the benefit and / or priority of each of the foregoing patent applications, and all parent, parent, and further parent applications, all of which are incorporated by reference in their entireties as if fully set forth herein.

[0003] The present disclosure relates generally to thermal conductivity probes. [Background technology]

[0004] There is an increasing need to accurately and easily calculate the energy loss through various sediment types for buried power lines below the surface. For buried power lines below the surface, the energy loss is directly related to the heat loss through the surrounding strata. Therefore, a system and method for measuring the thermal conductivity of soil is useful for quantifying the energy loss and determining the transfer efficiency, and is disclosed herein. Summary of the Invention [Means for solving the problem]

[0005] The embodiments disclosed herein generally relate to a thermal conductive probe. In one embodiment, the thermal conductive probe includes, but is not limited to, at least one heating element, at least one thermal insulator, and at least one thermistor thermally isolated from the at least one heating element by the at least one thermal insulator.

[0006] In another embodiment, an attachment for coupling to a conical penetration device (CPT) includes, but is not limited to, at least one heating element, at least one thermal insulator, at least one thermistor thermally isolated from the at least one heating element by the at least one thermal insulator, and a threaded member configured to removably couple to the CPT.

[0007] In a further embodiment, the heat transfer system includes, but is not limited to, at least one heating element, at least one thermal insulator, at least one thermistor thermally isolated from the at least one heating element by the at least one thermal insulator, and at least one processor configured to perform operations including at least controlling the at least one heating element, and measuring temperature over time using the at least one thermistor. [Brief description of the drawings]

[0008] The embodiments are described in detail below with reference to the following drawings: [Figure 1] FIG. 1 is a perspective view of a thermal conductivity probe according to one embodiment of the present invention. [Diagram 2] FIG. 2 is an environmental diagram of a thermal conductivity probe according to one embodiment of the present invention. [Diagram 3] FIG. 1 is a system diagram of a thermal conductivity and CPT system in accordance with an embodiment of the present invention. [Figure 4] FIG. 4 is a flow diagram of a computer process for operating a thermal conductivity probe in accordance with an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The present disclosure relates generally to a thermal conductive probe. Particular embodiments are described below and illustrated in Figures 1-4 to provide a thorough understanding of such embodiments.

[0010] 1 is a perspective view of a thermal conductive probe according to an embodiment of the present invention. In one embodiment, the thermal conductive probe 100 includes, but is not limited to, at least one heating element 110, at least one thermal insulator 108, and at least one thermistor 106 thermally isolated from the at least one heating element 110 by the at least one thermal insulator 108. In an embodiment, the thermal conductive probe 100 further includes a thermistor 102, a thermal insulator 104, a thermal insulator 112, a thermistor 114, a thermal insulator 116, and a thermistor 118. In a further embodiment, the thermal conductive probe 100 further includes a CPTu 120 with a friction sleeve 122, a bore pressure element 124, and a cone tip 126. Various embodiments of the thermal conductive probe 100 include various combinations of the aforementioned elements, as further disclosed herein.

[0011] Knowledge of thermal conductivity in soils is important for several applications, including the design of underground structures, determining heat losses and energy transfer efficiency for underground power and data lines, evaluating heat transfer in geothermal systems, predicting soil temperature profiles, and understanding the energy balance in agricultural systems.

[0012] The thermal conductivity probe 100 provides a tool to measure in-situ thermal conductivity through a subsurface soil profile. The thermal conductivity probe 100 is designed to fit behind a cone penetrator CPTu 120 that allows the thermal transmittance to be measured and the results plotted along with other CPT data such as depth, tip and sleeve resistance, hole pressure and inclination. The thermal conductivity probe 100 is approximately 10-100 mm (e.g., 36 mm) in diameter and 100-1000 mm (e.g., 425 mm) in length. In operation, the thermal conductivity probe 100 and CPTu 120 are pushed into the soil by a traditional CPT deployment frame. Typically, these deployment frames consist of a pair of hydraulic cylinders capable of exerting a force of up to 20 metric tons. Once the thermal conductivity probe 100 and CPT 120 are pushed to the depth of interest, typically 1-10 m (e.g., 2 m) below the earth's surface, the heating element 110 is energized and begins to heat the surrounding soil. The heating element 110 reaches a specified temperature, such as 50°C - 200°C (e.g., 90°C), and maintains that temperature for a specified time, such as, for example, 1 min - 60 min. The time can vary and is dependent on the hydraulic conductivity and density of the soil. Specifically, the heating element 110 is turned off when the thermistor 106 reads 1°C - 20°C (e.g., 5°C) above the ambient temperature. The decay in temperature measured using the thermistor 106 is then plotted against time, thus deriving a temperature decay index. This temperature decay index is then used to calculate the heat loss along the power line.

[0013] In one embodiment, there is a thermistor 102, a thermal insulator 104, a thermal insulator 112, a thermistor 114, a thermal insulator 116, and a thermistor 118. When the thermistors 102 and / or 118 read 1° C.- 20° C. (e.g., 5° C.) above ambient temperature, the heating element 110 is turned off. The temperature decay is then plotted versus time for each of the four thermistors 102, 106, 114, and 118. The slopes of the four temperature decay curves are then averaged to derive an average temperature decay index. This coefficient is then used to calculate the heat loss along the power line.

[0014] In a further embodiment, the thermal conductivity probe 100 includes, but is not limited to, multiple thermistors thermally isolated from at least one heating element 110. The multiple thermistors may include a thermistor 106 thermally isolated from the heating element 110 by a thermal insulator 108 and a thermistor 102 thermally isolated from the thermistor 106 by a thermal insulator 104. Additionally, the multiple thermistors may include a thermistor 114 thermally isolated from the heating element 110 by a thermal insulator 112 and a thermistor 118 thermally isolated from the thermistor 114 by a thermal insulator 116. Alternatively, the multiple thermistors may include a thermistor 106 thermally isolated from the heating element 110 by a thermal insulator 108 and a thermistor 114 thermally isolated from the heating element 110 by a thermal insulator 112.

[0015] The heating elements are positioned around the circumference along the section length of the thermally conductive probe. For example, the heating elements may be about 5 mm to 100 mm (e.g., 45 mm) in length and 10 to 100 mm (e.g., 36 mm) in diameter in cross section, with a wall thickness of about 1 mm to 50 mm. In certain embodiments, the heating elements include multiple heating elements as individual heat spots or regions radially positioned around the circumference of the thermally conductive probe. The individual hot spots or regions may be circular, square, rectangular, elliptical, or other regular or irregular shapes. Multiple heating elements can be engaged simultaneously or independently to create different temperature gradients around the circumference of the thermally conductive probe 100. This configuration allows for the measurement of differences in the thermal conductivity of soil along a length or specific region.

[0016] The heating elements are configured to raise the temperature and generate heat in the surrounding soil, and there are several methods that can be employed to achieve heating through these elements. Resistance Heating: This method utilizes the resistance of the material through which an electric current passes to generate heat. The most common type of resistance heating element is made of nichrome wire, an alloy that has high electrical resistance and can withstand high temperatures. Induction Heating: Induction heating uses electromagnetic induction to heat a conductive material. An alternating current (AC) is passed through an induction coil, which creates a magnetic field. Placing a conductive material within this area induces eddy currents, which generate heat in the material. Convection Heating: Convection heating involves the transfer of heat through a fluid medium, such as air or water. Infrared Heating: Infrared heating uses electromagnetic radiation in the infrared spectrum to transfer heat directly to an object or surface.

[0017] The thermal insulators are positioned circumferentially along the section length of the thermal conductivity probe 100. For example, the thermal insulators may be approximately 5 mm to 400 mm (e.g., 100 mm) long, 10 to 100 mm (e.g., 36 mm) in diameter, and have a wall thickness of approximately 1 mm to 50 mm. A variety of different thermal insulator sizes and lengths can be provided to isolate the thermistor, allowing measurement of the thermal conductivity of soil or sub-surface materials over different distances using the heating element and thermistor. Using a variety of thermal insulator sizes allows measurement of localized differences in thermal conductivity within a larger soil profile.

[0018] The thermal conductivity of the thermal conductive probe 100 between the thermistor and the heating element should be as low as possible. This property ensures that any changes in temperature detected by the thermistor are due to soil thermal conductivity and not due to thermal conductivity along the length of the thermal conductive probe 100. Thus, the thermal insulator can be selected from many different types of materials that are temperature resistant. Polyimide (PI): Polyimide is a high performance plastic known for its exceptional thermal stability and high temperature resistance. It can withstand continuous operating temperatures up to 300°C (572°F) and brief exposure to even higher temperatures. Polyetheretherketone (PEEK): PEEK is a high performance thermoplastic with excellent mechanical properties and heat resistance. It can withstand continuous operating temperatures up to 250°C (482°F) and brief exposure to even higher temperatures. Polyphenylene Sulfide (PPS): PPS is a rigid engineering plastic known for its high temperature resistance. It can withstand continuous use temperatures up to 240°C (464°F) and has good chemical resistance. Polyethylimide (PEI): PEI is a high-temperature thermoplastic known for its excellent mechanical and electrical properties. It can withstand continuous operating temperatures of up to 180-200°C (356-392°F) without significant degradation. PTFE, often known by the brand name Teflon, is a versatile plastic with excellent temperature resistance. It is known to withstand continuous operating temperatures up to 260°C (500°F) and has low friction and excellent chemical resistance.

[0019] The thermistor is disposed circumferentially along the section length of the thermal conductive probe 100. For example, the thermistor may be about 5 mm to 50 mm (e.g., 10 mm) in length and 10 to 100 mm (e.g., 36 mm) in diameter, with a wall thickness of about 1 mm to 50 mm. In one example, the thermistor is defined by a wall portion of the thermal conductive probe that includes a thermally conductive material with one or more temperature sensors. In another example, the thermistor is comprised of one or more temperature sensors embedded in the sidewall along the circumference or along the length of the thermal conductive probe. Thus, a discrete temperature level or temperature change in a region of soil surrounding the thermal conductive probe 100 can be measured.

[0020] There are several technologies available for thermistors. Thermocouples: Thermocouples are made of two dissimilar metals or metal alloys connected at one end to form a junction. When the junction is exposed to a temperature gradient, it generates a voltage proportional to the temperature difference. Resistance Temperature Detectors (RTDs): RTDs are temperature sensors that use the principle of electrical resistance. They consist of a pure metal or metal alloy wire wound around a core. As the temperature changes, the resistance of the wire changes in a predictable way. Semiconductors: Semiconductor devices have a large change in resistance with temperature. They are typically made from ceramic or polymer materials that have a highly nonlinear resistance-temperature relationship. Infrared (IR) Sensors: IR sensors measure temperature based on the thermal radiation an object emits. They detect the intensity of infrared radiation emitted by the object and convert it into a temperature reading. Integrated Circuit (IC) Temperature Sensors: IC temperature sensors are small electronic devices that contain a temperature-sensitive component integrated with signal processing circuitry. These sensors provide a digital temperature output and are often used in applications where size, accuracy, and convenience are important. Bimetallic Strip: A bimetallic strip consists of two different metals with different thermal expansion coefficients joined together. When the temperature changes, the bimetallic strip bends due to the unequal expansion of the metals. This bending can be used to measure temperature changes.

[0021] In one embodiment, multiple thermistors 102 and 106 are provided, each spaced a specified distance from the at least one heating element 110. Additionally or alternatively, multiple thermistors 114 and 118 are provided, each spaced a specified distance from the at least one heating element 110. In one particular embodiment, multiple thermistors 106 and 114 are provided, each spaced a specified distance from the at least one heating element 110. In another embodiment, multiple two or more thermistors are provided on either side of the heating element 110, each spaced a specified distance from the at least one heating element 110 (e.g., 3-10 thermistors on either side of the heating element 110). The specified distance can be between about 5 mm and 400 mm (e.g., 100 mm) to sample temperature at different locations separated from the heating element 110.

[0022] Thermal conductivity is a measure of a material's ability to conduct heat. In the context of soil, thermal conductivity refers to the soil's ability to transfer heat. It is an important property in a variety of fields, including agriculture, geophysics, and civil engineering, as it affects processes such as heat transfer, temperature distribution, and the design of geothermal systems. Soil is a heterogeneous, porous medium composed of solid particles, water, and air. The thermal conductivity of soil depends on several factors, including its composition, moisture content, density, and temperature. One or more thermistors 102, separated from the heating element 110 and isolated by one or more thermal insulators 108, allow for the measurement of thermal conductivity. Here are some key points regarding thermal conductivity in soil: Composition: The type and proportion of soil components greatly affect its thermal conductivity. Different minerals have varying thermal conductivity, with metals being the best conductors and insulating materials having lower conductivity. Soils with a high proportion of conductive minerals, such as sand and silt, generally have higher thermal conductivity compared to organic-rich soils and clays. Moisture content: Water is a better conductor of heat than air or dry soil particles. Thus, as the amount of water in a soil increases, its thermal conductivity also tends to increase. Saturated soils with high moisture content have a higher thermal conductivity than dry or partially saturated soils. Density: Compacted or dense soils tend to have a higher thermal conductivity than loose or less dense soils. When soil particles are tightly packed, there is greater contact between the particles and heat is transferred more efficiently. Temperature: Thermal conductivity in soils can vary with temperature. In general, the thermal conductivity of soils tends to increase with temperature due to changes in the physical properties of water and air. However, the effect may be more pronounced at lower temperatures and relatively constant at higher temperatures. Anisotropy: Soil thermal conductivity can exhibit anisotropic behavior, meaning that it can vary with direction. This is often observed in layered or structured soils, where the arrangement of soil particles affects the directionality of heat flow.

[0023] In further embodiments, the multiple thermistors 106 and 114 are located near at least one heating element 110. For example, the thermistor 106 can be located above the heating element 110 and can be separated from the heating element 110 by a thermal insulator 108. The thermistor 114 can be located below the heating element 110 and can be separated from the heating element 110 by a thermal insulator 112. In certain embodiments, the thermistor 106 and thermistor 114 are equidistant from the heating element 110. Alternatively, the thermistors 106 and 114 are spaced differently from the heating element 110. In some embodiments, the multiple thermistors 102, 106, 114, and 118 are located near the heating element 110. Optionally, the multiple heating elements can be interspersed among multiple thermistors having different thermistors configured to dynamically sample the temperature for any given one of the multiple heating elements 110. Thus, the placement of thermistors 106 and 114 relative to heating element 110 allows for measurements of the thermal conductivity of the soil in different directions relative to heating element 110. Also, the optional inclusion of multiple heating elements and multiple interspersed thermistors allows for measurements of thermal conductivity at one or more different depths along the column of probe 100.

[0024] There may be differences in thermal conductivity with depth in the soil, and flanking thermistors 106 with one or more heating elements 110 interspersed at different locations along the length of the probe 100 may allow for finer thermal conduction of the soil at different depths. These differences may be caused by several factors including changes in soil composition, moisture content, and density. Soil Composition: The composition of soil may vary with depth. Different layers may have different percentages of minerals, organic matter, and moisture. Different materials have varying thermal conductivities, so the thermal conductivity of the soil may vary deeper into the soil profile. Moisture Content: The moisture content in soil often decreases with depth, especially in arid regions and well-drained soils. The presence of water in the soil increases its thermal conductivity. Thus, as the moisture content decreases with depth, the thermal conductivity of the soil may decrease accordingly. Density and Compaction: Soil density and compaction may also vary with depth. Consolidated or dense layers tend to have higher thermal conductivity compared to loose or less dense layers. Thus, variations in density and compaction deep in the soil can result in differences in thermal conductivity. Geological and Environmental Factors: Geological factors such as the presence of rock layers, bedrock, or soil horizons can result in variations in thermal conductivity with depth. Additionally, environmental factors such as temperature gradients, groundwater movement, and soil disturbance can affect the distribution of thermal conductivity in the subsurface. Thus, site-specific studies and measurements can be performed to provide a more accurate understanding of the thermal conductivity profile at a particular location. Profiling of thermal conductivity with depth is important for applications such as geothermal energy systems, underground construction, and studying heat transfer underground. These profiles help in determining the thermal properties of different soil layers, understanding heat flow patterns, and optimizing the design and performance of associated systems. Thus, various amounts of thermistors can be provided on one or both sides of the heating element 110, up to 10 or more, separated by thermal insulation, allowing for the measurement of temperature at different distances from the heating element 110. Additionally, multiple heating elements can be provided along the length of the thermally conductive probe 110 to allow for sampling of thermal conductivity properties at different depths.Multiple heating elements can be distributed or closely located by one or more combinations of thermistors and thermal insulators, each of the thermistors being independently available for temperature measurement of any given heating element.

[0025] In a further embodiment, at least one heating element 110 is disposed between the upper thermal insulation portion 108 and the lower thermal insulation portion 112. The heating element 110 may be a section having a length of about 5 mm to 100 mm (e.g., 45 mm), a wall thickness of about 1 mm to 50 mm, and a diameter of 10 to 100 mm (e.g., 36 mm). The upper thermal insulation portion 108 and / or the lower thermal insulation portion 112 may be a section having a length of about 5 mm to 400 mm (e.g., 100 mm), and a wall thickness of about 1 mm to 50 mm, and a diameter of 10 to 100 mm (e.g., 36 mm). The heating element 110 may be a solid disk segment of the probe 100, or may be constructed as a hollow ring or surface band along a portion of the probe 100, or may consist of one or more discrete bands or regions on the surface of the probe 100. The thermal insulation portions 108 and / or 112 may be solid disk segments of the probe 110 or may be configured as rings or surface bands along a portion of the probe 100. Additionally, the thermal insulation portions 108 and / or 112 may be formed from a composite or layered set of materials having different properties. The thermal insulation portions 108 and / or 112 may each have different thermal insulation properties or may provide the same thermal insulation properties. The thermal insulation portions 108 and / or 112 may be detachable and / or replaceable, such as by threading or snap locking with the probe 100, so that different degrees, lengths, and distances of thermal insulation may be used, swapped, and removed for any given soil profile.

[0026] Several factors can be considered and modified to change the thermal insulation degree of a material. Here we will discuss some important considerations and techniques. Material Selection: Different types of plastics have different thermal insulation properties. Materials with lower thermal conductivity insulate better. Polymers like expanded polystyrene (EPS), polyurethane (PUR) and polyisocyanurate (PIR) are commonly used for insulation due to their low thermal conductivity. Foaming Agents: By introducing foaming agents into plastic materials, their insulating properties can be improved. These foaming agents create small air pockets within the plastic, reducing heat transfer by conduction and convection. Foamed plastics, e.g. foam boards, are widely used for insulation purposes. Thickness: Increasing the thickness of a plastic insulating material can improve its heat resistance and insulating ability. The thicker the layer of insulating material, the greater the barrier against heat transfer. Reflective Coatings: Applying a reflective coating or film to the surface of a plastic material can enhance its thermal insulation performance. These coatings reflect radiant heat, reducing the amount of heat absorbed by the plastic and improving its insulating properties. Multi-layer construction: Using multiple layers of plastic materials with different thermal properties can increase thermal insulation. For example, plastic composites can be constructed with alternating layers of high and low density plastics to create an effective barrier against heat transfer. Cellular: Cellular plastics, such as closed-cell, provide better thermal insulation. Closed-cell structures trap air within the plastic, reducing heat transfer. Encapsulation: Encapsulating plastic insulation within a protective barrier helps maintain its thermal properties over time. This can be done with coatings, films, or protective layers to shield the insulation from moisture, physical damage, and deterioration that can affect its insulating performance.

[0027] In various embodiments, at least one upper thermistor set is comprised of upper first thermistor portion 102 and upper second thermistor portion 106, which are thermally isolated from each other by upper thermistor thermal insulation portion 104 and from at least one heating element 110 by lower thermal insulation portion 108. Alternatively, or in addition, at least one lower thermistor set is comprised of lower first thermistor portion 118 and lower second thermistor portion 114, which are thermally isolated from each other by lower thermistor thermal insulation portion 116 and from at least one heating element 110 by upper thermal insulation portion 112. The upper or lower thermistor sets can be inserted at various locations along the length of probe 100 using screws, snaps, or other similar fastening means. Spacers can be used to position the upper or lower thermistor sets as needed or desired along the length of the probe 100. Additionally, either or both the upper or lower thermistor sets can be combined to create composite thermistor sets stacked along the length of the probe 100 with or without spacers or intervening heating elements 110.

[0028] In a further embodiment, the probe 100 further includes a conical penetration head 120 that includes one or more of the following sensors: pore pressure, friction, depth, and tilt. The conical penetration head (CPT) 120 can be attached and / or detached from the probe 100 using threads, snaps, fasteners, or other similar mechanisms. Thus, the CPT 120 can be removably attached with a threaded member 128 to at least one heating element 110; at least one thermal insulator 108; and at least one thermistor 106 that is thermally isolated from the at least one heating element 110 by the at least one thermal insulator 108. The CPT 120 can be employed in various types or configurations, and the probe 100 allows for the combination of CPT sensor functions in conjunction with thermal conductivity sensor functions to provide enhanced soil and subsurface profile analysis.

[0029] Cone Penetration Testing (CPT) is a widely used in situ geotechnical testing method that provides valuable information about subsurface soil or sediment layers. It involves forcing a cone-shaped penetrometer into the ground at a constant rate and measuring resistance and other parameters as the cone advances. The CPT device 120 typically consists of a steel cone 126 made of hardened steel that is forced into the ground using hydraulic or mechanical devices, and data is continuously recorded during the penetration process. The cone 126 typically has a friction sleeve 122 to measure the frictional resistance along the cone shaft. The CPT 120 may include a borehole pressure element 124 and / or one or more other types of sensors to measure the following data: 1. Cone Tip Resistance: This measurement represents the resistance encountered as the cone penetrates the soil. It provides an indication of the strength or stiffness of the soil. 2. Sleeve Friction: This measurement represents the frictional resistance along the cone shaft. It provides information about the shear strength and relative density of the soil. Pore ​​Water Pressure (u): Some CPT systems include a pore water pressure sensor to measure the excess pore water pressure developed during the test. This measurement is useful for evaluating soil consolidation properties and estimating soil hydraulic conductivity. The CPT 120 may also include additional measurements or modifications such as the use of electrical conductivity sensors to identify soil contamination, piezo cone tests to measure hydraulic conductivity, or seismic cone tests to evaluate soil stiffness and seismic properties. Data obtained from the CPT 120 is typically recorded in real time and used to create a profile of the subsurface soil layers. This information is valuable in assessing soil properties such as shear strength, stiffness, soil type, layer thickness, and stratigraphy. The data can be further analyzed to estimate parameters such as bearing capacity, settlement potential, liquefaction potential, and slope stability.

[0030] 2 is a diagram of a thermally conductive probe and its surroundings according to one embodiment of the present invention. In one embodiment, the site 200 includes a sub-surface 202 against which the thermally conductive probe 100 is pressed. The thermally conductive probe 100 includes, but is not limited to, at least one heating element 110, at least one thermal insulator 108, and at least one thermistor 106 thermally isolated from the at least one heating element 110 by the at least one thermal insulator 108. The sub-surface 202 includes, but is not limited to, the ocean floor, terrestrial, or extraterrestrial surfaces. In certain embodiments, the probe 100 further includes one or more of the thermistor 102, thermal insulator 104, thermal insulator 112, thermistor 114, thermal insulator 116, thermistor 118, and / or CPT 120.

[0031] The probe 100 is shown inserted or positioned within the subsurface 202. The heating element 110 is used to locally increase the temperature within the subsurface 202. The thermal insulator 108 substantially prevents the heating element 110 from directly affecting the thermistor 106. Thus, the localized increase in temperature induced by the heating element 110 penetrates and propagates to the subsurface 202. The thermistor 106 senses the increased temperature within the subsurface 202, the range of which depends on the thermal conductivity within the subsurface 202.

[0032] The probe 100 can be inserted into the subsurface 202 using a variety of techniques. Direct Push Method: In this method, a hydraulic or mechanical push system is used to insert the probe 100 directly into the subsurface. The probe 100 is pushed into the ground using force, typically applied by a hydraulic ram or a static weight system. This method is suitable for clay and granular soils and can provide real-time measurements during penetration or after the probe 100 reaches the desired depth or location. Hammering Method: In this technique, the probe 100 is driven into the subsurface using a hammering action. The hammer may be manual or powered by a mechanical device. This method is often used in dense or compacted soils and may require pre-drilling or pre-augering to facilitate penetration. Vibration Method: The vibration technique involves using a vibrating driver or vibrator attached to the probe 100. The vibration helps to reduce the subsurface resistance, making it easier for the probe 100 to penetrate the subsurface. This method is useful in clay soils and can improve penetration efficiency. Drilling method: In some cases, a boring rig may be used to create a borehole or pilot hole and then insert the probe 100. Once the hole is drilled, the probe 100 is lowered into the borehole using appropriate equipment. This method is suitable for more difficult subsurface conditions such as stiff or rocky soils. Jetting method: The jetting method involves using water or air pressure to fluidize the soil around the probe 100, reducing friction and facilitating penetration. A water or air jet is directed near the tip of the probe 100, allowing it to advance into the ground. This method is effective in loose or soft soils, but may not be suitable for clayey or compacted soils.

[0033] In various embodiments, the probe 100 can be used in a variety of subsurface types encountered in geotechnical and geological investigations, including any of the following examples: Sand: Sand is composed of granular particles ranging from 0.06 mm to 2 mm in diameter. It is often loose and has good drainage properties. Clay: Clay is composed of fine particles of 0.002 mm or less. It is cohesive, holds water well, and is prone to shrinkage and swelling. Silt: Silt particles are finer than sand but coarser than clay, ranging in size from 0.002 mm to 0.06 mm. Silt has properties intermediate between sand and clay. Gravel: Gravel is composed of larger particles, typically ranging in size from 2 mm to 60 mm. It is coarser than sand and has good load-bearing properties. Loam: Loam is a mixture of sand, silt, and clay in roughly equal proportions. It holds water while providing good drainage. Peat: Peat is formed from partially decomposed organic matter and is typically found in bogs or marshes. It has a high moisture content and low strength. Rock: The basement may contain many different types of rock, including sedimentary, igneous, and metamorphic. Examples include limestone, granite, shale, sandstone, basalt, and marble, each with their own unique properties. Fill: In some cases, the basement may contain fill, which is a man-made deposit that is often used to raise the ground level or support construction activities. Fill material may consist of a variety of materials, including sand, gravel, crushed stone, and even construction waste.

[0034] Subsurface 202 may further include freshwater or saltwater subsurfaces that may include sediments. The ocean floor is covered with layers of sediments. Sediments are a mixture of various materials that have settled over time. Terrigenous Sediments: These sediments originate from land and are transported to the ocean by rivers, wind, and other processes. Terrigenous sediments may include clay, silt, sand, and gravel, depending on the proximity to the coastline and the geological composition of the surrounding ground. Biogenic Sediments: Biogenic sediments are composed of the remains of marine organisms such as shells, skeletons, and microorganisms. For example, calcium carbonate shells from marine organisms such as foraminifera, coccolithophores, and corals may accumulate on the ocean floor to form calcareous mud. Volcanic Ash and Hydrothermal Deposits: In areas with active volcanic or hydrothermal activity, volcanic ash and minerals from hydrothermal vents may contribute to the composition of the ocean floor.

[0035] The locations of the sub-surface 202 and the locations where the probe 100 can be used may include a variety of ocean floor surfaces, such as any one or more of the following examples: Abyssal plain: A relatively flat area of ​​the ocean floor covered with fine-grained sediments. Mid-ocean ridge: A mid-ocean ridge is an underwater mountain range where tectonic plates are spreading apart, resulting in volcanic activity and the formation of new crust. Seamounts and Guyots: Seamounts are underwater mountain ranges that rise above the ocean floor, while Guyots are flat-topped seamounts that have eroded over time. Trench: A trench is a deep, elongated depression in the ocean floor associated with a subduction zone where one tectonic plate is being pushed under another. Hydrothermal vents: Hydrothermal vents are areas where hot, mineral-rich fluids are released from the ocean floor to support unique ecosystems and deposit minerals.

[0036] Thus, the probe 100 can be used to measure the thermal conductivity of the subsurface 202 through operations including at least (i) inserting the probe 100 to a location or depth for analysis so that it contacts the subsurface 202; (ii) activating the heating element 110 to transfer heat into the subsurface 202; (iii) recording the temperature at one or more intervals using the thermistor 106 for a time sufficient for the heat to propagate through the subsurface 202; (iv) analyzing the data after collecting temperature readings over a suitable period of time to observe how the temperature changes over time within the subsurface 202; and (v) calculating the thermal conductivity using a model or equation that factors in temperature change, time, and / or distance of the thermistor 106 from the heating element 110.

[0037] Many models can be used to convert temperature to thermal conductivity. One model that uses temperature change over time to determine thermal conductivity is the one-dimensional heat conduction equation. The one-dimensional heat conduction equation is written as: JPEG2025511511000002.jpg1040 where q is the heat flux (amount of heat transferred per unit area per unit time), k is the thermal conductivity of the soil, and dT / dx is the temperature gradient (rate of change of temperature with respect to distance). This particular equation can be used to determine thermal conductivity by performing operations that include: (i) applying a constant heat flux (q) to the soil sample, (ii) measuring the temperature change (dT) at a specific distance (x) from the heat source and recording the temperature readings at regular intervals, (iii) calculating the distance change (dx) based on the location of the temperature sensor, and (iv) substituting the measurements of q, dx, and dT into the equation to determine the thermal conductivity of the soil. This example model assumes steady-state conditions, which means that the temperature distribution in the soil sample has reached a steady state. Furthermore, this model assumes one-dimensional heat transfer, which may not accurately represent all subsurface types and conditions. There are other 2D and 3D models that can be used, for example: JPEG2025511511000003.jpg960 where q is the heat flux, k is the thermal conductivity, T is the temperature, and d 2 T / dx 2 and d 2 T / dy 2 are the second partial derivatives of temperature with respect to x and y, respectively. Additional example models include, for example: JPEG2025511511000004.jpg984 where q is the heat flux, k is the thermal conductivity, T is the temperature, and d 2 T / dx 2 , d 2 T / dy 2 , d 2 T / dz 2 are the second partial derivatives of temperature with respect to x, y, and z, respectively.

[0038] In certain embodiments, the probe 100 can be used with the CPT 120 head to collect and / or correlate various CPT data and thermal conductivity data for a given location within the subsurface 202. This data can be stored together in association with the GPS location of the 3D location to establish a 3D model of thermal conductivity and / or CPT data for an area and / or depth of the subsurface 202. Various cone penetration tests (CPT) of a subsurface 202, such as the ocean floor, can provide valuable data about subsurface conditions and geotechnical properties. Some of the key data that can be collected with a cone penetration of the ocean floor are: Cone Resistance (qc): Cone resistance is a measure of the resistance encountered as the cone penetration probe advances into the soil. It is an indicator of soil strength and stiffness. Cone resistance is measured in terms of cone tip resistance (qc) and can be used to estimate soil properties such as undrained shear strength and relative density. Friction Sleeve Resistance (fs): A friction sleeve is located behind the cone tip and measures the friction resistance between the sleeve and the surrounding soil. Provides information on soil skin friction and adhesion, useful in clayey soils. Pore Water Pressure (u): Cone penetration tests can measure pore water pressure at the seabed. Pore water pressure is useful in assessing soil behavior, stability, and liquefaction potential. Sleeve Friction Ratio (Rf): Sleeve friction ratio is calculated by dividing the friction sleeve resistance (fs) by the cone tip resistance (qc). It provides an indication of the relative ratio of frictional resistance to total resistance and can aid in characterizing soil types. Seabed Stratification: By continuously measuring the cone resistance and friction sleeve resistance as the probe advances, CPTs can identify distinct layers or changes in seabed sediment composition and stratigraphy. Soil Classification: Based on the measured cone resistance and friction sleeve resistance, along with other parameters, soil types can be classified using established soil classification systems (e.g., the Unified Soil Classification System or the International Soil Classification System). Soil strength and shear parameters: CPT data can be used to estimate geotechnical properties such as undrained shear strength, effective stress parameters, and soil stiffness, which are critical for geotechnical design and analysis. Groundwater conditions: Pore water pressures measured during cone penetration can provide insight into groundwater conditions, including atresia conditions, hydraulic gradients, and the presence of potential water flow patterns.These data points collected through cone penetrations of the seafloor are valuable for geotechnical investigations, foundation design, marine engineering, sediment characterization, subsea electrical and conduit engineering, and site assessment in the marine environment.

[0039] 3 is a system diagram of a thermal conductivity and CPT system according to an embodiment of the present invention. In one embodiment, the heat transfer system 300 includes, but is not limited to, a heat transfer device 302 with a heating element 304, a thermal insulator 306, and a thermistor 308, and a processor 310 configured to perform 312 heating element control operation, sample 314, 316 thermal data over time, and correlate 314, 316 thermal with CPT data. Optionally, the heat transfer system 300 can further include a cone penetration device 320 with a resistance sensor 322, a pressure sensor 324, an orientation sensor 326, and a processor 328 configured to sample 330 CPT data over time.

[0040] The heat transfer system 300 may include a probe integrated with the heat transfer device 302 and the processor 310. Alternatively, the heat transfer system 300 may be distributed with one or more heat transfer devices 302 in communication with one or more processors 310. For example, the heat transfer system 300 may include a probe 100 with an integrated processor 310. Alternatively, the heat transfer system 300 may include multiple probes 100, each in wired or wireless communication with one or more processors 310. The cone penetration device 320 may likewise be integrated with the heat transfer system 300, or may be partially or fully distributed with wired or wireless communication therebetween. In one particular embodiment, the heat transfer system 300 and the cone penetration device 320 are unified into a probe with wired data communication to one or more processors 310 or 328 to perform operations associated therewith.

[0041] The thermal conduction device 302 includes a set of heating elements 304, thermal insulators 306, and thermistors 308. The device 302 can include multiple sets of heating elements 304, thermal insulators 306, and thermistors 308. Alternatively, the device 302 can include any set with multiple heating elements 304, thermal insulators 306, and thermistors 308. For example, the device 302 can include two or more heating elements 304, each separated from two or more thermistors 308 by two or more thermal insulators 306. In one particular embodiment, one heating element 304 is flanked by four thermistors 308, each separated from the heating element 304 and the other thermistors 308 by thermal insulators 306. Alternatively, the system 300 can include two or more thermal conductivity devices 302 positioned along the length of one probe 100. Additionally, the system 300 can include multiple thermal conduction devices 302 distributed across multiple probes 100. Many combinations of devices 302 are possible, each with different combinations or instances of heating elements 304, thermal insulators 306, and thermistors 308.

[0042] The processor 310 may be physically integrated into the heat transfer system 300 or may be wired or wirelessly linked to the heat transfer system 300 or the heat transfer device 302. Various processor types or technologies may be used, including, for example, any of the following: Intel® Core Processors: Intel® Core processors are widely used in personal computers and laptops. They belong to different generations, such as the Intel® Core i3, i5, i7, and i9 series. Each generation offers improved performance and features over its predecessor. AMD Ryzen Processors: AMD Ryzen processors are a popular alternative to Intel® products. They offer high-performance computing capabilities and are known for their multitasking capabilities and affordability. Ryzen processors are commonly used in gaming PCs, workstations, and laptops. Qualcomm Snapdragon Processors: Qualcomm Snapdragon processors are primarily designed for mobile devices, including smartphones and tablets. They offer efficient power consumption, integrated graphics, and cellular connectivity. Snapdragon processors are known for their performance in the Android ecosystem. Apple® M1 Chip: The Apple® M1 chip is a custom-designed processor developed by Apple® for its Mac® computers. It leverages the ARM architecture to deliver high performance, energy efficiency, and improved battery life. The M1 chip integrates multiple components, including the CPU, GPU, and Neural Engine, for improved performance and optimized power consumption. IBM Power Processors: IBM Power processors are used in high-performance computing systems, servers, and enterprise-grade hardware. They are known for their scalability, reliability, and robust performance in demanding computing environments.

[0043] The processor 310 may be communicatively linked to the heat-conducting device 302 to receive and / or transmit data or control instructions. Wired communication may be accomplished using printed circuit board traces or wired conductors. Wireless communication may be accomplished using any one or more instances of Wi-Fi (Wireless Fidelity). Wi-Fi is a widely used wireless communication method that allows devices to wirelessly connect to a local area network (LAN) or the Internet. Wi-Fi operates under the IEEE 802.11 standard and transmits data using radio waves between devices within a limited range. Bluetooth: Bluetooth is a short-range wireless communication technology used to transfer data between devices in close proximity. Bluetooth operates in the unlicensed 2.4 GHz frequency band and allows wireless connections between devices. Cellular Network: Cellular networks provide wireless data communication over a wide area, typically using cellular towers and base stations. Cellular networks such as 3G, 4G LTE, and 5G allow mobile devices to connect wirelessly to the Internet and other networks. Mobile networks offer faster data transfer rates and greater coverage than Wi-Fi and Bluetooth. NFC (Near Field Communication): NFC is a short-range wireless communication technology that allows data transfer between devices at close range (within a few centimeters). Zigbee: Zigbee is a wireless communication standard based on the IEEE 802.15.4 standard. Zigbee operates in the 2.4 GHz frequency band and allows devices to form ad-hoc or mesh networks for data transmission. RFID (Radio Frequency Identification): RFID technology uses radio waves to wirelessly identify and track objects. RFID tags or transponders are attached to objects and when they come within range of an RFID reader, data is exchanged between the tag and the reader.

[0044] The cone penetrator 320 is an optional component to the heat transfer system 300. If present, the cone penetrator 320 may be physically incorporated into the heat transfer system or may be wired or wirelessly linked thereto. For example, the CPT 320 may be integrated into the probe 100 along with the heat transfer system 300. Alternatively, the CPT 320 may be part of one probe that is separate and / or usable from another probe that includes the heat transfer system 300. In an embodiment, multiple probes are provided in a system, some with the heat transfer system 300 and some with the CPT 320. In certain embodiments, the processor 310 and the processor 328 are combined into one processor. Optionally included within the CPT 320 are a resistance sensor 322, a pressure sensor 324, and / or a direction sensor 326.

[0045] In cone penetration testing (CPT), resistance sensors are used to measure the cone resistance (qc) and friction sleeve resistance (fs) as the cone penetration probe advances into the soil. These sensors provide valuable data about the geotechnical properties of the subsurface. Resistance sensors work on the principle of measuring the force or pressure exerted by the soil on the cone or friction sleeve. Cone Resistance (qc) Sensor: The cone resistance sensor is located at the tip of the cone penetration probe. As the probe is pushed into the soil, the cone encounters resistance from the surrounding soil. This resistance is transferred to the cone resistance sensor, which generally consists of a load cell or pressure transducer. The load cell or transducer converts the applied force or pressure into an electrical signal. The electrical signal is then amplified, conditioned, and processed by a data acquisition system connected to the cone penetration device. The processed signal is recorded and used to determine the cone resistance (qc) value, which represents the strength and stiffness of the soil. Friction Sleeve Resistance (fs) Sensor: The friction sleeve resistance sensor is located behind the cone tip and measures the friction resistance between the friction sleeve and the soil as the probe advances. The friction sleeve generally consists of a cylindrical metal sleeve with a pressure-sensitive device such as a strain gauge or pressure transducer embedded within it. When the friction sleeve encounters frictional forces from the soil, these forces are transmitted to the embedded sensor, which measures the applied pressure or strain. As with the cone resistance sensor, the electrical signal from the sensor is amplified, conditioned, and processed by a data acquisition system. The processed signal is used to determine the friction sleeve resistance (fs), which provides information about the soil's skin friction or adhesion. The cone resistance (qc) and friction sleeve resistance (fs) data obtained from the sensor are typically recorded continuously during the cone penetration test. These resistance measurements, along with other parameters such as pore water pressure and cone penetration rate, are analyzed to assess soil properties, evaluate subsurface conditions, and aid in geotechnical and site characterization.

[0046] Tilt sensors, also known as inclinometers or tilt sensors, can be used in cone penetration testing (CPT) to measure the tilt or inclination of a cone penetration probe during testing. These sensors provide information about the verticality or angle of the probe. This is useful for analyzing the geometry and alignment of the test, as well as accurately interpreting the CPT data. Sensor Placement: Tilt sensors are typically installed on the cone penetration probe itself, usually near the tip or near the cone. The sensor may be integrated into the probe assembly or mounted externally, depending on the specific design of the CPT device. Measurement Principle: Tilt sensors use various technologies to measure the tilt angle of the probe. Commonly used technologies include accelerometers, gyroscopes, or a combination of both. These sensors detect changes in the orientation of the probe relative to gravity and provide a corresponding electrical signal. Data Acquisition: The electrical signal from the tilt sensor is acquired by a data acquisition system connected to the CPT device. The signal is typically analog or digital and represents the tilt angle or inclination of the probe in real time. Data Processing and Analysis: The acquired tilt angle data is processed and recorded by the data acquisition system. Data can be visualized and analyzed to assess the verticality and alignment of the probe during testing. Deviations from vertical alignment indicate possible problems with the test, such as bent rods or uneven ground conditions. Correction and interpretation: Tilt data obtained from the sensor can be used to correct and interpret other CPT measurements. For example, correcting cone resistance (qc) and friction sleeve resistance (fs) values ​​based on tilt data can provide a more accurate representation of soil properties and geotechnical parameters. Quality control: Tilt sensors play a crucial role in quality control during CPT. Monitoring the tilt of the probe helps to ensure that tests are performed properly and that the data acquired are reliable and representative of subsurface conditions.

[0047] 4 is a flow diagram of a computer process 400 for operating a thermal conductive probe in accordance with an embodiment of the present invention. In one embodiment, a computer processor is configured to perform operations at 404 including at least controlling at least one heating element 402 and measuring temperature with at least one thermistor.

[0048] In a particular embodiment, computer process 400 is implemented on a central processing unit (CPU) such as: 1. x86 Architecture: x86 architecture includes various generations and families of processors, such as the Intel® Core i7, i5, i3 series, and AMD Ryzen processors. These processors are designed for general-purpose computing and are commonly used in desktops, laptops, and servers. 2. ARM Architecture: ARM (Advanced RISC Machines) processors are known for their energy efficiency and are designed using the RISC (Reduced Instruction Set Computing) architecture. Companies such as Qualcomm®, Apple®, and Samsung® use ARM-based processors in smartphones, tablets, and other portable devices. ARM processors are available for their power efficiency. 3. Power Architecture: Formerly known as PowerPC, the Power architecture is known for its scalability, reliability, and performance in enterprise environments. They are commonly found in IBM's Power Systems servers and some gaming consoles such as the Xbox 360 and PlayStation 3 (older generation gaming consoles). 4. RISC-V Architecture: RISC-V is an open source instruction set architecture (ISA) suitable for a variety of applications. RISC-V processors are open and flexible, with the advantage that companies and individuals can design their own processors based on the RISC-V instruction set. 5. Other Architectures: In addition to the above architectures, there are several other specialized processors used in specific domains.For example, IBM's z / Architecture is designed for mainframe computers, Intel's Itanium architecture targets High Performance Computing (HPC) applications, and NVIDIA's Graphics Processing Units (GPUs) are widely used for parallel computing and graphics-intensive tasks like gaming and artificial intelligence.

[0049] The computer process 400 can be implemented using one or more computer programming languages ​​that are compiled to configure the CPU, such as: 1. Python: Python is a versatile language that can be used in web development, scientific computing, data analysis, artificial intelligence, and automation. 2. JavaScript®: JavaScript® is the language of the web, primarily used for front-end web development. It can be used to create interactive web pages and dynamic user interfaces. 3. Java®: Java® is a general-purpose programming language known for its platform independence, and can be used to develop a wide range of applications, including desktop software, mobile apps (Android®), enterprise systems, and large-scale web applications. 4. C++: C++ is a powerful, high-performance language that is useful for system programming and resource-intensive applications. 5. C#: C# is a modern, object-oriented language that can be used for Windows® development, including desktop applications and web services. 6. Swift: Swift is a programming language developed by Apple® for iOS, macOS®, and watchOS development. 7. Kotlin: Kotlin is a statically typed programming language that runs on the Java Virtual Machine (JVM). It is available for Android app development8. Ruby: Ruby can be used for web development (Ruby on Rails framework). 9. Go: Go (or Golang) is a statically typed language suitable for network programming and distributed systems. 10. Rust: Rust is a systems programming language that can be used in areas such as systems programming and web browsers.

[0050] In some embodiments, a computer processor, such as the processor 310, is configured by a computer program to execute and control at least one heating element 402. For example, the heating element may include the heating element 110 of the probe 100. Controlling at least one heating element 402 may include increasing the temperature of the heating element, decreasing the temperature, turning on, off, or pulsing the heating element on / off. When turning on the heating element, the computer processor may run a steady current for a constant temperature, or may increase the temperature linearly or exponentially. When turning off the heating element, the computer processor may turn off the current, or may decrease the temperature linearly or exponentially. When pulsing on / off the heating element, the computer processor may turn on / off the heating element at regular or irregular intervals, such as intervals that increase or decrease over time. Additionally, the computer processor may turn on / off the heating element over time, at a steady temperature or with increasing or decreasing temperature. In certain embodiments, the computer processor may control the heating element based on user instructions, such as temperature, duration, or rise / fall profile. In other embodiments, the computer processor can automatically control the heating element based on programmed instructions or in part using sensor inputs. For example, the computer processor can detect depth, lack of movement, time, or soil factor and then automatically control the heating element. The computer processor can also adjust the control of the heating element with thermistor input. For example, if the thermistor is responding too quickly or not responding, the computer processor can adjust the control of the heating element to increase or decrease the temperature as needed.

[0051] In some embodiments, a computer processor, such as processor 310, is configured by a computer program to perform and measure temperature over time using at least one thermistor, at 404. For example, the thermistor may include the thermistor 102 of the probe 100.

[0052] The computer processor can measure the temperature at various times relative to the control of the heating element, including before, during, or after increasing the temperature of the heating element. In addition, the computer processor can measure the temperature at regular or irregular intervals relative to the control of the heating element. For example, the computer processor can measure the temperature every specified number of seconds after the heating element is turned on. The intervals between temperature measurements can increase or decrease over time. For example, the temperature measurement interval can be initially a first number of seconds, but can then be adjusted to a more frequent interval of a second number of seconds at such time that an initial temperature increase is detected. Then, in certain embodiments, the temperature interval can then be adjusted to a less frequent interval of a third number of seconds after the temperature has reached a steady state or has begun to decrease. In other embodiments, the temperature intervals are measured continuously in near real time during the control of the heating element. The computer processor can also measure the temperature when the heating element is not being used, such as for purposes of sampling the temperature at various sub-surface depths during probe insertion. Multiple thermistors at different locations can be used by a computer processor to measure temperatures at the same or different times at various locations or distances from the heating element 110. These operations can be used to detect and measure differences in the thermal conductivity of the soil and in different directions relative to the heating element.

[0053] In one particular embodiment, a computer processor can be used to control the heating element and measure temperature over time with the thermistor using the following steps: 1. Select the thermistor: Select an appropriate thermistor that is sensitive to temperature changes within a selected range for measurement. 2. Prepare the thermistor: Connect the thermistor to an appropriate measurement circuit or device. This typically involves connecting the thermistor to a voltage divider or Wheatstone bridge circuit to convert its resistance change into a measurable voltage or current change. 3. Attach the thermistor and heating element to the soil: Place the probe into the soil at a desired depth or location and measure the thermal conductivity. 4. Calibrate the system: Before taking long-term measurements, a system calibration can be performed, such as comparing the resistance or voltage output of the thermistor at known temperatures. A precision thermometer or a temperature-controlled chamber can be used to establish the calibration. 5. Measure temperature change: Connect the measurement circuit to a data acquisition system that can record the resistance or voltage output of the thermistor over time. Set up the data acquisition system to measure and record data at regular intervals. 6. Monitoring soil conditions: In addition to measuring temperature changes, CPT elements such as the CPT 120 can be used to monitor other relevant parameters, or even soil moisture content, ambient temperature, and humidity. These factors can affect the thermal conductivity of the soil and can be recorded simultaneously. 7. Calculating thermal conductivity: To determine the thermal conductivity of the soil, a computer processor can employ an appropriate mathematical model or equation, such as the one-dimensional heat conduction equation.

[0054] In one particular embodiment, the computer processor is configured to perform operations including energizing at least one heating element to emit heat, measuring the temperature using at least one thermistor to detect a preset temperature gain above ambient temperature, de-energizing the at least one heating element to stop emitting heat, and measuring the temperature over time using at least one thermistor to determine a decay profile. The computer processor measures an ambient temperature X degrees before energizing the heating element. The computer processor then heats the heating element to a specified temperature level. Upon energizing the thermistor, the computer processor continuously measures the temperature with the thermistor while the heating element is energized and measures the temperature until a time has elapsed such that the measured temperature exceeds X and reaches Y degrees. For example, Y ranges from 1C to 50C, e.g., 5C. Y may vary with X, and the time it takes for X to rise to Y is then stored and used to determine the thermal conductivity of the sub-surface. At such a time point that the computer processor records Y degrees above X, the computer processor also turns off the heating element. Optionally, the computer processor further samples the temperature decay to determine the time for the thermistor to reach ambient X.

[0055] One way to analyze the relationship between temperature rise and time and thermal conductivity is to use the concept of thermal diffusivity. Thermal diffusivity is a material property that characterizes how quickly heat can propagate through a material. The equation that relates temperature rise (ΔT), time (t), and thermal conductivity (κ) is known as the heat equation. JPEG2025511511000005.jpg1150 where ΔT is the temperature rise (in degrees Celsius or Kelvin), t is the time (in seconds), κ is the thermal conductivity (in watts per metre Kelvin, W / (m K)), and ρ is the density of the material (in cubic metres kilograms, kg / m 3), and c is the specific heat capacity of the material in joules per kilogram·Kelvin, J / (kg·K). This equation shows that the temperature rise (ΔT) is directly proportional to the product of thermal conductivity (κ) and time (t) divided by the product of density (ρ) and specific heat capacity (c). Thus, a greater thermal conductivity or a longer time will result in a greater temperature rise, assuming other parameters remain constant. In simpler terms, using a material with a higher thermal conductivity, heat will be transferred through it faster, resulting in a greater temperature rise in the same period of time. Similarly, the longer you apply heat to a material, the greater the temperature rise, given a constant thermal conductivity. This relationship assumes a one-dimensional heat transfer scenario and ignores other factors that may affect heat transfer, such as convection and radiation. In real situations, the heat transfer equation is often solved numerically, or using more complex mathematical models, to factor in these additional factors and provide a more accurate analysis.

[0056] In another particular embodiment, the at least one processor is configured to perform operations including at least energizing the at least one heating element to emit heat for a specified time, de-energizing the at least one heating element to stop emitting heat, and measuring temperature over time using at least one thermistor to determine a decay profile. For example, the computer processor may turn on the heating element to a specified level to heat the area of ​​soil for a specified time. The computer processor may sample the temperature using the thermistor to determine if the temperature has reached a certain temperature rise above ambient temperature or is at a steady state. The computer processor then deactivates the heating element while continuously monitoring the temperature using the thermistor. The time and temperature are monitored and recorded by the computer processor to identify a decay profile and / or time associated with a return to ambient temperature levels. The decay profile may be utilized to determine the thermal conductivity of the sub-surface.

[0057] A temperature decay profile, also called a temperature-time curve, describes how the temperature of a material changes over time after a heat source is removed or when the material is exposed to cooling. The relationship between the temperature decay profile and thermal conductivity provides insight into how quickly heat dissipates from a material. The rate at which heat dissipates from a material is governed by Fourier's law of heat conduction. Fourier's law states that the heat flux (Q) through a material is proportional to the negative gradient of the temperature (dT / dx) and the thermal conductivity (κ) of the material. JPEG2025511511000006.jpg1043

[0058] When considering a solid material with one-dimensional heat transfer, the temperature gradient (dT / dx) can be replaced by the time derivative of the temperature (dT / dt). Thus, the equation can be rewritten as: JPEG2025511511000007.jpg1143

[0059] In this form, the equation shows that the heat flux (Q) is directly proportional to the time derivative of temperature (dT / dt) and the negative of the thermal conductivity (κ). The negative sign indicates that heat flows from areas of higher temperature to areas of lower temperature. When the heat source is removed, the material begins to cool and its temperature decreases over time. The rate of temperature change (dT / dt) becomes negative, indicating a decrease in temperature. The magnitude of the temperature decay rate depends on the thermal conductivity of the material. If a material has a higher thermal conductivity, it can conduct heat efficiently, allowing for faster heat dissipation. As a result, the temperature of the material will decrease more rapidly over time, resulting in a steeper temperature decay profile. Conversely, a material with a lower thermal conductivity will have a slower heat dissipation rate, resulting in a less steep temperature decay profile. Thus, the thermal conductivity of a material directly affects the rate of cooling or heat loss. A material with a higher thermal conductivity will exhibit a faster temperature decay, and a material with a lower thermal conductivity will have a slower temperature decay.

[0060] In another particular embodiment, at least one processor performs operations including at least energizing at least one heating element to emit heat, measuring temperature using at least two thermistors to detect a preset temperature gain above ambient, de-energizing at least one heating element to stop emitting heat, measuring temperature using at least two thermistors over time to determine at least two decay profiles, and determining an average temperature decay index using at least two decay profiles. The computer processor can use one or more heating elements in combination with at least two spaced apart thermistors. The computer processor samples the temperature over time for each of the thermistors relative to activation of the heating element and determines the average time to reach a specified gain above ambient and / or the average decay profile to reach ambient. Thus, the computer processor can activate the heating elements and then use the thermistors to determine when each reaches a common threshold above ambient. If the thermistors are a specified distance away from the heating element, the time it takes each thermistor to reach a certain level above ambient may be slightly different. Therefore, the average of the two rise times can provide a more accurate assessment of thermal conductivity that accounts for local soil irregularities.

[0061] Using multiple temperature measurements to determine thermal conductivity has several advantages: 1. Accuracy: Thermal conductivity is affected by a variety of factors, including temperature, pressure, and material composition. By taking multiple temperature measurements at different points or intervals, more data is gathered, resulting in a more accurate record of the thermal behavior of the material. 2. Spatial variation: Materials often exhibit spatial variation in thermal conductivity due to variations in composition, density, or microstructure. By measuring temperature at multiple locations, the system can account for spatial variations and obtain a better understanding of how thermal conductivity varies within the material. This is especially important when dealing with heterogeneous materials or materials with complex shapes. 3. Anisotropic materials: Some materials have different thermal conductivities in different directions. These anisotropic materials require multiple temperature measurements to accurately determine their thermal conductivity. By measuring temperature along different axes or directions, the anisotropic behavior can be captured and the corresponding thermal conductivity components can be calculated. 4. Thermal gradients: In certain cases, the thermal conductivity of a material may vary with temperature. Measuring temperature at different levels or over a temperature range can capture thermal gradients within the material and account for the temperature dependence of thermal conductivity. This is particularly important when analyzing materials that are subject to changing temperatures or temperature gradients. 5. Validation and Consistency: Multiple temperature measurements allow cross-validation and consistency checks. By comparing the measured temperatures and the resulting thermal conductivity values, the system can ensure the reliability of the data and identify any discrepancies or errors. This helps to validate the experimental setup, the measurement technique, and the overall accuracy of the determined thermal conductivity. In summary, a computer processor using multiple temperature measurements provides a more comprehensive and accurate assessment of thermal conductivity. It allows for the consideration of spatial variations, anisotropic behavior, and temperature gradients, ensuring reliable and consistent results.

[0062] In another particular embodiment, at least one processor is configured to perform operations including at least controlling at least one heating element, measuring temperature over time using at least one thermistor, and generating an output of temperature registered to at least one of depth, tip resistance, sleeve resistance, hole pressure, and slope. The processor can measure CPT variables before, after, or during the measurement of thermal conductivity at the same site and sub-surface depth. Measurements such as depth, tip resistance, sleeve resistance, hole pressure, slope, etc. can be geolocated along with thermal conductivity measurements to establish a more comprehensive model of sub-surface properties. Additionally, the processor can aggregate thermal conductivity and CPT data from multiple sites or depths to establish a 3D matrix of geolocation data that can be used for various scientific or industrial purposes.

[0063] Combining Cone Penetration Test (CPT) data with thermal conductivity data provides several benefits in geotechnical and thermal analysis:1. Subsurface Characterization: CPT provides valuable information about the subsurface soil or rock layers, including composition, density, and stratigraphy. By integrating CPT data with thermal conductivity data, the system provides a comprehensive understanding of the subsurface conditions and thermal properties of the materials present. This aids in accurate geotechnical and thermal analysis, especially in applications like ground source heat pumps, electric energy transportation, or thermal energy storage.2. Heat Transfer Analysis: Thermal conductivity data alone provides no information about how heat flows through a material. However, by incorporating CPT data, the system is able to evaluate the geotechnical properties of the subsurface and how they affect heat transfer. For example, the presence of different soil layers with varying thermal conductivity or moisture content can have a significant impact on the thermal behavior of the system. By combining CPT and thermal conductivity data, the system can perform more accurate heat transfer analysis, optimizing the design and performance of geotechnical and thermal systems. 3. Geothermal Applications: CPT data combined with thermal conductivity data is particularly useful in geothermal energy applications. Geothermal systems involve transferring heat between the subsurface and a heat pump or heat exchanger. By integrating CPT data, which provides information on the thermal gradient, lithology, and hydraulic properties of the subsurface, with thermal conductivity data, the system assists in accurate modeling and improved design of geothermal systems. 4. Thermal Remediation: In environmental remediation projects that add heat to the subsurface to enhance the removal of contaminants, combining CPT data with thermal conductivity data can better assess how efficiently heat is distributed and transferred into the subsurface. Thus, the system can enable better design and control of remediation strategies. 5. Improved Site Characterization: By combining CPT data with thermal conductivity data, the system provides a more comprehensive site characterization. This integrated approach can provide a clearer picture of the subsurface conditions, including soil or rock properties, moisture content, thermal gradients, and thermal behavior.Such detailed information is valuable in a variety of applications, including underground construction, foundation design and thermal analysis for infrastructure projects.

[0064] The present invention may have additional embodiments and may be practiced without one or more of the details described in relation to a particular embodiment described, or may have any detail described in relation to one particular embodiment implemented with other details described in relation to another embodiment.

[0065] While preferred and alternative embodiments of the invention have been illustrated and described, as noted above, many changes can be made without departing from the spirit and scope of the invention. Accordingly, the scope of the invention is not limited by the disclosure of these preferred and alternative embodiments. Instead, the invention should be determined entirely by reference to the following claims.

Claims

1. at least one heating element; at least one thermal insulator; at least one thermistor thermally isolated from said at least one heating element by said at least one thermal insulator.

2. The probe of claim 1 , wherein the at least one thermistor comprises a plurality of thermistors thermally isolated from the at least one heating element.

3. The probe of claim 1 , wherein the at least one thermistor comprises a plurality of thermistors, each thermistor being spaced a designated distance from the at least one heating element.

4. The probe of claim 1 , wherein the at least one thermistor comprises a plurality of thermistors flanking at least one heating element.

5. The probe of claim 1 , wherein the at least one heating element comprises at least one heating element portion disposed between an upper thermal insulation portion and a lower thermal insulation portion.

6. The at least one thermistor 2. The probe of claim 1, comprising at least one upper thermistor set comprising an upper first thermistor portion and an upper second thermistor portion, the upper first thermistor portion and the upper second thermistor portion being thermally isolated from each other by an upper thermistor thermal insulation portion and from the at least one heating element by a lower thermal insulation portion.

7. The at least one thermistor 2. The probe of claim 1, comprising at least one lower thermistor set comprising a lower first thermistor portion and a lower second thermistor portion, the lower first thermistor portion and the lower second thermistor portion being thermally isolated from each other by a lower thermistor thermal insulation portion and from the at least one heating element by an upper thermal insulation portion.

8. the at least one heating element comprises at least one heating element portion disposed between an upper thermal insulation portion and a lower thermal insulation portion; the at least one thermistor includes at least one upper thermistor set and at least one lower thermistor set; the at least one upper thermistor set is comprised of an upper first thermistor portion and an upper second thermistor portion, the upper first thermistor portion and the upper second thermistor portion being thermally isolated from each other by an upper thermistor thermal insulation portion and from the at least one heating element portion by a lower thermal insulation portion; 2. The probe of claim 1, wherein the at least one lower thermistor set comprises a lower first thermistor portion and a lower second thermistor portion, the lower first thermistor portion and the lower second thermistor portion being thermally isolated from each other by a lower thermistor thermal insulation portion and from the at least one heating element portion by an upper thermal insulation portion.

9. The probe of claim 1 , further comprising a conical penetration head, said conical penetration head including one or more of the following sensors: pore pressure, friction, depth, and tilt.

10. The probe of claim 1 , further comprising at least one processor.

11. The at least one processor is configured to perform operations including: controlling the at least one heating element; using the at least one thermistor to measure temperature over time; The probe of claim 10.

12. The at least one processor is configured to perform operations including: controlling said at least one heating element to emit heat; measuring temperature using the at least one thermistor to detect a preset temperature gain above ambient temperature; de-energizing the at least one heating element to stop it from emitting heat; measuring temperature over time using said at least one thermistor to determine a decay profile; The probe of claim 10.

13. The at least one processor is configured to perform operations including: controlling said at least one heating element to emit heat for a specified period of time; de-energizing the at least one heating element to stop emitting heat; measuring temperature over time using said at least one thermistor to determine a decay profile; The probe of claim 10.

14. The at least one processor is configured to perform operations including: controlling said at least one heating element to emit heat; measuring temperature using the at least one thermistor over time to determine a thermal conductivity profile of the soil; de-energizing the at least one heating element to stop emitting heat; The probe of claim 10.

15. The at least one processor is configured to perform operations including: controlling said at least one heating element to emit heat; measuring temperature using at least two thermistors and detecting a preset temperature gain above ambient temperature; de-energizing the at least one heating element to stop emitting heat; measuring temperature over time using the at least two thermistors to determine at least two decay profiles; determining an average temperature decay profile using the at least two decay profiles; The probe of claim 10.

16. The at least one processor is configured to perform operations including: controlling the at least one heating element; measuring temperature over time using said at least one thermistor; generating an output of temperature registered to at least one of depth, tip resistance, sleeve resistance, hole pressure, and slope; The probe of claim 10.

17. An attachment for attaching to a cone penetration tool (CPT), comprising: at least one heating element; at least one thermal insulator; at least one thermistor thermally isolated from the at least one heating element by the at least one thermal insulator; a screw member removably attached to the CPT; attachment.

18. at least one heating element; at least one thermal insulator; at least one thermistor thermally isolated from the at least one heating element by the at least one thermal insulator; At least one processor configured to perform operations including at least the following: controlling the at least one heating element; measuring temperature over time using said at least one thermistor; A heat transfer system comprising:

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