Display panel and manufacturing method thereof

Abstract

A display panel is disclosed. The display panel includes a driving backplane, a plurality of light-emitting elements, and a packaging structure. The plurality of light-emitting elements are located on a first side of the driving backplane, and are spaced apart from one another. The light-emitting elements include a device body and a device pin. The device body includes a light-emitting portion, and the device pin is electrically connected to the driving backplane. The packaging structure is located on the first side of the driving backplane. The packaging structure includes a light-shielding pattern and a plurality of package parts. The light-shielding pattern has a plurality of receiving areas, each of which exposes at least one light-emitting element. At least a portion of the package part is located within the receiving area and covers the light-emitting element. The light-emitting portion of at least one light-emitting element is located within the receiving area.

Description

[Technical Field]

[0001] The present disclosure relates to the field of display technology, and more particularly to a display panel and a manufacturing method thereof. [Background technology]

[0002] The display panel includes a plurality of light-emitting elements, which are used to emit light to the outside, so that the display panel can realize the function of displaying images. Summary of the Invention [Means for solving the problem]

[0003] In one aspect, a display panel is provided. The display panel includes a driving backplane, a plurality of light-emitting elements, and a package structure. The plurality of light-emitting elements are located on a first side of the driving backplane, and are spaced apart from one another. The light-emitting elements include a device body and a device pin. The device body includes a light-emitting portion, and the device pin is electrically connected to the driving backplane. The package structure is located on the first side of the driving backplane. The package structure includes a light-shielding pattern and a plurality of package parts. The light-shielding pattern has a plurality of receiving areas, each of which exposes at least one light-emitting element. At least a portion of the package part is located within the receiving area and covers the light-emitting element. The light-emitting portion of at least one light-emitting element is located within the receiving area.

[0004] In some embodiments, the receiving area has a top opening and a bottom opening, the top opening being further from the drive backplane than the bottom opening, the area of the top opening being greater than the area of the bottom opening.

[0005] In some embodiments, the receiving area has a sidewall, and a first included angle is formed between the sidewall and a surface of the light-shielding pattern that is closer to the driving backplane, and the first included angle is an acute angle.

[0006] In some embodiments, the first included angle is less than or equal to 75°.

[0007] In some embodiments, an end face of the package part away from the driving backplane along the thickness direction of the driving backplane is higher than an end face of the light-shielding pattern away from the driving backplane, and the end face of the package part away from the driving backplane is a first curved surface, which curves in a direction away from the driving backplane.

[0008] In some embodiments, the package portion includes a first partial package portion and a second partial package portion, the first partial package portion being closer to the drive backplane than the second partial package portion. The first partial package portion surrounds the light-emitting element, and an end face of the first partial package portion facing away from the drive backplane is flush with an end face of the light-emitting element facing away from the drive backplane. The second partial package portion is located on the side of the first partial package portion facing away from the drive backplane and covers the first partial package portion and the light-emitting element. A third distance is present between the end face of the first partial package portion facing away from the drive backplane and the drive backplane. A fourth distance is present between the end face of the second partial package portion facing closer to the first partial package portion and the end face of the second partial package portion facing away from the first partial package portion. A fifth distance is present between the end face of the light-shielding pattern facing away from the drive backplane and the drive backplane. The fifth distance is greater than or equal to the third distance and less than the sum of 50% of the fourth distance and the third distance.

[0009] In some embodiments, the light-shielding pattern has a semi-elliptical shape in a longitudinal cross section, the longitudinal cross section being parallel to the thickness direction of the driving backplane. The semi-elliptical shape has a first side and a second side, and both ends of the first side are respectively connected to both ends of the second side. The first side is close to the driving backplane, and the second side is curved in a direction away from the driving backplane.

[0010] In some embodiments, an end face of the package part away from the driving backplane along the thickness direction of the driving backplane is lower than an end face of the light-shielding pattern away from the driving backplane, and at least a middle region of the end face of the package part away from the driving backplane is flat.

[0011] In some embodiments, the light-shielding pattern includes a first partial light-shielding pattern and a second partial light-shielding pattern, and the first partial light-shielding pattern is closer to the driving backplane than the second partial light-shielding pattern. An end surface of the first partial light-shielding pattern away from the driving backplane is flush with an end surface of the light-emitting element away from the driving backplane. The second partial light-shielding pattern is located on the side of the first partial light-shielding pattern away from the driving backplane. A first distance exists between the end surface of the first partial light-shielding pattern away from the driving backplane and the driving backplane. A second distance exists between the end surface of the second partial light-shielding pattern closer to the first partial light-shielding pattern and the end surface of the second partial light-shielding pattern away from the first partial light-shielding pattern. The second distance is equal to or greater than 30% of the first distance and equal to or less than twice the first distance.

[0012] In some embodiments, the accommodating area includes a first sub-accommodating area and a second sub-accommodating area, and the first sub-accommodating area and the second sub-accommodating area are in communication with each other. An orthogonal projection of an edge of the opening of the first sub-accommodating area on the driving backplane is located within an area formed by an orthogonal projection of an edge of the opening of the second sub-accommodating area on the driving backplane. The driving backplane includes a backplane body and a plurality of pad assemblies, and the plurality of pad assemblies are electrically connected to the backplane body. The pad assembly passes through the first sub-accommodating area and is welded to at least one light-emitting element. A light-emitting portion of the at least one light-emitting element is located within the second sub-accommodating area.

[0013] In some embodiments, the light-shielding pattern includes a first sub-light-shielding pattern and a second sub-light-shielding pattern that are stacked one on top of the other, the first sub-light-shielding pattern being closer to the driving backplane than the second sub-light-shielding pattern, the first sub-light-shielding pattern including a first sub-accommodating area, and the second sub-light-shielding pattern including a second sub-accommodating area.

[0014] In some embodiments, the first sub-light-shielding pattern has a first trapezoidal shape in a longitudinal cross section, the longitudinal cross section being parallel to the thickness direction of the driving backplane. The first trapezoid has a first base and a second base, the first base is parallel to the second base, and the length of the first base is shorter than the length of the second base. The first base is closer to the driving backplane than the second base. Alternatively, the first base is farther from the driving backplane than the second base.

[0015] In some embodiments, the pad assembly includes at least two conductive pads. The conductive pads include an extending surface and a welding surface. The extending surface extends in a direction away from the backplane body. The welding surface is connected to an end of the extending surface away from the backplane body. The element pin is welded to the welding surface. The first sub-accommodation area has a first sub-sidewall, and the first sub-sidewall contacts at least a portion of the extending surface.

[0016] In some embodiments, along the thickness of the drive backplane, the edge regions of the welding surface are higher than the center region of the welding surface.

[0017] In some embodiments, the second sub-light-shielding pattern has a second trapezoidal shape in a longitudinal cross section, the longitudinal cross section being parallel to the thickness direction of the driving backplane. The second trapezoid has a third base and a fourth base, the third base is parallel to the fourth base, and the length of the third base is shorter than the length of the fourth base. The third base is farther from the driving backplane than the fourth base. Alternatively, the third base is closer to the driving backplane than the fourth base.

[0018] In some embodiments, the second sub-accommodating area has a second sub-sidewall, and the display panel further includes a reflective layer covering at least a portion of the second sub-sidewall and / or covering at least a portion of a surface of the first sub-light-shielding pattern facing away from the driving backplane.

[0019] In some embodiments, at least a central region of the end face of the package part away from the driving backplane is flat, or the end face of the package part away from the driving backplane has a second curved surface that curves in a direction away from the driving backplane.

[0020] In some embodiments, along the thickness direction of the driving backplane, the end face of the package portion facing away from the driving backplane is higher than the end face of the light-shielding pattern facing away from the driving backplane, and the package portion covers the edge region of the end face of the light-shielding pattern facing away from the driving backplane.

[0021] In some embodiments, the package portion includes a first partial package portion and a second partial package portion, the first partial package portion being closer to the drive backplane than the second partial package portion. The first partial package portion surrounds the light-emitting element, and an end face of the first partial package portion facing away from the drive backplane is flush with an end face of the light-emitting element facing away from the drive backplane. The second partial package portion is located on the side of the first partial package portion facing away from the drive backplane and covers the first partial package portion and the light-emitting element. A third distance is present between the end face of the first partial package portion facing away from the drive backplane and the drive backplane. A fourth distance is present between the end face of the second partial package portion facing closer to the first partial package portion and the end face of the second partial package portion facing away from the first partial package portion. The fourth distance is greater than or equal to 30% of the third distance and less than or equal to twice the third distance.

[0022] In some embodiments, the display panel further includes a protective layer that covers at least one of an end surface of the light-shielding pattern facing away from the driving backplane and an end surface of the package portion facing away from the driving backplane.

[0023] In some embodiments, the display panel further comprises a touch layer, the touch layer being located on a side of the light-emitting element away from the driving backplane, the touch layer including a plurality of touch electrodes, the touch electrodes including grid lines, the orthogonal projections of the grid lines on the driving backplane being located within a range of the orthogonal projections of the light-shielding pattern on the driving backplane.

[0024] In some embodiments, the device body includes a body structure and a bait, the light emitting portion is located within the body structure, and the bait is connected to the body structure.

[0025] In another aspect, a method for manufacturing a display panel is provided for manufacturing the above-mentioned display panel. The method for manufacturing a display panel includes the steps of electrically connecting a plurality of light-emitting elements to a driving backplane and forming a package structure on a first side of the driving backplane. The plurality of light-emitting elements are located on the first side of the driving backplane, and the plurality of light-emitting elements are spaced apart from one another. The light-emitting elements include a device body and a device pin. The device body includes a light-emitting portion. The device pin is electrically connected to the driving backplane. The package structure includes a light-shielding pattern and a plurality of package parts. The light-shielding pattern has a plurality of receiving areas, each of which exposes at least one light-emitting element. At least a portion of the package part is located within the receiving area and covers the light-emitting element. The light-emitting portion of at least one light-emitting element is located within the receiving area.

[0026] In some embodiments, forming the package structure on the first side of the driving backplane includes first forming a plurality of package portions on the first side of the driving backplane, and then forming a light-shielding pattern on the first side of the driving backplane. Alternatively, forming the package structure on the first side of the driving backplane includes first forming a light-shielding pattern on the first side of the driving backplane, and then forming package portions in the receiving areas of the light-shielding pattern.

[0027] In yet another aspect, a display device is provided, the display device comprising the display panel described above. [Brief explanation of the drawings]

[0028] In order to more clearly explain the technical solutions according to the present disclosure, the drawings used in some embodiments of the present disclosure will be briefly described below. It is clear that the drawings in the following description are only a portion of the drawings in some embodiments of the present disclosure. Those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings in the following description can be considered as schematic diagrams and do not limit the actual dimensions of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure. [Figure 1] 1 is a structural diagram of a display device according to some embodiments; [Figure 2A] 1A and 1B are structural diagrams of display panels according to some embodiments. [Figure 2B] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 2C] 1 is a diagram illustrating the positional relationship between a light emitting element and a driving backplane according to some embodiments. [Figure 2D] 1A to 1C are structural diagrams of light-emitting devices according to some embodiments. [Figure 2E] 1 is a structural diagram of a drive backplane according to some embodiments. [Figure 2F] 1 is a structural diagram of a light emitting device after packaging according to some embodiments. [Figure 2G]1A to 1C are structural diagrams of an element body according to some embodiments. [Figure 2H] 10A to 10C are structural diagrams of element bodies according to some other embodiments. [Figure 2I] 10A to 10C are structural diagrams of element bodies according to some other embodiments. [Figure 2J] 10A to 10C are structural diagrams of element bodies according to some other embodiments. [Figure 3A] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 3B] 1 is a structural diagram of a driving backplane and a light-shielding pattern according to some embodiments. [Figure 3C] 1 is a structural diagram of a driving backplane, a light emitting element, and a packaging part according to some embodiments; [Figure 4A] 1 is a structural diagram of a negative OC adhesive according to some embodiments. [Figure 4B] 10A and 10B are structural diagrams of negative OC adhesives according to some other embodiments. [Figure 4C] 10A and 10B are structural diagrams of negative OC adhesives according to some other examples. [Figure 4D] 1 is a structural diagram of a positive OC adhesive according to some embodiments. [Figure 4E] 10A and 10B are structural diagrams of positive OC adhesives according to some other embodiments. [Figure 5A] 1 is a structural diagram of a driving backplane, a light-emitting element, and a light-shielding pattern according to some embodiments; [Figure 5B] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 5C] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 6A] 1A and 1B are structural diagrams of a light blocking pattern and a driving backplane according to some embodiments. [Figure 6B] 10A and 10B are structural diagrams of light-shielding patterns and driving backplanes according to some other embodiments. [Figure 6C] 10A and 10B are structural diagrams of a first sub-light-shielding pattern and a driving backplane according to some embodiments. [Figure 6D] 10A and 10B are structural diagrams of a driving backplane, a first sub-light-shielding pattern, a light-emitting element, and a packaging part according to some embodiments; [Figure 6E] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 6F] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 7A] 10A and 10B are diagrams illustrating the positional relationship between a reflective layer and a light-shielding pattern according to some embodiments. [Figure 7B] 10A to 10C are diagrams showing the positional relationship between a reflective layer and a light-shielding pattern according to some other embodiments. [Figure 7C] 10A to 10C are diagrams showing the positional relationship between the reflective layer and the light-shielding pattern according to some other examples. [Figure 7D] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 7E] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 7F] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 7G] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 8A] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 8B] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 8C] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 8D] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 9] 10A to 10C are structural diagrams of display panels according to some other embodiments. [Figure 10] 1 is a flowchart of steps in a method for manufacturing a display panel according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0029] Hereinafter, several embodiments of the present disclosure will be described clearly and completely with reference to the drawings. Of course, the embodiments described herein are only a part of the embodiments of the present disclosure, and are not all of the embodiments. All other embodiments that can be obtained by those skilled in the art based on the embodiments in the present disclosure shall fall within the scope of protection of the present disclosure.

[0030] Unless the context indicates otherwise, in this specification and claims, the term "comprise" and other forms thereof, such as the third-person singular "comprises" and the present participle form "comprising," should be interpreted in an open, inclusive sense, i.e., "including, but not limited to." In the description, the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," "some examples," and the like, are intended to indicate that a particular feature, structure, material, or characteristic associated with this embodiment or examples is included in at least one embodiment or example of the present disclosure. General references to the above terms do not necessarily refer to the same embodiment or example. Furthermore, a described particular feature, structure, material, or characteristic may be included in any one or more embodiments or examples in any appropriate manner.

[0031] Hereinafter, the terms "first" and "second" are for descriptive purposes only and should not be understood as indicating or implying the relative importance or quantity of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In describing the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more than two.

[0032] In describing some embodiments, the term "connected" and its derivatives may be used. For example, in describing some embodiments, the term "connected" may be used to indicate that two or more elements are in direct or indirect physical or electrical contact with each other.

[0033] "At least one of A, B, and C" has the same meaning as "at least one of A, B, or C," and all include A only, B only, C only, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0034] "A and / or B" includes three combinations: A only, B only, and a combination of A and B.

[0035] As used herein, "about," "approximately," or "approximately" includes the stated value and the mean within an acceptable range of deviation of the specified value, where the acceptable range of deviation is determined by one of ordinary skill in the art considering the measurement and the error associated with measuring the specified quantity (i.e., limitations of the measurement system).

[0036] As used herein, "parallel," "perpendicular," and "equal" include the described situation and situations that are similar to the described situation, and this range of similar situations is within an acceptable deviation range, which is determined by taking into account the measurement considered by a person skilled in the art and the error associated with measuring a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes true parallel and approximately parallel, where an acceptable deviation range for approximately parallel may be, for example, a deviation within 5°, and "perpendicular" includes true perpendicular and approximately perpendicular, where an acceptable deviation range for approximately perpendicular may be, for example, a deviation within 5°. "Equal" includes absolutely equal and approximately equal, where, within the acceptable deviation range for approximately equal, for example, the difference between the two equals is 5% or less.

[0037] When a layer or element is referred to as being on another layer or substrate, it is understood that the layer or element may be located directly on the other layer or substrate, or there may be intermediate layers between the layer or element and the other layer or substrate.

[0038] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized illustrative drawings. In the drawings, thicknesses of layers and regions are exaggerated for clarity. As such, variations in shape relative to the drawings due, for example, to manufacturing techniques and / or tolerances are to be expected. Thus, exemplary embodiments of the present disclosure are not limited to the shapes of regions illustrated herein, but should be construed to include deviations in shape due to manufacturing or otherwise. For example, an etching region shown as a rectangle typically has curved features. Thus, regions shown in the drawings are exemplary in nature, and their shapes are not intended to represent the actual shape of regions of a facility, nor are they intended to limit the scope of exemplary embodiments.

[0039] FIG. 1 is a structural diagram of a display device according to some embodiments.

[0040] 1 , some embodiments of the present disclosure provide a display device 200. In some examples, the display device 200 may be a laptop, a mobile phone, a wireless device, a personal data assistant (PDA), a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a video camera, a game console, a wristwatch, a clock, a calculator, a television monitor, a flat panel display, a computer monitor, a car display (e.g., a speedometer display, a distance meter display, etc.), a navigator, a cockpit controller and / or display, a camera view display (e.g., a rearview camera display in a vehicle), an electronic photograph, an electronic sign or sign, a projector, packaging, an aesthetic structure (e.g., a display of an image of a piece of jewelry), etc.

[0041] As shown in FIG. 1 , the display device 200 includes a display panel 100. It is understood that the display panel 100 is used to display image information. For example, the display panel 100 may be used to display still images such as pictures or photographs. The display panel 100 may also be used to display moving images such as videos or game screens. The embodiments of the present disclosure do not further limit the display device 200. The following description will be given by way of example of the display panel 100.

[0042] FIG. 2A is a structural diagram of a display panel according to some embodiments.

[0043] 2A, the display panel 100 includes a plurality of sub-pixels 101. The sub-pixels 101 are located in a display area AA of the display panel 100 and are arranged in an array.

[0044] It is understood that the subpixel 101 is the smallest unit for the display panel 100 to display an image. Each subpixel 101 may display a single color, such as red, green, or blue. The display panel 100 may include multiple red subpixels, multiple green subpixels, and multiple blue subpixels. By adjusting the brightness (grayscale) of the subpixels 101 of different colors, red light, green light, and blue light of different intensities can be obtained. By superimposing at least two of the red light, green light, and blue light of different intensities, more colors of light can be displayed, thereby realizing full-color display of the display panel 100.

[0045] FIG. 2B is a structural diagram of a display panel according to some other embodiments.

[0046] 2B, the display panel 100 includes a driving backplane 150 and a plurality of light-emitting elements 110. The plurality of light-emitting elements 110 are located on a first side of the driving backplane 150, and the plurality of light-emitting elements 110 are spaced apart from one another.

[0047] It should be noted that in the drawings of the present disclosure, only one or two light-emitting elements 110 are shown in order to clearly show the structure of the light-emitting element 110. The embodiments of the present disclosure do not further limit the number of light-emitting elements 110.

[0048] 2B, the plurality of light-emitting elements 110 are located on a first side of the driving backplane 150, and the plurality of light-emitting elements 110 are spaced apart from one another. That is, the plurality of light-emitting elements 110 are located on the same side of the driving backplane 150 and are spaced apart from one another. It is understood that the spacing between the plurality of light-emitting elements 110 may be the same or different.

[0049] It is understood that one light-emitting element 110 is located within one sub-pixel 101. In some examples, the multiple light-emitting elements 110 can emit light independently of each other, thereby improving the display performance of the display panel 100.

[0050] In some examples, the plurality of light-emitting elements 110 are used to emit light of different colors. For example, some (two or more) of the plurality of light-emitting elements 110 are used to emit red light, other some (two or more) of the plurality of light-emitting elements 110 are used to emit blue light, and still other some (two or more) of the plurality of light-emitting elements 110 are used to emit green light, thereby enabling the display panel 100 to achieve full-color display.

[0051] In some other examples, the plurality of light-emitting elements 110 are used to emit light of the same color. Illustratively, all of the plurality of light-emitting elements 110 may be used to emit white light, or all of the plurality of light-emitting elements 110 may be used to emit blue light. When the plurality of light-emitting elements 110 are used to emit light of the same color, the display panel 100 further includes a color conversion film (not shown).

[0052] For example, if the light-emitting elements 110 are all used to emit white light, the color conversion film may include a red filter film, a green filter film, and a blue filter film. By filtering the white light through different filter films, red light, green light, and blue light can be obtained, thereby enabling the display panel 100 to achieve full-color display.

[0053] For example, when the light emitting elements 110 are all used to emit blue light, the color conversion film may be a quantum dot film, which includes red and green quantum dots. When blue light emitted from the light emitting elements 110 is irradiated onto the quantum dot film, the red quantum dots convert the blue light into red light, and the green quantum dots convert the blue light into green light, thereby enabling the panel 100 to achieve full-color display.

[0054] In some examples, the light-emitting element 110 is a light-emitting diode (LED). Illustratively, the light-emitting element 110 may be a conventional LED, a mini light-emitting diode (Mini LED), or a micro light-emitting diode (Micro LED).

[0055] For example, a conventional LED is one whose size is 500 μm or more. A Mini LED is one whose size is 100 μm or more and less than 500 μm. A Micro LED is one whose size is less than 100 μm. In some cases, the size of a Micro LED may be 50 μm or less.

[0056] The embodiment of the present disclosure does not further limit the size of the light emitting device 110. In the following, the light emitting device 110 will be described as a Micro LED.

[0057] Micro LED is a new display technology that thins, miniaturizes, and arrays LEDs to make each LED smaller than 100μm.Compared to organic light-emitting diode displays (OLEDs), Micro LEDs have many advantages, including a longer service life, faster response speed (up to nanoseconds), high brightness, low power consumption, and ultra-high resolution.

[0058] 2C and 2D are diagrams illustrating the positional relationship between a light emitting device and a driving backplane according to some embodiments, respectively.

[0059] 2B and 2C, the light-emitting element 110 includes an element body 112 and element pins 114. As shown in FIG. 2C, the element body 112 includes a light-emitting portion 1121, and the element pins 114 are electrically connected to the driving backplane 150.

[0060] It is understood that the light emitting portion 1121 is used to emit light. In some examples, as shown in FIG. 2D , the device body 112 includes an N-type doped semiconductor 1125 and a P-type doped semiconductor 1124, and the light emitting portion 1121 is located between the N-type doped semiconductor 1125 and the P-type doped semiconductor 1124.

[0061] It is understood that in some examples, N-type doped semiconductor 1125 is N-type gallium nitride, P-type doped semiconductor 1124 is P-type gallium nitride, and light emitting portion 1121 is a multiple quantum well. It is understood that N-type doped semiconductor 1125 can provide electrons, P-type doped semiconductor 1124 can provide holes, and the electrons and holes can be transported to the multiple quantum well and combine within the multiple quantum well, causing the multiple quantum well to emit light.

[0062] As shown in FIG. 2C, the element pins 114 are electrically connected to the driving backplane 150, so that electrical signals from the driving backplane 150 can be transported to the element body 112 via the element pins 114, thereby enabling the driving backplane 150 to drive the light emitting portion 1121 to emit light.

[0063] 2D , the element pin 114 includes a first element pin 1141 and a second element pin 1142. The first element pin 1141 is electrically connected to the P-type doped semiconductor 1124, and the second element pin 1142 is electrically connected to the N-type doped semiconductor 1125.

[0064] Illustratively, the material of the element pin 114 may be a conductive metal such as copper or aluminum, which improves the conductive performance of the element pin 114. The materials of the first element pin 1141 and the second element pin 1142 may be the same or different.

[0065] 2E is a structural diagram of a driving backplane according to some embodiments. The following describes the driving backplane 150 by way of example with reference to FIG. 2E.

[0066] In some examples, as shown in FIG. 2E, the driving backplane 150 includes a backplane body 152 and a plurality of pad assemblies 154 electrically connected to the backplane body 152.

[0067] Illustratively, as shown in FIG. 2E, the backplane body 152 includes a substrate 1524, a first insulating layer 1521, a second insulating layer 1522, a third insulating layer 1523, circuit wiring 1525, and a conductive layer 1526.

[0068] In some examples, the substrate 1524 is a rigid substrate. In some other examples, the substrate 1524 is a flexible substrate. Illustratively, the material of the substrate 1524 includes any of plastic, FR-4 grade material, resin, glass, quartz, polyimide, polymethyl methacrylate (PMMA), or LTPS (Low Temperature Poly-Silicon).

[0069] 2E, the circuit traces 1525 are located on one side of the substrate 1524. It is understood that the circuit traces 1525 are used to transmit electrical signals. In some examples, the material of the circuit traces 1525 is copper, which improves the conductive properties of the circuit traces 1525.

[0070] As shown in FIG. 2E, first insulating layer 1521 is located on the side of circuit wiring 1525 away from substrate 1524 and serves as electrical isolation.

[0071] 2E , the backplane body 152 further includes a plurality of protrusions 1527. The protrusions 1527 are located on a side of the first insulating layer 1521 that faces away from the substrate 1524. It is understood that the protrusions 1527 protrude in a direction away from the substrate 1524.

[0072] In some examples, the protrusion 1527 is frusto-conical or approximately frusto-conical, with the top surface of the frustum being farther from the substrate 1524 than the bottom surface. It is understood that the top surface of the frustum is parallel to the bottom surface and has a smaller area than the bottom surface. In some examples, the material of the protrusion 1527 includes a resin.

[0073] For example, as shown in FIG. 2E, the second insulating layer 1522 covers the surface of the protrusion 1527 facing away from the substrate 1524 and the surface of the first insulating layer 1521 facing away from the substrate 1524, and serves as electrical isolation.

[0074] 2E , the conductive layer 1526 is located on the side of the second insulating layer 1522 that faces away from the substrate 1524. The orthogonal projection of the conductive layer 1526 on the substrate 1524 covers the orthogonal projection of the protrusion 1527 on the substrate 1524. That is, a portion of the conductive layer 1526 may extend along the extension direction of the outer surface of the protrusion 1527. Furthermore, the conductive layer 1526 may pass through the first insulating layer 1521 and the second insulating layer 1522 to be electrically connected to the circuit wiring 1525.

[0075] 2E, the third insulating layer 1523 covers the side of the conductive layer 1526 that faces away from the substrate 1524, and serves as electrical isolation. Also, as shown in FIG. 2E, the third insulating layer 1523 has a through hole P3, and the orthogonal projection of the edge of the through hole P3 on the substrate 1524 is located within the range of the orthogonal projection of the upper surface of the protrusion 1527 on the substrate 1524. Thus, the conductive layer 1526 covering the upper surface of the protrusion 1527 can be exposed through the through hole P3 on the third insulating layer 1523.

[0076] The plurality of pad assemblies 154 are electrically connected to the backplane body 152. Illustratively, as shown in FIG. 2E , the pad assembly 154 includes at least two conductive pads 156. The orthogonal projection of the conductive pads 156 on the substrate 1524 covers the orthogonal projection of the protrusion 1527 on the substrate 1524. That is, at least a portion of the conductive pads 156 can extend along the extension direction of the outer surface of the protrusion 1527.

[0077] In this manner, as shown in FIG. 2E, the conductive pad 156 can be electrically connected to the exposed conductive layer 1526 through the through hole P3 on the third insulating layer 1523, i.e., the pad assembly 154 can be electrically connected to the backplane body 152.

[0078] In some examples, the material of the conductive pads 156 is ITO (Indium Tin Oxide).

[0079] In some examples, the number of conductive pads 156 in the pad assembly 154 may be two, four, six, etc. As can be seen from the above, the element pins 114 are electrically connected to the drive backplane 150. In some examples, one light-emitting element 110 includes two element pins 114 (e.g., a first element pin 1141 and a second element pin 1142), and one element pin 114 is welded to one conductive pad 156.

[0080] That is, if the pad assembly 154 includes two conductive pads 156, the pad assembly 154 can be electrically connected to one light-emitting element 110. If the pad assembly 154 includes four conductive pads 156, the pad assembly 154 can be electrically connected to two light-emitting elements 110, and so on, by analogy as above.

[0081] 2E , the conductive pad 156 includes an extending surface 1561 and a welding surface 1562. The extending surface 1561 extends in a direction away from the backplane body 152. The welding surface 1562 is connected to the end of the extending surface 1561 that is away from the backplane body 152.

[0082] It is understood that the extension surface 1561 can cover the side surface of the protrusion 1527 and the welding surface 1562 can cover the top and bottom surface of the protrusion 1527, as shown in FIG. 2E.

[0083] By being arranged in this manner, as shown in FIG. 2E, the conductive pad 156 can extend in a direction away from the backplane body 152, and the welding surface 1562 can be electrically connected to the exposed conductive layer 1526 through the through hole P3 on the third insulating layer 1523, thereby electrically connecting the conductive pad 156 to the conductive layer 1526.

[0084] As shown in FIG. 2C, the element pins 114 are welded to the welding surface 1562, which allows the light emitting element 110 to be electrically connected to the driving backplane 150.

[0085] It is understood that by configuring the conductive pad 156 to include an extending surface 1561, which extends in a direction away from the backplane body 152, and the welding surface 1562 to be connected to the end of the extending surface 1561 away from the backplane body 152, the welding convenience between the element pin 114 and the welding surface 1562 of the conductive pad 156 can be improved, the welding yield between the element pin 114 and the welding surface 1562 can be improved, and the production efficiency of the display panel 100 can be improved.

[0086] In some examples, as shown in FIG. 2E, along the thickness direction of the drive backplane 150 (shown in the direction of arrow g in FIG. 2C), the edge region of the welding surface 1562 is higher than the center region of the welding surface 1562.

[0087] It can be understood that, because the through-hole P3 is opened in the third insulating layer 1523, the central region of the welding surface 1562 is located within the through-hole P3 and can be electrically connected to the exposed conductive layer 1526. As a result, the edge region of the welding surface 1561 can be higher than the central region of the welding surface 1561 along the thickness direction of the driving backplane 150.

[0088] For example, the element pin 114 may be welded to the edge region of the welding surface 1562, thereby further improving the welding convenience between the element pin 114 and the welding surface 1562 of the conductive pad 156, improving the yield of welding between the element pin 114 and the welding surface 1562, and improving the production efficiency of the display panel 100.

[0089] As shown in FIG. 2C, along the thickness direction of the drive backplane 150 (shown in the direction of arrow g in FIG. 2C), it can be understood that the edge region of the welding surface 1561 is higher than the central region of the welding surface 1561, and therefore, when the element pin 114 contacts the edge region of the welding surface 1561, a gap exists between the element pin 114 and the central region of the welding surface 1561.

[0090] In some instances, solder may be added between the central region of the welding surface 1561 and the element pin 114 to improve the reliability of the weld between the welding surface 1561 and the element pin 114 .

[0091] 2E , the backplane body 152 further includes a light-shielding layer 1528, which is located between the substrate 1524 and the first insulating layer 1521. Illustratively, the orthogonal projection of the light-shielding layer 1528 on the substrate 1524 is located between the orthogonal projections on the substrate 1524 of two conductive pads 156 that are welded to the same light-emitting element 110.

[0092] It is understood that the light emitting element 110 is a Lambertian emitter, that is, the light emitting element 110 is capable of emitting light in each direction.

[0093] Therefore, by installing the light-shielding layer 1528 so that its orthogonal projection on the substrate 1524 is located between the orthogonal projections on the substrate 1524 of the two conductive pads 156 that are welded to the same light-emitting element 110, when the light-emitting element 110 is welded to the conductive pad, the light-shielding layer 1528 acts as a shield against the light rays emitted from the light-emitting portion 1121, reducing the intensity of the light rays irradiated on the side of the substrate 1524 away from the light-emitting element 110, improving the light leakage phenomenon on the back of the display panel 100, and improving the display performance of the display panel 100.

[0094] In some embodiments, the driving backplane 150 is an active matrix (AM) driving backplane. That is, the driving backplane 150 further includes a pixel driving circuit (not shown). It is understood that the pixel driving circuit is located between the substrate 1524 and the conductive pads 156.

[0095] The driving backplane 150 includes a plurality of gate lines and a plurality of data lines located on the substrate 1524, and the pixel driving circuit is electrically connected to the gate lines and the data lines. Under the control of the gate scanning signal from the gate lines, the pixel driving circuit receives the data signal from the data lines and outputs the driving signal.

[0096] In some examples, the pixel driving circuit includes a thin film transistor (TFT), which includes a driving transistor. The driving transistor is located between the substrate 1524 and the conductive pad 156, and the conductive pad 156 is electrically connected to the driving transistor. The driving transistor can output a driving signal, which is transmitted to the light-emitting element 110 via the conductive pad 156, so that the pixel driving circuit can drive the light-emitting element 110.

[0097] In some examples, the pixel driving circuit may be a 2T1C driving circuit, i.e., the pixel driving circuit includes two thin film transistors and one capacitor. In some other examples, the pixel driving circuit may be a 7T1C pixel driving circuit (i.e., includes seven thin film transistors and one capacitor), or a 6T2C pixel driving circuit (i.e., includes six thin film transistors and one capacitor), etc.

[0098] It is understood that by configuring the driving backplane 150 to be an AM driving backplane, the driving backplane 150 can each drive the self-emission of multiple light-emitting elements 110, i.e., the multiple light-emitting elements 110 can emit light independently, thereby improving the display performance of the display panel 100.

[0099] Hereinafter, a method for manufacturing the light emitting device 110 will be described with reference to FIG. 2D.

[0100] As can be seen from the above, the element body 112 of the light emitting element 110 includes an N-type doped semiconductor 1125, a light emitting portion 1121, and a P-type doped semiconductor 1124. In some examples, as shown in FIG. 2D , the element body 112 may be formed on one side of the wafer base 116. That is, as shown in FIG. 2D , the N-type doped semiconductor 1125, the light emitting portion 1121, and the P-type doped semiconductor 1124 are formed in this order on one side of the wafer base 116.

[0101] In some examples, the wafer base 116 may be sapphire-based (English name: Sapphire, the main component is aluminum oxide, and the chemical formula is Al2O3), silicon carbide-based (chemical formula is SiC), or silicon-based (chemical formula is Si).

[0102] It is understood that the element bodies 112 of the plurality of light-emitting elements 110 are formed on one side of the wafer base 116, and the plurality of element bodies 112 are spaced apart. After the element bodies 112 are formed, the element pins 114 are electrically connected to the element bodies 112 to form the light-emitting elements 110. The wafer base 116 is laser cut so that the plurality of light-emitting elements 110 can be separated from one another (i.e., wafer expansion). It is understood that the wafer base 116 provides support and protection for the light-emitting elements 110, reducing the risk of the light-emitting elements 110 being damaged.

[0103] FIG. 2F is a structural diagram of a packaged light emitting device according to some embodiments.

[0104] In some embodiments, after cutting the wafer base 116, a portion of the wafer base 116 may be removed on a side of the wafer base 116 away from the light emitting elements 110, while a portion of the wafer base 116 on a side closer to the light emitting elements 110 may be retained. As shown in FIG. 2F , the remaining portion of the wafer base 116 may be packaged together with the device bodies 112 of the light emitting elements 110, exposing the device pins 114. Illustratively, the packaged light emitting elements 110 may be welded to a driving backplane 150.

[0105] In some other embodiments, the wafer base 116 is peeled off after cutting. After peeling off the wafer base 116, the light-emitting elements 110 are welded to the driving backplane 150. Illustratively, a mass transfer method may be used to weld the plurality of light-emitting elements 110 to the driving backplane 150. Then, a black adhesive film 111 (shown in FIG. 2B ) is used to cover the plurality of light-emitting elements 110, thereby achieving a package for the plurality of light-emitting elements 110.

[0106] The inventors of the present disclosure have discovered that the above implementation method has the following technical problems.

[0107] In the packaging-first-then-welding method, the light emitting devices 110 are individually packaged, resulting in poor height uniformity between the light emitting devices 110. Also, only a portion of the wafer base 116 is removed before packaging, and the remaining portion of the wafer base 116 is packaged together with the device body 112, resulting in a thicker packaged light emitting device 110. Exemplarily, the thickness of the packaged light emitting device 110 ranges from 60 μm to 120 μm, thereby increasing the thickness of the display panel 100.

[0108] In the welding-first-then-packaging method, as shown in Fig. 2B, the black adhesive film 111 is usually warped, so that the light emitted from the light emitting portion 1121 is irradiated onto the black adhesive film 111 and then irradiated onto another light emitting element 110 (shown as ray a in Fig. 2B) under the effect of reflection or refraction by the black adhesive film 111, thereby causing crosstalk between two adjacent light emitting elements 110.

[0109] For example, if some (two or more) of the light-emitting elements 110 are used to emit red light, other (two or more) of the light-emitting elements 110 are used to emit blue light, and still other (two or more) of the light-emitting elements 110 are used to emit green light, the wavelengths of the red light, blue light, and green light are different (the wavelength of red light is longer than the wavelength of green light, and the wavelength of green light is longer than the wavelength of blue light). Therefore, when light of one color is irradiated onto a light-emitting element 110 emitting light of another color, lateral excitation can occur between two adjacent light-emitting elements 110. For example, light with a shorter wavelength can excite light with a longer wavelength. That is, blue light can excite red light and green light, and green light can excite red light.

[0110] That is, when light of one color is irradiated onto a light-emitting element 110 that emits light of another color, crosstalk that occurs between two adjacent light-emitting elements 110 affects the light emission of the light-emitting elements 110 and reduces the display performance of the display panel 100.

[0111] In addition, the light transmittance of the black adhesive film 111 is relatively low. For example, because the black adhesive film 111 covers the light emitting element 110, approximately 30% of the light emitted from the light emitting portion 1121 is blocked by the black adhesive film 111 and cannot be emitted from the display panel 100. This reduces the utilization rate of the light, reduces the light output rate of the light emitting element 110, and increases the power consumption of the display panel 100.

[0112] 2B, it is usually necessary to provide flux 113 to improve the reliability of welding between the element pin 114 and the conductive pad 156. As a result, the light beam emitted from the light-emitting portion 1121 is irradiated onto the flux 113, and then irradiated onto another light-emitting element 110 (shown as light beam b in FIG. 2B) under the effect of reflection or refraction by the flux 113, thereby causing crosstalk between two adjacent light-emitting elements 110 and lateral excitation between the two adjacent light-emitting elements 110.

[0113] As can be seen from the above, a plurality of light emitting elements 110 are formed on one side of the wafer base 116, and the wafer base 116 needs to be laser cut to separate the plurality of light emitting elements 110 from one another.

[0114] Illustratively, the region between the cutting channel of the wafer base 116 and the light-emitting element 110 may be referred to as a dummy (virtual) region. It is understood that when cutting the wafer base 116 along the cutting channel, a film layer (e.g., an inorganic layer, etc.) located in the dummy region is adhered to the element body 112.

[0115] Fig. 2G is a structural diagram of an element body according to some embodiments, Fig. 2H is a structural diagram of an element body according to some other embodiments, Fig. 2I is a structural diagram of an element body according to still some other embodiments, and Fig. 2J is a structural diagram of an element body according to still some other embodiments.

[0116] 2G to 2J, the element body 112 includes a body structure 1122 and a bait 1123 (i.e., a film layer adhered to the body structure 1122 in the dummy region). The light-emitting portion 1121 is located in the body structure 1122, and the bait 1123 is connected to the body structure 1122.

[0117] It is understood that the bait 1123 is not removed before the light-emitting device 110 is packaged, so that the shape, position, size, etc. of the bait 1123 may all be different in different element bodies 112, as shown in Figures 2G to 2J.

[0118] In some examples, the volume of the bait 1123 may be greater than the volume of the body structure 1122. In some other examples, the volume of the bait 1123 may be less than the volume of the body structure 1122.

[0119] Because the bait 1123 is connected to the main body structure 1122, the light emitted from the light-emitting unit 1121 is irradiated onto the bait 1123 and can pass through the bait 1123 and exit to the outside, which causes side light leakage in the light-emitting element 110, causes the light-emitting element 110 to emit light at multiple angles, and the light-emitting areas between the multiple light-emitting elements 110 are different, which affects the display performance of the display panel 100.

[0120] Furthermore, under the reflection or refraction of the light ray 1123, the light ray is irradiated onto other light-emitting elements 110 (shown as light ray c in Figure 2B), resulting in crosstalk occurring between two adjacent light-emitting elements 110, i.e., lateral excitation occurring between two adjacent light-emitting elements 110, which affects the display performance of the display panel 100.

[0121] Furthermore, when using the black adhesive film 111 to package multiple light emitting devices 110, a certain amount of pressure must be applied to the black adhesive film 111 so that the black adhesive film 111 can be attached to the multiple light emitting devices 110. However, as shown in FIG. 2B , the bait 1123 is usually warped relative to the body structure 1122, which makes it easy for the bait 1123 to break and fall off when pressure is applied to the black adhesive film 111.

[0122] It is understood that if the bait 1123 breaks and falls off, there is an increased risk of damaging the black adhesive film 111, affecting the packaging of the light-emitting element 110, while the broken bait 1123 may also damage the driving backplane 150 and affect the reliability of the display panel 100.

[0123] Furthermore, the warping of the bait 1123 makes the element pins 114 more likely to fall off from the conductive pads 156 when subjected to pressure, affecting the reliability of the connection between the light emitting elements 110 and the driving backplane 150 .

[0124] Figure 3A is a structural diagram of a display panel according to some other embodiments, Figure 3B is a structural diagram of a driving backplane and a light-shielding pattern according to some embodiments, and Figure 3C is a structural diagram of a driving backplane, a light-emitting element, and a package part according to some embodiments.

[0125] 3A , in an embodiment provided by the present disclosure, the display panel 100 further includes a packaging structure 120. That is, the display panel 100 includes a driving backplane 150, a plurality of light-emitting elements 110, and the packaging structure 120.

[0126] The plurality of light emitting elements 110 are located on a first side of the driving backplane 150, and are spaced apart from one another. Each light emitting element 110 includes a light emitting body 112 and a light emitting pin 114. The light emitting body 112 includes a light emitting portion 1121, and the light emitting pin 114 is electrically connected to the driving backplane 150.

[0127] It is understood that the above embodiments of the present disclosure have already been described with examples for the light emitting element 110 and the driving backplane 150, and will not be repeated here. In the following, the package structure 120 will be described with examples.

[0128] 3A, the packaging structure 120 is located on a first side of the driving backplane 150. That is, the packaging structure 120 and the plurality of light-emitting elements 110 are located on the same side of the driving backplane 150.

[0129] As shown in FIG. 3A, the package structure 120 includes a light-shielding pattern 130 and a plurality of package parts 140. As shown in FIG.

[0130] The light-shielding pattern (full English name: Black Matrix, English abbreviation: BM) 130 is used to block light rays. In some examples, the material of the light-shielding pattern 130 may be a black organic material, thereby fulfilling the role of light blocking. For example, the black organic material may be formed by adding toner, graphite, or the like to a transparent organic material. In some examples, the light-shielding pattern 130 is a black photoresist.

[0131] As shown in FIGS. 3A and 3B, the light-shielding pattern 130 has a plurality of receiving areas Q, and each receiving area Q exposes at least one light-emitting element 110.

[0132] It is understood that the receiving area Q is a receiving hole that penetrates the light-shielding pattern 130 along the thickness direction of the driving backplane 150. The shapes of the multiple receiving areas Q may be the same or different.

[0133] In some examples, one receiving area Q exposes one light-emitting element 110. In some other examples, one receiving area Q exposes two, three, or more light-emitting elements 110. In some examples, the light-shielding pattern 130 having the receiving area Q may be formed by applying black photoresist and then performing a patterning process on the black photoresist.

[0134] 3B, the receiving area Q has a top opening P1 through which light emitted from the light-emitting element 110 can exit. Illustratively, the top openings P1 of the receiving areas Q are the same or substantially the same in shape and area.

[0135] As shown in FIG. 3A, at least a portion of the packaging portion 140 is located within the receiving region Q and covers the light emitting element 110.

[0136] It is understood that the packaging part 140 can play a protective role for the light-emitting element 110. Exemplarily, as shown in FIG. 3A, the packaging part 140 can cover not only the body structure 1122 but also the bait 1123.

[0137] In some examples, as shown in FIG. 3A, a portion of the outer surface of the package portion 140 is bonded to the inner wall of the receiving area Q.

[0138] It is understood that the packaging part 140 being made of a transparent material reduces the blocking of light emitted from the light emitting part 1121 by the packaging part 140, improves the light utilization rate, and improves the light output rate of the light emitting element 110.

[0139] In some examples, the material of the packaging unit 140 includes a photoresist, such as an OC adhesive, a PI (Polyimide) adhesive, or a Bank (also called Step) adhesive. In some other examples, the packaging unit 140 may be made of other materials with excellent light transparency.

[0140] As shown in FIG. 3A, the light emitting portion 1121 of at least one light emitting element 110 is located within the accommodation region Q.

[0141] In some examples, the entirety of at least one light emitting element 110 is located within the receiving region Q.

[0142] As can be seen from the above, the light-shielding pattern 130 is used to block light. In this manner, by arranging the light-emitting portion 1121 of at least one light-emitting element 110 so as to be positioned within the accommodation region Q, the light-shielding pattern 130 can play a role in blocking light emitted from the side surface of the light-emitting element 110.

[0143] It is understood that the light rays emitted from the side of the light-emitting element 110 may be light rays that are emitted after passing through the bait 1123, or light rays that are emitted through the side of the light-emitting element 110 under the reflection or refraction action of the bait 1123, or light rays that are emitted from the side due to other structures in the display panel 100 (e.g., flux 113, not shown in Figure 3A).

[0144] That is, by installing the shading pattern 130 and positioning at least one light-emitting portion 1121 within the accommodation area Q of the shading pattern 130, the side light leakage phenomenon of the light-emitting element 110 can be improved, the uniformity of the light-emitting area among the plurality of light-emitting elements 110 can be improved, and the intensity of the light irradiating other light-emitting elements 110 can be reduced, thereby suppressing the lateral excitation occurring between two adjacent light-emitting elements 110, reducing the crosstalk occurring between two adjacent light-emitting elements 110, and improving the display performance of the display panel 100.

[0145] In addition, since the light-shielding pattern 130 is located on the first side of the driving backplane 150, the light-shielding pattern 130 acts as a shield against light rays reflected from the driving backplane 150, thereby reducing the intensity of the reflected light rays irradiating the outside of the display panel 100 and improving the display effect of the display panel 100.

[0146] In some examples, as shown in FIG. 3A, one accommodating region Q exposes one light-emitting element 110, and the light-shielding pattern 130 can be positioned between any two adjacent light-emitting elements 110, thereby reducing crosstalk occurring between any two adjacent light-emitting elements 110, suppressing lateral excitation between any two adjacent light-emitting elements 110, and improving the display performance of the display panel 100.

[0147] As shown in FIG. 3A, there is no need to package the light emitting element 110 using a black adhesive film 111, and instead the light emitting element 110 is packaged using a method of covering the light emitting element 110 with a packaging part 140, thereby improving the light utilization efficiency, improving the light output efficiency of the light emitting element 110, and reducing the power consumption of the display panel 100.

[0148] Meanwhile, the packaging unit 140 can protect the pellet 1123, thereby reducing the risk of the pellet 1123 being damaged by force, thereby reducing the risk of the pellet 1123 being damaged and falling off, damaging the driving backplane 150 or other structures of the display panel 100, and improving the reliability of the display panel 100. In addition, protecting the pellet 1123 with the packaging unit 140 also reduces the risk of the element pins 114 falling off the conductive pads 156 due to force being applied to the pellet 1123, thereby improving the reliability of the display panel 100.

[0149] In some examples, after the wafer base 116 is cut, the wafer base 116 may be peeled off from the light-emitting element 110, and the peeled light-emitting element 110 may be welded to the driving backplane 150, and then a package structure 120 (including a light-shielding pattern 130 and a package portion 140) may be formed to package the light-emitting element 110, which can improve the height consistency between multiple light-emitting elements 110 and reduce the thickness of the light-emitting element 110 after packaging, thereby reducing the thickness of the display panel 100.

[0150] In some examples, after the wafer base 116 is peeled off, the height of the light emitting device 110 is about 5 μm.

[0151] 3B, the receiving area Q has a top opening P1 and a bottom opening P2, and the top opening P1 is farther away from the driving backplane 150 than the bottom opening P2. The area of the top opening P1 is greater than the area of the bottom opening P2.

[0152] Illustratively, as shown in FIGS. 3A and 3B, the conductive pads 156 can pass through the bottom openings P2 so that the element pins 114 can be welded to the conductive pads 156. As shown in FIG.

[0153] It is understood that light emitted from light-emitting unit 1121 can pass through top opening P1 and be irradiated to the outside of display panel 100. Therefore, setting top opening P1 so that its area is larger than that of bottom opening P2 reduces the blocking by light-shielding pattern 130 of light emitted from the front of light-emitting unit 1121 (i.e., the side of light-emitting unit 1121 away from element pins 114), increases the light emission angle of light-emitting element 110 (i.e., the included angle between the two edgemost light rays among the light rays emitted through top opening P1), increases the intensity of the light rays emitted through top opening P1, and increases the light output efficiency of light-emitting element 110, thereby improving light utilization efficiency and reducing power consumption of display panel 100.

[0154] In some examples, by setting the area of the top opening P1 to be larger than the area of the bottom opening P2, the shading pattern 130 reduces the blocking of light rays emitted from the front of the light-emitting section 1121 (i.e., the side of the light-emitting section 1121 away from the element pin 114), and the light emission radiation angle of the light-emitting element 110 located within the storage area Q can reach 115°.

[0155] In some examples, the shapes and areas of the top openings P1 of the multiple storage areas Q are the same or substantially the same, and the shapes and areas of the bottom openings P2 of the multiple storage areas Q are the same or substantially the same.

[0156] In some examples, the receiving area Q may be in the shape of an inverted truncated cone or a shape that is approximately inverted truncated cone, with the area enclosed by the top opening P1 being the lower base of the truncated cone and the area enclosed by the bottom opening P2 being the upper base of the truncated cone. In some other examples, the receiving area Q may have other shapes.

[0157] 3B, the receiving area Q has a sidewall L. The sidewall L and the surface of the light-shielding pattern 130 that is closer to the driving backplane 150 form a first included angle θ, and the first included angle θ is an acute angle.

[0158] It will be understood that in some examples, at least a portion of the package portion 140 is located within the receiving area Q, and an outer surface of a portion of the package portion 140 is bonded to an inner wall of the receiving area Q. Thus, as shown in FIG. 3C , there is also a first included angle θ between the side wall surface of the package portion 140 and the driving backplane 150.

[0159] By making the first included angle θ an acute angle, the area of the top opening P1 of the accommodating region Q can be made larger than the area of the bottom opening P2 of the accommodating region Q, thereby reducing the shading of light rays emitted from the front of the light-emitting section 1121 (i.e., the side of the light-emitting section 1121 away from the element pin 114) by the shading pattern 130, increasing the light emission radiation angle of the light-emitting element 110, increasing the intensity of the light rays emitted through the top opening P1, and increasing the light output rate of the light-emitting element 110, thereby improving the light utilization rate and reducing the power consumption of the display panel 100.

[0160] It is understood that the first included angle θ is greater than 0° and less than 90°, and illustratively the first included angle θ may be 88°, 85°, 82°, 80°, or 75°.

[0161] Figure 4A is a structural diagram of a negative OC adhesive according to some embodiments. Figure 4B is a structural diagram of a negative OC adhesive according to some other embodiments. Figure 4C is a structural diagram of a negative OC adhesive according to still some other embodiments. Figure 4D is a structural diagram of a positive OC adhesive according to some embodiments. Figure 4E is a structural diagram of a positive OC adhesive according to some other embodiments.

[0162] Hereinafter, a method for manufacturing the package unit 140 and the light-blocking pattern 130 will be described with reference to FIGS. 4A to 4E.

[0163] In some examples, the negative photoresist may be subjected to processes such as exposing, developing, and washing, thereby patterning the negative photoresist to form the package portion 140, and the sidewall surface of the package portion 140 may have a first angle θ between the driving backplane 150. Exemplarily, the negative photoresist may be a negative OC adhesive 115.

[0164] In some examples, as shown in Figures 4A and 4B, a negative OC adhesive 115 is applied to a base 118, shielded by a mask plate 119, and the negative OC adhesive 115 is irradiated with light, followed by processes such as development and cleaning, whereby the negative OC adhesive 115 is patterned to form an inverted truncated cone-shaped or approximately inverted truncated cone-shaped structure.

[0165] It is understood that a truncated cone has an upper surface and a lower surface, the upper surface being parallel to the lower surface and the area of the upper surface being smaller than the area of the lower surface. An inverted truncated cone is one in which the upper surface is closer to the base 118 than the lower surface.

[0166] 4C , after the patterning process is performed on the negative OC adhesive 115, the negative OC adhesive 115 may be baked and heated. By controlling the heating time, heating temperature, and temperature change curve over time, the negative OC adhesive 115 can form a variety of different shapes to meet different usage needs.

[0167] For example, after forming the plurality of package parts 140, the light-shielding pattern 130 may be formed by filling black photoresist between the plurality of package parts 140.

[0168] In some examples, the positive photoresist may be exposed, developed, washed, and so on, so as to pattern the positive photoresist to form the light-shielding pattern 130 having the receiving area Q, and the sidewall L of the light-shielding pattern 130 and the surface of the light-shielding pattern 130 close to the driving backplane 150 may have a first angle θ between them. Exemplarily, the positive photoresist may be a positive OC adhesive 117.

[0169] In some examples, as shown in Figures 4D and 4E, a positive OC adhesive 117 is applied to a base 118, shielded by a mask plate 119, and the positive OC adhesive 117 is irradiated with light, followed by processes such as development and cleaning, whereby the positive OC adhesive 117 is patterned to form a regular truncated cone-shaped or approximately regular truncated cone-shaped structure.

[0170] It is understood that a truncated cone has an upper surface and a lower surface, the upper surface being parallel to the lower surface and the area of the upper surface being smaller than the area of the lower surface. A regular truncated cone is one in which the upper surface is farther from the base 118 than the lower surface.

[0171] In some embodiments, the first included angle θ is less than or equal to 75°.

[0172] By installing it in this manner, the area of the top opening P1 can be increased, the shading of the light rays emitted from the front of the light-emitting section 1121 by the shading pattern 130 can be reduced, the light emission radiation angle of the light-emitting element 110 can be increased, the intensity of the light rays emitted through the top opening P1 can be increased, and the light output rate of the light-emitting element 110 can be increased, thereby improving the light utilization rate and reducing the power consumption of the display panel 100.

[0173] In some examples, the first included angle θ may be 70°, 65°, 60°, or 55°, etc.

[0174] 3A , along the thickness direction of the driving backplane 150 (shown in the direction of arrow g in FIG. 3A ), the end face of the package unit 140 away from the driving backplane 150 is higher than the end face of the light-blocking pattern 130 away from the driving backplane 150. In addition, the end face of the package unit 140 away from the driving backplane 150 is defined as a first curved surface M1, and the first curved surface M1 is curved in the direction away from the driving backplane 150.

[0175] By arranging the end face of the packaging unit 140 away from the driving backplane 150 higher than the end face of the light-shielding pattern 130 away from the driving backplane 150 along the thickness direction of the driving backplane 150, it is possible to prevent the light-shielding pattern 130 from covering the side of the packaging unit 140 away from the driving backplane 150, thereby improving the light output efficiency of the light-emitting elements 110, improving light utilization efficiency, and reducing power consumption of the display panel 100. In addition, preventing the light-shielding pattern 130 from covering the side of the packaging unit 140 away from the driving backplane 150 further improves the consistency of the light output efficiency of the plurality of light-emitting elements 110, thereby improving the consistency of the luminance of the plurality of sub-pixels 101.

[0176] In addition, by installing the end face of the package part 140 facing away from the driving backplane 150 higher than the end face of the shading pattern 130 facing away from the driving backplane 150 along the thickness direction of the driving backplane 150, the package part 140 can play a supporting role when external force is applied to the display panel 100, thereby playing a protective role for the light-emitting element 110 and the shading pattern 130 and reducing the risk of damage to the light-emitting element 110 and the shading pattern 130.

[0177] As shown in Figure 3A, the end surface of the package part 140 away from the driving backplane 150 is made into a first curved surface M1, and the first curved surface M1 is arranged so as to curve in the direction away from the driving backplane 150, so that the first curved surface M1 plays a role of collecting light rays and can reduce the intensity of light rays irradiated to other light-emitting elements 110, thereby reducing the crosstalk occurring between two adjacent light-emitting elements 110, suppressing lateral excitation between two adjacent light-emitting elements 110, and improving the display performance of the display panel 100.

[0178] In some examples, the package portion 140 may be generally mushroom-shaped.

[0179] In some other examples, the end surface of the packaging unit 140 away from the driving backplane 150 may be flat or substantially flat. By arranging it in this manner, the influence of the packaging unit 140 on the light emitted from the light-emitting unit 1121 can be reduced, and the display performance of the display panel 100 can be improved.

[0180] 3A , the package portion 140 includes a first partial package portion 142 and a second partial package portion 144, and the first partial package portion 142 is closer to the driving backplane 150 than the second partial package portion 144. The first partial package portion 142 surrounds the light-emitting element 110, and an end face of the first partial package portion 142 facing away from the driving backplane 150 is flush with an end face of the light-emitting element 110 facing away from the driving backplane 150. The second partial package portion 144 is located on the side of the first partial package portion 142 facing away from the driving backplane 150, and covers the first partial package portion 142 and the light-emitting element 110.

[0181] A third distance h3 exists between the end face of the first partial package part 142 facing away from the driving backplane 150 and the driving backplane 150. A fourth distance h4 exists between the end face of the second partial package part 144 facing closer to the first partial package part 142 and the end face of the second partial package part 144 facing away from the first partial package part 142. A fifth distance h5 exists between the end face of the light-shielding pattern 130 facing away from the driving backplane 150 and the driving backplane 150.

[0182] The fifth distance h5 is equal to or greater than the third distance h3 and is equal to or less than the sum of 50% of the fourth distance h4 and the third distance h3.

[0183] It is understood that, as shown in FIG. 3A, the end face of the first partial package portion 142 facing away from the driving backplane 150 may be approximately flush or completely flush with the end face of the light-emitting element 110 facing away from the driving backplane 150.

[0184] In some examples, the wafer base 116 is a patterned sapphire substrate (PSS), that is, the surface of the sapphire base closer to the N-type doped semiconductor 1125 has a pattern, making the surface closer to the N-type doped semiconductor 1125 uneven, thereby reducing the defect density of the sapphire base and increasing the mass of the sapphire base, thereby improving the light output efficiency of the light-emitting element 110.

[0185] It is understood that the wafer base 116 needs to be peeled off before packaging the light emitting device 110. In this way, as shown in Figures 2G to 2J, for example, a honeycomb structure 1126 is formed on the surface of the element body 112 away from the element pins 114 (the surface of the N-type doped semiconductor 1125 away from the element pins 114). As a result, as shown in Figure 3A, the surface of the element body 112 away from the element pins 114 is not flat.

[0186] Therefore, by positioning the second partial package part 144 on the side of the first partial package part 142 away from the driving backplane 150 and by installing the second partial package part 144 so as to cover the first partial package part 142 and the light-emitting element 110, the package part 140 (including the first partial package part 142 and the second partial package part 144) can cover the honeycomb structure 1126 and improve the packaging protection effect of the package part 140 on the light-emitting element 110.

[0187] In some examples, the first partial package part 142 and the second partial package part 144 are a single-piece molded structure. In some other examples, the first partial package part 142 may be formed first, and then the second partial package part 144 may be formed on the side of the first partial package part 142 that is away from the drive backplane 150. In this case, a certain included angle may be formed between the side wall surface of the first partial package part 142 and the side wall surface of the second partial package part 144.

[0188] 3A, there is a third distance h3 between the end face of the first partial package part 142 facing away from the drive backplane 150 and the drive backplane 150. There is a fourth distance h4 between the end face of the second partial package part 144 facing closer to the first partial package part 142 and the end face of the second partial package part 144 facing away from the first partial package part 142.

[0189] When the end face of the package part 140 facing away from the drive backplane 150 is a curved surface that is not flat (e.g., a first curved surface M1), there are multiple distances between the end face of the second partial package part 144 facing closer to the first partial package part 142 and the end face of the second partial package part 144 facing away from the first partial package part 142.

[0190] In this case, in some examples, the fourth distance h4 is the average value of the maximum distance and the minimum distance between the end face of the second partial package portion 144 closer to the first partial package portion 142 and the end face of the second partial package portion 144 away from the first partial package portion 142.

[0191] In some other examples, the fourth distance h4 is the maximum distance between the end face of the second partial package portion 144 closest to the first partial package portion 142 and the end face of the second partial package portion 144 away from the first partial package portion 142 (shown in FIG. 3A).

[0192] There is a fifth distance h5 between the end face of the light-shielding pattern 130 away from the driving backplane 150 and the driving backplane 150. The fifth distance h5 is equal to or greater than the third distance h3 and is equal to or less than the sum of 50% of the fourth distance h4 and the third distance h3. That is, as shown in FIG. 3A , the end face of the light-shielding pattern 130 away from the driving backplane 150 may be located on the peripheral edge side of the second partial package portion 144.

[0193] 3A, the end surface of the light-shielding pattern 130 away from the driving backplane 150 has a curved structure, that is, there are multiple distances between the end surface of the light-shielding pattern 130 away from the driving backplane 150 and the driving backplane 150.

[0194] In this case, in some examples, the fifth distance h5 is the average value of the maximum distance and the minimum distance between the drive backplane 150 and the end face of the light-shielding pattern 130 that faces away from the drive backplane 150.

[0195] In some other examples, the fifth distance h5 is the maximum distance between the end face of the light-shielding pattern 130 away from the driving backplane 150 and the driving backplane 150 (shown in FIG. 3A).

[0196] As can be seen from the above, the driving backplane 150 includes a substrate 1524, a first insulating layer 1521, a second insulating layer 1522, a third insulating layer 1523, circuit wiring 1525, a conductive layer 1526, and the like.

[0197] In an embodiment of the present disclosure, taking the first partial package part 144 as an example, the distance between the end face of the first partial package part 142 facing away from the driving backplane 150 and the driving backplane 150 is the distance between the end face of the first partial package part 142 facing away from the driving backplane 150 and the portion of the film layer closest to the driving backplane 150 and furthest from the substrate 1524 (e.g., the third insulating layer 1526 in Figure 2E) that does not cover the protrusion 1527.

[0198] It is understood that the first partial packaging part 142 can surround the light emitting element 110, that is, the first partial packaging part 142 can surround the light emitting part 1121 of the light emitting element 110. Therefore, by setting the fifth distance h5 to be equal to or greater than the third distance h3, the light emitting part 1121 can be positioned within the receiving area Q formed by the light blocking pattern 130, so that the light blocking pattern 130 can block light leakage from the side of the light emitting element 110, reduce crosstalk occurring between two adjacent light emitting elements 110, and suppress lateral excitation between two adjacent light emitting elements 110.

[0199] Furthermore, by setting the fifth distance h5 to be equal to or less than the sum of 50% of the fourth distance h4 and the third distance h3, lateral excitation between two adjacent light-emitting elements 110 can be suppressed, while reducing the blocking of light rays emitted from the front of the light-emitting section 1121 by the shading pattern 130, improving the light output rate of the light-emitting element 110, improving the light utilization rate, and reducing the power consumption of the display panel 100.

[0200] In some examples, the fifth distance h5 is equal to 50% of the fourth distance h4 plus the third distance h3.

[0201] In some embodiments, as shown in FIG. 3C, the fourth distance h4 is greater than or equal to 30% of the third distance h3 and less than or equal to twice the third distance h3.

[0202] As can be seen from the above, there is a third distance h3 between the end face of the first partial package part 142 facing away from the driving backplane 150 and the driving backplane 150. There is a fourth distance h4 between the end face of the second partial package part 144 facing closer to the first partial package part 142 and the end face of the second partial package part 144 facing away from the first partial package part 142. The first partial package part 142 surrounds the light-emitting element 110, and the end face of the first partial package part 142 facing away from the driving backplane 150 is flush with the end face of the light-emitting element 110 facing away from the driving backplane 150. The second partial package part 144 is located on the side of the first partial package part 142 facing away from the driving backplane 150 and covers the first partial package part 142 and the light-emitting element 110.

[0203] In this way, by setting the fourth distance h4 to be 30% or more of the third distance h3, the second partial packaging part 144 can completely cover the honeycomb structure 1126 and the base 1123 of the light-emitting element 110, thereby improving the packaging protection effect of the packaging part 140 (including the first partial packaging part 142 and the second partial packaging part 144) on the light-emitting element 110.

[0204] Furthermore, by setting the fourth distance h4 to be no more than twice the third distance h3, it is possible to avoid a situation in which the thickness of the fourth distance h4 becomes too large, increasing the height of the package unit 140 and thereby increasing the thickness of the display panel 100. In other words, setting the fourth distance h4 to be no more than twice the third distance h3 is advantageous for achieving a thinner display panel 100.

[0205] In some examples, the fourth distance h4 is equal to 30%, 40%, 50%, or 60% of the third distance h3, etc.

[0206] In some examples, the fourth distance h4 is equal to 30% of the third distance h3, and the fifth distance h5 is equal to 50% of the fourth distance h4 plus the third distance h3, i.e., the fifth distance h5 is equal to 1.15 times h3.

[0207] 5A is a structural diagram of a driving backplane, a light emitting element, and a light blocking pattern according to some embodiments, and FIG. 5B is a structural diagram of a display panel according to some other embodiments.

[0208] 5A and 5B, the light-shielding pattern 130 has a semi-elliptical shape 121 in a longitudinal cross section, which is parallel to the thickness direction of the driving backplane 150. The semi-elliptical shape 121 has a first side a1 and a second side a2, and both ends of the first side a1 are connected to both ends of the second side a2, respectively. The first side a1 is close to the driving backplane 150, and the second side a2 is curved in a direction away from the driving backplane 150.

[0209] 5A and 5B, it is understood that the shape of the light-shielding pattern 130 in a longitudinal cross section may include a semi-ellipse 121 or an approximately semi-ellipse 121. For example, when one accommodation region Q exposes one light-emitting element 110, one semi-ellipse 121 is located between two adjacent light-emitting elements 110.

[0210] By positioning the first side a1 of the semi-ellipse 121 close to the driving backplane 150 and the second side a2 curved away from the driving backplane 150, the area of the top opening P1 of the accommodating area Q can be made larger than the area of the bottom opening P2 of the accommodating area Q, thereby reducing the shading of the light rays emitted from the light-emitting section 1121 by the shading pattern 130, increasing the light emission radiation angle of the light-emitting element 110, increasing the intensity of the light rays emitted through the top opening P1, and increasing the light output rate of the light-emitting element 110, thereby improving the light utilization rate and reducing the power consumption of the display panel 100.

[0211] When the shape of the light-shielding pattern 130 in the longitudinal cross section includes a plurality of semi-ellipses 121, it is understood that the shapes of the plurality of semi-ellipses 121 may be the same or different.

[0212] 5A and 5B, an inkjet printing process (IJP) may be used to form the package portion 140 in the receiving area Q1. Illustratively, the package portion 140 formed by the inkjet printing process may act as an atomizer for the light emitted from the light-emitting portion 1121, thereby improving the brightness uniformity of the sub-pixels 101.

[0213] By configuring the cross-sectional shape of the light-shielding pattern 130 to include a semi-ellipse 121, the light output efficiency of the light-emitting element 110 can be improved, and the flexibility of the light-shielding pattern 130 can be improved to meet different usage needs.

[0214] FIG. 5C is a structural diagram of a display panel according to some other embodiments.

[0215] 5C , the cross-sectional shape of the light-shielding pattern 130 may include a semi-ellipse 121 and a third trapezoid D3. The semi-ellipse 121 is located on the side of the third trapezoid D3 that is away from the driving backplane 150. Illustratively, the upper base of the third trapezoid D3 is farther from the driving backplane 150 than the lower base. In some examples, the included angle between the lower base and the hypotenuse of the third trapezoid D3 is 75° or less.

[0216] By installing it in this manner, the shading pattern 130 reduces the blocking of light rays emitted from the front of the light-emitting section 1121, improves the intensity of the light rays emitted through the top opening P1, reduces the effect of the shading pattern 130 on the light radiation angle of the light-emitting element 110, improves the light utilization rate, improves the light output rate of the light-emitting element 110, and reduces the power consumption of the display panel 100.

[0217] In some examples, the included angle between the lower base and the hypotenuse of the third trapezoid D3 may be 70°, 65°, 60°, or 55°, etc.

[0218] 3A , in some embodiments, along the thickness direction of the driving backplane 150 (indicated by the direction of arrow g in FIG. 3A ), the end face of the package unit 140 away from the driving backplane 150 is higher than the end face of the light-blocking pattern 130 away from the driving backplane 150. In addition, the end face of the package unit 140 away from the driving backplane 150 is defined as a first curved surface M1, and the first curved surface M1 curves in the direction away from the driving backplane 150.

[0219] 5B and 5C, along the thickness direction of the driving backplane 150 (shown in the direction of arrow g in FIGS. 5B and 5C), the end face of the package unit 140 away from the driving backplane 150 is lower than the end face of the light-shielding pattern 130 away from the driving backplane 150. In addition, at least a middle region of the end face of the package unit 140 away from the driving backplane 150 is flat.

[0220] As shown in Figures 5B and 5C, along the thickness direction of the driving backplane 150 (shown in the direction of arrow g in Figures 5B and 5C), the end face of the package part 140 facing away from the driving backplane 150 is lower than the end face of the light-shielding pattern 130 facing away from the driving backplane 150, so that the light-emitting element 110 and the package part 140 are both located within the accommodating area Q, which can improve the effect of the light-shielding pattern 130 in improving the side light leakage of the light-emitting element 110, reduce crosstalk occurring between two adjacent light-emitting elements 110, suppress lateral excitation between two adjacent light-emitting elements 110, and improve the display performance of the display panel 100.

[0221] In addition, by installing the end face of the package part 140 away from the driving backplane 150 along the thickness direction of the driving backplane 150 (shown in the direction of arrow g in Figures 5B and 5C) so that it is lower than the end face of the light-shielding pattern 130 away from the driving backplane 150, the light-shielding pattern 130 can play a supporting role when external force is applied to the display panel 100, thereby playing a protective role for the light-emitting element 110 and the package part 140 and reducing the risk of damage to the light-emitting element 110 and the package part 140.

[0222] It is understood that by configuring at least the middle region of the end face of the package unit 140 facing away from the driving backplane 150 to be flat or approximately flat, the refraction of the light beam emitted from the light-emitting unit 1121 by the package unit 140 is reduced, i.e., the effect of the package unit 140 on the light beam emitted from the light-emitting unit 1121 is reduced, thereby improving the display performance of the display panel 100.

[0223] 5A and 5B , the light-shielding pattern 130 includes a first partial light-shielding pattern 132 and a second partial light-shielding pattern 134. The first partial light-shielding pattern 132 is closer to the driving backplane 150 than the second partial light-shielding pattern 134. The end surface of the first partial light-shielding pattern 132 away from the driving backplane 150 is flush with the end surface of the light-emitting element 110 away from the driving backplane 150. The second partial light-shielding pattern 134 is located on the side of the first partial light-shielding pattern 132 away from the driving backplane 150.

[0224] There is a first distance h1 between the end face of the first partial light-shielding pattern 132 facing away from the driving backplane 150 and the driving backplane 150. There is a second distance h2 between the end face of the second partial light-shielding pattern 134 facing closer to the first partial light-shielding pattern 132 and the end face of the second partial light-shielding pattern 134 facing away from the first partial light-shielding pattern 132.

[0225] The second distance h2 is equal to or greater than 30% of the first distance h3 and equal to or less than twice the first distance h2.

[0226] It is understood that the end surface of the first partial shading pattern 132 facing away from the driving backplane 150 may be approximately flush or completely flush with the end surface of the light-emitting element 110 facing away from the driving backplane 150.

[0227] It is understood that since the end face of the first partial shading pattern 132 facing away from the driving backplane 150 is flush with the end face of the light-emitting element 110 facing away from the driving backplane 150, the first partial shading pattern 132 can act as a shield against side light leakage from the light-emitting element 110, suppress lateral excitation between two adjacent light-emitting elements 110, and reduce crosstalk occurring between two adjacent light-emitting elements 110.

[0228] By setting the second distance h2 to be 30% or more of the first distance h3, the effect of the light-shielding pattern 130 in blocking side light leakage from the light-emitting element 110 can be improved.

[0229] By setting the second distance h2 to be no more than twice the first distance h2, it is possible to prevent the height of the second distance h2 from being too high, and to prevent the height of the light-shielding pattern 130 from being too high, which increases the thickness of the display panel 100. In other words, setting the second distance h2 to be no more than twice the first distance h2 is advantageous for making the display panel 100 thinner.

[0230] In some examples, the second distance h2 may be 30%, 40%, 50%, or 60% of the first distance h1, etc.

[0231] In some examples, when the shape of the light-shielding pattern 130 in a vertical cross section includes a semi-ellipse 121, there are multiple distances between an end face of the second partial light-shielding pattern 134 that is closer to the first partial light-shielding pattern 132 and an end face of the second partial light-shielding pattern 134 that is farther from the first partial light-shielding pattern 132. In this case, the second distance h2 is the distance between the end face of the second partial light-shielding pattern 134 that is closer to the first partial light-shielding pattern 132 and the highest point of the second partial light-shielding pattern 134 along the thickness direction of the driving backplane 150. In other words, the second distance h2 is the maximum distance between the end face of the second partial light-shielding pattern 134 that is closer to the first partial light-shielding pattern 132 and an end face of the second partial light-shielding pattern 134 that is farther from the first partial light-shielding pattern 132.

[0232] In some examples, the first partial light-shielding pattern 132 and the second partial light-shielding pattern 134 may be integrally molded. In some other examples, the first partial light-shielding pattern 132 may be formed first, and then the second partial light-shielding pattern 134 may be formed on the side of the first partial light-shielding pattern 132 that is away from the driving backplane 150.

[0233] FIG. 6A is a structural diagram of a light-shielding pattern and a driving backplane according to some embodiments. FIG. 6B is a structural diagram of a light-shielding pattern and a driving backplane according to some other embodiments. FIG. 6C is a structural diagram of a first sub-light-shielding pattern and a driving backplane according to some embodiments. FIG. 6D is a structural diagram of a driving backplane, a first sub-light-shielding pattern, a light-emitting element, and a packaging unit according to some embodiments. FIG. 6E is a structural diagram of a display panel according to some other embodiments. FIG. 6F is a structural diagram of a display panel according to some other embodiments.

[0234] 6A and 6B, the light-shielding pattern 130 includes a first light-shielding sub-pattern 136 and a second light-shielding sub-pattern 138 that are stacked one on top of the other. The first light-shielding sub-pattern 136 is closer to the driving backplane 150 than the second light-shielding sub-pattern 138.

[0235] It is understood that the materials and shapes of the first and second light-shielding sub-patterns 136 and 138 may be the same or different.

[0236] In some examples, the first and second light-shielding sub-patterns 136 and 138 may be an integrally molded structure.

[0237] In the embodiments of the present disclosure, a single-piece molded structure refers to a structure that is formed in one process or one manufacturing run. It is understood that a single process may include multiple manufacturing steps. That is, a single-piece molded structure may be produced through multiple manufacturing steps.

[0238] In some other examples, as shown in Figures 6C and 6D, a first sub-light-shielding pattern 136 may be formed first on one side of the driving backplane 150, and then the light-emitting element 110 may be electrically connected to the driving backplane 150 to form a package portion 140 covering the light-emitting element 110, and then a second sub-light-shielding pattern 138 may be formed on the side of the first sub-light-shielding pattern 136 away from the driving backplane 150, as shown in Figures 6E and 6F.

[0239] In some other examples, after forming the first sub-light-shielding pattern 136, the second sub-light-shielding pattern 138 may be formed on the side of the first sub-light-shielding pattern 136 away from the driving backplane 150, and then the light-emitting element 110 may be electrically connected to the driving backplane 150 before forming the package portion 140 covering the light-emitting element 110.

[0240] 6E and 6F , the accommodating region Q includes a first sub-accommodating region Q1 and a second sub-accommodating region Q2. The first sub-accommodating region Q1 and the second sub-accommodating region Q2 are in communication with each other. The orthogonal projection of the edge of the opening of the first sub-accommodating region Q1 on the driving backplane 150 is located within an area formed by the orthogonal projection of the edge of the opening of the second sub-accommodating region Q2 on the driving backplane 150. The first sub-light-shielding pattern 136 includes the first sub-accommodating region Q1, and the second sub-light-shielding pattern 138 includes the second sub-accommodating region Q2.

[0241] It will be understood that the first sub-accommodating area Q1 includes two openings, one of which is closer to the driving backplane 150 than the other opening. The second sub-accommodating area Q2 similarly includes two openings, one of which is closer to the driving backplane 150 than the other opening. The orthogonal projection of the edge of any one opening of the first sub-accommodating area Q1 onto the driving backplane 150 is located within the area formed by the orthogonal projection of the edge of any one opening of the second sub-accommodating area Q2 onto the driving backplane 150. With the above arrangement, the accommodation space of the first sub-accommodating area Q1 can be larger than the accommodation space of the second sub-accommodating area Q2.

[0242] It is understood that by positioning the orthogonal projection of the edge of the opening of the first sub-accommodating area Q1 on the driving backplane 150 within the area formed by the orthogonal projection of the edge of the opening of the second sub-accommodating area Q2 on the driving backplane 150, the shielding effect of the first sub-shading pattern 136 against reflected light from the driving backplane 150 can be improved, the intensity of the reflected light irradiating outside the display panel 100 can be reduced, and the display performance of the display panel 100 can be improved.

[0243] As can be seen from the above, the driving backplane 150 includes a backplane body 152 and a plurality of pad assemblies 154 , which are electrically connected to the backplane body 152 .

[0244] 6E and 6F, the pad assembly 154 passes through the first sub-container region Q1 and is welded to the at least one light-emitting element 110. The light-emitting portion 1121 of the at least one light-emitting element 110 is located in the second sub-container region Q2.

[0245] As shown in Figures 6A and 6B, it is understood that the pad assembly 154 includes a conductive pad 156, and the extending surface 1561 of the conductive pad 156 may extend in a direction away from the substrate 1524, so that the pad assembly 154 passes through the first sub-accommodating region Q1 and can be partially located within the second sub-accommodating region Q2, thereby allowing at least one light-emitting element 110 located within the second accommodating region Q2 to be welded to the conductive pad 156.

[0246] In some examples, as shown in Figures 6A and 6B, multiple conductive pads 156 in the pad assembly 154 pass through the same first sub-accommodation area Q1. In some other examples, as shown in Figure 6C, one conductive pad 156 passes through one first sub-accommodation area Q1.

[0247] In some examples, as shown in FIG. 6C, the first light-shielding sub-pattern 136 may be a planarization layer.

[0248] In some examples, after forming the first sub-shading pattern 136, a second sub-shading pattern 138 having a semi-elliptical, trapezoidal, or other irregular shape may be formed on the side of the first sub-shading 136 facing away from the driving backplane 150.

[0249] In some examples, as shown in Figures 6E and 6F, when the light-emitting portion 1121 of at least one light-emitting element 110 is located within the second sub-accommodating region Q2, the second sub-shading pattern 138 can act as a shield against side light leakage of the light-emitting element 110, reducing crosstalk occurring between two adjacent light-emitting elements 110, and thereby reducing lateral excitation occurring between two adjacent light-emitting elements 110.

[0250] In some examples, as shown in Fig. 6F, the light emitting portion 1121 of the light emitting element 110 is located in the second sub-accommodating region Q2. That is, along the thickness direction of the driving backplane 150 (shown in the direction of arrow g in Fig. 6F), the end face of the light blocking pattern 130 away from the driving backplane 150 is higher than the end face of the light emitting element 110 away from the driving backplane 150.

[0251] In some other examples, as shown in Fig. 6E, the entire light-emitting element 110 is located within the second sub-accommodating region Q2, that is, along the thickness direction of the driving backplane 150 (shown in the direction of arrow g in Fig. 6E), the end face of the light-shielding pattern 130 away from the driving backplane 150 is lower than the end face of the light-emitting element 110 away from the driving backplane 150.

[0252] It is understood that by arranging the first sub-shading pattern 136 to include the first sub-accommodating region Q1 and the second sub-shading pattern 138 to include the second sub-accommodating region Q2, the first sub-accommodating region Q1 and the second sub-accommodating region Q2 can be connected to each other, so that the conductive pad 156 passing through the first sub-accommodating region Q1 can be electrically connected to the light-emitting element 110 located in the second sub-accommodating region Q2, and the second sub-shading pattern 138 can play a role in blocking side light leakage of the light-emitting element 110, suppress lateral excitation occurring between two adjacent light-emitting elements 110, and improve the display effect of the display panel 100.

[0253] In some examples, as shown in FIGS. 6A and 6B, the first and second light-shielding sub-patterns 136 and 138 may have a two-step or approximately two-step staircase shape.

[0254] 6A and 6B, the first sub-light-shielding pattern 136 has a cross-sectional shape of a first trapezoid D1, which is parallel to the thickness direction of the driving backplane 150. The first trapezoid D1 has a first base b1 and a second base b2, the first base b1 is parallel to the second base b2, and the length of the first base b1 is shorter than the length of the second base b2.

[0255] As shown in FIGS. 6A and 6B, in some examples, the first base b1 is closer to the driving backplane 150 than the second base b2.

[0256] As can be seen from the above, in some examples, the protrusion 1527 of the driving backplane 150 has a truncated cone shape, and the upper base of the truncated cone is farther from the substrate 1524 than the lower base. Since the conductive pad 156 covers the protrusion 1527, the first base edge b1 is positioned closer to the driving backplane 150 than the second base edge b2, so that the first trapezoid D1 has an inverted trapezoid structure, which can reduce the gap between the first trapezoid D1 and the conductive pad 156. The first trapezoid D1 is bonded to the conductive pad 156, which can improve the blocking effect against reflected light by the first sub-light-shielding pattern 136, thereby improving the display performance of the display panel 100.

[0257] In some other examples, the first base b1 is further from the driving backplane 150 than the second base b2.

[0258] It is understood that in some other examples, the protrusion 1527 of the driving backplane 150 has a truncated cone shape, and the upper base of the truncated cone is closer to the substrate 1524 than the lower base. Since the conductive pad 156 covers the protrusion 1527, the first base edge b1 is positioned farther from the driving backplane 150 than the second base edge b2, so that the first trapezoid D1 has a regular trapezoid structure, which can reduce the gap between the first trapezoid D1 and the conductive pad 156. The first trapezoid D1 is bonded to the conductive pad 156, which can improve the blocking effect against reflected light by the first sub-light-shielding pattern 136, thereby improving the display performance of the display panel 100.

[0259] It is understood that the cross-sectional shape of the first sub-light-shielding pattern 136 includes a first trapezoid D1, and the first base b1 of the first trapezoid D1 is positioned closer to the driving backplane 150 than the second base b2. Alternatively, the first base b1 may be positioned farther from the driving backplane 150 than the second base b2, thereby adjusting the positional relationship between the first base b1 and the second base b2 of the first trapezoid D1 according to usage needs and improving the flexibility of the first sub-light-shielding pattern 136.

[0260] In some examples, the first sub-light-shielding pattern 136 includes a plurality of first trapezoids D1, and the shapes of the plurality of first trapezoids D1 may be the same or different.

[0261] As can be seen from the above, the pad assembly 154 includes at least two conductive pads 156. The conductive pad 156 includes an extending surface 1561 and a welding surface 1562, where the extending surface 1561 extends in a direction away from the backplane body 152. The welding surface 1562 is connected to the end of the extending surface 1561 that is away from the backplane body 152. The element pin 114 is welded to the welding surface 1562.

[0262] As shown in FIGS. 6A and 6B, the first sub-accommodation region Q1 has a first sub-sidewall L1, and the first sub-sidewall L1 contacts at least a portion of the extending surface 1562.

[0263] It is understood that the sub-sidewall L1 of the first sub-accommodating area Q1 is the hypotenuse of the first trapezoid D1. The first sub-sidewall L1 contacts at least a portion of the extending surface 1562, so that the first sub-accommodating area Q can be set up surrounding a portion of the extending surface 1562.

[0264] 6A and 6B , the first sub-sidewall L1 contacts the side of one extending surface 1562 that is away from the other extending surface 1562. That is, the first sub-light-shielding pattern 136 is not located between two conductive pads 156 that are electrically connected to the same light-emitting element 110. This arrangement reduces the influence of the first sub-light-shielding pattern 136 on the conductive pads 156, and improves the reliability of welding between the element pin 114 and the conductive pads 156.

[0265] 6C , the first sub-sidewall L1 surrounds the extending surface 1562. That is, the first sub-light-shielding pattern 136 is located between two conductive pads 156 electrically connected to the same light-emitting element 110. This arrangement improves the blocking effect of the first sub-light-shielding pattern 136 against reflected light from the driving backplane 150, reducing the intensity of light irradiating outside the display panel 100 and thereby improving the display performance of the display panel 100.

[0266] By positioning the first sub-side wall L1 so that it is in contact with at least a portion of the extending surface 1562, the first sub-shading pattern 136 can cover the driving backplane 150 and expose the welding surface 1561 of the driving backplane 150, so that the first sub-shading pattern 136 does not affect the welding between the welding surface 1561 and the element pin 114, and the shading effect of the first sub-shading pattern 136 against reflected light from the driving backplane 150 can be improved, thereby reducing the intensity of the reflected light irradiating the outside of the display panel 100 and improving the display effect of the display panel 100.

[0267] 6A and 6B, the second sub-light-shielding pattern 138 has a cross-sectional shape of a second trapezoid D2, which is parallel to the thickness direction of the driving backplane 150. The second trapezoid D2 has a third base b3 and a fourth base b4, the third base b3 is parallel to the fourth base b4, and the length of the third base b3 is shorter than the length of the fourth base b4.

[0268] In some embodiments, as shown in FIG. 6A, the third base b3 is farther from the driving backplane 150 than the fourth base b4.

[0269] As shown in Figure 6A, when the third base edge b3 is farther from the driving backplane 150 than the fourth base edge b4, and the first sub-shading pattern 136 and the second sub-shading pattern 138 are an integrally molded structure, the fourth base edge b4 is a virtual line segment located between the first sub-shading pattern 136 and the second sub-shading pattern 138.

[0270] When the first and second light-shielding sub-patterns 136 and 138 are formed separately, the fourth bottom edge b4 is a contact surface between the first and second light-shielding sub-patterns 136 and 138.

[0271] 6A , it can be seen that the second trapezoid D2 becomes a regular trapezoid by positioning the third base b3 farther away from the driving backplane 150 than the fourth base b4. In this way, the shading of the light emitting portion 1121 by the light-shielding pattern 130 against the light emitting beam from the front side can be reduced, the light emission angle of the light emitting element 110 can be increased, the intensity of the light emitting beam through the top opening P1 can be increased, and the light output rate of the light emitting element 110 can be increased, thereby improving the light utilization rate and reducing the power consumption of the display panel 100.

[0272] In some other examples, as shown in FIG. 6B, the third base edge b3 is closer to the driving backplane 150 than the fourth base edge b4.

[0273] As shown in Figure 6B, when the third bottom surface b3 is closer to the driving backplane 150 than the fourth bottom surface b4, and the first sub-shading pattern 136 and the second sub-shading pattern 138 are an integrally molded structure, it can be understood that the third bottom surface b3 is a virtual line segment located between the first sub-shading pattern 136 and the second sub-shading pattern 138.

[0274] When the first and second light-shielding sub-patterns 136 and 138 are formed separately, the third bottom edge b3 is a contact surface between the first and second light-shielding sub-patterns 136 and 138.

[0275] 6B, it can be seen that the second trapezoid D2 becomes an inverted trapezoid by positioning the third base b3 closer to the driving backplane 150 than the fourth base b4. In this way, the light-shielding pattern 130 can improve the shielding effect against side light leakage of the light-emitting elements 110, improve lateral excitation between two adjacent light-emitting elements 110, and improve the display performance of the display panel 100.

[0276] It is understood that the cross-sectional shape of the second sub-light-shielding pattern 138 includes a second trapezoid D2, and the third base b3 of the second trapezoid D2 is positioned closer to the driving backplane 150 than the fourth base b4. Alternatively, the third base b3 is positioned farther from the driving backplane 150 than the fourth base b4, thereby allowing the positional relationship between the third base b3 and the fourth base b4 of the second trapezoid D2 to be set according to usage needs, thereby improving the flexibility of the second sub-light-shielding pattern 138.

[0277] In some examples, the second sub-light-shielding pattern 138 includes a plurality of second trapezoids D2, the shapes of which may be the same or different.

[0278] Fig. 7A is a diagram showing the positional relationship between a reflective layer and a light-shielding pattern according to some embodiments. Fig. 7B is a diagram showing the positional relationship between a reflective layer and a light-shielding pattern according to some other embodiments. Fig. 7C is a diagram showing the positional relationship between a reflective layer and a light-shielding pattern according to still other embodiments. Fig. 7D is a structural diagram of a display panel according to still other embodiments. Fig. 7E is a structural diagram of a display panel according to still other embodiments. Fig. 7F is a structural diagram of a display panel according to still other embodiments.

[0279] 7A to 7C, in some embodiments, the second sub-accommodating region Q2 has a second sub-sidewall L2. The display panel 100 further includes a reflective layer 162. The reflective layer 162 covers at least a portion of the second sub-sidewall L2 and / or covers at least a portion of the surface of the first sub-light-shielding pattern 136 facing away from the driving backplane 150.

[0280] It is understood that light rays can be reflected when irradiated onto the reflective layer 162. Illustratively, the reflective layer 162 is made of a metal material. Illustratively, the material of the reflective layer 162 includes at least one of copper, aluminum, and titanium.

[0281] In some examples, as shown in Figures 7A, 7B, 7D, and 7E, the reflective layer 162 covers at least a portion of the second sub-sidewall L2, so that the reflective layer 162 can play a role in reflecting light rays irradiated onto the second sub-sidewall L2, thereby improving the utilization rate of light rays, improving the light output rate of the light-emitting element 110, and reducing the power consumption of the display panel 100.

[0282] In some examples, as shown in Figures 7C and 7F, the reflective layer 162 covers at least a portion of the surface of the first sub-shading pattern 136 facing away from the driving backplane 150, so that the reflective layer 162 can play a role in reflecting light rays irradiated onto the surface of the first sub-shading pattern 136 facing away from the driving backplane 150, thereby improving the utilization rate of light rays and reducing the power consumption of the display panel 100.

[0283] As shown in Figures 7C and 7F, when the reflective layer 162 covers at least a portion of the surface of the first sub-shading pattern 136 facing away from the driving backplane 150, it can be understood that the reflective layer 162 and the extended surface 1561 of the conductive pad 156 are spaced apart, which avoids short-circuiting of the light-emitting element 110 due to the electrical connection between the reflective layer 162 and the conductive pad 156 and improves the reliability of the display panel 100.

[0284] In some embodiments, as shown in FIGS. 7D to 7F, at least the central region of the end face of the package portion 140 away from the driving backplane 150 is flat.

[0285] 7D to 7F , the orthogonal projection of the central region of the package unit 140 on the driving backplane 150 overlaps with at least a portion of the orthogonal projection of the light emitting unit 1121 on the driving backplane 150. Illustratively, the orthogonal projection of the light emitting unit 1121 on the driving backplane 150 is located within the range of the orthogonal projection of the central region of the package unit 140 on the driving backplane 150.

[0286] It is understood that at least a central region of the end face of the packaging unit 140 away from the driving backplane 150 may be flat or approximately flat. By arranging it in this manner, the influence of the packaging unit 140 on the light emitted from the light emitting unit 1121 can be reduced, and the display performance of the display panel 100 can be improved.

[0287] FIG. 7G is a structural diagram of a display panel according to some other embodiments.

[0288] In some other embodiments, as shown in FIG. 7G, the end face of the package portion 140 facing away from the driving backplane 150 is a second curved surface M2, and the second curved surface M2 curves in the direction away from the driving backplane 150.

[0289] It is understood that by making the end face of the package section 140 away from the driving backplane 150 the second curved surface M2 and setting the second curved surface M2 so that it curves in the direction away from the driving backplane 150, the second curved surface M2 can serve to collect light rays and reduce the intensity of light rays irradiated to other light-emitting elements 110, thereby reducing crosstalk occurring between two adjacent light-emitting elements 110, suppressing lateral excitation between two adjacent light-emitting elements 110, and improving the display performance of the display panel 100.

[0290] It is understood that the second curved surface M2 and the first curved surface M1 may be the same or different.

[0291] 7D to 7F, in some embodiments, along the thickness direction of the driving backplane 150 (shown in the direction of arrow g in FIGS. 7D to 7F), the end face of the package unit 140 away from the driving backplane 150 is higher than the end face of the light-shielding pattern 130 away from the driving backplane 150. In addition, the package unit 140 covers the edge region of the end face of the light-shielding pattern 130 away from the driving backplane 150.

[0292] By arranging the end face of the package section 140 facing away from the driving backplane 150 along the thickness direction of the driving backplane 150 so that it is higher than the end face of the light-shielding pattern 130 facing away from the driving backplane 150, it is possible to prevent the light-shielding pattern 130 from covering the side of the package section 140 facing away from the driving backplane 150, thereby preventing the light-shielding pattern 130 from blocking the light emitted from the front of the light-emitting section 1121, increasing the intensity of the light emitted through the top opening P1, and increasing the light output rate of the light-emitting element 110, thereby improving the light utilization rate and reducing the power consumption of the display panel 100.

[0293] In addition, avoiding the light-shielding pattern 130 from covering the side of the package portion 140 away from the driving backplane 150 can further improve the consistency of the light output rate of the multiple light-emitting elements 110, thereby improving the consistency of the brightness of the multiple sub-pixels 101.

[0294] In addition, by installing the end face of the package part 140 facing away from the driving backplane 150 higher than the end face of the shading pattern 130 facing away from the driving backplane 150 along the thickness direction of the driving backplane 150, the package part 140 can play a supporting role when external force is applied to the display panel 100, thereby playing a protective role for the light-emitting element 110 and the shading pattern 130 and reducing the risk of damage to the light-emitting element 110 and the shading pattern 130.

[0295] For example, as shown in Figures 7D to 7F, the package section 140 covers the edge region of the end face of the light-shielding pattern 130 away from the driving backplane 150, thereby acting as a shield for the edge of the light-shielding pattern, reducing the risk that the boundary position between the light-shielding pattern 130 and the package section 140 will be detected by the naked eye, and improving the display performance of the display panel 100.

[0296] Figure 8A is a structural diagram of a display panel according to still other embodiments, Figure 8B is a structural diagram of a display panel according to still other embodiments, Figure 8C is a structural diagram of a display panel according to still other embodiments, and Figure 8D is a structural diagram of a display panel according to still other embodiments.

[0297] 8A to 8D, the display panel 100 further includes a protective layer 164. The protective layer 164 covers at least one of the end face of the light-shielding pattern 130 facing away from the driving backplane 150 and the end face of the package unit 140 facing away from the driving backplane 150.

[0298] It is understood that by having the protective layer 164 cover at least one of the end face of the light-shielding pattern 130 facing away from the driving backplane 150 and the end face of the package section 140 facing away from the driving backplane, the protective layer 164 can play a protective role for at least one of the end face of the light-shielding pattern 130 facing away from the driving backplane 150 and the end face of the package section 140 facing away from the driving backplane, thereby reducing the risk of damage to the package section 140 and the light-shielding pattern 130 and improving the reliability of the display panel 100.

[0299] In some examples, the material of the protective layer 164 is SiN x (silicon nitride). For example, the thickness of the protective layer 164 is in the range of 200 nm to 300 nm, which prevents the protective layer 164 from being too thin (for example, less than 200 nm) and thus affecting the protective effect of the protective layer 164 on the package unit 140 and the light-shielding pattern 130. Also, it is possible to prevent the protective layer 164 from being too thick (for example, more than 300 nm), which is disadvantageous to thinning the display panel 100.

[0300] In some examples, the thickness of the protective layer 164 is 220 nm, 250 nm, or 280 nm, or the like.

[0301] In some examples, as shown in FIG. 8A, the protective layer 164 does not cover the end face of the package portion 140 facing away from the driving backplane 150, but covers the end face of the light-shielding pattern 130 facing away from the driving backplane 150, thereby preventing the protective layer 164 from blocking the light emitted from the light-emitting element 110, improving the light utilization rate, and reducing the power consumption of the display panel 100.

[0302] In some other examples, as shown in FIG. 8B, the protective layer 164 does not cover the end face of the light-shielding pattern 130 facing away from the driving backplane 150, but covers the end face of the package portion 140 facing away from the driving backplane 150, so that the protective layer 164 plays a protective role for the package portion 140, reduces the risk of the package portion 140 being damaged, and improves the reliability of the display panel 100.

[0303] 8A and 8B, when the protective layer 164 covers one of the light-shielding pattern 130 and the package part 140, the protective layer 164 may also cover a portion of the edge of the other. For example, when the protective layer 164 covers the light-shielding pattern 130, it may cover a portion of the edge of the package part 140. When the protective layer 164 covers the package part 140, it may cover a portion of the edge of the light-shielding pattern 130, as shown in FIG. 8B.

[0304] In some other examples, as shown in Figures 8C and 8D, the protective layer 164 covers the end face of the light-shielding pattern 130 facing away from the driving backplane 150 and the end face of the package portion 140 facing away from the driving backplane 150, so that the protective layer 164 plays a protective role for the light-shielding pattern 130 and the package portion 140, thereby improving the reliability of the display panel 100.

[0305] It will be appreciated that the protective layer 164 being a transparent material reduces the blocking of light emitted from the light emitting element 110 by the package portion 140. In some examples, the protective layer 164 is a transparent inorganic material.

[0306] For example, a TFE CVD (Thin Film Encapsulation Chemical Vapor Evaporation) process may be used to form the protective layer 164. Figure 9 is a structural diagram of a display panel according to some other embodiments.

[0307] As can be seen from the above, in some embodiments, the display panel 100 includes a protective layer 164. In some other embodiments, as shown in FIG. 9 , the display panel 100 further includes a touch layer 170. The touch layer 170 is located on the side of the light-emitting element 110 that is away from the driving backplane 150. Here, the touch layer 170 includes a plurality of touch electrodes 176, and the touch electrodes 176 include grid lines 1761. The orthogonal projection of the grid lines 1761 on the driving backplane 150 is located within the range of the orthogonal projection of the light-blocking pattern 130 on the driving backplane 150.

[0308] It is understood that the touch layer 170 is used to acquire a touch position, thereby enabling the display panel 100 to achieve a touch function. Exemplarily, the touch layer 170 may be a self-capacitance touch structure or a mutual-capacitance touch structure.

[0309] It is understood that the transparent material of the touch layer 170 may reduce the blocking of light emitted from the light emitting element 110 by the touch layer 170, improve the light output rate of the light emitting element 110, and reduce the power consumption of the display panel 100.

[0310] For example, as shown in FIG. 9, the touch layer 170 is located on the side of the package structure 120 away from the driving backplane 150, and serves to protect the package structure 120 (including the light-shielding pattern 130 and the package portion 140) and reduce the risk of the package structure 120 being damaged.

[0311] In some examples, the touch layer 170 further includes an adhesive layer 172 and a touch function layer 174, and the adhesive layer 172 is located between the touch function layer 174 and the package structure 120. It is understood that the adhesive layer 172 plays a role of fixing and adhering, thereby preventing the touch function layer 174 from shifting relative to the package structure 120 and improving the reliability of the display panel 100.

[0312] In some examples, the material of adhesive layer 172 includes a photoresist, such as an OC adhesive.

[0313] 9 , the touch electrode 176 is located in the touch function layer 174 and is used to acquire a touch position. Illustratively, the touch electrode 176 includes grid lines 1761, which are used to transmit electrical signals. The orthogonal projection of the grid lines 1761 on the driving backplane 150 is located within the range of the orthogonal projection of the light-shielding pattern 130 on the driving backplane 150, thereby reducing the shading of light emitted from the front of the light-emitting unit 1121 by the grid lines 1761, improving the light output efficiency of the light-emitting element 110, and reducing the power consumption of the display panel 100.

[0314] FIG. 10 is a flowchart illustrating steps of a method for manufacturing a display panel according to some embodiments of the present disclosure.

[0315] In another aspect, an embodiment of the present disclosure provides a display panel manufacturing method for manufacturing the display panel 100 of the above embodiment.

[0316] In some embodiments, as shown in FIG. 10, a method for manufacturing the display panel 100 includes the following steps.

[0317] Step S101: electrically connect a plurality of light emitting devices to a driving backplane. The plurality of light emitting devices are located on a first side of the driving backplane, and the plurality of light emitting devices are spaced apart from one another. The light emitting devices include a light emitting body and a light emitting pin. The light emitting body includes a light emitting portion, and the light emitting pin is electrically connected to the driving backplane.

[0318] Step S102: Form a package structure on a first side of the driving backplane. The package structure includes a light-shielding pattern and a plurality of package parts. The light-shielding pattern has a plurality of receiving areas, each of which exposes at least one light-emitting element. At least a portion of the package part is located within the receiving area and covers the light-emitting element. A light-emitting part of the at least one light-emitting element is located within the receiving area.

[0319] The display panel manufacturing method provided by the embodiments of the present disclosure can be used to manufacture the above display panel, and therefore has all the beneficial effects mentioned above, which will not be repeated here.

[0320] It is understood that forming the package structure 120 after electrically connecting the plurality of light-emitting elements 110 to the driving backplane 150 can reduce the thickness of the light-emitting elements 110 and improve the consistency of the thickness of the plurality of light-emitting elements 110, which is advantageous for making the display panel 100 thinner.

[0321] In some embodiments, forming a packaging structure on the first side of the driving backplane includes the following steps.

[0322] First, forming a plurality of package portions on a first side of the driving backplane.

[0323] Then, forming a light-shielding pattern on the first side of the driving backplane.

[0324] 3C, a plurality of patterned package parts 140 may be formed by exposing, developing, washing, etc. a negative photoresist (e.g., a transparent OC adhesive), and a first included angle θ may be formed between the sidewall surface of the package part 140 and the driving backplane. After the plurality of package parts 140 are formed, a light-shielding pattern 130 (e.g., a black photoresist) may be filled in the gaps between the plurality of package parts 140, thereby forming a package structure 120, as shown in FIG.

[0325] In addition, along the thickness direction of the driving backplane 150 (shown in the direction of arrow g in Figure 3A), the end face of the package section 140 facing away from the driving backplane 150 is higher than the end face of the light-shielding pattern 130 facing away from the driving backplane 150. This prevents the light-shielding pattern 130 from flowing to the end face of the package section 140 facing away from the driving backplane 150 when the light-shielding pattern 130 is formed between two adjacent package sections 140, thereby preventing the light-shielding pattern 130 from blocking light rays emitted from the front of the light-emitting section 1121, improving the light emission rate of the light-emitting element 110, and reducing the power consumption of the display panel 100.

[0326] In some other embodiments, the step of forming a packaging structure on the first side of the driving backplane includes the following steps.

[0327] Step 1: Form a light-shielding pattern on the first side of the driving backplane.

[0328] Thereafter, a step of forming a package portion within the receiving area of the light-shielding pattern.

[0329] 5A, a light-shielding pattern 130 having a plurality of receiving regions Q1 may be formed by exposing, developing, and washing a positive photoresist, and a first included angle θ may be formed between a sidewall L of the receiving region Q1 and a surface of the light-shielding pattern 130 that is closer to the driving backplane 150. The first included angle θ is an acute angle. As shown in FIG. 5B, after the light-emitting device 110 is electrically connected to the driving backplane 150, a package part 140 that covers the light-emitting device 110 is formed.

[0330] As shown in Figure 5B, along the thickness direction of the driving backplane 150 (shown in the direction of arrow g in Figure 5B), the end face of the package part 140 facing away from the driving backplane 150 is lower than the end face of the shading pattern 130 facing away from the driving backplane 150, so that the light-emitting element 110 and the package part 140 can both be positioned within the accommodating area Q, improving the shielding effect of the shading pattern 130 against side light leakage of the light-emitting element 110, reducing crosstalk occurring between two adjacent light-emitting elements 110, suppressing lateral excitation between two adjacent light-emitting elements 110, and improving the display performance of the display panel 100.

[0331] As a result of the above, the embodiments of the present disclosure have at least the following beneficial effects.

[0332] The shading pattern 130 has multiple accommodating areas Q, and is installed so that the light-emitting portion 1121 of at least one light-emitting element 110 is located within the accommodating area Q. This allows the shading pattern 130 to act as a shield against side light leakage from the light-emitting element 110 (including side light leakage due to the feed 1123 or side light leakage due to other structures in the display panel 100, such as the flux 113), improve the consistency of the light-emitting area between the multiple light-emitting elements 110, reduce crosstalk occurring between two adjacent light-emitting elements 110, suppress lateral excitation between two adjacent light-emitting elements 110, and improve the display performance of the display panel 100.

[0333] In addition, there is no need to package the light emitting element 110 using the black adhesive film 111, and by packaging the light emitting element 110 using a method in which the light emitting element 110 is covered with the packaging part 140, the light utilization rate can be improved, the light output rate of the light emitting element 110 can be improved, and the power consumption of the display panel 100 can be reduced.

[0334] Meanwhile, the packaging unit 140 can protect the pellet 1123, thereby reducing the risk of the pellet 1123 being damaged by force, thereby reducing the risk of the pellet 1123 being damaged and falling off, damaging the driving backplane 150 or other structures of the display panel 100, and improving the reliability of the display panel 100. In addition, protecting the pellet 1123 with the packaging unit 140 also reduces the risk of the element pins 114 falling off the conductive pads 156 due to force being applied to the pellet 1123, thereby improving the reliability of the display panel 100.

[0335] The above are merely specific embodiments of the present disclosure, and the scope of protection of the present disclosure is not limited thereto. Any modifications or replacements that can be easily thought of by a person skilled in the art within the technical scope of the present disclosure are intended to be embraced within the technical scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be governed by the scope described in the claims.

Claims

1. a drive backplane; a plurality of light emitting elements located on a first side of the driving backplane, the plurality of light emitting elements being spaced apart from one another, each light emitting element including a light emitting body and a light emitting pin, the light emitting body including a light emitting portion, and the light emitting pin being electrically connected to the driving backplane; a package structure located on a first side of the driving backplane, the package structure including a light-shielding pattern and a plurality of package parts, the light-shielding pattern having a plurality of receiving areas, each receiving area exposing at least one of the light-emitting elements, and at least a portion of the package part being located in the receiving area and covering the light-emitting element; Equipped with a light-emitting portion of at least one of the light-emitting elements is located within the accommodating region; Display panel.

2. the receiving area has a top opening and a bottom opening, the top opening is farther from the drive backplane than the bottom opening, and the area of the top opening is greater than the area of the bottom opening; The display panel according to claim 1 .

3. The receiving area has a sidewall, and a first included angle is formed between the sidewall and a surface of the light-shielding pattern that is closer to the driving backplane, and the first included angle is an acute angle. The display panel according to claim 2 .

4. the first included angle is 75° or less; The display panel according to claim 3 .

5. an end face of the package part on a side away from the driving backplane along a thickness direction of the driving backplane is higher than an end face of the light-shielding pattern on a side away from the driving backplane, and the end face of the package part on the side away from the driving backplane is a first curved surface, and the first curved surface is curved in a direction away from the driving backplane; 5. The display panel according to claim 3 or 4.

6. the package portion includes a first partial package portion and a second partial package portion, the first partial package portion being closer to the drive backplane than the second partial package portion; the first partial package part surrounds the light emitting element, and an end surface of the first partial package part away from the driving backplane is flush with an end surface of the light emitting element away from the driving backplane; the second partial package part is located on the side of the first partial package part away from the driving backplane, and covers the first partial package part and the light emitting element; a third distance is provided between an end face of the first partial package part that faces away from the drive backplane and the drive backplane, and a fourth distance is provided between an end face of the second partial package part that faces closer to the first partial package part and an end face of the second partial package part that faces away from the first partial package part; a fifth distance is defined between the drive backplane and an end surface of the light-shielding pattern that faces away from the drive backplane, the fifth distance being equal to or greater than the third distance and equal to or less than the sum of 50% of the fourth distance and the third distance; The display panel according to claim 5 .

7. the light-shielding pattern has a semi-elliptical shape in a vertical cross section, and the vertical cross section is parallel to a thickness direction of the driving backplane; The semi-ellipse has a first side and a second side, both ends of the first side are connected to both ends of the second side, the first side is close to the driving backplane, and the second side is curved in a direction away from the driving backplane. The display panel according to claim 2 .

8. an end face of the package part on a side away from the driving backplane along a thickness direction of the driving backplane is lower than an end face of the light-shielding pattern on a side away from the driving backplane, and at least a middle region of the end face of the package part on the side away from the driving backplane is flat; The display panel according to claim 7 .

9. the light-shielding pattern includes a first partial light-shielding pattern and a second partial light-shielding pattern, the first partial light-shielding pattern being closer to the driving backplane than the second partial light-shielding pattern; an end surface of the first partial light-shielding pattern on a side away from the driving backplane is flush with an end surface of the light-emitting element on a side away from the driving backplane, and the second partial light-shielding pattern is located on the side of the first partial light-shielding pattern on the side away from the driving backplane; a first distance is provided between an end face of the first partial light-shielding pattern on a side away from the driving backplane and the driving backplane, and a second distance is provided between an end face of the second partial light-shielding pattern on a side closer to the first partial light-shielding pattern and an end face of the second partial light-shielding pattern on a side away from the first partial light-shielding pattern; The second distance is equal to or greater than 30% of the first distance and equal to or less than twice the first distance. The display panel according to claim 8 .

10. the accommodating area includes a first sub-accommodating area and a second sub-accommodating area, the first sub-accommodating area and the second sub-accommodating area are in communication with each other, and an orthogonal projection of an edge of an opening of the first sub-accommodating area on the driving backplane is located within an area formed by an orthogonal projection of an edge of an opening of the second sub-accommodating area on the driving backplane; The driving backplane includes a backplane body and a plurality of pad assemblies, the plurality of pad assemblies are electrically connected to the backplane body, the pad assemblies pass through the first sub-accommodating area and are welded to at least one of the light-emitting elements, and a light-emitting portion of the at least one light-emitting element is located in the second sub-accommodating area. The display panel according to claim 1 .

11. the light-shielding pattern includes a first sub-light-shielding pattern and a second sub-light-shielding pattern that are stacked, the first sub-light-shielding pattern is closer to the driving backplane than the second sub-light-shielding pattern, the first sub-light-shielding pattern includes the first sub-accommodating area, and the second sub-light-shielding pattern includes the second sub-accommodating area; The display panel according to claim 10.

12. the first sub light-shielding pattern has a first trapezoidal shape in a longitudinal section, the longitudinal section being parallel to a thickness direction of the driving backplane; the first trapezoid has a first base and a second base, the first base is parallel to the second base, and the length of the first base is shorter than the length of the second base; the first base edge is closer to the driving backplane than the second base edge, or the first base edge is farther from the driving backplane than the second base edge; The display panel according to claim 11 .

13. the pad assembly includes at least two conductive pads, each of the conductive pads including an extending surface and a welding surface, the extending surface extending in a direction away from the backplane body, the welding surface being connected to an end of the extending surface away from the backplane body, and the element pin being welded to the welding surface; The first sub-accommodation area has a first sub-sidewall, and the first sub-sidewall contacts at least a portion of the extension surface. The display panel according to claim 11 or 12.

14. along the thickness direction of the drive backplane, an edge region of the welding surface is higher than a central region of the welding surface; The display panel according to claim 13.

15. the second sub-light-shielding pattern has a cross section that is a second trapezoid, and the cross section is parallel to a thickness direction of the driving backplane; the second trapezoid has a third base and a fourth base, the third base is parallel to the fourth base, and the length of the third base is shorter than the length of the fourth base; the third base edge is farther from the driving backplane than the fourth base edge, or the third base edge is closer to the driving backplane than the fourth base edge; The display panel according to any one of claims 11 to 14.

16. the second sub-accommodating area has a second sub-sidewall, and the display panel further includes a reflective layer; the reflective layer covers at least a portion of the second sub-sidewall, and / or the reflective layer covers at least a portion of the surface of the first sub-light-shielding pattern away from the driving backplane; The display panel according to claim 15.

17. At least a central region of the end face of the package part away from the drive backplane is flat, or an end surface of the package part on a side away from the drive backplane is a second curved surface, and the second curved surface is curved in a direction away from the drive backplane; The display panel according to any one of claims 10 to 16.

18. an end face of the package part on a side away from the drive backplane along a thickness direction of the drive backplane is higher than an end face of the light-shielding pattern on a side away from the drive backplane, and the package part covers an edge region of the end face of the light-shielding pattern on the side away from the drive backplane; The display panel according to any one of claims 10 to 17.

19. the package portion includes a first partial package portion and a second partial package portion, the first partial package portion being closer to the drive backplane than the second partial package portion; the first partial package part surrounds the light emitting element, and an end surface of the first partial package part away from the driving backplane is flush with an end surface of the light emitting element away from the driving backplane; the second partial package part is located on the side of the first partial package part away from the driving backplane, and covers the first partial package part and the light emitting element; a third distance is provided between an end face of the first partial package part that faces away from the drive backplane and the drive backplane, and a fourth distance is provided between an end face of the second partial package part that faces closer to the first partial package part and an end face of the second partial package part that faces away from the first partial package part; the fourth distance is equal to or greater than 30% of the third distance and equal to or less than twice the third distance; The display panel according to claim 1 .

20. The display panel includes: a protective layer covering at least one of an end face of the light-shielding pattern on a side away from the drive backplane and an end face of the package part on a side away from the drive backplane; 20. The display panel according to claim 1.

21. The display panel includes: a touch layer positioned on a side of the light-emitting element away from the driving backplane; the touch layer includes a plurality of touch electrodes, the touch electrodes include grid lines, and orthogonal projections of the grid lines on the driving backplane are within a range of orthogonal projections of the light-shielding pattern on the driving backplane; 20. The display panel according to claim 1.

22. The element body includes a body structure and a bait, the light emitting part is located in the body structure, and the bait is connected to the body structure. The display panel according to any one of claims 1 to 21.

23. A display panel manufacturing method for manufacturing the display panel according to any one of claims 1 to 22, comprising the steps of: electrically connecting a plurality of light emitting devices to a driving backplane, the plurality of light emitting devices being located on a first side of the driving backplane and spaced apart from each other, the light emitting devices including a device body and a device pin, the device body including a light emitting portion, and the device pin being electrically connected to the driving backplane; forming a package structure on the first side of the driving backplane, the package structure including a light-shielding pattern and a plurality of package parts, the light-shielding pattern having a plurality of receiving areas, each receiving area exposing at least one of the light-emitting elements, at least a portion of the package part being located in the receiving area and covering the light-emitting element, and a light-emitting part of the at least one light-emitting element being located in the receiving area; Including, A method for manufacturing a display panel.

24. forming a packaging structure on a first side of the driving backplane; a step for first forming a plurality of package portions on a first side of the driving backplane; and then forming a light-shielding pattern on the first side of the driving backplane; or forming a packaging structure on a first side of the driving backplane; a step for forming a light-shielding pattern on a first side of the driving backplane; and then forming a package portion in the receiving area of the light-shielding pattern. The method for manufacturing the display panel according to claim 23 .

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