electronic devices

Abstract

The electronic device includes a housing having a space formed therein and including a heat dissipation passage passing through from one side to the other, an electronic component disposed in the space, and a heat dissipation member disposed within the heat dissipation passage and through which a refrigerant flows, the heat dissipation passage including a hole facing the electronic component, and the heat dissipation member disposed so that at least a portion of the heat dissipation member overlaps the electronic component in the vertical direction through the hole.

Description

[Technical Field]

[0001] The present embodiment relates to an electronic device. [Background technology]

[0002] The most common electronic devices in automobiles are the engine electrical systems (starting system, ignition system, charging system) and lighting systems, but in recent years, as vehicles have become more electronically controlled, most systems, including the sash electrical systems, have tended to be electro-mechanical.

[0003] The various electronic devices installed in automobiles, such as lamps, audio, heaters, and air conditioners, are powered by the battery when the vehicle is stopped, and by a generator when the vehicle is running, and in this case the generating capacity of the 14V power supply system is used as the normal power supply voltage.

[0004] In recent years, with the development of the information technology industry, various new technologies (motorized power steering, Internet, etc.) aimed at improving the convenience of automobiles have been incorporated into vehicles, and it is expected that the development of new technologies that will enable the maximum use of current automobile systems will continue in the future.

[0005] The electronic device has a housing that defines its outer shape, and the housing contains a number of electronic components for operation. The electronic components generate heat when they are operated. Summary of the Invention [Problem to be solved by the invention]

[0006] The object of this embodiment is to provide an electronic device that can be made lighter and at the same time improve the heat dissipation efficiency. [Means for solving the problem]

[0007] The electronic device of this embodiment includes a housing having a space formed therein and including a heat dissipation passage that penetrates from one side to the other, an electronic component arranged in the space, and a heat dissipation member arranged within the heat dissipation passage and through which a refrigerant flows, the heat dissipation passage including a hole facing the electronic component, and the heat dissipation member arranged so that at least a portion of the heat dissipation member overlaps the electronic component in the vertical direction through the hole.

[0008] The housing may be made of plastic, and the heat dissipation member may be made of metal.

[0009] The housing and the heat dissipation member can be integrally formed by insert injection.

[0010] The lower surface of the heat dissipation member facing the electronic component may be flat.

[0011] The heat dissipation plate may include a top surface that contacts the heat dissipation passage and a bottom surface that contacts the electronic component.

[0012] The heat sink plate can be screwed to the inner surface of the housing.

[0013] The inner surface of the housing may include a guide that protrudes from other areas and to which the heat dissipation plate is coupled, and the guide may be divided into a plurality of areas by the heat dissipation passage.

[0014] The plurality of regions can be screw-coupled to the heat sink plate and the electronic component, respectively.

[0015] The area of the top surface of the electronic component that contacts the heat sink plate may include a metal material.

[0016] A protrusion that protrudes upward from other areas may be formed in an area of the upper surface of the housing corresponding to an area where the heat dissipation passage is formed. [Effects of the Invention]

[0017] This embodiment has an advantage that the heat dissipation efficiency of the electronic device can be improved by the structure in which the heat dissipation member through which the coolant flows and the electronic components are in direct contact with each other or through a heat dissipation plate.

[0018] Furthermore, by integrally forming a heat dissipating member made of metal on a plastic housing, the weight of the electronic device can be reduced, which has the advantage of reducing the manufacturing cost. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a perspective view illustrating one surface of an electronic device according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view illustrating another surface of the electronic device according to the first embodiment of the present invention. [Figure 3] 1 is a plan view illustrating the bottom surface of an electronic device according to a first embodiment of the present invention. [Figure 4] 1 is an exploded perspective view of a housing, a heat dissipation plate, and electronic components according to a first embodiment of the present invention. [Figure 5] 1 is an exploded perspective view of a housing, a heat dissipation member, a heat dissipation plate, and electronic components according to a first embodiment of the present invention. [Figure 6] 1 is an exploded perspective view of a housing and a heat dissipation member according to a first embodiment of the present invention. [Figure 7] 1 is a plan view illustrating a coupling structure between an electronic component and a heat dissipation member according to a first embodiment of the present invention. [Figure 8] FIG. 10 is a perspective view illustrating one surface of an electronic device according to a second embodiment of the present invention. [Figure 9] FIG. 10 is a perspective view illustrating another surface of an electronic device according to a second embodiment of the present invention. [Figure 10] FIG. 10 is a plan view illustrating the top surface of an electronic device according to a second embodiment of the present invention. [Figure 11] 10A is a diagram illustrating A-A' in FIG. [Figure 12] FIG. 10 is an exploded perspective view of an electronic device according to a second embodiment of the present invention. [Figure 13] is a drawing showing Figure 12 from a different angle. DETAILED DESCRIPTION OF THE INVENTION

[0020] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0021] However, the technical concept of the present invention is not limited to the described embodiments and can be realized in various different forms, and one or more of the components of the embodiments can be selectively combined or substituted and used within the scope of the technical concept of the present invention.

[0022] Furthermore, unless otherwise clearly defined and described, terms (including technical and scientific terms) used in the embodiments of the present invention are to be interpreted as meanings that are commonly understood by a person of ordinary skill in the art to which the present invention belongs, and commonly used terms such as predefined terms may be interpreted in light of the contextual meaning of the relevant art.

[0023] Furthermore, the terms used in the examples of the present invention are intended to explain the examples and do not limit the present invention. In this specification, the singular form can also include the plural form unless otherwise specified in the context, and when it is stated as "A and at least one (or more) of B and C," it can include one or more of all possible combinations of A, B, and C.

[0024] Additionally, terms such as first, second, A, B, (a), (b), etc. may be used to describe components of embodiments of the present invention.

[0025] Such terms are used only to distinguish a component from other components, and are not intended to limit the nature, order, or sequence of the components.

[0026] Furthermore, when a component is described as being "coupled," "coupled," or "connected" to another component, it includes not only the case where the component is directly coupled, coupled, or connected to the other component, but also the case where the component is "coupled," "coupled," or "connected" by another component between the component and the other component.

[0027] Furthermore, when it is described as being formed or disposed "above (above) or below (below)" a component, "above (above)" or "below (below)" includes not only the case where two components are in direct contact with each other but also the case where one or more other components are formed or disposed between the two components. Furthermore, when it is expressed as "above (above) or below (below)," it can mean not only the upper direction but also the lower direction based on one component.

[0028] The electronic device according to this embodiment is installed in a vehicle and may include a converter, a pump, an electronic control unit (ECU), etc. However, this is merely an example, and the electronic device may include at least one or more electronic components disposed in a housing and various devices electrically connected via external terminals and connectors.

[0029] FIG. 1 is a perspective view illustrating one side of an electronic device according to a first embodiment of the present invention, FIG. 2 is a perspective view illustrating the other side of an electronic device according to a first embodiment of the present invention, FIG. 3 is a plan view illustrating the underside of an electronic device according to a first embodiment of the present invention, FIG. 4 is an exploded perspective view of a housing, a heat dissipation plate, and an electronic component according to a first embodiment of the present invention, FIG. 5 is an exploded perspective view of a housing, a heat dissipation member, a heat dissipation plate, and an electronic component according to a first embodiment of the present invention, FIG. 6 is an exploded perspective view of a housing and a heat dissipation member according to a first embodiment of the present invention, and FIG. 7 is a plan view illustrating the connection structure of an electronic component and a heat dissipation member according to a first embodiment of the present invention.

[0030] 1 to 7, an electronic device 10 according to a first embodiment of the present invention may include a housing 100, an electronic component 170, and a heat dissipation member 200. In the electronic device 10 shown in FIG.

[0031] The housing 100 may form the outer shape of the electronic device 10. The housing 100 may have a rectangular cross section. The housing 100 may be formed in a box shape. At least one component for operating the electronic device 10, including the electronic component 170, may be disposed in a space 102 within the housing 100. The space 102 within the housing 100 may be open downward. A cover (not shown) may be coupled to the bottom of the housing 100 to cover the bottom of the space 102.

[0032] The housing 100 may include a top plate 103 and a side plate 104 that extends downward from an end of the top plate 103. The top plate 103 may form a top surface of the electronic device 10. The side plate 104 may form a side surface of the electronic device 10. The side plate 104 may have at least one hole or groove formed therein. External terminals may be coupled to components inside the housing 100 through the hole or groove.

[0033] A plurality of regions arranged with steps may be formed on the upper surface of the housing 100. Some of the regions may have a shape that protrudes upward or is recessed downward compared to other regions.

[0034] The housing 100 may include a heat dissipation passage 160. The heat dissipation passage 160 may be formed in the housing 100 as a region in which at least a portion of the heat dissipation member 200 is disposed. A first opening 161 (see FIG. 6 ) forming one end of the heat dissipation passage 160 may be formed in one side of the housing 100, and a second opening 162 forming the other end of the heat dissipation passage 160 may be formed in the other side of the housing 100. The heat dissipation passage 160 may be formed as a single line defined from the first opening 161 to the second opening 162. The cross section of the heat dissipation passage 160 may be formed to correspond to the cross section of the heat dissipation member 200. For example, the heat dissipation passage 160 may be formed in a circular shape.

[0035] The heat dissipation path 160 may have at least one bent region. The heat dissipation path 160 may be arranged to overlap the electronic component 170 in the vertical direction. One side of the housing 100 where the first opening 161 is formed and the other side of the housing 100 where the second opening 162 is formed may be arranged adjacent to each other. One side of the housing 100 where the first opening 161 is formed and the other side of the housing 100 where the second opening 162 is formed may be arranged perpendicular to each other.

[0036] A protrusion 110 that protrudes upward from other areas may be formed in a region of the upper surface of the housing 100 corresponding to a region where the heat dissipation passage 160 is formed. The heat dissipation passage 160 may be formed inside the protrusion 110.

[0037] A hole 163 may be formed in a lower surface of the heat dissipation path 160 facing the electronic component 170. The hole 163 may be arranged to overlap the electronic component 170 in the vertical direction. The hole 163 may allow the space within the heat dissipation path 160 to open downward. When the heat dissipation path 160 is viewed from the side, the hole 163 may have an arc-shaped cross section. The space within the heat dissipation path 160 may be exposed downward through the hole 163. The heat dissipation member 200 may be exposed downward, facing the electronic component 170, through the hole 163.

[0038] A downwardly protruding rib (not shown) may be formed on the lower surface of the upper plate 103. The rib increases the surface area of the housing 100, thereby improving the heat dissipation efficiency of the housing 100.

[0039] A connector (not shown) may be disposed on a side surface of the housing 100. Depending on the material characteristics of the housing 100, the connector may be formed integrally with the housing 100.

[0040] The housing 100 may be made of plastic, which reduces the weight of the electronic device 10.

[0041] The housing 100 may include a guide 180. As shown in FIG. 4, the guide 180 may have a shape that protrudes downward from the lower surface of the upper plate 103. The guide 180 may be disposed outside the heat dissipation passage 160. The guide 180 may have a rectangular cross-sectional shape. The heat dissipation passage 160 may divide the guide 180 into two regions. The guide 180 may be disposed outside the region in which the hole 163 is formed in the heat dissipation passage 160. The lower surface of the guide 180 may be disposed higher than the lower surface of the heat dissipation passage 160. The lower surface of the guide 180 may be disposed higher than the lower surface of the heat dissipation member 200. However, this is merely an example, and the lower surface of the guide 180 may be disposed to form the same plane as the heat dissipation passage 160 and the lower surface of a flat surface 232 in the heat dissipation member 200, which will be described later.

[0042] A guide protrusion 182 and a first screw hole 186 may be formed on the lower surface of the guide 180. The guide protrusion 182 may have a shape that protrudes downward from the lower surface of the guide 180. A plurality of guide protrusions 182 may be provided and arranged to face each other with respect to the heat dissipation path 160. The guide protrusions 182 may be arranged in corner regions of the lower surface of the guide 180. The first screw hole 186 may have a shape that is recessed higher than other regions of the lower surface of the guide 180. A screw thread or a screw groove may be formed on an inner circumferential surface of the first screw hole 186. A plurality of first screw holes 186 may be provided and arranged to be spaced apart from each other. The plurality of first screw holes 186 may be arranged to face each other with respect to the heat dissipation path 160.

[0043] At least one electronic component may be disposed in the space 102 within the housing 100. A printed circuit board (not shown) may be disposed in the space 102 within the housing 100. The printed circuit board may be formed in a plate shape, and at least one driving component may be disposed (mounted) on one or the other surface.

[0044] An electronic component 170 may be disposed in the space 102 within the housing 100. The electronic component 170 may be mounted on the upper surface of the printed circuit board. The electronic component 170 may include a plurality of pins 172 for coupling with the printed circuit board. The electronic component 170 may include a core and a plurality of pins 172 extending from a side surface of the core. The electronic component 170 may generate heat when driven. The electronic component 170 may be disposed on the lower surface of the top plate 103 of the housing 100.

[0045] The electronic component 170 may be arranged to overlap the heat dissipation path 160 in the vertical direction. The electronic component 170 may be arranged to overlap at least a portion of the heat dissipation member 200 in the vertical direction. The electronic component 170 may be arranged to overlap the hole 163 of the heat dissipation path 160 in the vertical direction. The heat dissipation path 160 may be arranged to overlap the guide 180 in the vertical direction.

[0046] The electronic component 170 may be screw-coupled to the lower surface of the guide 180. To this end, the electronic component 170 may include a second screw hole 171 facing the first screw hole 186. Similar to the first screw hole 186, the second screw holes 171 may be provided in plurality and spaced apart from each other. When the electronic component 170 and the guide 180 are coupled together, a screw 177 may pass through the second screw hole 171 and be screw-coupled into the first screw hole 186.

[0047] The electronic device 10 may include a heat dissipation member 200. The heat dissipation member 200 may have a flow path formed therein for a refrigerant to flow therethrough. The heat dissipation member 200 may be formed in a pipe shape. The heat dissipation member 200 may have a circular cross section. The heat dissipation member 200 may be disposed within the heat dissipation passage 160. Both ends of the heat dissipation member 200 may protrude from the outer surface of the housing 100 through a first opening 161 and a second opening 162 of the heat dissipation passage 160. At least a portion of the heat dissipation member 200 may be exposed downward to the space 102 within the housing 100 through the hole 163. The heat dissipation member 200 may be disposed to face the electronic component 170 through the hole 163.

[0048] The heat dissipation member 200 may be made of a metal material, or may be integrally formed with the housing 100 made of a plastic material by insert injection molding.

[0049] A refrigerant inlet 210 for introducing the refrigerant into the flow path may be formed at one end of the heat dissipation member 200, and a refrigerant outlet 220 for discharging the refrigerant circulating through the flow path may be formed at the other end of the heat dissipation member 200. The refrigerant inlet 210 and the refrigerant outlet 220 may be arranged in parallel. The heat dissipation member 200 may be formed as a single line defined from the refrigerant inlet 210 to the refrigerant outlet 220. As described above, the region of the side of the housing 100 where the refrigerant inlet 210 is disposed and the region where the refrigerant outlet 220 is disposed may be perpendicular to each other.

[0050] The heat dissipation member 200 may have a region that is folded at least once.

[0051] In detail, the heat dissipation member 200 may include a contact portion 230 disposed between the refrigerant inlet portion 210 and the refrigerant outlet portion 220. The contact portion 230 may be bent from an end of the refrigerant inlet portion 210 and extend toward the refrigerant outlet portion 220. The contact portion 230 may be disposed to form an obtuse angle with the refrigerant inlet portion 210 or the refrigerant outlet portion 220. The contact portion 230 may be disposed to connect adjacent side surfaces of the housing 100. A first bent portion 273 may be formed between the contact portion 230 and the refrigerant inlet portion 210.

[0052] The contact portion 230 may be disposed within the heat dissipation path 160. A lower surface of the contact portion 230 may be exposed downward through the hole 163 to the space 102 within the housing 100. The lower surface of the contact portion 230 may be disposed to face the electronic component 170. A flat surface 232 may be formed on the lower surface of the contact portion 230 exposed downward through the hole 163 to the heat dissipation path 160. The heat dissipation member 200 excluding the contact portion 230 is a pipe having a circular cross section, but the cross section of the contact portion 230 forming area may not be circular due to the flat surface 232. The flat surface 232 may be formed higher than other areas of the heat dissipation member 200 with a step. The area where the flat surface 232 is formed may have a groove shape based on the lower surface of the heat dissipation member 200.

[0053] The flat surface 232 may be formed by pressing the heat dissipation member 200. The flat surface 232 may be pre-formed in the heat dissipation member 200 before the heat dissipation member 200 and the housing 100 are insert-injected.

[0054] The flat surface 232 may be formed on the lower surface of the contact portion 230 in an area facing the electronic component 170 or the heat dissipation plate 300 (described later). The flat surface 232 may be parallel to the upper or lower surface of the top plate 103 of the housing 100. The flat surface 232 may be parallel to the upper surface of the heat dissipation plate 300 or the upper surface of the electronic component 170. The flat surface 232 may be in surface contact with the upper surface of the heat dissipation plate 300 or the upper surface of the electronic component 170. An inclined surface may be formed on a surface connecting the flat surface 232 to another area within the heat dissipation member 200.

[0055] The heat dissipation member 200 may further include a connecting portion 250 in addition to the contact portion 230, and both ends of the connecting portion 250 may be connected to the contact portion 230 and the refrigerant discharge portion 220, respectively. The connecting portion 250 may be disposed perpendicular to the refrigerant inlet portion 210 or the refrigerant discharge portion 220. The connecting portion 250 may be disposed to form an obtuse angle with the contact portion 230. At least a portion of the connecting portion 250 may be disposed outside the heat dissipation passage 160.

[0056] A second bent portion 272 may be formed between the connecting portion 250 and the contact portion 230, and a third bent portion 271 may be formed between the connecting portion 250 and the refrigerant discharge portion 220. The first bent portion 273 and the second bent portion 272 may be arranged to overlap with the housing 100 in the vertical direction.

[0057] The electronic device 10 may include a heat dissipation plate 300. The heat dissipation plate 300 may be disposed between a lower surface of the guide 180 and an upper surface of the electronic component 170. The heat dissipation plate 300 may be disposed between a lower surface of the contact portion 230 exposed downward through the hole 163 and an upper surface of the electronic component 170. The heat dissipation plate 300 may be disposed between the flat surface 232 and the upper surface of the electronic component 170. The upper surface of the heat dissipation plate 300 may contact the flat surface 232 and the upper surface of the electronic component 170.

[0058] The heat dissipation plate 300 may have a plate shape and be made of a metal material. The heat dissipation plate 300 may include guide holes 310 to which the guide protrusions 182 are coupled, and third screw holes 186 disposed to face the first screw holes 186 and the second screw holes 171. When the heat dissipation plate 300 and the guide 180 are coupled, the guide protrusions 182 may be coupled to the guide holes 310. In addition, the screws 177 may pass through the second screw holes 171 and the third screw holes 186 and be screwed into the first screw holes 186.

[0059] A heat dissipation tape (not shown) made of a material with excellent thermal conductivity may be disposed between the heat dissipation plate 300 and the upper surface of the electronic component 170. The heat dissipation tape may have an adhesive material applied to one or both sides to bond the heat dissipation plate 300 and the electronic component 170 to each other.

[0060] 7, a metal plate 179 made of a metal material may be formed on the lower surface of the heat dissipation plate 300 or on the upper surface of the electronic component 170 that is in contact with the flat surface 232. The metal plate 179 may be exposed upward from the upper surface of the core in the electronic component 170 and may contact the lower surface of the heat dissipation plate 300.

[0061] According to the above structure, the heat dissipation member through which the refrigerant flows and the electronic components are in contact with each other via the heat dissipation plate, which has the advantage of improving the heat dissipation efficiency of the electronic device.

[0062] Furthermore, by integrally forming a heat dissipating member made of metal on a housing made of plastic, the weight of the electronic device can be reduced, which has the advantage of reducing the manufacturing cost.

[0063] An electronic device according to a second embodiment of the present invention will now be described.

[0064] FIG. 8 is a perspective view illustrating one side of an electronic device according to a second embodiment of the present invention, FIG. 9 is a perspective view illustrating the other side of an electronic device according to a second embodiment of the present invention, FIG. 10 is a plan view illustrating the top surface of an electronic device according to a second embodiment of the present invention, FIG. 11 is a drawing illustrating A-A' of FIG. 10, FIG. 12 is an exploded perspective view of an electronic device according to a second embodiment of the present invention, and FIG. 13 is a drawing illustrating FIG. 12 from a different angle.

[0065] 8 to 13, an electronic device 20 according to a second embodiment of the present invention may include a housing 1100, an electronic component 1170, and a heat dissipation member 1200.

[0066] The housing 1100 may form the outer shape of the electronic device 20. The housing 1100 may have a rectangular cross section. The housing 1100 may be formed in a box shape. At least one configuration for driving the electronic device 20, including the electronic components 1170, may be disposed in a space 1108 within the housing 1100. The space 1108 within the housing 1100 may be open downward. A cover (not shown) may be coupled to the bottom of the housing 1100 to cover the bottom of the space 1108.

[0067] The housing 1100 may include a top plate and side plates that are bent downward and extend from the ends of the top plate. The top plate may form the top surface of the electronic device 20. The side plates may form the sides of the electronic device 20. At least one hole or groove may be formed in the side plate. External terminals may be disposed within the housing 1100 through the holes or grooves.

[0068] A plurality of regions arranged with a step between them may be formed on the upper surface of the housing 1100. The upper surface of the housing 1100 may include a first region 1101 and a second region 1102. The upper surface of the first region 1101 may be arranged higher than the upper surface of the second region 1102. The upper surface of the second region 1102 may be arranged lower than the upper surface of the first region 1102 with a step.

[0069] A coupling groove 1110 and a hole 1112 to which the heat dissipation member 1200 (described later) is coupled may be formed on the upper surface of the second region 1102. The coupling groove 1110 may be formed to be recessed downward by a predetermined distance from the upper surface of the second region 1102. The bottom surface of the coupling groove 1110 may be formed to have a step lower than the upper surface of the second region 1102. A base 1210 of the heat dissipation member 1200 (described later) may be coupled to the coupling groove 1110. The cross-sectional shape of the coupling groove 1110 may be formed to correspond to the cross-sectional shape of the base 1210. The cross-section of the coupling groove 1110 may be approximately JPEG2025526737000002.jpg6170 may have the shape.

[0070] The hole 1112 may be formed to penetrate from the bottom surface of the coupling groove 1110 to the lower surface of the upper plate. A heat dissipation plate 1212 of the heat dissipation member 1200, which will be described later, may be disposed in the hole 1112. The hole 1112 has a diameter of approximately The cross-sectional area of the hole 1112 may be smaller than the cross-sectional area of the coupling groove 1110.

[0071] The area of the lower surface of the upper plate corresponding to the area where the coupling groove 1110 is formed may be shaped to protrude downward more than the other areas.

[0072] A connector 1190 may be disposed on a side surface of the housing 1100. The connector 1190 may be disposed to penetrate a side surface of the housing 1100. An external terminal (not shown) may be coupled to the connector 1190, and power may be supplied to the electronic device 20 or a control signal related to the operation of the electronic device 20 may be transmitted and received by coupling the external terminal. Connector pins may be disposed in a space within the connector 1190 and may be electrically connected to a printed circuit board (not shown) disposed in a space 1108 within the housing 1100. Depending on the material properties of the housing 1100, the connector 1190 may be formed integrally with the housing 1100.

[0073] A protrusion (not shown) protruding downward may be formed on the lower surface of the upper plate of the housing 1100. The protrusion increases the surface area of the housing 1100, thereby improving the heat dissipation efficiency of the housing 1100.

[0074] The housing 1100 may be made of plastic, which reduces the weight of the electronic device 20.

[0075] The housing 1100 may include an air vent structure. The air vent structure may include an air hole penetrating from the outer surface to the inner surface of the housing 1100, and a thin film 1160 disposed to cover the air hole. The hole may be disposed in the first region 1101. The thin film 1160 may be made of a breathable and waterproof material and disposed to cover the hole. The thin film 1160 may be bonded to the hole in the housing 1100 by heat sealing.

[0076] At least one electronic component may be disposed in the space 1108 inside the housing 1100. A printed circuit board (not shown) may be disposed in the space 1108 inside the housing 1100. The printed circuit board may be formed in a plate shape, and at least one component for driving may be disposed (mounted) on one or both sides. The printed circuit board may be coupled to connector pins of the connector 1190.

[0077] An electronic component 1170 may be disposed in the space 1108 within the housing 1100. The electronic component 1170 may be mounted on one side of the printed circuit board. The electronic component 1170 may include a plurality of pins 1172 for coupling to the printed circuit board. The electronic component 1170 may include a core and a plurality of pins 1172 extending from a side surface of the core. The electronic component 1170 may generate heat when driven.

[0078] The electronic components 1170 may be disposed on the underside of the top plate of the housing 1100 .

[0079] The electronic device 20 may include a heat dissipation member 1200. The heat dissipation member 1200 may be disposed such that at least a portion thereof penetrates the housing 1100. The heat dissipation member 1200 may include a main body 1220, a first pipe 1280, a second pipe 1290, and a heat dissipation plate 1212.

[0080] The main body 1220 may be disposed on the upper surface of the housing 1100. The cross section of the main body 1220 is approximately JPEG2025526737000004.jpg6170 shape. A flow path through which a refrigerant flows may be formed within the body 1220. A first opening 1232 forming one end of the flow path may be formed on one side of the body 1220, and a second opening forming the other end of the flow path may be formed on the other side of the body 1220. The first opening 1232 may be called a refrigerant inlet. The second opening may be called a refrigerant outlet.

[0081] The flow path may be formed as a single line defined from the first opening 1232 to the second opening. The flow path may have a region that is bent at least one time. The flow path may be disposed to overlap the electronic component 1170 in a vertical direction. One side of the body 1220 where the first opening 1232 is formed and the other side of the body 1220 where the second opening is formed may be disposed perpendicular to each other.

[0082] A base 1210 having a larger cross-sectional area than other regions may be formed at a lower portion of the body 1220. The base 1210 may be formed integrally with the body 1220. The cross-section of the base 1210 may be formed to correspond to the cross-sectional shape of the coupling groove 1110. The base 1210 may have a plate shape with a predetermined thickness. The base 1210 may contact the bottom surface of the coupling groove 1110.

[0083] The body 1220 and the base 1210 may be integrally formed of a metal material, or may be integrally formed with the housing 1100 made of a plastic material by insert injection molding.

[0084] The first pipe 1280 may be connected to the first opening 1232. The first pipe 1280 may have a pipe shape. A refrigerant may flow into a flow path in the main body 1220 through the first pipe 1280. The first pipe 1280 may be a refrigerant inlet.

[0085] The second pipe 1290 may be connected to the second opening. The second pipe 1290 may have a pipe shape. The refrigerant in the flow path may be discharged to the outside through the second pipe 1290. The second pipe 1290 may be a refrigerant discharge portion.

[0086] However, this is merely an example, and the second pipe 1290 may be the refrigerant inlet, and the first pipe 1280 may be the refrigerant outlet.

[0087] The first pipe 1280 and the second pipe 1290 may be arranged perpendicular to each other on the housing 1100 .

[0088] The heat dissipation plate 1212 may be coupled to the lower surface of the body 1220. The heat dissipation plate 1212 may be coupled to the lower surface of the base 1210. The cross-sectional shape of the heat dissipation plate 1212 may be formed to correspond to the cross-sectional shape of the hole 1112. The heat dissipation plate 1212 may be made of a metal material and may be integrally formed with the body 1220 and the base 1210. The lower surface of the heat dissipation plate 1212 may be disposed below the lower surface of the base 1210 with a step.

[0089] A first screw hole 1213 may be formed on the lower surface of the heat dissipation plate 1212. A plurality of the first screw holes 1213 may be provided and may be spaced apart from each other.

[0090] The electronic component 1170 may be coupled to the lower surface of the heat dissipation plate 1212. The lower surface of the heat dissipation plate 1212 may be in contact with the upper surface of the electronic component 1170. The upper surface of a core of the electronic component 1170 may be in contact with the lower surface of the heat dissipation plate 1212. The electronic component 1170 may be screwed to the heat dissipation plate 1212. A second screw hole may be formed in the electronic component 1170 in an area facing the first screw hole 1213. Therefore, when a screw 1177 passes through the second screw hole and is coupled to the first screw hole 1213, the electronic component 1170 may be screwed to the lower surface of the heat dissipation plate 1212. A plurality of second screw holes may be provided corresponding to the number of first screw holes.

[0091] In addition to the screw connection, a heat dissipation tape (not shown) made of a material with excellent thermal conductivity may be disposed between the lower surface of the heat dissipation plate 1212 and the upper surface of the electronic component 1170. The heat dissipation tape may have an adhesive applied to one or both surfaces to connect the heat dissipation plate 1212 and the electronic component 1170 to each other.

[0092] According to the above structure, the heat dissipation member through which the refrigerant flows is in direct contact with the electronic components, which has the advantage of improving heat dissipation efficiency.

[0093] Furthermore, by integrally forming a heat dissipating member made of metal on a plastic housing, the weight of the electronic device can be reduced, which has the advantage of reducing the manufacturing cost.

[0094] Although all components constituting the embodiments of the present invention have been described above as being combined or operating in combination, the present invention is not necessarily limited to such embodiments. That is, all components may be selectively combined and operate in combination as long as it is within the scope of the present invention. Furthermore, unless otherwise specified, the terms "comprise," "comprise," "have," etc., used above, mean that the corresponding component may be present within the context, and should be interpreted as including other components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as dictionary-defined terms, should be interpreted in accordance with the context of the relevant art and should not be interpreted as idealized or overly formal unless expressly defined in the present invention.

[0095] The above description merely exemplifies the technical concept of the present invention, and various modifications and variations may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed herein are for illustrative purposes only and are not intended to limit the technical concept of the present invention. The scope of the present invention should be interpreted by the following claims, and all technical concepts within the scope equivalent thereto should be interpreted as being within the scope of the present invention.

Claims

1. a housing having a space formed therein and including a heat dissipation passage passing through from one side to the other side; an electronic component disposed in the space; a heat dissipation member disposed in the heat dissipation passage and having a refrigerant flowing therethrough, the heat dissipation path includes a hole facing the electronic component; The heat dissipation member is arranged so that at least a portion of the heat dissipation member overlaps the electronic component in the vertical direction through the hole.

2. The housing is made of plastic, The electronic device according to claim 1 , wherein the heat dissipation member is made of a metal.

3. The electronic device according to claim 2 , wherein the housing and the heat dissipation member are integrally formed by insert injection.

4. The electronic device according to claim 1 , wherein a lower surface of the heat dissipation member facing the electronic component is a flat surface.

5. The electronic device of claim 1 , further comprising a heat dissipation plate having an upper surface in contact with the heat dissipation passage and a lower surface in contact with the electronic component.

6. The electronic device according to claim 5 , wherein the heat sink plate is screwed to an inner surface of the housing.

7. The inner surface of the housing includes a guide that protrudes from other areas and to which the heat dissipation plate is coupled, The electronic device according to claim 6 , wherein the guide is divided into a plurality of regions by the heat dissipation passage.

8. The electronic device according to claim 7 , wherein the plurality of regions are screw-coupled to the heat sink plate and the electronic component, respectively.

9. The electronic device of claim 5 , wherein an area of the top surface of the electronic component that contacts the heat sink plate includes a metal material.

10. The electronic device according to claim 1 , wherein a protrusion is formed in an area of the upper surface of the housing corresponding to an area where the heat dissipation passage is formed, the protrusion protruding upward from other areas.

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