Immersion cooling platform with adjustable weir and multifunction computing device handle - Patents.com

Abstract

A submersion cooling system and method of operating the system are described. The system can include a vessel configurable to hold a thermally conductive dielectric fluid, a computer component configurable to be at least partially submerged in the dielectric fluid, and a fluid circulation system configurable to draw the dielectric fluid from a sump region of the vessel, pass the dielectric fluid through a filter, and deliver the dielectric fluid to a bath region of the vessel. In one exemplary embodiment, there can be an adjustable weir between the bath region and the sump region. A multi-function handle is also described.

Description

[Technical field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims priority to U.S. Application No. 63 / 327737, filed April 5, 2022 (Docket No. 121219.0000141), and U.S. Application No. 63 / 327729, filed April 5, 2022 (Docket No. 121219.0000138), which are incorporated herein by reference.

[0002] This application is also related to International Publication WO2020 / 102090, entitled "Immersion Cooling Platform," filed on November 11, 2019, owned by TMG Core, which is incorporated herein by reference.

[0003] The present disclosure relates to an immersion cooling system adapted for house computing devices, for example an immersion cooling system including a control system for optimizing the temperature of the system.

[0004] The present disclosure also relates to single-phase immersion cooling systems and processes that may include, for example, a multifunction computing device handle. [Background technology]

[0005] Conventional computing and / or server systems utilize air to cool various components of those systems. Conventional liquid or water-cooled computers utilize flowing liquid to draw heat from computer components, but avoid direct contact between the computer components and the liquid itself. The development of electrically non-conductive and / or dielectric fluids allows for the use of immersion cooling, in which computer components and other electronic devices are immersed in a dielectric or electrically non-conductive liquid to draw heat from the components directly into the liquid. Immersion cooling can reduce the total energy required to cool computer components, and may also reduce the amount of space and equipment required for proper cooling. Exemplary prior art two-phase immersion cooling systems and processes are described, for example, in U.S. Pat. No. 1,101,3144, which is incorporated herein by reference.

[0006] Immersion cooling systems have been implemented for a variety of computing needs, and it is therefore instructive to describe an immersion cooling system that can be readily adapted for adjustable transfer of dielectric fluid between a bath region and a sump region using an adjustable weir. Summary of the Invention

[0007] Advantageously, the present application relates to an exemplary submersion cooling system and method of operating the system. In one embodiment, the system can include a vessel configurable to hold a thermally conductive dielectric fluid, a computer component configurable to be at least partially submerged in the dielectric fluid, and a fluid circulation system configurable to draw the dielectric fluid from a sump region of the vessel, pass the dielectric fluid through a filter, and deliver the dielectric fluid to a bath region of the vessel. In one exemplary embodiment, there can be an adjustable weir between the bath region and the sump region.

[0008] In one exemplary embodiment, the adjustable weir can be removably secured to a wall between the bath region and the sump region. In one exemplary embodiment, the adjustable weir can be secured to a wall between the bath region and the sump region using screws. In one exemplary embodiment, the system can include an actuator for moving the adjustable weir. In one exemplary embodiment, the system can include a management system that receives sensor data and directs the actuator to move the adjustable weir. In one exemplary embodiment, the sensor data can be a fluid level in the bath region or the sump region. In one exemplary embodiment, the sensor data can be a temperature of a dielectric fluid in the bath region or the sump region. In one exemplary embodiment, the management system can be configured to direct the actuator to move the adjustable weir wall asymmetrically.

[0009] In the disclosed embodiments of the invention described below, single-phase immersion cooling using oil, such as mineral oil, is described. Advantageously, in one embodiment, the present application relates to a cooling system for computing components, including a container having a bottom. The container includes a central reservoir including a heat exchanger for cooling a dielectric fluid. The container also includes a first tank configured to hold one or more computer components at least partially immersed in the dielectric fluid, the first tank being on one side of the central reservoir. The container includes a second tank configured to hold one or more computer components at least partially immersed in the dielectric fluid. The second tank is on the other side of the central reservoir, opposite the first tank. The vessel includes a perforated plate elevated from a bottom of the vessel to form a volume between the bottom of the vessel and the perforated plate, the volume including: (1) a first volume below the central reservoir, (2) a second volume below the first tank, and (3) a third volume below the second tank. The vessel is configured to allow a dielectric fluid to be circulated from the first volume below the central reservoir to each of the second and third volumes, from the second volume to the first tank, from the third volume to the second tank, from the first tank to the central reservoir, from the second tank to the central reservoir, and from the central reservoir to the first volume below the central reservoir while one or more computer components are operating, which is advantageous for providing efficient and effective cooling of the computer components.

[0010] In another embodiment, the present application relates to a multi-function handle for a computing device. The unique multi-function handle is advantageous because it allows for handling of the computing device without contacting fluids, provides cable management, acts as a heat sink, and acts as a device identifier.

[0011] These and other objects, features and advantages of the exemplary embodiments of the present disclosure will become apparent from a reading of the following detailed description of the exemplary embodiments of the present disclosure, taken in conjunction with the appended claims.

[0012] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claims. [Brief description of the drawings]

[0013] To illustrate how the above-mentioned and other advantages and features can be obtained, a more particular description of the subject matter briefly described above will be rendered by reference to specific embodiments illustrated in the accompanying drawings, in which the embodiments will be described and explained with additional specificity and detail, with the understanding that these drawings depict only exemplary embodiments and are therefore not to be considered limiting in scope. [Figure 1] FIG. 1 illustrates an immersion cooling system according to an example embodiment of the present disclosure. [Diagram 2] FIG. 2 illustrates another immersion cooling system according to an example embodiment of the present disclosure. [Diagram 3] FIG. 3 illustrates a top view of an immersion cooling system according to an example embodiment of the present disclosure. [Figure 4A] FIG. 4A illustrates a top view of another immersion cooling system according to an example embodiment of the present disclosure. [Figure 4B] FIG. 4B illustrates a side view of an immersion cooling system according to an example embodiment of the present disclosure. [Figure 5A] FIG. 5A illustrates yet another immersion cooling system according to an example embodiment of the present disclosure. [Figure 5B] FIG. 5B illustrates yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5C] FIG. 5C illustrates yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5D] FIG. 5D illustrates yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5E] FIG. 5E illustrates yet another immersion cooling system according to an example embodiment of the present disclosure. [Figure 5F] FIG. 5F illustrates yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5G] FIG. 5G illustrates yet another immersion cooling system according to an example embodiment of the present disclosure. [Figure 5H] FIG. 5H illustrates yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5I] FIG. 5I illustrates yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5J] FIG. 5J illustrates yet another immersion cooling system in accordance with an exemplary embodiment of the present disclosure. [Figure 5K] FIG. 5K illustrates yet another immersion cooling system according to an example embodiment of the present disclosure. [Figure 5L] FIG. 5L illustrates yet another immersion cooling system according to an example embodiment of the present disclosure. [Figure 5M] FIG. 5M illustrates yet another immersion cooling system according to an example embodiment of the present disclosure. [Figure 5N] FIG. 5N illustrates yet another immersion cooling system according to an example embodiment of the present disclosure. [Figure 6A] FIG. 6A illustrates yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 6B] FIG. 6B illustrates yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 6C] FIG. 6C illustrates yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 6D] FIG. 6D illustrates yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 6E] FIG. 6E illustrates yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 6F]FIG. 6F illustrates yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 7] FIG. 7 shows a typical single-phase immersion cooling tank with a heat exchanger and weir channels. [Figure 8] FIG. 8 shows the fluid flow in the weir channel in a typical single-phase immersion cooling tank. [Figure 9] FIG. 9 shows the flow patterns for mixing at the bottom of a typical single-phase immersion cooling tank in the area below where the servers are located. [Figure 10] FIG. 10 illustrates a representative native handle configured to be bolted to an OEM fan, for example. [Figure 11] FIG. 11 shows a representative native handle bolted to a computing device at the location of the OEM fan. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] To illustrate various features of the present invention, exemplary embodiments of the present invention will now be described. The embodiments described herein are not intended to limit the scope of the invention, but rather to provide examples of the components, applications and operation of the present invention.

[0015] Immersion Cooling System In one exemplary embodiment, the immersion cooling system or vessel can include a bath area, a sump area, an adjustable weir (e.g., between the bath area and the sump area), a computing device, a robot, a pressure control system, and a management system. The vessel can be a pressure controlled tank maintained at atmospheric pressure (or within its range) that can be cooled using a heat exchanger. The computing device can be immersed in a dielectric fluid in the bath area of ​​the vessel. The computing device can be connected to a network and can perform various processing and computing tasks while immersed in the dielectric fluid (or fluids). The vessel can include a lid for accessing the bath area, the computing device, and the sump area. The vessel can be fluidly connected to the pressure control system. The robot can lift the computing device from the bath area of ​​the vessel when the lid is open. The robot can place the lifted computing device in a magazine or on a vehicle provided to house the computing device. The robot can also lift the computing device from the magazine (or vehicle) and place it in the location of the computing device lifted from the bath area. The robot can be attached to the vessel, the vehicle, or another location. In this exemplary embodiment, the vessel can be a two-phase cooling system. In other exemplary embodiments, the vessel may be a single phase cooling system that may or may not have one or more of the components described above.

[0016] In one exemplary embodiment, the pump can circulate the fluid within the vessel. For example, the pump can draw the dielectric fluid from the sump region and transfer the fluid to the bath region. The fluid can then flow over the adjustable weir and back to the sump region. In one exemplary embodiment, the height of the adjustable weir can be changed, for example, using instructions provided by the actuator and / or management system. In one exemplary embodiment, the depth of the dielectric fluid (or fluids) can be changed, for example, as a result of removing or adding a computing device from or to the bath region. The depth of the dielectric fluid can also be changed, for example, when a different computing component is used within the bath region. In this exemplary embodiment, it can be beneficial to adjust the height of the adjustable weir, for example, to adjust the flow of the dielectric fluid and / or the depth of the dielectric fluid within the bath region.

[0017] For example, in one exemplary embodiment, it may be desirable to have less fluid in the bath region. In this example, an adjustable weir may be lowered to reduce the depth of the dielectric fluid. As another example, an arrangement of a group of computing devices performing a particular task may generate more heat compared to the average operation of the vessel. In this example, it may be desirable to have more fluid in the tank to compensate for rapid evaporation of the fluid. In this example, the height of the adjustable weir may be raised.

[0018] In one example, the management system can be configured with or without software and can be configured to receive any data generated by any of the sensors included in the immersion cooling system. In one example, the management system can make adjustments, issue alerts, and / or take other appropriate action, for example, based on the sensor readings. For example, the management system can adjust or control adjustable weirs, heating elements, adjust fluid flow or temperature, adjust pressure, adjust fluid levels, fluid purity, and / or any number of other system parameters. Such adjustments are often based on one or more sensed parameters of the immersion cooling system. The sensed parameters can include, for example, temperature (inside or outside the vessel), pressure, fluid level (in the bath or sump area), or power consumption of the system.

[0019] FIG. 1 illustrates an immersion cooling system 100 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the immersion cooling system 100 can include a vessel 105 and a vehicle 130. The vessel 105 can include a tank 119 including a bath area 111, a sump area 112, an adjustable weir 140, a fluid 113, a computer component 114, a pump 115, a filter 118, a door 116, a management system 117, a heat exchanger 110, and a passage plate 120. The computer component 114 can be submerged in the fluid 113. The vehicle 130 can include a robot 131. The robot 131 can lift the computer component 114 when the door 116 is open and place the computer component 114 on the vehicle 130. The adjustable weir 140 can move up and down according to instructions provided by the management system 117, for example, using an actuator. For example, based on sensor readings of fluid level in the bath region 111, the management system 117 can direct the adjustable weir 140 to move up or down to facilitate fluid transfer from the bath region 111 to the sump region 112.

[0020] In one exemplary embodiment, the immersion cooling system can be a single-phase immersion cooling system. For example, the immersion cooling system can include a tank that holds a volume of dielectric fluid. The tank can also be configured to hold a computer component. A pump can draw the dielectric fluid from a sump region and transfer it to the tank. In this exemplary embodiment, the pump can cause the fluid to flow over an adjustable weir into the sump region.

[0021] 2 illustrates an immersion cooling system 200 according to an example embodiment of the present disclosure. In this example embodiment, the immersion cooling system 200 may include a tank 210 including a bath region 211, a sump region 212, an adjustable weir 240, a fluid 213, a computer component 214, a pump 215, a heat exchanger 219, a door 216, and a management system 217. The computer component 214 may be submerged in the fluid 213. The adjustable weir 240 may move up and down with instructions provided by the management system 217, for example, using an actuator 241. For example, based on a sensor reading of the fluid level in the bath region 211, the management system 217 may instruct the adjustable weir 240 to move up and down to facilitate the transfer of the fluid 213 from the bath region 211 to the sump region 212. In this example embodiment, the tank 210 may not be pressure controlled, although in some other example embodiments, the tank may be pressure controlled. In this example embodiment, the door 216 can be removed and the computer component 214 can be lifted out of (or returned to) the tank. The management system 217 can adjust the height of the adjustable weir 240 to maintain the level of the fluid 213 in the tank 210.

[0022] 3 illustrates a top view of an immersion cooling system 200 according to an example embodiment of the present disclosure. In this example embodiment, a sump region 212 is adjacent to a bath region 211, and an adjustable weir 240 is between the bath region 211 and the sump region 212.

[0023] FIG. 4A shows a top view of the immersion cooling system 400 according to an example embodiment of the present disclosure. In this example embodiment, the adjustable weir 440 is a channel in the center of the bath area 411. The adjustable weir 440 or the channel can move up and down to facilitate transferring the fluid out of the tank 410. FIG. 4B shows a side view of the immersion cooling system 400 according to an example embodiment of the present disclosure. In this example embodiment, the adjustable weir 440 is connected to the pump 415, for example, via a flexible pipe. The adjustable weir 440 can move up and down to achieve the proper level with the fluid 413.

[0024] In one exemplary embodiment, the adjustable weir can be coupled to a motor or actuator that can facilitate movement of the weir, hi another exemplary embodiment, the weir can be removably secured to the body or tank of the bath area, for example with a screw, and can be moved up or down, for example by removing the screw to adjust the height of the weir.

[0025] In one exemplary embodiment, the management system can include a module for estimating an appropriate position for the weir. For example, the module can receive sensor data, such as the fluid level in the bath or sump area, the temperature of the fluid or computing components, the outside air temperature, the fluid viscosity, or other sensor data, and can determine an appropriate height of the fluid in the bath area based on the sensor data. The management system can then instruct a motor or actuator to adjust the height of the weir accordingly. For example, if the fluid level falls below an acceptable level due to removal of one or more computing components, the management system can instruct the actuator to lower an adjustable weir. On the other hand, if the fluid level in the sump area increases due to the addition of a computing component, the management system can move the weir higher to allow the bath area to hold the additional fluid.

[0026] In one exemplary implementation, the actuator can move the weir asymmetrically (e.g., move one side more or less than the other side). Asymmetric movement of the weir can, for example, tilt the weir. Asymmetric movement of the weir can promote asymmetric fluid movement out of the bath region. For example, if one side of the weir is lower than the other side, more fluid from the lower side can move out of the bath region. Asymmetric movement of the weir can be beneficial, for example, when one side of the tank is warmer than the other side, such that it may be desirable for fluid to move from the warmer or cooler side to the other side more quickly.

[0027] 5A-5L show an immersion cooling system 500 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the immersion cooling system 500 may include a tank 510, a bath region 511, a sump region 512, a pump 515, a heat exchanger 519, and a computer component 514. A distribution channel may be provided at the bottom of the bath region 511 to allow the dielectric fluid to be distributed to the bath region 511. For example, the pump 515 may draw fluid from the sump region and distribute it through a distribution channel 550 in the bath region 511. A grate may be provided above the distribution channel 550. The computer component 514 may be positioned above the grate 560 using, for example, a rack system. In this exemplary embodiment, the sump region 512 may be above the pump 515 and the heat exchanger 519. The heat exchanger may receive the heated dielectric fluid from the tank and cool the dielectric fluid using another fluid, for example, water. The heat exchanger may receive cooling water and discharge heated water. The discharged heated water can be cooled in another facility or location. An adjustable weir 540 can be between the bath region 511 and the sump region 512. In this example, the adjustable weir can be moved up and down (or even moved up and down asymmetrically) to facilitate the transfer of fluid from the bath region 511 to the sump region 512.

[0028] Figures 5M and 5N show an example adjustable weir that can be removably attached to the wall between the bath area and the sump area. In this example, adjustable weir 551 is secured to wall 555 between bath area 511 and sump area 512 with screws 558. In Figure 5N, weir 552 has been moved below weir 551. In this example, the dielectric fluid can exit bath area 511 from the left side of the bath area.

[0029] 6A-6F show an immersion cooling system 600 according to an example embodiment of the present disclosure. In this example embodiment, the immersion cooling system 600 can include a container 605, a tank 610, a bath area 611, a sump area 612, a pump 615, a heat exchanger 619, and a computer component 614. At the bottom of the bath area 611, there can be a distribution system that allows fluid to be distributed to the bath area 611. Above the distribution system 650, there can be a grate 660. In this example embodiment, there can also be an adjustable weir wall 640 between the bath area 611 and the sump area 612. In this example embodiment, the adjustable weir wall 640 can be removably secured (e.g., with a screw) to the wall between the bath area 611 and the sump area 612. The screw can be removed and the adjustable weir wall can be moved up or down so that a desired amount of fluid is pumped out of the bath area 611.

[0030] Single-phase system and method In one embodiment, the present application relates to a single-phase submerged system that may include a vessel configured to contain a thermally conductive dielectric fluid, such as mineral oil, in a liquid phase. A rack may be configured to hold one or more computer components such that the one or more computer components are at least partially submerged in the liquid of the dielectric fluid. A heat exchanger may be used for cooling.

[0031] In another embodiment of single-phase immersion, the system has two separate tanks for server placement with a central reservoir. Weir channels surrounding each tank force the fluids to collect in the central reservoir. The fluids collect in the central reservoir and are pumped to two side heat exchangers, one side for the fluids and the other for the house cooling water. The house water and plate exchangers work together to remove heat from the fluids. From the heat exchangers, the fluids are forced to the bottom of each tank, mixed in the area below the servers, and forced from the bottom of each tank to the top of the tank, resulting in the weir channels.

[0032] 7 and 8 show a representative single-phase immersion cooling tank including a heat exchanger and multiple weirs. As shown in Figs. 7-8, there are two separate tanks for server placement with a central reservoir. Weir channels surrounding each tank force fluid to collect in the central reservoir. Fluid is collected in the central reservoir and pumped to two side heat exchangers, one side for the fluid and the other for the house cooling water. The house water and plate exchangers work together to remove heat from the fluid. From the heat exchangers, the fluid is forced to the bottom of each tank as shown in Fig. 9 and mixed in the area below the servers. From the area below the servers, the fluid flows from the bottom of each tank to the top of the tank and consequently into the weir channels.

[0033] In this configuration, the perforated plate is elevated from the bottom of the container, forming a volume between the bottom of the container and the perforated plate. The volume includes (1) a first volume below the central reservoir, (2) a second volume below the first tank, and (3) a third volume below the second tank. The container is configured such that while one or more computer components are operating, the dielectric fluid is circulated from the first volume below the central reservoir to the second volume and the third volume, respectively, from the second volume to the first tank and the third volume to the second tank, from the first tank to the central reservoir and from the second tank to the central reservoir, and from the central reservoir to the first volume below the central reservoir. Because the pump is typically located in the center, the upward flow rate through the perforated plate is not uniform and decreases with distance from the pump. Pumping the fluid non-uniformly through the multiple holes advantageously promotes cooling efficiency.

[0034] The vessel can be configured such that while one or more computer components are operating, the dielectric fluid is circulated from the first volume below the central reservoir to each of the second and third volumes, from the second volume to the first tank, from the third volume to the second tank, from the first tank to the central reservoir, from the second tank to the central reservoir, and from the central reservoir to the first volume below the central reservoir. Such flow patterns are shown in Figures 8 and 9.

[0035] In some embodiments, a multi-function handle is used in conjunction with the computing device to be cooled. The handle is advantageous because it allows for handling of the computing device without contacting the fluid, provides cable management, acts as a heat sink, and / or acts as a device identifier.

[0036] Multi-function handle for computing devices FIG. 10 illustrates an exemplary native handle configured to be bolted to an OEM fan location, for example. FIG. 11 illustrates an exemplary native handle bolted to a computing device at an OEM fan location. Such a handle may be useful in single or dual phase immersion cooling systems used, for example, in cryptocurrency mining or cooling servers. By configuring the handle to be bolted to an OEM fan location, for example, by a bolt or screw, the handle can be advantageously secured without drilling or the time required to create a new mounting point.

[0037] The handle generally includes a bar or other gripping mechanism with opposing brackets configured to be attached to the computing device to be cooled. The height of the handle from the attachment point to the bar or other mechanism for gripping can vary depending on the application. Generally, the height is sufficient so that the user does not have to come into contact with the immersion fluid to remove the device. In some embodiments, the handle can be made to be adjustable in height, for example, by adding additional brackets and / or having a telescoping assembly with a locking mechanism.

[0038] In some embodiments, the side mounting bracket may have one or more openings to facilitate the flow of dielectric fluid and enhance cooling. Such openings may vary in size and shape depending on the application. As shown in Figures 10 and 11, the openings are slits, but multiple other shapes may be used. Slits or other openings may also be used for cable management within the immersion tank. That is, system power and / or network cables may be secured to the handle using ties, wires, Velcro® or other suitable fasteners that extend through the openings and around the cables.

[0039] The handle may also be used as a heat sink to aid in cooling the computing device: heat from the dielectric fluid may be transferred via conduction to the side mounting brackets, then to the bar or other gripping device, and then to the air to which the bar or other gripping device is exposed.

[0040] The bar or other gripping device and the mounting bracket may be constructed of the same or different materials, which may vary depending on the application. Suitable materials include metals, such as, for example, aluminum, copper, steel, and mixtures thereof.

[0041] Portions of the handle not exposed to the fluid, such as a bar or other gripping device, may include etchings, stickers, or other identifying features to identify the computing device to which it is attached. In this way, adhesive stickers or other materials cannot contaminate the dielectric fluid.

[0042] Embodiment 1. A cooling system for a computing component, comprising: A container having a bottom, the container comprising: a central reservoir including a heat exchanger for cooling the dielectric fluid; a first tank configured to hold one or more computer components at least partially immersed in a dielectric fluid, the first tank being on one side of the central reservoir; a second tank configured to hold one or more computer components at least partially immersed in a dielectric fluid, the second tank on another side of the central reservoir opposite the first tank; a perforated plate elevated from a bottom of the vessel to define volumes between the bottom of the vessel and the perforated plate, the volumes including: (1) a first volume below the central reservoir; (2) a second volume below the first tank; and (3) a third volume below the second tank; A container, Including, the container is configured to circulate the dielectric fluid from the first volume below the central reservoir to each of the second volume and the third volume, from the second volume to the first tank, from the third volume to the second tank, from the first tank to the central reservoir, from the second tank to the central reservoir, and from the central reservoir to the first volume below the central reservoir while the one or more computer components are operating.

[0043] 2. The cooling system of embodiment 1, wherein the vessel includes a weir channel for circulating the dielectric fluid.

[0044] 3. The cooling system of embodiment 1, further comprising a rack for the one or more computer components.

[0045] 4. The cooling system of embodiment 1, wherein the rack includes a handle configured to remove the rack from the system without handling a dielectric fluid.

[0046] 5. The cooling system of embodiment 1, wherein the rack includes a handle configured as a heat sink to remove heat from the system.

[0047] 6. The cooling system of embodiment 1, wherein the rack includes a handle configured to assist in managing one or more cables within the system.

[0048] In the foregoing specification, various embodiments have been described with reference to the accompanying drawings. It will be apparent, however, that various modifications and changes may be made and additional embodiments may be implemented without departing from the broader scope of the invention as set forth in the following claims. The specification and drawings are therefore to be regarded in an illustrative rather than a restrictive sense.

Claims

1. a vessel configured to hold a thermally conductive dielectric fluid; a computer component configured to be at least partially immersed within the dielectric fluid; a fluid circulation system configured to draw the dielectric fluid from a sump region of the vessel, pass the dielectric fluid through a filter, and supply the dielectric fluid to a bath region of the vessel; A system comprising: The system includes an adjustable weir between the bath region and the sump region.

2. The system of claim 1 , wherein the adjustable weir is removably secured to a wall between the bath area and the sump area.

3. 10. The system of claim 1, wherein the adjustable weir is secured to a wall between the bath area and the sump area with screws.

4. The system of claim 1 further comprising an actuator for moving the adjustable weir.

5. The system of claim 4 further comprising a management system that receives sensor data and directs the actuator to move the adjustable weir.

6. The system of claim 5 , wherein the sensor data is a fluid level in the bath or sump region.

7. The system of claim 5 , wherein the sensor data is a temperature of the dielectric fluid in the bath region or the sump region.

8. The system of claim 5 , wherein the management system is configured to direct the actuator to move the adjustable dam wall asymmetrically.

9. 1. A cooling system for a computing component, comprising: A container having a bottom, the container comprising: a central reservoir including a heat exchanger for cooling the dielectric fluid; a first tank configured to hold one or more computer components at least partially immersed in a dielectric fluid, the first tank being on one side of the central reservoir; a second tank configured to hold one or more computer components at least partially immersed in a dielectric fluid, the second tank on another side of the central reservoir opposite the first tank; a perforated plate elevated from a bottom of the container to define volumes between the bottom of the container and the perforated plate, the volumes including: (1) a first volume below the central reservoir; (2) a second volume below the first tank; and (3) a third volume below the second tank; A container, Including, the container is configured to circulate the dielectric fluid from the first volume below the central reservoir to each of the second volume and the third volume, from the second volume to the first tank, from the third volume to the second tank, from the first tank to the central reservoir, from the second tank to the central reservoir, and from the central reservoir to the first volume below the central reservoir while the one or more computer components are operating.

10. The cooling system of claim 9 , wherein the vessel includes a weir channel through which the dielectric fluid circulates.

11. The cooling system of claim 9 , further comprising a rack for the one or more computer components.

12. The cooling system of claim 11 , wherein the rack includes a handle configured for removing the rack from the system without handling a dielectric fluid.

13. The cooling system of claim 11 , wherein the rack includes a handle configured as a heat sink to remove heat from the system.

14. The cooling system of claim 11 , wherein the rack includes a handle configured to aid in management of one or more cables in the system.

15. 1. A handle suitable for use with a single-phase or dual-phase immersion computing device, comprising: Bar and one or more mounting brackets configured to be attached to a computing device to be immersed in a dielectric fluid; The handle containing the

16. The handle of claim 15 , wherein the one or more mounting brackets include a plurality of openings configured to facilitate the flow of a dielectric fluid.

17. The handle of claim 15 , wherein the bar and the one or more mounting brackets are configured as a heat sink to remove heat from the system.

18. The handle of claim 15 , wherein the one or more mounting brackets are configured to aid in management of one or more cables in the system.

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