Temperature Compensation System, Semiconductor Device, and Temperature Compensation Method

Abstract

The present invention provides a temperature compensation system including a cavity, a temperature feedback module, a heating plate, a main heating module, a multi-zone temperature control module, a distributed temperature control module, and at least one auxiliary temperature adjustment module. At least one temperature control compensation region is provided on the bottom surface of the heating plate. The auxiliary temperature adjustment module and the temperature control compensation region are arranged in correspondence. The temperature feedback module performs temperature detection on the heating plate and obtains a first temperature value and a second temperature value. The multi-zone temperature control module controls the main heating module to perform temperature adjustment on the heating plate based on the first temperature value. The distributed temperature control module controls the auxiliary temperature adjustment module to perform temperature compensation adjustment on the temperature control compensation region based on the second temperature value. It avoids complex wiring design, has a small occupied space, saves costs, and has high temperature control accuracy. The present invention further provides a semiconductor device and a temperature compensation method.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and more particularly to a temperature compensation system, a semiconductor device, and a temperature compensation method.

Background Art

[0002] Currently, in the wafer baking process during semiconductor manufacturing, it is necessary to frequently use a substrate baking unit. In the heating and baking process, the temperature uniformity of the substrate is very important for whether the process capability index can be achieved. Therefore, it is equally important to effectively adjust the temperature uniformity of the substrate.

[0003] Currently, the conventional solution for adjusting the substrate temperature in the industry is to optimize the heating circuit of the heater and appropriately increase the number of zones of the heater to improve the temperature uniformity of the heating plate. However, this solution has limitations. First, simply optimizing the circuit layout of the heater, optimizing the hardware structure around the heater, and even performing the necessary thermal field analysis cannot significantly improve the temperature uniformity during the wafer baking process. If we want to significantly improve the temperature uniformity during the wafer baking process, the solution adopted is to increase the number of zones of the heater, so that different zones of the heater can be individually controlled through a multi-zone temperature control system. However, such a conventional solution significantly increases the development cycle of the heater, increases the research and development cost of the heater, requires more stringent management and control requirements for the manufacturing process of the heater, thereby reducing the yield of the heater, and also increasing the price of the multi-zone high-precision heater. On the other hand, in the solution of optimizing the heating circuit by adding zones, the power lines and the wires of the temperature sensors become more, the wiring becomes more complex, the design of the peripheral structure of the heater becomes difficult, adding zones to the heater significantly increases the cost of the temperature control part, and at the same time increases the installation space of the hardware.

[0004] Therefore, in order to solve the above problems in the prior art, it is necessary to provide a temperature compensation system, a semiconductor device, and a temperature compensation method.

Summary of the Invention

[0005] An object of the present invention is to provide a temperature compensation system, a semiconductor device, and a temperature compensation method in order to solve the problems of high cost for adjusting the substrate temperature in the prior art and the need for a large space for hardware installation.

[0006] To achieve the above object, the temperature compensation system of the present invention includes a cavity, a temperature feedback module, a heating plate, a multi-zone temperature control module, a distributed temperature control module, a main heating module for heating the heating plate, and at least one auxiliary temperature adjustment module. The cavity and the bottom surface of the heating plate form an attachment chamber, and the main heating module, the auxiliary temperature adjustment module, and the distributed temperature control module are provided inside the attachment chamber. The distributed temperature control module is communicatively connected to the temperature feedback module and the auxiliary temperature adjustment module, and the multi-zone temperature control module is communicatively connected to the temperature feedback module and the main heating module. At least one temperature control compensation area is provided on the bottom surface of the heating plate, and the auxiliary temperature adjustment module is arranged corresponding to the temperature control compensation area. The temperature feedback module performs temperature detection on the heating plate and obtains a first temperature value and a second temperature value. The multi-zone temperature control module controls the main heating module to perform temperature adjustment on the heating plate based on the first temperature value. The distributed temperature control module controls the auxiliary temperature adjustment module to perform temperature compensation adjustment on the temperature control compensation area based on the second temperature value.

[0007] The beneficial effects of the temperature compensation system of the present invention are as follows. By correspondingly arranging the auxiliary temperature adjustment module in the temperature control compensation area, temperature compensation adjustment is performed on the heating plate, avoiding complex wiring design, having a smaller occupied space, solving the problems of high cost for adjusting the substrate temperature and large installation space for hardware in the prior art. The temperature feedback module detects the heating plate to obtain a first temperature value and a second temperature value. The multi-zone temperature control module controls the main heating module to perform temperature adjustment on the heating plate based on the first temperature value. The distributed temperature control module controls the auxiliary temperature adjustment module to perform temperature compensation adjustment on the temperature control compensation area based on the second temperature value. Through temperature adjustment and temperature compensation adjustment, the temperature of the heating plate becomes more uniform, effectively controlling the temperature uniformity while minimizing the manufacturing and maintenance costs, and having high temperature control accuracy.

[0008] After the heating power of the main heating module is stabilized, the temperature feedback module performs the first temperature detection on the heating plate, obtains the first temperature value, and feeds back the first temperature value to the multi-zone temperature control module. After the temperature adjustment is completed, the temperature feedback module performs the second temperature detection on the heating plate, obtains the second temperature value, and feeds back the second temperature value to the distributed temperature control module.

[0009] Optionally, it further includes a partition plate provided between the main heating module and the distributed temperature control module, and the auxiliary temperature adjustment module is provided on the partition plate.

[0010] Optionally, the partition plate is provided with lead holes for passing leads.

[0011] Optionally, the auxiliary temperature adjustment module includes a temperature compensation unit communicatively connected to the distributed temperature control module, and the distance between the temperature compensation unit and the corresponding temperature control compensation area is 0 or more.

[0012] Optionally, the auxiliary temperature adjustment module further includes a fixing assembly for fixing the temperature compensation unit in the corresponding temperature control compensation area.

[0013] Optionally, the auxiliary temperature adjustment module further includes a support member provided on the partition plate, an elastic member provided inside the support member, and a mounting portion provided at the uppermost end of the elastic member. The temperature compensation unit is provided on the side of the mounting portion facing the heating plate. Due to the action of the support member, the elastic member applies a force to the temperature compensation unit in a direction corresponding to the temperature control compensation area to adjust the distance between the temperature compensation unit and the corresponding temperature control compensation area.

[0014] Optionally, a lead hole for passing a lead is provided inside the support member.

[0015] Optionally, the temperature compensation unit includes a heating unit and a cooling unit provided at intervals.

[0016] Optionally, when the second temperature value is smaller than a preset second target temperature, the distributed temperature control module controls the heating unit to perform temperature compensation adjustment on the temperature control compensation area corresponding to the second temperature value.

[0017] Optionally, when the second temperature value is larger than a preset second target temperature, the distributed temperature control module controls the cooling unit to perform temperature compensation adjustment on the temperature control compensation area corresponding to the second temperature value.

[0018] Optionally, the temperature compensation system further includes a temperature control seal plate provided inside the mounting chamber, the temperature control seal plate is located at the bottom end of the heating plate, and a heat insulation space is formed between the temperature control seal plate, the heating plate and the inner wall of the mounting chamber, and both the distributed temperature control module and the auxiliary temperature adjustment module are provided in the heat insulation space.

[0019] Optionally, the upper surface of the heating plate includes a substrate contact area, the bottom surface of the heating plate includes a bottom surface control area corresponding to the substrate contact area, and the temperature control compensation area is any area within the bottom surface control area.

[0020] The present invention further provides a semiconductor device including the temperature compensation system.

[0021] The present invention Step S0 of providing a heating plate provided with at least one temperature control compensation area on the bottom surface, a main heating module, and an auxiliary temperature adjustment module arranged corresponding to the temperature control compensation area; Step S1 of performing temperature detection on the heating plate and obtaining a first temperature value and a second temperature value; Step S2 of controlling the main heating module to perform temperature adjustment on the heating plate based on the first temperature value; Step S3 of controlling the auxiliary temperature adjustment module to perform temperature compensation adjustment on the temperature control compensation area based on the second temperature value, and further providing a temperature compensation method including the above steps.

Brief Description of the Drawings

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Figure 1

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Embodiments for Carrying Out the Invention

[0023] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts shall be included within the protection scope of the present invention. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the technical field to which the present invention pertains. Similar words such as "including" used herein mean that the elements or things appearing before the word include the elements or things cited after the word and their equivalents, but do not exclude other elements or things.

[0024] Considering the problems existing in the prior art, the embodiments of the present invention provide a temperature compensation system. Figure 1 is a schematic cross-sectional structure diagram of a temperature compensation system according to an embodiment of the present invention, and Figure 2 is a circuit connection block diagram of a temperature compensation system according to an embodiment of the present invention.

[0025] Referring to FIGS. 1 and 2, the temperature compensation system of the present invention includes a cavity 1, a temperature feedback module 4, a heating plate 2, a distributed temperature control module 5, a multi-zone temperature control module 90, a main heating module 9 for heating the heating plate 2, and at least one auxiliary temperature adjustment module 6. The cavity 1 and the bottom surface of the heating plate 2 form an installation chamber 11, and the main heating module 9, the auxiliary temperature adjustment module 6, and the distributed temperature control module 5 are provided inside the installation chamber 11. Referring to FIG. 2, the distributed temperature control module 5 is communicatively connected to the temperature feedback module 4 and the auxiliary temperature adjustment module 6, and the multi-zone temperature control module 90 is communicatively connected to the temperature feedback module 4 and the main heating module 9.

[0026] In some embodiments, the heating plate 2 is made of a heat-conductive material, which facilitates the temperature adjustment of the heating plate 2 by the main heating module 9.

[0027] In some specific embodiments, the shape of the main heating module 9 coincides with the shape of the heating plate 2, and the heating plate 2 and the main heating module are seamlessly connected to improve the temperature adjustment efficiency.

[0028] In some embodiments, the main heating module and the heating plate 2 are connected by a sintering process.

[0029] In a specific embodiment, the main heating module 9 is embedded inside the heating plate 2 by a sintering process, that is, the main heating module 9 is embedded in the intermediate layer of the heating plate 2.

[0030] In another specific embodiment, by a sintering process, the main heating module is sintered on the back surface of the heating plate 4, whereby the main heating module and the heating plate 2 are seamlessly connected.

[0031] In some other embodiments, the main heating module 9 and the heating plate 2 are adhesively or welded together.

[0032] Referring to FIGS. 1 and 2, at least one temperature control compensation region (not shown) is provided on the bottom surface of the heating plate 2, and the auxiliary temperature adjustment module 6 and the temperature control compensation region are arranged in correspondence.

[0033] In some specific embodiments, the specific range of the temperature control compensation region and the distance between adjacent temperature control compensation regions are jointly determined by the structural performance, process requirements, and mounting conditions of the heating plate 2 itself.

[0034] The temperature feedback module 4 performs temperature detection on the heating plate 2 to obtain a first temperature value and a second temperature value. The multi-zone temperature control module 90 controls the main heating module 9 to perform temperature adjustment on the heating plate 2 based on the first temperature value. The distributed temperature control module 5 controls the auxiliary temperature adjustment module 6 to perform temperature compensation adjustment on the temperature control compensation region based on the second temperature value.

[0035] In some embodiments, the distributed temperature control module 5 includes a printed circuit board (Printed Circuit Board, PCB) and a control board including functional devices provided on the PCB board.

[0036] The advantages of the temperature compensation system of the present invention are as follows. By correspondingly arranging the auxiliary temperature adjustment module 6 in the temperature control compensation area, temperature compensation adjustment is performed on the heating plate 2, avoiding complex wiring design, having a smaller occupied space, and solving the problems in the prior art of high cost for adjusting the substrate temperature and large installation space for hardware. The temperature feedback module 4 detects the heating plate 2 and obtains a first temperature value and a second temperature value. The multi-zone temperature control module 90 controls the main heating module 9 to perform temperature adjustment on the heating plate 2 based on the first temperature value. The distributed temperature control module 5 controls the auxiliary temperature adjustment module 6 to perform temperature compensation adjustment on the temperature control compensation area based on the second temperature value. Thereby, the temperature of the heating plate 2 becomes more uniform, effectively controlling the temperature uniformity while minimizing the manufacturing and maintenance costs, and having high temperature control accuracy. It can effectively reduce the number of zones increased by using the conventional technical solutions and reduce the cost of the temperature control part.

[0037] As an alternative embodiment of the present invention, the upper surface of the heating plate 2 includes a substrate contact area, the bottom surface of the heating plate 2 includes a bottom surface control area corresponding to the substrate contact area, and the temperature control compensation area is any area within the bottom surface control area.

[0038] In some embodiments, a plurality of heating zones are provided on the heating plate 2, and the main heating module 9 includes a multi-zone heating circuit for heating the plurality of heating zones.

[0039] Figure 3 is a schematic structural diagram of the temperature feedback module and the distributed temperature control module according to an embodiment of the present invention.

[0040] In some embodiments, referring to FIG. 3, the temperature compensation system further includes a cover 13, a heating cavity 10 is formed between the cover 13 and the cavity 1, a wafer required for a wafer baking process or a temperature measurement wafer used for temperature detection is disposed in the heating cavity 10, in order to reduce heat loss, the cover 13 covers the top portion of the heating cavity 10, the heating plate 2 is provided at the bottom of the heating cavity 10, the distributed temperature control module 5 is positioned at the bottom of the heating plate 2, and the distributed temperature control module 5 and the heating plate 2 do not contact each other.

[0041] As an alternative embodiment of the present invention, referring to FIGS. 1 and 2, after the heating power of the main heating module 9 is stabilized, the temperature feedback module 4 performs a first temperature detection on the heating plate 2, obtains the first temperature value, and feeds back the first temperature value to the multi-zone temperature control module 90. After the temperature adjustment is completed, the temperature feedback module 4 performs a second temperature detection on the heating plate 2, obtains the second temperature value, and feeds back the second temperature value to the distributed temperature control module 5.

[0042] In some embodiments, the temperature feedback module 4 includes a temperature measurement wafer 41 and a temperature sensor 42, the temperature measurement wafer 41 is connected to the temperature sensor 42, and the temperature sensor 42 and the distributed temperature control module 5 are communicatively connected.

[0043] In some embodiments, the step in which the temperature feedback module 4 performs the first temperature detection is After the heating power of the main heating module 9 has stabilized, place the temperature measurement wafer 41 in the heating cavity 10 on the upper surface of the heating plate 2, measure the temperature measurement wafer 41 via the temperature sensor 42, perform the first temperature detection on the heating plate 2, obtain the first temperature value, and feedback the first temperature value to the multi-zone temperature control module 90.

[0044] In some embodiments, the specific adjustment steps for the multi-zone temperature control module 90 to control the main heating module 9 based on the first temperature value to perform temperature adjustment on the heating plate 2 are as follows: When the first temperature value is smaller than a preset first target temperature, the multi-zone temperature control module 90 controls the main heating module 9 to increase the heating power, raise the temperature of the heating plate 2, and maintain the output power of the main heating module 9 unchanged until the first temperature value is adjusted to the first target temperature. When the first temperature value is larger than a preset first target temperature, the multi-zone temperature control module 90 controls the main heating module 9 to decrease the heating power, lower the temperature of the heating plate 2, and maintain the output power of the main heating module 9 unchanged until the first temperature value is adjusted to the first target temperature.

[0045] In some embodiments, referring to FIGS. 2 and 3, the steps for the temperature feedback module 4 to perform the second temperature detection are as follows: After the temperature adjustment is completed, place the temperature measurement wafer 41 in the heating cavity 10 at the top of the heating plate 2, detect the temperature of the temperature measurement wafer 41 by the temperature sensor 42, thereby realizing the temperature detection of the heating plate 2. After the temperature sensor 42 obtains the second temperature value, feedback the second temperature value to the distributed temperature control module 5.

[0046] In some embodiments, several temperature measurement points are provided on the temperature measurement wafer 41, each of the temperature measurement points is connected to at least the temperature sensor 42, and in each region of the heating plate 2, in order to detect whether temperature compensation adjustment is required, the temperature control compensation region corresponds to the temperature measurement point, temperature detection is performed for each of the temperature control compensation regions respectively, and temperature compensation adjustment is performed for the temperature compensation regions that require temperature compensation respectively, thereby facilitating orderly temperature compensation adjustment of the heating plate 2.

[0047] In some specific embodiments, some of the temperature control compensation regions are dispersed in an array with respect to the center of the bottom surface control region. Specific array distribution types include, but are not limited to, annular arrays and rectangular arrays.

[0048] As an alternative embodiment of the present invention, referring to FIG. 1, the temperature compensation system further includes a partition plate 7 provided between the main heating module and the distributed temperature control module 5, and the auxiliary temperature adjustment module 6 is provided on the partition plate 7.

[0049] In some embodiments, the partition plate 7 is made of a heat insulating material. In order to play a heat insulating role, the outer edge of the partition plate 7 is hermetically connected to the lower side wall of the heating plate 2, reducing heat loss in the heating cavity 10, avoiding the influence of the heat in the heating cavity 10 on the operation of the distributed temperature control module 5, and extending the service life of the distributed temperature control module 5.

[0050] As an alternative embodiment of the present invention, the partition plate 7 is provided with lead holes for passing leads.

[0051] FIG. 4 is a front view of the auxiliary temperature adjustment module according to an embodiment of the present invention, FIG. 5 is a cross-sectional view of the auxiliary temperature adjustment module according to an embodiment of the present invention, and FIG. 6 is a schematic diagram of an enlarged structure of A in FIG. 1.

[0052] As an alternative embodiment of the present invention, referring to FIGS. 1, 4, 5, and 6, the auxiliary temperature adjustment module 6 includes a temperature compensation unit 60, the temperature compensation unit 60 is communicatively connected to the distributed temperature control module 5, and the distance between the temperature compensation unit 60 and the corresponding temperature control compensation area is 0 or more.

[0053] As an alternative embodiment of the present invention, the auxiliary temperature adjustment module 6 further includes a fixing assembly (not shown) for fixing the temperature compensation unit 60 to the corresponding temperature control compensation area.

[0054] As an alternative embodiment of the present invention, referring to FIG. 4, the temperature compensation unit 60 includes a heating unit 601 and a cooling unit 602 provided at intervals.

[0055] In some embodiments, the temperature compensation unit 60 and the heating plate 2 interact in a contact type, that is, the distance between the uppermost end of the temperature compensation unit 60 and the corresponding temperature control compensation area (not shown) is equal to 0, whereby the uppermost end of the temperature compensation unit 60 is brought into close contact with the temperature control compensation area (not shown).

[0056] In some specific embodiments, the fixing assembly is a heat-resistant adhesive, and the temperature compensation unit 60 is adhered to the temperature control compensation area corresponding to the bottom surface of the heating plate 2 by the heat-resistant adhesive. The heat-resistant adhesive can maintain good viscosity in a high-temperature environment, ensure that the temperature compensation unit 60 is adhered to the bottom surface of the heating plate 2, and has a better temperature compensation adjustment effect.

[0057] In some specific embodiments, the heating unit 601 of the temperature compensation unit 60 is a ceramic heating sheet.

[0058] In some specific embodiments, the cooling unit 602 of the temperature compensation unit 60 is a semiconductor cooling chip.

[0059] In some other embodiments, the temperature compensation unit 60 is suspended between the heating plate 2 and the distributed temperature control module 5 through the fixed assembly, so that the distance between the uppermost end of the temperature compensation unit 60 and the corresponding temperature control compensation region is greater than 0. The temperature compensation unit 60 and the heating plate 2 interact non - contact.

[0060] In some specific embodiments, the temperature - rising unit 601 of the temperature compensation unit 60 is an LED light or a halogen lamp.

[0061] As an alternative embodiment of the present invention, when the second temperature value is smaller than a preset second target temperature, until the second temperature value is adjusted to the second target temperature, the distributed temperature control module 5 controls the temperature - rising unit 601 to perform temperature compensation adjustment on the heating zone. When the second temperature value is greater than a preset second target temperature, until the second temperature value is adjusted to the second target temperature, the distributed temperature control module 5 controls the cooling unit 602 to perform temperature compensation adjustment on the heating zone.

[0062] In some embodiments, the cooling unit 602 of the temperature compensation unit 60 is a small gas supply assembly.

[0063] In some embodiments, the small gas supply assembly is configured to spray clean refrigerant gas into the corresponding temperature control compensation region under the control of the distributed temperature control module 5.

[0064] In some specific embodiments, the small gas supply assembly includes a gas circulation pipeline disposed corresponding to each of the temperature control compensation regions. The small gas supply assembly is configured to circulate clean refrigerant gas through the gas circulation pipeline under the control of the distributed temperature control module 5 in order to cool the corresponding temperature control compensation region. To improve the cooling effect, the gas circulation pipeline is close to or in close contact with the back surface of the heating plate 2.

[0065] In some embodiments, the cooling unit 602 of the temperature compensation unit 60 is a small liquid supply assembly.

[0066] In some specific embodiments, the small liquid supply assembly includes a liquid circulation pipeline disposed corresponding to each of the temperature control compensation regions. The small liquid supply assembly is configured to circulate a refrigerant liquid through the liquid circulation pipeline under the control of the distributed temperature control module 5 in order to cool the corresponding temperature control compensation region. To improve the cooling effect, the liquid circulation pipeline is close to or in close contact with the back surface of the heating plate 2.

[0067] As an alternative embodiment of the present invention, referring to FIG. 5, the auxiliary temperature adjustment module 6 further includes a support member 61 provided on the partition plate 7, an elastic member 62 provided inside the support member 61, and a mounting portion 63 provided at the uppermost end of the elastic member 62. The temperature compensation unit 60 is provided on the side of the mounting portion 63 facing the heating plate 2. Due to the action of the support member 61, the elastic member 62 applies a force to the temperature compensation unit 60 in the direction corresponding to the temperature control compensation region to adjust the distance between the temperature compensation unit 60 and the corresponding temperature control compensation region.

[0068] In some embodiments, inside the support member 61, a groove 64 is provided in a direction away from the bottom surface of the heating plate 2 or in a direction approaching the bottom surface of the heating plate 2, and the mounting portion 63 is slidable in the groove 64, and the elastic member 62 is provided inside the groove 64. The groove 64 defines the radial movement range of the mounting portion 63, and adjusts the distance between the temperature compensation unit 60 and the temperature control compensation region as needed, so that the temperature compensation unit 60 can effectively act on the corresponding temperature control compensation region.

[0069] In some embodiments, the elastic member 62 is in a compressed operating state, and applies a force to the temperature compensation unit 60 in a direction corresponding to the temperature control compensation region (not shown), so that the uppermost end of the temperature compensation unit 60 is in close contact with the corresponding temperature control compensation region (not shown).

[0070] In some specific embodiments, the elastic member 62 is a spring.

[0071] As an alternative embodiment of the present invention, inside the support member 61, a lead hole for passing a lead is provided, and inside the mounting portion 63, a lead hole for passing a lead is also provided.

[0072] In some embodiments, referring to FIG. 5, the partition plate 7 is provided with a first lead hole (not shown) for passing a lead, the support member 61 is provided with a second lead hole 610 for passing a lead inside, and the mounting portion 63 is provided with a third lead hole 630 for passing a lead inside. By passing the lead through the third lead hole 630, the groove 64, the second lead hole 610, and the first lead hole respectively, the temperature compensation unit 60 can be connected to the distributed temperature control module 5, and the communication connection between the temperature compensation unit 60 and the distributed temperature control module 5 can be realized.

[0073] As an alternative embodiment of the present invention, referring to FIG. 1, it further includes a temperature control sealing plate 3, the temperature control sealing plate 3 is provided in the mounting chamber 11, the temperature control sealing plate 3 is located at the bottom end of the heating plate 2, a heat insulation space is formed between the temperature control sealing plate 3 and the inner wall of the heating plate 2 and the heating cavity 10, and both the distributed temperature control module 5 and the auxiliary temperature adjustment module 6 are provided in the heat insulation space.

[0074] In some embodiments, the temperature control sealing plate 3 is made of a heat insulating material, the outer surface of the temperature control sealing plate 3 is hermetically connected to the inner wall of the heating cavity 10, a heat insulation space can be formed between the heating plate 2 and the inner wall of the heating cavity 10, it is easy to maintain the temperature in the heating cavity 10, thereby ensuring the temperature stability in the processing process of the semiconductor substrate, achieving the effects of power saving and energy conservation, and the temperature control board 8 also plays a role of hermetic protection to protect circuit components such as the distributed temperature control module 5 and the auxiliary temperature adjustment module 6 between the heating plate 2 and the temperature control sealing plate 3.

[0075] The present invention further provides a semiconductor device including the temperature compensation system.

[0076] FIG. 7 is a flowchart of a temperature compensation method according to an embodiment of the present invention.

[0077] Referring to FIG. 7, the present invention S0: providing a heating plate provided with at least one temperature control compensation region on the bottom surface, a main heating module, and an auxiliary temperature adjustment module arranged corresponding to the temperature control compensation region; S1: performing temperature detection on the heating plate to obtain a first temperature value and a second temperature value; S2: controlling the main heating module to perform temperature adjustment on the heating plate based on the first temperature value; S3: Based on the second temperature value, controlling the auxiliary temperature adjustment module to perform temperature compensation adjustment on the temperature control compensation region, and further providing a temperature compensation method including the step.

[0078] In some specific embodiments, referring to FIGS. 1 to 7, while referring to the temperature compensation system of the present invention, the specific operation steps of the temperature compensation method of the present invention are as follows. (1) After the heating power of the main heating module 9 is stabilized, place the temperature measurement wafer 41 on the heating surface on the upper surface of the heating plate 2, measure the temperature measurement wafer 41 through the temperature sensor 42, perform the first temperature detection on the heating plate 2, obtain the first temperature value, and feedback the first temperature value to the multi-zone temperature control module 90. (2) The step of the multi-zone temperature control module 90 controlling the main heating module 9 to perform temperature adjustment on the heating plate 2 based on the first temperature value is specifically as follows. When the first temperature value is smaller than a preset first target temperature, the multi-zone temperature control module controls the main heating module to increase the heating power, raise the temperature of the heating plate, and maintain the output power of the main heating module unchanged until the first temperature value is adjusted to the first target temperature. When the first temperature value is larger than a preset first target temperature, the multi-zone temperature control module controls the main heating module to reduce the heating power, lower the temperature of the heating plate, and maintain the output power of the main heating module unchanged until the first temperature value is adjusted to the first target temperature. (3) In the temperature compensation adjustment stage of the heating plate 2, that is, after the temperature adjustment is completed, several temperature measurement points on the temperature measurement wafer 41 are respectively measured by several temperature sensors 42 to obtain several second temperature values, and the measured second temperature values are fed back to the distributed temperature control module 5 to realize the online monitoring of the temperature in the temperature control compensation region. (4) The step of the distributed temperature control module 5 controlling the auxiliary temperature adjustment module 6 to perform temperature compensation adjustment on the temperature control compensation area based on the second temperature value is specifically as follows. When the second temperature value is less than the second target temperature, until the second temperature value corresponding to the temperature control compensation area reaches the second target temperature, the distributed temperature control module 5 controls the heating unit 601 of the corresponding temperature control compensation area of the temperature sensor 42 to raise the temperature of the temperature control compensation area. When the second temperature value is greater than the second target temperature, until the second temperature value corresponding to the temperature control compensation area reaches the second target temperature, the distributed temperature control module 5 controls the cooling unit 602 of the corresponding temperature control compensation area of the temperature sensor 42 to cool the temperature control compensation area.

[0079] In the prior art, usually, the temperature uniformity of the heating plate is adjusted by performing zone-by-zone control on the heating plate. For example, the heating plate is divided into 7 zones, 13 zones, 15 zones, etc. Considering the layout requirements of the functional devices and the limitations of the wiring installation, the zones of the heating plate cannot be infinitely large, and each zone includes some temperature measurement sampling points on the temperature measurement wafer. When a specific zone is indicated from the temperature measurement wafer, for example, if the temperature uniformity of the first zone does not meet the process requirements and needs to be adjusted to raise the temperature, the main control unit controls the first zone to raise the temperature. However, there are the following problems with such adjustment. The average temperature of some of the temperature measurement sampling points included in the first zone is lower than the target temperature, but the temperature of some of these temperature measurement sampling points is higher than the target temperature, and the temperature differences from the target temperature are probably different from each other. Even in each temperature control area where the temperature is lower than the target temperature, the temperature differences from the target temperature are probably different from each other. It can be seen that the temperature adjustment of a single zone easily causes the problem of temperature non-uniformity again over the entire range of the heating plate.

[0080] In addition, in the above zone-by-zone control method, since independent temperature control is required for each zone, the cost of the temperature control part increases significantly. Moreover, the more zones there are, the more heating devices are needed, and obviously the temperature control cost increases.

[0081] In the technical solution according to the embodiment of the present invention, after the heating power of the main heating module 9 is stabilized, the temperature feedback module 4 performs the first temperature detection on the heating plate 2, obtains the first temperature value, and feeds back the first temperature value to the multi-zone temperature control module 90. The multi-zone temperature control module 90 controls the main heating module 9 to perform temperature adjustment on the heating plate 2 based on the first temperature value until the first temperature value is maintained within the first temperature range.

[0082] After the temperature adjustment is completed, the temperature sensor 42 obtains the temperature information of the temperature measurement wafer 41 to obtain a second temperature value. Based on the second temperature value, several temperature control compensation regions where the temperature compensation adjustment of the bottom surface of the heating plate 2 is not required are determined. Finally, until the second temperature value is maintained at the second target temperature, the distributed temperature control module 5 controls the corresponding temperature compensation unit 60 to heat up or cool down the temperature control compensation region, thereby achieving the purpose of temperature compensation adjustment. Realize two temperature detections and two temperature adjustments of the heating plate, realize the functions of independent temperature measurement and independent temperature compensation adjustment of several of the temperature compensation units 60, ensure that the temperature of each temperature control compensation region reaches the preset temperature range, and ensure the temperature uniformity of the heating plate 2 and the temperature uniformity of each zone of the heating plate 2.

[0083] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the present invention as set forth in the appended claims. Further, the invention described herein is capable of other embodiments and can be practiced or realized in various ways.

Claims

1. A cavity, a temperature feedback module, a heating plate, a multi-zone temperature control module, a distributed temperature control module, a main heating module for heating the heating plate, and at least one auxiliary temperature adjustment module, wherein the cavity and the bottom surface of the heating plate form an attachment chamber, and the main heating module, the auxiliary temperature adjustment module, and the distributed temperature control module are provided inside the attachment chamber. The distributed temperature control module is communicatively connected to the temperature feedback module and the auxiliary temperature adjustment module, and the multi-zone temperature control module is communicatively connected to the temperature feedback module and the main heating module. At least one temperature control compensation region is provided on the bottom surface of the heating plate, and the auxiliary temperature adjustment module is arranged corresponding to the temperature control compensation region. The temperature feedback module performs temperature detection on the heating plate and obtains a first temperature value and a second temperature value. Based on the first temperature value, the multi-zone temperature control module controls the main heating module to perform temperature adjustment on the heating plate. The distributed temperature control module controls the auxiliary temperature adjustment module to perform temperature compensation adjustment on the temperature control compensation region based on the second temperature value. A temperature compensation system is characterized by this.

2. After the heating power of the main heating module is stabilized, the temperature feedback module performs the first temperature detection on the heating plate, obtains the first temperature value, and feeds back the first temperature value to the multi-zone temperature control module. After the temperature adjustment is completed, the temperature feedback module performs the second temperature detection on the heating plate, obtains the second temperature value, and feeds back the second temperature value to the distributed temperature control module. The temperature compensation system according to claim 1 is characterized by this.

3. The temperature compensation system according to claim 1 further includes a partition plate provided between the main heating module and the distributed temperature control module, and the auxiliary temperature adjustment module is provided on the partition plate.

4. The temperature compensation system according to claim 3, wherein the partition plate is provided with lead holes for passing leads.

5. The temperature compensation system according to claim 3, wherein the auxiliary temperature adjustment module includes a temperature compensation unit communicatively connected to the distributed temperature control module, and the distance between the temperature compensation unit and the corresponding temperature control compensation region is 0 or more.

6. The temperature compensation system according to claim 5, wherein the auxiliary temperature adjustment module further includes a fixing assembly for fixing the temperature compensation unit to the corresponding temperature control compensation region.

7. The auxiliary temperature adjustment module further includes a support member provided on the partition plate, an elastic member provided inside the support member, and a mounting portion provided at the uppermost end of the elastic member. The temperature compensation unit is provided on the side of the mounting portion facing the heating plate. The temperature compensation system according to claim 5, wherein, by the action of the support member, the elastic member applies a force to the temperature compensation unit in a direction corresponding to the temperature control compensation region to adjust the distance between the temperature compensation unit and the corresponding temperature control compensation region.

8. The temperature compensation system according to claim 7, wherein the support member is provided with lead holes for passing leads inside.

9. The temperature compensation system according to claim 7, wherein the temperature compensation unit includes a temperature raising unit and a cooling unit provided at intervals.

10. The temperature compensation system according to claim 9, wherein when the second temperature value is smaller than a preset second target temperature, the distributed temperature control module controls the temperature raising unit to perform temperature compensation adjustment on the temperature control compensation region corresponding to the second temperature value.

11. The temperature compensation system according to claim 9, wherein when the second temperature value is larger than a preset second target temperature, the distributed temperature control module controls the cooling unit to perform temperature compensation adjustment on the temperature control compensation region corresponding to the second temperature value.

12. Further comprising a temperature control sealing plate provided inside the mounting chamber, the temperature control sealing plate being located at the bottom end of the heating plate, a heat insulation space being formed between the temperature control sealing plate, the heating plate and the inner wall of the mounting chamber, and both the distributed temperature control module and the auxiliary temperature adjustment module being provided in the heat insulation space, the temperature compensation system according to claim 1 or 9.

13. A semiconductor device, characterized by comprising the temperature compensation system according to claim 1.

14. Step S0 of providing a heating plate provided with at least one temperature control compensation region on the bottom surface, a main heating module, and an auxiliary temperature adjustment module arranged corresponding to the temperature control compensation region; Step S1 of performing temperature detection on the heating plate and obtaining a first temperature value and a second temperature value; Step S2 of controlling the main heating module so as to perform temperature adjustment on the heating plate based on the first temperature value; A temperature compensation method, characterized by comprising step S3 of controlling the auxiliary temperature adjustment module so as to perform temperature compensation adjustment on the temperature control compensation region based on the second temperature value.

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