Noise minimization structure of a high-intensity focused ultrasonic generator

Abstract

The high-intensity focused ultrasound generating apparatus according to the present invention is configured such that the ultrasonic radiation frame, the transducer holder, and the transducer are integrated as an electrode, so that the EMI (Electro Magnetic Interference) noise that was concentrated only on the transducer can be passed to the ultrasonic radiation frame, and the noise can be minimized. Therefore, there is an advantage that signal loss due to noise is prevented and an RF signal can be applied more stably. Further, since the ultrasonic radiation frame, the transducer holder, and the transducer are configured as an integrated electrode, the negative electrode of the power supply unit can be connected to the negative electrode of the ultrasonic radiation frame or a single transducer. Therefore, there is an advantage that the circuit structure can be made very simple compared to a structure in which each of a plurality of transducers is connected.

Description

Technical Field

[0001] The present invention relates to a noise minimization structure of a high-intensity focused ultrasound generating apparatus. More specifically, a plurality of transducers are individually mounted on an ultrasonic radiation frame by transducer holders, and the transducers, the transducer holders, and the ultrasonic radiation frame are grounded, serving as an integrated electrode to minimize the noise that was concentrated only on the transducers. The present invention relates to a noise minimization structure of a high-intensity focused ultrasound generating apparatus.

Background Art

[0002] Generally, a high-intensity focused ultrasound (HIFU) generating apparatus focuses ultrasonic waves generated from a transducer to generate high-intensity ultrasonic energy, and irradiates this to the affected part of a patient to raise the temperature of the affected part, thereby enabling treatment of the affected part without surgery.

[0003] In a conventional high-intensity focused ultrasound generating apparatus when using dozens or hundreds of transducers, after mounting a large number of transducers on the front surface of an ultrasonic radiation frame, the entire front surface of the ultrasonic radiation frame is coated with glue to form a waterproof layer, thereby fixing a large number of transducers with the waterproof layer and preventing water leakage.

[0004] However, since the ultrasonic energy generated forward from the transducer is absorbed by the waterproof layer, there is not only a problem that the input voltage has to be increased to compensate for this, but also EMI (Electro Magnetic Interference) noise is generated by a large number of transducers, and there is a problem that the ultrasonic radiation frame has to be replaced even if only any one of the large number of transducers fails.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The present invention has been made in view of the above circumstances, and an object thereof is to provide a noise minimization structure for a high-intensity focused ultrasonic generator that enables easy replacement and repair of a transducer and can minimize noise generation and improve stability.

Means for Solving the Problems

[0006] The noise minimization structure of a high-intensity focused ultrasonic generator according to the present invention includes an ultrasonic radiation frame having a concave front surface and a plurality of coupling holes formed therein, a plurality of transducer holders respectively inserted into the plurality of coupling holes from the front of the ultrasonic radiation frame, penetrating the ultrasonic radiation frame, and detachably coupled thereto, and a plurality of transducers respectively mounted on the plurality of transducer holders so that the front surfaces are exposed. The ultrasonic radiation frame, the transducer holders, and the transducers are formed to have electrical conductivity and are integral electrodes that are in contact with each other and electrically connected.

[0007] At least one of the negative electrodes of the ultrasonic radiation frame and the transducers is connected to the negative electrode of the power supply unit and grounded, and the transducers are respectively connected to the positive electrode of the power supply unit.

[0008] The ultrasonic radiation frame, the transducer holders, and the transducers are molded from a conductive material.

[0009] At least a part of the ultrasonic radiation frame, the transducer holders, and the transducers is molded from a non-conductive material and the surface is coated with a conductive material.

[0010] The conductive material includes at least one of chromium, nickel, cadmium, iron, copper, platinum, gold, silver, lead, and alloy.

[0011] The transducer holder is attached to the front surface of the ultrasonic radiation frame, and includes a head portion on which a seating groove for inserting and seating the transducer is formed, and a body portion that extends rearward from the head portion, passes through the coupling hole, and is coupled by a fastening member behind the ultrasonic radiation frame.

[0012] An electrode wire hole is formed in the body portion of the transducer holder so that an electrode wire connected to the transducer can pass through and be drawn out behind the ultrasonic radiation frame, and the space between the electrode wire and the electrode wire hole is sealed with waterproof glue.

[0013] At least a part of the side surface of the seating groove of the head portion of the transducer holder is formed to be open.

[0014] At least one support protrusion is formed on the head portion of the transducer holder so as to protrude from the bottom surface of the seating groove to support the lower surface of the transducer and form a separation space between the transducer and the bottom surface.

[0015] A locking protrusion is formed on the head portion of the transducer holder so as to protrude from the bottom surface of the seating groove and have a tip bent inward, for preventing the inserted transducer in the seating groove from detaching.

[0016] The body portion of the transducer holder includes a shaft portion that extends rearward from the head portion and is press-fitted into the coupling hole, and a screw portion that extends rearward from the shaft portion, passes through the coupling hole, and is coupled to the fastening member behind the ultrasonic radiation frame.

[0017] The ultrasonic radiation frame further includes an RF board provided thereon, to which the plurality of transducers are electrically connected respectively to supply RF power to the transducers.

[0018] A plurality of electrode wires respectively connected to the plurality of transducers, and a plurality of board connectors provided on the RF board so as to correspond to the electrode wires respectively, and to which the electrode wires are detachably coupled.

[0019] The plurality of board connectors are detachably coupled to the RF board.

[0020] The RF board further includes a monitoring sensor for sensing the power supply state of the electrode wires respectively connected to the transducers and independently monitoring the operating state of the transducers.

[0021] The RF board further includes an insulating cover formed to cover the outside of the RF board.

[0022] The RF board further includes a power supply device for supplying the RF power, and a power cable connecting the RF board and the power supply device and detachably coupled to the RF board.

[0023] The ultrasonic emission frame further includes a probe coupled to the center thereof, and the RF board is provided at the remaining portion of the ultrasonic emission frame excluding the coupling portion where the probe is coupled at the back.

[0024] The noise minimization structure of the high-intensity focused ultrasound generating device according to another aspect of the present invention includes an ultrasonic radiation frame having a probe disposed at the center of the front surface and a plurality of coupling holes formed around the probe, a plurality of transducer holders respectively inserted into the plurality of coupling holes from the front of the ultrasonic radiation frame, penetrating the ultrasonic radiation frame, and detachably coupled behind the ultrasonic radiation frame, and a plurality of transducers respectively mounted on at least a part of the open front surfaces of the plurality of transducer holders. The transducer holder includes a head portion seated on the front surface of the ultrasonic radiation frame and having a seating groove formed therein for the transducer to be inserted and seated, and a body portion extending rearward from the head portion, penetrating the coupling hole, and coupled by a fastening member behind the ultrasonic radiation frame. The head portion has a plurality of support protrusions protruding from the bottom surface of the seating groove to support the lower surface of the transducer and form a separation space between the transducer and the bottom surface. The ultrasonic radiation frame, the transducer holder, and the transducer are each formed to have electrical conductivity and are integral electrodes that are in contact with each other and electrically connected. At least one of the ultrasonic radiation frame and the negative electrode of the transducer is connected to the negative electrode of the power supply unit and grounded, and the positive electrode of the transducer is connected to the positive electrode of the power supply unit. The ultrasonic radiation frame, the transducer holder, and the transducer are formed of a conductive material.

[0025] The noise minimization structure of a high-intensity focused ultrasound generating apparatus according to another aspect of the present invention includes an ultrasonic radiation frame having a probe disposed at the center of the front surface and a plurality of coupling holes formed around the probe, a plurality of transducer holders respectively inserted into the plurality of coupling holes from the front of the ultrasonic radiation frame, passing through the ultrasonic radiation frame, and detachably coupled behind the ultrasonic radiation frame, and a plurality of transducers respectively mounted on at least some of the open front surfaces of the plurality of transducer holders. The transducer holder includes a head portion seated on the front surface of the ultrasonic radiation frame and having a seating groove formed therein for inserting and seating the transducer, and a body portion extending rearward from the head portion, passing through the coupling hole, and coupled by a fastening member behind the ultrasonic radiation frame. The head portion is formed with a plurality of support protrusions protruding from the bottom surface of the seating groove to support the lower surface of the transducer and form a separation space between the transducer and the bottom surface. The ultrasonic radiation frame, the transducer holder, and the transducer are each formed to have electrical conductivity and are integral electrodes in contact with each other and electrically connected. At least one of the ultrasonic radiation frame and the negative electrode of the transducer is connected to the negative electrode of the power supply unit and grounded, the positive electrode of the transducer is connected to the positive electrode of the power supply unit, and at least some of the ultrasonic radiation frame, the transducer holder, and the transducer are molded of a non-conductive material and have a surface coated with a conductive material.

[0026] The noise minimization structure of the high-intensity focused ultrasound generating apparatus according to still another aspect of the present invention includes an ultrasonic radiation frame having a probe disposed at the center of the front surface and a plurality of coupling holes formed around the probe, a plurality of transducer holders respectively inserted into the plurality of coupling holes from the front of the ultrasonic radiation frame, penetrating the ultrasonic radiation frame, and detachably coupled behind the ultrasonic radiation frame, and a plurality of transducers respectively mounted on at least a part of the open front surfaces of the plurality of transducer holders. The ultrasonic radiation frame, the transducer holder, and the transducer are integrally formed electrodes having electrical conductivity and are electrically connected in contact with each other. The ultrasonic radiation frame further includes an RF board provided for supplying an RF power source to the transducer, a plurality of electrode lines respectively connected to the plurality of transducers, a plurality of board connectors provided on the RF board to correspond to the electrode lines respectively, and the electrode lines are detachably coupled thereto, and a monitoring sensor provided on the RF board for sensing the power supply state of the electrode lines respectively connected to the transducers and independently monitoring the operating state of the transducers.

[0027] The noise minimization structure of a high-intensity focused ultrasound generator according to still another aspect of the present invention includes an ultrasonic radiation frame having a concave front surface and a plurality of coupling holes formed therein, a plurality of transducer holders respectively inserted into the plurality of coupling holes from the front of the ultrasonic radiation frame, passing through the ultrasonic radiation frame, and detachably coupled thereto, and a plurality of transducers respectively mounted on the plurality of transducer holders such that the front surfaces thereof are exposed. The ultrasonic radiation frame, the transducer holders, and the transducers are integrally formed electrodes having electrical conductivity and are electrically connected by contacting each other. An RF board provided on the ultrasonic radiation frame, to which the plurality of transducers are respectively electrically connected to supply an RF power source to the transducers, a plurality of electrode lines respectively connected to the plurality of transducers, a plurality of board connectors provided on the RF board to correspond to the electrode lines respectively, and to which the electrode lines are detachably coupled, a monitoring sensor provided on the RF board to monitor the operating state of the transducers, and an insulating cover formed to cover the outside of the RF board are further included. The transducer holder includes a head portion seated on the front surface of the ultrasonic radiation frame and having a seating groove into which the transducer is inserted and seated, and a body portion extending rearward from the head portion, passing through the coupling hole, and coupled by a fastening member behind the ultrasonic radiation frame. An electrode line hole is formed in the body portion of the transducer holder so that the electrode line passes therethrough and can be drawn out behind the ultrasonic radiation frame.

Advantages of the Invention

[0028] In the high-intensity focused ultrasound generating device according to the present invention, since the ultrasonic radiation frame, the transducer holder, and the transducer are configured as an integrated electrode, the EMI (Electro Magnetic Interference) noise that was concentrated only on the transducer can be made to flow to the ultrasonic radiation frame, and the noise can be minimized. Therefore, there is an advantage that signal loss due to noise is prevented and an RF signal can be applied more stably.

[0029] Also, since the ultrasonic radiation frame, the transducer holder, and the transducer are configured as an integrated electrode, the negative electrode of the power supply unit can be connected to the negative electrode of the ultrasonic radiation frame or a single transducer. Therefore, there is an advantage that the circuit structure can be made very simple compared to a structure in which each of a plurality of transducers is connected.

[0030] Furthermore, by forming the transducer holder and the transducer as an integrated electrode, it is possible to minimize the loss of sound waves during the vibration of the transducer.

[0031] Also, since a plurality of transducers are individually mounted on the ultrasonic radiation frame by transducer holders, and the transducer holders and the transducers are in contact with each other and electrically connected, there is no need to solder electrode wires to the front surface of the transducers. Therefore, it is possible to prevent the occurrence of water leakage due to the soldering structure, and manufacturing becomes easier.

[0032] Furthermore, since an RF board for applying an RF power supply is provided on the back surface of the ultrasonic radiation frame, when repair or replacement of some of the plurality of transducers is required, it is easy to repair or replace only the corresponding transducer because the plurality of transducers are individually connected to the RF board via board connectors.

[0033] In addition, by providing a monitoring sensor on the RF board, the states of a plurality of transducers can be individually monitored, so that there is an advantage in that it is easier to identify transducers that require repair or replacement and respond promptly.

Brief Description of the Drawings

[0034]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Modes for Carrying Out the Invention

[0035] Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described as follows.

[0036] The high-intensity focused ultrasound generating device according to an embodiment of the present invention is a device using high-intensity focused ultrasound (HIFU). The high-intensity focused ultrasound generating device includes a transducer array in which dozens or hundreds of transducers are arranged radially. It can not only treat the affected part of a patient with a tumor or the like, but also stimulate the brain to treat Alzheimer's disease, depression, etc., and can also apply heat to a specific site to enhance immunity.

[0037] FIG. 1 is a perspective view showing a head module of a high-intensity focused ultrasound generating device according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view showing a coupling structure of an ultrasonic radiation frame and a transducer holder according to the first embodiment of the present invention.

[0038] Referring to FIGS. 1 and 2, the head module of the high-intensity focused ultrasound generating device includes an ultrasonic radiation frame 10, a plurality of transducers 20, and a plurality of transducer holders 100.

[0039] The ultrasonic radiation frame 10 is formed to have electrical conductivity. The ultrasonic radiation frame 10 will be described by taking an example of being formed of a conductive material. The conductive material will be described by taking an example of being a metal having electrical conductivity. However, it is not limited thereto, and of course, the ultrasonic radiation frame 10 may be formed of a non-conductive material and then the surface may be coated with the conductive material. When coated with the conductive material, the thickness of the coating layer is set to a skin depth that allows current conduction.

[0040] The ultrasonic radiation frame 10 has a probe 11 coupled to the center of the front surface 10a, and a plurality of coupling holes 12 are arranged radially around the probe 11. The ultrasonic radiation frame 10 is formed in a dish shape with a concave front surface so that ultrasonic waves radiated from the plurality of transducers 20 can be focused and radiated to one place.

[0041] The plurality of coupling holes 12 are through holes formed at predetermined intervals from each other. The number of the coupling holes 12 is set according to the number of the transducers 20.

[0042] The plurality of transducers 20 are formed to have electrical conductivity. The plurality of transducers 20 include piezoelectric elements. The transducer 20 generates ultrasonic waves when voltage is applied thereto. The transducer 20 will be described by taking an example that it is formed in a disc shape. Dozens or hundreds of the transducers 20 are radially arranged to form a transducer array. The number of the transducers 20 can be set according to the ultrasonic energy to be radiated.

[0043] Each surface of the transducer 20 is coated with an electrode material that is a conductive material. That is, the transducer 20 is made of a piezoelectric element material inside and the surface is coated with an electrode material.

[0044] The transducer holder 100 is formed to have electrical conductivity. In this embodiment, the transducer holder 100 will be described by taking an example that after being molded with a non-conductive material, each surface is coated with a conductive material. That is, the transducer holder 100 is molded with a resin material and the surface is coated with the conductive material as an example.

[0045] The conductive material includes, for example, at least one of chromium, nickel, cadmium, iron, copper, platinum, gold, silver, lead, and alloys. However, the present invention is not limited thereto, and any material having electrical conductivity can be applied.

[0046] In this embodiment, the chromium coating layer 170 is formed on the surface of the transducer holder 100 as an example.

[0047] The transducer holder 100 is detachably coupled to each of the plurality of coupling holes 12 of the ultrasonic radiation frame 10.

[0048] The transducers 20 are respectively coupled to the transducer holder 100. The transducer holder 100 and the transducers 20 are integral electrodes that are in contact with each other and electrically connected. The electrodes are connected to a power supply unit described later and receive an applied power supply.

[0049] Referring to FIGS. 3 to 6, the transducer holder 100 includes a head portion 110 in which a seating groove 110a into which the transducer 20 is inserted and seated is formed, and a body portion 120 that extends rearward of the head portion 110 and is coupled to the coupling hole 12.

[0050] The head portion 110 is formed to have a diameter larger than that of the coupling hole 12 so as to seat on the front surface 10a of the ultrasonic radiation frame 10. The head portion 110 is formed with the seating groove 110a, support protrusions 110b, locking protrusions 110c, and an opening 110d.

[0051] The seating groove 110a is formed such that the front surface is open at the front of the head portion 110, and is a groove formed so that the transducer 20 can be seated.

[0052] The support protrusion 110b is formed to protrude forward from the bottom surface of the seating groove 110a by a predetermined height and is a step formed to support the lower surface of the transducer 20. The support protrusion 110b forms a separation space S between the lower surface of the transducer 20 and the bottom surface of the seating groove 110a, and forms a passage through which the electrode wire 180 coupled to the transducer 20 passes, so that the structure of the electrode can be stably realized. In addition, the vibration of the transducer 20 can be enabled, and the vibration wave energy of the transducer 20 can be maximized. The support protrusions 110b are formed in plural and are spaced apart from each other by a predetermined interval as an example. However, the present invention is not limited thereto, and the support protrusion 110b may be provided as one at the center of the bottom surface of the seating groove 110a. In addition, the support protrusion 110b may be integrally formed with the head portion 110.

[0053] The locking protrusion 110c is formed to protrude from the bottom surface of the seating groove 110a and the tip thereof is bent inward, and the detachment of the transducer 20 inserted into the seating groove 110a can be prevented. The tip of the locking protrusion 110c can be changed as long as it has a shape that can prevent the detachment of the transducer 20, such as a hook shape. The locking protrusions 110c are formed such that a plurality of them are spaced apart from each other by a predetermined interval. In the present embodiment, a part of the plurality of locking protrusions 110c is described by taking as an example that they protrude from the support protrusion 110b.

[0054] The opening 110d is a part formed by being cut out and opened on the side surface of the seating groove 110a. The opening 110d has an advantage of facilitating assembly. In addition, the opening 110d enables the transducer 20 to vibrate inside the seating groove 110a so as to maximize the vibration wave energy of the transducer 20.

[0055] The body part 120 is preferably formed to extend rearward from the head part 110 and penetrate through the coupling hole 12. The body part 120 is formed smaller in diameter than the head part 110. An electrode wire hole 120a is formed at the center of the body part 120 so that an electrode wire, which will be described later, can pass through it.

[0056] The body part 120 includes a shaft part 121 and a screw part 122.

[0057] The shaft part 121 is formed in a cylindrical shape so as to extend rearward from the head part 110 and be press-fitted into the coupling hole 12.

[0058] The screw part 122 extends rearward from the shaft part 121, and screw threads are formed on the outer peripheral surface so as to be fastened by a fastening member 150.

[0059] The fastening member 150 is preferably a nut, but is not limited thereto.

[0060] On the other hand, FIG. 3 is a cross-sectional view showing a coupling structure between an ultrasonic radiation frame and a transducer holder according to an embodiment of the present invention.

[0061] The adhesive member will be described by taking a flexible glue as an example. A flexible glue layer 200 made of the flexible glue is formed between at least one of the back surface and the side surface of the transducer 20 and the head part 110. As the flexible glue, silicon or epoxy-based glue can be used, and any flexible material can be applicable.

[0062] In this embodiment, the flexible glue layer 200 will be described by taking as an example the case where it is formed between the back surface of the transducer 20 and the support protrusion 110b. However, it is not limited thereto, and the flexible glue layer 200 can also be formed between the side surface of the transducer 20 and the inner surface of the locking protrusion 110c. That is, the flexible glue layer 200 can be applied at any position as long as it does not block the front surface of the transducer 20.

[0063] Since the transducer 20 is adhered and fixed to the transducer holder 100 by the flexible glue, the position of the transducer 20 inside the transducer holder 100 is fixed while the transducer 20 can vibrate, so that the loss of vibration wave energy of the transducer 20 can be minimized. Also, since no glue is applied to the front surface of the transducer 20, loss of ultrasonic energy radiated forward from the transducer 20 can be prevented. That is, since the flexible glue layer 200 is formed only on the back surface or side surface of the transducer 20 and does not cover the front surface of the transducer 20, there is no restriction on the radiation of ultrasonic energy through the front surface.

[0064] Also, between the transducer holder 100 and the ultrasonic radiation frame 10 is sealed by a sealing member.

[0065] The sealing member includes a first sealing member 210 that seals between the head portion 110 of the transducer holder 100 and the front surface 10a of the ultrasonic radiation frame 10, and a second sealing member 220 that seals between the body portion 120 and the back surface 10b of the ultrasonic radiation frame 10.

[0066] The first sealing member 210 will be described by taking as an example two first and second O-rings 211 and 212 inserted and joined to the back surface of the head portion 110. However, the present invention is not limited thereto, and the number of the first sealing members 210 can be variously changed and applied. Further, the first sealing member 210 is made of various materials such as silicon and rubber in addition to the O-ring, and any structure that can perform sealing can be applied.

[0067] The first O-ring 211 and the second O-ring 212 are preferably formed to have different diameters from each other. The first O-ring 211 and the second O-ring 212 are inserted into a ring-shaped groove 110e formed on the back surface of the head portion 110 and are in close contact with the front surface 10a of the ultrasonic radiation frame 10 to perform sealing.

[0068] The second sealing member 220 includes a third O-ring 221 externally inserted into the shaft portion 121 of the body portion 120, and an O-ring pressing member 222 externally inserted into the shaft portion 121 behind the third O-ring 221 to bring the third O-ring 221 into close contact with the back surface 10b of the ultrasonic radiation frame 10.

[0069] The O-ring pressing member 222 is formed in a ring shape, and an inclined surface 222a is formed on the front surface so that a part of the third O-ring 221 is seated thereon.

[0070] The second sealing member 220 may further include a washer 223 provided between the O-ring pressing member 222 and the fastening member 150. The washer 223 is not an essential component of the second sealing member 220 and can be additionally included. The washer 223 can seal the third O-ring 221 and the O-ring pressing member 222 and serve to hold the transducer holder 100.

[0071] The second sealing member 220 is made of various materials such as silicon and rubber in addition to O-rings and washers, and any structure capable of sealing can be applied.

[0072] Also, a waterproof glue layer 250 made of waterproof glue is formed between the electrode wire hole 120a of the transducer holder 100 and the electrode wire 180 to be described later. The same waterproof glue as the flexible glue can be used. Furthermore, it is of course possible that the waterproof glue layer 250 is formed so as to completely fill the separation space S with the waterproof glue.

[0073] On the other hand, referring to FIG. 4, the structure of the electrode using the transducer holder 100 will be described as follows.

[0074] In the present invention, the ultrasonic radiation frame 10, the transducer holder 100, and the transducer 20 are all formed to have electrical conductivity and are an integrated electrode that is in contact with each other and electrically connected.

[0075] The ultrasonic radiation frame 10 is connected to the negative electrode of a power supply unit for supplying power and is grounded. However, it is not limited thereto, and it is of course possible that the positive electrode and the negative electrode of the power supply unit are respectively connected to the transducer 20.

[0076] The transducer 20 is connected to the positive electrode of the power supply unit respectively. The transducer 20 is connected to the power supply unit via the electrode wire 180. The electrode wire 180 can be connected to either one of the transducer holder 100 and the transducer 20. In this embodiment, the electrode wire 180 is taken as an example to illustrate that it is a wire soldered to the center of the back surface of the transducer 20. The electrode wire 180 is drawn out behind the ultrasonic radiation frame 10 through the electrode wire hole of the transducer holder 100 and connected to a separate circuit board. However, it is not limited thereto, and any power supply means such as pins, connectors, etc. can be applied as long as they can supply power.

[0077] The ultrasonic radiation frame 10 is grounded, and the transducer 20 is configured to receive the application of power from the electrode wire 180, and a current is supplied to the transducer 20 by the potential difference applied to the ultrasonic radiation frame 10 and the transducer 20 respectively.

[0078] As described above, in the present invention, the ultrasonic radiation frame 10, the transducer holder 100, and the transducer 20 form an integrated electrode, and the ultrasonic radiation frame 10 is configured to be grounded. When both the positive electrode and the negative electrode are connected to the transducer 20, the noise concentrated only on the transducer 20 can flow to the ultrasonic radiation frame 10, so that the noise can be minimized.

[0079] In addition, when the generation of noise is minimized, the loss of the signal due to noise is prevented, and the RF signal can be applied more stably, so that the high-intensity focused ultrasound can be irradiated to the accurate lesion position of the patient.

[0080] Furthermore, when individually grounding each of the plurality of transducers 20, there is a problem that the structure becomes complicated because the number of electrode wires for grounding increases. However, since the negative electrode of the power supply unit can be connected and grounded only to one ultrasonic radiation frame 10, the power supply connection and the circuit structure can be made simpler.

[0081] Also, by using the transducer holder 100 and the transducer 20 as an integrated electrode, the loss of sound waves during the vibration of the transducer can be minimized.

[0082] Therefore, since there is no need to solder the electrode wire to the front surface of the transducer 20, the occurrence of water leakage due to the soldering structure can be prevented on the front surface of the transducer 20. That is, it is possible to prevent water leakage from occurring inside from the front surface of the transducer 20 that is exposed on the front surface of the ultrasonic radiation frame 10 and contacts the liquid.

[0083] Also, since there is no need to solder the electrode wire to the front surface of the transducer 20, there is an advantage that the structure of the electrode is simplified and damage to the transducer 20 can be prevented.

[0084] Furthermore, in the high-intensity focused ultrasonic generating device configured as described above, a plurality of transducers 20 are mounted on the ultrasonic radiation frame 10 using the transducer holder 100, and the space between the transducer 20 and the transducer holder 100 is adhered and sealed with the flexible glue, so that water leakage from the front surface to the inside of the ultrasonic radiation frame 10 can be prevented without applying all the glue to the front surface of the ultrasonic radiation frame 10.

[0085] In addition, since not all the glue is applied to the front surface of the ultrasonic radiation frame 10, the entire front surface of the transducer 20 is exposed, and loss of ultrasonic energy radiated forward from the transducer 20 can be prevented. Conventionally, when the front surface of the transducer 20 is blocked by a glue layer, there is a problem that ultrasonic energy is absorbed by the glue layer. However, in the present invention, since the entire front surface of the transducer 20 is exposed, this can be prevented.

[0086] Furthermore, between the transducer 20 and inside the transducer holder 100, by being adhered with the flexible glue, the position of the transducer 20 is fixed and gaps are prevented, while the transducer 20 can vibrate. Therefore, loss of vibration wave energy of the transducer 20 can be reduced.

[0087] Also, since the plurality of transducers 20 are individually mounted via the transducer holder 100, and the transducer holder 100 is detachably coupled to the ultrasonic radiation frame 10, there is an advantage that the transducer 20 can be individually repaired and replaced.

[0088] Furthermore, since the plurality of transducers 20 are individually mounted via the transducer holder 100, there is an advantage that at least a part of the capacities of the plurality of transducers 20 can be configured to be different. For example, it is also possible to increase the capacity of the transducer arranged on the central side of the ultrasonic radiation frame 10, and of course, it is also possible to control the voltages applied to the plurality of transducers 20 to be different from each other.

[0089] Also, between the transducer holder 100 and the ultrasonic radiation frame 10, by being sealed with a sealing member such as an O-ring, not only can water leakage from the front surface to the rear of the ultrasonic radiation frame 10 be prevented, but also there is an advantage that attachment and detachment of the transducer holder from the ultrasonic radiation frame is easy.

[0090] On the one hand, in the above embodiment, the case where all the transducers 20 are coupled to the coupling holes 12 of the ultrasonic radiation frame 10 has been described as an example. However, the present invention is not limited thereto. Depending on the capacity of the high-intensity focused ultrasound generating device, it is of course possible to provide the transducers 20 only in at least a part of the coupling holes 12. When the transducers 20 are provided only in at least a part of the coupling holes 12, a transducer holder 100 is coupled to the entire coupling holes 12, and a holder cover (not shown) for shielding the open front surface may be detachably coupled to a part of the transducer holder where the transducers 20 are not coupled. The holder cover (not shown) is formed in the same shape with a material different from that of the transducers 20 and can be coupled by glue. Therefore, since the number of mounted transducers 20 can be adjusted, the energy capacity of the high-intensity focused ultrasound generating device can be adjusted.

[0091] On the other hand, FIG. 7 is a diagram showing the structure of an electrode using a transducer holder according to a second embodiment of the present invention.

[0092] Referring to FIG. 7, the structure of the electrode using the transducer holder according to the second embodiment of the present invention is different from that of the above embodiment in that the entire transducer holder 300 is formed of a conductive material, and the other remaining configurations and operations are the same as those of the above embodiment. Therefore, a detailed description of similar configurations will be omitted, and the description will be centered on the differences.

[0093] The transducer holder 300 is formed of the conductive material, and the structure and shape are those to which the above embodiment is applied.

[0094] Any material having electrical conductivity such as metal can be applied as the conductive material.

[0095] The surface of the transducer 20 is coated with an electrode material. Any electrode material that can be used as an electrode, such as a metal like silver, is applicable.

[0096] The ultrasonic radiation frame 10, the transducer holder 3 00 and the transducer 20 are all formed to have electrical conductivity and are integral electrodes that are in contact with each other and electrically connected.

[0097] The ultrasonic radiation frame 10 is connected to the negative electrode of a power supply unit for supplying power and is grounded.

[0098] The transducers 20 are each connected to the positive electrode of the power supply unit. The transducers 20 are connected to the power supply unit via electrode wires 180. The electrode wires 180 3 can be connected to either one of the transducer holder 3 00 and the transducer 20. In this embodiment, the electrode wire 180 is, for example, a wire soldered to the center of the back surface of the transducer 20. The electrode wires 180 120a are drawn out behind the ultrasonic radiation frame 10 through the electrode wire holes of the transducer holder

[0099] The transducers 20 are seated on the support protrusions 110b, and the separation space S is formed between the transducers 20 and the bottom surface of the seating grooves of the transducer holder 3 00, preventing the electrode wires 180 from contacting the surface of the transducer holder 300 and thus preventing a short circuit.

[0100] The ultrasonic emission frame 10 is grounded, the transducer 20 is configured to receive power supply from the electrode wire 180, and a current is supplied to the transducer 20 by the potential difference applied to the ultrasonic emission frame 10 and the transducer 20.

[0101] As described above, in the present invention, the ultrasonic emission frame 10, the transducer holder 3 00 and the transducer 20 form an integral electrode, and the ultrasonic emission frame 10 is configured to be grounded. When both the positive electrode and the negative electrode are connected to the transducer 20, noise that was concentrated only on the transducer 20 can flow to the ultrasonic emission frame 10, so that the noise can be minimized.

[0102] In addition, when the generation of noise is minimized, signal loss due to noise is prevented, and an RF signal can be applied more stably, so that high-intensity focused ultrasound can be irradiated to the accurate lesion position of the patient.

[0103] Furthermore, when each of the plurality of transducers 20 is individually grounded, there is a problem that the structure becomes complicated because the number of electrode wires for grounding increases. However, since the negative electrode of the power supply unit can be connected and grounded only to one ultrasonic emission frame 10, the connection of the power supply and the structure of the circuit can be made simpler.

[0104] In addition, since it is not necessary to solder the electrode wire to the front surface of the transducer 20, the occurrence of water leakage due to the soldering structure can be prevented on the front surface of the transducer 20. That is, it is possible to prevent water leakage from occurring inside from the front surface of the transducer 20 that is exposed on the front surface of the ultrasonic emission frame 10 and comes into contact with the liquid.

[0105] Furthermore, since there is no need to solder the electrode wires to the front surface of the transducer 20, the structure of the electrodes is simplified, and there is an advantage that damage to the transducer 20 can be prevented. Also, at least a part of the side surface and the back surface of the transducer 20 is coated with a waterproof material, which can prevent corrosion due to water intrusion or a phenomenon in which the output value fluctuates.

[0106] On the other hand, FIG. 8 is a rear view showing an ultrasonic radiation frame and an RF board according to a third embodiment of the present invention. FIG. 9 is a cross-sectional view taken along line A-A of FIG. 8.

[0107] Referring to FIGS. 8 and 9, the high-intensity focused ultrasonic generating device according to the third embodiment of the present invention is provided in the ultrasonic radiation frame 10, and further includes an RF board 260 to which the plurality of transducers 20 are electrically connected to supply RF power to the transducers 20. This is different from the first and second embodiments. Since the other remaining configurations and operations are similar, the following will mainly explain the different configurations, and detailed explanations of the similar configurations will be omitted.

[0108] Taking as an example, the transducer holder 100 is connected to the negative electrode of the RF board 260 and grounded, and the transducer 20 is connected to the positive electrode of the RF board 260 to receive the application of the RF power.

[0109] The transducer holder 100 and the transducer 20 are respectively connected to the board connector 261 of the RF board 260 via the electrode wires.

[0110] The electrode wires include a first electrode wire (not shown) connecting the transducer holder 100 and the board connector 261, and a second electrode wire 1 9 0 connecting the transducer 20 and the board connector 261.

[0111] The second electrode wire 1 90 is a wire that is soldered and connected to the center of the back surface of the transducer 20 to supply RF power to the transducer 20. The second electrode wire 1 9 0 is arranged to pass through the electrode wire hole 120a of the transducer holder 100. The second electrode wire 1 9 0 is drawn out behind the ultrasonic radiation frame 10 through the electrode wire hole 120a and connected to the RF board 260.

[0112] The RF board 260 is detachably coupled to the back surface of the ultrasonic radiation frame 10 and is connected to a plurality of first electrode wires (not shown) respectively connected to the plurality of transducer holders 100 and a plurality of second electrode wires 1 9 to which 0 is connected.

[0113] The RF board 260 is arranged in the remaining part except the center so as to prevent interference with the probe 11 when the probe 11 is coupled behind the ultrasonic radiation frame 10. Also, the RF board 260 can be composed of a plurality. In this embodiment, the RF board 260 is described by taking the example that four of them are each arc-shaped and connected to each other to form a ring shape. When the RF board 260 is composed of a plurality, it is also possible to connect to each other, and of course, it is also possible to arrange them so as to be separated from each other by a predetermined interval. Also, the number and shape of the RF board 260 can be variously changed as long as it is a shape that can prevent interference with the probe 11. That is, the RF board 260 can be variously changed as long as it is a shape arranged in the remaining part except the central part which is the coupling part where the probe 11 is coupled by the ultrasonic radiation frame 10. For example, one or more RF boards 260 can be arranged in shapes such as a square, a triangle, and a semi-circular shape in the remaining part except the central part of the ultrasonic radiation frame 10.

[0114] Also, when there are n RF boards 260, the plurality of transducers 20 can be classified into n bundles according to their positions, and the plurality of transducers 20 can be respectively connected to the n RF boards 260 for each bundle. Therefore, the RF board 260 can be individually replaced and repaired.

[0115] The RF board 260 is provided with a plurality of board connectors 261.

[0116] The board connector 261 is a connector provided on the RF board 260 to which the first and second electrode lines 1 9 0 are detachably coupled. The board connector 261 is formed corresponding to the number of the transducers 20 so that the transducers 20 are independently connected. However, it is not limited thereto, and at least two or more transducers 20 can be coupled to one board connector 261, and of course, the number of the board connectors 261 can be more than the number of the transducers 20. Also, the board connector 261 can be integrally provided on the RF board 260, or can be detachably coupled to the RF board 260.

[0117] The RF board 260 further includes a monitoring sensor (not shown).

[0118] The monitoring sensor (not shown) is a sensor provided on the RF board 260 for independently monitoring the operating state of the transducer 20. In this embodiment, the monitoring sensor (not shown) is described by taking as an example sensing the power supply state of the second electrode lines 1 9 0 respectively connected to the transducers 20 to sense the normal operation or abnormal operation of the transducers 20. For example, the monitoring sensor (not shown) Second the electrode line 1 9Taking, for example, a current sensor or a voltage sensor that senses overcurrent, overvoltage, or current interruption of 0, etc., as an example for description. However, it is not limited thereto, and any sensor that can sense a temperature sensor or an abnormal state of the transducer 20 is applicable.

[0119] An insulating cover 270 is provided on the outer surface of the RF board 260.

[0120] The insulating cover 270 is provided to cover the outer surface of the RF board 260 and serves as insulation. In this embodiment, the insulating cover 270 is described by taking a polyimide film as an example, but it is not limited thereto, and any insulating material is applicable. The insulating cover 270 can also be coupled to the RF board 260 using fastening members or the like, and can also be attached to the RF board 260 using a separate adhesive member.

[0121] On the other hand, the RF board 260 is connected to a power supply device (not shown) for supplying the RF power.

[0122] The RF board 260 and the power supply device (not shown) can be connected by a plurality of power cables (not shown) detachably coupled to the RF board 260. The power cable (not shown) is described by taking a BNC (Bayonet Neil-Concelman) cable provided with a BNC connector as an example, but it is not limited thereto and is variously applicable.

[0123] As described above, in this embodiment, the transducer 20 is connected to the RF board 260 and receives the application of the RF power through the RF board 260.

[0124] By connecting the plurality of transducers 20 to the board connector 261 of the RF board 260 respectively, if any one of the plurality of transducers 20 is damaged or needs to be replaced, only the corresponding transducer 20 can be repaired or replaced. That is, when a plurality of electrode wires respectively connected to the transducers 20 are bundled together and connected to a separate power supply device at once, there is a problem that not only the state of the transducers cannot be individually confirmed, but also individual repair and replacement are impossible. On the contrary, in the present invention, the RF board 260 is provided between the transducer 20 and a power supply device (not shown), and the second electrode wires 1 9 0 are respectively connected to the RF board 260 individually via a board connector 261 so that individual repair and replacement of the transducer 20 become possible.

[0125] In addition, since the states of the plurality of transducers 20 can be individually monitored using a monitoring sensor (not shown) provided on the RF board 260, only the transducers 20 that need repair or replacement can be grasped more easily and quickly, and a prompt response can be made.

[0126] Therefore, since the plurality of transducers 20 can be independently monitored and repaired or patched, maintenance and repair can be facilitated.

[0127] In addition, since the RF board 260 compatible with the probe 11 can be used, it is easy to treat various types of lesions.

[0128] On the one hand, in the above embodiment, the transducer holder 100 is grounded, and the example where the RF power supply is applied only to the transducer 20 has been described. However, the present invention is not limited thereto, and the transducer holder 100 may be connected to the negative electrode of the RF board 260, and the transducer 20 may be connected to the positive electrode of the RF board 260 so as to have a potential difference between the transducer holder 100 and the transducer 20.

[0129] On the other hand, in the above embodiment, the case where the surface of the transducer holder 100 is coated with a conductive material or the entire transducer holder 100 is formed of a conductive material so that the transducer holder 100 and the transducer 20 serve as an integral electrode has been described. However, the present invention is not limited thereto, and the transducer holder 100 may be formed of a non-conductive material, that is, an insulating material. When the transducer holder 100 is formed of an insulating material, first and second electrode lines (not shown) are connected to the upper and lower stages of the transducer 20, respectively, and the first and second electrode lines (not shown) are connected to the RF board 260.

[0130] The present invention has been described with reference to the embodiments shown in the drawings, but these are merely exemplary, and it can be understood that those having ordinary knowledge in the technical field can make various modifications and equivalent other embodiments therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical idea of the appended claims.

Industrial Applicability

[0131] According to the present invention, a high-intensity focused ultrasound generating device capable of minimizing noise can be manufactured.

Claims

1. An ultrasonic radiation frame having a concave front surface and formed with a plurality of coupling holes, a plurality of transducer holders respectively inserted into the plurality of coupling holes from the front of the ultrasonic radiation frame, penetrating the ultrasonic radiation frame, and detachably coupled thereto, a plurality of transducers respectively mounted on the plurality of transducer holders such that the front surfaces are exposed, comprising, the ultrasonic radiation frame, the transducer holder, and the transducer are each formed to have electrical conductivity and are integral electrodes that are in contact with each other and electrically connected, a noise minimization structure of a high-intensity focused ultrasound generator.

2. At least one of the negative electrodes of the ultrasonic radiation frame and the transducer is connected to the negative electrode of the power supply unit and grounded, the transducer is characterized in that each is connected to the positive electrode of the power supply unit, the noise minimization structure of the high-intensity focused ultrasound generator according to claim 1.

3. The ultrasonic radiation frame, the transducer holder, and the transducer are formed of a conductive material, the noise minimization structure of the high-intensity focused ultrasound generator according to claim 1.

4. At least a part of the ultrasonic radiation frame, the transducer holder, and the transducer is formed of a non-conductive material and the surface is coated with a conductive material, the noise minimization structure of the high-intensity focused ultrasound generator according to claim 1.

5. The conductive material includes at least one of chromium, nickel, cadmium, iron, copper, platinum, gold, silver, lead, and alloy, the noise minimization structure of the high-intensity focused ultrasound generator according to claim 3.

6. The conductive material includes at least one of chromium, nickel, cadmium, iron, copper, platinum, gold, silver, lead, and alloy, the noise minimization structure of the high-intensity focused ultrasound generator according to claim 4.

7. The transducer holder, a head portion that is seated on the front surface of the ultrasonic radiation frame and is formed with a seating groove into which the transducer is inserted and seated, a body portion that extends rearward from the head portion, penetrates the coupling hole, and is formed to be coupled by a fastening member behind the ultrasonic radiation frame. The noise minimization structure of the high-intensity focused ultrasound generating device according to claim 1, characterized by including

8. In the body part of the transducer holder, An electrode wire hole is formed so that the electrode wire connected to the transducer can pass through and be drawn out behind the ultrasonic radiation frame, The noise minimization structure of the high-intensity focused ultrasound generating device according to claim 7, characterized in that the space between the electrode wire and the electrode wire hole is sealed with waterproof glue.

9. The head part of the transducer holder The noise minimization structure of the high-intensity focused ultrasound generating device according to claim 7, characterized in that at least a part of the side surface of the seating groove is formed to be open.

10. In the head part of the transducer holder, The noise minimization structure of the high-intensity focused ultrasound generating device according to claim 7, characterized in that at least one support protrusion is formed to protrude from the bottom surface of the seating groove to support the lower surface of the transducer and form a separation space between the transducer and the bottom surface.

11. In the head part of the transducer holder, The noise minimization structure of the high-intensity focused ultrasound generating device according to claim 7, characterized in that a locking protrusion is formed to protrude from the bottom surface of the seating groove and have its tip bent inward to prevent the inserted transducer from detaching from the seating groove.

12. The body part of the transducer holder A shaft part extending rearward from the head part and press-fitted into the coupling hole, A screw part extending rearward from the shaft part, passing through the coupling hole, and then being coupled to the fastening member behind the ultrasonic radiation frame, The noise minimization structure of the high-intensity focused ultrasound generating device according to claim 7, characterized by including

13. The noise minimization structure of the high-intensity focused ultrasound generating device according to claim 1, further including an RF board provided on the ultrasonic radiation frame, to which the plurality of transducers are electrically connected respectively to supply RF power to the transducers.

14. A plurality of electrode wires respectively connected to the plurality of transducers, A plurality of board connectors provided on the RF board to correspond to the electrode wires respectively, to which the electrode wires are detachably coupled, The noise minimization structure of the high-intensity focused ultrasound generator according to claim 13, characterized by including

15. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 14, characterized in that the plurality of board connectors are detachably coupled to the RF board.

16. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 13, further including a monitoring sensor provided on the RF board for sensing the power supply state of the electrode wires respectively connected to the transducers and independently monitoring the operating state of the transducers.

17. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 13, further including an insulating cover formed to cover the outside of the RF board.

18. A power supply device for supplying the RF power to the RF board, A power cable connecting the RF board and the power supply device and detachably coupled to the RF board, The noise minimization structure of the high-intensity focused ultrasound generator according to claim 13, further characterized by including

19. The noise minimization structure of the high-intensity focused ultrasound generator according to claim 13, further including a probe coupled to the center of the ultrasonic radiation frame, wherein the RF board is provided at the remaining portion of the back surface of the ultrasonic radiation frame except for the coupling portion where the probe is coupled.

20. An ultrasonic radiation frame having a probe disposed at the center of the front surface and a plurality of coupling holes formed around the probe, A plurality of transducer holders respectively inserted into the plurality of coupling holes from the front of the ultrasonic radiation frame, penetrating the ultrasonic radiation frame, and detachably coupled at the back of the ultrasonic radiation frame, A plurality of transducers respectively mounted on the open front surfaces of at least some of the plurality of transducer holders, including wherein the transducer holder has a head portion seated on the front surface of the ultrasonic radiation frame and having a seating groove formed therein for the transducer to be inserted and seated, and a body portion extending rearward from the head portion, penetrating the coupling hole, and coupled by a fastening member at the back of the ultrasonic radiation frame, including wherein in the head portion, A plurality of support protrusions are formed to protrude from the bottom surface of the seating groove to support the lower surface of the transducer and form a separation space between the transducer and the bottom surface. The ultrasonic radiation frame, the transducer holder, and the transducer are each formed to have electrical conductivity and are an integrated electrode that is in contact with each other and electrically connected. At least one of the ultrasonic radiation frame and the negative electrode of the transducer is connected to the negative electrode of the power supply unit and grounded. The positive electrode of the transducer is connected to the positive electrode of the power supply unit. The ultrasonic radiation frame, the transducer holder, and the transducer are a noise minimization structure of a high-intensity focused ultrasonic generator formed of a conductive material.

21. An ultrasonic radiation frame having a probe disposed at the center of the front surface and a plurality of coupling holes formed around the probe, A plurality of transducer holders respectively inserted into the plurality of coupling holes from the front of the ultrasonic radiation frame, penetrating the ultrasonic radiation frame, and detachably coupled behind the ultrasonic radiation frame, A plurality of transducers respectively mounted on the open front surfaces of at least some of the plurality of transducer holders, comprising The transducer holder A head portion that is seated on the front surface of the ultrasonic radiation frame and has a seating groove into which the transducer is inserted and seated, A body portion that extends rearward from the head portion, penetrates the coupling hole, and is coupled by a fastening member behind the ultrasonic radiation frame, comprising In the head portion, A plurality of support protrusions are formed to protrude from the bottom surface of the seating groove to support the lower surface of the transducer and form a separation space between the transducer and the bottom surface. The ultrasonic radiation frame, the transducer holder, and the transducer are each formed to have electrical conductivity and are an integrated electrode that is in contact with each other and electrically connected. At least one of the ultrasonic radiation frame and the negative electrode of the transducer is connected to the negative electrode of the power supply unit and grounded. The positive electrode of the transducer is connected to the positive electrode of the power supply unit. A noise minimization structure of a high-intensity focused ultrasound generating device, wherein at least a part of the ultrasonic radiation frame, the transducer holder, and the transducer is formed of a non-conductive material and the surface is coated with a conductive material.

22. An ultrasonic radiation frame having a probe disposed at the center of the front surface and a plurality of coupling holes formed around the probe, A plurality of transducer holders respectively inserted into the plurality of coupling holes from the front of the ultrasonic radiation frame, penetrating the ultrasonic radiation frame, and detachably coupled behind the ultrasonic radiation frame, A plurality of transducers respectively mounted on the open front surfaces of at least a part of the plurality of transducer holders, comprising wherein the ultrasonic radiation frame, the transducer holder, and the transducer are each formed to have electrical conductivity and are an integral electrode in contact with each other and electrically connected, an RF board provided on the ultrasonic radiation frame for supplying an RF power source to the transducer, a plurality of electrode wires respectively connected to the plurality of transducers, a plurality of board connectors provided on the RF board to correspond to the electrode wires respectively, and to which the electrode wires are respectively detachably coupled, a monitoring sensor provided on the RF board for sensing the power supply state of the electrode wires respectively connected to the transducers and independently monitoring the operating state of the transducers, further comprising a noise minimization structure of a high-intensity focused ultrasound generating device.

23. An ultrasonic radiation frame having a concave front surface and a plurality of coupling holes formed thereon, A plurality of transducer holders respectively inserted into the plurality of coupling holes from the front of the ultrasonic radiation frame, penetrating the ultrasonic radiation frame, and detachably coupled, A plurality of transducers respectively mounted on the plurality of transducer holders such that the front surfaces are exposed, comprising wherein the ultrasonic radiation frame, the transducer holder, and the transducer are each formed to have electrical conductivity and are an integral electrode in contact with each other and electrically connected, an RF board provided on the ultrasonic radiation frame, to which the plurality of transducers are respectively electrically connected to supply an RF power source to the transducers, A plurality of electrode wires respectively connected to the plurality of transducers; A plurality of board connectors provided on the RF board so as to correspond to the electrode wires respectively, and to which the electrode wires are detachably coupled; A monitoring sensor provided on the RF board for monitoring the operating state of the transducer; An insulating cover formed so as to cover the outside of the RF board; Further comprising; The transducer holder; A head portion that is seated on the front surface of the ultrasonic radiation frame and has a seating groove into which the transducer is inserted and seated; A body portion that extends rearward from the head portion, passes through the coupling hole, and is coupled by a fastening member behind the ultrasonic radiation frame; Including; In the body portion of the transducer holder; A noise minimization structure of a high-intensity focused ultrasound generating device in which an electrode wire hole is formed so that the electrode wire can pass through and be drawn out behind the ultrasonic radiation frame.

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