Liquid Cooling Device for Encapsulation Cooling of On-Board High-Heat-Generation Electronic Components

Abstract

A liquid cooling device and system for liquid immersion cooling of an electronic device, particularly including servers and other IT hardware nodes, having an array of heat generating devices including microprocessors, RAM, motherboards, etc., each having a different operating temperature. The device and system are adapted for partitioned liquid cooling of a plurality of heat generating electronic components, with at least some of the electronic components being spatially isolated from other components for individual cooling by a dielectric liquid. This multi-stage heat transfer to the isolated cooling fluid improves the energy efficiency and operating performance of the electronic device.

Description

Technical Field

[0001] The idea of the present invention relates to a liquid cooling system for the effective and efficient cooling of heat-generating electronic components, and more particularly, but not limited thereto, to a liquid cooling system that cools IT components, servers, computer electronic devices, etc. by directly immersing them in a dielectric liquid coolant.

Background Art

[0002] The cooling of electronic devices, particularly IT components, servers, data storage, and computer electronic devices having graphics and central processing units (GPUs and CPUs), is a major technical challenge for the continuous development of smaller, faster, higher-density, and larger-capacity electronic devices.

[0003] Computing devices generate heat as a byproduct of operation processing. In data centers where thousands of such devices are deployed, the amount of heat generated can be extremely large. As the need for more processing and access to data storage continues to grow, the density of server systems continues to increase, and thus the heat-related problems to be solved are realistically looming large.

[0004] Conventional fan-based cooling systems require a large amount of power. Therefore, the power demand to drive such systems increases significantly with the increasing density of servers. Immersion cooling of IT components is a relatively recent development. During operation, high-heat electronic devices are in direct contact with a circulating and cooled dielectric (electrically insulating) cooling liquid using a heat exchanger or the like. When the electronic devices are cooled, their performance efficiency is improved, enabling high-speed processing (e.g., overclocking operation of a CPU). The heat generated in the circuit is directly and rapidly removed by the dielectric liquid at the heat source. However, there is a general need for continuous improvement in the operating efficiency of existing immersion cooling systems with respect to both the effectiveness of cooling of electronic components and the thermal management and circulation of the cooling liquid for efficient energy reuse.

Summary of the Invention

Problems to be Solved by the Invention

[0005] An object of the present invention is to provide an apparatus and method for precise and efficient liquid cooling of electronic devices. Specifically, it is an object to provide a liquid cooling system for electronic components that enables IT components and the like to operate at high temperatures. A more specific object is to provide a cooling system that maximizes the operating temperature of the dielectric liquid by heat transfer with the electronic components for subsequent energy reuse. A further specific object is to provide a system that provides an outflow of the dielectric liquid at a uniform / constant temperature (after heat transfer with the electronic components). Such a configuration maximizes the efficiency and effectiveness of heat energy transfer in an appropriate heat exchanger or the like for heat energy reuse.

Means for Solving the Problems

[0006] The system provides a liquid immersion / immersion configuration in which IT electronic components are spatially partitioned / isolated based on their operating temperature and effective power consumption. In particular, the system is configured to cool the electronic components via direct contact and circulation with a refrigerant liquid, and provides a single liquid cooling system for cooling each electronic component on demand, individually and / or independently of each other, depending on the operating performance, type, operating temperature, size and / or configuration of the electronic components.

[0007] References herein to "electronic components", "electronic devices" or the like include heat-generating electronic components attached to larger IT components / devices such as, for example, servers, motherboards, data storage devices, programmable logic controller boards. Such heat-generating electronic components include, for example, random access memory (RAM); graphics processing unit (GPU); central processing unit (CPU); chips, sockets; peripheral component interconnect (PCI); slots; read only memory (ROM) components; chips and slots; graphics processing components, ports, slots, chips; electronic bridges; battery components, ports and slots; power plugs, slots and ports, electronic connectors; electronic heat sinks; switches; jumpers; capacitors; transistors; diodes; operating power-related components; current and / or voltage regulators and modules; power converters, etc., which are circuits and / or electronic components on a motherboard or other printed circuit board device.

[0008] The system is configured to deliver a cooling liquid to a heat-generating electronic device based on the typical, standard, average, and / or maximum operating temperature for various different liquid flow circuit configurations that may exist. For example, the system is compatible with series, parallel, and / or a combination of series and parallel liquid flow configurations based on the spatial location of the electronic components according to the typical, standard, average, and / or maximum operating temperature. Thereby, the system provides a liquid flow that exits at a maximum outlet temperature and at a constant / uniform temperature over time. Then, this heated dielectric liquid is efficiently and effectively processed by transferring thermal energy to a secondary application or device that requires a temporary or continuous supply of thermal energy from the dielectric liquid via a heat exchanger or the like for heat reuse.

[0009] The outflow of the dielectric liquid heated to a maximum and uniform operating temperature (over time) provides an efficient and effective heat source for heat reuse technology. This is achieved by the spatial partitioning / isolation of the heat-generating devices based on their respective operating temperatures. In particular, at least one, especially a set of first heat-generating electronic components, may be partitioned and arranged within a first region or chamber of the device for the first contact with the dielectric liquid. At least one second component, or a set of further heat-generating electronic components (having a higher operating temperature than the first electronic device), may be arranged in an isolated or partitioned region (or enclosure) of the system / device for separation and / or subsequent contact with the dielectric liquid. With such a configuration, the dielectric liquid can flow in direct contact with the first heat-generating electronic component and then the second heat-generating electronic component, and as a result, the outlet temperature of the dielectric liquid in the outlet region of the device is the sum of the temperature rises of the liquid that has passed in contact with the electronic components in all spatially isolated regions.

[0010] In one aspect, the system includes a capsule (or cover) that can be arranged to store (at least partially) an electronic device such as a CPU / GPU. This capsule may be installed on or above the chip (e.g., using cold plate technology), regardless of the presence or absence of a heat sink. And a coolant is configured to flow through each capsule region to capture all the heat generated by the electronic device. With such a configuration, the electronic device (CPU / GPU) can operate at its optimal or typical operating temperature, while at the same time, for improved energy reuse, the temperature at which the coolant liquid flows out can be made as high as possible and uniform over time.

[0011] In one aspect, the system has immersed heat-generating devices isolated according to their operating temperature ranges, such that all of them contact different portions of the cooling fluid within a fluid container at a given time. The fluid within the container is driven towards a cooling device where it is cooled to a state where it can be driven back into the container, thereby effectively cooling the heat-generating devices immersed in series. The fluid may be driven through the system in such a way that it first contacts the isolated heat-generating device having the lowest operating temperature. Next, the partially heated fluid is then driven to contact the next set of isolated heat-generating devices having the second lowest operating temperature, where its temperature may further increase. This is repeated until the set of isolated heat-generating devices having the maximum operating temperature contacts the dielectric liquid, and the dielectric liquid is then driven towards the cooling device (i.e., heat exchanger).

[0012] According to a first aspect of the present invention, a liquid cooling device for an electronic device comprises: a housing defining a chamber at least partially accommodating at least a part of at least one electronic device having at least one heat-generating electronic component; at least one cover at least partially within the chamber and positionable over the heat-generating electronic component, the cover comprising at least one inlet enabling a dielectric cooling liquid to enter an enclosure in direct contact with the heat-generating electronic component, and at least one outlet enabling the liquid to exit the enclosure; and at least one cooling unit fluidly connected to at least one of the at least one inlet and the at least one outlet, the cooling unit receiving the liquid from at least one of the at least one outlet and delivering the liquid to at least one inlet.

[0013] Preferably, the electronic device has at least one first heat-generating electronic component at least partially accommodated within the chamber for immersion in the liquid within the chamber; and at least one second heat-generating electronic component at least partially accommodated within the enclosure for immersion in the liquid within the enclosure. Optionally, the second heat-generating electronic component may or does have a higher operating temperature than the first heat-generating electronic component.

[0014] References to a first heat-generating electronic component herein include relatively low heat-generating devices / components (LHGDs) such as, for example, RAM, motherboards, etc. Similarly, references to a second heat-generating electronic component herein include relatively high heat-generating devices (HHGDs) such as, for example, microprocessors, CPUs, GPUs, etc. The first and second heat-generating electronic components are herein distinguished relatively by their typical, standard, average and / or maximum operating temperatures. This is the thermal energy generated by such devices during use and / or as detailed in electronic component datasheets, databases, etc. Thus, generally, low heat-generating components / devices include lower typical, standard, average and / or maximum operating temperatures than high heat-generating components / devices. In a specific embodiment, the low heat-generating component / device may be configured to generate heat under standard or typical operation of less than 200W. In a more specific embodiment, the high heat-generating component / device may be configured to generate heat under standard or typical operation of more than 200W. However, such values are provided for guidance only, and those skilled in the art will understand that this 200W value applied here to LGHDs and HHGDs will vary in specification depending on the type of electronic component.

[0015] Optionally, the device comprises at least one inlet provided in the housing to allow the liquid to enter the chamber and / or at least one outlet provided in the housing to allow the liquid to exit the chamber. Optionally, the inlet of the cover is defined by at least the outer periphery of an opening that enables the cover to be positioned to receive and enclose the heat-generating electronic component in the enclosure. Optionally, the inlet and the outlet of the cover are separated from each other and / or are arranged in different regions of the cover. Optionally, the cover comprises an opening that enables the cover to receive and enclose the heat-generating electronic component in the enclosure, and a roof portion located on the opposite side of the opening. Optionally, the inlet or the outlet of the cover may be located on the roof portion of the cover. Optionally, the inlet or the outlet of the cover is partially defined by the outer periphery of the opening. Optionally, the inlet or the outlet of the cover is partially defined by a gap or region between the outer periphery of the electronic component and a region immediately inside the outer periphery of the enclosure. Such a gap region may be annular so that the flow of the liquid to and / or from the enclosure occurs through the space / gap between the electronic component and the wall or body of the cover. Optionally, the device comprises an actuator connected to the cover, the actuator being configured to move the cover towards and away from the housing and / or the heat-generating electronic component. The actuator may be an electronic actuator, a magnetic actuator, a pneumatic or hydraulic actuator, or a combination including an electromagnetic or electromechanical actuator that is controlled locally or remotely via a control unit.

[0016] Optionally, the cover is adjustably attached to the device via an actuator, and its operation changes any one of or a combination of: the internal volume of the enclosure; the position of the enclosure relative to the housing and / or the heat-generating electronic component; the separation distance between the cover and the heat-generating electronic component; the degree to which the cover encapsulates or houses the heat-generating electronic component within the enclosure. Preferably, the cover is configured to move back and forth relative to the electronic component so as to adjust the separation distance between the inner surface of the cover and the outer surface of the electronic component.

[0017] Optionally, at least one outlet of the chamber is fluidly connected in fluid communication to at least one inlet of the enclosure such that the liquid flows through the chamber and then through the enclosure. Optionally, at least one outlet of the enclosure is fluidly connected in fluid communication to an inlet of the cooling unit, and an outlet of the cooling unit is fluidly connected in fluid communication to at least one inlet of the chamber.

[0018] Preferably, the chamber is fluidly connected in series with the enclosure. According to the present invention, the device may comprise one or more chambers and one or more enclosures. Preferably, the device comprises a plurality of enclosures disposed within the chamber. The plurality of enclosures may be arranged in series and / or in parallel with each other. Thereby, the liquid may be configured to flow through the chamber along a first flow path, then flow serially through at least one enclosure via a second flow path, and then flow through a further enclosure connected in series with the first enclosure. Each enclosure may comprise the same or different heat-generating electronic components having the same or different operating temperatures. When the enclosures are connected in parallel, the supply of liquid may be split / branched into separate flows that flow into each of the parallel enclosures. Then, the separated parallel flows may merge into a single flow after flowing through the enclosures (in the direction of fluid flow).

[0019] Preferably, the apparatus further comprises a pump fluidly connected to the inlet and / or the outlet of the cover for driving the flow of the liquid through the enclosure. Preferably, the apparatus comprises at least one electronically controlled valve provided in fluid communication with the inlet and / or the outlet of the cover.

[0020] Preferably, the apparatus further comprises a control unit for controlling the valve and controlling the flow of the liquid entering and leaving the enclosure through the inlet and the outlet. Optionally, the control unit is configured to control the flow of the liquid through the chamber for performing a first heat energy exchange with the first heat-generating electronic component, and then control the flow of the liquid through the enclosure for performing a second heat energy exchange with the second heat-generating electronic component, wherein the second heat energy exchange is auxiliary and additional to the first heat energy exchange, so that the temperature rise of the liquid at the outlet of the enclosure is the sum of the temperature rises of the liquid passing through the chamber and the enclosure. The control unit may comprise one or more electronic control units, modules or devices including a programmable logic controller (PLC), a remote telemetry unit (RTU), a microprocessor, a server, a printed circuit board, a motherboard or other similar devices. The control unit may comprise sensors including at least one flow rate, temperature, proximity, motion, current, voltage, pH and / or magnet sensor. The control unit may comprise at least one control valve including solenoid valves, diaphragm valves, pilot-operated multi-way valves and combinations thereof. The control unit may be disposed locally or remotely with respect to the system and the apparatus for local and / or remote control of the apparatus. The control unit may operate via a cloud network, a wireless or wired communication path and associated components.

[0021] Optionally, the apparatus comprises a weir structure provided in fluid communication with the inlet and / or the outlet of the housing and / or the cover. Optionally, the apparatus comprises a first weir structure provided in fluid communication with the inlet and / or the outlet of the cover. Optionally, the apparatus may comprise a second weir structure provided in fluid communication with the inlet and / or the outlet of the housing. The reference to "weir structure" herein includes at least one opening, partition wall, flow restrictor, etc. configured to at least partially separate a first volume of liquid from a second volume of liquid such that the liquid flows from the first volume to the second volume through a restricted flow path in the weir structure. Such a structure includes an overflow or through-flow structure. Optionally, the weir structure may provide an overflow or through-flow under gravity.

[0022] Optionally, the apparatus comprises a plurality of covers each having an inlet and an outlet fluidly connected to the cooling unit. Optionally, the covers are arranged or connected in series with each other as part of a liquid flow network including the cooling unit. Optionally, at least some of the covers are connected in parallel with each other as part of a liquid flow network including the cooling unit.

[0023] Optionally, the cooling unit comprises a heat exchanger for removing thermal energy from the liquid. Optionally, the heat exchanger comprises a refrigerant fluid configured to circulate in a fluid circuit or network separated from the dielectric liquid and a dielectric liquid network configured to flow through the chamber and the enclosure. These exchanges enable the transfer of thermal energy between the dielectric liquid and the refrigerant fluid, particularly the transfer of thermal energy from the dielectric liquid to the refrigerant working fluid. The dielectric cooling liquid may be any liquid type suitable for liquid immersion cooling of IT components having suitable electrical insulation properties to provide safe direct contact with energized electronic components, and importantly, having no liquid conductivity.

[0024] Optionally, the apparatus comprises at least one storage reservoir fluidly connected to the chamber, supplying and / or receiving the liquid in the chamber, and maintaining the liquid in the chamber at a predetermined volume. Optionally, the apparatus may comprise at least one main storage reservoir fluidly connected to at least one of the inlet and outlet of the enclosure / cover and storing the liquid as part of a fluid flow network. Optionally, the main storage reservoir comprises a pressurizing mechanism for changing the pressure of the liquid in the fluid flow network. Optionally, the pressurizing mechanism comprises at least one electronic control valve for controlling the volume of the liquid in the main storage reservoir and / or in the fluid flow network.

[0025] Optionally, the electronic device comprises any one of a computer main body, a server, a motherboard, a printed circuit board composed of a plurality of electronic components, or a combination thereof. Optionally, the heat-generating electronic components comprise any one of a motherboard, a random access memory (RAM), a graphics processing unit (GPU), a central processing unit (CPU), or a combination thereof.

[0026] Optionally, the dielectric cooling liquid is stored in the chamber and can flow through the enclosure. Optionally, at least a part of the electronic device and / or at least a part of the first heat-generating electronic component are arranged in the chamber so as to be in direct contact with the liquid in the chamber, and at least a part of the second heat-generating electronic component is arranged in the enclosure so as to be in direct contact with the liquid in the enclosure.

[0027] Optionally, the electronic device and / or the first heat-generating electronic component are at least partially immersed in the liquid in the chamber, and the second heat-generating electronic component is at least partially immersed or completely immersed in the liquid in the enclosure.

[0028] Optionally, the apparatus comprises at least one sensor. Optionally, the at least one sensor may comprise at least one flow rate, temperature, proximity, motion, current, voltage, pH and / or magnetic sensor. Optionally, the apparatus may further comprise a temperature sensor for measuring the temperature or temperature difference of the liquid and the heat-generating electronic component within the enclosure. Optionally, the electronic device or the first and / or second heat-generating electronic component comprises at least one temperature sensor for measuring the temperature or temperature difference of the liquid and the first and / or second heat-generating electronic component. Optionally, this (these) temperature sensor(s) may communicate electronically with the control unit. Optionally, the electronic device of the first and / or second heat-generating electronic component may comprise a temperature sensor for measuring the temperature or temperature difference of the liquid and the first and / or second heat-generating electronic component.

[0029] Optionally, at least one outlet of the enclosure is fluidly connected to an inlet of the cooling unit, and an outlet of the cooling unit is fluidly connected to at least one inlet of the chamber. Optionally, the chamber is fluidly connected in series with the enclosure. Optionally, the housing comprises a liquid immersion tank, and the cover is smaller in size than the housing and is disposed within the chamber.

[0030] Optionally, the housing is larger than the cover such that the chamber houses the enclosure. The housing may comprise an immersion tank or bath, and the cover may comprise a partition / separated liquid flow enabling cover, shroud, container, pocket or sub-chamber that houses different heat-generating electronic components spatially partitioned with respect to the larger housing and contacts different (sets of) electronic devices.

[0031] Optionally, the apparatus comprises a control unit configured to control the flow of the liquid through the chamber for a first heat energy exchange with the first heat-generating electronic component, and then to control the flow of the liquid through the enclosure for a second heat energy exchange with the second heat-generating electronic component, the second heat energy exchange being auxiliary and additional to the first heat energy exchange such that the temperature rise of the liquid at the outlet of the enclosure is the sum of the temperature rises of the liquid passing through the chamber and the enclosure.

[0032] According to a further aspect of the invention, there is provided a method of cooling a heat-generating electronic component of an electronic device, the method comprising: at least partially housing an electronic device having at least one heat-generating electronic component within a chamber defined by a housing; disposing a cover over the heat-generating electronic component to define an enclosure that houses the heat-generating electronic component, the cover being provided with at least one liquid inlet and at least one liquid outlet; providing a flow of a dielectric cooling liquid within the enclosure between the at least one inlet and the at least one outlet, the liquid being in direct contact with the heat-generating electronic component so as to receive heat energy directly from the heat-generating electronic component; and using a cooling device forming part of a fluid flow network fluidly connected to the at least one inlet and / or the at least one outlet to cool the liquid heated by the heat-generating electronic component.

[0033] Optionally, the method includes providing a flow of the liquid through the chamber via at least one liquid inlet and at least one liquid outlet of the housing, the electronic device being at least partially immersed in the liquid within the chamber.

[0034] Optionally, providing a flow of the liquid through the chamber via at least one liquid inlet and at least one liquid outlet of the housing, wherein the electronic device is at least partially immersed in the liquid within the chamber. Optionally, the electronic device comprises at least one first heat-generating electronic component and a second heat-generating electronic component that can have, or has, an operating temperature higher than that of the first heat-generating electronic component, and the second heat-generating electronic component is arranged to be in direct contact with the liquid within the enclosure defined by the cover, and the first heat-generating electronic component is arranged to be in direct contact with the liquid within the chamber.

[0035] Optionally, the chamber is fluidly connected in series with the enclosure such that the liquid flows through the chamber and then through the enclosure.

[0036] Optionally, the method controls the flow of the liquid through the chamber to effect a first heat energy exchange with the first heat-generating electronic component, and then controls the flow of the liquid through the enclosure to effect a second heat energy exchange with the second heat-generating electronic component, and the second heat energy exchange is auxiliary and additional to the first heat energy exchange such that the temperature rise of the liquid at the outlet of the enclosure is the sum of the temperature rises of the liquid passing through the chamber and then through the enclosure.

[0037] Optionally, a flow of the liquid from the outlet of the chamber to the inlet of the enclosure is configured via a return conduit, and then a flow of the liquid from at least one outlet of the enclosure to a fluid flow network including the cooling unit is configured. Optionally, the flow of the liquid within the enclosure is supplied from the liquid within the chamber via the inlet of the cover. Optionally, the flow of the liquid within the enclosure is supplied from the fluid flow network via the inlet of the cover.

[0038] Optionally, the method includes providing a serial flow of the liquid through a plurality of enclosures defined by respective covers that each surround a respective heat-generating electronic component provided in the electronic device, where the respective heat-generating electronic components have substantially the same operating temperature or different operating temperatures in increasing order of operating temperature and are disposed within the respective covers such that the liquid contacts the respective heat-generating electronic components in series from a relatively low operating temperature to a high operating temperature to constitute a flow through the respective covers.

[0039] Optionally, the method includes providing a parallel flow of the liquid through a plurality of enclosures defined by respective covers that each surround a respective heat-generating electronic component provided in the electronic device.

[0040] According to a further aspect of the invention, there is provided a liquid immersion cooling tank for cooling an electronic device having at least one heat-generating electronic component, the apparatus as described and claimed herein; and an electronic device having at least one heat-generating electronic component immersed in a dielectric coolant stored within the housing.

[0041] Optionally, the liquid immersion cooling tank comprises a plurality of electronic devices each having at least one heat-generating electronic component, and the devices and the heat-generating electronic components are each at least partially immersed in the liquid stored within the chamber and the respective enclosures.

[0042] Optionally, the immersion cooling tank includes at least one housing that defines the chamber for housing the electronic device; and a plurality of covers disposed within the chamber that define respective enclosures for at least partially housing each of the heat-generating electronic components of the device; wherein the device is immersed in the liquid stored within the chamber and the heat-generating electronic components are immersed in the liquid stored within the respective enclosures.

[0043] According to a further aspect of the invention, there is provided an electronic device rack for storing an electronic device, each having a heat-generating electronic component, the apparatus described and claimed herein; and an electronic device having at least one heat-generating electronic component and at least partially attached to the rack via the housing; the heat-generating electronic component being at least partially immersed in the dielectric cooling liquid within the enclosure defined by the cover.

[0044] Optionally, the rack may include a plurality of electronic devices, each having at least one heat-generating electronic component. Optionally, the rack includes a plurality of housings that define respective chambers for housing each of the electronic devices; and a plurality of covers that define enclosures and are respectively disposed within the chambers for housing the at least one heat-generating electronic component; wherein the plurality of electronic devices are immersed in the liquid stored within the respective chambers and the at least one heat-generating electronic component is immersed in the liquid stored within the respective enclosures.

Brief Description of the Drawings

[0045] Here, specific embodiments of the present invention will be described by way of example only with reference to the accompanying drawings.

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DETAILED DESCRIPTION OF THE INVENTION

[0046] This segmented coolant system seeks to maximize energy efficiency within a circulating coolant network through the isolated / partitioned delivery of the working fluid. The working fluid is delivered to an array of on-board heat-generating devices (typically microprocessors) sorted by maximum or typical operating temperatures. In particular, the system provides a multi-stage series coolant circulation network, and the dielectric coolant is delivered through a first flow path in direct contact with at least one heat-generating device having a relatively low maximum operating temperature, and then flows through a second flow path in direct contact with at least one or more heat-generating devices (arranged in substantially the same location as the low heat-generating devices). Thereby, the transfer of thermal energy from the low heat-generating devices and subsequent high heat-generating devices is made in series as a multi-stage heat transfer process. This configuration maximizes the temperature change of the circulating coolant. The system of the present invention can be implemented either in a liquid immersion cooling tank or even in a conventional IT hardware node rack.

[0047] Referring to FIG. 1, the immersion cooling tank 10 includes an internal chamber 12 for accommodating a plurality of IT hardware nodes 11 (such as servers). Each IT hardware node may include relatively low-heat generating components (such as RAM, motherboards, etc.) and relatively high-heat generating devices (such as microprocessors) that may themselves have different maximum operating temperatures, in the form of an array of different heat generating devices (HGDs) of on-board electronic components. FIG. 2 shows an alternative configuration for attaching the IT hardware node 11 in the form of a support rack 13, in which the IT hardware node 11 is attached within a substantially upright frame 70. Each tray 14 is attached to a plurality of horizontal rails 71, and each tray accommodates at least one IT hardware node 11, whereby an array of nodes 11 is attached to each other in a perpendicular direction in the rack 13.

[0048] Referring to FIG. 3, the system includes a housing 15 that defines an internal chamber 28 for storing a dielectric cooling liquid 18. The housing 15 is sized to accommodate an electronic device such as a motherboard 16 that mounts a plurality of electronic components, particularly a plurality of low heat generating devices 17 (LHGDs) and a plurality of high heat generating devices 19 (HHGDs). FIG. 3 schematically shows a single LHGD 17 and HHGD 19, and respective single covers 20. However, it will be understood that the apparatus includes a plurality of such components. A plurality of second housings (or covers) 20 are disposed for each HHGD 19. A conduit 21 provides fluid communication between an outlet port 23 of the housing 15 and respective enclosures 27 defined by each cover 20. Each cover 20 includes an opening 37 having a cross-sectional area larger than the size / cross-sectional area of each HHGD 19. Thus, at least a portion of each HHGD 19 can be received or contained within each enclosure 27 defined by each cover 20 disposed for each HHGD 19. Thus, each opening 37 is in a position to contact or substantially contact the motherboard 16 in the region immediately surrounding each HHGD 19. The housing 15 also includes an inlet 22 at an end opposite to the outlet 23 respectively. An inlet manifold 24 is fluidly connected in communication between the inlet 22 and a heat exchanger 26 having an outlet 26a and an inlet 26b respectively. A corresponding return manifold 25 provides fluid communication between the housing outlet 23 and the heat exchanger inlet 26b. Thus, the dielectric cooling liquid is configured to circulate through the chamber 28 and in direct contact with the LHGDs 17 and HHGDs 19 (via the inlet 22 and outlet 23), the heat exchanger 26, and the manifolds 25 and 24. The heat exchanger 26 includes an internal heat coil, and the internal heat coil has an associated working fluid configuration or other similar configuration that transfers energy from the dielectric cooling liquid received at the inlet 26b such that the temperature of the liquid outflow at the outlet 26a is lower than the temperature of the liquid flowing in (via the inlet 26b).

[0049] According to the series isolation liquid immersion cooling of each LHGD17 and HHGD19, the temperature difference of the liquid at the outlet 23 and the inlet 22 is maximized, thereby maximizing the energy efficiency of this configuration. In particular, according to the configuration of FIG. 3, the cooling liquid enters the chamber 28 through the inlet 22, and then the liquid contacts the LHGD17 to perform the first energy exchange, thereby slightly increasing the temperature of the dielectric liquid. The partially heated liquid is drawn into the enclosure 27 through each opening 37 by the suction force. The liquid stored in each cover 20 undergoes a second stage of energy exchange with the HHGD19 that operates at a much higher temperature than the LHGD17. Therefore, the already heated liquid is further heated to its maximum operating temperature. Thereafter, the fluid flows out from the enclosure 27 (and the chamber 28) and is delivered to the heat exchanger 26 through the outlet 23 and the return manifold 25. When the dielectric liquid is cooled in the heat exchanger 26, it is then recirculated to the inlet 22 through the inlet manifold 24, and the cycle is repeated.

[0050] According to various embodiments described herein, the apparatus and system include a control unit, a sensor, and an electronically controllable fluid flow valve to control and regulate the flow rate of the dielectric liquid flowing through various regions of the apparatus and to maximize energy efficiency, particularly the desired thermal energy exchange with the LHGD17 and HHGD19. The control unit may include a programmable logic controller (PLC), a remote terminal unit (RTU), a microprocessor, and / or a motherboard, etc. The sensor may include a flow rate, temperature, proximity, motion, current, voltage, pH, and / or magnetic sensor. The control valve may include a solenoid valve, a diaphragm valve, or other electromagnetic valves, for example, those of direct acting, pilot operated, two-way, three-way, four-way valve and their combination types. The system and apparatus can be controlled locally and / or remotely via a cloud network and may be configured to monitor various operating characteristics of the system and apparatus locally or remotely, including the operating performance of the electronic components and / or the dielectric cooling fluid.

[0051] Referring to FIG. 4, in addition to supplying the cooling liquid to the heat exchanger at a constant temperature, the present apparatus is configured to achieve a maximum temperature change of the dielectric cooling liquid (supplied in direct contact with a plurality of LHGDs 17 and HHGDs 19). Such a configuration maximizes the operating performance of the heat exchanger and the present system. According to the configuration of FIG. 4, the inlet manifold 24 provides fluid communication between a plurality of LHGDs 17 and a plurality of spatially separated HHGDs 19 (all of which are mounted on-board an IT hardware node). Each HHGD 19 is at least partially encapsulated by each cover 20 (FIG. 3). In particular, the incoming cooling liquid is split via the inlet conduit 24a to provide a parallel liquid flow to each of the enclosures 27 housing each HHGD 19. The heated fluid then exits each enclosure 27 via conduit 21. The flow control valve 29 is electronically connected to the control unit 23, which also includes appropriate sensors (not shown) and monitors at least one operating characteristic in the region of each HHGD 19 and / or enclosure 27, including in particular the flow rate, temperature and / or temperature change of the cooling liquid in each HHGD 19. The flow from conduit 21 converges via the outlet conduit 25a and is configured to provide a single flow to the return manifold 25. A temperature sensor 30 (electronically connected to the control unit 33) is provided in the manifold 25. The pump 31 drives the flow of liquid through this circuit, in particular towards the heat exchanger 26 in direct contact with the LHGDs 17 and HHGDs 19. The inlet manifold 24 provides a flow returning from the heat exchanger 26 to the LHGDs 17 for the first stage of heat energy exchange before flowing to the HHGDs 19.

[0052] Referring to FIG. 5, a specific embodiment of the flow paths at LHGD17 and HHGD19 will be described. The cooling liquid 18 within the housing 15 is supplied in direct contact with the LHGD17 for the first stage of heat transfer. The partially heated liquid then flows out through the outlet 61 of the housing 15. This partially heated fluid is then returned to the inlet 22 via the return manifold. The liquid is then split for further heat energy exchange with the LHGD17, but at the same time is transferred via the conduit 38 to the covers 20 disposed for each HHGD19. The partially heated liquid enters the enclosure 27 through each inlet 34, flows in direct contact with each HHGD19, and exits the enclosure 27 through each outlet 35. Thereby, the dielectric liquid is heated to its maximum operating temperature. The outlet conduit 39 provides fluid communication between each enclosure 27 (defined by the cover 20) and a single combined outlet conduit 21, which is then provided in fluid communication with the heat exchanger 26. In the embodiment of FIG. 5, the dielectric liquid is delivered via each conduit 38, particularly to reach the enclosure 27.

[0053] A modification of the embodiment of FIG. 5 is shown in FIG. 6. In this configuration, the dielectric liquid 18 within the housing 15 undergoes the first stage of heat transfer with the LHGD17. The partially warmed liquid is then drawn into each enclosure 27 through each inlet port 34 that is at least partially immersed in the liquid 18 in which the electronic device 16 is immersed (within the chamber 28). The liquid then undergoes a second stage of heat energy exchange with the HHGD19 before flowing out to the heat exchanger 26. The configuration of FIG. 6 operates in series with respect to the first stage of heat energy transfer with the initial LHGD17, and then performs a second stage of heat energy transfer with the subsequent HHGD19 by isolating / partitioning the HHGD19 from the LHGD17 via the cover 20 and various cooling liquid flow paths.

[0054] Referring to FIG. 7, according to one embodiment, each cover 20 includes an opening 37 that allows the HHGD 19 to be enclosed within and at least partially received within the inner enclosure 27. The dielectric coolant liquid 18 is drawn through a suction pump 31 (FIG. 4) and flows into the enclosure 27, passing in direct contact with and circulating through the HHGD 19 within the enclosure 27 that is locally partitioned for heat energy transfer between the HHGD 19 and the liquid 18. Each HHGD 19 mounted on the motherboard 16 has various operating characteristics in normal use, including in particular processing requirements and the resulting heat energy output. The system is adapted to adjust the supply of the coolant liquid by an automatic or semi-automatic response operation aimed at delivering the operating liquid heated to a maximum operating temperature and a constant temperature to the heat exchanger as needed. This flow control (and temperature adjustment of the dielectric liquid 18) is achieved via a control unit 33 and the cover 20 that is adjustably attached. In particular, each cover 20 may be attached to the motherboard 16 so as to be movable back and forth (towards and away from) each HHGD 19 to vary the internal volume of each enclosure 27, as will be described in detail with reference to FIGS. 8 to 10. Referring to FIG. 8, each enclosure 27, in particular the cover 20, may include a control valve 40 that can be electronically controlled by the control unit 33 to regulate the flow of the liquid 18 to each enclosure 27 (and each HHGD 19). Conventionally, each device 19 mounted on the electronic device 16 includes a processor body, a thermal interface material, a heat spreader, a second thermal interface material, and a heat sink. Since it is advantageous to minimize such thermal joints, according to the present apparatus and system, each HHGD 19 may include a microprocessor, a thermal interface material, and a series of heat dissipation fins 41 that extend upward into the enclosure 27 from the microprocessor / thermal interface material. When the microprocessor operates at its maximum processing speed, i.e., at its maximum operating temperature, the valve 40 may be controlled to the fully open position to maximize the flow rate of the liquid between the inlet and outlet conduits 38, 35.

[0055] The configurations of FIGS. 9 and 10 may represent alternative configurations to the valve control configuration of FIG. 8, or may be combinations of such embodiments, and may optionally include corresponding control valves 40 (not shown in FIGS. 9 and 10) optionally attached to the inlet conduit 38 and / or the outlet conduit 35. Referring to FIGS. 9 and 10, an electronically controllable actuator 42 is connected to the cover 20, which is adjustably attached to the device via another support or via the actuator 42 alone. Thereby, each cover 20 is capable of reciprocating movement relative to each HHGD 19. In the minimum volume position of FIG. 9, the cover 20 is positioned closest to the HHGD 19. In this position, the dielectric liquid 18 is forced between the fins 41 for maximum thermal energy exchange with the HHGD 19. According to the position of FIG. 10, the cover 20 is raised via the actuator 42. In this position, the liquid 18 may flow around the fins 41 rather than necessarily between the fins 41 to reduce the thermal energy exchange with the HHGD 19 (lower processing speed, i.e., less heat generation). Each actuator 42 is connected to the control unit 33 (shown in FIG. 4) and provides local or remote control of the flow rate that responds directly to the operating state of each HHGD 19 (microprocessor), particularly each operating temperature, and is in direct contact with the HHGD 19. Such a configuration is advantageous not only for maximizing the thermal energy transfer from the LHGD 17 and HHGD 19 to the liquid 18, but also for adjusting the temperature of the liquid delivered to the heat exchanger 26 to a constant temperature.

[0056] The apparatus, implemented as either the immersion cooling tank of FIG. 1 or the support rack of FIG. 2, may include one or more liquid flow weir structures. The weir structures may be provided at, or directed towards, the inlets of the chamber 28 and / or each enclosure 27, and / or the outlets of the chamber 28 and / or each enclosure 27. The configuration of the tray of FIG. 11 may be particularly adapted to the rack embodiment of FIG. 2, in which case the electronic device 16 may be disposed within the inner recess 14b with respect to a partial annulus that at least partially houses therein and surrounds the outer recess 14a. The recesses 14a, 14b are partitioned by a plurality of partition weir walls 46c extending upwardly from the base 43a. The outer recess 14a is further defined by a plurality of outer tray walls 43b extending upwardly from the base 43a as well. The height of the wall 43c is preferably configured to be slightly lower than the outer wall 43b such that when the liquid 18 is delivered to the outer recess 14a via the inlet 22, the liquid overflows from the outer recess 14a to the inner recess 14b via the weir structure (over the partition weir wall 43c). Thereby, the liquid 18 can flow out of the tray 14 via the outlet 23.

[0057] FIGS. 12a, b, and c show configurations of different weir structures that control the flow of liquid into the inner recess 14b. FIG. 12a shows the structure of FIG. 11, where the liquid 18a in the outer recess 14a moves to the liquid 18b in the inner recess 14b via the weir structure 44. According to the embodiment of FIG. 12b, each partition wall 45 separates the outer recess 14a from the inner recess 14b and includes at least one port 45a that allows the liquid 18a in the outer recess 14a to flow directly into the inner recess 14b (liquid 18b) in addition to the flow over the partition wall 45. FIG. 12c shows a weir structure with a siphon effect. In this embodiment, the siphon flange 46 extends up to the upper end of the partition wall 46c, defining a weir flow conduit between each outer recess 14a and the inner recess 14b and providing a flow path based on a suction siphon. Each tray 14 that houses the electronic devices 16 each having devices 17 and 19 can be removably stored in the rack 13 via rails 71 that engage corresponding runners (not shown) provided laterally on each tray 14.

[0058] Figure 13 shows a further embodiment of the present cooling device implemented as part of the configuration of the immersion cooling tank. Chamber 28 corresponds to main chamber 12 of tank 10 (Figure 1) that supports a plurality of electronic devices suspended / immersed in cooling liquid 18 and arranged in parallel. As shown, electronic device 16 may comprise a plurality of sets of HHGDs 19 that are arranged and separated by each operating temperature, particularly each maximum operating temperature. In particular, the first set 19a is arranged towards inlet 48, and the second set 19b is arranged downstream in the flow direction away from inlet 48 relative to the first set 19a. The first set 19a is provided in liquid flow communication with the second set 19b via each port 36, and the first set 19a is provided in fluid communication with inlet 48 via port 34. Each HHGD 19 of the first and second sets 19a, 19b is partitioned from main chamber 28 via each cover 20, and each cover is optionally and adjustably attached via the configuration of Figures 8 to 10 having a controllable flow of cooling liquid. Housing 15 is configured such that cooling liquid flows in via inlet 22, and according to the configuration of Figure 13, a plenum 47 is provided at inlet 22 to evenly distribute / diffuse the incoming liquid flow into chamber 28. Housing 15 comprises at least one corresponding weir structure 44 located at the upper end of tank 10. That is, the cooling liquid is configured to overflow into at least one temporary storage reservoir 49 as liquid holding container 50. Gravity return manifold 25 provides fluid communication between holding container 50 and inlet 48. The apparatus also comprises an outlet flow conduit network 52 that provides fluid communication from sets 19a, 19b of HHGDs to heat exchanger 26 via intermediate control valve 51. Heat exchanger 26 can comprise pump 31 as an integral component, or the apparatus may comprise additional pumps at various positions within the liquid flow network. Heat exchanger 26 comprises an internal heat transfer coil 54 connected to an operating fluid network 72 configured to receive thermal energy from dielectric cooling liquid 18. The heated operating fluid (within network 72) may be delivered (as a heat source) to auxiliary or complementary components 53 such as a data center where the present system may be implemented.During operation, the dielectric liquid is first introduced into chamber 28 via inlet 22 and plenum 47 and flows upward (within chamber 28) against gravity toward weir 44. During this path, liquid 18 flows in direct contact with LHGD 17, and the partially heated / warmed liquid overflows into holding container 50. The warmed liquid is then returned to inlet 48 via manifold 25 and is sent directly to the first set 19a of HHGD 19 for the second stage of heat transfer. The flow to each HHGD 19 within the first set 19a is made in parallel. The flow then continues via a series flow from the first set 19a to the second set 19b. Again, the flow in each HHGD 19 within the second set 19b is also made in parallel. Thus, the system is configured to serially deliver dielectric liquid 18 by a three-stage heat transfer process that includes first-stage transfer at LHGD 17, second-stage transfer at the first set 19a of HHGD 19, and third-stage transfer at the second set 19b of HHGD 19. The liquid is then supplied to heat exchanger 26 via pump 31 (and control valve 51) and is recirculated to chamber 28 via return manifold 24.

[0059] Encapsulating each HHGD 19 and partitioning it from the other HHGD 19s and LHGD 17 increases the temperature difference of the dielectric liquid supplied to tank 10 initially (at inlet 22) with respect to the heated liquid supplied to heat exchange device 26. Further, the system is adapted to maximize energy efficiency via an automated or semi-automated dynamic response that operates between the minimum and maximum operating temperatures based on the operating state of each HHGD 19, i.e., the processing speed, via control unit 33 (FIG. 4), various sensors 30, control valve 40, and / or actuator 42. The single or various operating characteristics / states (i.e., temperature, power generation, processing speed, etc.) of each LHDG and HHGD can be monitored and / or supplied and utilized in real time by the system to control cooling liquid 18 in various different regions of the circuit (e.g., adjustment of liquid flow rate).

[0060] Figures 14 to 19 show further specific embodiments of the circulating cooling liquid network forming part of the present apparatus and system implemented as either the immersion cooling tank 10 (Figure 1) or the storage rack 13 (Figure 2). The configurations of Figures 14 to 19 are configured to further actuate control of the fluid flow via additional reservoirs and / or pressure tanks in different regions of the system, where a dielectric cooling liquid can be temporarily stored and its temperature and / or pressure adjusted as part of the circulation within the network.

[0061] Referring to Figure 14, the cooling liquid network comprises any of an inlet manifold 24, a heat exchanger 26, a second return manifold 58, a gravity return manifold 25, a reservoir 56 (including a storage container for liquid 57), a pump 31, an immersion tank or rack, and a tray structure (provided by fluid communication between manifolds 24 and 25). According to a specific embodiment, a weir structure 44 is provided at the inlet end of the chamber 28 to regulate the flow of cooling liquid to the electronic device 16. The LHGD 17 is at least partially immersed in the cooling liquid for the first heat energy transfer. The cooling liquid then flows out through an outlet valve 61 to a second weir structure 44 that provides fluid communication to the gravity return manifold 25. The liquid is then transferred to the reservoir 56 (buffer storage), returned to the heat exchanger 26 via the manifold 58, and then proceeds to the inlet manifold 24 as the cooling liquid. The flow of liquid to the inlet 22 is redirected via a junction valve 74 and flows into each enclosure 27 to come into direct contact with the HHGD 19. The flow exiting the enclosure 27 is then directed to a conduit 21 between outlet flow valves 60 that are in fluid communication and connected to the gravity return manifold 25 to merge with the liquid from the valve 61. The liquid in the circuit of Figure 14 may be pressurized or at atmospheric pressure. The system comprises a control unit 33 (not shown) and associated sensors (not shown) as described herein to provide a real-time dynamic response liquid cooling system for the advantages described herein.

[0062] FIG. 15 is a more simplified embodiment of the configuration of FIG. 14 and includes a manifold 24, 55, 58, a reservoir 56, a pump 31, and a heat exchanger 26, and has a substantially similar configuration and function. According to the embodiment of FIG. 15, the electronic device 16 is housed in the chamber 28, and the chamber 28 has an inlet and an outlet 22, 23 that provide a direct flow between each of the manifolds 24, 55. The serial flow on the LHGD 17 and the HHGD 19 is as described with reference to the embodiment of FIG. 3. A further embodiment, which is a variation of the embodiment of FIG. 15, is shown in FIG. 16. A pressurized vessel 59 is provided in place of the reservoir 59, and an inlet flow weir structure 44 is provided at the inlet 22 of the housing 15. A further embodiment is shown in FIG. 17, where the storage reservoir 56 is connected downstream of the return manifold 55, and the return manifold 55 is connected to the outlet valve 61 of the chamber 28 via an outlet weir structure 44. The outlet valve 61 is configured to receive the warm liquid partially heated by the LHGD 17. The outlet valve 60 is configured to receive the sufficiently heated liquid from the HHGD 19 for subsequent supply to the manifold 58 and transfer to the heat exchanger 26. As shown, the partially warmed liquid (from the outlet valve 61) is transferred through the manifold 55, the reservoir 56, and the pump 31 and delivered to the closed HHGD 19 via a multi-stage serial heat energy exchange (from the initial stage heating by the LHGD 17).

[0063] FIG. 18 shows a further embodiment of a coolant network similar to the configuration of FIG. 17. The first stage heating outlet valve 61 is connected to a first return manifold 55a that is connected to the supply storage reservoir 56. The second return manifold 55b is connected to the second stage heating outlet valve 60. The outflow from manifold 55b is transferred via the connected pump 31 to manifold 58 and thence to heat exchanger 26 and delivered to manifold 24. Also, reservoir 56 is connected upstream of pump 31 and the flows of coolant from valves 61, 60 merge and enter return manifold 58 for heat transfer in heat exchanger 26. FIG. 19 shows yet another embodiment and variation of the configuration of FIG. 16, in which an inlet weir structure 44 and also a second weir structure 44 at the outlet 23 are provided for delivery of the flow towards a return manifold 25 provided in fluid communication with the storage reservoir 56. The embodiment of FIG. 19 also comprises a pump 31, a manifold 58, a heat exchanger 26 and an inlet manifold 24 connected in liquid flow communication as described with reference to FIG. 16.

Claims

1. A liquid cooling device for electronic devices: A housing defining a chamber that partially houses at least one electronic device having at least one heat-generating electronic component; at least one inlet provided in the housing to allow a liquid to enter the chamber; and at least one outlet provided in the housing to allow the liquid to exit the chamber; At least one cover located at least partially within the chamber and positionable over the heat-generating electronic component, comprising at least one inlet allowing a dielectric cooling liquid to enter an enclosure in direct contact with the heat-generating electronic component, and at least one outlet allowing the liquid to exit the enclosure, wherein the cover comprises an opening that allows the enclosure to receive and enclose the heat-generating electronic component; A cooling unit comprising at least one cooling unit connected in fluid communication to at least one of the inlets and at least one of the outlets, the cooling unit receiving the liquid from at least one of the outlets and delivering the liquid to at least one inlet; An apparatus in which at least one outlet of the enclosure is connected in fluid communication to the inlet of the cooling unit, and the outlet of the cooling unit is connected in fluid communication to at least one inlet of the chamber.

2. At least one first thermoelectric component, at least partially housed within the chamber for immersion in the liquid within the chamber; and At least one second heat-generating electronic component, at least partially housed within the enclosure, to be immersed in the liquid within the enclosure. The apparatus according to claim 1, comprising an electronic device having the following:

3. The apparatus according to claim 2, wherein the second heat-generating electronic component is capable of or has a higher operating temperature than the first heat-generating electronic component.

4. The apparatus according to claim 1, wherein the entrance of the cover is defined by at least the outer circumference of the opening in the enclosure, which allows the cover to be positioned to receive and enclose the heat-generating electronic component.

5. The apparatus according to claim 1, wherein the inlet and outlet of the cover are separated from each other and / or located in different regions of the cover.

6. The cover is adjustablely attached to the device via an actuator, and its operation: - Internal volume of the enclosure; - The position of the enclosure relative to the housing and / or the heat-generating electronic component; - The separation distance between the cover and the heat-generating electronic component; - The degree to which the cover encapsulates or houses the heat-generating electronic components within the enclosure. The apparatus according to claim 1, which varies any one of these, or a combination thereof.

7. The apparatus according to claim 1, wherein at least one outlet of the chamber is connected in fluid communication to at least one inlet of the enclosure, such that the liquid flows through the chamber and then through the enclosure.

8. The apparatus according to claim 1, wherein the chamber is connected to the enclosure in series via fluid communication.

9. At least one electronically controlled valve provided in fluid communication with the inlet and / or outlet of the cover, and The system includes a control unit that controls the valve and controls the flow of the liquid entering and leaving the enclosure via the inlet and outlet, The apparatus according to claim 1, wherein the control unit is configured to control the flow of the liquid through the chamber to perform a first thermal energy exchange with the first heat-generating electronic component, and then to control the flow of the liquid through the enclosure to perform a second thermal energy exchange with the second heat-generating electronic component, and the second thermal energy exchange is auxiliary and additional to the first thermal energy exchange, so that the temperature rise of the liquid at the outlet of the enclosure is the sum of the temperature rises of the liquid that have passed through the chamber and the enclosure.

10. The apparatus according to claim 1, comprising a plurality of covers, each having an inlet and an outlet, which are connected to the cooling unit in fluid communication.

11. The apparatus according to claim 10, wherein at least some of the covers are connected in series with one another as part of a liquid flow network including the cooling unit.

12. The apparatus according to claim 10 or 11, wherein at least some of the covers are connected in parallel to one another as part of a liquid flow network including the cooling unit.

13. The aforementioned electronic device: • Computer unit; ·server; Motherboard; • Printed circuit board consisting of multiple electronic components The apparatus according to claim 1, comprising any one of the above, or a combination thereof.

14. The chamber contains a dielectric cooling liquid that can flow through the enclosure, At least a portion of the electronic device and / or at least a portion of the first heat-generating electronic component is disposed within the chamber so as to be in direct contact with the liquid in the chamber, and at least a portion of the second heat-generating electronic component is disposed within the enclosure so as to be in direct contact with the liquid in the enclosure, The apparatus according to claim 1, wherein the electronic device and / or the first heat-generating electronic component is at least partially immersed in the liquid in the chamber, and the second heat-generating electronic component is at least partially or completely immersed in the liquid in the enclosure.

15. The at least one outlet of the enclosure is connected to the inlet of the cooling unit in fluid communication, and the outlet of the cooling unit is connected to the at least one inlet of the chamber in fluid communication. The apparatus according to claim 1, wherein the chamber is connected to the enclosure in series via fluid communication.

16. The apparatus according to claim 1, wherein the housing comprises an immersion tank, and the cover is smaller in size than the housing and is positioned inside the chamber.

17. A method for cooling heat-generating electronic components of an electronic device: To at least partially house an electronic device having at least one heat-generating electronic component within a chamber defined by a housing, wherein the housing has at least one inlet provided in the housing to allow a liquid to enter the chamber and at least one outlet provided in the housing to allow the liquid to exit the chamber; A cover is positioned over a heat-generating electronic component to define an enclosure for housing the heat-generating electronic component, wherein the cover is provided with at least one liquid inlet and at least one liquid outlet, and the cover comprises an opening that allows the heat-generating electronic component to be received and enclosed in the enclosure, and a roof portion located opposite the opening; To provide a flow of dielectric cooling liquid within the enclosure between the at least one inlet and the at least one outlet, the liquid being in direct contact with the heat-generating electronic component so as to receive thermal energy directly from the heat-generating electronic component; and Cooling the liquid heated by the exothermic electronic component using a cooling device that forms part of a fluid flow network connected in fluid communication to at least one inlet and / or at least one outlet; A method wherein at least one outlet of the enclosure is connected in fluid communication to the inlet of the cooling unit, and the outlet of the cooling unit is connected in fluid communication to at least one inlet of the chamber.

18. The method according to claim 17, wherein the electronic device comprises at least one first thermoelectric electronic component and a second thermoelectric electronic component capable of or having a higher operating temperature than the first thermoelectric electronic component, wherein the second thermoelectric electronic component is arranged to be in direct contact with the liquid in an enclosure defined by the cover, and the first thermoelectric electronic component is arranged to be in direct contact with the liquid in the chamber.

19. The method according to claim 17 or 18, wherein the chamber is connected in series with the enclosure in fluid communication such that the liquid flows through the chamber and then through the enclosure.

20. The method according to claim 19, wherein the flow of the liquid through the chamber is controlled to perform a first thermal energy exchange with the first heat-generating electronic component, and then the flow of the liquid through the enclosure is controlled to perform a second thermal energy exchange with the second heat-generating electronic component, and the second thermal energy exchange is auxiliary and additional to the first thermal energy exchange, such that the temperature rise of the liquid at the outlet of the enclosure is the sum of the temperature rises of the liquid that have passed through the chamber and then the enclosure.

21. The method according to claim 17, wherein the flow of the liquid is configured from the outlet of the chamber to the inlet of the enclosure via a return flow conduit, and then the flow of the liquid is configured from at least one outlet of the enclosure to a fluid flow network including the cooling unit.

22. An immersion cooling tank for cooling a plurality of electronic devices, each having at least one heat-generating electronic component, as described in claim 1; and The system comprises multiple electronic devices, each having at least one heat-generating electronic component. A liquid immersion cooler in which the device and the heat-generating electronic component are at least partially immersed in the liquid stored in the chamber and each of the enclosures, respectively.

23. At least one housing defining the chamber for housing the electronic device; and The device comprises a plurality of covers disposed within the chambers defining each enclosure that at least partially houses each of the heat-generating electronic components of the device; The immersion cooling tank according to claim 22, wherein the device is immersed in the liquid stored in the chamber, and the heat-generating electronic components are immersed in the liquid stored in each of the enclosures.

24. An electronic device rack for housing electronic devices, each having a heat-generating electronic component, as described in claim 1; and A plurality of electronic devices, each having at least one heat-generating electronic component, are mounted at least partially to the rack via the housing; An electronic device rack in which the heat-generating electronic component is at least partially immersed in the dielectric cooling liquid within the enclosure defined by the cover.

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