Power supply module cooling structure

Abstract

The power module includes a first substrate, a first electronic component on a main surface of the first substrate, a second electronic component above the first electronic component, and a heat sink located above the first electronic component. The first electronic component and the second electronic component are thermally connected, and the first electronic component and the heat sink are thermally connected. In a top view of the power module, at least a portion of one of the first electronic components overlaps at least a portion of one of the second electronic components, and at least a portion of the one of the first electronic components overlaps a portion of the heat sink. In a side view of the power module, the second electronic component does not overlap any portion of the heat sink.

Description

[Technical field]

[0001] The present invention relates to power supply modules, and more particularly to cooling heat generating power elements within the power supply modules, thereby improving the performance of the power supply modules. [Background technology]

[0002] Known power supply modules include heat generating components, such as power elements of the power supply module. The heat generating components are typically separated from other more heat sensitive components in a location where a cavity / gap is provided to allow thermal isolation and heat dissipation of the heat generating components. For example, inductors near the heat generating components can be problematic, as inductors can have poor thermal conductivity. Also, some of the heat generated by the heat generating components is typically transferred through the substrate to a heat sink, which can be connected to a carbon sheet.

[0003] For example, Patent Document 1 teaches a power converter 101 including a pair of circuit boards 10A and 10B including a heat-generating power component 14 and an inductive component 24, as shown in FIG. 1. A conductive body 23 is provided between the pair of circuit boards 10A and 10B, and heat sinks 40A and 40B are provided adjacent to the pair of circuit boards 10A and 10B, respectively. Heat is transferred from the pair of circuit boards 10A and 10B to the conductive body 23 through a heat dissipation terminal block 50. A heat sink 3 is attached to the conductive body 23 to help remove heat from the conductive body 23. The heat-generating power component 14 is separated from the inductive component 24 and disposed in an open gap between the pair of circuit boards 10A and 10B to dissipate a portion of the heat generated by the heat-generating power component 14 to the surrounding air. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2020-205714 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, these arrangements in known power supply modules require a large amount of space, which is undesirable when miniaturization of the power supply module is required. Also, if the heat-generating power components must be located close to the inductive components, the cooling efficiency is reduced due to the poor thermal conductivity of the inductive components, which means that the heat-generating power components cannot operate at high currents. [Means for solving the problem]

[0006] In order to solve the above problems, a preferred embodiment of the present invention provides a power supply module that can be miniaturized while providing sufficient cooling to generate a large current. A preferred embodiment of the present invention provides a power module including a first substrate, a first electronic component on a main surface of the first substrate, a second electronic component above the first electronic component, and a heat sink located above the first electronic component. The first electronic component and the second electronic component are thermally connected, and the first electronic component and the heat sink are thermally connected. In a top view of the power module, at least a portion of one of the first electronic components overlaps at least a portion of one of the second electronic components, and at least a portion of the one first electronic component overlaps a portion of the heat sink. In a side view of the power module, the second electronic component does not overlap any portion of the heat sink.

[0007] The first electronic component may include a power element. The power supply module may further include a third electronic component on the main surface of the first substrate. The third electronic component may include a capacitor.

[0008] The power module may further include a first thermally conductive material between the first electronic component and the second electronic component. The first thermally conductive material may include a first carbon sheet. The power module may further include a second thermally conductive material between the first electronic component and the heat sink. The second thermally conductive material may include a second carbon sheet. The first thermally conductive material and the second thermally conductive material may define a single layer.

[0009] The second electronic component may include an inductor. A top surface of the heat sink may be located above the top surface of the inductor. The heat sink may be electrically and thermally conductive. The top surface of the second electronic component and / or the top surface of the heat sink may be at least partially molded into the housing.

[0010] A preferred embodiment of the present invention also provides a power module including a first substrate, a first electronic component and a second electronic component on a main surface of the first substrate, a second substrate above the first electronic component and the second electronic component, a third electronic component on a main surface of the second substrate, a fourth electronic component above the third electronic component, and a heat sink above the third electronic component. The third electronic component and the fourth electronic component are thermally connected, and the third electronic component and the heat sink are thermally connected. In a top view of the power module, at least a portion of one of the third electronic components overlaps a portion of one of the fourth electronic components and the power module, and at least a portion of the one third electronic component overlaps a portion of the heat sink. In a side view of the power module, the fourth electronic component does not overlap any portion of the heat sink.

[0011] The first electronic component may include a capacitor. The second electronic component may include a conductive connection pin. The power supply module may further include a fifth electronic component provided on a main surface of the second substrate. The fifth electronic component may include a capacitor. The power supply module may further include a sixth electronic component provided on another main surface of the second substrate opposite to the main surface of the second substrate on which the third electronic component is provided. The sixth electronic component may include a capacitor.

[0012] The above and other features, elements, characteristics, steps, and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the present invention with reference to the accompanying drawings. [Brief description of the drawings]

[0013] [Figure 1] 1 illustrates an example of a known power supply module. [Diagram 2] FIG. 1 shows a cross-sectional block diagram of a power supply module according to a first preferred embodiment of the present invention. [Diagram 3] FIG. 1 illustrates a perspective view of a power module with the housing removed according to a first preferred embodiment of the present invention. [Figure 4] FIG. 2 shows a cross-sectional block diagram of a power supply module according to a second preferred embodiment of the present invention. [Diagram 5] FIG. 2 illustrates a perspective view of a power module with the housing removed according to a second preferred embodiment of the present invention. [Figure 6] FIG. 1 illustrates a perspective view of a power module with the housing, the heat sink, and one of the second substrates removed in accordance with a second preferred embodiment of the present invention. [Figure 7] FIG. 13 shows a cross-sectional block diagram of a power supply module according to a modification of the second preferred embodiment of the present invention. [Figure 8] FIG. 13 shows an example of a circuit diagram of a power supply module according to a third preferred embodiment of the present invention. [Figure 9] FIG. 13 illustrates a perspective view of a power supply module according to a fourth preferred embodiment of the present invention. [Figure 10] FIG. 13 illustrates a top view of a power module according to a fourth preferred embodiment of the present invention. [Figure 11] FIG. 10 shows an exploded view of the power supply module of FIG. [Figure 12] 10 shows a perspective view of the power module of FIG. 9 without a heat sink. [Figure 13] 10 shows a top view of the power module of FIG. 9 without a heat sink. [Figure 14] 13 illustrates a simulated heat map of a power supply module according to a fifth preferred embodiment of the present invention. [Figure 15] FIG. 15 shows the power supply module used to create the simulated heat map of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] First Preferred Embodiment A power module according to a first preferred embodiment of the present invention will be described with reference to Figures 2 and 3. Figure 2 is a cross-sectional block diagram showing an example of an arrangement of components of a power module 1 according to a first preferred embodiment of the present invention. Figure 3 is a perspective view of an example of a power module 1 according to a first preferred embodiment of the present invention, with the housing removed to show a possible arrangement of components of the power module 1.

[0015] As shown in FIG. 2, the power supply module 1 may include a first substrate 10, a thermally conductive layer 20 (which may include at least one material layer), a housing 30, a first electronic component 11, a second electronic component 12, a third electronic component 13, and a heat sink 18.

[0016] At least one first electronic component 11 and one third electronic component 13 are provided on the main surface of the first substrate 11. A plurality of first electronic components 11 and a plurality of third electronic components 13 may be provided on the main surface of the first substrate 11. The first electronic component 11 may be a high heat generating element. For example, the first electronic component 11 may be a power element such as a transistor, an operational amplifier, an inverter, or a diode. The third electronic component 13 may be a small low heat generating element. For example, the third electronic component 13 may be a capacitor such as a surface mount chip capacitor.

[0017] The heat sink 18 may be a single heat sink or may be divided into multiple heat sinks that may or may not be in thermal contact with each other. The heat sink 18 may be made of a material that conducts heat, such as a metal containing at least one alloy of Al, Cu, and brass. The heat sink 18 may be manufactured by cutting, pressing, die casting, or the like. The heat sink 18 may be fixed to a product using adhesive, solder, or the like. The heat sink 18 may be provided with protrusions that can be used to fix the heat sink 18 in a predetermined position by hooking the protrusions onto the edge of a substrate. Fixing the heat sink 18 to the edge of the substrate and bonding the heat sink may be performed at the same position.

[0018] A thermal interface material (TIM) may be interposed between the heat sink 18 and the first electronic component 11 . The top surface of the first electronic component 11 may be provided with a thermally conductive layer 20. Depending on the application, the thermally conductive layer 20 may have a thermal conductivity lower than, higher than, or the same as that of the first substrate 10. The thermally conductive layer may include at least one material or layer, or may include two or more materials or layers bonded together. The at least one material or layer may include, for example, one or more types of carbon sheets.

[0019] At least one second electronic component 12 and a heat sink 18 are provided on the main surface of the thermally conductive layer 20. A plurality of second electronic components 12 and a heat sink 18 may be provided on the thermally conductive layer 20. The second electronic component 12 may be a large low heat generating element. For example, the second electronic component 12 may be an inductor that may have a lower thermal conductivity than the heat sink 18. The first electronic element 11 and the second electronic element 12 may be larger than the third electronic element 13. By arranging a low heat generating element such as an inductor and a heat sink on the same layer, overlapping a power element and a large electronic element such as an inductor in a top view, and overlapping a high heat generating element such as a power element and a heat sink in a top view, it is possible to achieve miniaturization (e.g., reduction in mounting area) while providing sufficient thermal coupling between the high heat generating element and the heat sink.

[0020] Another TIM may be interposed between each portion of the first electronic component 11 that overlaps the underside of the second electronic component 12. Thermal resistance may be large even when thermally coupled to the second electronic component 12. Therefore, a thermally conductive layer 20 may be interposed between the first electronic component and the underside of the second electronic component to facilitate heat dissipation to the heat sink 18.

[0021] The first electronic component 11, the second electronic component 12, and the heat sink 18 can be arranged such that (i) a portion of the first electronic component 11 and the heat sink 18 overlap each other when viewed from the top surface of the power module 1, and (ii) a portion of the first electronic component 11 and the second electronic component 12 overlap each other when viewed from the top surface of the power module 1. Alternatively, the first electronic component 11, the second electronic component 12, and the heat sink 18 may be arranged such that (i) a portion of one first electronic component 11 and the heat sink 18 overlap each other when viewed from the top surface of the power module 1, and (ii) a portion of the first electronic component 11 and a portion of the second electronic component 12 overlap each other when viewed from the top surface of the power module 1. The first electronic component 11 (or a plurality of first electronic components) and the heat sink 18 can overlap with any overlap ratio. With these arrangements and the thermally conductive layer 20, both the first electronic component 11 and the second electronic component 12 are efficiently thermally connected to the heat sink 18. Although inductors typically have low thermal conductivity, the inclusion of the thermally conductive layer 20 provides a path for heat to transfer from the second electronic component 12 to the heat sink 18. This efficient thermal connection results in improved cooling, which improves the performance of the power supply module 1 and allows for higher current output.

[0022] Additionally, the first electronic component 11 and the third electronic component 13 may or may not overlap each other when viewed from the side of the power module 1, depending on the particular application. The second electronic component 12 and the heat sink 18 may or may not overlap each other when viewed from the side of the power module 1, depending on the particular application.

[0023] When viewed from the top of the power supply module 1, the first electronic component 11, the second electronic component 12, and the heat sink 18 can be arranged in a stacked manner, thereby reducing the surface area of ​​the first substrate 10, and thereby enabling the power supply module 1 to be made smaller.

[0024] The heat sink 18 can be made of a material that is both thermally and electrically conductive. Suitable materials for the heat sink 18 include, for example, copper, aluminum, or other suitable materials. The top surface of the heat sink 18 can be located above the top surface of the second electronic component 12. This arrangement can better facilitate dissipating heat to the outside of the power module 1 by defining a gap between the second electronic component 12 and the housing 30, which contacts the top surface of the heat sink 18 but not the second electronic component 12. Furthermore, this arrangement can help avoid failures caused by short circuits, electrostatic discharge, etc. between the housing 30 and the second electronic component 12. The housing 30 can be made of, for example, aluminum, steel, copper, brass, or other suitable materials.

[0025] To further facilitate heat dissipation, the top surface of the second electronic component 12 and / or the top surface of the heat sink 18 can be at least partially molded or embedded within a portion of the housing 30 to increase thermal conductivity between the housing 30, the second electronic component 12 and the heat sink 18.

[0026] 3 shows a perspective view of an example of a power supply module 1 with the housing removed according to the first preferred embodiment of the present invention. The housing is not shown in FIG. 3. Here, a first electronic component 11 (power element) and a third electronic component 13 (chip capacitor) are provided on the main surface of a first substrate 10. A thermally conductive layer 20 (not visible in FIG. 3 because it overlaps with other components) is provided on the upper surface of the first electronic component 11, and the thermally conductive layer 20 is in contact with a second electronic component 12 (inductor) and the lower surface of a heat sink 18.

[0027] Second Preferred Embodiment A power module according to a second preferred embodiment of the present invention will be described with reference to Figs. 4 to 7. Fig. 4 is a cross-sectional block diagram showing an example of an arrangement of components of a power module 2 according to a second preferred embodiment of the present invention. Fig. 5 is a perspective view of an example of a power module 2 according to a second preferred embodiment of the present invention, with the housing removed to show a possible arrangement of components of the power module 2. The housing is not shown in Fig. 5. Fig. 6 is another perspective view of an example of a power module 2 according to a second preferred embodiment of the present invention, with one of the first substrates 10 removed to show a possible arrangement of components of the power module 2. The housing is not shown in Fig. 6.

[0028] As shown in FIG. 4, the power module 2 according to the second preferred embodiment differs from the power module 1 according to the first preferred embodiment in that a first substrate 10 and a second substrate 100 are stacked. The first substrate 10 can be stacked on the second substrate 100. The first substrate 10 may be a single substrate, or may include two or more first substrates 10 as shown in FIGS. 5 and 6. Other configurations of the power module 2 according to the second preferred embodiment can be similar to those of the power module 1 according to the first preferred embodiment, and for simplification, a description of the same parts will be omitted.

[0029] The first substrate 10, the first electronic component 11, the second electronic component 12, the third electronic component 13, the heat sink 18, the thermally conductive layer 20, and the housing 30 of the second preferred embodiment may be arranged the same or similar to those of the first preferred embodiment. The first substrate 10 may be mounted to the second substrate 100, with the fourth electronic component 14 and the fifth electronic component 15 between the first substrate 10 and the second substrate 100. The fourth electronic component 14 may include a small, low heat generating element, including, for example, a capacitor, and the fifth electronic component 15 may include, for example, a contact pin or other suitable connector(s) connecting the first substrate 10 and the second substrate 100.

[0030] The power supply module 2 may include a laminated substrate defined by a first substrate 10 and a second substrate 100. The first substrate 10 includes at least one third electronic component 13 provided on a major surface of the first substrate 10. The second substrate 200 includes at least one fifth electronic component 15 provided on a major surface of the second substrate 200. This arrangement allows for a miniaturization of the power supply module 2, especially when additional chip capacitors are used in the power supply module 2.

[0031] The first substrate 10 may include at least one first electronic component 11 and one third electronic component 13 on a main surface, and at least one second electronic component 12 and a heat sink 18 are provided on a main surface of a thermally conductive layer 20 on the first electronic component 11. As in the power supply module 1, in the power supply module 2, the first electronic component 11, the second electronic component 12, and the heat sink 18 may be arranged such that (i) when viewed from the top surface of the power supply module 2, a portion of the first electronic component 11 and the heat sink 18 overlap each other, and (ii) when viewed from the top surface of the power supply module 2, a portion of the first electronic component 11 and the second electronic component 12 overlap each other. Alternatively, the first electronic component 11, the second electronic component 12, and the heat sink 18 may be arranged such that (i) when viewed from the top of the power supply module 2, a portion of the first electronic component 11 and the heat sink 18 overlap each other, and (ii) when viewed from the top of the power supply module 2, a portion of the first electronic component 11 and a portion of the second electronic component 12 overlap each other.

[0032] The inclusion of the power supply module 2 in a laminate substrate defined by the first substrate 10 and the second substrate 100 allows for the inclusion of additional components in a smaller footprint, while the inclusion of a specific layout of the power supply module 2 provides an efficient thermal connection resulting in improved cooling, thereby improving the performance of the power supply module 2 and allowing for a higher current output.

[0033] 7 shows a modification of the power supply module 2A in which a sixth electronic component 16 can be provided on the underside of the first substrate 10. This configuration allows for further miniaturization whilst maintaining improved cooling.

[0034] The first substrate 10, the second substrate 100, the first electronic component 11, the second electronic component 12, the third electronic component 13, the fourth electronic component 14, the fifth electronic component 15, the heat sink 18, the thermally conductive layer 20, and the housing 30 of the modified second embodiment may be arranged in the same or similar manner as in the second embodiment. A sixth electronic component may be added to the lower surface of the first substrate 10. The sixth electronic component 15 may be a small, low heat generating element, including, for example, a capacitor.

[0035] Third Preferred Embodiment 8 shows a circuit diagram of a power supply module according to a third preferred embodiment of the present invention. This circuit diagram can be implemented in the power supply modules according to other preferred embodiments, including the first and second preferred embodiments described above, and the fourth and fifth preferred embodiments described below. The circuit diagram in FIG. 8 is only an example, and the power supply modules of other preferred embodiments can implement other power supply circuits or topologies.

[0036] The circuit diagram includes an input voltage V1, an input capacitor Cin, power stages 1, 2, 3, 4, inductors L1, L2, L3, L4, an output capacitor Cout, and a load I1. The input voltage V1 is connected to the input capacitor Cin. The power stages 1, 2, 3, 4 are connected to the input capacitor Cin. Although FIG. 8 shows four power stages, any number of power stages may be used. Each power stage 1, 2, 3, 4 includes a driver that drives two power switches Q1 and Q2, Q3 and Q4, Q5 and Q6, Q7 and Q8. Different topologies may have different numbers of power switches in each stage. Each power stage 1, 2, 3, 4 may be connected to a corresponding inductor L1, L2, L3, L4. The number of inductors may match the number of power stages. As shown in FIG. 8, the inductors L1, L2, L3, L4 may be coupled. The inductors may be coupled by sharing a common core, for example, as shown in FIG. 6. In some applications, the inductors may not be coupled. The inductors L1, L2, L3, and L4 are connected to an output capacitor Cout. A load I1 is connected to the output capacitor Cout.

[0037] The various components of the circuit diagram can be located in different areas of the power module. For example, the components of the power stages 1, 2, 3, 4, including the drivers and power switches Q1 and Q2, Q3 and Q4, Q5 and Q6, Q7 and Q8, can be the first electronic component 11 on the first substrate 10, the inductors L1, L2, L3, L4 can be the second electronic component 12 located above and at least partially overlapping the first electronic component 11, and the input capacitor Cin and the output capacitor Cout can be the third electronic component 13 on the first substrate 10, or the fifth electronic component 15 and the sixth electronic component 16 between the first substrate 10 and the second substrate 100 as shown in FIG. 8. A fourth electronic component 14 can be used to connect the electronic components located on different substrates.

[0038] Fourth Preferred Embodiment 9-13 show a power module 2 according to a fourth preferred embodiment of the present invention. The power module 2 of FIGS. 9-13 is similar to the power module 2 of the second preferred embodiment, but includes eight first substrates 10 on a second substrate 100. FIGS. 9 and 10 show the power module 2 without a housing but including a single heat sink 18. FIG. 11 is an exploded view showing the heat sink 18 above the first substrates 10. FIGS. 12 and 13 show the power module 2 without the heat sink 18. Note that in FIG. 12, one of the first substrates 10 is not shown, and the inductors on two of the other first substrates 10 are not shown.

[0039] Located above the first substrates 10 are a heat sink 18, a first electronic component 11, a second electronic component 12, and a third electronic component 13. As shown in FIGS. 9 and 10, a single heat sink 18 can be located above all eight first substrates 10, with each of the first substrates 10 including a separate first electronic component 11, second electronic component 12, and third electronic component 13. A fourth electronic component 14 can connect a different first substrate 10 to the second substrate 100. A fifth electronic component 15 (e.g., a capacitor), and possibly a sixth electronic component (e.g., a capacitor) (not shown in FIGS. 9-13) can be located between a corresponding one of the first substrates 10 and the second substrate 100.

[0040] As shown in Figures 9 to 13, the second substrate 100 may include one or more areas where the second substrate 100 is not covered by the corresponding first substrate 10. Additional electronic components may be included in the uncovered areas. The additional electronic components may, for example, control the first electronic components 11. For example, if the first electronic component includes a power stage having a power switch and a driver for the power switch, the additional electronic components may include a controller that sends a control signal to a driver for the power stage.

[0041] Fifth Preferred Embodiment FIG. 14 shows a heat map of the power module 3 according to the fifth preferred embodiment of the present invention in FIG. 15. The power module 3 is similar to the power module 2 of the second preferred embodiment, including a first substrate 10 on a second substrate 100. Above the first substrate 10 are located a heat sink 18, a first electronic component 11 (e.g., a power element), a second electronic component 12 (e.g., an inductor), and a third electronic component 13 (e.g., a capacitor). A fourth electronic component 14 can connect the first substrate 10 and the second substrate 100. A fifth electronic component 15 (e.g., a capacitor) can be located between the first substrate 10 and the second substrate 100.

[0042] The heat map in FIG. 14 shows that by overlaying both the second electronic component 12 and the heat sink 18 on the first electronic component 11, heat can flow from the first electronic component 11 and the second electronic component 12 to the heat sink 18.

[0043] The configurations of the preferred embodiment and modified embodiments described above can be appropriately combined with each other, and effects corresponding to each combination can be obtained. It should be understood that the foregoing description is only illustrative of the present invention. Various alternatives and modifications can be devised by those skilled in the art without departing from the present invention. Accordingly, the present invention is intended to embrace all such alternatives, modifications, and variations that fall within the scope of the appended claims.

Claims

1. 1. A power supply module, comprising: A first substrate; a first electronic component on a major surface of the first substrate; a second electronic component above the first electronic component; a heat sink located above the first electronic component; the first electronic component and the second electronic component are thermally connected; the first electronic component and the heat sink are thermally connected; when viewed from above, at least a portion of one of the first electronic components overlaps with at least a portion of one of the second electronic components; When viewed from above, at least a portion of the one first electronic component overlaps with a portion of the heat sink; A power supply module, wherein, in a side view of the power supply module, the second electronic component does not overlap any portion of the heat sink.

2. The power supply module of claim 1 , wherein the first electronic component includes a power element.

3. The power supply module of claim 1 or 2, further comprising a third electronic component on the main surface of the first substrate.

4. The power supply module of claim 3 , wherein the third electronic component includes a capacitor.

5. The power supply module of any one of claims 1 to 4, further comprising a first thermally conductive material between the first electronic component and the second electronic component.

6. The power module of claim 5 , wherein the first thermally conductive material comprises a first carbon sheet.

7. 7. The power module of claim 5 or 6, further comprising a second thermally conductive material between the first electronic component and the heat sink.

8. The power module of claim 7 , wherein the second thermally conductive material comprises a second carbon sheet.

9. 9. The power module of claim 7 or 8, wherein the first thermally conductive material and the second thermally conductive material define a single layer.

10. The power supply module according to any one of claims 1 to 9, wherein the second electronic component includes an inductor.

11. The power module of claim 10 , wherein a top surface of the heat sink is located above a top surface of the inductor.

12. The power supply module according to any one of claims 1 to 10, wherein the heat sink has electrical conductivity and thermal conductivity.

13. The power module of any one of claims 1 to 10, wherein at least one of a top surface of the second electronic component and a top surface of the heat sink is at least partially molded within a housing.

14. 1. A power supply module, comprising: a first substrate and a second substrate, the first substrate being positioned above the second substrate; a first electronic component on a major surface of the first substrate; a second electronic component above the first electronic component; a fourth electronic component on a main surface of the second substrate; a heat sink above the first electronic component; the first electronic component and the second electronic component are thermally connected; the first electronic component and the heat sink are thermally connected; when viewed from above, a portion of one of the first electronic components overlaps with a portion of one of the second electronic components; When viewed from above, at least a portion of the one first electronic component overlaps with a portion of the heat sink; A power supply module, wherein, in a side view of the power supply module, the second electronic component does not overlap any portion of the heat sink.

15. The power supply module of claim 14 , wherein the fourth electronic component includes a capacitor.

16. 16. The power supply module according to claim 14, further comprising a conductive connection pin connecting the first substrate and the second substrate.

17. The power supply module according to any one of claims 14 to 16, further comprising a third electronic component provided on the main surface of the first substrate.

18. The power supply module of claim 17 , wherein the third electronic component includes a capacitor.

19. The power supply module according to any one of claims 14 to 18, further comprising a sixth electronic component provided on another main surface of the first substrate opposite to the main surface of the first substrate on which the first electronic component is provided.

20. The power supply module of claim 19 , wherein the sixth electronic component includes a capacitor.

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