Antenna equipment and automatic test equipment

Abstract

The present invention describes an antenna device. The antenna device includes a printed circuit board (PCB) with an opening, and at least two probes are disposed on or within the printed circuit board so as to be orthogonal to each other. The antenna device includes a cavity between a portion of the PCB carrying the probes and a waveguide back-short, forming a dual-polarized waveguide between the portion of the PCB carrying the probes and the waveguide back-short. The opening in the printed circuit board is disposed in a central region around a central axis of the cavity, and the cavity has a depth of one-quarter wavelength (λ / 4) plus an integer multiple of one-half wavelength. The present invention provides an antenna design for use in a socket for OTA testing using automatic test equipment providing wideband.

Description

[Technical Field]

[0001] FIELD OF THE INVENTION Embodiments of the present invention relate to over-the-air testing of antenna modules, and more particularly to using an antenna device integrated into a socket for over-the-air (OTA) testing of antennas in packaged modules.

[0002] The embodiment of the present invention relates to an antenna device.

[0003] FIELD OF THE INVENTION The present invention relates to automatic test equipment.

[0004] Embodiments of the present invention can be used for OTA testing for far-field and radiated near-field applications, as well as for applications such as 5G, 6G, WiGig and mmWave radar.

[0005] According to one aspect, embodiments of the present invention can be applied to provide an optimized concept for OTA testing using automatic test equipment. [Background technology]

[0006] A large number of antenna devices are currently known.

[0007] The use of in-socket antenna devices for over-the-air (OTA) test and measurement can present several challenges. OTA test and measurement applications have different requirements than antenna design for antenna-in-package (AiP) antenna arrays. Therefore, simply copying the antenna topology used in AiP antenna arrays, such as those in 5G modules, will not provide any advantage.

[0008] The key requirements for OTA applications are: 1. In OTA applications, the measurement antenna is often a single antenna, not an array, so the size of the antenna is not important. 2. The gain of the antenna is not important since it is used in the radiating near field and the entire measurement setup is calibrated. 3. It is desirable, and in some cases even most important, to have a wide bandwidth that covers all frequencies to be tested.

[0009] In view of the above, it would be desirable to create an antenna design that can be used (or is usable) in a socket for OTA testing using automated test equipment that provides a wide bandwidth. Summary of the Invention [Problem to be solved by the invention]

[0010] One embodiment of the present invention provides an antenna device, e.g., an antenna device for OTA socket measurements, e.g., a wideband antenna device. The antenna device includes a printed circuit board (PCB) with an aperture (e.g., a substantially square hole), and at least two, e.g., orthogonal, e.g., pin-shaped probes, are arranged orthogonally on or within the PCB, e.g., for coupling with two orthogonal modes of a waveguide. The antenna device includes a cavity, e.g., a back-short cavity, e.g., having a rectangular cross-section, a square cross-section, or a circular cross-section, disposed between a portion of the PCB carrying the probe, e.g., an aperture cutout or a layer of the PCB carrying the probe, and the waveguide back-short. The waveguide back-short may be formed, e.g., by a metal base plate or, e.g., by one layer of a multi-layer PCB. The cavity forms a waveguide (preferably a dual-polarization waveguide), e.g., a rectangular hollow waveguide, a square hollow waveguide, or a circular hollow waveguide, between the portion of the PCB carrying the probe and the waveguide back-short. The opening in the printed circuit board is positioned in a central region around the central axis of the cavity, and the cavity has a depth of a quarter wavelength, e.g., λ / 4 of the guide wavelength of the waveguide formed by the cavity, plus an integer multiple of half wavelengths, where the integer may be equal to or greater than 0, and the wavelength is set to the center frequency of the device.

[0011] It should be noted that technically reasonable tolerances should be taken into account: for example, an acceptable tolerance on a dimension (e.g., on the depth of a cavity) may be ±1 / 16 of a wavelength, or ±1 / 8 of a wavelength.

[0012] It should be noted that, because embodiments create very wideband devices, there will naturally be wavelength variations as the wavelength shifts from the center frequency to the band edges, and in some cases these variations may exceed the specified 1 / 16 tolerance on the physical length of the backshort.

[0013] This embodiment of the present invention is based on the finding that a quarter wavelength distance between the probe and the backshorting plate provides a wide antenna operating frequency range for the antenna arrangement. Furthermore, this embodiment is based on the finding that an antenna structure with good characteristics can be achieved when the antenna includes the above-described waveguide transition with a backshorting. It has been found that a waveguide backshorting with a quarter wavelength is advantageous for good or proper operation.

[0014] Therefore, there is no need to change the antenna to cover different frequency bands, minimizing implementation costs.

[0015] Furthermore, the described antenna geometries have been found to be suitable for coupling to one or more antennas of a device under test (DUT) in automatic test equipment. For example, a cavity between a printed circuit board and a backshort may provide good matching and may help to efficiently couple to the radiating near-field of the DUT antenna. The cavity has also been found to improve the broadband characteristics of the antenna structure.

[0016] According to one embodiment, a probe is positioned in or on the printed circuit board in a region of the printed circuit board adjacent to the cavity, between the printed circuit board and the waveguide backshort, such that the probe couples to an electromagnetic mode of the cavity. Such a probe placement is configured such that the probe excites a principal orthogonal mode of the waveguide, for example, inside an aperture cutout. However, this geometry may allow coupling to other modes of the waveguide, such as evanescent modes that couple into the radiating near-field of the DUT antenna.

[0017] According to one embodiment, the probes form at least one orthogonal pair of probes, and are adapted to measure at least two orthogonal modes of the waveguide, e.g., (TE 10 and T.E. 01 ), which allows testing of devices that receive or transmit using different polarizations or using circular polarization.

[0018] According to one embodiment, the probe is connected to at least two microstrip lines formed on or within the printed circuit board in an area of ​​the printed circuit board that is not adjacent to the cavity between the printed circuit board and the waveguide backshort, the microstrip lines forming a feed network for the probe and connected to the port, for example, via a transmission line. Such a concept allows for cost-effective implementation, for example, since both the probe and the feed can be realized on a single printed circuit board. The appropriate impedance or impedance matching function of the feed lines can be achieved by an appropriate geometric layout (or design) (or impedance) of the feed lines.

[0019] According to one embodiment, the probe's feed network is connected to each differential port via a respective differential line transition. Differential feeding provides symmetry to the antenna circuit, increasing decoupling between the orthogonal arms and helping to widen the operating bandwidth. The feed network can be connected to a differential line transition with, for example, a 100 Ω differential interface. This allows versatility for integrating the antenna circuit with transmit / receive chain components on the same board.

[0020] According to one embodiment, one or more probe feed networks having a first direction and one or more probe feed networks having a second direction orthogonal to the first direction (e.g., a first probe of an orthogonal pair and a second probe of an orthogonal pair) are disposed on different layers, e.g., opposite layers, of a printed circuit board, with a ground layer sandwiched therebetween, such that the ground layer shields the different feed networks even in areas where the different feed networks intersect in a plane view of the PCB. Placing the probe feed networks on opposite layers of the PCB facilitates routing and provides high isolation. Furthermore, PCB processing is simplified because blind or buried vias are not required. Furthermore, multilayer printed circuit board manufacturing is a standard technology today, enabling cost-effective solutions with good performance. Furthermore, the use of multilayer PCBs simultaneously enables quasi-three-dimensional shaping of probes using multiple layers.

[0021] According to one embodiment, the antenna arrangement comprises four probes arranged in two orthogonal pairs and positioned in a region of the printed circuit board adjacent to the cavity between the printed circuit board and the waveguide backshort, e.g., positioned such that the probes couple to the modes of the cavity and are aligned with the principal orthogonal modes TE of the waveguide. 10 and T.E. 01 However, the probe may (optionally) couple to other modes of the waveguide, which may be advantageous under near-field conditions.

[0022] According to one embodiment, four probes are connected to respective microstrip lines in or on the printed circuit board in a region of the printed circuit board not adjacent to the cavity between the printed circuit board and the waveguide backshort, with two probes having a first orientation, e.g., two collinear probes, coupled to a first differential port, e.g., using respective microstrip lines and / or using two differential transmission lines, and two probes having a second orientation, e.g., two other collinear probes, coupled to a second differential port, e.g., using respective microstrip lines and / or using two differential transmission lines. The differential feeding provides symmetry to the antenna circuit, increasing decoupling between the orthogonal arms and helping to widen the operating bandwidth.

[0023] According to one embodiment, the printed circuit board comprises at least three layers, preferably four layers. Thus, so-called "thick probes" (using multiple layers of a printed circuit board, which may be connected using vias, for example) may be created. As a result, for example, good (e.g., broadband) coupling between the probe and the electromagnetic field in the waveguide can be achieved with less effort. For example, it has been found that thickening the probe along the direction perpendicular to the PCB increases the operating bandwidth. Also, using multiple PCB layers helps improve matching and broadband characteristics.

[0024] According to one embodiment, the printed circuit board is arranged (e.g., attached) to a surface, e.g., the top surface, of a metal base plate, and the cavity is formed in the metal base plate, e.g., in an upper part of the metal base plate, e.g., the metal base plate also forms the waveguide back short. Thus, miniaturization of the antenna device is realized. Also, fabrication is relatively simple, e.g., milling techniques may be used.

[0025] According to one embodiment, the printed circuit board is a multilayer printed circuit board, e.g., a thick one, e.g., having five or more layers, e.g., eight or more layers, and the waveguide back-short is implemented using one of the printed circuit board layers, e.g., a metal layer, as a PCB layer, and / or the cavity boundaries, e.g., sidewall boundaries, are implemented using vias that penetrate the multilayer printed circuit board, e.g., plated-through via holes that may penetrate multiple layers of the PCB. Through holes inside the aperture cutouts can be provided to increase the antenna bandwidth. Such an approach allows antenna structures to be cost-effectively manufactured using PCB manufacturing techniques. Using such an approach, it has been found that the characteristics of such structures are good enough for many test requirements, even if the cavity characteristics (e.g., cavity walls) are not optimal.

[0026] According to one embodiment, the cavity has a width of half a wavelength (λ / 2), such dimensions have been found to provide good properties for the antenna structure.

[0027] According to one embodiment, the probe has a length equal to the depth of the cavity within a tolerance of 1 / 16 wavelength, it being recognized that such dimensions result in particularly good antenna characteristics.

[0028] According to one embodiment, the probe penetrates multiple layers of the PCB, connecting through one or more probe vias, recognizing that this improves the broadband performance of the antenna structure while still being able to be implemented at a reasonable cost.

[0029] According to one embodiment, the antenna device further comprises an upper metal plate, in which an additional waveguide section is formed, the additional waveguide section being an extension of the waveguide formed by the cavity, the additional waveguide section increasing the antenna bandwidth.

[0030] According to one embodiment, a printed circuit board is disposed between a metal base plate and an upper metal plate, thus providing a two-part waveguide. Furthermore, such a layout (or design) can be used to easily manufacture a feed structure, for example, by milling grooves in the metal base plate or the upper metal plate along the feed traces on the printed circuit board.

[0031] According to one embodiment, the differential transmission lines are provided with a shield adjacent thereto, providing improved isolation. Such shielding can be provided, for example, using a metal base plate and / or a top metal plate.

[0032] According to one embodiment, the antenna device comprises one or more external connections, e.g., blind-mate waveguide connections, where a first external connection, e.g., the first waveguide connection, is coupled to one or more probes having a first orientation and / or a second external connection, e.g., the second waveguide connection, is coupled to one or more probes having a second orientation, which may be orthogonal to the first orientation. Thus, improved routing and isolation are provided. Using such connections, the antenna device may be coupled to, for example, one or more signal sources and / or one or more signal receivers of an automatic test equipment. Thus, the antenna device may be coupled to, for example, a test head of the automatic test equipment using one or more external connectors.

[0033] According to one embodiment, the one or more external connections are waveguide connections, it being recognized that waveguide connections are particularly prone to low wear and are therefore suitable for high volume testing where the antenna arrangement is frequently connected and disconnected from automatic test equipment.

[0034] According to one embodiment, one or more external connections are blind-mate connections, such as blind-mate waveguide connections. The blind-mate waveguide connections can be used, for example, to connect millimeter-wave signals from a measurement antenna to measurement equipment in an automatic test instrument. The blind-mate feature of the external connectors allows for rapid connection and disconnection, controlled, for example, by a robotic handler, thus enabling high test throughput.

[0035] According to one embodiment, the one or more external connections are aligned, e.g., contacted, in the same direction as the main radiation direction of the antenna arrangement, such that the antenna arrangement can be placed on the "top" of the device under test, which may be located in a test socket located on a DUT board, and can return signals in a direction towards the DUT board (e.g., towards the opening of the DUT port where the high frequency connections are located).

[0036] According to one embodiment, the antenna arrangement comprises an electromagnetically permeable, e.g. electromagnetically transparent, cover covering the waveguide, thus protecting the waveguide and which may also serve to press the device under test into a desired position (e.g. a test socket).

[0037] According to one embodiment, the cover is configured to allow passage of electromagnetic radiation from the waveguide towards the device under test and vice versa while pushing the device under test into the device under test location, e.g., a test socket. Thus, the antenna arrangement can (at least partially) take over the function of the pusher, which helps to reduce costs and speed up replacement of the device under test.

[0038] An embodiment according to the invention provides for the production of automatic test equipment (ATE), the automatic test equipment comprising an antenna arrangement according to any one of the preceding claims, the automatic test equipment being configured to test a device under test, e.g. a radio device under test, e.g. an antenna-in-package device under test, using the antenna arrangement.

[0039] The automatic test equipment according to this embodiment is based on similar considerations as the antenna device described above. Furthermore, this disclosed embodiment may optionally be supplemented by any other features, functions and details disclosed herein relating to the antenna device, either individually or in combination.

[0040] One embodiment of the present invention creates an automatic test equipment that includes a device under test socket and one or more, e.g., blind-mate, high frequency connectors, e.g., waveguide connectors, positioned adjacent to the test socket for establishing a high frequency connection, e.g., with an antenna arrangement.

[0041] The automatic test equipment according to this embodiment is based on similar considerations as the antenna device described above. Furthermore, this disclosed embodiment may optionally be supplemented by any other features, functions and details disclosed herein relating to the antenna device, either individually or in combination.

[0042] According to one embodiment, the test socket and one or more high-frequency connectors are arranged so that one or more external connection portions of the antenna device mate with the one or more high-frequency connectors, and the cover of the antenna device is arranged so that when the one or more external connection portions of the antenna device mate with the one or more high-frequency connectors, the cover of the antenna device presses the device under test into the device under test socket.

[0043] The antenna device and automatic test equipment may optionally be supplemented by any of the features, functions and details disclosed in this specification (the entire document), either individually or in combination. [Brief explanation of the drawings]

[0044] Preferred embodiments of the present application are described below with reference to the following drawings: [Figure 1] 1 is a diagram illustrating an antenna device according to an embodiment; [Figure 2A]1 is a diagram illustrating an antenna device according to an embodiment in an exploded state; [Figure 2B] 2B is a diagram illustrating the antenna device of FIG. 2A in an assembled state according to one embodiment. [Figure 2C] 2B is a cross-sectional view showing the antenna device of FIG. 2A in an assembled state according to one embodiment. [Figure 3A] 1 is a diagram showing an antenna device according to an embodiment in an assembled state; [Figure 3B] 1 is a diagram showing an antenna device according to an embodiment in an assembled state without an upper metal plate. [Figure 3C] 2B is a schematic diagram of the antenna device of FIG. 2A according to an embodiment; [Figure 4A] 1 is a diagram illustrating an antenna device according to an embodiment; [Figure 4B] 4B is a rear view of the antenna device of FIG. 4A according to one embodiment. [Figure 4C] 4B is an enlarged cross-sectional view of the antenna device of FIG. 4A according to one embodiment. [Figure 4D] 4B is an enlarged cross-sectional view schematically illustrating the antenna device of FIG. 4A according to one embodiment. [Figure 5A] 1 is a diagram illustrating an antenna device according to an embodiment; [Figure 5B] 5B illustrates the antenna device of FIG. 5A within a housing according to one embodiment. [Figure 5C] 5C is an exploded view of the antenna device of FIG. 5B according to one embodiment. [Figure 5D] 5B is an exploded view of the antenna device of FIG. 5A according to one embodiment. FIG. [Figure 6A] 10A and 10B are diagrams illustrating antenna simulation results of the antenna device according to the embodiment. [Figure 6B] 10A and 10B are diagrams illustrating antenna simulation results of the antenna device according to the embodiment. [Figure 7A] FIG. 1 illustrates an automatic test equipment according to one embodiment. [Figure 7B] FIG. 1 illustrates an automatic test equipment according to one embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0045] FIG. 1 shows an antenna device 100 according to one embodiment. The antenna device 100 includes a printed circuit board (PCB) 110 having an opening 111 and at least two probes 112 arranged orthogonally to each other within the PCB. The opening 111 is, for example, a substantially square hole. Although FIG. 1 shows two orthogonal probes 112, in an embodiment, four probes forming two orthogonal pairs can be arranged on the PCB 110.

[0046] The antenna device 100 includes a back-short 120, which may be formed, for example, by a metal base plate, or may be formed, for example, by one layer of a multi-layer PCB.

[0047] The antenna device 100 includes a cavity 130 between a portion (e.g., an aperture cutout) of the PCB 110 carrying the probe 112 or multiple layers of the PCB 110 carrying the probe 112 and the backshort 120. The cavity 130 may have, for example, a rectangular or square cross section. The cavity 130 forms a waveguide between the portion of the printed circuit board 110 carrying the probe 112 and the backshort 120 (e.g., a waveguide backshort 120). The opening 111 in the printed circuit board 110 is disposed in a central region around the central axis of the cavity 130. The cavity 130 has a depth of λ / 4, a quarter wavelength (e.g., the guide wavelength of the waveguide formed by the cavity), plus an integer multiple of λ / 4 half wavelengths, where the integer may be equal to or greater than 0, and the wavelength is set to the center frequency of the device.

[0048] Probe 112 is positioned on (or within) printed circuit board 110 in a region 113 of printed circuit board 110 adjacent cavity 130 such that probe 112 couples to a mode of cavity 130 .

[0049] The probes 112 form an orthogonal pair of probes 112 and are configured to excite at least two orthogonal modes in the waveguide.

[0050] The probe 112 is connected to at least two microstrip lines 114 formed on or within the printed circuit board 110 in a region 115 of the printed circuit board 110 not adjacent to the cavity 130. The microstrip lines 114 form a feed network for the probe and are connected to the ports, for example, via transmission lines. In one embodiment, the feed network for the probe 112 can be connected to each differential port, for example, via respective differential line transitions.

[0051] The feed networks of one or more probes 1121 having a first direction and the feed networks of one or more probes 1122 having a second direction perpendicular to the first direction are arranged on different layers of the printed circuit board 110, for example on opposite layers, for example with a ground layer sandwiched between them so that the ground layer shields the different feed networks.

[0052] However, it should be noted that the antenna device 100 may optionally be supplemented by any of the features, functions and details disclosed herein, either individually or in combination.

[0053] 2A to 2C show an antenna device 200 according to one embodiment.

[0054] 2A shows the antenna device 200 in an exploded state. As shown in FIG. 2A, the antenna device 200 includes a printed circuit board (PCB) 210 having an opening 211 and four probes 212 arranged in two orthogonal pairs. The opening 211 is a substantially square hole. The opening 211 is a through-hole for widening the bandwidth of the antenna.

[0055] The antenna device 200 includes a backshort 220. The backshort 220 is formed by a metal base plate. The printed circuit board 210 is disposed (e.g., attached) on the top surface of the metal base plate, and a cavity 230 is formed in an upper portion of the metal base plate, which also forms the waveguide backshort 220. The cavity 230 has a shape that generally corresponds to the opening 211.

[0056] Thus, the antenna device 200 includes a cavity 230 between a portion of the PCB 210 (i.e., the aperture cutout) carrying the probe 212 and the backshort 220. The cavity 230 is shown to have a square cross-section. However, the cavity 230 may have, for example, a rectangular, circular, or elliptical cross-section. The cavity 230 forms a waveguide between the portion of the PCB 210 carrying the probe 212 and the waveguide backshort 220. The opening 211 in the printed circuit board 210 is disposed in a central region around the central axis of the cavity 230. The cavity 230 has a depth of λ / 4, a quarter wavelength (e.g., the guide wavelength of the waveguide formed by the cavity), plus an integer multiple of λ / 4 half wavelengths, where the integer may be equal to or greater than 0, and the wavelength is set to the center frequency of the device.

[0057] The probes 212 are arranged in two orthogonal pairs, which are located on the printed circuit board 210 in a region 213 of the printed circuit board 210 adjacent to the cavity 230 between the printed circuit board 210 and the waveguide backshort 220, such that the probes couple to the electromagnetic modes of the cavity, and the principal orthogonal modes TE of the waveguide. 10 and T.E. 01 is configured to excite the

[0058] Four probes 212 are connected to respective microstrip lines 214 on the printed circuit board 210 in a region 215 of the printed circuit board 210 not adjacent to the cavity 230. Two probes 2121 have a first direction and represent two collinear probes. Two probes 2121 are coupled to a first differential port 2171 using respective microstrip lines 2141 and a differential line 2161. Two probes 2122 have a second direction and represent two separate collinear probes. Two probes 2122 are coupled to a second differential port 2172 using respective microstrip lines 2142 and a differential line 2162. The first direction is orthogonal to the second direction. The differential feeding provides symmetry to the antenna circuit, increases decoupling between the orthogonal arms, and widens the operating bandwidth. The differential transmission lines may, for example, be provided with a shield adjacent thereto.

[0059] The metal base plate 220 comprises a portion configured to accommodate the microstrip line 2142 and the differential line 2162, e.g., a channel 229 made in an upper portion of the metal base plate 220 corresponding to the microstrip line 2142 and the differential transmission line 2162. The metal base plate 220 also comprises a cutout corresponding to the second differential port 2172, e.g., a cutout that is open upward.

[0060] The feed networks of the two probes 2121 having a first direction and the feed networks of the two probes 2122 having a second direction orthogonal to the first direction are arranged on opposite layers of the printed circuit board 210, e.g., with a ground layer sandwiched between them so that the ground layer shields the different feed networks. Placing the feed networks on opposite layers of the printed circuit board 210 facilitates routing and provides high isolation. This simplifies the PCB process by eliminating the need for blind or buried vias. The feed networks are connected to differential lines 216 with a 100 Ω differential interface. This provides the versatility to integrate antenna circuits with transmit / receive chain components on the same board.

[0061] The cavity 230 has a width of half a wavelength λ / 2. The probe 212 preferably has an electrical length equal to (at least approximately) the depth of the cavity, e.g., within a tolerance of 1 / 16 wavelength. For example, the length of the probe may depend on the particular dielectric material of the PCB. For example, if an alumina substrate is used, the length of the probe will be shorter (e.g., shorter than the depth of the cavity). However, for example, the electrical length (i.e., length in wavelengths) can be considered to be approximately the same for different materials.

[0062] The antenna device 200 further comprises an upper metal plate 240 in which an additional waveguide section 250 is formed, the additional waveguide section 250 being an extension of the waveguide formed by the cavity 230 .

[0063] The upper metal plate may comprise channels made in the bottom of the upper metal plate 240 corresponding to, for example, the microstrip line 2141 and the differential line 2161. The upper metal plate 240 may comprise cutouts, for example cutouts that open downwards, such as the cutout 241 shown in FIG. 2B corresponding to the first differential port 2171.

[0064] The printed circuit board 210 is disposed between a metal base plate 220 and an upper metal plate 240. As shown in the following figures, the printed circuit board 210 is sandwiched between the metal base plate 220 and the upper metal plate 240.

[0065] The antenna device may, for example, comprise one or more external connection portions (e.g., blind-mate waveguide connection portions), where a first external connection portion (e.g., first waveguide connection portion) is coupled to one or more probes having a first direction, and / or a second external connection portion (e.g., second waveguide connection portion) is coupled to one or more probes having a second direction that may be orthogonal to the first direction.

[0066] The one or more external connections may be, for example, waveguide connections.

[0067] One or more of the external connections may be, for example, blind-mate connections, such as blind-mate waveguide connections.

[0068] The one or more external connection portions may be aligned in the same direction as the main radiation direction of the antenna device 200, for example, so as to make contact in the same direction as the main radiation direction.

[0069] 2B is a diagram illustrating the antenna apparatus of FIG. 2A in an assembled state according to one embodiment. As shown in FIG. 2B, PCB 210 is disposed between metal base plate 220 and upper metal plate 240. PCB 210 is sandwiched between metal base plate 220 and upper metal plate 240.

[0070] The cavity 230 and corresponding waveguide are not visible in Figure 2B because the cavity 230 is located on top of the waveguide backshort 220 and is closed by the PCB 210 and the top plate 240. An additional waveguide section 250 is shown formed in the upper metal plate 240.

[0071] The cutouts 241 are formed in the bottom of the upper metal plate 240 and one on each of two matching sides of the upper metal plate 240. The cutouts 241 are located above respective microstrip lines 2141 located on the upper portion of the printed circuit board 210, in an area 215 of the printed circuit board 210 not adjacent to the cavity 230. The cutouts have a generally rectangular shape.

[0072] FIG. 2C is a cross-sectional view of the antenna device 200 according to the embodiment in an assembled state.

[0073] 2C, the printed circuit board 210 includes multiple layers. The printed circuit board 210 may include at least three layers, and preferably four layers. The probes 212 utilize multiple PCB layers that are connected through probe vias 218, for example, passing through or passing through the multiple PCB layers.

[0074] 2C as being disposed on top of the waveguide back-short 220 between the waveguide back-short 220 and the PCB 210. An additional cutout 221 is disposed in the upper portion of the waveguide back-short 220. The additional cutout 221 may have a depth that is, for example, at least two times smaller (or only two times smaller) than the depth of the cavity 230. However, it should be noted that there is no strict requirement for the depth of the cutout. For example, it is desirable (but not necessarily) that the depth not be too small so as to affect the transmission line impedance. The additional cutout 221 is formed to accommodate each microstrip line 2142 and two separate differential transmission lines 2162 that couple the probe 2122 to the second differential port 2172.

[0075] Cavity 230 may have, for example, a square cross section. Cavity 230 forms a waveguide between the portion of printed circuit board 210 carrying probe 212 and waveguide backshort 220. Opening 211 in printed circuit board 210 is located in a central region about the central axis of cavity 230. Cavity 230 has a depth of λ / 4, a quarter wavelength (e.g., the guide wavelength of the waveguide formed by the cavity), plus an integer multiple of λ / 4 half wavelengths, where the integer may be equal to or greater than 0, and the wavelength is set to the center frequency of the device.

[0076] However, it should be noted that the antenna device 200 may optionally be supplemented by any of the features, functions and details disclosed herein, either individually or in combination.

[0077] 3A to 3C show an antenna device 300 according to one embodiment.

[0078] 3A shows the antenna device 300 in an assembled state. As shown in FIG. 3A, the antenna device 300 includes a printed circuit board (PCB) 310 having an aperture 311 and four probes 312 arranged in two orthogonal pairs. The aperture 311 is shown as a substantially square hole. However, the aperture 311 may have, for example, a substantially rectangular hole, a substantially oval hole, or a substantially circular hole. The corners of the square are shown rounded. The aperture 311 is a through hole for widening the antenna bandwidth.

[0079] The antenna device 300 includes a back-short 320. The back-short 320 is formed by a metal base plate. The printed circuit board 310, which may correspond to the printed circuit board 210, is disposed on (e.g., attached to) the top surface of the metal base plate, and a cavity (not shown) is formed in the upper portion of the metal base plate, which also forms the waveguide back-short 320.

[0080] The antenna device 300 further comprises an upper metal plate 340 in which an additional waveguide portion 350 is formed, the additional waveguide portion 350 being an extension of the waveguide formed by the cavity (not shown).

[0081] The printed circuit board 310 is disposed, eg, sandwiched, between a metal base plate 320 and an upper metal plate 340 .

[0082] Four probes 312 are connected to respective microstrip lines (not visible below upper metal plate 340) on printed circuit board 310 in a region 315 of printed circuit board 310 not adjacent to the cavity. Two probes 3121 have a first orientation and represent two collinear probes. Two probes 3121 are coupled to a first port (e.g., in the form of a coaxial connector 3601) using a microstrip line 3171 (which may extend partially below upper metal plate 340), a differential line 3161 (not visible below upper metal plate 340), and another microstrip line 3141; a balun 319 (not shown in FIG. 3A ) may be present between microstrip line 3171 and differential line 3161. Two probes 3122 have a second orientation and represent two other collinear probes. The two probes 3122 are coupled to a second port (e.g., in the form of a coaxial connector 3602) using a microstrip line and (e.g., two) differential lines (not shown), and respective microstrip lines (not shown), with a balun (not shown) between the microstrip lines and the differential lines. The first direction is orthogonal to the second direction. The differential feed provides symmetry to the antenna circuit, increases decoupling between the orthogonal arms, and widens the operating bandwidth. The differential transmission lines may, for example, be provided with a shield adjacent to them.

[0083] The PCB 310 is shown to extend beyond the size of the metal base plate 320 and the upper metal plate 340. The sizes of the metal plate 320 and the PCB 310 can be different and the ratio between them is arbitrary. This depends on the mechanism, not the operation, of the device.

[0084] Two coaxial connectors 360 are attached to the PCB 310. A first coaxial connector 3601 is arranged to connect the first microstrip line 3171 to a measuring instrument. A second coaxial connector 3602 is arranged to connect the second microstrip line (not shown) to a measuring instrument.

[0085] Figure 3B shows the antenna device 300 in an assembled state without the top metal plate 340. As shown in Figure 3B, a printed circuit board (PCB) 310 includes an opening 311 and four probes 312 arranged in two orthogonal pairs.

[0086] The four probes 312 are connected to respective microstrip lines 314 on the printed circuit board 310 in a region 315 of the printed circuit board 310 not adjacent to the cavity 330. Two probes 3121 have a first direction and represent two collinear probes. The two probes 3121 are coupled to a first differential port 3181 using respective microstrip lines 3141 and a differential line 3161. The two probes 3122 have a second direction and represent two other collinear probes. The two probes 3122 are coupled to a second differential port (not shown) using respective microstrip lines (not shown) and a different differential line (not shown). The first direction is orthogonal to the second direction. The differential feed provides symmetry to the antenna circuit, increases decoupling between the orthogonal arms, and widens the operating bandwidth. The differential transmission lines may, for example, be provided with a shield adjacent thereto.

[0087] The first differential port 3181 is connected to a microstrip line 3171 via a balun 319. The microstrip line 3171 is connected to a first coaxial connector 3601, which connects the first differential port 3181 to a corresponding measuring instrument.

[0088] The second coaxial connector 3602 is positioned upside down relative to the first coaxial connector 3601 to connect a second differential port located on the bottom surface of the PCB 310 to a corresponding measuring instrument.

[0089] The first and second coaxial connectors 360 are attached (e.g., fastened) to matching sides of the PCB 310 by screws 362. The first and second coaxial connectors 360 are attached upside down relative to one another, e.g., positioned in planes rotated 180 degrees relative to one another.

[0090] A plurality of plated-through via holes 390 form the sidewalls of the backshort 320 and correspondingly form the sidewalls of the cavity 330 .

[0091] The cavity sidewalls or waveguide sidewalls, eg, sidewall boundaries, of cavity 330 are implemented using vias 390 that penetrate multilayer printed circuit board 310, eg, plated-through via holes that may penetrate multiple layers of printed circuit board 310.

[0092] A plurality of, eg, plated, through-via holes 391 form the shield, eg, route, of each microstrip line.

[0093] 3C is a schematic diagram of the antenna device 300. FIG. 3C shows only the PCB 310 (top view) and the coaxial connector 360 of the antenna device 300.

[0094] As shown in FIG. 3C, the antenna device 300 comprises a printed circuit board (PCB) 310 with an aperture 311 and four probes 312 arranged in two orthogonal pairs.

[0095] The probes 312 are arranged in two orthogonal pairs, which are positioned on the printed circuit board 310 in a region 313 of the printed circuit board 310 adjacent to the cavity 330 between the printed circuit board 310 and the waveguide backshort 320 so that the probes couple to the electromagnetic modes of the cavity.

[0096] Four probes 312 are connected to respective microstrip lines 314 on the printed circuit board 310 in a region 315 of the printed circuit board 310 not adjacent to the cavity 330. Two probes 3121 use respective microstrip lines 3141 and are coupled to a first differential port 3181 using a differential line 3161. Two probes 3122 have a second orientation and represent two separate collinear probes.

[0097] It should be noted that differential line portion 316 (e.g., comprising a differential line 3161 having two conductors, a first of which is coupled to a first microstrip line 3141 and a second of which is coupled to a second microstrip line 3141) is bounded by (e.g., between) balun 319 and the coupling point of a pair of microstrip feed lines 3141.

[0098] The feed networks of two probes 3121 having a first direction and the feed networks of two probes 3122 having a second direction perpendicular to the first direction are disposed on opposite layers of the printed circuit board 310, for example with a ground layer sandwiched between them so that the ground layer shields the different feed networks. Placing the feed networks on opposite layers of the PCB 310 facilitates routing and provides high isolation. This simplifies the PCB process by eliminating the need for blind or buried vias.

[0099] A plurality of plated through via holes 390 form the sidewalls of the backshort 320 and correspondingly form the sidewalls of the cavity 330 .

[0100] The boundaries, eg, sidewall boundaries, of cavity 330 are implemented using vias 390 that penetrate multilayer printed circuit board 310, eg, using plated through via holes that may penetrate multiple layers of printed circuit board 310.

[0101] A plurality of, eg, plated, through-via holes 391 form the shields for each microstrip line.

[0102] However, it should be noted that the antenna device 300 may optionally be supplemented by any of the features, functions and details disclosed herein, either individually or in combination.

[0103] 4A to 4D show an antenna device 400 according to one embodiment.

[0104] 4A, the antenna device 400 includes a printed circuit board (PCB) 410 having an aperture 411 and four probes 412 arranged in two orthogonal pairs. The aperture 411 is a substantially square hole. The aperture 411 is a through hole for widening the bandwidth of the antenna.

[0105] The antenna device 400 includes a back short 420 (not shown in FIG. 4A).

[0106] The printed circuit board 410 is, for example, a thick, multi-layer printed circuit board. The printed circuit board 410 has five or more layers, preferably eight or more layers. The waveguide back-short 420 is implemented using one layer of the printed circuit board, for example, a metal layer, as the PCB layer. The bottom PCB layer functions as the metal back-short 420.

[0107] The PCB 410 has a thickness defined below.

number

[0108] The antenna device 400 thus comprises a cavity 430 between the portion of the PCB 410 carrying the probe 412, i.e., the aperture cutout, and the back-short 420. The cavity 430 may have, for example, a square cross section. The cavity 430 forms a waveguide between the portion of the printed circuit board 410 carrying the probe 412 and the waveguide back-short 420. The aperture 411 in the printed circuit board 410 is located in a central region around the central axis of the cavity 430. The cavity 430 has a length √ε where λ / 4 is a quarter wavelength in the PCB substrate material (e.g., a guide wavelength in the waveguide formed by the cavity). r has a depth equal to an integer multiple of 1 / 2 wavelength divided by , where the integer may be equal to or greater than 0, and the wavelength is set to the center frequency of the device.

[0109] The boundaries of cavity 430, e.g., sidewall boundaries, are implemented using vias 490 that penetrate multilayer printed circuit board 410, e.g., using plated through via holes that may penetrate multiple layers of printed circuit board 410.

[0110] As can be further seen in FIGS. 4A-4D, a plurality of plated through-via holes 490 form the sidewalls of the backshort 420 and correspondingly form the sidewalls of the cavity 430.

[0111] The boundaries of cavity 430, e.g., sidewall boundaries, are implemented using vias 490 that penetrate multilayer printed circuit board 410, e.g., using plated through via holes that may penetrate multiple layers of printed circuit board 410.

[0112] As can be seen in Figures 4A, 4C and 4D, a plurality of, for example, plated through via holes 491 form shields for each microstrip line.

[0113] As shown in FIGS. 4A, 4C, and 4D, the probes 412 are arranged in two orthogonal pairs, which are located on the printed circuit board 410 in the region 413 adjacent to the cavity 430 between the printed circuit board 410 and the waveguide backshort 420, such that the probes couple to the modes of the cavity and the principal orthogonal modes TE of the waveguide. 10 and T.E. 01 is configured to excite the

[0114] The four probes 412 are connected to respective microstrip lines 414 on the printed circuit board 410 in a region 415 of the printed circuit board 410 not adjacent to the cavity 430. Two probes 4121 have a first direction and represent two collinear probes. The two probes 4121 are coupled to a first differential port 4181 using respective microstrip lines 4141 and a differential line 4161. The two probes 4122 have a second direction and represent two other collinear probes. The two probes 4122 are coupled to a second differential port (not shown) using respective microstrip lines (not shown) and a different differential line (not shown). The first direction is orthogonal to the second direction. The differential feed provides symmetry to the antenna circuit, increases decoupling between the orthogonal arms, and widens the operating bandwidth. The differential transmission lines may, for example, be provided with a shield adjacent thereto.

[0115] As shown in FIG. 4C , the probe 412 utilizes multiple PCB layers of a thick PCB connected through probe vias 419, e.g., penetrates or passes through multiple PCB layers. The probe 412 connects upper layers of the PCB layers. The probe 412 utilizes, e.g., at least three PCB layers, e.g., at least three upper PCB layers are connected through probe vias 419. For example, not all PCB layers are utilized by the probe 412. In some implementations, the probe 412 may utilize, e.g., less than half of the PCB layers. However, it should be noted that the desired (or required) number of layers in a probe depends, for example, on the required antenna bandwidth. The probe utilizes at least one or two metal layers. The probe does not necessarily utilize the upper layers; the utilized layers (e.g., the utilized layers) can be hidden inside inner layers.

[0116] From FIG. 4D, it can be seen that probe 412 is formed as a multi-layer probe.

[0117] However, it should be noted that the antenna device 400 may optionally be supplemented by any of the features, functions and details disclosed herein, either individually or in combination.

[0118] 5A to 5D illustrate an antenna device 500 and / or portions thereof according to one embodiment.

[0119] 5A shows a printed circuit board (PCB) 510 having an aperture 511 and four probes 512 arranged in two orthogonal pairs. The aperture 511 is a generally square hole. The aperture 511 is a through-hole for increasing the bandwidth of the antenna. Although the aperture 511 is shown as a generally square hole, the aperture 511 may be, for example, a generally rectangular hole, a generally circular hole, or a generally elliptical hole, and the aperture may have a cross or X shape. However, apertures of other shapes may also be used.

[0120] The four probes 512 are connected to respective microstrip lines 514 on the printed circuit board 510 in a region 515 of the printed circuit board 510 not adjacent to the cavity 530. Two probes 5121 have a first direction and represent two collinear probes. The two probes 5121 are coupled to a first (e.g., differential) waveguide transition 5941 using respective microstrip lines 5141 and a differential line 5161. The two probes 5122 have a second direction and represent two separate collinear probes. The two probes 5122 are coupled to a second (e.g., differential) waveguide transition (not shown) using respective microstrip lines (not shown) and a separate differential line (not shown). The first direction is orthogonal to the second direction. The differential feed provides symmetry to the antenna circuit, increases decoupling between the orthogonal arms, and widens the operating bandwidth. The differential transition lines may, for example, be provided with a shield adjacent thereto.

[0121] FIG. 5B shows the antenna device 500 in an assembled state, eg, enclosed in a metal housing 560, eg, ready to use.

[0122] The backshort of antenna 500 is formed, for example, by a metal base plate (e.g., plate 570 or plate 580) or by a layer (e.g., the bottom layer) of a printed circuit board. Printed circuit board 510 is, for example, disposed (e.g., attached) on top of metal base plate 570, for example, with a cavity (not shown) formed in the upper portion of metal base plate 570, for example, which also forms waveguide backshort 520.

[0123] The separate pieces of the metal housing are shown in Figure 5C. The upper layer 568 of the metal base plate is shown to include mounting holes 528 for screws configured to secure the pieces of the metal housing together.

[0124] An additional waveguide portion is formed in the upper metal plate 568, which is an extension of the waveguide formed by the cavity (not shown).

[0125] In the assembled state of the antenna 500, the printed circuit board 510 is disposed, eg, sandwiched, between the upper metal plate 568 and the middle metal plate 570.

[0126] In addition to the upper metal plate 568, the metal housing further includes two metal layers 570 (e.g., designated as middle metal layers) and 580 (e.g., designated as lower metal layers), each having a central portion 571, 581 and two pairs of peripheral portions 572, 573, 582, 583. For example, the central portions 571, 581 of the two metal layers 570, 580 have shapes that correspond to the shape of the PCB 510 (e.g., a generally rectangular or quadratic shape) and the shape of the upper metal plate 568. For example, the first peripheral portions 572, 582 of the two metal layers 570, 580 extend diagonally from two opposite sides of the central portions 571, 581 to form metal plates. For example, the second peripheral portions 573, 583 of the two metal layers 570, 580 extend obliquely from the first peripheral portions 572, 582 to form metal plates. The second peripheral portions 573, 583 are arranged, for example, parallel to the central portions 571, 581, and the sides of the second peripheral portions 573, 583 are parallel to the corresponding sides of the central portions 571, 581. One metal layer 570 includes mounting holes 574 for mounting the upper metal plate 568 to the intermediate metal plate 570 and the lower metal layer 580. The metal layers may include alignment means, such as alignment pins or alignment holes. The other (lower) metal layer 580 includes two waveguide structures 575, 576 for the first and second polarizations. For example, both metal layers 570, 580 include mounting holes 578, 588 for securing antenna 500 within the metal housing, and mounting holes for attaching antenna 500 within metal housing 560 to a corresponding test stand or test equipment.

[0127] FIG. 5D shows the antenna device 500 in an assembled state, e.g., in a metal housing 560 and mounted on a test stand 580a. The test stand has an upper portion 583a and a lower portion 584a. The lower portion 584a stands on a stable base 585a and is attached to the stable base 585a with screws 586a. The components of the metal housing 560 are secured to the test stand 580a using, e.g., metal fixtures 581a. The metal fixtures 581a have a generally n-shape. The metal fixtures 581a hold the second peripheral components 573, 583 (or the entire antenna device 500) in hollow cutouts 582a of the test stand 580a. The hollow cutouts 582a have a shape corresponding to the shape of the metal housing 560. Metal fixtures 581a are attached to top portion 583a of test stand 580a using screws 587a, for example, each metal fixture 581a is attached with four screws 587a.

[0128] First and second coaxial connectors 590a, 591a are attached to waveguide transitions 592a, 593a and establish electromagnetic coupling with waveguide structures 575, 576. Thus, the coaxial connectors are effectively coupled to the antenna by waveguide transitions 592a, 593a, waveguide structures 575, 576, and transmission line routing (e.g., waveguide coupling structure 5941, differential line 5161, and microstrip line 5141) on printed circuit board 510. Thus, first coaxial connector 590a is associated with a first polarization, and second coaxial connector 591a is associated with a second polarization.

[0129] However, it should be noted that the antenna device 500 may optionally be supplemented by any of the features, functions and details disclosed herein, either individually or in combination.

[0130] 6A and 6B show antenna simulation results for an antenna device according to one embodiment. Antenna devices 100, 200, 300, 400, and 500 shown corresponding to FIGS. 1, 2, 3, 4, and 5 can all exhibit performance similar to the results shown in FIGS. 6A and 6B.

[0131] FIG. 6A shows the antenna 3D radiation pattern and the antenna radiation patterns in plane E (electric field plane) and plane H (magnetic field plane) at frequencies F1=24.25 GHz, F2=29.5 GHz, F3=37 GHz, F4=40 GHz.

[0132] FIG. 6B shows a graph of the frequency dependence of the antenna boresight gain and the antenna reflection coefficient.

[0133] As can be seen from FIGS. 6A and 6B, the electrical performance of the antenna device according to one embodiment can be characterized as follows: 22-43GHz operating frequency band (65%) considering 1.10dBRL 2. The insertion loss of the antenna circuit ranges from 0.75 to 1.35 dB across the frequency band (Megtron6-based board). 3. Antenna gain is 6 to 9.5 dBi across the band 4. Port-to-port leakage is less than -80dB across the band 5. Far-field cross-polarization discrimination is 55 dB or better across the band.

[0134] At the same time, the mechanical performance of the antenna device according to this embodiment can be characterized as follows. 1. The antenna circuit occupies only an area of ​​2 × 2λ0 within the PCB, where λ0 is calculated at a center frequency of 32.5 GHz. 2. The antenna PCB utilizes at least three layers, and the process does not require blind or buried vias.

[0135] 7A and 7B show an automatic test equipment having an antenna arrangement 700. FIG.

[0136] The automatic test equipment comprises an antenna arrangement 700. The automatic test equipment is configured to utilize the antenna arrangement 700 to test a device under test 792, for example a wireless device under test, for example an antenna-in-package device under test.

[0137] The automatic test equipment mounts the device under test 792 in an electrical socket and includes a blind mating connector 793. Two blind mating connectors 793 are shown in FIG. 7A. However, the automatic test equipment may include one or more blind mating connectors 793. The blind mating connector 793 can be, for example, a high frequency connector, such as a waveguide connector, similar to that shown in FIG. 7A. The blind mating connector 793 is configured to establish a high frequency connection with, for example, the antenna arrangement 700. The connector 793 is located near the test socket.

[0138] An antenna device 700, for example an OTA measurement antenna, in a metal housing is fixed to a socket cover 790. A pusher 791 is attached to the antenna device 700. The pusher 791 is made of a radio-transparent material. The pusher 791 is provided to push a device under test 792 into an electrical socket. In an embodiment, the pusher 791 may be configured as a cover for the antenna device 700.

[0139] When socket lid 790 is installed in the automatic test equipment, first and second (preferably blind-mate) waveguide connectors 794 interconnect with blind-mate waveguide 793. Blind-mate waveguide 793 connects the measurement antenna's mm-wave signal to the ATE measurement equipment.

[0140] The antenna device 700 includes two external connections 794, which are preferably waveguide connections. Although two external connections 794 are shown in Figure 7A, the antenna device 700 may include one or more external connections 794.

[0141] The test socket 792 and the connector 793 are positioned so that the external connection portion 794 of the antenna device 700 mates with the connector 793, and so that when the connection portion 794 of the antenna device 700 mates with the connector 793, the pusher 791 of the antenna device 700 pushes the device under test 792 into the device under test socket.

[0142] FIG. 7B shows an antenna arrangement 700 fixed to an automatic test equipment.

[0143] However, it should be noted that the automatic test equipment 700 may optionally be supplemented by any of the features, functions and details disclosed herein, either individually or in combination.

[0144] Alternative Embodiments and Aspects Further aspects and embodiments of the present invention are described below, which can be used individually or in combination with other embodiments disclosed herein.

[0145] Furthermore, the embodiments disclosed in this section may be optionally supplemented by other features, functions, and details disclosed herein, individually or in combination.

[0146] Below we describe an antenna layout (or design) used for integration into a socket for over-the-air (OTA) testing of Antenna-in-Package (AiP) modules for applications such as 5G.

[0147] This can be used in embodiments according to the invention for far-field and radiated near-field OTA testing.

[0148] Antenna layouts (or designs) according to embodiments of the present invention have been optimized for use in sockets for OTA testing using automated test equipment. Because OTA test measurement applications have different requirements than known antenna layouts (or designs) for AiP antenna arrays, it has been found advantageous to use antenna technologies that differ from the antenna topologies used in AiP antenna arrays, such as 5G modules. -For OTA applications, the measurement antenna is a single antenna element (not an antenna array), so the size of the antenna is not important. -The antenna gain is not important as it is used in the radiating near field (close to the DUT, unlike the base station in a real OTA scenario), what is important is that it has a wide bandwidth that covers all frequencies to be tested.

[0149] The following describes the basic concept of the embodiments of the present invention.

[0150] Antenna design (or antenna layout)

[0151] The antenna design (or antenna layout) shown in Figures 2A-2C comprises a dual-polarized waveguide (230), a waveguide backshort (220), and a PCB (210). Two orthogonal pairs of differentially fed microstrip probes (212) are coupled to the waveguide's principal orthogonal modes (TEs). 10 and T.E. 01 ) is positioned within the open cutout area (211).

[0152] Differential feeding provides symmetry to the antenna circuit, increases decoupling between the orthogonal arms, and helps to widen the operating bandwidth.

[0153] The probe's feed network is placed on the opposite layer of the PCB for easier routing and better isolation. This simplifies the PCB process by eliminating the need for blind or buried vias. The feed network is connected to a differential line or differential line transition (216) with a 100 Ω differential interface. This allows the versatility to integrate antenna circuitry with transmit and receive chain components on the same board.

[0154] Finally, the probe utilizes multiple PCB layers ("thick probe") connected through probe vias (218), and through-holes (211) exist inside the aperture cutout to extend the antenna bandwidth. According to one aspect of the present invention, another possibility for utilizing magnetic interactions in testing is to add new circuits to DFT components for structural testing, creating new possibilities with dynamic magnetic fields, for example, by inducing intervention in SCAN testing. Complex logic has the disadvantage that scan chains must be loaded frequently to achieve sufficiently high test coverage (which should be 99% or higher for high-quality products). However, while it is easy to reach large parts of the circuit area, the chains must always be fully loaded, and therefore additional test options in complex areas have a significant impact on test time and test costs.

[0155] The simulation results of the antenna are shown in Figures 6A and 6B.

[0156] Electrical Performance Operating frequency band: 22-43GHz (65%) 10dBRL Antenna circuit insertion loss: 0.75 to 1.35 dB across the frequency band (Megtron6-based board) Antenna gain: 6 to 9.5 dBi across the band Port-to-port leakage: Less than -80dB across the band Far-field cross-polarization discrimination: better than 55 dB across the band mechanical performance The antenna circuit only occupies an area of ​​2×2λ0 in the PCB (λ0 is calculated at a center frequency of 32.5 GHz). The antenna PCB uses at least three layers, and the process does not require blind or buried vias.

[0157] A prototype of the OTA antenna is shown in Figures 5A to 5D.

[0158] Antenna integration within an ATE socket is shown in Figures 7A-7B.

[0159] Furthermore, it should be noted that the embodiments and procedures may be used as described in this section and may optionally be supplemented by any of the features, functions, and details disclosed in this specification (the entire document), both individually and in combination.

[0160] However, features, functions and details described in other sections may also be optionally incorporated into embodiments of the present invention.

[0161] Also, the embodiments described in the above sections can be used individually or can be supplemented by any of the features, functions and details described in other sections.

[0162] It should also be noted that the individual aspects described herein can be used individually or in combination, and thus details can be added to each of the individual aspects without adding details to another one of the aspects.

[0163] In particular, the embodiments are also set forth in the claims, which may optionally be supplemented by any of the features, functions, and details described herein, both individually and in combination.

[0164] Additionally, any of the features and functions described herein may be implemented in hardware or software, or using a combination of hardware and software, as described in the "Implementation Alternatives" section.

[0165] (Alternative implementation example) While some aspects are described in the context of an apparatus, it will be apparent that these aspects also represent a description of a corresponding method, and that a block or device corresponds to a method step or feature of a method step. Similarly, aspects described in the context of a method step also represent a description of a corresponding block or item, or feature of a corresponding apparatus. Some or all of the method steps may be performed by (or using) a hardware apparatus, such as, for example, a microprocessor, a programmable computer, or an electronic circuit. In some embodiments, one or more of the most significant method steps may be performed by such an apparatus.

[0166] Depending on specific implementation requirements, embodiments of the present invention can be implemented in hardware or software. Implementation can be performed using a digital storage medium, such as a floppy disk, DVD, Blu-ray, CD, ROM, PROM, EPROM, EEPROM or FLASH memory, having electronically readable control signals stored thereon and cooperating (or being capable of cooperating) with a programmable computer system to perform the respective methods. The digital storage medium may therefore be computer-readable.

[0167] Some embodiments of the present invention comprise a data carrier having electronically readable control signals and capable of cooperating with a programmable computer system to perform one of the methods described herein.

[0168] Generally, embodiments of the present invention can be implemented as a computer program product having program code operable to perform one of the methods when the computer program product is run on a computer, the program code may for example be stored on a machine readable carrier.

[0169] Other embodiments comprise the computer program for performing one of the methods described herein, stored on a machine readable carrier.

[0170] In other words, an embodiment of the inventive method is, therefore, a computer program having a program code for performing one of the methods described herein, when the computer program runs on a computer.

[0171] Therefore, another embodiment of the inventive methods is a data carrier (or digital storage medium, or computer readable medium) having recorded thereon a computer program for performing one of the methods described herein. The data carrier, digital storage medium or recording medium is typically tangible and / or non-transitory.

[0172] A further embodiment of the inventive methods is, therefore, a data stream or a sequence of signals representing the computer program for performing one of the methods described herein, the data stream or sequence of signals being adapted to be transmitted via a data communication connection, such as, for example, the Internet.

[0173] Another embodiment comprises a processing means, for example a computer, or a programmable logic device, configured to or adapted to perform one of the methods described herein.

[0174] Another embodiment comprises a computer having installed thereon the computer program for performing one of the methods described herein.

[0175] Another embodiment of the invention comprises an apparatus or system configured to transfer (e.g. electronically or optically) a computer program for performing one of the methods described herein to a receiver. The receiver may be, for example, a computer, a mobile device, a memory device, etc. The apparatus or system may, for example, comprise a file server for transferring the computer program to the receiver.

[0176] In some embodiments, a programmable logic device (e.g., a field programmable gate array) may be used to perform some or all of the functionality of the methods described herein. In some embodiments, a field programmable gate array may cooperate with a microprocessor to perform one of the methods described herein. In general, the methods are preferably performed by any hardware apparatus.

[0177] The apparatus described herein may be implemented using a hardware apparatus, or using a computer, or using a combination of a hardware apparatus and a computer.

[0178] The devices described herein, or any components of the devices described herein, may be implemented at least in part in hardware and / or software.

[0179] The methods described herein may be performed using a hardware apparatus, or using a computer, or using a combination of a hardware apparatus and a computer.

[0180] The methods described herein, or any components of the apparatus described herein, may be implemented at least in part by hardware and / or software.

[0181] The embodiments described herein are merely illustrative of the principles of the present invention. It is understood that modifications and variations of the arrangements and details described herein will be apparent to those skilled in the art. It is therefore intended to be limited only by the scope of the following claims, and not by the specific details presented in the description and explanation of the embodiments herein.

Claims

1. a printed circuit board (PCB) having an opening; At least two probes are disposed on or within the printed circuit board so as to be orthogonal to each other; a cavity between a portion of the PCB carrying the probe and a waveguide backshort; the cavity forms a dual polarization waveguide between the portion of the PCB carrying the probe and the waveguide backshort; the opening in the printed circuit board is disposed in a central region about a central axis of the cavity; the cavity has a depth of one-quarter wavelength plus an integer multiple of one-half wavelength, within a tolerance of ±1 / 16 wavelength; Antenna device.

2. the probe is disposed in or on the printed circuit board in a region of the printed circuit board adjacent a cavity between the printed circuit board and the waveguide backshort; The antenna device according to claim 1 .

3. the probes are configured to form at least one orthogonal pair of probes and to excite at least two orthogonal modes of the waveguide; 3. The antenna device according to claim 1.

4. the probe is connected to at least two microstrip lines formed on or within the printed circuit board in a region of the printed circuit board not adjacent to the cavity between the printed circuit board and the waveguide backshort, the microstrip lines forming a feed network for the probe; The antenna device according to claim 1 .

5. the feed networks of the probes are connected to respective differential ports via respective differential line transitions; 5. The antenna device according to claim 4.

6. the one or more probe feed networks having a first direction and the one or more probe feed networks having a second direction orthogonal to the first direction are disposed on different layers of the printed circuit board; The antenna device according to any one of claims 1 to 5.

7. a TE waveguide backshort disposed in a region of the printed circuit board adjacent to the cavity between the printed circuit board and the waveguide backshort; １０ and T.E. ０１ four probes arranged in two orthogonal pairs, each configured to excite a 7. An antenna device according to claim 1.

8. the four probes are connected to respective microstrip lines in or on the printed circuit board in a region of the printed circuit board not adjacent to the cavity between the printed circuit board and the waveguide backshort; two probes having a first orientation are coupled to the first differential port; two probes having a second orientation are coupled to the second differential port; 8. The antenna device according to claim 7.

9. The printed circuit board comprises at least three layers, preferably four layers.

9. An antenna device according to claim 1.

10. the printed circuit board is disposed on a surface of a metal base plate; the cavity is formed in the metal base plate; 10. An antenna device according to any one of claims 1 to 9.

11. the printed circuit board is a multilayer printed circuit board; and the waveguide backshort is implemented using one layer of the printed circuit board; and / or the cavity boundaries are implemented using vias through the multilayer printed circuit board; 11. An antenna device according to any one of claims 1 to 10.

12. the cavity has a width of ½ wavelength; 12. An antenna device according to any one of claims 1 to 11.

13. the probe has a length equal to the depth of the cavity within a tolerance of 1 / 16 wavelength; 13. An antenna device according to any one of claims 1 to 12.

14. The probes penetrate multiple layers of the PCB, connecting through one or more probe vias.

14. An antenna device according to any one of claims 1 to 13.

15. further comprising an upper metal plate, wherein an additional waveguide portion is formed in the upper metal plate, the additional waveguide portion being an extension of the waveguide formed by the cavity; 15. An antenna device according to any one of claims 1 to 14.

16. the printed circuit board is disposed between the metal base plate and the upper metal plate; 16. The antenna device according to claim 15.

17. the differential line transition has a shield in contact therewith; 17. An antenna arrangement according to any one of claims 1 to 16.

18. The antenna device includes one or more external connection parts; the first external connection is coupled to one or more probes having a first orientation; and / or the second external connection is coupled to one or more probes having a second orientation; 18. An antenna arrangement according to any one of claims 1 to 17.

19. the one or more external connections are waveguide connections; 19. The antenna device according to claim 18.

20. the one or more external connections are blind-mate connections; 20. An antenna device according to claim 18 or 19.

21. 21. The antenna device according to any one of claims 18 to 20, wherein the one or more external connections are aligned in the same direction as a main radiation direction of the antenna device.

22. The antenna device includes a radio-transparent cover covering the waveguide.

22. An antenna arrangement according to any one of claims 1 to 21.

23. the cover is configured to permit passage of electromagnetic radiation from the waveguide to the device under test and vice versa while the device under test is pressed into the device under test position; 23. The antenna device according to claim 22.

24. 1. An automatic test equipment (ATE) comprising: The automatic test equipment comprises an antenna arrangement according to any one of claims 1 to 23, the automatic test equipment is configured to test a device under test using the antenna apparatus; Automatic test equipment.

25. 1. An automatic test equipment comprising: the automatic test equipment includes a device under test socket and one or more high frequency connectors; the one or more high frequency connectors are positioned adjacent to the test socket; Automatic test equipment.

26. The test socket and one or more high frequency connectors include: One or more external connection portions of the antenna device are arranged to mate with one or more high frequency connectors; and a cover of the antenna device is arranged to press the device under test into the device under test socket when the one or more external connection portions of the antenna device are mated with the one or more high-frequency connectors; 26. The automatic test equipment of claim 25.

Images