IMMERSION BATH COOLING APPARATUS FOR ELECTRONIC HARDWARE HAVING DIFFERENT ON-BOARD HEAT-GENERATING ELECTRONIC COMPONENTS - Patent application

Abstract

A liquid cooling apparatus and system for immersion cooling of electronic devices, particularly including servers and other IT hardware nodes, having an array of heat generating devices including microprocessors, RAM, motherboards, etc., each having a different operating temperature. The apparatus and system accommodates at least a serial flow of cooling liquid in direct contact with the different heat generating devices, thereby providing a multi-stage heat transfer phase to improve the energy efficiency and operational control and performance of the electronic device.

Description

[Technical field]

[0001] The concept of the present invention relates to a liquid cooling system for effective and efficient cooling of heat-generating electronic components, and in particular, but not exclusively, to a liquid cooling system for cooling IT components, servers, computer electronic devices, etc., by direct immersion in a dielectric liquid coolant. [Background technology]

[0002] Cooling of electronic devices, especially IT components, servers, data storage devices, and computer electronic devices with graphic and central processing units (GPUs and CPUs), is a major technological challenge due to the continuing development of smaller, faster, denser, and higher capacity electronic devices.

[0003] Computing devices generate heat as a by-product of their operations. In data centers where thousands of such devices are deployed, the amount of heat generated can be significant. As the need for more processing and access to data storage continues to expand, the density of server systems continues to increase, making thermal challenges very real and looming.

[0004] Conventional fan-based cooling systems require large amounts of power. Thus, the power demand to drive such systems increases significantly with increasing server density. Immersion cooling of IT components is a relatively recent development. During operation, hot electronic devices are in direct contact with a dielectric (electrically insulating) cooling liquid that is circulated and cooled, for example using a heat exchanger. Cooling the electronic devices improves their performance efficiency and allows for faster processing (e.g. overclocking of a CPU). Heat generated in the circuitry is quickly and efficiently removed by the dielectric liquid directly at the heat source. However, there is a general need for continuous improvement in the operating efficiency of existing immersion cooling systems, both in terms of the effectiveness of cooling the electronic components, and in the thermal management and circulation of the cooling liquid for efficient energy reuse. Summary of the Invention [Problem to be solved by the invention]

[0005] It is an object of the present invention to provide an apparatus and method for precise and efficient liquid cooling of electronic devices. In particular, it is an object to provide a liquid cooling system for electronic components that allows IT components and the like to operate at high temperatures. A more particular object is to provide a cooling system that maximizes the operating temperature of the dielectric liquid through heat transfer with the electronic components for subsequent energy reuse. A still more particular object is to provide a system that provides an outlet of the dielectric liquid (after heat transfer with the electronic components) at a uniform / constant temperature. Such an arrangement maximizes the efficiency and effectiveness of thermal energy transfer in suitable heat exchangers and the like for thermal energy reuse. [Means for solving the problem]

[0006] The system provides a liquid immersion / submersion configuration in which IT electronic components are spatially partitioned / isolated based on their operating temperature and active power consumption. In particular, the system is configured to cool the electronic components through direct contact and circulation of a refrigerant liquid, providing a single liquid cooling system for cooling each electronic component individually and / or independently of one another on demand depending on the electronic components' operational performance, type, operating temperature, size and / or configuration.

[0007] References herein to "electronic components," "electronic devices," or the like encompass heat-generating electronic components attached to larger IT components / devices, such as, for example, servers, motherboards, data storage devices, programmable logic controller boards, etc. Such heat-generating electronic components include, for example, circuits and / or electronic components on a motherboard or other printed circuit board device, such as random access memory (RAM); graphic processing units (GPUs); central processing units (CPUs); chips, sockets; peripheral component interconnects (PCI); slots; read-only memory (ROM) components; chips and slots; graphic processing components, ports, slots, chips; electronic bridges; battery components, ports and slots; power plugs, slots and ports, electronic connectors; electronic heat sinks; switches; jumpers; capacitors; transistors; diodes; operating power related components; current and / or voltage regulators and modules; power converters, etc.

[0008] The system is configured to deliver cooling liquid to heat generating electronic devices based on typical, typical, average and / or maximum operating temperatures through a variety of different liquid flow circuit configurations that may exist. For example, the system is compatible with series, parallel and / or combination series and parallel liquid flow configurations based on the spatial location of electronic components according to typical, typical, average and / or maximum operating temperatures. This allows the system to provide a liquid flow that exits at a maximum exit temperature and at a constant / uniform temperature over time. This heated dielectric liquid can then be efficiently and effectively processed by transferring thermal energy from the dielectric liquid to a secondary application or device that requires a temporary or continuous supply of thermal energy, such as via a heat exchanger, for heat recycling.

[0009] The outflow of the dielectric liquid, heated (over time) to a maximum and uniform operating temperature, provides an efficient and effective heat source for heat recycling techniques. This is achieved by spatial partitioning / segregation of the heat generating devices based on their respective operating temperatures. In particular, at least one, in particular a set of first heat generating electronic components may be partitioned and placed in a first region or chamber of the device for first contact with the dielectric liquid. At least one second component, or a set of further heat generating electronic components (having a higher operating temperature than the first electronic device), may be placed in a separate or partitioned region (or enclosure) of the system / device for isolation and / or subsequent contact with the dielectric liquid. Such a configuration allows the dielectric liquid to flow in direct contact with the first heat generating electronic component and then the second heat generating electronic component, so that the outflow temperature of the dielectric liquid in the outflow region of the device is the sum of the temperature rise of the liquid passing in contact with the electronic components in all spatially separated regions.

[0010] In one aspect, the system includes a capsule (or cover) that can be positioned to (at least partially) house an electronic device such as a CPU / GPU. The capsule may be placed on top of a chip (with or without a heat sink) or on top of a chip (e.g., cold plate technology), and a coolant is configured to flow through each capsule area to capture all heat generated by the electronic device. Such a configuration allows the electronic device (CPU / GPU) to operate at its optimal or typical operating temperature regardless of overclocking mode, while allowing the coolant liquid to exit at a temperature as high and uniform as possible over time for improved energy reuse.

[0011] In one embodiment, the system isolates the submerged heat generating devices according to their operating temperature ranges so that all of them are in contact with different portions of the cooling fluid in the fluid container at a given time. The fluid in the container is driven towards a cooling device where it is cooled to a state where it can be driven back into the container, thereby effectively cooling the heat generating devices immersed in series. The fluid may be driven through the system in such a way that it first contacts the isolated heat generating device having the lowest operating temperature. The partially heated fluid may then be driven to contact the next set of isolated heat generating devices having the second lowest operating temperature, where its temperature may be further increased. This is repeated until the set of isolated heat generating devices having the highest operating temperature is in contact with the dielectric liquid, and the dielectric liquid is driven towards the cooling device (i.e., heat exchanger).

[0012] According to a first aspect of the invention, a liquid cooling apparatus for an electronic device comprises: a first housing defining a chamber for accommodating at least one electronic device having at least one heat-generating electronic component; at least one liquid inlet and at least one liquid outlet provided in said housing to allow a flow of a dielectric cooling liquid into and out of said chamber in direct contact with said electronic device; a second housing disposed within the chamber defining an enclosure for at least partially accommodating at least one heat-generating electronic component of said device; at least one liquid inlet and at least one liquid outlet provided in said second housing to allow a flow of said liquid into and out of said enclosure in direct contact with said heat-generating electronic component; and a cooling unit connected in fluid communication to at least one of said inlets and at least one of said outlets, said cooling unit forming part of a fluid flow network for transferring thermal energy from said liquid.

[0013] Preferably, said at least one outlet of said first housing is connected in fluid communication to said at least one inlet of said second housing such that said liquid flows through said chamber and then through said enclosure.

[0014] Preferably, the electronic device comprises: at least one first heat-generating electronic component at least partially contained within the chamber for immersion in the liquid within the chamber; and at least one second heat-generating electronic component at least partially contained within the enclosure for immersion in the liquid within the enclosure, Optionally, the second heat-generating electronic component may have a higher operating temperature than the first heat-generating electronic component.

[0015] Reference herein to a first heat generating electronic component encompasses a relatively low heat generating device / component (LHGD), such as, for example, RAM, motherboard, etc. Similarly, reference herein to a second heat generating electronic component encompasses a relatively high heat generating device (HHGD), such as, for example, microprocessor, CPU, GPU, etc. The first and second heat generating electronic components are distinguished herein by their relative, typical, average, and / or maximum operating temperatures. This is the heat energy that such devices generate during use and / or are detailed in electronic component data sheets, databases, etc. Thus, in general, a low heat generating component / device includes a lower typical, typical, average, and / or maximum operating temperature than a high heat generating component / device. In a specific embodiment, a low heat generating component / device may be configured to generate heat under a typical or typical operation of less than 200W. In a more specific embodiment, a high heat generating component / device may be configured to generate heat under a typical or typical operation of more than 200W. However, such values ​​are given for guidance only, and those skilled in the art will appreciate that the 200 W value applied herein to the LGHD and HHGD may vary in specification for different types of electronic components.

[0016] Preferably, the at least one outlet of the second housing is fluidly connected to an inlet of the cooling unit, and the outlet of the cooling unit is fluidly connected to the at least one inlet of the first housing. Optionally, the chamber is fluidly connected in series with the enclosure.

[0017] Preferably, the apparatus comprises at least one electronically controlled valve provided in fluid communication with at least one of the inlets and / or outlets of the first housing and / or the second housing; and a control unit for controlling the valves and the flow of the liquid into and out of the first housing and / or the second housing via the respective inlets and outlets.

[0018] Optionally, the control unit is configured to control the flow of the liquid through the chamber for a first thermal energy exchange with the first heat-generating electronic component and then control the flow of the liquid through the enclosure for a second thermal energy exchange with the second heat-generating electronic component, the second thermal energy exchange being complementary and additive to the first thermal energy exchange such that a temperature rise of the liquid at the outlet of the enclosure is the sum of a temperature rise of the liquid passing through the chamber and the enclosure. The control unit may comprise one or more electronic control units, modules or devices, including a programmable logic controller (PLC), a remote telemetry unit (RTU), a microprocessor, a server, a printed circuit board, a motherboard or other similar device. The control unit may comprise sensors, including at least one flow, temperature, proximity, motion, current, voltage, pH and / or magnet sensor. The control unit may comprise at least one control valve, which may include a solenoid valve, a diaphragm valve, a pilot operated multi-way valve and combinations thereof. The control unit may be located locally or remotely relative to the system and devices for local and / or remote control of the devices. The control unit may operate via a cloud network, wireless or wired communication paths and associated components.

[0019] Preferably, the first housing comprises an immersion tank. Preferably, the at least one second housing is smaller in size than the first housing and is arranged in the chamber. Optionally, the apparatus comprises a plurality of second housings (also referred to herein as enclosures) which may be arranged in series and / or parallel with each other. This may be arranged so that the liquid flows through the chamber along a first flow path, then through at least one enclosure in series via a second flow path, and then through a further enclosure connected in series with the first enclosure. Each enclosure may comprise the same or different heat-generating electronic components having the same or different operating temperatures. When enclosures are connected in parallel, the liquid supply may be split / branched into separate flows entering each of the parallel enclosures. The separated parallel flows may then merge (in fluid flow direction) into a single flow after flowing through the enclosures.

[0020] Optionally, the system may comprise a plurality of enclosures defined by respective second housings enclosing respective heat-generating electronic components provided in the electronic device; the plurality of enclosures may be arranged in parallel and / or series with each other in a fluid flow. Optionally, the heat-generating electronic components may be arranged in respective second housings with substantially the same operating temperature or with different operating temperatures in ascending order of operating temperature. Optionally, the liquid may pass through each of the second housings in contact with the respective heat-generating electronic components in parallel or series. Preferably, the first housing comprises an immersion tank or bath, and the second housing comprises at least one second housing, shroud, container, pocket or sub-chamber that contains different heat-generating electronic components, each spatially partitioned with respect to the larger first housing, and allows partitioned / separated liquid flow in contact with different (sets of) electronic devices. Optionally, the second housing may be exclusively and / or entirely contained within the first housing.

[0021] The apparatus typically comprises a dielectric cooling liquid stored in the chamber of the first housing, and the second housing is at least partially immersed or fully immersed in the liquid in the chamber of the first housing. The dielectric cooling liquid may be any liquid type suitable for immersion cooling of IT components, having suitable electrical insulating properties to provide safe direct contact with energized electronic components, and importantly, the liquid is not electrically conductive.

[0022] Optionally, at least a portion of the second heat-generating electronic component is arranged in direct contact with the liquid in the enclosure defined by the second housing, and / or at least a portion of the first heat-generating electronic component is arranged in direct contact with the liquid in the chamber.

[0023] Optionally, the electronic device may comprise any of: a computer main unit, a server, a motherboard, a printed circuit board comprising multiple electronic components, or a combination thereof. Optionally, the first heat-generating electronic component and / or the second heat-generating electronic component may comprise any of: a motherboard, a random access memory (RAM), a graphics processing unit (GPU), a central processing unit (CPU), or a combination thereof.

[0024] Optionally, the inlet of the second housing is defined by at least a periphery of an opening through which the second housing is positionable to receive and encase the heat-generating electronic component in the enclosure. Optionally, the inlet and the outlet of the second housing are spaced apart from one another and / or located in different areas of the second housing. Optionally, the second housing comprises an opening through which the second housing is positionable to receive and encase the heat-generating electronic component in the enclosure and a roof portion located opposite the opening. Optionally, the inlet of the second housing is located on the roof portion of the second housing. Optionally, the inlet and / or outlet of the second housing are defined in part by a periphery of the opening. Optionally, the inlet or outlet of the second housing is defined in part by a gap or area between the periphery of the electronic component and an area immediately inside the periphery of the enclosure. Such a gap region may be annular such that flow of the liquid into and / or out of the enclosure occurs through the space / gap between the electronic component and a wall or body of the second housing.

[0025] Optionally, the second housing is adjustably attached to the apparatus via an actuator, the actuation of which is configured to vary an internal volume of the enclosure. Optionally, the apparatus comprises an actuator connected to the second housing, the actuator configured to move the second housing, the actuator configured to vary any of: an internal volume of the enclosure; a position of the enclosure relative to the housing and / or the heat-generating electronic component; a separation distance between the second housing and the heat-generating electronic component; the degree to which the second housing encapsulates or contains the heat-generating electronic component within the enclosure, or any combination thereof. The actuator may be an electronic actuator, a magnetic actuator, a pneumatic or hydraulic actuator, or a combination including an electromagnetic or electromechanical actuator controlled locally or remotely via the control unit.

[0026] Optionally, the apparatus comprises a pump connected in fluid communication to the inlet and / or the outlet of the second housing to drive the flow of the liquid through the enclosure.

[0027] Optionally, the apparatus comprises a first electronically controlled valve fluidly connected to the inlet and / or the outlet of the chamber and a second electronically controlled valve fluidly connected to the inlet and / or the outlet of the enclosure. Optionally, the apparatus comprises at least one electronically controlled valve provided in fluid communication with the inlet and / or the outlet of the second housing.

[0028] Optionally, the apparatus further comprises at least one temperature sensor for measuring a temperature or relative temperature difference between the liquid and / or the heat-generating electronic component, the temperature sensor being arranged in electronic communication with the control unit. Optionally, the electronic device or the first and / or second heat-generating electronic components comprise a temperature sensor for measuring a temperature or a temperature difference between the liquid and the first and / or second heat-generating electronic components. Optionally, the apparatus comprises at least one sensor. Optionally, the at least one sensor may comprise at least one of a flow, temperature, proximity, motion, current, voltage, pH and / or magnet sensor.

[0029] Optionally, the apparatus comprises a liquid return conduit connected in fluid communication to the outlet of the chamber and the inlet of the enclosure for circulating liquid out of the chamber and into the enclosure. Optionally, the apparatus comprises a temporary storage reservoir connected in fluid communication between the outlet of the chamber and the inlet of the enclosure for temporarily storing a quantity of liquid for circulation from the chamber to the enclosure. Optionally, the inlet of the chamber comprises a plenum for distributing the flow of the liquid into the chamber.

[0030] Optionally, the cooling unit comprises a heat exchanger for transferring thermal energy from the liquid. Optionally, the heat exchanger comprises a refrigerant fluid configured to circulate in a fluid circuit or network separate from a dielectric liquid, and a dielectric liquid network configured to flow through the chamber and the enclosure. These exchanges are configured to allow the transfer of thermal energy between the dielectric liquid and the refrigerant fluid, in particular from the dielectric liquid to a refrigerant working fluid.

[0031] Preferably, the outlet of the first housing is connected in fluid communication to the inlet of the cooling unit, and the outlet of the cooling unit is connected in fluid communication to the inlet of the second housing.

[0032] Optionally, the apparatus comprises a plurality of second housings, each having a respective inlet and outlet fluidly connected to said cooling units. Optionally, at least some of said second housings are connected to each other in series as part of a liquid flow network that includes said cooling units. Optionally, at least some of said second housings are connected to each other in parallel as part of a liquid flow network that includes said cooling units.

[0033] Optionally, a dielectric cooling liquid is stored in the chamber and allowed to flow through the enclosure. Optionally, at least a portion of the electronic device and / or at least a portion of the first heat-generating electronic component are disposed within the chamber in direct contact with and immersed in the liquid in the chamber, and at least a portion of the at least one second heat-generating electronic component is disposed within the enclosure in direct contact with and immersed in the liquid in the enclosure.

[0034] Optionally, the apparatus comprises a weir structure disposed in fluid communication with the inlet and / or the outlet of the first housing and / or the second housing. Optionally, the apparatus comprises a first weir structure disposed in fluid communication with the inlet and / or the outlet of the second housing. Optionally, the apparatus may comprise a second weir structure disposed in fluid communication with the inlet and / or the outlet of the first housing. References herein to a "weir structure" include at least one aperture, partition, flow restrictor, etc. configured to at least partially separate a first volume of liquid from a second volume of liquid such that liquid flows from the first volume to the second volume via a restricted flow path in the weir structure. Such structures include overflow or throughflow structures. Optionally, the weir structure may provide an overflow or throughflow under gravity.

[0035] Optionally, the device comprises at least one storage reservoir fluidly connected to the chamber for supplying and / or receiving liquid in the chamber and for maintaining a predetermined volume of liquid in the chamber. Optionally, the device may comprise at least one main storage reservoir fluidly connected to at least one of the inlet and outlet of the enclosure / second housing for storing liquid as part of the fluid flow network. Optionally, the main storage reservoir comprises a pressurization mechanism for varying the pressure of the liquid in the fluid flow network. Optionally, the pressurization mechanism comprises at least one electronically controlled valve for controlling the volume of liquid in the main storage reservoir and / or the fluid flow network.

[0036] According to a further aspect of the present invention, there is provided a method of cooling at least a portion of an electronic device, the method comprising: immersing an electronic device having at least one heat-generating electronic component in a dielectric cooling liquid stored in a chamber defined by a first housing; immersing the heat-generating electronic component in the liquid in an enclosure defined by a second housing disposed in the chamber; providing a first flow of the liquid through the chamber via at least one inlet and at least one outlet in the first housing; and providing a second flow of the liquid through the enclosure via at least one inlet and at least one outlet in the second housing.

[0037] Optionally, the method further comprises the electronic device comprising at least one first heat-generating electronic component and at least one second heat-generating electronic component capable of having or having a higher operating temperature than the first heat-generating electronic component, at least a portion of the second heat-generating electronic component being arranged in direct contact with the liquid in the enclosure defined by the second housing, and / or at least a portion of the first heat-generating electronic component being arranged in direct contact with the liquid in the chamber.

[0038] Optionally, the chamber is connected in series in fluid communication with the enclosure such that the liquid flows through the chamber and then through the enclosure.

[0039] Optionally, the method includes a plurality of enclosures defined by respective second housings respectively enclosing respective heat-generating electronic components provided in the electronic device; wherein the plurality of enclosures are arranged in series with one another in fluid flow; and wherein each of the heat-generating electronic components has substantially the same operating temperature or is arranged within each second housing with different operating temperatures in order of increasing operating temperature, thereby configuring a flow of the liquid through each of the enclosures in contact with each of the heat-generating electronic components in series from a relatively low operating temperature to a relatively high operating temperature.

[0040] Optionally, the liquid is arranged to flow from the outlet of the chamber to the inlet of the enclosure via a return flow conduit and then from the at least one outlet of the enclosure to a fluid flow network including the cooling unit.

[0041] Optionally, the method includes controlling a flow of the liquid such that the liquid flows along a first flow path through the chamber in direct contact with at least a portion of the first heat-generating electronic component, and then flows along a second flow path through the enclosure in direct contact with at least a portion of the second heat-generating electronic component, such that thermal energy transferred to the liquid is the sum of thermal energy transferred from the first heat-generating electronic component and the second heat-generating electronic component to the liquid.

[0042] Preferably, the method includes driving a flow of the liquid through the chamber and / or the enclosure using a pump. Preferably, the method includes directing a return flow of the liquid from the outlet of the chamber at the end of the first flow path to the inlet of the enclosure at the beginning of the second flow path. Preferably, the method further includes directing the flow of the liquid from the outlet of the enclosure to a cooling unit to reduce a temperature of the liquid; and providing a return flow of the liquid cooled by the cooling unit to the inlet of the enclosure.

[0043] Optionally, the method includes temporarily storing the liquid received from a terminal end of the first flow path in a temporary storage reservoir prior to directing a return flow of the liquid to the inlet of the enclosure. Optionally, the electronic device comprises a plurality of first heat-generating electronic components each immersed in the liquid, and a plurality of second housings defining respective enclosures for containing the heat-generating electronic components. Optionally, the liquid flows through the enclosures in direct contact with the heat-generating electronic components, the flow through some of the enclosures being serial, and / or the flow through some of the enclosures being parallel.

[0044] According to a further aspect of the present invention, there is provided an immersion cooling bath for cooling an electronic device having at least one heat-generating electronic component, comprising: an apparatus as described and claimed herein; and an electronic device having at least one heat-generating electronic component, the device and the heat-generating electronic component being respectively immersed in the dielectric cooling liquid stored in the chamber defined by the first housing and / or the enclosure defined by the second housing.

[0045] Optionally, the immersion cooling bath comprises at least one first housing defining the chamber to accommodate at least one electronic device having at least one heat-generating electronic component; a plurality of second housings disposed within the chamber defining respective enclosures at least partially housing a respective one of the heat-generating electronic components of the device; and a plurality of electronic devices, each having at least one heat-generating electronic component, wherein the devices are immersed in the liquid stored in the chamber and the at least one heat-generating electronic component is immersed in the liquid stored in each of the enclosures.

[0046] Optionally, the immersion cooling bath comprises a plurality of electronic devices each having a first and second heat-generating electronic component, the devices and the first heat-generating electronic component being at least partially immersed or fully immersed in the liquid stored in the first housing, and the second heat-generating electronic component being at least partially immersed or fully immersed in the liquid stored in the enclosure. [Brief description of the drawings]

[0047] Specific embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings, in which: [Figure 1] FIG. 1 is a perspective view of an immersion cooling bath for housing multiple IT hardware nodes, each having an array of microprocessors, according to an illustrative embodiment of the present invention. [Diagram 2] FIG. 2 is a perspective view of a rack in which a plurality of IT hardware nodes of FIG. 1 are mounted in a vertical arrangement according to a further embodiment of the present invention. [Diagram 3] FIG. 3 is a schematic diagram of a precision isolation cooling system for cooling respective first and second heat generating electronic components mounted on an IT hardware node. [Figure 4]FIG. 4 is a schematic diagram of certain selected components of a precision isolation cooling system having a circulating fluid network that circulates a cooling liquid in direct contact with multiple heat-generating electronic components. [Diagram 5] FIG. 5 is a schematic diagram of selected components of a precision isolation cooling system configured to deliver cooling liquid to low heat generating devices and multiple high heat generating devices mounted on an IT hardware node. [Figure 6] FIG. 6 is a further schematic diagram of certain selected components of a precision isolated cooling system configured to deliver cooling liquid in series to the IT hardware nodes and heat-generating devices of FIG. [Figure 7] FIG. 7 is a schematic diagram of a plurality of adjustably mounted second housings configured to receive a cooling liquid for cooling a plurality of heat generating device IT hardware nodes. [Figure 8] FIG. 8 is a schematic diagram of an enclosure that encapsulates a high heat generating device and has a control valve for regulating the flow of cooling liquid to the inlet of the enclosure. [Figure 9] FIG. 9 is a schematic diagram of the enclosure and heat generating device of FIG. 8 with the enclosure moved to a lower position to reduce the interior volume of the enclosure. [Figure 10] FIG. 10 is a further schematic view of the configuration of FIG. 8 with the enclosure elevated to increase the internal volume of the enclosure. [Figure 11] FIG. 11 is a perspective view of a tray housing IT hardware nodes having multiple microprocessors and provided with internal divider weir walls for controlled circulation of cooling liquid. [Figure 12a] FIG. 12a is a side cross-sectional view of a first weir structure for controlled circulation of cooling liquid in an IT hardware node. [Figure 12b] FIG. 12b is a side cross-sectional view of a second weir structure for controlled circulation of cooling liquid in an IT hardware node. [Figure 12c]FIG. 12c is a side cross-sectional view of a third weir structure for controlled circulation of cooling liquid in an IT hardware node. [Figure 13] FIG. 13 is a schematic diagram of an immersion cooling system according to a specific embodiment of the invention having IT hardware nodes immersed in a cooling liquid stored in an immersion cooling bath and connected to a circulating cooling fluid network and manifold. [Figure 14] FIG. 14 is a schematic diagram of a cooling liquid circulation system for partitioned distribution and circulation of cooling liquid in each heat generating device mounted on an IT hardware node according to a specific embodiment of the present invention. [Figure 15] FIG. 15 is a schematic diagram of a cooling liquid circulation system for partitioned distribution and circulation of cooling liquid in each heat generating device mounted on an IT hardware node according to a further specific embodiment of the present invention. [Figure 16] FIG. 16 is a schematic diagram of a cooling liquid circulation system according to a further specific embodiment of the present invention for partitioned distribution and circulation of cooling liquid in each heat generating device mounted on an IT hardware node. [Figure 17] FIG. 17 is a schematic diagram of a cooling liquid circulation system according to a further specific embodiment of the present invention for partitioned distribution and circulation of cooling liquid in each heat generating device mounted on an IT hardware node. [Figure 18] FIG. 18 is a schematic diagram of a cooling liquid circulation system according to a further specific embodiment of the present invention for partitioned distribution and circulation of cooling liquid in each heat generating device mounted on an IT hardware node. [Figure 19] FIG. 19 is a schematic diagram of a cooling liquid circulation system for partitioned distribution and circulation of cooling liquid in each heat generating device mounted on an IT hardware node according to a further specific embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0048] This partitioned cooling fluid system seeks to maximize energy efficiency within a circulating cooling liquid network through segregated / compartmentalized distribution of the working fluid. The working fluid is distributed to an array of on-board heat generating devices (typically microprocessors) that are segregated by their or typical operating temperature. In particular, the system provides a multi-stage serial cooling liquid circulation network, where a dielectric cooling liquid is distributed through a first flow path in direct contact with at least one heat generating device having a relatively low operating temperature, and then flows through a second flow path in direct contact with at least one or more heat generating devices (approximately co-located with the low heat generating devices). This allows the transfer of thermal energy from the low heat generating devices and subsequent high heat generating devices in series as a multi-stage heat transfer process. This configuration maximizes the temperature change of the circulating cooling liquid. The system of the present invention can be implemented either in an immersion cooling bath or even in a conventional IT hardware node rack.

[0049] Referring to FIG. 1, an immersion cooling bath 10 includes an interior chamber 12 for housing a number of IT hardware nodes 11 (such as servers). Each IT hardware node has an array of different heat generating devices (HGDs) in the form of on-board electronic components, which may include relatively low heat generating components (such as RAM, motherboards, etc.) and relatively high heat generating devices (such as microprocessors) that may themselves have different maximum operating temperatures. FIG. 2 shows an alternative configuration for mounting the IT hardware nodes 11 in the form of a support rack 13, in which the IT hardware nodes 11 are mounted within a generally upright frame 70. The array of nodes 11 are mounted vertically relative to one another in the rack 13, with each tray 14 mounted on a number of horizontal rails 71, each tray housing at least one IT hardware node 11.

[0050] Referring to FIG. 3, the system comprises a first housing 15 defining an internal chamber 28 for storing a dielectric cooling liquid 18. The first housing 15 is sized to accommodate an electronic device such as an IT hardware node, in particular a motherboard 16 carrying multiple electronic components including multiple low heat generating devices 17 (LHGDs) and multiple high heat generating devices 19 (HHGDs). FIG. 3 shows a single LHGD 17 and HHGD 19 for simplicity, and a single respective second housing 20. However, it will be understood that the apparatus comprises multiple such components. A plurality of second housings (or covers) 20 are disposed for each HHGD 19. A conduit 21 provides fluid communication between an outlet port 23 of the first housing 15 and a respective enclosure 27 defined by each second housing 20. Each second housing 20 comprises an opening 37 having a cross-sectional area larger than the size / cross-sectional area of ​​each HHGD 19. At least a portion of each HHGD 19 may therefore be housed or contained within a respective enclosure 27 defined by a respective second housing 20 disposed about each HHGD 19. Each opening 37 is therefore in a position to contact or nearly contact the motherboard 16 in the area immediately surrounding each HHGD 19. The first housing 15 also comprises an inlet 22 at a respective opposite end to the outlet 23. An inlet manifold 24 is connected in fluid communication between the inlet 22 and a heat exchanger 26 having an outlet 26a and an inlet 26b, respectively. A corresponding return manifold 25 provides fluid communication between the housing outlet 23 and the heat exchanger inlet 26b. A dielectric cooling liquid is therefore configured to circulate through the chamber 28 and in direct contact with the LHGD 17 and HHGD 19 (via the inlet 22 and outlet 23), the heat exchanger 26, and the manifolds 25 and 24. The heat exchanger 26 includes an internal thermal coil having an associated working fluid arrangement or other similar arrangement that transfers energy from a dielectric cooling liquid received at inlet 26b such that the temperature of the liquid exiting at outlet 26a is lower than the temperature of the liquid entering (via inlet 26b).

[0051] The serial isolated immersion cooling of each LHGD 17 and HHGD 19 maximizes the temperature difference of the liquid at the outlet 23 and the inlet 22, thereby maximizing the energy efficiency of the configuration. In particular, according to the configuration of FIG. 3, the cooling liquid enters the chamber 28 via the inlet 22, and then the liquid contacts the LHGD 17 for a first energy exchange, which slightly increases the dielectric liquid temperature. The partially heated liquid is drawn into the enclosure 27 via the respective openings 37 by suction. The liquid stored in each second housing 20 undergoes a second stage energy exchange with the HHGD 19, which operates at a significantly higher temperature than the LHGD 17. Thus, the already heated liquid is further heated to its maximum operating temperature. The fluid is then discharged from the enclosure 27 (and chamber 28) and delivered to the heat exchanger 26 via the outlet 23 and the return manifold 25. Once the dielectric liquid is cooled in heat exchanger 26, it is then recirculated through inlet manifold 24 to inlet 22 and the cycle repeats.

[0052] According to various embodiments described herein, the apparatus and system includes a control unit, sensors and electronically controllable fluid flow valves to control and regulate the flow rate of the dielectric liquid through various regions of the apparatus and maximize energy efficiency, particularly the desired thermal energy exchange with the LHGD 17 and HHGD 19. The control unit may include a programmable logic controller (PLC), a remote measurement unit (RTU), a microprocessor and / or a motherboard, and the like. The sensors may include flow, temperature, proximity, motion, current, voltage, pH and / or magnetic sensors. The control valves may include solenoid valves, diaphragm valves, or other electromagnetic valves, such as direct actuated, pilot actuated, 2-way, 3-way, 4-way valves and combinations thereof. The systems and apparatus may be controlled locally and / or remotely via a cloud network and may be configured to locally or remotely monitor various operational characteristics of the systems and apparatus, including the operational performance of the electronic components and / or the dielectric cooling fluid.

[0053] Referring to FIG. 4, the apparatus is configured to achieve maximum temperature change of the dielectric cooling liquid (supplied in direct contact with the LHGDs 17 and HHGDs 19) in addition to supplying the cooling liquid to the heat exchanger at a constant temperature. Such a configuration maximizes the operational performance of the heat exchanger and the system. According to the configuration of FIG. 4, an inlet manifold 24 provides fluid communication between the LHGDs 17 and the spatially partitioned HHGDs 19 (all implemented on-board the IT hardware node). Each HHGD 19 is at least partially encapsulated by a respective second housing 20 (FIG. 3). In particular, the incoming cooling liquid is split via inlet conduits 24a to provide parallel liquid flow to each of the enclosures 27 housing each HHGD 19. The heated fluid is then discharged from each enclosure 27 via conduits 21. The flow control valve 29 is in electronic communication with the control unit 23, which also includes suitable sensors (not shown) to monitor at least one operating characteristic of each HHGD 19 and / or the region of the enclosure 27, including, among other things, the flow rate, temperature and / or temperature change of the cooling liquid in each HHGD 19. The flows from the conduits 21 are arranged to converge via the outlet conduit 25a to provide a single flow to the return manifold 25. A temperature sensor 30 (electronically connected to the control unit 33) is provided in the manifold 25. A pump 31 drives the flow of liquid through this circuit, among other things in direct contact with the LHGD 17 and the HHGD 19 towards the heat exchanger 26. The inlet manifold 24 provides a return flow from the heat exchanger 26 to the LHGD 17 for first stage thermal energy exchange before passing to the HHGD 19.

[0054] With reference to FIG. 5, a specific embodiment of the flow path in the LHGD 17 and HHGD 19 is described. The cooling liquid 18 in the first housing 15 is provided in direct contact with the LHGD 17 for the heat transfer of the first stage. The partially heated liquid is then discharged through the outlet 61 of the first housing 15. This partially heated fluid is then returned to the inlet 22 through the return manifold. The liquid is then split for further thermal energy exchange with the LHGD 17, while at the same time being transferred through the conduits 38 to the second housings 20 arranged for each HHGD 19. The partially heated liquid enters the enclosure 27 through the respective inlets 34, flows in direct contact with each HHGD 19, and leaves the enclosure 27 through the respective outlets 35. This heats the dielectric liquid to its maximum operating temperature. The outlet conduits 39 provide fluid communication between each enclosure 27 (defined by the second housing 20) to a single combined outlet conduit 21 which is in turn provided in fluid communication with the heat exchanger 26. In the embodiment of Figure 5, the dielectric liquid is delivered via each conduit 38 specifically to reach the enclosures 27.

[0055] A variation of the embodiment of FIG. 5 is shown in FIG. 6. In this configuration, the dielectric liquid 18 in the first housing 15 undergoes a first stage heat transfer with the LHGD 17. The partially warmed liquid is then drawn into each enclosure 27 via respective inlet ports 34 that are at least partially immersed in the liquid 18 in which the electronic device 16 is immersed (in chamber 28). The liquid then undergoes a second stage heat energy exchange with the HHGD 19 before exiting to the heat exchanger 26. The configuration of FIG. 6 is configured to operate in series for a first stage heat energy transfer with an initial LHGD 17, and then a second stage heat energy transfer with a subsequent HHGD 19 by isolating / partitioning the LHGD 17 from the HHGD 19 via the second housing 20 and various cooling liquid flow paths.

[0056] Referring to FIG. 7, according to one embodiment, each second housing 20 includes an opening 37 that allows the HHGD 19 to be encapsulated and at least partially contained within the inner enclosure 27. The dielectric cooling liquid 18 is drawn into the enclosure 27 via a suction pump 31 (FIG. 4) and circulates through and in direct contact with the HHGD 19 within the localized partitioned enclosure 27 for thermal energy transfer between the HHGD 19 and the liquid 18. Each HHGD 19 mounted on the motherboard 16 has different operating characteristics in normal use, including in particular the processing requirements and the resulting thermal energy output. The system is adapted to regulate the supply of cooling liquid as required, with automatic or semi-automatic responsive action aimed at delivering a working liquid heated to a maximum operating temperature and a constant temperature to the heat exchanger. This flow control (and temperature regulation of the dielectric liquid 18) is achieved via a control unit 33 and the adjustably mounted second housing 20. In particular, each second housing 20 may be mounted on the motherboard 16 so as to be movable back and forth (towards and away from) each HHGD 19, thereby varying the internal volume of each enclosure 27, as will be described in detail with reference to Figures 8 to 10. With reference to Figure 8, each enclosure 27, and in particular the second housing 20, may comprise a control valve 40 electronically controllable by the control unit 33 to regulate the flow of liquid 18 into each enclosure 27 (and each HHGD 19). Conventionally, each device 19 mounted on the electronic device 16 comprises a processor body, a thermal interface material, a heat spreader, a second thermal interface material, and a heat sink. Since it is advantageous to minimize such thermal junctions, in accordance with the present apparatus and system, each HHGD 19 may comprise a microprocessor, a thermal interface material, and a series of heat spreading fins 41 extending upward from the microprocessor / thermal interface material into the enclosure 27. When the microprocessor is operating at its maximum processing speed, i.e., at its maximum operating temperature, the valve 40 may be controlled to a fully open position to maximize the flow rate of liquid between the inlet and outlet conduits 38,35.

[0057] The configurations of Figures 9 and 10 may represent alternative configurations to the valve control configuration of Figure 8, or may be combinations of such embodiments, and may include corresponding control valves 40 (not shown in Figures 9 and 10) optionally attached to the inlet conduit 38 and / or the outlet conduit 35. With reference to Figures 9 and 10, an electronically controllable actuator 42 is connected to the second housing 20, which is adjustably attached to the device via another support or via the actuator 42 alone. This allows each second housing 20 to reciprocate relative to each HHGD 19. In the minimum volume position of Figure 9, the second housing 20 is located in the closest position to the HHGD 19. In this position, the dielectric liquid 18 is forced to distribute between the fins 41 for maximum thermal energy exchange with the HHGD 19. According to the position of Figure 10, the second housing 20 is raised via the actuator 42. In this position, the liquid 18 may flow around the fins 41, not necessarily between them, to reduce thermal energy exchange with the HHGD 19 (lower process rate, i.e. less heat generation). Each actuator 42 is connected to a control unit 33 (shown in FIG. 4) and provides local or remote control of the flow rate in direct contact with the HHGD 19 in direct response to the operating state of each HHGD 19 (microprocessor), in particular the respective operating temperature. Such a configuration is advantageous not only for maximizing the thermal energy transfer from the LHGD 17 and HHGD 19 to the liquid 18, but also for regulating the liquid delivered to the heat exchanger 26 to a constant temperature.

[0058] The apparatus, whether embodied as an immersion cooling bath of FIG. 1 or a support rack of FIG. 2, may include one or more liquid flow weir structures. Weir structures may be provided at or toward the inlet of the chamber 28 and / or each enclosure 27 and / or each outlet of the chamber 28 and / or each enclosure 27. The tray configuration of FIG. 11 may be particularly adapted for the rack embodiment of FIG. 2, in which the electronic device 16 may be at least partially housed therein and disposed within an inner recess 14b relative to a partial annulus surrounding the outer recess 14a. The recesses 14a, 14b are separated by a number of partition weir walls 46c extending upwardly from the base 43a. The outer recess 14a is further defined by a number of outer tray walls 43b also extending upwardly from the base 43a. The height of the wall 43c is preferably configured to be slightly lower than the outer wall 43b so that when liquid 18 is delivered to the outer well 14a via the inlet 22, the liquid will overflow through the weir structure (over the dividing weir wall 43c) from the outer well 14a to the inner well 14b, thereby allowing the liquid 18 to exit the tray 14 via the outlet 23.

[0059] Figures 12a, b and c show different weir structure configurations to control the flow of liquid into the inner recess 14b. Figure 12a shows the structure of Figure 11, where liquid 18a in the outer recess 14a moves through the weir structure 44 to liquid 18b in the inner recess 14b. According to the embodiment of Figure 12b, each partition wall 45 separates the outer recess 14a from the inner recess 14b and includes at least one port 45a that allows liquid 18a in the outer recess 14a to flow directly to the inner recess 14b (liquid 18b) in addition to flowing over the partition wall 45. Figure 12c shows a siphon effect weir structure. In this embodiment, a siphon flange 46 extends to about the top of the partition wall 46c and defines a weir flow conduit between each outer recess 14a and the inner recess 14b, providing a flow path based on a suction siphon. Each tray 14, housing an electronic device 16 each having devices 17 and 19, can be removably stored in rack 13 via rails 71 that engage corresponding runners (not shown) provided laterally on each tray 14.

[0060] Fig. 13 shows a further embodiment of the cooling device implemented as part of an immersion cooling bath configuration. The chamber 28 corresponds to the main chamber 12 of the bath 10 (Fig. 1) which supports multiple electronic devices arranged in parallel and suspended / submerged in the cooling liquid 18. As shown, the electronic devices 16 may comprise a set of multiple HHGDs 19 arranged and separated according to their respective operating temperatures, in particular their respective maximum operating temperatures. In particular, a first set 19a is arranged towards the inlet 48 and a second set 19b is arranged downstream in the flow direction, further away from the inlet 48 than the first set 19a. The first set 19a is provided in liquid flow communication with the second set 19b via respective ports 36, and the first set 19a is provided in fluid communication with the inlet 48 via port 34. Each HHGD 19 of the first and second sets 19a, 19b is separated from the main chamber 28 via a respective second housing 20, which is optionally adjustably mounted via the configuration of Figs. 8 to 10 with a controllable flow of cooling liquid. The first housing 15 is configured to receive cooling liquid via the inlet 22, which according to the configuration of Fig. 13 is provided with a plenum 47 that distributes / spreads the incoming liquid flow evenly within the chamber 28. The first housing 15 is provided with at least one corresponding weir structure 44 located at the upper end of the basin 10, i.e., configured to allow the cooling liquid to overflow into at least one temporary storage reservoir 49 as a liquid holding vessel 50. A gravity return manifold 25 provides fluid communication between the holding vessel 50 and the inlet 48. The apparatus also includes an outlet flow conduit network 52 that provides fluid communication from the set of HHGDs 19a, 19b to the heat exchanger 26 via an intermediate control valve 51. The heat exchanger 26 may include a pump 31 as an integral component, or the apparatus may include additional pumps at various locations in the liquid flow network. The heat exchanger 26 includes an internal heat transfer coil 54 connected to a working fluid network 72 configured to receive thermal energy from the dielectric cooling liquid 18. The heated working fluid (within network 72) may be delivered (as a heat source) to an auxiliary or complementary component 53, such as a data center in which the system may be implemented.In operation, dielectric liquid is first introduced into chamber 28 via inlet 22 and plenum 47 and flows upward (within chamber 28) against gravity towards weir 44. During this path, liquid 18 flows in direct contact with LHGDs 17 and partially heated / warmed liquid overflows into holding vessel 50. The warmed liquid is then returned to inlet 48 via manifold 25 and directed to first set 19a of HHGDs 19 for second stage heat transfer. The flow to each HHGD 19 in first set 19a is in parallel. The flow then continues via serial flow from first set 19a to second set 19b. Again, the flow in each HHGD 19 in second set 19b is also in parallel. Thus, the system is configured to serially deliver dielectric liquid 18 through a three stage heat transfer process including a first stage transfer through LHGD 17, a second stage transfer through first set 19a of HHGDs 19, and a third stage transfer through second set 19b of HHGDs 19. The liquid is then fed to heat exchanger 26 via pump 31 (and control valve 51) and recirculated to chamber 28 via return manifold 24.

[0061] The encapsulation and partitioning of each HHGD 19 relative to the other HHGDs 19 and LHGDs 17 increases the temperature difference of the dielectric liquid initially fed to the vessel 10 (at the inlet 22) relative to the heated liquid fed to the heat exchange device 26. Additionally, the system is adapted to maximize energy efficiency through automated or semi-automated dynamic response via the control unit 33 (FIG. 4), various sensors 30, control valves 40 and / or actuators 42 to operate between minimum and maximum operating temperatures based on the operating condition, i.e., processing rate, of each HHGD 19. Single or various operating characteristics / conditions (i.e., temperature, power generation, processing rate, etc.) of each LHDG and HHGD can be monitored and / or provided and utilized in real time by the system to control the cooling liquid 18 in various different areas of the circuit (e.g., adjusting the liquid flow rate).

[0062] Figures 14 through 19 show further exemplary embodiments of circulating cooling liquid networks forming part of the present apparatus and systems embodied as either an immersion cooling bath 10 (Figure 1) or a storage rack 13 (Figure 2). The configurations of Figures 14 through 19 are configured to further actuate and control the flow of fluid via additional reservoirs and / or pressurized tanks in different regions of the system, where the dielectric cooling liquid can be temporarily stored and its temperature and / or pressure regulated as part of the circulation within the network.

[0063] 14, the cooling liquid network includes an inlet manifold 24, a heat exchanger 26, a second return manifold 58, a gravity return manifold 25, a reservoir 56 (including a storage container for liquid 57), a pump 31, a dip tank or rack, and / or a tray structure (provided in fluid communication between manifolds 24 and 25). According to a specific embodiment, a weir structure 44 is provided at the inlet end of chamber 28 to regulate the flow of cooling liquid to electronic device 16. LHGD 17 is at least partially immersed in the cooling liquid for a first thermal energy transfer. The cooling liquid is then discharged via outlet valve 61 to second weir structure 44, which provides fluid communication to gravity return manifold 25. The liquid is then transferred to reservoir 56 (buffer storage) and returned to heat exchanger 26 via manifold 58 before proceeding to inlet manifold 24 as cooling liquid. The liquid flow into the inlet 22 is redirected through junction valve 74 into each enclosure 27 for direct contact with the HHGD 19. The flow out of the enclosures 27 is then directed into conduit 21 between outlet flow valves 60 which connect in fluid communication to the gravity return manifold 25 to join the liquid from valve 61. The liquid in the circuit of FIG. 14 may be pressurized or at atmospheric pressure. The system includes a control unit 33 (not shown) and associated sensors (not shown) as described herein to provide a real-time dynamic response liquid cooling system for the advantages described herein.

[0064] FIG. 15 is a simplified embodiment of the configuration of FIG. 14, with substantially similar configuration and function, including manifolds 24, 55, 58, reservoir 56, pump 31 and heat exchanger 26. According to the embodiment of FIG. 15, electronic device 16 is accommodated in chamber 28, which has inlet and outlet 22, 23 providing direct flow between each manifold 24, 55. The serial flow on LHGD 17 and HHGD 19 is as described with reference to the embodiment of FIG. 3. A further embodiment, which is a modification of the embodiment of FIG. 15, is shown in FIG. 16. A pressurized vessel 59 is provided instead of reservoir 59, and an inlet flow weir structure 44 is provided at the inlet 22 of first housing 15. A further embodiment is shown in FIG. 17, in which a storage reservoir 56 is connected downstream of return manifold 55, which is connected to outlet valve 61 of chamber 28 via outlet weir structure 44. Outlet valve 61 is configured to receive warm liquid that has been partially heated by LHGD 17. Outlet valve 60 is configured to receive fully heated liquid from HHGD 19 for subsequent delivery to manifold 58 and transfer to heat exchanger 26. As shown, the partially warmed liquid (from outlet valve 61) is transferred through manifold 55, reservoir 56 and pump 31 and delivered to each blocked HHGD 19 via multi-stage serial thermal energy exchange (from initial stage heating by LHGD 17).

[0065] Figure 18 shows a further embodiment of a cooling liquid network similar to the arrangement of Figure 17. The first stage heating outlet valve 61 is connected to a first return manifold 55a which is linked to a supply storage reservoir 56. The second return manifold 55b is connected to a second stage heating outlet valve 60. The outflow from the manifold 55b is transferred to a manifold 58 and subsequent heat exchanger 26 via a connected pump 31 for delivery to the manifold 24. Also, a reservoir 56 is connected upstream of the pump 31, where the cooling liquid flows from the valves 61, 60 join and flow into the return manifold 58 for heat transfer in the heat exchanger 26. Figure 19 shows yet another embodiment and variant of the arrangement of Figure 16, this one with a weir structure 44 at the inlet 22 and also a second weir structure 44 at the outlet 23 for delivery of the flow towards the return manifold 25 provided in fluid communication with the storage reservoir 56. The embodiment of FIG. 19 also includes, in liquid flow communication, a pump 31, a manifold 58, a heat exchanger 26 and an inlet manifold 24 as described with reference to FIG.

Claims

1. A liquid cooling device for electronic devices: A first housing defining a chamber for housing at least one electronic device having at least one heat-generating electronic component; The housing includes at least one liquid inlet and at least one liquid outlet, which allow a flow of dielectric cooling liquid to enter and exit the chamber in direct contact with the electronic device; A second housing is located within a chamber defining an enclosure that at least partially houses at least one heat-generating electronic component of the device, wherein the first housing is an immersion tank, the second housing is smaller in size than the first housing and located within the chamber, and the chamber is connected in series with the enclosure in fluid communication; The second housing includes at least one liquid inlet and at least one liquid outlet, which allow the liquid flow to enter and exit the enclosure in direct contact with the heat-generating electronic component; and A cooling unit connected in fluid communication to at least one of the inlets and at least one of the outlets, the cooling unit forming part of a fluid flow network for transferring thermal energy from the liquid; At least one first thermoelectric electronic component at least partially housed within the chamber for immersion in the liquid within the chamber, and at least one second thermoelectric electronic component at least partially housed within the enclosure for immersion in the liquid within the enclosure, wherein the second thermoelectric electronic component is positioned to be in direct contact with the liquid within the enclosure defined by the second housing, and the first thermoelectric electronic component is positioned to be in direct contact with the liquid within the chamber, and the second thermoelectric electronic component has a higher operating temperature than the first thermoelectric electronic component; and A dielectric cooling liquid stored in the chamber of the first housing, wherein the second housing is at least partially or completely immersed in the liquid in the chamber of the first housing. A device equipped with the following features.

2. The apparatus according to claim 1, wherein at least one outlet of the first housing is connected in fluid communication to at least one inlet of the second housing, such that the liquid flows through the chamber and then through the enclosure.

3. The apparatus according to claim 1 or 2, wherein at least one outlet of the second housing is connected to the inlet of the cooling unit in fluid communication, and the outlet of the cooling unit is connected to the at least one inlet of the first housing in fluid communication.

4. At least one electronically controlled valve provided in fluid communication with at least one of the inlets and / or outlets of the first housing and / or the second housing; and A control unit that controls the valve and controls the flow of the liquid entering and leaving the first housing and / or the second housing via the respective inlets and outlets. The apparatus according to claim 1, further comprising the following:

5. The apparatus according to claim 4, wherein the control unit is configured to control the flow of the liquid through the chamber to perform a first thermal energy exchange with the first heat-generating electronic component, and then to control the flow of the liquid through the enclosure to perform a second thermal energy exchange with the second heat-generating electronic component, and the second thermal energy exchange is auxiliary and additional to the first thermal energy exchange, so that the temperature rise of the liquid at the outlet of the enclosure is the sum of the temperature rises of the liquid that have passed through the chamber and the enclosure.

6. The aforementioned electronic device: • Computer unit; ·server; Motherboard; • Printed circuit board consisting of multiple electronic components Equipped with any of these, or a combination thereof, The first heat-generating electronic component and / or the second heat-generating electronic component: Motherboard; Random access memory (RAM); Graphics processing unit (GPU); • Central Processing Unit (CPU) The apparatus according to claim 1, comprising any one of the above, or a combination thereof.

7. The apparatus according to claim 1, wherein the entrance of the second housing is defined by at least the outer circumference of an opening in the enclosure that allows the second housing to be positioned to receive and enclose the heat-generating electronic component.

8. A temperature sensor for measuring the temperature or relative temperature difference between the liquid and / or the heat-generating electronic component, comprising at least one temperature sensor provided to communicate electronically with the control unit, and / or The apparatus according to claim 1, wherein the electronic device or the first and / or second heat-generating electronic component includes a temperature sensor for measuring the temperature or temperature difference between the liquid and the first and / or second heat-generating electronic component.

9. The apparatus according to claim 1, further comprising a liquid return conduit connected in fluid communication to the outlet of the chamber and the inlet of the enclosure, for circulating the liquid that leaves the chamber and enters the enclosure.

10. The apparatus according to claim 9, wherein the inlet of the chamber is provided with a plenum for distributing the flow of the liquid into the chamber.

11. The apparatus according to claim 9 or 10, wherein the outlet of the first housing is connected to the inlet of the cooling unit in fluid communication, and the outlet of the cooling unit is connected to the inlet of the second housing in fluid communication.

12. The apparatus according to claim 1, comprising a plurality of second housings, each having an inlet and an outlet, each connected to the cooling unit in fluid communication.

13. The apparatus according to claim 12, wherein at least some of the second housings are connected in series with one another as part of a liquid flow network including the cooling unit.

14. The apparatus according to claim 12 or 13, wherein at least some of the second housings are connected in parallel to one another as part of a liquid flow network including the cooling unit.

15. The apparatus according to claim 1, further comprising a dielectric cooling liquid stored in the chamber and capable of flowing through the enclosure.

16. An apparatus according to claim 15, wherein at least a portion of the electronic device and / or at least a portion of the first heat-generating electronic component is disposed in the chamber so as to be immersed in direct contact with the liquid in the chamber, and at least a portion of the at least one second heat-generating electronic component is disposed in the enclosure so as to be immersed in direct contact with the liquid in the enclosure.

17. A method for cooling at least a portion of an electronic device: Immersing an electronic device having at least one heat-generating electronic component in a dielectric coolant stored in a chamber defined by a first housing; Immersing the heat-generating electronic component in the liquid within an enclosure defined by a second housing positioned within the chamber; The first housing comprises an immersion tank, and the second housing is smaller in size than the first housing and is positioned within the chamber; The chamber is connected to the enclosure in series via fluid communication; To provide a first flow of the liquid through the chamber via at least one inlet and at least one outlet provided in the first housing; To provide a second flow of the liquid through the enclosure via at least one inlet and at least one outlet provided in the second housing; The second heat-generating electronic component includes a higher operating temperature than the first heat-generating electronic component. Cooling the liquid heated by the electronic device and / or the heat-generating electronic component using a cooling device that forms part of a fluid flow network connected via fluid communication to at least one inlet and at least one outlet, Methods that include...

18. The electronic device comprises a plurality of enclosures defined by each second housing that encloses each heat-generating electronic component provided in the aforementioned electronic device; Here, the plurality of enclosures are arranged in series with respect to the fluid flow; and The method according to claim 17, wherein each of the heat-generating electronic components has substantially the same operating temperature, or has different operating temperatures in an order of increasing operating temperature, and is arranged in each second housing, thereby configuring a flow through each enclosure in which the liquid comes into contact with each of the heat-generating electronic components in series from a relatively low operating temperature to a high operating temperature.

19. The method according to claim 17 or 18, wherein the flow of the liquid is configured from the outlet of the chamber to the inlet of the enclosure via a return flow conduit, and then the flow of the liquid is configured from at least one outlet of the enclosure to a fluid flow network including the cooling unit.

20. The method according to claim 17, comprising controlling the flow of the liquid so that it flows along a first channel through the chamber in direct contact with at least a portion of the first thermoelectric electronic component, and then flows along a second channel through the enclosure in direct contact with at least a portion of the second thermoelectric electronic component, such that the thermal energy transferred to the liquid is the sum of the thermal energy transferred to the liquid from the first thermoelectric electronic component and the second thermoelectric electronic component.

21. The method according to claim 17 or 18, wherein the electronic device comprises a plurality of first heat-generating electronic components, each immersed in the liquid, and a plurality of second housings defining each enclosure for housing the heat-generating electronic components.

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