Wafer placement device and semiconductor processing equipment

Abstract

The base of the wafer placement device is used for placing a wafer and has a cavity inside. The edge guard ring assembly includes an edge guard ring, a guard ring support member, and a plurality of guard ring connection rods. The guard ring support member is provided at a distance below the base. The plurality of guard ring connection rods are all provided on the guard ring support member and are connected to the edge guard ring. The drive assembly is provided inside the cavity and is connected to the guard ring support member and is used for driving the guard ring support member to drive the edge guard ring to move between the wafer transfer position and the process position along the vertical direction. The first detection assembly is used for detecting the distance between the guard ring support member and the base, and controlling the drive assembly to drive the guard ring support member to move based on the distance so as to adjust the process position of the edge guard ring.

Description

Technical Field

[0001] This application belongs to the technical field of semiconductor processes, and specifically relates to a wafer placement device and semiconductor process equipment.

Background Art

[0002] In the semiconductor field, the etching process needs to be performed by dedicated semiconductor process equipment such as an etching machine. The etching machine is mainly composed of structures such as an upper electrode, a lower electrode, and a process chamber. The stability of the lifting pin mechanism of the lower electrode in the process chamber determines the positioning accuracy during wafer transfer, which has an important impact on the process result. In the process flow of the etching process, usually, the edge of the wafer is etched using an edge guard ring, that is, the over-etching problem is prevented. Currently, the lifting pin mechanism and the guard ring in the semiconductor process chamber use a mechanical interlocking method, that is, the same driving mechanism is used to realize the transmission sequence in which the push-up pin and the edge guard ring start rising and stop descending at different times, improving the operation efficiency and safety.

[0003] However, when the lifting pin mechanism and the edge guard ring use a mechanical interlocking method, the edge guard ring can only stop at a fixed position. Therefore, after the push-up pin transports the wafer to the electrostatic chuck, the position of the edge guard ring is also fixed, and at this time, the clearance between the guard ring and the wafer is also fixed. The magnitude of this clearance value directly affects the distribution of the plasma electric field and flow field inside the process chamber. If the clearance value is too high, the clearance between the edge guard ring and the wafer is too large, and the plasma enters the clearance during etching, and the over-etching problem still occurs at the edge of the wafer. If the clearance value is too low, it will cause the problem that the inclination angle of the etching groove of the wafer is too large, affecting the etching uniformity.

Summary of the Invention

Problems to be Solved by the Invention

[0004] An embodiment of the present application aims to provide a wafer placement device and a semiconductor processing apparatus that can solve the problems of over-etching of the edge of the wafer and too large an inclination angle of the etching groove of the wafer due to the relatively fixed pitch between the edge guard ring and the wafer in the process flow.

Means for Solving the Problems

[0005] To solve the above technical problems, the present application is realized as follows.

[0006] In a first aspect, an embodiment of the present application provides a wafer placement device applied to a semiconductor processing apparatus, including a base, an edge guard ring assembly, a first detection assembly, and a drive assembly. The base is used for placing a wafer and has a cavity inside. The edge guard ring assembly includes an edge guard ring, a guard ring support member, and a plurality of guard ring connection rods. The guard ring support member is provided at a distance below the base. The plurality of guard ring connection rods are all provided on the guard ring support member and connected to the edge guard ring. The drive assembly is provided in the cavity and connected to the guard ring support member. The drive assembly is used to drive the guard ring support member to move between a wafer transfer position and a process position along the vertical direction of the edge guard ring. The first detection assembly is used to detect the distance between the guard ring support member and the base. When the wafer is placed on the base, the drive assembly drives the guard ring support member to move based on the distance to adjust the process position of the edge guard ring.

[0007] In a second aspect, an embodiment of the present application further provides a semiconductor processing apparatus including the above wafer placement device.

Advantages of the Invention

[0008] In the embodiment of the present application, the first detection assembly can detect the distance between the guard ring support member and the base. When a wafer is placed on the base, the driving assembly can drive the movement of the guard ring support member based on the distance detected by the first detection assembly, so as to adjust the process position of the edge guard ring and the pitch between the edge guard ring and the wafer, so that the actual process requirements are met. Therefore, the wafer placement device according to the embodiment of the present application can solve the problem that the pitch between the edge guard ring and the wafer is relatively fixed in the process flow, thereby avoiding the occurrence of over-etching at the edge of the wafer and the problem that the inclination angle of the etching groove of the wafer is too large.

Brief Description of the Drawings

[0009]

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Embodiments for Carrying Out the Invention

[0010] Hereinafter, with reference to the drawings of the embodiments of the present application, the technical solutions of the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative labor belong to the protection scope of the present application.

[0011] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects and are not used to explain a specific order or the order before and after. It should be understood that such data used in this way can be exchanged appropriately when applicable so that the embodiments of the present application can be implemented in an order other than that illustrated or described in this specification, and the distinguished objects such as "first", "second", etc. generally belong to the same type and do not limit the number of objects. For example, the first object may be one or a plurality. Also, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally represents that the related objects before and after are in an "or" relationship.

[0012] The following will refer to the drawings and specifically describe the wafer placement device and semiconductor process equipment according to the embodiments of the present application with specific embodiments and their application scenarios.

[0013] As shown in FIGS. 1 to 16, the embodiment of the present application provides a wafer mounting device applied to semiconductor process equipment, and includes a base 110, an edge guard ring assembly 120, a first detection assembly 140, and a drive assembly 150.

[0014] Here, the base 110 is a basic member of the wafer mounting device and can provide a mounting foundation for other structures of the wafer mounting device. The base 110 is used for mounting a wafer, and has a cavity inside. Optionally, the base 110 includes a bottom plate 112 and a housing 111. The housing 111 is provided on the bottom plate 112, and the housing 111 and the bottom plate 112 form a cavity.

[0015] The edge guard ring assembly 120 includes an edge guard ring 121, a guard ring support member 122, and a plurality of guard ring connection rods 123. The edge guard ring 121 is used to protect the edge of the wafer in the process flow. The guard ring support member 122 is provided circumferentially spaced below the base 110, and the guard ring support member 122 is movably provided on the base 110. The plurality of guard ring connection rods 123 are all provided on the guard ring support member 122 and are connected to the edge guard ring 121. Optionally, the guard ring connection rod 123 includes a support pin 123a and a support pin sleeve 123b. The support pin sleeve 123b is provided on the guard ring support member 122, and the support pin 123a is connected between the support pin sleeve 123b and the edge guard ring 121. The support pin 123a, the support pin sleeve 123b, and the guard ring support member 122 are all used as the support structure of the edge guard ring 121. Further optionally, the number of the support pins 123a may be at least three. The support pin sleeves 123b are provided in a one-to-one correspondence with the support pins 123a. Naturally, the number of the support pins 123a can also be set according to actual needs and is not particularly limited here. Optionally, when the number of the support pins 123a is three, the guard ring support member 122 may have a three-claw structure, thereby reducing the weight and cost of the guard ring support member 122. Naturally, other structures may also be used and are not particularly limited here.

[0016] The drive assembly 150 is provided within the cavity and is connected to the guard ring support member 122. The drive assembly 150 is used to drive the guard ring support member 122 to move and drive the edge guard ring 121 along the vertical direction between the wafer transfer position and the process position. When the edge guard ring 121 is in the process position, there is a pitch between the edge guard ring 121 and the edge of the wafer disposed on the base 110 in the direction where the central axis of the edge guard ring 121 is located. Optionally, the drive assembly 150 may be one of a hydraulic cylinder, a motor, a shape memory alloy, and a piezoelectric ceramic component, and is not particularly limited herein.

[0017] The first detection assembly 140 is used to detect the distance between the guard ring support member 122 and the base 110. When a wafer is placed on the base 110, the drive assembly 150 moves and drives the guard ring support member 122 based on the distance between the guard ring support member 122 and the base 110 to adjust the process position of the edge guard ring 121, thereby moving the edge guard ring 121 between different process positions, that is, adjusting the pitch between the edge guard ring 121 and the edge of the wafer so that the pitch meets the actual requirements of the process.

[0018] In an embodiment of the present application, the first detection assembly 140 can detect the distance between the guard ring support member 122 and the base 110. When a wafer is placed on the base 110, the drive assembly 150 moves and drives the guard ring support member 122 based on the distance detected by the first detection assembly 140, so as to adjust the process position of the edge guard ring 121 and the pitch between the edge guard ring 121 and the wafer, thereby avoiding over-etching at the edge of the wafer and the inclination angle of the etching groove of the wafer being too large. Therefore, the wafer placement device according to the embodiment of the present application can solve the problems of over-etching at the edge of the wafer and the inclination angle of the etching groove of the wafer being too large due to the relatively fixed pitch between the edge guard ring 121 and the wafer in the process flow.

[0019] In an optional embodiment, the drive assembly 150 includes a cylinder 151, a transmission member 154, and an adapter 157. The cylinder 151 is provided on the bottom plate 112 of the base 110. Optionally, the cylinder 151 may be a damping cylinder, which has the characteristics of a small volume and stable operation. The first end of the transmission member 154 is connected to the output shaft of the cylinder 151, the second end of the transmission member 154 is connected to one end of the adapter 157, the other end of the adapter 157 penetrates through the bottom plate 112 and is connected to the guard ring support member 122, and the cylinder 151 moves and drives the guard ring support member 122 by driving the adapter 157 to move up and down through the transmission member 154.

[0020] In an optional embodiment, the wafer placement device further includes a first positioning assembly 160. The first positioning assembly 160 is provided in the cavity and is used to position the transmission member 154, that is, to fix the adapter 157 connected to the transmission member 154, thereby fixing the edge guard ring 121 at its current position and further improving the stability of the edge guard ring 121. The first positioning assembly 160 is used to fix the edge guard ring 121 at an arbitrary position (i.e., its current position) when the edge guard ring 121 moves to any position. For example, when the edge guard ring 121 moves to the process position, the first positioning assembly 160 can fix the edge guard ring 121 at the process position. In addition, in order to reduce the occupied space, the drive assembly 150 is driven by using a cylinder 151 with a smaller volume than an electric cylinder, so as to be applicable to the narrow space of the cavity. In this case, by using the first positioning assembly 160 in cooperation with the cylinder 151, the stop of the cylinder can be realized at any time, and the edge guard ring 121 can be fixed at the designated position.

[0021] In an optional embodiment, the first positioning assembly 160 includes a first positioning member 161 and a second positioning member 162. The first positioning member 161 is connected to the driving assembly 150, specifically, it may be provided on the transmission member 154. The second positioning member 162 is connected to the base 110, for example, provided on the bottom plate 112 of the base 110. When the driving assembly 150 drives the guard ring support member 122 to move, the first positioning member 161 moves along the vertical direction relative to the second positioning member 162, and at least one of the first positioning member 161 and the second positioning member 162 is movable along a first direction forming an angle with the vertical direction. The first positioning member 161 and the second positioning member 162 can be switched between positioning engagement and release of positioning engagement. An angle is formed between the first direction and the vertical direction. Here, the first direction is specifically a direction perpendicular to the vertical direction, that is, the horizontal direction. Of course, the first direction and the vertical direction may have an angle therebetween, and it is not particularly limited here. For example, when the edge guard ring 121 is in the process position, the edge guard ring 121 can be fixed at the process position by positioning and engaging the first positioning member 161 with the second positioning member 162. Here, at least one of the first positioning member 161 and the second positioning member 162 is movable along the first direction, for example. When the cylinder 151 drives to adjust the edge guard ring 121 to the process position, the output shaft of the cylinder 151 stops operating, and at least one of the first positioning member 161 and the second positioning member 162 moves to a position where they are positioned and engaged with each other along the first direction, thereby fixing the edge guard ring 121, improving the stability of the edge guard ring 121, and avoiding changes in the position of the edge guard ring 121 in the process flow.Specifically, the first positioning member 161 may be fixed and not moved, and the second positioning member 162 may be moved to a position where it is positioned and engaged with the first positioning member 161 along the first direction. Alternatively, the second positioning member 162 may be fixed and not moved, and the first positioning member 161 may be moved to a position where it is positioned and engaged with the second positioning member 162 along the first direction. Alternatively, the first positioning member 161 and the second positioning member 162 may be relatively moved to positions where they are positioned and engaged with each other along the first direction. Also, compared with the method in which the first positioning assembly 160 is provided on one of the bottom plate 112 and the transmission member 154 and further positioned and engaged with the other, the fact that the first positioning member 161 and the second positioning member 162 are provided on different members enables the positions of both to be selected more flexibly, thereby facilitating the design of the structure of the wafer placement device.

[0022] In an optional embodiment, the second positioning member 162 extends along the vertical direction, so that when the first positioning member 161 moves, the second positioning member 162 can always overlap the first positioning member 161 in the first direction. When the two overlap, it can be ensured that when the first positioning member 161 moves along the first direction, it can be positioned and engaged with the overlapping portion of the second positioning member 162. At least one of the first positioning member 161 and the second positioning member 162 is a solenoid. That is, the first positioning member 161 may be a solenoid, the second positioning member 162 may be a solenoid, and furthermore, both the first positioning member 161 and the second positioning member 162 may be solenoids, which is not particularly limited here. When the solenoid is turned on, the first positioning member 161 is positioned and engaged with the second positioning member 162. When the solenoid is turned off, the engagement between the first positioning member 161 and the second positioning member 162 is released, making it easier to control. Further optionally, the second positioning member 162 is a solenoid and the first positioning member 161 is a magnetic member. When the magnetic member approaches the solenoid, the solenoid is turned on and the magnetic member is magnetically connected to the solenoid. Since the solenoid is fixed and does not move, it is easier to control.

[0023] Optionally, the second positioning member 162 may be a strip member, and the second positioning member 162 extends along the moving direction of the guard ring support member 122. Since the first positioning member 161 is provided on the transmission member 154, when the strip-shaped second positioning member 162 extends along the moving direction of the guard ring support member 122, it is advantageous to increase the contact range between the first positioning member 161 and the second positioning member 162, and facilitate the positioning engagement between the first positioning member 161 and the second positioning member 162.

[0024] Further optionally, a plurality of first positioning grooves are provided in the second positioning member 162 along the vertical direction. The first positioning member 161 includes a first main body and a first magnetic head. The first main body is fixed to the transmission member 154 by a fastener such as a screw, and the first magnetic head is movably provided on the first main body. When the first magnetic head is turned on, the first magnetic head is positioned and engaged with one of the plurality of first positioning grooves. At this time, not only is there a magnetic positioning engagement, but also a mechanical positioning engagement, thereby further improving the positioning stability between the first positioning member 161 and the second positioning member 162.

[0025] In another alternative embodiment, the wafer placement device further includes a lift pin support member 180 and a stopper baffle 130. The stopper baffle 130 is fixedly installed inside the cavity. Optionally, the stopper baffle 130 is provided on the housing 111. On the bottom surface of the stopper baffle 130, a plurality of first guides 220 extending along the vertical direction are provided. The lift pin support member 180 is in sliding contact with the plurality of first guides 220, and the first guides 220 provide a guiding effect for the movement of the lift pin support member 180. When the edge guard ring 121 rises to the first position, the transmission member 154 contacts the lift pin support member 180. In the process that the transmission member 154 drives the edge guard ring 121 to continuously rise from the first position to the wafer transfer position, the transmission member 154 further synchronously drives the lift pin support member 180 to rise until the lift pin support member 180 abuts against the stopper baffle 130. At this time, the stopper baffle 130 can prevent the lift pin support member 180 from continuously rising. When the lift pin support member 180 descends from the wafer transfer position, the lift pin support member 180 and the edge guard ring 121 synchronously descend to the first position. The lift pin support member 180 is separated from the transmission member 154. The transmission member 154 drives the edge guard ring 122 to continuously descend. When the edge guard ring 121 descends from the first position to the process position, the first detection assembly 140 is activated and used to detect the distance between the guard ring support member 122 and the base 110, and based on this distance, the process position of the edge guard ring 121 is adjusted. As can be seen from this, in such a mechanical interlocking manner, this embodiment can not only drive the edge guard ring 121 to move using the same drive mechanism, but also drive the lift pin support member 180 to move. Compared with driving the edge guard ring 121 and the lift pin support member 180 to move respectively by different mechanisms, this embodiment is advantageous for improving the operation convenience of the wafer placement device.

[0026] Optionally, the push-up pin support member 180 may be engaged with the first guide 220, whereby the push-up pin support member 180 and the first guide 220 are always connected, and the attachment of the push-up pin support member 180 is realized.

[0027] Optionally, the wafer placement device further includes a push-up pin 260 and a push-up pin sleeve 270. The push-up pin sleeve 270 is provided on the push-up pin support member 180, and the push-up pin 260 is provided on the push-up pin sleeve 270. During the movement of the push-up pin support member 180, the push-up pin sleeve 270 and the push-up pin 260 move together.

[0028] Further optionally, the number of the push-up pins 260 is at least three, each push-up pin 260 is provided at intervals in the circumferential direction, and the push-up pin sleeve 270 is provided in a one-to-one correspondence with the push-up pins 260, whereby the acting force acting on the wafer is dispersed, and the stability of wafer transfer is improved.

[0029] Optionally, when the number of the push-up pins 260 is three, the push-up pin support member 180 may have a three-claw structure at this time, whereby the size and weight of the push-up pin support member 180 are reduced, and it is easy to save space for other structures.

[0030] In another alternative embodiment, the wafer placement device further includes a second detection assembly 210, and the second detection assembly 210 includes a first sensor 211 and a second sensor 212. The first sensor 211 and the second sensor 212 are provided at intervals along the moving direction of the push-up pin support member 180. When the push-up pin support member 180 contacts the stopper baffle 130, the first sensor 211 is triggered, and at this time, the cylinder 151 can be closed, so that the cylinder 151 does not apply a force to the transmission member 154. Further, it is prevented that the push-up pin support member 180 further rises to excessively press the stopper baffle 130 or damage the cylinder 151. When the push-up pin support member 180 is in the first position, the second sensor 212 is triggered, which indicates that the push-up pin support member 180 has moved to the lower limit position.

[0031] Optionally, both the first sensor 211 and the second sensor 212 may be fiber optic sensors. The fiber optic sensors can emit light rays, and by detecting the intensity of the light rays irradiated on the push-up pin support member 180, the position of the push-up pin support member 180 can be accurately determined.

[0032] Optionally, the second detection assembly 210 further includes a fiber optic conduction member 213. Both the first sensor 211 and the second sensor 212 are provided on the fiber optic conduction member 213. The fiber optic conduction member 213 is used to electrically connect the first sensor 211 and the second sensor 212, which is easy to control. Of course, the first sensor 211 and the second sensor 212 may be controlled independently, and are not particularly limited here.

[0033] In an optional embodiment, the wafer placement device further includes an anti-pad 280, the anti-pad 280 is provided on the housing 111 of the base 110, the stopper baffle 130 is provided on the anti-pad 280, and the stopper baffle 130 is located on the side facing the push-up pin support member 180 of the anti-pad 280. The optical fiber conduction member 213 is provided on the stopper baffle 130, thereby increasing the detection range of the first sensor 211 and the second sensor 212 with respect to the push-up pin support member 180.

[0034] In an optional embodiment, the wafer placement device further includes a second positioning assembly 190. The second positioning assembly 190 includes a third positioning member 191 and a fourth positioning member. The third positioning member 191 is provided on the push-up pin support member 180, and the fourth positioning member is provided on the transmission member 154. When the push-up pin support member 180 contacts the stopper baffle 130, the third positioning member 191 is positioned and engaged with the fourth positioning member, so that the transmission member 154 can synchronously drive the push-up pin support member 180 and the guard ring support member 122 to descend to the first position. When the third positioning member 191 is positioned and engaged with the fourth positioning member, the push-up pin support member 180 moves together with the transmission member 154, thereby avoiding the separation of the transmission member 154 from the push-up pin support member 180 and improving the connection stability between the transmission member 154 and the push-up pin support member 180. When the engagement between the third positioning member 191 and the fourth positioning member is released, the push-up pin support member 180 is separated from the transmission member 154. At this time, only the transmission member 154 moves, and the push-up pin 260 connected to the push-up pin support member 180 is maintained at its process position. As can be seen from this, this embodiment is advantageous for improving the connection stability between the push-up pin support member 180 and the transmission member 154 by providing the third positioning member 191 and the fourth positioning member. At the same time, the transmission member 154 can quickly drive the push-up pin support member 180, and the push-up pin support member 180 can quickly drive the push-up pin 260 to reach its process position.

[0035] In an embodiment where the wafer placement device includes both the second positioning assembly 190 and the second detection assembly 210, when the push-up pin support member 180 contacts the stopper baffle 130, the first sensor 211 is triggered. At this time, the third positioning member 191 can be controlled to be positioned and engaged with the fourth positioning member, so that the transmission member 154 can synchronously drive the push-up pin support member 180 and the guard ring support member 122 to descend to the first position. When the push-up pin support member 180 is in the first position, the second sensor 212 is triggered. At this time, the third positioning member 191 and the fourth positioning member can be controlled to release the engagement. The push-up pin support member 180 is separated from the transmission member 154, and only the transmission member 154 continues to descend.

[0036] Optionally, both the third positioning member 191 and the fourth positioning member may be magnetic members, and at least one of the third positioning member 191 and the fourth positioning member is a solenoid. When the solenoid is turned on, the third positioning member 191 and the fourth positioning member are magnetically engaged, which is easy to control.

[0037] In an optional embodiment, the third positioning member 191 is provided on the bottom surface of the push-up pin support member 180. In another optional embodiment, the third positioning member 191 is provided on the side wall of the push-up pin support member 180. The third positioning member 191 includes a second main body and a second magnetic head. The second main body is provided on the push-up pin support member 180, and the second magnetic head is movably provided on the second main body. A second positioning groove is provided in the fourth positioning member. When the second magnetic head is turned on, the second magnetic head is positioned and engaged with the second positioning groove. At this time, not only a magnetic positioning engagement exists, but also a mechanical positioning engagement exists, thereby improving the positioning stability between the third positioning member 191 and the fourth positioning member. Optionally, the transmission member 154 may be a magnetic member or a non-magnetic member. When the transmission member 154 is a non-magnetic member, the fourth positioning member may be provided separately on the transmission member 154. At this time, the structure and installation position of the fourth positioning member can be flexibly selected, facilitating the positioning engagement between the third positioning member 191 and the fourth positioning member. When the transmission member 154 is a magnetic member, the fourth positioning member is provided integrally with the transmission member 154. At this time, the structure of the wafer mounting device is simpler and the cost is lower.

[0038] In a further optional embodiment, the wafer placement device further includes a telescopic seal member 170 and at least one second guide 230. The telescopic seal member 170 is fitted outside the adapter 157, and one end of the telescopic seal member 170 is sealingly connected to the bottom plate 112. The cavity of the telescopic seal member 170 communicates with the cavity of the base 110, and the other end of the telescopic seal member 170 is connected to the adapter 157, thereby isolating the cavity of the base 110 from the external environment, so that the process conditions are satisfied. The second guide 230 is provided between the bottom plate 112 and the guard ring support member 122. The guard ring support member 122 can move relative to the bottom plate 112 along the second guide 230 in the vertical direction, thereby avoiding the inclination of the guard ring support member 122 and improving the movement accuracy of the guard ring support member 122. Further optionally, the number of the second guides 230 may be at least two, and each second guide 230 is provided at an interval to disperse the acting force, thereby improving the guiding accuracy. Of course, the number of the second guides 230 may be provided according to the actual requirements and is not particularly limited herein.

[0039] Optionally, the wafer placement device further includes a cylinder guide 250 and at least one third guide 240. Both the cylinder guide 250 and the third guide 240 are provided on the bottom plate 112 and are located on both sides of the cylinder 151 respectively. The cylinder 151 drives the transmission member 154 to move along the cylinder guide 250 and the third guide 240. The cylinder guide 250 and the third guide 240 provide a guiding action for the movement of the output shaft of the cylinder 151 and the transmission member 154, and improve the movement stability of the transmission member 154. Optionally, the transmission member 154 may have a Z-shaped structure. The transmission member includes a first plate, a second plate and a third plate which are sequentially connected. The first plate is parallel to the third plate, and the second plate is bent with respect to the first plate and the third plate respectively. When the edge guard ring 121 is in the first position, the first plate contacts the push pin support member 180, and the third plate is connected to the output shaft of the cylinder 151.

[0040] When the push-up pin support member 180 is engaged with the first guide 220, the first guide 220 and the second guide 230 may be provided separately. In another alternative embodiment, the first guide 220 and the second guide 230 may be provided coaxially, and both may have an integral structure. In this case, the transmission member 154 and the push-up pin support member 180 may be fitted together into the same guide, thereby facilitating the installation of the first guide 220 and the second guide 230. Optionally, when the first guide 220 and the second guide 230 are provided coaxially and both have an integral structure, the guide may be provided on the bottom surface of the anti-pad 280. At this time, it is not necessary to provide the stopper baffle 130, thereby simplifying the structure and saving costs.

[0041] In an optional embodiment, the drive assembly 150 further includes a first throttle valve 152 and a second throttle valve 153. The first throttle valve 152 is provided in the first gas passage of the cylinder 151. Optionally, the first throttle valve 152 may be provided in the first through hole of the cylinder 151 or in the first gas pipeline of the cylinder 151, and is not particularly limited herein. The second throttle valve 153 is provided in the second gas passage of the cylinder 151. Optionally, the second throttle valve 153 may be provided in the second through hole of the cylinder 151 or in the second gas pipeline of the cylinder 151, and is not particularly limited herein. The first end of the transmission member 154 is connected to the output shaft of the cylinder 151, and the second end of the transmission member 154 is connected to the guard ring support member 122. The cylinder 151 drives the guard ring support member 122 to move through the transmission member 154. In the process flow, by adjusting the intake air volume of the cylinder 151 through the first throttle valve 152 or the second throttle valve 153, the lifting stability of the edge guard ring 121 is improved. When the output shaft of the cylinder 151 is rising, gas enters the cylinder 151 from within the first gas passage and then is discharged from the second gas passage. At the same time, the opening degree of the first throttle valve 152 gradually increases, thereby adjusting the intake air volume within the cylinder 151. When the output shaft of the cylinder 151 is descending, gas enters the cylinder 151 from within the second gas passage and then is discharged from the first gas passage. At the same time, the opening degree of the second throttle valve 153 gradually increases, thereby adjusting the intake air volume within the cylinder 151. As can be seen from this, the first gas passage and the second gas passage of the embodiment of the present application may serve as intake passages or exhaust passages. By providing the first throttle valve 152 and the second throttle valve 153 in the first gas passage and the second gas passage respectively, the intake air volume entering the cylinder 151 is adjusted, the movement stability of the output shaft of the cylinder 151 is adjusted, and furthermore, the control accuracy for adjusting the process position of the edge guard ring 121 is improved.

[0042] In another alternative embodiment, the drive assembly 150 further includes a first flow-limiting spacer 155 and a second flow-limiting spacer 156. The first flow-limiting spacer 155 is provided in the first gas passage. When the output shaft of the cylinder 151 is rising, the first flow-limiting spacer 155 is used to adjust the intake air volume entering the cylinder 151, ensuring the smoothness of the gas supply in the cylinder 151, thereby improving the rising stability of the transmission member 154. The second flow-limiting spacer 156 is provided in the second gas passage. When the output shaft is descending, the second flow-limiting spacer 156 is used to adjust the intake air volume entering the cylinder 151, ensuring the smoothness of the gas supply in the cylinder 151, thereby improving the descending stability of the transmission member 154.

[0043] Optionally, in an embodiment where the drive assembly 150 further includes a first throttle valve 152 and a second throttle valve 153, the drive assembly 150 may further include a first flow-limiting spacer 155 and a second flow-limiting spacer 156. When the first gas passage is an intake passage, the combined action of the first throttle valve 152 and the first flow-limiting spacer 155 adjusts the intake air flow rate of the first gas passage, thereby further improving the movement stability of the edge guard ring 121. Similarly, when the second gas passage is an intake passage, the combined action of the second throttle valve 153 and the second flow-limiting spacer 156 adjusts the intake air flow rate of the second gas passage, thereby further improving the movement stability of the edge guard ring 121. At the same time, the first throttle valve 152, the second throttle valve 153, the first flow-limiting spacer 155, and the second flow-limiting spacer 156 can reduce the gas flow rate of the cylinder 151 when the transmission member 154 is positioned and engaged with the base 110, further reducing the acting force exerted by the cylinder 151 on the transmission member 154 so that the acting force cannot drive the transmission member 154 to move. Installed in this way, there is no need to close the cylinder 151. When the cylinder 151 needs to drive the transmission member 154 to move again, the gas flow rate can be directly adjusted, and there is no need to restart the cylinder 151 over a relatively long period of time.

[0044] Optionally, the first flow-limiting spacer 155 may be located downstream of the first throttle valve 152 or upstream of the first throttle valve 152, and is not particularly limited herein. Optionally, the second flow-limiting spacer 156 may be located downstream of the second throttle valve 153 or upstream of the second throttle valve 153, and is not particularly limited herein.

[0045] In a further optional embodiment, the drive assembly 150 further includes a damping spring. One end of the damping spring is connected to the output shaft of the cylinder 151, and the other end is connected to the transmission member 154. When the output shaft of the cylinder 151 is rising or falling, the damping spring can absorb the vibration of the output shaft, thereby adjusting the movement stability of the output shaft and further improving the control accuracy for adjusting the edge guard ring 121. In an embodiment where the drive assembly 150 includes the first throttle valve 152, the second throttle valve 153, the first flow-limiting spacer 155, and the second flow-limiting spacer 156, the drive assembly 150 may include a damping spring. At this time, when the output shaft is rising or falling, the damping spring, the throttle valve, and the flow-limiting spacer jointly adjust the movement stability of the output shaft, which is advantageous for further improving the control accuracy for adjusting the edge guard ring 121.

[0046] In an optional embodiment, the first detection assembly 140 includes a first photoelectric sensor 141, a first signal processor 143, a second photoelectric sensor 142, and a second signal processor 144. Among the two opposing surfaces of the guard ring support member 122 and the bottom plate 112, the first signal processor 143 is provided on one side, and the second signal processor 144 is provided on the other side. The first photoelectric sensor 141 is provided on the first signal processor 143, and the two are electrically connected. The second photoelectric sensor 142 is provided on the second signal processor 144, and the two are electrically connected. The first photoelectric sensor 141 and the second photoelectric sensor 142 are provided staggeredly. The first signal processor 143 is used to reflect the light rays emitted from the second photoelectric sensor 142, and the second signal processor 144 is used to reflect the light rays emitted from the first photoelectric sensor 141. When the drive assembly 150 drives the guard ring support member 122 to move relative to the base 110, the distance between the guard ring support member 122 and the base 110 changes, the intensity of the light rays irradiated from the first photoelectric sensor 141 to the second signal processor 144 changes, the second signal processor 144 reflects the light rays to the first photoelectric sensor 141, and the first signal processor 143 electrically connected to the first photoelectric sensor 141 calculates the distance between the guard ring support member 122 and the base 110 based on the change in the intensity of the reflected light rays. In another optional aspect, since the distance between the guard ring support member 122 and the base 110 changes, the second signal processor 144 can calculate the distance between the guard ring support member 122 and the base 110 by calculating the time difference between the incidence of the light rays and the reflection of the light rays, which is not particularly limited here.

[0047] Similarly, the intensity of the light beam irradiated from the second photoelectric sensor 142 to the first signal processor 143 changes, and the first signal processor 143 reflects the light beam to the second photoelectric sensor 142. The second signal processor 144 electrically connected to the second photoelectric sensor 142 calculates the distance between the guard ring support member 122 and the base 110 based on the change in the intensity of the reflected light beam, thereby improving the detection accuracy of the first position detection assembly 140. In another optional aspect, since the distance between the guard ring support member 122 and the base 110 changes, the first signal processor 143 can also calculate the distance between the guard ring support member 122 and the base 110 by calculating the time difference between the incidence of the light beam and the reflection of the light beam, which is not particularly limited here. By providing two sets of sensors and processors, the adjustment accuracy can be improved when adjusting the position of the edge guard ring 121.

[0048] Optionally, the first signal processor 143 and the second signal processor 144 are manufactured from a reflective material. Optionally, the first photoelectric sensor 141 and the second photoelectric sensor 142 may be other detection components, which are not particularly limited here. Further optionally, the first photoelectric sensor 141 and the second photoelectric sensor 142 may be of the same type of photoelectric sensor or different types of photoelectric sensors, which are not particularly limited here.

[0049] The operation process of the wafer placement device disclosed in the embodiments of the present application will be briefly described as follows.

[0050] While the edge guard ring 121 is rising from the process position to the wafer transfer position, the cylinder 151 drives the transmission member 154 to rise along the third guide 240 until the edge guard ring 121 reaches the first position. At this time, the transmission member 154 contacts the push-up pin support member 180. Then, the transmission member 154 pushes the push-up pin support member 180 to synchronously rise along the first guide 220. When the edge guard ring 121 rises to the wafer transfer position, the push-up pin support member 180 abuts against the stopper baffle 130. At this time, the first sensor 211 is triggered, and the cylinder 151 is further closed. At the same time, the third positioning member 191 and the fourth positioning member are positioned and engaged, and the push-up pin support member 180 is fastened to the transmission member 154. After the wafer transfer is completed, the cylinder 151 is activated again, so that the edge guard ring 121 can descend from the wafer transfer position to the process position. While the edge guard ring 121 is descending from the wafer transfer position to the process position, the cylinder 151 drives the transmission member 154 to synchronously drive the push-up pin support member 180 to descend along the first guide 220 until the second sensor 212 is triggered. At this time, the edge guard ring 121 is located at the first position, the third positioning member 191 and the fourth positioning member are disengaged, the push-up pin support member 180 stops descending, and the transmission member 154 continues to drive the edge guard ring 121 to descend to the process position. While the edge guard ring 121 is descending from the first position to the process position, the first detection assembly 140 is activated and used to detect the distance between the guard ring support member 122 and the base 110. The drive assembly 150 adjusts the process position of the edge guard ring 121 based on this distance, so that the edge guard ring 121 can reach different process positions along with the process flow.

[0051] The above has described the embodiments of the present application with reference to the drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. A person skilled in the art can, without departing from the spirit of the present application and the scope of protection of the claims, form more embodiments, all of which fall within the protection scope of the present application.

Description of Reference Signs

[0052] 110 Base 111 Housing 112 Bottom Plate 120 Edge Guard Ring Assembly 121 Edge Guard Ring 122 Guard Ring Support Member 123 Guard Ring Connecting Rod 123a Support Pin 123b Support Pin Sleeve 130 Stopper Baffle 140 First Detection Assembly 141 First Photoelectric Sensor 142 Second Photoelectric Sensor 143 First Signal Processor 144 Second Signal Processor 150 Drive Assembly 151 Cylinder 152 First Throttle Valve 153 Second Throttle Valve 154 Transmission Member 155 First Flow Limiting Spacer 156 Second Flow Limiting Spacer 157 Adapter 160 First Positioning Assembly 161 First Positioning Member 162 Second Positioning Member 170 Telescopic Sealing Member 180 Pushing Pin Support Member 190 Second Positioning Assembly 191 Third Positioning Member 210 Second Detection Assembly 211 First Sensor 212 Second Sensor 213 Optical Fiber Conductive Member 220 First Guide 230 Second Guide 240 Third Guide 250 Cylinder Guide 260 Pushing Pin 270 Pushing Pin Sleeve 280 Anti-Pad

Claims

1. A wafer placement device applied to semiconductor process equipment, comprising: a base, an edge guard ring assembly, a first detection assembly, and a drive assembly, wherein the base is used for placing a wafer, and has a cavity inside; the edge guard ring assembly includes an edge guard ring, a guard ring support member, and a plurality of guard ring connection rods; the edge guard ring is provided above the base, the guard ring support member is provided below the base at an interval, and all of the plurality of guard ring connection rods are connected between the guard ring support member and the edge guard ring, the drive assembly is provided in the cavity and connected to the guard ring support member, and is used for driving the guard ring support member to move the edge guard ring vertically between a wafer transfer position and a process position via the plurality of guard ring connection rods, the first detection assembly is used for detecting a distance in the vertical direction between the guard ring support member and the base, and controlling the drive assembly to drive the guard ring support member to move based on the distance, so as to adjust the process position of the edge guard ring. A wafer placement device characterized by the above.

2. Further comprising a first positioning assembly, wherein the first positioning assembly is provided in the cavity and is used for positioning the drive assembly and fixing the edge guard ring at its current position. The wafer placement device according to claim 1, characterized by the above.

3. The first positioning assembly includes a first positioning member and a second positioning member. The first positioning member is connected to the drive assembly, and the second positioning member is connected to the base. When the drive assembly drives the guard ring support member to move, the first positioning member moves along the vertical direction with respect to the second positioning member, and at least one of the first positioning member and the second positioning member is movable along a first direction forming an angle with the vertical direction, and the first positioning member and the second positioning member can be switched between positioning engagement and release of positioning engagement. The wafer placement device according to claim 2, characterized by the above.

4. At least one of the first positioning member and the second positioning member is a solenoid. When the solenoid is turned on, the first positioning member is positioned and engaged with the second positioning member. When the solenoid is turned off, the positioning engagement between the first positioning member and the second positioning member is released. The wafer mounting device according to claim 3, characterized in that.

5. The second positioning member extends along the vertical direction, so that when the first positioning member moves, the second positioning member can always overlap the first positioning member in the first direction. The wafer mounting device according to claim 4, characterized in that.

6. The drive assembly includes a cylinder, a transmission member, and an adapter. The cylinder is provided on the bottom plate of the base. The first end of the transmission member is connected to the output shaft of the cylinder. The second end of the transmission member is connected to one end of the adapter. The other end of the adapter penetrates the bottom plate and is connected to the guard ring support member. The cylinder drives the adapter to move up and down through the transmission member, thereby driving the guard ring support member to move. The wafer mounting device according to any one of claims 1 to 5, characterized in that.

7. Further includes a push-up pin support member and a stopper baffle, The stopper baffle is fixedly provided in the cavity. A plurality of first guides extending along the vertical direction are provided on the bottom surface of the stopper baffle. The push-up pin support member is in sliding contact with the plurality of first guides. When the edge guard ring rises to the first position, the transmission member contacts the push-up pin support member. In the process of the transmission member continuously driving the edge guard ring to rise from the first position to the wafer transfer position, the transmission member further synchronously drives the push-up pin support member to rise until the push-up pin support member abuts against the stopper baffle. The wafer mounting device according to claim 6, characterized in that.

8. Further includes a second detection assembly, The second detection assembly includes a first sensor and a second sensor. The first sensor and the second sensor are provided at intervals along the moving direction of the push-up pin support member. When the push-up pin support member contacts the stopper baffle, the first sensor is triggered, and when the push-up pin support member is in the first position, the second sensor is triggered. The wafer mounting device according to claim 7, characterized in that.

9. Further comprising a second positioning assembly, The second positioning assembly includes a third positioning member and a fourth positioning member. The third positioning member is provided on the push-up pin support member, and the fourth positioning member is provided on the transmission member. When the push-up pin support member contacts the stopper baffle, the third positioning member is positioned and engaged with the fourth positioning member, and the transmission member drives the push-up pin support member and the guard ring support member to descend synchronously to the first position. The wafer mounting device according to claim 7, characterized in that.

10. Further comprising a telescopic seal member and at least one second guide, The telescopic seal member is fitted outside the adapter, and one end of the telescopic seal member is sealingly connected to the bottom plate, the other end of the telescopic seal member is connected to the adapter, the second guide is provided between the bottom plate and the guard ring support member, and the guard ring support member can move relative to the bottom plate along the second guide in the vertical direction. The wafer mounting device according to claim 6, characterized in that.

11. Further comprising a cylinder guide and at least one third guide, Both the cylinder guide and the third guide are provided on the bottom plate and are located on both sides of the cylinder respectively. The cylinder drives the transmission member to move along the cylinder guide and the third guide. The wafer mounting device according to claim 6, characterized in that.

12. The drive assembly further includes a first throttle valve and a second throttle valve. The first throttle valve is provided in the first gas passage of the cylinder, the second throttle valve is provided in the second gas passage of the cylinder, and / or The drive assembly further includes a first flow-limiting spacer and a second flow-limiting spacer. The first flow-limiting spacer is provided in the first gas passage, and the second flow-limiting spacer is provided in the second gas passage. The wafer mounting device according to claim 6, characterized in that.

13. The first detection assembly includes a first optoelectronic sensor, a first signal processor, a second optoelectronic sensor, and a second signal processor. Among the two opposing surfaces of the guard ring support member and the base, the first signal processor is provided on one surface, and the second signal processor is provided on the other surface. The first optoelectronic sensor is provided on the first signal processor, and the two are electrically connected. The second optoelectronic sensor is provided on the second signal processor, and the two are electrically connected. The first optoelectronic sensor and the second optoelectronic sensor are provided staggeredly. The first signal processor is used to reflect the light rays emitted from the second optoelectronic sensor, and the second signal processor is used to reflect the light rays emitted from the first optoelectronic sensor. The wafer mounting device according to any one of claims 1 to 5, characterized in that.

14. A semiconductor processing apparatus comprising the wafer mounting device according to any one of claims 1 to 13, characterized in that.

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