Processing Method and Application of Laser-Cut Materials

Abstract

A method for laser cutting a material, comprising moving the material (200) along a preset path (110, 120, 130, 140, 150, 160, 170), repeatedly moving a focused laser beam (11) on the material surface to ablate the material and form a two-dimensional figure (320) facing the machining depth. As the material moves along the preset path, a plurality of two-dimensional figures are generated, and these two-dimensional figures are overlapped to form a required shape. The focused laser beam repeatedly moves linearly along the material surface or repeatedly moves along a figure. This method can significantly improve the processing efficiency of laser ablation materials, make the moving speed of the focus spot along the processing trajectory higher, and can achieve higher processing efficiency.

Description

Technical Field

[0001] The present invention relates to a method for cutting materials, and particularly to a method for performing cutting processing on materials using a laser as a means.

Background Art

[0002] Hole machining, milling, hinge machining, etc. are industrially common material processing means for processing materials into desired features, such as a plate material with hole features or a cavity with an arc surface. The most common means for completing these processes are tools such as drills, mills, and reamers. Achieving the purpose of removing materials using a laser (field) as a means is also widely applied.

[0003] For example: Processing materials using a laser as a means is already common in the field of metal processing. It uses a focused high-energy laser beam to irradiate the material and performs ablation removal on the material through photothermal and electrothermal effects (such as vaporization evaporation, electron avalanche, etc.) within a spatial range where the beam energy density is higher than the material damage threshold. Then, by moving the beam relative to the material, ablation (usually also called "cutting") of the material with a specific shape, shape, and specification is completed, achieving the purpose of creating the required product.

[0004] The laser is the light source of the laser beam for industrial processing. No matter what kind of laser is used, it is distinguished by the presence or absence of multiple reciprocating motions of the beam relative to the material during processing. There are mainly two processes in laser cutting: single ablation and multiple ablations. Based on the analysis of the laser principle, as shown in Fig. 1, the important parameters of the single ablation process are the effective focal depth 11 of the focused laser beam 10 and the diameter of the focused spot 12. The space determined by both of them in the focused laser beam is the theoretical effective laser ablation area. Based on the optical principle, on the premise that the laser power remains unchanged, it is found that the smaller the focused spot diameter, the higher the energy density, but the smaller the effective focal depth. As shown in Fig. 2, for the single ablation process, in order to ensure that the laser beam is effectively ablated across the entire thickness of the material, that is, to ablate a thicker material at one time, a larger effective focal depth is required. However, increasing the effective focal depth will lead to an increase in the diameter of the focal spot and a decrease in the laser energy density.

[0005] In the industry, in order to maintain the laser energy density above the material damage threshold level, the laser output must be improved. That is, one of the conventional technology circuits for improving the cutting energy efficiency of thick materials is to improve the laser output power. Although the processing efficiency of the process using this technology is extremely high, the improvement of the laser output increases the heat affected area of the laser light on the material and is likely to cause defects such as thermal damage to the material ablation edge. Therefore, this technical means mainly focuses on industrial fields with low requirements for the accuracy of ablation (cutting) edges, such as sheet metal and pipe processing.

[0006] On the one hand, if the laser device can control the processing depth of the focused laser beam, as shown in Fig. 3, the material can be reciprocally ablated (cut) multiple times (layer by layer) along the processing depth direction. Since the focused laser beam can be focused to a smaller diameter without being restricted by the depth of focus, the requirement for laser power can be significantly reduced. Multiple ablations (e.g., 4 times such as S11, S12, S13, S14) can achieve finer shape processing, less thermal damage, and less edge ablation, and are more controllable than the depth of single-shot ablation processing. However, as the processing depth increases, the efficiency of multiple ablations decreases rapidly. Therefore, usually, it is difficult to achieve a large depth of processing that controls such a focused laser beam, and it is not economical.

[0007] When processing a material by focusing a laser beam, usually, the focused laser beam is emitted perpendicular or almost perpendicular to the surface of the material processing (shown in Figs. 2 and 3). In this way, the cut surface always has a positive taper. In order to obtain a more perpendicular cross-section or a cross-section with a certain reverse taper, theoretically, it is necessary to incline the focused laser beam to the material surface and cut it multiple times so as to be incident on the material away from the vertical incident direction (that is, it is necessary that the surface generated by laser cutting and the material surface form an angle such as a reverse taper angle). As shown in Fig. 4, the focused laser beam performs three ablations of S21, S22, and S23 on the material. As the processing depth increases, the partially focused laser beam that is obliquely injected into the material cannot avoid shielding the material 21 on the laser path (for example, the edge of the slit). The actual effective power of the focused light spot rapidly decreases below the threshold required for the ablation material, and ablation cannot be completed. The greater the processing depth, the more serious the power drop at the focused light spot.

[0008] By expanding the ablation area of the laser beam on the surface layer of the material, it is possible to alleviate or eliminate the reduction in the effective laser power due to material generation shielding in subsequent deeper processing. As a result, when performing multiple ablation processes inclined (tilted) on the thick material surface, the processing efficiency is reduced by a factor of 2 due to multiple processing in the depth direction, and the processing efficiency is further reduced by a factor of 2 due to multiple ablations in the width direction of the ablation. Therefore, as the thickness of the material and the processing depth increase, the processing efficiency of multiple ablation processes for each layer from the material surface to the maximum desired processing depth can be exponentially reduced compared to the efficiency of a single ablation process. Therefore, this process route is mainly intensively applied to related fields that only process the superficial layer of materials, such as laser etching and embossed deep engraving.

[0009] From the above, in order to achieve high-efficiency precision cutting of thick materials (thickness 0.5 mm or more), further technical means are required, such as reducing the material damage threshold (using technical means such as ultrafast light sources such as picoseconds and femtoseconds to shorten the laser pulse width, or using technical means such as ultraviolet and extreme ultraviolet light sources to improve the material absorption rate), or changing the process to reduce the impact of the material on laser beam shielding. For example, using moving parts such as a rotation mechanism to superimpose a two-dimensional circular or annular movement of the spot while the focused laser spot moves along the processing path. Also, as described in CN 202210007485.1, while superimposing the two-dimensional movement of the spot, further superimposing the polarization of the laser beam and the change in the focal length to increase the ablation depth and ablation range of a single ablation in multiple ablations, thereby reducing the number of reciprocating processing times and improving the processing efficiency. However, these technologies often require expensive light sources (e.g., femtosecond lasers, extreme ultraviolet lasers, etc.) and precise and complex hardware (e.g., dynamic focal length devices and dynamic polarization devices, etc.), which reduce the reliability of the system (e.g., more complex temperature control and beam pointing control, more complex mechanical and electrical structures).

Prior Art Documents

Patent Document

[0010]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0011] An object of the present invention is to provide a method for laser cutting materials that improves the processing efficiency of laser cutting of thick materials, such as improving the precision cutting processing efficiency of polycrystalline diamond composite sheets with a thickness greater than 0.5 mm.

[0012] Another object of the present invention is to provide a laser cutting method that efficiently realizes laser cutting of thick materials and at the same time obtains high-precision geometric shapes such as a cutting surface with an accurate reverse taper angle, a hole with good cylindricity, and a groove with a vertical side wall.

Means for Solving the Problems

[0013] Generally understood lasers, light emitted by system atoms by induction, when electrons in atoms absorb energy and transition from a low energy level to a high energy level, and then return from the high energy level to the low energy level, the released energy is emitted in the form of photons. The forms of lasers can be divided into continuous lasers and pulsed lasers. According to the pulse width characteristics of laser light, it can be divided into thermal laser light and cold laser light.

[0014] Laser emitters, for example, are not limited to nanosecond, femtosecond, or picosecond lasers, but the generated lasers are, for example, infrared light, infrared light, blue light, green light, purple light, or extreme ultraviolet light.

[0015] An ultra-high-speed laser refers to a pulsed laser with a pulse width of the output laser of several tens of nanoseconds or less, that is, at the picosecond level or less or less than the picosecond level. The core components related to ultra-high-speed lasers include oscillators, amplifiers, amplifiers, compressors, etc.

[0016] In machining, the material or workpiece usually refers to the parts or materials or semi-finished products for manufacturing parts, and is the object to be processed during machining. That is, after machining the workpiece, a product that meets the processing or design requirements is obtained.

[0017] Precision machining refers to a machining technology in which the machining accuracy and surface quality reach an extremely high level. For example, in tool machining, the dimensional accuracy, straightness, profile accuracy, surface roughness, cutting edge arc radius, and machining accuracy all reach a higher level than the micron level.

[0018] In laser machining, the laser beam removes the material by ablation. After the material on the first surface layer is removed, a new interface is exposed as the material surface again. The laser beam continues to ablate the material on the new interface, thereby reciprocating and removing more material to achieve the machining of the material shape (for example, cutting). Therefore, in laser machining, the laser beam always acts on the material surface and ablates the material located on the surface (surface layer).

[0019] A machining facility (or machining center) is a machining facility having a plurality of moving axes. That is, in the right-handed rectangular coordinate system, the X, Y, and Z axes that move in a straight line direction, and the A, B, and C axes that rotate around the X, Y, and Z axes respectively.

[0020] Machining facilities, such as NC machine tools, usually load each control software, receive each command in code form, and issue it to automatically perform machining on the workpiece.

[0021] A method of laser cutting a material, comprising moving the material along a preset path (i.e., machining locus), focusing and repeatedly moving a laser beam on the material surface, where

[0022] It acts on the material in the direction of focusing a laser beam inclined to the material surface, ablates the material along a set trajectory, repeatedly moves both ends of the trajectory, forms a two-dimensional pattern facing the surface along the processing depth, and as the material moves along a preset path, many two-dimensional patterns facing the surface along the processing depth are generated. These two-dimensional patterns overlap along the direction in which the material moves to form a required shape (usually a three-dimensional shape), such as holes, grooves, etc., or cut a mass of the material into several parts.

[0023] The trajectory along which the focused laser beam repeatedly moves on the material surface is at least a straight line segment or includes a pattern in which two straight line segments intersect to form an intersection angle of less than 90 degrees. It is called a figure such as a triangle, a rhombus, a trapezoid, etc., but is not limited thereto. The closed pattern of the present invention preferentially adopts a triangle in order to facilitate processing of a desired shape and meet the requirement of improving processing accuracy.

[0024] When limited to the power of the laser light or when the thickness of the processed material is large, it is usually necessary to stack the aforementioned two-dimensional figures in the direction of the processing depth. In this case, by reciprocating the material, the depth of the laser processing can be increased, the material can be returned to the starting point of the processing, and the aforementioned laser processing scheme can be continuously implemented along the depth direction of the processing to continuously generate another two-dimensional figure along the depth direction.

[0025] The device for driving the material usually provides at least two movement directions, taking the coordinate axes as an example, providing movement in the X-axis direction and movement in the Y-axis direction. If necessary, movement in the Z-axis direction must also be provided. According to the requirements of the required processing form, the device for driving the material usually includes movement in the rotational direction around the X-axis (i.e., the A-axis direction) and movement in the rotational direction around the Y-axis (i.e., the B-axis direction).

[0026] In order to obtain a focused laser light source for implementing the method of the present invention, it is necessary to be equipped with a laser as the light source, focus the irradiated laser light with a focusing (field) mirror, and obtain a focused laser light beam. Further, in order to form a two-dimensional pattern along the processing depth surface for the focused laser beam, it is necessary to repetitively move the focused laser beam along a straight line, or a driving device that repetitively moves along a pattern formed by connecting the heads and tails of several straight line segments is required.

[0027] With the cooperation of the mirror, the deflection of the laser beam can be controlled, the light spot moves on the working plane, and by focusing the laser beam, the movement trajectory along one figure can be completed in a short time. Alternatively, by driving the focused laser beam through a rotation mechanism, the movement trajectory along one figure can be completed.

[0028] When the trajectory is a straight line segment, it falls only at one end on the preset path of the material movement. When the trajectory is a figure including an angle, the end point of the angle falls on the preset path of the material movement.

[0029] When the focused laser light spot falls on the trajectory of the preset path, the movement direction of the focused laser light beam is adjusted with that position as the rotation center. Thereby, the movement direction of the focused laser beam is adapted to the change of the preset trajectory, and the angle in the normal direction with the preset trajectory is always maintained within the range of 20° to 70°, and in particular, the movement direction of the focused laser beam is always maintained in the normal direction of the processing trajectory.

[0030] As the processing depth increases, the total length of the linear movement of the spot continues to shrink, and the moving speed along the preset trajectory of the focus spot movement trajectory is continuously improving.

[0031] The method of the present invention is applied to processing equipment having a plurality of motion axes (for example: 3-axis machine tool, 4-axis machine tool, 5-axis machine tool, etc.) so as to be advantageous for realizing automatic laser cutting processing of materials with the cooperation of a numerical control system.

Effects of the Invention

[0032] The beneficial effects achieved by the technical solution of the present invention are as follows.

[0033] The laser cutting method provided by the present invention, compared with the prior art, when the focused spot moves along the processing trajectory, superimposes the movement of a figure (e.g., triangle or sector) including a straight line or an angle of the spot itself, significantly improving the processing efficiency of laser ablation of materials, that is, the speed at which the focused spot moves along the processing trajectory can be higher, and the processing efficiency can be higher.

[0034] When superimposing a centrally symmetric motion trajectory such as a circular motion trajectory, since the spot center is also the center of the spot motion, when calculating the spot movement trajectory, offset compensation is performed with the circular radius. In an actual case, it is necessary to consider the compensation and offset directions respectively, which may lead to the complication of calculation. In comparison, the technical solution of the present invention takes one end of the motion trajectory of a figure (e.g., triangle or sector) including a straight line or an angle as the contact point between the figure and the trajectory, adapts to the change of the processing trajectory, and is equivalent to moving along the processing trajectory with only a single focal spot. Therefore, when calculating the spot movement trajectory, there is no need to perform additional offset compensation, simplifying the correlation algorithm, reducing the programming difficulty and the computer performance requirements, and increasing the calculation speed.

[0035] When superimposing a centrally symmetric motion trajectory such as a circular motion trajectory, the spot center is actually at the center of the circular motion. When offsetting the spot movement trajectory with the circular radius, the processing trajectory changes to be smaller than the circular motion radius and cannot be processed when it becomes concave. In comparison, the method of the present invention takes one end of the motion trajectory of a figure (e.g., triangle) including a straight line or an angle as the rotation center, adapts to the change of the processing trajectory, moves along the processing trajectory with only a single spot, realizes the detailed processing of the desired form, and is equivalent to improving the processing accuracy.

[0036] Compared with the prior art, the method of the present invention can adjust the total length of the movement trajectory of a shrinking straight line or an included-angle figure (e.g., a triangle) as the processing depth increases, and utilize the feature that the ablation width can be reduced as the processing depth increases to macroscopically form a "cut" with a "narrower bottom and wider top", reduce unnecessary material removal, that is, further improve the processing efficiency.

Brief Description of the Drawings

[0037]

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Embodiments for Carrying Out the Invention

[0038] Hereinafter, the technical solution of the present invention will be described in detail in conjunction with the drawings. The embodiments of the present invention are for explaining the technical solution of the present invention and are not limiting. The present invention will be described in detail with reference to preferred embodiments. However, as can be understood by those skilled in the art, modifications or equivalent replacements can be made to the technical solution of the invention, and as long as it does not deviate from the spirit and scope of the technical solution of the present invention, it should be included in the scope of the claims of the present invention.

[0039] In order to implement the method of the present invention, it is preferably implemented using a processing facility having a plurality of motion axes such as a 3-axis machine tool, a 4-axis machine tool, a 5-axis machine tool, etc. Such a processing device can provide at least two directions of movement necessary to drive the material, such as movement in the X-axis direction and movement in the Y-axis direction, and usually can also provide movement in the Z-axis direction to meet the needs of processing. In order to realize three-dimensional processing, movement in the rotational direction around the X-axis (i.e., the A-axis direction) and movement in the rotational direction around the Y-axis (i.e., the B-axis direction) can also be easily obtained from these processing devices.

[0040] Since there already exist processing devices equipped with a laser light source and having a plurality of motion axes, for example, CN 212144994. These devices are equipped with a laser, a focus (field) mirror, and a drive device, which can focus the received laser light to obtain a focused laser light, and can repeatedly move the guide of the drive device or the focused laser light along a straight line, or along a figure formed by the intersection of at least two straight line segments with an intersection angle less than 90 degrees, or along a closed figure formed by connecting the heads and tails of several straight line segments. For example, when the trajectory is a straight line segment, the focused laser beam reciprocates between both ends of the trajectory. When the trajectory is a triangular figure, the focused laser beam repeatedly moves along the closed trajectory formed on the three sides of the triangle. The trajectory is a figure formed by the intersection of two straight line segments with an intersection angle less than 90 degrees, and the focused laser beam repeatedly moves only along the trajectory formed by the two edges.

[0041] These devices usually also have a vibrator arranged. Under the cooperation of the vibrator, the focus spot moves on the working plane, and the focused laser beam can complete the motion trajectory along a figure in a short time, or the focused laser beam can be driven through a rotation mechanism to complete the motion trajectory along a figure.

[0042] It is an explanatory diagram of an embodiment of laser processing of a material to which the method of the present invention is applied. As shown in FIG. 5, the laser beam ablates the workpiece 200 (i.e., the material) along the processing locus 110, and the upward arrow on the processing locus 110 indicates the direction in which the workpiece 200 moves. During this time, the focused laser beam 11 moves from one end to the other end along the straight path 310 on the surface of the workpiece 200, and performs a repeated movement in which only one end falls on the processing locus 110 where the workpiece 200 moves. The focused laser beam 11 ablates the workpiece 200 along the processing depth from the surface of the workpiece 200. As the processing depth increases, the total length of the linear movement of the focus spot continues to decrease, the moving speed along the preset locus of the focus spot continuously improves, and a two-dimensional pattern 320 with the straight path 310 as the upper boundary is generated. Such laser processing usually forms a three-dimensional shape such as a hole or a groove that needs to be overlapped along the direction in which the workpiece 200 moves by moving the workpiece 200 along the processing locus 100, and many two-dimensional patterns similar to the initially obtained two-dimensional pattern 320 are generated. When the laser beam 11 continues to ablate from one side of the workpiece 200 to the other side on the opposite side, the workpiece 200 is divided into two parts, and the workpiece 200 can be divided into several parts.

[0043] If the power of the laser beam is limited or the thickness of the processed material is large, the above-mentioned two-dimensional figure 320 can be completed by being divided several times in the processing depth direction. First, a part of the processed two-dimensional figure 320 is arranged along the processing depth direction. After being stacked, the other part of the two-dimensional figure 320 that constitutes the complete two-dimensional figure 320 continues to be processed along the processing depth direction. In order to realize such a processing method, first, a part of the processed two-dimensional figure 320, the workpiece 200 is reciprocated to continuously add another part of the two-dimensional figure 320 that is processed in the depth of the laser processing, or the workpiece 200 is returned to the starting point of the processing, and the laser processing method shown in FIG. 5 is continuously implemented along the processing depth direction. By continuing a part of the two-dimensional figure 320 processed along the depth direction, a complete two-dimensional figure 320 can be generated along the processing depth.

[0044] It is an explanatory diagram of another embodiment of laser processing of a material using the method of the present invention. Referring to FIG. 5, as shown in FIG. 6, the focused laser beam 12 ablates a workpiece (not shown) along the processing locus 120, and only one end drops onto the processing locus 120 where the workpiece moves. The arrow on the processing locus 120 indicates the direction in which the workpiece moves. The angle in the normal direction between the focused laser beam 12 and the processing locus 120 is always maintained within the range of 20° to 70°. When a certain locus 121 on the processing locus 120 turns to another locus 122, in order to adapt to the change of the processing locus, the focused laser beam 12 is rotated around the laser spot that has dropped onto the processing locus 122 to adjust the movement direction of the laser beam.

[0045] It is an explanatory diagram of another embodiment of laser processing of a material using the method of the present invention. Referring to FIG. 5, as shown in FIG. 7, the light spot moves on the working plane and can complete a movement locus along a triangle (or sector) in a short time. The triangle (or sector) pattern 13 formed by the focused laser beam in this way ablates a workpiece (not shown) along the processing locus 130, and the upper arrow on the processing locus 130 indicates the moving direction of the workpiece. The angle in the normal direction between the triangle pattern 13 and the processing locus 130 is always maintained within the range of 20° to 70°. One end point of a corner of the triangle (or sector) pattern 13 drops onto the processing locus 130 where the workpiece moves. When a certain locus 133 on the processing locus 130 turns to another locus 134, in order to adapt to the change of the processing locus, the triangle (or sector) pattern 13 is rotated around the laser spot that has dropped onto the processing locus 134 to adjust the movement direction of the triangle (or sector) pattern 13 formed by the laser beam.

[0046] It is an explanatory diagram of another embodiment of laser processing of a material using the method of the present invention. Referring to FIG. 5, as shown in FIG. 8, the focused laser beam 14 ablates a workpiece (not shown) along the processing locus 140, and only one end drops onto the processing locus 140 along which the workpiece moves. The arrow on the processing locus 140 indicates the direction in which the workpiece moves. The focused laser beam 14 is held in the normal direction of the processing locus 140. When a certain locus 141 on the processing locus 140 turns to another locus 142, in order to adapt to the change of the processing locus, the focused laser beam 14 is rotated around the laser spot that has dropped onto the processing locus 142, and the movement direction of the laser beam is adjusted.

[0047] It is an explanatory diagram of another embodiment of laser processing of a material using the method of the present invention. Referring to FIG. 5, as shown in FIG. 9, the light spot moves on the working plane and can complete a movement locus along a triangle (or sector) in a short time. The triangle (or sector) pattern 15 formed by the focused laser beam in this way ablates a workpiece (not shown) along the processing locus 150, and the upper arrow on the processing locus 150 indicates the movement direction of the workpiece. One corner end point of the triangle pattern 15 drops onto the processing locus 150 along which the workpiece moves. The triangle (or sector) pattern 15 holds the normal direction of the processing locus 150. When a certain locus 153 on the processing locus 150 turns to another locus 154, in order to adapt to the change of the processing locus, the triangle (or sector) pattern 15 is rotated around the laser spot that has dropped onto the processing locus 154, and the movement direction of the triangle (or sector) pattern 15 formed by the laser beam is adjusted.

[0048] It is an explanatory diagram of another embodiment of laser processing of a material to which the method of the present invention is applied. Referring to FIG. 5, as shown in FIG. 10, the focused laser beam 16 ablates a workpiece (not shown) along the processing locus 160, and only one end falls on the processing locus 160 along which the workpiece moves. The arrow on the processing locus 160 indicates the direction in which the workpiece moves. The angle in the normal direction between the focused laser beam 16 and the processing locus 160 is always maintained within the range of 20° to 70°. When a certain locus 161 on the processing locus 160 turns to another locus 162, the processing locus changes, but the focused laser beam 16 can perform processing without changing the direction of movement.

[0049] It is an explanatory diagram of another embodiment of laser processing of a material using the method of the present invention. Referring to FIG. 5, as shown in FIG. 11, the light spot moves on the working plane and can complete a movement locus along a triangle (or sector) in a short time. The triangle (or sector) pattern 17 formed by the focused laser beam in this way ablates a workpiece (not shown) along the processing locus 170, and the upper arrow of the processing locus 170 indicates the moving direction of the workpiece. The end point of one corner of the triangle (or sector) pattern 17 falls on the processing locus 170 along which the workpiece moves. The angle in the normal direction between the triangle (or sector) pattern 17 and the processing locus 170 is always maintained within the range of 20° to 70°. When the locus 172 on the processing locus 170 turns to another locus 173, there is a change in the processing locus, but the triangle (or sector) figure 17 can perform processing without changing the direction of movement.

[0050] FIG. 12 is a schematic diagram of an embodiment of laser processing of a material using a circular shape, and FIG. 13 is an explanatory diagram of an embodiment of laser processing of a material using a circular shape. As shown in FIG. 12, the center of the focused spot is the center of the circular motion. When the center is placed on the processing trajectory, transition ablation to the workpiece edge occurs, resulting in a decrease in processing accuracy. When the center is parallel to the processing trajectory and the edge of the focal spot ablates the workpiece, and offset compensation is performed with the circular radius when calculating the spot movement trajectory, in the actual case, it is necessary to consider the compensation and the offset direction respectively, which may lead to a complication of the calculation. Also, when the processing trajectory changes to be smaller than the circular motion radius and becomes concave, ablation cannot be performed there, and similarly, the processing accuracy decreases, as shown in FIG. 13.

Explanation of Signs

[0051] 110 Processing trajectory 200 Workpiece 310 Straight path 320 Two-dimensional figure

Claims

1. A method for laser cutting a material, comprising the steps of driving the material to move along a predetermined path, and repeatedly moving a laser beam focused on the surface of the material, wherein the focused laser beam acts on the material in a direction inclined with respect to the surface of the material, ablates the material along a set trajectory, repeatedly moves at both ends of the trajectory, and moves the material along a predetermined path to form opposing two-dimensional patterns along the processing depth, and generates a plurality of opposing two-dimensional patterns along the processing depth to form a desired shape by overlapping the two-dimensional patterns. The trajectory of the repeated movement of the focused laser beam is either a single straight line portion or at least includes a pattern in which two straight line portions intersect at an angle of less than 90 degrees. When the rail is a straight line segment, only one end of the rail is located on the planned movement path of the material. When the trajectory is a pattern having a clamping angle, the end point of the clamping angle is located on the preset movement path of the material.

2. The method according to claim 1, characterized in that the figure is selected from a triangle, a rhombus, and a trapezoid.

3. The method according to claim 1, characterized in that the device for driving the material usually provides at least two movement directions.

4. The method according to claim 1, characterized in that when the focused laser spot falls on the trajectory of a preset path, the movement direction of the focused laser beam is adjusted with its position as the center of rotation.

5. The method according to claim 1, characterized in that the movement direction of the focused laser beam adapts to the change of the preset trajectory, and the angle in the normal direction to the preset trajectory is always maintained within the range of 20° to 70°.

6. The method according to claim 1, characterized in that the movement direction of the focused laser beam adapts to the change of the preset trajectory, and the movement direction of the focused laser beam is always maintained in the normal direction of the processing trajectory.

7. The method according to claim 1, characterized in that as the processing depth increases, the total length of the linear movement of the focal spot decreases, and the moving speed of the focal spot along the preset trajectory increases.

8. The method according to claim 1, characterized in that the deflection of the laser beam is controlled by a mirror to form the pattern.

9. The method according to claim 1, characterized in that it is used in a processing device having a plurality of movement axes.

10. The method according to claim 9, characterized in that the processing device is a laser processing device.

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