Pad surface cleaning device around pad conditioner to allow in-situ pad conditioning

Abstract

The present disclosure relates to a pad surface cleaning system to be used with a conditioning module for conditioning the polishing surface of a polishing pad. The pad surface cleaning system can be used to spray a high-pressure fluid spray onto the polishing surface to loosen debris from the polishing surface. The pad surface cleaning system can also be used to remove the loosened debris. Furthermore, the pad surface cleaning system can separate the conditioning disk from the polishing fluid to protect the conditioning disk from reacting with the polishing fluid.

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure generally relate to an apparatus and method for conditioning a polishing pad. More particularly, embodiments of the present disclosure relate to a pad surface cleaning system for removing debris from a polishing pad and isolating an abrasive disc from a polishing fluid. [Background technology]

[0002] Processing stations for performing polishing processes, such as chemical mechanical planarization (CMP) or electrochemical mechanical planarization (ECMP), use a polishing pad and a polishing fluid to polish a substrate. The polishing surface of the polishing pad contacts the substrate and removes debris from the substrate, planarizing the substrate and smoothing its surface. The polishing fluid may be disposed intermediate the polishing surface and the substrate to facilitate material removal. The polishing pad may have a rough surface for contacting the substrate. Over time, the rough surface may smooth out and the polishing pad may no longer planarize the substrate. Additionally, abrasive particles from the substrate or the polishing fluid may become embedded or smeared into the polishing pad, resulting in less effective planarization or contamination of subsequent substrates polished by the polishing pad.

[0003] A conditioning disk is used in conjunction with a polishing fluid to condition the polishing surface and remove embedded material. Traditional methods of conditioning a polishing pad involve conditioning the polishing pad midway through a polishing step in a separate step, where no other polishing action can occur. The separate step can increase the time required to polish a substrate and reduce the availability of the processing station. The polishing fluid can degrade or corrode the conditioning disk, or the conditioning disk can also deposit additional embedded material or embed pieces of the conditioning disk that can be removed during conditioning.

[0004] Therefore, what is needed in the art is an apparatus and method for solving the problems set forth above. Summary of the Invention

[0005] FIELD OF THE DISCLOSURE The present disclosure relates generally to an apparatus and method for conditioning a polishing pad. More particularly, embodiments of the present disclosure relate to a pad surface cleaning system for removing debris from a polishing pad and isolating the abrasive disc from the polishing fluid.

[0006] Some embodiments provide a polishing pad cleaning system for a substrate polishing process. The polishing pad cleaning system includes an outer wash ring with an outer nozzle configured to be coupled to a first fluid source, an inner wash ring with an inner nozzle configured to be coupled to a second fluid source, and a vacuum ring forming a vacuum port configured to be fluidly coupled to a vacuum source. A conditioning disk is disposed within the polishing pad cleaning system and configured to condition the polishing pad. The outer nozzle is configured to release debris from the substrate polishing process. The inner nozzle is configured to release debris from the conditioning of the polishing pad, and the vacuum ring is configured to remove debris released by the outer wash ring and the inner wash ring.

[0007] Another embodiment provides a conditioning system for conditioning a polishing pad. The conditioning system includes a conditioning module including a conditioning arm and a conditioning head configured to move a conditioning disk relative to the polishing pad, and a polishing pad cleaning system coupled to the conditioning arm. The polishing pad cleaning system includes an outer wash ring with outer nozzles configured to couple to a first fluid source, a vacuum ring with vacuum ports configured to couple to a vacuum source, and an inner wash ring with inner nozzles configured to couple to a second fluid source.

[0008] Another embodiment provides a method for conditioning a polishing pad. The method includes placing a conditioning disk on a polishing pad in a polishing pad cleaning system. The polishing pad cleaning system includes an outer wash ring with an outer nozzle coupled to a first fluid source, an inner wash ring with an inner nozzle coupled to a second fluid source, and a vacuum ring, the vacuum ring forming a vacuum port fluidly coupled to the vacuum source. The method further includes flowing a fluid from the first fluid source through the outer nozzle to loosen debris from the polishing pad during a substrate polishing process, and removing debris from the polishing pad during the substrate polishing process through the vacuum port by creating a negative pressure using the vacuum source. The method further includes flowing a fluid from the second fluid source through the inner nozzle to loosen debris from the polishing pad during the substrate polishing process, and creating a negative pressure using the vacuum source to remove debris from the polishing pad during the substrate polishing process through the vacuum port.

[0009] So that the above-recited features of the present disclosure may be understood in detail, a more particular description of the present disclosure briefly summarized above can be had by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that since the present disclosure may admit of other equally effective embodiments, the accompanying drawings depict only exemplary embodiments and therefore should not be considered as limiting the scope of the present disclosure. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 2 is a top view of a processing station, according to some embodiments. [Figure 2] 1 is a schematic side view of a processing station, according to some embodiments. [Figure 3] FIG. 1 illustrates a top view of a pad surface cleaning system, according to some embodiments. [Figure 4A]4 is a schematic side view of the pad surface cleaning system from FIG. 3, according to some embodiments. [Figure 4B-4C] 4B is a schematic side view of the pad surface cleaning system from FIG. 4A according to some embodiments. [Figure 5] 1 is a schematic side view of a rotatable pad surface cleaning system according to some embodiments. [Figures 6A-6B] 1A-1D are top views of different pad surface cleaning systems, according to some embodiments. [Figure 6C] 1A-1D are top views of different pad surface cleaning systems, according to some embodiments. [Figure 7] 1 is a top schematic view of a pad surface cleaning system that moves relative to a polishing fluid application point, according to some embodiments. [Figure 8] 1 is a top schematic view of a pad surface cleaning system and a polishing fluid application point that moves relative to a polishing pad, according to some embodiments. [Figure 9] FIG. 2 is a functional block diagram of a system controller for a pad surface cleaning system, according to some embodiments. [Figure 10] 1 is a flowchart of a method for conditioning a polishing pad, according to some embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0011] For ease of understanding, where possible, like reference numerals have been used to designate like elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0012] In the following description, numerous specific details are set forth to provide a more thorough understanding of the present disclosure. However, it will be apparent to those skilled in the art that some embodiments of the present disclosure can be practiced without one or more of these specific details. In other instances, well-known features are not described to avoid obscuring one or more embodiments of the present disclosure.

[0013] The present disclosure relates to a pad surface cleaning system to be used with a conditioning module for conditioning the polishing surface of a polishing pad. The pad surface cleaning system can be used to spray a high-pressure fluid spray onto the polishing surface to loosen debris from the polishing surface. The pad surface cleaning system can also be used to remove the loosened debris. Furthermore, the pad surface cleaning system can separate the conditioning disk from the polishing fluid to protect the conditioning disk from reacting with the polishing fluid.

[0014] The methods and systems disclosed herein may provide features that overcome many of the drawbacks associated with conventional processing stations for performing the polishing processes described above.

[0015] Example of a processing station for a polishing process 1 shows a top view of a processing station 100, according to some embodiments. The processing station 100 is configured to perform a polishing process, such as a chemical mechanical planarization (CMP) or electrochemical mechanical planarization (ECMP) process, and is also configured to clean a polishing surface 102 of a polishing pad 104. The processing station 100 can be a stand-alone unit or part of a larger processing system.

[0016] Processing station 100 includes a substrate carrier head 106 (shown in phantom), a platen 108, a conditioning module 110, and a polishing fluid supply assembly, such as a slurry supply assembly 112. Platen 108, conditioning module 110, and slurry supply assembly 112 may be mounted to a base 114 of processing station 100.

[0017] The platen 108 supports the polishing pad 104. The platen 108 is rotated by a motor (not shown), and thus the polishing pad 104 is rotated relative to the substrate 116 held in the substrate carrier head 106 during processing. Accordingly, terms such as upstream, downstream, in front, behind, incoming, outgoing, before, and after should generally be interpreted with respect to the movement or direction of the platen 108 and the polishing pad 104 supported thereon, as appropriate.

[0018] The substrate carrier head 106 is configured to hold the substrate 116 and controllably move the substrate 116 relative to the polishing surface 102 of the polishing pad 104 during processing. The substrate carrier head 106 may also rotate the substrate 116 during processing.

[0019] The conditioning module 110 is configured to condition the polishing pad 104 by opening pores in the polishing pad 104. The conditioning module 110 includes a support assembly 136, a conditioning arm 121, a conditioning head 120, and a conditioning disk 118. The conditioning disk 118 may be a brush with bristles made from a polymeric material or may have an abrasive surface with abrasive particles. In some embodiments, the conditioning disk 118 is a circular disk containing abrasive particles, such as diamonds. The conditioning head 120 is configured to hold the conditioning disk 118 and controllably move the conditioning disk 118 relative to the polishing surface 102 of the polishing pad 104 during conditioning.

[0020] The adjusting disk 118 may be coupled to the adjusting head 120 by a passive mechanism, such as a magnet and pneumatic actuator, that utilizes the existing up and down motion of the adjusting arm 121. The adjusting disk 118 generally extends beyond the housing of the adjusting head 120 by about 0.2 mm to about 1 mm to contact the polishing surface 102. The adjusting disk 118 may be made from nylon, cotton cloth, polymer, or other soft material that will not damage the polishing surface 102. Alternatively, the adjusting disk 118 may be made from a textured polymer or stainless steel having a roughened surface with diamond particles bonded thereto or formed therein. The diamond particles may range in size from about 30 microns to about 100 microns. The adjusting head 120 may also rotate the adjusting disk 118 during adjustment.

[0021] The conditioning module 110 is adapted to move the conditioning head 120, and thus the conditioning disk 118, in a linear, arcing, or sweeping motion from the edge of the polishing pad 104 diameter (e.g., the circumference of the polishing pad 104) to at least a portion of the radius of the polishing pad 104. In particular, the support assembly 136 can position the conditioning head 120. The movement of the conditioning head 120 can be configured so that the entire surface of the polishing pad is conditioned. The slurry supply assembly 112 is configured to supply a polishing medium, such as a fluid or slurry 123, to the polishing pad 104 while the substrate 116 is polished on the polishing surface 102. As one skilled in the art will appreciate, the polishing pad 104 can include any features that will retain the slurry 123, such as pores and / or polishing pad grooves found in the polishing pad 104. The slurry supply assembly 112 includes a polishing fluid supply arm, such as a slurry supply arm 122, which can be located in front of or behind the substrate carrier head 106. The slurry delivery arm 122 delivers slurry 123 to the polishing surface 102. The slurry delivery arm 122 and the carrier head 106 may similarly move in a linear, arcing, or sweeping motion.

[0022] A system controller 190 may direct various operations of the processing station 100, such as controlling the movement of the processing station 100. For example, the system controller 190 may move and control the positions of the platen 108, the conditioning arm 121, and the slurry supply arm 122 so that the polishing pad 104 is conditioned and the substrate 116 is polished. The system controller 190 is further described with respect to FIG. 9.

[0023] In some embodiments, the slurry supply assembly 112 does not move during all or part of the operation of the processing station 100 , such as during conditioning of the polishing pad 104 .

[0024] 2 shows a schematic side view of processing station 100, according to some embodiments. Polishing pad 104 is disposed on or supported on the surface of platen 108, which rotates polishing pad 104 and polishing surface 102 during processing. Platen 108 may rotate about a first axis of rotation 231. Slurry supply arm 122 distributes a fluid flow to processing station 100. For example, slurry supply arm 122 may distribute slurry 123 to rotating polishing pad 104 in a continuous or variable feed rate.

[0025] Conditioning module 110 further includes a conditioning base 237 attached to base 114. Conditioning arm 121 has a distal end coupled to conditioning head 120 and a proximal end coupled to conditioning base 237, such as through support assembly 136. Conditioning base 237 can rotate conditioning arm 121 about second axis of rotation 233 to position conditioning head 120, for example, to sweep conditioning head 120 across polishing surface 102 to condition polishing surface 102.

[0026] The conditioning head 120 can be used to restore the polishing performance of the polishing surface 102, for example, by spinning the polishing pad 104 about a third axis of rotation 235 of the conditioning head 120. The third axis of rotation 235 can be at the center of the conditioning head 120 or at a central location of the conditioning head 120. The conditioning head 120 can also provide a controllable pressure or downforce to controllably push the conditioning head 120 toward the polishing surface 102. In one embodiment, the downforce can be in a range between about 0.5 lbf (22.2 N) and about 14 lbf (62.3 N), for example, between about 1 lbf (4.45 N) and about 10 lbf (44.5 N). The conditioning head 120 generally rotates and / or moves laterally in a sweeping motion across the polishing surface 102. In some embodiments, the conditioning head 120 may have an additional range of motion to move the conditioning head 120 away from the platen 108 when not in use.

[0027] Example of a pad surface cleaning system FIG. 3 shows a top view of a pad surface cleaning system 340, according to some embodiments.

[0028] The pad surface cleaning system 340 can be used to clean the polishing surface 102 and / or separate the polishing disc 108 from the slurry 123 (FIGS. 1 and 2). The pad surface cleaning system 340 includes an outer wash ring 342 with outer nozzles 344, a vacuum ring 346 with vacuum ports 347, and an inner wash ring 348 with inner nozzles 350. In the embodiment shown in FIG. 3, the pad surface cleaning system 340 completely surrounds the conditioning disc 118 and does not rotate with the conditioning disc 118. For example, the conditioning disc 118 may rotate about the third axis of rotation 235, but the pad surface cleaning system 340 does not rotate about the third axis of rotation 235. In other words, the pad surface cleaning system 340 can remain stationary or fixed relative to the third axis of rotation 235. The pad surface cleaning system 340 may be coupled to the conditioning arm 121, such that the conditioning module 110 (FIGS. 1 and 2) moves the pad surface cleaning system 340 along with the conditioning disk 118. The pad surface cleaning system 340 may be positioned downstream from the slurry supply arm 122 (FIG. 1), and the substrate carrier head 106 may be positioned downstream from the pad surface cleaning system 340.

[0029] The outer wash ring 342 and inner wash ring 348 spray fluid onto the polishing surface 102 to remove debris. The debris may include pieces of the substrate 116 ( FIG. 1 ) removed during the polishing process or pieces of the polishing pad 104 or polishing disc 118 removed or dislodged during the conditioning process. The outer wash ring 342 may also be used to isolate the polishing disc 108 from the slurry 123 by diluting, reducing the amount of, or eliminating the slurry 123 that contacts the polishing disc 118. The vacuum ring 346 may remove or siphon off the debris and slurry 123 (or diluted slurry 123) before they contact the polishing disc 118. Diluting or removing the slurry 123 may reduce the acidity of the slurry 123 and prevent it from chemically reacting with, corroding, or attacking the polishing disc 118, which may include stainless steel. Protecting the abrasive disc 118 may extend the life of the abrasive disc 118, which may reduce operating costs, for example, by reducing the amount of abrasive disc 118 that is worn and, as a result, reducing the downtime of the polishing station 100 (FIG. 1) required to replace the abrasive disc 118. Diluting the slurry 123 may reduce the density of the slurry 123, allowing the vacuum ring 346 to remove the diluted slurry 123 more easily than the slurry 123.

[0030] The outer nozzles 344 of the outer wash ring 342 deliver a high-pressure fluid spray to the polishing surface 102 to remove debris, such as byproducts from the polishing process, and to dilute or remove the slurry 123. Removing debris prevents the abrasive disc 118 from moving or adhering to the polishing surface 102, which helps prevent the debris from becoming trapped or embedded in the polishing surface 102. Debris embedded in the polishing surface 102 can scratch or become embedded in the substrate 116 during the polishing process, which can result in excessive processing or rejection of the polished substrate 116. The outer nozzles 344 are coupled by a first fluid supply line 355 to a first fluid source 354, such as a water source or a deionized water source, and spray fluid from the first fluid source 354. In the illustrated embodiment, the outer nozzles 344 are disposed around the diameter of the outer wash ring 342. In some embodiments, the outer nozzles 344 may be positioned at different diameters or angular positions of the outer wash ring 342 .

[0031] Inner nozzles 350 of the inner wash ring 348, in a manner similar to the outer nozzles 344, supply a high-pressure fluid spray to the polishing surface 102 to remove debris, such as by-products from the conditioning process. The inner nozzles 350 are coupled to a second fluid source 356, such as a water source or a deionized water source, by a second fluid supply line 357 and spray fluid from the second fluid source 356. In the illustrated embodiment, the inner nozzles 350 are positioned around the diameter of the inner wash ring 348. In some embodiments, the inner nozzles 350 may be positioned at different diameters or angular positions of the inner wash ring 348. In some embodiments, the high-pressure flow of the water or deionized water source through the outer nozzles 344 and inner nozzles 350 may be at a flow rate greater than 1 liter per minute.

[0032] The vacuum port 347 of the vacuum ring 346 is coupled to a vacuum source 358 through a vacuum line 359. The vacuum source 358 can be any system capable of creating a vacuum or drawing fluid from the vacuum port 347 through the vacuum line 359, such as a Venturi system or a vacuum pump. Thus, the vacuum ring 346 can use the Venturi effect or negative pressure to remove debris and slurry through the vacuum port 347. In the illustrated embodiment, the vacuum port 347 is a cylindrically shaped opening (e.g., a hollow cylinder or tube) formed by the vacuum ring 346 and along a radius of the vacuum ring 346. For example, the radius of the vacuum port 347 can follow the radius of the vacuum ring 346, or the center point of the vacuum port 347 can be approximately the same as the center point of the vacuum ring 346.

[0033] The pad surface cleaning system 340 may operate based on two zones, A and B. Zone A and Zone B are separated by a zone boundary line 352. In the illustrated embodiment, the zone boundary line 352 extends between the center of the polishing pad 104 (e.g., the third axis of rotation 235) and the edge of the polishing pad 104 diameter, and is therefore a straight line orthogonal (e.g., perpendicular) to the edge of the polishing pad 104 diameter, such as 90 degrees + / - 5 degrees, such as 90 degrees + / - 2 degrees, such as 90 degrees + / - 1 degree, such as 90 degrees + / - 0.5 degrees, or 90 degrees + / - 0.25 degrees. In some embodiments, the zone boundary line 352 may be orthogonal to the direction of the linear velocity of the polishing pad 104. The zone boundary line 352 may move with the pad surface cleaning system 340, such as in embodiments in which the polishing disc 118 moves in a linear, arcing, or sweeping motion. In such an embodiment, the zone boundary line 352 may remain perpendicular to the edge of the polishing pad 104 diameter.

[0034] Zones A and B are configured such that Zone A includes the portions of outer wash ring 342, vacuum ring 346, and inner wash ring 348 disposed over an incoming portion of polishing pad 104, such as the portion of polishing pad 104 moving toward zone boundary 352. Zone B includes the portions of outer wash ring 342, vacuum ring 346, and inner wash ring 348 disposed over an outgoing portion of polishing pad 104, such as the portion of polishing pad 104 moving away from zone boundary 352.

[0035] A portion of the vacuum port 347 located in Zone A is located downstream from the outer nozzle 344 located in Zone A. A portion of the vacuum port 347 located in Zone B is located downstream from the inner nozzle 350 located in Zone B. Locating the portion of the vacuum port 347 in Zone A downstream from the outer nozzle 344 allows the vacuum ring 346 to collect fluid from the first fluid source 354, debris from polishing the substrate 116 ( FIG. 1 ) using the carrier head 106 ( FIG. 1 ), and the slurry 123 ( FIG. 2 ) or used slurry 123. Locating the portion of the vacuum port 347 in Zone B downstream from the inner nozzle 350 allows the vacuum ring 346 to collect fluid from the second fluid source 356 and debris from conditioning the polishing surface 102 using the conditioning disk 118.

[0036] The system controller 190 may control the pad surface cleaning system 340 based on the position of the pad surface cleaning system 340. For example, the system controller 190 may control the application of fluid from the first fluid source 354 and the second fluid source 356 (collectively referred to as rinsing fluid) and fluid from the vacuum source 358 based on the position of the pad surface cleaning system 340 relative to the slurry supply arm 122. In some embodiments, the system controller 190 may stop applying rinsing fluid when a portion of the pad surface cleaning system 340 is within a radius of the polishing pad 104 occupied by the slurry 123 application point of the slurry supply arm 122. This prevents dilution or removal of the newly added slurry 123. Control of the rinsing fluid is further described with respect to FIGS. 7 and 8.

[0037] The configuration of the pad surface cleaning system 340 (e.g., attached to the conditioning arm 121 and interfaced with the system controller 190) allows the pad surface cleaning system 340 to operate in situ or simultaneously with the processing station 100 (FIG. 1). For example, the pad surface cleaning system 340 can be used in conjunction with the conditioning head 120 and conditioning disk 118 to condition the polishing surface 102 while the carrier head 106 polishes a substrate. Simultaneous conditioning and polishing can beneficially reduce operating costs and reduce substrate 116 processing time.

[0038] 1-3 show polishing pad 104 rotating clockwise and conditioning disk 118 rotating counterclockwise, pad 104 and pad 118 may rotate differently. In some embodiments, polishing pad 104 may rotate counterclockwise and conditioning disk 118 may rotate clockwise. In some embodiments, pad 104 and pad 118 may rotate in the same direction, such as both clockwise or both counterclockwise.

[0039] In some embodiments, the pad surface cleaning system 340 is disposed on an arm separate from the conditioning arm 121. In some embodiments, the pad surface cleaning system 340 is downstream of the slurry supply arm 122 and the conditioning head 120.

[0040] In some embodiments, at least one of the outer nozzles 344 and the inner nozzles 350 may occupy both Zone A and Zone B. Such a nozzle may operate as part of Zone A or Zone B, or may operate as part of both Zone A and Zone B.

[0041] In some embodiments, the first fluid source 354 and the second fluid source 356 contain different fluids. In some embodiments, the first fluid source 354 and the second fluid source 356 contain the same fluid. In some embodiments, the outer wash ring 342 may include outer nozzles 344 only in Zone A, and the inner wash ring 348 may include inner nozzles 350 only in Zone B.

[0042] In some embodiments, the pad surface cleaning system 340 does not use Zone A and Zone B. In such embodiments, the fluid from the first fluid source 354 may be provided to all of the outer nozzles 344, and the fluid from the second fluid source 356 may be provided to all of the inner nozzles 350.

[0043] In some embodiments, the vacuum port 347 may comprise a converging or diverging section. In some embodiments, the vacuum port 347 may comprise multiple vacuum ports disposed in or formed by the vacuum ring 346. For example, multiple vacuum ports may be arranged around the diameter of the vacuum ring 346.

[0044] FIG. 4A shows a schematic side view of the pad surface cleaning system 340 from FIG. 3 , according to some embodiments. In particular, FIG. 4A shows a cross-sectional view of the pad surface cleaning system 340, in which the nozzles 344 of the outer nozzle 344, the nozzles 350 of the inner nozzle 350, and the vacuum port 347 are cross-sectionalized. The first fluid supply line 355, the second fluid supply line 357, and the vacuum line 359 are coupled to the adjustment arm 121 through a mounting bracket 460, such as a clip, zip tie, bracket, or strap. In the illustrated embodiment, the outer nozzle 344 and the inner nozzle 350 are cylindrical and connected to the first fluid supply line 355 and the second fluid supply line 357 through channels in the outer wash ring 342 and the inner wash ring 348. The channels may be referred to as the outer wash ring channel and the inner wash ring channel. The vacuum port 347 forms a cylindrical cutout in the vacuum ring 346 and includes a passage in the vacuum ring 346 connected to the vacuum line 359. The passages are sometimes referred to as vacuum ring channels.

[0045] In the illustrated embodiment, the outer wash ring 342, the vacuum ring 346, and the inner wash ring 348 are shown as separate components and may be coupled or joined to one another, such as by press-fitting the inner wash ring 348 onto the vacuum ring 346 and the vacuum ring 346 onto the outer wash ring 342. Of course, it is contemplated that the outer wash ring 342, the vacuum ring 346, and the inner wash ring 348 may be joined to one another using a variety of other fastening means, including, but not limited to, various adhesives, various mechanical fasteners, or welding. In some embodiments, the outer wash ring 342, the vacuum ring 346, and the inner wash ring 348 may be integrally formed. For example, the outer wash ring 342, the vacuum ring 346, and the inner wash ring 348 may be machined from a single billet of material, molded or printed as a single piece, and welded or bonded to one another or otherwise joined to function as a single article.

[0046] 4B and 4C show schematic side views of the pad surface cleaning system 340 from FIG. 4A, according to some embodiments. In particular, FIG. 4B shows the standoff distance from the outer nozzle 344 and vacuum port 347 to the polishing surface 102. FIG. 4C shows the standoff distance from the inner nozzle 350 and vacuum port 347 to the polishing surface 102.

[0047] The outer nozzle 344 is positioned a first standoff distance (h1) from the polishing surface 102. The vacuum port 347 is positioned a second standoff distance (h2) from the polishing surface 102. The inner nozzle 350 is positioned a third standoff distance (h3) from the polishing surface 102. As shown, the first standoff distance (h1) is greater than the third standoff distance (h3), which is greater than the second standoff distance (h2). Having the second standoff distance (h2) as the shortest distance positions the vacuum port 347 closer to the polishing surface 102 than the outer nozzle 344 and the inner nozzle 350, which may allow the vacuum port 347 to collect debris and slurry 123 ( FIG. 2 ) without interference from the outer wash ring 342 and the inner wash ring 348 through the vacuum port 347. The second standoff distance (h2) may also require less vacuum pressure from the vacuum source 358 than if the second standoff distance (h2) is greater. The first standoff distance (h1) and the third standoff distance (h3) may be based on the outer nozzle 344 and the inner nozzle 350. For example, the first standoff distance (h1) and the third standoff distance (h3) may depend on the inlet diameter, outlet diameter, or throat diameter of the nozzles 344 and 350, or the desired impact velocity of the rinsing fluid, where the velocity of the rinsing fluid may depend on the distance the rinsing fluid travels from the outer nozzle 344 and the inner nozzle 350. The first standoff distance (h1) and the third standoff distance (h3) may also depend on the desired cross-section of the rinsing fluid at impact (e.g., the diameter of a conical spray pattern or the width of a flat fan spray pattern), where the cross-section may increase or decrease as the distance from the outer nozzle 344 and the inner nozzle 350 increases. In some embodiments, the standoff distance (h1) can be between 10 and 100 mm. In some embodiments, the standoff distance (h2) can be less than or equal to 10 mm. In some embodiments, the standoff distance (h3) can be between 10 and 100 mm.In some embodiments, any or all of the standoff distances (h1), (h2), and (h3) can be equal to another.

[0048] 3-4C as cylindrical, the outer nozzle 344 and the inner nozzle 350 can be convergent or convergent-divergent nozzles. In some embodiments, the outer nozzle 344 and the inner nozzle 350 can be veejet nozzles, N2 / DI mist atomizer nozzles, or a combination thereof.

[0049] 1-4C show a circular platen 108 and circular polishing pad 104 in a rotary polisher, the polishing pad surface cleaning system 340 can be used with other polishing methods and designs. In some embodiments, the polishing pad 104 can be a conveyor belt that moves on rollers, and the platen 108 can remain stationary rather than rotating, such as in a linear polisher. In some embodiments, the platen 108 can move in an orbit about a first axis of rotation 231 (FIG. 2) while rotating, such as in an orbital polisher.

[0050] FIG. 5 shows a schematic side view of a rotatable pad surface cleaning system 540, according to some embodiments.

[0051] The conditioning module 510 is similar to the conditioning module 110 described with respect to Figures 1-4A, except as noted. The conditioning module 510 includes a conditioning arm 521 coupled to a conditioning head 520 through a rotary union 562 or manifold. The conditioning head 520 spins or rotates the conditioning disk 118. The rotatable pad surface cleaning system 540 is similar to the pad surface cleaning system 340, except as noted. The rotatable pad surface cleaning system 540 completely surrounds the conditioning disk 118 and rotates with the abrasive disk 118. The rotatable pad surface cleaning system 540 includes an outer wash ring 542 with outer nozzles 544, a vacuum ring 546 with vacuum ports 547, and an inner wash ring 548 with inner nozzles 550. The outer nozzle 544 is coupled to a first fluid source 354 through a first fluid supply line 355, the inner nozzle 550 is coupled to a second fluid source 356 through a second fluid supply line 357, and the vacuum port 547 is coupled to a vacuum source 358 through a vacuum line 359.

[0052] The first fluid supply line 355, the second fluid supply line 357, and the vacuum line 359 pass through a rotary union 562 to fluidly couple the stationary first fluid source 354, the second fluid source 356, and the vacuum source 358 to the rotating outer wash ring 342, the inner wash ring 348, and the vacuum ring 346, respectively. The rotary union 562 rotates relative to the adjustment arm 521. The rotatable pad surface cleaning system 540 includes Zone A and Zone B and the zone boundary line 352 described with respect to FIG. 3. Zone A and Zone B do not rotate with the rotatable pad surface cleaning system 540; instead, the zone boundary line 352 remains perpendicular to the edge of the polishing pad 104 diameter. The system controller 190 can control which nozzle or nozzles 544 and 550 of the outer wash ring 542 and the inner wash ring 548 are used based on the zone in which each respective nozzle 544 and 550 is located.

[0053] Additional examples of pad surface cleaning systems 6A-6C show top views of different pad surface cleaning systems 640 (e.g., 640A, 640B, and 640C), according to some embodiments. In particular, FIG. 6A shows a rectangular pad surface cleaning system 640A, which is similar to pad surface cleaning system 340, except as noted.

[0054] Rectangular pad surface cleaning system 640A includes an outer wash ring 642A with outer nozzles 644A, a vacuum ring 646A with vacuum ports 647A, and an inner wash ring 648A with inner nozzles 650A. Outer wash ring 642A, vacuum ring 646A, and inner wash ring 648A each have a rectangular shape, where inner wash ring 648A is nested inside vacuum ring 646A, and vacuum ring 646A is nested inside outer wash ring 642A. Rectangular pad surface cleaning system 640A includes zones A and B and zone boundary lines 652A that are used in a manner similar to zones A and B and zone boundary lines 352 described with respect to FIG. 3 .

[0055] The rectangular pad surface cleaning system 640A may be used with the conditioning module 110 or 510, which may move the rectangular pad surface cleaning system 640A along with the conditioning head 120 or 520 in a linear, arcing, or sweeping motion. The rectangular pad surface cleaning system 640A may completely surround the conditioning disk 118.

[0056] In the illustrated embodiment, two sides of the rectangular pad surface cleaning system 640A are approximately parallel to the zone boundary line 652A, such as within 5 degrees, such as within 3 degrees, such as within 1 degree, or within 0.5 degrees. In some embodiments, the rectangular pad surface cleaning system 640A may not be positioned with sides approximately parallel to the zone boundary line 652A. In some embodiments, the two sides of the rectangular pad surface cleaning system 640A may be parallel to each other but not parallel to the zone boundary line 652A. Although a rectangle is described with respect to FIG. 6A , other polynomial shapes may be used for the rectangular pad surface cleaning system 640A, such as a square, a pentagon, or an octagon, to name a few.

[0057] FIG. 6B shows a semicircular pad surface cleaning system 640B, which is similar to pad surface cleaning system 340 except as noted.

[0058] The semicircular pad surface cleaning system 640B includes an arc-shaped (e.g., semicircular) outer wash ring 642B with outer nozzles 644B and a corresponding first vacuum ring 646Ba with vacuum ports 647Ba. The semicircular pad surface cleaning system 640B also includes an arc-shaped inner wash ring 648B with inner nozzles 650B and a corresponding second vacuum ring 646Bb with vacuum ports 647Bb. The first vacuum ring 646Ba has a semicircular shape nested inside and downstream of the outer wash ring 642B. The second vacuum ring 646Bb has a semicircular shape nested outside and downstream of the inner wash ring 642B. The first vacuum ring 646Ba extends beyond the outer wash ring 642B to capture fluid sprayed through the outermost outer nozzles 644B. A second vacuum ring 646Bb extends beyond the inner wash ring 648B to capture fluid sprayed through the outermost outer nozzle 644B.

[0059] The semicircular pad surface cleaning system 640B may be used with the conditioning module 110 or 510 and may move with the conditioning head 120 or 520 in a linear, arcing, or sweeping motion.

[0060] The semicircular pad surface cleaning system 640B includes zones A and B and zone boundary line 652B used in a manner similar to zones A and B and zone boundary line 352 described with respect to Figure 3. In the illustrated embodiment, the outer wash ring 642B and first vacuum ring 646Ba are disposed in zone A, and the inner wash ring 648B and second vacuum ring 646Bb are disposed in zone B. In some embodiments, the outer wash ring 642B and inner wash ring 648B can be disposed in both zone A and zone B, such as mostly in one of the zones and partially in the other zone.

[0061] FIG. 6C shows a flat bar pad surface cleaning system 640C, which is similar to pad surface cleaning system 340 except as noted.

[0062] The flat pad surface cleaning system 640C includes an outer wash ring 642C with outer nozzles 644C and a corresponding first vacuum ring 646Ca with vacuum ports 647Ca. The flat pad surface cleaning system 640C further includes an inner wash ring 648C with inner nozzles 650C and a corresponding second vacuum ring 646Cb with vacuum ports 647Cb. The outer wash ring 642C and the inner wash ring 648C each have a rectangular shape and are generally parallel to each other. The abrasive disc 118 is positioned intermediate the outer wash ring 642C and the inner wash ring 648C.

[0063] The first vacuum ring 646Ca has a rectangular shape and is downstream of and adjacent to (e.g., coupled to) the outer wash ring 642C, and the second vacuum ring 646Cb has a rectangular shape and is downstream of and adjacent to the inner wash ring 648C.

[0064] The flat pad surface cleaning system 640C may be used with the conditioning module 110 or 510 and may move with the conditioning head 120 or 520 in a linear, arcing, or sweeping motion.

[0065] In some embodiments, the outer wash ring 642C and the inner wash ring 648C may not be substantially parallel to one another. For example, the outer wash ring 642C and the inner wash ring 648C may each be aligned with a radial line extending from the center point of the polishing pad 104 to the edge of the polishing pad 104 diameter.

[0066] 7 shows a top schematic view of a pad surface cleaning system 740 that moves relative to a polishing fluid supply point 724, according to some embodiments. In particular, FIG. 7 shows how the pad surface cleaning system 740 can be controlled based on its position relative to the polishing fluid supply point 724.

[0067] The pad surface cleaning system 740 is similar to the pad surface cleaning system 340 (FIGS. 3-4C) except as noted. The pad surface cleaning system 740 includes an outer wash ring and an inner wash ring (not shown) and a vacuum ring (not shown) having a vacuum port 747 (shown as vacuum port 747A in a first position and vacuum port 747B in a second position). The polishing fluid supply point 724 is the point where a polishing fluid, such as the slurry 123 described with reference to FIGS. 1-4C, contacts the polishing surface 102 of the polishing pad 104. The polishing fluid may be dispersed in the distribution path 725 as the polishing pad 104 rotates. The vacuum port 747 may be coupled to a vacuum source (not shown) that provides negative pressure when the vacuum port 747 is not in the distribution path 725 (as shown on this page). For example, the vacuum source may not provide negative pressure when the vacuum port 747A is in the distribution path 725, such as when the vacuum port 747A is in the first position. The vacuum source may provide a negative pressure when the vacuum port 747 is outside the distribution path 725, such as when the vacuum port 747B is in the second position. The system controller 190 (FIG. 3) may control the vacuum source using the pad surface cleaning system application 912 described with respect to FIG.

[0068] In the illustrated embodiment, the dispersion path 725 follows a radius of the polishing pad 104. In some embodiments, the dispersion path 725 may not be radial, such as in embodiments having a linear or orbital polisher.

[0069] 8 shows a top schematic view of a pad surface cleaning system 740 and a polishing fluid supply point 824 that moves relative to the polishing pad 104, according to some embodiments. In particular, FIG. 8 shows how the pad surface cleaning system 740 can be controlled based on its position relative to the polishing fluid supply point 824.

[0070] The polishing fluid can be added at several locations on the polishing pad 104 while it rotates, such as along a path from the edge of the polishing pad 104 diameter to at least a portion of the radius of the polishing pad 104. For example, the polishing fluid can be distributed at a polishing fluid supply point 824A at an outer location, a polishing fluid supply point 824B at an inner location, or a polishing fluid supply point at a location intermediate the outer and inner locations. The polishing fluid can be distributed in a distribution path 825 (e.g., outer distribution path 825A or inner distribution path 825B) as the polishing pad 104 rotates.

[0071] The vacuum source may provide negative pressure when the vacuum port 747 (shown as vacuum port 747C in the third position and vacuum port 747D in the fourth position) is not on the distribution path 825 (shown as outer distribution path 825A or inner distribution path 825B) (as shown on this page). For example, the vacuum source may not provide negative pressure when the vacuum port 747 is within the distribution path 825, such as when vacuum port 747C is in the third position or when vacuum port 747D is in the fourth position. The vacuum source may provide negative pressure when the vacuum port 747 is outside the distribution path 825, such as when the vacuum port 747 is halfway between the third and fourth positions. Thus, the polishing fluid supply point 824 may be coordinated with the movement of the vacuum port 747 to ensure that the vacuum source provides negative pressure when the vacuum port 747 is outside the outer and inner locations of the polishing pad 104.

[0072] In some embodiments, the polishing fluid is dispensed from a slurry delivery arm 122 (FIG. 1) that moves along a path from the edge of the polishing pad 104 diameter to at least a portion of the polishing pad 104 radius.

[0073] Although Figures 7 and 8 are described with respect to a vacuum source and vacuum port 747, in some embodiments, fluid from the first fluid source and / or fluid from the second fluid source may not be provided when the outer nozzle and / or inner nozzle are on the distribution paths 725 and 825.

[0074] Exemplary System Controller for a Pad Surface Cleaning System FIG. 9 shows a functional block diagram of a system controller 190 for a pad surface cleaning system (eg, pad surface cleaning systems 340, 540, 640, and 740 in FIGS. 3-8), according to some embodiments.

[0075] The system controller 190 includes a processor 920 (e.g., a central processing unit (CPU)) in data communication with memory 910, input devices 930, and output devices 940. Although described separately, it should be appreciated that the functional blocks described with respect to the system controller 190 need not be separate structural elements. For example, the processor 920 and memory 910 may be embodied in a single chip. The processor 920 may be a general-purpose processor, a digital signal processor (“DSP”), an application-specific integrated circuit (“ASIC”), a field-programmable gate array (“FPGA”) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any suitable combination thereof designed to perform the functions described herein. A processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.

[0076] The processor 920 may be coupled to read and write information from and to the memory 910 via one or more buses. The processor may additionally or alternatively include memory, such as processor registers. The memory 910 may include a processor cache, including a multi-level hierarchical cache, with different levels having different capacities and access speeds. The memory 910 may also include random access memory (RAM), other volatile storage devices, or non-volatile storage devices. The storage may include a hard drive, flash memory, or the like. The memory 910 may also include a pad surface cleaning system application 912 used to control the vacuum source, the first fluid source, and the second fluid source, as described in FIGS. 7 and 8 . The pad surface cleaning system application 912 may be code that can be executed by the processor 920. In various instances, memory is referred to as a computer-readable storage medium. A computer-readable storage medium is a non-transitory device capable of storing information and is distinguishable from a computer-readable transmission medium, such as an electronic transitory signal, that can convey information from one location to another. The non-transitory computer-readable medium includes computer-executable instructions that, when executed by a processing system, cause the processing system to perform a method as described with reference to FIG. 10 , including flowing fluid from a first fluid source through an outer nozzle to release debris from the substrate polishing process, removing debris from the substrate polishing process through a vacuum port by creating a negative pressure using a vacuum source, flowing fluid from a second fluid source through an inner nozzle to release debris from conditioning the polishing pad, and removing debris from conditioning the polishing pad through the vacuum port by creating a negative pressure using a vacuum source. The computer-readable medium described herein may generally refer to a computer-readable storage medium.

[0077] The processor 920 may also be coupled to input devices 930 and output devices 940 for receiving input from and providing output to a user of the system controller 190, respectively. Suitable input devices include, but are not limited to, a keyboard, buttons, keys, switches, a pointing device, a mouse, a joystick, a remote control, an infrared detector, a barcode reader, a scanner, a video camera (possibly coupled with video processing software to detect, e.g., hand or facial gestures), a motion detector, or a microphone (possibly coupled with audio processing software to detect, e.g., voice commands). The input device 930 may include a position sensor, such as an encoder, to sense the position of the pad surface cleaning systems 340, 540, 640, and 740 ( FIGS. 3-8 ) and / or the slurry delivery arm 122 ( FIGS. 1 and 2 ). Suitable output devices include, but are not limited to, the adjustment base 237 (FIG. 2), a motor attached to the slurry supply arm 122, as well as visual output devices including displays and printers, audio output devices including speakers, headphones, earphones, and alarms, additive manufacturing machines, and haptic output devices.

[0078] Exemplary Methods for Conditioning a Polishing Pad FIG. 10 shows a flowchart of a method 1000 for a method for conditioning a polishing pad, according to some embodiments.

[0079] The method 1000 may be performed using any suitable processing station, such as the processing station 100 described with respect to Figures 1 and 2. The processing station 100 includes the pad surface cleaning system 340, 540, 640, or 740 described in Figures 3-6C.

[0080] In operation 1002, method 1000 includes positioning a conditioning disk relative to a polishing pad in a polishing pad cleaning system, as described above with respect to Figures 3-4C. In some embodiments, the polishing pad cleaning system includes an outer wash ring with an outer nozzle, an inner wash ring with an inner nozzle, and a vacuum ring. The outer nozzle is coupled to a first fluid source, the inner nozzle is coupled to a second fluid source, and the vacuum ring forms a vacuum port fluidly coupled to the vacuum source.

[0081] In operation 1004, the method 1000 includes flowing fluid from a first fluid source through an outer nozzle to loosen debris from the polishing pad during the substrate polishing process, as described above with respect to Figures 3-6C.

[0082] In operation 1006, the method 1000 includes removing debris from the polishing pad during the substrate polishing process through a vacuum port by creating a negative pressure using a vacuum source, as described above with respect to Figures 3-8.

[0083] In operation 1008, the method 1000 includes flowing fluid from a second fluid source through the inner nozzle to loosen debris from the polishing pad during the substrate polishing process, as described above with respect to Figures 3-6C.

[0084] In operation 1010, the method 1000 includes removing debris from the polishing pad during the substrate polishing process through a vacuum port by creating a negative pressure using a vacuum source, as described above with respect to Figures 3-8.

[0085] In some embodiments, debris from a substrate polishing process is generated by polishing a substrate using a polishing pad.

[0086] In some embodiments, flowing fluid from a first fluid source and removing debris from the substrate polishing process, and flowing fluid from a second fluid source and removing debris from conditioning the polishing pad are performed simultaneously while polishing a substrate using the polishing pad.

[0087] Some embodiments further include rotating the polishing pad. Some embodiments further include dispensing a polishing fluid onto the polishing pad. Some embodiments further include moving a polishing pad cleaning system and a conditioning disk over the surface of the polishing pad, where the negative pressure is created using a vacuum source when the vacuum port is outside the distribution path of the polishing fluid. Some embodiments further include moving a polishing fluid supply arm over the polishing pad so that the polishing fluid is applied at several locations on the polishing pad.

[0088] Although the operations of method 1000 have been described with respect to FIGS. 1-8, one skilled in the art will understand that any system configured to perform the operations of method 1000 in any order falls within the scope of the embodiments described herein.

[0089] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, which scope is determined by the following claims.

Claims

1. 1. A polishing pad cleaning system for a substrate polishing process, the polishing pad cleaning system comprising: an outer wash ring including an outer nozzle, the outer nozzle configured to be coupled to a first fluid source; an inner wash ring including an inner nozzle, the inner nozzle configured to be coupled to a second fluid source; a vacuum ring, the vacuum ring defining a vacuum port configured to be fluidly coupled to a vacuum source; Equipped with a conditioning disk disposed within the polishing pad cleaning system and configured to condition the polishing pad; the outer nozzle is configured to emit debris from the substrate polishing process; the inner nozzle is configured to emit debris from conditioning the polishing pad; The polishing pad cleaning system, wherein the vacuum ring is configured to remove the debris released by the outer wash ring and the inner wash ring.

2. The polishing pad cleaning system of claim 1 , wherein the inner wash ring is disposed within the vacuum ring, and the vacuum ring is disposed within the outer wash ring.

3. The polishing pad cleaning system of claim 1 , wherein the outer nozzles, the inner nozzles, and the vacuum ports are each arranged around an arc, a semicircle, or a circle.

4. The polishing pad cleaning system of claim 1 , wherein the outer wash ring, the vacuum ring, and the inner wash ring are integrally formed.

5. 2. The polishing pad cleaning system of claim 1, wherein the vacuum ring comprises a first vacuum ring and a second vacuum ring, the first vacuum ring being positioned downstream and adjacent to the outer wash ring, and the second vacuum ring being positioned downstream and adjacent to the inner wash ring.

6. The polishing pad cleaning system of claim 1 , wherein the vacuum port is located downstream of the outer nozzle and the inner nozzle.

7. the polishing pad cleaning system comprises a first zone, a second zone, and a boundary line separating the first zone and the second zone; the boundary line is perpendicular to the edge of the polishing pad; the outer nozzle is configured to project debris in the first zone and the inner nozzle is configured to project debris in the second zone; The polishing pad cleaning system of claim 1 .

8. The polishing pad cleaning system of claim 1 , wherein the second fluid source is the same as the first fluid source.

9. The polishing pad cleaning system of claim 1 , wherein the polishing pad cleaning system is configured to surround the conditioning disk.

10. 1. A conditioning system for conditioning a polishing pad, the conditioning system comprising: a conditioning module comprising a conditioning arm and a conditioning head configured to move a conditioning disk relative to the polishing pad; a polishing pad cleaning system coupled to the conditioning arm, the polishing pad cleaning system comprising: an outer wash ring including an outer nozzle configured to couple to a first fluid source; a vacuum ring including a vacuum port configured to couple to a vacuum source; an inner wash ring including an inner nozzle configured to couple to a second fluid source; a polishing pad cleaning system comprising: An adjustment system comprising:

11. 11. The conditioning system of claim 10, wherein the conditioning head is configured to rotate the conditioning disk about an axis of rotation of the conditioning head, and the polishing pad cleaning system remains stationary relative to the axis of rotation of the conditioning head.

12. The conditioning system of claim 10 , wherein the conditioning head is configured to rotate the conditioning disk and the polishing pad cleaning system about an axis of rotation of the conditioning head.

13. The polishing pad cleaning system of claim 10 , wherein the outer nozzles, the inner nozzles, and the vacuum ports are each arranged around an arc, a semicircle, or a circle.

14. 11. The polishing pad cleaning system of claim 10, wherein the vacuum ring comprises a first vacuum ring and a second vacuum ring, the first vacuum ring being positioned downstream and adjacent to the outer wash ring, and the second vacuum ring being positioned downstream and adjacent to the inner wash ring.

15. The polishing pad cleaning system of claim 10 , wherein the vacuum port is located downstream of the outer nozzle and the inner nozzle.

16. 1. A method for conditioning a polishing pad, comprising: placing a conditioning disk against a polishing pad in a polishing pad cleaning system, the polishing pad cleaning system comprising: an outer wash ring including an outer nozzle, the outer nozzle coupled to a first fluid source; an inner wash ring including an inner nozzle, the inner nozzle coupled to a second fluid source; a vacuum ring, the vacuum ring forming a vacuum port fluidly coupled to a vacuum source; placing an adjustment disc; flowing fluid from the first fluid source through the outer nozzle to loosen debris from the polishing pad during a substrate polishing process; removing the debris from the polishing pad during the substrate polishing process through the vacuum port by creating a negative pressure using the vacuum source; flowing fluid from the second fluid source through the inner nozzle to loosen debris from the polishing pad during the substrate polishing process; removing the debris from the polishing pad during the substrate polishing process through the vacuum port by creating a negative pressure using the vacuum source; A method comprising:

17. 17. The method of claim 16, wherein the debris from the substrate polishing process is generated by polishing a substrate using the polishing pad.

18. 18. The method of claim 17, wherein flowing the fluid from the first fluid source, removing the debris from the polishing pad, flowing the fluid from the second fluid source, and removing the debris from the polishing pad are performed simultaneously while polishing a substrate using the polishing pad.

19. rotating the polishing pad; dispensing a polishing fluid onto the polishing pad; moving the polishing pad cleaning system and the conditioning disk over the surface of the polishing pad, the negative pressure being created using the vacuum source when the vacuum port is outside the polishing fluid distribution path; 17. The method of claim 16, further comprising:

20. 20. The method of claim 19, further comprising moving a polishing fluid delivery arm across the polishing pad so that the polishing fluid is applied at several locations on the polishing pad.

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