Module kit for chemical and / or electrolytic surface treatment of substrates

Abstract

The present invention relates to a modular kit for chemical and / or electrolytic surface treatment of a substrate, a platform assembly comprising the modular kit, a method for chemical and / or electrolytic surface treatment of a substrate, and the use of the modular kit. The modular kit includes a process chamber, a first replaceable dispensing unit for dispensing a first liquid onto the substrate, and a second replaceable dispensing unit for supplying a second liquid onto the substrate. The process chamber is sized to receive either the first replaceable dispensing unit or the second replaceable dispensing unit. Each of the first replaceable dispensing unit and the second replaceable dispensing unit is sized to receive the substrate. The process chamber includes a kit interface for supplying the first liquid or the second liquid. The first replaceable dispensing unit includes a first inlet interface for the first liquid. The second replaceable dispensing unit includes a second inlet interface for the second liquid. The kit interface, the first inlet interface, and the second inlet interface are configured to cooperate interchangeably between the kit interface and the first inlet interface or between the kit interface and the second inlet interface.

Description

Technical Field

[0001] The present invention relates to a modular kit for chemical and / or electrolytic surface treatment of substrates, a platform assembly comprising the modular kit, a method for chemical and / or electrolytic surface treatment of substrates, and the use of the modular kit.

Background Art

[0002] Many industrial manufacturing processes - particularly complex semiconductor manufacturing lines - require a highly flexible process apparatus that can meet specific process requirements in a quick and uncomplicated manner. Such adjustments are preferably feasible without making major hardware changes to the apparatus.

[0003] However, conventional modular processing apparatuses - particularly apparatuses for manufacturing semiconductor devices from silicon wafers by enabling a plurality of apparatuses composed of a plurality of independent processing modules in a plurality of track and / or branch configurations - cannot quickly adjust the processing configuration based on the process requirements of individual substrates.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Therefore, there is a need to provide an improved substrate processing system including the design of a common interface that enables quick and reliable adaptation of the processing environment for individual substrates.

Means for Solving the Problems

[0005] This problem is solved by the subject matter of the independent claims of the present invention. Other embodiments are included in the dependent claims. It should be noted that the aspects of the present disclosure described hereinafter are applicable to a modular kit for chemical and / or electrolytic surface treatment of substrates, a platform assembly comprising the modular kit, a method for chemical and / or electrolytic surface treatment of substrates, and the use of the modular kit.

[0006] According to the present invention, a modular kit for chemical and / or electrolytic surface treatment of a substrate is provided. The modular kit includes a process chamber, a first replaceable dispensing unit for dispensing a first liquid onto the substrate, and a second replaceable dispensing unit for supplying a second liquid onto the substrate. The process chamber is sized to receive either the first replaceable dispensing unit or the second replaceable dispensing unit. Each of the first replaceable dispensing unit and the second replaceable dispensing unit is sized to receive the substrate. The process chamber includes a kit interface for supplying the first liquid or the second liquid. The first replaceable dispensing unit includes a first inlet interface for the first liquid. The second replaceable dispensing unit includes a second inlet interface for the second liquid. The kit interface, the first inlet interface, and the second inlet interface are configured to cooperate interchangeably between the kit interface and the first inlet interface or between the kit interface and the second inlet interface.

[0007] The modular kit according to the present invention enables a highly flexible design of a replaceable process chamber. In other words, the modular kit may enable easy adjustment of the replaceable dispensing unit inside the process chamber based on the requirements of the substrate treatment. Furthermore, the modular kit may be optimized for minimum space without adjusting the connection of the liquid supply and discharge ports. Since the interface between the process chamber and the replaceable dispensing unit can be standardized, quick and easy chamber changes can be achieved without adjusting the interface between the process chamber and the replaceable dispensing unit.

[0008] The module kit can be adapted to form a module structure of a plurality of module kits. The module kit can be configured to perform chemical surface treatment and / or electrolytic surface treatment. Wet processing - for example, the chemical surface treatment and / or electrolytic surface treatment - can enable high chemical selectivity achievable by various process liquids (such as acids, bases, oxidants, etc.) or the above-mentioned simple or complex mixtures. In addition, the wet processing enables an essential simplification of the processing, scale adjustment of the process to various types of substrates having various sizes, and low-cost operation.

[0009] The chemical and / or electrolytic surface treatment of the substrate may be any material deposition, zinc plating coating, chemical or electrochemical etching, cleaning, removal, anodic or pure chemical oxidation, metal separation process, etc. The substrate may include a conductor plate, a semiconductor substrate, a film substrate, an essentially planar metal or semi-metal workpiece. At least one substrate is held by a substrate holder and can be immersed in the process chamber for the surface treatment.

[0010] The substrate holder can be configured to hold one or more substrates. Alternatively, two separate substrate holders for fixing two separate substrates can be inserted into the process chamber simultaneously through the lid unit and the opening of the process chamber, or removed from the process chamber. The process chamber can be configured to receive or release the substrate holder parallel to the insertion direction of inserting the exchangeable distribution unit into the process chamber. The two substrates to be processed in the process chamber may have the same size and / or the same shape. However, the two substrates to be processed may have different sizes and / or different shapes.

[0011] The process chamber may be a module. This means that a plurality of process chambers can be interconnected to provide a highly reliable substrate processing system. The process chamber may include materials compatible with the process chemicals - namely, the first liquid and the second liquid - and the required process conditions. The materials may be PFA (perfluoroalkoxy alkane), quartz, PP (polypropylene), PE (polyethylene), Ta (tantalum), etc.

[0012] The process chamber may be sized such that individual processing of a plurality of substrates can be appropriately performed with respect to the size and / or shape of the plurality of substrates. The process chamber may be configured to hold a process fluid and / or an electrolyte applied to the surface treatment. The process fluid and / or the electrolyte may be individually selected to be suitable for the intended use and / or the expected result of the surface treatment.

[0013] Thus, the process chamber may have a common design designed to enable a highly flexible surface treatment of the substrate. Individual substrate processing in the common process chamber can be achieved by changing the replaceable dispensing unit. In other words, the process chamber may be configured to receive one of a variety of replaceable dispensing units suitable for the intended substrate processing.

[0014] In addition to the substrate to be processed, the process chamber may be configured to receive one of the first replaceable dispensing unit and the second replaceable dispensing unit. The first replaceable dispensing unit may be configured to supply the first liquid inside the process chamber, and the second replaceable dispensing unit may be configured to supply the second liquid inside the process chamber. The first liquid and the second liquid may be the same or different from each other. The first liquid and / or the second liquid may be a process fluid, a rinse fluid, and / or an electrolyte used for the surface treatment of the substrate.

[0015] The substrate processed by the first liquid may be different from the substrate processed by the second liquid. Alternatively, the same substrate may first be processed by the first liquid and then by the second liquid. Also, the same substrate may first be processed by the first liquid and then processed by the second liquid without replacing the replaceable dispensing unit.

[0016] Preferably, the first replaceable dispensing unit or the second replaceable dispensing unit may be inserted into the process chamber before inserting or immersing the substrate into the process chamber.

[0017] The term "replaceable cooperation" can be understood such that each of the first replaceable dispensing unit and the second replaceable dispensing unit can be releasably connected to the process chamber based on the process liquid used in subsequent surface treatment of the substrate. In other words, when the first replaceable dispensing unit is removed from the process chamber, the first replaceable dispensing unit can be inserted into the process chamber without modifying or adjusting the interface. Thus, the replaceable cooperation can also refer to a replaceable connection, a replaceable interface, a common interface, etc.

[0018] The first replaceable dispensing unit can face the substrate to be processed when the substrate is immersed in the process chamber. To uniformly supply the first liquid onto the surface of the substrate, the size and / or shape of the first replaceable dispensing unit can be adapted to the size and / or shape of the substrate to be processed. Similarly, the second replaceable dispensing unit can face the substrate to be processed when the substrate is immersed in the process chamber. To uniformly supply the second liquid onto the surface of the substrate, the size and / or shape of the second replaceable dispensing unit can be adapted to the size and / or shape of the substrate to be processed.

[0019] The first replaceable dispensing unit and / or the second replaceable dispensing unit may have a plurality of orifices for dispensing the process fluid and / or the electrolyte from within the first replaceable dispensing unit and / or the second replaceable dispensing unit to the process chamber and / or the substrate. The orifices may include, for example, spray nozzles, jet holes, and the like.

[0020] The kit interface disposed in the process chamber may be connected to a first liquid container configured to supply the first liquid. Accordingly, the first liquid may be supplied from the kit interface to the plurality of orifices of the first replaceable dispensing unit via the first injection port interface. Alternatively, the kit interface disposed in the process chamber may be connected to a second liquid container configured to supply the second liquid. Accordingly, the second liquid may be supplied from the kit interface to the plurality of orifices of the second replaceable dispensing unit via the second injection port interface.

[0021] Accordingly, the kit interface and the plurality of orifices of the first replaceable dispensing unit may form a first flow path for the first liquid. Similarly, the kit interface and the plurality of orifices of the second replaceable dispensing unit may form another flow path for the second liquid. The first injection port interface and the second injection port interface may be adapted to freely change the flow path for the first liquid and the flow path for the second liquid based on the process performed on the surface of the substrate.

[0022] In one example, the replaceable cooperation does not require changing the piping within the process chamber, within the first replaceable dispensing unit, or within the second replaceable dispensing unit. The term "piping" may be understood as an independent pipe or passage connecting the process chamber and the first replaceable dispensing unit, or connecting the process chamber and the second replaceable dispensing unit.

[0023] By directly connecting the first inlet interface of the first replaceable dispensing unit that supplies the first liquid, or the second inlet interface of the second replaceable dispensing unit that supplies the second liquid, to the kit interface of the process chamber, a quick and simple replaceable cooperation can be achieved. Therefore, it can be easier to change the replaceable dispensing unit based on specific requirements for the application, process, and / or liquid.

[0024] In one example, the kit interface, the first inlet interface, and the second inlet interface are further configured to enable exchangeable transmission of power and / or data between the kit interface and the first inlet interface, or between the kit interface and the second inlet interface. In other words, the kit interface, the first inlet interface, and the second inlet interface can enable the exchange of not only chemical liquids but also electricity and / or data between them by means of standardized connection means. The standardized electrical connection and / or data connection can facilitate the change of the replaceable dispensing unit.

[0025] In one example, the exchangeable transmission does not require changing either the electrical connection or the data connection within the process chamber, within the first replaceable dispensing unit, or within the second replaceable dispensing unit. Therefore, while complex piping and / or cable connections between the process chamber and the replaceable dispensing unit are avoided, reliable fluid, electrical, and / or information exchange between the process chamber and the replaceable dispensing unit can be guaranteed. Therefore, even if the first replaceable dispensing unit is replaced with the second replaceable dispensing unit within the process chamber, it does not affect the exchangeable transmission of power and / or data.

[0026] In one example, the exchangeable cooperation, the electrical connection, and / or the data connection, either between the kit interface and the first inlet interface or between the kit interface and the second inlet interface, is a plug-and-play cooperation or connection. The term "plug-and-play" can be understood to mean that the first exchangeable distribution unit and / or the second exchangeable distribution unit becomes available for use as soon as it is connected to the process chamber.

[0027] The exchangeable cooperation does not require changing the piping, electrical connection, or data connection within the process chamber, within the first exchangeable distribution unit, or within the second exchangeable distribution unit when replacing the exchangeable distribution unit, so the plug-and-play cooperation or connection is available. Thus, the first exchangeable distribution unit can be used immediately after the first inlet interface is connected to the kit interface, and / or the second exchangeable distribution unit can be used immediately after the second inlet interface is connected to the kit interface. Thus, rapid and uncomplicated installation of the modular kit in a manufacturing environment is achievable.

[0028] In one example, the kit interface can be connected to either a supply unit for an etching liquid that supplies the first liquid, or a supply unit for a different etching liquid or plating liquid that supplies the second liquid. The first liquid is the etching liquid, and the first liquid can be a different etching liquid or the plating liquid. The kit interface can be adapted to be connected to both the supply unit for the etching liquid and the supply unit for the different etching liquid or plating liquid simultaneously. Thus, the kit interface can supply the etching liquid to the process chamber via the first inlet interface and / or supply the different etching liquid or plating liquid to the process chamber via the second inlet interface.

[0029] The module kit can be configured for an etching process of a thin metal layer that requires highly controllable etching rate and highly uniform etching over the entire surface of the substrate. Thus, the substrate can be immersed in the first liquid provided through the first replaceable dispensing unit that can be used to fill the chamber with the first liquid before immersion of the substrate. As a result, it becomes possible to perform an etching process while controlling the diffusion rate of reactive species through a distinct diffusion boundary layer on the substrate. Further, the boundary layer can be made thinner while being controlled by the second liquid provided through the second replaceable dispensing unit. The second liquid may be a liquid different from the first liquid or may be the same liquid as the first liquid. The first liquid provided into the chamber before the substrate is immersed may be provided through a liquid inlet at the bottom of the process chamber. In addition, the process chamber can be provided with an overflow and recirculation system. Thereby, it becomes possible to continuously recirculate the first liquid and / or the second liquid through, for example, a pumping system - liquid filtration system, purification system, and / or reconditioning system that can be included.

[0030] The module kit can also be configured to plate the surface of the substrate. During plating, the substrate may be treated purely chemically by using an ionic fluid or may be treated electrochemically - that is, electroplated - by using an electrolytic solution and an electric current. The substrate may also be electrically connected to a power supply system by a second material known to those skilled in the art within a system that functions as a counter electrode that can function as an anode and / or a cathode.

[0031] In one example, the first replaceable dispensing unit and / or the second replaceable dispensing unit has a spray nozzle for spraying and applying the first liquid and / or the second liquid to the substrate, and / or has a jet hole for immersing and applying the first liquid and / or the second liquid to the substrate. The spray nozzle or the jet hole can be arranged in the first replaceable dispensing unit and / or the second replaceable dispensing unit such that the first liquid and / or the second liquid can be dispensed onto the surface of the substrate to be processed with high reliability and uniformity. For example, the spray nozzles or the jet holes may be evenly spaced from each other along the vertical direction, horizontal direction, and / or radial direction of the first replaceable dispensing unit and / or the second replaceable dispensing unit.

[0032] The first replaceable dispensing unit and / or the second replaceable dispensing unit may have two dispensing parts arranged to be parallel to each other. Each of the dispensing parts can be configured independently for the spraying application or the immersion application. The substrate holder, i.e., the substrate to be processed, can be inserted or removed between the dispensing parts.

[0033] For the spraying application, the first replaceable dispensing unit and / or the second replaceable dispensing unit may include a plurality of spray bars for dispensing a spray body of the first liquid and / or a spray body of the second liquid into the process chamber. Preferably, each of the spray bars may have a plurality of spray nozzles for discharging the spray body of the first liquid and / or the spray body of the second liquid toward the surface of the substrate to be processed. The spray bar may be arranged in a direction perpendicular or horizontal to the process chamber.

[0034] For the purpose of the immersion application, each of the first replaceable dispensing unit and / or the second replaceable dispensing unit may include a dispenser. The dispenser may be formed as a frame or a solid surface having a plurality of jet holes for dispensing the first liquid and / or the second liquid into the process chamber. For example, the dispenser may be in the shape of a flat plate. The plurality of jet holes may extend from the inside of the dispenser to the active surface of the dispenser facing the substrate to be processed.

[0035] Preferably, the plurality of jet holes may be arranged in the dispenser or inside the dispenser such that when the substrate is immersed in the process chamber, they face at least an inclined or perpendicular direction with respect to the surface of the substrate to be processed. Alternatively or in addition, the plurality of jet holes may be arranged in the first replaceable dispensing unit and / or the second replaceable dispensing unit having a specific arrangement pattern. Accordingly, the liquid dispensing area of the plurality of jet holes can be adapted to the size and / or shape of the substrate to be processed. In particular, the dispenser may be part of a high-speed plating (HSP) system.

[0036] In one example, both the first replaceable dispensing unit and the second replaceable dispensing unit may be configured for the spraying application. Alternatively, instead, both the first replaceable dispensing unit and the second replaceable dispensing unit may be configured for the immersion application. Further, the first replaceable dispensing unit may be configured for the spraying application, and the first replaceable dispensing unit may be configured for the immersion application. And vice versa is also possible. In addition, the dispensing parts of each replaceable dispensing unit may be formed symmetrically with respect to each other or differently from each other.

[0037] In one example, the module kit is arranged for a vertically arranged substrate holder and / or for surface treatment of the substrate. In other words, the module kit can be configured to receive the substrate in a direction perpendicular to the process chamber. Since the substrate can preferably be held by the substrate holder, the substrate holder can be inserted into the process chamber in the vertical direction or removed from the process chamber in the vertical direction. The substrate holder can have a plurality of chuck members for holding a large-sized substrate. Accordingly, easy handling of the substrate can be realized, and it is possible to configure the module kit to be small-sized.

[0038] In one example, the process chamber has an opening for receiving the first replaceable dispensing unit or the second replaceable dispensing unit. The opening is arranged on the upper surface of the process chamber. In other words, the first replaceable dispensing unit or the second replaceable dispensing unit can also be inserted into the process chamber in the vertical direction through the opening or removed from the process chamber. Since the opening is arranged on the upper surface of the process chamber, the handling of both the first replaceable dispensing unit and the second replaceable dispensing unit can be easily coordinated with each other.

[0039] In one example, the module kit further includes a lid unit arranged on the upper surface of the module kit. The lid unit has a lid configured to insert and / or remove the substrate holder. The lid unit can include a single lid member or two separate lid members. The lid unit can have an opening aligned with the opening of the process chamber so as to provide a passage for the substrate holder or the substrate to enter the process chamber. The lid unit can be configured to prevent contaminants from entering the interior of the process chamber and / or to prevent toxic or corrosive chemical fumes from escaping from the process chamber. The lid unit may also be movable between an open position and a closed position.

[0040] In one example, the lid unit may have an outlet. The outlet may be integrated with the lid unit and configured to discharge the vapor of the chemical substance exiting the process chamber to a safe area where the vapor of the chemical substance can be treated in accordance with health, safety, and environmental standards.

[0041] In one example, the first replaceable dispensing unit is sized for a first substrate, and the second replaceable dispensing unit is sized for a second substrate that is larger than the first substrate.

[0042] The first substrate inserted into the process chamber may face the first replaceable dispensing unit, and the second substrate immersed in the process chamber thereafter may face the second replaceable dispensing unit. Thus, if the first substrate is larger than the second substrate, the first replaceable dispensing unit for the first liquid may also be larger than the second replaceable dispensing unit for the second liquid. Further, if the second substrate is larger than the first substrate, the second replaceable dispensing unit for the second liquid may also be larger than the first replaceable dispensing unit for the first liquid.

[0043] Alternatively or in addition, the liquid dispensing area defined by the area of the spray nozzles or jet holes provided in or within the first replaceable dispensing unit or the second replaceable dispensing unit may also be adapted with respect to the size of the substrate to be treated. Thus, if the first substrate is larger than the second substrate, the first replaceable dispensing unit for the first liquid may also be larger than the second replaceable dispensing unit for the second liquid. Further, if the second substrate is larger than the first substrate, the second replaceable dispensing unit for the second liquid may also be larger than the first replaceable dispensing unit for the first liquid.

[0044] Thus, individual chemical and / or electrolytic surface treatment of the substrate can be achieved.

[0045] In one example, the module kit further includes a substrate size adjustment member for aligning the first replaceable dispensing unit or the second replaceable dispensing unit with a substrate of a specific size. The substrate size adjustment member may be configured to receive information about the size or shape of the substrate to be processed and select a replaceable dispensing unit appropriate for the substrate. Thus, the first replaceable dispensing unit or the second replaceable dispensing unit can be appropriately selected for each substrate to be processed.

[0046] In one example, the module kit further includes an actuating unit configured to actuate the substrate holder of the substrate in at least one of three possible directions. The actuating unit may be disposed on the substrate holder or the upper surface of the module kit to adjust the position of the substrate holder when the substrate is inserted into the process chamber. Since the actuating unit can adjust the position of the substrate in the vertical direction, the horizontal direction, and / or the direction intersecting the vertical and horizontal directions so as to optimize the position of the substrate with respect to the first replaceable dispensing unit or the second replaceable dispensing unit, the quality of the surface treatment can be improved.

[0047] In one example, the module kit further includes an anode. In the electrochemical surface treatment of the substrate, the anode may be disposed in the process chamber. When the process chamber contains an electrolytic solution supplied through the first replaceable dispensing unit or the second replaceable dispensing unit, the current distribution may be from the anode towards the substrate to be processed. At this time, the substrate may function as a cathode. The anode may be soluble or insoluble in the first liquid and / or the second liquid. The anode may be disposed so as not to interfere with the liquid flow distribution between the replaceable dispensing unit and the substrate.

[0048] In one example, the process chamber further comprises a temperature control unit, an electromagnetic radiation source, an ultrasonic unit, and / or a liquid outlet. The temperature control unit may be configured to control the temperature of the process chamber - in particular, the first liquid, the second liquid, and / or a mixture thereof. The temperature control unit may include infrared radiation, a heat exchanger, etc. Specifically, the electromagnetic radiation source may be configured not only for temperature control but also for photon-initiated etching, for example, by utilizing UV light.

[0049] The ultrasonic unit may include, for example, a transducer. The transducer may be configured to promote the sloshing of the liquid inside the process chamber in a frequency range of several Hz to several million Hz. The liquid outlet is configured to discharge the process liquid from the process chamber after chemical and / or electrolytic surface treatment of the substrate. Therefore, the liquid outlet may preferably be disposed on the bottom surface of the process chamber.

[0050] According to the present invention, a platform assembly for chemical and / or electrolytic surface treatment of a substrate is provided. The platform assembly includes the above-described first module kit and a device platform. The first module kit includes a first kit interface, and the device platform includes a platform interface. The platform interface and the first kit interface are configured to perform an exchangeable cooperation between the first kit interface and the platform interface. The platform assembly enables rapid and instantaneous change of the module kit according to process-specific requirements.

[0051] The device platform can be adapted to quickly and reliably adapt the processing environment for individual substrates. This can be achieved by a standardized platform interface and the kit interface. Thus, the cooperation between the platform interface and the first kit interface can be configured to be exchangeable. This can facilitate the change of the module kit.

[0052] The device platform can be provided with one or more liquid inlets and liquid outlets, electrical supply means, data communication means, etc. Therefore, as soon as the module kit is attached to the device platform via the kit interface and the platform interface, the module kit can be connected to all the supply or communication means necessary to execute the substrate processing.

[0053] In one example, the platform assembly further comprises a second module kit having a second kit interface. The platform interface, the first kit interface, and the second kit interface are configured to perform an exchangeable cooperation between the platform interface and either the first kit interface or the second kit interface.

[0054] In one example, the device platform comprises a plurality of platform interfaces configured to perform an exchangeable cooperation with a plurality of kit interfaces of a plurality of module kits simultaneously.

[0055] The device platform may be adapted to attach two or more module kits for performing the surface treatment. In other words, the device platform may include two or more platform interfaces that are connected to the kit interfaces of each module kit. The platform interface and the kit interface may have a standardized structure such that each cooperation between the platform interface and the kit interface can be configured to be interchangeable. The process chamber of each module kit may be configured to perform individual substrate processing. Thus, each module kit may include the same interchangeable distribution unit or may include different interchangeable distribution units respectively.

[0056] The device platform may be provided with one or more liquid inlets and liquid outlets, electrical supply means, data communication means, etc. In addition, the device platform can perform overall control of the module kit. Thus, the replacement of one or more module kits can be facilitated while ensuring reliable supply connection and / or communication.

[0057] In one example, the interchangeable cooperation does not require changing the piping, electrical connection, or data connection within the device platform and / or within the module kit(s). The standardized kit interface and platform interface can facilitate the change of the module kit. Thus, the change of the module kit based on the specific requirements of the application, process, and / or liquid can also be facilitated.

[0058] In one example, the interchangeable cooperation, the electrical connection, and / or the data communication between the device platform and the module kit(s), particularly between the platform interface(s) and the kit interface(s), may be a plug-and-play cooperation or connection.

[0059] In one example, each platform interface and each kit interface may together constitute a supply interface. The supply interface may be configured by plug-and-play cooperation between the kit interface and the platform interface. This may enable rapid replacement of the process chamber in cases of certain processes that require replacement of the process chamber but do not require replacement of the replaceable distribution unit. This may be required, for example, when the use of chemical substances is necessary - for chemical compatibility and safety reasons, the chamber is required to be made of different materials.

[0060] According to the present invention, a method for chemical and / or electrolytic surface treatment of a substrate is provided. The method comprises distributing a first liquid onto a first substrate disposed within a first replaceable distribution unit, wherein the first replaceable distribution unit is inserted into a process chamber and a first inlet interface of the first replaceable distribution unit cooperates with a kit interface of the process chamber; removing the first substrate from the first replaceable distribution unit; removing the first replaceable distribution unit from the process chamber; inserting a second replaceable distribution unit into the process chamber; connecting the kit interface of the process chamber to a second first inlet interface of the second replaceable distribution unit; inserting a second substrate into the second replaceable distribution unit; distributing a second liquid onto the second substrate. The method has.

[0061] The kit interface, the first inlet interface, and the second inlet interface are configured to perform an interchangeable cooperation either between the kit interface and the first inlet interface or between the kit interface and the second inlet interface. The first substrate and the second substrate may be a single identical substrate or may be two substrates.

[0062] Accordingly, a quick and easy change of the module kit based on the specific requirements of the application, process, and / or liquid can be ensured.

[0063] According to the present invention, the use of the above-described module kit is provided. The module kit has a width of 500 to 1700 mm and a length of 500 to 1700 mm, and is preferably suitable for chemical and / or electrolytic surface treatment of substrates having a width of 1300 to 1700 mm and a length of 1600 to 2000 mm or a width of 500 to 520 mm and a length of 505 to 525 mm.

[0064] Since the first exchangeable distribution unit and / or the second exchangeable distribution unit can have dimensions considering the size and / or shape of the substrate to be processed, the module kit can be freely applied to a wide range of substrate sizes. In particular, the module kit may also be suitable for surface treatment of large substrates.

[0065] It should be noted that the above-described embodiments can be combined with each other regardless of the related aspects. Accordingly, a method may be combined with structural features, and similarly, a system may be combined with the features described above with respect to the method.

[0066] These and other aspects of the present invention will become apparent by referring to the embodiments described below.

Brief Description of the Drawings

[0067] Exemplary embodiments of the present invention will be described below with reference to the following drawings.

[0068]

Figure 1

Figure 2

Figure 3

Figure 4

Mode for Carrying Out the Invention

[0069] FIG. 1 shows a platform assembly 1 for chemical and / or electrolytic surface treatment of a substrate. The chemical and / or electrolytic surface treatment of the substrate may be deposition of a material, zinc plating coating, chemical or electrochemical etching, anodization, a metal separation process, etc. The substrate may include a conductor plate, a semiconductor substrate, a film substrate, an essentially plate-shaped, metal or metallized sample piece, etc.

[0070] The platform assembly 1 comprises an apparatus platform 200 and three module kits 100. Each module kit 100 consists of a kit interface 110, and the apparatus platform 200 has a platform interface 210 corresponding to each kit interface 110. Each platform interface 210 and kit interface 110 together form a supply interface 11 (see also Fig. 2). Each platform interface 210 and kit interface 110 are configured to be interchangeable. The interchangeable cooperation does not require changing the piping, electrical connections, and / or data connections of the apparatus platform 200 and / or the module kits 100 when replacing one or more module kits 100. The platform interface 210 and kit interface 110 may have a standardized interface structure so as to form each cooperation between the platform interface 210 and the kit interface 110 interchangeably.

[0071] As shown in Fig. 2, the module kit 100 is arranged for the surface treatment of a vertically arranged substrate 41 held by a substrate holder 40. The module kit 100 is suitable for the chemical and / or electrolytic surface treatment of substrates having a width in the range of 500 to 1700 mm and a length in the range of 505 to 2000 mm, preferably a width in the range of 1300 to 1700 mm and a length in the range of 1600 to 2000 mm, or a width in the range of 500 to 520 mm and a length in the range of 505 to 525 mm. The substrate holder 40 is vertically insertable into or removable from the process chamber 10, enabling a compact structure of the module kit 100.

[0072] FIG. 3 shows such a modular kit 100 comprising a process chamber 10, a first replaceable dispensing unit 20 or a second replaceable dispensing unit 20. The process chamber 10 has an opening 12 on the upper surface of the process chamber 10 for receiving the first replaceable dispensing unit 20 and / or the second replaceable dispensing unit 20. In other words, the process chamber 10 is dimensioned to receive the first replaceable dispensing unit 20 and / or the second replaceable dispensing unit 20.

[0073] The first replaceable dispensing unit 20 is configured to discharge a first liquid onto the substrate 41, and the second replaceable dispensing unit 20 is configured to discharge a second liquid onto the substrate 41. The first replaceable dispensing unit 20 and the second replaceable dispensing unit 20 are each dimensioned to receive the substrate 41 within its internal cavity 24. The first replaceable dispensing unit 20 and / or the second replaceable dispensing unit 20 may be composed of two dispensing members 21, 22 arranged parallel to each other. Each of the dispensing members 21, 22 can be configured independently of each other for spraying application or dipping application. The substrate holder 40, and thus the substrate 41 to be processed, may be insertable and / or removable between the two dispensing members 21, 22.

[0074] The process chamber 10 includes a kit interface 110 for supplying the first liquid or the second liquid. The first replaceable dispensing unit 20 includes a first inlet interface 23 for the first liquid. The second replaceable dispensing unit 20 includes a second inlet interface 23 for the second liquid. The kit interface 110 is connectable to a platform interface 210, and this platform interface 210 is connected to an etching liquid supply device (not shown) for supplying the first liquid, or another etching liquid supply device or plating liquid supply device (not shown) for supplying the second liquid.

[0075] The kit interface 110, the first inlet interface 23, and the second inlet interface 23 are configured to be interchangeably cooperative between the kit interface 110 and the first inlet interface 23 or between the kit interface 110 and the second inlet interface 23. Accordingly, the interchangeable cooperation does not require replacement of the piping within the process chamber 10, the first interchangeable distribution unit 20, or the second interchangeable distribution unit 20.

[0076] The kit interface 110, the first inlet interface 23, and the second inlet interface 23 are further configured to interchangeably transfer power and / or data between the kit interface 110 and the first inlet interface 23 or between the kit interface 110 and the second inlet interface 23. Thus, the interchangeable transfer does not require modification of the electrical or data connections in the process chamber 10, the first interchangeable distribution unit 20, or the second interchangeable distribution unit 20.

[0077] The interchangeable cooperation, electrical connection, and / or data connection between the kit interface 110 and the first inlet interface 23 or between the kit interface 110 and the second inlet interface 23 can be a plug-and-play cooperation or connection. Accordingly, the liquid supply system can be quickly and easily changed according to the process without adjusting the interface between the process chamber 10 and the interchangeable distribution unit 20.

[0078] Standardization and plug-and-play of the platform interface 210 and the kit interface 110 forming the supply interface 11 also enable quick and easy replacement of the common chamber 10.

[0079] The module kit 100 further includes a lid unit 30 disposed on the upper surface of the module kit 100, and this lid unit 30 includes a lid 31 configured for insertion and / or removal of the substrate holder 40. The substrate holder 40 is aligned with the lid 31, and the substrate 41 can be disposed between the distribution members 21, 22 of the first replaceable distribution unit 20 or the second replaceable distribution unit 20 of the module kit 100.

[0080] The substrates processed in the process chamber 10 may have the same size and / or the same shape. However, they may have different sizes and / or different shapes. Each substrate 41 inserted into the process chamber 10 may face the respective replaceable distribution unit 20. For example, the first replaceable distribution unit 20 can be sized for the first substrate, and the second replaceable distribution unit 20 can be sized for a second substrate that is larger (or smaller) than the first substrate. Thus, when the first substrate is smaller than the second substrate, in order to improve the quality of the surface treatment, the liquid distribution area of the first replaceable distribution unit 20 for the first liquid can also be made smaller than the liquid distribution area of the second replaceable distribution unit 20 for the second liquid.

[0081] Figures 4a to 4d show four examples of the first and second replaceable distribution units 20, which facilitate reliable and uniform distribution of the first or second liquid onto the surface of the substrate 41 to be processed.

[0082] As shown in Figure 4A, the replaceable distribution unit 20 includes two distribution members 21, 22 arranged parallel to each other and formed symmetrically. The replaceable distribution unit 20 can have a spray nozzle 27 for spraying the first or second liquid onto the substrate 41. The spray nozzle 27 can be disposed on a plurality of spray bars 26 oriented in the horizontal direction of the process chamber 10. Alternatively, as shown in Figure 4b, the spray bars 26 may be arranged in the vertical direction of the process chamber 10.

[0083] In FIG. 4c, the replaceable dispensing unit 20 includes jet holes 29 for immersively applying the first or second liquid to the substrate 41. The ejection holes 29 are arranged on the dispenser 28 or within the dispenser 28 such that when the substrate 41 is immersed in the process chamber 10, they are directed substantially perpendicular to the surface of the substrate 41 to be processed. Alternatively, the injection holes 29 may be arranged at an angle to the surface of the substrate 41 to be processed. The dispenser 28 may be part of a HSP (High-Speed-Plate) system. As shown in FIGS. 4c and 4d, the liquid distribution area formed by a plurality of jet holes 29 on or within the dispenser 28 can be adapted to the size of the substrate 41 to be processed.

[0084] Alternatively, the dispensing members 21, 22 of the replaceable dispensing unit 20 may be formed differently or asymmetrically and can simultaneously include an injection nozzle 27 for injection application and a jet hole 29 for immersion application.

[0085] The process chamber 10 may further include a temperature control unit (not shown) for controlling the temperature of the process chamber 10 or the process fluid, an electromagnetic radiation source (not shown) for photon-initiated etching, an ultrasonic unit (not shown) for promoting liquid stirring within the process chamber 10, and / or a liquid outlet (not shown) for discharging fluid from the process chamber 10.

[0086] Furthermore, the lid unit 30 includes an exhaust 32 configured to remove chemical vapor from the process chamber 10 to a storage area, and the chemical vapor can be processed in accordance with health, safety, and environmental standards.

[0087] The module kit 100 further includes a substrate size adjustment member 14 for aligning the first replaceable dispensing unit 20 or the second replaceable dispensing unit 20 with a substrate of a specific size (see FIG. 3).

[0088] The module kit 100 also comprises an operating unit 13 configured to agitate the substrate holder 40 for the substrate 41 in at least one of three possible directions. The agitation unit 13 is arranged on the substrate holder 40 to adjust the position of the substrate holder 40 and thus the substrate 41 when the substrate 41 is inserted into the process chamber 10. The operating unit 13 can adjust the position of the substrate holder 40 in the vertical direction, the horizontal direction and / or the direction intersecting the vertical and horizontal directions in order to optimize the position of the substrate 41 relative to the first replaceable distribution unit 20 or the second replaceable distribution unit 20.

[0089] The module kit 100 is configured as a hybrid processing device enabling etching or (electro)plating of the substrate 41. Specifically, in order to perform electroplating, the module kit 100 can further comprise an anode (not shown) inside the process chamber 10. When the process chamber 10 contains an electrolyte supplied via the first replaceable distribution unit 20 or the second replaceable distribution unit 20, the current distribution is directed from the anode towards the substrate surface to be processed and the substrate 41 can function as a cathode.

[0090] Thus, the module kit 100 enables easy change of the replaceable distribution unit 20 within the process chamber 10 based on the requirements of substrate processing.

[0091] It should be noted that the embodiments of the present disclosure are described with reference to different protection objects. In particular, some embodiments are described with reference to method-type claims and other embodiments are described with reference to apparatus-type claims. However, those skilled in the art will consider that any combination of features belonging to one type of protection object, as well as any combination between features related to different protection objects, is disclosed in the present application, unless otherwise stated, based on the above and following descriptions. However, all features can be combined in a way that provides a synergistic effect greater than the simple sum of the features.

[0092] Although the present disclosure has been illustrated and described in detail in the drawings and the description, such illustrations and descriptions are exemplary or illustrative and not restrictive. The present disclosure is not limited to the disclosed embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed disclosure, from a study of the drawings, the present disclosure, and the dependent claims.

[0093] In the claims, the terms "comprising", "including", and "having" do not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. A single processor or other unit may perform the functions of a plurality of items recited in the claims. The mere fact that certain means are recited in mutually different dependent claims does not indicate that these means cannot be used advantageously in combination. Any reference signs in the claims should not be construed as limiting the scope.

Claims

1. A modular kit for chemical and / or electrolytic surface treatment of a substrate, comprising: a process chamber; a first replaceable dispensing unit for dispensing a first liquid onto the substrate; a second replaceable dispensing unit for supplying a second liquid onto the substrate; wherein the process chamber is dimensioned to receive either the first replaceable dispensing unit or the second replaceable dispensing unit; each of the first replaceable dispensing unit and the second replaceable dispensing unit is dimensioned to receive the substrate; the process chamber comprises a kit interface for supplying the first liquid or the second liquid; the first replaceable dispensing unit comprises a first inlet interface for the first liquid; the second replaceable dispensing unit comprises a second inlet interface for the second liquid; the kit interface, the first inlet interface, and the second inlet interface are configured to cooperate interchangeably between the kit interface and the first inlet interface or between the kit interface and the second inlet interface; a modular kit.

2. The modular kit according to claim 1, wherein the interchangeable cooperation does not require changing the piping within the process chamber, within the first replaceable dispensing unit, or within the second replaceable dispensing unit.

3. The modular kit according to claim 1 or 2, wherein the kit interface, the first inlet interface, and the second inlet interface are further configured to perform an interchangeable transmission of power and / or data between the kit interface and the first inlet interface or between the kit interface and the second inlet interface.

4. The modular kit according to any one of claims 1 to 3, wherein the interchangeable transmission does not require changing the electrical connection or the data connection within the process chamber, within the first replaceable dispensing unit, or within the second replaceable dispensing unit.

5. A module kit according to any one of claims 1 to 4, wherein the exchangeable cooperation, the electrical connection, and / or the data connection between the kit interface and the first inlet interface or between the kit interface and the second inlet interface is a plug-and-play cooperation or connection.

6. A module kit according to any one of claims 1 to 5, wherein the kit interface is connectable to a supply unit for an etching liquid that supplies the first liquid and / or a supply unit for a different etching liquid or plating liquid that supplies the second liquid.

7. A module kit according to any one of claims 1 to 6, wherein the first exchangeable dispensing unit and / or the second exchangeable dispensing unit has a spray nozzle for spraying and applying the first liquid and / or the second liquid to the substrate, and / or a jet hole for immersing and applying the first liquid and / or the second liquid to the substrate.

8. A module kit according to any one of claims 1 to 7, which is arranged for surface treatment of a vertically arranged substrate holder and / or a substrate.

9. A module kit according to any one of claims 1 to 8, wherein the process chamber has an opening for receiving the first exchangeable dispensing unit or the second exchangeable dispensing unit, and the opening is arranged on the upper surface of the process chamber.

10. A module kit according to any one of claims 1 to 9, wherein the first exchangeable dispensing unit is sized for a first substrate, and the second exchangeable dispensing unit is sized for a second substrate that is larger than the first substrate.

11. A module kit according to any one of claims 1 to 10, further comprising a substrate size adjusting member for aligning the first exchangeable dispensing unit or the second exchangeable dispensing unit with a substrate of a specific size.

12. A module kit according to any one of claims 1 to 11, further comprising an operating unit configured to operate the substrate holder of the substrate in at least one direction out of three possible directions.

13. A module kit according to any one of claims 1 to 12, further comprising an anode.

14. A module kit according to any one of claims 1 to 13, wherein the process chamber further comprises a temperature control unit, an electromagnetic radiation source, an ultrasonic unit, and / or a liquid outlet.

15. An assembly of platforms for chemical and / or electrolytic surface treatment of substrates, a first module kit according to any one of claims 1 to 14, a device platform, comprising: the device platform comprises a platform interface, the platform interface and the first kit interface of the first module kit are configured to perform an exchangeable cooperation between the first kit interface and the platform interface. An assembly of platforms.

16. The assembly of platforms according to claim 15, further comprising a second module kit having a second kit interface, wherein the platform interface, the first kit interface, and the second kit interface are configured to perform an exchangeable cooperation between the platform interface and either the first kit interface or the second kit interface.

17. The assembly of platforms according to claim 15 or 16, wherein the exchangeable cooperation does not require changing piping, electrical connections, or data connections within the device platform and / or within the (plural) module kits.

18. The assembly of platforms according to any one of claims 15 to 17, wherein the device platform comprises a plurality of platform interfaces configured to perform an exchangeable cooperation with a plurality of kit interfaces of a plurality of module kits simultaneously.

19. A method for chemical and / or electrolytic surface treatment of substrates, Distributing a first liquid onto a first substrate disposed on a first substrate within the first replaceable dispensing unit, wherein the first replaceable dispensing unit is inserted into a process chamber, and a first inlet interface of the first replaceable dispensing unit cooperates with a kit interface of the process chamber; Removing the first substrate from the first replaceable dispensing unit; Removing the first replaceable dispensing unit from the process chamber; Inserting a second replaceable dispensing unit into the process chamber; Connecting the kit interface of the process chamber to a second first inlet interface of the second replaceable dispensing unit; Inserting a second substrate into the second replaceable dispensing unit; Distributing a second liquid onto the second substrate; comprising; The kit interface, the first injection port interface, and the second injection port interface are configured to cooperate interchangeably between the kit interface and the first injection port interface or between the kit interface and the second injection port interface; Method.

20. Use of a modular kit for chemical and / or electrolytic surface treatment of a substrate according to any one of claims 1 to 14 on a substrate having a width of 500 to 1700 mm and a length of 500 to 1700 mm, preferably having a width of 1300 to 1700 mm and a length of 1600 to 2000 mm or a width of 500 to 520 mm and a length of 505 to 525 mm.

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