Evaporation mask for OLED pixel deposition

Abstract

The deposition mask according to the embodiment includes a metal plate including a deposition region and a non-deposition region, the deposition region including at least one effective portion, the effective portion including a plurality of unit through holes, the unit through holes including a small-area hole formed on a first surface of the metal plate, a large-area hole formed on a second surface of the metal plate, and a connecting portion connecting the small-area hole and the large-area hole, the unit through holes having a first width defined by a width in a first direction and a second width defined by a width in a second direction, the first width and the second width being different from each other, a rib being disposed between adjacent unit through holes in the first direction, and an island portion being disposed between adjacent unit through holes in the second direction, the height of the large-area hole in the second direction being greater than the height of the large-area hole in the first direction, and the height of the small-area hole of the unit through hole in the second direction being smaller than the height of the small-area hole of the unit through hole in the first direction.

Description

[Technical Field]

[0001] The example relates to a deposition mask for OLED pixel deposition. [Background technology]

[0002] Display devices are applied to a variety of devices. For example, the display devices are applied to small devices such as smartphones or tablet PCs. Alternatively, the display devices are applied to large devices such as TVs, monitors, and public displays (PDs). Recently, there has been an increasing demand for ultra-high resolution (UHD) of 500 pixels per inch (PPI) or more. As a result, display devices with high resolution are being applied to both small and large devices.

[0003] Display devices are classified into liquid crystal displays (LCDs) and organic light emitting diodes (OLEDs) depending on their driving methods.

[0004] The LCD is a display device driven by using liquid crystal, and the OLED is a display device driven by using organic materials.

[0005] OLEDs can display an infinite contrast ratio, have a response speed 1000 times faster than LCDs, and have a wide viewing angle, making them a promising display device that can replace LCDs.

[0006] The OLED includes an emitting layer. The emitting layer includes an organic material. The organic material is deposited on a substrate using a deposition mask. The deposition mask can include an open mask (OM) or a fine metal mask (FMM). A deposition pattern corresponding to the pattern formed on the deposition mask is formed on the substrate. As a result, the deposition pattern can function as a pixel.

[0007] The open mask is a thin plate that forms a deposition pattern only in specific locations when manufacturing an OLED. The open mask is used in the deposition process to form an emitting layer on a backplane after the backplane is completed during the display manufacturing process. That is, the open mask is a mask that does not block any areas within the display's operating range in order to deposit the entire surface of the display. Therefore, the open mask is used when depositing an emitting layer with a single color emitting material.

[0008] On the other hand, a fine metal mask is used to create different colors for each sub-pixel of the light-emitting layer. Therefore, the fine metal mask contains ultra-fine holes. The process using the fine metal mask requires multiple deposition steps. Therefore, the process requires precise alignment. Therefore, the process using the fine metal mask is more difficult than the process using an open mask.

[0009] When the OLED light-emitting layer is deposited using an open mask, only one color light-emitting layer is formed. Therefore, a separate color filter (C / F) is required to realize various colors. On the other hand, when the fine metal mask is used, RGB light-emitting layers can be formed. Therefore, a separate color filter is not required. In other words, the technology using the fine metal mask is difficult. However, compared to the method using an open mask, light efficiency is better because a filter that blocks light is not required.

[0010] The fine metal mask is generally manufactured using an Invar alloy metal plate containing iron (Fe) and nickel (Ni). Through holes are formed on one side and the other side of the metal plate, penetrating the one side and the other side. The through holes are formed at positions corresponding to pixel patterns. As a result, red, green, and blue organic materials pass through the through holes in the metal plate and are deposited on the substrate. As a result, pixel patterns are formed on the substrate.

[0011] The fine metal mask includes a small-area hole formed on one side of a metal plate and a large-area hole formed on the other side of the metal plate, and the small-area hole and the large-area hole are connected by a connecting portion to form the through hole.

[0012] The organic material is sprayed toward the fine metal mask, and is deposited on the deposition substrate through the large-area holes as an inlet and the small-area holes as an outlet.

[0013] The through-holes have different angles on the inner surface of the large-area holes depending on the direction, so if the small-area holes are formed with the same height in all directions, the efficiency of organic material deposition will decrease.

[0014] Furthermore, if the small area holes are formed so that their heights differ in different directions, the strength of the fine metal mask will differ in different directions, which may cause the fine metal mask to warp in one direction.

[0015] Therefore, a deposition mask having a new structure and a method for manufacturing the same that can solve the above problems is required. Summary of the Invention [Problem to be solved by the invention]

[0016] The embodiments provide a deposition mask for OLED pixel deposition with improved deposition efficiency and rigidity. [Means for solving the problem]

[0017] The deposition mask according to the embodiment includes a metal plate including a deposition region and a non-deposition region, the deposition region including at least one effective portion, the effective portion including a plurality of unit through holes, the unit through holes including a small-area hole formed on a first surface of the metal plate, a large-area hole formed on a second surface of the metal plate, and a connecting portion connecting the small-area hole and the large-area hole, the unit through holes having a first width defined by a width in a first direction and a second width defined by a width in a second direction, the first width and the second width being different from each other, a rib being disposed between adjacent unit through holes in the first direction, and an island portion being disposed between adjacent unit through holes in the second direction, the height of the large-area hole in the second direction being greater than the height of the large-area hole in the first direction, and the height of the small-area hole of the unit through hole in the second direction being smaller than the height of the small-area hole of the unit through hole in the first direction. [Effects of the Invention]

[0018] The deposition mask according to the first embodiment includes a unit through-hole, which has different widths in a first direction and a second direction.

[0019] Therefore, the large-area holes of the unit through-holes have different heights and inclination angles in the first and second directions, which reduces the deposition efficiency of the deposition mask. Also, the strength of the deposition mask varies depending on the direction, which can cause the deposition mask to warp in one direction.

[0020] Therefore, the height of the small-area holes is made to vary depending on the direction. Specifically, the height of the small-area holes is greater in the direction in which the height of the large-area holes is smaller. Also, the height of the small-area holes is smaller in the direction in which the height of the large-area holes is larger. This prevents the strength of the deposition mask from varying depending on the direction.

[0021] The height of the small-area holes is greater in a direction in which the inclination angle of the large-area holes is smaller, and the height of the small-area holes is smaller in a direction in which the inclination angle of the large-area holes is larger, thereby improving deposition uniformity of the deposition mask.

[0022] Therefore, the deposition mask according to the first embodiment has improved deposition efficiency and reliability.

[0023] The deposition mask according to the second embodiment includes unit through holes, each having a different width in the first direction and the second direction, and a rib having a different width in the first direction and the second direction is disposed between adjacent unit through holes.

[0024] This reduces the uniformity of deposition of the deposition mask, and the strength of the deposition mask varies depending on the direction.

[0025] Therefore, the heights of the small-area holes and the large-area holes are made to differ depending on the direction. Specifically, the height of the large-area holes is small in the direction in which the rib width is small. The height of the small-area holes is large in the direction in which the rib width is small. The height of the large-area holes is large in the direction in which the rib width is large. The height of the small-area holes is small in the direction in which the rib width is large.

[0026] This prevents the strength of the deposition mask from varying depending on the direction, and allows a sufficient amount of organic material to be accommodated in the large-area holes having a large width of the ribs.

[0027] Therefore, the deposition mask according to the second embodiment has improved deposition efficiency and reliability.

[0028] The deposition mask according to the third embodiment includes unit through holes having different widths in a third direction and a fourth direction, and island portions having different widths and / or areas in the third direction and the fourth direction are disposed between adjacent unit through holes.

[0029] This reduces the uniformity of deposition of the deposition mask, and the strength of the deposition mask varies depending on the direction.

[0030] Therefore, the heights of the small-area holes and the large-area holes are made to differ depending on the direction. Specifically, the height of the large-area holes is smaller in the direction in which the width and / or area of the island portion is smaller. The height of the small-area holes is larger in the direction in which the width and / or area of the island portion is smaller. The height of the large-area holes is larger in the direction in which the width and / or area of the island portion is larger. The height of the small-area holes is smaller in the direction in which the width and / or area of the island portion is larger.

[0031] This prevents the strength of the deposition mask from varying depending on the direction, and allows a sufficient amount of organic material to be accommodated in the large-area holes having a large width and / or area of the island portion.

[0032] Therefore, the deposition mask according to the third embodiment has improved deposition efficiency and reliability. [Brief explanation of the drawings]

[0033] [Figure 1] FIG. 1 is a diagram illustrating the combination of a deposition mask and a frame according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view of an organic vapor deposition apparatus including a vapor deposition mask according to the embodiment. [Figure 3] FIG. 3 is a diagram illustrating that a deposition pattern is formed on a deposition substrate by through holes of a deposition mask according to an embodiment. [Figure 4]FIG. 4 is a plan view of the deposition mask according to the embodiment. [Figure 5] FIG. 5 is a plan view of an effective portion of the deposition mask according to the first embodiment. [Figure 6] FIG. 6 is a cross-sectional view taken along the line AA' in FIG. [Figure 7] FIG. 7 is a cross-sectional view taken along the line BB' in FIG. [Figure 8] FIG. 8 is a diagram for comparing FIG. 6 and FIG. [Figure 9] FIG. 9 is a plan view of an effective portion of an evaporation mask according to a second embodiment. [Figure 10] FIG. 10 is a cross-sectional view taken along the line CC' in FIG. [Figure 11] FIG. 11 is a cross-sectional view taken along the line DD' in FIG. [Figure 12] FIG. 12 is a diagram for comparing FIG. 10 and FIG. [Figure 13] FIG. 13 is a plan view of an effective portion of an evaporation mask according to a third embodiment. [Figure 14] FIG. 14 is a cross-sectional view taken along the line EE' in FIG. [Figure 15] FIG. 15 is a cross-sectional view taken along the line FF' in FIG. [Figure 16] FIG. 16 is a diagram for comparing FIG. 14 and FIG. [Figure 17] FIG. 17 is a plan view of an effective portion of an evaporation mask according to a fourth embodiment. [Figure 18] FIG. 18 is a cross-sectional view taken along the line GG' in FIG. [Figure 19] FIG. 19 is a cross-sectional view taken along the line HH' in FIG. [Figure 20] FIG. 20 is a cross-sectional view taken along the line II' in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0034] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that the technical concept of the present invention is not limited to the described embodiments, but may be embodied in various forms, and the components of the embodiments may be selectively combined or substituted within the scope of the technical concept of the present invention. Furthermore, terms (including technical and scientific terms) used in the embodiments of the present invention should be interpreted as meanings that are commonly understood by those skilled in the art to which the present invention pertains, unless otherwise expressly specified. Generally used terms, such as dictionary-defined terms, should be interpreted in light of the context of the relevant technology.

[0035] Furthermore, terms used in the examples of the present invention are intended to explain the examples and are not intended to limit the present invention. In this specification, the singular form can also include the plural form unless otherwise specified, and when it is described as "A and at least one (or one or more) of B and C," it can include one or more of all possible combinations of A, B, and C.

[0036] Furthermore, in describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. are used to distinguish the components from other components, and the terms do not limit the essence or order of the components.

[0037] Furthermore, when a component is described as being "coupled," "coupled," or "connected" to another component, this includes both cases where the component is directly coupled or connected to the other component, and cases where other components are further "coupled," "coupled," or "connected" between the components.

[0038] Furthermore, when it is described as being formed or positioned "above or below" each component, "above or below" does not only include cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or positioned between the two components.

[0039] Furthermore, when the expression "above or below" is used, it can mean not only an upward direction but also a downward direction with respect to one component.

[0040] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, deposition masks according to embodiments will be described with reference to the drawings.

[0041] The deposition mask described below is a fine metal mask (FMM) that can form an RGB pixel pattern on a deposition substrate by depositing red, green, and blue organic materials on the deposition substrate. The following description does not apply to an open mask (OM).

[0042] 1 to 3 are diagrams illustrating a process of depositing an organic material on a deposition substrate 300 using a deposition mask 100 according to the embodiment.

[0043] Fig. 1 is a diagram illustrating the combination of a deposition mask and a frame according to an embodiment, Fig. 2 is a cross-sectional view of an organic material deposition apparatus including a deposition mask according to an embodiment, and Fig. 3 is a diagram illustrating that a deposition pattern is formed on the deposition substrate through through-holes of the deposition mask.

[0044] 1 and 2, the organic material deposition apparatus includes a deposition mask 100, a mask frame 200, a deposition substrate 300, an organic material deposition vessel 400, and a vacuum chamber 500.

[0045] The deposition mask 100 includes a metal. For example, the deposition mask includes iron (Fe) and nickel (Ni). More specifically, the deposition mask includes an Invar alloy including iron (Fe) and nickel (Ni).

[0046] The deposition mask 100 includes a plurality of through holes TH. The through holes are arranged in an effective portion. The through holes are arranged to correspond to pixel patterns to be formed on a deposition substrate. The deposition mask 100 includes an ineffective portion other than an effective portion including a deposition region.

[0047] The mask frame 200 includes openings 205. The through-holes are disposed in regions corresponding to the openings 205. Thus, the organic material supplied from the organic material deposition container 400 is deposited on the deposition substrate 300. The deposition mask 100 is disposed on and fixed to the mask frame 200. For example, the deposition mask 100 is stretched with a set tension. The deposition mask 100 is also welded and fixed to the mask frame 200.

[0048] For example, the ineffective portion of the deposition mask 100 is welded, so that the deposition mask 100 is fixed on the mask frame 200. Then, the portion of the mask frame 200 that protrudes outward is cut off and removed.

[0049] The mask frame 200 includes a metal having high rigidity, which reduces deformation of the mask frame during the welding process.

[0050] The deposition substrate 300 is a substrate used when manufacturing a display device. For example, an OLED pixel pattern is formed on the deposition substrate 300. Organic patterns of red, green, and blue are formed on the deposition substrate 300 to form pixels of the three primary colors of light. That is, an RGB pattern is formed on the deposition substrate 300.

[0051] The organic material deposition container 400 is a crucible. An organic material is placed inside the crucible. The organic material deposition container 400 moves within the vacuum chamber 500. That is, the organic material deposition container 400 moves in one direction within the vacuum chamber 500. For example, the organic material deposition container 400 moves in the width direction of the deposition mask 100 within the vacuum chamber 500.

[0052] A heat source and / or an electric current is supplied to the organic material deposition chamber 400, so that the organic material is deposited on the deposition substrate 300.

[0053] 3, the deposition mask 100 includes a metal plate 10. The metal plate includes a first surface 1S and a second surface 2S. The first surface 1S and the second surface 2S are opposite to each other.

[0054] The first surface 1S includes small-area holes V1, and the second surface 2S includes large-area holes V2. For example, the first surface 1S and the second surface 2S are respectively formed with a plurality of small-area holes V1 and a plurality of large-area holes V2.

[0055] The deposition mask 100 also includes through holes TH, which are formed by connecting portions CA that connect the boundaries of the small-area holes V1 and the large-area holes V2.

[0056] The width of the large-area hole V2 is larger than the width of the small-area hole V1. The width of the small-area hole V1 is measured on a first surface 1S of the deposition mask 100. The width of the large-area hole V2 is measured on a second surface 2S of the deposition mask 100.

[0057] Additionally, the width of the connecting portion CA has a predetermined size. Specifically, the width of the connecting portion CA may be 15 μm to 33 μm. More specifically, the width of the connecting portion CA may be 19 μm to 33 μm. Even more specifically, the width of the connecting portion CA may be 20 μm to 27 μm. If the width of the connecting portion CA exceeds 33 μm, it becomes difficult to realize a resolution of 500 PPI or higher. Furthermore, if the width of the connecting portion CA is less than 15 μm, defects may occur during the deposition process.

[0058] The small area holes V1 face the deposition substrate 300. The small area holes V1 are disposed close to the deposition substrate 300. Therefore, the small area holes V1 have a shape corresponding to the deposition pattern DP.

[0059] The large-area hole V2 faces the organic material deposition container 400. Therefore, the organic material supplied from the organic material deposition container 400 is accommodated in a wide area by the large-area hole V2. In addition, a fine pattern can be quickly formed on the deposition substrate 300 through the small-area hole V1.

[0060] As a result, the organic material accommodated in the large-area holes V2 is deposited on the deposition substrate 300 through the small-area holes V1. As a result, one of red, green, and blue pixel patterns is formed on the deposition substrate 300. Then, the above process is repeated. As a result, all of red, green, and blue pixel patterns are formed on the deposition substrate 300.

[0061] FIG. 4 is a plan view of an evaporation mask 100 according to an embodiment.

[0062] Referring to FIG. 4, the deposition mask 100 includes a deposition area DA and a non-deposition area NDA.

[0063] The deposition area DA is an area for forming a deposition pattern. The deposition area DA includes a patterned area and a non-patterned area. The patterned area includes small-area holes V1, large-area holes V2, through-holes TH, and island portions IS. The non-patterned area does not include small-area holes V1, large-area holes V2, through-holes TH, or island portions IS.

[0064] The deposition area DA includes a plurality of effective portions AA1, AA2, and AA3. The effective portions can form a plurality of deposition patterns. Specifically, the pattern area includes the plurality of effective portions AA1, AA2, and AA3.

[0065] The deposition area DA includes a plurality of isolation regions IA1 and IA2. The isolation regions IA1 and IA2 are disposed between adjacent effective portions. The isolation regions IA1 and IA2 are separation regions between the effective portions. The isolation regions IA1 and IA2 can distinguish the adjacent effective portions from each other. Furthermore, one deposition mask 100 can support a plurality of effective portions.

[0066] The non-deposition area NDA is an area that is not involved in deposition. The non-deposition area NDA includes frame fixing areas FA1 and FA2. The frame fixing areas FA1 and FA2 are areas for fixing the deposition mask 100 to the mask frame 200. The non-deposition area NDA may also include half-etched portions HF1 and HF2 and an open portion.

[0067] The half-etched portions HF1 and HF2 can disperse stress generated when the deposition mask 100 is stretched.

[0068] In addition, the open portions can disperse stress generated when the deposition mask 100 is stretched, thereby reducing deformation of the deposition mask.

[0069] As described above, the deposition mask 100 includes the through-holes, which are passages through which the organic material moves.

[0070] The through-holes are formed by small-area holes, large-area holes, and connecting portions. When the large-area holes have an asymmetric shape with multiple widths, the inclination angle of the inner surface of the large-area holes varies from region to region. That is, the inner surface of the large-area holes in the long-width direction has a different inclination angle from the inner surface of the large-area holes in the short-width direction. As a result, when the height of the small-area holes is the same, the deposition rates in the short-width direction and the long-width direction differ. This reduces the deposition efficiency of the deposition mask.

[0071] Furthermore, when the large-area holes have an asymmetric shape having a plurality of widths, the height of the large-area holes in the long width direction is different from the height of the large-area holes in the short width direction, which causes the strength of the deposition mask to differ between the long width direction and the short width direction, which may cause the deposition mask to warp in one direction.

[0072] Furthermore, when the large-area hole has an asymmetric shape having multiple widths, the remaining area of the metal plate in the long width direction differs from the remaining area of the metal plate in the short width direction, which causes the strength of the deposition mask to differ between the long width direction and the short width direction, which may cause the deposition mask to warp in one direction.

[0073] A deposition mask that can solve the above problems will now be described.

[0074] An evaporation mask according to a first embodiment will be described with reference to FIGS.

[0075] 5 to 8, the deposition mask 100 includes a plurality of through holes. Specifically, the deposition mask 100 includes a plurality of unit through holes UTH. Each unit through hole UTH is formed by a small-area hole V1, a large-area hole V2, and a connecting portion CA.

[0076] Each unit through hole UTH has a first width W1 in a first direction 1D and a second width W2 in a second direction 2D. The first direction 1D and the second direction 2D may be the length direction or width direction of the deposition mask 100. For example, the first direction 1D may be the length direction of the deposition mask 100. The second direction 2D may be the width direction of the deposition mask 100. The width is defined as the width of a large area hole.

[0077] The first width W1 and the second width W2 are different from each other. For example, the first width W1 is greater than the second width W2. Thus, each unit through hole UTH has a long width in the first direction and a short width in the second direction.

[0078] Ribs RB and island portions IS are arranged between the plurality of unit through-holes UTH. The ribs RB are areas where the metal plate 10 is partially etched. The island portions IS are areas where the metal plate 10 is not etched. The thickness of the island portions IS is the same as the thickness of the non-deposition areas NDA of the metal plate 10.

[0079] The ribs RB are disposed between unit through-holes UTH adjacent to each other in the first direction 1D, and the island portions IS are disposed between unit through-holes UTH adjacent to each other in the second direction 2D.

[0080] Therefore, the unit through-hole UTH has a first large-area hole height H1-1 and a second large-area hole height H1-2. The first large-area hole height H1-1 is the height in the first direction 1D. The second large-area hole height H1-2 is the height in the second direction 2D. The first large-area hole height H1-1 and the second large-area hole height H1-2 are different. The first large-area hole height H1-1 is the height from the connecting portion CA to the rib RB. The second large-area hole height H1-2 is the height from the connecting portion CA to the island portion IS.

[0081] The rib RB is a region where the metal plate 10 is partially etched. Therefore, the height H1-2 of the second large area hole is greater than the height H1-1 of the first large area hole.

[0082] The large-area hole V2 has an inner surface. Although the inner surface of the large-area hole V2 is illustrated as being curved in Figures 6 and 7, the embodiment is not limited thereto. For example, the inner surface of the large-area hole V2 may be formed as a flat surface.

[0083] The large-area hole V2 includes a plurality of inner surfaces defined by directions. Referring to Fig. 6, the large-area hole V2 includes a first inner surface ES1 facing the first direction. Referring to Fig. 7, the large-area hole V2 includes a second inner surface ES2 facing the second direction.

[0084] The first inner surface ES1 and the second inner surface ES2 each have an inclination angle. An imaginary line is defined connecting one end of the connecting portion CA and one end of the large-area hole V2. The inclination angle is defined as an acute angle formed by the imaginary line and an extension of the connecting portion CA.

[0085] The first inner surface ES1 has a first inclination angle θ1. The second inner surface ES2 has a second inclination angle θ2. The first inclination angle θ1 and the second inclination angle θ2 are different. For example, the second inclination angle θ2 may be greater than the first inclination angle θ1. That is, because the height H1-2 of the second large-area hole is greater than the height H1-1 of the first large-area hole, the second inclination angle θ2 may be greater than the first inclination angle θ1.

[0086] The height H1-2 of the second large area hole is greater than the height H1-1 of the first large area hole, and the second inclination angle θ2 is greater than the first inclination angle θ1.

[0087] As a result, the angles of the organic material entering the large-area holes in the first direction and the organic material entering the large-area holes in the second direction differ. Also, the amounts of the organic material entering the large-area holes in the first direction and the large-area holes in the second direction differ. Therefore, even if the heights of the small-area holes in the first and second directions are the same, the organic layer deposited on the deposition substrate will have different thicknesses in each direction. This reduces the deposition efficiency of the deposition mask.

[0088] In addition, since the heights of the large-area holes in the first direction and the second direction are different, the remaining areas of the metal plate in the first direction and the second direction are different. Therefore, the strength of the deposition mask is different in the first direction and the second direction. As a result, the strength of the deposition mask is different depending on the direction, and the deposition mask may be warped in one direction.

[0089] In order to solve the above-mentioned problems, the deposition mask according to the first embodiment forms the small area holes in the first direction and the small area holes in the second direction so that their heights are different.

[0090] 6 to 8, the unit through hole UTH has a first small area hole height H2-1 and a second small area hole height H2-2. The first small area hole height H2-1 is the height in the first direction 1D. The second small area hole height H2-2 is the height in the second direction 2D. The first small area hole height H2-1 and the second small area hole height H2-2 are different. The first small area hole height H2-1 and the second small area hole height H2-2 are each defined as the height from the connecting portion CA to the first surface 1S of the metal plate.

[0091] Specifically, the height H2-2 of the second small area hole is smaller than the height H2-1 of the first small area hole.

[0092] Specifically, the height H2-1 of the first small area hole and the height H2-2 of the second small area hole may be 1 μm to 5 μm. More specifically, the height H2-1 of the first small area hole and the height H2-2 of the second small area hole may be 1 μm to 4 μm. Even more specifically, the height H2-1 of the first small area hole and the height H2-2 of the second small area hole may be 1 μm to 3 μm.

[0093] As a result, the distance between one surface of the deposition mask 100 and the deposition substrate is reduced, thereby reducing deposition defects due to a shadow effect. For example, when forming RGB patterns using the deposition mask 100, it is possible to prevent other deposition materials from being deposited in the areas between adjacent patterns.

[0094] Within this range, the height H2-2 of the second small area hole is smaller than the height H2-1 of the first small area hole.

[0095] Therefore, the height H1-1 of the first large area hole is smaller than the height H1-2 of the second large area hole, and the height H2-1 of the first small area hole is larger than the height H2-2 of the second small area hole.

[0096] As a result, the strength of the deposition mask can be uniform in the first direction and the second direction. This prevents the deposition mask from warping in one direction. That is, the areas of the metal plate remaining on the upper and lower parts of the metal plate in the first and second directions are substantially the same. This allows the strength of the metal plate to be uniform regardless of direction.

[0097] Furthermore, the first inclination angle is smaller than the second inclination angle, but the height of the first small area hole is greater than the height of the second small area hole.

[0098] This prevents the deposition of the deposition mask from being different in the first direction and the second direction, thereby improving the deposition efficiency of the deposition mask.

[0099] The deposition mask according to the first embodiment includes a unit through-hole, which has different widths in a first direction and a second direction.

[0100] Therefore, the large-area holes of the unit through-holes have different heights and inclination angles in the first and second directions, which reduces the deposition efficiency of the deposition mask. Also, the strength of the deposition mask varies depending on the direction, which can cause the deposition mask to warp in one direction.

[0101] Therefore, in the deposition mask according to the first embodiment, the height of the small-area holes is made to vary depending on the direction. Specifically, the height of the small-area holes is greater in the direction in which the height of the large-area holes is smaller. Also, the height of the small-area holes is smaller in the direction in which the height of the large-area holes is larger. This prevents the strength of the deposition mask from varying depending on the direction.

[0102] The height of the small-area holes is greater in a direction in which the inclination angle of the large-area holes is smaller, and the height of the small-area holes is smaller in a direction in which the inclination angle of the large-area holes is larger, thereby improving deposition uniformity of the deposition mask.

[0103] Therefore, the deposition mask according to the first embodiment has improved deposition efficiency and reliability.

[0104] Meanwhile, in the above description, the ribs are arranged between adjacent unit through holes in the long width direction of the unit through holes, and the island portions are arranged between adjacent unit through holes in the short width direction of the unit through holes, but the embodiments are not limited to this.

[0105] That is, an island portion may be disposed between adjacent unit through holes in the long width direction of the unit through holes, and a rib may be disposed between adjacent unit through holes in the short width direction of the unit through holes.

[0106] In this case, the height H2-1 of the first small area hole is smaller than the height H2-2 of the second small area hole. Also, the above-mentioned effects can be achieved by making the first inclination angle θ1 larger than the second inclination angle θ2.

[0107] Hereinafter, a deposition mask according to a second embodiment will be described with reference to FIGS. 9 to 12. In the description of the deposition mask according to the second embodiment, descriptions of parts that are the same as or similar to those of the deposition mask according to the first embodiment will be omitted. In addition, the same reference numerals will be used to designate the same components as those of the deposition mask according to the first embodiment.

[0108] 9 to 12, the deposition mask 100 includes a plurality of through holes. Specifically, the deposition mask 100 includes a plurality of unit through holes UTH. Each unit through hole UTH is formed by a small-area hole V1, a large-area hole V2, and a connecting portion CA.

[0109] Each unit through hole UTH has a first width W1 in a first direction 1D and a second width W2 in a second direction 2D. The first direction 1D and the second direction 2D may be the length direction or width direction of the deposition mask 100. For example, the first direction 1D may be the length direction of the deposition mask 100. The second direction 2D may be the width direction of the deposition mask 100. The width is defined as the width of a large area hole.

[0110] The first width W1 and the second width W2 are different from each other. For example, the first width W1 is greater than the second width W2. Thus, each unit through hole UTH has a long width in the first direction and a short width in the second direction.

[0111] Ribs RB and island portions IS are arranged between the plurality of unit through-holes UTH. The ribs RB are areas where the metal plate 10 is partially etched, and the island portions IS are areas where the metal plate 10 is not etched.

[0112] A first rib RB1 is disposed between unit through holes UTH adjacent to each other in the first direction 1D. A second rib RB2 is disposed between unit through holes UTH adjacent to each other in the second direction 2D. An island portion IS is disposed between unit through holes UTH adjacent to each other in the third direction 3D. Here, the third direction 3D is a direction between the first direction 1D and the second direction 2D.

[0113] The first rib RB1 and the second rib RB2 connect the adjacent island portions IS.

[0114] The first rib RB1 and the second rib RB2 extend in different directions. Specifically, the first rib RB1 extends in the second direction 2D, and the second rib RB2 extends in the first direction 1D.

[0115] The width W3 of the large-area hole V2 between the first ribs RB1 is different from the width W4 of the large-area hole V2 between the second ribs RB2. Specifically, the width W3 of the large-area hole V2 between the first ribs RB1 is larger than the width W4 of the large-area hole V2 between the second ribs RB2.

[0116] As a result, the amount of organic material entering the large-area holes in the first direction differs from the amount of organic material entering the large-area holes in the second direction. Therefore, even if the heights of the small-area holes in the first direction and the second direction are the same, the organic layer deposited on the deposition substrate has different thicknesses in each direction. This reduces the deposition efficiency of the deposition mask.

[0117] In addition, since the width of the large-area holes between the first ribs in the second direction is different from the width of the large-area holes between the second ribs in the first direction, the remaining areas of the metal plate in the first direction are different from those in the second direction. Therefore, the strength of the deposition mask is different in the first direction and the second direction. As a result, the strength of the deposition mask is different depending on the direction, and the deposition mask may warp in one direction.

[0118] In order to solve the above-mentioned problems, the deposition mask according to the second embodiment makes the heights of the large area holes and the small area holes different from each other in the first direction and the second direction.

[0119] 10 to 12, the unit through-hole UTH has a first large-area hole height H1-1 and a second large-area hole height H1-2. The first large-area hole height H1-1 is the height in the first direction. The second large-area hole height H1-2 is the height in the second direction. The first large-area hole height H1-1 is the height from the connecting portion CA to the first rib RB1. The second large-area hole height H1-2 is the height from the connecting portion CA to the second rib RB2.

[0120] The height H1-1 of the first large-area hole is different from the height H1-2 of the second large-area hole, and more specifically, the height H1-2 of the second large-area hole is greater than the height H1-1 of the first large-area hole.

[0121] As a result, the unit through-hole can accommodate a sufficient amount of organic material in the large-area hole in the second direction. That is, the width W4 of the large-area hole between the second ribs RB2 is greater than the width W3 of the large-area hole between the first ribs RB1. Therefore, the area of the large-area hole in the second direction 2D that accommodates the organic material is reduced due to the width of the large-area hole between the second ribs RB2. Therefore, the height H1-2 of the second large-area hole is made greater than the height H1-1 of the first large-area hole. As a result, the area of the large-area hole in the second direction 2D that accommodates the organic material can be secured.

[0122] 10 to 12, the unit through hole UTH has a first small area hole height H2-1 and a second small area hole height H2-2. The first small area hole height H2-1 is the height in the first direction 1D. The second small area hole height H2-2 is the height in the second direction 2D. The first small area hole height H2-1 and the second small area hole height H2-2 are different. The first small area hole height H2-1 and the second small area hole height H2-2 are each the height from the connecting portion CA to the first surface 1S of the metal plate.

[0123] Specifically, the height H2-2 of the second small area hole is smaller than the height H2-1 of the first small area hole.

[0124] Specifically, the height H2-1 of the first small area hole and the height H2-2 of the second small area hole may be 1 μm to 5 μm. More specifically, the height H2-1 of the first small area hole and the height H2-2 of the second small area hole may be 1 μm to 4 μm. Even more specifically, the height H2-1 of the first small area hole and the height H2-2 of the second small area hole may be 1 μm to 3 μm.

[0125] Within this range, the height H2-2 of the second small area hole is smaller than the height H2-1 of the first small area hole.

[0126] Therefore, the width W3 of the large-area holes between the first ribs RB1 in the first direction 1D is greater than the width W4 of the large-area holes between the second ribs RB2 in the second direction 2D. Also, the height H2-1 of the first small-area holes is greater than the height H2-2 of the second small-area holes.

[0127] As a result, the strength of the deposition mask can be uniform in the first and second directions. This prevents the deposition mask from warping in one direction. That is, the areas of the metal plate remaining on the upper and lower parts of the metal plate in the first and second directions are substantially the same. This allows the strength of the metal plate to be uniform regardless of direction.

[0128] The deposition mask according to the second embodiment includes unit through holes, each having a different width in the first direction and the second direction, and a rib having a different width in the first direction and the second direction is disposed between adjacent unit through holes.

[0129] This reduces the uniformity of deposition of the deposition mask, and the strength of the deposition mask varies depending on the direction.

[0130] Therefore, the heights of the small-area holes and the large-area holes are made to differ depending on the direction. Specifically, the height of the large-area holes is small in the direction in which the rib width is small. The height of the small-area holes is large in the direction in which the rib width is small. The height of the large-area holes is large in the direction in which the rib width is large. The height of the small-area holes is small in the direction in which the rib width is large.

[0131] This prevents the strength of the deposition mask from varying depending on the direction, and allows a sufficient amount of organic material to be accommodated in the large-area holes having a large width of the ribs.

[0132] Therefore, the deposition mask according to the second embodiment has improved deposition efficiency and reliability.

[0133] Hereinafter, a deposition mask according to a third embodiment will be described with reference to FIGS. 13 to 16. In the description of the deposition mask according to the third embodiment, descriptions that are the same as or similar to the deposition masks according to the previous embodiments will be omitted. In addition, the same reference numerals will be used to designate the same components as those of the deposition mask according to the previous embodiments.

[0134] 13 to 16, the deposition mask 100 includes a plurality of through holes. Specifically, the deposition mask 100 includes a plurality of unit through holes UTH. Each unit through hole UTH is formed by a small-area hole V1, a large-area hole V2, and a connecting portion CA.

[0135] Each unit through hole UTH has a first width W1 in a third direction 3D and a second width W2 in a fourth direction 4D. The third direction 3D is one diagonal direction of the deposition mask 100. The fourth direction 4D is the other diagonal direction of the deposition mask 100. The widths are defined as the widths of large area holes.

[0136] The first width W1 and the second width W2 are different from each other. For example, the first width W1 is greater than the second width W2. Therefore, the unit through hole UTH has a long width in the first direction and a short width in the second direction.

[0137] A rib RB and island portions IS1 and IS2 are arranged between the plurality of unit through-holes UTH. The rib RB is a region where the metal plate 10 is partially etched. The island portions IS1 and IS2 are regions where the metal plate 10 is not etched.

[0138] A first island portion IS1 is disposed between unit through holes UTH adjacent in the third direction 3D. A second island portion IS2 is disposed between unit through holes UTH adjacent in the fourth direction 4D. A rib RB is disposed between unit through holes UTH adjacent in the first direction 1D and the second direction 2D.

[0139] The rib RB connects the adjacent island portions IS1 and IS2.

[0140] The width W5 of the first island portion IS1 and the width W6 of the second island portion IS2 are different from each other. Specifically, the width W5 of the first island portion IS1 is larger than the width W6 of the second island portion IS2. Alternatively, the areas of the first island portion IS1 and the second island portion IS2 are different from each other. Specifically, the area of the first island portion IS1 is larger than the area of the second island portion IS2.

[0141] As a result, the amount of organic material entering the large-area holes in the third direction differs from the amount of organic material entering the large-area holes in the fourth direction. Therefore, even if the heights of the small-area holes in the third direction and the fourth direction are the same, the organic layer deposited on the deposition substrate will have different thicknesses in each direction. This reduces the deposition efficiency of the deposition mask.

[0142] In addition, since the widths and / or areas of the first island portion and the second island portion are different, the remaining areas of the metal plate in the third direction and the fourth direction are different, and therefore the strength of the deposition mask is different in the third direction and the fourth direction. As a result, the strength of the deposition mask is different depending on the direction, and the deposition mask may be warped in one direction.

[0143] In order to solve the above-mentioned problems, the deposition mask according to the third embodiment makes the heights of the large area holes and the small area holes different from each other in the first direction and the second direction.

[0144] 14 to 16, the unit through-hole UTH has a first large-area hole height H1-1 and a second large-area hole height H1-2. The first large-area hole height H1-1 is the height in the third direction. The second large-area hole height H1-2 is the height in the fourth direction. The first large-area hole height H1-1 is the height from the connecting portion CA to the first island portion IS1. The second large-area hole height H1-2 is the height from the connecting portion CA to the second island portion IS2.

[0145] The height H1-1 of the first large-area hole is different from the height H1-2 of the second large-area hole, specifically, the height H1-1 of the first large-area hole is greater than the height H1-2 of the second large-area hole.

[0146] As a result, the unit through-hole can accommodate a sufficient amount of organic material in the large-area hole in the third direction 3D. That is, the width W5 and / or area of the first island portion IS1 is greater than the width W6 and / or area of the second island portion IS2. Therefore, the area of the large-area hole in the third direction 3D that accommodates the organic material is reduced due to the width W5 and / or area of the first island portion IS1. Therefore, the height H1-1 of the first large-area hole is made greater than the height H1-2 of the second large-area hole. As a result, the large-area hole in the third direction 3D can secure an area for accommodating the organic material.

[0147] 14 to 16, the unit through hole UTH has a first small area hole height H2-1 and a second small area hole height H2-2. The first small area hole height H2-1 is the height in the third direction 3D. The second small area hole height H2-2 is the height in the fourth direction 4D. The first small area hole height H2-1 and the second small area hole height H2-2 are different. The first small area hole height H2-1 and the second small area hole height H2-2 are each the height from the connecting portion CA to the first surface 1S of the metal plate.

[0148] Specifically, the height H2-1 of the first small area hole is smaller than the height H2-2 of the second small area hole.

[0149] Specifically, the height H2-1 of the first small area hole and the height H2-2 of the second small area hole may be 1 μm to 5 μm. More specifically, the height H2-1 of the first small area hole and the height H2-2 of the second small area hole may be 1 μm to 4 μm. Even more specifically, the height H2-1 of the first small area hole and the height H2-2 of the second small area hole may be 1 μm to 3 μm.

[0150] Within this range, the height H2-1 of the first small area hole is smaller than the height H2-2 of the second small area hole.

[0151] Therefore, the width W6 of the second island portion IS2 in the fourth direction 4D is smaller than the width W5 of the first island portion IS1 in the third direction 3D. Also, the height H2-2 of the second small area hole is larger than the height H2-1 of the first small area hole.

[0152] As a result, the strength of the deposition mask can be uniform in the third direction 3D and the fourth direction 4D. This prevents the deposition mask 100 from warping in one direction. That is, the areas of the metal plate remaining on the upper and lower parts of the metal plate in the third and fourth directions are substantially the same. This allows the strength of the metal plate to be uniform regardless of the direction.

[0153] The deposition mask according to the third embodiment includes unit through holes having different widths in a third direction and a fourth direction, and island portions having different widths and / or areas in the third direction and the fourth direction are disposed between adjacent unit through holes.

[0154] This reduces the uniformity of deposition of the deposition mask, and the strength of the deposition mask varies depending on the direction.

[0155] Therefore, in the deposition mask according to the third embodiment, the heights of the small-area holes and the large-area holes are made to differ depending on the direction. Specifically, the height of the large-area holes is smaller in the direction in which the width and / or area of the island portion is smaller. The height of the small-area holes is larger in the direction in which the width and / or area of the island portion is smaller. The height of the large-area holes is larger in the direction in which the width and / or area of the island portion is larger. The height of the small-area holes is smaller in the direction in which the width and / or area of the island portion is larger.

[0156] This prevents the strength of the deposition mask from varying depending on the direction, and allows a sufficient amount of organic material to be accommodated in the large-area holes having a large width and / or area of the island portion.

[0157] Therefore, the deposition mask according to the third embodiment has improved deposition efficiency and reliability.

[0158] Meanwhile, in the above description, the width and / or area of the first island portion between adjacent unit through holes in the long width direction of the unit through holes is described as being larger than the width and / or area of the second island portion between adjacent unit through holes in the short width direction of the unit through holes, but the embodiments are not limited to this.

[0159] That is, the width and / or area of the first island portion between adjacent unit through holes in the long width direction of the unit through holes may be smaller than the width and / or area of the second island portion between adjacent unit through holes in the short width direction of the unit through holes.

[0160] In this case, the height H1-2 of the second large area hole is greater than the height H1-1 of the first large area hole, and the height H2-2 of the second small area hole is smaller than the height H2-1 of the first small area hole, thereby achieving the above-mentioned effects.

[0161] Hereinafter, a deposition mask according to a fourth embodiment will be described with reference to FIGS. 17 to 20. In the description of the deposition mask according to the fourth embodiment, descriptions that are the same as or similar to the deposition masks according to the previous embodiments will be omitted. In addition, the same reference numerals will be used to designate the same components as those of the deposition masks according to the previous embodiments.

[0162] 17 to 20, the deposition mask 100 according to the fourth embodiment includes a plurality of through holes. Specifically, the deposition mask 100 includes a plurality of unit through holes UTH. Each unit through hole UTH is formed by a small-area hole V1, a large-area hole V2, and a connecting portion CA.

[0163] Each unit through hole UTH has a first width W1 in a first direction 1D and a second width W2 in a second direction 2D. The first direction 1D may be the length direction of the deposition mask 100. The second direction 2D may be the width direction of the deposition mask 100. The width is defined as the width of a large area hole.

[0164] The first width W1 and the second width W2 are different from each other. For example, the first width W1 is greater than the second width W2. Therefore, the unit through hole UTH has a long width in the first direction and a short width in the second direction.

[0165] Ribs RB and island portions IS are arranged between the plurality of unit through-holes UTH. The ribs RB are areas where the metal plate 10 is partially etched, and the island portions IS are areas where the metal plate 10 is not etched.

[0166] A rib RB is disposed between unit through holes UTH adjacent in the first direction 1D. A rib RB and an island portion IS are disposed between unit through holes UTH adjacent in the second direction 2D. Specifically, both the rib RB and the island portion IS are disposed in one region among the regions between unit through holes UTH adjacent in the second direction 2D. Furthermore, only the rib RB is disposed in the other region among the regions between unit through holes UTH adjacent in the second direction 2D.

[0167] In addition, one rib RB is arranged between unit through holes UTH adjacent in the first direction 1D. In addition, at least one rib RB is arranged in another region among the regions between unit through holes UTH adjacent in the second direction 2D. Specifically, a plurality of ribs RB are arranged in another region among the regions between unit through holes UTH adjacent in the second direction 2D.

[0168] Therefore, the remaining areas of the metal plate in the first direction and the second direction are different. That is, only one rib is disposed between unit through holes UTH adjacent in the first direction 1D. On the other hand, a plurality of island portions and a plurality of ribs are disposed between unit through holes UTH adjacent in the second direction 2D.

[0169] Therefore, the remaining areas of the metal plate in the first direction and the second direction are different, and thus the strength of the deposition mask is different in the first direction and the second direction, which may cause the deposition mask to warp in one direction since the strength of the deposition mask is different depending on the direction.

[0170] In order to solve the above-mentioned problems, the deposition mask according to the fourth embodiment forms the small area holes in the first direction and the second direction so that their heights are different.

[0171] 18 to 20, the unit through hole UTH has a first small area hole height H2-1 and a second small area hole height H2-2. The first small area hole height H2-1 is the height in the first direction 1D. The second small area hole height H2-2 is the height in the second direction 2D. The first small area hole height H2-1 and the second small area hole height H2-2 are different. The first small area hole height H2-1 and the second small area hole height H2-2 are each the height from the connecting portion CA to the first surface 1S of the metal plate.

[0172] Specifically, the height H2-2 of the second small area hole is smaller than the height H2-1 of the first small area hole.

[0173] Specifically, the height H2-1 of the first small area hole and the height H2-2 of the second small area hole may be 1 μm to 5 μm. More specifically, the height H2-1 of the first small area hole and the height H2-2 of the second small area hole may be 1 μm to 4 μm. Even more specifically, the height H2-1 of the first small area hole and the height H2-2 of the second small area hole may be 1 μm to 3 μm.

[0174] Within this range, the height H2-2 of the second small area hole is smaller than the height H2-1 of the first small area hole.

[0175] As a result, the strength of the deposition mask can be uniform in the first direction and the second direction, which can prevent the deposition mask from warping in one direction. That is, the difference in the area of the metal plate remaining at the top and bottom of the metal plate in the first direction and the second direction is reduced. Therefore, the strength of the metal plate can be uniform regardless of the direction.

[0176] Meanwhile, in the above description, one rib is arranged between adjacent unit through holes in the long width direction of the unit through holes, and multiple island portions and multiple ribs are arranged between adjacent unit through holes in the short width direction of the unit through holes, but the embodiments are not limited to this.

[0177] That is, one rib may be disposed between unit through holes adjacent in the short width direction of the unit through holes, and a plurality of island portions and a plurality of ribs may be disposed between unit through holes adjacent in the long width direction of the unit through holes.

[0178] In this case, the height H2-2 of the second small area hole is made larger than the height H2-1 of the first small area hole, thereby achieving the above-mentioned effects.

[0179] Furthermore, in the above description, one rib is arranged between adjacent unit through holes in the long width direction of the unit through holes, and multiple island portions and multiple ribs are arranged between adjacent unit through holes in the short width direction of the unit through holes, but the embodiments are not limited to this.

[0180] That is, one rib and one island portion may be arranged between unit through holes adjacent to each other in the short width direction of the unit through holes, and multiple island portions and multiple ribs may be arranged between unit through holes adjacent to each other in the long width direction of the unit through holes.

[0181] In this case, the height H2-1 of the first small area hole is made larger than the height H2-2 of the second small area hole, thereby achieving the above-mentioned effects.

[0182] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by a person skilled in the art to which the embodiment belongs. Therefore, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

[0183] Furthermore, although the above description has focused on the embodiments, these are merely examples and are not intended to limit the present invention. A person skilled in the art to which the present invention pertains may make various modifications and applications not exemplified above within the scope of the essential characteristics of the present invention. For example, each component specifically presented in the embodiments may be modified and implemented. Differences related to such modifications and applications should be construed as being included within the scope of the present invention as defined by the appended claims.

Claims

1. a metal plate including a vapor-deposited area and a non-vapor-deposited area; the deposition region includes at least one effective portion; the effective portion includes a plurality of unit through-holes, the unit through-hole includes a small-area hole formed on a first surface of the metal plate, a large-area hole formed on a second surface of the metal plate, and a connecting portion connecting the small-area hole and the large-area hole, The unit through-hole has a first width defined as a width in a first direction and a second width defined as a width in a second direction, the first width and the second width are different; ribs are disposed between the unit through-holes adjacent to each other in the first direction, island portions are disposed between the unit through holes adjacent to each other in the second direction; a height of the small area hole of the unit through-hole in the second direction is smaller than a height of the small area hole of the unit through-hole in the first direction;

2. 2 . The deposition mask of claim 1 , wherein a first inclination angle of a first inner side surface of the large-area hole in the first direction is smaller than a second inclination angle of a second inner side surface of the large-area hole in the second direction.

3. the first direction is defined as a length direction of the deposition mask, the second direction is defined as a width direction of the deposition mask, The evaporation mask according to claim 1 , wherein the first width is greater than the second width.

4. the first direction is defined as a length direction of the deposition mask, the second direction is defined as a width direction of the deposition mask, The evaporation mask according to claim 1 , wherein the second width is greater than the first width.

5. a metal plate including a vapor-deposited area and a non-vapor-deposited area; the deposition region includes at least one effective portion; the effective portion includes a plurality of unit through-holes, the unit through-hole includes a small-area hole formed on a first surface of the metal plate, a large-area hole formed on a second surface of the metal plate, and a connecting portion connecting the small-area hole and the large-area hole, Each of the unit through-holes has a first width defined as a width in a first direction and a second width defined as a width in a second direction, the first width and the second width are different; a first rib is disposed between adjacent unit through-holes in the first direction; second ribs are disposed between the unit through-holes adjacent to each other in the second direction; a width of the large-area opening between the first ribs is greater than a width of the large-area opening between the second ribs; a height of the small area hole of the unit through-hole in the second direction is smaller than a height of the small area hole of the unit through-hole in the first direction;

6. The deposition mask of claim 5 , wherein the first rib and the second rib extend in different directions.

7. a metal plate including a vapor-deposited area and a non-vapor-deposited area; the deposition region includes at least one effective portion; the effective portion includes a plurality of unit through-holes, the unit through-hole includes a small-area hole formed on a first surface of the metal plate, a large-area hole formed on a second surface of the metal plate, and a connecting portion connecting the small-area hole and the large-area hole, The unit through-hole has a first width defined as a width in a third direction and a second width defined as a width in a fourth direction, the first width and the second width are different; a first island portion is disposed between the unit through holes adjacent to each other in the third direction; a second island portion is disposed between the unit through holes adjacent to each other in the fourth direction; The width of the first island portion is larger than the width of the second island portion, the height of the small area holes in the third direction is smaller than the height of the small area holes in the fourth direction.

8. The deposition mask according to claim 7 , wherein an area of the first island portion is larger than an area of the second island portion.

9. a metal plate including a vapor-deposited area and a non-vapor-deposited area; the deposition region includes at least one effective portion; the effective portion includes a plurality of unit through-holes, the unit through-hole includes a small-area hole formed on a first surface of the metal plate, a large-area hole formed on a second surface of the metal plate, and a connecting portion connecting the small-area hole and the large-area hole, Each of the unit through-holes has a first width defined as a width in a first direction and a second width defined as a width in a second direction, the first width and the second width are different; ribs are disposed between the unit through-holes adjacent to each other in the first direction, a rib and an island portion are disposed between adjacent unit through-holes in the second direction; a height of the small area hole of the unit through-hole in the second direction is smaller than a height of the small area hole of the unit through-hole in the first direction;

10. a rib and an island portion are disposed in one region among regions between unit through holes adjacent to each other in the second direction; The deposition mask of claim 9 , wherein at least one rib is disposed in another region among the regions between the unit through-holes adjacent in the second direction.

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