Leak detection for gas stick leaks

By using fluid path and pressure measurement technology during semiconductor chip processing, gas leakage is detected in real time, and the problem of leakage problems in the existing technology can only be discovered when significant is solved, fast and accurate leakage detection is achieved, and production efficiency and equipment reliability are improved.

JP2025512810APending Publication Date: 2025-04-22APPLIED MATERIALS INC
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Patent Information

Application Number
JP2024556663
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-03-27
Filing Date
2023-03-30
Publication Date
2025-04-22

AI Technical Summary

Technical Problem

The prior art lacks a method to detect gas leakage in real time during semiconductor chip processing, which causes leakage problems to be discovered only when the leakage is significant, affecting production efficiency and equipment life.

Method used

By using the characteristics of the fluid path in the gas leakage detection system, the valves in the gas leakage detection system are closed and opened, and the pump is used to press the gas leakage detection system to a specific pressure, and the pressure data is measured and analyzed to determine the presence of gas leakage.

Benefits of technology

It realizes real-time and rapid detection of gas leakage during semiconductor chip processing, reduces equipment maintenance time, avoids unnecessary downtime and replacement, and improves production efficiency and equipment reliability.

✦ Generated by Eureka AI based on patent content.

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Abstract

A method and system for monitoring and detecting gas leaks in a gas stick assembly is provided that includes measuring pressure at a mass flow controller of the gas stick assembly at different times and determining whether there is a difference in the pressure at the different times that exceeds a difference threshold.
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Description

[Technical field]

[0001] The present disclosure relates generally to methods and hardware for monitoring gas leaks. In particular, the present disclosure relates to methods and hardware for rapid in-situ detection of gas leaks during and / or between processing of semiconductor substrates. [Background technology]

[0002] Semiconductor substrates are typically processed in processing systems. These systems include one or more processing chambers, each performing a substrate processing operation, such as etching, chemical vapor deposition, or physical vapor deposition, which may include temperature and pressure cycling, and the introduction of various chemical components to the chamber. Some processing chambers also include a gas panel for performing the substrate processing operation. Processing chambers undergo regular maintenance, and the health of such processing chambers is regularly monitored.

[0003] A gas panel in a processing chamber may carry various gases throughout the processing chamber. These gases include both toxic and non-toxic gases. It is not uncommon for gas leaks to occur in the gas panel (e.g., in a gas stick assembly), which causes problems in the gas panel. When there is a gas leak in the gas panel, the gas panel most likely needs to be repaired or replaced, which slows down the production of semiconductor substrates. Alternatively, if hydrobromide is the gas that leaks in the gas panel, it will react with moisture in the atmosphere inside the gas panel to form hydrobromic acid, which can then attack the material of the gas panel (e.g., stainless steel, etc.).

[0004] Currently, there is no in situ method for detecting such leaks in a gas panel. Instead, once a gas panel is installed, the typical inspection process to check if a gas leak is occurring in the gas stick or gas panel is by visual inspection of the gas panel. During visual inspection, a user checks to see if there is corrosion in the gas panel or on the gas stick. Such inspection techniques do not catch gas leaks until the leak is ongoing and / or excessive. Summary of the Invention

[0005] Some embodiments described herein are directed to methods for detecting gas leaks in a gas panel and / or gas stick assembly (also referred to simply as a gas stick) of a processing chamber.

[0006] In some embodiments of the present disclosure, a method for monitoring gas leaks in a gas stick assembly is provided. The method may include closing a first valve of the gas stick assembly downstream of a mass flow controller (MFC) or pressure sensor in a flow path of the gas stick assembly, opening one or more additional valves of the gas stick assembly upstream of the MFC or pressure sensor for a first time period until the gas stick assembly is pressurized with gas, closing a second valve of the one or more valves, where at least a portion of the gas stick assembly between the first valve and the second valve is pressurized after closing the second valve, measuring a pressure in at least a portion of the gas stick assembly by a pressure sensor of the MFC or other pressure sensor in the flow path to collect pressure data for a second time period, and analyzing the pressure data to determine whether at least a portion of the gas stick assembly has a leak.

[0007] In some embodiments of the present disclosure, a method for monitoring gas leaks in a gas stick assembly is provided, which may include closing a first valve of the gas stick assembly upstream of a mass flow controller (MFC) or other pressure sensor in a flow path of the gas stick assembly, opening a second valve of the one or more valves of the gas stick assembly downstream of the MFC or other pressure sensor, connecting an output end of the gas stick assembly to a pump, pumping the gas stick assembly to a first pressure, closing a second valve of the one or more valves of the gas stick assembly, where at least a portion of the gas stick assembly between the first valve and the second valve is under vacuum after closing the second valve, measuring a pressure in at least a portion of the gas stick assembly by a pressure sensor of the MFC or other pressure sensor in the flow path to collect pressure data over a second time period, and analyzing the pressure data to determine whether at least a portion of the gas stick assembly has a leak.

[0008] In some embodiments of the present disclosure, a system is provided. The system includes a memory and a processing device operably coupled to the memory. The processing device causes a first valve of the gas stick assembly, which is on a first side of a mass flow controller (MFC) or other pressure sensor of the gas stick assembly, to close. The processing device further causes one or more additional valves of the gas stick assembly to remain open for a first period of time until the gas stick assembly reaches a target pressure. The processing device further causes a second valve of the one or more additional valves to close when the gas stick assembly reaches the target pressure, and at least a portion of the gas stick between the first valve and the second valve has the target pressure after closing the second valve. The processing device further receives pressure data about the pressure within at least a portion of the gas stick assembly from the pressure sensor of the MFC or other pressure sensor over a second period of time. The processing device analyzes the pressure data to determine whether at least a portion of the gas stick assembly has a leak.

[0009] The present invention is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals denote like elements. It should be noted that different references to "an" or "one" embodiment in this disclosure are not necessarily to the same embodiment, but such references mean at least one. [Brief description of the drawings]

[0010] [Figure 1] 1 is a cross-sectional view of a fabrication chamber according to some embodiments. [Diagram 2] FIG. 2 is a schematic diagram of a gas panel of a fabrication chamber according to one embodiment of the present disclosure. [Figure 3A] FIG. 1 is a schematic diagram of a gas stick assembly for use in a gas panel according to one embodiment of the present disclosure. [Figure 3B]FIG. 1 illustrates a gas stick assembly for use in a gas panel according to one embodiment of the present disclosure. [Figure 4] 1 is a flow chart of a method for detecting a gas leak according to one embodiment of the present disclosure. [Diagram 5] 4 is a flow chart of a method for detecting a gas leak according to another embodiment of the present disclosure. [Figure 6] 1 is a flow chart of a method for measuring pressure in a gas stick assembly according to one embodiment of the disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Methods and systems for monitoring / detecting gas leaks in a gas panel and / or gas stick assembly of a manufacturing chamber (also referred to as a process chamber) are described herein. In some embodiments, the present disclosure is directed to a method suitable for quickly detecting gas leaks in a gas stick assembly of a gas panel.

[0012] The methods and systems of the present disclosure provide active, in-situ, real-time feedback during and / or during the operation of a manufacturing process that can be used to quickly (e.g., within minutes) determine if a gas stick assembly in a gas panel has a leak. The methods and systems described herein reduce system maintenance time by providing early detection of gas leaks. Such early detection of gas leaks can prevent unnecessary early maintenance or replacement of parts and / or can trigger maintenance of parts. The methods and systems described herein are more cost-effective than older techniques and systems for detecting gas leaks, making them more viable and potentially utilized on multiple chambers.

[0013] The term "in situ" herein means "in situ" in that the processing chamber is intact and does not need to be disassembled or exposed to the atmosphere to perform the disclosed method(s). The in situ method(s) may be performed during the processing of a substrate, as well as during a step in a process performed in the process chamber (e.g., a step in an etch process, a deposition process, etc.).

[0014] In some embodiments, a system is described herein that includes a fabrication chamber (e.g., a semiconductor processing chamber). The fabrication chamber may include one or more inputs that allow gas to flow into the chamber and / or one or more outputs that allow gas to flow out of the chamber. In embodiments, one or more gas stick assemblies may be connected to the fabrication chamber, each of which may supply a different gas to the fabrication chamber. The system may include a controller or processing device that automatically implements the gas leak detection techniques described herein.

[0015] The disclosed method is advantageous over previous methods of leak detection on a processing chamber, gas panel, and / or gas stick assembly because the processing chamber, in embodiments, does not need to be shut down to perform leak detection. Indeed, in embodiments, the method for detecting / monitoring gas leaks can be performed during the ideal time while running a process on a processing chamber (e.g., to deposit and / or etch a layer on a substrate) without the need to pump out the gas inside the gas stick and / or without compromising the vacuum environment in the processing chamber. Another advantage of this method in embodiments is that each gas stick assembly can be checked simultaneously or in parallel. If there is a leak detected in any one or more of the gas stick assemblies, the leak on one or more specific gas stick assemblies can be identified by the present system. In contrast, conventional leak detection techniques cannot identify which gas stick assembly in a gas panel is leaking.

[0016] Aspects of the present disclosure provide technical advantages over conventional solutions. The present disclosure results in a more efficient substrate manufacturing process, and gas leaks may be prevented and / or detected early. If a gas leak is detected in a manufacturing chamber, material waste, exposure to toxic / non-toxic gases, wear of manufacturing chamber components, etc. may be prevented. Gas leaks may also be detected and indicate aging components. Thus, by detecting gas leaks earlier than could be conventionally achieved, unscheduled downtime may be reduced, costs associated with rush shipment of replacement parts may be avoided, etc.

[0017] FIG. 1 illustrates a cross-sectional view of a fabrication chamber 100 (e.g., a semiconductor processing chamber) according to some embodiments of the present disclosure. The fabrication chamber 100 may be one or more of an etch chamber (e.g., a plasma etch chamber), a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), an anneal chamber, and the like. For example, the fabrication chamber 100 may be a chamber for a plasma etcher, a plasma cleaning apparatus, an atomic layer deposition (ALD) device, a chemical vapor deposition (CVD) device, and the like. Examples of chamber components may include a substrate support assembly 104, an electrostatic chuck, a ring (e.g., a process kit ring), chamber walls, a base, a showerhead 106, a gas distribution plate, a liner, a liner kit, a shield, a plasma screen, a flow equalizer, a cooling base, a chamber viewport, a chamber lid, a nozzle, and the like.

[0018] In one embodiment, the fabrication chamber 100 may include a chamber body 108 and a showerhead 106 that enclose an interior volume 110. In some chambers, the showerhead 106 may be replaced with a lid and nozzle. The chamber body 108 may be constructed from aluminum, stainless steel, or other suitable materials. The chamber body 108 generally includes a sidewall 112 and a bottom 114.

[0019] An exhaust port 116 may be defined in the chamber body 108 and may couple the interior volume 110 to a pumping system 118. The pumping system 118 may include one or more pumps and valves utilized to evacuate and adjust the pressure of the interior volume 110 of the fabrication chamber 100. Actuators for controlling gas flow from and / or pressure in the chamber may be disposed at or near the exhaust port 116.

[0020] The showerhead 106 may be supported on a sidewall 112 of the chamber body 108 or on an upper portion of the chamber body. The showerhead 106 (or in some embodiments, a lid) may be opened to allow access to the interior volume 110 of the fabrication chamber 100 and may provide a seal to the fabrication chamber 100 when closed.

[0021] A gas panel 120 may be coupled to the fabrication chamber 100 to provide process gases or cleaning gases to the interior volume 110 through the showerhead 106 (or lid and nozzle). The gas panel 120 may be coupled to the fabrication chamber 100 to provide process gases and / or cleaning gases through one or more supply lines to the interior volume 110 through the showerhead 106. The gas panel 120 may include or be connected to one or more flow controllers. The flow controller(s) may be used to measure and control the flow of one or more gases from one or more gas sources to the interior volume 110. In one embodiment, the gas panel 120 includes multiple gas stick assemblies, as described in more detail below with reference to FIGS. 2-3B. Each gas stick assembly may include one or more valves, filters, mass flow controllers (MFCs), and / or other components, as described below.

[0022] The showerhead 106 may include multiple gas supply holes throughout. Examples of process gases that may be used to process substrates in the fabrication chamber 100 may include toxic gases, non-toxic gases, or combinations thereof. For example, process gases may include halogen-containing gases, such as C2F6, SF6, SiCl4, HBr, NF3, CF4, CHF3, F2, Cl2, CCl4, BCl3, and SiF4, among others, and other gases, such as O2 or N2O. Examples of carrier gases include N2, He, Ar, and other gases that are inert to the process gas (e.g., non-reactive gases).

[0023] The substrate support assembly 104 may be disposed in the interior volume 110 of the fabrication chamber 100 below the showerhead 106. In some embodiments, the substrate support assembly 104 includes a susceptor 122 and a shaft 124. The substrate support assembly 104 supports the substrate during processing. In some embodiments, one or more heaters 126 and a reflector 128 are also disposed within the fabrication chamber 100.

[0024] In some embodiments, the showerhead 106 is configured to create a plasma via RF discharge. Maximum power delivery depends on matching impedance between the RF source and the plasma. Impedance matching may be performed by a closed loop control system. Sensors measuring properties related to RF impedance matching (RF match) may be monitored. Impedance within the fabrication chamber 100 is highly correlated with chamber pressure. Monitored properties related to RF impedance matching (e.g., RF match voltage, RF match current, RF match capacitor position) may provide insight into the pressure inside the fabrication chamber.

[0025] 2 is a schematic diagram of a gas panel 200 that may be used in the fabrication chamber of FIG. 1. As explained above, the gas panel provides process and / or cleaning gases to the showerhead and / or to other components of the processing chamber. To effectively provide the process or cleaning gases, a gas stick assembly may be utilized. Gas Stick Assembly

[0026] The gas stick assemblies of the present disclosure may be used with toxic gases (e.g., as in gas stick assemblies 202a-g) or with inert or non-toxic gases (e.g., as in gas stick assemblies 203a-c). Each gas stick assembly 202a-g, 203a-c may be used to flow a different gas into a processing chamber in an embodiment. To provide gas flow through the gas panel 200, gas enters the panel through one end 201b of the panel. For example, if a cleaning gas is used, the cleaning gas may enter the gas stick assembly, the cleaning gas may flow through the appropriate gas stick assembly 202a-g, 203a-c, and then through the output end 201b into the processing chamber. A purge gas may enter through the gas panel 200 through the input end 201a, and the purge gas may proceed to the appropriate gas stick assembly 202a-g. The purge gas, which may be N2, may pass through purge valve 205 into the gas stick assemblies 202a-g to remove toxic gases before servicing the system.

[0027] A gas panel may include a single gas stick assembly 202a-g, multiple gas stick assemblies 202a-g, a single inert gas stick assembly 203a-c, and / or multiple inert gas stick assemblies 203a-c. For example, FIG. 2 shows seven gas stick assemblies 202a-g and three inert gas stick assemblies 203a-c. However, this is not intended to limit the amount or type of gas stick assemblies that may be included in the gas panel 200. In some embodiments, the gas panel 200 may include 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, or 20 gas stick assemblies 202a-g and 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, or 20 inert gas stick assemblies 203a-c. Additionally, the components of each gas stick assembly 202a-g and inert gas stick assembly 203a-c of FIG. 2 are not labeled herein for clarity, but it should be understood that each gas stick assembly 202a-g and inert gas stick assembly 203a-c may include the same or different components as described herein for some gas stick assemblies. Gas stick assembly 202a-g may include, in embodiments, hybrid valve 204, purge valve 205, regulator 206, filter or purifier 207, upstream valve 208, mass flow controller 209, and downstream valve 210. Hybrid valve 204 may allow gas to flow through the gas stick assembly when in an open position, or may keep gas from flowing through the gas stick assembly when in a closed position. Hybrid valve 204 may include a combination of manual valves and valves that may be automatically actuated (e.g., pneumatic valves, electric valves, etc.). Purge valve 205 may be used to purge the toxic gas out before it acts on the toxic gas stick assembly.The regulator 206 may be a pressure regulator that may control the pressure within the gas stick assemblies 202a-g, 203a-c. The filter or purifier 207 may reduce contaminants from entering. The upstream valve 208 may be in an open or closed position to allow gas to either leave the mass flow controller 209 or remain in the mass flow controller 209 depending on the process. The mass flow controller 209 may include a pressure sensor that provides pressure data for the gas stick assembly. The downstream valve 210 may be in an open or closed position to allow gas to either leave the mass flow controller 209 or remain in the mass flow controller 209 depending on the process. The inert gas stick assemblies 203a-c may include a manual valve 211, a regulator 206, a filter or purifier 207, an upstream valve 208, a mass flow controller 209, and a downstream valve 210 in an embodiment.

[0028] 3A-3B show a gas stick assembly 300 according to one embodiment of the present disclosure. The gas stick assembly 300 shows the gas stick assemblies 202a-g of FIG. 2. That is, the gas stick assembly 300 represents a gas stick assembly used to flow toxic gases. For gas stick assemblies in which non-toxic gases flow, the purge valve 302 may not be present. As seen in FIG. 3, the gas stick assembly 300 includes an input end 308 and an output end 309. Gas may flow through the gas stick assembly 300 from the input end 308 to the output end 309 as indicated by the arrows in FIG. 3. The gas flowing through the gas stick assembly may be a gas as described with respect to the gas stick assembly of FIG. 2. The gas stick assembly 300 may include a hybrid valve 301 upstream of a mass flow controller 306. The hybrid valve may include a combination of a manual valve and a valve that may be automatically actuated (e.g., a pneumatic valve, an electric valve, etc.).

[0029] If toxic gas is to travel through the gas stick assembly, a purge valve 302 may be included that may be used to purge the toxic gas out before acting on the toxic gas stick assembly. A regulator 303 is then included in the gas stick assembly 300. The regulator 303 may be a pressure regulator as known in the art. A filter 304 is also included upstream of the mass flow controller 306 in the gas stick assembly 300 to filter contaminants from the gas. An isolation valve 305 is included upstream of the mass flow controller 306, and an isolation valve 307 is downstream of the mass flow controller 306 in the gas stick assembly 300. The isolation valve 307 is on the output end 309 of the gas stick assembly 300. The mass flow controller 306 of the present disclosure includes a pressure sensor, a controller (e.g., a processing device), and / or a variable or proportional valve that can control the amount of gas flowing through the mass flow controller based on instructions from the MFC's controller. The MFC 306 is an instrument used to measure and control the flow rate of gas. The MFC 306 may be designed and calibrated for a particular type of gas in an embodiment. The MFC 306 of the gas stick assembly 300 may be connected to a computing device, a processing device, or an additional controller 330 (e.g., a controller for a processing device, for a tool cluster, etc.). The MFC 306 may generate pressure measurements and send the pressure measurements to the controller 330.

[0030] The controller 330 may process data from the MFC 306 to perform a leak check of the gas stick assembly 300. In an embodiment, the controller 330 may further be connected to one or more valves (e.g., hybrid valve 301, valve 302, valve 305 and / or valve 307) of the gas stick assembly 300. All such connections between the controller 330 and one or more components of the gas stick assembly 300 may be wired or wireless connections (e.g., connections via Wi-Fi, Bluetooth, Zigbee, or another wireless protocol). Through such connections, the controller 330 may cause one or more operations to be performed on the gas stick assembly 300 to achieve the leak test described in the embodiments herein. Thus, the controller 330 may measure and monitor the pressure of the mass flow controller 306 in either a pressurized or vacuum system, as described with respect to the flow charts of FIG. 4 and FIG. 5.

[0031] In alternative embodiments, a pressure gauge (not shown) may be included in the gas stick assembly 300. The pressure gauge may be included in the gas stick assembly in addition to or instead of the MFC 306. If a pressure gauge is included in the gas stick assembly, it may be included downstream of the regulator 303 and upstream of the filter 304. Furthermore, if a pressure gauge is included, the MFC may not include an internal pressure sensor. In some embodiments, the pressure gauge may be connected to a computing device, a processing device, or an additional controller 330 (e.g., a controller for a processing device, for a tool cluster, etc.). The pressure gauge may generate pressure measurements and send the pressure measurements to the controller 330 as described with respect to the MFC 306. The pressure gauge and the pressure sensor of the MFC may be in the flow path of the gas in the gas stick assembly 300.

[0032] Although embodiments are described herein with respect to an MFC that includes an internal pressure sensor, it should be understood that the embodiments described with respect to using an MFC to measure pressure within a gas stick assembly may instead use other pressure sensors that are not part of the MFC.

[0033] In some embodiments, the controller 330 includes a central processing unit (CPU), a microcontroller, a programmable logic controller (PLC), a system on a chip (SoC), a server computer, or other suitable type of computing device. The controller 330 may be configured to execute programming instructions related to one or more gas leak checks as described herein. The controller 330 may receive feedback signals from the MFC 306 and may calculate the pressure in at least a portion of the gas stick assembly multiple times during a gas leak check. In some embodiments, the controller 330 is configured to execute a gas leak check strategy, or one or more steps of a gas leak check strategy. Such a gas leak check strategy may be implemented in situ at the gas stick assembly before, after, or during execution of a process strategy on a product. For example, a gas leak check may be implemented as a step in a process strategy implemented on a product.

[0034] The portion of the gas stick assembly that a leak check is performed on may depend on which valve is actuated. For example, the area between valve 305 and valve 307 may be checked for leaks, the area between valve 302 and valve 307 may be checked for leaks, and / or the area between valve 301 and valve 307 may be checked for leaks (effectively checking the entire gas stick assembly for leaks). (If a leak is found, e.g., by pressurizing or creating a vacuum between valves 301 and 307, further leak checks may be performed on the area between valves 302 and 307 and / or between valves 305 and 307 to narrow down the source of the leak. For example, a first leak check may be performed between valves 301 and 307. If a leak is found, a further leak check may be performed on the area between valves 305 and 307. If the second leak check indicates a leak, the leak will be from the area between valves 305 and 307, but if the second leak check does not indicate a leak, the leak detected by the first leak check will be between valves 301 and 305.)

[0035] FIG. 4 illustrates a flow chart of a method 400 for detecting a gas leak in a gas stick assembly according to one embodiment of the present disclosure. The gas stick assembly may include a first end with an input configured to receive gas from a gas source, a second end with an output configured to deliver the gas to a destination (e.g., to a processing chamber), and a number of components between the first end and the second end, including at least two valves and a mass flow controller (MFC). The method 400 of FIG. 4 describes monitoring and / or detecting a gas leak under a pressurized condition 400. FIG. 4 is illustrated generally, and an exemplary embodiment is described using the gas stick assembly of FIGS. 3A-3B. The method of FIG. 4 may be performed in situ in a processing chamber. In an embodiment, operations of the method 400 are performed by one or more components associated with the process chamber (e.g., by a controller for the process chamber) and / or by an external controller or processing device.

[0036] At block 402 of the method 400, a first valve of the gas stick assembly downstream of a mass flow controller (MFC) is closed. For example, the controller may cause the valve to be actuated to close the valve. This valve may be the last valve of the gas stick assembly. Then, at block 404, one or more additional valves upstream of the MFC are opened for a first period of time until the gas stick assembly is pressurized. For example, the controller may cause the one or more additional valves to be actuated to open. While the one or more additional valves are open, gas may be flowed into the gas stick assembly, which may increase the pressure in the gas stick assembly since the downstream valve is closed. For example, the controller may cause a gas source to flow gas into the gas stick assembly. The pressure of the gas stick assembly may be about 30 psia to about 50 psia, or about 35 psia, about 40 psia, or about 45 psia, or any value therein. The first time period may be about 5 seconds to about 60 seconds, or about 10 seconds, about 15 seconds, about 20 seconds, about 25 seconds, about 30 seconds, about 35 seconds, about 40 seconds, about 45 seconds, about 50 seconds, or about 60 seconds, or any value therein. Once the gas stick assembly is pressurized, a second valve of the one or more additional valves is closed at 406. For example, the controller may cause the second valve to be actuated and closed. In an embodiment, the second valve is the first valve of the gas stick assembly (upstream of the MFC). One or more valves and / or other components may be attached to the gas stick assembly between the second valve and the MFC.

[0037] Then, in block 408, the pressure of at least a portion of the gas stick assembly is measured using a pressure sensor in the MFC over a second time period. In an embodiment, the MFC generates pressure measurements over the second time period and periodically or continuously sends the pressure measurements to the controller. The second time period may be about 5 seconds to about 60 seconds, or about 10 seconds, about 15 seconds, about 20 seconds, about 25 seconds, about 30 seconds, about 35 seconds, about 40 seconds, about 45 seconds, about 50 seconds, or about 60 seconds, or any value therein. Then, in block 410, the pressure data is analyzed by processing logic (e.g., by the controller) to determine if the portion of the gas stick assembly has a leak. The pressure data may be analyzed using a processing device of the controller to compare pressure data received over the time period.

[0038] In an embodiment, the processing logic determines whether there is a leak by at least comparing a second pressure generated later in the second time period (e.g., at the end of the second time period) to a first pressure generated earlier in the second time period (e.g., at the beginning of the second time period). Based on that comparison, the processing logic determines whether there is a difference between the two (or more) pressure measurements (e.g., whether the second pressure is lower than the first pressure by at least a threshold amount). If there is a detected difference, the processing logic determines whether at least a portion of the gas stick assembly has a leak based on whether the detected pressure difference exceeds a pressure difference threshold. If the pressure difference exceeds the pressure difference threshold, a leak is detected. If there is no pressure difference or the pressure difference does not exceed the pressure difference threshold, a leak is not detected. In an embodiment, the pressure difference threshold is between about 5 psi and about 15 psi. Other pressure difference thresholds may also be used.

[0039] In some embodiments, pressure may be plotted from multiple pressure measurements over time to determine one or more characteristics of the leak, such as the extent of the leak. If a leak is detected, a signal may be sent to the system to alert the user. If there is a leak, the user can shut down the process chamber or divert the gas flow to an alternative gas stick assembly. If no leak is detected, the process chamber can continue to operate without dispensing.

[0040] As an example, the gas stick assembly of FIG. 3 may be monitored according to method 400 as follows. In a first step, the isolation valve 307 of the gas stick assembly 300 is closed. The hybrid valve 301, the purge valve 302, the isolation valve 305, or a combination thereof, may be opened as described above until the gas stick assembly is pressurized. Once pressurized, the hybrid valve 301, the valve 302, or the isolation valve 305 are closed. The pressure at the mass flow controller 306 is then measured for a period of time, and this pressure data is collected in a processing device. The pressure data is then analyzed to determine whether the gas stick assembly (or a portion thereof) has a leak (e.g., whether a pressure drop is observed over time).

[0041] FIG. 5 shows a flow chart of a method 500 for detecting gas leaks in a gas stick assembly according to another embodiment of the present disclosure. The method of FIG. 5 describes monitoring and / or detecting gas leaks under vacuum conditions. In a first block 502, a first valve of the gas stick assembly, upstream of a mass flow controller (MFC) of the gas stick assembly, is closed. Then, in block 504, a second valve, downstream of the MFC, is opened. The output end of the gas stick assembly can then be connected to a pump 506. Alternatively, the output end may already be connected to a vacuum system (e.g., to a processing chamber that remains under vacuum) where the vacuum is maintained by the pump. The gas stick assembly is then pumped to a first pressure, which in some embodiments is less than about 6 psia, such that the MFC is under vacuum conditions 508. Once vacuum conditions are reached, the second valve of the gas stick assembly is closed, such that after closing, at least a portion of the gas stick assembly between the first and second valves is under vacuum 510. The second valve may be a valve downstream of the MFC. Thus, the gas stick assembly between the first and second valves will be under vacuum (at least initially). Then, in block 512, pressure is measured using a pressure sensor in the MFC over a period of time. The period of time may be about 5 seconds to about 60 seconds, or about 10 seconds, about 15 seconds, about 20 seconds, about 25 seconds, about 30 seconds, about 35 seconds, about 40 seconds, about 45 seconds, about 50 seconds, or about 60 seconds, or any value therein. Then, in block 514, the pressure data is analyzed to determine if a portion of the gas stick assembly has a leak. The pressure data may be analyzed using a processing device (e.g., a controller) to compare the data.

[0042] In an embodiment, the processing logic determines whether there is a leak by at least comparing a second pressure generated later in the second time period (e.g., at the end of the second time period) to a first pressure generated earlier in the second time period (e.g., at the beginning of the second time period). Based on that comparison, the processing logic determines whether there is a difference between the two (or more) pressure measurements (e.g., whether the second pressure is greater than the first pressure by at least a threshold amount). If there is a detected difference, the processing logic determines whether at least a portion of the gas stick assembly has a leak based on whether the detected pressure difference exceeds a pressure difference threshold. If the pressure difference exceeds the pressure difference threshold, a leak is detected. If there is no pressure difference or the pressure difference does not exceed the pressure difference threshold, a leak is not detected. In an embodiment, the pressure difference threshold is between about 5 psi and about 15 psi. Other pressure difference thresholds may also be used.

[0043] In some embodiments, pressure may be plotted from multiple pressure measurements over time to determine one or more characteristics of the leak, such as the extent of the leak. If a leak is detected, a signal may be sent to the system to alert the user. If there is a leak, the user can shut down the process chamber or divert the gas flow to an alternative gas stick assembly. If no leak is detected, the process chamber can continue to operate without dispensing.

[0044] As an example, the gas stick assembly of FIG. 3 may be monitored according to method 500 as follows. In a first step, the hybrid valve 301 of the gas stick assembly 300 is closed. The output end 309 is connected to a pump or an area under vacuum, and the purge valve 302 and the isolation valves 305 and 307 are open, so that the pressure of the gas stick assembly 300 is reduced to a target pressure (e.g., less than about 6 psia). Once the target pressure is reached, the isolation valve 307 downstream of the mass flow controller 306 is closed. The pressure of the mass flow controller 306 is then measured for a period of time, and this pressure data is collected in a processing device. The pressure data is then analyzed to determine whether the gas stick assembly has a leak (e.g., whether a pressure increase is observed over time).

[0045] FIG. 6 illustrates a method for measuring pressure in a gas stick assembly according to one embodiment of the disclosure. The method 600 for measuring pressure may be used in either pressurized or vacuum conditions as described above. In a first block 602, a first pressure of a mass flow controller (MFC) is measured using a pressure sensor of the mass flow controller at a first time after closing the second valve as described in FIG. 4 and FIG. 5. This first time may be while the gas stick assembly is under pressurized or under vacuum conditions. Thus, the first pressure may correspond to either a pressurized system or a vacuum system. In some embodiments, the first pressure may be about 30 psia to about 50 psia, or about 30 psia, about 35 psia, about 40 psia, about 45 psia, or about 50 psia, or any value therein. In another embodiment, the first pressure may be less than about 6 psia. In yet another embodiment, the first pressure may be about 3 psia to about 60 psia, about 5 psia to about 55 psia, about 10 psia to about 50 psia, about 15 psia to about 45 psia, about 20 psia to about 40 psia, about 25 psia to about 35 psia, or any value or range therein. After the pressure condition is reached in the gas stick assembly and the second valve is closed, a second pressure measurement is taken 604. The second pressure measurement is also taken using the pressure sensor of the MFC. As explained above, the MFC generates pressure measurements over a second period of time and sends the pressure measurements to the controller periodically or continuously. The first and second pressure measurements are then compared 606 and analyzed by the processing logic (e.g., by the controller). When comparing the data, it should be checked whether there is a difference between the first and second pressures at 608. This may be accomplished by a user monitoring the data or by a processing device.

[0046] In an embodiment, the processing logic determines whether there is a leak by at least comparing a second pressure generated later in the second time period (e.g., at the end of the second time period) to a first pressure generated earlier in the second time period (e.g., at the beginning of the second time period). Based on that comparison, the processing logic determines whether there is a difference between the two (or more) pressure measurements (e.g., whether the second pressure is lower than the first pressure by at least a threshold amount). If there is a detected difference, the processing logic determines whether at least a portion of the gas stick assembly has a leak based on whether the detected pressure difference exceeds a pressure difference threshold. If the pressure difference exceeds the pressure difference threshold, a leak is detected. If there is no pressure difference or the pressure difference does not exceed the pressure difference threshold, a leak is not detected. In an embodiment, the pressure difference threshold is between about 5 psi and about 15 psi. Other pressure difference thresholds may also be used.

[0047] If there is no difference in the measurements, there is no gas leak in the gas stick assembly. If there is a difference in the measurements, a difference threshold is checked to see if there is a gas leak. The difference threshold can be a difference of about 5 psi, about 6 psi, about 7 psi, about 8 psi, about 9 psi, about 10 psi, about 11 psi, about 12 psi, about 13 psi, about 14 psi, about 15 psi, about 16 psi, about 17 psi, about 18 psi, about 19 psi, about 20 psi, about 21 psi, about 22 psi, about 23 psi, about 24 psi, about 25 psi, about 26 psi, about 27 psi, about 28 psi, about 29 psi, about 30 psi, about 31 psi, about 32 psi, about 33 psi, about 34 psi, about 35 psi, about 36 psi, about 37 psi, about 38 psi, about 39 psi, or about 40 psi. If the difference threshold is met, there is a gas leak in the gas stick assembly.

[0048] In another embodiment of the present disclosure, a system is provided. The system may include a memory and a processing device. The processing device may be operably coupled to the memory. The processing device is configured to cause a valve of the gas stick assembly, either downstream or upstream of the mass flow controller of the gas stick assembly according to the present disclosure, to close. The processing device is also configured to cause one or more additional valves of the gas stick assembly system to remain open for a period of time until the gas stick assembly reaches a target pressure. The processing device may also cause a second valve of the one or more additional valves to close when the gas stick assembly reaches the target pressure, and at least a portion of the gas stick between the first valve and the second valve has the target pressure after closing the second valve. The processing device may then receive pressure data about the pressure in at least a portion of the gas stick assembly from the MFC over a second period of time, and analyze the pressure data to determine whether at least a portion of the gas stick assembly has a leak. In some embodiments, the target pressure can be from about 10 psia to about 50 psia, or about 10 psia, about 15 psia, about 20 psia, about 25 psia, about 30 psia, about 35 psia, about 40 psia, about 45 psia, or about 50 psia, or any value therein.

[0049] The preceding description describes numerous specific details, such as examples of specific systems, components, methods, etc., to provide a good understanding of some embodiments of the present invention. However, it will be apparent to those skilled in the art that at least some embodiments of the present invention can be practiced without these specific details. In other instances, well-known components or methods are not described in detail or are presented in a simple block diagram format to avoid unnecessarily obscuring the present invention. Thus, the specific details described are by way of example only. It is contemplated that particular implementations may vary from these illustrative details and still fall within the scope of the present invention.

[0050] References throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or property described with respect to that embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification do not necessarily all refer to the same embodiment. Furthermore, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or". When the term "about" or "approximately" is used herein, it is intended to mean that the nominal value presented is accurate to within ±10%.

[0051] Although the operations of the methods herein are shown and described in a particular order, the order of operations of each method may be changed such that some operations may be performed in reverse order or such that some operations may be performed, at least in part, simultaneously with other operations. In another embodiment, the order of separate operations or sub-operations may be in an intermittent and / or alternating manner. In one embodiment, multiple metallurgical bonding operations are performed as a single step.

[0052] It should be understood that the above description is illustrative, and not restrictive. Many other embodiments will be apparent to those of ordinary skill in the art upon reading and understanding the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

1. 1. A method for monitoring gas leaks in a gas stick assembly, the method comprising: closing a first valve of the gas stick assembly downstream of a pressure sensor in a flow path of the gas stick assembly; opening one or more additional valves of the gas stick assembly upstream of the pressure sensor for a first period of time until the gas stick assembly is pressurized with gas; closing a second valve of the one or more valves, wherein at least a portion of the gas stick assembly between the first valve and the second valve is pressurized after closing the second valve; measuring a pressure within at least the portion of the gas stick assembly with the pressure sensor to collect pressure data over a second period of time; analyzing the pressure data to determine whether at least the portion of the gas stick assembly has a leak; and A method comprising:

2. Measuring the pressure within at least the portion of the gas stick assembly measuring a first pressure within at least the portion of the gas stick assembly using the pressure sensor at a first time after closing the second valve; measuring a second pressure within at least the portion of the gas stick assembly using the pressure sensor at a second time after closing the second valve; Including, Analyzing the pressure data includes: comparing the second pressure to the first pressure; determining whether there is a difference between the second pressure and the first pressure based on the comparing; and determining whether at least the portion of the gas stick assembly has a leak based on whether there is a difference between the second pressure and the first pressure that exceeds a difference threshold; The method of claim 1 , comprising:

3. 2. The method of claim 1, wherein the gas stick assembly further comprises a first end having an input configured to receive the gas from a gas source, a second end having an output configured to deliver the gas to a destination, and a number of components between the first end and the second end, and the pressure sensor is a mass flow controller (MFC) pressure sensor.

4. 3. The method of claim 2, wherein the first valve is disposed at the output, the second valve is a hybrid valve having a first mechanism actuated via a first type of input and a second mechanism actuated via a second type of input, the hybrid valve is disposed at the input, and the at least a portion of the gas stick assembly includes an entirety of the gas stick assembly between the input and the output.

5. The method of claim 4, wherein the first period of time is from about 5 seconds to about 30 seconds.

6. The method of claim 4, wherein at least the portion of the gas stick assembly is pressurized to a pressure of from about 3 psia to about 60 psia.

7. 7. The method of claim 6, wherein the method is performed in situ for a processing chamber without stopping the process between processes performed on an article.

8. The method of claim 2 , wherein the difference threshold comprises from about 5 psi to about 15 psi.

9. The method of claim 2 , wherein the gas comprises a non-toxic gas or a toxic gas.

10. 1. A method for monitoring gas leaks in a gas stick assembly, the method comprising: closing a first valve of the gas stick assembly upstream of a pressure sensor in a flow path of the gas stick assembly; opening a second valve of the one or more valves of the gas stick assembly downstream of the pressure sensor; connecting an output end of the gas stick assembly to a pump; pumping the gas stick assembly to a first pressure; closing the second valve of the one or more valves of the gas stick assembly, wherein at least a portion of the gas stick assembly between the first valve and the second valve is under a vacuum after closing the second valve; measuring pressure within at least the portion of the gas stick assembly with the pressure sensor to collect pressure data over a period of time; analyzing the pressure data to determine whether at least the portion of the gas stick assembly has a leak; and A method comprising:

11. Measuring the pressure within at least the portion of the gas stick assembly measuring a first pressure within at least the portion of the gas stick assembly using the pressure sensor at a first time after closing the second valve; measuring a second pressure within at least the portion of the gas stick assembly using the pressure sensor at a second time after closing the second valve; Including, Analyzing the pressure data includes: comparing the second pressure to the first pressure; determining whether there is a difference between the second pressure and the first pressure based on the comparing; and determining whether at least the portion of the gas stick assembly has a leak based on whether there is a difference between the second pressure and the first pressure that exceeds a difference threshold; The method of claim 10, comprising:

12. 11. The method of claim 10, wherein the gas stick assembly further comprises a first end having an input configured to receive the gas from a gas source, a second end having an output configured to deliver the gas to a destination, and a number of components between the first end and the second end, and the pressure sensor is a mass flow controller (MFC) pressure sensor.

13. 12. The method of claim 11, wherein the second valve is disposed at the output, the first valve is a hybrid valve having a first mechanism actuated via a first type of input and a second mechanism actuated via a second type of input, the hybrid valve is disposed at the input, and the at least the portion of the gas stick assembly includes an entirety of the gas stick assembly between the input and the output.

14. The method of claim 13, wherein the pumping is performed for a second period of time from about 5 seconds to about 30 seconds.

15. 14. The method of claim 13, wherein the first pressure is a vacuum pressure of less than about 6 psia.

16. The method of claim 15 , wherein the method is performed in situ for a processing chamber between processes performed on an article.

17. The method of claim 11 , wherein the difference threshold comprises about 5 psi to about 15 psi.

18. The method of claim 11 , wherein the gas comprises a non-toxic gas or a toxic gas.

19. Memory, a processing device operably coupled to the memory; The system includes: causing a first valve of the gas stick assembly, the first valve being downstream or upstream of a mass flow controller (MFC) of the gas stick assembly, to close; causing one or more additional valves of the gas stick assembly to remain open for a first period of time until the gas stick assembly reaches a target pressure; causing a second valve of the one or more additional valves to close when the gas stick assembly reaches the target pressure, wherein at least a portion of the gas stick between the first valve and the second valve has the target pressure after closing the second valve; and receiving pressure data about a pressure within at least the portion of the gas stick assembly from a pressure sensor of the MFC over a second period of time, the pressure sensor being in a flow path in the gas stick assembly; analyzing the pressure data to determine whether at least the portion of the gas stick assembly has a leak; and configured to: system.

20. The system of claim 19, wherein the target pressure is from about 10 psia to about 50 psia.

Citation Information

Patent Citations

  • Official approval system of gas piping system

    JP1997184600A

  • Valve integral type coupling device of distributor for superhigh purity gas

    JP1998047515A

  • Apparatus and method for vacuum processing

    JP2003031507A

  • Leak tester

    JP2003270077A

  • Non-pressure sensitive gas control system

    JP2003504888A